A continuous magnetron sputtering coating device

Abstract

This invention relates to the field of coating, specifically to a continuous magnetron sputtering coating apparatus. It includes a main body and a coating mechanism mounted on the main body. The coating mechanism includes a coating cylinder, a substrate stage, a sputtering target, a baffle assembly, and a transmission assembly. The substrate stage is located at the top inner part of the coating cylinder. The sputtering targets are disposed inside the coating cylinder and evenly distributed along its circumference. The baffle assembly includes a top baffle and vertical baffles. The top baffle is located above the sputtering target, and the vertical baffles are positioned between two adjacent sets of top baffles. This invention divides the top baffle corresponding to each sputtering target into two sector-shaped plates. During use, the two sector-shaped plates open to the sides, ensuring that only the same target material is sputtered on the same surface of the same sector-shaped plate. This prevents the surface of the sector-shaped plates sputtered by different sputtering targets from overlapping, thus preventing contamination of the coating layer by other target materials and improving coating quality.

Description

Technical Field

[0001] This invention relates to the field of coating, and more specifically to a continuous magnetron sputtering coating apparatus. Background Technology

[0002] In modern industrial coating, magnetron sputtering is a commonly used physical vapor deposition method, widely adopted due to its advantages such as simple equipment, ease of control, large coating area, and strong adhesion. Magnetron sputtering coating equipment includes a vacuum chamber, a vacuum system, a cathode target, a sputtering power supply, an inlet system, and baffles. During coating, the vacuum system extracts the gas from the vacuum chamber to achieve the specified vacuum pressure. Then, the inlet system fills the vacuum chamber with argon gas. The sputtering power supply applies high pressure to the argon gas in the vacuum chamber, causing a glow discharge between the anode and cathode. The argon molecules between the electrodes are ionized, generating a charged substance. The positive ions, influenced by the negative potential of the cathode, accelerate and collide with the cathode target, sputtering atoms and other particles. These sputtered atoms are deposited on the substrate located at the anode to form a thin film.

[0003] With the continuous improvement of thin-film device performance and the shrinking linewidth, the requirements for magnetron sputtering films are becoming increasingly stringent. Multi-cavity clustered magnetron sputtering equipment can avoid cross-contamination between targets, but it is expensive, making it unaffordable for most domestic research institutes and enterprises. Therefore, methods integrating multiple magnetron sputtering targets within a single process chamber are increasingly being adopted as an alternative. In this method, multiple sputtering targets are located within the same process chamber. Although each target is equipped with an independent baffle, providing some protection, gaps inevitably exist between the baffles and targets due to their similar height. During sputtering, irregular particle movement can cause cross-contamination of the target material, affecting film quality. This is especially true in multi-target confocal sputtering, where targets are deflected at a certain angle to the same center, making cross-contamination even more likely.

[0004] Chinese patent document CN 106435499 A discloses a magnetron sputtering coating machine. This machine incorporates a partition assembly between two adjacent sputtering targets to reduce side contamination. A rotating baffle assembly is positioned between the sputtering targets and the substrate stage. The rotating baffle assembly has notches to allow individual sputtering targets to be sputtered while shielding the remaining targets, reducing top contamination. This combination of the partition assembly and the rotating baffle assembly effectively protects the sputtering targets, reducing cross-contamination and improving coating quality. However, in actual use, a layer of target material is also sputtered onto the upper surface of the rotating baffle. Due to the use of multiple targets, the upper surface of the rotating baffle contains all target materials, resulting in a more complex composition and structure. Over time, this target material layer on the baffle can also negatively impact coating quality during subsequent use.

[0005] The information disclosed in the background section of this application is intended only to enhance the understanding of the general background of this application and should not be construed as an admission or in any way implying that the information constitutes prior art known to those skilled in the art. Summary of the Invention

[0006] To address the shortcomings of existing technologies, this invention proposes a continuous magnetron sputtering coating apparatus to solve the problem of difficulty in guaranteeing the coating quality of existing coating equipment that integrates multiple magnetron sputtering targets.

[0007] The continuous magnetron sputtering coating apparatus of the present invention adopts the following technical solution: it includes a body and a coating mechanism disposed on the body. The coating mechanism includes a coating cylinder, a substrate stage, a sputtering target, a baffle assembly and a transmission assembly.

[0008] The substrate stage is coaxially positioned at the top inner part of the coating cylinder, and the substrate is mounted on the substrate stage;

[0009] There are three sets of sputtering targets. The three sets of sputtering targets are set inside the coating cylinder and are evenly distributed along the circumference of the coating cylinder. The target material is installed on the sputtering target. The sputtering target is located below the substrate stage and its upper end is tilted and points towards the center of the coating cylinder.

[0010] The baffle assembly includes a top baffle and vertical baffles. There are three sets of top baffles, each corresponding to a sputtering target. The top baffles are located above the sputtering targets. The vertical baffles are positioned between two adjacent sets of top baffles to separate the sputtering targets. Each set of top baffles includes two sector plates. The two adjacent sector plates in two sets of top baffles are rotatably connected relative to each other. Initially, all the top baffles are circular and perpendicular to the axis of the sputtering target.

[0011] The transmission assembly is configured to control the two sector plates of any set of top baffles to open upwards and to both sides until they fit against the adjacent sector plates.

[0012] Optionally, the continuous magnetron sputtering coating apparatus further includes a spindle cylinder, which is coaxially disposed inside the coating cylinder. Vertical baffles are disposed on the outer peripheral wall of the spindle cylinder and are evenly distributed along the circumferential direction of the spindle cylinder. A hinge shaft is provided at the top of the vertical baffle. Two adjacent sector plates in two adjacent sets of top baffles are rotatably connected to the hinge shaft, and a torsion spring is provided between the two sector plates and the hinge shaft. The initial torsion spring causes all the top baffles to be circumferentially closed.

[0013] Optionally, a hinge connects two adjacent sector plates in two adjacent sets of top baffles.

[0014] Optionally, the transmission assembly includes a rotating shaft and a support member, the support member being rotatably mounted on the top of the vertical baffle and capable of pushing the two connected sector plates from the bottom;

[0015] The rotating shaft is fixedly connected to the support. The rotating shaft passes through the side wall of the shaft cylinder and its inner end extends into the inside of the shaft cylinder. A gear is coaxially connected to the inner end of the rotating shaft. A rack is provided inside the shaft cylinder. The rack can rotate around the axis of the shaft cylinder and can slide up and down. In the initial state, the rack is below the gear.

[0016] Optionally, the support includes an arc plate and struts. There are two arc plates, which are arranged radially spaced along the shaft cylinder. The arc plates arch downward. There are two struts, which are respectively connected to the two ends of the arc plates. The arc plates are rotatably mounted on the top of the vertical baffle. The two struts are respectively located below the corresponding sector plates.

[0017] Optionally, the shaft cylinder has an internal mounting post that can slide up and down, and a rack is located at the top of the mounting post and at the outer edge of the mounting post; the shaft cylinder also has an internal first drive rod for driving the mounting post to move up and down along the shaft cylinder.

[0018] Optionally, a drive motor is also provided inside the shaft cylinder. The output end of the drive motor is connected to the first drive rod. The drive motor is used to drive the mounting column to rotate along the axis of the shaft cylinder.

[0019] Optionally, a positioning cylinder is provided on the inner wall of the coating cylinder. The positioning cylinder is inclined and gradually approaches the axis of the coating cylinder from bottom to top. The sputtering target is placed in the positioning cylinder and can slide along the axis of the positioning cylinder. A support seat is provided inside the coating cylinder. The support seat is fixed relative to the coating cylinder. The spindle is slidably inserted into the support seat. A compression spring is provided between the spindle and the support seat. In the initial state, the compression spring has a tendency to move the spindle downward.

[0020] Optionally, the substrate stage can move up and down.

[0021] Optionally, the substrate stage can rotate about its own axis.

[0022] The beneficial effects of the present invention are as follows: In the continuous magnetron sputtering coating apparatus of the present invention, the sputtering targets are separated from each other by the setting of the baffle assembly, and the top baffle corresponding to each sputtering target is divided into two fan-shaped plates. When in use, the two fan-shaped plates open to both sides to shield the upper surface of the adjacent fan-shaped plates, ensuring that the same side of the fan-shaped plate will only sputter the same type of target material. Thus, when the same sputtering target is used, the target material on it is always sputtered on the same surface of the same fan-shaped plate. The surfaces of the fan-shaped plates sputtered between different sputtering targets do not overlap, preventing the coating layer from being contaminated by other target materials and improving the coating quality.

[0023] Furthermore, in this invention, the sputtering target can slide along its axis, while the baffle assembly can move under the push of the sputtering target, thereby adjusting the target-substrate spacing and ensuring that substrates of different materials can achieve uniform film deposition. Attached Figure Description

[0024] To more clearly illustrate the technical solutions in the embodiments of the present invention or the prior art, the drawings used in the description of the embodiments or the prior art will be briefly introduced below. Obviously, the drawings described below are only some embodiments of the present invention. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0025] Figure 1 This is a schematic diagram of the overall structure of a continuous magnetron sputtering coating apparatus according to the present invention.

[0026] Figure 2 This is a schematic diagram of the overall structure of the coating mechanism in this invention;

[0027] Figure 3 This is a cross-sectional view of the coating mechanism in the invention;

[0028] Figure 4 This is a schematic diagram of the coating mechanism in the invention, with the coating cylinder and substrate stage hidden.

[0029] Figure 5 This is a schematic diagram of the top baffle in the coating mechanism;

[0030] Figure 6 This is a schematic diagram of the transmission components in the coating mechanism;

[0031] Figure 7 for Figure 4 A schematic diagram of the structure with the top baffle removed;

[0032] Figure 8 for Figure 7 Enlarged view of point A in the middle.

[0033] In the picture:

[0034] 100. Fuselage;

[0035] 200. Alarm light;

[0036] 300. Coating mechanism; 310. Target material;

[0037] 320. Coating tube; 321. Positioning tube; 325. Observation window; 327. Negative pressure control tube;

[0038] 330. Vertical baffle; 334. Hinge shaft;

[0039] 340. Substrate stage;

[0040] 350. Top baffle; 351. Sector-shaped plate; 353. Hinge;

[0041] 360. Transmission assembly; 361. Drive motor; 362. First drive rod; 363. Rack; 364. Gear; 365. Support component; 3651. Arc plate; 3652. Support rod; 366. Rotating shaft; 367. Mounting column;

[0042] 370. Support base; 371. Compression spring; 372. Shaft cylinder; 375. Torsion spring; 377. Through hole;

[0043] 380. Sputtering target; 381. Second drive rod;

[0044] 390. Substrate. Detailed Implementation

[0045] The technical solutions of the embodiments of the present invention will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of the present invention, and not all embodiments. Based on the embodiments of the present invention, all other embodiments obtained by those skilled in the art without creative effort are within the scope of protection of the present invention.

[0046] like Figures 1 to 8 As shown, the continuous magnetron sputtering coating apparatus provided in this embodiment of the invention includes a body 100 and a coating mechanism 300 disposed on the body 100. The electrical control, gas supply and other control systems are disposed inside the body 100. An alarm light 200 is provided on the body 100 for alarming equipment failure. The coating mechanism 300 includes a coating cylinder 320, a substrate stage 340, a sputtering target 380, a baffle assembly and a transmission assembly 360.

[0047] The substrate stage 340 is coaxially disposed on the inner top of the coating cylinder 320, and the substrate 390 is mounted on the substrate stage 340.

[0048] There are three sets of sputtering targets 380. The three sets of sputtering targets 380 are arranged inside the coating cylinder 320 and are evenly distributed along the circumference of the coating cylinder 320. The target material 310 is installed on the sputtering target 380. The sputtering target 380 is located below the substrate stage 340 and its upper end is tilted towards the center of the coating cylinder 320. Furthermore, the axis of the sputtering target 380 passes through the center of the lower surface of the substrate 390, so that the target material 310 can be sputtered more evenly on the surface of the substrate 390.

[0049] The baffle assembly includes a top baffle 350 and vertical baffles 330. There are three sets of top baffles 350, each corresponding to a sputtering target 380. The top baffles 350 are located above the sputtering targets 380. The vertical baffles 330 are positioned between two adjacent sets of top baffles 350 to separate each sputtering target 380. Each set of top baffles 350 includes two sector plates 351. Two adjacent sector plates 351 in two adjacent sets of top baffles 350 are rotatably connected relative to each other. In the initial state, all the top baffles 350 are circumferentially closed and perpendicular to the axis of the sputtering target 380 to shield the sputtering target 380.

[0050] The transmission assembly 360 is configured to control the two sector plates 351 of any set of top baffles 350 to open upwards and to both sides until they fit against the adjacent sector plates 351, thereby exposing the sputtering target 380. That is, when one of the top baffles 350 is opened, its two sector plates 351 respectively block the upper surface of one of the sector plates 351 of the two adjacent sets of top baffles 350. It needs to be explained that although the sputtering targets 380 are separated by the top baffle 350 and the vertical baffle 330, and the targets 310 do not contaminate each other, a large number of target 310 molecules will still adhere to the upper surface of the top baffle 350 during sputtering. Furthermore, each target 310 will adhere to the top baffle 350 during use, causing the target 310 molecules on the top baffle 350 to become mixed. After prolonged use, the target 310 molecules on the upper surface of the top baffle 350 accumulate and may be re-sputtered to the surface of the substrate 390 during sputtering, leading to plating defects. The film is not pure; the present invention separates the top baffle 350 corresponding to each sputtering target 380 into two fan-shaped plates 351. When in use, the two fan-shaped plates 351 open to both sides to shield the upper surface of adjacent fan-shaped plates 351, ensuring that the same side of the fan-shaped plate 351 will only sputter the same type of target material 310. Thus, when the same sputtering target 380 is used, the target material 310 on it is always sputtered on the same surface of the same fan-shaped plate 351. The surfaces of the fan-shaped plates 351 sputtered between different sputtering targets 380 do not overlap, preventing the coating layer from being contaminated by other target materials 310 and improving the coating quality.

[0051] In a further embodiment, the continuous magnetron sputtering coating apparatus of the present invention further includes a core cylinder 372, which is coaxially disposed inside the coating cylinder 320. Vertical baffles 330 are disposed on the outer peripheral wall of the core cylinder 372 and are evenly distributed along the circumferential direction of the core cylinder 372. A hinge shaft 334 is disposed at the top of the vertical baffles 330. Two adjacent sector plates 351 in two adjacent sets of top baffles 350 are rotatably connected to the hinge shaft 334. A torsion spring 375 is disposed between the two sector plates 351 and the hinge shaft 334. The initial torsion spring 375 causes all the top baffles 350 to be circumferentially closed.

[0052] A hinge 353 connects two adjacent sector plates 351 in two adjacent sets of top baffles 350 to make the connection between the two adjacent sets of top baffles 350 more reliable.

[0053] In a further embodiment, the transmission assembly 360 includes a rotating shaft 366 and a support member 365. The support member 365 is rotatably mounted on the top of the vertical baffle 330 and can push the two connected sector plates 351 from the bottom. The rotating shaft 366 is fixedly connected to the support member 365. The rotating shaft 366 passes through the side wall of the shaft cylinder 372 and its inner end extends into the interior of the shaft cylinder 372. The inner end of the rotating shaft 366 is coaxially connected to a gear 364. The side wall of the shaft cylinder 372 is provided with a through hole 377 for the rotating shaft 366 to pass through.

[0054] A rack 363 is installed inside the spindle 372. The rack 363 can rotate around the axis of the spindle 372 and slide up and down. In the initial state, the rack 363 is below the gear 364. When any sputtering target 380 is needed, opening any set of top baffles 350 causes the rack 363 to rotate until it aligns with the top baffle 350 that is blocking the sputtering target 380. Then, the rack 363 moves upward. During the upward movement of the rack 363, it drives the gears 364 on the two adjacent rotating shafts 366 to rotate, which in turn drives the support member 365 to rotate around the hinge axis 334. When the support member 365 rotates, it pushes the corresponding sector plate 351 to flip upward and open, exposing the sputtering target 380 to be used. The relevant program can then be started to begin coating the substrate 390. After a target 310 is coated (one target 310 is coated with one layer of film, and multiple targets 310 are coated in sequence to form a multi-layer film on the substrate surface), the rack 363 is moved downwards, and the top baffle 350, which was originally in the open state, is closed again and kept in the closed state under the action of the torsion spring 375. When it is necessary to replace the sputtering target 380, the rack 363 is rotated to the corresponding position.

[0055] Furthermore, the support member 365 includes an arc plate 3651 and a strut 3652. Two arc plates 3651 are provided, spaced radially apart along the shaft cylinder 372. The arc plates 3651 arch downwards. Two struts 3652 are provided and connected to both ends of the arc plates 3651 respectively. The arc plates 3651 are rotatably mounted on the top of the vertical baffle 330. The two struts 3652 are located below the corresponding sector plates 351. The rotating shaft 366 is fixedly mounted at the center of the inner arc plate 3651. Specifically, the top surface of the vertical baffle 330 has mounting grooves on both sides of the hinge shaft 334. The arc plates 3651 are rotatably mounted in the mounting grooves, and the two struts 3652 are located below the corresponding sector plates 351 and can push the sector plates 351 to rotate upwards.

[0056] Furthermore, to facilitate the installation of the rack 363, the interior of the shaft cylinder 372 is provided with a mounting post 367 that can slide up and down. The rack 363 is located at the top of the mounting post 367 and at the outer edge of the mounting post 367. The interior of the shaft cylinder 372 is provided with a first drive rod 362. The output end of the first drive rod 362 is connected to the mounting post 367. The first drive rod 362 is used to drive the mounting post 367 to move up and down along the shaft cylinder 372. The first drive rod 362 can be an electric push rod, or a hydraulic rod, pneumatic rod, or other drive element that can achieve linear motion.

[0057] Furthermore, a drive motor 361 is also provided inside the shaft cylinder 372. The output end of the drive motor 361 is connected to the first drive rod 362. The drive motor 361 is used to drive the mounting column 367 to rotate along the axis of the shaft cylinder 372, thereby driving the rack 363 to rotate.

[0058] In a further embodiment, a positioning cylinder 321 is provided on the inner wall of the coating cylinder 320. The positioning cylinder 321 is inclined and gradually approaches the axis of the coating cylinder 320 from bottom to top. The sputtering target 380 is disposed in the positioning cylinder 321 and can slide along the axis of the positioning cylinder 321. A support seat 370 is provided inside the coating cylinder 320. The support seat 370 is fixed relative to the coating cylinder 320. The shaft cylinder 372 is slidably inserted into the support seat 370. A compression spring 371 is provided between the shaft cylinder 372 and the support seat 370. In the initial state, the compression spring 371 has a tendency to move the shaft cylinder 372 downward. Specifically, a second drive rod 381 is provided inside the positioning cylinder 321. The output end of the second drive rod 381 is connected to the sputtering target 380. The second drive rod 381 is used to drive the sputtering target 380 to move along the axis of the positioning cylinder 321. The second drive rod 381 can be an electric push rod, or a hydraulic rod, pneumatic rod, or other drive element that can achieve linear motion.

[0059] It should be explained that different substrate materials 390 require different target-base spacing during coating. In this case, the sputtering target 380 can be controlled to slide along the positioning cylinder 321 to adjust the target-base spacing. For example, when it is necessary to reduce the target-base spacing, the sputtering target 380 is extended outward, and the sputtering target 380 pushes the top baffle 350, causing the axial cylinder 372 to move upward. That is, the axial cylinder 372 and the baffle assembly move upward as a whole, and stop after moving to the appropriate position. At this time, the axis of the sputtering target 380 still passes through the center of the lower surface of the substrate 390. When it is necessary to increase the target-base spacing, the sputtering target 380 is moved into the positioning cylinder 321 to the appropriate position, and the axial cylinder is reset downward under the action of the compression spring 371, thereby making the top baffle 350 fit with the target material 310 on the sputtering target 380. It should be further explained that the top baffle 350 in this invention forms a pyramid-like shape, and the axis of the sputtering target 380 is perpendicular to the top baffle 350, so that the target material 310 can be in close contact with the top baffle 350. On the one hand, this facilitates the sputtering target 380 to push the top baffle 350, and on the other hand, it ensures that the unused target material 310 will not absorb energy sputtering, and further ensures that the various targets 310 will not contaminate each other.

[0060] In other embodiments, the sputtering target 380 is fixedly disposed on the inner peripheral wall of the coating cylinder 320, and the sputtering target 380 is inclined and gradually approaches the axis of the coating cylinder 320 from bottom to top. In this embodiment, the target-substrate spacing is not adjustable, which is suitable for occasions where the target-substrate spacing does not need to be adjusted.

[0061] In a further embodiment, the substrate stage 340 can move up and down. For substrates 390 of different thicknesses, by setting the substrate stage 340 to move up and down, the lower surface of the substrate 390 can always be at the same baseline when different substrates 390 are installed, which makes it easier to adjust the position of the sputtering target 380 and thus easier to control the target-substrate spacing.

[0062] In a further embodiment, the substrate stage 340 is rotatable about its own axis, and the rotation of the substrate stage 340 during sputtering makes the coating more uniform.

[0063] Furthermore, the substrate stage 340 can vibrate, further improving the uniformity of the coating.

[0064] In a further embodiment, a suction cup is provided on the substrate stage 340, and the substrate 390 is mounted on the substrate stage 340 by means of the suction cup. In other embodiments, the substrate 390 can also be mounted on the substrate stage 340 by means of snap-fit, crimping or other methods.

[0065] In a further embodiment, refer to Figure 2The coating cylinder 320 has an observation window 325 on its outer peripheral wall, which connects to its interior, allowing observation of the coating process during operation. The top cover of the coating cylinder 320 is removable, and a substrate stage 340 is mounted on it for easy installation of the substrate 390. A negative pressure control pipe 327 is installed on the top cover for evacuating the interior of the coating cylinder 320. It is understood that the invention also includes structures for gas filling and magnetic control, which are similar to existing technologies and will not be described in detail here.

[0066] The above description is only a preferred embodiment of the present invention and is not intended to limit the present invention. Any modifications, equivalent substitutions, improvements, etc., made within the spirit and principles of the present invention should be included within the protection scope of the present invention.

Claims

1. A continuous magnetron sputtering coating apparatus, characterized in that, It includes a fuselage and a coating mechanism mounted on the fuselage. The coating mechanism includes a coating cylinder, a substrate stage, a sputtering target, a baffle assembly, and a transmission assembly. The substrate stage is coaxially positioned at the top inner part of the coating cylinder, and the substrate is mounted on the substrate stage; There are three sets of sputtering targets. The three sets of sputtering targets are set inside the coating cylinder and are evenly distributed along the circumference of the coating cylinder. The target material is installed on the sputtering target. The sputtering target is located below the substrate stage and its upper end is tilted and points towards the center of the coating cylinder. The baffle assembly includes a top baffle and vertical baffles. There are three sets of top baffles, each corresponding to a sputtering target. The top baffles are located above the sputtering targets. The vertical baffles are positioned between two adjacent sets of top baffles to separate the sputtering targets. Each set of top baffles includes two sector plates. The two adjacent sector plates in two sets of top baffles are rotatably connected relative to each other. Initially, all the top baffles are circular and perpendicular to the axis of the sputtering target. The transmission assembly is configured to control the two sector plates of any set of top baffles to open upwards and to both sides until they fit against the adjacent sector plates.

2. The continuous magnetron sputtering coating apparatus according to claim 1, characterized in that, The continuous magnetron sputtering coating apparatus also includes a core cylinder, which is coaxially disposed inside the coating cylinder. Vertical baffles are disposed on the outer peripheral wall of the core cylinder and are evenly distributed along the circumferential direction of the core cylinder. A hinge shaft is provided at the top of the vertical baffle. Two adjacent sector plates in two adjacent sets of top baffles are rotatably connected to the hinge shaft, and a torsion spring is provided between the two sector plates and the hinge shaft. The initial torsion spring causes all the top baffles to close circumferentially.

3. The continuous magnetron sputtering coating apparatus according to claim 2, characterized in that, Hinges connect two adjacent sector plates in two adjacent sets of top baffles.

4. The continuous magnetron sputtering coating apparatus according to claim 2, characterized in that, The transmission assembly includes a rotating shaft and a support member. The support member is rotatably mounted on the top of the vertical baffle and can push the two connected sector plates from the bottom. The rotating shaft is fixedly connected to the support. The rotating shaft passes through the side wall of the shaft cylinder and its inner end extends into the inside of the shaft cylinder. A gear is coaxially connected to the inner end of the rotating shaft. A rack is provided inside the shaft cylinder. The rack can rotate around the axis of the shaft cylinder and can slide up and down. In the initial state, the rack is below the gear.

5. The continuous magnetron sputtering coating apparatus according to claim 4, characterized in that, The support includes an arc plate and struts. There are two arc plates, which are arranged radially at intervals along the central cylinder. The arc plates arch downwards. There are two struts, which are respectively connected to the two ends of the arc plates. The arc plates are rotatably mounted on the top of the vertical baffle. The two struts are located below the corresponding sector plates.

6. The continuous magnetron sputtering coating apparatus according to claim 4, characterized in that, The shaft cylinder has an internal mounting post that can slide up and down, and a rack is located at the top of the mounting post and on the outer edge of the mounting post; the shaft cylinder also has an internal first drive rod, which is used to drive the mounting post to move up and down along the shaft cylinder.

7. The continuous magnetron sputtering coating apparatus according to claim 5, characterized in that, The shaft cylinder is also equipped with a drive motor. The output end of the drive motor is connected to the first drive rod. The drive motor is used to drive the mounting column to rotate along the axis of the shaft cylinder.

8. The continuous magnetron sputtering coating apparatus according to claim 2, characterized in that, A positioning cylinder is provided on the inner wall of the coating cylinder. The positioning cylinder is inclined and gradually approaches the axis of the coating cylinder from bottom to top. The sputtering target is placed in the positioning cylinder and can slide along the axis of the positioning cylinder. A support base is provided inside the coating cylinder. The support base is fixed relative to the coating cylinder. The spindle is slidably inserted into the support base. A compression spring is provided between the spindle and the support base. In the initial state, the compression spring has a tendency to move the spindle downward.

9. The continuous magnetron sputtering coating apparatus according to claim 1, characterized in that, The substrate stage can move up and down.

10. The continuous magnetron sputtering coating apparatus according to claim 1, characterized in that, The substrate stage can rotate around its own axis.

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