A heat sink and electronic device

Abstract

The application provides a radiator and an electronic device, relates to the technical field of electronic devices, and aims to solve the problem of how to reduce the influence of electromagnetic noise on the performance of an antenna without greatly reducing the heat dissipation performance of electronic components. The electronic device comprises a circuit board, an electronic component, a radiator and an antenna. The circuit board has a first surface. The electronic component is located on the side facing the first surface, and the electronic component is electrically connected to the first surface. The radiator is located on the side of the electronic component away from the circuit board, and the radiator is in thermal conduction with the electronic component. The radiator comprises a middle region and an edge, the edge comprises opposite first and second edges, and opposite third and fourth edges, the fourth edge is provided with a cut corner with the second edge, and the part of the edge connected between the fourth edge and the second edge on the radiator is a cut corner edge. The antenna is arranged on the side of the cut corner edge away from the middle region of the radiator. The electronic device provided by the application is used for office or entertainment.

Description

TECHNICAL FIELD

[0001] The present application relates to the technical field of electronic devices, and in particular to a heat sink and an electronic device comprising the same. BACKGROUND

[0002] With the development of electronic information technology, the data transmission rate of electronic devices is increasing, and there are more and more high-speed digital interface signals in large-screen and other large electronic devices. When the electronic device is working, system-on-a-chip (SOC), application processor (AP), double data rate (DDR) and universal flash storage (UFS) chips and power electronic components on the internal circuit board will radiate high-speed digital signal electromagnetic noise. In addition, with the surge in power consumption of these electronic components, heat dissipation through a metal heat sink has become the mainstream. In this way, when the electronic device is working, the electromagnetic noise generated by the electronic components is coupled with the metal heat sink to radiate high-frequency electromagnetic noise to the surrounding space through the metal heat sink, thereby affecting the OTA (over the air) performance of the antenna in the surrounding space, and the total isotropic sensitivity (TIS) cannot meet the standard, resulting in poor antenna performance and reduced network throughput. SUMMARY

[0003] Embodiments of the present application provide a heat sink and an electronic device, which are used to solve the problem of how to reduce the influence of electromagnetic noise on the performance of an antenna without significantly reducing the heat dissipation performance of the heat sink.

[0004] To achieve the above-mentioned purpose, the embodiments of the present application adopt the following technical solutions:

[0005] In a first aspect, an electronic device is provided, which includes a circuit board, an electronic component, a heat sink, and an antenna. The circuit board has a first surface. The electronic component is located on a side facing the first surface, and the electronic component is electrically connected to the first surface. The heat sink is located on a side of the electronic component away from the circuit board, and the heat sink is in thermal conduction with the electronic component. The heat sink includes a middle region and an edge, and the edge includes opposite first and second edges, and opposite third and fourth edges. A cut corner is provided between the fourth edge and the second edge. A portion of the edge connected between the fourth edge and the second edge of the heat sink is a cut corner edge, and the cut corner is a non-solid region surrounded by the extension line of the cut corner edge, the fourth edge, and the second edge. On this basis, the antenna is arranged on a side of the cut corner edge away from the middle region of the heat sink.

[0006] In this way, when the electronic device is in operation, electromagnetic noise generated by the electronic components is coupled with the heat sink to radiate high-frequency electromagnetic noise to a larger space around the heat sink through the heat sink. On this basis, the fourth side and the second side of the heat sink are provided with a chamfer. The chamfer can destroy the symmetry of the heat sink, and can deflect the electric field distribution on the heat sink to make the electric field intensity of the heat sink at the chamfer side weaker, so as to weaken the electromagnetic field intensity of the partial area radiated by the chamfer side. The partial area radiated by the chamfer side refers to the chamfer area and the area on one side of the central area of the heat sink away from the chamfer area, so that the antenna can be placed in these areas to improve the isolation between the heat sink and the antenna. On this basis, the antenna is arranged on one side of the chamfer side away from the central area of the heat sink, that is, the antenna is arranged in the chamfer area or the area on one side of the central area of the heat sink away from the chamfer area. According to the foregoing description, the electromagnetic field intensity of these areas is weak, the interference of the heat sink on the antenna is weak, the isolation between the heat sink and the antenna is high, and the performance of the antenna is better.

[0007] In a possible implementation of the first aspect, the chamfer side is an inclined side, and the inclined side is inclined relative to the fourth side and the second side. The inclined side has a simple structure and is convenient to process.

[0008] In a possible implementation of the first aspect, the chamfer side is inclined relative to the fourth side at an angle greater than or equal to 30° and less than or equal to 60°. Specifically, the angle can be 30°, 35°, 40°, 45°, 50°, 55° or 60°. In this way, the electric field distribution of the heat sink can be deflected by a large angle, so as to weaken the electromagnetic field intensity of the chamfer area and the area on one side of the central area of the heat sink away from the chamfer area.

[0009] In a possible implementation of the first aspect, in a plane parallel to the heat sink, a projection of the antenna on the chamfer side overlaps the chamfer side. In this way, the antenna is opposite to the chamfer side, the interference between the antenna and the heat sink is weak, and the isolation is high.

[0010] In a possible implementation of the first aspect, the chamfer side is a circular arc side, the circular arc side is arched away from the central area of the heat sink, and the circular arc side is tangent to the fourth side and the second side. This structure has a smooth edge transition, which can prevent scratching other devices during transportation and assembly.

[0011] In a possible implementation manner of the first aspect, a projection length of the cut-off corner edge in the extension direction of the fourth edge is less than or equal to 1 / 2 of the width of the heat dissipation device in the extension direction of the fourth edge. Specifically, the length can be 1 / 2, 1 / 4, 1 / 8, 3 / 8, and the like of the width, which is not limited herein. In this way, the electric field distribution of the heat dissipation device can be deflected at a large angle, while the heat dissipation performance of the heat dissipation device is less affected, and the heat dissipation capacity of the heat dissipation device can be ensured.

[0012] In a possible implementation manner of the first aspect, the first edge is parallel to the second edge, the third edge is parallel to the fourth edge, and the third edge is perpendicular to the first edge. In this way, the heat dissipation device is approximately rectangular or square, which is regular in structure and convenient to process.

[0013] In a possible implementation manner of the first aspect, the width of the heat dissipation device in the extension direction of the first edge and the second edge is a first width, and the width of the heat dissipation device in the extension direction of the third edge and the fourth edge is a second width. The first width is greater than the second width. In this way, the heat dissipation device is approximately rectangular, and the first edge and the second edge form opposite long sides of the rectangular structure, and the third edge and the fourth edge form opposite short sides of the rectangular structure. The rectangular heat dissipation device does not need to ensure that the length and the width are consistent, and therefore is less difficult to manufacture.

[0014] In a possible implementation manner of the first aspect, the third edge is connected to the first edge or is provided with a first chamfer, the third edge is connected to the second edge or is provided with a second chamfer, and the fourth edge is connected to the first edge or is provided with a third chamfer. The area of the first chamfer, the area of the second chamfer, and the area of the third chamfer are all less than the area of the cut-off corner. This structure is simple, and when the third edge is provided with the first chamfer, the third edge is provided with the second chamfer, and the fourth edge is provided with the third chamfer, the sharp corners of the edge corner parts of the heat dissipation device can be avoided, and other devices can be prevented from being scratched during transportation and assembly.

[0015] In a possible implementation manner of the first aspect, the heat dissipation device includes a metal heat dissipation plate and fins. The metal heat dissipation plate is stacked and spaced apart from the circuit board. The fins are arranged on the surface of the metal heat dissipation plate away from the electronic components, and the fins are integrally formed with the metal heat dissipation plate. This structure is simple and has good heat dissipation performance.

[0016] In a possible implementation manner of the first aspect, the electronic component includes at least one of an SOC, a DDR, and an AP.

[0017] In a possible implementation manner of the first aspect, the antenna is a Bluetooth antenna, a WIFI-2.4G antenna, a WIFI-5G antenna, or a GPS antenna.

[0018] In a possible implementation manner of the first aspect, the electronic device is a large-screen display device.

[0019] In a second aspect, a heat sink is provided, which comprises a middle region and an edge, the edge comprising opposite first and second edges, and opposite third and fourth edges, the fourth edge being provided with a chamfer relative to the second edge, and a part of the edge between the fourth edge and the second edge being connected to the heat sink being a chamfered edge, the chamfer being a non-solid region surrounded by the chamfered edge, an extension line of the fourth edge and an extension line of the second edge.

[0020] When the heat sink is applied to an electronic device, and the electronic device is working, electromagnetic noise generated by electronic components is coupled with the heat sink to radiate high-frequency electromagnetic noise to a larger space around the heat sink. On this basis, since the fourth edge of the heat sink is provided with a chamfer relative to the second edge, the chamfer can break the symmetry of the heat sink, and can deflect the electric field distribution on the heat sink, so that the electric field intensity at the chamfered edge of the heat sink is weaker, thereby weakening the electromagnetic field intensity of the part of the area radiated by the chamfered edge. The part of the area radiated by the chamfered edge refers to the chamfered area and the area on the side of the chamfered area away from the middle region of the heat sink, so that the antenna can be placed in these areas to improve the isolation between the heat sink and the antenna.

[0021] In a possible implementation manner of the second aspect, the chamfered edge is an inclined edge, which is inclined relative to the fourth edge and the second edge. The inclined edge has a simple structure and is convenient to process.

[0022] In a possible implementation manner of the second aspect, the chamfered edge is an inclined edge, which is inclined relative to the fourth edge and the second edge. The inclined edge has a simple structure and is convenient to process.

[0023] In a possible implementation manner of the second aspect, the chamfered edge is an inclined edge, which is inclined relative to the fourth edge and the second edge. The inclined edge has a simple structure and is convenient to process.

[0024] In a possible implementation manner of the second aspect, the first edge is parallel to the second edge, the third edge is parallel to the fourth edge, and the third edge is perpendicular to the first edge. In this way, the heat sink is approximately rectangular or square, and this structure is regular and convenient to process.

[0025] In a possible implementation of the second aspect, the width of the heat sink in the extension direction of the first edge and the second edge is a first width; the width of the heat sink in the extension direction of the third edge and the fourth edge is a second width; and the first width is greater than the second width. In this way, the heat sink is approximately rectangular, and the first edge and the second edge form opposite long edges of the rectangular structure, and the third edge and the fourth edge form opposite short edges of the rectangular structure. The rectangular heat sink does not need to ensure that the length and the width are consistent, and therefore is relatively easy to manufacture.

[0026] In a possible implementation of the second aspect, the projection length of the beveled edge in the extension direction of the fourth edge is less than or equal to 1 / 2 of the width of the heat sink in the extension direction of the fourth edge. Specifically, the length can be 1 / 2, 1 / 4, 1 / 8, 3 / 8, or the like, of the width, without specific limitation. In this way, the electric field distribution of the heat sink can be deflected at a relatively large angle, while the heat dissipation performance of the heat sink is less affected, and the heat dissipation capacity of the heat sink can be ensured.

[0027] In a possible implementation of the second aspect, the third edge is connected to the first edge or is provided with a first chamfer, the third edge is connected to the second edge or is provided with a second chamfer, and the fourth edge is connected to the first edge or is provided with a third chamfer. The area of the first chamfer, the area of the second chamfer, and the area of the third chamfer are all less than the area of the bevel. This structure is simple, and when the third edge is connected to the first edge or is provided with the first chamfer, the third edge is connected to the second edge or is provided with the second chamfer, and the fourth edge is connected to the first edge or is provided with the third chamfer, the sharp corners of the edge corner part of the heat sink can be avoided, and other devices can be prevented from being scratched during transportation and assembly.

[0028] In a possible implementation of the second aspect, the heat sink includes a metal heat dissipation plate and fins. The fins are arranged on a surface of the metal heat dissipation plate surrounded by the first edge, the second edge, the third edge, and the fourth edge, and the fins are integrally formed with the metal heat dissipation plate. This structure is simple, and the heat dissipation performance is relatively good. BRIEF DESCRIPTION OF DRAWINGS

[0029] Figure 1 A structural schematic diagram of an electronic device provided for some embodiments of the present application;

[0030] Figure 2 A structural schematic diagram of the main body of the electronic device shown in Figure 1

[0031] A structural schematic diagram of the main body of the electronic device shown in Figure 3 Figure 2 A structural schematic diagram of the main body of the electronic device shown in

[0032] Figure 4 Figure 1 A structural schematic diagram of the main body of the electronic device shown in ​​

[0033] Figure 5 As shown in FIG. 1, the electronic device is provided with a back plate 1, a circuit board 2, electronic components 3, a heat sink 4 and an antenna 5. Figure 4 As shown in FIG. 2, the electronic device is provided with a back plate 1, a circuit board 2, electronic components 3, a heat sink 4 and an antenna 5.

[0034] Figure 6a As shown in FIG. 3, the electronic device is provided with a back plate 1, a circuit board 2, electronic components 3, a heat sink 4 and an antenna 5. Figure 4 As shown in FIG. 4, the electronic device is provided with a back plate 1, a circuit board 2, electronic components 3, a heat sink 4 and an antenna 5.

[0035] Figure 6b As shown in FIG. 5, the electronic device is provided with a back plate 1, a circuit board 2, electronic components 3, a heat sink 4 and an antenna 5. Figure 4 As shown in FIG. 6, the electronic device is provided with a back plate 1, a circuit board 2, electronic components 3, a heat sink 4 and an antenna 5.

[0036] Figure 7 As shown in FIG. 7, the electronic device is provided with a back plate 1, a circuit board 2, electronic components 3, a heat sink 4 and an antenna 5. Figure 1 As shown in FIG. 8, the electronic device is provided with a back plate 1, a circuit board 2, electronic components 3, a heat sink 4 and an antenna 5.

[0037] Figure 8 As shown in FIG. 9, the electronic device is provided with a back plate 1, a circuit board 2, electronic components 3, a heat sink 4 and an antenna 5. Figure 7 As shown in FIG. 10, the electronic device is provided with a back plate 1, a circuit board 2, electronic components 3, a heat sink 4 and an antenna 5.

[0038] Figure 9 As shown in FIG. 11, the electronic device is provided with a back plate 1, a circuit board 2, electronic components 3, a heat sink 4 and an antenna 5.

[0039] Figure 10 As shown in FIG. 12, the electronic device is provided with a back plate 1, a circuit board 2, electronic components 3, a heat sink 4 and an antenna 5.

[0040] Figure 11 As shown in FIG. 13, the electronic device is provided with a back plate 1, a circuit board 2, electronic components 3, a heat sink 4 and an antenna 5.

[0041] Figure 12 As shown in FIG. 14, the electronic device is provided with a back plate 1, a circuit board 2, electronic components 3, a heat sink 4 and an antenna 5.

[0042] Figure 13 As shown in FIG. 15, the electronic device is provided with a back plate 1, a circuit board 2, electronic components 3, a heat sink 4 and an antenna 5.

[0043] Figure 14 As shown in FIG. 16, the electronic device is provided with a back plate 1, a circuit board 2, electronic components 3, a heat sink 4 and an antenna 5.

[0044] Figure 15 As shown in FIG. 17, the electronic device is provided with a back plate 1, a circuit board 2, electronic components 3, a heat sink 4 and an antenna 5.

[0045] Figure 16A structure schematic diagram of the electronic device provided by some other embodiments of the present application is shown in the figure, wherein the back plate and the electronic components and the heat sink (provided with a chamfer) are viewed from the back side;

[0046] Figure 17 A structure schematic diagram of the electronic device provided by some other embodiments of the present application is shown in the figure, wherein the back plate and the electronic components and the heat sink (provided with a chamfer) are viewed from the back side; Figure 15 A structure schematic diagram of the electronic device provided by some other embodiments of the present application is shown in the figure, wherein the back plate and the electronic components and the heat sink (provided with a chamfer) are viewed from the back side; Figure 16 A structure schematic diagram of the electronic device provided by some other embodiments of the present application is shown in the figure, wherein the back plate and the electronic components and the heat sink (provided with a chamfer) are viewed from the back side;

[0047] Figure 18 A structure schematic diagram of the electronic device provided by some other embodiments of the present application is shown in the figure, wherein the back plate and the electronic components and the heat sink (provided with a chamfer) are viewed from the back side;

[0048] Figure 19 A structure schematic diagram of the electronic device provided by some other embodiments of the present application is shown in the figure, wherein the back plate and the electronic components and the heat sink (provided with a chamfer) are viewed from the back side; Figure 18

[0049] A structure schematic diagram of the electronic device provided by some other embodiments of the present application is shown in the figure, wherein the back plate and the electronic components and the heat sink (provided with a chamfer) are viewed from the back side; Figure 20

[0050] A structure schematic diagram of the electronic device provided by some other embodiments of the present application is shown in the figure, wherein the back plate and the electronic components and the heat sink (provided with a chamfer) are viewed from the back side; Figure 21 Figure 20 A structure schematic diagram of the electronic device provided by some other embodiments of the present application is shown in the figure, wherein the back plate and the electronic components and the heat sink (provided with a chamfer) are viewed from the back side;

[0051] Figure 22 A structure schematic diagram of the electronic device provided by some other embodiments of the present application is shown in the figure, wherein the back plate and the electronic components and the heat sink (provided with a chamfer) are viewed from the back side;

[0052] Figure 23 A structure schematic diagram of the electronic device provided by some other embodiments of the present application is shown in the figure, wherein the back plate and the electronic components and the heat sink (provided with a chamfer) are viewed from the back side;

[0053] Figure 24 A structure schematic diagram of the electronic device provided by some other embodiments of the present application is shown in the figure, wherein the back plate and the electronic components and the heat sink (provided with a chamfer) are viewed from the back side;

[0054] Figure 25 Figure 24 A structure schematic diagram of the electronic device provided by some other embodiments of the present application is shown in the figure, wherein the back plate and the electronic components and the heat sink (provided with a chamfer) are viewed from the back side;

[0055] Figure 26 A structure schematic diagram of the electronic device provided by some other embodiments of the present application is shown in the figure, wherein the back plate and the electronic components and the heat sink (provided with a chamfer) are viewed from the back side;

[0056] Figure 27 A structure schematic diagram of the electronic device provided by some other embodiments of the present application is shown in the figure, wherein the back plate and the electronic components and the heat sink (provided with a chamfer) are viewed from the back side; Figure 26 DETAILED DESCRIPTION

[0057] ​​​In the embodiments of the present application, the terms "first", "second", "third", "fourth" are only used for descriptive purpose and cannot be understood as indicating or implying relative importance or implicitly indicating the number of the technical features indicated. Therefore, the features defined with "first", "second", "third", "fourth" can explicitly or implicitly include one or more of the features.

[0058] In the embodiments of the present application, the terms "including", "containing" or any other variants thereof are intended to cover non-exclusive inclusion, so that the process, method, article or device including a series of elements not only includes those elements, but also includes other elements not explicitly listed or inherent to such process, method, article or device. Without more limitations, the element defined by the statement "including a" does not exclude the presence of another identical element in the process, method, article or device including the element.

[0059] In the embodiments of the present application, it should be noted that the descriptions of "vertical", "parallel" respectively represent approximately vertical and approximately parallel within a certain error range, which can be a range of deviation angle less than or equal to 5°, 8° or 10° with respect to absolute vertical and absolute parallel, which is not limited here.

[0060] The present application provides an electronic device, which includes but is not limited to a large-screen display device, a personal computer, a notebook computer, a vehicle-mounted device, a radio, etc. The large-screen display device includes but is not limited to a smart television, a conference screen, etc.

[0061] Please refer to Figure 1 , Figure 1 The structural schematic diagram of an electronic device 100 is provided for some embodiments of the present application. The present embodiment and the following embodiments are exemplarily described by taking the electronic device 100 as a large-screen display device. The electronic device 100 includes a main body 101 and a support 102. The support 102 is used to support the main body 101 on a desktop, a television counter or a floor, or to hang the main body 101 on a wall. The main body 101 is mainly introduced below.

[0062] The main body 101 is configured to implement functions such as video / image display, wireless communication, sound playing, signal input / output, and the like. The main body 101 is approximately in the shape of a rectangular flat plate. On this basis, an XYZ coordinate system is established for the convenience of the description of the embodiments below. Specifically, the length direction of the main body 101 in the electronic device 100 is defined as the X-axis direction, the width direction of the main body 101 is defined as the Y-axis direction, and the thickness direction of the main body 101 is defined as the Z-axis direction. It can be understood that the coordinate system of the main body 101 can be flexibly set according to actual needs, and is not specifically limited here. In some other embodiments, the main body 101 can also be approximately in the shape of a square flat plate, a circular flat plate, a triangular flat plate, or a polygonal flat plate, and the like, and the present application does not limit this.

[0063] Please refer to Figures 1-3 , Figure 2 for Figure 1 the schematic diagram of the back surface structure of the main body 101 in the electronic device 100 shown in Figure 3 for Figure 2 the exploded view of the main body 101. The main body 101 can include a display screen 10, a back light unit (BLU) 20, a back plate 30, a face frame 40, a rear shell 50, and internal electronic components (not shown in the figure).

[0064] It should be noted that Figure 2 and Figure 3 only schematically show some components included in the main body 101, and the actual shape, actual size, actual position, and actual structure of these components are not limited by Figure 2 and Figure 3 and the following drawings.

[0065] The display screen 10 is configured to display images, videos, and the like. In some embodiments, the display screen 10 can be a liquid crystal display (LCD). The display screen 10 includes a display surface, and the images or videos displayed by the display screen 10 are presented to the user by the display surface. The display screen 10 has a back surface side, which is the side of the display screen 10 opposite to the display surface.

[0066] The backlight module 20 is located on the back side of the display screen 10 and is arranged in a stack with the display screen 10. The backlight module 20 is used to provide a light source for the display screen 10, so that each sub-pixel in the display screen 10 can emit light to realize image display. The sub-pixel is the smallest imaging unit of the display screen. A plurality of sub-pixels emitting different light rays in turn adjacent to each other can constitute a pixel. For example, a red (R) sub-pixel, a green (G) sub-pixel, and a blue (B) sub-pixel in turn adjacent to each other constitute a pixel. In this case, the proportion of R, G, and B light rays in different pixels can be adjusted to achieve the purpose of adjusting the display color of the pixel. The backlight module 20 can be a side-in backlight module or a direct backlight module, which is not limited here.

[0067] In other embodiments, the display screen 10 can also be replaced by a self-luminous display screen, such as an organic light-emitting diode (OLED) display screen, an active-matrix organic light-emitting diode (AMOLED) display screen, a mini organic light-emitting diode display screen, a micro organic light-emitting diode display screen, a micro organic light-emitting diode display screen, or a quantum dot light emitting diode (QLED) display screen. The self-luminous display screen can emit light independently without a backlight source, so the backlight module 20 can also not be arranged in the main body 101.

[0068] The back plate 30 is located on the side of the backlight module 20 away from the display screen 10 and is arranged in a stack with the backlight module 20. The back plate 30 is used as a support framework in the main body 101, and the backlight module 20, the display screen 10, the face frame 40, the rear shell 50, and internal electronic components are all fixed and supported on the back plate 30. In order to meet the structural strength and stability of the whole machine, the back plate 30 is usually made of metal materials such as aluminum alloy and magnesium-aluminum alloy. The backlight module 20 can be fixed on the back plate 30 by adhesive.

[0069] The face frame 40 includes, but is not limited to, a plastic face frame and a metal face frame. The face frame 40 covers the edges of the display screen 10, the backlight module 20 and the back plate 30, thereby playing a protective and decorative role. Specifically, the face frame 40 includes an upper face frame 41, a lower face frame 42, a left face frame 43 and a right face frame 44. The upper face frame 41, the lower face frame 42, the left face frame 43 and the right face frame 44 cover the upper edge, the lower edge, the left side edge and the right side edge of the display screen 10, the backlight module 20 and the back plate 30, respectively.

[0070] The back shell 50 is located on the side of the back plate 30 away from the backlight module 20. The back shell 50 and the face frame 40 together form the shell part of the main body 101, for protecting and decorating the internal structure of the main body 101. In some embodiments, referring to Figure 3 , the back shell 50 and the face frame 40 are two independent structural members, and the edge of the back shell 50 is fixed to the back plate 30 by means of screws, buckles, elastic sheets and the like. In other embodiments, the back shell 50 and the face frame 40 can also be integrally formed, that is, the back shell 50 and the face frame 40 are one structural member, which is fixed to the back plate 30 by means of screws, buckles and the like.

[0071] The back shell 50 and the back plate 30 form a containing space therebetween. The internal electronic components are fixed to the back plate 30 and contained in the containing space. The internal electronic components include, but are not limited to, a timer control register (TCON), a SOC, a DDR, a speaker (also referred to as a "loudspeaker"), a camera, an antenna, a sensor and the like. The TCON is also referred to as a logic board or a screen driving board.

[0072] With the development of electronic information technology, the data transmission rate of electronic devices is increasing, and there are more and more high-speed digital interface signals in the above-mentioned large-screen display device and other electronic devices. When the electronic device is working, the electronic components (such as a SOC or a DDR) related thereto on the internal circuit board will radiate high-speed digital signal electromagnetic noise. In addition, with the surge in power consumption of these related electronic components, it has become a mainstream to achieve heat dissipation by means of a metal heat sink. In this way, when the main body 101 is working, the electromagnetic noise generated by these electronic components is coupled with the metal heat sink to radiate high-frequency electromagnetic noise to the surrounding space through the metal heat sink, thereby affecting the OTA performance of the antenna in the surrounding space, the TIS cannot meet the standard, resulting in poor antenna performance and reduced network throughput.

[0073] The above technical problems will be described in detail below with reference to the accompanying drawings.

[0074] Please refer to Figure 4 and Figure 5 , Figure 4 for Figure 1Another structural schematic view of the electronic device 100 from the front view, Figure 5 For Figure 4 A cross-sectional structural schematic view of the electronic device 100 along the A-A direction. The electronic device 100 includes electronic components 60. The electronic components 60 are arranged in the accommodation space between the back shell 50 and the back plate 30.

[0075] Among them, the electronic components 60 are components with relatively large heat generation and high-frequency electromagnetic signal radiation during work in the electronic device 100. Specifically, the electronic components 60 include but are not limited to SOC chips and DDR chips. When the electronic device 100 is other devices such as mobile phones, notebook computers, etc., the electronic components 60 can also be AP, central processing unit (CPU), graphics processing unit (GPU), CPU mos tube, GPU mos tube, CPU power inductance, GPU power inductance, or video random access memory (VRAM), etc., which are not limited in the present application. In the present embodiment and each of the following embodiments, unless otherwise specified, the electronic components 60 are taken as SOC chips for example, and the relevant parts will not be repeated hereinafter. The electronic components 60 are located at the lower right corner of the electronic device 100, of course, the electronic components 60 can also be arranged at other positions, which are not limited in the present application.

[0076] Please continue to refer to Figure 4 and Figure 5 , the electronic device 100 further includes a circuit board 80. The circuit board 80 is located in the accommodation space between the back shell 50 and the back plate 30, and the circuit board 80 can be fixed to the back plate 30 by screw connection, clamping, bonding, riveting, etc. The circuit board 80 is used to integrate electronic components and realize electrical connection between electronic components. The electronic components 60 are arranged on the side of the circuit board 80 away from the back plate 30, and the electronic components 60 are electrically connected to the circuit board 80 by means of their pins.

[0077] On the basis of the above, since the electronic components 60 generate relatively large heat during work, based on this, please continue to refer to Figure 4 and Figure 5 , the electronic device 100 further includes a heat sink 90. The heat sink 90 is located on the side of the electronic components 60 away from the circuit board 80, and the heat sink 90 is in thermal conduction with the electronic components 60. In some embodiments, please refer to Figure 5A heat-conducting medium C is arranged between the heat sink 90 and the electronic component 60. The heat-conducting medium C includes, but is not limited to, a heat-conducting paste and / or a heat-conducting gasket. The heat-conducting paste includes, but is not limited to, a heat-conducting gel and a heat-conducting silicone grease, and the material of the heat-conducting gasket includes, but is not limited to, silica gel and foam. The heat sink 90 is in thermal conduction with the electronic component 60 through the heat-conducting medium C. In this way, the heat generated by the electronic component 60 during operation can be transmitted to the heat sink 90 through the heat-conducting medium C to achieve heat dissipation. In other embodiments, the heat sink 90 can also be in direct thermal conduction with the electronic component 60, which is not limited here.

[0078] In the above embodiments, the heat sink 90 has various structural forms. In large devices such as large-screen display devices, a finned heat sink is usually used. Based on this, in some embodiments, please refer to Figure 5 , the heat sink 90 is a finned heat sink. Specifically, the heat sink 90 is substantially in the form of a rectangular plate. Please continue to refer to Figure 5 , the heat sink 90 includes a metal heat sink plate 91 and fins 92. The metal heat sink plate 91 is arranged in a stacked and spaced manner with the circuit board 80, and the material of the metal heat sink plate 91 includes, but is not limited to, copper, iron, aluminum, copper alloy, iron alloy, aluminum alloy, magnesium-aluminum alloy and other metal materials with high thermal conductivity. The heat sink 90 is in thermal conduction with the electronic component 60 through the metal heat sink plate 91. The fins 92 are arranged on the surface of the metal heat sink plate 91 away from the electronic component 60, and the fins 92 are integrally formed with the metal heat sink plate 91. In this way, the heat sink 90 exchanges heat with the surrounding air through the fins 92, and the contact area between the fins 92 and the surrounding air is large, which can ensure the heat exchange efficiency. The structure of this heat sink 90 is simple and the cost is low.

[0079] In other embodiments, the heat sink 90 can also include a metal heat sink plate 91 and a medium channel arranged in the metal heat sink plate 91. By passing fluid medium in the medium channel, the same heat dissipation purpose can also be achieved.

[0080] The heat dissipation path of the electronic component 60 is introduced above. Specifically, the heat dissipation path of the electronic component 60 is: electronic component 60→heat-conducting medium C→metal heat sink plate 91→fins 92→air.

[0081] On the basis of the above, in addition to emitting a large amount of heat, the electronic component 60 also radiates high-speed digital signal electromagnetic noise (frequency range: 0.7 GHz-6 GHz) during operation. On this basis, since the structure of the heat sink 90 is substantially a rectangular metal plate with fins, based on this, please refer to Figure 6a , Figure 6a for Figure 4The simulation result of the coupling of the electric field generated by the electronic component 60 and the radiator 90 in the electronic device 100 is shown in FIG. 6. The electromagnetic noise generated by the electronic component 60 can be coupled with the radiator 90 to amplify the high-frequency electromagnetic noise, and the amplified electromagnetic noise can be radiated to the surrounding space in the form of electromagnetic waves, thereby interfering with the sensitive devices (such as an antenna) in the surrounding space.

[0082] On the basis of the above, the electronic device 100 further includes at least one antenna (ant), which includes but is not limited to a wireless fidelity (WIFI) antenna, a bluetooth antenna, a GPS antenna, and the like. Specifically, when the electronic device 100 is a large-screen display device, the antenna is a WIFI antenna or a bluetooth antenna. When the antenna is a WIFI antenna, specifically, the antenna (ant) can be a WIFI-2.4G antenna (frequency range: 2.412 GHz-2.484 GHz), a WIFI-5G antenna (frequency range: 5.15 GHz-5.825 GHz), and the like, which are not limited herein. In the electronic device 100, the number of antennas can be one, two, three, four, or more, which are not limited herein. One of the at least one antenna (ant) closest to the electronic component 60 is marked as 70. For example, referring back to FIG. 1, the number of antennas is two, and the antenna on the right side is closest to the electronic component 60, so it is marked as 70. Figure 4

[0083] Please refer to Figure 6b , Figure 6b is Figure 4 The structure of the circuit board 80, the electronic component 60, the radiator 90, and the antenna 70 in the electronic device 100 viewed from the back side of the electronic device 100 is shown in FIG. 7. The high-frequency noise signal i radiated by the radiator 90 interferes with the antenna 70, specifically, causing the OTA performance of the antenna 70 to decrease, the TIS to fail to meet the standard, the performance to deteriorate, and the network throughput rate to decrease.

[0084] To solve the above technical problem, please refer to Figure 7 , Figure 7 is Figure 1 The structure of the circuit board 80, the electronic component 60, the radiator 90, and the antenna 70 in the electronic device 100 viewed from the back side of the electronic device 100 is shown in FIG. 7. The high-frequency noise signal i radiated by the radiator 90 interferes with the antenna 70, specifically, causing the OTA performance of the antenna 70 to decrease, the TIS to fail to meet the standard, the performance to deteriorate, and the network throughput rate to decrease.

[0085] The circuit board 80 has a first surface 80a. In some embodiments, in combination with reference to Figure 5 ​The first surface 80a is a surface of the circuit board 80 facing away from the backplane 30. In other embodiments, when the electronic device 100 is another device such as a mobile phone, a notebook computer, etc., the first surface 80a can be another surface, which is not limited herein.

[0086] The electronic component 60 is located on a side of the circuit board 80 facing the first surface 80a, and the electronic component 60 is electrically connected to the first surface 80a. Specifically, the electronic component 60 is soldered to the pads on the first surface 80a by means of its pins to achieve electrical connection.

[0087] The heat sink 90 is located on a side of the electronic component 60 away from the circuit board 80. The structure of the heat sink 90 can be the same as that of the heat sink 90 in Figure 4 and Figure 5 , which is not repeated here. The heat sink 90 is in thermal communication with the electronic component 60. Specifically, the thermal communication mode between the heat sink 90 and the electronic component 60 is the same as that in Figures 4-5 , which is not repeated here.

[0088] Please refer to Figure 7 and Figure 8 , Figure 8 for the structure of the heat sink 90 in the electronic device 100 shown in Figure 7 . The heat sink 90 includes a middle region and edges. The edges of the heat sink 90 include opposite first and second edges 90a and 90b, and opposite third and fourth edges 90c and 90d. In some embodiments, please refer to Figure 8 , the first, second, third and fourth edges 90a, 90b, 90c and 90d are substantially straight edges.

[0089] One end of the third edge 90c is connected to the first edge 90a, and the other end of the third edge 90c is connected to the second edge 90b. One end of the fourth edge 90d is connected to the first edge 90a, and the other end of the fourth edge 90d is provided with a cut corner C4.

[0090] In some embodiments, please refer to Figure 8 , the first edge 90a can be substantially parallel to the second edge 90b, the third edge 90c can be substantially parallel to the fourth edge 90d, and the third edge 90c can be substantially perpendicular to the first edge 90a. In this way, the heat sink 90 is substantially rectangular or square, which is regular in structure and convenient to process.

[0091] In some other embodiments, the first side 90a can be inclined to the second side 90b by a first angle, and the third side 90c can be inclined to the fourth side 90d by a second angle. In some embodiments, the first angle and the second angle can be less than or equal to 30°. In some embodiments, the first angle and the second angle can be 30°, 25°, 20°, 15°, 10° or 5°. In some embodiments, the angle between the third side 90c and the first side 90a can be greater than or equal to 70° and less than or equal to 110°.

[0092] It should be noted that the following embodiments are described based on the first side 90a and the second side 90b being substantially parallel, the third side 90c and the fourth side 90d being substantially parallel, and the third side 90c being substantially perpendicular to the first side 90a, which should not be considered as a special limitation to the present application.

[0093] In some embodiments, please refer to Figure 8 , the width of the heat sink 90 in the extension direction of the first side 90a and the second side 90b (i.e., the Y-axis direction) is a first width W1, and the width of the heat sink 90 in the extension direction of the third side 90c and the fourth side 90d (i.e., the X-axis direction) is a second width W2. The first width W1 is greater than the second width W2. In this way, the heat sink 90 is substantially rectangular, and the first side 90a and the second side 90b form two opposite long sides of the rectangular structure, and the third side 90c and the fourth side 90d form two opposite short sides of the rectangular structure. The rectangular heat sink 90 does not need to ensure that the length and the width are consistent, and therefore the manufacturing difficulty is relatively low.

[0094] In some other embodiments, the first width W1 can also be less than or equal to the second width W2. In this way, the heat sink 90 is substantially rectangular, and the third side 90c and the fourth side 90d form two opposite long sides of the rectangular structure, and the first side 90a and the second side 90b form two opposite short sides of the rectangular structure. Alternatively, the heat sink 90 is substantially square.

[0095] In the above embodiments, the cut angle C4 between the fourth side 90d and the second side 90b is used to break the symmetry of the heat sink 90, so that the electric field distribution on the heat sink 90 is deflected, so as to weaken the electromagnetic field strength of the cut angle C4 region and the region on one side of the cut angle C4 region away from the middle region of the heat sink 90, so that the sensitive device (such as an antenna) can be placed in the cut angle C4 region and the region on one side of the cut angle C4 region away from the middle region of the heat sink 90, thereby improving the isolation between the heat sink 90 and the sensitive device.

[0096] Based on this, the structure of the cut angle C4 between the fourth side 90d and the second side 90b is introduced below.

[0097] Please refer to Figure 8, define the part edge of the heat sink 90 connected between the fourth side 90d and the second side 90b as a bevel edge n4. It should be noted that the bevel C4 refers to the non-solid area surrounded by the bevel edge n4, the extension line of the fourth side 90d and the extension line of the second side 90b.

[0098] In the above embodiment, the bevel edge n4 can be a circular arc edge, an inclined edge, a broken line edge, a curved edge or other irregular shape edge, which is not limited here.

[0099] In the above embodiment, the bevel edge n4 can be a circular arc edge, an inclined edge, a broken line edge, a curved edge or other irregular shape edge, which is not limited here. Figure 8 In the embodiment shown in the figure, the bevel edge n4 is an inclined edge, which is inclined relative to the fourth side 90d and the second side 90b. The structure of the inclined edge is simple and convenient for processing.

[0100] On the basis of the above embodiment, optionally, the inclination angle θ2 of the bevel edge n4 relative to the fourth side 90d can be greater than or equal to 30° and less than or equal to 60°. Specifically, the inclination angle θ2 can be 30°, 35°, 40°, 45°, 50°, 55° or 60°. In this way, the electric field distribution of the heat sink 90 can be deflected at a large angle, so as to weaken the electromagnetic field intensity of the bevel C4 region and the region on the side of the bevel C4 region away from the central region of the heat sink 90.

[0101] In some embodiments, please continue to refer to Figure 8 , the projection length L2 of the bevel edge n4 in the extension direction of the fourth side 90d is less than or equal to 1 / 2 of the width W2 of the heat sink 90 in the extension direction of the fourth side 90d (i.e. the X-axis direction). Specifically, the length L2 can be 1 / 2, 1 / 4, 1 / 8, 3 / 8, etc. of the width W2, which is not limited here. In this way, the electric field distribution of the heat sink 90 can be deflected at a large angle, while the influence on the heat dissipation performance of the heat sink 90 is small, which can ensure the heat dissipation capacity of the heat sink 90.

[0102] In still other embodiments, please refer to Figure 9 , Figure 9 for the structural schematic diagram of the heat sink 90 provided in still other embodiments of the present application. In the embodiment, the bevel edge n4 is a circular arc edge, which is arched away from the central region of the heat sink 90, and the circular arc edge is tangent to the fourth side 90d and the second side 90b. The structure of the edge is smooth and can prevent scratching other devices during transportation and assembly.

[0103] On the basis of the above embodiment, optionally, please continue to refer to Figure 9The radius R of the cut corner edge n4 can be less than or equal to 1 / 2 of the width W2 of the heat sink 90 in the extension direction of the fourth edge 90d (i.e., the X-axis direction). Specifically, the radius R can be 1 / 2, 1 / 4, 1 / 8, 3 / 8, etc. of the width W2, which is not limited herein. In this way, the electric field distribution of the heat sink 90 can be deflected at a large angle, while the heat dissipation performance of the heat sink 90 is less affected, and the heat dissipation capacity of the heat sink 90 can be ensured.

[0104] In some embodiments, referring to Figure 10 , Figure 10 A structural schematic diagram of the heat sink 90 is provided for some embodiments of the present application. In the present embodiment, the cut corner edge n4 is a fold line edge, which includes two straight line segments perpendicular to each other.

[0105] In some embodiments, referring to Figure 11 , Figure 11 A structural schematic diagram of the heat sink 90 is provided for some embodiments of the present application. In the present embodiment, the cut corner edge n4 is a fold line edge, which includes two straight line segments at an obtuse angle.

[0106] In this way, the heat sink 90 has an asymmetric structure, which can deflect the electric field distribution on the heat sink 90, so that the electric field intensity at the cut corner edge n4 of the heat sink 90 is weaker, thereby weakening the electromagnetic field intensity of the partial area radiated by the cut corner edge n4. The partial area radiated by the cut corner edge n4 refers to the cut corner C4 area and the area on one side of the cut corner C4 area away from the middle area of the heat sink 90, so that the sensitive device (such as an antenna) can be placed in these areas to improve the isolation between the heat sink 90 and the sensitive device.

[0107] On the basis of the above, in order to prove that the cut corner C4 can deflect the electric field distribution on the heat sink 90 and weaken the electric field intensity at the cut corner edge n4, the electric field distribution of the heat sink 90 without the cut corner C4 (hereinafter referred to as the traditional scheme) and the heat sink 90 with the cut corner C4 (hereinafter referred to as the present application scheme) is simulated and compared from four aspects of changing the feeding position, changing the cut corner, changing the feeding frequency point, and changing the area of the heat sink 90.

[0108] First, referring to Figure 12 , Figure 12 The electric field distribution diagrams of the heat sink 90 in the traditional scheme and the present application scheme at 10 different feeding positions are shown. The 10 feeding positions correspond to 10 modes excited out of the heat sink 90, which are mode 1 to mode 10. The specific simulation parameters are: the length (i.e., the first width W1 in Figure 12 ) of the heat sink 90 is 89 mm, and the width (i.e., the second width W2 in Figure 8 ) is 89 mm.Figure 8 The second width W2 in the cutting corner n4 is 65 mm. In the present application, the cutting corner n4 is a slant edge, the inclination angle θ2 of the slant edge relative to the fourth side 90d is 55°, and the projection length L2 of the slant edge on the fourth side 90d is equal to 1 / 2 of the width of the heat sink 90. The excitation frequency point is 2.4 GHz. Figure 12 In the cutting corner n4, it should be noted that the electric field distribution of the metal hot plate 91 in the conventional scheme under mode n is shown in Fig. (an), and the electric field distribution of the metal hot plate 91 in the present application under mode n is shown in Fig. (bn), where n = 1, 2, 3, 4, 5, 6, 7, 8, 9 or 10. For example, please refer to Figure 12 In the cutting corner n4, it should be noted that the electric field distribution of the metal hot plate 91 in the conventional scheme under mode n is shown in Fig. (an), and the electric field distribution of the metal hot plate 91 in the present application under mode n is shown in Fig. (bn), where n = 1, 2, 3, 4, 5, 6, 7, 8, 9 or 10. For example, please refer to

[0109] In the cutting corner n4, it should be noted that the electric field distribution of the metal hot plate 91 in the conventional scheme under mode n is shown in Fig. (an), and the electric field distribution of the metal hot plate 91 in the present application under mode n is shown in Fig. (bn), where n = 1, 2, 3, 4, 5, 6, 7, 8, 9 or 10. For example, please refer to Figure 12 It can be seen that compared with the 10 modes excited before and after the cutting corner, the position of the mode excited after the cutting corner changes, and the electric field distribution is deflected. Taking mode 1 as an example, the electric field is excited at the upper and lower ends of the heat sink 90 before the cutting corner, wherein the area excited at the lower end of the heat sink 90 is area Q1; after the cutting corner, the electric field is excited in the area Q2 at the upper left corner, so the electric field distribution is deflected. Comprehensive analysis of the 10 modes after the cutting corner, only mode 4 is excited at the cutting corner edge of the heat sink 90 (i.e. at the area Q3 position), but compared with the model without cutting corner, the electric field intensity of the cutting corner edge in this mode is greatly weakened. In this way, the electromagnetic field intensity radiated from the cutting corner edge to the cutting corner area and the area far away from the middle area of the metal heat sink plate on one side of the cutting corner area is weak, and the electromagnetic interference caused to the sensitive devices placed in these areas is also smaller.

[0110] Secondly, please refer to Figure 13 , Figure 13 are the electric field distributions of the heat sink 90 in the present application when the inclination angle θ2 under mode 1-mode 5 is 30° and 45°, respectively. The specific simulation parameters are: the length of the heat sink 90 is also 89 mm, the width is also 65 mm, the cutting corner n4 is also a slant edge, the projection length L2 of the slant edge on the fourth side 90d is equal to 1 / 2 of the width of the heat sink 90, and the frequency point of 2.4 GHz is also used to excite the heat sink 90 at 5 different positions of mode 1-mode 5. Figure 13 In the cutting corner n4, it should be noted that the electric field distribution of the metal hot plate 91 in the conventional scheme under mode n is shown in Fig. (an), and the electric field distribution of the metal hot plate 91 in the present application under mode n is shown in Fig. (bn), where n = 1, 2, 3, 4, 5, 6, 7, 8, 9 or 10. For example, please refer to Figure 13 In the cutting corner n4, it should be noted that the electric field distribution of the metal hot plate 91 in the conventional scheme under mode n is shown in Fig. (an), and the electric field distribution of the metal hot plate 91 in the present application under mode n is shown in Fig. (bn), where n = 1, 2, 3, 4, 5, 6, 7, 8, 9 or 10. For example, please refer to

[0111] By Figure 13 It can be seen that compared with the five modes, the electric field distribution positions of the modes excited by different cut angle angles are similar. Compared with the uncut angle model, the electric field intensity at the cut angle edge under different inclination angles is greatly weakened, the electromagnetic field intensity of the cut angle region and the side region away from the middle region of the metal heat sink is weak, and the electromagnetic interference caused to the sensitive devices placed in these regions is small. It should be noted that compared with the above modes 6-mode 10, the electric field intensity of modes 1-5 is relatively high, so the simulation results shown in Figure 13 sufficiently illustrate this conclusion.

[0112] Then, refer to Figure 14 , Figure 14 are the electric field distribution diagrams of the heat sink 90 in the traditional scheme and the scheme of the present application when the excitation frequency point is 2.4GHz, 4GHz and 5GHz respectively. Among them, (a1) represents the electric field distribution diagram of the heat sink 90 in the traditional scheme when the frequency point is 2.4GHz, (b1) represents the electric field distribution diagram of the heat sink 90 in the scheme of the present application when the frequency point is 2.4GHz; (a2) represents the electric field distribution diagram of the heat sink 90 in the traditional scheme when the frequency point is 4GHz, (b2) represents the electric field distribution diagram of the heat sink 90 in the scheme of the present application when the frequency point is 4GHz; (a3) represents the electric field distribution diagram of the heat sink 90 in the traditional scheme when the frequency point is 5GHz, (b3) represents the electric field distribution diagram of the heat sink 90 in the scheme of the present application when the frequency point is 5GHz.

[0113] It should be noted that compared with Figure 12 and Figure 14 , the electric field distribution obtained by simulation when the excitation frequency point is 2.4GHz is different, mainly because: Figure 14 is the simulation result obtained when the heat sink 90 and the back plate 30 exist at the same time, and the noise is excited through the center position of the heat sink 90. While Figure 12 is the first mode that can be excited by the heat sink at the excitation frequency point of 2.4GHz, but this mode is not necessarily excited at the center position, but may be excited at the off-center position. However, Figure 12 and Figure 14 both show that after cutting the angle, the electric field distribution is deflected, resulting in a weakening of the electric field intensity at the cut angle edge.

[0114] Figure 14 The simulation parameters are: the length of the heat sink 90 is also 89mm, and the width is also 65mm. The cut angle edge n4 is also a hypotenuse, and the inclination angle θ2 of the hypotenuse relative to the fourth side 90d is 55°, and the projection length L2 of the hypotenuse on the fourth side 90d is equal to 1 / 2 times the width of the heat sink 90.

[0115] Depend on Figure 14 As can be seen, at 2.4 GHz, the mode is the fundamental mode (i.e., TM10 mode). Before the corner is cut, the regions with stronger electric field intensity are the upper and lower ends (regions Q1 and Q2, respectively), which are arranged along the length direction. After the corner is cut, the symmetry of the rectangular heat sink 90° changes, and the electric field distribution deflects. The regions with stronger electric field intensity are the diagonally distributed regions Q3 and Q4. The electric field intensity at the corner edge is greatly reduced, and the electromagnetic field intensity in the corner region and the side of the corner region away from the middle region of the metal heat sink is relatively weak, resulting in less electromagnetic interference to sensitive devices placed in these regions. At 4 GHz, the excitation mode is TM02 mode. The electric field distribution also deflects before and after the corner is cut. The electric field intensity at the corner edge is greatly reduced, and the electromagnetic field intensity in the corner region and the side of the corner region away from the middle region of the corner is relatively weak, resulting in less electromagnetic interference to sensitive devices placed in these regions. At 5 GHz, the excitation mode is a higher-order mode. The electric field distribution also deflects before and after the chamfer, with the electric field strength at the chamfer edge significantly reduced. The electromagnetic field strength in the chamfer region and the area on one side of the chamfer region away from the central region of the metal heat sink is weaker, resulting in less electromagnetic interference to sensitive devices placed in these areas. It should be noted that compared to modes 2-10, the electric field strength in mode 1 is relatively higher, therefore... Figure 14 The simulation results shown are sufficient to illustrate this conclusion.

[0116] It should be noted that, since the backplate 30 is also a metal plate, in the low-frequency range, the electronic components 60 will not only excite the heat sink 90 to generate electromagnetic radiation, but will also couple with the backplate 30 to excite the backplate 30 to generate electromagnetic radiation. Based on this, please refer to... Figure 15 and Figure 16 , Figure 15 This is a schematic diagram of the structure of the back panel 30, electronic components 60, and heat sink 90 (without chamfer C4) in an electronic device 100 provided in some embodiments of this application, viewed from the back side. Figure 16 This is a schematic diagram of the structure of the back plate 30, electronic components 60, and heat sink 90 (with chamfered corner C4) in an electronic device 100 provided in some embodiments of this application, as viewed from the back side.

[0117] Based on the above, please refer to Figure 17 , Figure 17 for Figure 15 The scheme shown and Figure 16 The diagram shows the electric field distribution of the backplane 30 in the illustrated scheme at frequencies of 2.4 GHz and 4 GHz. Where (a1) represents... Figure 15 The electric field distribution diagram of the backplane 30 in the scheme shown is shown in mode 1 when the excitation frequency is 2.4 GHz. (b1) represents Figure 16The electric field distribution diagram of the backplane 30 at 2.4 GHz in the scheme shown; (a2) indicates Figure 15 The electric field distribution diagram of the backplate 30 in the scheme shown is at an excitation frequency of 4 GHz. (b2) represents Figure 16 The diagram shows the electric field distribution of the backplate 30 at an excitation frequency of 4 GHz in the scheme shown. Figure 17 The simulation parameters are the same as those mentioned above. Figure 14 The simulation parameters are consistent, so they will not be elaborated here.

[0118] Depend on Figure 17 It can be seen that at 2.4GHz and 4GHz, the electric field distribution on the backplate 30 is also deflected. The electric field strength on the backplate 30 near the chamfered edge is weaker. The electromagnetic field strength radiated from the backplate 30 to the chamfered area and the side of the chamfered area away from the middle area of ​​the metal heat sink is also weaker. The electromagnetic interference caused to sensitive devices placed in these areas is smaller.

[0119] Finally, please see Figure 18 , Figure 18 To simulate and compare the input return loss curves before and after reducing the area of ​​the 90° heatsink (without chamfering). Figure 18 As can be seen, compared to the original scheme, the reduced scheme shifts the resonant frequency to higher frequencies, moving resonant modes that originally appeared at low frequencies to higher frequencies. For example, the TM20 mode is moved from 3.1 GHz to 4.8 GHz, and the TM02 mode is moved from 4.1 GHz to 6.35 GHz. Please refer to [link / reference]. Figure 19 , Figure 19 for Figure 18 The diagram shows the electric field distribution in TM20 and TM02 modes after the area of ​​the heat sink 90 is reduced. This can shift the resonant frequency of interference away from the antenna frequency band (such as the WIFI-2.4G or WIFI-5G band), thereby reducing interference to the antenna. However, reducing the area of ​​the heat sink 90 will lead to a decrease in the heat dissipation effect of electronic components.

[0120] Please see Figure 20 , Figure 20 To simulate and compare the input return loss curves before and after increasing the area of ​​the 90° heatsink (without chamfering). Figure 20 As can be seen, compared to the original scheme, the resonant frequency shifts to a lower frequency in the enlarged scheme. For example, the TM20 mode is moved from 3.1 GHz to 2.1 GHz, and the TM02 mode is moved from 4.1 GHz to 2.8 GHz. Please refer to [link / reference]. Figure 21 , Figure 21 for Figure 20The electric field distribution diagrams of the heat sink 90 with increased area in TM20 mode and TM02 mode are shown. This will cause more resonance modes to appear at low frequencies.

[0121] In summary, by cutting the corner, the area of the heat sink 90 can be increased while reducing electromagnetic interference to sensitive devices such as antennas. Thus, the heat dissipation and isolation requirements can be met without sacrificing heat dissipation performance by deflecting the electric field distribution to solve the interference problem.

[0122] Based on the above embodiments, please refer to Figure 8 , the antenna 70 is arranged on the side of the corner edge n4 away from the middle area of the heat sink 90. That is, the antenna 70 is arranged in the corner C4 area or on the side of the corner C4 area away from the middle area of the heat sink 90. According to the foregoing description, the magnetic field strength in this area is weak, causing less interference to the antenna 70, and the isolation between the antenna 70 and the heat sink 90 is higher.

[0123] Please refer to Figure 22 , Figure 22 The input return loss curves of the antenna 70 when the heat sink 90 is not provided with a corner C4 and is provided with a corner C4 are simulated and compared. The antenna 70 is a 5G-WIFI antenna, and the corner edge of the corner C4 is a diagonal edge. As can be seen from Figure 22 , compared with the scheme without the corner C4, the isolation between the antenna 70 and the heat sink 90 is improved by 2-3 dB after the corner C4 is provided.

[0124] At the same time, when the electronic components 60 in the electronic device are DDR, and the antenna 70 is a WIFI-2.4G antenna, the downlink throughput rate of the antenna 70 in the active frequency and the off-frequency state of the DDR is tested, and the test results are shown in Table 1. Specifically, the scheme without the corner is recorded in the “without corner scheme” column, and the scheme with the corner of the present application is recorded in the “with corner scheme” column. The on-off frequency refers to whether the noise frequency band of the DDR is widened. Specifically, the active frequency refers to the widening of the noise frequency band of the DDR. When the active frequency is on, the noise bandwidth is large, covering the frequency band of the antenna 70, and thus interfering with the antenna 70. The off-frequency refers to the noise frequency band of the DDR not being widened. In this state, the noise of the DDR is only in a small frequency band range, and does not cover the frequency band of the antenna 70, so the interference to the antenna 70 is small. As can be seen from Table 1, after the corner C4 is provided, the interference can be obviously suppressed, and the downlink throughput rate is obviously improved.

[0125] Table 1

[0126] 64 channels No cut corner scheme With cut corner scheme Spread spectrum 113 173 Spread spectrum 174 184

[0127] It should be noted that Table 1 gives an example of test results, and the test results will be different under different conditions and scenarios, therefore, Table 1 cannot be considered as a special limitation to the related parameters of the present application.

[0128] Please refer to Figure 23 , Figure 23 The input return loss curves of the antenna 70 when the cut corner C4 is not set and when the cut corner C4 is set are simulated. The antenna 70 is a 5G-WIFI antenna, and the cut corner edge of the set cut corner is a circular arc edge. It can be known from Figure 23 that compared with the scheme in which the cut corner C4 is not set, the isolation between the antenna 70 and the heat sink 90 is also improved after the cut corner C4 is set.

[0129] In some embodiments, when the cut corner edge n4 is a slope edge, the projection of the antenna 70 on the cut corner edge n4 has an overlap with the cut corner edge n4 in the plane parallel to the heat sink 90. In this way, the antenna 70 is opposite to the cut corner edge n4, the interference between the antenna 70 and the heat sink 90 is weak, and the isolation is high.

[0130] The above embodiments mainly introduce the structure and effect of the cut corner C4 and the cut corner edge n4 of the heat sink 90, and the other corner parts of the heat sink 90 are introduced below.

[0131] Specifically, the connection mode between the third edge 90c and the first edge 90a includes but is not limited to abutting or being provided with a first chamfer. The connection mode between the third edge 90c and the second edge 90b includes but is not limited to abutting or being provided with a second chamfer. The connection mode between the fourth edge 90d and the first edge 90a includes but is not limited to abutting or being provided with a third chamfer.

[0132] The "abutting" means directly contacting together, and there is no other part edge spacing between them.

[0133] In the embodiments shown in Figures 8-11 , the third edge 90c and the first edge 90a, the third edge 90c and the second edge 90b, and the fourth edge 90d and the first edge 90a are all abutting. The shape of the heat sink 90 is regular, the structure is simple, and the manufacturing is convenient.

[0134] In other embodiments, please refer to Figure 24 , Figure 24A structural schematic diagram of the heat sink 90 is provided for some other embodiments of the present application. In the present embodiment, a first chamfer C1 is provided between the third edge 90c and the first edge 90a, a second chamfer C2 is provided between the third edge 90c and the second edge 90b, and a third chamfer C3 is provided between the fourth edge 90d and the first edge 90a. The first chamfer C1, the second chamfer C2 and the third chamfer C3 are used to avoid sharp corners at the edge corner positions of the heat sink 90, so as to prevent other devices from being scratched during transportation and assembly.

[0135] On the basis of the above, it should be noted that, in order to facilitate the description of each of the following embodiments, the edge of the heat sink 90 connected between the third edge 90c and the first edge 90a is defined as a first chamfer edge n1, the edge connected between the third edge 90c and the second edge 90b is defined as a second chamfer edge n2, and the edge connected between the fourth edge 90d and the first edge 90a is defined as a third chamfer edge n3. On this basis, it should be noted that the first chamfer C1 mentioned in the above embodiment and each of the following embodiments refers to a non-solid region surrounded by the first chamfer edge n1, the extension line of the third edge 90c and the extension line of the first edge 90a, the second chamfer C2 refers to a non-solid region surrounded by the second chamfer edge n2, the extension line of the third edge 90c and the extension line of the second edge 90b, and the third chamfer C3 refers to a non-solid region surrounded by the third chamfer edge n3, the extension line of the fourth edge 90d and the extension line of the first edge 90a. Among them, the first chamfer edge n1, the second chamfer edge n2 and the third chamfer edge n3 can be a circular arc edge, can also be an inclined edge, and can also be an edge of other shapes, which are not specifically limited here. When the first chamfer edge n1, the second chamfer edge n2 and the third chamfer edge n3 are circular arc edges, the circular arc edges are arched away from the middle region of the heat sink 90, and the circular arc edges are tangent to the edges at both ends of the circular arc edges. When the first chamfer edge n1, the second chamfer edge n2 and the third chamfer edge n3 are inclined edges, the inclined edges are inclined relative to the edges at both ends of the inclined edges.

[0136] In Figure 24 the illustrated embodiment, the first chamfer edge n1, the second chamfer edge n2 and the third chamfer edge n3 are all circular arc edges. On this basis, please refer to Figure 25 , Figure 25 for Figure 24 a partial enlarged view of the heat sink 90 at region I. The radius of the first chamfer edge n1, the second chamfer edge n2 and the third chamfer edge n3 can be less than or equal to 20 millimeters (mm). Specifically, the radius of the first chamfer edge n1, the second chamfer edge n2 and the third chamfer edge n3 can be 20 mm, 15 mm, 10 mm, 5 mm, etc., which are not specifically limited here. In Figure 25 , the radius of the first chamfer edge n1 is marked as R1. In this way, the areas of the first chamfer C1, the second chamfer C2 and the third chamfer C3 are small, and the influence on the heat dissipation performance of the heat sink 90 is small.

[0137] The radius of the first chamfered edge n1, the second chamfered edge n2 and the third chamfered edge n3 can be equal or not equal, which is not limited here.

[0138] In other embodiments, please refer to Figure 26 , Figure 26 The structure diagram of the heat sink 90 is provided for other embodiments of the present application. In the present embodiment, the first chamfered edge n1, the second chamfered edge n2 and the third chamfered edge n3 are bevels, which are inclined relative to the edges at both ends of the bevels. For example, please refer to Figure 27 , Figure 27 The local enlarged view of the heat sink 90 at the area II is shown in Figure 26 , in the present embodiment, the first chamfered edge n1 is a bevel, which is inclined relative to the third edge 90c and the first edge 90a at both ends of the bevel. In this way, the sharp corners at the edge corner positions of the heat sink 90 can also be avoided, preventing scratching other devices during transportation and assembly.

[0139] Optionally, the projection length of the first chamfered edge n1 and the second chamfered edge n2 in the extension direction of the third edge 90c and the projection length of the third chamfered edge n3 in the extension direction of the fourth edge 90d can be less than or equal to 30 mm. Specifically, the projection length of the first chamfered edge n1 and the second chamfered edge n2 in the extension direction of the third edge 90c and the projection length of the third chamfered edge n3 in the extension direction of the fourth edge 90d can be 30 mm, 25 mm, 20 mm, 15 mm, 10 mm, 5 mm, etc., which is not limited here. In Figure 27 , the projection length of the first chamfered edge n1 in the extension direction of the third edge 90c is marked as L1. In this way, the areas of the first chamfer C1, the second chamfer C2 and the third chamfer C3 are small, which has little effect on the heat dissipation performance of the heat sink 90.

[0140] The length of the first chamfered edge n1, the second chamfered edge n2 and the third chamfered edge n3 can be equal or not equal, which is not limited here.

[0141] Please refer to Figure 26 and Figure 27 , the inclination angle of the first chamfered edge n1 relative to the third edge 90c and the inclination angle of the second chamfered edge n2 relative to the third edge 90c can be greater than or equal to 30 degrees (°) and less than or equal to 60°. Specifically, these inclination angles can be 30°, 35°, 40°, 45°, 50°, 55° or 60°. In Figure 27In some embodiments, the first chamfered edge n1 has an angle of inclination with respect to the third edge 90c that is greater than or equal to 30° and less than or equal to 60°. In particular, the angle of inclination can be 30°, 35°, 40°, 45°, 50°, 55°, or 60°. In this way, the sharp corners at the edge corners of the heat sink 90 can be effectively avoided, and the other devices can be prevented from being scratched during transportation and assembly.

[0142] The angle of inclination of the first chamfered edge n1 with respect to the third edge 90c, the angle of inclination of the second chamfered edge n2 with respect to the third edge 90c, and the angle of inclination of the third chamfered edge n3 with respect to the fourth edge 90d can be equal or not equal, and are not specifically limited herein.

[0143] The above describes the structure of the three corner portions of the edge of the heat sink 90. The three corner portions can be all connected as shown in FIG. 1A, or all provided with chamfers as shown in FIG. 1B, or part of the three corner portions are connected and part of the three corner portions are provided with chamfers, and are not specifically limited herein. Figure 8 Figure 24 Figure 26 The above describes the structure of the three corner portions of the edge of the heat sink 90. The three corner portions can be all connected as shown in FIG. 1A, or all provided with chamfers as shown in FIG. 1B, or part of the three corner portions are connected and part of the three corner portions are provided with chamfers, and are not specifically limited herein.

[0144] In some embodiments, the area of the first chamfer C1, the area of the second chamfer C2, and the area of the third chamfer C3 are all less than the area of the aforementioned cut corner C4. In this way, the electric field distribution of the heat sink 90 is not damaged, and the aforementioned purpose of improving the isolation between the heat sink 90 and the antenna 70 can be achieved.

[0145] In the description of the present specification, specific features, structures, materials or characteristics can be combined in any one or more embodiments or examples in a suitable manner.

[0146] Finally, it should be noted that the above embodiments are only used to illustrate the technical solutions of the present application, and not to limit them; although the present application has been described in detail with reference to the foregoing embodiments, those skilled in the art should understand that the technical solutions recorded in the foregoing embodiments can be modified, or some technical features can be replaced by equivalents; and these modifications or replacements do not make the essence of the corresponding technical solutions deviate from the spirit and scope of the technical solutions of the embodiments of the present application.​​

Claims

1. An electronic device, comprising: The application relates to an electronic device, comprising: a circuit board having a first surface; an electronic component located on a side facing the first surface and electrically connected to the first surface; a heat sink located on a side of the electronic component away from the circuit board and in thermal conduction with the electronic component, the heat sink comprising a middle region and an edge, the edge comprising opposite first and second edges and opposite third and fourth edges, an angle being provided between the fourth edge and the second edge, a part of the edge of the heat sink connected between the fourth edge and the second edge being a bevel edge, the bevel being a non-solid region surrounded by the bevel edge, an extension line of the fourth edge and an extension line of the second edge; an antenna provided on the bevel edge away from the middle region of the heat sink.

2. The electronic device of claim 1, wherein, The bevel edge is an inclined edge, which is inclined relative to the fourth edge and the second edge.

3. The electronic device of claim 2, wherein, The angle of inclination of the bevel edge relative to the fourth edge is greater than or equal to 30 DEG and less than or equal to 60 DEG.

4. The electronic device of claim 2, wherein, In a plane parallel to the heat sink, a projection of the antenna on the bevel edge overlaps the bevel edge.

5. The electronic device of claim 1, wherein, The bevel edge is a circular arc edge, which is arched away from the middle region of the heat sink, and the circular arc edge is tangent to the fourth edge and the second edge.

6. The electronic device of any of claims 1-5, wherein, The first edge is parallel to the second edge, the third edge is parallel to the fourth edge, and the third edge is perpendicular to the first edge.

7. The electronic device of claim 6, wherein, The width of the heat sink in the extension direction of the first edge and the second edge is a first width; The width of the heat sink in the extension direction of the third edge and the fourth edge is a second width; The first width is greater than the second width.

8. The electronic device of any of claims 1-5, 7, wherein, The projection length of the bevel edge in the extension direction of the fourth edge is less than or equal to 1 / 2 of the width of the heat sink in the extension direction of the fourth edge.

9. The electronic device of any of claims 1-5, 7, wherein, The third edge is connected to the first edge or provided with a first chamfer; The third edge is connected to the second edge or provided with a second chamfer; The fourth edge is connected to the first edge or provided with a third chamfer; The areas of the first chamfer, the second chamfer and the third chamfer are all less than the area of the bevel.

10. The electronic device of any of claims 1-5, 7, wherein, The heat sink comprises a metal heat sink plate and fins; The metal heat sink plate is stacked and spaced apart from the circuit board; The fins are provided on the surface of the metal heat sink plate away from the electronic component, and the fins are integrally formed with the metal heat sink plate.

11. The electronic device of any of claims 1-5, 7, wherein, The electronic component comprises at least one of an SOC, a DDR and an AP.

12. The electronic device of any of claims 1-5, 7, wherein, The antenna is a Bluetooth antenna, a WIFI-2.4G antenna, a WIFI-5G antenna or a GPS antenna.

13. The electronic device of any of claims 1-5, 7, wherein, The electronic device is a large-screen display device.

14. A heat spreader, comprising: The heat sink comprises a middle region and edges, the edges comprise opposite first and second edges, and opposite third and fourth edges, the fourth edge is provided with a cut corner with the second edge, a part of the edge of the heat sink connected between the fourth edge and the second edge is a cut corner edge, the cut corner is a non-solid region surrounded by the cut corner edge, an extension line of the fourth edge and an extension line of the second edge.

15. The heat spreader of claim 14, wherein, The cut corner edge is an inclined edge, which is inclined relative to the fourth edge and the second edge.

16. The heat spreader of claim 15, wherein, The inclination angle of the cut corner edge relative to the fourth edge is greater than or equal to 30° and less than or equal to 60°.

17. The heat spreader of claim 14, wherein, The cut corner edge is a circular arc edge, which is arched away from the middle region of the heat sink, and the circular arc edge is tangent to the fourth edge and the second edge.

18. The heat sink of any of claims 14-17, wherein, The first edge is parallel to the second edge, the third edge is parallel to the fourth edge, and the third edge is perpendicular to the first edge.

19. The heat spreader of claim 18, wherein, The width of the heat sink in the extension direction of the first edge and the second edge is a first width. The width of the heat sink in the extension direction of the third edge and the fourth edge is a second width. The first width is greater than the second width.

20. The heat sink of any of claims 14-17, 19, wherein, The projection length of the cut corner edge in the extension direction of the fourth edge is less than or equal to 1 / 2 of the width of the heat sink in the extension direction of the fourth edge.

21. The heat sink of any of claims 14-17, 19, wherein, The third edge is connected to the first edge or provided with a first chamfer; The third edge is connected to the second edge or provided with a second chamfer; The fourth edge is connected to the first edge or provided with a third chamfer; The areas of the first chamfer, the second chamfer and the third chamfer are all less than the area of the cut corner.

22. The heat sink of any of claims 14-17, 19, wherein, The heat sink comprises a metal heat dissipation plate and fins; The fins are arranged on a surface of the metal heat dissipation plate surrounded by the first edge, the second edge, the third edge and the fourth edge, and the fins are integrally formed with the metal heat dissipation plate.

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