A power semiconductor package lead bonding apparatus

Abstract

The application relates to the technical field of power semiconductor packaging, in particular to a lead welding device for power semiconductor packaging, which comprises a workbench, an ultrasonic aluminum wire pressure welding machine, guide rails and placing blocks and the like, the workbench has four supporting legs at the bottom, the workbench is connected with the ultrasonic aluminum wire pressure welding machine, the top of the workbench is connected with the guide rails, two placing blocks are slidably arranged on the guide rails, and placing grooves for placing power semiconductors are formed in the top of the placing blocks. The two push blocks are moved towards each other, the two clamping plates are driven to move towards each other, the power semiconductor is clamped by the two clamping plates, the power semiconductor is fixed, the ultrasonic aluminum wire pressure welding machine can perform lead welding on the power semiconductor, the two clamping plates are moved away from each other by pulling the bolt upwards, the power semiconductor after welding is released, the power semiconductor is clamped and released without screwing, the operation is more convenient, and the working efficiency is higher.

Description

Technical Field

[0001] This invention relates to the field of power semiconductor packaging technology, and in particular to a wire bonding apparatus for power semiconductor packaging. Background Technology

[0002] During the production process, power semiconductors need to be packaged to isolate them from the outside world and prevent external impurities from corroding them. Wire bonding is a key step in power semiconductor packaging technology, serving as a bridge connecting the power semiconductor to external circuits.

[0003] Currently, ultrasonic aluminum wire bonding machines are generally used to bond the leads of power semiconductors. The power semiconductor is fixed on the table and then bonded. The power semiconductor is fixed by two clamps, which are connected to the table by screws. Before bonding, the screws need to be tightened with a wrench to fix the power semiconductor. After bonding, the screws need to be loosened with a wrench to release the power semiconductor. The operation is relatively troublesome and affects work efficiency. Summary of the Invention

[0004] To overcome the drawbacks of needing to use a wrench to tighten screws before and after soldering, which is cumbersome and affects work efficiency, this invention provides a more efficient wire bonding device for power semiconductor packaging.

[0005] The technical solution is: a wire bonding device for power semiconductor packaging, comprising a worktable, an ultrasonic aluminum wire bonding machine, a guide rail, placement blocks, a sliding plate, an elastic element one, a clamping plate, an elastic element two, a screw, a pressure plate, a push block, and a fixing assembly. The worktable has four legs at its bottom. The ultrasonic aluminum wire bonding machine is connected to the worktable. A guide rail is connected to the top of the worktable, and two placement blocks are slidably mounted on the guide rail. Each placement block has a placement groove on its top for placing power semiconductors. Sliding plates are slidably mounted on both sides inside the placement groove. Each placement block has an opening for the sliding plates to move. An elastic element 1 connects the inner walls of the slot, and the slide plate is reset by the elastic element 1. Both slide plates in the same slot are slidably equipped with clamping plates for clamping power semiconductors. An elastic element 2 connects the clamping plates and the slide plates, and the clamping plates are reset by the elastic element 2. Both clamping plates are threaded with two screws at the top. The lower ends of the two screws on the same clamping plate are rotatably connected to a pressure plate for pressing the power semiconductors. Both slide plates in the same slot are slidably equipped with push blocks, which are used to push the clamping plates upward so that the pressure plate moves upward. A fixing component is used to fix the slide plates.

[0006] Furthermore, it is particularly preferred that the fixing component includes a pin, with pins connected to each clamp plate, the pins sliding through the slide plate, and each placement block having a through opening at the top for the pins to move, with evenly spaced insertion holes at the bottom of each opening, the pins being inserted into the insertion holes to fix the slide plate.

[0007] Furthermore, it is particularly preferred that the device also includes a release mechanism, which includes mounting blocks and wedge rods. Mounting blocks are connected to both sides of the top of the worktable, and wedge rods are connected to the mounting blocks. During the movement, the pin will contact the wedge rods, and under the action of the wedge rods, the pin will move upward and be removed from the insertion hole.

[0008] Furthermore, it is particularly preferred that the device also includes a lifting mechanism, which includes a top block, an elastic element, and a contact rod. The bottom of each placement slot is provided with a top block in a sliding manner. An elastic element connects the top block and the placement block. The top block is reset by the elastic element. Each mounting block is connected to a contact rod. The top block will contact the contact rod during movement. Under the action of the contact rod, the top block moves upward to lift the soldered power semiconductor.

[0009] Furthermore, it is particularly preferred that the bottom of each top block is provided with an inclined surface, and when the top block moves, the inclined surface on the top block contacts the contact rod so that the top block can move upward.

[0010] Furthermore, it is particularly preferred that both placement blocks have receiving grooves for accommodating the contact rod.

[0011] Furthermore, it is particularly preferred that the device also includes a moving mechanism, which includes a lead screw motor and a moving block. The lead screw motor is connected to the worktable, and the moving blocks are connected to the placement blocks. The moving blocks are threadedly connected to the lead screw motor.

[0012] Furthermore, it is particularly preferred that a protective mechanism is also included, which includes a shield and a folding plate. A shield for shielding the lead screw motor is connected between the two placement blocks, and folding plates for shielding the lead screw motor are connected to both sides inside the guide rail. The folding plates are connected to the placement blocks.

[0013] Furthermore, it is particularly preferred that the device also includes a storage mechanism, which includes storage boxes and drawers. Multiple storage boxes are slidably provided on the worktable, and each storage box is slidably provided with multiple drawers for storing the soldered power semiconductors.

[0014] In addition, it is particularly preferred that the worktable also includes a foot support mechanism, which includes a lifting rod and a pad. The lower ends of the four legs of the worktable are all threaded with lifting rods, and the lower ends of the lifting rods are all connected to pads.

[0015] The present invention has the following advantages: 1. By moving the two push blocks toward each other, the present invention can drive the two clamping plates to move toward each other, so that the two clamping plates clamp the power semiconductor and fix the power semiconductor. The ultrasonic aluminum wire welding machine can perform lead welding on the power semiconductor. By pulling the pin upward, the two clamping plates can be moved away from each other, and the welded power semiconductor can be released. The clamping and releasing of the power semiconductor does not require screws, making the operation more convenient and the work efficiency higher.

[0016] 2. After the power semiconductor welding is completed, move the right-side placement block away from directly under the ultrasonic aluminum wire welding machine, and move the left-side placement block to directly under the ultrasonic aluminum wire welding machine. The two stations are switched alternately, which can continuously perform welding, thereby improving work efficiency.

[0017] 3. When the placement block moves to the right, it will drive the pin to move to the right. Under the action of the wedge rod, the pin will move upward and move out of the socket, automatically releasing the soldered power semiconductor, thereby improving work efficiency.

[0018] 4. When the placement block moves to the right, it will drive the top block to move to the right. Under the action of the contact rod, the top block moves upward to lift the soldered power semiconductor, making it easy to pick up. The soldered power semiconductor can be placed in the drawer for storage, making it convenient for subsequent collection.

[0019] 5. The lead screw motor can drive the placement block to move to the right and left without the need for manual operation by the staff, making it more convenient to use. The shield and folding plate can cover the lead screw motor to prevent impurities from falling onto the lead screw motor and causing the moving block to get stuck.

[0020] 6. The position of the pad can be adjusted so that the pad contacts the ground, supporting the workbench and preventing it from shaking. Attached Figure Description

[0021] Figure 1 This is a three-dimensional structural diagram of the present invention.

[0022] Figure 2 This is a cross-sectional view of the block in this invention.

[0023] Figure 3 This is a cross-sectional view of the skateboard of the present invention.

[0024] Figure 4 This is a three-dimensional structural diagram of the fixing component of the present invention.

[0025] Figure 5 This is a three-dimensional structural diagram of the release mechanism of the present invention.

[0026] Figure 6 This is a three-dimensional structural diagram of the wedge-shaped rod of the present invention.

[0027] Figure 7 This is a three-dimensional structural diagram of the lifting mechanism of the present invention.

[0028] Figure 8 This is a three-dimensional structural diagram of the elastic element three of the present invention.

[0029] Figure 9 This is a three-dimensional structural diagram of the receiving groove of the present invention.

[0030] Figure 10 This is a three-dimensional structural diagram of the moving mechanism of the present invention.

[0031] Figure 11 This is a three-dimensional structural diagram of the protection mechanism of the present invention.

[0032] Figure 12 This is a three-dimensional structural diagram of the storage mechanism of the present invention.

[0033] Figure 13 This is a three-dimensional structural diagram of the foot pad mechanism of the present invention.

[0034] The following are the labels in the diagram: 1. Workbench, 2. Ultrasonic aluminum wire welding machine, 3. Guide rail, 4. Placement block, 5. Slide plate, 6. Elastic component one, 7. Clamping plate, 8. Elastic component two, 9. Screw, 10. Pressure plate, 11. Push block, 121. Pin, 122. Insertion hole, 131. Mounting block, 132. Wedge rod, 141. Top block, 142. Elastic component three, 143. Contact rod, 151. Screw motor, 152. Moving block, 161. Baffle plate, 162. Folding plate, 171. Storage box, 172. Drawer, 181. Lifting rod, 182. Pad block. Detailed Implementation

[0035] The present invention will be further described below with reference to the embodiments shown in the accompanying drawings.

[0036] Example 1: As Figures 1-4As shown, a wire bonding device for power semiconductor packaging includes a worktable 1, an ultrasonic aluminum wire bonding machine 2, a guide rail 3, placement blocks 4, sliding plates 5, elastic element 1 6, clamping plate 7, elastic element 2 8, screw 9, pressure plate 10, push block 11, and fixing components. The worktable 1 has four legs at its bottom. The ultrasonic aluminum wire bonding machine 2 is bolted to the center of the rear side of the worktable 1. The guide rail 3 is connected to the center of the top of the worktable 1. Two placement blocks 4 are slidably mounted on the guide rail 3. Each placement block 4 has a placement groove on its top for placing power semiconductors. Sliding plates 5 are slidably mounted on the left and right sides of each placement groove. Each of the two slide plates 4 has an opening on its front side for the slide plate 5 to move. Two elastic elements 6, which are springs, are connected between the slide plate 5 and the inner wall of the placement slot. On the side of the two slide plates 5 in the same placement slot that are close to each other, a clamping plate 7 is slidably provided. Two elastic elements 8, which are springs, are connected between the clamping plate 7 and the slide plate 5. The top front and rear sides of the clamping plate 7 are threaded with screws 9. The lower ends of the two screws 9 on the same clamping plate 7 are rotatably connected to a pressure plate 10. On the side of the two slide plates 5 in the same placement slot that are far apart from each other, a push block 11 is slidably provided. The fixing component is used to fix the slide plate 5.

[0037] like Figures 2-4 As shown, the fixing component includes a pin 121. The front of the clamping plate 7 is connected to the pin 121. The pin 121 slides through the sliding plate 5. The top front side of the placement block 4 has a through-hole for the pin 121 to move. The bottom of the opening is evenly spaced with insertion holes 122. The pin 121 is inserted into the insertion holes 122.

[0038] The operator rotates screw 9 downwards, causing pressure plate 10 to move downwards. Rotating screw 9 upwards also causes pressure plate 10 to move upwards. The height of pressure plate 10 can be adjusted according to the thickness of the power semiconductor to accommodate semiconductors of different thicknesses. The power semiconductor is then placed into the placement slot. Two push blocks 11 within the same placement slot are then pushed towards each other, causing clamping plate 7 to move upwards. Elastic element 2 8 is compressed, and clamping plate 7 causes pin 121 to move upwards. Pin 121 moves out of insertion hole 122, releasing slide plate 5. At this point, two slide plates 5 within the same placement slot move towards each other, causing two clamping plates 7 to move towards each other, clamping the power semiconductor. The operator then pinches the two slide plates 5 to prevent them from returning to their original position, and then releases push blocks 11. Under the action of elastic element 2 8, clamping plate 7 and pressure plate 1... The plate 10 moves downward, pressing down on the power semiconductor and fixing it in place. The pin 121 also moves downward and inserts into the socket 122, fixing the slide plate 5. Then, the ultrasonic aluminum wire welding machine 2 is started to weld the leads of the power semiconductor. After welding is completed, the placement block 4 is pushed to the right, moving the right placement block 4 away from directly below the ultrasonic aluminum wire welding machine 2, and the left placement block 4 is moved to directly below the ultrasonic aluminum wire welding machine 2. The two stations are switched alternately, allowing for continuous welding and improving work efficiency. The pin 121 is pulled upward, moving it out of the socket 122 and releasing the slide plate 5. Under the action of the elastic element 6, the two slide plates 5 move away from each other, causing the two clamping plates 7 to move away from each other, releasing the welded power semiconductor. Clamping and releasing the power semiconductor does not require screws, making the operation more convenient and the work efficiency higher.

[0039] Example 2: Based on Example 1, such as Figure 5 and Figure 6 As shown, it also includes a release mechanism, which includes a mounting block 131 and a wedge rod 132. The left and right sides of the front top of the worktable 1 are bolted to the mounting block 131, and the wedge rod 132 is bolted to the side of the two mounting blocks 131 that are close to each other.

[0040] like Figures 7-9As shown, it also includes a lifting mechanism, which includes a top block 141, an elastic element 142, and a contact rod 143. The bottom of each placement slot is slidably provided with a top block 141. Two elastic elements 142 are connected between the bottom of the top block 141 and the placement block 4. The elastic elements 142 are springs. The sides of the two mounting blocks 131 that are close to each other are connected with contact rods 143. The sides of the two placement blocks 4 that are far apart from each other are provided with receiving slots for accommodating contact rods 143. The front side of the bottom of the top block 141 is provided with an inclined surface. When the top block 141 moves, the inclined surface on the top block 141 contacts the contact rod 143 so that the top block 141 can move upward.

[0041] When the placement block 4 moves to the right, it will cause the pin 121 and the top block 141 to move to the right. When the pin 121 moves to the right and contacts the wedge rod 132, under the action of the wedge rod 132, the pin 121 moves upward and moves out of the insertion hole 122, releasing the slide plate 5. The slide plate 5 resets and automatically releases the soldered power semiconductor, thereby improving work efficiency. Then, the inclined surface on the top block 141 contacts the contact rod 143, and the top block 141 continues to move to the right. Under the action of the contact rod 143, the top block 141 moves upward and lifts the soldered power semiconductor for easy removal. (Elastic element 14) 2. When the placement block 4 moves to the left, the top block 141 and the contact rod 143 do not contact each other. Under the action of the elastic element 3 142, the top block 141 moves downward, and the pin 121 and the wedge rod 132 do not contact each other. Under the action of the elastic element 2 8, the pin 121 moves downward. Similarly, when the placement block 4 on the left moves to the left, the pin 121 on the left will contact the wedge rod 132 on the left, and the top block 141 on the left will contact the contact rod 143 on the left. When the placement block 4 on the left moves to the right, the top block 141 on the left and the contact rod 143 on the left do not contact each other, and the pin 121 on the left and the wedge rod 132 on the left do not contact each other.

[0042] like Figure 10 As shown, it also includes a moving mechanism, which includes a lead screw motor 151 and a moving block 152. The lead screw motor 151 is connected to the top center of the worktable 1, and the moving blocks 152 are connected to the bottom of the placement blocks 4. Both moving blocks 152 are threadedly connected to the lead screw motor 151.

[0043] like Figure 11 As shown, it also includes a protective mechanism, which includes a baffle plate 161 and a folding plate 162. The baffle plate 161 is connected between the two placement blocks 4. The folding plates 162 are connected to both the left and right sides of the guide rail 3. The two folding plates 162 are respectively connected to the two placement blocks 4.

[0044] The lead screw motor 151 can drive the moving block 152 to move to the right or to the left. The moving block 152 can drive the placement block 4 to move to the right and to the left. No manual operation is required, making it more convenient to use. The shielding plate 161 and the folding plate 162 can cover the lead screw motor 151 to prevent impurities from falling onto the lead screw motor 151 and causing the moving block 152 to get stuck. When the placement block 4 moves to the right, the left folding plate 162 unfolds and the right folding plate 162 folds. When the placement block 4 moves to the left, the left folding plate 162 folds and the right folding plate 162 unfolds, without affecting the movement of the placement block 4.

[0045] like Figure 12 As shown, it also includes a storage mechanism, which includes a storage box 171 and drawers 172. The storage box 171 is slidably provided on both the left and right sides of the rear top of the workbench 1. The storage box 171 can be removed from the workbench 1 for replacement with a new storage box 171. Multiple drawers 172 are slidably provided at even intervals on the front side of the storage box 171. The soldered power semiconductors can be placed into the drawers 172 for storage, which is convenient for subsequent collection.

[0046] like Figure 13 As shown, it also includes a foot support mechanism, which includes a lifting rod 181 and a pad 182. The lower ends of the four legs of the workbench 1 are all threaded with lifting rods 181, and the lower ends of the lifting rods 181 are all connected to pads 182.

[0047] After the workbench 1 is placed on the ground, if any pad 182 is not in contact with the ground, the worker can rotate the pad 182 downwards to make it contact the ground, thus supporting the workbench 1 and preventing it from shaking.

[0048] Finally, it should be noted that the above description is only a preferred embodiment of the present invention and is not intended to limit the present invention. Although the present invention has been described in detail with reference to the foregoing embodiments, those skilled in the art can still modify the technical solutions described in the foregoing embodiments or make equivalent substitutions for some of the technical features. Any modifications, equivalent substitutions, improvements, etc., made within the spirit and principles of the present invention should be included within the protection scope of the present invention.

Claims

1. A wire bonding apparatus for power semiconductor packaging, comprising a worktable (1) and an ultrasonic aluminum wire bonding machine (2), wherein the worktable (1) has four legs at its bottom and the ultrasonic aluminum wire bonding machine (2) is connected to the worktable (1), characterized in that, It also includes a guide rail (3), a placement block (4), a slide plate (5), an elastic element one (6), a clamping plate (7), an elastic element two (8), a screw (9), a pressure plate (10), a push block (11), and a fixing assembly. The top of the worktable (1) is connected to the guide rail (3). Two placement blocks (4) are slidably provided on the guide rail (3). The top of each placement block (4) has a placement slot for placing power semiconductors. Slide plates (5) are slidably provided on both sides inside the placement slot. Each placement block (4) has an opening for the slide plate (5) to move. An elastic element one (6) is connected between the slide plate (5) and the inner wall of the placement slot. The slide plate (5) is reset by the elastic element one (6). Both slide plates (5) in the slot are slidably provided with clamping plates (7) for clamping power semiconductors. An elastic element (8) is connected between the clamping plate (7) and the slide plate (5). The clamping plate (7) is reset by the elastic element (8). The top of the clamping plate (7) is provided with two screws (9). The lower ends of the two screws (9) on the same clamping plate (7) are rotatably connected to a pressure plate (10) for pressing the power semiconductor. Both slide plates (5) in the same slot are slidably provided with push blocks (11). The push blocks (11) are used to push the clamping plate (7) to move upward so that the pressure plate (10) moves upward. The fixing component is used to fix the slide plate (5). It also includes a lifting mechanism, which includes a top block (141), an elastic element three (142) and a contact rod (143). The bottom of the placement slot is provided with a top block (141) in a sliding manner. The top block (141) and the placement block (4) are connected by an elastic element three (142). The top block (141) is reset by the elastic element three (142). The mounting block (131) is connected to a contact rod (143). The top block (141) will contact the contact rod (143) during the movement. Under the action of the contact rod (143), the top block (141) moves upward to lift the welded power semiconductor. The bottom of the top block (141) is provided with an inclined surface. When the top block (141) moves, the inclined surface on the top block (141) contacts the contact rod (143) so that the top block (141) can move upward. Both placement blocks (4) have receiving slots for accommodating the contact rod (143).

2. The wire bonding apparatus for power semiconductor packaging according to claim 1, characterized in that, The fixing components include a pin (121), and pins (121) are connected to the clamps (7). The pins (121) slide through the slide plate (5). The top of the placement block (4) has a through hole for the pins (121) to move. The bottom of the opening has evenly spaced holes (122). The pins (121) are inserted into the holes (122) to fix the slide plate (5).

3. The wire bonding apparatus for power semiconductor packaging according to claim 2, characterized in that, It also includes a release mechanism, which includes a mounting block (131) and a wedge rod (132). Mounting blocks (131) are connected to both sides of the top of the worktable (1), and wedge rods (132) are connected to the mounting blocks (131). The pin (121) will contact the wedge rod (132) during the movement. Under the action of the wedge rod (132), the pin (121) moves upward and moves out of the insertion hole (122).

4. The wire bonding apparatus for power semiconductor packaging according to claim 3, characterized in that, It also includes a moving mechanism, which includes a lead screw motor (151) and a moving block (152). The lead screw motor (151) is connected to the worktable (1), and the moving block (152) is connected to each of the placement blocks (4). The moving block (152) is threadedly connected to the lead screw motor (151).

5. The wire bonding apparatus for power semiconductor packaging according to claim 4, characterized in that, It also includes a protective mechanism, which includes a shield (161) and a folding plate (162). The shield (161) for covering the lead screw motor (151) is connected between the two placement blocks (4). The folding plates (162) for covering the lead screw motor (151) are connected to both sides of the inside of the guide rail (3). The folding plates (162) are connected to the placement blocks (4).

6. The wire bonding apparatus for power semiconductor packaging according to claim 5, characterized in that, It also includes a storage mechanism, which includes a storage box (171) and a drawer (172). Multiple storage boxes (171) are slidably provided on the workbench (1), and multiple drawers (172) for storing the soldered power semiconductors are slidably provided on each storage box (171).

7. The wire bonding apparatus for power semiconductor packaging according to claim 6, characterized in that, It also includes a foot support mechanism, which includes a lifting rod (181) and a pad (182). The lower ends of the four legs of the worktable (1) are threaded with lifting rods (181), and the lower ends of the lifting rods (181) are connected to pads (182).

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