Segmented debinding sintering method and parts

Abstract

The present invention provides a segmented degreasing and sintering method, the steps of which include: making a green blank, wherein the green blank is formed into a porous structure; performing a first degreasing on the green blank; injecting a filling slurry into the porous structure of the green blank, and curing the filling slurry; and performing a second degreasing. By making the parts porous and the porous structure formed by the porous design, not only the degreasing thickness of the parts is significantly reduced, but the porous structure can also become a macroscopic channel for the discharge of pyrolysis gases, which is beneficial for suppressing the generation of cracks. In addition, through the segmented process route of primary degreasing-slurrying-secondary degreasing, the degreasing and sintering of large-section ceramic or metal parts can be achieved, effectively breaking through the limitation of the degreasing wall thickness of ceramic or metal parts.

Description

Technical Field

[0001] The present invention relates to the technical field of 3D printing, and in particular to a segmented degreasing and sintering method. Background Art

[0002] Forming technologies, represented by photo-curing 3D printing, offer both precision and cost advantages and have been widely developed and applied in the manufacture of thin-walled, macroporous ceramics, metals, and their composite parts across a wide range of fields, including photonic crystals, castings, industrial filtration, and medical devices. Degreasing, the removal of organic matter such as resin from ceramic / metal blanks, is a critical step in producing high-performance ceramics / metals. The decomposition of organic matter during this process generates large amounts of gas that must be expelled from the part, potentially causing deformation, cracking, and even failure. Therefore, suppressing crack defects during the degreasing process is a common challenge in the manufacture of ceramic / metal parts.

[0003] In view of this, it is necessary to provide a new segmented debinding sintering method to solve or at least alleviate the above technical defects. Summary of the Invention

[0004] The main purpose of the present invention is to provide a segmented degreasing and sintering method, which aims to solve the technical problem in the prior art that gas generated during the existing degreasing process easily causes part defects.

[0005] To achieve the above object, according to one aspect of the present invention, the present invention provides a segmented debinding and sintering method, the segmented debinding and sintering method comprising the following steps:

[0006] preparing a green blank, wherein the green blank is formed into a porous structure;

[0007] Degreasing the green blank for the first time;

[0008] injecting a filling slurry into the porous structure of the green blank and curing the filling slurry;

[0009] Perform a second degreasing.

[0010] In some embodiments, the step of preparing a green blank and forming the green blank into a porous structure comprises:

[0011] The porous structure is designed based on the degreasing limit thickness and fluid flow parameters to obtain a porous structure model with the same shape as the target part;

[0012] According to the porous structure model, the green blank is obtained by 3D printing.

[0013] In some embodiments, the porous structure includes a plurality of blind holes, and the steps of preparing the green blank and forming the green blank into the porous structure include:

[0014] A plurality of blind holes are made in the blank, and only one end of each blind hole is connected to the outside.

[0015] In some embodiments, the plurality of blind holes include a plurality of first blind holes and a second blind hole that are interconnected, and the step of forming the plurality of blind holes in the blank includes:

[0016] A plurality of first blind holes and second blind holes that are interconnected are made in the blank.

[0017] In some embodiments, the step of preparing a green blank and forming the green blank into a porous structure comprises:

[0018] A green blank slurry is prepared by mixing a first resin-type organic matter with metal or ceramic, and the green blank slurry is used to produce a green blank through a light-curing 3D printing technology, and the green blank is formed into a porous structure.

[0019] In some embodiments, the step of injecting a filling slurry into the porous structure of the green blank and then performing a curing treatment comprises:

[0020] A filling slurry is prepared by mixing a second organic matter of resin with metal or ceramic, and the filling slurry is injected into the porous structure of the green body, followed by a curing treatment; wherein the first organic matter and the second organic matter have different compositions.

[0021] In some embodiments, the step of performing a first degreasing on the green blank comprises:

[0022] According to the DSC pyrolysis curve of the green body slurry, the green body is subjected to a first degreasing process in a protective gas or vacuum environment to remove organic matter in the green body; wherein a microporous structure is formed in the green body at the location where the organic matter is removed.

[0023] In some embodiments, the step of performing a second degreasing step comprises:

[0024] According to the DSC thermal decomposition curve of the slurry injected into the porous structure, a second degreasing is performed to remove organic matter in the filling slurry.

[0025] In some embodiments, the steps after performing the second degreasing include:

[0026] The green blank after the second debinding is sintered.

[0027] According to another aspect of the present invention, the present invention further provides a part, which is made by the above-mentioned segmented debinding and sintering method.

[0028] In the above scheme, the segmented degreasing and sintering method of the present invention includes the following steps: making a green blank, wherein the green blank is formed into a porous structure; performing a first degreasing on the green blank; injecting a filling slurry into the porous structure of the green blank, and curing the filling slurry; and performing a second degreasing. By making the parts porous, not only can the difficulty of forming the parts be reduced, especially for bottom-up photocuring forming technology, the separation force can be effectively reduced, and the porous structure formed by the porous design not only significantly reduces the degreasing thickness of the parts, but the porous structure can also become a macroscopic channel for the discharge of pyrolysis gases, which is beneficial to suppress the generation of cracks. Through the segmented process route of primary degreasing-grouting-secondary degreasing, the degreasing and sintering of large-section ceramic or metal parts can be realized, effectively breaking through the limitation of the degreasing wall thickness of ceramic or metal parts. BRIEF DESCRIPTION OF THE DRAWINGS

[0029] In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the following briefly introduces the drawings required for use in the embodiments or the description of the prior art. Obviously, the drawings described below are only some embodiments of the present invention. For ordinary technicians in this field, other drawings can be obtained based on the structures shown in these drawings without paying any creative work.

[0030] Figure 1 Schematic diagram of the process of the segmented debinding and sintering method according to the first embodiment of the present invention;

[0031] Figure 2 Schematic diagram of the process of the segmented debinding and sintering method according to the second embodiment of the present invention;

[0032] Figure 3 Schematic diagram of the process of the segmented degreasing and sintering method according to the third embodiment of the present invention;

[0033] Figure 4 Schematic diagram of the process of the segmented degreasing and sintering method according to the fourth embodiment of the present invention;

[0034] Figure 5 Schematic diagram of structural changes during the manufacturing process of the segmented degreasing and sintering method according to an embodiment of the present invention.

[0035] Description of Figure Numbers:

[0036] 1. Blank; 2. Blind hole; 4. Part; 5. Hole position; 6. Filling slurry.

[0037] The realization of the objectives, functional features and advantages of the present invention will be further explained in conjunction with the embodiments and with reference to the accompanying drawings. DETAILED DESCRIPTION

[0038] The following will clearly and completely describe the technical solutions in the embodiments of the present invention in conjunction with the accompanying drawings. Obviously, the described embodiments are only part of the embodiments of the present invention, not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without making any creative efforts are within the scope of protection of the present invention.

[0039] It should be noted that all directional indications (such as up, down, etc.) in the embodiments of the present invention are only used to explain the relative position relationship, movement status, etc. between the various components under a certain specific posture (as shown in the accompanying drawings). If the specific posture changes, the directional indication will also change accordingly.

[0040] In addition, the terms "first," "second," and so on, used in this disclosure are for descriptive purposes only and should not be construed as indicating or implying relative importance or implicitly specifying the number of technical features indicated. Therefore, features specified as "first" or "second" may explicitly or implicitly include at least one of these features.

[0041] Moreover, the technical solutions between the various embodiments of the present invention may be combined with each other, but this must be based on the fact that ordinary technicians in this field can implement them. When the combination of technical solutions is mutually contradictory or cannot be implemented, it should be deemed that such a combination of technical solutions does not exist and is not within the scope of protection required by the present invention.

[0042] At present, the photocuring 3D printing technology is the representative molding technology with the advantages of both precision and cost, and has been widely developed and applied in many fields. After photocuring 3D printing molding, degreasing treatment is required. Degreasing is to remove organic matter such as resin in the ceramic / metal blank. During the decomposition of organic matter, carbon dioxide or other gases will be produced. These gases need to be discharged from the manufactured parts. If a large amount of gas is discharged in a short time, it is easy to cause the parts to deform, crack or even be scrapped. In the related technology, there are methods such as regulating the degreasing rate, changing the degreasing atmosphere and adding non-reactive components to effectively reduce the thermal deformation and internal stress during the degreasing process of the blank, thereby effectively avoiding the cracking defects of the sintered parts. However, for ceramic / metal parts with larger or thicker cross-sections, since more gas will be produced during the degreasing process and it is not easy to be discharged in time, there is currently no efficient and low-defect degreasing method.

[0043] Reference Figure 1 , Figure 1 The figure is a flow chart of the first embodiment of the present invention. According to one aspect of the present invention, the present invention provides a segmented debinding and sintering method, which includes the following steps:

[0044] S100, preparing a green blank 1, wherein the green blank 1 is formed into a porous structure;

[0045] The blank 1 produced here has a roughly identical appearance and structure to the target part 4 to be manufactured. However, unlike conventional blanks 1, which are designed only with the holes required for the target part 4, the porous structure in this embodiment does not encompass all of the final target part 4. The porous structure is the multiple pores within the blank 1. This porous structure is designed to provide a vent for gases released from organic matter during the subsequent first degreasing process, allowing them to escape smoothly from the blank 1 and reducing the risk of defects such as cracks. Specifically, the pore size of the porous structure ranges from 500 mm to 3000 mm.

[0046] Specifically, refer to Figure 2 , Figure 2 This is a schematic flow chart of the segmented debinding and sintering method according to the second embodiment of the present invention. Step S100 includes:

[0047] S101 , a green blank slurry is prepared by mixing a first organic resin with metal or ceramic, and the green blank 1 is manufactured by using the green blank slurry through a light-curing 3D printing technology, so that the green blank 1 has a porous structure.

[0048] A green blank 1 is produced by one-step molding through photocuring 3D printing of a slurry comprising a first resin-based organic material and a metal, or a first resin-based organic material and a mixture of a metal and a ceramic, thereby forming a green blank 1 having a porous structure. Specifically, the green blank slurry can be a SiO2 ceramic slurry having a solid phase content of 50 vol% and photocuring properties. The first organic material specifically comprises: 1,6-hexanediol diacrylate and trimethylolpropane triacrylate (both in a 1:1 volume ratio of the photosensitive resin). The green blank slurry also includes silica powder (accounting for 50% of the total slurry by volume), phenylbis(2,4,6-trimethylbenzoyl)phosphine oxide (a photoinitiator, accounting for 1.5% of the weight of the two photosensitive resins), and Digo 685 (a dispersant, accounting for 0.75% of the weight of the ceramic powder).

[0049] S200, performing the first degreasing on the green body 1;

[0050] The first degreasing process is to remove at least part of the organic matter in the green blank 1. Due to the presence of the porous structure, the gas generated by the decomposition of the organic matter can be quickly discharged from the green blank 1 through the porous structure, reducing the risk of cracks.

[0051] Specifically, the steps of S200 include:

[0052] S201, based on the DSC pyrolysis curve of the green blank slurry, the green blank 1 is subjected to a first degreasing in a protective gas or vacuum environment to remove organic matter in the green blank 1; wherein, at the location where the organic matter is removed, a microporous structure is formed on the green blank 1 body. Specifically, the first organic matter is removed during the first degreasing, and under normal circumstances, all of the first organic matter is removed. The DSC (Differential scanning calorimetry) curve is a curve of heat exchange between a material and the surrounding environment, usually expressed in terms of power or heat flow. The formed microporous structure can provide an exhaust channel during the second degreasing, accelerate the discharge of gas, effectively inhibit the generation of cracks, and reduce the risk of cracks during the second degreasing. Specifically, the protective gas can be nitrogen, argon, or other gases.

[0053] S300, injecting a filling slurry 6 into the porous structure of the green body 1, and curing the filling slurry 6;

[0054] Since the final target part 4 does not have a porous structure, after the first degreasing is completed, a filling slurry 6 is injected into the porous structure and then cured. The filling slurry 6 fills the position of the original porous structure, ensuring that the final part 4 has the same appearance as the target part 4 and does not have a porous structure. The injected filling slurry 6 has controllable curing characteristics. The curing process can be heating reaction curing, catalyst reaction curing, radiation excitation curing, etc.

[0055] Specifically, the steps of S300 include:

[0056] S301, a filling slurry 6 is prepared by mixing a second organic matter of a resin type with a metal or a ceramic, and the filling slurry 6 is injected into the porous structure of the blank 1, followed by a curing treatment; wherein the first organic matter and the second organic matter have different compositions. The curing treatment here may include curing methods such as photocuring, catalytic curing or radiation excitation. In this embodiment, the metal or ceramic component in the filling slurry 6 can be the same as that in the blank slurry, and the composition of the first organic matter and the second organic matter is generally different, because the blank 1 is generally made using a photocuring 3D molding technology, and the blank 1 after the filling slurry 6 is injected is generally cured using a thermal curing technology, because the filling slurry 6 is structurally thick in the porous structure of the blank 1, and it is difficult to completely cure it using a photocuring 3D molding technology. Specifically, filling slurry 6 has heat-curing properties and can be a silica ceramic slurry with a solid phase content of 52% by volume. The second organic compound includes heat-curable E51 epoxy resin, methylhexahydrophthalic anhydride (heat curing agent), and N,N-dimethylacetamide (low-temperature diluent), with the volume ratio of the three reagents being 4:3:3. Filling slurry 6 can also include Digo 685 (dispersant, accounting for 0.75% of the ceramic powder mass).

[0057] S400, perform the second degreasing.

[0058] The second degreasing step in this step primarily involves degreasing the structure after the injected filling slurry 6 solidifies, removing any organic matter. During the first degreasing process, the gases generated by the decomposition of the first organic matter in the green blank 1 form microporous structures within the green blank 1. These microporous structures provide venting channels for the second degreasing step, allowing the gases generated by the decomposition of the second organic matter to be rapidly discharged, further reducing the likelihood of cracks.

[0059] Specifically, the steps of S400 include:

[0060] S401, based on the DSC pyrolysis curve of the slurry injected into the porous structure, a second degreasing is performed to remove organic matter in the filling slurry 6. Specifically, the green body 1 contains the first organic matter, and the filling slurry 6 contains the second organic matter.

[0061] In the above-described embodiment of the present invention, the porous design of component 4 not only reduces the difficulty of forming component 4, especially for bottom-up stereolithography, effectively reducing the separation force, but also significantly reduces the degreasing thickness of component 4. The porous structure formed by this porous design also serves as a macroscopic channel for the exhaust of pyrolysis gases, which helps to suppress the formation of cracks. Through a staged process of primary degreasing, slurry injection, and secondary degreasing, large-cross-section ceramic or metal components 4 can be degreased and sintered, effectively overcoming the limitations of degreasing wall thickness of ceramic or metal components.

[0062] Reference Figure 3 , Figure 3 This is a schematic flow chart of the segmented debinding and sintering method according to the third embodiment of the present invention. Step S100 includes:

[0063] S110, designing a porous structure based on the degreasing limit thickness and the fluid flow parameters to obtain a porous structure model with an appearance consistent with the target part 4;

[0064] The degreasing limit is defined as the thickness of the blank 1 exceeding a certain value, where degreasing cannot be completed, resulting in defects in the finished part 4. This limit can be 10mm. The porous structure incorporated into the blank 1 reduces the thickness of the continuous material across its cross-section due to its partitioning effect. In other words, the porous structure model is designed to ensure that the thickness of the continuous material at any cross-section does not exceed 10mm, ensuring optimal degreasing. Therefore, a blank 1 with a porous structure is suitable for degreasing parts 4 with large cross-sections or thicknesses.

[0065] S120, obtaining a blank 1 by 3D printing according to the porous structure model.

[0066] Based on the designed porous structure model, the desired green blank 1 can be produced using 3D printing or the gel method. Furthermore, the green blank 1 can be produced using photocuring 3D printing. Due to the porous structure, the separation force during the photocuring molding process is relatively small, allowing for continuous production of green blank 1 models, rather than the layered production required in the prior art. Of course, in other embodiments, the gel method can also be used to produce the green blank 1.

[0067] In some embodiments, the porous structure includes a plurality of blind holes 2. The steps of preparing the green blank 1 and forming the green blank 1 into the porous structure include:

[0068] A plurality of blind holes 2 are formed in the blank 1, each blind hole 2 having only one end connected to the outside. In a specific embodiment, the plurality of blind holes 2 include a plurality of first blind holes and a plurality of second blind holes that are interconnected. The step of forming the plurality of blind holes 2 in the blank 1 includes: forming the plurality of first blind holes and the plurality of second blind holes that are interconnected in the blank 1.

[0069] Each blind hole 2 has one end connected to the outside world, from which slurry can be injected, and the other end is not connected to the outside world in order to prevent the injected slurry from flowing out. Figure 5 (c) and Figure 5 (d) The plurality of blind holes 2 include a plurality of first blind holes and second blind holes that are interconnected, such as Figure 5 The first blind holes are arranged in parallel horizontally, the second blind holes are arranged in parallel vertically, and the first blind holes and the second blind holes are connected in an interlaced manner. Figure 5 It is only one form of existence of the first blind hole and the second blind hole. Specifically, the arrangement of the first blind hole and the second blind hole is designed according to the shape and structure of the part. It is not necessarily arranged horizontally and vertically, nor is it necessarily arranged in parallel with multiple first blind holes or multiple second blind holes. In this way, multiple blind holes 2 form multiple one-way exhaust channels during the first degreasing process, which is convenient for quickly discharging the gas generated during the degreasing process and reducing the possibility of cracks. It should be noted that the number of the first blind holes and the second blind holes here are both multiple, and the first blind holes and the second blind holes can be interconnected in such a way that some of the first blind holes and some of the second blind holes are connected, and another part of the first blind holes and another part of the second blind holes are connected, or all the first blind holes and all the second blind holes are interconnected. It should be noted that if the part 4 to be manufactured itself has a hole position 5, the blind hole 2 here cannot be connected to the hole position 5 to avoid injecting the slurry into the hole position 5 during grouting. The hole position here can be Figure 5 The through hole shown in the figure may also be a hole with a certain depth that is connected to the outside at one end, or a closed hole inside the part.

[0070] Reference Figure 4 , Figure 4 Schematic diagram of the process of the segmented debinding and sintering method according to the fourth embodiment of the present invention. The steps of S400 include:

[0071] S500 , sintering the green blank 1 after the second debinding.

[0072] Sintering is mainly used to improve the mechanical properties of materials, and the sintering temperature is generally around 1550℃.

[0073] In order to more clearly illustrate the embodiments of the present invention, Figure 5 , Figure 5 This is a schematic diagram of the structural changes during the manufacturing process of the segmented degreasing and sintering method according to an embodiment of the present invention. Figure 5 (a) shows the model of the target part 4 to be manufactured; Figure 5 (b) shows the model of the porous part made in three dimensions; Figure 5 (c) shows a schematic structural diagram of the blank 1, wherein the blank 1 is formed with a porous structure, which includes a plurality of blind holes 2 and holes 5 required for the target part 4 itself; Figure 5 (d) shows a schematic diagram of the structure of the blank 1 after one degreasing; Figure 5 (e) is a schematic diagram showing the structure after the primary degreasing blank 1 is injected with the filling slurry 6; Figure 5 (f) shows a schematic diagram of the structure of the part 4 after the filling slurry 6 is injected and the second degreasing is performed; Figure 5 (g) shows a schematic structural diagram of the target part 4 obtained after the second degreasing is completed.

[0074] The following is a specific example of a segmented degreasing and sintering method:

[0075] (1) Taking SiO2 ceramic slurry with a solid content of 50 vol% as an example, it has photocuring properties. The specific ingredients include: 1,6-hexanediol diacrylate and trimethylolpropane triacrylate (both photosensitive resins with a volume ratio of 1:1), silica powder (50% by volume of the entire slurry), phenyl bis (2,4,6-trimethylbenzoyl) phosphine oxide (photoinitiator, 1.5% of the mass of the two photosensitive resins), Digo 685 (dispersant, 0.75% of the mass of the ceramic powder), and digital light processing technology to prepare the slurry. Figure 5 (a) shows the target part 4 model. The material limit degreasing thickness is 2.0 mm, which means that the maximum size of each cross section on the part 4 is required to be no more than 2.0 mm. According to the Fluent fluid software, with the slurry flow characteristics as the optimization target, a porous structure is designed on the part 4 model. The pore size is 500-1000 μm. The porous structures are interconnected but not connected to the target part 4 (i.e. Figure 5 (a) The original pores are connected, and only the upper end is connected to the outside world, such as Figure 5 (b) shown.

[0076] (2) Using light curing technology to prepare Figure 5 (b) shows a model of a porous part 4 of a silicon dioxide ceramic part 4 blank 1, with a layer thickness of 150 μm. Figure 5 (c)

[0077] (3) The printed porous ceramic blank 1 was degreased for the first time. The degreasing process was as follows: in an argon protective environment, the temperature was raised to 200°C at a heating rate of 2°C / min, kept at 200°C for 60 minutes, then raised to 600°C at a heating rate of 0.5°C / min, kept at 600°C for 120 minutes, and cooled to room temperature with the furnace. The degreasing results are shown in FIG. Figure 5 (d).

[0078] (4) The silicon dioxide ceramic slurry (filling slurry 6) with thermal curing properties was injected into the designed porous structure, treated in a constant temperature box at 200°C for 120 minutes, and taken out. Figure 5 (e) The ceramic solids content of the heat-curing silica ceramic slurry is 52% vol%, slightly higher than that of the printed silica ceramic slurry. The composition includes: E51 epoxy resin (heat-curable), methylhexahydrophthalic anhydride (heat curing agent), N,N-dimethylacetamide (low-temperature diluent), the three reagents are in a volume ratio of 4:3:3, silica powder (52% of the total slurry volume), and Digo 685 (dispersant, 0.75% of the ceramic powder mass).

[0079] (5) Place the ceramic part 4 after grouting and curing in a high-temperature furnace for a second degreasing process. The degreasing process is as follows: under nitrogen protection, heat up to 100℃ at a heating rate of 2℃ / min, keep at 100℃ for 60min, then heat up to 250℃ at a heating rate of 0.5℃ / min, and keep at 250℃ for 120min to remove low-temperature diluent and other organic matter in part 4, then heat up to 600℃ at a heating rate of 0.5℃ / min, and keep at 600℃ for 120min to remove other organic matter in part 4, and cool to room temperature with the furnace. The results of the second degreasing are as follows: Figure 5 (f).

[0080] (6) The degreased part 4 is placed in a high-temperature furnace for sintering strengthening. The process parameters are as follows: in an air atmosphere, the temperature is raised to 1550°C at 5°C / min, and the furnace is cooled to room temperature to obtain the final part 4, as shown in FIG. Figure 5 (g).

[0081] According to another aspect of the present invention, a component 4 is provided. The component 4 is manufactured by the aforementioned segmented debinding and sintering method. Since the component 4 is manufactured by the aforementioned segmented debinding and sintering method, it has all the beneficial effects of the aforementioned embodiments, which will not be described in detail here.

[0082] Finally, it should be noted that the above embodiments are only used to illustrate the technical solutions of the present application, and do not limit the patent scope of the present invention. Although the present application has been described in detail with reference to the aforementioned embodiments, those skilled in the art should understand that under the technical concept of the present invention, the technical solutions described in the aforementioned embodiments can still be modified, or some or all of the technical features therein can be replaced by equivalents; or directly / indirectly applied to other related technical fields, and these modifications or replacements do not deviate the essence of the corresponding technical solutions from the scope of the technical solutions of the embodiments of the present application, and they should all be included in the scope of the claims and description of the present application. In particular, as long as there is no structural conflict, the various technical features mentioned in each embodiment can be combined in any way. The present application is not limited to the specific embodiments disclosed herein, but includes all technical solutions that fall within the scope of the claims.

Claims

1. A segmented degreasing and sintering method, characterized in that: The segmented degreasing and sintering method comprises the following steps: preparing a green blank, wherein the green blank is formed into a porous structure; Degreasing the green blank for the first time; injecting a filling slurry into the porous structure of the green blank and curing the filling slurry; Perform a second degreasing.

2. The segmented degreasing and sintering method according to claim 1, characterized in that: The step of preparing the green blank and forming the green blank into a porous structure comprises: The porous structure is designed based on the degreasing limit thickness and fluid flow parameters to obtain a porous structure model with the same shape as the target part; According to the porous structure model, the green blank is obtained by 3D printing.

3. The segmented degreasing and sintering method according to claim 1, characterized in that: The porous structure includes a plurality of blind holes, and the steps of preparing the green blank and forming the green blank into the porous structure include: A plurality of blind holes are made in the blank, and only one end of each blind hole is connected to the outside.

4. The segmented degreasing and sintering method according to claim 3, characterized in that: The plurality of blind holes include a plurality of first blind holes and a second blind hole that are interconnected. The step of forming the plurality of blind holes in the blank includes: A plurality of first blind holes and second blind holes that are interconnected are made in the blank.

5. The segmented debinding and sintering method according to claim 1, characterized in that: The step of preparing the green blank and forming the green blank into a porous structure comprises: A green blank slurry is prepared by mixing a first resin-type organic matter with metal or ceramic, and the green blank slurry is used to produce a green blank through a light-curing 3D printing technology, and the green blank is formed into a porous structure.

6. The segmented debinding and sintering method according to claim 5, characterized in that: The step of injecting filling slurry into the porous structure of the green blank and then performing a curing treatment comprises: A filling slurry is prepared by mixing a second organic matter of resin with metal or ceramic, and the filling slurry is injected into the porous structure of the green body, followed by a curing treatment; wherein the first organic matter and the second organic matter have different compositions.

7. The segmented debinding and sintering method according to claim 1, characterized in that: The step of performing a first degreasing on the green blank comprises: According to the DSC pyrolysis curve of the green body slurry, the green body is subjected to a first degreasing process in a protective gas or vacuum environment to remove organic matter in the green body; wherein a microporous structure is formed in the green body at the location where the organic matter is removed.

8. The segmented debinding and sintering method according to claim 1, characterized in that: The step of performing the second degreasing comprises: According to the DSC thermal decomposition curve of the filling slurry injected into the porous structure, a second degreasing is performed to remove organic matter in the filling slurry.

9. The segmented debinding and sintering method according to claim 1, characterized in that: The steps after the second degreasing process include: The green blank after the second debinding is sintered.

10. A component, characterized in that: The parts are made by the segmented debinding sintering method according to any one of claims 1 to 9.

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