Semiconductor refrigerator crystal cleaning device, method, electronic equipment and storage medium

Abstract

The present application relates to a semiconductor refrigerator grain cleaning device, method, electronic device and storage medium. The electric control box is provided with a control module and an operation sequence storage module. The control module controls the motion module to adjust the relative position of the cleaning fixture and the cleaning tank according to the preset operation sequence stored in the operation sequence storage module, so that each semiconductor refrigerator grain clamped by the cleaning fixture is immersed in the cleaning liquid stored in the cleaning tank, and the cleaning fixture and each semiconductor refrigerator grain clamped by it are separated from the cleaning liquid. The cleaning process is completely completed automatically by the equipment, without the need to bind an operator, thereby greatly saving human resources; compared with traditional manual cleaning, it is at least 50% or even multiple levels of improvement, thereby greatly improving the cleaning efficiency; it can avoid the inconsistency of traditional manual cleaning, so that the semiconductor refrigerator grains have a higher consistency in cleaning, thereby avoiding product defects caused by the cleaning process.

Description

Technical Field

[0001] The present application relates to the field of crystal grain cleaning, and in particular to a semiconductor refrigerator crystal grain cleaning device, method, electronic equipment and storage medium. Background Art

[0002] The traditional cleaning process of crystal grains, or chips, is mainly done manually. Taking the cleaning of crystal grains of semiconductor refrigerators (Thermo-Electric Cooler, TEC) as an example, a brief explanation is as follows: First, prepare three cleaning boxes A, B, and C with appropriate volumes, pour appropriate amounts of cleaning solution into each box, put the cut chips into box A for soaking, turn on the alarm and set the appropriate time. When the alarm rings, pick it up with tweezers and put it into box B for soaking to initialize the alarm. When the alarm rings, the soaking is completed, then pick it up and put it into box C for soaking and initialize the alarm. When the alarm rings, take out the chip and blow it dry.

[0003] It can be seen from the above process that the traditional grain cleaning process needs to bind the operator and has strict requirements on the immersion time each time. A fixed person is needed to wait for the alarm signal and take action immediately once the alarm rings. This also brings about the problem of processing capacity, that is, the processing capacity is small. When multiple wafers are immersed at one time, for example, more than four wafers, the immersion time of the wafers picked up later will be too long, resulting in poor cleaning and inconvenient operation. Summary of the invention

[0004] Based on this, it is necessary to provide a semiconductor refrigerator crystal cleaning device, method, electronic equipment and storage medium.

[0005] In one embodiment, a semiconductor refrigerator crystal grain cleaning device includes a cleaning fixture, a cleaning tank, a motion module and an electric control box;

[0006] The cleaning fixture is arranged on the motion module, and the cleaning fixture is provided with at least two clamping positions, each of which clamps a semiconductor refrigerator grain to be cleaned;

[0007] The motion module is conductively connected to the electric control box, and the electric control box is provided with a control module and an operation timing storage module. The control module controls the motion module to adjust the relative position of the cleaning fixture and the cleaning tank according to the preset operation timing stored in the operation timing storage module, so that each of the semiconductor refrigerator grains clamped by the cleaning fixture is immersed in the cleaning liquid stored in the cleaning tank, and the cleaning fixture and each of the semiconductor refrigerator grains clamped by it are separated from the cleaning liquid.

[0008] The above-mentioned semiconductor refrigerator grain cleaning device can clean multiple semiconductor refrigerator grains at a time, and adopts a preset operation sequence. On the one hand, the cleaning process is completely completed automatically by the equipment, without the need to bind an operator, thereby greatly saving human resources and protecting the operator from the cleaning liquid; on the other hand, compared with traditional manual cleaning, it is at least 50% or even multiple levels higher, thereby greatly improving the cleaning efficiency; on the other hand, it can avoid the inconsistency of traditional manual cleaning, so that the semiconductor refrigerator grains have a higher consistency in cleaning, thereby avoiding product defects caused by the cleaning process.

[0009] In one embodiment, the electric control box is further provided with an indication module electrically connected to the control module; and

[0010] The electrical control box is also provided with an immersion timing module connected to the control module, which is used to accumulate the usage time of the cleaning fluid and when a preset time threshold is reached, the control module controls the indication module to issue a reminder message for replacing the cleaning fluid; and / or, the semiconductor refrigerator grain cleaning device also includes a detection module, which is arranged on the motion module and conductively connected to the control module, and the detection module is used to control the indication module to issue a cleaning fluid abnormality prompt message through the control module when an abnormality occurs in the cleaning fluid stored in the cleaning tank.

[0011] In one embodiment, the cleaning fixture comprises a reciprocating half-turn drive, a rotating shaft and a chuck, and each of the clamping positions is disposed on the chuck and is regularly arranged in a matrix;

[0012] The reciprocating half-turn driver is conductively connected to the electric control box. Each time the chuck enters the cleaning tank, the reciprocating half-turn driver drives the chuck to reciprocate 180 degrees around the rotating shaft, so that the semiconductor cooler grains that enter the cleaning tank first are taken out of the cleaning tank first after soaking; or,

[0013] The motion module is a two-dimensional motion mechanism, which is used to move the cleaning fixture up and down relative to the cleaning tank to enter and exit the cleaning tank, and to move the cleaning fixture left and right relative to the cleaning tank to align with or leave the cleaning tank; or,

[0014] The cleaning fixture or its clamping plate is provided with two side surfaces which are arranged opposite to each other, and each of the side surfaces is provided with at least two clamping positions.

[0015] In one embodiment, the semiconductor refrigerator crystal cleaning device further comprises a control terminal, the control terminal is conductively connected to the electric control box, and the control terminal is used to send a control signal to the control module and send the preset operation sequence to the operation sequence storage module; or,

[0016] The semiconductor refrigerator crystal grain cleaning device also includes a frame, and the cleaning tank, the motion module and the electric control box are respectively arranged on the frame.

[0017] Furthermore, in one of the embodiments, the shell of the electric control box is integrally provided with the frame, and the cleaning tank and the motion module are respectively provided on the shell of the electric control box.

[0018] In one embodiment, the cleaning tank includes three tank bodies arranged side by side, and the motion module sequentially adjusts the relative position of the cleaning fixture and the three tank bodies so that each of the semiconductor refrigerator grains clamped by the cleaning fixture is immersed in the cleaning liquid stored in the three tank bodies in sequence.

[0019] In one embodiment, the cleaning tank further comprises a bottom plate and a cover, the cover is rotatably disposed on the bottom plate and forms an enclosed area together with the bottom plate, and the three tank bodies are regularly arranged on the bottom plate and located in the enclosed area;

[0020] The cover is provided with a through slot, and the moving module passes through the through slot and is movably arranged in the through slot so as to adjust the relative positions of the cleaning fixture and the three slot bodies in the enclosed area.

[0021] Furthermore, in one of the embodiments, the chassis is provided with an overflow collection pipe for collecting the cleaning liquid dripping from the gaps between the three troughs and transporting it to a recovery container.

[0022] In one embodiment, a semiconductor refrigerator grain cleaning method comprises the steps of:

[0023] S100, clamping each semiconductor refrigerator crystal grain to be cleaned on the clamping position of the cleaning fixture;

[0024] S200, setting a preset operation sequence;

[0025] S300, determining whether the cleaning liquid stored in the cleaning tank is available, if yes, executing S400;

[0026] S400, the control module controls the motion module to adjust the relative position of the cleaning fixture and the cleaning tank according to the preset operation sequence, so that each of the semiconductor refrigerator grains is immersed in the cleaning liquid stored in the cleaning tank;

[0027] S500, the control module controls the motion module to adjust the relative position of the cleaning fixture and the cleaning tank according to the preset operation sequence, so that each of the semiconductor cooler grains is separated from the cleaning liquid.

[0028] In one embodiment, in step S400, the control module controls the motion module to adjust the relative position of the cleaning fixture and the first tank body of the cleaning tank according to the preset operation sequence, so that each of the semiconductor refrigerator grains is immersed in the cleaning liquid stored in the tank body;

[0029] In step S500, the control module controls the motion module to adjust the relative position of the cleaning fixture and the tank body according to the preset operation sequence, so that each of the semiconductor refrigerator grains is separated from the cleaning liquid;

[0030] After step S500, the method further includes the following steps:

[0031] S600, determining whether the cleaning is completed, if not, executing S700;

[0032] S700, the control module controls the motion module to adjust the relative position of the cleaning fixture and the next tank body of the cleaning tank according to the preset operation sequence, so that each of the semiconductor refrigerator grains is immersed in the cleaning liquid stored in the next tank body; return to execute S500.

[0033] In one embodiment, an electronic device includes a memory and a processor, wherein the memory stores a computer program, and the processor implements the steps of the semiconductor refrigerator grain cleaning method described in any embodiment when executing the computer program.

[0034] In one embodiment, a computer-readable storage medium stores a computer program, wherein the computer program, when executed by a processor, implements the steps of the semiconductor refrigerator grain cleaning method described in any embodiment. BRIEF DESCRIPTION OF THE DRAWINGS

[0035] In order to more clearly illustrate the technical solutions in the embodiments of the present application or the conventional technology, the drawings required for use in the embodiments or the conventional technology descriptions are briefly introduced below. Obviously, the drawings described below are only some embodiments of the present application. For ordinary technicians in this field, other drawings can be obtained based on these drawings without creative work.

[0036] Figure 1 This is a schematic structural diagram of an embodiment of a semiconductor refrigerator crystal cleaning device described in this application.

[0037] Figure 2 for Figure 1 A partial structural schematic diagram of the illustrated embodiment.

[0038] Figure 3 This is a schematic structural diagram of another embodiment of the semiconductor refrigerator crystal cleaning device described in this application.

[0039] Figure 4 This is a schematic flow chart of an embodiment of a semiconductor refrigerator crystal cleaning method described in this application.

[0040] Figure 5 This is a flow chart of another embodiment of the semiconductor refrigerator crystal cleaning method described in the present application.

[0041] Figure numerals: semiconductor refrigerator grain cleaning device 100, cleaning fixture 200, cleaning tank 300, motion module 400, electric control box 500, control terminal 600, clamping position 210, mounting plate 220, first tank body 310, second tank body 320, third tank body 330, first direction moving module 410, second direction moving module 420, mounting position 510. DETAILED DESCRIPTION

[0042] In order to make the above-mentioned purposes, features and advantages of the present application more obvious and easy to understand, the specific implementation methods of the present application are described in detail below in conjunction with the accompanying drawings. In the following description, many specific details are set forth to facilitate a full understanding of the present application. However, the present application can be implemented in many other ways different from those described herein, and those skilled in the art can make similar improvements without violating the connotation of the present application, so the present application is not limited by the specific embodiments disclosed below.

[0043] It should be noted that when a component is referred to as being "fixed to" or "disposed on" another component, it may be directly on the other component or there may also be a central component. When a component is considered to be "connected to" another component, it may be directly connected to the other component or there may be a central component at the same time. The terms "vertical", "horizontal", "upper", "lower", "left", "right" and similar expressions used in the specification of this application are for illustrative purposes only and do not represent the only implementation method.

[0044] In addition, the terms "first" and "second" are used for descriptive purposes only and should not be understood as indicating or implying relative importance or implicitly indicating the number of the indicated technical features. Therefore, the features defined as "first" and "second" may explicitly or implicitly include at least one of the features. In the description of this application, the meaning of "plurality" is at least two, such as two, three, etc., unless otherwise clearly and specifically defined.

[0045] In the present application, unless otherwise clearly specified and limited, a first feature being “above” or “below” a second feature may mean that the first feature is directly in contact with the second feature, or the first feature and the second feature are in contact indirectly through an intermediate medium. Moreover, a first feature being “above”, “above”, or “above” a second feature may mean that the first feature is directly above or obliquely above the second feature, or simply means that the first feature is higher in level than the second feature. A first feature being “below”, “below”, or “below” a second feature may mean that the first feature is directly below or obliquely below the second feature, or simply means that the first feature is lower in level than the second feature.

[0046] Unless otherwise defined, all technical and scientific terms used in the specification of this application have the same meaning as those commonly understood by those skilled in the art to which this application belongs. The terms used in the specification of this application are only for the purpose of describing specific embodiments and are not intended to limit this application. The term "and / or" used in the specification of this application includes any and all combinations of one or more related listed items.

[0047] The present application discloses a semiconductor refrigerator grain cleaning device, method, electronic device and storage medium, which include some or all of the technical features of the following embodiments; that is, the semiconductor refrigerator grain cleaning device includes some or all of the following structures. In one embodiment of the present application, a semiconductor refrigerator grain cleaning device includes a cleaning fixture, a cleaning tank, a motion module and an electric control box; the cleaning fixture is arranged on the motion module, and the cleaning fixture is provided with at least two clamping positions, each of which clamps a semiconductor refrigerator grain to be cleaned; the motion module is conductively connected to the electric control box, and the electric control box is provided with a control module and an operation timing storage module, and the control module controls the motion module to adjust the relative position of the cleaning fixture and the cleaning tank according to the preset operation timing stored in the operation timing storage module, so that each of the semiconductor refrigerator grains clamped by the cleaning fixture is immersed in the cleaning liquid stored in the cleaning tank, and the cleaning fixture and each of the semiconductor refrigerator grains clamped by it are separated from the cleaning liquid. The above-mentioned semiconductor refrigerator grain cleaning device can clean multiple semiconductor refrigerator grains at a time, and adopts a preset operation sequence. On the one hand, the cleaning process is completely completed automatically by the equipment, without the need to bind an operator, thereby greatly saving human resources and protecting the operator from the cleaning liquid; on the other hand, compared with traditional manual cleaning, it is at least 50% or even multiple levels higher, thereby greatly improving the cleaning efficiency; on the other hand, it can avoid the inconsistency of traditional manual cleaning, so that the semiconductor refrigerator grains have a higher consistency in cleaning, thereby avoiding product defects caused by the cleaning process.

[0048] Combine the following Figures 1 to 5 , the semiconductor refrigerator grain cleaning device, method, electronic equipment and storage medium are described in detail.

[0049] In one embodiment, a semiconductor refrigerator crystal cleaning device 100 is as follows: Figure 1 As shown, it includes a cleaning fixture 200, a cleaning tank 300, a motion module 400 and an electric control box 500. The cleaning fixture 200 is used to clamp the semiconductor refrigerator grains to be cleaned. The cleaning tank 300 stores the cleaning liquid used to clean the semiconductor refrigerator grains. The embodiments of the present application do not limit the specific cleaning liquid or the specific components of the cleaning liquid. The motion module 400 drives the cleaning fixture 200 to move to adjust the position of the cleaning fixture 200. The electric control box 500 controls the motion module 400.

[0050] In each embodiment, the cleaning fixture 200 is disposed on the motion module 400, and the cleaning fixture 200 is provided with at least two clamping positions 210, and each of the clamping positions 210 clamps a semiconductor cooler grain to be cleaned. In one embodiment, the cleaning fixture 200 is provided with two side surfaces disposed opposite to each other, and each of the side surfaces is provided with at least two clamping positions 210. Further, in one embodiment, in combination with Figure 2 The cleaning fixture 200 is provided with a mounting plate 220, and the mounting plate 220 is provided with two side surfaces arranged opposite to each other, and the side surfaces can also be called surfaces or bottom surfaces, and each of the side surfaces is provided with at least two clamping positions 210. This design can clean multiple semiconductor cooler grains at one time, which greatly improves the cleaning efficiency compared to the traditional manual individual clamping cleaning method.

[0051] In each embodiment, the motion module 400 is conductively connected to the electric control box 500 , and the electric control box 500 controls the relative position of the cleaning fixture 200 and the cleaning tank 300 by controlling the motion module 400 , so as to achieve the immersion and removal of each semiconductor refrigerator grain.

[0052] In one embodiment, the motion module 400 is a two-dimensional motion mechanism, which is used to move the cleaning fixture 200 up and down relative to the cleaning tank 300 to enter and exit the cleaning tank 300, and to move the cleaning fixture 200 left and right relative to the cleaning tank 300 to align with or leave the cleaning tank 300. Figure 2As shown, the motion module 400 includes a first direction moving module 410 and a second direction moving module 420, the second direction moving module 420 is arranged on the first direction moving module 410, the cleaning fixture 200 is arranged on the second direction moving module 420, the first direction moving module 410 drives the second direction moving module 420 to move along the first direction, and the second direction moving module 420 drives the cleaning fixture 200 to move along the second direction, so that each of the semiconductor cooler grains clamped by the cleaning fixture is immersed in the cleaning liquid stored in the cleaning tank, and the cleaning fixture and each of the semiconductor cooler grains clamped by it are separated from the cleaning liquid. In this embodiment, the first direction is the Y-axis direction, and the second direction is the Z-axis direction. The first-direction moving module 410 drives the second-direction moving module 420 to move left and right along the Y-axis direction to align with the cleaning tank 300 or leave the cleaning tank 300. When the semiconductor cooler crystal grains held by the cleaning fixture are aligned with the cleaning tank 300 and are in the state of moving along the second direction, i.e., the Z-axis direction, they can enter the cleaning tank 300 or be taken out of the cleaning tank 300; when the semiconductor cooler crystal grains held by the cleaning fixture leave the cleaning tank 300, they cannot enter the cleaning tank 300 by moving along the second direction. With such a design, the motion module 400 has the advantages of simple control, low cost, convenient implementation, and small space occupation, and is particularly suitable for semiconductor cooler crystal grain cleaning.

[0053] Because semiconductor cooler crystal products have very strict requirements on the soaking time, traditional cleaning equipment needs to be bound to cleaning personnel who have received strict training. During the cleaning period, the operator needs to use a stopwatch to time and replace the cleaning tank immediately. And because the time is precise, a large number of semiconductor cooler crystals cannot be processed at one time. In order to meet the time requirement, only 4 semiconductor cooler crystals, such as wafers, can be cleaned at one time, and the cleaning tank capacity is small. In contrast, in each embodiment of the present application, the electric control box 500 is provided with a control module and an operation timing storage module. The control module controls the motion module 400 to adjust the relative position of the cleaning fixture 200 and the cleaning tank 300 according to the preset operation timing stored in the operation timing storage module, so that each of the semiconductor cooler crystals clamped by the cleaning fixture 200 is immersed in the cleaning liquid stored in the cleaning tank 300, and the cleaning fixture 200 and each of the semiconductor cooler crystals clamped by it are separated from the cleaning liquid. The preset operation sequence includes where to soak, how long to soak, how long to leave to stand, etc.; combined with other embodiments, it can also include what order to soak in, whether ultrasonic cleaning is required, whether heating cleaning is required, etc., so it has extremely high scalability and universality. And such a design can clean multiple semiconductor cooler grains at a time, and use the preset operation sequence sequence operation, and the cleaning process is completely completed automatically by the equipment without binding operators, thereby greatly saving human resources, and is also conducive to protecting operators away from cleaning fluids, and can handle relatively more semiconductor cooler grains at a time.

[0054] Further, in one of the embodiments, the preset operation sequence includes a correspondence between at least two operation positions and operation times, and the operation positions include but are not limited to at least one immersion position and one waiting position; the operation time includes but is not limited to at least one immersion time and one waiting time. Further, in one of the embodiments, the preset operation sequence also includes additional processes and their processing time, such as ultrasonic cleaning for 10 seconds. Further, in one of the embodiments, the preset operation sequence includes: transferring the cleaning fixture 200 to the top of the first tank body 310 to be in a state to be cleaned, moving the cleaning fixture 200 down to a preset height so that each of the semiconductor cooler grains clamped by the cleaning fixture 200 is immersed in the cleaning liquid stored in the first tank body 310, soaking for a first time, resetting the cleaning fixture 200 to the top of the first tank body 310 and waiting for a second time; thus, the cleaning of the semiconductor cooler grains in the first tank body is completed, and excessive loss of the cleaning liquid can be avoided. The cleaning jig 200 is transferred to the top of the second trough body 320 to be in a state to be cleaned, and the cleaning jig 200 is moved down to a preset height so that all the semiconductor cooler grains clamped by the cleaning jig 200 are immersed in the cleaning liquid stored in the second trough body 320, and soaked for a third time, and the cleaning jig 200 is reset to the top of the second trough body 320 and waits for a fourth time; thus, the cleaning of the semiconductor cooler grains in the second trough body is completed. The cleaning jig 200 is transferred to the top of the third trough body 330 to be in a state to be cleaned, and the cleaning jig 200 is moved down to a preset height so that all the semiconductor cooler grains clamped by the cleaning jig 200 are immersed in the cleaning liquid stored in the third trough body 330, and soaked for a fifth time, and the cleaning jig 200 is reset to the top of the third trough body 330 and waits for a sixth time; thus, the cleaning of the semiconductor cooler grains in the second trough is completed. Figure 1 The embodiment with only three tanks is shown, and all cleaning processes are completed. For the embodiment with more tanks, the cleaning fixture 200 can be transferred and soaked and waited. The same is true for the other embodiments, and no further description is given.

[0055] Considering the need for multi-tank cleaning, in one embodiment, the cleaning tank 300 includes three tank bodies arranged side by side, and the motion module 400 sequentially adjusts the relative positions of the cleaning fixture 200 and the three tank bodies so that the semiconductor cooler grains clamped by the cleaning fixture 200 are immersed in the cleaning liquid stored in the three tank bodies in sequence. Figure 1As shown, in this embodiment, the cleaning tank 300 includes three tank bodies arranged side by side, namely the first tank body 310, the second tank body 320 and the third tank body 330. The semiconductor refrigerator grains clamped by the cleaning fixture 200 are immersed in the cleaning liquid stored in the three tank bodies in sequence, for example, first immersed in the cleaning liquid stored in the first tank body 310, then immersed in the cleaning liquid stored in the second tank body 320, and then immersed in the cleaning liquid stored in the third tank body 330, and finally taken out to complete the cleaning. By analogy, the present application can also be applied to other numbers of tank bodies to clean the semiconductor refrigerator grains. It can be understood that in each embodiment, the semiconductor refrigerator grains can be granular, or flake-shaped, such as chips, or round-shaped, such as wafers.

[0056] In order to avoid the overflow of the cleaning liquid caused by the transfer between the various tank bodies, in one embodiment, the cleaning tank 300 also includes a bottom plate and a cover, the cover is rotatably arranged on the bottom plate and forms an enclosure together with the bottom plate, the three tank bodies are regularly arranged on the bottom plate and are located in the enclosure; the cover is provided with a through slot, the motion module 400 passes through the through slot and is movably arranged in the through slot to adjust the relative position of the cleaning fixture 200 and the three tank bodies in the enclosure. Furthermore, in one embodiment, the bottom plate is provided with an overflow collection pipe for collecting the cleaning liquid dripping from the gaps between the three tank bodies and transporting it to a recovery container. Such a design, on the one hand, is conducive to concentrating the cleaning liquid dripping from the cleaning fixture 200 due to cleaning on the chassis for cleaning; on the other hand, it is conducive to protecting the cleaning liquid through the cover during the cleaning process, and does not affect the movement of the cleaning fixture 200 driven by the motion module 400; on the other hand, compared with traditional manual cleaning, the improvement is at least 50% or even multiple levels. The more the number of troughs and the more the number of semiconductor cooler grains clamped by the cleaning fixture 200, the more obvious the improvement is, thereby greatly improving the cleaning efficiency.

[0057] In order to provide some feedback information, in one embodiment, the electric control box 500 is also provided with an indication module conductively connected to the control module; the indication module can give indications through sound, text, light and other means.

[0058] The traditional grain cleaning process replaces the cleaning solution by registering the usage time, which cannot intuitively present the saturation of the cleaning solution. It can only manually register the usage time of the corresponding cleaning box solution. This makes it easy for the saturated solution to not be replaced immediately, affecting the cleaning effect and causing poor cleaning. In order to avoid cleaning failure due to excessive cleaning time of the cleaning solution, in one embodiment, the electrical control box 500 is also provided with an immersion timing module connected to the control module, which is used to accumulate the usage time of the cleaning solution and when the preset time threshold is reached, the control module controls the indication module to issue a prompt message for changing the cleaning solution. Such a design is conducive to giving a prompt for changing the cleaning solution through the usage time. The prompt message for changing the cleaning solution includes but is not limited to sound, text, and light.

[0059] During the operation of traditional cleaning equipment, there is no obvious oversaturation warning for the saturation of the solution, which will affect the immersion effect of the solution. In order to avoid cleaning failure due to insufficient saturation caused by too many cleaning times of the cleaning solution, further, in one of the embodiments, the electrical control box 500 is also provided with an immersion counting module connected to the control module, which is used to accumulate the number of times the cleaning solution is used and when a preset number threshold is reached, the control module controls the indication module to issue a reminder message for changing the cleaning solution.

[0060] In order to avoid cleaning failure due to abnormality of the cleaning fluid, in one embodiment, the semiconductor refrigerator crystal cleaning device 100 further includes a detection module, which is arranged on the motion module 400 and is conductively connected to the control module. The detection module is used to control the indication module to issue a cleaning fluid abnormality prompt message through the control module when an abnormality occurs in the cleaning fluid stored in the cleaning tank 300. In one embodiment, the detection module is a video detection module or a humidity sensor, etc.

[0061] In order to facilitate the control of the electric control box 500, in one embodiment, as Figure 3 As shown, the semiconductor refrigerator crystal cleaning device 100 also includes a control terminal 600, the control terminal 600 is conductively connected to the electric control box 500, and the control terminal 600 is used to send a control signal to the control module, and send the preset operation sequence to the operation sequence storage module; further, in one embodiment, the indication module is arranged in the control terminal 600 and conductively connected to the control module. In one embodiment, the control terminal 600 is a PC or a single-chip microcomputer or an industrial computer, etc. In one embodiment, the control terminal 600 is a PC host computer.

[0062] In order to facilitate the overall movement of the semiconductor refrigerator crystal cleaning device 100, in one embodiment, the semiconductor refrigerator crystal cleaning device 100 further includes a frame, and the cleaning tank 300, the motion module 400 and the electric control box 500 are respectively arranged on the frame. Further, in one embodiment, the shell of the electric control box 500 is integrally arranged with the frame, and the cleaning tank 300 and the motion module 400 are respectively arranged on the shell of the electric control box 500. Further, in one embodiment, in combination with Figure 1 and Figure 2 The housing of the electric control box 500 is provided with a mounting position 510, each of which is used to position and mount a cleaning tank 300 or a tank body thereof, wherein the tank body includes a first tank body 310, a second tank body 320 and a third tank body 330. Such a design is conducive to the overall movement of the semiconductor refrigerator grain cleaning device 100 and is also conducive to the connection of other structural parts.

[0063] In order to accurately control the immersion time of each semiconductor refrigerator grain, in one embodiment, the cleaning fixture 200 includes a reciprocating half-turn drive, a rotating shaft and a chuck, and each of the clamping positions 210 is arranged on the chuck and regularly arranged in a matrix; the reciprocating half-turn drive is conductively connected to the electrical control box 500, and each time the chuck enters the cleaning tank 300, the reciprocating half-turn drive drives the chuck to reciprocate 180 degrees around the rotating shaft, so that the semiconductor refrigerator grain that enters the cleaning tank 300 first is taken out of the cleaning tank 300 first after immersion; in one embodiment, the chuck is provided with two side surfaces arranged opposite to each other, and each of the side surfaces is provided with at least two clamping positions 210; further, in one embodiment, the chuck is semicircular, and at least two clamping positions 210 are provided on each of its two sides. Such a design is conducive to evenly distributing the immersion time of the semiconductor refrigerator grains in the cleaning tank 300, so that each semiconductor refrigerator grain to be cleaned can follow the first-in-first-out principle, and the immersion time of each semiconductor refrigerator grain in the cleaning tank 300 is almost consistent, and can be accurately controlled to a time level of 0.1 seconds or even with smaller differences. This is completely impossible with traditional manual immersion methods, thereby avoiding the inconsistency of traditional manual cleaning, making the semiconductor refrigerator grains have higher consistency in cleaning, and thus more effectively avoiding product defects caused by the cleaning process.

[0064] In one embodiment, a semiconductor refrigerator grain cleaning method is implemented by using the semiconductor refrigerator grain cleaning device 100 described in any embodiment. In one embodiment, a semiconductor refrigerator grain cleaning method is as follows Figure 4As shown, it includes the steps: S100, clamping each semiconductor refrigerator grain to be cleaned on the clamping position 210 of the cleaning fixture 200; S200, setting a preset operation sequence; S300, judging whether the cleaning liquid stored in the cleaning tank 300 is available, and executing S400 if it is available; S400, the control module controls the motion module 400 to adjust the relative position of the cleaning fixture 200 and the cleaning tank 300 according to the preset operation sequence, so that each semiconductor refrigerator grain is immersed in the cleaning liquid stored in the cleaning tank 300; S500, the control module controls the motion module 400 to adjust the relative position of the cleaning fixture 200 and the cleaning tank 300 according to the preset operation sequence, so that each semiconductor refrigerator grain is separated from the cleaning liquid. Such a design can clean multiple semiconductor refrigerator grains at one time, and adopts a preset operation sequence. On the one hand, the cleaning process is completely completed automatically by the equipment, without the need to bind an operator, which greatly saves human resources and is also beneficial for protecting operators away from cleaning fluids; on the other hand, compared with traditional manual cleaning, it is at least 50% or even multiple levels higher, thereby greatly improving the cleaning efficiency; on the other hand, it can avoid the inconsistency of traditional manual cleaning, so that the semiconductor refrigerator grains have a higher consistency in cleaning, thereby avoiding product defects caused by the cleaning process.

[0065] In order to adapt to the cleaning tank 300 with multiple tanks, in one embodiment, in step S400, the control module controls the motion module 400 to adjust the relative position of the cleaning fixture 200 and the first tank body of the cleaning tank 300 according to the preset operation sequence, so that each of the semiconductor refrigerator grains is immersed in the cleaning liquid stored in the tank body; in step S500, the control module controls the motion module 400 to adjust the relative position of the cleaning fixture 200 and the tank body according to the preset operation sequence, so that each of the semiconductor refrigerator grains is separated from the cleaning liquid; after step S500, it also includes the following steps: S600, judging whether the cleaning is completed, otherwise executing S700; S700, the control module controls the motion module 400 to adjust the relative position of the cleaning fixture 200 and the next tank body of the cleaning tank 300 according to the preset operation sequence, so that each of the semiconductor refrigerator grains is immersed in the cleaning liquid stored in the next tank body; return to execute S500. In one embodiment, a semiconductor refrigerator grain cleaning method is as follows Figure 5As shown, it includes the following steps: S100, clamping each semiconductor refrigerator grain to be cleaned on the clamping position 210 of the cleaning fixture 200; S200, setting a preset operation sequence; S300, judging whether the cleaning liquid stored in the cleaning tank 300 is available, and executing S400 if it is available; S400, the control module controls the motion module 400 to adjust the relative position of the cleaning fixture 200 and the first tank body of the cleaning tank 300 according to the preset operation sequence, so that each semiconductor refrigerator grain is immersed in the cleaning liquid stored in the tank body; S500, The control module controls the motion module 400 to adjust the relative position of the cleaning fixture 200 and the tank body according to the preset operation sequence, so that each of the semiconductor refrigerator grains is separated from the cleaning liquid; S600, determine whether the cleaning is completed, otherwise execute S700; S700, the control module controls the motion module 400 to adjust the relative position of the cleaning fixture 200 and the next tank body of the cleaning tank 300 according to the preset operation sequence, so that each of the semiconductor refrigerator grains is immersed in the cleaning liquid stored in the next tank body; return to execute S500.

[0066] Next, continue to combine Figures 1 to 5 The semiconductor refrigerator crystal grain cleaning device and method described in the present application are described. In one embodiment, the semiconductor refrigerator crystal grain cleaning device 100 includes a cleaning fixture 200, a cleaning tank 300, a motion module 400, an electric control box 500 and a control terminal 600.

[0067] The cleaning fixture 200 is used to clamp the grains to be cleaned. In one embodiment, six fixing devices are provided inside the cleaning fixture 200 as the clamping position 210. As for the number of grains to be cleaned, it mainly involves the actual volume of the cleaning fixture 200 and the cleaning tank 300. In theory, this application can be achieved by simply increasing the volume of the relevant mechanisms at the same time. Due to the problem of cleaning time control, this cannot be achieved by traditional cleaning equipment.

[0068] The cleaning tank 300 is used to contain cleaning solvent, that is, cleaning liquid. There are scale lines inside the cleaning tank 300 to indicate the amount of solution used. The cleaning liquid is used to soak and clean the cleaning fixture 200 in the cleaning tank 300; ultrasonic cleaning and heating cleaning functions can also be used in combination.

[0069] The motion module 400 provides motion function for the cleaning fixture 200. The illustrated embodiment uses two stepper motors to provide reciprocating motion in the Y-axis and Z-axis directions respectively. The control circuit of the motion module 400 is placed in the electrical control box 500. The entire automated cleaning process can be controlled by cooperating with the electrical control box 500 through the software of the control terminal 600, such as a PC host computer. The motion module 400 shown in the figure is a two-dimensional motion mechanism. In other cases, the motion module 400 can be replaced by other motor systems or two-axis manipulators.

[0070] The electric control box 500 is used to place the cleaning tank 300 and the motion module 400, as well as the control circuit of the built-in motion module 400; the PC host computer is used as a software running carrier, and a configuration development environment can be used in combination with a stepper motor driver card to complete motion control; in addition to the PC host computer, the control terminal 600 can also be replaced by a touch screen and an industrial computer, a PLC or a single-chip microcomputer.

[0071] The specific cleaning process example is described below.

[0072] The operator places the wafers to be cleaned in the fixing device of the cleaning fixture 200. In the illustrated embodiment, a total of 6 wafers are placed as semiconductor refrigerator grains to be cleaned.

[0073] Open the software part of the PC host computer, set the cleaning time of the three-stage immersion as the preset operation sequence, and then start cleaning.

[0074] The motion module 400 moves the cleaning fixture 200 to the top of the first tank body 310 through the Y-axis motor, and then moves the cleaning fixture 200 to the working point inside the first tank body 310 through the Z-axis motor to start the first stage of immersion.

[0075] After the first stage of immersion is completed, the motion module 400 moves the cleaning fixture 200 to a safe position through the Z-axis motor, and then moves it to the top of the second tank body 320 through the Y-axis motor. After completion, the cleaning fixture 200 is moved to the working point inside the second tank body 320 to start the second stage of immersion.

[0076] The third stage of soaking the Y axis can refer to the above movement mode, and the cleaning fixture 200 can be moved to the relevant position of the third tank 330. After the cleaning is completed, the PC host machine prompts that the cleaning product needs to be replaced, and the cleaning is continued after the product to be cleaned is replaced.

[0077] The saturation of the solution in the cleaning tank 300 can be reflected by the total immersion time. When the use time is exceeded, the PC host will prompt you to replace the solution. After manually replacing the solution in all the cleaning tanks 300, you can continue to restart the cleaning.

[0078] On the one hand, this processing method is conducive to liberating manpower, because the cleaning process is completely completed automatically by the equipment, so the operator can be liberated. On the other hand, it is conducive to expanding capacity. The illustrated embodiment can clean 6 wafers at a time, which is 50% higher than the traditional process. In fact, due to the precise time control, more wafers can be cleaned at one time. In some embodiments, a solution oversaturation prompt is also designed. For example, by automatically accumulating the usage time of 300 solutions in each cleaning tank, the saturation degree of the solution is instantly fed back through the usage time. When it is oversaturated, a change prompt appears on the software interface. It is also possible to use a detection module such as a visual system to determine whether the solution is saturated based on the actual condition of the final grain.

[0079] In one embodiment, an electronic device includes a memory and a processor, wherein the memory stores a computer program, and the processor implements the steps of the semiconductor cooler grain cleaning method described in any embodiment when executing the computer program. The electronic device may also be referred to as a device or an electronic control device. In one embodiment, an electronic device is also provided, including a memory and a processor, wherein the memory stores a computer program, and the processor implements the steps of the semiconductor cooler grain cleaning method described in the above embodiments when executing the computer program.

[0080] In one embodiment, a computer-readable storage medium stores a computer program, characterized in that the computer program, when executed by a processor, implements the steps of the semiconductor refrigerator grain cleaning method described in any embodiment. A person of ordinary skill in the art can understand that the implementation of all or part of the process in the above-mentioned embodiment method can be completed by instructing the relevant hardware through a computer program, and the computer program can be stored in a non-volatile computer-readable storage medium. When the computer program is executed, it can include the process of the embodiments of the above-mentioned methods. Among them, any reference to memory, storage, database or other media used in the embodiments provided in this application may include at least one of non-volatile and volatile memory. Non-volatile memory may include read-only memory (ROM), tape, floppy disk, flash memory or optical memory, etc. Volatile memory may include random access memory (RAM) or external cache memory. As an illustration and not limitation, RAM can be in various forms, such as static random access memory (SRAM) or dynamic random access memory (DRAM).

[0081] It should be noted that other embodiments of the present application also include semiconductor refrigerator grain cleaning devices, methods, electronic devices and storage media that can be implemented by combining the technical features in the above embodiments.

[0082] The technical features of the above-described embodiments may be arbitrarily combined. To make the description concise, not all possible combinations of the technical features in the above-described embodiments are described. However, as long as there is no contradiction in the combination of these technical features, they should be considered to be within the scope of this specification.

[0083] The above-described embodiments only express several implementation methods of the present application, and the descriptions thereof are relatively specific and detailed, but they cannot be understood as limiting the scope of the patent application. It should be pointed out that, for a person of ordinary skill in the art, several variations and improvements can be made without departing from the concept of the present application, and these all belong to the protection scope of the present application. Therefore, the scope of patent protection of the present application shall be subject to the attached claims.

Claims

1. A semiconductor refrigerator crystal cleaning device, characterized in that: Including cleaning fixture, cleaning tank, motion module and electric control box; The cleaning fixture is arranged on the motion module, and the cleaning fixture is provided with at least two clamping positions, each of which clamps a semiconductor refrigerator grain to be cleaned; the cleaning fixture comprises a reciprocating half-turn driver, a rotating shaft and a chuck, and each of the clamping positions is arranged on the chuck and is regularly arranged in a matrix; the reciprocating half-turn driver is conductively connected to the electric control box, and each time the chuck enters the cleaning tank, the reciprocating half-turn driver drives the chuck to reciprocate 180 degrees around the rotating shaft, so that the semiconductor refrigerator grain that enters the cleaning tank first is taken out of the cleaning tank first after soaking; The motion module is conductively connected to the electric control box, and the electric control box is provided with a control module and an operation sequence storage module. The control module controls the motion module to adjust the relative position of the cleaning fixture and the cleaning tank according to the preset operation sequence stored in the operation sequence storage module, so that each semiconductor refrigerator grain clamped by the cleaning fixture is immersed in the cleaning liquid stored in the cleaning tank, and the cleaning fixture and each semiconductor refrigerator grain clamped by the cleaning fixture are separated from the cleaning liquid. The preset operation sequence includes a correspondence between at least two operation positions and operation times, wherein the operation positions include but are not limited to at least one immersion position and one waiting position; the operation time includes but is not limited to at least one immersion time and one waiting time, and the preset operation sequence also includes additional processes and their processing time; The preset operation sequence includes: The cleaning fixture is transferred to the top of the first tank body to be in a state to be cleaned, and the cleaning fixture is moved down to a preset height so that each semiconductor refrigerator grain clamped by the cleaning fixture is immersed in the cleaning liquid stored in the first tank body for a first soaking time, and the cleaning fixture is reset to the top of the first tank body and waits for a second time; The cleaning jig is transferred to the top of the second tank body to be in a state to be cleaned, the cleaning jig is moved down to a preset height so that each semiconductor refrigerator grain clamped by the cleaning jig is immersed in the cleaning liquid stored in the second tank body, immersed for a third time, and the cleaning jig is reset to the top of the second tank body and waited for a fourth time; The cleaning jig is transferred to the top of the third tank body to be in a state to be cleaned, and the cleaning jig is moved down to a preset height so that each of the semiconductor refrigerator grains clamped by the cleaning jig is immersed in the cleaning liquid stored in the third tank body, soaked for a fifth time, and the cleaning jig is reset to the top of the third tank body and wait for a sixth time.

2. The semiconductor refrigerator crystal cleaning device according to claim 1, characterized in that: The electric control box is also provided with an indication module which is conductively connected to the control module; and The electrical control box is also provided with an immersion timing module connected to the control module, which is used to accumulate the usage time of the cleaning fluid and when a preset time threshold is reached, the control module controls the indication module to issue a reminder message for replacing the cleaning fluid; and / or, the semiconductor refrigerator grain cleaning device also includes a detection module, which is arranged on the motion module and conductively connected to the control module, and the detection module is used to control the indication module to issue a cleaning fluid abnormality prompt message through the control module when an abnormality occurs in the cleaning fluid stored in the cleaning tank.

3. The semiconductor refrigerator crystal cleaning device according to claim 1, characterized in that: The motion module is a two-dimensional motion mechanism, which is used to move the cleaning fixture up and down relative to the cleaning tank to enter and exit the cleaning tank, and to move the cleaning fixture left and right relative to the cleaning tank to align with or leave the cleaning tank; or, The cleaning fixture or its clamping plate is provided with two side surfaces which are arranged opposite to each other, and each of the side surfaces is provided with at least two clamping positions.

4. The semiconductor refrigerator crystal cleaning device according to claim 1, characterized in that: It also includes a control terminal, which is conductively connected to the electric control box, and is used to send a control signal to the control module and send the preset operation sequence to the operation sequence storage module; or, The semiconductor refrigerator crystal cleaning device further comprises a frame, and the cleaning tank, the motion module and the electric control box are respectively arranged on the frame; or, The electric control box is also provided with an immersion counting module connected to the control module, which is used to accumulate the number of times the cleaning liquid is used and when a preset number threshold is reached, the control module controls the indication module to issue a reminder message for replacing the cleaning liquid.

5. The semiconductor refrigerator crystal cleaning device according to any one of claims 1 to 4, characterized in that: The cleaning tank includes three tank bodies arranged side by side, and the motion module sequentially adjusts the relative positions of the cleaning fixture and the three tank bodies so that the semiconductor refrigerator grains clamped by the cleaning fixture are immersed in the cleaning liquid stored in the three tank bodies in sequence.

6. The semiconductor refrigerator crystal cleaning device according to claim 5, characterized in that: The cleaning tank further comprises a bottom plate and a cover, wherein the cover is rotatably disposed on the bottom plate and forms an enclosure together with the bottom plate, wherein the three tank bodies are regularly arranged on the bottom plate and are located in the enclosure; wherein the bottom plate is provided with an overflow collection pipe for collecting the cleaning liquid dripping from the gaps between the three tank bodies and transporting the cleaning liquid to a recovery container; The cover is provided with a through slot, and the moving module passes through the through slot and is movably arranged in the through slot so as to adjust the relative positions of the cleaning fixture and the three slot bodies in the enclosed area.

7. A semiconductor refrigerator grain cleaning method, characterized in that: The semiconductor refrigerator grain cleaning device according to any one of claims 1 to 6 is used to implement the semiconductor refrigerator grain cleaning method, which comprises the steps of: S100, clamping each semiconductor refrigerator crystal grain to be cleaned on the clamping position of the cleaning fixture; S200, setting a preset operation sequence; S300, determining whether the cleaning liquid stored in the cleaning tank is available, if yes, executing S400; S400, the control module controls the motion module to adjust the relative position of the cleaning fixture and the cleaning tank according to the preset operation sequence, so that each of the semiconductor refrigerator grains is immersed in the cleaning liquid stored in the cleaning tank; S500, the control module controls the motion module to adjust the relative position of the cleaning fixture and the cleaning tank according to the preset operation sequence, so that each of the semiconductor cooler grains is separated from the cleaning liquid.

8. The semiconductor refrigerator grain cleaning method according to claim 7, characterized in that: In step S400, the control module controls the motion module to adjust the relative position of the cleaning fixture and the first tank body of the cleaning tank according to the preset operation sequence, so that each of the semiconductor refrigerator grains is immersed in the cleaning liquid stored in the tank body; In step S500, the control module controls the motion module to adjust the relative position of the cleaning fixture and the tank body according to the preset operation sequence, so that each of the semiconductor refrigerator grains is separated from the cleaning liquid; After step S500, the method further includes the following steps: S600, determining whether the cleaning is completed, if not, executing S700; S700, the control module controls the motion module to adjust the relative position of the cleaning fixture and the next tank body of the cleaning tank according to the preset operation sequence, so that each of the semiconductor refrigerator grains is immersed in the cleaning liquid stored in the next tank body; return to execute S500.

9. An electronic device comprising a memory and a processor, wherein the memory stores a computer program, wherein: When the processor executes the computer program, the steps of the semiconductor refrigerator grain cleaning method according to any one of claims 7 to 8 are implemented.

10. A computer-readable storage medium storing a computer program, characterized in that: When the computer program is executed by a processor, the steps of the semiconductor cooler grain cleaning method according to any one of claims 7 to 8 are implemented.

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