Wafer support plate with inclined support clamping

Abstract

The present application relates to a wafer support plate with inclined support and clamping, which belongs to the field of wafer production equipment. When the device of the present application is in use, the driving device moves the driving rod toward the center of the support plate, so that the connecting block and the connecting rod move toward the center of the support plate and compress the elastic member, and the top of the clamping column on the connecting rod moves away from the center of the support plate, thereby increasing the diameter of the circle formed by all the clamping columns, and the wafer can be placed on the clamping column from the top. Then, the force of the driving device on the driving rod is canceled, and the elastic member restores the connecting rod and the clamping column to their original position, thereby clamping the wafer. The wafer support plate with inclined support and clamping of the present invention has the advantage of firmly fixing the wafer, reducing the risk of the wafer being thrown away and damaged during rotation and cleaning.

Description

Technical Field

[0001] The present application belongs to the technical field of wafer production equipment, and in particular relates to a wafer support plate with inclined support and clamping. Background Art

[0002] A single wafer cleaning system cleans wafers one by one. It uses multiple cleaning solutions (usually three) on a rotating wafer support plate, performing sequential process operations and cleaning on the wafers. This system offers the advantages of stable quality and meeting process requirements.

[0003] Chinese invention patent CN113113328B discloses a cleaning plate structure and a single-wafer cleaning device, wherein the wafer is directly placed on a support column, which does not securely fix the wafer. This poses a risk of the wafer being thrown off and damaged during high-speed rotation. Summary of the Invention

[0004] The technical problem to be solved by the present invention is: to solve the deficiencies of the prior art, thereby providing a wafer supporting plate with inclined support and clamping that can clamp wafers.

[0005] The technical solution adopted by the present invention to solve its technical problem is:

[0006] A wafer support plate with tilted support and clamping, comprising:

[0007] A disc body having a middle hole in the middle thereof for being mounted on a rotating shaft so as to rotate driven by the rotating shaft. The disc body comprises a top surface and a bottom surface mounted at the bottom of the top surface, with a mounting space formed between the top surface and the bottom surface;

[0008] A support rod is provided on the top of the tray body and is used to support the wafer;

[0009] There are multiple clamping posts, each of which includes a bottom, a middle section located on the bottom, and a top section located at the top. The top section is provided with a recessed portion, and the recessed portion is used to clamp the wafer;

[0010] A claw mechanism, comprising a driving rod, a tilting block, a connecting rod, an elastic member, a connecting block, a limiting block and a mounting rod;

[0011] One end of the connecting rod is connected to the connecting block, and the other end of the connecting rod is hingedly provided with a mounting rod. The connecting block is provided with the driving rod, and the driving rod is used to connect with the driving device and to pull the driving rod axially;

[0012] The tilting block is arranged in the disc body, one end of the tilting block is hinged to the disc body, and the other end of the tilting block is hinged to the connecting block;

[0013] The elastic member is tilted against the tilting block to provide a force in the opposite direction to the pulling force of the driving device pulling the driving rod;

[0014] A clamping column is installed on the installation rod;

[0015] The connecting rod is restricted by the limiting block and can only move along the axial direction of the connecting rod.

[0016] Preferably, in the wafer supporting plate with inclined support and clamping of the present invention, the connecting block is a hollow U-shaped structure, and the inclined block is arranged inside the connecting block.

[0017] Preferably, the wafer support plate of the present invention has an inclined support and clamping, the clamping column is arranged on the plate body and can swing, the clamping column has a cavity inside, the mounting rod extends into the cavity, and the mounting rod can move freely in the cavity along the axial direction of the mounting rod.

[0018] Preferably, in the wafer support plate with inclined support and clamping of the present invention, a mounting hole is provided on the plate body, the clamping column is provided in the mounting hole, and a sealing piece is provided at the opening of the mounting hole.

[0019] Preferably, in the wafer support tray with inclined support and clamping of the present invention, the support rods are mounted on the tray body by threads, and the tops of the support rods are tapered to form a pointed tip at the top for supporting the wafer.

[0020] Preferably, in the wafer supporting plate with inclined support and clamping of the present invention, the recessed portion has a curved surface with a diameter gradually decreasing from bottom to top, and the wafer is supported by the curved surface.

[0021] Preferably, in the wafer support plate with inclined support and clamping of the present invention, the clamping claw mechanisms are arranged in a plurality along the plate body, all the support rods are arranged in a cocircle, and all the clamping columns are arranged in a cocircle.

[0022] Preferably, in the wafer supporting plate with inclined support and clamping of the present invention, two mounting rods are provided on each connecting rod.

[0023] The beneficial effects of the present invention are:

[0024] The wafer support tray with inclined support and clamping of the present invention is used by moving the driving rod toward the center of the support tray through the driving device, so that the connecting block and the connecting rod move toward the center of the support tray and compress the elastic member. The top of the clamping column on the connecting rod moves away from the center of the support tray, thereby increasing the diameter of the circle formed by all the clamping columns. The wafer can be placed on the clamping column from the top. Then, the force of the driving device on the driving rod is canceled, and the elastic member restores the connecting rod and the clamping column to their original positions, thereby clamping the wafer. The wafer support tray with inclined support and clamping of the present invention has the advantage of firmly fixing the wafer, reducing the risk of the wafer being thrown away and damaged during rotation and cleaning. BRIEF DESCRIPTION OF THE DRAWINGS

[0025] The technical solution of the present application is further described below with reference to the accompanying drawings and embodiments.

[0026] Figure 1 1 is a schematic structural diagram of a wafer support plate with tilted support and clamping according to an embodiment of the present application;

[0027] Figure 2 is a cross-sectional view of a wafer support plate with inclined support and clamping according to an embodiment of the present application;

[0028] Figure 3 1 is a bottom view of a wafer support plate with tilted support and clamping according to an embodiment of the present application;

[0029] Figure 4 is a cross-sectional view of a claw mechanism according to an embodiment of the present application;

[0030] Figure 5 This is a schematic structural diagram of a clamping column according to an embodiment of the present application;

[0031] The reference numerals in the figures are:

[0032] 1 disc;

[0033] 2 support rods;

[0034] 3 clamping column;

[0035] 11 middle hole;

[0036] 12 Bottom;

[0037] 13 shaft;

[0038] 14 top surface;

[0039] 15 mounting holes;

[0040] 31 bottom;

[0041] 32 middle section;

[0042] 33 top segment;

[0043] 34 cavity;

[0044] 41 Drive rod

[0045] 42 tilt blocks;

[0046] 43 connecting rod;

[0047] 44 elastic member;

[0048] 45 connection blocks;

[0049] 46 limit block;

[0050] 47 Mounting rod. DETAILED DESCRIPTION

[0051] It should be noted that, unless there is any conflict, the embodiments and features in the embodiments of this application can be combined with each other.

[0052] In the description of the present application, it should be understood that the terms "center", "longitudinal", "lateral", "up", "down", "front", "back", "left", "right", "vertical", "horizontal", "top", "bottom", "inside", "outside" and the like indicate orientations or positional relationships based on the orientations or positional relationships shown in the accompanying drawings, and are only for the convenience of describing the present application and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore cannot be understood as limiting the scope of protection of the present application. In addition, the terms "first", "second", etc. are only used for descriptive purposes and cannot be understood as indicating or implying relative importance or implicitly indicating the number of the indicated technical features. Therefore, features defined as "first", "second", etc. may explicitly or implicitly include one or more of the features. In the description of the present invention, unless otherwise specified, "multiple" means two or more.

[0053] In the description of this application, it should be noted that, unless otherwise expressly specified or limited, the terms "mounted," "connected," and "connected" should be understood in a broad sense. For example, they can refer to fixed connections, detachable connections, or integral connections; mechanical connections or electrical connections; direct connections or indirect connections through an intermediate medium; and internal connections between two components. Those skilled in the art will understand the specific meanings of the above terms in this application based on specific circumstances.

[0054] The technical solution of the present application will be described in detail below with reference to the accompanying drawings and in combination with embodiments.

[0055] Example

[0056] This embodiment provides a wafer support plate with tilted support clamping, such as Figure 1 and Figure 2 Shown, including:

[0057] A disk body 1 having a central hole 11 for mounting on a rotating shaft 13 to rotate driven by the rotating shaft 13. The disk body 1 includes a top surface 14 and a bottom surface 12 mounted at the bottom of the top surface 14, with a mounting space formed between the top surface 14 and the bottom surface 12.

[0058] Support rods 2, which are arranged on the top of the tray 1 and are used to support the wafer;

[0059] Clamping column 3, such as Figure 5 As shown, there are several of them, the clamping column 3 includes a bottom 31, a middle section 32 located on the bottom 31, and a top section 33 located at the top. The top section 33 is provided with a recessed portion, and the recessed portion is used to clamp the wafer;

[0060] Claw mechanism, such as Figure 3 and Figure 4 As shown, the claw mechanism includes a driving rod 41, a tilting block 42, a connecting rod 43, an elastic member 44, a connecting block 45, a limiting block 46 and a mounting rod 47;

[0061] One end of the connecting rod 43 is connected to the connecting block 45, and the other end of the connecting rod 43 is hingedly provided with a mounting rod 47. The connecting block 45 is provided with the driving rod 41, and the driving rod 41 is used to connect with the driving device for pulling the driving rod 41 in the axial direction;

[0062] The tilting block 42 is disposed in the tray body 1 , one end of the tilting block 42 is hinged to the tray body 1 , and the other end of the tilting block 42 is hinged to the connecting block 45 ;

[0063] The elastic member 44 is tilted against the tilting block 42 to provide a force in the opposite direction to the pulling force of the driving device pulling the driving rod 41;

[0064] The mounting rod 47 is provided with a clamping column 3;

[0065] The connecting rod 43 is restricted by the limiting block 46 and can only move along the axial direction of the connecting rod 43 .

[0066] The wafer support tray with tilted support and clamping of this embodiment is used. When the drive device is used, the drive rod 41 is moved toward the center of the support tray, so that the connecting block 45 and the connecting rod 43 move toward the center of the support tray and compress the elastic member 44. The top of the clamping column 3 on the connecting rod 43 moves away from the center of the support tray, thereby increasing the diameter of the circle formed by all the clamping columns 3. The wafer can be placed on the clamping column 3 from the top. Then, the force of the drive device on the drive rod 41 is canceled, and the elastic member 44 restores the connecting rod 43 and the clamping column 3 to their original positions, thereby clamping the wafer. The wafer support tray with tilted support and clamping of this embodiment has the advantage of firmly fixing the wafer, reducing the risk of the wafer being thrown away and damaged during rotation and cleaning.

[0067] Furthermore, the connecting block 45 has a hollow U-shaped structure, and the tilting block 42 is arranged inside the connecting block 45 .

[0068] Furthermore, the clamping column 3 is arranged on the disc body 1 and can swing. The clamping column 3 has a cavity 34 inside, and the mounting rod 47 extends into the cavity 34. The mounting rod 47 can move freely in the cavity 34 along the axial direction of the mounting rod 47.

[0069] Furthermore, a sealing piece (made of PTFE material) is provided at the opening of the mounting hole 15 to prevent water from flowing into the opening.

[0070] Furthermore, the support rod 2 is mounted on the disk body 1 through a thread, and the top of the support rod 2 is tapered to form a tip at the top to facilitate supporting the wafer.

[0071] Furthermore, the recessed portion has a curved surface with a diameter gradually decreasing from bottom to top, and the wafer is supported by the curved surface.

[0072] Furthermore, the claw mechanism is a plurality of claw mechanisms arranged along the disc body 1, such as Figure 3 Six are shown, all the support rods 2 are arranged in a cocircle, and all the clamping columns 3 are arranged in a cocircle.

[0073] Furthermore, each connecting rod 43 is provided with two mounting rods 47 , thereby forming a structure that can adapt to wafers of two sizes.

[0074] Based on the above-mentioned ideal embodiments of this application, and in accordance with the above description, relevant personnel can make various changes and modifications without departing from the scope of the technical concept of this application. The technical scope of this application is not limited to the contents of the specification, but must be determined according to the scope of the claims.

Claims

1. A wafer support plate with tilted support and clamping, characterized in that: include: A disk body (1), wherein the disk body (1) has a middle hole (11) in the middle thereof, and is used for being mounted on a rotating shaft (13) so as to rotate under the drive of the rotating shaft (13); the disk body (1) comprises a top surface (14) and a bottom surface (12) mounted at the bottom of the top surface (14); and a mounting space is formed between the top surface (14) and the bottom surface (12); A support rod (2), the support rod (2) being arranged on the top of the disk body (1) and used for supporting the wafer; There are a plurality of clamping columns (3), each of which comprises a bottom portion (31), a middle section (32) located on the bottom portion (31), and a top section (33) located at the top, wherein the top section (33) is provided with a recessed portion for clamping a wafer; A claw mechanism, the claw mechanism comprising a driving rod (41), a tilting block (42), a connecting rod (43), an elastic member (44), a connecting block (45), a limiting block (46) and a mounting rod (47); One end of the connecting rod (43) is connected to the connecting block (45), and the other end of the connecting rod (43) is hingedly provided with a mounting rod (47). The connecting block (45) is provided with the driving rod (41), and the driving rod (41) is used to connect to the driving device and to pull the driving rod (41) in the axial direction. The tilting block (42) is arranged in the disk body (1), one end of the tilting block (42) is hinged to the disk body (1), and the other end of the tilting block (42) is hinged to the connecting block (45); The elastic member (44) is tilted against the tilting block (42) to provide a force in the opposite direction to the pulling force of the driving device pulling the driving rod (41); A clamping column (3) is mounted on the mounting rod (47); The connecting rod (43) is restricted by the limiting block (46) and can only move along the axial direction of the connecting rod (43); The connecting block (45) has a hollow U-shaped structure, and the tilting block (42) is arranged inside the connecting block (45); The clamping column (3) is arranged on the disc body (1) and can swing. The clamping column (3) has a cavity (34) inside. The mounting rod (47) extends into the cavity (34). The mounting rod (47) can freely move in the cavity (34) along the axial direction of the mounting rod (47). The disc body (1) is provided with a mounting hole (15), the clamping column (3) is arranged in the mounting hole (15), and a blocking piece is provided at the opening of the mounting hole (15).

2. The wafer support plate with tilted support and clamping according to claim 1, characterized in that: The support rod (2) is mounted on the disk body (1) via a thread, and the top of the support rod (2) is conical to form a tip at the top to facilitate supporting the wafer.

3. The wafer support plate with tilted support and clamping according to claim 1, characterized in that: The recessed portion has a curved surface with a diameter gradually decreasing from bottom to top, and supports the wafer via the curved surface.

4. The wafer support plate with tilted support and clamping according to claim 1, characterized in that: The clamping claw mechanisms are arranged in a plurality along the disc body (1), all the support rods (2) are arranged in a cocircular manner, and all the clamping columns (3) are arranged in a cocircular manner.

5. The wafer support plate with tilted support and clamping according to claim 1, characterized in that: Two mounting rods (47) are provided on each connecting rod (43).

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