A film pasting device with self-cutting function for wafer production

Abstract

The application discloses a film pasting device with a self-cutting function for wafer production in the technical field of wafer production. The application discloses a film pasting device with a self-cutting function for wafer production, which comprises a supporting frame, a feeding roller rotatably connected to the supporting frame, mirror image distributed rotating shafts, mirror image distributed first threaded rods and rotating rods, sliding blocks threadedly connected to one end of the first threaded rods close to the feeding roller, a transition plate commonly slidably connected to the sliding blocks, side walls of the transition plate slidably connected to mirror image distributed first limiting frames, and mirror image distributed clamping plates commonly slidably connected to the side walls of the first limiting frames.

Description

Technical Field

[0001] This invention discloses a film-applying device with self-cutting function for wafer production, which relates to the field of wafer manufacturing technology. Background Technology

[0002] A wafer is a basic material for semiconductor chips. Because it is relatively fragile and easily damaged, it needs to be protected during wafer production or transportation to prevent damage to its surface. The current method of protecting wafers is to cover its surface with a thin film.

[0003] The current wafer lamination process is as follows: First, the wafer is fixed on a housing. Then, the film is dragged onto the upper surface of the wafer and pressed. After lamination, the film is cut off along the edge of the wafer. When laminating the next wafer, the cut part of the film is usually dragged. Since a portion of the film is removed from the dragged part, uneven force during the dragging process can cause the film to deform or even break, affecting the lamination efficiency and wasting film material.

[0004] Therefore, there is an urgent need to develop a film-applying device with self-cutting function for wafer production. Summary of the Invention

[0005] The present invention provides a film-applying device with self-cutting function for wafer production, the purpose of which is to solve the problems mentioned in the background art.

[0006] The technical solution is as follows: A film-applying device with self-cutting function for wafer production includes a support frame. The support frame is rotatably connected to a feeding roller, a mirror-distributed rotating shaft, a mirror-distributed first threaded rod, and a rotating rod. The support frame is equipped with mirror-distributed servo motors. The rotating shaft is driven by a power assembly to the output shaft of an adjacent servo motor. The rotating shaft cooperates with an adjacent first threaded rod. A sliding block is threadedly connected to the end of the first threaded rod near the feeding roller. The mirror-distributed sliding blocks are slidably connected to a transition plate. The mirror-distributed sliding blocks and the transition plate are connected... All components are fixedly connected to springs. The sidewall of the transition plate is slidably connected to a mirror-distributed first limiting frame. The sidewalls of the mirror-distributed first limiting frames are slidably connected to mirror-distributed clamping plates. The rotating rod is provided with an inclined sliding groove. The sliding block near the rotating rod is provided with a limiting ball that cooperates with the inclined sliding groove of the rotating rod. A one-way bevel gear is installed on the feeding roller. The rotating rod is fixedly connected to a bevel gear that meshes with the one-way bevel gear on the feeding roller. The support frame is slidably connected to a holding shell through a bracket. The first limiting frame is provided with a clamping assembly. The support frame is provided with a transmission assembly and a winding assembly.

[0007] Preferably, the clamping assembly includes mirror-distributed limiting plates, each of which is fixed to the side of the transition plate away from the mirror-distributed sliding block. A first elastic element is fixed between the mirror-distributed clamping plates, and each of the mirror-distributed clamping plates has an inclined groove on its back side. The limiting plate engages with the inclined groove of the adjacent clamping plate.

[0008] Preferably, the transmission assembly includes a first sleeve with a mirror-distributed arrangement. The first sleeve is fixedly connected to the support frame on the side near the servo motor. A first piston rod is slidably connected to the first sleeve. The side of the first piston rod away from the feed roller is fixedly connected to an adjacent first limiting frame. A second sleeve with a mirror-distributed arrangement is fixedly connected to the support frame on the side near the servo motor. The second sleeve is connected to an adjacent first sleeve through a conduit. A second piston rod is slidably connected to the second sleeve. The side of the mirror-distributed second piston rod away from the feed roller is fixedly connected to the holding shell.

[0009] Preferably, the space between the first sleeve and the adjacent first piston rod, and the space between the second sleeve and the adjacent second piston rod, are filled with compressible gas. The first sleeve forms a communicating cavity with the adjacent second sleeve through a conduit. The portion of the cavity formed by the first sleeve and the adjacent second sleeve located between the adjacent first piston rod and the adjacent second piston rod is under negative pressure.

[0010] Preferably, the winding assembly includes mirror-distributed guide rollers, each of which is disposed on the side of the support frame away from the feed roller. One of the guide rollers is rotatably connected to the support frame. The guide roller rotatably connected to the support frame is rotatably connected to a mirror-distributed first fixing plate. Each of the mirror-distributed first fixing plates is fixedly connected to the support frame. Each of the mirror-distributed first fixing plates is provided with a second fixing plate. The second fixing plate is rotatably connected to the other guide roller. The support frame is rotatably connected to a winding roller. A fan is installed on the side of the support frame near the mirror-distributed second fixing plate.

[0011] Preferably, a flattening mechanism is also included, which is disposed on the support frame and is used to extrude the film. The flattening mechanism includes a second threaded rod distributed in a mirror image. The second threaded rod is rotatably connected to the support frame. The mirror-distributed second threaded rods are threaded together to an extrusion plate. A rectangular groove is provided on the lower side of the extrusion plate. An extrusion roller is rotatably connected to the extrusion plate. A driven wheel is fixedly connected to the side of the second threaded rod near the feeding roller. The rotating shaft is provided with a switching component for driving the adjacent driven wheel to rotate.

[0012] Preferably, the first fixing plate is slidably connected to the adjacent second fixing plate to adjust the distance between the mirror-distributed guide rollers, and a spring is fixed between the first fixing plate and the adjacent second fixing plate.

[0013] Preferably, the switching assembly includes mirror-distributed drive wheels, which are fixed to the middle of adjacent rotating shafts. The drive wheels cooperate with adjacent driven wheels. A second limiting frame is rotatably connected to the rotating shafts. A mirror-distributed first push rod is fixed to the support frame. The telescopic end of the first push rod cooperates with the extrusion plate. A second push rod is fixed to the support frame. The telescopic end of the second push rod cooperates with an adjacent second limiting frame. The second push rod communicates with the adjacent first push rod, and both are filled with compressible gas. A second elastic element is fixed between the second limiting frame and the support frame bracket. The second limiting frame cooperates with the holding shell and slides with the support frame bracket. The rotating shaft cooperates with an adjacent first threaded rod.

[0014] Preferably, the system also includes a cutting mechanism located on the side of the support frame away from the servo motor. The cutting mechanism is used to cut the film. The cutting mechanism includes a three-phase motor mounted on the side of the support frame away from the servo motor. A telescopic rod is fixedly connected to the output shaft of the three-phase motor. A third sleeve is fixedly connected to the side of the support frame near the three-phase motor. A third piston rod is slidably connected to the third sleeve and fixedly connected to the telescopic rod. A spring is provided between the third sleeve and the third piston rod. A cutting blade is fixedly connected to the third piston rod. A fourth sleeve is connected to the third sleeve and slidably connected to the fourth sleeve. A sliding plate is fixedly connected to the side of the fourth piston rod away from the third sleeve, and the sliding plate cooperates with the extrusion plate.

[0015] Preferably, the assembly also includes a fixing component disposed on the holding shell. The fixing component is used to fix the wafer. The fixing component includes an air storage shell, which is fixedly connected to the holding shell. The air storage shell has a cavity inside and through holes distributed circumferentially and communicating with its cavity. An adsorption plate is slidably connected to the air storage shell. A third elastic element is fixedly connected between the adsorption plate and the air storage shell. An air guide pipe is fixedly connected to the air storage shell and communicates with the cavity of the air storage shell. A negative pressure pump is installed on the side of the support frame near the servo motor and communicates with the air guide pipe.

[0016] Compared with the prior art, the present invention has the following advantages: The present invention clamps the edge of the film with mirror-distributed clamping plates, and the part clamped by the mirror-distributed clamping plates is always an intact film, so that the edge of the film is subjected to uniform force, avoiding the deformation or damage of the film caused by only the two ends of the film being subjected to force; the film is perfectly adhered to the surface of the wafer by moving the extrusion plate and extrusion rollers and extruding the film; by controlling the distance between the mirror-distributed guide rollers, the distance between the mirror-distributed guide rollers is reduced, thereby offsetting the tension of the film movement and preventing the film from being excessively stretched and deformed due to the fixation of the two ends of the film; the negative pressure pump adjusts the air storage shell to a negative pressure state to fix the wafer, preventing the wafer from moving during the cutting process and changing its position relative to the film; the negative pressure pump pumps gas into the air storage shell to allow the processed wafer to be easily removed by the operator. Attached Figure Description

[0017] Figure 1 This is a three-dimensional structural diagram of the present invention;

[0018] Figure 2 This is a three-dimensional structural cross-sectional view of the present invention;

[0019] Figure 3 This is a three-dimensional structural diagram of the servo motor and the components at the rotating shaft of the present invention;

[0020] Figure 4 This is a three-dimensional structural diagram of the components at the sliding block and transition plate of the present invention;

[0021] Figure 5 This is an exploded three-dimensional view of the components at the transition plate and the first limiting frame of the present invention.

[0022] Figure 6 This is a three-dimensional structural diagram of the housing and the second piston rod of the present invention.

[0023] Figure 7 This is a three-dimensional structural diagram of the clamping assembly of the present invention;

[0024] Figure 8 This is a three-dimensional structural schematic diagram of the transmission component of the present invention;

[0025] Figure 9 This is a three-dimensional structural diagram of the winding assembly of the present invention;

[0026] Figure 10 This is a three-dimensional structural diagram of the flattening mechanism of the present invention;

[0027] Figure 11 This is a three-dimensional structural diagram of the switching component of the present invention;

[0028] Figure 12This is a three-dimensional structural diagram of the second limiting frame and the container shell switching assembly of the present invention;

[0029] Figure 13 This is a three-dimensional structural diagram of the cutting mechanism of the present invention;

[0030] Figure 14 This is a three-dimensional structural diagram of the fixing component of the present invention.

[0031] Explanation of reference numerals in the attached drawings: 1-Support frame, 101-Clamping assembly, 102-Transmission assembly, 103-Wrap-up assembly, 104-Flattening mechanism, 105-Switching assembly, 106-Cutting mechanism, 107-Fixing assembly, 2-Feeding roller, 3-Servo motor, 4-Rotating shaft, 5-First threaded rod, 6-Sliding block, 7-Transition plate, 8-First limiting frame, 9-Clamping plate, 10-Rotating rod, 11-Container shell, 201-Limiting plate, 202-First elastic element, 301-First sleeve, 302-First piston rod, 303-Second sleeve, 304-Second piston rod, 401-Guide roller, 402-First fixing plate, 4 03-Second fixed plate, 404-Take-up roller, 405-Fan, 501-Second threaded rod, 502-Extrusion plate, 503-Extrusion roller, 504-Driven wheel, 601-Drive wheel, 602-Second limit frame, 603-First push rod, 604-Second push rod, 605-Second elastic element, 701-Three-phase motor, 702-Telescopic rod, 703-Third sleeve, 704-Third piston rod, 705-Cut blade, 706-Fourth sleeve, 707-Fourth piston rod, 708-Sliding plate, 801-Air storage shell, 802-Adsorption plate, 803-Third elastic element, 804-Air guide pipe, 805-Negative pressure pump. Detailed Implementation

[0032] The present invention will be further described below with reference to the accompanying drawings and specific embodiments.

[0033] Example 1: A film-applying device with self-cutting function for wafer production, please refer to... Figures 1-6The system includes a support frame 1, a feeding roller 2 rotatably connected to the left side of the support frame 1, on which an uncut film is wound. Two servo motors 3 are mounted in a mirror image on the upper side of the support frame 1. Two rotating shafts 4 are rotatably connected to the upper side of the support frame 1 in a mirror image. Pulleys are fixed to the rotating shafts 4. Pulleys are fixed to the output shafts of the servo motors 3. A belt is wound around the pulleys of the rotating shafts 4 and the pulleys on the output shafts of the adjacent servo motors 3. A first threaded rod 5 is provided on the rotating shafts 4, and the first threaded rod 5 is rotatably connected to the support frame 1. A sliding block 6 is threadedly connected to the left side of a threaded rod 5. A transition plate 7 is slidably connected to the left side of two mirror-distributed sliding blocks 6. The transition plate 7 consists of a square plate and two round rods. Springs are fixed between the two mirror-distributed sliding blocks 6 and adjacent round rods on the transition plate 7. Two mirror-distributed first limiting frames 8 are slidably connected to the left side of the transition plate 7. Each first limiting frame 8 consists of a square plate, round rods, and a disc. The disc on the first limiting frame 8 limits the transition plate 7. Two... A chute, mirror-distributed first limiting frame 8, has a common sliding connection of a clamping plate 9 at the same height. The clamping plate 9 is used to clamp the film. A rotating rod 10 is rotatably connected to the front side of the support frame 1. The rotating rod 10 is provided with an inclined chute. A limiting ball is provided on the front sliding block 6. The inclined chute of the rotating rod 10 cooperates with the limiting ball of the adjacent sliding block 6. The sliding block 6 drives the limiting ball on it to move to the right. The limiting ball of the sliding block 6 presses against the inclined chute of the rotating rod 10, causing the rotating rod 10 to rotate. A bevel gear is fixed to the left side of the rotating rod 10 for feeding. A one-way bevel gear is installed on the front side of roller 2. When the sliding block 6 moves to the right, the rotating rod 10 drives the feeding roller 2 to rotate through the bevel gear set. When the sliding block 6 moves to the left, the support frame 1 is slidably connected to the holding shell 11 through the bracket. The holding shell 11 is initially located on the right side of the support frame 1. The holding shell 11 is used to place the wafer. The first limiting frame 8 is provided with a clamping assembly 101 for clamping the film. The support frame 1 is provided with a transmission assembly 102 for driving the holding shell 11 to move. The support frame 1 is provided with a winding assembly 103 for winding the film.

[0034] Please see Figure 7 The clamping assembly 101 includes two mirror-distributed limiting plates 201, which are L-shaped. Both limiting plates 201 are fixed to the left side of the transition plate 7. The distance between the two limiting plates 201 is greater than the distance between the two clamping plates 9. A first elastic element 202, which is a spring, is fixed between the two clamping plates 9 to drive the two clamping plates 9 back to their original positions. Inclined grooves are provided on the opposite sides of the two clamping plates 9. The limiting plate 201 cooperates with the inclined grooves of the adjacent clamping plate 9. The limiting plate 201 moves to the left and presses the inclined grooves of the adjacent clamping plate 9, causing the adjacent clamping plate 9 to move under pressure.

[0035] Please see Figure 4 and Figure 8The transmission assembly 102 includes two mirror-distributed first sleeves 301. Each first sleeve 301 is a multi-stage telescopic sleeve. A through hole is provided on the left side of each first sleeve 301 to allow the adjacent first piston rod 302 to move left and right. The first sleeve 301 is fixed to the upper side of the support frame 1. The first piston rod 302 is sealed inside the first sleeve 301 and slidably connected to it. The right side of the first piston rod 302 is fixed to the adjacent first limiting frame 8. Two mirror-distributed second sleeves 303 are fixed to the upper side of the support frame 1. Each second sleeve 303 is a multi-stage telescopic sleeve. A through hole is provided on the right side of each second sleeve 303 to allow the adjacent second piston rod 304 to move left and right. The first sleeve 301 is located above the adjacent second sleeve 303. The second sleeve 303 is adjacent to the first sleeve 301. The second sleeve 303 is sealed and slidably connected to the second piston rod 304 through a conduit. The left sides of the two mirror-distributed second piston rods 304 are fixed to the right side of the holding shell 11. Compressible gas is filled between the first sleeve 301 and the adjacent first piston rod 302 and between the second sleeve 303 and the adjacent second piston rod 304. The first sleeve 301 forms a cavity with the adjacent second sleeve 303 through a conduit. The part of the cavity formed by the first sleeve 301 and the adjacent second sleeve 303 between the adjacent first piston rod 302 and the adjacent second piston rod 304 is in a negative pressure state. The first sleeve 301 and the second sleeve 303 are always kept in a negative pressure state to fix the adjacent first limiting frame 8 and the holding shell 11.

[0036] Please see Figure 6 and Figure 9 The winding assembly 103 includes two mirror-distributed guide rollers 401 for guiding the film. Both guide rollers 401 are located on the right side of the support frame 1. The lower guide roller 401 is rotatably connected to the right side of the support frame 1. The lower guide roller 401 is rotatably connected to two mirror-distributed first fixing plates 402. Both first fixing plates 402 are fixed to the support frame 1. A second fixing plate 403 is provided on the upper side of each of the two first fixing plates 402. The two mirror-distributed second fixing plates 403 are rotatably connected to the upper guide roller 401. The support frame 1 is rotatably connected to a winding roller 404. A fan 405 is installed on the right side of the support frame 1. The fan 405 is used to blow on the surface of the wafer to ensure that there are no impurities on the wafer surface. The upper guide roller 401 is supported by the two first fixing plates 402 and the two second fixing plates 403.

[0037] When a wafer needs to be laminated, the operator first places the wafer on the housing 11. Then, the operator pulls the outer end of the film to the right, allowing the film to pass between the two clamping plates 9 and around the two guide rollers 401. After the film passes the upper guide roller 401, it is pulled to the left and fixed to the take-up roller 404. At this point, the preparation is complete. The operator then turns on the two servo motors 3. The output shafts of the two servo motors 3 drive the adjacent rotating shafts 4 to rotate via the power assembly. The rotating shafts 4 drive the adjacent first threaded rods 5 to rotate. The two sliding blocks 6 move to the right along the threads of the adjacent first threaded rods 5. The two sliding blocks 6, through their adjacent springs, jointly drive the transition plate 7 to... As the transition plate 7 moves to the right, it drives the two limiting plates 201 to move to the right. During the movement of the limiting plates 201 to the right, the transition plate 7 cannot drive the two first limiting frames 8 to move to the right because the first piston rod 302 and the adjacent second piston rod 304 are under negative pressure. As the transition plate 7 moves to the right, it moves along the first limiting frames 8 to the right. At the same time, the two limiting plates 201 drive the two clamping plates 9 to move in opposite directions due to the inclined grooves of the adjacent clamping plates 9. The first elastic element 202 is compressed, and the two clamping plates 9 move in opposite directions to clamp the film. When the transition plate 7 contacts the disc on the first limiting frame 8, the transition plate 7 drives the two first limiting frames 8 to move. At this time, the spring on the transition plate 7 is initially compressed.

[0038] As the sliding block 6 moves to the right, the front sliding block 6 drives the rotating rod 10 to rotate through the limiting ball on it. The rotating rod 10 drives the feeding roller 2 to rotate through the bevel gear set. During the rotation of the feeding roller 2, the feeding roller 2 releases the film on it. At the same time, the two clamping plates 9 drive the film to move to the right. The two clamping plates 9 clamp the edge of the film to make the edge of the film bear the force evenly, so as to avoid the film being deformed or damaged because only the two ends of the film bear the force.

[0039] After the spring on the transition plate 7 is initially compressed, when the spring force on the transition plate 7 is greater than the negative pressure between the first piston rod 302 and the adjacent second piston rod 304, the transition plate 7 drives the two first limiting frames 8 to move to the right. The two first limiting frames 8 drive the adjacent first piston rod 302 to move to the right. When the first piston rod 302 moves to the right, under the action of pressure, the adjacent second piston rod 304 moves to the left. The two second piston rods 304 drive the holding shell 11 to move to the left and drive the wafer on it to move to the left. During the process of the holding shell 11 moving to the left, when the holding shell 11 contacts the bracket on the support frame 1, the holding shell 11 can no longer move to the left. At this time, the wafer reaches the designated cutting position, and then the staff uses the existing cutting device to cut the film.

[0040] When the operator starts the servo motor 3, the take-up roller 404 and the fan 405 are started simultaneously. The take-up roller 404 rotates and takes up the film moving to the right. During the film movement, the film is released by the feed roller 2. Then, the two clamping plates 9 clamp and fix the film and drive the film to move to the right. While the feed roller 2 rotates, the take-up roller 404 takes up the cut film. During the film movement to the right, the film passes around the two guide rollers 401 and drives the two guide rollers 401 to rotate. During the process of the container 11 driving the wafer on it to move to the left, when the wafer is under the fan 405, the air blown by the fan 405 blows the passing wafer to clean it and prevent other impurities from adhering to it, which would affect the subsequent film application operation.

[0041] After the film is cut, the film application to a single wafer is completed. Then, the operator controls the servo motor 3 to rotate in the reverse direction, causing the two sliding blocks 6 to move to the left. During this leftward movement, the corresponding springs on the transition plate 7 reset. Simultaneously, under the action of the two first sleeves 301, the two first limiting frames 8 cannot move. Subsequently, the transition plate 7 drives the limiting plate 201 to move to the left and presses against the adjacent clamping plate 9. The two clamping plates 9 move in opposite directions under the action of the first elastic element 202 and lose their clamping grip on the film. Then, the two first limiting frames 8 press against the adjacent first piston rod 302. The first piston rod 302 moves to the left and drives the adjacent second piston rod 304 to move to the right. The two second piston rods 304 drive the holding shell 11 to move to the right. The wafer with the film applied is moved synchronously to the right. After the sliding block 6 returns to its initial position, the operator turns off the servo motor 3 and the winding roller 404, takes out the processed wafer and puts in an unfilmed wafer. The above operation is then repeated to apply film to subsequent wafers. After film application is completed, the fan 405 is turned off. During the movement of the two sliding blocks 6 to the left, the front sliding block 6 drives the rotating rod 10 to rotate in the opposite direction. Since the bevel gear on the feeding roller 2 is a one-way bevel gear, the bevel gear on the feeding roller 2 cannot drive the feeding roller 2 to rotate. After the two sliding blocks 6 return to their original positions, the two clamping plates 9 are located on the uncut part of the film. This prevents the film from being subjected to uneven force when the two clamping plates 9 clamp and move the cut waste part, which would cause the film to be damaged or deformed.

[0042] Example 2: Based on Example 1, please refer to... Figures 10-12It also includes a flattening mechanism 104, which is disposed on the support frame 1. The flattening mechanism 104 is used to extrude the film. The flattening mechanism 104 includes two mirror-distributed second threaded rods 501, both of which are rotatably connected to the upper side of the support frame 1. The two second threaded rods 501 are threadedly connected to an extrusion plate 502, which is used to extrude the film. The lower surface of the extrusion plate 502 is flush with the upper surface of the housing 11, and both are in contact with the film to ensure that the film adheres to the wafer. A rectangular groove is provided on the lower side of the extrusion plate 502, through which the film passes. A compression roller 503 is rotatably connected to the left side of the 502 plate. The compression roller 503 is used to compress the film. The lower side of the compression plate 502 and the surface of the compression roller 503 are both made of soft foam material to avoid scratching the film. A driven wheel 504 is fixedly connected to the left side of the second threaded rod 501. The surface of the driven wheel 504 is made of rubber. The first fixed plate 402 is slidably connected to the adjacent second fixed plate 403 to adjust the distance between the mirror-distributed guide rollers 401. A spring is fixedly connected between the first fixed plate 402 and the adjacent second fixed plate 403. The rotating shaft 4 is provided with a switching component 105 for driving the adjacent driven wheel 504 to rotate.

[0043] Please see Figure 11 and Figure 12The switching assembly 105 includes two mirror-distributed drive wheels 601. The surfaces of the drive wheels 601 are made of rubber. The drive wheels 601 are fixed to the middle of adjacent rotating shafts 4. The drive wheels 601 cooperate with adjacent driven wheels 504. When the drive wheel 601 moves to the left and comes into contact with the surface of the adjacent driven wheel 504, the drive wheel 601 transmits power to the adjacent driven wheel 504. The rubber material on both surfaces increases the friction between them. A limit bracket 602 is rotatably connected to the middle of the rotating shaft 4. Position frame 602 is located to the left of the adjacent drive wheel 601. A first push rod 603, mirror-distributed, is fixedly connected to support frame 1. The telescopic end of the first push rod 603 engages with the compression plate 502. The compression plate 502 moves to the left and compresses the telescopic end of the first push rod 603, causing it to retract and compress the gas inside. A second push rod 604 is fixedly connected to support frame 1. The telescopic end of the second push rod 604 engages with the adjacent second limiting frame 602. The second limiting frame 602 moves to the left and compresses the telescopic end of the second push rod 604. At the end, the telescopic end of the second push rod 604 retracts, compressing the gas inside. The second push rod 604 is connected to the adjacent first push rod 603, and both are filled with compressible gas. A second elastic element 605, which is a tension spring, is fixedly connected between the second limiting frame 602 and the bracket of the support frame 1. The second elastic element 605 is used to drive the adjacent second limiting frame 602 to reset. The second limiting frame 602 cooperates with the holding shell 11. The holding shell 11 moves to the left and squeezes the adjacent second limiting frame 602. The second limiting frame 602 moves to the right and pulls... When the adjacent rotating shaft 4 moves, the second limiting frame 602 slides with the bracket of the support frame 1, and the rotating shaft 4 engages with the adjacent first threaded rod 5. In the initial state, the rotating shaft 4 engages with the adjacent first threaded rod 5. When the rotating shaft 4 moves to the left, the rotating shaft 4 and the adjacent first threaded rod 5 are rotatably connected, and the rotating shaft 4 cannot transmit power to the adjacent first threaded rod 5. When the rotating shaft 4 moves to the right, the rotating shaft 4 engages with the adjacent first threaded rod 5 via a spline, and the rotating shaft 4 transmits power to the adjacent first threaded rod 5.

[0044] During wafer lamination, the operator first passes the film through the rectangular groove under the extrusion plate 502 and positions the film under the extrusion roller 503. As the wafer is moved to the left by the holding shell 11, after the holding shell 11 contacts the two second limiting frames 602, the holding shell 11 moves to the left and squeezes the two second limiting frames 602. The two second limiting frames 602 move to the left, and the two second elastic elements 605 stretch. The two second limiting frames 602 respectively drive the adjacent rotating shaft 4 to move to the left. The rotating shaft 4 rotates with the adjacent first threaded rod 5. In the moving connection, the two second limiting brackets 602 respectively squeeze the telescopic ends of the adjacent first push rods 603. The telescopic ends of the first push rods 603 move to the left, and the gas in the first push rods 603 and the adjacent second push rods 604 is compressed. Due to the limiting effect of the extrusion plate 502 (the extrusion plate 502 is located in the thread groove of the second threaded rod 501 and cannot move), the telescopic ends of the second push rods 604 cannot extend. During the process of the rotating shaft 4 moving to the left, the rotating shaft 4 drives the adjacent driving wheel 601 to move to the left, and the driving wheel 601 contacts the adjacent driven wheel 504.

[0045] After the driven wheel 504 contacts the adjacent driving wheel 601, the operator controls the servo motor 3 to rotate. The output shaft of the servo motor 3 drives the adjacent rotating shaft 4 to rotate through the power assembly. The rotating shaft 4 drives the adjacent driven wheel 504 to rotate through the driving wheel 601 on it. The driven wheel 504 drives the adjacent second threaded rod 501 to rotate. The two second threaded rods 501 drive the extrusion plate 502 to move to the right and extrude the film downward. When the extrusion plate 502 moves to the right and loses contact with the telescopic end of the adjacent second push rod 604, under the pressure inside the second push rod 604 and the adjacent first push rod 603, the telescopic end of the second push rod 604 extends outward. The extrusion plate 502 drives the extrusion roller 503 to move to the right and extrude the film. As the extrusion plate 502 and the extrusion roller 503 move to the right, the extrusion plate 502 and the extrusion roller 503 extrude the film to the upper surface of the wafer, so that the film adheres to the upper surface of the wafer.

[0046] Before the extrusion plate 502 and extrusion roller 503 move to the right, the film is not attached to the surface of the wafer, and the extrusion plate 502 and extrusion roller 503 will squeeze the film downward, causing the film to tend to move to the left. Since both ends of the film are restricted by the feed roller 2 and the take-up roller 404, in order to avoid the film moving to the left and causing excessive stretching and damage, the specific operation is as follows: During the process of the extrusion plate 502 and extrusion roller 503 moving to the left, the film moves to the left and drives the two clamping plates 9 to move to the left. The two clamping plates 9 drive the transition plate 7 to move to the left through the adjacent limiting plate 201 and further compress the spring on the transition plate 7. During the process of the film moving to the left, the film forms a squeezing force on the two guide rollers 401, causing the two guide rollers 401 to move in opposite directions, thereby causing the first fixing plate 402 to enter the interior of the adjacent second fixing plate 403. By controlling the distance between the two guide rollers 401, the distance between the two guide rollers 401 is reduced, thereby counteracting the pulling force of the film moving to the left and preventing the film ends from being fixed, which would cause the film to be squeezed and deformed.

[0047] After the film is flattened, the workers use the existing cutting device to cut the film on the wafer surface. After cutting, the workers control the servo motor 3 to rotate in the reverse direction, so that the extrusion plate 502 and the extrusion roller 503 move in the opposite direction and reset. When the extrusion plate 502 moves to the left and extrudes the telescopic end of the second push rod 604, the telescopic end of the second push rod 604 retracts, and its internal pressure increases, causing the telescopic end of the adjacent first push rod 603 to extend. The telescopic end of the first push rod 603 extrudes the adjacent second limit frame 602, and the second limit frame 602 moves to the right and drives the rotating shaft 4 to move to the right, so that the driving wheel 601 loses its engagement with the adjacent driven wheel 504. At the same time, the rotating shaft 4 continues to engage with the adjacent first threaded rod 5, and the second elastic element 605 retracts and resets.

[0048] Example 3: Based on Example 2, please refer to... Figure 1 and Figure 13The system also includes a cutting mechanism 106, which is located on the upper side of the support frame 1. The cutting mechanism 106 is used to cut the film. The cutting mechanism 106 includes a three-phase motor 701, which is mounted on the upper side of the support frame 1. The output shaft of the three-phase motor 701 is fixedly connected to a telescopic rod 702. The telescopic part of the telescopic rod 702 is splinedly connected to its fixed part. The specific parts are not shown in the figure. A third sleeve 703 is fixedly connected to the upper side of the support frame 1. The third sleeve 703 is sealed and slidably connected to a third piston rod 704. The upper end of the third piston rod 704 is fixedly connected to the telescopic end of the telescopic rod 702. The output shaft of the three-phase motor 701 drives the third piston rod 704 to rotate through the telescopic rod 702. A spring is provided between the third sleeve 703 and the third piston rod 704. The spring is used to drive the third piston rod 704 to return to its original position. The spring does not affect the rotation of the third piston rod 704. A cutting blade 705 is fixedly connected to the lower end of the third piston rod 704. The cutting blade 705 is used to cut the film. The rotation radius of the cutting blade 705 is equal to the radius of the wafer. The cutting blade 705 is initially located on the upper side of the support frame 1 to avoid affecting the movement of other parts. When cutting the film, the cutting blade 705 will move downward. The right side of the third sleeve 703 is connected to the fourth sleeve 706. The fourth sleeve 706 is sealed and slidably connected to the fourth piston rod 707. A sliding plate 708 is fixedly connected to the right side of the fourth piston rod 707. The sliding plate 708 cooperates with the extrusion plate 502. During the process of the extrusion plate 502 moving to the right, the extrusion plate 502 pushes the sliding plate 708, and the sliding plate 708 moves to the right, so that the interior of the third sleeve 703 and the fourth sleeve 706 becomes a negative pressure state.

[0049] Please see Figure 14 It also includes a fixing component 107, which is disposed on the holding shell 11 and used to fix the wafer. The fixing component 107 includes an air storage shell 801, which is fixed to the inside of the holding shell 11. The air storage shell 801 has a cavity inside, and the upper part of the air storage shell 801 has circumferentially distributed through holes that communicate with the cavity inside. An adsorption disk 802 is slidably connected to the middle of the air storage shell 801. The adsorption disk 802 is used to support the wafer. A third elastic element 803 is fixedly connected to the air storage shell 801. In the initial state, the adsorption plate 802 is higher than the air storage shell 801. The air storage shell 801 is fixedly connected to the air guide pipe 804, which is connected to the cavity of the air storage shell 801. A negative pressure pump 805 is installed on the side of the support frame 1 near the servo motor 3. The negative pressure pump 805 is connected to the air guide pipe 804. When the negative pressure pump 805 draws the gas in the cavity of the air storage shell 801 under negative pressure, the air storage shell 801 fixes the wafer through negative pressure adsorption.

[0050] During the process of the extrusion plate 502 moving to the right to flatten the film, the operator turns on the three-phase motor 701. The output shaft of the three-phase motor 701 rotates and drives the telescopic rod 702 to rotate. The telescopic rod 702 drives the third piston rod 704 to rotate. The third piston rod 704 drives the cutting blade 705 to rotate. When the extrusion plate 502, which is moving to the right, comes into contact with the sliding plate 708, the extrusion plate 502 continues to move to the right and pushes the sliding plate 708 to move to the right. The sliding plate 708 drives the fourth piston rod 707 to move to the right, and the pressure inside the fourth sleeve 706 decreases. Since the third sleeve 703 and the fourth sleeve 706 are in a connected state, the pressure inside the fourth sleeve 706 decreases synchronously. The third piston rod 704 moves downward and compresses the adjacent spring. The third piston rod 704 drives the cutting blade 705 to move downward. When the downward-moving cutting blade 705 comes into contact with the film, the cutting blade 705 cuts the film.

[0051] After the film is cut, when the extrusion plate 502 moves to the right to the end of the thread of the second threaded rod 501, the operator controls the servo motor 3 to rotate in the opposite direction, which drives the extrusion plate 502 to move to the left. At the same time, the extrusion plate 502 loses its pressure on the sliding plate 708. After the sliding plate 708 loses its pressure, under the action of the adjacent spring of the third piston rod 704, the third piston rod 704 moves upward. The third piston rod 704 drives the cutting blade 705 to move upward. The upward movement of the third piston rod 704 also drives the fourth piston rod 707 to move to the left. The fourth piston rod 707 drives the sliding plate 708 to move to the left. After the extrusion plate 502 is reset, the operator turns off the servo motor 3.

[0052] After the operator places the wafer on the adsorption plate 802, the spring of the adsorption plate 802 is initially compressed. Then, the operator turns on the negative pressure pump 805. The negative pressure pump 805 works and extracts the gas from the cavity of the air storage shell 801 through the air guide pipe 804. As the negative pressure pump 805 extracts the air from the air storage shell 801, the adsorption plate 802 gradually moves downward. The third elastic element 803 is compressed, and the adsorption plate 802 drives the wafer on it to move downward synchronously. When the wafer comes into contact with the air storage shell 801, the wafer blocks the annularly distributed through holes on the air storage shell 801, so that the cavity inside the air storage shell 801 is in a negative pressure state. The negative pressure adsorption force of the air storage shell 801 fixes the wafer, ensuring that the film will not be misaligned with the wafer during the flattening process.

[0053] After the thin film on the wafer surface is cut, when the holding shell 11 moves to the right and returns to its original position, the operator controls the negative pressure pump 805 to fill the air storage shell 801 with air. At the same time, the air pushes the wafer upward and makes it lose contact with the air storage shell 801, making it easier for the operator to remove the wafer. The third elastic element 803 resets. After removing the wafer, the above operation steps are repeated to perform the film application operation on subsequent wafers. After the film application work is completed, the operator shuts down all electronic components of the device.

[0054] Although embodiments of the invention have been shown and described, it will be understood by those skilled in the art that variations may be made to these embodiments without departing from the principles and spirit of the invention, the scope of which is defined by the appended claims and their equivalents.

Claims

1. A film-applying device with self-cutting function for wafer production, characterized in that, The utility model provides a support frame (1) is rotatoryly connected with the feeding roller (2), mirror image distribution's rotating shaft (4), mirror image distribution's first threaded rod (5) and rotating rod (10), mirror image distribution's servo motor (3) is installed to the support frame (1), the output shaft of adjacent servo motor (3) is driven through power assembly to the rotating shaft (4), and the rotating shaft (4) is cooperated with adjacent first threaded rod (5), and the first threaded rod (5) is threadedly connected with the sliding block (6) close to the feeding roller (2), and mirror image distribution's sliding block (6) is commonly slidably connected with the transition plate (7), and the spring is fixedly connected between mirror image distribution's sliding block (6) and the transition plate (7), and the side wall of transition plate (7) is slidably connected with mirror image distribution's first limiting frame (8), and the side wall of mirror image distribution's first limiting frame (8) is commonly slidably connected with mirror image distribution's clamping plate (9), and the rotating rod (10) is provided with inclined slide groove, and the sliding block (6) close to the rotating rod (10) is provided with limiting ball matched with the inclined slide groove of rotating rod (10), and the feeding roller (2) is installed with one-way bevel gear, and the rotating rod (10) is fixedly connected with bevel gear meshed with the one-way bevel gear on the feeding roller (2), and the support frame (1) is slidably connected with containing shell (11) through support, and the first limiting frame (8) is provided with clamping assembly (101), and the support frame (1) is provided with transmission assembly (102) and winding assembly (103); The transmission assembly (102) includes mirror image distribution's first sleeve (301), the first sleeve (301) is fixedly connected to the side of the support frame (1) close to the servo motor (3), the first sleeve (301) is slidably connected with first piston rod (302), the side of first piston rod (302) away from the feeding roller (2) is fixedly connected with adjacent first limiting frame (8), the side of support frame (1) close to the servo motor (3) is fixedly connected with mirror image distribution's second sleeve (303), the second sleeve (303) is communicated with adjacent first sleeve (301) through pipe, the second sleeve (303) is slidably connected with second piston rod (304), and the side of mirror image distribution's second piston rod (304) away from the feeding roller (2) is fixedly connected with containing shell (11). The winding assembly (103) comprises mirror image distributed guide rollers (401), one of which is rotatably connected to the support frame (1), the guide roller (401) rotatably connected to the support frame (1) is rotatably connected with mirror image distributed first fixed plates (402), the mirror image distributed first fixed plates (402) are fixedly connected with the support frame (1), the mirror image distributed first fixed plates (402) are provided with second fixed plates (403), the second fixed plates (403) are rotatably connected with the other guide rollers (401), the support frame (1) is rotatably connected with a winding roller (404), and one side of the support frame (1) close to the mirror image distributed second fixed plates (403) is provided with a fan (405).

2. The film attaching apparatus for wafer production having a self-cutting function according to claim 1, wherein The clamping assembly (101) comprises mirror image distributed limiting plates (201), the mirror image distributed limiting plates (201) are fixedly connected to one side of the transition plate (7) away from the mirror image distributed sliding blocks (6), first elastic members (202) are fixedly connected between the mirror image distributed clamping plates (9), the back sides of the mirror image distributed clamping plates (9) are provided with inclined grooves, and the limiting plates (201) are matched with the inclined grooves of the adjacent clamping plates (9).

3. The film attaching apparatus for wafer production having a self-cutting function according to claim 2, wherein The first sleeve (301) and the adjacent first piston rod (302) and the second sleeve (303) and the adjacent second piston rod (304) are filled with compressible gas, the first sleeve (301) is connected with the adjacent second sleeve (303) through a conduit to form a cavity, and the part of the cavity formed by the first sleeve (301) and the adjacent second sleeve (303) between the adjacent first piston rod (302) and the adjacent second piston rod (304) is in a negative pressure state.

4. The film attaching apparatus for wafer production having a self-cutting function according to claim 3, wherein The flattening mechanism (104) is arranged on the support frame (1), the flattening mechanism (104) is used for extruding the film, the flattening mechanism (104) comprises mirror image distributed second threaded rods (501), the second threaded rods (501) are rotatably connected to the support frame (1), the mirror image distributed second threaded rods (501) are threadedly connected with an extrusion plate (502), the lower side of the extrusion plate (502) is provided with a rectangular groove, the extrusion plate (502) is rotatably connected with an extrusion roller (503), one side of the second threaded rod (501) close to the feeding roller (2) is fixedly connected with a driven wheel (504), and the rotating shaft (4) is provided with a switching assembly (105) used for driving the adjacent driven wheel (504) to rotate.

5. The film attaching apparatus for wafer production having a self-cutting function according to claim 4, wherein The first fixed plate (402) is slidably connected with the adjacent second fixed plate (403), used for adjusting the distance between the mirror image distributed guide rollers (401), and the first fixed plate (402) and the adjacent second fixed plate (403) are fixedly connected with a spring.

6. The film attaching apparatus for wafer production having a self-cutting function according to claim 5, wherein The switching assembly (105) includes a mirror image distributed driving wheel (601), the driving wheel (601) is fixed to the middle part adjacent to the rotating shaft (4), the driving wheel (601) cooperates with the adjacent driven wheel (504), the rotating shaft (4) is rotatably connected with a second limiting frame (602), the support frame (1) is fixed with a mirror image distributed first push rod (603), the telescopic end of the first push rod (603) cooperates with the extrusion plate (502), the support frame (1) is fixed with a second push rod (604), the telescopic end of the second push rod (604) cooperates with the adjacent second limiting frame (602), the second push rod (604) communicates with the adjacent first push rod (603), and the interiors of the two are filled with compressible gas, the second limiting frame (602) is fixed with a second elastic member (605) between the support frame (1) and the support frame, the second limiting frame (602) cooperates with the containing shell (11), and the second limiting frame (602) and the support frame (1) are in sliding fit.

7. The film attaching apparatus for wafer production having a self-cutting function according to claim 6, wherein Further comprising a cutting mechanism (106), the cutting mechanism (106) is arranged on the side of the support frame (1) away from the servo motor (3), the cutting mechanism (106) is used for cutting film, the cutting mechanism (106) includes a three-phase motor (701), the three-phase motor (701) is installed on the side of the support frame (1) away from the servo motor (3), the output shaft of the three-phase motor (701) is fixedly connected with a telescopic rod (702), the side of the support frame (1) close to the three-phase motor (701) is fixedly connected with a third sleeve (703), the third sleeve (703) is slidably connected with a third piston rod (704), the third piston rod (704) is fixedly connected with the telescopic rod (702), a spring is arranged between the third sleeve (703) and the third piston rod (704), the third piston rod (704) is fixedly connected with a cutting knife (705), the third sleeve (703) communicates with a fourth sleeve (706), the fourth sleeve (706) is slidably connected with a fourth piston rod (707), the side of the fourth piston rod (707) away from the third sleeve (703) is fixedly connected with a sliding plate (708), and the sliding plate (708) cooperates with the extrusion plate (502).

8. The film attaching apparatus for wafer production having a self-cutting function according to claim 7, wherein It also includes a fixing component (107), which is disposed on the holding shell (11). The fixing component (107) is used to fix the wafer. The fixing component (107) includes an air storage shell (801), which is fixed to the holding shell (11). The air storage shell (801) has a cavity inside and through holes distributed circumferentially and communicating with its internal cavity. An adsorption plate (802) is slidably connected to the air storage shell (801), and a third elastic element (803) is fixed between the adsorption plate (802) and the air storage shell (801). An air guide pipe (804) is fixed to the air storage shell (801), and the air guide pipe (804) communicates with the cavity of the air storage shell (801). A negative pressure pump (805) is installed on the side of the support frame (1) near the servo motor (3), and the negative pressure pump (805) communicates with the air guide pipe (804).

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