PCB conveying system and PCB conveying method

Abstract

The application discloses a PCB conveying system and a PCB conveying method. The PCB conveying system comprises a conveying module and a supporting plate module. The conveying module is arranged along a preset conveying path and is used for conveying a PCB. Two groups of inclined conveying surfaces are formed on the conveying module. The two groups of conveying surfaces are arranged on two sides in the width direction of the conveying path, and the lower sides of the two groups of conveying surfaces are close to each other. The supporting plate module is arranged along the conveying path. The two groups of conveying surfaces can support the PCB at two edges in the width direction of the conveying path, thereby reducing the contact area between the conveying surface and the PCB, and reducing the damage of the board surface of the PCB in the conveying process. The supporting plate module can support the middle part of the PCB without friction with the board surface of the PCB, so that the PCB conveying system can convey the PCB with a relatively small thickness.

Description

Technical Field

[0001] This invention relates to the field of PCB conveying technology, and in particular to a PCB conveying system and a PCB conveying method. Background Technology

[0002] In the PCB production process, after the PCB undergoes pretreatment to roughen the solder mask, it needs to be transported to the solder mask ink spraying equipment via a conveyor line so that a layer of solder mask ink can be sprayed onto the PCB surface.

[0003] In related technologies, conveyor belts are used to transport PCBs; however, after the PCB undergoes solder mask roughening pretreatment, the PCB surface is relatively fragile. During the conveyor belt transport process, the conveyor belt is prone to scratching the PCB surface, causing damage to the PCB during transport. Summary of the Invention

[0004] The purpose of this invention is to at least solve one of the technical problems existing in the prior art. The first aspect of this invention provides a PCB conveying system to reduce the wear of the PCB surface during the conveying process.

[0005] A second aspect of the present invention also provides a PCB conveying method.

[0006] According to a first aspect of the present invention, a PCB conveying system includes a conveying module and a pallet module. The conveying module is arranged along a preset conveying path and is used to convey PCBs. Two sets of inclined conveying surfaces are formed on the conveying module. The two sets of conveying surfaces are respectively arranged on both sides in the width direction of the conveying path, and the lower sides of the two sets of conveying surfaces are close to each other, so that the two sets of conveying surfaces can respectively support the two edges of the PCB in the width direction of the conveying path. The pallet module is arranged along the conveying path and is used to lift the PCB at the middle part in the width direction of the conveying path without friction and / or without contact during the conveying of the PCB along the conveying path.

[0007] The PCB conveying system described in the first aspect of the present invention has at least the following beneficial effects: the two sets of conveying surfaces can respectively support the two edges of the PCB in the width direction of the conveying path, thereby reducing the contact area between the conveying surface and the PCB, thus reducing the damage to the PCB board surface during the conveying process; at the same time, the pallet module can lift the PCB in the middle of the conveying path width direction without friction and / or without contact during the conveying process, so that the pallet module can support the middle of the PCB without friction with the PCB board surface, thereby reducing the probability of PCB damage caused by the downward concavity of the PCB center, so that the PCB conveying system of the present invention can realize the conveying of thinner PCBs.

[0008] According to the PCB conveying system of the first aspect of the present invention, the pallet module includes an air flotation component located below the gap between two sets of conveying surfaces and capable of blowing air upwards to lift the PCB in the middle of the conveying path width direction without contact via airflow; and / or; the pallet module includes a support component, the support component including a carrier member for lifting the PCB in the middle of the conveying path width direction, and the carrier member is slidably disposed along the conveying path to follow the PCB as it moves along the conveying path.

[0009] According to the PCB conveying system of the first aspect of the present invention, the pallet module includes a support component, the support component further includes a lifting mechanism and a transfer mechanism connected to each other, the transfer mechanism is used to drive the carrier to move along the conveying path, and the lifting mechanism is used to drive the carrier to lift or detach from the PCB.

[0010] According to the PCB conveying system of the first aspect of the present invention, the pallet module further includes an air flotation component, which is disposed at the inlet end of the conveying module, and the transfer mechanism is capable of driving the carrier to move to the inlet end of the conveying module.

[0011] According to the first aspect of the PCB conveying system, the system further includes a width adjustment module and a board picking adjustment module. The conveying module includes two conveying components that can move closer to or further away from each other, and two sets of conveying surfaces are respectively formed on the two conveying components. The width adjustment module is connected to at least one conveying component and is used to adjust the relative distance between the two conveying components. The board picking adjustment module is located on one side of the conveying module and is capable of picking up the PCB on the conveying path, rotating it horizontally, and then putting it back.

[0012] According to the PCB conveying system of the first aspect of the present invention, the conveying component includes a first conveying mechanism and a second conveying mechanism distributed along the conveying path, and the first conveying mechanism is located at the entrance end of the conveying module. The distance between the two first conveying mechanisms and the distance between the two second conveying mechanisms are independently adjustable. The board picking adjustment module can pick up the PCB on the first conveying mechanism, rotate it horizontally, and place it on the second conveying mechanism.

[0013] According to the PCB conveying system of the first aspect of the present invention, the conveying component further includes a third conveying mechanism, which is located on the side of the second conveying mechanism away from the first conveying mechanism, and the distance between the two third conveying mechanisms is independently adjustable.

[0014] According to the first aspect of the PCB conveying system, the system further includes a temporary storage module disposed on one side of the conveying module, and the board picking adjustment module is capable of picking up the PCB from the conveying path and placing it in the temporary storage module.

[0015] According to the first aspect of the PCB conveying system, the system further includes a lifting conveying module. The lifting conveying module is located behind the conveying module along the conveying direction of the PCB, and a passage is formed at the bottom that allows operators to pass through. The lifting conveying module is used to lift the PCB to a certain height so that the PCB can pass over the passage from above and continue to be conveyed to the rear.

[0016] The PCB conveying method provided according to a second aspect embodiment of the present invention includes the following steps:

[0017] During PCB transport, two sets of inclined and close-to-each-side transport surfaces support the PCB at its two edges along the width of the transport path, and lift the PCB at its center in a frictionless and / or contactless manner.

[0018] The PCB conveying method described in the second aspect of the present invention has at least the following beneficial effects: by having two sets of inclined and mutually close conveying surfaces respectively supporting the two edges of the PCB in the width direction of the conveying path, the contact area between the conveying surface and the PCB can be reduced, thereby reducing the wear of the PCB surface during conveying; by lifting the PCB in a frictionless and / or contactless manner in the middle of the conveying path width direction, the degree of downward concavity of the PCB center during conveying can be reduced while reducing the wear of the PCB surface, thereby enabling the conveying of thinner PCBs.

[0019] According to a second aspect embodiment of the present invention, the PCB transport method, which lifts the PCB in a frictionless and / or contactless manner at the middle of the transport path width direction, includes the following steps:

[0020] Air is blown upwards from below the PCB, and the airflow lifts the PCB to the middle of the transport path width without contact.

[0021] and / or;

[0022] The PCB is lifted by a carrier and positioned in the middle of the conveying path width, and the carrier is driven to move along the conveying path with the PCB.

[0023] According to a second aspect embodiment of the present invention, the PCB transport method, which lifts the PCB in a frictionless and / or contactless manner at the middle of the transport path width direction, includes the following steps:

[0024] As the PCB is gradually conveyed into the beginning of the conveying path, air is blown upwards from below the PCB, and the airflow lifts the PCB without contact in the middle of the conveying path width direction.

[0025] After the PCB has fully entered the beginning of the conveying path, the carrier lifts the PCB to the middle of the conveying path width and drives the carrier to move along the conveying path with the PCB.

[0026] According to the PCB conveying method of the second aspect of the present invention, the conveying path includes an infeed section and an adjustment section with independently adjustable conveying width, and the infeed section is located at the beginning of the conveying path;

[0027] The PCB delivery method also includes the following steps:

[0028] Obtain the dimensions of the PCB to be input; wherein, the dimension of the PCB to be input in the direction parallel to the width of the transport path is denoted as D1, and the dimension in the direction parallel to the extension of the transport path is denoted as D2;

[0029] Determine if D1 exceeds the preset range;

[0030] If D1 is within the preset range, the conveying width of the board feeding section and the adjustment section is adjusted according to D1 so that the board feeding section and the adjustment section can adapt to the conveying of the PCB to be input, and so that the PCB can be directly conveyed from the board feeding section to the adjustment section.

[0031] If D1 exceeds the preset range, the conveying width of the board feeding section is adjusted according to D1 so that the board feeding section can adapt to the conveying of the PCB to be input. The conveying width of the adjustment section is adjusted according to D2. After the PCB is input into the board feeding section, the PCB is rotated 90° and then placed on the adjustment section to continue conveying.

[0032] Additional aspects and advantages of the invention will be set forth in part in the description which follows, and in part will be obvious from the description, or may be learned by practice of the invention. Attached Figure Description

[0033] The present invention will be further described below with reference to the accompanying drawings and embodiments;

[0034] Figure 1 This is a schematic diagram of the PCB conveying system according to an embodiment of the present invention;

[0035] Figure 2 for Figure 1 A schematic diagram of the PCB conveying system from another perspective;

[0036] Figure 3 for Figure 1 A schematic diagram of part of the PCB conveying system shown.

[0037] Figure 4 for Figure 3 A magnified view of a portion of the structure at point A in the structure shown.

[0038] Figure 5 for Figure 3 A magnified view of the structure at point B in the structure shown.

[0039] Figure 6 for Figure 1 The diagram shows the structural schematic of the board picking and adjustment module of the PCB conveying system.

[0040] Figure 7 for Figure 6 A schematic diagram of a portion of the pickup adjustment module shown.

[0041] Figure 8 for Figure 1 A schematic diagram of the temporary storage module of the PCB conveying system shown.

[0042] Figure 9 for Figure 1 The diagram shows the structural schematic of the lifting and conveying module of the PCB conveying system.

[0043] Figure 10 This is a flowchart of a PCB conveying method according to an embodiment of the present invention;

[0044] Figure 11 This is a flowchart illustrating the adjustment of the board feeding section and the conveying width of the adjustment section according to the PCB size to be input, as described in one embodiment of the present invention.

[0045] Figure label:

[0046] Conveying module 100; conveying assembly 110; first conveying mechanism 111; second conveying mechanism 112; third conveying mechanism 113; conical roller 120;

[0047] Pallet module 200; air flotation component 210; air jet component 211; air jet hole 211a; support component 220; load-bearing component 221; limiting part 221a; load-bearing part 221b; lifting mechanism 222;

[0048] Width adjustment module 300;

[0049] Plate-picking adjustment module 400; robotic arm 410; mounting frame 420; mounting rod 421; adsorption structure 430;

[0050] Temporary storage module 500; transfer component 510; horizontal moving mechanism 511; vertical moving mechanism 512; gripper 513; storage component 520; storage area 521; base 530;

[0051] Lifting conveyor module 600; first horizontal transfer mechanism 610; second horizontal transfer mechanism 620; transverse transfer structure 621; third horizontal transfer mechanism 630; first vertical transfer mechanism 640; loading clamping structure 641; first lifting structure 642; second vertical transfer mechanism 650; unloading clamping structure 651; second lifting structure 652. Detailed Implementation

[0052] This section will describe in detail specific embodiments of the present invention. Preferred embodiments of the present invention are shown in the accompanying drawings. The purpose of the drawings is to supplement the textual description with graphics, so that people can intuitively and vividly understand each technical feature and overall technical solution of the present invention, but they should not be construed as limiting the scope of protection of the present invention.

[0053] In the description of this invention, it should be understood that the orientation descriptions, such as up, down, front, back, left, right, etc., are based on the orientation or positional relationship shown in the accompanying drawings. They are only for the convenience of describing this invention and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation. Therefore, they should not be construed as limiting this invention.

[0054] In the description of this invention, "several" means one or more, "more than" means two or more, "greater than," "less than," and "exceeding" are understood to exclude the stated number, while "above," "below," and "within" are understood to include the stated number. The use of "first" and "second" in the description is merely for distinguishing technical features and should not be construed as indicating or implying relative importance, or implicitly indicating the number of indicated technical features, or implicitly indicating the order of the indicated technical features.

[0055] In the description of this invention, unless otherwise explicitly defined, terms such as "set up," "install," and "connect" should be interpreted broadly, and those skilled in the art can reasonably determine the specific meaning of the above terms in this invention in conjunction with the specific content of the technical solution.

[0056] The following is for reference. Figures 1 to 9 The PCB conveying system according to the first aspect of the present invention will be described in detail.

[0057] Reference Figures 1 to 3 According to some embodiments of the present invention, a PCB conveying system includes a conveying module 100 and a pallet module 200.

[0058] The conveying module 100 is set along a preset conveying path and is used to convey PCBs. The conveying module 100 has two sets of inclined conveying surfaces, which are respectively located on both sides in the width direction of the conveying path. The lower sides of the two sets of conveying surfaces are close to each other, so that the two sets of conveying surfaces can support the two edges of the PCB in the width direction of the conveying path respectively. The pallet module 200 is set along the conveying path and is used to lift the PCB in the middle of the width direction of the conveying path without friction and / or without contact during the conveying of the PCB along the conveying path.

[0059] For example, such as Figure 3 and Figure 4 As shown, the conveying path can extend in the front-to-back direction. The conveying module 100 is located on the conveying path. The conveying module 100 is equipped with two sets of conical rollers. The two sets of conical rollers are arranged side by side in the left-to-right direction. Each set of conical rollers includes multiple conical rollers 120 spaced apart in the front-to-back direction. In the same set of conical rollers, the common upper tangent of each conical roller 120 forms a set of conveying surfaces. For the right-side conical roller 120, the cross-sectional area of ​​the conical roller 120 gradually decreases from right to left, so that the conveying surface on the right side is inclined to the lower left. For the left-side conical roller 120, the cross-sectional area of ​​the conical roller 120 gradually decreases from left to right, so that the conveying surface on the left side is inclined to the lower right. Therefore, the lower sides of the two sets of conveying surfaces are close to each other. The pallet module 200 is arranged along the conveying path and is located between the two sets of conical rollers.

[0060] When the PCB conveying system of this embodiment is working, the PCB is conveyed from front to back along the conveying path. The left and right edges of the PCB can be supported on two sets of conveying surfaces respectively, and the pallet module 200 can provide upward support force to support the PCB. When the conical roller 120 rolls, the PCB can move from front to back under the drive of the conical roller 120. Understandably, since the side of the two sets of conveying surfaces that are close to each other is lower than the side that is away from each other, when the PCB is carried on the two sets of conveying surfaces, the contact area between the PCB and the conveying surface can be reduced, thereby reducing the scratches on the PCB surface by the conical rollers 120 during the conveying process. At the same time, since the pallet module 200 can lift the middle of the PCB without friction and / or without contact during the conveying process, the pallet module 200 can support the middle of the PCB to reduce the depression in the middle of the PCB. Thus, the PCB conveying system of this embodiment can realize the conveying of thinner PCBs. And since there is no friction and / or no contact between the pallet module 200 and the PCB, the scratches on the PCB surface by the pallet module 200 during the conveying process can be reduced to ensure the quality of the PCB.

[0061] Optionally, in order to form two sets of conveying surfaces that are inclined and close to each other on their lower sides, in some other embodiments of the present invention, the conveying module 100 may also include two sets of cylindrical roller groups. The two sets of cylindrical roller groups are arranged side by side in the left-right direction. Each set of cylindrical roller groups includes multiple cylindrical rollers that are spaced apart in the front-back direction. The upper tangent surface of each cylindrical roller in the same set of cylindrical roller groups forms a conveying surface. In this case, the cylindrical roller on the right side is inclined to the lower left so that the conveying surface on the right side is inclined to the lower left, and the cylindrical roller on the left side is inclined to the lower right so that the conveying surface on the left side is inclined to the lower right.

[0062] In some embodiments of the present invention, the pallet module 200 includes an air flotation component 210 and a support component 220; for example, see reference Figure 3 In one embodiment of the present invention, the air flotation component 210 is disposed at the inlet end of the conveying module 100, and the transfer mechanism in the support component 220 can drive the carrier 221 to move to the inlet end of the conveying module 100. During the process of the PCB gradually entering the inlet end of the conveying module 100, the air flotation component 210 lifts the PCB to the middle of the conveying path width direction. After the PCB has completely entered the inlet end of the conveying module 100, the carrier 221 lifts the PCB to the middle of the conveying path width direction. Understandably, as the PCB gradually enters the inlet of the conveying module 100, the PCB is in a moving state, and the moving speed of the support member 221 is difficult to keep in line with the moving speed of the PCB. If the support member 221 is used to support the PCB as it gradually enters the inlet of the conveying module 100, the PCB is prone to relative sliding with the support member 221, thereby damaging the PCB. However, by placing the air flotation component 210 at the inlet of the conveying module 100, the air flotation component 210 can output airflow upwards during the process of the PCB entering the conveying module 100, so as to lift the PCB by airflow. Since there is a gap between the air flotation component 210 and the PCB, the air flotation component 210 and the PCB do not contact each other throughout the process. Thus, under the premise that the PCB is lifted in the middle of the conveying path width direction, the damage to the PCB board surface can be reduced. Since the stability of the airflow output by the air flotation component 210 is relatively poor, after the PCB has completely entered the conveying module 100, the support member 221 of the support component 220 can support the PCB, which can improve the stability of the PCB during the movement process.

[0063] For details, please refer to Figure 4 The air flotation assembly 210 includes an air jet 211, which extends in the front-to-back direction. The air jet 211 has multiple air jet holes 211a along the front-to-back direction. The lower end of the air jet holes 211a is connected to a gas supply device so that the gas supply device can supply air to the air jet 211, thereby enabling the air jet holes 211a to spray air upwards, so as to lift the middle part of the PCB without contact through the airflow.

[0064] Furthermore, in some embodiments, two jets 211 may be provided, arranged side by side in the left-right direction. It is understood that by providing two jets 211 arranged side by side in the left-right direction, the airflow output upward by the air flotation assembly 210 can be made more uniform, so that the air flotation assembly 210 can more stably support the PCB by the airflow.

[0065] Specifically, the pallet module 200 includes a support assembly 220, which further includes an interconnected lifting mechanism 222 and a transfer mechanism (not shown in the figure). The transfer mechanism is used to drive the carrier 221 to move along the conveying path, and the lifting mechanism 222 is used to drive the carrier 221 to rise or fall to support or detach from the PCB. For example, as Figure 5 As shown, the lifting mechanism 222 is connected to the output end of the transfer mechanism, and the output end of the lifting mechanism 222 is connected to the carrier 221. It can be understood that when the supporting assembly 220 is working, driven by the transfer mechanism, the carrier 221 can move forward to the inlet end of the conveying module 100. Driven by the lifting mechanism 222, the carrier 221 can move upward to carry the PCB located at the inlet end of the conveying module 100. Then, driven by the transfer mechanism, the carrier 221 can move backward following the PCB. When the PCB moves to a designated position, the lifting mechanism 222 can drive the carrier 221 to move downward away from the PCB. At this time, the transfer mechanism can drive the carrier 221 to move forward so that the carrier 221 carries subsequent PCBs.

[0066] It is understood that in some embodiments, the support assembly 220 further includes a first distance adjustment mechanism (not shown in the figure). The support assembly 220 includes two support members 221 and two lifting mechanisms 222. The output ends of the two lifting mechanisms 222 are respectively connected to the two support members 221. The two lifting mechanisms 222 are configured to be adjustable in position in the front-back direction. The first distance adjustment mechanism is connected to at least one of the two lifting mechanisms 222 and is capable of adjusting the distance between the two lifting mechanisms 222.

[0067] Furthermore, in some of these embodiments, reference is made to... Figure 5The support member 221 includes a support portion 221b and two limiting portions 221a. The two limiting portions 221a are located at opposite ends of the two support portions 221b. The support portion 221b can support the PCB, and the limiting portions 221a can abut against and limit the movement of the PCB on its front and rear sides. By providing two support members 221, the two support members 221 can respectively support the middle of the front and rear ends of the PCB, thereby enabling the support assembly 220 to stably support the PCB while reducing the contact area between the PCB and the support member 221. Furthermore, during the PCB transport process, relative sliding between the carrier 221 and the PCB is inevitable. At this time, the carrier 221 may damage the PCB surface. By setting a first distance adjustment mechanism and adjusting the distance between the two carriers 221, the limiting part 221a on the two carriers 221 can abut against the front and rear sides of the PCB respectively, which can reduce the probability of relative sliding between the carrier 221 and the PCB, thereby reducing the probability of damage to the PCB surface during transport.

[0068] In some other embodiments of the present invention, the pallet module 200 may include only the air flotation component 210. In this case, the air flotation component 210 is provided below the gap between the two sets of conveying surfaces in the front-back direction, and forms a uniform upward airflow in the area between the two sets of conveying surfaces. After the PCB gradually enters the inlet end of the conveying module 100 and after the PCB has completely entered the inlet end of the conveying module 100, the air flotation component 210 supports the middle part of the PCB in the width direction of the conveying path.

[0069] In some other embodiments of the present invention, the pallet module 200 may also include only the support component 220. In this case, after the PCB gradually enters the inlet end of the conveying module 100 and after the PCB has completely entered the inlet end of the conveying module 100, the support component 221 of the support component 220 supports the middle part of the PCB in the width direction of the conveying path.

[0070] In some embodiments of the present invention, reference is made to Figures 1 to 3The PCB conveying system also includes a width adjustment module 300 and a board pickup adjustment module 400. The conveying module 100 includes two conveying components 110 that can move closer to or further away from each other, with two sets of conveying surfaces formed on the two conveying components 110 respectively. The width adjustment module 300 is connected to at least one conveying component 110 and is used to adjust the relative distance between the two conveying components 110. The board pickup adjustment module 400 is located on one side of the conveying module 100 and can pick up the PCB on the conveying path, rotate it horizontally, and then put it back. It is understood that the PCBs conveyed by the PCB conveying system have different specifications. The width adjustment module 300 allows the PCB conveying system to adjust the distance between the two conveying components 110 according to the different specifications of the PCB, thereby improving the versatility of the PCB conveying system in this embodiment.

[0071] It should be noted that the preceding process of the PCB conveying system of the present invention can be a solder resist roughening pretreatment process, and the following process of the PCB conveying system of the present invention can be a solder resist ink spraying process. After the PCB undergoes the solder resist roughening pretreatment process, the PCB is conveyed along its long side, that is, the size of the PCB in the width direction of the conveying path is larger than the size of the PCB in the extension direction of the conveying path. However, when the PCB undergoes solder resist ink spraying, the size of the PCB in the width direction of the conveying path needs to be within a preset range. Therefore, for some larger PCBs, after the solder resist roughening pretreatment process, the size of the PCB in the width direction of the conveying path is outside the preset range. In this case, if the PCB is directly conveyed to the solder resist ink spraying equipment, the solder resist ink spraying equipment cannot spray the solder resist ink on the PCB because the size of the PCB in the width direction of the conveying path is outside the preset range. By setting up a pick-up adjustment module 400, which picks up the PCB on the conveying path and drives the PCB to rotate 90° before placing it back on the conveying path, the PCB can be adjusted from being conveyed along its long side to being conveyed along its short side. This ensures that the PCB's dimensions in the width direction of the conveying path are within a preset range, facilitating the subsequent application of solder resist ink to the PCB by the solder resist ink spraying equipment.

[0072] Furthermore, in some embodiments, the conveying assembly 110 includes a first conveying mechanism 111 and a second conveying mechanism 112 distributed along the conveying path. The first conveying mechanism 111 is located in front of the second conveying mechanism 112 and at the entrance end of the conveying module 100. The distance between the two first conveying mechanisms 111 and the distance between the two second conveying mechanisms 112 are independently adjustable. The PCB picking and adjusting module 400 can pick up the PCB on the first conveying mechanism 111, rotate it horizontally, and place it on the second conveying mechanism 112. For example, as... Figure 3As shown, the conveying assembly 110 includes a first conveying mechanism 111 and a second conveying mechanism 112 distributed along the front-back direction. The first conveying mechanism 111 is located at the inlet end of the conveying module 100. Each set of conveying surfaces includes multiple sub-conveying surfaces. A sub-conveying surface is formed on the first conveying mechanism 111 and the second conveying mechanism 112 respectively. The width adjustment module 300 includes a first width adjustment mechanism and a second width adjustment mechanism. The first width adjustment mechanism is connected to at least one of the two first conveying mechanisms 111 and is used to adjust the distance between the two first conveying mechanisms 111. The second width adjustment mechanism is connected to at least one of the two second conveying mechanisms 112 and is used to adjust the distance between the two second conveying mechanisms 112.

[0073] Understandably, during PCB transport, when the PCB's dimensions in the width direction of the transport path are within a preset range, the PCB does not need to rotate. The first width adjustment mechanism can adjust the distance between the two first transport mechanisms 111 to fit the PCB, and the second width adjustment mechanism can adjust the distance between the two second transport mechanisms 112 to fit the PCB. When the PCB's dimensions in the width direction of the transport path are outside the preset range, the PCB needs to rotate 90° to ensure that the PCB... The short side is used for conveying, which means that the short side of the PCB is parallel to the width direction of the conveying path. Before the PCB is rotated, the first width adjustment mechanism can adjust the distance between the two first conveying mechanisms 111 so that the distance between the first conveying mechanisms 111 is adapted to the PCB before rotation. After the board picking adjustment module 400 picks up the PCB and rotates it 90°, the board picking adjustment module 400 needs to place the rotated PCB on the second conveying mechanism 112. At this time, the second width adjustment mechanism can adjust the distance between the two second conveying mechanisms 112 accordingly so that the distance between the two second conveying mechanisms 112 is adapted to the PCB after rotation.

[0074] It is understandable that the distance between the two first conveying mechanisms 111 and the distance between the two second conveying mechanisms 112 can be adjusted independently, which also allows the first conveying mechanism 111 and the second conveying mechanism 112 to carry PCBs of different specifications respectively. Thus, after the previous PCB moves to the second conveying mechanism 112, the first conveying mechanism 111 can immediately receive the next PCB of a different specification, thereby improving the working efficiency of the PCB conveying system.

[0075] Furthermore, in some other embodiments, the conveying assembly 110 further includes a third conveying mechanism 113, which is located on the side of the second conveying mechanism 112 away from the first conveying mechanism 111, and the distance between the two third conveying mechanisms 113 is independently adjustable. For example, as Figure 3As shown, the conveying assembly 110 also includes a third conveying mechanism 113, which is located behind the second conveying mechanism 112. A sub-conveyor surface is formed on the third conveying mechanism 113. The width adjustment assembly also includes a third width adjustment mechanism, which is connected to at least one of the two third conveying mechanisms 113 and is used to adjust the distance between the two third conveying mechanisms 113. It is understood that the distance between the two third conveying mechanisms 113 can be independently adjusted, allowing the second conveying mechanism 112 and the third conveying mechanism 113 to respectively carry PCBs of different specifications. Thus, after a PCB moves from the second conveying mechanism 112 to the third conveying mechanism 113, the second conveying mechanism 112 can immediately receive a subsequent PCB of a different specification from the first conveying mechanism 111, thereby improving the working efficiency of the PCB conveying system.

[0076] Specifically, the first width adjustment mechanism may include a motor, a lead screw, a first lead screw sleeve, and a second lead screw sleeve. The lead screw includes a first threaded section and a second threaded section with opposite thread directions. The first lead screw sleeve is threaded onto the first threaded section and is rotatably connected to a first conveying mechanism 111. The second lead screw sleeve is threaded onto the second threaded section and is rotatably connected to another first conveying mechanism 111. Driven by the motor, the lead screw can rotate. Driven by the first and second lead screw sleeves, the two first conveying mechanisms 111 can move closer to or further away from each other. The specific structures of the second and third width adjustment mechanisms are the same as those of the first width adjustment mechanism.

[0077] In some embodiments of the present invention, reference is made to Figure 6 and Figure 7The plate-picking adjustment module 400 includes a robotic arm 410, a mounting frame 420, a second distance adjustment mechanism, and multiple adsorption structures 430. The robotic arm 410 is connected to the mounting frame 420. The mounting frame 420 includes two parallel mounting rods 421 with adjustable distance. Each mounting rod 421 is provided with multiple adsorption structures 430, and the multiple adsorption structures 430 on the same mounting rod 421 are distributed along the extension direction of the mounting rod 421. The second distance adjustment mechanism is connected to at least one of the two mounting rods 421 and is used to adjust the distance between the two mounting rods 421. Furthermore, when the board picking and adjusting module 400 needs to rotate the PCB on the conveying module 100, the robotic arm 410 can drive the mounting bracket 420 to move towards the PCB on the conveying module 100, and cause the adsorption structure 430 to adsorb the PCB on the conveying path. Then, the robotic arm 410 can drive the mounting bracket 420 away from the conveying module 100 and rotate it horizontally by 90°. Next, the robotic arm 410 can drive the mounting bracket 420 closer to the conveying module 100 to put the rotated PCB back into the conveying module 100. The second distance adjustment mechanism allows the robotic arm 410 to adjust the relative distance between the two mounting rods 421 before driving the mounting bracket 420 closer to the conveying module 100, so that the distance between the two mounting rods 421 can be adapted to PCBs of different sizes.

[0078] In some embodiments of the present invention, reference is made to Figure 1 and Figure 2 The PCB conveying system also includes a temporary storage module 500, located on one side of the conveying module 100. The pick-up adjustment module 400 can pick up PCBs from the conveying path and place them in the temporary storage module 500. Understandably, when a downstream process of the PCB conveying system malfunctions, the upstream process continues to feed PCBs into the PCB conveying system. To ensure the normal operation of the entire production line, the pick-up adjustment module 400 can move the PCBs from the PCB conveying system to the temporary storage module 500 for temporary storage, allowing the upstream process to operate normally. Simultaneously, this gives workers sufficient time to repair the downstream process. Conversely, when a upstream process of the PCB conveying system malfunctions, to ensure the downstream process continues to operate, the pick-up adjustment module 400 can move the PCBs stored in the temporary storage module 500 back onto the conveying path, allowing the downstream process to operate normally. This also gives workers sufficient time to repair the upstream process.

[0079] For details, please refer to Figure 8The temporary storage module 500 includes a transfer component 510, a storage component 520, and a base 530. The base 530 is provided with a conveyor belt mechanism arranged in the left-right direction. The storage component 520 is located on the conveyor belt of the conveyor belt mechanism and can move left and right under the drive of the conveyor belt to enter and exit the base 530. A storage area 521 is formed in the storage component 520. The storage area 521 includes multiple sub-storage areas distributed in the front-back direction. Each sub-storage area is used to store a PCB. The transfer component 510 is located above the storage component 520. The transfer component 510 includes a horizontal moving mechanism 511, a vertical moving mechanism 512, and a gripper 513. The output end of the vertical moving mechanism 512 is connected to the horizontal moving mechanism 511 and can drive the horizontal moving mechanism 511 to move in the vertical direction. The output end of the horizontal moving mechanism 511 is connected to the gripper 513 and can drive the gripper 513 to move in the front-back direction. In the PCB conveying system of this application, when a PCB on the conveying path needs to be stored in the temporary storage module 500, the board picking and adjusting module 400 can pick up the PCB from the conveying module 100, convey the PCB to the temporary storage module 500, and adjust the PCB to a vertical position. At this time, the gripper 513 can pick up the PCB. Driven by the horizontal moving mechanism 511, the gripper 513 can move the PCB in the front-back direction to directly above an empty sub-storage area. Driven by the vertical moving mechanism 512, the gripper 513 can move the PCB in the vertical direction to directly above an empty sub-storage area. The PCB moves up and down to store the PCB in a sub-storage area. When it is necessary to move the PCB in the temporary storage module 500 to the conveying module 100, the gripper 513 can move in the front-back direction to directly above a sub-storage area containing the PCB under the drive of the horizontal moving mechanism 511. Under the drive of the vertical moving mechanism 512, the gripper 513 can move up and down to remove the PCB in the sub-storage area. Then, the board picking and adjusting module 400 can transport the PCB removed by the gripper 513 to the conveying module 100.

[0080] It is understood that the PCB conveying system of the present invention is relatively long. In the factory, operators often need to walk a long distance to bypass the PCB conveying system of the present invention to perform related operations, such as transporting solder resist ink.

[0081] To reduce the distance operators must walk to avoid the PCB conveying system of this invention, in a further embodiment of this invention, reference is made to... Figure 1 and Figure 2The PCB conveying system also includes a lifting conveyor module 600. Located behind the conveying module 100 along the PCB conveying direction, the lifting conveyor module has a passage at its bottom that allows operators to pass through. The lifting conveyor module is used to lift the PCB to a certain height, allowing the PCB to pass over the passage from above and continue conveying to the rear. By providing a passage at the bottom of the lifting conveyor module 600, workers can directly pass through the PCB conveying system of this embodiment, thereby shortening the distance workers need to walk to avoid the PCB conveying system.

[0082] For details, please refer to Figure 9 The lifting conveyor module 600 includes a first horizontal transfer mechanism 610, a second horizontal transfer mechanism 620, a third horizontal transfer mechanism 630, a first vertical transfer mechanism 640, and a second vertical transfer mechanism 650. The first horizontal transfer mechanism 610 is connected to the tail end of the conveying module 100. The lower end of the first vertical transfer mechanism 640 is connected to the tail end of the first horizontal transfer mechanism 610. The upper end of the first vertical transfer mechanism 640 is connected to the first end of the second horizontal transfer mechanism 620. The upper end of the second vertical transfer mechanism 650 is connected to the tail end of the second horizontal transfer mechanism 620. The lower end of the second vertical transfer mechanism 650 is connected to the first end of the third horizontal transfer mechanism 630. The second horizontal transfer mechanism 620 can be docked with a solder resist ink spraying equipment. When the lifting conveyor module 600 is working, the first horizontal transfer mechanism 610 can receive the PCB output by the conveyor module 100 and convey the PCB backward to the first vertical transfer mechanism 640. Then, the first vertical transfer mechanism 640 can convey the PCB upward to the second horizontal transfer mechanism 620. Next, the second horizontal transfer mechanism 620 can convey the PCB backward to the second vertical transfer mechanism 650. Immediately afterwards, the second vertical transfer mechanism 650 can drive the PCB downward to the third horizontal transfer mechanism 630. Finally, the third horizontal transfer mechanism 630 can convey the PCB backward to the next process. Furthermore, the PCB output by the conveying module 100 can sequentially pass through the first horizontal transfer mechanism 610 and the first vertical transfer mechanism 640 before moving to the second horizontal transfer mechanism 620, thereby raising the height of the PCB. At the same time, since the height of the second horizontal transfer mechanism 620 is higher than that of the first horizontal transfer mechanism 610 and the third horizontal transfer mechanism 630, a channel can be formed below the second horizontal transfer mechanism 620. The operator can use the channel to cross the PCB conveying system of this embodiment, so that the operator can bypass the PCB conveying system of this embodiment without walking an extra distance.

[0083] Further reference Figure 9In some embodiments, the first horizontal transfer mechanism 610 may also include a support component 220 as described in the above embodiments and two sets of conical rollers. The two sets of conical rollers are distributed in the left-right direction, and each set of conical rollers includes multiple conical rollers 120 spaced apart in the front-back direction. The common upper tangent of each conical roller 120 in the same set of conical rollers forms an inclined conveying surface, and the lower sides of the two conveying surfaces are close to each other. The support component 220 is disposed between the two conveying surfaces. The support component 220 includes a carrier member 221 that is slidably disposed in the front-back direction. The two conveying surfaces can respectively carry the PCB on both sides in the left-right direction, and under the drive of the conical rollers, the PCB can move from front to back. The carrier member 221 can lift the middle part of the PCB and can follow the PCB from front to back. The specific structure of the third horizontal transfer mechanism 630 is the same as that of the first horizontal transfer mechanism 610.

[0084] Further reference Figure 9 In some embodiments, the first vertical transfer mechanism 640 includes a loading clamping structure 641 and a first lifting structure 642. The output end of the first lifting structure 642 is connected to the loading clamping structure 641 and can drive the loading clamping structure 641 to perform lifting movements. The loading clamping structure 641 can clamp or release the PCB. The second vertical transfer mechanism 650 includes a unloading clamping structure 651 and a second lifting structure 652. The output end of the second lifting structure 652 is connected to the unloading clamping structure 651 and can drive the unloading clamping structure 651 to perform lifting movements. The unloading clamping structure 651 can clamp or release the PCB.

[0085] Further reference Figure 9 In some embodiments, the second horizontal transfer mechanism 620 includes a drive structure and a transverse structure 621. The output end of the drive structure is connected to the transverse structure 621 and is capable of driving the transverse structure 621 to move in the front-back direction.

[0086] The following describes the working process of the lifting conveyor module 600 using a specific embodiment: The conveyor module 100 conveys the PCB to the two conveying surfaces of the first horizontal transfer mechanism 610. Driven by the conical roller assembly, the PCB moves from front to back along the conveying surface to the tail end of the first horizontal transfer mechanism 610, and is transferred to the loading clamping structure 641. During this process, the carrier 221 of the first horizontal transfer mechanism 610 can lift the middle part of the PCB and move with the PCB from front to back. Then, driven by the first lifting structure 642, the loading clamping structure 641... 1. The PCB is moved upward to transfer it onto the transverse structure 621. Then, driven by the drive structure, the transverse structure 621 moves the PCB backward to transfer it onto the unloading clamping structure 651. Afterward, driven by the second lifting structure 652, the unloading clamping structure 651 moves the PCB downward to transfer it onto the conveying surface of the third horizontal transfer mechanism 630. The carrier 221 of the third horizontal transfer mechanism 630 lifts the middle of the PCB. Then, the PCB can be conveyed backward to the next process under the drive of the conical roller group.

[0087] The following reference Figure 10 and Figure 11 The PCB conveying method according to the second aspect of the present invention will be described in detail.

[0088] The PCB conveying method according to a second aspect of the present invention includes, but is not limited to, the following steps:

[0089] Step S100: During the PCB transport process, two sets of inclined and mutually close transport surfaces support the PCB at the two edges in the transport path width direction, and lift the PCB at the middle in the transport path width direction in a frictionless and / or non-contact manner.

[0090] It is understandable that by having two sets of inclined and close-to-each-side conveyor surfaces support the PCB at its two edges along the width of the conveyor path, the contact area between the conveyor surfaces and the PCB can be reduced, thereby reducing wear on the PCB surface during transport. By lifting the PCB in a frictionless and / or contactless manner at the center of the conveyor path, the degree of downward concavity of the PCB center during transport can be reduced while minimizing wear on the PCB surface, thus enabling the transport of thinner PCBs.

[0091] It should be noted that the PCB can be transported using the conical roller group in the first aspect embodiment of the present invention, and the transport surface can be the common upper tangent surface of each conical roller in the conical roller group; in some other cases, the PCB can also be transported using a cylindrical roller group, in which case each roller in the roller group is inclined, and the common upper tangent surface of each roller in the roller group forms the transport surface.

[0092] Furthermore, in some embodiments, regarding step S100, lifting the PCB in a frictionless and / or contactless manner at the center of the transport path width includes, but is not limited to, the following steps:

[0093] Step S110a: Blow air upwards from below the PCB and lift the PCB in the middle of the transport path width direction without contact using the airflow.

[0094] It is understandable that by lifting the PCB with airflow to the middle of the conveying path width, the airflow causes less damage to the PCB surface, thereby reducing damage to the PCB surface during conveying.

[0095] It should be noted that the PCB in the middle of the transport path width direction can be lifted without contact by the air flotation component 210 in the first aspect embodiment of the present invention. The air flotation component 210 can output airflow from the bottom of the PCB to support the PCB in the middle of the transport path width direction through airflow.

[0096] Alternatively, in some other embodiments, regarding step S100, lifting the PCB in a frictionless and / or contactless manner at the center of the transport path width includes, but is not limited to, the following steps:

[0097] Step S110b: The PCB is lifted by the carrier 221 at the middle of the width of the conveying path, and the carrier 221 is driven to move along the conveying path with the PCB.

[0098] It is understandable that by lifting the PCB at the middle of the width direction of the conveying path by the carrier 221 and driving the carrier 221 to move together with the PCB along the conveying path, the relative displacement between the PCB and the carrier 221 during the conveying process can be reduced, thereby reducing the damage to the PCB surface by the carrier 221 and ensuring the surface quality of the PCB.

[0099] It should be noted that the PCB in the middle of the conveying path width direction can also be supported without friction by the support component 220 in the first aspect embodiment of the present invention. The support component 220 includes a carrier 221, which can move along the conveying path while supporting the PCB in the middle of the conveying path width direction. Of course, in some other cases, other mechanisms can also be used to support the PCB in the middle of the conveying path width direction, as long as there is no friction between the mechanism and the PCB.

[0100] Alternatively, in some other embodiments, reference is made to... Figure 10 Regarding step S100, lifting the PCB in a frictionless and / or contactless manner at the center of the transport path width includes, but is not limited to, the following steps:

[0101] Step S110c: When the PCB is gradually conveyed into the beginning of the conveying path, air is blown from below the PCB upwards, and the PCB is lifted without contact in the middle of the conveying path width direction by the airflow.

[0102] Step S120c: After the PCB has fully entered the beginning of the conveying path, the carrier 221 lifts the PCB to the middle of the width direction of the conveying path and drives the carrier 221 to move along the conveying path with the PCB.

[0103] It should be noted that the PCB can be transported using the conveying module 100 of the first aspect embodiment of the present invention, with the first end of the conveying module 100 and the first end of the conveying path at the same position; as the PCB gradually enters the first end of the conveying path, the PCB can be lifted without contact at the middle part of the conveying path width direction using the air flotation component 210 of the first aspect embodiment of the present invention; after the PCB has completely entered the first end of the conveying path, the PCB can also be lifted without friction at the middle part of the conveying path width direction using the support component 220 of the first aspect embodiment of the present invention.

[0104] Understandably, as the PCB gradually enters the beginning of the conveying path, it is in a moving state. The moving speed of the support component 221 is difficult to keep up with the moving speed of the PCB. If the support component 221 is used to support the PCB when it gradually enters the beginning of the conveying path, the PCB is prone to relative sliding with the support component 221, thereby damaging the PCB. However, by placing the air flotation component 210 at the inlet end of the conveying module 100, the air flotation component 210 can output airflow upwards during the process of the PCB entering the conveying module 100, so as to support the PCB by airflow. Since there is a gap between the air flotation component 210 and the PCB, the air flotation component 210 and the PCB do not contact each other throughout the process. Thus, the PCB can be supported in the middle of the width direction of the conveying path, thereby reducing the damage to the PCB surface. Since the stability of the airflow output by the air flotation component 210 is relatively poor, after the PCB has completely entered the conveying module 100, the support component 221 of the support component 220 can support the PCB, thereby improving the stability of the PCB during the movement process.

[0105] In some embodiments of the present invention, the conveying path includes an infeed section and an adjustment section with independently adjustable conveying width, and the infeed section is located at the beginning of the conveying path, as shown in the reference. Figure 11 The PCB conveying method according to the second aspect of the present invention further includes, but is not limited to, the following steps:

[0106] Step S210: Obtain the dimensions of the PCB to be input; wherein, the dimensions of the PCB to be input in the direction parallel to the width of the conveying path are denoted as D1, and the dimensions in the direction parallel to the extension of the conveying path are denoted as D2;

[0107] Step S220: Determine whether D1 exceeds the preset range;

[0108] Step S230a: If D1 is within the preset range, adjust the conveying width of the board entry section and the adjustment section according to D1 so that the board entry section and the adjustment section can adapt to the conveying of the PCB to be input, and so that the PCB can be directly conveyed from the board entry section to the adjustment section.

[0109] Step S230b: If D1 exceeds the preset range, adjust the conveying width of the board entry section according to D1 so that the board entry section can adapt to the conveying of the PCB to be input. Adjust the conveying width of the adjustment section according to D2, and rotate the PCB 90° after it is input into the board entry section, and then place it on the adjustment section to continue conveying.

[0110] It should be noted that the feeding section may correspond to the first width adjustment mechanism and two first conveying mechanisms 111 in the first aspect embodiment of the present invention, and the adjustment section may correspond to the second width adjustment mechanism and two second conveying mechanisms 112 in the first aspect embodiment of the present invention.

[0111] It should be noted that the board picking adjustment module 400 in the first aspect embodiment of the present invention can be used to rotate the PCB by 90°.

[0112] It is understandable that PCBs are transported into the board feeding section along their long sides. For larger PCBs, the dimensions in the width direction of the transport path are larger, making it inconvenient for subsequent solder resist ink spraying equipment to spray solder resist ink onto them. In the PCB transport method of this invention, by rotating such PCBs 90° and placing them back on the transport path, the PCB transport method along its long side can be adjusted to transport along its short side. This ensures that the dimensions of the PCB in the width direction of the transport path are within a preset range, thereby facilitating the subsequent solder resist ink spraying equipment to spray solder resist ink onto such PCBs.

[0113] Although embodiments of the invention have been shown and described, those skilled in the art will understand that various changes, modifications, substitutions and alterations can be made to these embodiments without departing from the principles and spirit of the invention, the scope of which is defined by the claims and their equivalents.

Claims

1. A PCB conveying system, characterized in that, include: A conveying module is set along a preset conveying path and used to convey PCBs. The conveying module has two sets of inclined conveying surfaces. The two sets of conveying surfaces are respectively located on both sides in the width direction of the conveying path, and the lower sides of the two sets of conveying surfaces are close to each other, so that the two sets of conveying surfaces can respectively support the two edges of the PCB in the width direction of the conveying path. A pallet module is provided along the conveying path and is used to lift the PCB at the middle of the width direction of the conveying path without friction and / or without contact during the conveying of the PCB along the conveying path. The pallet module includes an air flotation component and a support component. The air flotation component is located below the gap between the two sets of conveying surfaces and is disposed at the inlet end of the conveying module. The air flotation component can blow air upward to lift the PCB in the middle of the conveying path width direction without contact. The support component includes a carrier, a lifting mechanism, and a transfer mechanism. The carrier is used to lift the PCB in the middle of the conveying path width direction, and the carrier is slidably disposed along the conveying path to follow the PCB along the conveying path. The lifting mechanism and the transfer mechanism are connected to each other. The transfer mechanism is used to drive the carrier to move along the conveying path and can drive the carrier to move to the inlet end of the conveying module. The lifting mechanism is used to drive the carrier to rise and fall to lift or detach from the PCB. The supporting assembly further includes a first distance adjustment mechanism. The supporting assembly includes two carriers and two lifting mechanisms. The output ends of the two lifting mechanisms are respectively connected to the two carriers. The two lifting mechanisms are configured with an adjustable position in the length direction of the conveying path. The first distance adjustment mechanism is connected to at least one of the two lifting mechanisms and is capable of adjusting the distance between the two lifting mechanisms.

2. The PCB conveying system according to claim 1, characterized in that, It also includes a width adjustment module and a board picking adjustment module. The conveying module includes two conveying components that can move closer to or further away from each other, and two sets of conveying surfaces are respectively formed on the two conveying components. The width adjustment module is connected to at least one of the conveying components and is used to adjust the relative distance between the two conveying components. The board picking adjustment module is located on one side of the conveying module and is capable of picking up the PCB on the conveying path, rotating it horizontally, and then putting it back.

3. A PCB conveying system according to claim 2, characterized in that, The conveying assembly includes a first conveying mechanism and a second conveying mechanism distributed along the conveying path. The first conveying mechanism is located at the entrance end of the conveying module. The distance between the two first conveying mechanisms and the distance between the two second conveying mechanisms are independently adjustable. The board picking adjustment module can pick up the PCB on the first conveying mechanism, rotate it horizontally, and place it on the second conveying mechanism.

4. A PCB conveying system according to claim 3, characterized in that, The conveying assembly further includes a third conveying mechanism, which is located on the side of the second conveying mechanism away from the first conveying mechanism, and the distance between the two third conveying mechanisms can be independently adjusted.

5. A PCB conveying system according to claim 2, characterized in that, It also includes a temporary storage module, which is located on one side of the conveying module, and the board picking adjustment module can pick up the PCB from the conveying path and place it in the temporary storage module.

6. A PCB conveying system according to any one of claims 1 to 5, characterized in that, It also includes a lifting and conveying module. Along the conveying direction of the PCB, the lifting and conveying module is located behind the conveying module and has a passage at the bottom that allows operators to pass through. The lifting and conveying module is used to lift the PCB to a certain height so that the PCB can pass over the passage from above and continue to be conveyed to the rear.

7. A PCB conveying method, characterized in that, Applied to the PCB transport system as described in any one of claims 1 to 6, the PCB transport method includes the following steps: During PCB transport, two sets of inclined, close-to-each-side transport surfaces support the two edges of the PCB along the width of the transport path, and lift the middle of the PCB along the width of the transport path in a frictionless and / or contactless manner. Lifting the middle of the PCB along the width of the transport path in a frictionless and / or contactless manner includes the following steps: as the PCB gradually enters the beginning of the transport path, air is blown upwards from below the PCB, and the airflow lifts the middle of the PCB along the width of the transport path without contact; after the PCB has completely entered the beginning of the transport path, a carrier lifts the middle of the PCB along the width of the transport path, and drives the carrier to move along the transport path with the PCB.

8. A PCB conveying method according to claim 7, characterized in that, The conveying path includes an infeed section and an adjustment section with independently adjustable conveying width, and the infeed section is located at the beginning of the conveying path; The PCB delivery method also includes the following steps: Obtain the dimensions of the PCB to be input; wherein, the dimensions of the PCB to be input in the direction parallel to the width of the transport path are denoted as D1, and the dimensions in the direction parallel to the extension of the transport path are denoted as D2; Determine if D1 exceeds the preset range; If D1 is within the preset range, the conveying width of the board feeding section and the adjustment section is adjusted according to D1 so that the board feeding section and the adjustment section can adapt to the conveying of the PCB to be input, and so that the PCB is directly conveyed from the board feeding section to the adjustment section. If D1 exceeds the preset range, the conveying width of the board feeding section is adjusted according to D1 so that the board feeding section can adapt to the conveying of the PCB to be input. The conveying width of the adjustment section is adjusted according to D2. After the PCB is input into the board feeding section, the PCB is rotated 90° and then placed on the adjustment section to continue conveying.

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