High-uniformity OPA chip end face polishing machine

Abstract

The application discloses a high-uniformity OPA chip end face polishing machine and relates to the technical field of chip end face polishing. The upper cover plate is fixedly provided with a polishing motor, the output shaft of the polishing motor is fixedly provided with a mounting seat, the mounting seat is fixedly provided with an adjusting micro-cylinder mounting disc, and the adjusting micro-cylinder mounting disc is fixedly provided with a plurality of adjusting micro-cylinders which are equidistantly distributed. The application can quickly detect the flatness of the polishing disc before polishing the chip each time, so that the parallelism between the polishing sandpaper and the chip end face is guaranteed. The closed-loop feedback mechanism can detect and adjust the pressure applied to the polishing disc by all the adjusting micro-cylinders in real time, so that the force applied to the chip end face by the polishing disc is uniform. The application can effectively improve the uniformity of the polished end face and obtain better surface quality and performance.

Description

A high-uniformity OPA chip end face polishing machine Technical Field

[0001] This invention relates to the field of chip end-face polishing technology, specifically to a high-uniformity OPA chip end-face polishing machine. Background Technology

[0002] Uniform polishing of the OPA chip end face can eliminate defects such as bumps and pits on the chip surface, improving chip performance and reliability, thus providing better assurance for stable equipment operation. A smoother chip surface facilitates packaging and soldering, enhances chip reliability, and allows for accurate preparation of photolithography patterns, improving the success rate of photolithography processes.

[0003] Currently, in the existing technology, invention patent with publication number CN116141111A discloses a chip end-face angle grinding and polishing device. This device uses the cooperation of dovetail groove and dovetail boss to fix quick-release movable parts, and uses locking pins for positioning. This can improve the accuracy of repeated disassembly and assembly of quick-release movable parts, facilitate the disassembly and assembly of sample fixtures, and also ensure the accuracy of reinstallation after disassembly. However, when polishing chips with large polishing areas, it is impossible to guarantee the uniformity of the chip end-face polishing. Summary of the Invention

[0004] To overcome the shortcomings of the prior art, the present invention provides the following technical solution: a high-uniformity OPA chip end-face polishing machine, wherein a polishing motor is fixedly mounted on the upper cover plate, a mounting base is fixedly mounted on the output shaft of the polishing motor, an adjusting micro-cylinder mounting plate is fixedly mounted on the mounting base, a plurality of equidistantly distributed adjusting micro-cylinders are fixedly mounted on the adjusting micro-cylinder mounting plate, a ball joint is movably mounted at the end of the telescopic rod of each adjusting micro-cylinder, a polishing disc is provided below the adjusting micro-cylinder mounting plate, a pressure sensor is fixedly mounted between all the ball joints of the polishing disc for feedback of the force applied to the polishing disc by the adjusting micro-cylinders, a detection disc is provided below the polishing disc, a contact conductive rod bracket is fixedly mounted on the side of the detection disc, a contact conductive rod is slidably mounted on the contact conductive rod bracket, a tension spring is fixedly mounted between one end of the contact conductive rod and the contact conductive rod bracket, and a capacitance measuring head corresponding to the number and position of the adjusting micro-cylinders is also fixedly mounted on the detection disc.

[0005] Preferably, the tension spring is arranged around the contact conductive rod, the contact conductive rod is in contact with the polishing disc, and the contact conductive rod is electrically connected to the polishing disc.

[0006] Preferably, an electric brush is fixedly installed on the upper cover plate, and the electric brush is electrically slidingly engaged with the mounting base to supply power to the micro electric cylinder.

[0007] Preferably, the detection disc is fixedly mounted on the detection disc bracket, the detection disc bracket is rotatably mounted on the output shaft of the detection swing motor, the detection swing motor is fixedly mounted on the outer casing, and the upper cover plate is also fixedly mounted on the outer casing.

[0008] Preferably, a feeding assembly is fixedly provided at the bottom end of the housing, the feeding assembly includes a support platform, the support platform is fixedly engaged with the bottom end of the housing, and a clamping platform is slidably provided on the inner wall of the housing.

[0009] Preferably, three feed screws are fixedly installed on the lower surface of the clamping table, and three feed nut gears that are threadedly engaged with the feed screws are rotatably installed on the support table. Three feed motors are fixedly installed on the surface of the support table, and feed drive gears that mesh with the corresponding feed nut gears are fixedly installed on the output shafts of the three feed motors to control the axial movement of the feed screws.

[0010] Preferably, a compression piston cylinder is fixedly installed on the lower surface of the clamping platform, the interior of the compression piston cylinder is connected to the interior of the clamping platform, a vent hole is provided at the bottom end of the compression piston cylinder, and a compression gear support housing is also fixedly installed at the bottom end of the compression piston cylinder. Two meshing compression nut gears and a compression drive gear are rotatably arranged inside the compression gear support housing, and a compression drive motor for driving the compression drive gear to rotate is also fixedly installed on the compression gear support housing.

[0011] Preferably, a compression drive screw is slidably fitted at the center of the compression gear support housing in a spline manner. The compression drive screw is threadedly fitted with the compression nut gear. A piston is fixedly installed at the top end of the compression drive screw, and the piston is slidably sealed to the inner wall of the compression piston cylinder.

[0012] Preferably, four hydraulic telescopic rods are fixedly installed on the upper surface of the clamping platform. The interior of the telescopic cylinders of the four hydraulic telescopic rods is connected to the interior of the clamping platform. A fixing plate is fixedly installed at the end of each of the four hydraulic telescopic rods. A gasket is overlapped at the center of the upper surface of the clamping platform. Two iron pillars are embedded in the gasket. Six permanent magnets that magnetically attract the iron pillars are embedded in the upper surface of the clamping platform for positioning the gasket.

[0013] Compared with the prior art, the present invention has the following advantages: (1) The present invention can quickly detect the flatness of the polishing pad before each chip polishing to ensure that the polishing sandpaper is parallel to the chip end face; (2) The present invention adopts a closed-loop feedback mechanism, which can detect and adjust the pressure applied to the polishing pad by all the micro electric cylinders in real time to ensure that the force applied to the chip end face by the polishing pad is uniform; (3) The present invention can effectively improve the uniformity of the polished end face and obtain better surface quality and performance. Attached Figure Description

[0014] Figure 1 is a schematic diagram of the overall structure of the present invention.

[0015] Figure 2 is a schematic diagram of the structure of the detection disc support of the present invention.

[0016] Figure 3 is a schematic diagram of the structure of the capacitance measuring head of the present invention.

[0017] Figure 4 is a schematic diagram of the ball joint structure of the present invention.

[0018] Figure 5 is a schematic diagram of the feeding component structure of the present invention.

[0019] Figure 6 is a schematic diagram of the structure of the feed screw of the present invention.

[0020] Figure 7 is a schematic diagram of the structure of the extrusion piston cylinder of the present invention.

[0021] Figure 8 is a schematic diagram of the structure at point A in Figure 7 of this invention.

[0022] Figure 9 shows the connection between the ball joint and the polishing disc of the present invention.

[0023] In the diagram: 101-Top cover plate; 102-Outer shell; 103-Grinding motor; 104-Detection swing motor; 105-Detection disc bracket; 106-Detection disc; 107-Mounting base; 108-Brush; 109-Adjusting micro-cylinder mounting disc; 110-Contact conductive rod bracket; 111-Capacity measuring head; 112-Contact conductive rod; 113-Tension spring; 114-Adjusting micro-cylinder; 115-Ball joint; 116-Polishing disc; 117-Polishing sandpaper; 118-Pressure sensor; 201-Support 202-Supporting platform; 203-Feed drive gear; 204-Feed nut gear; 205-Feed screw; 206-Clamping table; 207-Hydraulic telescopic rod; 208-Fixing plate; 209-Shim; 210-Iron column; 211-Permanent magnet; 212-Extrusion piston cylinder; 2121-Ventilation hole; 213-Piston; 214-Extrusion nut gear; 215-Extrusion gear support housing; 216-Extrusion drive gear; 217-Extrusion drive motor; 218-Extrusion drive screw. Detailed Implementation

[0024] The technical solution of the present invention will be further described below with reference to Figures 1-9 and through specific embodiments.

[0025] This invention provides a high-uniformity OPA chip end-face polishing machine. A polishing motor 103 is fixedly mounted on an upper cover plate 101. A mounting base 107 is fixedly mounted on the output shaft of the polishing motor 103. An adjusting micro-electric cylinder mounting plate 109 is fixedly mounted on the mounting base 107. Several equidistantly distributed adjusting micro-electric cylinders 114 are fixedly mounted on the adjusting micro-electric cylinder mounting plate 109. A ball joint 115 is movably mounted at the end of the telescopic rod of each adjusting micro-electric cylinder 114. A polishing disc 116 is arranged below the adjusting micro-electric cylinder mounting plate 109. All the ball joints of the polishing disc 116... Pressure sensors 118 are fixedly installed between 115 to provide feedback on the force applied to the polishing disc 116 by the micro electric cylinder 114. A detection disc 106 is located below the polishing disc 116. A contact conductive rod bracket 110 is fixedly installed on the side of the detection disc 106. A contact conductive rod 112 is slidably installed on the contact conductive rod bracket 110. A tension spring 113 is fixedly installed between one end of the contact conductive rod 112 and the contact conductive rod bracket 110. A capacitance measuring head 111, corresponding to the number and position of the micro electric cylinders 114, is also fixedly installed on the detection disc 106. The tension spring 113 surrounds the contact conductive rod 112, which contacts and engages with the polishing disc 116 and is electrically connected to it. A brush 108 is fixedly installed on the upper cover plate 101, and the brush 108 is electrically slidably engaged with the mounting base 107 to supply power to the micro electric cylinders 114. The detection plate 106 is fixedly mounted on the detection plate bracket 105. The detection plate bracket 105 is rotatably mounted on the output shaft of the detection swing motor 104. The detection swing motor 104 is fixedly mounted on the outer casing 102. The upper cover plate 101 is also fixedly mounted on the outer casing 102.

[0026] A feeding assembly is fixedly mounted on the bottom end of the housing 102. The feeding assembly includes a support platform 201, which is fixedly fitted to the bottom end of the housing 102. A clamping platform 206 is slidably disposed on the inner wall of the housing 102. Three feed screws 205 are fixedly mounted on the lower surface of the clamping platform 206. Three feed nut gears 204 that are threadedly engaged with the feed screws 205 are also rotatably mounted on the support platform 201. Three feed motors 202 are fixedly mounted on the surface of the support platform 201. Each of the three feed motors 202 has a feed drive gear 203 fixedly mounted on its output shaft that meshes with the corresponding feed nut gear 204, for controlling the axial movement of the feed screws 205. A compression piston cylinder 212 is fixedly installed on the lower surface of the clamping table 206. The interior of the compression piston cylinder 212 communicates with the interior of the clamping table 206. A vent hole 2121 is provided at the bottom end of the compression piston cylinder 212. A compression gear support housing 215 is also fixedly installed at the bottom end of the compression piston cylinder 212. Two meshing compression nut gears 214 and a compression drive gear 216 are rotatably mounted inside the compression gear support housing 215. A compression drive motor 217 for driving the compression drive gear 216 is also fixedly installed on the compression gear support housing 215. A compression drive screw 218 is slidably fitted at the center of the compression gear support housing 215 using a spline configuration. The compression drive screw 218 is threadedly fitted with the compression nut gear 214. A piston 213 is fixedly installed at the top end of the compression drive screw 218. The piston 213 is slidably sealed to the inner wall of the compression piston cylinder 212. Four hydraulic telescopic rods 207 are fixedly installed on the upper surface of the clamping platform 206. The interior of the telescopic cylinders of the four hydraulic telescopic rods 207 communicates with the interior of the clamping platform 206. A fixing plate 208 is fixedly installed at the end of each of the four hydraulic telescopic rods 207. A gasket 209 is overlapped at the center of the upper surface of the clamping platform 206. Two iron pillars 210 are embedded in the gasket 209. Six permanent magnets 211 are embedded in the upper surface of the clamping platform 206, which magnetically engage with the iron pillars 210, for positioning the gasket 209.

[0027] The working principle of the high-uniformity OPA chip end-face polishing machine disclosed in this invention is as follows: Polishing sandpaper 117 is pasted on the lower surface of polishing disc 116, ensuring that there are no air bubbles between them. Then, the chip to be polished is placed on the pad 209. Different sized pads 209 are selected according to the size of the chip to achieve better support. The spacing of the iron pillars 210 of different sizes is also different and needs to correspond to the position of the permanent magnet 211. The extrusion drive motor 217 drives the extrusion drive gear 216 to rotate, which in turn drives the extrusion nut gear 214 to rotate. The extrusion nut gear 214 then drives the extrusion drive screw 218 to move along its axis. The extrusion drive screw 218 drives the piston 213 to slide inside the extrusion piston cylinder 212. At this time, the piston 213 moves upward, which increases the internal pressure of the clamping table 206. This, in turn, increases the internal pressure of the hydraulic telescopic rod 207. The telescopic rod 207 then drives the fixing plate 208 to move toward the chip, fixing the chip in place. (During the movement toward the chip, the chip needs to be pressed down by hand until all four fixing plates 208 are in contact with the four sides of the chip. This step ensures that the four sides of the chip are subjected to the same force, preventing stress shift.) A shim 209 of appropriate thickness is selected according to the chip thickness.

[0028] Before polishing, the polishing disc 116 needs to be calibrated for flatness to ensure processing accuracy. The detection swing motor 104 is controlled, and its output shaft drives the detection disc support 105, swinging the detection disc 106 directly below the polishing disc 116. At this time, the capacitance measuring head 111 also moves directly below the polishing disc 116. The capacitance measuring head 111 is intermittently energized, and different capacitance measuring heads 111 and the polishing disc 116 form capacitances. By measuring the capacitance values ​​between different capacitance measuring heads 111 and the polishing disc 116, the distance between the corresponding capacitance measuring head 111 and the polishing disc 116 can be determined. Ensuring that all capacitance measuring heads 111 and the polishing disc 116 have the same distance guarantees the flatness of the polishing disc 116 (the capacitance measuring head 111 serves as a flat reference; the extension and retraction of the micro electric cylinder 114's telescopic rod is adjusted by adjusting the corresponding position). Specifically, this can be determined using C=εA / d (where C represents capacitance, ε represents dielectric constant, A represents the area between the two metal pieces, and d represents the distance between the two metal pieces). By controlling three feed motors 202, the output shafts of the feed motors 202 drive the feed drive gear 203 to rotate. The rotation of the feed drive gear 203 drives the feed nut gear 204, which in turn drives the corresponding feed screw 205 to move axially. Then, the feed screw 205 drives the clamping table 206 to move up and down, allowing the chip on the clamping table 206 to contact the rotating polishing sandpaper 117 (first, the polishing motor 103 is started to make the polishing disc 116 rotate).

[0029] During the polishing process, pressure sensor 118 monitors the pressure at the corresponding position in real time and transmits the pressure signal to the control system. The control system receives the signal from pressure sensor 118 and compares and judges it according to the preset pressure range. If the current pressure exceeds the preset range, the control system sends a command to the adjusting micro-cylinder 114 for adjustment. The adjusting micro-cylinder 114 adjusts the extension and retraction of the telescopic rod according to the command of the control system. By adjusting the movement of the telescopic rod of the adjusting micro-cylinder 114, the contact force between the polishing sandpaper 117 and the chip can be changed, thereby adjusting the polishing pressure and making the entire chip surface polished more uniformly. The ball joint 115 and the polishing disc 116 are connected in the manner shown in Figure 9, with the pressure sensor 118 positioned in the middle.

Claims

1. A high-uniformity OPA chip end-face polishing machine, characterized in that: The system includes an upper cover plate (101), on which a grinding motor (103) is fixedly mounted. A mounting base (107) is fixedly mounted on the output shaft of the grinding motor (103). An adjustable micro-electric cylinder mounting plate (109) is fixedly mounted on the mounting base (107). Several equidistantly distributed adjustable micro-electric cylinders (114) are fixedly mounted on the adjustable micro-electric cylinder mounting plate (109). Each adjustable micro-electric cylinder (114) has a ball joint (115) movably mounted at the end of its telescopic rod. A polishing disc (116) is located below the adjustable micro-electric cylinder mounting plate (109). All the balls of the polishing disc (116) are... Pressure sensors (118) are fixedly installed between the joints (115) to provide feedback on the force applied to the polishing disc (116) by the micro electric cylinder (114). A detection disc (106) is provided below the polishing disc (116). A contact conductive rod bracket (110) is fixedly installed on the side of the detection disc (106). A contact conductive rod (112) is slidably installed on the contact conductive rod bracket (110). A tension spring (113) is fixedly installed between one end of the contact conductive rod (112) and the contact conductive rod bracket (110). A device for adjusting the micro electric cylinder (114) is also fixedly installed on the detection disc (106). 4) The quantity and position of the corresponding capacitance measuring head (111), the pressure sensor (118) monitors the pressure at the corresponding position in real time and transmits the pressure signal to the control system. The control system can send instructions to the adjusting micro electric cylinder (114) to adjust the extension and retraction amount, and can change the contact force between the polishing sandpaper (117) and the chip; the detection disk (106) is fixedly installed on the detection disk bracket (105), the detection disk bracket (105) is rotatably installed on the output shaft of the detection swing motor (104), the detection swing motor (104) is fixedly installed on the outer shell (102), and the upper cover plate (101) The feed assembly is also fixedly installed on the outer shell (102); the bottom end of the outer shell (102) is fixedly equipped with a feed assembly, which includes a support platform (201). The support platform (201) is fixedly engaged with the bottom end of the outer shell (102). The inner wall of the outer shell (102) is slidably provided with a clamping platform (206). A pad (209) is overlapped at the center of the upper surface of the clamping platform (206). Two iron pillars (210) are embedded in the pad (209). Six permanent magnets (211) that magnetically engage with the iron pillars (210) are embedded in the upper surface of the clamping platform (206) for positioning the pad (209).

2. The high uniformity OPA chip end-face polishing machine according to claim 1, characterized in that: The tension spring (113) is arranged around the contact conductive rod (112), the contact conductive rod (112) is in contact with the polishing disk (116), and the contact conductive rod (112) is electrically connected to the polishing disk (116).

3. The high uniformity OPA chip end-face polishing machine according to claim 2, characterized in that: A brush (108) is fixedly installed on the upper cover plate (101). The brush (108) is electrically slidably engaged with the mounting base (107) to supply power to the micro electric cylinder (114).

4. The high uniformity OPA chip end-face polishing machine according to claim 3, characterized in that: Three feed screws (205) are fixedly installed on the lower surface of the clamping table (206). Three feed nut gears (204) that are threadedly engaged with the feed screws (205) are also rotatably installed on the support table (201). Three feed motors (202) are fixedly installed on the surface of the support table (201). Each of the three feed motors (202) has a feed drive gear (203) that meshes with the corresponding feed nut gear (204) fixedly installed on its output shaft to control the axial movement of the feed screws (205).

5. A high-uniformity OPA chip end-face polishing machine according to claim 4, characterized in that: A compression piston cylinder (212) is fixedly installed on the lower surface of the clamping platform (206). The interior of the compression piston cylinder (212) is connected to the interior of the clamping platform (206). A vent hole (2121) is provided at the bottom end of the compression piston cylinder (212). A compression gear support housing (215) is also fixedly installed at the bottom end of the compression piston cylinder (212). Two meshing compression nut gears (214) and a compression drive gear (216) are rotatably arranged inside the compression gear support housing (215). A compression drive motor (217) for driving the compression drive gear (216) to rotate is also fixedly installed on the compression gear support housing (215).

6. The high uniformity OPA chip end-face polishing machine according to claim 5, characterized in that: The extrusion gear support housing (215) has an extrusion drive screw (218) slidably fitted at its center by a spline. The extrusion drive screw (218) is threadedly fitted with the extrusion nut gear (214). A piston (213) is fixedly installed at the top of the extrusion drive screw (218). The piston (213) is slidably sealed with the inner wall of the extrusion piston cylinder (212).

7. A high-uniformity OPA chip end-face polishing machine according to claim 6, characterized in that: Four hydraulic telescopic rods (207) are fixedly installed on the upper surface of the clamping platform (206). The inside of the telescopic cylinder of the four hydraulic telescopic rods (207) is connected to the inside of the clamping platform (206) to ensure that the four sides of the chip being clamped are subjected to the same force. The ends of the telescopic rods of the four hydraulic telescopic rods (207) are fixedly installed with fixing plates (208).

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