Dimming piece, manufacturing method thereof, light-transmitting assembly, and vehicle

Abstract

A dimming element (110) includes a first electrode (111), a second electrode (112), and a dimming film (113). The dimming film (113) includes a first substrate (1131a), a first conductive layer (1131b), a dimming layer (1133), a second conductive layer (1132b), and a second substrate (1132a) stacked sequentially. The dimming layer (1133), the first conductive layer (1131b), and the second conductive layer (1132b) form a dimming layer... A receiving space (Z) is formed, and a first electrode (111) and a second electrode (112) are disposed within the receiving space (Z). The first electrode (111) is attached to the side of the first conductive layer (1131b) opposite to the first substrate (1131a) and is electrically connected to the first conductive layer (1131b). The second electrode (112) is attached to the side of the second conductive layer (1132b) opposite to the second substrate (1132a) and is electrically connected to the second conductive layer (1132b). The structural design of the dimming element (110) ensures that the dimming element (110) can function properly. A light-transmitting assembly (10) including the dimming element (110) and a vehicle (1) including the light-transmitting assembly (10) are also provided.

Description

Technical Field

[0001] This application relates to the field of vehicle parts technology, specifically to a dimming component and its manufacturing method, a light-transmitting component, and a vehicle. Background Technology

[0002] Vehicles are one of the most important means of transportation for humans. Some vehicles have dimming mechanisms in their windows, creating a more comfortable and luxurious driving environment. These dimming mechanisms are electronic light-control products, whose transparency can be controlled electronically. However, if the structure of the dimming mechanism is not properly designed, its function will be affected. Summary of the Invention

[0003] This application provides a dimming component and its manufacturing method, a light-transmitting component, and a vehicle. The structural design of the dimming component can ensure that the dimming component can perform its functions normally.

[0004] In a first aspect, this application provides a dimming device, the dimming device including a first electrode, a second electrode, and a dimming film, the dimming film including a first substrate, a first conductive layer, a dimming layer, a second conductive layer, and a second substrate stacked sequentially, the dimming layer, the first conductive layer, and the second conductive layer forming a receiving space, the first electrode and the second electrode being disposed in the receiving space, the first electrode being attached to the side of the first conductive layer opposite to the first substrate and electrically connected to the first conductive layer, and the second electrode being attached to the side of the second conductive layer opposite to the second substrate and electrically connected to the second conductive layer.

[0005] The containment space includes a first subspace and a second subspace space that are spaced apart, with the first electrode disposed in the first subspace and the second electrode disposed in the second subspace.

[0006] The dimming component further includes a first adhesive layer and a second adhesive layer. The first electrode is bonded to and electrically connected to the first conductive layer through the first adhesive layer, and the second electrode is bonded to and electrically connected to the second conductive layer through the second adhesive layer.

[0007] The dimming element has a sealing structure, at least a portion of which is arranged along the periphery of the dimming element, and a first substrate and a second substrate are connected at the sealing structure.

[0008] Secondly, this application also provides a method for manufacturing a dimming component, the method comprising:

[0009] A dimming film is provided, the dimming film comprising a first film layer, a dimming layer and a second film layer stacked thereon, the first film layer comprising a first substrate and a first conductive layer stacked thereon, the second film layer comprising a second substrate and a second conductive layer stacked thereon, the dimming layer being located between the first conductive layer and the second conductive layer, and the dimming film comprising a first region and a second region;

[0010] The first film layer and the second film layer located in the first region are peeled away from each other in a direction away from each other to expose the dimming layer in the first region;

[0011] Remove at least a portion of the dimming layer from the first conductive layer located in the first region;

[0012] A first electrode is attached to a first conductive layer located in the first region;

[0013] Remove at least a portion of the dimming layer from the second conductive layer located in the first region;

[0014] A second electrode is attached to a second conductive layer located in the first region.

[0015] The phrase "peeling the first film layer and the second film layer located in the first region away from each other in a direction away from each other to expose the dimming layer in the first region" includes:

[0016] The dimming film located in the first region is cut along a first preset path to form a first sub-region;

[0017] The first film layer and the second film layer located in the first sub-region are peeled away from each other in a direction away from each other to expose the dimming layer located in the first sub-region;

[0018] The dimming film located in the first region is cut along the second preset path to form the second sub-region;

[0019] The first and second films located in the second sub-region are peeled away from each other in a direction away from each other to expose the dimming layer located in the second sub-region.

[0020] Wherein, "removing at least a portion of the dimming layer on the first conductive layer located in the first region" includes:

[0021] Remove the dimming layer from the first conductive layer and the second conductive layer located in the first sub-region.

[0022] Wherein, "attaching a first electrode to a first conductive layer located in the first region" includes:

[0023] A first adhesive layer is formed on the surface of the first conductive layer located in the first region that is opposite to the first substrate, or a first adhesive layer is formed on the surface of the first electrode.

[0024] The first electrode is attached to the first conductive layer located in the first region via the first adhesive layer.

[0025] The phrase "attaching a second electrode to a second conductive layer located in the first region" is followed by:

[0026] A sealing structure is formed at the periphery of the dimming film, wherein a first substrate and a second substrate are connected at the sealing structure.

[0027] The phrase "forming a sealing structure around the periphery of the dimming film" includes:

[0028] Provide the first and second processed parts;

[0029] The dimming film is disposed between a first processing member and a second processing member, wherein the first processing member abuts against a first substrate of the dimming film, and the second processing member abuts against a second substrate of the dimming film;

[0030] A sealing structure is formed around the dimming film by the cooperation of the first and second processed parts, wherein the first processed part is rotatable and the second processed part is vibrating.

[0031] Thirdly, this application also provides a dimming component, the dimming component including a dimming film, the dimming film including a first substrate, a functional layer and a second substrate stacked sequentially; a sealing structure is provided around the functional layer, the sealing structure being formed by the first substrate and the second substrate wrapping the functional layer.

[0032] The first substrate and the second substrate each include a substrate body portion and a substrate edge portion. The functional layer is located between the substrate body portion of the first substrate and the substrate body portion of the second substrate. The substrate edge portion forms a sealing structure for covering the functional layer.

[0033] The sealing structure is formed by the mutual contact and melting of the first substrate and the second substrate.

[0034] At least one groove structure is provided on the outer edge of the dimming element, and the sealing structure is located at the groove structure.

[0035] The groove structure has a filling part on the side opposite to the sealing structure.

[0036] The groove structure is formed by melting and shrinking the first substrate and / or the second substrate toward the functional layer.

[0037] The groove structure extends through the outer peripheral edge of the functional layer, connecting the surface of the functional layer adjacent to the first substrate and / or the surface of the functional layer adjacent to the second substrate.

[0038] The groove structure includes a stepped structure or a trench structure.

[0039] A dam structure is provided around the periphery of the groove structure, and the distance between the dam structure and the groove structure is 0.5mm-10mm.

[0040] The sealing structure has a longitudinal section at the groove structure that is V-shaped, U-shaped, W-shaped, M-shaped, X-shaped, I-shaped, II-shaped, III-shaped, or a combination thereof.

[0041] The functional layer includes a first conductive layer, a dimming layer, and a second conductive layer stacked sequentially.

[0042] The dimming element further includes at least one notch.

[0043] Fourthly, this application also provides a method for manufacturing a dimming element, the method comprising:

[0044] (1) A dimming component is provided, the dimming component comprising a first substrate, a functional layer and a second substrate stacked sequentially;

[0045] (2) A processing mold is provided on the side of the first base away from the functional layer, and a support platform is provided on the side of the second base away from the functional layer;

[0046] (3) The mold presses the first base and vibrates back and forth relative to the support platform in a horizontal direction parallel to the mold direction and parallel to the ground plane, generating local friction on the functional layer, making the local functional layer adjacent to the mold easier to be crushed and pushed to both sides, while the first base and the second base locally become molten near the mold.

[0047] (4) The functional layer forms a groove structure under the action of local friction. After the first substrate and the second substrate come into contact with each other in a high-temperature molten state, they are cooled and solidified to form a sealing structure.

[0048] (5) At least one complete sealing structure is formed within the outer periphery of the dimming element to complete the edge sealing.

[0049] The vibration frequency range is 20KHz-40KHz.

[0050] The mold includes at least one raised or recessed pattern parallel to the outer side of the mold, and the width of the raised or recessed pattern on the mold ranges from 0.2mm to 10mm.

[0051] The groove structure extends through the outer peripheral edge of the functional layer, connecting the surface of the functional layer adjacent to the first substrate and / or the surface of the functional layer adjacent to the second substrate.

[0052] The dimming component also includes a dam structure located around the groove structure. After "forming at least one sealing structure within the outer periphery of the dimming component to complete the edge sealing", the manufacturing method of the dimming component further includes:

[0053] The dam structure was removed.

[0054] Prior to forming the groove structure, a filling portion is provided on the side surface of the first substrate and / or the second substrate facing away from the functional layer.

[0055] The thickness of the filling portion in the stacking direction is 1 / 3 to 1 / 2 times the thickness of the first substrate or the second substrate in the stacking direction.

[0056] In this process, after or simultaneously with the formation of the groove structure, a filling portion is provided on the side of the groove structure that is away from the sealing structure.

[0057] Fifthly, this application also provides a light-transmitting component, the light-transmitting component including a first light-transmitting element, a second light-transmitting element and a dimming element, the dimming element being located between the first light-transmitting element and the second light-transmitting element.

[0058] Sixthly, this application also provides a vehicle that includes a light-transmitting component. Attached Figure Description

[0059] To more clearly illustrate the technical solutions of the embodiments of this application, the drawings used in the implementation will be briefly introduced below. Obviously, the drawings described below are some implementations of this application. For those skilled in the art, other drawings can be obtained from these drawings without creative effort.

[0060] Figure 1 A schematic diagram of a vehicle provided in an embodiment of this application;

[0061] Figure 2 A schematic diagram of the light-transmitting component provided in an embodiment of this application;

[0062] Figure 3 for Figure 2 The light-transmitting component shown is a cross-sectional view along line AA.

[0063] Figure 4 A schematic diagram of a dimming device provided in an embodiment of this application;

[0064] Figure 5 for Figure 4 A cross-sectional view of the dimming element shown along line BB;

[0065] Figure 6 for Figure 4 A cross-sectional view of the dimming element shown along the CC line;

[0066] Figure 7 A connection diagram of the first electrode and the first insulating member provided in an embodiment of this application;

[0067] Figure 8 A connection diagram of the second electrode and the second insulating member provided in the embodiments of this application;

[0068] Figure 9 for Figure 4 Another cross-sectional view of the dimming element shown along line BB;

[0069] Figure 10 A flowchart illustrating a method for manufacturing a dimming component according to an embodiment of this application;

[0070] Figure 11 For corresponding Figure 10 A structural diagram illustrating the manufacturing method of the dimming component;

[0071] Figure 12 for Figure 11 The structure shown is a cross-sectional view along line DD;

[0072] Figure 13 For corresponding Figure 10 A structural diagram illustrating the manufacturing method of the dimming component;

[0073] Figure 14 For corresponding Figure 10 A structural diagram illustrating the manufacturing method of the dimming component;

[0074] Figure 15 For corresponding Figure 10 A structural diagram illustrating the manufacturing method of the dimming component;

[0075] Figure 16 For corresponding Figure 10 A structural diagram illustrating the manufacturing method of the dimming component;

[0076] Figure 17 For corresponding Figure 10 A structural diagram illustrating the manufacturing method of the dimming component;

[0077] Figure 18A schematic diagram of the arrangement of the first and second electrodes provided in an embodiment of this application;

[0078] Figure 19 Another arrangement diagram of the first and second electrodes provided in the embodiments of this application;

[0079] Figure 20 Another arrangement diagram of the first and second electrodes provided in the embodiments of this application;

[0080] Figure 21 A flowchart illustrating a method for manufacturing a dimming element according to another embodiment of this application;

[0081] Figure 22 For corresponding Figure 21 A structural diagram illustrating the manufacturing method of the dimming component;

[0082] Figure 23 For corresponding Figure 21 A structural diagram illustrating the manufacturing method of the dimming component;

[0083] Figure 24 For corresponding Figure 21 A structural diagram illustrating the manufacturing method of the dimming component;

[0084] Figure 25 For corresponding Figure 21 A structural diagram illustrating the manufacturing method of the dimming component;

[0085] Figure 26 For corresponding Figure 21 A structural diagram illustrating the manufacturing method of the dimming component;

[0086] Figure 27 For corresponding Figure 21 A structural diagram illustrating the manufacturing method of the dimming component;

[0087] Figure 28 A flowchart illustrating a method for manufacturing a dimming element according to another embodiment of this application;

[0088] Figure 29 For corresponding Figure 28 A structural diagram illustrating the manufacturing method of the dimming component;

[0089] Figure 30 A flowchart illustrating a method for manufacturing a dimming element according to another embodiment of this application;

[0090] Figure 31 For corresponding Figure 30 A structural diagram illustrating the manufacturing method of the dimming component;

[0091] Figure 32 A flowchart illustrating a method for manufacturing a dimming element according to another embodiment of this application;

[0092] Figure 33 For corresponding Figure 32 A structural diagram illustrating the manufacturing method of the dimming component;

[0093] Figure 34 For corresponding Figure 32 A structural diagram illustrating the manufacturing method of the dimming component;

[0094] Figure 35 A flowchart illustrating a method for manufacturing a dimming element according to another embodiment of this application;

[0095] Figure 36 For corresponding Figure 35 A structural diagram illustrating the manufacturing method of the dimming component;

[0096] Figure 37 For corresponding Figure 35 A structural diagram illustrating the manufacturing method of the dimming component;

[0097] Figure 38 A flowchart illustrating a method for manufacturing a dimming element according to another embodiment of this application;

[0098] Figure 39 For corresponding Figure 38 A structural diagram illustrating the manufacturing method of the dimming component;

[0099] Figure 40 For corresponding Figure 38 A structural diagram illustrating the manufacturing method of the dimming component;

[0100] Figure 41 A flowchart illustrating a method for manufacturing a dimming element according to another embodiment of this application;

[0101] Figure 42 For corresponding Figure 41 A structural diagram illustrating the manufacturing method of the dimming component;

[0102] Figure 43 For corresponding Figure 41 A structural diagram illustrating the manufacturing method of the dimming component;

[0103] Figure 44 For corresponding Figure 41 A structural diagram illustrating the manufacturing method of the dimming component;

[0104] Figure 45 For corresponding Figure 41 A structural diagram illustrating the manufacturing method of the dimming component;

[0105] Figure 46 A schematic diagram of a sealing structure provided in an embodiment of this application;

[0106] Figure 47 A schematic diagram of a sealing structure provided in another embodiment of this application;

[0107] Figure 48 This is a top view of the dimming component provided in embodiment (1) of this application;

[0108] Figure 49 for Figure 48 Schematic diagram of cross section along line II;

[0109] Figure 50 A cross-sectional schematic diagram of the dimming film provided in Embodiment (II) of this application;

[0110] Figure 51 A cross-sectional schematic diagram of the dimming film provided in Embodiment (III) of this application;

[0111] Figure 52 A cross-sectional schematic diagram of the dimming film provided in embodiment (iv) of this application;

[0112] Figure 53 A schematic diagram of the step structure provided in embodiment (v) of this application;

[0113] Figure 54 A top view of the dimming component provided in embodiment (vi) of this application;

[0114] Figure 55 A schematic diagram of the manufacturing process of the dimming component provided in Embodiment (VII) of this application;

[0115] Figure 56 A schematic diagram of the mold and support platform provided for embodiment (viii) of this application;

[0116] Figure 57 This is a cross-sectional schematic diagram of the light-transmitting component provided in embodiment (ix) of this application;

[0117] Figure 58 This is a top view of the vehicle provided for embodiment (x) of this application. Detailed Implementation

[0118] The technical solutions of the embodiments of this application will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of this application, and not all embodiments. Based on the embodiments of this application, all other embodiments obtained by those of ordinary skill in the art without creative effort are within the scope of protection of this application.

[0119] In this document, references to "embodiment" or "implementation" mean that a particular feature, structure, or characteristic described in connection with an embodiment or implementation may be included in at least one embodiment of this application. The appearance of this phrase in various places throughout the specification does not necessarily refer to the same embodiment, nor is it a separate or alternative embodiment mutually exclusive with other embodiments. It will be explicitly and implicitly understood by those skilled in the art that the embodiments described herein can be combined with other embodiments.

[0120] The following describes various aspects of the dimming component provided in this application using Embodiment 1 and Embodiment 2. Embodiment 1 is derived from an earlier application with application number 202111004531.4, and Embodiment 2 is derived from an earlier application with application number 202110749492.4. It should be noted that although the numbering of the various parts of the dimming component differs in Embodiment 1 and Embodiment 2, they are essentially the same. That is, features in Embodiment 1 can be applied to Embodiment 2, and similarly, features in Embodiment 2 can be applied to Embodiment 1.

[0121] Example 1 ( Figures 1 to 47 )

[0122] Please refer to Figure 1 This application provides a vehicle 5, which may be, but is not limited to, a sedan, a multi-purpose vehicle (MPV), a sport utility vehicle (SUV), an off-road vehicle (ORV), a pickup truck, a van, a bus, a truck, etc.

[0123] The vehicle 5 includes the light-transmitting component 10 described in any of the following embodiments. The vehicle 5 may also include a frame 20, on which the light-transmitting component 10 is directly or indirectly supported.

[0124] The light-transmitting component 10 is used to transmit light to ensure sufficient light inside the vehicle and to provide visibility for the occupants. The light-transmitting component 10 can be the windshield, rear windshield, sunroof, door windows, rear side windows, etc. of the vehicle 5.

[0125] The light-transmitting component 10 can change its light transmittance (thus causing a change in haze). That is, the light-transmitting component 10 is highly transparent when powered on and becomes blurry and opaque when powered off. The term "opaque" does not mean that light is completely blocked by the light-transmitting component 10, but rather that the light-transmitting component 10 blocks most of the light, making it impossible for people outside the vehicle to see inside, and vice versa. However, some light can still pass through the light-transmitting component 10 to enter the vehicle, thus preventing the interior from becoming completely dark.

[0126] Please refer to Figure 2This application also provides a light-transmitting component 10, which includes a light-transmitting element 120 and a dimming element 110 as described in any of the following embodiments. The dimming element 110 is supported on the light-transmitting element 120. The light-transmitting element 120 is made of a transparent material, which may be, but is not limited to, glass, plastic, etc.

[0127] The light-transmitting element 120 may include a transparent first light-transmitting element 120a and a second light-transmitting element 120b. The dimming element 110 is disposed between the first light-transmitting element 120a and the second light-transmitting element 120b, so that the dimming element 110 can be protected by the first light-transmitting element 120a and the second light-transmitting element 120b.

[0128] Please refer to Figure 3 The light-transmitting component 10 further includes a transparent first connecting layer 130 and a transparent second connecting layer 140. The first light-transmitting element 120a is bonded to the dimming element 110 through the first connecting layer 130. The second light-transmitting element 120b is bonded to the dimming element 110 through the second connecting layer 140.

[0129] The shape of the light-transmitting component 10 can be, but is not limited to, circular, elliptical, rectangular, etc. The light-transmitting component 10 can be, but is not limited to, used in the windows of vehicles 5, windows of houses, partition doors of bathrooms, partition doors of conference rooms, etc.

[0130] The dimming element 110 in the light-transmitting component 10 provided in the above embodiment will be described in detail below with reference to the accompanying drawings.

[0131] Please refer to Figures 4 to 6 This application also provides a dimming element 110, which includes a first electrode 111, a second electrode 112, and a dimming film 113. The dimming film 113 includes a first substrate 1131a, a first conductive layer 1131b, a dimming layer 1133, a second conductive layer 1132b, and a second substrate 1132a, which are sequentially stacked. The dimming layer 1133, the first conductive layer 1131b, and the second conductive layer 1132b form a receiving space Z. The first electrode 111 and the second electrode 112 are disposed within the receiving space Z. The first electrode 111 is attached to the side of the first conductive layer 1131b opposite to the first substrate 1131a, so that the first electrode 111 is electrically connected to the first conductive layer 1131b. The second electrode 112 is attached to the side of the second conductive layer 1132b opposite to the second substrate 1132a, so that the second electrode 112 is electrically connected to the second conductive layer 1132b.

[0132] The materials of the first substrate 1131a and the second substrate 1132a are preferably polyethylene terephthalate (PET), but can also be polymers such as polyvinyl alcohol (PVA), polyimide (PI), and polyethylene naphthalate (PEN).

[0133] The materials of the first conductive layer 1131b and the second conductive layer 1132b are preferably indium tin oxide (also known as indium tin oxide, ITO), or they can be fluorine-doped tin oxide (FTO) or aluminum-doped zinc oxide (AZO), or they can be materials formed by doping these materials with metals such as gold, silver, and copper.

[0134] The dimming layer 1133 can be a dimming material produced from roll to roll, such as polymer dispersed liquid crystal (PDLC), electrochromic (EC), light value (LV), suspended particle devices (SPD), liquid crystal (LC), etc.

[0135] Optional, please refer to Figure 7 The dimming element 110 may further include a first insulating element 114 for enclosing the first electrode 111. The first insulating element 114 has a first opening K1 to expose one side of the first electrode 111. The side of the first electrode 111 exposed through the first opening K1 is electrically connected to the first conductive layer 1131b. The side of the first insulating element 114 opposite to the first opening K1 is connected to the second conductive layer 1132b, thereby insulating the first electrode 111 and the second conductive layer 1132b. Please refer to... Figure 8 The dimming element 110 may further include a second insulating element 115 for enclosing the second electrode 112. The second insulating element 115 has a second opening K2 to expose one side of the second electrode 112. The side of the second electrode 112 exposed through the second opening K2 is electrically connected to the second conductive layer 1132b. The side of the second insulating element 115 opposite to the second opening K2 is connected to the first conductive layer 1131b, thereby insulating the second electrode 112 from the first conductive layer 1131b.

[0136] The first electrode 111 and the second electrode 112 are used to connect to a power source, which can be a current source or a voltage source. When the dimming element 110 is de-energized, the dimming layer 1133 is in a first state. In the first state, the dimming layer 1133 can block most of the light, thus making the dimming element 110 opaque. At this time, the dimming element 110 has the highest haze level and the largest haze. When the dimming element 110 is energized, an electric field is formed between the first conductive layer 1131b and the second conductive layer 1132b. Under the action of this electric field, the dimming layer 1133 changes from the first state to the second state. In the second state, the dimming layer 1133 can transmit most of the light, thus making the dimming element 110 transparent. At this time, the dimming element 110 has the lowest haze level and the smallest haze.

[0137] Optionally, in some embodiments, the dimming layer 1133 can be in a third state by controlling the intensity of the electric field formed between the first conductive layer 1131b and the second conductive layer 1132b, thereby making the dimming element 110 in a state between transparent and opaque. Further optionally, the third state includes multiple sub-states, and the dimming element 110 includes multiple different haze levels, with each sub-state corresponding to one haze level. The greater the intensity of the electric field, the lower the haze level of the dimming element 110, i.e., the greater the transparency of the dimming element 110. This allows the dimming element 110 to switch between multiple (greater than or equal to four) different haze levels, thereby expanding the applicable scenarios of the dimming element 110.

[0138] The orthographic projection of the dimming film 113 onto the first light-transmitting element 120a falls entirely within the area of ​​the first light-transmitting element 120a, and the orthographic projection of the dimming film 113 onto the second light-transmitting element 120b falls entirely within the area of ​​the second light-transmitting element 120b. In other words, the length and width of the dimming film 113 are both less than or equal to the length and width of the first light-transmitting element 120a and the second light-transmitting element 120b, which helps to protect the dimming film 113 from external damage.

[0139] Furthermore, the first electrode 111 and the second electrode 112 are self-dimming films 113 extending out of the edges of the first light-transmitting element 120a and the second light-transmitting element 120b. That is, part of the first electrode 111 and part of the second electrode 112 are exposed outside the first light-transmitting element 120a and the second light-transmitting element 120b, which is beneficial for connecting the first electrode 111 and the second electrode 112 to the power supply.

[0140] In related technologies, electrodes are directly inserted into the dimming layer, with the electrodes and conductive layer spaced apart. However, this arrangement leads to adverse consequences. Specifically, on the one hand, since the dimming layer is usually an insulating material, it is difficult for the electrodes and conductive layer to form an electrical connection. Even if an electrical connection is formed, the dimming layer between the electrodes and conductive layer will have a large resistance. When the dimming device is energized, this area will heat up due to the high resistance, and after prolonged operation, the dimming device may be damaged due to heat accumulation. At the same time, the high resistance of the dimming layer will also reduce the voltage distributed to the conductive layer, resulting in insufficient electric field strength in the conductive layer, thus causing the dimming device to always have a certain degree of haze and not be able to reach a high transparency state. On the other hand, inserting the electrodes into the dimming layer will result in an excessively thick portion. During the process of clamping the dimming device between the first and second light-transmitting elements, excessive stress can easily cause the first and second light-transmitting elements to break. Even if they do not break, air bubbles may be generated due to the uneven thickness.

[0141] In this application, the first electrode 111 and the second electrode 112 are respectively disposed within the receiving space Z formed by the first conductive layer 1131b, the dimming layer 1133, and the second conductive layer 1132b. This prevents the dimming element 110 at the location of the receiving space Z from becoming too thick, thereby avoiding the problems of breakage and air bubbles during the subsequent installation of the first light-transmitting element 120a and the second light-transmitting element 120b. Furthermore, since the first electrode 111 is attached to the first conductive layer 1131b to form an electrical connection, there is no dimming layer 1133 between the first electrode 111 and the first conductive layer 1131b. Similarly, since the second electrode 112 is attached to the second conductive layer 1132b to form an electrical connection, there is no dimming layer 1133 between the second electrode 112 and the second conductive layer 1132b. This overcomes the technical problems of damage to the dimming element 110 due to heat accumulation caused by the dimming layer 1133 and the dimming element 110 always having a certain degree of haze due to the voltage distribution of the dimming layer 1133. Therefore, the dimming element 110 provided in this application can ensure the normal functioning of itself.

[0142] Please refer to Figure 4 and Figure 6The receiving space Z includes a first subspace Z1 and a second subspace Z2 spaced apart. The first electrode 111 is disposed within the first subspace Z1. The second electrode 112 is disposed within the second subspace Z2. Since the first subspace Z1 and the second subspace Z2 are spaced apart, the first electrode 111 and the second electrode 112 are not present in the space between the first subspace Z1 and the second subspace Z2. Therefore, a portion of the dimming layer 1133 can be disposed within this space without causing the aforementioned technical problems associated with the dimming layer 1133. It is understood that disposing of the dimming layer 1133 within this space can increase the total adjustable area of ​​the dimming component 110; that is, haze adjustment can also be performed in the space. The shapes of the first subspace Z1 and the second subspace can be, but are not limited to, circular, rectangular, elliptical, triangular, etc.

[0143] Please refer to Figure 6 The dimming element 110 further includes a first adhesive layer 1134 and a second adhesive layer 1135. The first electrode 111 is bonded to and electrically connected to the first conductive layer 1131b via the first adhesive layer 1134. The second electrode 112 is bonded to and electrically connected to the second conductive layer 1132b via the second adhesive layer 1135. The first adhesive layer 1134 and the second adhesive layer 1135 are made of conductive materials and have a certain degree of adhesion; specifically, they can be, but are not limited to, conductive tape, conductive silver paste, anisotropic conductive adhesive, metal tape, etc.

[0144] It is understandable that, due to manufacturing limitations, the surfaces of the first conductive layer 1131b, the second conductive layer 1132b, the first electrode 111, and the second electrode 112 are difficult to make absolutely flat. The following description uses the first conductive layer 1131b and the first electrode 111 as an example. If the first conductive layer 1131b and the first electrode 111 are in direct contact for electrical connection, a gap will inevitably exist between them. This gap will increase the conduction resistance between the first electrode 111 and the first conductive layer 1131b. In this embodiment, using a conductive first adhesive layer 1134 to connect the first electrode 111 and the first conductive layer 1131b can eliminate or reduce the aforementioned resistance. Specifically, at the initial moment when the first adhesive layer 1134 is used to bond the first electrode 111 and the first conductive layer 1131b, because the first adhesive layer 1134 has a certain degree of extensibility (such as conductive tape) or fluidity (such as conductive silver paste), the first adhesive layer 1134 can fill at least part of the gap between the first electrode 111 and the first conductive layer 1131b, thereby reducing the aforementioned resistance. Furthermore, after the first adhesive layer 1134 cures, a strong connection is formed, thus improving the peel strength between the first electrode 111 and the first conductive layer 1131b. The conductive bonding effect of the second electrode 112 and the second conductive layer 1132b through the second adhesive layer 1135 is similar and will not be described in detail here.

[0145] Please refer to Figure 9 The dimming element 110 has a sealing structure M, at least a portion of which is arranged along the periphery of the dimming element 110. The first substrate 1131a and the second substrate 1132a at the sealing structure M are connected and fused together. That is, the peripheries of the first substrate 1131a and the second substrate 1132a are connected to form the sealing structure M, thereby isolating foreign objects from the first substrate 1131a and the second substrate 1132a to prevent them from entering the dimming film 113 and damaging the dimming layer 1133. Simultaneously, forming the sealing structure M increases the peel strength at the edge of the dimming film 113 (approximately 50 times that before sealing), thus preventing the layers of the dimming film 113 from detaching due to bending. For example, in a skylight made of 3D curved glass, the curved area of ​​the dimming film 113 is subjected to greater stress, and there is a probability of peeling (the gap between the two substrate layers increases). Therefore, forming the sealing structure M overcomes this problem.

[0146] Specifically, the first connecting layer 130 and the second connecting layer 140 used to bond the light-transmitting element 120 and the dimming element 110 contain plasticizers. If the plasticizer enters the interior of the dimming film 113 through the edge of the dimming film 113, it will come into contact with the dimming layer 1133, thereby damaging the dimming layer 1133. Overall, this manifests as peripheral failure of the dimming layer 1133, and the failed area cannot perform the corresponding light control function. In this embodiment, a sealing structure M is provided at the periphery of the dimming element 110 to prevent the plasticizer from entering.

[0147] It should be noted that the sealing structure M is groove-shaped (or recessed), and the sealing structure M is 1 / 3 to 1 / 2 shorter than the effective working area of ​​the dimming film 113 (the dimming film 113 inside the sealing structure M). In other words, the upper surface of the sealing structure M is 1 / 3 to 1 / 2 shorter than the upper surface of the effective working area by the thickness of the first or second substrate. The grooves can all be located on the same side of the dimming film 113, or they can be located on different sides (i.e., the recessed directions are opposite). Taking a rectangular sealing structure M as an example, the four grooves can be on the same side (i.e., the recessed directions of the four grooves are the same), or they can be on opposite sides (i.e., the recessed directions of the four grooves are partially the same and partially different).

[0148] In another related technology, to facilitate electrode attachment, portions of the first substrate and the second substrate are removed from opposite sides of the dimming film, exposing portions of the first conductive layer and the second conductive layer. The exposed first conductive layer is used for electrical connection to the first electrode, and the exposed second conductive layer is used for electrical connection to the second electrode. However, since portions of the first substrate and the second substrate are removed (hereinafter referred to as the pre-defined region), a sealing structure as described in this application cannot be formed in the pre-defined region. Therefore, foreign matter (such as plasticizer) can enter the interior of the dimming film through this pre-defined region, thereby damaging the dimming film. In this application, the first electrode 111 and the second electrode 112 are connected to the first conductive layer 1131b and the second conductive layer 1132b respectively from the interior of the dimming film 113. Therefore, it is not necessary to remove the first substrate 1131a and the second substrate 1132a, thereby forming the aforementioned sealing structure M.

[0149] Please refer to Figure 10 This application also provides a method for manufacturing a dimming element 110. For a description of the dimming element 110, please refer to the accompanying drawings and descriptions of any of the preceding embodiments. The manufacturing method includes, but is not limited to, steps S100, S200, S300, S400, S500, and S600. The descriptions of steps S100, S200, S300, S400, S500, and S600 are as follows.

[0150] S100: A dimming film 113 is provided, the dimming film 113 comprising a first film layer 1131, a dimming layer 1133, and a second film layer 1132 stacked together. Please refer to... Figure 11 and Figure 12 .

[0151] The first film layer 1131 includes a first substrate 1131a and a first conductive layer 1131b stacked together. The second film layer 1132 includes a second substrate 1132a and a second conductive layer 1132b stacked together. The dimming layer 1133 is located between the first conductive layer 1131b and the second conductive layer 1132b. That is, the first substrate 1131a, the first conductive layer 1131b, the dimming layer 1133, the second conductive layer 1132b, and the second substrate 1132a are stacked sequentially.

[0152] The shape of the dimming film 113 may be, but is not limited to, a circle, a rectangle, an ellipse, a triangle, etc. In this application, a rectangle is used as an example.

[0153] The dimming film 113 includes a first region A1 and a second region A2, that is, a portion of the dimming film 113 constitutes the first region A1, and another portion of the dimming film 113 constitutes the second region A2. It should be noted that the first region A1 in this application changes with the position of the dimming film 113. That is, when the dimming film 113 in the first region A1 changes from a first position to a second position, the dimming film 113 located at the second position constitutes the first region A1. The following description, in conjunction with the first region A1 and the second region A2, will assist in describing the fabrication process of the dimming element 110.

[0154] S200: Peel away the first film layer 1131 and the second film layer 1132 located in the first region A1 in opposite directions away from each other to expose the dimming layer 1133 in the first region A1. Please refer to... Figure 13 .

[0155] The term "peeling" refers to tearing apart the first film layer 1131 and the second film layer 1132. During the peeling process, the first film layer 1131 and the second film layer 1132 move relative to each other in a direction away from each other. The peeling method can be manual, that is, the operator directly tears apart the first film layer 1131 and the second film layer 1132 by hand. In other embodiments, the peeling method can also be mechanical.

[0156] It should be noted that after the dimming film 113 is peeled off, part of the dimming layer 1133 is attached to the first conductive layer 1131b of the first film layer 1131, and another part of the dimming layer 1133 is attached to the second conductive layer 1132b of the second film layer 1132.

[0157] In one implementation, the second film layer 1132 is fixed, and the first film layer 1131 is peeled away in a direction away from the second film layer 1132. After the peeling operation is completed, the first film layers 1131 of the first region A1 and the second region A2 are connected in a curved or bent shape, such as... Figure 13 As shown. In another embodiment, the first film layer 1131 is fixed, and the second film layer 1132 is peeled away from the first film layer 1131. After the peeling operation is completed, the second film layers 1132 of the first region A1 and the second region A2 are connected in a bent or folded shape. In yet another embodiment, the first film layer 1131 is peeled away from the second film layer 1132, and simultaneously, the second film layer 1132 is peeled away from the first film layer 1131. After the peeling operation is completed, the first film layers 1131 of the first region A1 and the second region A2 are connected in a bent or folded shape, and the second film layers 1132 of the first region A1 and the second region A2 are connected in a bent or folded shape. In the above three embodiments, the first region A1 is composed of the peeled first film layer 1131, the second film layer 1132, and the dimming layer 1133.

[0158] S300: Remove at least a portion of the dimming layer 1133 from the first conductive layer 1131b located in the first region A1. Please refer to... Figure 14 .

[0159] Specifically, after the peeling operation is completed, the dimming layer 1133 on the first conductive layer 1131b of the peeled part (first region A1) is cleaned with an organic solvent (ethanol, ethyl acetate, acetone, etc.) so that the side of the first conductive layer 1131b away from the first substrate 1131a is exposed.

[0160] S400: Attach the first electrode 111 to the first conductive layer 1131b located in the first region A1. Please refer to... Figure 15 .

[0161] In other words, the first electrode 111 is attached to the side of the first conductive layer 1131b away from the first substrate 1131a, so that the first electrode 111 and the first conductive layer 1131b form an electrical connection.

[0162] S500: Remove at least a portion of the dimming layer 1133 from the second conductive layer 1132b located in the first region A1. Please refer to... Figure 16 .

[0163] Specifically, after the peeling operation is completed, the dimming layer 1133 on the second conductive layer 1132b of the peeled part (first region A1) is cleaned with an organic solvent (such as ethanol) so that the side of the second conductive layer 1132b away from the second substrate 1132a is exposed.

[0164] S600: Attach the second electrode 112 to the second conductive layer 1132b located in the first region A1. Please refer to... Figure 17 and Figure 18 In other words, the second electrode 112 is attached to the side of the second conductive layer 1132b away from the second substrate 1132a, so that the second electrode 112 and the second conductive layer 1132b are electrically connected.

[0165] It should be noted that there are several feasible implementations for the execution order of the above steps S300, S400, S500, and S600. In one implementation, steps S300, S400, S500, and S600 are performed sequentially. In another implementation, steps S300 and S500 are first performed sequentially (or simultaneously), and then steps S400 and S600 are performed sequentially (or simultaneously).

[0166] In related technologies, the dimming layer is not removed; instead, the electrodes are directly inserted into the dimming layer, with the electrodes and conductive layer spaced apart. However, this arrangement leads to adverse consequences. Specifically, on the one hand, since the dimming layer is usually an insulating material, it is difficult for the electrodes and conductive layer to form an electrical connection. Even if an electrical connection is formed, the dimming layer between the electrodes and conductive layer will be a large resistance. When the dimming device is energized, this resistance will generate heat, and after prolonged operation, the dimming device may be damaged due to heat accumulation. Moreover, this resistance will also distribute part of the voltage, resulting in insufficient voltage distribution to the conductive layer, which leads to insufficient electric field strength formed by the conductive layer, thus causing the dimming device to always have a certain degree of haze and not be able to enter a transparent state. On the other hand, inserting the electrodes into the dimming layer will result in that part being too thick, which can easily cause the first and second light-transmitting elements to break during the process of clamping the dimming device between them. For a description of the first light-transmitting element 120a and the second light-transmitting element 120b, please refer to the previous related embodiments.

[0167] In this embodiment, before attaching the first electrode 111 and the second electrode 112, the dimming layer 1133 on the first conductive layer 1131b and the second conductive layer 1132b located in the first region A1 has been removed. After attachment, there is no dimming layer 1133 between the first electrode 111 and the first conductive layer 1131b, or between the second electrode 112 and the second conductive layer 1132b. This overcomes the technical problems of heat accumulation damaging the dimming element 110 caused by the dimming layer 1133, and the dimming element 110 always having a certain degree of haze. At the same time, since the dimming layer 1133 in the first region A1 has been removed, space can be provided for the first electrode 111 and the second electrode 112, thereby avoiding the problem of breakage caused by the dimming element 110 being too thick at the location where the first electrode 111 and the second electrode 112 are placed.

[0168] It should be noted that the first electrode 111 and the second electrode 112 can be disposed at the same end of the dimming film 113 (e.g., Figure 18 As shown), it can also be set on different ends (e.g. Figure 19 and Figure 20 As shown, this application is only illustrative of the first electrode 111 and the second electrode 112 being disposed at the same end, but should not be regarded as constituting a limitation on the dimming device 110 provided in this application.

[0169] Please refer to Figure 21 In the above embodiment, step "S200: peeling the first film layer 1131 and the second film layer 1132 located in the first region A1 away from each other to expose the dimming layer 1133 in the first region A1" may include steps S210, S220, S230, and S240. The description of steps S210, S220, S230, and S240 is as follows.

[0170] S210: Cut the dimming film 113 located in the first region A1 along the first preset path S1 to form the first sub-region A11. Please refer to... Figure 22 .

[0171] The first preset path S1 can be a straight line or a curve. The cutting tool can be, but is not limited to, scissors, blades, etc., as long as it can cut to form the first sub-region A11.

[0172] S220: Peel away the first film layer 1131 and the second film layer 1132 located in the first sub-region A11 in opposite directions away from each other to expose the dimming layer 1133 located in the first sub-region A11. Please refer to... Figures 23 to 24 For details on the peeling process, please refer to the description in step S200 above.

[0173] S230: Cut the dimming film 113 located in the first region A1 along the second preset path S2 to form the second sub-region A12. Please refer to... Figure 25 .

[0174] The second preset path S2 can be a straight line or a curve. The cutting tool can be, but is not limited to, scissors, blades, etc., as long as it can cut to form the second sub-region A12. It should be noted that the second sub-region A12 and the first sub-region A11 do not overlap.

[0175] S240: Peel away the first film layer 1131 and the second film layer 1132 located in the second sub-region A12 in opposite directions away from each other to expose the dimming layer 1133 located in the second sub-region A12. Please refer to... Figures 26 to 27 For details on the peeling process, please refer to the description in step S200 above.

[0176] It should be noted that there are several feasible implementations for the execution order of the above steps S210, S220, S230, and S240. In one implementation, steps S210, S220, S230, and S240 are performed sequentially. In another implementation, steps S210 and S230 are first performed sequentially (or simultaneously), and then steps S220 and S240 are performed sequentially (or simultaneously).

[0177] It should also be noted that when the first preset path S1 and the second preset path S2 are straight lines, they can be parallel to each other (e.g., Figure 25 (as shown), or they are perpendicular to each other, or their extension directions intersect.

[0178] Please refer to Figure 25 Optionally, the first region A1 further includes a third sub-region A13, which is located between the first sub-region A11 and the second sub-region A12. That is, the first sub-region A11 and the second sub-region A12 are spaced apart. Therefore, the third sub-region A13 does not need to be peeled off, and the dimming layer 1133 in the third sub-region A13 does not need to be removed, thereby increasing the total adjustable area of ​​the dimming element 110. In other words, the third sub-region A13 can also achieve haze adjustment. In this embodiment, the first sub-region A11 and the second sub-region A12 correspond to the first subspace Z1 and the second subspace Z2 mentioned above, respectively. That is, the first subspace Z1 is located within the first sub-region A11, and the second subspace Z2 is located within the second sub-region A12. For a description of the first subspace Z1 and the second subspace Z2, please refer to the description in the preceding structural embodiments.

[0179] Please refer to Figure 28 In the above embodiment, step "S300: remove at least a portion of the dimming layer 1133 on the first conductive layer 1131b located in the first region A1" may include step S310, and the description of step S310 is as follows.

[0180] S310: Remove the dimming layer 1133 from the first conductive layer 1131b and the second conductive layer 1132b located in the first sub-region A11. Please refer to... Figure 29 .

[0181] As described above, the first conductive layer 1131b is used to attach the first electrode 111. After the first electrode 111 is attached, the first film layer 1131 and the second film layer 1132 need to be closed so that the dimming film 113 returns to its state before being peeled off. After closing, the first electrode 111 is located between the first conductive layer 1131b and the second conductive layer 1132b.

[0182] If the dimming layer 1133 on the second conductive layer 1132b is not removed, then after closing, the side of the first electrode 111 facing the second conductive layer 1132b will come into contact with the dimming layer 1133. It is understood that in some cases, the dimming film 113 may be exposed to direct sunlight for extended periods. For example, if the dimming film 113 is applied to the sunroof of a vehicle 5, exposure to direct sunlight is unavoidable in summer. Exposure to sunlight may cause the dimming layer 1133 to produce substances that can damage the first electrode 111, thereby damaging the first electrode 111 and potentially causing the dimming element 110 to malfunction after a period of time. Simultaneously, the substances produced by the dimming layer 1133 may also affect the first adhesive layer 1134, reducing its adhesive performance. In this embodiment, the dimming layer 1133 on both the first conductive layer 1131b and the second conductive layer 1132b is removed, thereby potentially avoiding the aforementioned problems.

[0183] Please refer to Figure 30 In the above embodiment, step "S500: remove at least a portion of the dimming layer 1133 on the second conductive layer 1132b located in the first region A1" may include step S510, and the description of step S510 is as follows.

[0184] S510: Remove the dimming layer 1133 from the first conductive layer 1131b and the second conductive layer 1132b located in the second sub-region A12. Please refer to... Figure 31 Step S510 is similar to step S310 above. For an explanation of step S510, please refer to the description in step S310 above. It will not be repeated here.

[0185] Please refer to Figure 32 In the above embodiment, step "S400: attaching the first electrode 111 to the first conductive layer 1131b located in the first region A1" may include steps S410 and S420. The description of steps S410 and S420 is as follows.

[0186] S410: A first adhesive layer 1134 is formed on the surface of the first conductive layer 1131b located in the first region A1, facing away from the first substrate 1131a; or, a first adhesive layer 1134 is formed on the surface of the first electrode 111. Please refer to [reference needed]. Figure 33 .

[0187] S420: The first electrode 111 is attached to the first conductive layer 1131b located in the first region A1 via the first adhesive layer 1134. Please refer to... Figure 34 .

[0188] Specifically, in one embodiment, a first adhesive layer 1134 can be formed on the first conductive layer 1131b first, and then the first electrode 111 can be attached to the first conductive layer 1131b. In another embodiment, the first adhesive layer 1134 can also be formed on the first electrode 111 first, and then the first electrode 111 can be attached to the first conductive layer 1131b. The first adhesive layer 1134 can be, but is not limited to, a material with adhesive and conductive properties such as conductive tape, conductive silver paste, anisotropic conductive adhesive, or metal tape. Taking conductive silver paste as an example, in one embodiment, conductive silver paste is coated on the surface of the first conductive layer 1131b facing away from the first substrate 1131a, and then the first electrode 111 is attached to the conductive silver paste. Finally, the conductive silver paste can be cured by a drying operation, thereby firmly bonding the first electrode 111 to the first conductive layer 1131b. In another embodiment, conductive silver paste can be first applied to the first electrode 111, and then the first electrode 111 can be attached to the first conductive layer 1131b using conductive silver paste. Finally, the conductive silver paste can be cured by drying, thereby making the first electrode 111 firmly bonded to the first conductive layer 1131b.

[0189] It is understood that using a first adhesive layer 1134 with conductive properties to connect the first electrode 111 and the first conductive layer 1131b can eliminate or reduce the on-resistance between the first electrode 111 and the first conductive layer 1131b. The specific principle can be found in the description in the structural embodiment.

[0190] Please refer to Figure 35 In the above embodiment, step "S600: attaching the second electrode 112 to the second conductive layer 1132b located in the first region A1" may include steps S610 and S620. The description of steps S610 and S620 is as follows.

[0191] S610: A second adhesive layer 1135 is formed on the surface of the second conductive layer 1132b located in the first region A1, facing away from the second substrate 1132a; or, a second adhesive layer 1135 is formed on the surface of the second electrode 112. Please refer to [reference needed]. Figure 36 .

[0192] S620: The second electrode 112 is attached to the second conductive layer 1132b located in the first region A1 via the second adhesive layer 1135. Please refer to... Figure 37 .

[0193] The descriptions of steps S610 and S620 are the same as those in steps S410 and S420 above, and will not be repeated here.

[0194] Please refer to Figure 38 In the embodiments described above, after step "S600: attaching the second electrode 112 to the second conductive layer 1132b located in the first region A1", step S700 may also be included. The description of S700 is as follows.

[0195] S700: A sealing structure M is formed at the periphery of the dimming film 113, wherein the first substrate 1131a and the second substrate 1132a at the sealing structure M are connected. Please refer to... Figure 39 and Figure 40 .

[0196] The so-called periphery refers to the edge of the dimming film 113. That is, the sealing structure M is formed at the edge of the dimming film 113. After the sealing structure M is formed, the first substrate 1131a and the second substrate 1132a at the corresponding positions are connected together, thereby preventing foreign objects from entering the interior of the dimming film 113.

[0197] It should be noted that before the sealing structure M is formed, the first substrate 1131a and the second substrate 1132a are in a spaced-out state. In the second region A2, the first substrate 1131a and the second substrate 1132a are separated by the first conductive layer 1131b, the dimming layer 1133, and the second conductive layer 1132b. In the first region A1, the first substrate 1131a and the second substrate 1132a are separated by the first conductive layer 1131b, the second conductive layer 1132b, the first electrode 111, the second electrode 112, the first adhesive layer 1134, and the second adhesive layer 1135. Please refer to the relevant figures in the previous embodiments for details. After the sealing structure M is formed, the sealing structure M intersects with the first electrode 111 and the second electrode 112, and except for the positions of the first electrode 111 and the second electrode 112, the first substrate 1131a and the second substrate 1132a at the other sealing structure M are connected, that is, only the first substrate 1131a and the second substrate 1132a at the first electrode 111 and the second electrode 112 are in a spaced-out state.

[0198] As mentioned in the above structural embodiments, in related technologies, to facilitate electrode attachment, a portion of the first substrate and a portion of the second substrate are removed to expose a portion of the first conductive layer and a portion of the second conductive layer. Then, the first electrode is directly attached to the first conductive layer, and the second electrode is attached to the second conductive layer. This process does not involve the aforementioned peeling operation. However, this preparation method cannot form a sealed structure as shown in this application at the location where the electrodes are set. Foreign objects (such as plasticizers) can thus enter the interior of the dimming film through this location, thereby damaging the dimming film. In this application, the first electrode 111 and the second electrode 112 are connected from the interior of the dimming film 113 to the first conductive layer 1131b and the second conductive layer 1132b, respectively. Therefore, it is not necessary to remove the first substrate 1131a and the second substrate 1132a, thereby forming the aforementioned sealed structure M. Meanwhile, after forming the sealing structure M, the peel strength at the edge of the dimming film 113 can be increased (approximately 50 times that before sealing), thereby avoiding the problem of the layers of the dimming film 113 separating from each other due to bending. For example, the skylight is a 3D curved surface, and the curved area of ​​the dimming film 113 will be subjected to greater stress, and there is a certain probability that it will peel off (the gap between the two substrates becomes larger). Therefore, forming the sealing structure M can overcome this problem.

[0199] Please refer to Figure 41 In one embodiment, step "S700: forming a sealing structure M at the periphery of the dimming film 113, wherein the first substrate 1131a and the second substrate 1132a at the sealing structure M are connected" may include steps S710, S720, and S730. The description of steps S710, S720, and S730 is as follows.

[0200] S710: Provides first machined part 2 and second machined part 3. Please refer to... Figure 42 .

[0201] S720: The dimming film 113 is disposed between the first processed part 2 and the second processed part 3. Please refer to... Figure 43 .

[0202] The first processed part 2 abuts against the first substrate 1131a of the dimming film 113, and the second processed part 3 abuts against the second substrate 1132a of the dimming film 113.

[0203] S730: A sealing structure M is formed at the periphery of the dimming film 113 by the cooperation of the first processed part 2 and the second processed part 3. That is, the peripheries of the first substrate 1131a and the second substrate 1132a are connected to form the sealing structure M. Please refer to [reference needed]. Figure 44 .

[0204] Specifically, the second processing component 3 is a support platform used to support the dimming film 113, and its shape can be, but is not limited to, circular, elliptical, rectangular, etc. The first processing component 2 is wheel-shaped and is used to cooperate with the second processing component 3 to form a tight contact effect with the dimming film 113. The first processing component 2 is rotatable, and the second processing component 3 is vibrating. Through the cooperation of the first processing component 2 and the second processing component 3, the first substrate 1131a and the second substrate 1132a at the edge of the dimming film 113 are fused together to form the sealing structure M, thereby obtaining the dimming component 110.

[0205] It should be noted that the sealing structure M is groove-shaped (or recessed), and the sealing structure M is 1 / 3 to 1 / 2 lower than the effective working area of ​​the dimming film 113. The grooves can all be located on the same side of the dimming film 113, or they can be located on different sides (i.e., the recesses are in opposite directions). Taking a rectangular sealing structure M as an example, the four grooves can be on the same side (i.e., the recesses of the four grooves are in the same direction), or they can be on opposite sides (i.e., the recesses of the four grooves are partially the same and partially different).

[0206] The following describes in detail the process by which the first processed part 2 and the second processed part 3 work together to combine the first substrate 1131a and the second substrate 1132a.

[0207] The first processed component 2 can rotate relative to the dimming film 113. During rotation, sliding friction exists between the first processed component 2 and the first substrate 1131a, generating heat and raising the temperature of the first substrate 1131a. Simultaneously, the second processed component 3 can drive the dimming film 113 to vibrate (high-frequency vibration) relative to the first processed component 2. During vibration, high-frequency pressure effects are generated between the first processed component 2 and the first substrate 1131a, and between the second processed component 3 and the second substrate 1132a, resulting in high-frequency friction. Therefore, under the combined action of the first processed component 2 and the second processed component 3, the first substrate 1131a and the second substrate 1132a will heat up and reach a regional melting state, fusing together. After cooling, a sealing structure M with good sealing effect can be formed. It should be noted that during vibration, the first conductive layer 1131b, the second conductive layer 1132b, and the dimming layer 1133 corresponding to the first processed component 2 are pulverized.

[0208] Optional, please refer to Figure 45The second processed part 3 can rotate around a preset axis L, which is parallel to the direction of the first processed part 2 toward the second processed part 3. The point on the second processed part 3 where the first processed part 2 abuts (indirectly acts) is defined as the abutment point O. The distance from the preset axis L to the abutment point O is greater than or equal to a preset distance H, which is greater than zero. It is understood that since the second processed part 3 vibrates during the sealing process, if the second processed part 3 rotates around the abutment point O, a depression will form at the position of the abutment point O on the second processed part 3 due to the prolonged abutment by the first processed part 2, potentially damaging the dimming film 113. In this embodiment, since the preset distance H is set to be greater than zero, the abutment point O will also rotate around the preset axis L during the rotation of the second processed part 3. That is, the abutment point O is a changing point, thus avoiding repeated action of the first processed part 2 on the same point on the second processed part 3, thereby preventing the formation of the aforementioned depression. Moreover, the change in the abutment point O can also allow the sealing structure M to form a certain width D (see reference...). Figure 44 This enhances the sealing effect of the dimming film 113.

[0209] Furthermore, the sealing structure M is generally annular, and this annular shape can be, but is not limited to, a circular ring or a rectangular ring (e.g., Figure 44 (as shown), elliptical rings, etc. The specific shape can be determined according to the edge direction of the dimming film 113, and is not limited here.

[0210] Optionally, openings (such as serrated, semi-circular, rectangular, etc., in unlimited quantities) can be added around the edges of the dimming film 113 to avoid wrinkles when applied to the light-transmitting component 120 with a 3D curved surface.

[0211] It is understandable that to form the overall shape of the sealing structure M, relative movement between the first processing component 2 and the dimming film 113 is required. In other words, the first processing component 2 needs to move relative to the dimming film 113 along a predetermined direction (the overall shape of the sealing structure M) to abut against different positions on the dimming film 113, gradually forming the sealing structure M. The formation of the sealing structure M along the predetermined direction can be achieved solely through the movement of the first processing component 2, or by the second processing component 3 driving the movement of the dimming film 113, or by other external objects driving the movement of the dimming film 113.

[0212] Please refer to Figure 46The sealing structure M may include a first substructure M1, a second substructure M2, and a third substructure M3. The first substructure M1 is formed at the boundary between the first sub-region A11 and the third sub-region A13. The second substructure M2 is formed at the boundary between the second sub-region A12 and the third sub-region A13. The third substructure M3 is formed along the edge of the dimming film 113 and is used to seal the edge of the dimming film 113. It is understood that since the first sub-region A11, the second sub-region A12, and the third sub-region A13 are cut along the first preset path S1 and the second preset path S2, there are openings at the locations of the first preset path S1 and the second preset path S2, and these openings also need to be sealed.

[0213] In one embodiment, the first substructure M1 is formed along a first preset path S1, meaning that the first substructure M1 is formed on the first preset path S1 and follows the same direction as the first preset path S1. Figure 46 As shown. In another embodiment, the first preset path S1 is enclosed within the first substructure M1 and the third substructure M3, that is, the first substructure M1 and the third substructure M3 form an enclosing circle, and the first preset path S1 is located within this enclosing circle, as shown. Figure 47 As shown.

[0214] In one embodiment, the second substructure M2 is formed along a second preset path S2, meaning that the second substructure M2 is formed on the second preset path S2 and has the same orientation as the second preset path S2. Figure 46 As shown. In another embodiment, the second preset path S2 is enclosed within the second substructure M2 and the third substructure M3, that is, the second substructure M2 and the third substructure M3 form an enclosing circle, and the second preset path S2 is located within this enclosing circle, as shown. Figure 47 As shown.

[0215] Example 2 ( Figures 48 to 58 )

[0216] This application provides a dimming element 1, please refer to it as well. Figure 48 and Figure 49 , Figure 48 A top view schematic diagram of the dimming component provided in implementation method (i) of this application; Figure 49 for Figure 48 A cross-sectional view along line II. The dimming element 1 includes a dimming film, which includes a first substrate 11, a functional layer 12, and a second substrate 13 stacked sequentially; a sealing structure 15 is provided around the functional layer 12; the sealing structure 15 is formed by wrapping the functional layer 12 with the first substrate 11 and the second substrate 13.

[0217] It should be noted that, in order to better observe the overall structure and components of the dimming element 1, it is shown in a perspective view. Figure 48 This does not mean that the entire structure and components are disposed on the first substrate 11. In this embodiment, the functional layer 12 includes a first conductive layer 121, a dimming layer 122, and a second conductive layer 123 stacked sequentially. When voltage or current is applied to the first conductive layer 121 and the second conductive layer 123, the dimming layer 122 is energized, and the dimming element 1 enters an energized state; when no voltage or current is applied to the first conductive layer 121 and the second conductive layer 123, the dimming layer 122 is de-energized, and the dimming element 1 is in a de-energized state. It is understood that in other possible embodiments, the dimming element 1 can be controlled to adjust its energized and de-energized states in other ways, and this application does not limit this. It is understood that the functional layer may have other functions besides light control, such as communication or display functions, but it is not limited to having dimming functions.

[0218] The dimming element 1 is a multilayer composite structure capable of adjusting the reflection or transmission properties of transmitted light, such as polymer-dispersed liquid crystal (PDLC), suspended particle device (SPD), dichroic dye liquid crystal film (LC), electrochromic (EC) film, etc. In this embodiment, the dimming element 1 is described as a PDLC. When the functional layer 12 of the dimming element 1 is de-energized, the dimming element 1 has a high degree of haze. When light passes through the dimming element 1, the functional layer 12 blocks most of the light, making the dimming element 1 opaque when de-energized. When the functional layer 12 of the dimming element 1 is energized, the functional layer 12 becomes transparent and no longer blocks light. Most of the light passes through the dimming element 1, making the dimming element 1 transparent when energized.

[0219] The functional layer 12 is sensitive to environmental factors and gases around the membrane, such as moisture or plasticizers, which can cause the membrane around the functional layer to lose its dimming capability. This sensitivity may worsen over time and with increasing temperature. Therefore, the functional layer 12 needs to be sealed to form the sealing structure 15, effectively protecting it. Preferably, the sealing structure 15 is formed completely enclosed on the outer periphery of the dimming element 1. Thus, the dimming element 110 provided in this application can ensure its normal functioning.

[0220] Understandably, in this embodiment (I), the first substrate 11 and the second substrate 13 undergo localized high-frequency friction near the processing mold, causing the localized conductive layer and functional layer 12 material between the two substrates to pulverize and flow to both sides of the mold. After high-temperature melting, such as 250-300°C, the first substrate 11 comes into contact with the second substrate 13. After cooling and solidification, a high-density sealing structure 15 is formed in the dimming component, which can reduce the water absorption rate of the functional layer to less than 1%, effectively enhancing the peel strength of the dimming component 1 and resulting in greater overall mechanical strength. At the same time, the first conductive layer 121 and the second conductive layer 123 will not short-circuit, improving the yield and product reliability.

[0221] Alternatively, please refer to [the relevant document / reference]. Figure 49 The dimming component 1 includes a first substrate 11, a functional layer 12 and a second substrate 13 stacked in sequence. The first substrate 11 and the second substrate 13 each include a substrate main body 1a and a substrate edge 1b. The substrate main body 1a and 1b are used to hold or clamp the functional layer 12, and the substrate edge 1b forms a sealing structure to cover the functional layer 12.

[0222] In this embodiment (I), the total thickness of the first substrate 11 and the first conductive layer 121 in the stacking direction is the same as the total thickness of the second substrate 13 and the second conductive layer 123 in the stacking direction, which is approximately 187 μm. The thickness of the dimming layer 122 in the stacking direction is approximately 11 μm. In other words, the total thickness of the dimming element 1 in the stacking direction is approximately 385 μm.

[0223] Please refer to it again. Figure 49 At least one groove structure 14 is provided on the outer edge of the dimming element 1, and the sealing structure is located at the groove structure 14. In this embodiment, the length of the groove structure 14 in the stacking direction is approximately 270 μm. In other possible embodiments, the length of the groove structure 14 in the stacking direction may change due to variations in actual operation.

[0224] It should be noted that the thickness of the first conductive layer 121 and the second conductive layer 123 in the stacking direction is relatively small, typically on the order of several hundred nm, far less than 5 μm, and they are bonded very tightly to the first substrate 11 and the second substrate 13, respectively. Therefore, in this application, the first conductive layer 121 and the second conductive layer 123 can be approximately considered as part of the first substrate 11 or the second substrate 13 in the stacking direction. The material in the dimming layer 122 at the groove structure 14 will be extruded, thus making the groove structure transparent or translucent. In one possible embodiment, the sealing structure 15 is integrally formed with the first substrate 11 and / or the second substrate 13.

[0225] Specifically, in one possible implementation, the groove structure 14 is formed by melting and shrinking the first substrate 11 and / or the second substrate 13 toward the functional layer 12.

[0226] Specifically, in this embodiment, the longitudinal section of the portion of the groove structure 14 located on the first base 11 is trapezoidal. In other possible embodiments, the longitudinal section of the groove structure 14 may also be rectangular, elliptical, etc., and this application does not limit it in this regard.

[0227] The groove structure 14 penetrates the functional layer 12, connecting the surface of the functional layer 12 adjacent to the first substrate 11 and / or the surface of the functional layer 12 adjacent to the second substrate 13. The first substrate 11, in its high-temperature molten state, flows through the groove structure 14 to the second substrate 13 under the influence of gravity, filling the groove structure 14 to form the sealing structure 15. It is understood that in other possible embodiments, the second substrate 13, in its high-temperature molten state, may also flow through the groove structure 14 to the first substrate 11 under the influence of gravity; or both the first substrate 11 and the second substrate 13 may simultaneously fill the groove structure 14. This application does not limit this to any particular embodiment.

[0228] It should be noted that, in this embodiment, the sealing structure 15 is formed by the melting and shrinking of the first substrate 11 toward the functional layer 12, so the side of the first substrate 11 away from the functional layer 12 has at least a partial indentation.

[0229] To avoid this problem, please refer to the following: Figure 50 , Figure 50 This is a cross-sectional schematic diagram of the dimming film provided in Embodiment (II) of this application. Specifically, before forming the groove structure 14, a raised portion is pre-filled in the corresponding part of the first substrate 11 to form a filling portion 101. After the first substrate 11 melts and flows into the groove structure 14, and cools and solidifies, the filling portion 101 can supplement the recessed portion of the first substrate 11. After melting, the side of the first substrate 11 facing away from the functional layer 12 is relatively flat. In this embodiment, the thickness of the filling portion 101 in the lamination direction is 1 / 3 to 1 / 2 times the thickness of the first substrate 11 or the second substrate 13 in the lamination direction.

[0230] For other possible implementations, please refer to [the relevant documentation]. Figure 51 , Figure 51This is a cross-sectional schematic diagram of the dimming film provided in Embodiment (III) of this application. The difference between Embodiment (III) and Embodiment (II) is that, while forming the groove structure 14, the filling portion 101 is filled into the recessed part of the first substrate 11, making the surface of the first substrate 11 facing away from the functional layer 12 relatively flat. Visually, the groove structure 14 essentially disappears, increasing the cost but improving the aesthetics. In particular, when the dimming element 1 is applied to applications such as frameless car windows (but not limited thereto), it is preferable to form the groove structure 14 while simultaneously "filling" the sealing structure 15 with the filling portion 101. It should be noted that the filling portion 101 and the first substrate 11 can be made of the same or different materials; "filling" can mean roughly filling, such that the main body of the substrate and the upper surface of the filling portion are roughly flush, or it can mean completely filling, making the main body of the substrate and the upper surface of the filling portion flush. It is understood that the groove structure 14 can also be formed first, and then the sealing structure 15 can be "filled" with the filling portion 101.

[0231] In one possible implementation, please refer to [the relevant documentation / reference]. Figure 49 and Figure 52 , Figure 52 This is a cross-sectional view of the dimming component provided in embodiment (four) of this application. The longitudinal section of the sealing structure 15 at the groove structure 14 is U-shaped, I-shaped, II-shaped, III-shaped, or a combination thereof.

[0232] Specifically, such as Figure 49 As shown, the longitudinal section of the sealing structure 15 at the groove structure 14 is U-shaped; as Figure 52 As shown, the longitudinal section of the sealing structure 15 at the groove structure 14 is type III. It can be understood that the type III sealing structure 15, together with the first substrate 11 and the second substrate 13, can be considered to have six force-bearing contact surfaces, while the U-shaped sealing structure 15 can be considered to have two force-bearing contact surfaces. Therefore, under the same conditions, the type III sealing structure 15 provides stronger peel strength than the U-shaped sealing structure 15. On the other hand, the U-shaped sealing structure 15 is simpler and easier to manufacture than the type III sealing structure 15.

[0233] Understandably, different shapes of the sealing structure 15 result in different adjustments to the peel strength of the dimming element 1. (See attached document) Figure 49 Appendix Figure 52 These are merely some possible implementations and do not represent a limitation of the shape of the sealing structure 15 in this application. In other possible implementations, the sealing structure 15 may also have other shapes, which are not limited in this application.

[0234] In one possible implementation, please refer again. Figure 48 The groove structure 14 includes a stepped structure or a groove structure. When the groove structure 14 is a groove structure, a dam structure 16 is provided at the periphery of the groove structure 14. The dam structure 16 completely electrically isolates the outer dimming element 1 of the groove from the inner dimming element 1 of the groove. The dam structure 16 is 0.5mm-10mm away from the groove structure 14.

[0235] It should be noted that the dam structure 16 includes the first base 11, the functional layer 12 and the second base 13 arranged in sequence. However, after the dimming component 1 completes the edge sealing, the dam structure 16 loses its dimming function and exists as a further protection for the sealing structure 15.

[0236] In this embodiment, the distance between the dam structure 16 and the groove structure 14 is 0.5mm-10mm. Preferably, the distance between the dam structure 16 and the groove structure 14 is 3mm-7mm. Specifically, the distance between the dam structure 16 and the groove structure 14 can be 5.1mm, 5.7mm, 6.4mm, etc., and this application does not limit it.

[0237] When the groove structure 14 is a stepped structure, please refer to the following: Figure 53 , Figure 53 This is a cross-sectional schematic diagram of the dimming film provided in Embodiment (V) of this application. The dam structure 16 in the periphery of the groove structure 14 is cut off to form the dimming element 1 with almost no non-dimming area, in order to meet the manufacturing needs of emerging frameless dimming laminated glass or other components and structures.

[0238] In one possible implementation, please refer again. Figure 48 The dimming element 1 further includes a conductive element 17, which is electrically connected to the first conductive layer 121 and the second conductive layer 123, respectively. The conductive element 17 transmits current to the first conductive layer 121 and the second conductive layer 123, thereby energizing the dimming element 1. It is understood that when the conductive element 17 stops transmitting current to the first conductive layer 121 and the second conductive layer 123, the dimming element 1 enters a de-energized state.

[0239] The conductive element 17 includes a first electrode and a second electrode. The first electrode is electrically connected to the first conductive layer 121, and the second electrode is electrically connected to the second conductive layer 123.

[0240] In one possible implementation, please refer to [the relevant documentation / reference]. Figure 54 , Figure 54This is a top view schematic diagram of the dimming component provided in embodiment (vi) of this application. The dimming component 1 further includes at least one notch 18, and the opening direction of the notch 18 can be approximately perpendicular to the stacking direction of the dimming component 1 and outward.

[0241] Specifically, the opening direction of the notch 18 is as follows: Figure 54 As indicated by the arrow. In this embodiment (six), the notch 18 is U-shaped. In other possible embodiments, the notch 18 can also be V-shaped or other shapes, and the sizes can also be different. These are not all listed in the accompanying drawings, and this application does not limit the shape of the notch 18. It should be noted that the notch is preferably formed before the dimming component is edge-sealed.

[0242] It should be noted that many types of glass, such as windshields, door windows, and sunroofs in vehicles, are currently shaped like hyperboloids. Therefore, a flat film cannot be laid out properly on hyperboloid glass, resulting in numerous wrinkles.

[0243] Understandably, in this embodiment (six), by creating at least one notch 18 around the periphery of the dimming element 1, the notch 18 area of ​​the molded dimming element 1 is hidden under the black edge of the dimming element 1, effectively preventing the appearance of wrinkles. Furthermore, by sealing the notch 18 area and the outer periphery of the dimming element 1, the functional layer 12 of the dimming element 1 can be isolated from the outside world, preventing it from being affected by external moisture and plasticizers.

[0244] Next, a method for manufacturing a dimming element according to the dimming element 1 provided in this application will be described. This application also provides a method for manufacturing a dimming element, which can be referred to in conjunction with the description. Figure 55 , Figure 55 This is a schematic flowchart of the manufacturing method of the dimming component provided in Embodiment (VII) of this application. The manufacturing method of the dimming component includes steps S801, S802, S803, S804, S805, and S806. The detailed descriptions of steps S801, S802, S803, S804, S805, and S806 are as follows.

[0245] S801, a dimming component is provided, the dimming component comprising a first substrate, a functional layer and a second substrate stacked sequentially;

[0246] Specifically, the dimming element 1 is described above and will not be repeated here.

[0247] S802, a processing mold is provided on the side of the first substrate away from the functional layer, and a support platform is provided on the side of the second substrate away from the functional layer;

[0248] Please refer to the following for details. Figure 56 , Figure 56 This is a schematic diagram of the mold and support platform provided in embodiment (eight) of this application. In this embodiment, the mold 2 is in the shape of a wheel and abuts against the first substrate 11. When the mold 2 begins to press against the first substrate 11, the support platform vibrates at a high frequency, pulverizing the functional layer of the first substrate 11 that is in contact with the mold 2 and pushing it to both sides of the mold 2; then the first substrate and the second substrate rub directly against each other, melting at high temperature; the sub-millimeter film edge sealing is completed in a sub-second time; the wheel continues to rotate at a uniform speed, repeating the above process in a new position. In this way, the edge sealing work continues continuously until the outer perimeter is fully sealed.

[0249] The support platform 3 can be a round, flat-surfaced anvil, which abuts against the second base 13 and is used to support the dimming component 1. When the mold 2 rolls, the mold 2 also drives the dimming component 1 to move in a translational motion along the rolling direction of the mold 2 on the support platform 3, so as to polish different parts of the dimming component 1.

[0250] S803, the mold presses the first base, and vibrates back and forth relative to the support platform in a horizontal direction parallel to the mold direction and parallel to the ground plane, generating local friction on the functional layer.

[0251] Specifically, when the mold 2 polishes the first base 11, the first base 11 and the functional layer 12 generate local friction due to continuous vibration and displacement. At the same time, the support platform 3 vibrates at high frequency in a direction parallel to the mold 2, and drives the second base 13 to vibrate and displace, thereby causing the second base 13 and the functional layer 12 to generate local friction. The local friction generates heat and the temperature rises, making it easier for the local functional layer adjacent to the mold to be pulverized and pushed to both sides of the mold. At the same time, the first base and the second base locally become molten near the mold.

[0252] In this embodiment, since the structural strength of the dimming layer 122 is weaker than that of the first conductive layer 121 and the second conductive layer 123, under the local friction of the first substrate 11 and the second substrate 13, the dimming layer 122 in the functional layer 12 is first rubbed away and then pushed by the mold 2 to both sides of the grinding direction of the mold 2. Further, the first conductive layer 121 and the second conductive layer 123 rub and tear against each other and are pushed by the mold 2 to both sides of the grinding direction of the mold 2 to form the groove structure 14.

[0253] S804, the functional layer forms a groove structure under the action of local friction, and after the first substrate and the second substrate abut against each other in a high temperature molten state, they are cooled and solidified to form a dense sealing structure.

[0254] Under continuous localized friction, the temperatures of the first substrate 11 and the second substrate 13 rise rapidly, reaching the melting temperature after passing the softening temperature and subsequently melting locally. Due to gravity, the molten portion of the first substrate 11 flows to the second substrate 13 and fuses with the molten portion of the second substrate 13, forming a groove structure. After the molten portions of the first substrate 11 and the second substrate 13 cool and solidify, the sealing structure 15 is formed. The sealing structure 15 is firmly connected to the first substrate 11 and the second substrate 13, enhancing the peel strength of the overall structure of the dimming element 1.

[0255] Peel strength refers to the maximum force required to peel bonded materials apart per unit width from their contact surface. For example, in this embodiment, before the sealing structure 15 is formed, the peel strength of the dimming element 1 at a peel angle of 180° is 0.059 N (Newtons) / mm; after the sealing structure 15 is formed, at the same peel angle, the peel strength at the sealing structure 15 is 2.5 N / mm, an increase of 50 times.

[0256] It should be noted that in this embodiment, by adjusting parameters such as the grinding speed of the mold 2 and the vibration frequency of the support platform 3, the process of step S804 is completed within 0.01-100 milliseconds. It is understood that, for example, increasing the grinding speed of the mold 2 and raising the vibration frequency of the support platform 3 can shorten the time taken for step S804; conversely, decreasing the grinding speed of the mold 2 and lowering the vibration frequency of the support platform 3 can prolong the time taken for step S804. This application does not impose any limitations on this and adjustments can be made according to actual circumstances.

[0257] S805, at least one complete sealing structure is formed within the outer peripheral edge of the dimming element to complete the edge sealing.

[0258] Specifically, in this embodiment, the mold 2 can be rolled to move the dimming component 1, thereby repeating the above steps at different parts of the dimming component 1 to form multiple continuous sealing structures 15. These continuous sealing structures 15 form a single unit, connecting the opposing side boundaries of the dimming component 1 perpendicular to the stacking direction, thus completing the sealing. In other possible embodiments, the above steps can be repeated on the other side of the dimming component 1 to form another sealing structure 15 connecting the opposing side boundaries of the dimming component 1 perpendicular to the stacking direction. It is understood that the functional layer 12 located between adjacent sealing structures 15 is protected by the sealing structures 15, preventing damage to the functional layer 12 from external gases or solvents.

[0259] It should be noted that in this embodiment, the sealing structure 15 is substantially transparent or semi-transparent. When the dimming element 1 is in the power-off state, the PDLC is a high-haze opaque film, and the SPD and EC are colored films. Therefore, the manufacturing method of the dimming element provided in this application has a high degree of visualization, and the integrity and reliability of the sealing edge can be judged based on characteristics such as the transparency of the sealing structure 15 of the dimming element 1.

[0260] Understandably, in this embodiment, after the first substrate 11 melts at high temperature, it flows into and fills the groove structure 14, so that after the first substrate 11 cools and solidifies, it forms the sealing structure 15. The sealing structure 15 is firmly connected to the second substrate 13, enhancing the peel strength of the dimming element 1. At the same time, the surface structure of the dimming element 1 is relatively uniform, and its overall strength is high, making it less susceptible to damage.

[0261] In one possible implementation, the distance between the mold 2 and the support platform 3 is less than the thickness of the dimming element 1 in the stacking direction.

[0262] Specifically, the distance between the mold 2 and the support platform 3 is less than the thickness of the dimming component 1 in the stacking direction, so that while the mold 2 exerts a compressive force on the first substrate 11, the support platform 3 exerts a compressive force on the second substrate 13. In other words, the dimming component 1 is sandwiched between the mold 2 and the support platform 3.

[0263] Understandably, the smaller the distance between the mold 2 and the support platform 3, the greater the compressive force exerted by the mold 2 on the first substrate 11, and the greater the compressive force exerted by the support platform 3 on the second substrate 13. Although a smaller distance between the mold 2 and the support platform 3 results in better local friction between the first substrate 11 and the second substrate 13 and the functional layer 12, the distance between the mold 2 and the support platform 3 should not be too small to avoid damage to the dimming component 1 caused by the compressive force exerted by the mold 2 and the support platform 3. In this embodiment, the difference between the thickness of the dimming component 1 in the stacking direction and the distance between the mold 2 and the support platform 3 should be an intensity threshold. The intensity threshold may vary depending on the layer structure and material of the dimming component 1, and this application does not impose any limitations on it.

[0264] In one possible implementation, the support platform 3 generates high-frequency vibrations, with the vibration frequency ranging from 20kHz to 40kHz.

[0265] Specifically, the support platform 3 generates high-frequency vibrations to cause the second substrate 13 to vibrate, thereby generating localized friction with the functional layer 12. It is understood that the vibration frequency of the support platform 3 affects the degree of localized friction between the second substrate 13 and the functional layer 12.

[0266] In this embodiment, the vibration frequency range of the support platform 3 is 20kHz-40kHz, preferably 27kHz-36kHz. Specifically, the vibration frequency of the support platform 3 can be 29kHz, 31kHz, or 35kHz, and this application does not limit it.

[0267] In one possible implementation, the mold 2 includes at least one mold 21 surrounding the outside of the mold 2, the width of the mold 21 surrounding the mold 2 ranging from 0.2mm to 10mm.

[0268] Specifically, the grinding of the first substrate 11 by the mold 21 mainly involves localized friction between the mold 21 and the first substrate 11. In other words, the formation and shape of the groove structure 14 are related to the mold 21. The width of the mold 21 enclosing the first substrate 11 directly affects the aperture size of the groove structure 14. In this embodiment, the width of the mold 21 enclosing the first substrate 11 on the mold 2 ranges from 0.2mm to 10mm. Preferably, the width ranges from 0.5mm to 3mm. More preferably, the width ranges from 0.8mm to 2.6mm. Specifically, the width can be 1mm, 1.5mm, 2.0mm, etc., as long as it does not affect the passage of the molten portion of the groove structure 14 through the first substrate 11 or the second substrate 13. This application does not impose any limitations on this.

[0269] like Figure 56 As shown, when the number of molds 21 is greater than or equal to two, the multiple molds 21 are spaced apart, which can form groove structures 14 of different shapes, and thus seal structures 15 of different shapes. It should be noted that the multiple molds 21 may involve at least one mold 21 generating localized friction with the first substrate 11, while another mold 21 generates localized friction with the second substrate 12. It is understood that the shape of the mold 21 will affect the shape of the groove structure 14. The mold 21 can also be a single mold, including at least one raised or recessed pattern parallel to the outer side of the mold, such as simple patterns like rectangles or circles, or various complex patterns such as lace, serrations, or tire treads, to make the final seal structure 15 formed within the groove structure 14 more aesthetically pleasing. The groove structure can be single-channel, double-channel, or multi-channel. When there are two or more channels, it is preferable that at least one channel is continuous and complete. In addition, the mold 21 may have a special shape and may have one or more teeth (such as tire treads). The teeth may be continuous, discontinuous, or staggered, which is beneficial to forming the sealing structure 15 with strong peel strength and sealing strength. This application does not limit this.

[0270] In one possible implementation, the groove structure 14 extends through the functional layer 12, connecting the surface of the functional layer 12 adjacent to the first substrate 11 and / or the surface of the functional layer adjacent to the second substrate 13.

[0271] In one possible implementation, please refer again. Figure 54The groove structure 14 includes a stepped structure or a groove structure. The dimming component also has a dam structure located around the groove structure. After "forming at least one sealing structure in the outer periphery of the dimming component to complete the edge sealing", the manufacturing method of the dimming component further includes step S806. The detailed description of step S806 is as follows.

[0272] S806, the dam structure around the periphery of the groove structure is removed to form the stepped structure. Specifically, the dam structure 16 can also be removed, especially when making frameless dimming laminated glass without printed black edges (not limited thereto), to reduce the volume occupied by the dimming element 1, so that the dimming element 1 can be integrated into laminated glass or other components or structures with fewer non-dimming edges.

[0273] In one possible implementation, the mold 2 is made of metal. Specifically, the mold 2 is made of metal because metal generally has good heat dissipation and strength. It is understood that, on the one hand, when the mold 2 processes the first substrate 11, friction generates significant heat. When the mold 2 is made of metal, it allows for better heat dissipation, thus facilitating continuous operation. On the other hand, the mold 2 needs a certain strength to process the first substrate 11, and metal generally possesses high strength to facilitate the processing of the first substrate 11 by the mold 2.

[0274] In one possible implementation, please refer again. Figure 49 The groove structure 14 penetrates the functional layer 12 and connects the surface of the functional layer 12 adjacent to the first substrate 11 and / or the surface of the functional layer 12 adjacent to the second substrate 13.

[0275] Specifically, the groove structure 14 connects the surface of the functional layer 12 adjacent to the first substrate 11 and the surface of the functional layer 12 adjacent to the second substrate 13, so that the first conductive layer 121, the dimming layer 122, and the second conductive layer 123 form a torn structure on the side adjacent to the groove structure 14. It should be noted that in the prior art, lasers or mechanical devices may be used to cut the dimming element 1, often causing short circuits between the first conductive layer 121 and the second conductive layer 123, requiring a high-voltage breakdown step to break down the short circuit.

[0276] Understandably, in this embodiment, the first conductive layer 121, the dimming layer 122, and the second conductive layer 123 form a discontinuity structure on the side adjacent to the groove structure 14, which avoids the problem of short circuit between the first conductive layer 121 and the second conductive layer 123 and saves the manufacturing steps of the dimming element 1.

[0277] In one possible implementation, the thicknesses of the first substrate 11 and the second substrate 13 in the stacking direction range from 30 μm to 200 μm, respectively. The functional layer 12 includes a first conductive layer 121, a dimming layer 122, and a second conductive layer 123 stacked sequentially. The thicknesses of the first conductive layer 121 and the second conductive layer 123 in the stacking direction range from 0.1 μm to 5 μm, respectively, and their sheet resistance ranges from 5 to 200 Ω / □, respectively. The thickness of the dimming layer 122 in the stacking direction ranges from 1 μm to 20 μm.

[0278] It should be noted that the dimming element 1 is typically used in glass. To avoid excessive overall thickness of the glass, in this embodiment, the thickness range of the first substrate 11 and the second substrate 13 in the stacking direction is 30μm-200μm, respectively. Preferably, the thickness range of the first substrate 11 and the second substrate 13 in the stacking direction is 45μm-185μm, respectively. Specifically, the thickness of the first substrate 11 and the second substrate 13 in the stacking direction can be 50μm, 100μm, 180μm, etc., and this application does not limit this.

[0279] Specifically, the thicknesses of the first conductive layer 121 and the second conductive layer 123 in the stacking direction range from 0.1 μm to 5 μm, respectively. Preferably, the thicknesses of the first conductive layer 121 and the second conductive layer 123 in the stacking direction range from 0.5 μm to 3 μm, respectively. More specifically, the thicknesses of the first conductive layer 121 and the second conductive layer 123 in the stacking direction can be 1 μm, 1.7 μm, 2.4 μm, etc. It is understood that in other possible embodiments, the thicknesses of the first conductive layer 121 and the second conductive layer 123 in the stacking direction can be different, and this application does not limit this.

[0280] In this embodiment, it should be noted that when the dimming element 1 is a PDLC, the thickness of the dimming layer 122 in the stacking direction ranges from 10μm to 20μm; when the dimming element 1 is an SPD or EC, the thickness of the dimming layer 122 in the stacking direction ranges from 1μm to 20μm. Preferably, the thickness of the dimming layer 122 in the stacking direction ranges from 4μm to 18μm. Specifically, the thickness of the dimming layer 122 in the stacking direction can be 7μm, 9μm, 13μm, etc., and this application does not limit this.

[0281] In one possible implementation, the first substrate 11 and the second substrate 13 are made of any one of PET, PMMA, and PC.

[0282] Specifically, polyethylene terephthalate (PET), polymethyl methacrylate (PMMA), and polycarbonate (PC) are all polymer materials with excellent thermoplasticity. Preferably, the first substrate 11 and the second substrate 13 are made of PET. It is understood that the first substrate 11 and the second substrate 13 are selected from polymer materials with excellent thermoplasticity so that the first substrate 11 and the second substrate 13 can melt better under the action of local friction, and fuse together through the groove structure 14, forming the sealing structure 15 after cooling and solidification.

[0283] It is understood that in other possible implementations, the materials of the first substrate 11 and the second substrate 13 may also be other materials, as long as it does not affect the formation of the sealing structure 15, and this application does not limit this.

[0284] This application also provides a light-transmitting component 4, which can be referred to in conjunction with the application. Figure 57 , Figure 57 This is a cross-sectional schematic diagram of the light-transmitting component provided in embodiment (ix) of this application. The light-transmitting component 4 includes a first light-transmitting element 41, a second light-transmitting element 42, and a dimming element 1 as described above, wherein the dimming element 1 is sandwiched between the first light-transmitting element 41 and the second light-transmitting element 42.

[0285] Specifically, the dimming element 1 is described above and will not be repeated here. The light-transmitting component 4 typically also includes a connecting portion 43, through which the first light-transmitting element 41 is connected to the first substrate 11 of the dimming element 1, and the second light-transmitting element 42 is connected to the second substrate 13 of the dimming element 1, through the connecting portion 43. The first light-transmitting element or the second light-transmitting element may be made of inorganic glass, organic glass, or a mixture of both, respectively.

[0286] In this embodiment, the connecting part 43 is made of polyvinyl butyral (PVB) material. It is understood that the dimming element 1, applied to the light-transmitting component 4, has strong peel strength and can be firmly fixed in the light-transmitting component 4. The dimming element 1 has a relatively uniform layer structure, high overall strength, and is not easily damaged, while also making the light-transmitting component 4 more aesthetically pleasing.

[0287] It should be further noted that in existing technologies, the adhesive layer in light-transmitting components, such as PVB, often requires the addition of plasticizers and other materials to improve the performance of the polymer material. When the dimming component is made of PDLC material, these plasticizers and other materials cause approximately 3-15mm of the outer periphery of the dimming component to lose its dimming function, becoming transparent and losing its dimming effect, and this effect will further diffuse over time. Even when using plasticizer-free materials, such as EVA laminates, high-temperature conditions will still cause a degradation of 2-12mm. Existing dimming components, after edge sealing, also require a 1000-hour thermal aging test at 110℃. Experiments show that the dimming component manufactured using the method provided in this application loses its dimming function only in a portion of about 1mm, or even less than 0.9mm, on its outer periphery, and there is no further diffusion problem, representing a significant improvement and superior technical effect compared to existing technologies.

[0288] This application also provides a vehicle 5, please refer to it as well. Figure 58 , Figure 58 This is a top view of a vehicle provided for embodiment (ten) of this application. The vehicle 5 employs a light-transmitting component 4 as described above.

[0289] It should be noted that, typically, the vehicle 5 also includes a frame 51, on which the light-transmitting component 4 is mounted. Specifically, the light-transmitting component 4 is described above and will not be repeated here.

[0290] Although embodiments of this application have been shown and described above, it is understood that the above embodiments are exemplary and should not be construed as limiting this application. Those skilled in the art can make changes, modifications, substitutions and variations to the above embodiments within the scope of this application, and such improvements and refinements are also considered to be within the protection scope of this application.

Claims

1. A dimming element, characterized in that, The dimming element includes a first electrode, a second electrode, and a dimming film. The dimming film includes a first substrate, a first conductive layer, a dimming layer, a second conductive layer, and a second substrate stacked sequentially. The dimming layer, the first conductive layer, and the second conductive layer form a receiving space. The first electrode and the second electrode are disposed within the receiving space. The first electrode is attached to the side of the first conductive layer opposite to the first substrate and is electrically connected to the first conductive layer. The second electrode is attached to the side of the second conductive layer opposite to the second substrate and is electrically connected to the second conductive layer. The dimming element has a sealing structure, at least a portion of which is disposed along the periphery of the dimming element. The sealing structure is formed by the first substrate and the second substrate abutting and melting against each other. The method for preparing the sealing structure includes: Provide the first and second processed parts; The dimming film is disposed between the first processed component and the second processed component, wherein the first processed component abuts against the first substrate of the dimming film, and the second processed component abuts against the second substrate of the dimming film; The first processed component rotates relative to the dimming film, and the second processed component drives the dimming film to vibrate relative to the first processed component. The first substrate and the second substrate are heated and reach a regional melting state, and then fuse together.

2. The dimming element as described in claim 1, characterized in that, The containment space includes a first subspace and a second subspace spaced apart from each other, with the first electrode disposed in the first subspace and the second electrode disposed in the second subspace.

3. The dimming element as described in claim 1, characterized in that, The first and second bases at the sealing structure are connected.

4. The dimming element as described in claim 1, characterized in that, The end of the sealing structure away from the second substrate is located within the first substrate, and / or the end of the sealing structure away from the first substrate is located within the second substrate.

5. The dimming element as described in claim 4, characterized in that, The distance between the end of the sealing structure away from the second substrate and the side surface of the first substrate facing away from the dimming layer is 1 / 3 to 1 / 2 times the thickness of the first substrate, and / or the distance between the end of the sealing structure away from the first substrate and the side surface of the second substrate facing away from the dimming layer is 1 / 3 to 1 / 2 times the thickness of the second substrate.

6. The dimming element as described in claim 1, characterized in that, The dimming component further includes a first adhesive layer and a second adhesive layer. The first electrode is bonded to and electrically connected to the first conductive layer through the first adhesive layer, and the second electrode is bonded to and electrically connected to the second conductive layer through the second adhesive layer.

7. A method for manufacturing a dimming component, characterized in that, The manufacturing method includes: A dimming film is provided, the dimming film comprising a first film layer, a dimming layer and a second film layer stacked thereon, the first film layer comprising a first substrate and a first conductive layer stacked thereon, the second film layer comprising a second substrate and a second conductive layer stacked thereon, the dimming layer being located between the first conductive layer and the second conductive layer, and the dimming film comprising a first region and a second region; The first film layer and the second film layer located in the first region are peeled away from each other in a direction away from each other to expose the dimming layer in the first region; Remove at least a portion of the dimming layer from the first conductive layer located in the first region; A first electrode is attached to a first conductive layer located in the first region; Remove at least a portion of the dimming layer from the second conductive layer located in the first region; A second electrode is attached to a second conductive layer located in the first region; A sealing structure is formed at the periphery of the dimming film, and the sealing structure is formed by the first substrate and the second substrate abutting and melting each other; The method for preparing the sealing structure includes: Provide the first and second processed parts; The dimming film is disposed between the first processed component and the second processed component, wherein the first processed component abuts against the first substrate of the dimming film, and the second processed component abuts against the second substrate of the dimming film; The first processed component rotates relative to the dimming film, and the second processed component drives the dimming film to vibrate relative to the first processed component. The first substrate and the second substrate are heated and reach a regional melting state, and then fuse together.

8. The method for manufacturing a dimming component as described in claim 7, characterized in that, "Peeling the first and second film layers located in the first region away from each other in a direction away from each other to expose the dimming layer in the first region" includes: The dimming film located in the first region is cut along a first preset path to form a first sub-region; The first film layer and the second film layer located in the first sub-region are peeled away from each other in a direction away from each other to expose the dimming layer located in the first sub-region; The dimming film located in the first region is cut along the second preset path to form the second sub-region; The first and second film layers located in the second sub-region are peeled away from each other in a direction away from each other to expose the dimming layer located in the second sub-region.

9. The method for manufacturing a dimming element as described in claim 7 or 8, characterized in that, "A sealing structure is formed around the periphery of the dimming film." include: The first base and the second base are connected at the sealing structure.

10. A dimming element, characterized in that, The dimming element includes a dimming film, which comprises a first substrate, a functional layer, and a second substrate stacked sequentially. A sealing structure is provided around the functional layer, and the sealing structure is formed by the first substrate and the second substrate wrapping the functional layer. At least one groove structure is provided on the outer edge of the dimming element, and the sealing structure is located at the groove structure. The sealing structure is formed by the first substrate and the second substrate abutting and melting each other. The method for preparing the sealing structure includes: Provide the first and second processed parts; The dimming film is disposed between the first processed component and the second processed component, wherein the first processed component abuts against the first substrate of the dimming film, and the second processed component abuts against the second substrate of the dimming film; The first processed component rotates relative to the dimming film, and the second processed component drives the dimming film to vibrate relative to the first processed component. The first substrate and the second substrate are heated and reach a regional melting state, and then fuse together.

11. A dimming element, characterized in that, The dimming component includes a dimming film, which includes a first substrate, a functional layer, and a second substrate stacked sequentially. The first substrate and the second substrate each include a substrate body portion and a substrate edge portion. The functional layer is located between the substrate body portion of the first substrate and the substrate body portion of the second substrate. The substrate edge portion forms a sealing structure for covering the functional layer. At least one groove structure is provided on the outer edge of the dimming element, and the sealing structure is located at the groove structure; the sealing structure is formed by the first substrate and the second substrate abutting and melting against each other. The method for preparing the sealing structure includes: Provide the first and second processed parts; The dimming film is disposed between the first processed component and the second processed component, wherein the first processed component abuts against the first substrate of the dimming film, and the second processed component abuts against the second substrate of the dimming film; The first processed component rotates relative to the dimming film, and the second processed component drives the dimming film to vibrate relative to the first processed component. The first substrate and the second substrate are heated and reach a regional melting state, and then fuse together.

12. The dimming element as described in claim 10 or 11, characterized in that, The functional layer includes a first conductive layer, a dimming layer, and a second conductive layer stacked sequentially.

13. The dimming element as described in claim 10 or 11, characterized in that, The groove structure has a filling part on the side opposite to the sealing structure.

14. The dimming element as described in claim 13, characterized in that, The thickness of the filling portion in the lamination direction is 1 / 3 to 1 / 2 times the thickness of the first substrate or the second substrate in the lamination direction.

15. The dimming element as described in claim 10 or 11, characterized in that, The groove structure is formed by melting and shrinking the first substrate and / or the second substrate toward the functional layer.

16. The dimming element as described in claim 10 or 11, characterized in that, The groove structure extends through the outer peripheral edge of the functional layer, connecting the surface of the functional layer adjacent to the first substrate and / or the surface of the functional layer adjacent to the second substrate.

17. The dimming element as described in claim 10 or 11, characterized in that, The groove structure includes a stepped structure or a trench structure.

18. The dimming element as described in claim 10 or 11, characterized in that, A dam structure is provided around the periphery of the groove structure, and the distance between the dam structure and the groove structure is 0.5mm-10mm.

19. A light-transmitting component, characterized in that, The light-transmitting component includes a first light-transmitting element, a second light-transmitting element, and a dimming element as described in any one of claims 1-6 and 10-18, wherein the dimming element is located between the first light-transmitting element and the second light-transmitting element.

20. A vehicle, characterized in that, The vehicle includes the light-transmitting component as described in claim 19.

Images