Aerogel full-edge packaging process and equipment

Through aerogel full-edge packaging equipment and processes, using components such as the lower mold and folding mold, the problem of overlapping PET layers in the aerogel packaging structure was solved, achieving fast and efficient packaging, and improving packaging strength and sealing.

CN117885431BActive Publication Date: 2025-09-26CHENGDU BOSHUO PRECISION ELECTRONICS CO LTD
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Patent Information

Application Number
CN202410104836.X
Authority / Receiving Office
CN · China
Patent Type
Patents(China)
Current Assignee / Owner
Filing Date
2024-01-25
Publication Date
2025-09-26
Estimated Expiration
2044-01-25

AI Technical Summary

Technical Problem

In the prior art, the overlapping PET layers at the edges of the aerogel packaging structure cannot be removed, resulting in the aerogel packaging structure being unable to be applied in high-precision applications.

Method used

By adopting aerogel full-edge packaging equipment and technology, and utilizing components such as the lower mold and folding mold, the silicone frame and the lower packaging film are restricted in shape and folded and hot-pressed to shorten the overlapping part and improve the packaging strength and efficiency.

Benefits of technology

It achieves fast and efficient packaging without manual calibration, improves the outer edge strength and shape retention of aerogel products, and enhances the sealing and strength of the packaging.

✦ Generated by Eureka AI based on patent content.

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Abstract

The present invention relates to the technical field of aerogel edge wrapping, and specifically to an aerogel full-edge encapsulation device, including: a hot press and a lower mold inside it. A lower encapsulation film is laid flat and conveyed on the top of the lower mold, and an assembly groove is opened on the top of the lower mold below the lower encapsulation film; a downward hot pressing mold, which can press and embed a silica gel frame into the assembly groove, and restrict and convert the lower encapsulation film into a U-shaped state with the opening facing upwards. The downward hot pressing mold can perform film encapsulation on the opening of the U-shaped state; a hemming mold, which can perform hemming hot pressing on the lower encapsulation film on both sides of the silica gel frame. The present invention can quickly and efficiently encapsulate the silica gel frame, improving the encapsulation efficiency. Secondly, by using the hemming mold, the excess lower encapsulation film in the U-shaped state can be folded and hot pressed and adhered, enhancing the sealing and encapsulation strength between the lower encapsulation film and the silica gel frame.
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Description

Technical Field

[0001] The present invention relates to the technical field of aerogel edge wrapping, and specifically to an aerogel full-edge encapsulation process and equipment. Background Art

[0002] Aerogel is a thermal insulation material. Compared with traditional materials such as asbestos and fiberglass, it has a lower thermal conductivity and stronger flame retardant ability. Therefore, its application in the fields of battery thermal insulation and fire prevention is relatively prominent.

[0003] In the prior art, such as a patent for a flame retardant and thermal insulation aerogel blanket for power batteries and its encapsulation process in China, the silica aerogel is cut into sheet-like blanket pieces, and two PETs coated with glue are used to sandwich the blanket pieces to form an intermediate with a three-layer structure of the first PET layer - blanket piece layer - second PET layer. The intermediate is compressed and encapsulated through an encapsulation mold at a set temperature, and then cured and formed to obtain a flame retardant and thermal insulation aerogel blanket for power batteries. In this encapsulation structure of the aerogel, there will be overlapping PET layers at the four peripheral edges of the encapsulated aerogel product. This part plays a role in sealing and bearing pressure. However, in actual use, for this overlapping part, trimming such as cutting cannot be performed, resulting in its inapplicability to high-precision occasions.

[0004] The patent publication number of the above cited document is: CN116766726A. Summary of the Invention

[0005] The present invention provides an aerogel full-edge encapsulation process and equipment, which can quickly and efficiently encapsulate the silicone frame, improve the encapsulation efficiency. Secondly, by using a hemming mold, the redundant lower encapsulation film in the U-shaped state can be hemmed and thermally pressed and adhered, enhancing the sealing and encapsulation strength between the lower encapsulation film and the silicone frame.

[0006] To achieve the above object, the present invention provides the following technical solutions:

[0007] An aerogel full-edge encapsulation equipment, comprising:

[0008] A hot press and the lower mold inside it. The lower encapsulation film is laid flat and conveyed on the top of the lower mold, and an assembly groove is opened on the top of the lower mold below the lower encapsulation film; A downward hot pressing mold, which can press and embed the silicone frame into the assembly groove, and restrict and convert the lower encapsulation film into a U-shaped state with the opening facing upwards. The downward hot pressing mold can perform film encapsulation on the opening of the U-shaped state; A hemming mold, which can perform hemming and thermal pressing on the lower encapsulation film on both sides of the silicone frame.

[0009] Optionally, the hemming die includes an assembly plate slidably and embeddedly mounted on the top of the lower die. The bottom plane of the assembly plate is flush with the top plane of the silica gel frame, and the assembly plate can slide over to the top of the silica gel frame after film encapsulation. In the U-shaped state, the top of the assembly plate is covered by the lower encapsulation film.

[0010] Optionally, a second heating plate is fixedly installed inside the assembly plate. A chute is formed in the top of the lower die, and an electronic slider is slidably installed inside the chute. The electronic slider is fixedly connected to the assembly plate, and the traveling distance of the assembly plate is greater than the wall thickness of the border of the silica gel frame.

[0011] Optionally, the hemming die includes a wing plate rotatably mounted on the top of the lower die. When the wing plate is in the vertical state, the outer wall of the wing plate cooperates with the inner wall of the assembly groove to limit the lower encapsulation film to a U-shaped state. When the wing plate rotates, the outer wall of the lowest part of the wing plate is at the same horizontal plane as the top of the silica gel frame.

[0012] Optionally, a third heating plate is installed inside the wing plate. An electromagnetic bearing is installed on the lower die, and a rotor is rotatably installed inside the electromagnetic bearing. The wing plate is fixedly installed on the outer wall of the rotor, and the part of the wing plate exceeding the border of the lower die is greater than the border thickness of the silica gel frame.

[0013] Optionally, a concave plate cavity is formed inside the lower die, and a concave first heating plate is installed inside the plate cavity. The heating range of the first heating plate covers the inner wall of the assembly groove. The lower die on both sides of the opening of the first heating plate is configured with an opening design, and the opening design provides a discharging path for the encapsulated silica gel frame.

[0014] Optionally, the downward hot pressing die includes an upper die, which is slidably mounted up and down on a hot press. Two assembly rollers are rotatably mounted on the upper die through bearing seats. The two assembly rollers are symmetrically designed, and an upper encapsulation film is conveyed horizontally between the two assembly rollers. The bottom of the upper die is designed with a convex part, and the convex part extends the upper encapsulation film downward into a convex shape, and the bottom of the convex part is assembled and matched with the assembly groove. A fourth heating plate is installed inside the upper die.

[0015] Optionally, a hydraulic system is installed inside the hot press. A plurality of guide columns are designed on the hot press, and the upper die is slidably mounted vertically on the outer walls of the plurality of guide columns. The output end of the hydraulic system controls the overall downward movement and pressing of the upper die.

[0016] Aerogel full-edge encapsulation process, which includes the aerogel full-edge encapsulation equipment, and also includes an aerogel felt bonded inside the silica gel frame to form a heat insulation body, and includes the following steps:

[0017] S1. Use a manipulator or electrical tooling to place the heat insulation body on top of the lower encapsulation film being conveyed flat. The PET layer of the lower encapsulation film contacts the bottom of the heat insulation body, and ensure that the outer frame part of the heat insulation body is directly above the assembly groove;

[0018] S2. Drive the downward hot pressing die to displace downward. Through the heat insulation body, the lower encapsulation film is restricted to a U-shaped state with the opening facing upward, so that the PET layer of the lower encapsulation film fits against the bottom of the heat insulation body, and the downward hot pressing die makes the upper encapsulation film fit against the top of the heat insulation body;

[0019] S3. After hot pressing and encapsulation, control the hemming die to perform hemming and hot pressing on the part of the lower encapsulation film that extends beyond the heat insulation body towards the top of the heat insulation body, improving the encapsulation strength of the heat insulation body.

[0020] Specifically, in S2, it further includes:

[0021] V1. The upper die restricts the upper encapsulation film to a downward convex state, and makes the convex part of the upper encapsulation film flat, so as to facilitate matching with the top of the heat insulation body;

[0022] V2. The hydraulic system controls the upper die and the upper encapsulation film thereon to displace downward, completing the fitting and hot pressing processes;

[0023] V3. Hydraulic reset makes the PET layer of the upper encapsulation film separate from the base paper layer.

[0024] Compared with the prior art, the present invention provides an aerogel fully wrapped edge encapsulation device, which can enable the silicone frame to replace the overlapping part, and at the same time can shorten the originally longer overlapping part as much as possible. It can not only reduce the overlapping part, but also improve the encapsulation strength between the PET layer and the aerogel. At the same time, the silicone frame can also enhance the strength and shape retention of the outer edge of the aerogel. Secondly, through the cooperation of the lower die, the assembly groove and the downward hot pressing die, the silicone frame can be quickly and efficiently encapsulated, improving the encapsulation efficiency without manual calibration and fitting. Thirdly, by designing the hemming die, the excess lower encapsulation film in the U-shaped state can be hemmed and hot pressed for fitting, enhancing the sealing and encapsulation strength between the lower encapsulation film and the silicone frame. BRIEF DESCRIPTION OF THE DRAWINGS

[0025] Figure 1 is the external three-dimensional structure schematic diagram of the present invention;

[0026] Figure 2 is the structural assembly schematic diagram of the lower die and the hemming die in the first embodiment of the present invention;

[0027] Figure 3 is for the present invention Figure 2 right view structural schematic diagram;

[0028] Figure 4 is for the present invention Figure 3Schematic diagram of the structure viewed from the middle along AA;

[0029] Figure 5 This is a schematic diagram of the structure of the lower mold and the folding mold in Example 1 of the present invention;

[0030] Figure 6 This is a schematic diagram of the structural assembly of the lower die and the folding die in Example 2 of the present invention;

[0031] Figure 7 This is a schematic diagram of the state of the wing panel after flipping in the present invention;

[0032] Figure 8 Schematic diagram of the structure of the downward hot pressing mold in the present invention;

[0033] Figure 9 For the present invention Figure 8 Schematic diagram of the right view structure;

[0034] Figure 10 For the present invention Figure 9 Schematic diagram of the structure cut away at CC along the middle edge;

[0035] Figure 11 Schematic diagram of silica gel frame packaging of aerogel in the prior art.

[0036] In the figure: 1. Hot press; 2. Lower mold; 3. Assembly groove; 4. Lower packaging film; 5. Silicone frame; 6. Aerogel felt; 7. First heating plate; 8. Assembly plate; 9. Second heating plate; 11. Slide; 12. Electronic slider; 13. Wing plate; 14. Third heating plate; 15. Upper mold; 16. Upper packaging film; 17. Assembly roller; 18. Fourth heating plate. DETAILED DESCRIPTION

[0037] The following will clearly and completely describe the technical solutions in the embodiments of the present invention in conjunction with the accompanying drawings. Obviously, the described embodiments are only part of the embodiments of the present invention, not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without making creative efforts are within the scope of protection of the present invention.

[0038] See also Figures 1 to 11 The present invention provides a technical solution: an aerogel full-edge packaging device, comprising:

[0039] The hot press 1 and the lower die 2 inside it. The lower die 2 has a lower encapsulation film 4 laid flat and conveyed on its top. An assembly groove 3 is opened on the top of the lower die 2 below the lower encapsulation film 4; a downward hot pressing die, which can press and embed the silica gel frame 5 into the assembly groove 3, and restrict and convert the lower encapsulation film 4 into a U-shaped state with the opening facing upwards, and the downward hot pressing die can perform film encapsulation on the opening of the U-shaped state; a hemming die, which can perform hemming and hot pressing on the lower encapsulation film 4 on both sides of the silica gel frame 5.

[0040] In the prior art, in the encapsulation method of the PET layer - aerogel - PET layer structure, there will be overlapping parts around the aerogel, which is inconvenient for customers to handle and affects subsequent precise operations. In the present invention, by designing the silica gel frame 5, the silica gel frame 5 can replace the overlapping parts, and at the same time, the originally longer overlapping parts can be shortened as much as possible. It can not only reduce the overlapping parts, but also improve the encapsulation strength between the PET layer and the aerogel. At the same time, the silica gel frame 5 can also enhance the strength and shape retention of the outer edge of the aerogel. Secondly, through the cooperation of the lower die 2, the assembly groove 3 and the downward hot pressing die, the silica gel frame 5 can be quickly and efficiently encapsulated, improving the encapsulation efficiency without manual calibration and fitting. Thirdly, by designing the hemming die, the redundant lower encapsulation film 4 in the U-shaped state can be hemmed and hot pressed and adhered, improving the sealing and encapsulation strength between the lower encapsulation film 4 and the silica gel frame 5.

[0041] The following provides two implementation schemes of the hemming die:

[0042] Embodiment 1:

[0043] The hemming die includes an assembly plate 8 slidably installed in an embedded manner on the top of the lower die 2. The bottom plane of the assembly plate 8 is flush with the top plane of the silica gel frame 5, and the assembly plate 8 can slide over to the top of the silica gel frame 5 after film encapsulation. In the U-shaped state, the top of the assembly plate 8 is covered by the lower encapsulation film 4. Please refer to Figures 2 to 5 , in this embodiment, the hemming and hot pressing are carried out by translation. Specifically, by setting the assembly plate 8, the lower encapsulation film 4 exceeding the top of the lower die 2 is pushed and adhered to the top of the silica gel frame 5 by the translation of the assembly plate 8. Before this, the top and bottom of the silica gel frame 5 have both been completed with film encapsulation. At this time, the two ends of the lower encapsulation film 4 are used to cover and adhere the film on the upper layer of the silica gel frame 5, and then the adhered part is hot pressed by a hot pressing device, thereby improving the overall encapsulation quality and strength.

[0044] Among them, through the pushing of the assembly plate 8, uninterrupted right-angle encapsulation can be formed on both sides of the top of the silica gel frame 5. Based on the U-shaped state of the lower encapsulation film 4, all four edges on both sides of the silica gel frame 5 can be continuously covered without a disconnection process. Please refer to Figure 11, which is a defect of the existing encapsulation method. The weak area at the edge of the silicone frame 5 is the encapsulation weakness. In the present invention, by providing the lower encapsulation film 4 in a U-shaped state, the weak area will be covered by the lower encapsulation film 4 during encapsulation. At the same time, the folded part of the lower encapsulation film 4 can form a fitting assembly with the upper PET layer by using a hemming die, supplemented by hot pressing or glue coating, so as to ensure the firmness of the hemmed part and improve the quality and strength of the overall encapsulation.

[0045] On the basis of Embodiment 1, a second heating plate 9 is fixedly installed inside the assembly plate 8. A chute 11 is opened at the top of the lower die 2. An electronic slider 12 is slidably installed inside the chute 11. The electronic slider 12 is fixedly connected to the assembly plate 8. The travel distance of the assembly plate 8 is greater than the wall thickness of the border of the silicone frame 5. Please refer to Figures 2 to 5 , in this embodiment, through the cooperation of the chute 11, the electronic slider 12 and the assembly plate 8, the translation of the assembly plate 8 can be more easily controlled. At the same time, by designing the second heating plate 9, after hemming, the two PET layers can be thermally pressed together. It should be noted that before hemming, the downward hot pressing die needs to be withdrawn to peel off the PET layer and the base paper.

[0046] Embodiment 2:

[0047] The hemming die includes a wing plate 13 rotatably installed on the top of the lower die 2. When the wing plate 13 is in a vertical state, the outer wall of the wing plate 13 cooperates with the inner wall of the assembly groove 3 to limit the lower encapsulation film 4 to a U-shaped state. When the wing plate 13 rotates, the outer wall of the lowest part of the wing plate 13 is at the same horizontal plane as the top of the silicone frame 5. Please refer to Figure 6 and Figure 7 , different from Embodiment 1, the hemming method adopted in this embodiment is a flipping method. When the lower encapsulation film 4 is in a U-shaped state with the opening facing up, the wing plate 13 serves as a fitting part for the U-shaped state of the lower encapsulation film 4. When the hot pressing encapsulation is completed, the wing plate 13 is transformed from a fitting part to a functional part. At this time, the wing plate 13 deflects, driving the part of the lower encapsulation film 4 extending beyond the top of the silicone frame 5 to rotate, so that the PET layer of the lower encapsulation film 4 can be hemmed and cover the top of the silicone frame 5, so that the PET layer can be adhesively encapsulated with the PET layer on the top of the hot-pressed silicone frame 5, and then the two can be fixed by hot pressing or glue coating.

[0048] On the basis of the second embodiment, a third heating plate 14 is installed inside the wing plate 13, an electromagnetic bearing is installed on the lower die 2, a rotor is rotatably installed inside the electromagnetic bearing, the wing plate 13 is fixedly installed on the outer wall of the rotor, and the part of the wing plate 13 exceeding the frame of the lower die 2 is greater than the frame thickness of the silica gel frame 5. In this embodiment, the rotation of the wing plate 13 is controlled through the cooperation of the electromagnetic bearing and the rotor, so as to accurately control the flipping angle of the wing plate 13. Secondly, the length of the wing plate 13 can ensure that the hot pressing range is sufficient to ensure the strength of the edge folding hot pressing. In this process, since the top of the silica gel frame 5 has been adhered to the single-layer PET layer during the initial hot pressing, and at this time, since the outer wall of the lowest part of the wing plate 13 and the top of the silica gel frame 5 are at the same horizontal plane, when the wing plate 13 is flipped to the horizontal state, the lower encapsulation film 4 has been pressed against this PET layer, thus completing the hot pressing with high quality without the need to set up a tooling.

[0049] In the first and second embodiments, both ends of the lower encapsulation film 4 are connected to a conveying device or a material pulling device with a tension structure to ensure that the lower encapsulation film 4 can be kept in a taut state during the downward displacement of the silica gel frame 5.

[0050] In a more preferred embodiment, a concave plate cavity is opened inside the lower die 2, and a concave first heating plate 7 is installed inside the plate cavity. The heating range of the first heating plate 7 covers the inner wall of the assembly groove 3. The lower die 2 on both sides of the opening of the first heating plate 7 is configured with an opening design, and the opening design provides a discharging path for the encapsulated silica gel frame 5.

[0051] In a more preferred embodiment, the downward hot pressing die includes an upper die 15. The upper die 15 is slidably installed up and down on the hot press 1. Two assembly rollers 17 are rotatably installed on the upper die 15 through bearing seats. The two assembly rollers 17 are symmetrically designed. An upper encapsulation film 16 is conveyed flatly between the two assembly rollers 17. The bottom of the upper die 15 is designed with a convex part. The convex part extends the upper encapsulation film 16 downward into a convex shape, and the bottom of the convex part is assembled and matched with the assembly groove 3. A fourth heating plate 18 is installed inside the upper die 15. Please refer to Figures 8 to 10 , in this embodiment, through the cooperation of the convex part of the upper die 15 and the upper encapsulation film 16, a part of the upper encapsulation film 16 can protrude downward. The PET layer of the protruding part of the upper encapsulation film 16 can follow the downward displacement of the upper die 15 to be adhered to the top of the silica gel frame 5, thus completing accurate hot pressing. In this process, the upper die 15 will also first displace the silica gel frame 5 loaded with the aerogel felt 6 downward to drive the lower encapsulation film 4 into a U-shaped state with the opening facing upward, and then complete the encapsulation structure and perform hot pressing and fixing. Similarly, both ends of the upper encapsulation film 16 are associated with a feeding and discharging device with a tension mechanism. <​​​, a hydraulic system is installed inside the hot press 1. Multiple guide columns are designed on the hot press 1. The upper die 15 is vertically and slidably installed on the outer walls of the multiple guide columns. The output end of the hydraulic system controls the downward movement and pressure application of the overall upper die 15.

[0053] With the cooperation of the above structures, the silica gel frame can be encapsulated quickly and efficiently, improving the encapsulation efficiency. Secondly, with the hemming die, the excess lower encapsulation film 4 in the C-shaped state can be hemmed and thermally pressed and bonded, enhancing the sealing and encapsulation strength between the lower encapsulation film 4 and the silica gel frame 5.

[0054] An aerogel full-edge encapsulation process further includes an aerogel felt 6 bonded inside the silica gel frame 5 to form a heat insulation body, and includes the following steps:

[0055] S1, use a manipulator or an electrical tooling fixture to place the heat insulation body on the top of the flatly conveyed lower encapsulation film 4. The PET layer of the lower encapsulation film 4 contacts the bottom of the heat insulation body, and ensure that the outer frame part of the heat insulation body is directly above the assembly groove 3;

[0056] S2, drive the downward hot pressing die to move downward. Through the heat insulation body, the lower encapsulation film 4 is restricted to a C-shaped state with the opening facing upward, so that the PET layer of the lower encapsulation film 4 is bonded to the bottom of the heat insulation body, and the downward hot pressing die makes the upper encapsulation film 16 bonded to the top of the heat insulation body;

[0057] S3, after hot press encapsulation, control the hemming die to fold and thermally press the part of the lower encapsulation film 4 that exceeds the heat insulation body towards the top of the heat insulation body to improve the encapsulation strength of the heat insulation body.

[0058] Specifically, in S2, it further includes:

[0059] V1, the upper die 15 restricts the upper encapsulation film 16 to a downward convex state, and makes the convex part of the upper encapsulation film 16 a flat surface to facilitate matching with the top of the heat insulation body;

[0060] V2, the hydraulic system controls the upper die 15 and the upper encapsulation film 16 thereon to move downward to complete the bonding and hot pressing process;

[0061] V3, hydraulic reset to separate the PET layer of the upper encapsulation film 16 from the base paper layer.

[0062] In this process, the automatic operation of the aerogel full-edge encapsulation equipment can be used for fast, efficient and accurate assembly and hot press encapsulation, which not only improves the encapsulation efficiency but also enhances the product quality.

[0063] The standard parts used in this embodiment can be purchased directly from the market, and the non-standard structural components recorded in the specification and drawings can also be directly processed according to existing technical common sense without any doubt. At the same time, the connection method of each component adopts the mature conventional means in the existing technology, and the machinery, parts and equipment all adopt conventional models in the existing technology, so no specific description will be given here.

[0064] While embodiments of the present invention have been shown and described, it will be appreciated by those skilled in the art that various changes, modifications, substitutions, and variations may be made to these embodiments without departing from the principles and spirit of the invention, and that the scope of the invention is defined by the appended claims and their equivalents.

Claims

1. An aerogel full-edge packaging device, characterized by: Comprising: A hot press (1) and a lower die (2) inside it. The lower die (2) has a lower encapsulation film (4) laid flat and conveyed on its top. An assembly groove (3) is opened on the top of the lower die (2) below the lower encapsulation film (4). A downward hot pressing die, which can press and embed a silica gel frame (5) into the assembly groove (3), limit the lower encapsulation film (4) and convert it into a U-shaped state with the opening facing upwards, and the downward hot pressing die can perform film encapsulation on the opening of the U-shaped state. A hemming die, which can perform hemming hot pressing on the lower encapsulation film (4) on both sides of the silica gel frame (5). The hemming die includes an assembly plate (8) slidably installed in an embedded manner on the top of the lower die (2). The bottom plane of the assembly plate (8) is flush with the top plane of the silica gel frame (5), and the assembly plate (8) can slide over the top of the silica gel frame (5) after film encapsulation. In the U-shaped state, the top of the assembly plate (8) is covered by the lower encapsulation film (4). A second heating plate (9) is fixedly installed inside the assembly plate (8). A chute (11) is opened on the top of the lower die (2). An electronic slider (12) is slidably installed inside the chute (11). The electronic slider (12) is fixedly connected to the assembly plate (8). The travel distance of the assembly plate (8) is greater than the wall thickness of the border of the silica gel frame (5).

2. An aerogel full-edge packaging device, characterized by: Comprising: A hot press (1) and a lower die (2) inside it. The lower die (2) has a lower encapsulation film (4) laid flat and conveyed on its top. An assembly groove (3) is opened on the top of the lower die (2) below the lower encapsulation film (4). A downward hot pressing die, which can press and embed a silica gel frame (5) into the assembly groove (3), limit the lower encapsulation film (4) and convert it into a U-shaped state with the opening facing upwards, and the downward hot pressing die can perform film encapsulation on the opening of the U-shaped state. A hemming die, which can perform hemming hot pressing on the lower encapsulation film (4) on both sides of the silica gel frame (5). The hemming die includes a wing plate (13) rotatably installed on the top of the lower die (2). When the wing plate (13) is in a vertical state, the outer wall of the wing plate (13) cooperates with the inner wall of the assembly groove (3) to limit the lower encapsulation film (4) to a U-shaped state. When the wing plate (13) rotates, the outer wall at the lowest part of the wing plate (13) is at the same horizontal plane as the top of the silica gel frame (5). A third heating plate (14) is installed inside the wing plate (13). The lower die (2) is equipped with an electromagnetic bearing, and a rotor is rotatably installed inside the electromagnetic bearing. The wing plate (13) is fixedly installed on the outer wall of the rotor. The part of the wing plate (13) exceeding the border of the lower die (2) is greater than the border thickness of the silica gel frame (5).

3. The aerogel full-edge packaging device according to claim 1 or 2, characterized in that: A concave plate cavity is opened inside the lower die (2). A concave first heating plate (7) is installed inside the plate cavity. The heating range of the first heating plate (7) covers the inner wall of the assembly groove (3). The lower die (2) on both sides of the opening of the first heating plate (7) is configured with an opening design, and the opening design provides a discharge path for the encapsulated silica gel frame (5).

4. The aerogel full-edge packaging device according to any one of claims 1 to 3, characterized in that: The downward hot pressing die includes an upper die (15), the upper die (15) is vertically slidably mounted on a hot press (1), two assembly rollers (17) are rotatably mounted on the upper die (15) through bearing seats, the two assembly rollers (17) are symmetrically designed, an upper encapsulation film (16) is conveyed flatly between the two assembly rollers (17), a convex portion is designed at the bottom of the upper die (15), the convex portion extends the upper encapsulation film (16) downward into a convex shape, and the bottom of the convex portion is assembled and mated with an assembly groove (3), and a fourth heating plate (18) is installed inside the upper die (15).

5. The aerogel full-edge packaging device according to claim 4, characterized in that: A hydraulic system is installed inside the hot press (1), a plurality of guide columns are designed on the hot press (1), the upper die (15) is vertically slidably mounted on the outer walls of the plurality of guide columns, and the output end of the hydraulic system controls the overall downward movement and pressing of the upper die (15).

6. An aerogel full-edge packaging process, comprising the aerogel full-edge packaging device as claimed in claim 5, and further comprising an aerogel felt (6) bonded to the inside of the silica gel frame (5) to form a heat insulator, characterized in that: It includes the following steps: S1. Use a manipulator or an electric tooling device to place the heat insulator on the top of the flatly conveyed lower encapsulation film (4), the PET layer of the lower encapsulation film (4) contacts the bottom of the heat insulator, and ensure that the outer frame part of the heat insulator is directly above the assembly groove (3); S2. Drive the downward hot pressing die to move downward, limit the lower encapsulation film (4) to a U-shaped state with the opening facing upward through the heat insulator, make the PET layer of the lower encapsulation film (4) fit the bottom of the heat insulator, and the downward hot pressing die makes the upper encapsulation film (16) fit the top of the heat insulator; S3. After hot pressing and encapsulation, control the hemming die to hem and thermally press the part of the lower encapsulation film (4) exceeding the heat insulator to the top of the heat insulator to improve the encapsulation strength of the heat insulator.

7. The aerogel full-edge packaging process according to claim 6, characterized in that: In S2, it further includes: V1. The upper die (15) limits the upper encapsulation film (16) to a downward convex state, and makes the convex part of the upper encapsulation film (16) flat, so as to be matched with the top of the heat insulator; V2. The hydraulic system controls the upper die (15) and the upper encapsulation film (16) thereon to move downward to complete the fitting and hot pressing processes; V3. Hydraulic reset to separate the PET layer of the upper encapsulation film (16) from the base paper layer.

Citation Information

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