Cutting apparatus and method of manufacturing cut products

Abstract

The present invention provides a cutting device capable of cleaning flanges and a method of manufacturing a cut product. The cutting device includes a blade replacement mechanism that replaces a blade provided to a spindle portion, and a cleaning mechanism that cleans a pair of flanges for fixing the blade to the spindle portion.

Description

Technical Field

[0001] This invention relates to a cutting device and a method for manufacturing the cut product. Background Technology

[0002] Patent Document 1 discloses a cutting device including a blade changing mechanism that can replace blades mounted on a spindle. Specifically, the blade changing mechanism disclosed in Patent Document 1 holds the blade and a flange for fixing the blade, and is detachable from the spindle. The blade changing mechanism allows for automatic blade replacement.

[0003] Existing technical documents

[0004] Patent documents

[0005] Patent Document 1: Japanese Patent Application Publication No. 2019-5857 Summary of the Invention

[0006] The problem that the invention aims to solve

[0007] In the cutting device described in Patent Document 1, cutting chips or water droplets generated during cutting sometimes adhere to the flange, so it is preferable to perform a flange cleaning operation appropriately. Therefore, from the viewpoint of reducing the workload, a technology that can automatically clean the flange is sought.

[0008] The present invention was made in view of the situation described above, and the problem it aims to solve is to provide a cutting device capable of cleaning flanges and a method for manufacturing cut articles.

[0009] Technical means to solve the problem

[0010] The problem to be solved by the present invention is as described above. In order to solve the problem, the cutting device of the present invention includes: a blade replacement mechanism for replacing the blade provided on the main shaft; and a cleaning mechanism for cleaning a pair of flanges used to fix the blade to the main shaft.

[0011] Furthermore, the method for manufacturing the cut-off article of the present invention includes the following steps: replacing the blade provided on the main shaft using the cutting device; cleaning the pair of flanges; and cutting the object to be cut using the blade.

[0012] The effects of the invention

[0013] According to the present invention, flange cleaning can be performed. Attached Figure Description

[0014] Figure 1 This is a plan view showing the overall structure of a cutting device according to one embodiment.

[0015] Figure 2 It is a three-dimensional diagram showing the positional relationship between the blade changing mechanism, the cleaning mechanism, and the spindle.

[0016] Figure 3 It is a three-dimensional diagram showing the movement of the moving part.

[0017] Figure 4 It is an enlarged cross-sectional perspective view showing the structure of the main shaft.

[0018] Figure 5 (a) is a three-dimensional diagram showing the shape of the first cleaning sponge. Figure 5 (b) is a perspective view showing a modified example of the first cleaning sponge.

[0019] Figure 6 (a) is a schematic diagram showing the use of air from an air nozzle to clean the blade. Figure 6 (b) is a schematic diagram showing the second flange and the blade being disassembled from the spindle. Figure 6 (c) is a schematic diagram showing the case where a used blade is contained. Figure 6 (d) is a schematic diagram showing the use of a second cleaning sponge to clean the second flange.

[0020] Figure 7 (a) is a schematic diagram showing the case where the holding part holds an unused blade. Figure 7 (b) is a schematic diagram showing the use of air from an air nozzle to clean the first flange. Figure 7 (c) is a schematic diagram showing the use of a first cleaning sponge to clean the first flange. Figure 7 (d) is a schematic diagram showing the second flange and the blade being mounted on the spindle.

[0021] [Explanation of Symbols]

[0022] 1: Cutting device

[0023] 11: Substrate supply organization

[0024] 21: Cutting platform

[0025] 22: Cutting clamp

[0026] 23: Mobile mechanism

[0027] 24: Rotating mechanism

[0028] 25: Spindle section

[0029] 25a: Blade

[0030] 25b: Rotation axis

[0031] 25c: First flange

[0032] 25d: Second flange

[0033] 25e: Disassembly and assembly components

[0034] 25f: First contact surface

[0035] 25g: Second contact surface

[0036] 26: Partition wall

[0037] 26a: Opening

[0038] 27: Blade Changer

[0039] 27a: Blade housing section already in use

[0040] 27b: Unused blade storage compartment

[0041] 31: Inspection Platform

[0042] 32: Pallet

[0043] 100: Blade changing mechanism

[0044] 110: Support section

[0045] 120: Maintaining Department

[0046] 130: Mobile Department

[0047] 131: Rotating part

[0048] 132: First linear moving part

[0049] 133: Second linear movement unit

[0050] 134: Third linear movement unit

[0051] 200: Enclosed section

[0052] 300: Cleaning organization

[0053] 310: First Cleaning Agency

[0054] 311: First cleaning sponge

[0055] 311a: Installation components

[0056] 312: Air Nozzle

[0057] 320: Second Cleaning Unit

[0058] 321: Second cleaning sponge

[0059] 322: Drive Unit

[0060] A: Substrate supply module

[0061] B: Disconnect module

[0062] C: Storage module

[0063] CTL: Control Department

[0064] P: Products

[0065] W: Sealed substrate

[0066] X, Y, Z, θ: Direction Detailed Implementation

[0067] <Structure of Cutting Device 1>

[0068] First, the structure of the cutting device 1 in this embodiment will be described. In this embodiment, for example, when the cutting device 1 is used to cut a sealed substrate W on which a semiconductor chip is mounted, the structure of the cutting device 1 will be described.

[0069] As a sealed substrate W, examples include ball grid array (BGA) packaging substrates, chip size package (CSP) packaging substrates, and light emitting diode (LED) packaging substrates. Moreover, as the object to be cut, not only sealed substrate W is used, but sometimes sealed lead frames that have resin-sealed the lead frames on which semiconductor chips are mounted are also used.

[0070] Figure 1 The cutting device 1 shown is a processing apparatus that cuts a sealed substrate W, which is the object to be cut, into multiple cut products (products P). The cutting device 1 includes a substrate supply module A, a cutting module B, and a storage module C as constituent components. Each constituent component is detachable and replaceable relative to the other constituent components.

[0071] <Baseboard Supply Module A>

[0072] The substrate supply module A mainly includes a substrate supply mechanism 11 and a control unit CTL.

[0073] The sealed substrate W, the object to be cut, is taken out from the substrate supply mechanism 11 and transferred to the cutting module B via a transfer mechanism (not shown). The control unit CTL controls the operation of each part of the cutting device 1. By controlling each part of the cutting device 1 through the control unit CTL, the loading of the sealed substrate W, the cutting of the sealed substrate W, the inspection of the product P, and the unloading of the product P can be performed. Furthermore, the control unit CTL may be provided in a module other than the substrate supply module A. Moreover, multiple control units CTLs may be provided. For example, control units CTLs may be provided in each module, allowing the control units CTLs to control each part in a coordinated manner.

[0074] <Cut-off Module B>

[0075] Figure 1 The cutting module B shown mainly includes a cutting platform 21, a cutting clamp 22, a moving mechanism 23, a rotating mechanism 24, a main shaft 25, a partition wall 26, a blade changing table 27, a blade changing mechanism 100, a sealing part 200, a first cleaning mechanism 310 (cleaning mechanism 300), and a second cleaning mechanism 320 (cleaning mechanism 300).

[0076] In this embodiment, a double-cutting-platform type cutting device 1 with two cutting platforms 21 is illustrated. A cutting clamp 22 is provided on each cutting platform 21. The cutting platform 21 can be moved in the Y direction by a moving mechanism 23 and rotated in the θ direction by a rotating mechanism 24.

[0077] Furthermore, in this embodiment, a cutting device 1 with a dual-spindle structure having two spindle sections 25 is illustrated. The two spindle sections 25 can move independently of each other in the X and Z directions.

[0078] A partition wall 26 is positioned to separate the space where the spindle section 25 is located from the space where the blade changing station 27 is located. In this embodiment, the partition wall 26 is located behind one of the spindle sections 25 (right side of the figure). Moreover, the partition wall 26 is arranged around the blade changing station 27. An opening 26a is formed in a portion of the partition wall 26, which connects the space where the spindle section 25 is located with the space where the blade changing station 27 is located.

[0079] exist Figure 1 as well as Figure 2 The upper surface of the blade changing station 27 shown has: a used blade receiving section 27a, which receives used blades 25a that have been used by the spindle section 25; and an unused blade receiving section 27b, which receives unused blades 25a for replacement. The used blade receiving section 27a is formed as a box with an open upper surface. Furthermore, a second cleaning mechanism 320 (cleaning mechanism 300), described later, is provided on the upper surface of the blade changing station 27.

[0080] Furthermore, the structure of the unused blade receiving portion 27b and the used blade receiving portion 27a is not limited to this embodiment and can be modified arbitrarily. As an example, the used blade receiving portion 27a may also be configured to include a cylindrical member extending vertically. In this configuration, the blade 25a can be retained by inserting the center of the blade 25a into the cylindrical member.

[0081] The blade changing mechanism 100 replaces the blades 25a located on the spindle section 25. The blade changing mechanism 100 is positioned behind the two spindle sections 25 (right side of the diagram). The blade changing mechanism 100 includes a closing section 200 that can close the opening 26a of the partition wall 26. Furthermore, the blade changing mechanism 100 includes a first cleaning mechanism 310 (cleaning mechanism 300), which will be described later.

[0082] In the cutting module B, with the sealed substrate W held on the cutting platform 21, the cutting platform 21 is moved relative to the two spindle sections 25, thereby cutting the sealed substrate W into a single piece. The blades 25a of the spindle section 25 rotate in a plane including the Y and Z directions, thereby cutting the sealed substrate W held on the cutting platform 21. At this time, cutting water can also be sprayed towards the blades 25a while cutting the sealed substrate W.

[0083] <Storage Module C>

[0084] The storage module C mainly includes an inspection platform 31 and a tray 32.

[0085] On inspection platform 31, an assembly of multiple products P, each monolithically formed by cutting a sealed substrate W, is placed. The multiple products P are inspected by an inspection camera (not shown) and sorted into good and defective products. The sorted good products are stored in tray 32. The sorted defective products are stored in a separately prepared tray (not shown) and excluded from the product P. Furthermore, in storage module C, inspection of the product P may not be necessary.

[0086] <Detailed Structure of Blade Changing Mechanism 100>

[0087] Next, the structures of the blade changing mechanism 100, the sealing part 200, and the cleaning mechanism 300 will be described in more detail. Furthermore, the detailed structure or shape of each part of the blade changing mechanism 100, etc., is not particularly limited; therefore, the shapes of each part are illustrated in a simplified manner in this embodiment.

[0088] <Blade changing mechanism 100>

[0089] like Figure 2 as well as Figure 3As shown, the blade changing mechanism 100 mainly includes a support part 110, a holding part 120, and a moving part 130.

[0090] The support portion 110 supports the retaining portion 120 and the first cleaning mechanism 310, which will be described later. The support portion 110 can be formed by combining suitable components (rod-shaped components, plate-shaped components, etc.). In this embodiment, the support portion 110 is formed along one direction ( Figure 2 as well as Figure 3 It is a long strip (with the X direction in the middle).

[0091] The retaining part 120 can retain the blade 25a provided on the spindle part 25, and the second flange 25d for fixing the blade 25a to the spindle part 25. The retaining part 120 is provided at one end in the long side direction of the support part 110.

[0092] Here, use Figure 4 The structure of the spindle section 25 (especially the part related to fixing the blade 25a) will be explained. Figure 4 This indicates one of the two main spindle sections 25. Figure 2 A cross-section of a portion of the main shaft 25 on the left side of the paper.

[0093] A generally annular first flange 25c is fixed to the rotation shaft 25b of the main shaft portion 25. Furthermore, a generally annular second flange 25d is provided facing the first flange 25c. Moreover, the first flange 25c and the second flange 25d are respectively one embodiment of the flange and the other flange of the present invention.

[0094] By fastening the mounting / unmounting component 25e, such as a nut, to the boss portion of the first flange 25c, the second flange 25d is pressed toward the first flange 25c. On the outer periphery of the first flange 25c and the second flange 25d, a first contact surface 25f and a second contact surface 25g protruding in opposite directions are formed. A generally annular blade 25a is clamped and fixed between the first contact surface 25f and the second contact surface 25g.

[0095] Figure 2 as well as Figure 3 The retaining portion 120 shown rotates the mounting / removing member 25e mounted on the spindle portion 25, thereby allowing the mounting / removing member 25e to be mounted or detached from the protruding portion of the first flange 25c. Furthermore, the retaining portion 120 can independently retain the blade 25a and the second flange 25d respectively. Methods for the retaining portion 120 to retain the blade 25a and the second flange 25d include, for example, a method of holding the blade 25a by adsorption, or a method of mechanically retaining it by hooking a claw-shaped member onto the blade 25a.

[0096] Thus, the retaining part 120 can detach the blade 25a and the second flange 25d mounted on the spindle part 25 from the spindle part 25. Moreover, the retaining part 120 can mount the retained blade 25a and the second flange 25d to the spindle part 25.

[0097] The moving part 130 moves the support part 110 in any direction. The moving part 130 mainly includes a rotating part 131, a first linear moving part 132, a second linear moving part 133, and a third linear moving part 134.

[0098] The rotating part 131 rotates the support part 110. The rotating part 131 can support the support part 110 and uses the driving force of a drive source such as a motor to rotate the support part 110. The rotating part 131 can rotate the support part 110 about an axis parallel to the Y direction.

[0099] The first linear motion unit 132 causes the rotating unit 131 to move linearly. The first linear motion unit 132 can support the rotating unit 131 and use the driving force of a drive source such as a motor to move the rotating unit 131. The first linear motion unit 132 can cause the rotating unit 131 to move linearly along the Y direction.

[0100] The second linear moving part 133 causes the first linear moving part 132 to move linearly. The second linear moving part 133 can support the first linear moving part 132 and uses the driving force of a drive source such as a motor to move the first linear moving part 132. The second linear moving part 133 can cause the first linear moving part 132 to move linearly along the Z direction.

[0101] Figure 2 The third linear movement unit 134 shown causes the second linear movement unit 133 to move linearly. The third linear movement unit 134 can support the second linear movement unit 133 and uses the driving force of a drive source such as a motor to move the second linear movement unit 133. The third linear movement unit 134 can cause the second linear movement unit 133 to move linearly along the X direction.

[0102] By combining the movements of the various parts of the moving part 130 configured as described above, the support part 110 can be moved to any position and rotated arbitrarily about an axis along the Y direction.

[0103] <Closed Section 200>

[0104] The closing portion 200 can close the opening 26a of the partition wall 26. The closing portion 200 is formed as a plate with a shape corresponding to the opening 26a. The closing portion 200 is disposed on one side of the support portion 110 in the X direction. Figure 2(Right side of the paper in the image). The closing part 200 is provided on the moving part 130 with the plate surface facing the X direction. Specifically, the closing part 200 is provided on the second linear moving part 133 and can move linearly in the X direction via the third linear moving part 134.

[0105] <Cleaning Unit 300>

[0106] The cleaning mechanism 300 is used to clean the flanges (first flange 25c and second flange 25d) used to fix the blade 25a to the spindle portion 25. The cleaning mechanism 300 mainly includes a first cleaning mechanism 310 and a second cleaning mechanism 320.

[0107] Figure 3 The first cleaning mechanism 310 shown cleans the first flange 25c, which is mounted on the spindle section 25. The first cleaning mechanism 310 mainly includes a first cleaning sponge 311 and an air nozzle 312.

[0108] Figure 3 as well as Figure 5 The first cleaning sponge 311 shown in (a) is a cleaning member for cleaning the first flange 25c. The first cleaning sponge 311 is formed into a cylindrical shape having an outer diameter equal to that of the first flange 25c. The first cleaning sponge 311 is mounted to one end of the support portion 110 in the long side direction via a circular plate-shaped mounting member 311a. The first cleaning sponge 311 is located on the opposite side of the holding portion 120 in the long side direction of the support portion 110. In other words, the first cleaning sponge 311 is located at a position that is 180 degrees reversed from the holding portion 120 with respect to the rotation axis of the rotating portion 131. Furthermore, in this embodiment, the "opposite side of the holding portion 120" where the first cleaning sponge 311 is disposed is an example of the "side different from the holding portion" of the present invention.

[0109] Furthermore, the first cleaning sponge 311 is not limited to Figure 5 The cylindrical shape shown in (a) can be any shape. For example, it can also be as follows: Figure 5 As shown in the modified example (b), the cylinder is divided into multiple shapes. Therefore, the corners of the sponge can be used to clean the first flange 25c, thereby improving the cleaning ability of the first cleaning sponge 311.

[0110] Figure 3 The air nozzle 312 shown can eject compressed air supplied by a compressor (not shown). The air nozzle 312 is provided at one end of the support portion 110 in the long side direction (on the same side as the first cleaning sponge 311). The air nozzle 312 is configured so that the air ejection direction is towards the first cleaning sponge 311.

[0111] The second cleaning mechanism 320 cleans the second flange 25d in the disassembled state of the self-shaft portion 25 (held by the holding portion 120). The second cleaning mechanism 320 mainly includes a second cleaning sponge 321 and a drive portion 322.

[0112] Figure 2 The second cleaning sponge 321 shown is a cleaning component used to clean the second flange 25d. The second cleaning sponge 321 is formed as a cylinder having the same diameter as the second flange 25d. The second cleaning sponge 321 is formed as... Figure 5 The first cleaning sponge 311 shown has the same shape. The second cleaning sponge 321 is provided on the upper surface of the blade changing table 27 with the axis of the cylinder facing the Z direction.

[0113] The drive unit 322 rotates the second cleaning sponge 321. The drive unit 322 has a drive source such as a motor. The output shaft of the drive unit 322 is connected to the second cleaning sponge 321. The second cleaning sponge 321 can be rotated about an axis parallel to the Z direction by the driving force of the drive unit 322.

[0114] <Operation of blade changing mechanism 100, etc.>

[0115] Next, the operation of replacing the blade 25a provided on the spindle section 25 and cleaning the first flange 25c and the second flange 25d using the blade replacement mechanism 100 and cleaning mechanism 300 configured as described above will be explained. Furthermore, the following describes the operation of replacing the blade 25a on the spindle section 25 and cleaning the first flange 25c and the second flange 25d using one of the two spindle sections 25 (e.g., ...). Figure 2 The replacement of the blade 25a in the spindle section 25 on the left side of the paper will be explained.

[0116] When the cutting device 1 is cutting the sealed substrate W, such as Figure 2 As shown by the two-point chain line, the sealing section 200 is positioned at the opening 26a of the sealing partition wall 26. By using the sealing section 200 to close the opening 26a, the space where the blade changing table 27 is arranged and the space where the spindle section 25 is arranged can be divided. This prevents cutting chips or water droplets generated during the cutting of the sealed substrate W from adhering to the blade changing table 27 (especially the unused blade receiving section 27b that holds the replacement blade 25a). Furthermore, in this state, the holding section 120 and the first cleaning mechanism 310 are located in the space where the blade changing table 27 is arranged.

[0117] When replacing the blade 25a, the cutting of the sealed substrate W by the cutting device 1 is temporarily interrupted. Furthermore, the replacement of the blade 25a and the cleaning of the first flange 25c and the second flange 25d can be performed at any time. For example, the wear of the blade 25a can be detected using a suitable sensor, and the blade 25a can be replaced when the wear exceeds a certain amount. Moreover, the blade 25a can also be replaced when the operating time of the cutting device 1, the number of products P produced, or other predetermined values ​​are exceeded.

[0118] When changing the blade 25a, the closing part 200 moves integrally with the support part 110 and the holding part 120 via the moving part 130, and the opening 26a of the partition wall 26 is opened. The support part 110 and the like can move between the space on the spindle part 25 side and the space on the blade changing table 27 side via the opened opening 26a.

[0119] When changing the 25a blade, etc., firstly as follows: Figure 6 As shown in (a), the support 110 moves via the moving part 130, and the front end of the air nozzle 312 faces the blade 25a mounted on the spindle 25. In this state, air is ejected from the air nozzle 312, and cutting chips or water droplets adhering to the blade 25a are removed.

[0120] Furthermore, cutting chips or water droplets that are not removed by the air nozzle 312 will remain on the blade 25a. Therefore, as will be described later, when the second flange 25d and the blade 25a are disassembled from the autonomous shaft 25, the cutting chips or water droplets remaining on the blade 25a may sometimes adhere to the first flange 25c and the second flange 25d, causing contamination.

[0121] Next, as Figure 6 As shown in (b), the support portion 110 is reversed by the moving portion 130, and the holding portion 120 is moved to a position facing the blade 25a of the spindle portion 25. Then, the second flange 25d and the blade 25a are separated from the spindle portion 25 by the holding portion 120.

[0122] Next, as Figure 6 As shown in (c), the holding part 120 moves to a position facing the used blade receiving part 27a provided on the blade changing table 27 from above via the moving part 130. Then, the holding part 120 releases its holding of the blade 25a, and the used blade 25a is received into the used blade receiving part 27a.

[0123] Next, as Figure 6As shown in (d), the second flange 25d, held by the holding part 120, is moved to a position contacting the upper surface of the second cleaning sponge 321 of the second cleaning mechanism 320 via the moving part 130. In this state, the second cleaning sponge 321 is rotated by the driving part 322, thereby cleaning the surface of the second flange 25d (especially... Figure 4 The second contact surface 25g (as shown) is cleaned. This removes cutting chips and other debris adhering to the second flange 25d.

[0124] Next, as Figure 7 As shown in (a), the holding part 120 moves to a position facing the unused blade receiving part 27b provided on the blade changing table 27 from above via the moving part 130. Then, the holding part 120 holds the unused blade 25a contained in the unused blade receiving part 27b. As in this embodiment, by providing the used blade receiving part 27a, the unused blade receiving part 27b, and the second cleaning mechanism 320 on the same blade changing table 27, the travel distance of the holding part 120 when moving between the used blade receiving part 27a, the unused blade receiving part 27b, and the second cleaning mechanism 320 can be minimized.

[0125] Next, as Figure 7 As shown in (b), the support 110 moves via the moving part 130, and the front end of the air nozzle 312 faces the first flange 25c mounted on the spindle part 25. In this state, air is ejected from the air nozzle 312, and cutting chips or water droplets adhering to the first flange 25c are removed.

[0126] Next, as Figure 7 As shown in (c), the first cleaning sponge 311 of the first cleaning mechanism 310 is moved to a position contacting the first flange 25c mounted on the main shaft 25 via the moving part 130. In this state, the main shaft 25 is rotated, thereby cleaning the surface of the first flange 25c (especially...) Figure 4 The first contact surface 25f shown is cleaned. This removes cutting chips and other debris adhering to the first flange 25c.

[0127] Next, as Figure 7 As shown in (d), the support portion 110 is reversed by the moving portion 130, and the holding portion 120 is moved to a position facing the first flange 25c of the spindle portion 25. Then, the second flange 25d held by the holding portion 120 and the blade 25a are mounted to the spindle portion 25.

[0128] Furthermore, in the example described, the operation of changing the blade 25a of one of the spindle sections 25 is explained, but the operation of changing the blade 25a of the other spindle section 25 is roughly the same, so the description is omitted.

[0129] As described above, when the replacement of the blade 25a of the spindle section 25 and the cleaning of the first flange 25c and the second flange 25d are completed, the sealing section 200 moves again to the position of sealing the opening 26a of the partition wall 26 (see reference). Figure 2 Subsequently, the cutting device 1 began cutting the sealed substrate W again.

[0130] Thus, in this embodiment, the steps of replacing the blade 25a provided on the spindle section 25 and cleaning the first flange 25c and the second flange 25d can be performed in parallel. Furthermore, the step of cutting the sealed substrate W using the replaced blade 25a can be performed.

[0131] As described above, the cutting device 1 of this embodiment includes: a blade replacement mechanism 100 for replacing the blade 25a provided on the spindle portion 25; and a cleaning mechanism 300 for cleaning a pair of flanges (first flange 25c and second flange 25d) used to fix the blade 25a to the spindle portion 25.

[0132] By configuring it in this way, the flange can be cleaned. Furthermore, by using the cleaning mechanism 300 to clean the flange, the user's cleaning workload can be reduced. Moreover, by cleaning the flange, the blade 25a can be properly secured.

[0133] Furthermore, the cleaning mechanism 300 includes: a first cleaning mechanism 310 for cleaning the first flange 25c (one of the flanges) of the pair of flanges; and a second cleaning mechanism 320 for cleaning the second flange 25d (the other flange) of the pair of flanges.

[0134] By constructing it in this way or that way, a pair of flanges can be cleaned separately, thereby cleaning a pair of flanges more effectively.

[0135] Furthermore, the first cleaning mechanism 310 can clean the first flange 25c when it is installed on the spindle portion 25, and the second cleaning mechanism 320 can clean the second flange 25d when it is detached from the spindle portion 25.

[0136] By configuring it in this way, the second flange 25d that is removed from the spindle portion 25 and the first flange 25c that remains in the spindle portion 25 can be cleaned separately when the blade 25a is replaced.

[0137] Furthermore, the first cleaning mechanism 310 can clean the first flange 25c while the first flange 25c mounted on the main shaft 25 is rotating due to the rotation of the main shaft 25.

[0138] By configuring it in this way, the first flange 25c can be cleaned by rotating the main shaft 25. As a result, the structure of the first cleaning mechanism 310 can be simplified.

[0139] Furthermore, the blade replacement mechanism 100 includes: a holding part 120 for holding the blade 25a and the second flange 25d; a support part 110 for supporting the holding part 120 and the first cleaning mechanism 310; and a moving part 130 for moving the support part 110, wherein the first cleaning mechanism 310 is located on a side of the support part 110 different from the holding part 120.

[0140] By configuring the first cleaning mechanism 310 and the holding portion 120 on opposite sides, the tilting of the center of gravity of the support portion 110 can be suppressed. This allows for smooth movement of the support portion 110. In particular, in this embodiment, since the first cleaning mechanism 310 and the holding portion 120 are positioned on opposite sides, the tilting of the center of gravity of the support portion 110 can be effectively prevented.

[0141] Furthermore, the second cleaning mechanism 320 can clean the second flange 25d held by the holding part 120.

[0142] By configuring it in this way, the second flange 25d held by the holding part 120 can be cleaned directly when the blade 25a is replaced, so the second flange 25d can be cleaned efficiently.

[0143] Furthermore, the cutting device 1 includes: a partition wall 26 that separates the space where the main shaft portion 25 is disposed from the space where the replacement blade 25a is disposed, and has an opening 26a; and a closing portion 200 that can be moved by the moving portion 130 and closes the opening 26a when the blade replacement mechanism 100 is in a predetermined position.

[0144] By configuring it in this way, the holding part 120 and the like can be moved via the opening 26a, and the opening 26a can be closed by the closing part 200 as needed. For example, by closing the opening 26a by the closing part 200 during the cutting of the sealed substrate W, cutting chips and the like can be prevented from adhering to the replacement blade 25a. Especially in this embodiment, with the opening 26a closed by the closing part 200, the holding part 120 and the first cleaning mechanism 310 are arranged in the space on the side of the replacement blade 25a, so cutting chips and the like generated during the cutting of the sealed substrate W can also be prevented from adhering to the holding part 120 and the like.

[0145] Furthermore, the manufacturing method of the article P (cut article) in this embodiment includes the following steps: replacing the blade 25a provided on the spindle portion 25 using the cutting device 1; cleaning the pair of flanges; and cutting the sealed substrate W (cutting object) using the blade 25a.

[0146] By configuring it in this way, the flanges can be cleaned. In particular, in this embodiment, the process of changing the blade 25a and the process of cleaning a pair of flanges can be performed in parallel, thus enabling efficient manufacturing of the product P.

[0147] The embodiments of the present invention have been described above, but the present invention is not limited to the described embodiments, and appropriate modifications can be made within the scope of the technical concept of the invention as described in the claims.

[0148] For example, the structure of the moving part 130 in this embodiment (see reference). Figure 3 For example, as long as the holding part 120 and the first cleaning mechanism 310 can be moved to the desired position, the specific structure is not limited. Moreover, the closing part 200 is provided on the second linear moving part 133, but the present invention is not limited to this. That is, the closing part 200 can be a structure that can be moved by the moving part 130 to close the opening 26a, for example, it can also be provided on the third linear moving part 134 independently of the second linear moving part 133.

[0149] Furthermore, in this embodiment, an example is shown where the spindle portion 25 is rotated during cleaning of the first flange 25c (see reference). Figure 7 (c) can also be configured, for example, to rotate the first cleaning sponge 311.

[0150] Furthermore, the shapes of the first cleaning sponge 311 and the second cleaning sponge 321 are not limited to the shapes of this embodiment (see reference). Figure 5 ), and can be changed at will.

[0151] Furthermore, the cleaning mechanism 300 in this embodiment uses sponges (first cleaning sponge 311 and second cleaning sponge 321) as cleaning components for cleaning, but the present invention is not limited to this, and any cleaning component (such as waste cotton) can also be used.

[0152] Furthermore, while the cleaning mechanism 300 of this embodiment cleans the flange using a sponge and an air nozzle 312, the flange cleaning method is not limited to this, and any cleaning method can be used to clean the flange. For example, the flange can be cleaned by spraying cleaning water, or by suctioning away cutting chips or other debris adhering to the flange. Moreover, the cleaning mechanism 300 can also combine multiple cleaning methods to clean the flange.

[0153] Furthermore, this embodiment illustrates an example of cleaning the first flange 25c while it is mounted on the spindle portion 25 (see reference). Figure 7 (b) and Figure 7 (c)), but the present invention is not limited thereto. For example, it may be configured to clean the first flange 25c while the first flange 25c is detached from the spindle portion 25. In this case, a separate mechanism for loading and unloading the first flange 25c may also be provided, so that the loading and unloading of the first flange 25c is performed automatically.

[0154] Furthermore, in this embodiment, the holding part 120 and the first cleaning mechanism 310 are shown to be located on opposite sides of the support part 110 (reversed 180 degrees when viewed from the front, see reference). Figure 6 Examples (e.g., etc.) are provided, but the present invention is not limited thereto. The holding part 120 and the first cleaning mechanism 310 may be provided at any position of the support part 110. For example, the first cleaning mechanism 310 may also be positioned at a position rotated 90 degrees or 120 degrees relative to the holding part 120.

[0155] Furthermore, this embodiment illustrates an example in which the holding part 120 and the first cleaning mechanism 310 are both provided on the support part 110 so that they can move as a single unit, but the present invention is not limited thereto. For example, it may also be configured such that the holding part 120 and the first cleaning mechanism 310 are respectively provided on different components so that they can move independently of each other.

[0156] Furthermore, this embodiment illustrates an example of temporarily interrupting the cutting device 1's cutting of the sealed substrate W to replace the blade 25a and clean the flange. However, the timing of replacing the blade 25a, etc., can be arbitrarily determined. For example, the blade 25a can be replaced before the cutting device 1 begins cutting the sealed substrate W, or after the cutting device 1 has completely finished cutting the sealed substrate W. Moreover, when the cutting device 1 is provided with multiple spindle sections 25 as in this embodiment, the replacement of the blade 25a of each spindle section 25 can be performed at the same time or at different times.

Claims

1. A cutting device, comprising: The blade changing mechanism replaces the blades located on the spindle. as well as The cleaning mechanism cleans the pair of flanges used to fix the blade to the spindle portion. The cleaning mechanism includes: The first cleaning mechanism cleans one of the two flanges; as well as The second cleaning mechanism cleans the other flange of the pair of flanges. The first cleaning mechanism is capable of cleaning one of the flanges that is mounted on the spindle. The second cleaning mechanism is capable of cleaning the other flange in a state of being disassembled from the main shaft.

2. The cutting device according to claim 1, wherein the first cleaning mechanism is capable of cleaning one of the flanges mounted on the main shaft while the flange is rotated by the rotation of the main shaft.

3. The cutting device according to claim 1 or 2, wherein The blade replacement mechanism includes: The retaining part is capable of holding the blade and the other flange; The support part supports the holding part and the first cleaning mechanism; as well as The movable part enables the support part to move. The first cleaning mechanism is located on a side of the support portion that is different from the holding portion.

4. The cutting device according to claim 3, wherein the second cleaning mechanism is capable of cleaning the other flange held by the holding portion.

5. The cutting device according to claim 3, comprising: A partition wall separates the space where the main shaft is arranged from the space where the replacement blade is arranged, and has an opening; as well as The closing part is movable via the moving part, and closes the opening when the blade changing mechanism is in a predetermined position.

6. A method for manufacturing a cut-off object, comprising the steps of: replacing the blade disposed on the main shaft portion using a cutting device as described in any one of claims 1 to 5; cleaning the pair of flanges; and cutting the object to be cut using the blade.

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