Additive manufacturing quality inspection method and related device

Abstract

The present application discloses an additive manufacturing quality detection method and related devices, the method comprising: an industrial computer obtains a first electrical signal corresponding to an output light signal in a first period of time during laser additive manufacturing, a second electrical signal corresponding to a laser reflection signal, a third electrical signal corresponding to a visible light signal, and a fourth electrical signal corresponding to an infrared light signal; the industrial computer determines the layer electrical signal amplitude corresponding to at least one of the output light signal, the laser reflection signal, the visible light signal, and the infrared light signal according to at least one of the first electrical signal, the second electrical signal, the third electrical signal, and the fourth electrical signal in the first period; and determines whether a target slice layer has defects based on at least one of the layer electrical signal amplitude corresponding to the output light signal, the layer electrical signal amplitude corresponding to the laser reflection signal, the layer electrical signal amplitude corresponding to the visible light signal, and the layer electrical signal amplitude corresponding to the infrared light signal. This is beneficial for detecting abnormal areas of the part slice layer during additive processing.

Description

Technical Field

[0001] The present application relates to the field of additive manufacturing technology, and in particular to an additive manufacturing quality detection method and related devices. Background Art

[0002] Additive manufacturing, also known as 3D printing manufacturing, is mainly to melt the metal raw materials with laser focused heat energy, and then process the dust and other materials layer by layer into the required workpiece. Laser additive manufacturing is a metal additive manufacturing process. Compared with the processing methods such as parts assembly and metal cutting in traditional industries, laser additive manufacturing has higher efficiency and flexibility. It can be used for rapid prototyping, manufacturing functional graded materials, and repairing high value-added components. At present, this technology is increasingly used in aerospace, defense, automotive and biomedical industries. In the laser additive manufacturing process, under the influence of different laser processing parameters, environment and equipment, the surface accuracy of the workpiece forming quality is poor, among which the generation of defects and dimensional accuracy have always affected the further popularization and application of this technology. Therefore, the research on online monitoring technology of the additive manufacturing process is a necessary means and quality assurance for controlling the overall additive manufacturing process.

[0003] Existing online detection of laser additive processing generally has the following two detection methods: offline and online:

[0004] In offline detection, surface detection is mainly completed through microscopes, scanning electron microscopes and other surface detection equipment, and it is difficult to detect internal defects of components. Industrial metallographic cutting and other cutting methods are used for destructive measurement, which destroys the original morphology of components and has low efficiency. Industrial CT scanning and ultrasonic testing can obtain internal information of workpieces and perform defect detection, but they can only be arranged after the parts are manufactured. They are offline detection and cannot be realized online. Manufacturing and testing are difficult to be carried out in one, which affects production efficiency.

[0005] In the online detection method, such as the existing Chinese patent (CN115861187A) laser additive manufacturing through the laser deposition additive manufacturing online monitoring system schematic diagram of this application, the powder material or filamentary material is melted and deposited in combination with the digital model by means of photographing, scanning, infrared sensing, etc., and three types of data, namely, molten pool image data, molten pool temperature data and three-dimensional point cloud data, are used for matching. Specifically, high-speed cameras, infrared cameras and laser three-dimensional scanners are used to obtain online detection information, such as collecting molten pool image data through high-speed cameras; collecting molten pool temperature data using infrared cameras; and collecting three-dimensional point cloud data of the workpiece shape using laser three-dimensional scanners.

[0006] The offline detection method not only destroys the workpiece structure, but also easily causes the workpiece to deform due to destructive detection, affecting the final measurement results; inspection based on online detection methods is costly. Summary of the invention

[0007] The present application proposes an additive manufacturing quality detection method and related devices, which are conducive to detecting abnormal areas of a part slice layer during the additive manufacturing process.

[0008] This application is implemented using the following technical solutions.

[0009] In a first aspect, an embodiment of the present application provides an additive manufacturing quality detection method, comprising: an industrial control computer acquires an electrical signal corresponding to an optical signal in a first time period during a laser additive manufacturing process, the first time period being a time period during which a target slice layer of a target part is processed during laser additive processing, the optical signal comprising an output light signal of a laser in the first time period, and a laser reflection signal, a visible light signal, and an infrared light signal generated by the target slice layer in the first time period; the electrical signal corresponding to the optical signal comprises one or more of a first electrical signal corresponding to the output light signal, a second electrical signal corresponding to the laser reflection signal, a third electrical signal corresponding to the visible light signal, and a fourth electrical signal corresponding to the infrared light signal; the industrial control computer determines that a defect exists in the target slice layer when one or more of the following conditions are met; the following conditions include:

[0010] The amplitude of the layer electrical signal corresponding to the light output signal exceeds the first threshold range, the amplitude of the layer electrical signal corresponding to the laser reflection signal exceeds the second threshold range, the amplitude of the layer electrical signal corresponding to the visible light signal exceeds the third threshold range, and the amplitude of the layer electrical signal corresponding to the infrared light signal exceeds the fourth threshold range;

[0011] Among them, the layer electrical signal amplitude corresponding to the light output signal is determined based on the first electrical signal in the first time period, and the layer electrical signal amplitude corresponding to the laser reflection signal is determined based on the second electrical signal in the first time period; the layer electrical signal amplitude corresponding to the visible light signal is determined based on the third electrical signal in the first time period; and the layer electrical signal amplitude corresponding to the infrared light signal is determined based on the fourth electrical signal in the first time period.

[0012] In the process of processing the target slice layer of the target part, the electrical signal corresponding to the light output signal, the electrical signal corresponding to the laser reflection signal, the electrical signal corresponding to the visible light signal and the electrical signal corresponding to the infrared light signal are obtained; based on the acquired electrical signal corresponding to the light output signal, the electrical signal corresponding to the laser reflection signal, the electrical signal corresponding to the visible light signal and the electrical signal corresponding to the infrared light signal, it is determined whether the target slice layer has defects. While being able to detect abnormal areas of the slice layer of the part during the additive processing process, compared with the existing technology, it will not damage the parts and has low cost.

[0013] In combination with the first aspect, in a possible implementation, the method of this embodiment also includes: an industrial control computer obtains layer electrical signal amplitudes corresponding to multiple light output signals corresponding to multiple reference slicing layers respectively; the reference slicing layer is a defect-free slicing layer, and the processing parameters are the same as the processing parameters of the target slicing layer; the industrial control computer determines a first threshold range based on the layer electrical signal amplitudes corresponding to the multiple light output signals, and the upper and lower limits of the first threshold range are respectively the maximum and minimum values ​​of the layer electrical signal amplitudes corresponding to the multiple light output signals.

[0014] In combination with the first aspect, in a possible implementation, the method of this embodiment also includes: an industrial control computer obtains layer electrical signal amplitudes corresponding to multiple laser reflection signals corresponding to multiple reference slicing layers respectively; the reference slicing layer is a defect-free slicing layer, and the processing parameters are the same as the processing parameters of the target slicing layer; the industrial control computer determines a second threshold range based on the layer electrical signal amplitudes corresponding to the multiple laser reflection signals, and the upper and lower limits of the second threshold range are respectively the maximum and minimum values ​​of the layer electrical signal amplitudes corresponding to the multiple laser reflection signals.

[0015] In combination with the first aspect, in a possible implementation, the method of this embodiment also includes: an industrial control computer obtains layer electrical signal amplitudes corresponding to multiple visible light signals corresponding to multiple reference slicing layers respectively; the reference slicing layer is a defect-free slicing layer, and the processing parameters are the same as the processing parameters of the target slicing layer; the industrial control computer determines a third threshold range based on the layer electrical signal amplitudes corresponding to the multiple visible light signals, and the upper and lower limits of the third threshold range are respectively the maximum and minimum values ​​of the layer electrical signal amplitudes corresponding to the multiple visible light signals.

[0016] In combination with the first aspect, in a possible implementation, the method of this embodiment also includes: an industrial control computer obtains layer electrical signal amplitudes corresponding to multiple infrared light signals corresponding to multiple reference slicing layers respectively; the reference slicing layer is a defect-free slicing layer, and the processing parameters are the same as the processing parameters of the target slicing layer; the industrial control computer determines a fourth threshold range based on the layer electrical signal amplitudes corresponding to the multiple infrared light signals, and the upper and lower limits of the fourth threshold range are respectively the maximum and minimum values ​​of the layer electrical signal amplitudes corresponding to the multiple infrared light signals.

[0017] In combination with the first aspect, in a possible implementation manner, the method of this embodiment further includes:

[0018] When the industrial control computer determines that there is a defect in the target slice layer, it constructs a trajectory amplitude map corresponding to the target slice layer based on the target electrical signal in the first time period, the contour of the trajectory amplitude map is the same as the contour of the target slice layer, the trajectory amplitude map includes multiple trajectory amplitude lines, the multiple trajectory amplitude lines correspond to the processing trajectory when processing the target slice layer, and the amplitude represented by the trajectory amplitude line is the amplitude of the target electrical signal during the processing of the target slice layer; the industrial control computer divides the trajectory amplitude map into multiple image blocks; the industrial control computer determines the average electrical signal amplitude corresponding to each image block in the multiple image blocks; the industrial control computer obtains a first ratio for each image block based on the electrical signal amplitude corresponding to each image block and the layer electrical signal amplitude corresponding to the target electrical signal, and the first ratio of each image block is the ratio of the average electrical signal amplitude corresponding to each image block to the layer electrical signal amplitude corresponding to the target electrical signal; the industrial control computer determines the abnormal area of ​​the target slice layer according to the first ratio of each image block.

[0019] The abnormal area of ​​the target slice layer is an area corresponding to an image block of which the first ratio exceeds the ratio threshold range corresponding to the target electrical signal in the plurality of image blocks. The target electrical signal is any one of the first electrical signal of the first time period, the second electrical signal of the first time period, the third electrical signal of the first time period, and the fourth electrical signal of the first time period.

[0020] By dividing the constructed trajectory amplitude map into blocks, the defective area in the target slice layer, that is, the abnormal area, is determined based on the average electrical signal amplitude of the image block obtained by block division. In this way, the defective area in the target slice layer is further determined, which facilitates the subsequent reprocessing of the defective area to eliminate the defective area.

[0021] In combination with the first aspect, in a possible implementation, the method of this embodiment also includes: the industrial control computer obtains the position information of the abnormal area of ​​the target slice layer, and the industrial control computer transmits the position information of the abnormal area of ​​the target slice layer to the laser processing system, so that the laser processing system re-processes the abnormal area of ​​the target slice layer based on the position information of the abnormal area of ​​the target slice layer.

[0022] In combination with the first aspect, in a possible implementation, the above-mentioned layer electrical signal amplitude is a layer average electrical signal amplitude, and the electrical signal amplitude corresponding to each image block is an average electrical signal amplitude of each image block;

[0023] or,

[0024] The above-mentioned layer electrical signal amplitude is determined by weighted summing the electrical signal amplitudes of all points in the layer, and the electrical signal amplitude corresponding to each image block is determined by weighted summing the electrical signal amplitudes of all points in each image block.

[0025] In combination with the first aspect, in a possible implementation, the method of this embodiment also includes: the industrial control computer displays at least one of the curve of the first electrical signal, the curve of the second electrical signal, the curve of the third electrical signal and the curve of the fourth electrical signal in the first time period; and displays the result of whether there are defects in the target slice layer.

[0026] By displaying the above curves and the results of whether there are defects, processing personnel can easily know whether there are defects in the target slice layer and the changes in each electrical signal curve.

[0027] In combination with the first aspect, in a possible implementation, the method of this embodiment further includes: displaying a trajectory amplitude map corresponding to the target slice layer; and displaying an abnormal area of ​​the target slice layer on the trajectory amplitude map corresponding to the target slice layer. In this way, it is easy for processing personnel to know which specific area of ​​the target slice layer has defects, so as to facilitate subsequent reprocessing.

[0028] In a second aspect, an embodiment of the present application provides an industrial computer, comprising an acquisition unit, a display unit, a determination unit, a construction unit, a division unit, and a sending unit. The acquisition unit, the display unit, the determination unit, the construction unit, the division unit, and the sending unit are used to implement the method provided in any one of the first aspects.

[0029] In a third aspect, an embodiment of the present application provides an industrial control computer, comprising: a processor, the processor is connected to a memory, the memory is used to store a computer program, and the processor is used to execute the computer program stored in the memory, so that the industrial control computer executes a method as provided in any one of the first aspects.

[0030] In a fourth aspect, an embodiment of the present application provides a laser processing control system, comprising a laser welding system, a sensor module, a signal processor and an industrial control computer, wherein the industrial control computer is used to execute a method as provided in any one of the first aspects.

[0031] In a fifth aspect, an embodiment of the present application provides a computer-readable storage medium, wherein the computer-readable storage medium stores a computer program, and the computer program enables a computer to execute a method as provided in any one of the first aspects.

[0032] In a sixth aspect, an embodiment of the present application provides a computer program product, which includes a non-transitory computer-readable storage medium storing a computer program, and the computer is operable to cause the computer to execute the method described in the first aspect or the second aspect.

[0033] It can be understood that the industrial control computer described in the second and third aspects, the laser processing control system described in the fourth aspect, the computer storage medium described in the fifth aspect, or the computer program product described in the sixth aspect are all used to implement the method provided in any one of the first aspects. Therefore, the beneficial effects that can be achieved can refer to the beneficial effects in the corresponding methods, which will not be repeated here. BRIEF DESCRIPTION OF THE DRAWINGS

[0034] In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the drawings required for use in the embodiments of the present invention will be briefly introduced below. Obviously, the drawings described below are only some embodiments of the present invention. For ordinary technicians in this field, other drawings can be obtained based on these drawings without paying creative work.

[0035] Figure 1 A schematic diagram of the structure of a laser additive manufacturing online detection system provided in an embodiment of the present application.

[0036] Figure 2 A schematic diagram of a process for additive manufacturing quality inspection provided in an embodiment of the present application.

[0037] Figure 3 A schematic diagram of the relationship between a processing trajectory and an electrical signal provided in an embodiment of the present application.

[0038] Figure 4 A trajectory amplitude diagram provided in an embodiment of the present application.

[0039] Figure 5 A schematic diagram of an electrical signal provided in an embodiment of the present application.

[0040] Figure 6 A structural schematic diagram of an industrial control computer is provided for an embodiment of the present application.

[0041] Figure 7 A structural schematic diagram of another industrial control computer is provided for the embodiment of the present application. DETAILED DESCRIPTION

[0042] The following will be combined with the drawings in the embodiments of the present application to clearly and completely describe the technical solutions in the embodiments of the present application. Obviously, the described embodiments are only part of the embodiments of the present invention, not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the present invention.

[0043] The terms used in the embodiments of the present application are only for the purpose of describing specific embodiments, and are not intended to limit the present invention. The singular forms of "a", "said" and "the" used in the embodiments of the present application, the accompanying drawings and the claims are also intended to include plural forms, unless the context clearly indicates other meanings. It should be understood that the term "and / or" used in this article is only a kind of association relationship describing the associated objects, indicating that there can be three relationships, for example, A and / or B, which can be represented by: A exists alone, A and B exist at the same time, and B exists alone. In addition, the character " / " in this article generally indicates that the associated objects before and after are an "or" relationship. It should be understood that although the terms "first", "second" and similar words may be used in the embodiments of the present application, they do not represent any order, quantity or importance, but are only used to distinguish different components. Similarly, similar words such as "one" or "one" do not represent quantity restrictions, but represent the existence of at least one. The "multiple" involved in the embodiments of the present application refers to greater than or equal to two.

[0044] See also Figure 1 , Figure 1 This is a schematic diagram of the structure of a laser additive manufacturing online detection system provided in an embodiment of the present application. Figure 1 As shown, the system includes a laser 1, a field lens 2, a scanning galvanometer 3, a beam splitter 4, a sensor module 5, a signal processor 6, and an industrial control computer 7, wherein the sensor module 5 is coaxially installed in the scanning galvanometer system of the laser additive manufacturing equipment, the sensor module 5 is connected to the signal processor 6 through a signal line, the signal processor 6 is connected to the industrial control computer 7 through a signal line, and the signal processor 6 is connected to the control system 8 of the laser additive manufacturing equipment through a signal line.

[0045] In this embodiment, the laser light generated by the laser 1 is first transmitted to the sensor module 5 through the beam splitter 4. At the same time, the laser light generated by the laser 1 is also incident into the molding cavity 9 by the scanning galvanometer 3 and the field lens 2. The light radiation generated in the laser additive manufacturing process is transmitted to the sensor module 5 through the field lens 2, the scanning galvanometer 3 and the beam splitter 4. The sensor module 5 can realize photoelectric conversion and can convert light radiation signals of multiple wavelengths into electrical signals, including visible light (400-700nm), laser reflection (1060-1070nm), laser light (1060-1070nm) ) and infrared light (>1200nm); the electrical signal is transmitted to the signal processor 6 via the signal line, and the signal processor 6 performs relevant processing on the electrical signal, including signal amplification and filtering. After the signal processing, it is transmitted to the industrial control computer 7 via the signal line, and the industrial control computer 7 extracts and processes the corresponding characteristic values ​​of the signal, and compares it with the preset upper and lower thresholds and upper and lower ratio thresholds, so as to judge the processing quality of each slice layer in the additive manufacturing process. The industrial control computer 7 transmits the corresponding processing information to the control system 8 of the laser additive manufacturing equipment through the signal line and the signal processor 6, so as to adjust and optimize the process parameters of additive manufacturing.

[0046] Optionally, the sensor module 5 includes at least one of a laser light output signal sensor, a laser reflection signal sensor, a visible light signal sensor and an infrared light signal sensor.

[0047] The laser wavelength generated by the laser 1 is 1070-1070nm, and the sensor module 5 can realize photoelectric conversion, specifically through a silicon photoelectric sensor; the sensor module 5 can perform photoelectric conversion on light of multiple wavelengths, including visible light (400-700nm), laser reflection (1070-1070nm), and infrared light (>1200nm); the signal processor 6 processes the electrical signal, including signal amplification and filtering, so that the signal amplitude becomes larger and the signal noise is reduced; the industrial control computer 7 can further filter the signal, and then determine whether there is an abnormal area in the slice layer of the part based on the collected electrical signal. If there is an abnormal area, obtain the position information of the abnormal area; the position information or other information of the abnormal area is transmitted to the control system 8 of the laser additive manufacturing equipment through the signal line and the signal processor 6, so that the control system controls the laser 1 or the laser processing head or other components that control laser welding in the laser welding system to reprocess the abnormal area.

[0048] In laser processing applications, the infrared radiation signal corresponds to the infrared radiation signal with a wavelength in the range of 1250nm to 1700nm. The visible light radiation signal corresponds to the visible light radiation signal in the range of 400nm to 700nm. The laser processing reflection signal corresponds to the processing laser reflection signal during actual laser processing, such as the processing laser wavelengths of 915nm, 1064nm, 1070nm, etc. The wavelength of the processing laser is related to the actual wavelength of the laser used. In some use environments, the suitable range of the infrared radiation signal can be extended outside the range of 1250nm to 1700nm. In some use environments, the visible light radiation signal can be extended outside the range of 400nm to 700nm.

[0049] The solution of this application is described in detail below.

[0050] See also Figure 2 , Figure 2 A schematic diagram of a process flow of an additive manufacturing quality inspection method provided in an embodiment of the present application. Figure 2 As shown, the method includes:

[0051] S201. An industrial control computer obtains an electrical signal corresponding to an optical signal in a first period of time during a laser additive manufacturing process.

[0052] Among them, the first time period is the time period for processing the target slice layer of the target part during the laser additive processing process, and the optical signal includes the light output signal of the laser in the first time period, and the laser reflection signal, visible light signal and infrared light signal generated by the target slice layer in the first time period; the electrical signal corresponding to the optical signal includes one or more of the first electrical signal corresponding to the light output signal, the second electrical signal corresponding to the laser reflection signal, the third electrical signal corresponding to the visible light signal and the fourth electrical signal corresponding to the infrared light signal.

[0053] During the laser additive manufacturing process, the keyhole metal vapor generated radiates visible light, the molten pool radiates infrared light, the laser reflected light not absorbed by the powder and the laser light output signal are collected by the sensor module 5, and photoelectrically converted into electrical signals, including: obtaining the corresponding voltage value V0 through the laser light output signal sensor, obtaining the corresponding voltage value V1 through the visible light signal sensor, obtaining the corresponding voltage value V2 through the laser reflection signal sensor, and obtaining the corresponding voltage value V3 through the infrared light signal sensor, respectively adjusting the gain of the voltage values ​​V0, V1, V2, and V3 to obtain the adjusted output adjusted electrical signal. In the process of machining the target slicing layer of the target part, the first electrical signal corresponding to the light output signal, the second electrical signal corresponding to the laser reflection signal, the third electrical signal corresponding to the visible light signal, and the fourth electrical signal corresponding to the infrared light signal can be obtained in the above manner.

[0054] S202. The industrial control computer determines the layer electrical signal amplitude corresponding to the optical signal according to the first electrical signal in the first time period; determines the layer electrical signal amplitude corresponding to the laser reflection signal according to the second electrical signal in the first time period; determines the layer electrical signal amplitude corresponding to the visible light signal according to the third electrical signal in the first time period; determines the layer electrical signal amplitude corresponding to the infrared light signal according to the fourth electrical signal in the first time period.

[0055] It should be understood that the layer electrical signal amplitude corresponding to the light output signal, the layer electrical signal amplitude corresponding to the laser reflection signal, the layer electrical signal amplitude corresponding to the visible light signal and the layer electrical signal amplitude corresponding to the infrared light signal can only be obtained in the above manner when needed.

[0056] It should be pointed out that the layer electrical signal amplitude mentioned in this application is the layer average electrical signal amplitude or the weighted sum of the electrical signal amplitudes of all points in the layer. It should be understood that during one layer of additive processing, the photoelectric sensor collects the electrical signal amplitude corresponding to the optical signal of the additive processing point at a certain frequency, and for each layer, multiple electrical signal amplitudes corresponding to the additive processing points will be collected. The following is an example in which the layer electrical signal amplitude is the layer average electrical signal amplitude.

[0057] It should be understood that the laser light output signal sensor collects laser light output signals at a certain frequency. In the first period of processing the target slice layer, the laser light output signal sensor collects multiple first electrical signals, and the average value of the multiple first electrical signals is the layer average electrical signal amplitude corresponding to the light output signal. Optionally, after collecting the multiple first electrical signals, the multiple first electrical signals are gain adjusted to obtain the adjusted multiple first electrical signals. The average value of the adjusted multiple first electrical signals is the layer average electrical signal amplitude corresponding to the light output signal.

[0058] The laser reflection signal sensor collects laser reflection signals at a certain frequency. In the first period of processing the target slice layer, the laser reflection signal sensor collects multiple second electrical signals, and the average value of the multiple second electrical signals is the layer average electrical signal amplitude corresponding to the laser reflection signal. Optionally, after collecting the multiple second electrical signals, the multiple second electrical signals are gain-adjusted to obtain the adjusted multiple second electrical signals. The average value of the adjusted multiple second electrical signals is the layer average electrical signal amplitude corresponding to the laser emission signal.

[0059] The visible light signal sensor collects visible light signals at a certain frequency. In the first period of processing the target slice layer, the visible light signal sensor collects multiple third electrical signals, and the average value of the multiple third electrical signals is the layer average electrical signal amplitude corresponding to the visible light signal. Optionally, after collecting the multiple third electrical signals, the multiple third electrical signals are gain-adjusted to obtain the adjusted multiple third electrical signals. The average value of the adjusted multiple third electrical signals is the layer average electrical signal amplitude corresponding to the visible light signal.

[0060] The infrared light signal sensor collects infrared light signals at a certain frequency. In the first period of processing the target slice layer, the infrared light signal sensor collects multiple fourth electrical signals, and the average value of the multiple fourth electrical signals is the layer average electrical signal amplitude corresponding to the infrared light signal. Optionally, after collecting the multiple fourth electrical signals, the multiple fourth electrical signals are gain-adjusted to obtain the adjusted multiple fourth electrical signals. The average value of the adjusted multiple fourth electrical signals is the layer average electrical signal amplitude corresponding to the infrared light signal.

[0061] S203. When one or more of the following conditions are met: the layer electrical signal amplitude corresponding to the output light signal exceeds the first threshold range, the layer electrical signal amplitude corresponding to the laser reflection signal exceeds the second threshold range, the layer electrical signal amplitude corresponding to the visible light signal exceeds the third threshold range, and the layer electrical signal amplitude corresponding to the infrared light signal exceeds the fourth threshold range, the industrial control computer determines that there is a defect in the target slice layer.

[0062] Among them, the upper limit and lower limit of the first threshold range are respectively the maximum value and minimum value of the layer average electrical signal amplitude corresponding to the light output signal in the process of processing a defect-free slicing layer under the same processing parameters. The upper limit and lower limit of the second threshold range are respectively the maximum value and minimum value of the layer average electrical signal amplitude corresponding to the laser emission signal in the process of processing a defect-free slicing layer under the same processing parameters. The upper limit and lower limit of the third threshold range are respectively the maximum value and minimum value of the layer average electrical signal amplitude corresponding to the visible light signal in the process of processing a defect-free slicing layer under the same processing parameters. The upper limit and lower limit of the fourth threshold range are respectively the maximum value and minimum value of the layer average electrical signal amplitude corresponding to the infrared light signal in the process of processing a defect-free slicing layer under the same processing parameters.

[0063] In one example, the above defects refer to the presence of pores, unfused holes, cracks or warping in the slice layer.

[0064] Specifically, the industrial computer obtains layer average electrical signal amplitudes corresponding to multiple light output signals corresponding to multiple reference slice layers, wherein the reference slice layer is a defect-free slice layer, and the processing parameters when processing the reference slice layer are the same as the processing parameters of the target slice layer. The industrial computer determines a first threshold range based on the layer average electrical signal amplitudes corresponding to the multiple light output signals, wherein the upper limit and the lower limit of the first threshold range are respectively the maximum value and the minimum value of the layer average electrical signal amplitudes corresponding to the multiple light output signals.

[0065] The industrial computer obtains layer average electrical signal amplitudes corresponding to multiple laser reflection signals corresponding to multiple reference slice layers respectively. The industrial computer determines a second threshold range based on the layer average electrical signal amplitudes corresponding to the multiple laser reflection signals, wherein the upper limit and the lower limit of the second threshold range are respectively the maximum value and the minimum value of the layer average electrical signal amplitudes corresponding to the multiple laser reflection signals.

[0066] The industrial computer obtains layer average electrical signal amplitudes corresponding to multiple visible light signals corresponding to multiple reference slice layers, respectively. The industrial computer determines a third threshold range based on the layer average electrical signal amplitudes corresponding to the multiple visible light signals, wherein the upper limit and the lower limit of the third threshold range are respectively the maximum value and the minimum value of the layer average electrical signal amplitudes corresponding to the multiple visible light signals.

[0067] The industrial computer obtains layer average electrical signal amplitudes corresponding to multiple infrared light signals corresponding to multiple reference slice layers respectively. The industrial computer determines a fourth threshold range based on the layer average electrical signal amplitudes corresponding to the multiple infrared light signals, wherein the upper limit and the lower limit of the fourth threshold range are respectively the maximum value and the minimum value of the layer average electrical signal amplitudes corresponding to the multiple infrared light signals.

[0068] When the layer-average electrical signal amplitude corresponding to the output light signal exceeds the first threshold range, the layer-average electrical signal amplitude corresponding to the laser reflection signal exceeds the second threshold range, the layer-average electrical signal amplitude corresponding to the visible light signal exceeds the third threshold range, and the layer-average electrical signal amplitude corresponding to the infrared light signal exceeds the fourth threshold range, the industrial control computer determines that there is a defect in the target slice layer.

[0069] In one possible implementation, when the layer-average electrical signal amplitude corresponding to the output light signal exceeds the first threshold range, the layer-average electrical signal amplitude corresponding to the laser reflection signal exceeds the second threshold range, the layer-average electrical signal amplitude corresponding to the visible light signal exceeds the third threshold range, and the layer-average electrical signal amplitude corresponding to the infrared light signal exceeds at least one of the fourth threshold range, the industrial control computer determines that there is a defect in the target slice layer.

[0070] When it is determined that the target slice layer has defects, the industrial control computer determines the location information of the area where the target slice layer has abnormalities in the following manner:

[0071] The industrial computer constructs a trajectory amplitude map corresponding to the target slice layer based on the target electrical signal of the first time period, the target electrical signal is any one of the first electrical signal of the first time period, the second electrical signal of the first time period, the third electrical signal of the first time period and the fourth electrical signal of the first time period, the contour of the trajectory amplitude map corresponding to the target slice layer is the same as the contour of the target slice layer, the trajectory amplitude map corresponding to the target slice layer includes multiple trajectory amplitude lines, the multiple trajectory amplitude lines correspond to the processing trajectory in processing the target slice layer, and the amplitude represented by the trajectory amplitude line is the amplitude of the target electrical signal in the process of processing the target slice layer.

[0072] In the laser additive manufacturing process, the model of the target part is preprocessed, that is, the three-dimensional model of the target part is sliced ​​and layered in the Z-axis direction according to the preset slice layer thickness, so as to obtain the contour data of each layer section in the XY direction. Figure 3 Part (a) is the contour information of a slice layer of the target part model, where line segments ①-⑧ are the laser tracks during the laser processing of the slice layer, and the arrows are the positions where the laser ends in each laser track; Figure 3 Part (b) is a graph of the electrical signals corresponding to the laser tracks of the slice layer obtained after the laser light output signal and the generated light radiation signal (including laser reflection signal, visible light signal and infrared light signal) in the laser additive manufacturing process are collected by the sensor module 5 and photoelectrically converted into electrical signals, and then the signal processor 6 performs corresponding signal processing.

[0073] like Figure 3 As shown in part (b), the electric signal amplitude interval L1-L2 corresponds to laser trajectory ①, the electric signal amplitude interval L3-L4 corresponds to laser trajectory ②, the electric signal amplitude interval L5-L6 corresponds to laser trajectory ③, the electric signal amplitude interval L7-L8 corresponds to laser trajectory ④, the electric signal amplitude interval L9-L10 corresponds to laser trajectory ⑤, the electric signal amplitude interval L11-L12 corresponds to laser trajectory ⑥, the electric signal amplitude interval L13-L14 corresponds to laser trajectory ⑦, and the electric signal amplitude interval L15-L16 corresponds to laser trajectory ⑧.

[0074] Figure 4 A trajectory amplitude diagram is shown. Figure 4 The illustrated trajectory amplitude graph includes a plurality of trajectory amplitude lines, and the trajectory amplitude lines correspond to the processing trajectory of the processing target slice layer. The trajectory amplitude line includes a plurality of pixel points, and the pixel values ​​of the pixel points are used to characterize the amplitude of the target electrical signal at the corresponding moment in the process of processing the target slice layer. Optionally, the industrial control computer displays the trajectory amplitude graph corresponding to the target slice layer. The inspection personnel can know the amplitude of the target electrical signal at the corresponding moment through the pixel values ​​of the pixel points in the trajectory amplitude graph.

[0075] The industrial computer divides the trajectory amplitude map corresponding to the target slice layer into multiple image blocks. Optionally, the industrial computer divides the trajectory amplitude map into multiple image blocks according to a preset method. Of course, the industrial computer can also divide the trajectory amplitude map based on other rules.

[0076] It should be noted that, for each image block, its electrical signal amplitude is the average electrical signal amplitude of the image block or is determined by weighted summing of the electrical signal amplitudes of all points in the image block. The following is an example in which the electrical signal amplitude corresponding to each image block is the average electrical signal amplitude corresponding to the image block.

[0077] Since the pixel values ​​of the pixels in the image block are used to characterize the amplitude of the target electrical signal at the corresponding moment in the process of processing the target slice layer, the industrial control computer can determine the average electrical signal amplitude corresponding to each image block in the multiple image blocks; based on the average electrical signal amplitude corresponding to each image block and the layer average electrical signal amplitude corresponding to the target electrical signal, the first ratio of each image block is obtained, and the first ratio of each image block is the ratio of the average electrical signal amplitude corresponding to each image block to the layer average electrical signal amplitude corresponding to the target electrical signal; the industrial control computer determines the abnormal area of ​​the target slice layer according to the first ratio of each image block; wherein the abnormal area of ​​the target slice layer is the area corresponding to the image block whose first ratio exceeds the ratio threshold range corresponding to the target electrical signal among the multiple image blocks. In other words, the image block corresponding to the abnormal area of ​​the target slice layer satisfies the following preset conditions: the first ratio of the image block exceeds the ratio threshold range corresponding to the target electrical signal.

[0078] Among them, when the target electrical signal is the first electrical signal, the threshold range corresponding to the target electrical signal is the above-mentioned first threshold range; when the target electrical signal is the second electrical signal, the threshold range corresponding to the target electrical signal is the above-mentioned second threshold range; when the target electrical signal is the third electrical signal, the threshold range corresponding to the target electrical signal is the above-mentioned third threshold range; when the target electrical signal is the fourth electrical signal, the threshold range corresponding to the target electrical signal is the above-mentioned fourth threshold range.

[0079] It should be understood that the image block corresponds to the area of ​​the target slice layer. Therefore, when determining the image block that meets the above preset conditions, the abnormal area of ​​the target slice layer, that is, the defective area, can be determined based on the image block that meets the above preset conditions.

[0080] It should be pointed out here that the above process is only based on one of the first electrical signal in the first time period, the second electrical signal in the first time period, the third electrical signal in the first time period and the fourth electrical signal in the first time period to determine a trajectory amplitude map. The solution of the present application can also be based on the first electrical signal in the first time period, the second electrical signal in the first time period, the third electrical signal in the first time period and the fourth electrical signal in the first time period to determine the corresponding multiple trajectory amplitude maps. The industrial control computer processes each trajectory amplitude map in the multiple trajectory amplitude maps in the above manner, and can obtain the average electrical signal amplitude corresponding to each image block in each trajectory amplitude map. Optionally, for multiple image blocks corresponding to the same area of ​​the target slice layer in the multiple trajectory amplitude maps, if at least one image block in the multiple image blocks meets the above preset conditions, the industrial control computer determines that the area corresponding to the multiple image blocks in the target slice layer is an abnormal area. Further, if the multiple image blocks all meet the above preset conditions, the industrial control computer determines that the area corresponding to the multiple image blocks in the target slice layer is an abnormal area.

[0081] It should be understood that since the image blocks of the target slice layer are obtained by dividing the trajectory amplitude map of the target slice layer in a preset manner, the image blocks correspond to the areas in the target slice layer. Therefore, after determining the abnormal area of ​​the target slice layer, the industrial control computer determines the position information of the abnormal area in the target slice layer based on the preset method.

[0082] In a possible implementation, the industrial computer constructs multiple trajectory amplitude maps corresponding to the target electrical signals based on the target electrical signals corresponding to the multiple reference slice layers, and the multiple trajectory amplitude maps correspond to the multiple reference slice layers; each of the multiple trajectory amplitude maps is processed as follows:

[0083] Each trajectory amplitude map is divided in a preset manner to obtain multiple image blocks; the industrial control computer obtains the average electrical signal amplitude corresponding to the target electrical signal of each image block in the multiple image blocks, and determines the second ratio of each image block based on the average electrical signal amplitude corresponding to the target electrical signal of each image block and the corresponding layer average electrical signal amplitude, and the second ratio of each image block is the ratio of the average electrical signal amplitude corresponding to the target electrical signal of each image block to the corresponding layer average electrical signal amplitude.

[0084] For multiple trajectory amplitude images, the industrial computer can obtain the second ratios of multiple image blocks (the multiple image blocks here include image blocks obtained by dividing the multiple trajectory amplitude images) in the above manner. The upper limit and lower limit of the ratio threshold range corresponding to the target electrical signal are respectively the maximum value and the minimum value in the second ratios of the multiple image blocks.

[0085] It should be understood that the preset manner used to divide the trajectory amplitude map when determining the ratio threshold range is the same as the preset manner used to divide the trajectory amplitude map when determining whether there is a defect in the target slice layer.

[0086] In one possible implementation, when the industrial control computer determines that there is an abnormal area in the target slice layer, it obtains the position information of the abnormal area in the target slice layer, and transmits the position information of the abnormal area to the laser processing system, so that the laser processing system re-processes the abnormal area of ​​the target slice layer based on the position information of the abnormal area of ​​the target slice layer, thereby eliminating the defects in the target slice layer.

[0087] In a feasible implementation, when it is determined that there is an abnormal area in the target slice layer, the industrial control computer obtains the average electrical signal amplitude of the light output signal, the average electrical signal amplitude of the laser reflection signal, the average electrical signal amplitude of the visible light signal, and the average electrical signal amplitude of the infrared light signal corresponding to the abnormal area of ​​the target slice layer. The industrial control computer compares the average electrical signal amplitude of the light output signal, the average electrical signal amplitude of the laser reflection signal, the average electrical signal amplitude of the visible light signal, and the average electrical signal amplitude of the infrared light signal corresponding to the abnormal area with the corresponding preset thresholds respectively; based on the comparison result, the industrial control computer sends an instruction message to the additive manufacturing equipment control system to instruct the additive manufacturing equipment control system to adjust the light output power of the laser. If the comparison result is that the number of electrical signals higher than the corresponding preset threshold is greater than the number of electrical signals lower than the corresponding preset threshold, it means that the reason why the target slice layer has an abnormal area may be that the laser output power is too high, and the indication information instructs the additive manufacturing equipment control system to reduce the laser output power; if the comparison result is that the number of electrical signals higher than the corresponding preset threshold is not greater than the number of electrical signals lower than the corresponding preset threshold, it means that the reason why the target slice layer has an abnormal area may be that the laser output power is too low, and the indication information instructs the additive manufacturing equipment control system to increase the laser output power.

[0088] After completing the above adjustment, the industrial computer transmits the position information of the abnormal area to the additive manufacturing equipment control system, so that the additive manufacturing equipment control system controls the abnormal area to be reprocessed according to the position information and indication information of the abnormal area, so as to achieve the purpose of eliminating the defects in the target slice layer. And processing the subsequent slice layer based on the adjusted light output power can avoid the occurrence of defects in the subsequent slice layer.

[0089] In a possible implementation, the industrial computer displays at least one of the curves of the first electrical signal, the second electrical signal, the third electrical signal, and the fourth electrical signal in the first period and the maximum and minimum values ​​of the corresponding layer average electrical signal amplitudes. Figure 5As shown, V+ and V- are the maximum and minimum values ​​of the corresponding layer average electrical signal amplitude respectively; and the result of whether the target slice layer has defects is displayed.

[0090] Figure 5 The relationship between the number of layers and the electrical signal is shown. That is, the electrical signal corresponding to the target optical signal when processing multiple slice layers is shown in one figure. While displaying the electrical signal, the maximum and minimum values ​​of the corresponding layer average electrical signal amplitude are displayed, so that the processing personnel can know whether there are abnormal areas in the processed slice layer.

[0091] In one possible implementation, the industrial control computer displays a trajectory amplitude map corresponding to the target slice layer, and when it is determined that the target slice layer has defects, the industrial control computer displays the abnormal area of ​​the target slice layer on the trajectory amplitude map corresponding to the target slice layer, so that the inspection personnel know the location information of the abnormal area in the target slice layer.

[0092] It can be seen that in the scheme of the present application, in the process of processing the target slice layer of the target part, the electrical signal corresponding to the light output signal, the electrical signal corresponding to the laser reflection signal, the electrical signal corresponding to the visible light signal and the electrical signal corresponding to the infrared light signal are obtained; based on the acquired electrical signal corresponding to the light output signal, the electrical signal corresponding to the laser reflection signal, the electrical signal corresponding to the visible light signal and the electrical signal corresponding to the infrared light signal, it is determined whether the target slice layer has defects. While being able to detect abnormal areas of the slice layer of the part during additive processing, compared with the prior art, it will not damage the parts and has low cost. When determining that the target slice layer has defects, the area with defects in the target slice layer, that is, the abnormal area, is determined by dividing the constructed trajectory amplitude map into blocks, and the average electrical signal amplitude of the image block obtained by the block division. In this way, the area with defects in the target slice layer is further determined, which facilitates the subsequent reprocessing of the defective area to eliminate the defective area.

[0093] See also Figure 6 , the present application embodiment provides a structural diagram of an industrial control computer. Figure 6 As shown, the industrial computer 600 includes:

[0094] An acquisition unit 601 is used to acquire an electrical signal corresponding to an optical signal in a first time period during a laser additive manufacturing process, wherein the first time period is a time period during which a target slice layer of a target part is processed during the laser additive processing process, wherein the optical signal includes an output light signal of a laser in the first time period, and a laser reflection signal, a visible light signal, and an infrared light signal generated by the target slice layer in the first time period; and the electrical signal corresponding to the optical signal includes one or more of a first electrical signal corresponding to the output light signal, a second electrical signal corresponding to the laser reflection signal, a third electrical signal corresponding to the visible light signal, and a fourth electrical signal corresponding to the infrared light signal;

[0095] A display unit 602, configured to display at least one of a curve of the first electrical signal, a curve of the second electrical signal, a curve of the third electrical signal, and a curve of the fourth electrical signal in the first time period;

[0096] The determination unit 603 is used to determine that there is a defect in the target slice layer by the industrial control computer when one or more of the following conditions are met: the layer average electrical signal amplitude corresponding to the output light signal exceeds the first threshold range, the layer average electrical signal amplitude corresponding to the laser reflection signal exceeds the second threshold range, the layer average electrical signal amplitude corresponding to the visible light signal exceeds the third threshold range, and the layer average electrical signal amplitude corresponding to the infrared light signal exceeds the fourth threshold range; wherein the layer electrical signal amplitude corresponding to the output light signal is determined based on the first electrical signal in the first time period, the layer electrical signal amplitude corresponding to the laser reflection signal is determined based on the second electrical signal in the first time period; the layer electrical signal amplitude corresponding to the visible light signal is determined based on the third electrical signal in the first time period; and the layer electrical signal amplitude corresponding to the infrared light signal is determined based on the fourth electrical signal in the first time period.

[0097] In a possible implementation, the acquisition unit 601 is further used to acquire layer average electrical signal amplitudes corresponding to a plurality of light output signals corresponding to a plurality of reference slice layers respectively; the reference slice layer is a defect-free slice layer, and the processing parameters are the same as the processing parameters of the target slice layer;

[0098] The determination unit 603 is further used to determine a first threshold range based on the layer average electrical signal amplitudes corresponding to the multiple output light signals, wherein the upper limit and lower limit of the first threshold range are respectively the maximum value and the minimum value of the layer average electrical signal amplitudes corresponding to the multiple output light signals.

[0099] In a possible implementation, the acquisition unit 601 is further used to acquire layer average electrical signal amplitudes corresponding to a plurality of laser reflection signals respectively corresponding to a plurality of reference slice layers; the reference slice layer is a defect-free slice layer, and the processing parameters are the same as the processing parameters of the target slice layer;

[0100] The determination unit 603 is further used to determine a second threshold range based on the layer average electrical signal amplitudes corresponding to the multiple laser reflection signals, wherein the upper limit and lower limit of the second threshold range are respectively the maximum value and the minimum value of the layer average electrical signal amplitudes corresponding to the multiple laser reflection signals.

[0101] In a possible implementation, the acquisition unit 601 is further used to acquire layer average electrical signal amplitudes corresponding to multiple visible light signals corresponding to multiple reference slice layers respectively; the reference slice layer is a defect-free slice layer, and the processing parameters are the same as the processing parameters of the target slice layer;

[0102] The determination unit 603 is further used to determine a third threshold range based on the layer average electrical signal amplitudes corresponding to the multiple visible light signals, and the upper limit and lower limit of the third threshold range are respectively the maximum value and the minimum value of the layer average electrical signal amplitudes corresponding to the multiple visible light signals.

[0103] In a possible implementation, the acquisition unit 601 is further used to acquire layer average electrical signal amplitudes corresponding to a plurality of infrared light signals respectively corresponding to a plurality of reference slice layers; the reference slice layer is a defect-free slice layer, and the processing parameters are the same as the processing parameters of the target slice layer;

[0104] The determination unit 603 is further used to determine a fourth threshold range based on the layer average electrical signal amplitudes corresponding to the multiple infrared light signals, wherein the upper limit and lower limit of the fourth threshold range are respectively the maximum value and the minimum value of the layer average electrical signal amplitudes corresponding to the multiple infrared light signals.

[0105] In combination with the first aspect, in a possible implementation, the industrial computer 600 further includes:

[0106] A constructing unit 604 is used to construct a trajectory amplitude map corresponding to the target slice layer based on the target electrical signal in the first period when the determining unit 603 determines that the target slice layer has a defect, wherein the contour of the trajectory amplitude map is the same as the contour of the target slice layer, the trajectory amplitude map includes a plurality of trajectory amplitude lines, the plurality of trajectory amplitude lines correspond to the processing trajectories when processing the target slice layer, and the amplitudes represented by the trajectory amplitude lines are the amplitudes of the target electrical signals during the processing of the target slice layer;

[0107] A division unit 605, used to divide the trajectory amplitude map into a plurality of image blocks;

[0108] The determination unit 603 is also used for the industrial control computer to determine the average electrical signal amplitude corresponding to each image block in the multiple image blocks; the industrial control computer obtains a first ratio of each image block based on the electrical signal amplitude corresponding to each image block and the layer electrical signal amplitude corresponding to the target electrical signal, and the first ratio of each image block is the ratio of the electrical signal amplitude corresponding to each image block to the layer average electrical signal amplitude corresponding to the target electrical signal; the abnormal area of ​​the target slice layer is determined according to the first ratio of each image block.

[0109] The abnormal area of ​​the target slice layer is an area corresponding to an image block of which the first ratio exceeds the ratio threshold range corresponding to the target electrical signal in the plurality of image blocks. The target electrical signal is any one of the first electrical signal of the first time period, the second electrical signal of the first time period, the third electrical signal of the first time period, and the fourth electrical signal of the first time period.

[0110] In a possible implementation, the acquisition unit 601 is further configured to acquire location information of an abnormal region of a target slice layer.

[0111] Industrial Computer 600 also includes:

[0112] The sending unit 606 is used to transmit the position information of the abnormal area of ​​the target slice layer to the laser processing system, so that the laser processing system re-processes the abnormal area of ​​the target slice layer based on the position information of the abnormal area of ​​the target slice layer.

[0113] In a possible implementation, the above-mentioned layer electrical signal amplitude is the layer electrical signal amplitude, and the electrical signal amplitude corresponding to each image block is the electrical signal amplitude corresponding to the image block;

[0114] or,

[0115] The above-mentioned layer electrical signal amplitude is determined by weighted summing the electrical signal amplitudes of all points in the layer, and the electrical signal amplitude corresponding to each image block is determined by weighted summing the electrical signal amplitudes of all points in the image block.

[0116] In a possible implementation, the display unit 602 is further configured to display a result of whether the target slice layer has defects.

[0117] In a possible implementation, the display unit 602 is further configured to display a trajectory amplitude map corresponding to the target slice layer; and to display an abnormal region of the target slice layer on the trajectory amplitude map corresponding to the target slice layer.

[0118] It should be noted that the above-mentioned units (acquisition unit 601, display unit 602, determination unit 603, construction unit 604, division unit 605 and sending unit 606) are used to execute the relevant steps of the above-mentioned method. For example, acquisition unit 601 is used to execute the relevant content of S201, determination unit 603 is used to execute the relevant content of S202, display unit 602, determination unit 603, construction unit 604, division unit 605 and sending unit 606 are used to execute the relevant content of S203. Each unit or module in the industrial computer 600 can be combined into one or several other units or modules separately or in full, or one (some) of the units or modules can be further divided into multiple units or modules with smaller functions, which can achieve the same operation without affecting the realization of the technical effects of the embodiments of the present invention. The above-mentioned units or modules are divided based on logical functions. In practical applications, the functions of one unit (or module) can also be implemented by multiple units (or modules), or the functions of multiple units (or modules) can be implemented by one unit (or module).

[0119] Based on the description of the above method embodiment and device embodiment, please refer to Figure 7 , an embodiment of the present invention also provides a structural schematic diagram of another industrial control computer 700. Figure 7The industrial computer 700 shown (the industrial computer 700 may be a computer device) includes a memory 701, a processor 702, a communication interface 703 and a bus 704. The memory 701, the processor 702 and the communication interface 703 are connected to each other through the bus 704.

[0120] The memory 701 may be a read-only memory (ROM), a static storage device, a dynamic storage device or a random access memory (RAM).

[0121] The memory 701 can store programs. When the program stored in the memory 701 is executed by the processor 702, the processor 702 and the communication interface 703 are used to execute each step of the additive manufacturing quality detection method of the embodiment of the present application.

[0122] The processor 702 can adopt a general-purpose central processing unit (CPU), a microprocessor, an application-specific integrated circuit (ASIC), a graphics processing unit (GPU) or one or more integrated circuits to execute relevant programs to implement the functions required to be performed by the units in the industrial control computer 600 of the embodiment of the present application, or to execute the additive manufacturing quality detection method of the method embodiment of the present application.

[0123] The processor 702 may also be an integrated circuit chip with signal processing capabilities. In the implementation process, each step of the additive manufacturing quality detection method of the present application may be completed by an integrated logic circuit of hardware or software instructions in the processor 702. The above-mentioned processor 702 may also be a general-purpose processor, a digital signal processor (DSP), an application-specific integrated circuit (ASIC), a field programmable gate array (FPGA) or other programmable logic devices, discrete gates or transistor logic devices, discrete hardware components. The methods, steps and logic block diagrams disclosed in the embodiments of the present application may be implemented or executed. The general-purpose processor may be a microprocessor or the processor may also be any conventional processor, etc. The steps of the method disclosed in the embodiments of the present application may be directly embodied as being executed by a hardware decoding processor, or may be executed by a combination of hardware and software modules in a decoding processor. The software module may be located in a mature storage medium in the art such as a random access memory, a flash memory, a read-only memory, a programmable read-only memory or an electrically erasable programmable memory, a register, etc. The storage medium is located in the memory 701, and the processor 702 reads the information in the memory 701, and combines its hardware to complete the functions required to be performed by the units included in the industrial control computer 700 of the embodiment of the present application, or executes the additive manufacturing quality detection method of the method embodiment of the present application.

[0124] The communication interface 703 uses a transceiver such as, but not limited to, a transceiver to implement communication between the industrial computer 700 and other devices or a communication network. For example, data can be obtained through the communication interface 703 .

[0125] The bus 704 may include a path for transmitting information between various components of the industrial computer 700 (eg, the memory 701 , the processor 702 , and the communication interface 703 ).

[0126] It should be noted that although Figure 7 The industrial computer 700 shown only shows a memory, a processor, and a communication interface. However, in the specific implementation process, those skilled in the art should understand that the industrial computer 700 also includes other devices necessary for normal operation. At the same time, according to specific needs, those skilled in the art should understand that the industrial computer 700 may also include hardware devices for implementing other additional functions. In addition, those skilled in the art should understand that the industrial computer 700 may also include only the devices necessary for implementing the embodiments of the present application, and does not necessarily include Figure 7 All devices shown in .

[0127] An embodiment of the present application also provides a chip, which includes a processor and a data interface. The processor reads instructions stored in a memory through the data interface to implement the additive manufacturing quality detection method.

[0128] Optionally, as an implementation method, the chip may further include a memory, in which instructions are stored, and the processor is used to execute the instructions stored in the memory. When the instructions are executed, the processor is used to execute the additive manufacturing quality inspection method.

[0129] An embodiment of the present application also provides a computer-readable storage medium, which stores instructions. When the computer-readable storage medium is executed on a computer or a processor, the computer or the processor executes one or more steps in any of the above methods.

[0130] The embodiment of the present application further provides a computer program product including instructions. When the computer program product is executed on a computer or a processor, the computer or the processor executes one or more steps in any of the above methods.

[0131] Those skilled in the art will appreciate that the functions described in conjunction with the various illustrative logic blocks, modules, and algorithm steps disclosed herein can be implemented in hardware, software, firmware, or any combination thereof. If implemented in software, the functions described in the various illustrative logic blocks, modules, and steps can be stored or transmitted as one or more instructions or codes on a computer-readable medium and executed by a hardware-based processing unit. Computer-readable media may include computer-readable storage media, which corresponds to tangible media, such as data storage media, or includes any media (e.g., based on a communication protocol) that facilitates the transfer of a computer program from one place to another. In this manner, computer-readable media may generally correspond to (1) non-temporary tangible computer-readable storage media, or (2) communication media, such as signals or carrier waves. Data storage media may be any available media that can be accessed by one or more computers or one or more processors to retrieve instructions, codes, and / or data structures for implementing the techniques described in this application. A computer program product may include computer-readable media.

[0132] As an example and not limitation, such computer-readable storage media may include RAM, ROM, EEPROM, CD-ROM or other optical disk storage, magnetic disk storage or other magnetic storage, flash memory, or any other medium that can be used to store the desired program code in the form of instructions or data structures and can be accessed by a computer. Also, any connection is properly referred to as a computer-readable medium. For example, if instructions are transmitted from a website, server or other remote source using a coaxial cable, fiber optic cable, twisted pair, digital subscriber line (DSL), or wireless technologies such as infrared, radio and microwave, then the coaxial cable, fiber optic cable, twisted pair, DSL, or wireless technologies such as infrared, radio and microwave are included in the definition of media. However, it should be understood that the computer-readable storage media and data storage media do not include connections, carrier waves, signals or other temporary media, but are actually directed to non-temporary tangible storage media. As used herein, disks and optical disks include compact disks (CDs), laser optical disks, optical optical disks, digital versatile disks (DVDs), and Blu-ray disks, where disks typically reproduce data magnetically, while optical disks reproduce data optically using lasers. Combinations of the above should also be included within the scope of computer-readable media.

[0133] Instructions may be executed by one or more processors, such as one or more digital signal processors (DSPs), general purpose microprocessors, application specific integrated circuits (ASICs), field programmable logic arrays (FPGAs), or other equivalent integrated or discrete logic circuits. Thus, the term "processor" as used herein may refer to any of the aforementioned structures or any other structures suitable for implementing the techniques described herein. Additionally, in some aspects, the functions described by the various illustrative logic blocks, modules, and steps described herein may be provided within dedicated hardware and / or software modules configured for encoding and decoding, or incorporated in a combined codec. Moreover, the techniques may be fully implemented in one or more circuits or logic elements.

[0134] The techniques of the present application may be implemented in a variety of devices or apparatuses, including a wireless handset, an integrated circuit (IC), or a set of ICs (e.g., a chipset). Various components, modules, or units are described in this application to emphasize functional aspects of devices for performing the disclosed techniques, but do not necessarily need to be implemented by different hardware units. In fact, as described above, the various units may be combined in an encoded hardware unit in conjunction with appropriate software and / or firmware, or provided by interoperating hardware units (including one or more processors as described above).

[0135] Those skilled in the art can clearly understand that, for the convenience and brevity of description, the specific working processes of the systems, devices and units described above can refer to the specific descriptions of the corresponding steps in the aforementioned method embodiments, and will not be repeated here.

[0136] It should be understood that in the description of the present application, unless otherwise specified, " / " indicates that the objects associated before and after are in an "or" relationship, for example, A / B can represent A or B; wherein A and B can be singular or plural. Also, in the description of the present application, unless otherwise specified, "multiple" refers to two or more than two. "At least one of the following" or similar expressions refers to any combination of these items, including any combination of single items or plural items. For example, at least one of a, b, or c can represent: a, b, c, ab, ac, bc, or abc, wherein a, b, c can be single or multiple. In addition, in order to facilitate the clear description of the technical solutions of the embodiments of the present application, in the embodiments of the present application, the words "first", "second", etc. are used to distinguish the same items or similar items with substantially the same functions and effects. Those skilled in the art can understand that the words "first", "second", etc. do not limit the quantity and execution order, and the words "first", "second", etc. do not limit them to be necessarily different. Meanwhile, in the embodiments of the present application, words such as "exemplary" or "for example" are used to indicate examples, illustrations or descriptions. Any embodiment or design described as "exemplary" or "for example" in the embodiments of the present application should not be interpreted as being more preferred or more advantageous than other embodiments or designs. Specifically, the use of words such as "exemplary" or "for example" is intended to present related concepts in a concrete manner for ease of understanding.

[0137] In the several embodiments provided in the present application, it should be understood that the disclosed systems, devices and methods can be implemented in other ways. For example, the division of the unit is only a logical function division, and there may be other division methods in actual implementation, for example, multiple units or components can be combined or integrated into another system, or some features can be ignored or not executed. The mutual coupling, direct coupling, or communication connection shown or discussed can be through some interfaces, indirect coupling or communication connection of devices or units, which can be electrical, mechanical or other forms.

[0138] The units described as separate components may or may not be physically separated, and the components shown as units may or may not be physical units, that is, they may be located in one place or distributed on multiple network units. Some or all of the units may be selected according to actual needs to achieve the purpose of the solution of this embodiment.

[0139] In the above embodiments, it can be implemented in whole or in part by software, hardware, firmware or any combination thereof. When implemented using software, it can be implemented in whole or in part in the form of a computer program product. The computer program product includes one or more computer instructions. When the computer program instructions are loaded and executed on a computer, the process or function according to the embodiment of the present application is generated in whole or in part. The computer can be a general-purpose computer, a special-purpose computer, a computer network, or other programmable devices. The computer instructions can be stored in a computer-readable storage medium or transmitted through the computer-readable storage medium. The computer instructions can be transmitted from a website site, computer, server or data center to another website site, computer, server or data center by wired (e.g., coaxial cable, optical fiber, digital subscriber line (digital subscriber line, DSL)) or wireless (e.g., infrared, wireless, microwave, etc.) mode. The computer-readable storage medium can be any available medium that a computer can access or a data storage device such as a server or data center that contains one or more available media integrations. The available medium may be a read-only memory (ROM), or a random access memory (RAM), or a magnetic medium, such as a floppy disk, a hard disk, a tape, a disk, or an optical medium, such as a digital versatile disc (DVD), or a semiconductor medium, such as a solid state disk (SSD), etc.

[0140] The above is only a specific implementation of the embodiment of the present application, but the protection scope of the embodiment of the present application is not limited thereto, and any changes or replacements within the technical scope disclosed in the embodiment of the present application should be included in the protection scope of the embodiment of the present application. Therefore, the protection scope of the embodiment of the present application should be based on the protection scope of the claims.

[0141] The device embodiments described above are merely illustrative, wherein the units and modules described as separate components may or may not be physically separated. In addition, some or all of the units and modules may be selected according to actual needs to achieve the purpose of the present embodiment. Those of ordinary skill in the art may understand and implement the present invention without creative effort.

[0142] The above is only a specific implementation of the present application. It should be pointed out that for ordinary technicians in this technical field, several improvements and modifications can be made without departing from the principles of the present application. These improvements and modifications should also be regarded as the scope of protection of the present application.

Claims

1. A method for detecting quality of additive manufacturing, characterized in that: The method comprises: Acquire an electrical signal corresponding to an optical signal in a first time period during a laser additive manufacturing process, wherein the first time period is a time period during which a target slice layer of a target part is processed during the laser additive processing process, wherein the optical signal includes an output light signal of a laser in the first time period, and a laser reflection signal, a visible light signal, and an infrared light signal generated by the target slice layer in the first time period; the electrical signal corresponding to the optical signal includes one or more of a first electrical signal corresponding to the output light signal, a second electrical signal corresponding to the laser reflection signal, a third electrical signal corresponding to the visible light signal, and a fourth electrical signal corresponding to the infrared light signal; When one or more of the following conditions are met, it is determined that the target slice layer has a defect; the following conditions include: The amplitude of the layer electrical signal corresponding to the output optical signal exceeds a first threshold range; The layer electrical signal amplitude corresponding to the laser reflection signal exceeds a second threshold range; The amplitude of the layer electrical signal corresponding to the visible light signal exceeds a third threshold range, and The amplitude of the layer electrical signal corresponding to the infrared light signal exceeds a fourth threshold range; Among them, the layer electrical signal amplitude corresponding to the light output signal is determined based on the first electrical signal of the first time period, and the layer electrical signal amplitude corresponding to the laser reflection signal is determined based on the second electrical signal of the first time period; the layer electrical signal amplitude corresponding to the visible light signal is determined based on the third electrical signal of the first time period; the layer electrical signal amplitude corresponding to the infrared light signal is determined based on the fourth electrical signal of the first time period; the trajectory amplitude diagram corresponding to the target slice layer includes multiple trajectory amplitude lines corresponding to the processing trajectory when processing the target slice layer, and the amplitude represented by the trajectory amplitude line is the amplitude of the target electrical signal during the processing of the target slice layer; the trajectory amplitude diagram is constructed based on the target electrical signal of the first time period, and the target electrical signal is any one of the first electrical signal of the first time period, the second electrical signal of the first time period, the third electrical signal of the first time period and the fourth electrical signal of the first time period, and the trajectory amplitude diagram is used to determine the abnormal area of ​​the target slice layer when it is determined that the target slice layer has defects.

2. The method according to claim 1, characterized in that The method further comprises: Acquire layer electrical signal amplitudes corresponding to a plurality of light output signals respectively corresponding to a plurality of reference slice layers; the reference slice layer is a defect-free slice layer, and the processing parameters are the same as the processing parameters of the target slice layer; The first threshold range is determined based on the amplitudes of the layer electrical signals corresponding to the multiple output light signals, and the upper limit and the lower limit of the first threshold range are respectively the maximum value and the minimum value of the amplitudes of the layer electrical signals corresponding to the multiple output light signals.

3. The method according to claim 1, characterized in that The method further comprises: Acquiring layer electrical signal amplitudes corresponding to a plurality of laser reflection signals respectively corresponding to a plurality of reference slice layers; the reference slice layer is a defect-free slice layer, and the processing parameters are the same as the processing parameters of the target slice layer; The second threshold range is determined based on the layer electrical signal amplitudes corresponding to the multiple laser reflection signals, and the upper limit and lower limit of the second threshold range are respectively the maximum value and the minimum value of the layer electrical signal amplitudes corresponding to the multiple laser reflection signals.

4. The method according to claim 1, characterized in that: The method further comprises: Acquiring layer electrical signal amplitudes corresponding to a plurality of visible light signals respectively corresponding to a plurality of reference slice layers; the reference slice layer is a defect-free slice layer, and the processing parameters are the same as the processing parameters of the target slice layer; The third threshold range is determined based on the slice electrical signal amplitudes corresponding to the multiple visible light signals, and the upper limit and the lower limit of the third threshold range are respectively the maximum value and the minimum value of the slice electrical signal amplitudes corresponding to the multiple visible light signals.

5. The method according to claim 1, characterized in that The method further comprises: Acquiring layer electrical signal amplitudes corresponding to a plurality of infrared signals respectively corresponding to a plurality of reference slice layers; the reference slice layer is a defect-free slice layer, and the processing parameters are the same as the processing parameters of the target slice layer; The fourth threshold range is determined based on the amplitudes of the layer electrical signals corresponding to the multiple infrared signals, and the upper limit and the lower limit of the fourth threshold range are respectively the maximum value and the minimum value of the amplitudes of the layer electrical signals corresponding to the multiple infrared signals.

6. The method according to any one of claims 1 to 5, characterized in that: When it is determined that the target slice layer has defects, the method further includes: constructing a trajectory amplitude map corresponding to a target slice layer based on a target electrical signal in the first period, wherein the target electrical signal is any one of a first electrical signal in the first period, a second electrical signal in the first period, a third electrical signal in the first period, and a fourth electrical signal in the first period, wherein an outline of the trajectory amplitude map is the same as an outline of the target slice layer, and wherein the trajectory amplitude map comprises a plurality of trajectory amplitude lines, wherein the plurality of trajectory amplitude lines correspond to processing trajectories when processing the target slice layer, and an amplitude represented by the trajectory amplitude line is an amplitude of the target electrical signal in the process of processing the target slice layer; Dividing the trajectory amplitude map into a plurality of image blocks; determining the electrical signal amplitude corresponding to each image block in the plurality of image blocks; obtaining a first ratio of each image block based on the electrical signal amplitude corresponding to each image block and the layer electrical signal amplitude corresponding to the target electrical signal, wherein the first ratio of each image block is a ratio of the electrical signal amplitude corresponding to each image block to the layer electrical signal amplitude corresponding to the target electrical signal; Determine an abnormal area of ​​the target slice layer according to the first ratio of each image block; The abnormal area of ​​the target slice layer is an area corresponding to an image block whose first ratio among the multiple image blocks exceeds a ratio threshold range corresponding to the target electrical signal.

7. The method according to claim 6, characterized in that The method further comprises: Obtaining the position information of the abnormal area of ​​the target slice layer, The position information of the abnormal area of ​​the target slice layer is transmitted to the laser processing system, so that the laser processing system re-processes the abnormal area of ​​the target slice layer based on the position information of the abnormal area of ​​the target slice layer.

8. The method according to claim 6, characterized in that The layer electrical signal amplitude is the layer average electrical signal amplitude, and the electrical signal amplitude corresponding to each image block is the average electrical signal amplitude corresponding to each image block; or, The layer electrical signal amplitude is determined by weighted summing the electrical signal amplitudes of all points in the layer, and the electrical signal amplitude corresponding to each image block is determined by weighted summing the electrical signal amplitudes of all points in each image block.

9. The method according to any one of claims 1 to 5, characterized in that: The method further comprises: At least one of the curves of the first electrical signal, the second electrical signal, the third electrical signal and the fourth electrical signal in the first time period is displayed; and the result of whether the target slice layer has defects is displayed.

10. The method according to claim 6, characterized in that The method further comprises: The trajectory amplitude map corresponding to the target slice layer is displayed; and the abnormal area of ​​the target slice layer is displayed on the trajectory amplitude map corresponding to the target slice layer.

11. An industrial computer, characterized in that: include: an acquisition unit, configured to acquire an electrical signal corresponding to an optical signal in a first time period during a laser additive manufacturing process, wherein the first time period is a time period during which a target slice layer of a target part is processed during the laser additive processing process, wherein the optical signal includes an output light signal of a laser in the first time period, and a laser reflection signal, a visible light signal, and an infrared light signal generated by the target slice layer in the first time period; and the electrical signal corresponding to the optical signal includes one or more of a first electrical signal corresponding to the output light signal, a second electrical signal corresponding to the laser reflection signal, a third electrical signal corresponding to the visible light signal, and a fourth electrical signal corresponding to the infrared light signal; A display unit, configured to display at least one of a curve of the first electrical signal, a curve of the second electrical signal, a curve of the third electrical signal, and a curve of the fourth electrical signal in the first time period; A determining unit, configured to determine that the target slice layer has a defect when one or more of the following conditions are met; The following conditions include: The amplitude of the layer electrical signal corresponding to the output optical signal exceeds a first threshold range; The layer electrical signal amplitude corresponding to the laser reflection signal exceeds a second threshold range; The amplitude of the layer electrical signal corresponding to the visible light signal exceeds a third threshold range, and The amplitude of the layer electrical signal corresponding to the infrared light signal exceeds a fourth threshold range; Among them, the layer electrical signal amplitude corresponding to the light output signal is determined based on the first electrical signal, and the layer electrical signal amplitude corresponding to the laser reflection signal is determined based on the second electrical signal; the layer electrical signal amplitude corresponding to the visible light signal is determined based on the third electrical signal; the layer electrical signal amplitude corresponding to the infrared light signal is determined based on the fourth electrical signal; the trajectory amplitude diagram corresponding to the target slice layer includes multiple trajectory amplitude lines corresponding to the processing trajectory when processing the target slice layer, and the amplitude represented by the trajectory amplitude line is the amplitude of the target electrical signal during the processing of the target slice layer; the trajectory amplitude diagram is constructed based on the target electrical signal of the first time period, and the target electrical signal is any one of the first electrical signal of the first time period, the second electrical signal of the first time period, the third electrical signal of the first time period and the fourth electrical signal of the first time period; the trajectory amplitude diagram is used to determine the abnormal area of ​​the target slice layer when it is determined that the target slice layer has defects.

12. An industrial computer, characterized in that: It comprises a processor, the processor is connected to a memory, the memory is used to store a computer program, and the processor is used to execute the computer program stored in the memory, so that the industrial computer executes the method as described in any one of claims 1-10.

13. A laser processing control system, comprising: A laser welding system, a sensor module, a signal processor and an industrial control computer, wherein the industrial control computer is used to execute the method as described in any one of claims 1 to 10.

14. A computer-readable storage medium, characterized in that: The computer-readable storage medium stores a computer program, and the computer program is executed by a processor to implement the method according to any one of claims 1 to 10.

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