Flexible matching control system and process method of semiconductor coating power supply

Abstract

A flexible matching control system and process method of a semiconductor coating power supply, through the synergistic effect of the parameter setting area, the semiconductor coating power supply and the load, the precise control of the current and voltage in the semiconductor coating process is realized. The system includes a parameter setting area, a semiconductor coating power supply and a load. The parameter setting area is used for configuring and adjusting the key parameters of the semiconductor coating power supply. The semiconductor coating power supply includes a control module and a detection module. The load is the receiving end of the power supply output, and through the flexible matching control technology, the precise matching between the semiconductor coating power supply and the load is ensured. The application can effectively improve the safety and stability of the semiconductor coating power supply in the working process, realize the stable control of the current and voltage through the peak current control, alarm shutdown mechanism and other means, so that the semiconductor coating power supply can adapt to the change of the load impedance, reduce the loss caused by the current peak value overrun, and realize the goal of reducing cost and increasing efficiency.

Description

Technical Field

[0001] This invention relates to a flexible matching control system and process method for semiconductor coating power supplies, belonging to the field of flexible matching control technology for semiconductor coating power supplies. Background Technology

[0002] Taking gas ionization in conventional vapor deposition as an example, to achieve stronger passivation of silicon wafers and a denser film, direct plasma deposition and other methods are currently employed. Figure 3 The dual-floating electrode technology shown can more effectively reduce electromagnetic interference to its own equipment and other equipment, and has better electrical symmetry and a more stable discharge environment. Vapor deposition technology is commonly used in semiconductor coating processes such as integrated circuits and photovoltaic cells. During the manufacturing process, a semiconductor coating power supply based on a radio frequency system is often used for glow discharge to decompose and ionize the gas, causing a rapid reaction in the form of plasma to form a thin film. The semiconductor coating power supply is in contact with the load by connecting electrodes. During operation, under the condition of fixed power and load impedance, the output current and voltage of the power supply are relatively stable. When the load impedance changes, the power, current, and voltage of the power supply will also change accordingly. When the deviation is too large, an alarm will sound and the system will shut down. Factors that cause changes in load impedance include silicon wafer microcracks, fragmentation or deformation during transportation or high-temperature deformation, contact between adjacent silicon wafer electrodes, partial misalignment of the silicon wafer, shortening of the distance between the two electrodes due to heating or force deformation of the wafer carrier (such as a graphite boat), and charge focusing. Because ions participate in conductivity, the degree of gas ionization also affects the impedance of the entire system. Taking the power supply output current as an example, when the current is too small, the number of ions is small and the gas is not fully ionized, while when the current is too large, it is easy to cause breakdown. Summary of the Invention

[0003] To address the aforementioned technical problems, this invention proposes a flexible matching control system and process method for semiconductor film deposition power supplies. During the manufacturing process, the flow rate and pressure of the reaction gas for each thin film preparation are constant. During the radio frequency gas discharge of the semiconductor film deposition power supply, electrons oscillate, and secondary electrons generate more collisional ionization. The charge density and electron / ion concentration of the radio frequency discharge plasma in the reaction chamber increase over time. By controlling the power supply output to match the degree of gas ionization with the load impedance changes, the entire process can be effectively guaranteed to proceed completely, reducing losses due to interruptions and achieving cost reduction and efficiency improvement.

[0004] Meanwhile, from the perspective of energy conservation, as long as the current is controlled within the upper and lower range, peak current control is adopted, the output power is calculated through a stable voltage value and converted into a current control command by an algorithm. By compensating for the power value set, the semiconductor coating power supply can be guaranteed to remain in operation until the end.

[0005] To achieve the above objectives, the technical solution adopted by the present invention is as follows:

[0006] A flexible matching control system for a semiconductor coating power supply includes a parameter setting area, a semiconductor coating power supply, and a load.

[0007] The parameter setting area is used to configure and adjust the operating parameters of the semiconductor coating power supply, including the setting of key parameters such as the power supply's output current, voltage, operating frequency, and peak current. The operating parameters are configured through the parameter setting area.

[0008] The semiconductor coating power supply enables the power supply to operate normally within the current peak range, and when the instantaneous value of the output current exceeds the preset current peak, it performs current suppression, peak current control, triggers alarm shutdown, and completes coating. It includes a control module and a detection module. The parameter setting area is connected to the control module, and the control module operates normally according to the preset parameters in the parameter setting area. The control module is connected to the detection module, and the detection module transmits the collected operating parameters to the control module. The control module adjusts and corrects according to the set program to maintain the safe operation of the semiconductor coating power supply.

[0009] The control module is responsible for overall control and adjustment of power output. Based on the settings in the parameter setting area and the feedback from the detection module, it flexibly adjusts the output to achieve precise matching with the load and meet the load requirements.

[0010] The detection module monitors the operating status of the semiconductor coating power supply, and detects changes in output current and voltage parameters in real time. When the instantaneous value of the output current or other parameters exceeds the preset range, the detected output current, voltage and other information are fed back to the control module to trigger the abnormal handling mechanism, including current suppression and shutdown protection measures. The module makes dynamic adjustments in real time to ensure the controllable operation of the system under abnormal conditions and maintain system stability.

[0011] The load is the receiving end of the semiconductor coating power supply output energy, and its power demand varies over time.

[0012] The system configures operating parameters through the parameter setting area. The control module inside the semiconductor coating power supply is responsible for regulating the overall power output, while the detection module monitors the system status and takes corresponding abnormal handling measures to ensure flexible matching control of the load under different operating conditions.

[0013] As a further improvement to the system of the present invention, the semiconductor coating power supply is in contact with the load by means of connecting electrodes, which can ensure that the current and voltage output by the power supply are relatively stable when the power and load impedance are determined during operation.

[0014] As a further improvement to the system of the present invention, the control module of the semiconductor coating power supply ensures that the current is controlled within the upper and lower range by peak current control, calculates the output power by a stable voltage value and converts it into a current control command by an algorithm, performs power compensation with the set power value, and ensures that the semiconductor coating power supply remains in working state until the end.

[0015] As a further improvement to the system of the present invention, the flexible matching control system of the semiconductor coating power supply is also provided with an alarm shutdown mechanism, which triggers an alarm shutdown when the load impedance changes and the deviation is too large.

[0016] As a further improvement to the system of the present invention, the semiconductor coating power supply can flexibly adjust its output according to the settings in the parameter setting area, depending on the load and power demand, so as to achieve precise matching with the load and ensure a stable power supply.

[0017] This invention provides a process method for a flexible matching control system for the semiconductor coating power supply, the specific steps of which are as follows:

[0018] S0: Initialize N=0, K=0, where N is the number of times the instantaneous value of the output current exceeds the peak value of the output current, and K is the number of times the actual current value exceeds the current threshold.

[0019] S1: Start the semiconductor coating power supply and set the pause time;

[0020] S2: Start the process and record the output voltage during normal operation;

[0021] S3: The power supply operates normally within the peak range of the output current. When the instantaneous value of the output current is detected to exceed the preset peak current, N=N+1 is set. If N=1, current suppression is performed. If the suppression is ineffective, i.e. N>1, the power supply output is turned off for tens of milliseconds, corresponding to the pause time, and then the discharge continues.

[0022] S4: If the process follows step S3, and the instantaneous value of the output current still exceeds the peak current (i.e., N>2), then stop working; if successful, calculate the output power during the suppression time and compare it with the power set value during the time, and calculate the difference.

[0023] S5: Divide the absolute value of the difference in step S4 by the remaining time and the output voltage value to obtain the residual current compensation value;

[0024] S6: The power supply continues to work. The peak current is temporarily added to the residual current compensation value to obtain the current threshold. The output current is the actual value plus the residual current compensation value. If it does not exceed the current threshold, i.e., K=0, the coating will continue until the coating is completed. If it exceeds the current threshold, i.e., K=1, the power supply output will be turned off for tens of milliseconds, corresponding to the pause time, and then the discharge will continue. If the value still exceeds the threshold, i.e., K>1, the power supply will stop working immediately.

[0025] During the operation of the semiconductor coating power supply, abnormal output current conditions are detected and compared multiple times. Control strategies such as current suppression and dynamic power adjustment are adopted to ensure stable system operation and achieve controllable shutdown protection in abnormal situations.

[0026] The specific control flow of the flexible matching control technology of this invention is as follows: Initialize the number of times the instantaneous output current value exceeds the peak value (N) and the number of times the actual current value exceeds the current threshold (K), and start the power supply to set a rest time. Then, start the process and record the output voltage during normal operation. During operation, the power supply operates normally within the peak range of the output current. If the instantaneous output current value is detected to exceed the preset current peak value for the first time, current suppression is performed; if suppression is ineffective (N>1), the power supply output is turned off for a period of time before resuming discharge. If the instantaneous output current value is detected to exceed the current peak value multiple times (N>2), operation stops; if successful, the output power during the suppression time is calculated and compared with the set value to obtain the difference. The remaining current compensation value is calculated by dividing the absolute value of the difference by the remaining time and the output voltage value. Subsequently, the power supply continues to operate, temporarily adding the current peak value to the remaining current compensation value to obtain the current threshold, and the output current is the actual value plus the remaining current compensation value. If the current threshold is not exceeded (K=0), the coating process continues until completion; if the current threshold is exceeded (K=1), the power supply output is turned off for a period of time before resuming discharge; if the value exceeds again (K>1), operation stops immediately. This control process ensures the stable operation of the system through multiple tests and dynamic adjustments, and provides controllable shutdown protection in abnormal situations, thus ensuring the safety and stability of the semiconductor coating power supply in the manufacturing process.

[0027] This invention can effectively ensure the integrity of the entire coating process by controlling the power supply output to match the degree of gas ionization with the load impedance change, thereby reducing losses caused by excessive current peak and achieving cost reduction and efficiency improvement.

[0028] Compared with the prior art, the beneficial effects of the present invention are as follows:

[0029] Precise matching of load requirements: Through parameter settings, the semiconductor coating power supply can flexibly adjust its output according to the different power demands of the load, achieving precise matching. This ensures that the power supply can provide a stable and efficient power supply under different process conditions.

[0030] Stable output current and voltage: The use of connected electrodes ensures that the power supply output current and voltage remain relatively stable during operation, given a fixed power and load impedance. This helps maintain the stability of the coating process and prevents equipment damage caused by current and voltage fluctuations.

[0031] Peak current control: By controlling the peak current, the current is ensured to remain within a certain range, avoiding problems such as insufficient ionization due to too low a current or breakdown due to too high a current. This helps maintain stable plasma generation and improves coating quality.

[0032] Alarm shutdown mechanism: An alarm shutdown mechanism is provided when the load impedance changes and the deviation is too large, which can respond to abnormal situations in a timely manner and avoid equipment failure or unsafe operation.

[0033] Dynamic power adjustment: By dynamically calculating the output power and comparing it with a set power value, dynamic power adjustment is achieved. This helps to compensate during suppression, ensuring that the system can still operate stably under abnormal conditions. Attached Figure Description

[0034] Figure 1 This is a schematic diagram of a system that applies flexible matching control technology in this invention;

[0035] Figure 2 This is a control flowchart related to the manufacturing process of the flexible matching control technology for semiconductor coating power supply in this invention.

[0036] Figure 3 This is a schematic diagram illustrating the production process of the dual-floating electrode technology. Detailed Implementation

[0037] The present invention will be further described in detail below with reference to the accompanying drawings and specific embodiments:

[0038] like Figure 1 As shown, this invention proposes a flexible matching control technology for semiconductor coating power supplies. The system in which this technology is applied includes a parameter setting area, a semiconductor coating power supply, and a load. It is a control and arc suppression technology specifically designed for semiconductor coating power supplies.

[0039] The semiconductor coating power supply utilizes flexible matching control technology to complete the safe coating process. This includes ensuring the power supply operates normally within its peak current range, suppressing current when the instantaneous output current exceeds the preset peak current, controlling peak current, triggering alarm shutdown, and completing the coating process.

[0040] The parameter setting area is a region used to configure and adjust the operating parameters of the semiconductor coating power supply, including the setting of key parameters such as the power supply's output current, voltage, operating frequency, and peak current.

[0041] The semiconductor coating power supply includes a control module and a detection module. The parameter setting area is connected to the control module, and the control module operates normally according to the preset parameters in the parameter setting area. The control module is also connected to the detection module, and the detection module transmits the collected operating parameters to the control module. The control module adjusts and corrects the parameters according to the set program to maintain the safe operation of the semiconductor coating power supply.

[0042] The load is the receiving end of the semiconductor coating power supply output energy, and can be a device, system or other electrical component.

[0043] The control module is the core module of the semiconductor coating power supply. It is responsible for overall control and adjustment of power output. Based on the settings in the parameter setting area and the feedback from the detection module, it flexibly adjusts the output to achieve precise matching with the load and meet the load requirements.

[0044] The detection module monitors the operating status of the semiconductor coating power supply, detecting changes in parameters such as output current and voltage in real time. When the instantaneous value of the output current or other parameters exceeds the preset range, the detected output current and voltage information is fed back to the control module, triggering an abnormal handling mechanism. This mechanism may include measures such as current suppression and shutdown protection, and can be dynamically adjusted in real time to ensure controllable operation of the system under abnormal conditions and maintain system stability.

[0045] The system configures operating parameters through the parameter setting area. The control module inside the semiconductor coating power supply is responsible for regulating the overall power output, while the detection module monitors the system status and takes corresponding abnormal handling measures to ensure flexible matching control of the load under different operating conditions.

[0046] This invention can match the degree of gas ionization with the load impedance change by controlling the power supply output, which can effectively ensure the integrity of the entire process, reduce losses caused by excessive current peaks, and achieve cost reduction and efficiency improvement.

[0047] A flexible matching control technology for semiconductor coating power supplies, such as Figure 2 The semiconductor coating power supply is characterized by the following steps in its control technology:

[0048] S0: Initialize N=0, K=0, where N is the number of times the instantaneous value of the output current exceeds the peak value of the output current, and K is the number of times the actual current value exceeds the current threshold.

[0049] S1: Start the semiconductor coating power supply and set the pause time.

[0050] S2: Start the process and record the output voltage during normal operation.

[0051] S3: The power supply operates normally within the peak range of the output current. When the instantaneous value of the output current is detected to exceed the preset peak current, N=N+1 is set. If N=1, current suppression is performed. If the suppression is ineffective, i.e. N>1, the power supply output is turned off for tens of milliseconds (corresponding to the pause time), and then the discharge continues.

[0052] S4: If the process follows step S3, and the instantaneous value of the output current is still detected to exceed the peak current (i.e., N>2), then stop working; if successful, calculate the output power during the suppression time and compare it with the power set value during the time to calculate the difference.

[0053] S5: Divide the absolute value of the difference in step S4 by the remaining time and the output voltage value to obtain the remaining current compensation value.

[0054] S6: The power supply continues to work. The peak current is temporarily added to the residual current compensation value to obtain the current threshold. The output current is the actual value plus the residual current compensation value. If it does not exceed the current threshold, i.e., K=0, the coating will continue until the coating is completed. If it exceeds the current threshold, i.e., K=1, the power supply output will be turned off for tens of milliseconds (corresponding to the pause time), and then the discharge will continue. If the value still exceeds the threshold, i.e., K>1, the power supply will stop working immediately.

[0055] Based on a flexible matching control technology for semiconductor coating power supplies, the specific control flow of the flexible matching control technology is as follows: Initialize the number of times the instantaneous output current value exceeds the peak value (N) and the number of times the actual current value exceeds the current threshold (K), and start the power supply to set a rest time. Then, start the process and record the output voltage during normal operation. During operation, the power supply operates normally within the peak range of the output current. If the instantaneous output current value is detected to exceed the preset current peak value for the first time, current suppression is performed; if suppression is ineffective (N>1), the power supply output is turned off for a period of time before resuming discharge. If the instantaneous output current value is detected to exceed the current peak value multiple times (N>2), operation stops; if successful, the output power during the suppression time is calculated and compared with the set value to obtain the difference. The residual current compensation value is calculated by dividing the absolute value of the difference by the remaining time and the output voltage value. Subsequently, the power supply continues to operate, temporarily adding the current peak value to the residual current compensation value to obtain the current threshold, and the output current is the actual value plus the residual current compensation value. If the current threshold is not exceeded (K=0), the coating process continues until completion; if the current threshold is exceeded (K=1), the power supply output is turned off for a period of time before resuming discharge. If the value exceeds the threshold again (K>1), the operation is stopped immediately. This control process, through multiple detections and dynamic adjustments, ensures the stable operation of the system and provides controllable shutdown protection in abnormal situations, ensuring the safety and stability of the semiconductor coating power supply in the manufacturing process.

[0056] This invention can match the degree of gas ionization with the load impedance change by controlling the power supply output, which can effectively ensure the integrity of the entire process, reduce losses caused by interruption, and achieve cost reduction and efficiency improvement.

[0057] This invention achieves significant improvements in semiconductor coating power supplies by enabling precise load matching through a parameter setting area, ensuring a stable and efficient power supply under different process conditions.

[0058] This invention employs a connected electrode method to ensure relatively stable output current and voltage during operation, maintain the stability of the coating process, and prevent equipment damage.

[0059] This invention introduces a peak current control mechanism to effectively avoid abnormal current conditions, improve plasma stability, and thus enhance coating quality.

[0060] The present invention further includes a load impedance change alarm shutdown mechanism to respond promptly to abnormal situations and ensure safe operation of the equipment.

[0061] This invention achieves flexible power control through dynamic power adjustment, ensuring stable operation of the system even under abnormal conditions, and bringing comprehensive technological innovation to the field of semiconductor coating.

[0062] The above description is merely a preferred embodiment of the present invention and is not intended to limit the present invention in any other way. Any modifications or equivalent changes made based on the technical essence of the present invention shall still fall within the scope of protection claimed by the present invention.

Claims

1. A flexible matching control system for a semiconductor coating power supply, comprising a parameter setting area, a semiconductor coating power supply, and a load, characterized in that: The parameter setting area is used to configure and adjust the operating parameters of the semiconductor coating power supply, including the setting of key parameters such as the power supply's output current, voltage, operating frequency, and peak current. The operating parameters are configured through the parameter setting area. The semiconductor coating power supply enables the power supply to operate normally within the current peak range, and when the instantaneous value of the output current exceeds the preset current peak, it performs current suppression, peak current control, triggers alarm shutdown, and completes coating. It includes a control module and a detection module. The parameter setting area is connected to the control module, and the control module operates normally according to the preset parameters in the parameter setting area. The control module is connected to the detection module, and the detection module transmits the collected operating parameters to the control module. The control module adjusts and corrects according to the set program to maintain the safe operation of the semiconductor coating power supply. The control module is responsible for overall control and adjustment of power output. Based on the settings in the parameter setting area and the feedback from the detection module, it flexibly adjusts the output to achieve precise matching with the load and meet the load requirements. The detection module monitors the operating status of the semiconductor coating power supply, and detects changes in output current and voltage parameters in real time. When the instantaneous value of the output current or the voltage parameter exceeds the preset range, the detected output current and voltage information is fed back to the control module to trigger the abnormal handling mechanism, including current suppression and shutdown protection measures. The module makes dynamic adjustments in real time to ensure the controllable operation of the system under abnormal conditions and maintain system stability. The load is the receiving end of the semiconductor coating power supply output energy, and its power demand varies over time.

2. The flexible matching control system for a semiconductor coating power supply according to claim 1, characterized in that: The semiconductor coating power supply is in contact with the load by means of connecting electrodes.

3. The flexible matching control system for a semiconductor coating power supply according to claim 1, characterized in that: The control module of the semiconductor coating power supply ensures that the current is controlled within the upper and lower range through peak current control. It calculates the output power through a stable voltage value and converts it into a current control command by an algorithm. The command is then used to compensate for the power value set, ensuring that the semiconductor coating power supply remains in operation until the end.

4. The flexible matching control system for a semiconductor coating power supply according to claim 1, characterized in that: The flexible matching control system of the semiconductor coating power supply is also equipped with an alarm shutdown mechanism. When the load impedance changes and the deviation is too large, an alarm shutdown is triggered.

5. The flexible matching control system for a semiconductor coating power supply according to claim 1, characterized in that: Depending on the load and power demand, the semiconductor coating power supply can flexibly adjust its output according to the settings in the parameter setting area to achieve precise matching with the load and ensure a stable power supply.

6. The process method for the flexible matching control system of the semiconductor coating power supply according to any one of claims 1-5, characterized in that: The specific steps are as follows: S0: Initialize N=0, K=0, where N is the number of times the instantaneous value of the output current exceeds the peak value of the output current, and K is the number of times the actual current value exceeds the current threshold. S1: Start the semiconductor coating power supply and set the pause time; S2: Start the process and record the output voltage during normal operation; S3: The power supply operates normally within the peak range of the output current. When the instantaneous value of the output current is detected to exceed the preset peak current, N=N+1 is set. If N=1, current suppression is performed. If the suppression is ineffective, i.e. N>1, the power supply output is turned off for tens of milliseconds, corresponding to the pause time, and then the discharge continues. S4: If the process follows step S3, and the instantaneous value of the output current still exceeds the peak current (i.e., N>2), then stop working; if successful, calculate the output power during the suppression time and compare it with the power set value during the time, and calculate the difference. S5: Divide the absolute value of the difference in step S4 by the remaining time and the output voltage value to obtain the residual current compensation value; S6: The power supply continues to work. The peak current is temporarily added to the residual current compensation value to obtain the current threshold. The output current is the actual value plus the residual current compensation value. If it does not exceed the current threshold, i.e., K=0, the coating will continue until the coating is completed. If it exceeds the current threshold, i.e., K=1, the power supply output will be turned off for tens of milliseconds, corresponding to the pause time, and then the discharge will continue. If the value still exceeds the threshold, i.e., K>1, the power supply will stop working immediately.

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