A pressure etching device

Abstract

The present invention relates to the technical field of silicon product processing equipment, and specifically to a pressurized etching device, comprising a base having an etching groove with an open top; a cover plate for covering the etching groove; an open groove provided on the inner side of the cover plate, and a liquid outlet provided on the cover plate; a liquid outlet assembly located in the open groove, wherein the nozzle can rotate circumferentially around the axis of the liquid outlet under the action of the recoil force generated when the nozzle sprays liquid; an annular clamping member for pressing the upper surface of the product, which is provided on the cover plate and surrounds the outer periphery of the open groove, and the clamping member can move axially relative to the cover plate. In the scheme, the spray direction of the nozzle on the nozzle is toward the peripheral wall of the open groove, that is, the nozzle sprays etching acid (hereinafter referred to as acid) to the side, rather than directly onto the surface of the product, thereby avoiding the problem of uneven etching caused by spraying liquid directly onto the surface of the product; the nozzle can stir the acid to make the acid mix more evenly, thereby improving the etching effect.

Description

Technical Field

[0001] The present invention relates to the technical field of silicon product processing equipment, and in particular to a pressure etching device. Background Art

[0002] Pressure etching refers to a processing method that uses mechanical supercharging, chemical corrosion and other effects to make the inner wall of the small hole of the silicon electrode product bright, flat and without processing damage;

[0003] As the market for silicon electrode products grows, the requirements for the inner walls of the small holes in these products are becoming increasingly stringent. These holes must be damage-free (0DoD). Chemical etching can remove the damage caused by machining and smooth the inner walls. However, since the holes in silicon electrodes are typically less than 1mm (even smaller than 0.4mm), acid cannot penetrate them smoothly. Therefore, the acid needs to be pressurized to ensure smooth passage through the holes and complete the chemical etching process.

[0004] In existing pressurized etching equipment, the acid is sprayed onto the product in a spraying manner. At this time, the acid will directly impact the surface of the product. Therefore, the closer the small holes on the product are to the position where the acid directly impacts, the faster the acid flows through, which will cause uneven etching of the product. Therefore, there is room for improvement. Summary of the Invention

[0005] In order to solve at least one of the technical problems mentioned in the background technology, an object of the present invention is to provide a pressurized etching device.

[0006] To achieve the above object, the present invention provides the following technical solutions:

[0007] A pressurized etching device, comprising:

[0008] a base having an etched groove with an open top;

[0009] A cover plate, used to cover the etching groove; an opening groove is provided on the inner side of the cover plate, and the cover plate is provided with a liquid outlet;

[0010] A liquid outlet assembly is located in the open slot and includes an end piece rotatably docked with the liquid outlet and a plurality of nozzles sequentially arranged around the end piece along a circumferential direction. The nozzles are all connected to the liquid outlet and have a plurality of spray holes formed on their side walls. The spray holes spray toward the circumferential wall of the open slot. The nozzles are capable of circumferentially rotating around the axis of the liquid outlet under the action of the recoil force generated by the spray holes when liquid is sprayed.

[0011] The annular pressing member is used to press the upper surface of the product. It is arranged on the cover plate and surrounds the outer periphery of the opening groove. The pressing member can move axially relative to the cover plate.

[0012] Compared with the existing technology, the advantages of adopting this solution are:

[0013] In this solution, the nozzle holes on the nozzle pipe spray towards the peripheral wall of the open groove, that is, the nozzle holes spray the etching acid (hereinafter referred to as acid) to the side instead of directly spraying it on the surface of the product. This can avoid the problem of uneven etching caused by spraying the acid directly on the surface of the product.

[0014] In addition, in this solution, while the nozzle hole sprays acid for etching, the nozzle hole sprays liquid and generates a recoil force, which drives the nozzle to rotate circumferentially. In this way, all the nozzles can rotate within the space of the open groove. In this way, the nozzle is equivalent to a stirring rod, which can stir the acid above the product and located in the open groove, so that the acid is mixed more evenly, thereby improving the etching effect.

[0015] Preferably, the cover plate can be flipped relative to the base to achieve closing or opening, wherein a first shaft is fixed on the base and a second shaft is fixed on the cover plate; the first shaft and the second shaft are coaxially arranged, and the ends of the two shafts are rotated and docked with each other; the second shaft has a cavity connected to the liquid outlet, and the first shaft is a hollow tubular structure, one end of which is connected to the cavity, and the other end constitutes the liquid inlet end.

[0016] Preferably, it also includes an acid liquid tank and a first pump. A liquid return port is provided at the bottom of the etching tank. The first pump is used to pump the acid liquid in the acid liquid tank to the liquid outlet. The acid liquid flowing out through the liquid return port flows back to the acid liquid tank through the acid return pipeline.

[0017] Preferably, it also includes a water tank and a second pump, and the water flowing out through the liquid return port flows back to the water tank through the return water pipeline, and the second pump is used to pump water in the water tank to the liquid outlet; wherein the acid return pipeline and the return water pipeline are respectively provided with an acid return valve and a return water valve.

[0018] Preferably, the acid tank has an acid outlet, and the water tank has a water outlet; the acid outlet is provided with a first pipeline, and the water outlet is provided with a second pipeline; the first pipeline and the second pipeline are converged at one end of the main pipeline, and the other end of the main pipeline is connected to the liquid outlet; the first pump is provided in the first pipeline, and the second pump is provided in the second pipeline; wherein, the first pipeline is provided with a first valve, and the second pipeline is provided with a second valve.

[0019] Preferably, a purge pipeline is further included, which includes a main pipeline and two branch pipelines connected to one end of the main pipeline, the two branch pipelines are respectively connected to the first pipeline and the second pipeline, and are respectively located downstream of the first valve and the second valve; wherein, a third valve is provided on the main pipeline, and a one-way valve is provided on both branch pipelines.

[0020] Preferably, one end of the acid return pipeline extends into the acid liquid tank to form an acid return end; a buffer tank is provided in the acid liquid tank; the buffer tank has a bottom wall, the acid return end is located in the buffer tank and faces the bottom wall of the buffer tank; and an acid return port is provided on the side wall of the buffer tank.

[0021] Preferably, the base is provided with a plurality of side clamping mechanisms distributed in sequence along the circumference of the etching groove, the side clamping mechanism includes a cylinder and a clamping block provided at the output shaft end of the cylinder, and the clamping block is used to press the peripheral wall of the product.

[0022] Preferably, a supporting surface for supporting the product is provided on the top of the etching groove; a lower sealing ring surrounding the periphery of the etching groove is provided on the supporting surface, and / or an upper sealing ring is provided on the lower wall of the pressing member.

[0023] Preferably, the cover plate can be flipped relative to the base to achieve closing or opening; a driving assembly is provided between the cover plate and the base, and the driving assembly is used to provide power to drive the cover plate to flip for opening or closing.

[0024] Other advantages and effects of the present invention are explained in detail in the detailed description and drawings. BRIEF DESCRIPTION OF THE DRAWINGS

[0025] Figure 1 It is a structural schematic diagram of the present invention;

[0026] Figure 2 It is a structural schematic diagram of the base and cover plate of the present invention;

[0027] Figure 3 for Figure 2 Exploded diagram;

[0028] Figure 4 Schematic diagram of the back structure of the cover plate of the present invention;

[0029] Figure 5 It is a cross-sectional schematic diagram of the present invention when the cover plate is in a closed state;

[0030] Figure 6 Schematic diagram of the structure of the liquid outlet component in the present invention;

[0031] Figure 7 Schematic diagram of the internal structure of the present invention;

[0032] Figure 8 is a cross-sectional view of the buffer tank of the present invention;

[0033] Figure 9 This is a schematic diagram of the pipeline connection of the present invention;

[0034] Figure 10 Schematic diagram of the structure of the drive assembly of the present invention. DETAILED DESCRIPTION

[0035] The following is an explanation and description of the technical solutions of the embodiments of the present invention in conjunction with the drawings of the embodiments of the present invention. However, the following embodiments are only preferred embodiments of the present invention and are not exhaustive. Based on the embodiments in the implementation manner, other embodiments obtained by those skilled in the art without creative work are all within the scope of protection of the present invention.

[0036] In the following description, terms such as "inside", "outside", "up", "down", "left", "right", etc. that indicate directions or positional relationships are only used to facilitate the description of the embodiments and simplify the description, and do not indicate or imply that the device or element referred to must have a specific direction, be constructed and operate in a specific direction. Therefore, they should not be understood as limiting the present invention.

[0037] See also Figure 1-10 As shown, this embodiment provides a pressurized etching device, such as Figure 1 As shown, it mainly includes a housing 1, a base 2, a cover 3, a liquid outlet assembly 4 and a pressing member 5, etc. The following is a detailed description of each part:

[0038] like Figure 3 and Figure 5 As shown, the base 2 is fixed in the casing 1, and the base 2 has an etching groove 21 with an open top; wherein, the top of the etching groove 21 is provided with a supporting surface 211 for supporting the product, that is, when in use, the product is placed on the supporting surface 211, and the area of ​​the product to be etched (that is, the area where the small holes are distributed on the product) is located within the range of the etching groove 21.

[0039] The cover plate 3 is used to cover the etching groove 21 and can be opened or closed. For example, in this embodiment, the cover plate 3 is connected to the base 2 in a rotating connection manner to achieve opening or closing.

[0040] like Figure 2 and Figure 5 As shown, an opening groove 31 is provided on the inner side of the cover plate 3 (ie, the side facing the etching groove 21 ), and a liquid outlet 32 ​​is provided on the cover plate 3 . During etching, the supplied acid solution flows into the etching groove 21 through the liquid outlet 32 ​​.

[0041] like Figure 2 As shown, the pressing member 5 is annular, such as a circular ring, and is used to press the upper surface of the product. It is provided on the cover plate 3 and surrounds the outer circumference of the opening groove 31 . The pressing member 5 can move axially relative to the cover plate 3 .

[0042] like Figure 2 and Figure 3As shown, the liquid outlet assembly 4 is located in the open slot 31 and includes an end head 41 that is rotatably connected to the liquid outlet 32 ​​and a plurality of nozzles 42 arranged in sequence around the end head 41 along the circumference of the end head 41. For example, in this embodiment, three nozzles 42 are provided and distributed in a circumferential array around the end head 41. The nozzles 42 can rotate within the open slot 31.

[0043] like Figure 5 As shown, the end cap 41 is basically a tubular structure with one end closed and the other end open. The open end is inserted into the liquid outlet 32 ​​and communicates with the liquid outlet 32. The open end and the liquid outlet 32 ​​are rotatably connected. That is, the end cap 41 can rotate circumferentially around the axis of the liquid outlet 32 ​​in the liquid outlet 32.

[0044] One end of the nozzle 42 is closed and the other end is open. The open end of the nozzle 42 is fixed on the end head 41 and communicates with the interior of the end head 41, thereby realizing the communication between the nozzle 42 and the liquid outlet 32; a plurality of spray holes 421 are opened on the side wall of the nozzle 42, wherein the spray direction of the spray holes 421 is toward the peripheral wall of the open groove 31.

[0045] The spraying directions of the nozzles 42 are consistent, so that the nozzles 42 can rotate around the axis of the liquid outlet 32 ​​under the action of the recoil force generated when the nozzle hole 421 sprays liquid. The consistent spraying direction here can also be understood as the direction of rotation of the nozzles driven by the recoil force generated by the nozzle head in each nozzle 42 is consistent, such as Figure 6 As shown, the nozzles on each nozzle drive the nozzle to rotate clockwise.

[0046] When working, Figure 5 As shown, the product is placed on the supporting surface 211. After the cover 3 is closed, the pressing member 5 is driven to move downward so that the pressing member 5 presses against the upper surface of the product. At this time, the product is clamped between the supporting surface 211 and the pressing member 5; and the etched area is located within the inner circle of the pressing member 5.

[0047] In this way, the open groove 31 is inverted above the product; the acid liquid outlet 32 ​​enters the end head 41, and then enters each nozzle 42 from the end head 41, and then is sprayed sideways from the nozzle hole 421 on each nozzle 42 into the open groove 31 (i.e., the etching space); as the acid liquid continues to flow in, the pressure in the open groove 31 continues to increase, and then the acid liquid will pass through the small holes on the product under pressure, thereby etching the small holes.

[0048] Moreover, when the spray hole 421 sprays the acid, a recoil force is generated, and under the action of the recoil force, the nozzle 42 is driven to rotate. This is equivalent to the nozzle 42 rotating circumferentially in the open groove 31 while the spray hole 421 sprays the acid. Thus, the nozzle 42 is similar to a stirring rod that continuously stirs the acid filled in the open groove 31, making the acid mixture more uniform, which is beneficial to improving the etching effect.

[0049] Moreover, in this solution, during etching, the spray hole 421 does not spray the acid liquid directly toward the product surface, thus avoiding the problem of uneven etching caused by spraying the liquid directly onto the product surface.

[0050] For the compression of the compression member 5, a pneumatic drive method can be used to drive the compression member 5 to move axially. For example, a cylinder (not shown in the figure) is set on the cover plate 3, and the output end of the cylinder is fixed to the top wall of the compression member 5. The compression member 5 is driven to move along the axial direction of the cover plate 3 through the expansion and contraction action of the cylinder to achieve compression or loosening of the product.

[0051] Of course, in other optional embodiments, the cover plate 3 and the pressing member 5 may form an annular cylinder structure as a whole. In this case, the cover plate 3 is equivalent to the cylinder barrel of the cylinder, and the pressing member 5 is equivalent to the piston rod of the cylinder.

[0052] In addition, if Figure 5 As shown, in order to improve the sealing performance between the pressing member 5 and the product when pressing the product, in this embodiment, the lower wall of the pressing member 5 is provided with an upper sealing ring 51, and the upper sealing ring 51 is coaxially arranged with the pressing member 5.

[0053] Similarly, in order to improve the sealing between the product and the supporting surface 211 , a lower sealing ring 52 surrounding the periphery of the etched groove 21 is provided on the supporting surface 211 .

[0054] In addition, in order to be able to clamp the product laterally and avoid lateral deviation of the product, in this embodiment, the base 2 is provided with a number of side clamping mechanisms distributed in sequence along the circumference of the etching groove 21, and the side clamping mechanism includes a cylinder 91 fixed on the base 2 and a clamping block 92 provided at the output shaft end of the cylinder. The telescopic action of the cylinder 91 drives the clamping block 92 to move radially along the etching groove 21 to achieve lateral clamping or loosening of the product; the clamping block 92 is used to press against the peripheral wall of the product. When clamping, the product is clamped between the clamping blocks.

[0055] In this embodiment, Figure 7 As shown, an acid tank 10 and a water tank 11 are formed at the bottom of the casing 1. The acid tank 10 is used to store the acid used for etching, and the water tank 11 is used to store water for cleaning. The acid tank 10 and the water tank 11 are isolated from each other and are not connected.

[0056] In addition, if Figure 1 As shown, a demisting port 13 is provided on the top of the housing 1 , and a demisting device, such as a fan, can be connected to the demisting port 13 to extract and collect the acid mist generated by the acid liquid tank 10 .

[0057] Combine Figure 2 and Figure 9As shown, the acid liquid tank 10 is connected to a first pump 611 for extracting the acid liquid in the acid liquid tank 10, and the first pump 611 extracts the acid liquid to the liquid outlet 32; correspondingly, the water tank 11 is connected to a second pump 621 for extracting water in the water tank 11, and the second pump 621 extracts water to the liquid outlet 32.

[0058] In order to discharge the acid or water in the etching tank 21, in this embodiment, a liquid return port 22 is provided at the bottom of the etching tank 21. Specifically:

[0059] like Figure 7 As shown, an acid outlet 101 is provided at the bottom of the acid liquid tank 10 , and a water outlet 111 is provided at the bottom of the water tank 11 .

[0060] like Figure 2 and Figure 9 As shown, the acid outlet 101 is connected to a first pipeline 61 , and the water outlet 111 is connected to a second pipeline 62 ; the ends of the first pipeline 61 and the second pipeline 62 converge at one end of a main pipeline 63 , the other end of which is connected to the liquid outlet 32 ​​.

[0061] The first pump 611 is arranged on the first pipeline 61, the second pump 621 is arranged on the second pipeline 62, the first pipeline 61 is provided with a first valve 612, and the second pipeline 62 is provided with a second valve 622. The first valve 612 is located downstream of the first pump 611, and the second valve 622 is located downstream of the second pump 621. Here, the downstream of the pump can also be understood as the output side of the pump.

[0062] The liquid return port 22 at the bottom of the etching tank 21 is connected to two branch pipelines 67, namely the acid return pipeline 64 and the water return pipeline 65. The acid return pipeline 64 is used to return the acid discharged from the liquid return port 22 to the acid liquid tank 10, and the water return pipeline 65 is used to return the water discharged from the liquid return port 22 to the water tank 11.

[0063] In order to control the on-off of the acid return pipeline 64 and the return water pipeline 65, an acid return valve 641 and a return water valve 651 are respectively provided on the acid return pipeline 64 and the return water pipeline 65; when acid return is required, the return water valve 651 is closed and the acid return valve 641 is opened; conversely, when water return is required, the acid return valve 641 is closed and the return water valve 651 is opened.

[0064] Specifically, the end of the acid return pipe 64 away from the liquid return port 22 extends into the acid liquid tank 10 to form an acid return end; similarly, the end of the water return pipe 65 away from the liquid return port 22 extends into the water tank 11 to form a water return end.

[0065] The acid return end flows out acid downward, and the water return end flows out water downward; if the acid return end directly flows back the acid toward the acid return end, it will have a greater impact on the acid in the acid tank 10, thereby causing greater splashing in the acid tank 10. Therefore, in this embodiment, Figure 7 and Figure 8 As shown, the buffer tank 7 is inside the acid tank 10; the buffer tank 7 includes a bottom wall 72 and a side wall 71 surrounding the upper side of the bottom wall, and the bottom wall 72 and the side wall 71 are enclosed to form the buffer tank 7; the acid return end is located in the buffer tank 7 and faces the bottom wall 72 of the buffer tank; the side wall 71 of the buffer tank is provided with an acid return port 73, and the acid output from the acid return end enters the buffer tank 7 and falls back into the acid tank 10 through the acid return port 73 on the side wall 71; in this way, the buffer tank 7 can play a buffering role for the acid return end, preventing the acid discharged from the acid return end from directly impacting the acid in the acid tank 10 to form a large splash.

[0066] It is understandable that the above-mentioned buffering method can also be adopted to set the same buffer tank between the water tank 11 and the return water pipe 65 to reduce the splashing of water in the water tank 11.

[0067] In order to discharge the acid in the acid tank 10 or the water in the water tank 11, in this embodiment, Figure 2 and Figure 9 As shown, the acid outlet 101 is further connected to an acid discharge pipeline 68 , on which a fourth valve 681 is provided; the water outlet 111 is connected to a drainage pipeline 69 , on which a fifth valve 691 is provided.

[0068] In addition, this embodiment also includes a purge pipeline, such as Figure 2 and Figure 9 As shown, the purge pipeline includes a main pipeline 66 and two branch pipelines 67 connected to one end of the main pipeline 66. The first ends of the two branch pipelines 67 are connected to the first pipeline 61 and the second pipeline 62, respectively. The first end of the branch pipeline 67 provided on the first pipeline 61 is located downstream of the first valve 612, and the first end of the branch pipeline 67 provided on the second pipeline 62 is located downstream of the second valve 622. Both branch pipelines 67 are equipped with a one-way valve 671, which unidirectionally restricts the acid solution in the first pipeline 61 and the water in the second pipeline 62 from entering the main pipeline 66.

[0069] The second ends of the two branch pipelines 67 are connected to the main pipeline 66, wherein the main pipeline 66 is connected to a nitrogen supply device such as a nitrogen storage tank, and a third valve 661 is provided on the main pipeline 66 to control the on-off of the main pipeline 66.

[0070] In this embodiment, the purge pipeline is mainly used to purge the pipeline system after the acid etching and / or water flushing is completed, so as to reduce the acid or water residue in each pipeline and the etching tank 21.

[0071] Since the cover plate 3 is closed or opened by flipping, the cover plate 3 needs to be flipped when closing or opening, and the liquid outlet 32 ​​is provided on the cover plate 3. When the pipeline is connected to the liquid outlet 32, it is necessary to ensure that the pipeline can be connected to the liquid outlet 32 ​​to ensure that the acid, water, etc. can flow into the liquid outlet 32 ​​normally. Secondly, the existence of the pipeline must not interfere with the normal flipping and opening / closing of the cover plate 3. Therefore, this embodiment provides a specific rotation connection structure between the cover plate 3 and the base 2:

[0072] like Figure 2 and Figure 3 As shown, a first shaft 33 is fixed on the base 2, and a second shaft 34 is fixed on the cover plate 3; the first shaft 33 and the second shaft 34 are coaxially arranged, and the ends of the two shafts are rotatably connected to each other. For example, the opposite ends of the first shaft 33 and the second shaft 34 are rotatably connected through bearings. It can be understood that the butt ends of the first shaft 33 and the second shaft 34 are sealed under the premise of ensuring rotation.

[0073] The second shaft 34 has a cavity connected to the liquid outlet 32. Specifically, the cavity is connected to the liquid outlet 32 ​​through a connecting pipe 35, and the connecting pipe 35 is fixed to the cover plate 3. The first shaft 33 is a hollow tubular structure, one end of which is connected to the cavity, and the other end constitutes a liquid inlet end 33a, and the liquid inlet end 33a is connected to the main pipeline 66. In this way, the acid output from the first pipeline 61 or the water output from the second pipeline 62 passes through the main pipeline 66, the liquid inlet end 33a of the first shaft 33, the interior of the first shaft 33, the cavity of the second shaft 34, and the connecting pipe 35 in sequence, and is finally input into the liquid outlet 32 ​​through the connecting pipe 35 and sprayed out from the spray hole 421 on the nozzle 42 connected to the liquid outlet 32.

[0074] In this embodiment, the first valve 612 , the second valve 622 , the third valve 661 , the fourth valve 681 , the fifth valve 691 , the acid return valve 641 and the water return valve 651 are preferably solenoid valves.

[0075] In order to automatically drive the cover 3 to open and close, in this embodiment, a driving component is provided between the cover 3 and the base 2, and the driving component is used to provide power to drive the cover 3 to flip over to open or close.

[0076] Specifically, such as Figure 10 As shown, the driving assembly includes a first cylinder 81, one end of the first cylinder 81 is hinged to the base 2, and the other end is hinged to the cover 3. The cover 3 is driven to flip and open and close through the telescopic action of the first cylinder 81.

[0077] In addition, in order to improve the driving effect, in this embodiment, the driving assembly also includes a second cylinder 82, which is supported at the bottom of the first cylinder 81, with one end hinged to the first cylinder 81 and the other end hinged to the base 2.

[0078] In addition, a first groove 23 is provided on the upper surface of the base 2, and the first cylinder 81 and the second cylinder 82 are provided in the first groove 23. A second groove 36 is provided on the inner wall of the cover plate 3. When the cover plate 3 is in the closed state, the first cylinder 81 and the second cylinder 82 are retracted in the first groove 23 and the second groove 36 to make the cover plate 3 and the base 2 fit together.

[0079] The usage of this device mainly includes the following steps:

[0080] First, place the product on the supporting surface 211 and clamp it using the side clamping mechanism to limit the lateral deviation of the product.

[0081] Then, the cover 3 is closed, and the pressing member 5 is driven downward to press the product between the pressing member 5 and the supporting surface 211; Figure 5 As shown, at this time, an upper space (i.e., the space formed by the open groove 31) is formed on the upper side of the product, the nozzle 42 is located in the upper space, and a lower space (the space formed by the etched groove 21) is formed on the lower side of the product.

[0082] Then, acid etching begins. Among all the valves, only the first valve 612 and the acid return valve 641 are opened, and the first pump 611 is turned on. In this way, the first pump 611 transports the acid in the acid tank 10 through the first pipeline 61 and the main pipeline 63 to the liquid outlet 32 ​​on the cover plate 3 in sequence, and then inputs the acid from the liquid outlet 32 ​​into the nozzle 42. The acid is sprayed sideways from the nozzle hole 421 of the nozzle 42 into the upper space, so that the upper space is filled with acid. As the acid continues to enter the upper space, the pressure in the upper space increases, and the acid in the upper space is pressed downward, so that the acid passes through the small holes on the product to achieve etching. After passing through the product, the acid falls downward into the lower space and finally flows back to the acid tank 10 again through the acid return pipeline 64.

[0083] When the nozzle 42 sprays the acid liquid, the nozzle 42 rotates due to the recoil force, thereby stirring the acid liquid in the upper space, so that the acid liquid in the upper space is mixed more evenly.

[0084] After etching is completed, the first pump 611 and the first valve 612 are closed, and then the first purge is started to blow the residual acid in the pipeline, etching tank 21, and small holes of the product back to the acid tank. Specifically:

[0085] Open the third valve 661, and the nitrogen enters the two branch pipelines 67 through the main pipeline 66. The two branch pipelines 67 respectively blow the nitrogen into the first pipeline 61 and the second pipeline 62 (specifically, the pipeline sections between the first valve and the second valve), and then converge into the main pipeline 63, and enter the nozzle 42 through the liquid outlet 32, and then be sprayed out from the nozzle hole 421 on the nozzle 42. Finally, the nitrogen sprayed from the nozzle hole 421 is sprayed downward through the small hole on the product, and finally returns to the acid tank 10 through the acid return pipeline 64. In this way, during the entire nitrogen flow process, the acid remaining in each pipeline (such as the pipeline between the first valve 612 and the second valve 622, the main pipeline 66, etc.) during etching can be blown back into the acid tank 10.

[0086] After the first purge is completed, the third valve 661 and the acid return valve 641 are closed; then, pure water cleaning is started. Specifically:

[0087] Open the second valve 622, the return valve 651, and the second pump 621. The second pump 621 draws water from the water tank 11 through the second pipe 62, the main pipe 63, the liquid outlet 32, the nozzle 42, the nozzle hole 421 into the upper space, and then passes through the small hole on the product into the lower space. Finally, it flows back into the water tank 11 through the return pipe 65 to achieve cleaning.

[0088] After the cleaning is completed, the second pump 621 and the second valve 622 are closed; then, the second nitrogen purge is started. The purge steps are basically the same as the first purge, except that the nitrogen finally purged flows back to the water tank 11 through the return pipe 65.

[0089] The second purge is mainly to purge away the water remaining in the pipelines, etching tank 21 and the like during cleaning.

[0090] It will be apparent to those skilled in the art that the present invention is not limited to the details of the exemplary embodiments described above and that the invention can be embodied in other specific forms without departing from the spirit or essential characteristics of the invention. Therefore, the embodiments should be considered in all respects as illustrative and non-restrictive, and the scope of the invention is defined by the appended claims rather than the foregoing description, and it is intended that all variations that come within the meaning and range of equivalents of the claims be embraced therein.

Claims

1. A pressurized etching device, characterized in that: include: a base having an etched groove with an open top; A cover plate, used to cover the etching groove; an opening groove is provided on the inner side of the cover plate, and the cover plate is provided with a liquid outlet; A liquid outlet assembly is located in the open slot and includes an end piece rotatably docked with the liquid outlet and a plurality of nozzles sequentially arranged around the end piece along a circumferential direction. The nozzles are all connected to the liquid outlet and have a plurality of spray holes formed on their side walls. The spray holes spray toward the circumferential wall of the open slot. The nozzles are capable of circumferentially rotating around the axis of the liquid outlet under the action of the recoil force generated by the spray holes when liquid is sprayed. The annular pressing member is used to press the upper surface of the product. It is arranged on the cover plate and surrounds the outer periphery of the opening groove. The pressing member can move axially relative to the cover plate.

2. The pressurized etching device according to claim 1, characterized in that: The cover plate can be flipped relative to the base to achieve closing or opening, wherein a first shaft is fixed on the base and a second shaft is fixed on the cover plate; the first shaft and the second shaft are coaxially arranged, and the ends of the two shafts are rotatably connected to each other; the second shaft has a cavity connected to the liquid outlet, and the first shaft is a hollow tubular structure, one end of which is connected to the cavity, and the other end constitutes the liquid inlet end.

3. The pressurized etching device according to claim 1, characterized in that: It also includes an acid liquid tank and a first pump. A liquid return port is provided at the bottom of the etching tank. The first pump is used to pump the acid liquid in the acid liquid tank to the liquid outlet. The acid liquid flowing out through the liquid return port flows back to the acid liquid tank through the acid return pipeline.

4. The pressurized etching device according to claim 3, characterized in that: It also includes a water tank and a second pump. The water flowing out through the liquid return port flows back to the water tank through the return water pipeline. The second pump is used to pump water in the water tank to the liquid outlet. The acid return pipeline and the return water pipeline are respectively provided with an acid return valve and a return water valve.

5. The pressurized etching device according to claim 4, characterized in that: The acid liquid tank has an acid outlet, and the water tank has a water outlet; the acid outlet is provided with a first pipeline, and the water outlet is provided with a second pipeline; the first pipeline and the second pipeline are converged at one end of the main pipeline, and the other end of the main pipeline is connected to the liquid outlet; the first pump is provided in the first pipeline, and the second pump is provided in the second pipeline; wherein, a first valve is provided on the first pipeline, and a second valve is provided on the second pipeline.

6. The pressurized etching device according to claim 5, characterized in that: It also includes a purge pipeline, which includes a main pipeline and two branch pipelines connected to one end of the main pipeline, the two branch pipelines are respectively connected to the first pipeline and the second pipeline, and are respectively located downstream of the first valve and the second valve; wherein, the main pipeline is provided with a third valve, and the two branch pipelines are both provided with a one-way valve.

7. A pressurized etching device according to claim 3 or 4, characterized in that: One end of the acid return pipeline extends into the acid liquid tank to form an acid return end; a buffer tank is provided in the acid liquid tank; the buffer tank has a bottom wall, the acid return end is located in the buffer tank and faces the bottom wall of the buffer tank; an acid return port is provided on the side wall of the buffer tank.

8. The pressurized etching device according to claim 1, characterized in that: The base is provided with a plurality of side clamping mechanisms distributed in sequence along the circumference of the etching groove. The side clamping mechanisms include a cylinder and a clamping block provided at the output shaft end of the cylinder. The clamping block is used to press the peripheral wall of the product.

9. The pressurized etching device according to claim 1, characterized in that: The top of the etching groove is provided with a supporting surface for supporting the product; the supporting surface is provided with a lower sealing ring surrounding the periphery of the etching groove, and / or the lower wall of the pressing member is provided with an upper sealing ring.

10. The pressurized etching equipment according to claim 1, characterized in that: The cover plate can be flipped relative to the base to achieve closing or opening; a driving component is provided between the cover plate and the base, and the driving component is used to provide power to drive the cover plate to flip for opening or closing.

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