Oscillating grinding path planning method, device, electronic device and storage medium

Through the oscillation grinding path planning method, the problems of high cost, complex use and low efficiency of oscillation grinding in the prior art are solved, and high-quality oscillation grinding is achieved, reducing the cost and operation complexity.

CN118068774BActive Publication Date: 2025-02-11SUZHOU RHENAIKE INFORMATION TECH CO LTD
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Patent Information

Application Number
CN202410189258.4
Authority / Receiving Office
CN · China
Patent Type
Patents(China)
Current Assignee / Owner
Filing Date
2024-02-20
Publication Date
2025-02-11
Estimated Expiration
2044-02-20

AI Technical Summary

Technical Problem

The existing oscillation grinding processing methods have problems such as additional costs, limited use, troublesome operation and low efficiency.

Method used

A planning method for oscillation grinding path is provided. By obtaining oscillation instructions, a target oscillation curve is constructed, the oscillation path of each axis is calculated, and it is superimposed with the original grinding path to obtain the oscillation grinding path. This method requires no additional equipment, simplifies operation and reduces costs.

Benefits of technology

Synchronous oscillation and grinding are achieved, which improves grinding quality, reduces cost and complexity, and simplifies the operation process.

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Abstract

The present application discloses a planning method, device, electronic device and storage medium for an oscillating grinding path. The planning method includes obtaining an oscillation instruction; constructing a target oscillation curve for a target axis based on the oscillation instruction; calculating the oscillation path of each axis based on the oscillation position amplitude of each axis and the target oscillation curve; and superimposing the oscillation path of each axis with the original grinding path to obtain an oscillating grinding path. The oscillating grinding path planned by the present application can realize oscillation and grinding simultaneously, effectively improving the grinding quality; it can be realized based on the software improvement of the existing CNC system, without adding any additional equipment, effectively reducing costs, and at the same time without occupying additional communication and interface resources. The on-site deployment is simple, fast, simple to operate, and not prone to errors.
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Description

Technical Field

[0001] The present application belongs to the technical field of numerical control machining, and specifically relates to a planning method, device, electronic device and storage medium for an oscillating grinding path. Background Art

[0002] For the precision machining of hard and brittle materials, the surface quality is of vital importance. Grinding is one of the main means of precision machining of brittle materials. Relevant studies have shown that superimposing oscillation during grinding to form an oscillating grinding process can effectively improve the surface quality of the grinding process. At present, the commonly used oscillation processing method is ultrasonic vibration (high frequency, low amplitude) grinding and cutting functions, which requires the additional introduction of ultrasonic equipment, increasing the cost and complexity of implementation. In addition, there are also dual-path methods based on existing CNC systems to achieve oscillation and grinding, but this will occupy additional machine tool interface channels and also make the operation more complicated.

[0003] Therefore, the current oscillation grinding processing method has the following disadvantages: 1. Additional costs are added, such as ultrasonic equipment and interface equipment; 2. Usage is restricted, such as ultrasonic frequency restrictions and dual-path path planning restrictions; 3. Operation is cumbersome, for example, the operator needs to be familiar with ultrasonic equipment, or needs to understand the use and debugging of dual paths; 4. The efficiency is low, and parameter adjustment is not flexible and convenient, which makes debugging difficult and time-consuming. Summary of the invention

[0004] The purpose of the present application is to provide a method, device, electronic device and storage medium for planning an oscillating grinding path, so as to solve the technical problems of the oscillating grinding processing method in the prior art, such as increased additional costs, limited use, cumbersome operation and low efficiency.

[0005] In order to achieve the above purpose, a technical solution adopted in this application is:

[0006] A planning method for an oscillating grinding path is provided, comprising:

[0007] Obtaining an oscillation instruction, wherein the oscillation instruction includes an oscillation curve type, an oscillation speed amplitude, and an oscillation position amplitude of each axis;

[0008] Based on the oscillation instruction, construct a target oscillation curve for a target axis, the target axis being the axis with the largest oscillation position amplitude;

[0009] Based on the oscillation position amplitude of each axis and the target oscillation curve, an oscillation path of each axis is calculated;

[0010] The oscillation paths of the axes are respectively superimposed on the original grinding paths to obtain oscillating grinding paths.

[0011] In one or more embodiments, the oscillation curve type includes a complete oscillation curve type with an initial and final oscillation speed of zero and an initial and final oscillation position of zero;

[0012] The step of constructing a target oscillation curve for a target axis based on the oscillation instruction comprises:

[0013] Based on the complete oscillation curve type, construct an oscillation curve model;

[0014] Based on the oscillation velocity amplitude and the oscillation position amplitude of the target axis, the parameters of the oscillation curve model are calculated and substituted into the oscillation curve model to obtain the target oscillation curve.

[0015] In one or more embodiments, the oscillation curve type includes a 5-segment double S-shaped speed curve, each oscillation cycle of the 5-segment double S-shaped speed curve includes a symmetrical first half cycle model and a second half cycle model, the first half cycle model includes an acceleration segment, a uniform speed segment, and a deceleration segment, and the PVT curve of the acceleration segment is as follows:

[0016] a a =η[1-cos(u·t)];

[0017]

[0018]

[0019] Where t∈[0,T a ], T a is the acceleration time, P a is the real-time oscillation position, V a is the real-time oscillation speed, a a is the real-time oscillation acceleration, η is the amplification factor, and η=V m / T a , u=2π / T a , V m is the oscillation velocity amplitude;

[0020] The PVT curve of the uniform speed section is as follows:

[0021] a ave =0;

[0022] V ave =V m ;

[0023] P ave =0.5V m ·Ta+V m ·(t-Ta);

[0024] In the formula, t∈[Ta , T a +T ave ], T ave is the uniform time, T ave =A m / V m -T a , P ave is the real-time oscillation position, V ave is the real-time oscillation speed, a ave is the real-time oscillation acceleration;

[0025] The PVT curve of the deceleration section is as follows:

[0026] a d =η[1-cos(u·(T half -t))];

[0027]

[0028]

[0029] In the formula, t∈[T a +T ave , T half ], T half is half an oscillation period, and T half =T a +T ave +T d , T d is the deceleration time, and T d =T a , P d is the real-time oscillation position, V d is the real-time oscillation speed, a d is the real-time oscillation acceleration.

[0030] In one or more embodiments, the oscillation curve types include a non-complete oscillation curve type in which the initial and final oscillation speeds are not zero and the initial and final oscillation positions are not zero, and a speed-up curve type;

[0031] The step of constructing a target oscillation curve for a target axis based on the oscillation instruction comprises:

[0032] Based on the incomplete oscillation curve type, construct an oscillation curve model;

[0033] Based on the oscillation velocity amplitude and the oscillation position amplitude of the target axis, the parameters of the oscillation curve model are calculated and substituted into the oscillation curve model to obtain an oscillation process curve;

[0034] Based on the oscillation process curve, obtaining an initial speed and an initial oscillation position of the oscillation process curve;

[0035] Based on the speed increase curve type, the initial speed and the initial oscillation position, a speed increase process curve is obtained;

[0036] Based on the speed-up process curve and the target oscillation curve, a deceleration process curve is obtained;

[0037] The target oscillation curve is obtained based on the speed-up process curve, the oscillation process curve and the deceleration process curve.

[0038] In one or more embodiments, the non-complete oscillation curve type is a sinusoidal speed curve, and the oscillation curve model is as follows:

[0039] P=A m sin(ωt)+P0;

[0040] V=A m ω·cos(ωt);

[0041] a=-A m ω 2 sin(ωt);

[0042] Where P0 is the initial oscillation position, P is the real-time oscillation position, V is the real-time velocity, a is the real-time acceleration, ω=V m / A m , V m is the oscillation velocity amplitude, A m is the oscillation position amplitude;

[0043] The oscillation process curve is as follows:

[0044] P1=A m1 ·sin(ω1(tT a ))+P0;

[0045] V1=A m1 ω·cos(ω1(tT a ));

[0046] a1=-A m1 ω 2 ·sin(ω1(tT a ));

[0047] In the formula, t∈[T a , T total -T d ], T a is the acceleration time, T d is the deceleration time, T totalis the total oscillation time, P1 is the real-time oscillation position of the target axis, V1 is the real-time oscillation speed of the target axis, a is the real-time oscillation acceleration of the target axis, ω1=V m / A m1 , V m is the oscillation velocity amplitude, A m1 is the oscillation position amplitude of the target axis.

[0048] In one or more embodiments, the speed increase curve type is a sinusoidal acceleration curve, and the speed increase process curve is as follows:

[0049] a a =η[1-cos(u·t)];

[0050]

[0051]

[0052] Where t∈[0,T a ], P a is the real-time oscillation position of the target axis, V a is the real-time oscillation speed of the target axis, a a is the real-time oscillation acceleration of the target axis, η is the amplification factor, and η=V m / T a , u=2π / T a , and P0=0.5η·Ta 2 .

[0053] In one or more embodiments, the oscillation duration of the target oscillation curve is n is a positive integer, T is the sinusoidal period of the target oscillation curve; the step of obtaining the deceleration process curve based on the speed-up process curve and the target oscillation curve is specifically as follows:

[0054] Calculating and obtaining the center line of the target oscillation curve;

[0055] A curve that is symmetrical with respect to the center line of the speed-up process curve is calculated as the deceleration process curve.

[0056] In one or more embodiments, the speed increase process curve is as follows:

[0057] a a =η[1-cos(u·t)];

[0058]

[0059]

[0060] Where t∈[0,Ta ], P a is the real-time oscillation position of the target axis, V a is the real-time oscillation speed of the target axis, a a is the real-time oscillation acceleration of the target axis, η is the amplification factor, and η=V m / T a , u=2π / T a , and P0=0.5η·Ta 2 ;

[0061] The deceleration process curve is as follows:

[0062] a d =η[1-cos(u·(T total -t)];

[0063]

[0064]

[0065] In the formula, t∈[T total -T d , T total ], T total is the total oscillation time.

[0066] In one or more embodiments, the step of calculating the oscillation path of each axis based on the oscillation position amplitude of each axis and the target oscillation curve includes:

[0067] Calculating the ratio of the oscillation position amplitude of each axis to the oscillation position amplitude of the target axis to obtain the reduction coefficient of each axis;

[0068] Based on the reduction coefficient, a corresponding proportional reduction operation is performed on the real-time oscillation position, the real-time oscillation rate and the real-time oscillation acceleration of the target oscillation curve to obtain the oscillation path of each axis.

[0069] In one or more embodiments, the step of superimposing the oscillation paths of the axes with the original grinding paths to obtain the oscillating grinding paths comprises:

[0070] The oscillation path of each axis is superimposed on the motion path of the corresponding axis in the original grinding path to obtain an oscillating grinding path.

[0071] In order to achieve the above purpose, another technical solution adopted by this application is:

[0072] Provided is a device for planning an oscillating grinding path, comprising:

[0073] An instruction acquisition module, used to acquire an oscillation instruction, wherein the oscillation instruction includes an oscillation curve type, an oscillation speed amplitude, and an oscillation position amplitude of each axis;

[0074] A construction module, configured to construct a target oscillation curve for a target axis based on the oscillation instruction, wherein the target axis is an axis having the largest oscillation position amplitude;

[0075] A calculation module, configured to calculate an oscillation path of each axis based on the oscillation position amplitude of each axis and the target oscillation curve;

[0076] The superposition module is used to superimpose the oscillation path of each axis with the original grinding path to obtain an oscillating grinding path.

[0077] In order to achieve the above purpose, another technical solution adopted by this application is:

[0078] An electronic device is provided, comprising:

[0079] at least one processor; and

[0080] The memory stores instructions, and when the instructions are executed by the at least one processor, the at least one processor executes the oscillation grinding path planning method described in any one of the above embodiments.

[0081] In order to achieve the above purpose, another technical solution adopted by this application is:

[0082] A machine-readable storage medium is provided, storing executable instructions, and when the executable instructions are executed, the machine executes the oscillating grinding path planning method described in any one of the above embodiments.

[0083] Different from the prior art, the beneficial effects of this application are:

[0084] Based on the oscillation instruction, the present application can construct a target oscillation curve for the target axis, calculate the oscillation path of each axis based on the target oscillation curve, and superimpose the oscillation path of each axis with the original grinding path to obtain an oscillating grinding path. The oscillating grinding path can realize oscillation and grinding synchronously, effectively improving the grinding quality.

[0085] The planning method of the present application can be implemented based on the software improvement of the existing CNC system without adding any additional equipment, effectively reducing costs. At the same time, it does not require additional communication and interface resources. The on-site deployment is simple, fast, simple to operate, and not prone to errors. BRIEF DESCRIPTION OF THE DRAWINGS

[0086] In order to more clearly illustrate the technical solutions in the embodiments of the present application or the prior art, the drawings required for use in the embodiments or the prior art description are briefly introduced below. Obviously, the drawings described below are only some embodiments recorded in the present invention, and for ordinary technicians in this field, other drawings can be obtained based on these drawings without creative work.

[0087] Figure 1 It is a schematic flow chart of an implementation method of an oscillating grinding path planning method of the present application;

[0088] Figure 2 yes Figure 1 A schematic diagram of a flow chart of an implementation method corresponding to step S200;

[0089] Figure 3 It is a schematic diagram of the acceleration curve of the 5-stage double S-shaped speed curve of the present application;

[0090] Figure 4 yes Figure 1 A flowchart of another implementation method corresponding to step S200;

[0091] Figure 5 is a schematic diagram of an implementation method of a target oscillation curve of the present application;

[0092] Figure 6 yes Figure 1 A schematic flow chart of an implementation method corresponding to step S500;

[0093] Figure 7 is a schematic diagram of an embodiment of an oscillating grinding path of a single-axis oscillation of the present application;

[0094] Figure 8 is a schematic diagram of an embodiment of an oscillating grinding path of multi-axis oscillation of the present application;

[0095] Fig. 9 It is a schematic diagram of an embodiment of an oscillating grinding path in an inclined surface processing state of the present application;

[0096] Fig.10 It is a structural block diagram of an implementation method of an oscillating grinding path planning device of the present application;

[0097] Fig.11 It is a structural block diagram of an embodiment of the electronic device of the present application. DETAILED DESCRIPTION

[0098] In order to enable those skilled in the art to better understand the technical solutions in the present application, the technical solutions in the embodiments of the present application will be clearly and completely described below in conjunction with the drawings in the embodiments of the present application. Obviously, the described embodiments are only part of the embodiments of the present invention, not all of the embodiments. Based on the embodiments in the present application, all other embodiments obtained by ordinary technicians in the field without creative work should fall within the scope of protection of this application.

[0099] At present, the oscillation grinding processing method of CNC machine tools usually adopts ultrasonic vibration grinding and cutting, and the oscillation in the grinding process is realized by introducing ultrasonic equipment. Since the ultrasonic equipment needs to be introduced additionally, the cost and complexity will be increased. At present, there are also methods based on the existing CNC system that use oscillation and grinding dual paths to realize oscillation grinding, but the oscillation path will occupy the machine tool interface channel additionally, and also make the operation more complicated.

[0100] In order to solve the above problems, the applicant has developed an oscillating grinding path planning method that can be implemented based on the existing CNC system. This method can implement oscillating grinding path planning based on the existing CNC system, thereby realizing synchronous oscillation and grinding without the need to add other equipment or occupy other channels or dual-path resources, and on-site deployment and operation are extremely simple.

[0101] Specifically, see Figure 1 , Figure 1 It is a flow chart of an implementation method of an oscillating grinding path planning method of the present application.

[0102] like Figure 1 As shown, planning methods include:

[0103] S100: Obtain an oscillation instruction.

[0104] The oscillation instruction may be issued by an operator, and may include the oscillation curve type, the oscillation speed amplitude, and the oscillation position amplitude of each axis.

[0105] In one embodiment, the oscillation instruction may be an NC instruction. For example, the oscillation instruction may be expressed as G05P703 Q_I_J_K_L_, wherein G05 P703 is used as an identification code for the oscillation instruction, Q_ may represent the type of oscillation curve, for example, Q1 may represent a sinusoidal speed curve, Q2 may represent an S-type speed curve, I_J_K_ may represent the oscillation position amplitudes on the X-axis, Y-axis, and Z-axis, respectively, and L_ may represent the oscillation speed amplitude.

[0106] The type of oscillation curve may be selected based on actual needs, and an oscillation curve with continuous velocity and continuous acceleration, such as a sine curve, an S-shaped curve, etc., is preferred.

[0107] The oscillation position amplitude of each axis is used to indicate the maximum value of the oscillation position on the corresponding axis, which is preset based on the actual oscillation requirements; the oscillation speed amplitude is used to indicate the maximum allowable oscillation speed on each axis, which needs to be preset considering the speed and acceleration limits of each axis.

[0108] S200: construct a target oscillation curve for a target axis based on the oscillation instruction.

[0109] The target axis is the axis with the largest oscillation position amplitude.

[0110] Since the oscillation speed amplitude is used to limit the maximum oscillation speed allowed on all axes, and the axis with the largest oscillation position amplitude has the largest oscillation speed, the oscillation speed amplitude can be used as the speed limit of the target axis to calculate the target oscillation curve of the target axis. Synchronization can make the maximum oscillation speed of other axes also smaller than the oscillation speed amplitude.

[0111] In one embodiment, the oscillation curve type in the oscillation instruction may include a complete oscillation curve type with an initial and final oscillation speed of zero and an initial and final oscillation position of zero. In this case, a complete oscillation process from an initial position of 0, an initial speed of 0 to a final position of 0, a final speed of 0 may be realized based on a single type of oscillation curve.

[0112] Specifically, see Figure 2 , Figure 2 yes Figure 1 A flowchart of an implementation method corresponding to step S200 in FIG.

[0113] like Figure 2 As shown, when the oscillation curve type is a complete oscillation curve type, the method for constructing a target oscillation curve may include:

[0114] S201a. Construct an oscillation curve model based on the complete oscillation curve type.

[0115] Firstly, based on the complete oscillation curve type in the oscillation instruction, a corresponding oscillation curve model can be constructed.

[0116] For example, the complete oscillation curve type may be a 5-stage double S-shaped speed curve, see Figure 3 , Figure 3 Schematic diagram of the acceleration curve of the 5-stage double S-shaped speed curve of the present application. Figure 3 As shown, each oscillation cycle of the 5-segment double S-shaped speed curve includes a symmetrical first half cycle model and a second half cycle model, and the first half cycle model includes an acceleration segment, a uniform speed segment, and a deceleration segment.

[0117] Among them, the PVT curve of the acceleration section is as follows:

[0118] a a=η[1-cos(u·t)];

[0119]

[0120]

[0121] Where t∈[0,T a ], T a is the acceleration time, P a is the real-time oscillation position, V a is the real-time oscillation speed, a a is the real-time oscillation acceleration, η is the amplification factor, and η=V m / T a , u=2π / T a , V m is the oscillation velocity amplitude;

[0122] The PVT curve of the uniform speed section is as follows:

[0123] a ave =0;

[0124] V ave =V m ;

[0125] p ave =0.5V m ·Ta+V m· (t-Ta);

[0126] In the formula, t∈[T a , T a +T ave ], T ave is the uniform time, T ave =A m / V m -T a , P ave is the real-time oscillation position, V ave is the real-time oscillation speed, a ave is the real-time oscillation acceleration;

[0127] The PVT curve of the deceleration section is as follows:

[0128] a d =η[1-cos(u·(T half -t))];

[0129]

[0130]

[0131] In the formula, t∈[T a +Tave , T half ], T half is half an oscillation period, and T half =T a +T ave +T d , T d is the deceleration time, and T d =T a , P d is the real-time oscillation position, V d is the real-time oscillation speed, a d is the real-time oscillation acceleration.

[0132] Based on the PVT curve of the first half cycle model, the position, velocity and acceleration of the target axis can be calculated according to the range of t values ​​and the corresponding curve segment. half When t is 0, the second half of the cycle is entered, and then t is gradually reduced according to the interpolation cycle. Similarly, according to the range of t values, the position, velocity and acceleration of the target axis are calculated according to the corresponding curve segment, but the velocity value needs to change its sign. Further, in the second half of the cycle, t gradually decreases to 0, and then the next cycle is entered, and t is restored to be gradually increased according to the interpolation cycle. According to the range of t values, the position, velocity and acceleration of the target axis are calculated according to the corresponding curve segment until t gradually increases to T half , and so on and so forth to obtain a complete oscillation curve model.

[0133] Of course, in other implementations, the complete oscillation curve type may also be other types of S-shaped acceleration curves, or other non-S-shaped acceleration curves, which can also achieve the effect of this implementation.

[0134] S202a. Based on the oscillation velocity amplitude and the oscillation position amplitude of the target axis, the parameters of the oscillation curve model are calculated and substituted into the oscillation curve model to obtain a target oscillation curve.

[0135] Based on the oscillation position amplitude and the oscillation velocity amplitude of the target axis, the parameters of the above oscillation curve model can be calculated to obtain the target oscillation curve.

[0136] Taking the five-stage double S-shaped speed curve in step S201a as an example, the oscillation position amplitude A of the target axis is m1 and the oscillation velocity amplitude V m Substituting into the above formula, we can get a The associated oscillation curve model function, where T ave =A m / V m -T a ; T half =T ave +2Ta =A m / V m +T a .

[0137] At this time, T can be calculated based on the preset oscillation cycle number and oscillation duration of the system. a , or T is calculated based on the preset oscillation cycle time of the system a , thus obtaining the target oscillation curve.

[0138] In another embodiment, the oscillation curve type may also include an incomplete oscillation curve type whose initial and final oscillation speeds are not zero and whose initial and final oscillation positions are not zero, and a speed-up curve type.

[0139] It can be understood that, since the initial and final oscillation positions and velocities of the incomplete oscillation curve type are not zero, a speed-up process curve and a speed-down process curve are also required to make the position and speed of the overall oscillation curve continuous.

[0140] Specifically, see Figure 4 , Figure 4 yes Figure 1 A flowchart of another implementation method corresponding to step S200 in FIG.

[0141] like Figure 4 As shown, when the oscillation curve type includes an incomplete oscillation curve type and a speed-up curve type, the method for constructing a target oscillation curve may include:

[0142] S201b. Based on the incomplete oscillation curve type, construct an oscillation curve model.

[0143] Firstly, an oscillation curve model corresponding to the oscillation process can be constructed based on the incomplete oscillation curve type.

[0144] For example, in one embodiment, when the non-complete oscillation curve type is a sinusoidal speed curve, the oscillation curve model may be as follows:

[0145] P=A m sin(ωt)+P0;

[0146] V=A m ω·cos(ωt);

[0147] a=-A m ω 2 sin(ωt);

[0148] Where P0 is the initial oscillation position, P is the real-time oscillation position, V is the real-time velocity, a is the real-time acceleration, ω=V m / A m , V mis the oscillation velocity amplitude, A m is the oscillation position amplitude.

[0149] S202b. Based on the oscillation velocity amplitude and the oscillation position amplitude of the target axis, the parameters of the oscillation curve model are calculated and substituted into the oscillation curve model to obtain an oscillation process curve.

[0150] Taking the oscillation curve type in step S201b as a sinusoidal velocity curve as an example, for the target axis, the oscillation position amplitude A of the target axis can be m1 and the oscillation velocity amplitude V m Substituting into the curve model, taking into account the acceleration time and deceleration time required in the actual oscillation process, the oscillation process curve is obtained as follows:

[0151] P1=A m1 ·sin(ω1(tT a ))+P0;

[0152] V1=A m1 ω1·cos(ω1(tT a ));

[0153] a1=-A m1 ω1 2 ·sin(ω1(tT a ));

[0154] Where P1 is the real-time oscillation position of the target axis, V1 is the real-time oscillation velocity of the target axis, a is the real-time oscillation acceleration of the target axis, ω1 = V m / A m1 , V m is the oscillation velocity amplitude, A m1 is the oscillation position amplitude of the target axis, t∈[T a , T total -T d ], T a is the acceleration time, T d is the deceleration time, T total is the total oscillation time.

[0155] It can be understood that the above oscillation process curve is only related to T a The associated function.

[0156] S203b. Based on the oscillation process curve, an initial speed and an initial oscillation position of the oscillation process curve are obtained.

[0157] Under the premise that the oscillation process curve is known, the initial state of the oscillation process corresponding to the oscillation process curve can be obtained.

[0158] Taking the oscillation process curve when the oscillation curve type in step S202b is a sinusoidal speed curve as an example, at t=T a When P1=P0,V1=A m1 ω1=V m In order to ensure the continuity of speed and position, it can be seen that the speed increase process curve is at t = T a The position should be P0 and the speed should be V m Based on this setting, the speed increase process curve can be calculated.

[0159] S204b: Obtain a speed increase process curve based on the speed increase curve type, the initial speed, and the initial oscillation position.

[0160] The speed-up curve type can be preset based on actual needs. In one embodiment, when the oscillation curve type is a sinusoidal speed curve, the speed-up process curve can be a sinusoidal acceleration curve. The sinusoidal acceleration curve can be expressed as follows:

[0161] a a =1-cos(u·t)

[0162] V a =t-sin(u·t) / u

[0163] P a =P 0a +0.5t 2 +cos(u·t) / u 2

[0164] Where u is the frequency, and u = 2π / T a , T a The acceleration time.

[0165] At the initial moment of t=0, all values ​​should be 0, so:

[0166] P 0a =-1 / u 2

[0167] P a =0.5t 2 +[cos(u·t)-1] / u 2

[0168] Furthermore, in order to ensure the speed continuity of the speed increase process curve and the target oscillation curve, it is necessary to multiply the speed increase process curve by the amplification factor η, η satisfies η=V m / T a , V m is the initial velocity of the oscillation process curve.

[0169] The following is the speed increase process curve obtained in step S203b at t=Ta The position at which the m1 Taking ω1 as an example, the construction method of the speed increase process curve is introduced.

[0170] The speed increase process curve is at t = T a The speed is A m1 ω1, then η=A m1 ω1 / T a .

[0171] Therefore, the formula of the speed increase process curve is as follows:

[0172] a a =η[1-cos(u·t)];

[0173]

[0174]

[0175] Where η = A m1 ω1 / T a , u=2π / T a , t∈[0,T a ].

[0176] It can be understood that the above speed-up curve is only related to T a The associated function.

[0177] Furthermore, in order to ensure the position continuity of the speed-up process curve and the oscillation process curve, the following formula must be satisfied:

[0178] P0=0.5η·Ta 2 =0.5A m1 ω1·T a

[0179] Where P0 is the initial oscillation position of the oscillation process curve.

[0180] In one embodiment, in order to facilitate the setting and simplification of the speed-up process curve and the target oscillation curve, the initial oscillation position P0 of the target oscillation curve can be equal to A m1 , then ω1·T a =2, and then V m ·T a =2A m1 , Wherein T is the sinusoidal period of the target oscillation curve. Therefore, the speed-up time of the speed-up process curve can be calculated based on the sinusoidal period of the target oscillation curve, thereby obtaining a specific speed-up process curve and an oscillation process curve.

[0181] The synchronous, oscillating process curve can be simplified as follows:

[0182] P1=A m1 ·sin(ω1(tT a ))+A m1 ;

[0183] V1=A m1 ω·cos(ω1(tT a ));

[0184] a1=-A m1 ω 2 ·sin(ω1(tT a )).

[0185] S205b: Obtain a deceleration process curve based on the speed-up process curve and the oscillation process curve.

[0186] Specifically, in order to facilitate the construction of the deceleration process curve, the acceleration process curve and the deceleration process curve can be set symmetrically, thereby achieving rapid construction.

[0187] In one embodiment, when the oscillation process curve is a sinusoidal speed curve, in order to make the deceleration process curve symmetrical with the acceleration process curve, refer to Figure 5 , Figure 5 is a schematic diagram of the structure of an embodiment of the target oscillation curve of the present application, which can control the oscillation duration of the oscillation process curve to be n is a positive integer, and T is the sinusoidal period of the oscillation process curve.

[0188] At this time, the initial speed, initial position, terminal speed and terminal position of the oscillation process curve are exactly the same, while the acceleration is opposite.

[0189] Therefore, the curve that is symmetrical with respect to the center line of the oscillation process curve can be directly used as the deceleration process curve.

[0190] For example, when the acceleration process curve is a sinusoidal acceleration curve as shown in step S204b, the deceleration process curve may be as follows:

[0191] a d =η[1-cos(u·(T total -t)];

[0192]

[0193]

[0194] In the formula, t∈[T total -T d , T total ], T total is the total oscillation time.

[0195] Of course, in other embodiments, the deceleration process curve can be adjusted accordingly based on the incomplete oscillation curve type and the speed-up curve type in the oscillation instruction; or the type of the deceleration process curve can be re-specified, and based on the terminal speed, terminal position, terminal acceleration of the target oscillation curve, and the terminal state of the deceleration process curve, all values ​​are 0, and the deceleration process curve can be calculated, which can achieve the effect of this embodiment.

[0196] S206b: Obtain a target oscillation curve based on the speed-up process curve, the oscillation process curve, and the deceleration process curve.

[0197] By combining the oscillation process curves, speed-up process curves and deceleration process curves obtained in the above steps, a target oscillation curve can be obtained. The target oscillation curve corresponds to the speed-up process curve, the target oscillation curve and the deceleration process curve in different time ranges, such as Figure 5 shown.

[0198] It should be noted that since the acceleration curve of the sinusoidal velocity curve is smoother than the 5-segment double S-shaped velocity curve, in order to reduce the performance requirements for the machine tool axis, the preferred oscillation curve type is the sinusoidal velocity curve.

[0199] S300 , based on the oscillation position amplitude of each axis and the target oscillation curve, calculate and obtain the oscillation path of each axis.

[0200] Specifically, see Figure 6 , Figure 6 yes Figure 1 A flowchart of an implementation method corresponding to step S300 in FIG.

[0201] like Figure 6 As shown, the method for calculating the oscillation path of each axis may include:

[0202] S301 , calculating the ratio of the oscillation position amplitude of each axis to the oscillation position amplitude of the target axis, and obtaining the reduction coefficient of each axis.

[0203] S302 . Based on the reduction coefficient, a corresponding reduction operation is performed on the real-time oscillation position, the real-time oscillation rate and the real-time oscillation acceleration of the target oscillation curve to obtain the oscillation path of each axis.

[0204] First, the ratio of the oscillation position amplitude of each axis to the target axis can be calculated as the reduction coefficient of each axis; for example, when the oscillation position amplitudes of the X, Y, and Z axes are 1, 2, and 3 respectively, the Z axis is the target axis, and the reduction coefficients of the X and Y axes are one third and two thirds respectively.

[0205] Then, the real-time oscillation position, the real-time oscillation rate, and the real-time oscillation acceleration of the target oscillation curve may be multiplied by the reduction coefficient to obtain the oscillation path of the X-axis and the oscillation path of the Y-axis.

[0206] S400, superimposing the oscillation path of each axis with the original grinding path to obtain an oscillating grinding path.

[0207] In one embodiment, only one of the axes may have an oscillating path, and the other axes do not oscillate. The oscillating path of the axis may be superimposed on the grinding path of the corresponding axis of the original grinding path to obtain an oscillating grinding path. Figure 7 , Figure 7 is a schematic diagram of an embodiment of an oscillating grinding path of a single-axis oscillation of the present application, Figure 7 The circular line in is the original grinding path.

[0208] In another embodiment, multiple axes may have oscillating paths at the same time. The oscillating path of each axis may be superimposed on the grinding path of the corresponding axis of the original grinding path. Finally, the paths of all axes are combined to obtain the oscillating grinding path. Please refer to Figure 8 , Figure 8 is a schematic diagram of an embodiment of an oscillating grinding path of multi-axis oscillation of the present application, Figure 8 The circular line in is the original grinding path.

[0209] It is worth noting that the oscillating grinding paths obtained in the above-mentioned embodiments can be applied to various processing conditions, such as the grinding of inclined surfaces, and the effects of the present embodiment can be achieved. Fig. 9 , Fig. 9 It is a schematic diagram of an implementation method of an oscillating grinding path under the inclined surface processing state of the present application; in addition, the oscillating path obtained in the previous implementation methods can be selectively superimposed on the entire path or a partial path segment of the original grinding path, and the effect of this implementation method can be achieved.

[0210] In one embodiment, the above-mentioned superposition process can be implemented based on the LYNUC numerical control system by supplementing the original algorithm in the corresponding sub-function code.

[0211] This application also provides a planning device for an oscillating grinding path, see Fig.10 , Fig.10 It is a structural block diagram of an implementation method of an oscillating grinding path planning device of the present application.

[0212] like Fig.10 As shown, the planning device includes an instruction acquisition module 21, a construction module 22, a calculation module 23 and a superposition module 24.

[0213] The instruction acquisition module 21 is used to acquire an oscillation instruction, and the oscillation instruction includes an oscillation curve type, an oscillation speed amplitude, and an oscillation position amplitude of each axis;

[0214] The construction module 22 is used to construct a target oscillation curve for a target axis based on the oscillation instruction, where the target axis is the axis with the largest oscillation position amplitude;

[0215] The calculation module 23 is used to calculate the oscillation path of each axis based on the oscillation position amplitude of each axis and the target oscillation curve;

[0216] The superposition module 24 is used to superimpose the oscillation path of each axis with the original grinding path to obtain an oscillating grinding path.

[0217] As above Figures 1 to 9 , a method for planning an oscillating grinding path according to an embodiment of this specification is described. The details mentioned in the above description of the method embodiment are also applicable to the planning device for the oscillating grinding path of the embodiment of this specification. The above planning device for the oscillating grinding path can be implemented by hardware, or by software, or by a combination of hardware and software.

[0218] This application also provides an electronic device, see Fig.11 , Fig.11 It is a structural block diagram of an embodiment of the electronic device of the present application.

[0219] like Fig.11 As shown, the electronic device 30 may include at least one processor 31, a memory 32 (e.g., a non-volatile memory), a memory 33, and a communication interface 34, and the at least one processor 31, the memory 32, the memory 33, and the communication interface 34 are connected together via a bus 35. At least one processor 31 executes at least one computer-readable instruction stored or encoded in the memory 32.

[0220] It should be understood that the computer executable instructions stored in the memory 32, when executed, cause at least one processor 31 to perform the above combined operations in various embodiments of the present specification. Figure 1-Figure 9 Describes the various operations and functions.

[0221] In the embodiments of the present specification, the electronic device 30 may include, but is not limited to, personal computers, server computers, workstations, desktop computers, laptop computers, notebook computers, mobile electronic devices, smart phones, tablet computers, cellular phones, personal digital assistants (PDAs), handheld devices, messaging devices, wearable electronic devices, consumer electronic devices, and the like.

[0222] According to one embodiment, a program product such as a machine-readable medium is provided. The machine-readable medium may have instructions (i.e., the above-mentioned elements implemented in the form of software), which, when executed by a machine, causes the machine to perform the above-mentioned combination of various embodiments of this specification. Figure 1-Figure 5 Specifically, a system or device equipped with a readable storage medium may be provided, on which a software program code implementing the functions of any of the above-mentioned embodiments is stored, and a computer or processor of the system or device reads and executes the instructions stored in the readable storage medium.

[0223] In this case, the program code itself read from the machine-readable medium can realize the function of any one of the above embodiments, and thus the machine-readable code and the machine-readable storage medium storing the machine-readable code constitute part of this specification.

[0224] Examples of readable storage media include floppy disks, hard disks, magneto-optical disks, optical disks (such as CD-ROM, CD-R, CD-RW, DVD-ROM, DVD-RAM, DVD-RW, DVD-RW), magnetic tapes, non-volatile memory cards, and ROMs. Alternatively, the program code may be downloaded from a server computer or a cloud via a communication network.

[0225] Those skilled in the art should understand that the various embodiments disclosed above can be modified and altered in various ways without departing from the essence of the invention. Therefore, the protection scope of this specification should be defined by the appended claims.

[0226] It should be noted that not all steps and units in the above-mentioned processes and system structure diagrams are necessary, and some steps or units can be ignored according to actual needs. The execution order of each step is not fixed and can be determined as needed. The device structure described in the above-mentioned embodiments can be a physical structure or a logical structure, that is, some units may be implemented by the same physical client, or some units may be implemented by multiple physical clients, or some components in multiple independent devices may be implemented together.

[0227] In the above embodiments, the hardware unit or module can be realized by mechanical or electrical means. For example, a hardware unit, module or processor can include permanent dedicated circuit or logic (such as special processor, FPGA or ASIC) to complete the corresponding operation. The hardware unit or processor can also include programmable logic or circuit (such as general-purpose processor or other programmable processor), which can be temporarily set by software to complete the corresponding operation. Specific implementation (mechanical method or dedicated permanent circuit or temporary circuit) can be determined based on cost and time consideration.

[0228] The specific embodiments described above in conjunction with the accompanying drawings describe exemplary embodiments, but do not represent all embodiments that can be implemented or fall within the scope of protection of the claims. The term "exemplary" used throughout this specification means "used as an example, instance or illustration" and does not mean "preferred" or "having advantages" over other embodiments. For the purpose of providing an understanding of the described technology, the specific embodiments include specific details. However, these technologies can be implemented without these specific details. In some instances, in order to avoid making the concepts of the described embodiments difficult to understand, well-known structures and devices are shown in block diagram form.

[0229] The above description of the present disclosure is provided to enable any person of ordinary skill in the art to implement or use the present disclosure. Various modifications to the present disclosure will be apparent to those of ordinary skill in the art, and the general principles corresponding to the present disclosure may be applied to other variations without departing from the scope of protection of the present disclosure. Therefore, the present disclosure is not limited to the examples and designs described herein, but is consistent with the widest range of principles and novel features disclosed herein.

Claims

1. A method for planning an oscillating grinding path, characterized in that: include: Obtaining an oscillation instruction, wherein the oscillation instruction includes an oscillation curve type, an oscillation speed amplitude, and an oscillation position amplitude of each axis; Based on the oscillation instruction, construct a target oscillation curve for a target axis, the target axis being the axis with the largest oscillation position amplitude; Based on the oscillation position amplitude of each axis and the target oscillation curve, an oscillation path of each axis is calculated; Superimposing the oscillation paths of the axes with the original grinding paths respectively to obtain oscillating grinding paths; Wherein, multiple axes in each axis have oscillation paths at the same time, and the step of superimposing the oscillation paths of each axis with the original grinding path to obtain the oscillation grinding path is specifically: The oscillating path of each axis is superimposed on the grinding path of the corresponding axis of the original grinding path, and finally the paths of all axes are combined to obtain the oscillating grinding path.

2. The planning method according to claim 1, characterized in that: The oscillation curve type includes a complete oscillation curve type in which the initial and final oscillation speeds are zero and the initial and final oscillation positions are zero; The step of constructing a target oscillation curve for a target axis based on the oscillation instruction comprises: Based on the complete oscillation curve type, construct an oscillation curve model; Based on the oscillation velocity amplitude and the oscillation position amplitude of the target axis, the parameters of the oscillation curve model are calculated and substituted into the oscillation curve model to obtain the target oscillation curve.

3. The planning method according to claim 2, characterized in that: The oscillation curve type includes a 5-segment double S-shaped speed curve. Each oscillation cycle of the 5-segment double S-shaped speed curve includes a symmetrical first half cycle model and a second half cycle model. The first half cycle model includes an acceleration segment, a uniform speed segment, and a deceleration segment. The PVT curve of the acceleration segment is as follows: a a =η[1-cos(u·t)]; Where t∈[0,T a ], T a is the acceleration time, P a is the real-time oscillation position, V a is the real-time oscillation speed, a a is the real-time oscillation acceleration, η is the amplification factor, and η=V m / T a , u=2π / T a , V m is the oscillation velocity amplitude; The PVT curve of the uniform speed section is as follows: a ave =0; V ave =V m ; P ave =0.5V m ·Ta+V m ·(t-Ta)? In the formula, t∈[T a , T a +T ave ], T ave is the uniform time, T ave =A m / V m -T a , P ave is the real-time oscillation position, V ave is the real-time oscillation speed, a ave is the real-time oscillation acceleration; The PVT curve of the deceleration section is as follows: a d =η[1-cos(u·(T half -t))]; In the formula, t∈[T a +T ave , T half ], T half is half an oscillation period, and T half =T a +T ave +T d , T d is the deceleration time, and T d =T a , P d is the real-time oscillation position, V d is the real-time oscillation speed, a d is the real-time oscillation acceleration.

4. The planning method according to claim 1, characterized in that: The oscillation curve types include an incomplete oscillation curve type in which the initial and final oscillation speeds are not zero and the initial and final oscillation positions are not zero, and a speed-up curve type; The step of constructing a target oscillation curve for a target axis based on the oscillation instruction comprises: Based on the incomplete oscillation curve type, construct an oscillation curve model; Based on the oscillation velocity amplitude and the oscillation position amplitude of the target axis, the parameters of the oscillation curve model are calculated and substituted into the oscillation curve model to obtain an oscillation process curve; Based on the oscillation process curve, obtaining an initial speed and an initial oscillation position of the oscillation process curve; Based on the speed increase curve type, the initial speed and the initial oscillation position, a speed increase process curve is obtained; Based on the speed-up process curve and the target oscillation curve, a deceleration process curve is obtained; The target oscillation curve is obtained based on the speed-up process curve, the oscillation process curve and the deceleration process curve.

5. The planning method according to claim 4, characterized in that: The non-complete oscillation curve type is a sinusoidal speed curve, and the oscillation curve model is as follows: P=A m ·sin(ωt)+P0; V=A m ω·cos(ωt); a=-A m oh 2 ·sin(ωt); Where P0 is the initial oscillation position, P is the real-time oscillation position, V is the real-time velocity, a is the real-time acceleration, ω=V m / A m , V m is the oscillation velocity amplitude, A m is the oscillation position amplitude; The oscillation process curve is as follows: P1=A m1 ·sin(ω1(t-T a ))+P0; V1=A m1 ω1·cos(ω1(t-T a )); a1=-A m1 ω1 2 ·sin(ω1(t-T a )); In the formula, t∈[T a , T total -T d ], T a is the acceleration time, T d is the deceleration time, T total is the total oscillation time, P1 is the real-time oscillation position of the target axis, V1 is the real-time oscillation speed of the target axis, a is the real-time oscillation acceleration of the target axis, ω1=V m / A m1 , V m is the oscillation velocity amplitude, A m1 is the oscillation position amplitude of the target axis.

6. The planning method according to claim 5, characterized in that: The speed-up curve type is a sinusoidal acceleration curve, and the speed-up process curve is as follows: a a =η[1-cos(u·t)]; Where t∈[0,T a ], P a is the real-time oscillation position of the target axis, V a is the real-time oscillation speed of the target axis, a a is the real-time oscillation acceleration of the target axis, η is the amplification factor, and η=V m / T a , u=2π / T a , and P0=0.5η·Ta 2 .

7. The planning method according to claim 5, characterized in that: The oscillation duration of the oscillation process curve is n is a positive integer, T is the sinusoidal period of the target oscillation curve; the step of obtaining the deceleration process curve based on the speed-up process curve and the oscillation process curve is specifically as follows: Calculate and obtain the center line of the oscillation process curve; A curve that is symmetrical to the center line of the speed-up process curve is calculated as the deceleration process curve.

8. The planning method according to claim 7, characterized in that: The speed increase process curve is as follows: a a =η[1-cos(u·t)]; Where t∈[0,T a ], P a is the real-time oscillation position of the target axis, V a is the real-time oscillation speed of the target axis, a a is the real-time oscillation acceleration of the target axis, η is the amplification factor, and η=V m / T a , u=2π / T a , and P0=0.5η·Ta 2 ; The deceleration process curve is as follows: a d =η[1-cos(u·(T total -t)]; In the formula, t∈[T total -T d , T total ], T total is the total oscillation time.

9. The planning method according to claim 1, characterized in that: The step of calculating the oscillation path of each axis based on the oscillation position amplitude of each axis and the target oscillation curve comprises: Calculating the ratio of the oscillation position amplitude of each axis to the oscillation position amplitude of the target axis to obtain the reduction coefficient of each axis; Based on the reduction coefficient, a corresponding proportional reduction operation is performed on the real-time oscillation position, the real-time oscillation rate and the real-time oscillation acceleration of the target oscillation curve to obtain the oscillation path of each axis.

10. A device for planning an oscillating grinding path, characterized in that: include: An instruction acquisition module, used to acquire an oscillation instruction, wherein the oscillation instruction includes an oscillation curve type, an oscillation speed amplitude, and an oscillation position amplitude of each axis; A construction module, configured to construct a target oscillation curve for a target axis based on the oscillation instruction, wherein the target axis is an axis with the largest oscillation position amplitude; A calculation module, configured to calculate an oscillation path of each axis based on the oscillation position amplitude of each axis and the target oscillation curve; A superposition module, used for superimposing the oscillation path of each axis with the original grinding path to obtain an oscillating grinding path; Wherein, multiple axes in each axis have oscillation paths at the same time, and the step of superimposing the oscillation paths of each axis with the original grinding path to obtain the oscillation grinding path is specifically: The oscillating path of each axis is superimposed on the grinding path of the corresponding axis of the original grinding path, and finally the paths of all axes are combined to obtain the oscillating grinding path.

11. An electronic device, characterized in that: include: at least one processor; as well as A memory storing instructions, which, when executed by the at least one processor, enable the at least one processor to execute the oscillating grinding path planning method according to any one of claims 1 to 9.

12. A machine-readable storage medium, characterized in that: Executable instructions are stored, and when the executable instructions are executed, the machine executes the oscillation grinding path planning method according to any one of claims 1 to 9.

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