A method for manufacturing a cold plate and a cooling system

Abstract

The present invention provides a method for manufacturing a cold plate and a cooling system, the method for manufacturing the cold plate comprising: step S1, obtaining a first substrate; step S2, shoveling the second surface of the first substrate to form a plurality of fins; step S3, obtaining a second substrate, the second substrate comprising a side plate and a bottom plate connected to a first end in a height direction of the side plate, the side plate corresponding to an edge of the first substrate, the bottom plate being formed with a plurality of plug holes corresponding to the plurality of fins one by one, and the side plate being formed with a liquid inlet hole and a liquid outlet hole arranged at intervals; step S4, inserting the plurality of fins of the first substrate into the plurality of plug holes one by one, and connecting the second end in a height direction of the side plate with the second surface of the first substrate, the side plate, the bottom plate and the first substrate being able to enclose and form a chamber, the chamber being used to contain a cooling liquid, and the two ends in a length direction of the fin being at a predetermined distance from the inner wall of the chamber. The method for manufacturing the cold plate of the present invention can easily form a cold plate combining liquid cooling and air cooling.

Description

Technical Field

[0001] The invention relates to the field of radiators, and in particular to a manufacturing method of a cold plate and a cooling system. Background Art

[0002] When the object to be cooled (chip, power device or power module, etc.) is working, it will generate heat. In order to prevent high temperature from affecting the performance of the object to be cooled, a cold plate is usually used to dissipate the heat of the object to be cooled.

[0003] Existing finned heat sinks are usually air-cooled heat sinks, which have relatively low heat dissipation efficiency and cannot meet the requirements of heat dissipation of objects to be cooled that have large heat fluctuations during use or the use of objects to be cooled that have high heat generation during use. Summary of the invention

[0004] In view of the above problems in the prior art, an object of the present invention is to provide a method for manufacturing a cold plate and a cooling system, which can form a cold plate combining liquid cooling and air cooling, has a stable structure, is easy to manufacture, and has a low cost.

[0005] In order to solve the above problems, the present invention provides a method for manufacturing a cold plate, the method comprising:

[0006] Step S1, obtaining a first substrate, wherein the first substrate comprises a first surface and a second surface opposite to each other, and the first surface of the first substrate is used for connecting an object to be cooled;

[0007] Step S2, performing tooth cutting on the second surface of the first substrate to form a plurality of fins;

[0008] Step S3, obtaining a second substrate, wherein the second substrate comprises a side plate and a bottom plate connected to a first end of the side plate in a height direction, wherein the side plate corresponds to an edge of the first substrate, the bottom plate is formed with a plurality of insertion holes corresponding to the plurality of fins one by one, and the side plate is formed with a liquid inlet hole and a liquid outlet hole arranged at intervals;

[0009] Step S4, inserting the plurality of fins of the first substrate into the plurality of jacks one by one, and connecting the second end of the side plate in the height direction to the second surface of the first substrate, the side plate, the bottom plate and the first substrate can enclose a chamber for containing a cooling liquid, the two ends of the fins in the length direction are at a predetermined distance from the inner wall of the chamber, and the height of the fins is greater than the height of the side plate.

[0010] Furthermore, the method for manufacturing the cold plate further comprises:

[0011] Step S5, according to the heat dissipation requirements of the object to be cooled, the liquid inlet and the liquid outlet are processed in one of the following ways:

[0012] 1) obtaining a first plug and a second plug, plugging the liquid outlet through the first plug, injecting a predetermined volume of coolant into the chamber through the liquid inlet, and plugging the liquid inlet through the second plug;

[0013] 2) Obtain a first joint and a second joint, connect the first joint to the liquid inlet hole, and connect the second joint to the liquid outlet hole, and the first joint and the second joint are used to connect to a circulating cooling mechanism of an external coolant.

[0014] Furthermore, in the step S4, the connection between the side plate and the first base plate, and the connection between the bottom plate and the fin are both connected by brazing through a brazing plate.

[0015] Furthermore, step S6 is included between step S2 and step S3, and step S6 includes:

[0016] Step S61, grooving the first surface of the first substrate to form a groove;

[0017] Step S62, obtaining a heat pipe, wherein the size of the heat pipe is adapted to the groove;

[0018] Step S63, burying the heat pipe in the groove.

[0019] Furthermore, the step S6 further includes:

[0020] Step S64, extruding the heat pipe so that the upper surface of the heat pipe is flush with the first surface of the first substrate;

[0021] Step S65, obtaining thermally conductive resin, and filling the thermally conductive resin into the gap between the heat pipe and the groove.

[0022] Another aspect of the present invention provides a cooling system, the cooling system comprising:

[0023] A cold plate, wherein the cold plate is manufactured by any of the above-mentioned cold plate manufacturing methods;

[0024] A temperature sensor, wherein the temperature sensor is used to connect to the object to be cooled to detect the temperature of the object to be cooled;

[0025] A fan faces the fins of the cold plate.

[0026] Furthermore, the cooling system further comprises:

[0027] A water pump, wherein the liquid inlet end of the water pump is connected to the liquid outlet hole of the cold plate;

[0028] A cooling device, wherein the liquid outlet of the cooling device is connected to the liquid outlet of the water pump to cool the coolant, and the liquid outlet of the cooling device is connected to the liquid inlet of the cold plate.

[0029] Furthermore, the cooling device comprises:

[0030] A metal shell, wherein the metal shell can contain a coolant, and the cooling device is connected to the liquid outlet of the water pump and the liquid inlet of the cold plate through the metal shell;

[0031] A semiconductor refrigerator is attached to the surface of the metal shell and can cool the metal shell.

[0032] Further, the metal shell and the semiconductor refrigerator each include a plurality of metal shells, the metal shells correspond to the semiconductor refrigerators one by one, the metal shells are formed into a column, and two adjacent metal shells are threadedly connected, and the cooling device further includes:

[0033] A metal filter is arranged at the connection between two adjacent metal shells.

[0034] Furthermore, the cooling device further comprises:

[0035] A controller is provided, wherein the controller is connected to the temperature sensor, the fan, the water pump and the semiconductor refrigerator, so as to start the fan according to the temperature of the coolant detected by the temperature sensor being higher than a first predetermined temperature, and to start the water pump and the semiconductor refrigerator according to the temperature of the coolant monitored by the temperature sensor being higher than a second predetermined temperature, wherein the first predetermined temperature is lower than the second predetermined temperature.

[0036] Due to the above technical solution, the present invention has the following beneficial effects:

[0037] According to the manufacturing method of the cold plate of the present invention, the first surface of the first substrate is used to connect the object to be cooled, the second surface of the first substrate is shoveled to form fins, the second substrate forms a trough body through the side plate and the bottom plate, the fins of the first substrate are inserted into the jacks of the bottom plate, the second surface of the first substrate is connected to the top of the side plate of the second substrate, and then enclosed to form a chamber that can accommodate the coolant, the liquid inlet and the liquid outlet are arranged at positions adjacent to the two ends of the fin length direction in the side plate, and the coolant can flow into the chamber from the liquid inlet and out of the chamber from the outlet. In this way, a cold plate combining liquid cooling and air cooling can be easily formed to meet the needs of heat dissipation of objects to be cooled with large heat fluctuations or the use of objects to be cooled with high / very high heat generation during use, with a stable structure, simple manufacturing, and low cost. BRIEF DESCRIPTION OF THE DRAWINGS

[0038] In order to more clearly illustrate the technical solution of the present invention, the following briefly introduces the drawings required for use in the embodiments or prior art descriptions. Obviously, the drawings described below are only some embodiments of the present invention, and for those of ordinary skill in the art, other drawings can be obtained based on these drawings without creative work.

[0039] Figure 1 is a flow chart of a method for manufacturing a cold plate according to one embodiment of the present invention;

[0040] Figure 2 is a structural diagram of a cold plate according to an embodiment of the present invention;

[0041] Figure 3 is a structural diagram of a first substrate according to an embodiment of the present invention;

[0042] Figure 4 yes Figure 2 A structural diagram of the cold plate of the embodiment with the main body of the first substrate removed;

[0043] Figure 5 is a structural diagram of a cooling system according to an embodiment of the present invention.

[0044] Reference numerals:

[0045] 100, cold plate; 110, first substrate; 111, groove; 112, fin; 120, second substrate; 121, side plate; 122, bottom plate; 123, liquid inlet; 200, fan; 310, water pump; 320, cooling device; 321, metal shell; 322, semiconductor refrigerator; 400, heat pipe. DETAILED DESCRIPTION

[0046] In order to enable those skilled in the art to better understand the scheme of the present invention, the technical scheme in the embodiments of the present invention will be clearly and completely described below in conjunction with the drawings in the embodiments of the present invention. Obviously, the described embodiments are only part of the embodiments of the present invention, not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the present invention.

[0047] It should be noted that the terms "first", "second", etc. in the specification and claims of the present invention and the above-mentioned drawings are used to distinguish similar objects, and are not necessarily used to describe a specific order or sequence. It should be understood that the data used in this way can be interchanged where appropriate, so that the embodiments of the present invention described herein can be implemented in an order other than those illustrated or described herein. In addition, the terms "including" and "having" and any variations thereof are intended to cover non-exclusive inclusions.

[0048] Next, a method for manufacturing the cold plate 100 according to an embodiment of the present invention is described.

[0049] like Figures 1 to 3 As shown, the manufacturing method of the cold plate 100 of the embodiment of the present invention includes:

[0050] Step S1 , obtaining a first substrate 110 , wherein the first substrate 110 comprises a first surface and a second surface opposite to each other, and the first surface of the first substrate 110 is used for connecting an object to be cooled.

[0051] like Figure 3 As shown, the upper surface of the first substrate 110 is a first surface, which is used to connect to the object to be cooled to dissipate heat from the object to be cooled.

[0052] In step S2 , the second surface of the first substrate 110 is reamed to form a plurality of fins 112 .

[0053] The second surface of the first substrate 110 is raked to form Figure 3 The structure shown, that is, the first substrate includes a main body and fins 112. The fins 112 are formed by a shovel-tooth method, which is simple in process and high in efficiency.

[0054] Step S3, take the second substrate 120, the second substrate 120 includes a side plate 121 and a bottom plate 122 connected to the first end of the side plate 121 in the height direction, the side plate 121 corresponds to the edge of the first substrate 110, the bottom plate 122 is formed with a plurality of jacks corresponding to the plurality of fins 112, and the side plate 121 is formed with a liquid inlet hole 123 and a liquid outlet hole (not shown) arranged at intervals.

[0055] like Figure 1 and Figure 4 As shown, the second substrate 120 includes a side plate 121 and a bottom plate 122. The side plate 121 is arranged around the edge of the second surface of the first substrate 110, and the bottom plate 122 is connected to the bottom end (the first end in the height direction) of the side plate 121 to form a trough body with an opening at the top, and a socket corresponding to and penetrating the fins 112 is formed on the bottom plate 122.

[0056] Step S4, insert the multiple fins 112 of the first substrate 110 into the multiple sockets one by one, and connect the second end of the side plate 121 in the height direction to the second surface of the first substrate 110, the side plate 121, the bottom plate 122 and the first substrate 110 can enclose a chamber, the chamber is used to contain the cooling liquid, the two ends of the fins 112 in the length direction are at a predetermined distance from the inner wall of the chamber, and the height of the fins 112 is greater than the height of the side plate 121 (enabling the fins 112 to pass through the second substrate 120).

[0057] like Figure 1 and Figure 4 As shown, the fin 112 of the first substrate 110 is inserted into the insertion hole of the bottom plate 122 of the second substrate 120 , and the top end (the second end in the height direction) of the side plate 121 of the second substrate 120 is connected to the second surface of the first substrate 110 .

[0058] The bottom plate 122 of the second substrate 120, the side plate 121 and the second surface of the first substrate 110 enclose a chamber capable of accommodating cooling liquid, and the liquid inlet 123 and the liquid outlet are arranged in the side plate 121 at positions adjacent to the two ends of the fin 112 in the length direction.

[0059] The coolant can flow into the chamber from the liquid inlet hole 123, then flow into the gap between the chamber inner wall and the first end of the length direction of the fin 112, then pass through the gaps between a plurality of adjacent fins 112, then flow into the gap between the chamber inner wall and the second end of the length direction of the fin 112, and finally flow into the liquid outlet hole to flow out of the chamber. The fins 112 in the chamber can increase the contact area between the coolant and the cold plate 100, thereby increasing the heat exchange efficiency.

[0060] In the above manufacturing method of the cold plate 100, the first surface of the first substrate 110 is used to connect the object to be cooled, the second surface of the first substrate 110 is shoveled to form fins 112, the second substrate 120 forms a groove body through the side plate 121 and the bottom plate 122, the fins 112 of the first substrate 110 are inserted into the jack of the bottom plate 122, the second surface of the first substrate 110 is connected to the top of the side plate 121 of the second substrate 120, and then enclosed to form a chamber that can accommodate the coolant, the liquid inlet 123 and the liquid outlet are arranged in the side plate 121 at positions adjacent to the two ends of the fin 112 in the length direction, and the coolant can flow into the chamber from the liquid inlet 123 and flow out of the chamber from the outlet. In this way, a cold plate 100 combining liquid cooling and air cooling can be formed, which can meet the heat dissipation of the object to be cooled with large heat fluctuations or the use of the object to be cooled with high / very high heat generation during use, and has a stable structure, simple manufacturing, and low cost.

[0061] In some embodiments of the present invention, the method for manufacturing the cold plate 100 further includes step S5.

[0062] Step S5, according to the heat dissipation requirements of the object to be cooled, perform one of the following processing on the liquid inlet hole 123 and the liquid outlet hole: 1) Obtain a first plug and a second plug, block the liquid outlet hole through the first plug, inject a predetermined volume of coolant into the chamber through the liquid inlet hole 123, and block the liquid inlet hole 123 through the second plug. 2) Obtain a first joint and a second joint, connect the first joint to the liquid inlet hole 123, and connect the second joint to the liquid outlet hole. The first joint and the second joint are used to connect to the external coolant circulation mechanism.

[0063] That is, the cold plate 100 has two optional structures to achieve diversified heat dissipation.

[0064] Structure 1: Obtain a first plug and a second plug, plug the liquid outlet through the first plug, inject a predetermined volume of coolant into the chamber through the liquid inlet 123, and plug the liquid inlet 123 through the second plug.

[0065] The cold plate 100 dissipates heat through air cooling and the coolant retained in the chamber, which can meet the heat dissipation needs of objects to be cooled with high heat dissipation requirements, or meet the heat dissipation needs of objects to be cooled with large heat dissipation fluctuations, or meet the heat dissipation needs of objects to be cooled with high heat dissipation requirements but low usage frequency.

[0066] Structure 2: Obtain a first joint and a second joint, connect the first joint to the liquid inlet 123, and connect the second joint to the liquid outlet. The first joint and the second joint are used to connect to a circulating cooling mechanism of an external coolant.

[0067] The cold plate 100 dissipates heat through air cooling and the coolant flowing in the chamber (the circulating cooling mechanism cools and circulates the coolant, which may be the cooling device 320 described below), and can meet the heat dissipation requirements of the object to be cooled with a high heat dissipation requirement.

[0068] In some embodiments of the present invention, in step S4, the connection between the side plate 121 and the first substrate 110, and the connection between the bottom plate 122 and the fins 112 are both brazed by means of a brazing plate.

[0069] Liquid leakage in the chamber can be avoided by soldering the connection between the first substrate 110 and the second substrate 120 (ie, the connection between the side plate 121 and the first substrate 110 , and the connection between the bottom plate 122 and the fins 112 ) with a solder plate.

[0070] It should be noted that the above are only optional examples, and laser welding may also be performed on the connection between the first substrate 110 and the second substrate 120 by laser, which should be understood to be within the scope of the present invention.

[0071] In some embodiments of the present invention, step S6 is further included between step S2 and step S3, and step S6 includes: step S61, grooving the first surface of the first substrate 110 to form a groove 111; step S62, obtaining a heat pipe 400, the size of which is adapted to the groove 111; step S63, burying the heat pipe 400 in the groove 111. The heat pipe 400 is a known technology and will not be described in detail here.

[0072] The heat pipe 400 is embedded in the groove 111 of the first substrate 110, which can increase the contact area between the heat pipe 400 and the first substrate 110. The heat pipe 400 has a high thermal conductivity, and can more quickly exchange heat from the object to be cooled with the area of ​​the cold plate 100 that is not in contact with the object to be cooled, further improving the heat dissipation efficiency.

[0073] Furthermore, step S6 also includes: step S64, extruding the heat pipe 400 so that the upper surface of the heat pipe 400 is flush with the first surface of the first substrate 110; step S65, obtaining thermal conductive resin, and filling the thermal conductive resin into the gap between the heat pipe 400 and the groove 111.

[0074] The heat pipe 400 is forced to be flush with the first surface of the first substrate 110, which can increase the contact area between the heat pipe 400 and the object to be cooled, increase the heat exchange efficiency, and increase the contact between the heat pipe 400 and the first substrate 110, reducing thermal resistance. The thermal conductive resin can further reduce the thermal resistance between the heat pipe 400 and the first substrate 110, thereby improving the heat exchange efficiency of the cold plate 100.

[0075] The cooling system according to the embodiment of the present invention is described below. The cooling system includes a cold plate 100 , a temperature sensor and a fan 200 .

[0076] The cold plate 100 is manufactured by the manufacturing method of the cold plate 100 described above. The temperature sensor is used to connect to the object to be cooled to detect the temperature of the object to be cooled. The fan 200 faces the fins 112 of the cold plate 100 .

[0077] like Figure 5 As shown, the fan 200 is disposed on the side of the cold plate 100, facing the fins 112, so as to form forced convection heat exchange and improve heat exchange efficiency. The temperature sensor detects the temperature of the object to be cooled, and can timely and accurately obtain the temperature of the object to be cooled so as to make corresponding adjustments.

[0078] In some embodiments of the present invention, the cooling system further includes a water pump 310 and a cooling device 320. The liquid inlet of the water pump 310 is connected to the liquid outlet of the cold plate 100. The liquid outlet of the cooling device 320 is connected to the liquid outlet of the water pump 310 to cool the coolant, and the liquid outlet of the cooling device 320 is connected to the liquid inlet 123 of the cold plate 100.

[0079] The water pump 310 can extract the coolant in the cold plate 100 and transport the coolant to the cooling device 320. The cooling device 320 cools the coolant and then transports the cooled coolant back to the cold plate 100. Thus, the coolant in the chamber of the cold plate 100 can be kept at a low temperature.

[0080] Furthermore, the cooling device 320 includes a metal shell 321 and a semiconductor refrigerator 322. The metal shell 321 can contain cooling liquid, and the cooling device 320 connects the liquid outlet of the water pump 310 and the liquid inlet hole 123 of the cold plate 100 through the metal shell 321. The semiconductor refrigerator 322 is attached to the surface of the metal shell 321, and the semiconductor refrigerator 322 can cool the metal shell 321.

[0081] The semiconductor refrigerator 322 cools the metal shell 321 , and the metal shell 321 exchanges heat with the cooling liquid, thereby reducing the temperature of the cooling liquid in the metal shell 321 .

[0082] Furthermore, the metal shell 321 and the semiconductor refrigerator 322 each include a plurality of metal shells 321 and semiconductor refrigerators 322, and the metal shells 321 correspond to each other one by one. The metal shells 321 are formed into a column, and two adjacent metal shells 321 are threadedly connected. The cooling device 320 also includes a metal filter, which is arranged at the connection between two adjacent metal shells 321.

[0083] like Figure 5 As shown, a semiconductor refrigerator 322 is arranged on a metal shell 321. According to the heat dissipation requirements of the object to be cooled, a suitable number of metal shells 321 can be selected. The more metal shells 321 there are, the stronger the cooling capacity is. After the number of metal shells 321 is selected, the metal shells 321 are combined (two adjacent metal shells 321 are threadedly connected). The liquid inlet and the liquid outlet of the cooling device 320 are respectively arranged at the first and the last of the multiple metal shells 321.

[0084] A metal filter is provided between adjacent metal shells 321, which can reduce pollutants (impurities, particles, etc.) in the coolant, increase the cleanliness of the coolant, and increase the contact area between the coolant and the cooling device 320, thereby improving the heat exchange efficiency.

[0085] Optionally, in the case of including multiple metal filters, the mesh size of the metal filter closer to the liquid outlet of the cooling device 320 is smaller and denser, thereby achieving a progression from coarse filtration to fine filtration, further improving the cleanliness of the cooling and avoiding clogging of the metal filter.

[0086] In some embodiments of the present invention, the cooling device 320 also includes a controller, which is connected to the temperature sensor, the fan 200, the water pump 310 and the semiconductor refrigerator 322, so as to start the fan 200 based on the temperature of the coolant detected by the temperature sensor being higher than the first predetermined temperature, and to start the water pump 310 and the semiconductor refrigerator 322 based on the temperature of the coolant monitored by the temperature sensor being higher than the second predetermined temperature, and the first predetermined temperature is lower than the second predetermined temperature.

[0087] That is, according to the temperature of the object to be cooled monitored by the temperature sensor, the controller controls and adjusts the fan 200, the water pump 310 and the semiconductor refrigerator 320 as follows:

[0088] 1) The temperature of the object to be cooled is lower than a first predetermined temperature.

[0089] In this case, the object to be cooled is cooled by natural convection of air cooling and the coolant retained in the multifunctional cold plate 100 .

[0090] 2) The temperature of the object to be cooled is higher than the first predetermined temperature and lower than the second predetermined temperature.

[0091] In this case, the controller controls the fan 200 to start. The object to be cooled is cooled by forced convection of air cooling and the coolant retained in the multifunctional cold plate 100 .

[0092] 3) The temperature of the object to be cooled is higher than the second predetermined temperature.

[0093] In this case, the controller controls the water pump 310 and the cooling device 320 to start up based on the start-up of the fan 200. The cooling object is cooled by forced convection of air cooling and the coolant flowing and refrigerated by the cooling device 320.

[0094] The above cooling system can be adjusted in time according to the temperature of the object to be cooled, can reduce energy consumption, and has high heat dissipation efficiency for the object to be cooled.

[0095] The above are only preferred embodiments of the present invention and are not intended to limit the present invention. Any modifications, equivalent substitutions, improvements, etc. made within the spirit and principles of the present invention should be included in the protection scope of the present invention.

Claims

1. A method for manufacturing a cold plate, characterized in that: The method for manufacturing the cold plate comprises: Step S1, obtaining a first substrate, wherein the first substrate comprises a first surface and a second surface opposite to each other, and the first surface of the first substrate is used for connecting an object to be cooled; Step S2, performing tooth cutting on the second surface of the first substrate to form a plurality of fins; Step S3, obtaining a second substrate, wherein the second substrate comprises a side plate and a bottom plate connected to a first end of the side plate in a height direction, wherein the side plate corresponds to an edge of the first substrate, the bottom plate is formed with a plurality of insertion holes corresponding to the plurality of fins one by one, and the side plate is formed with a liquid inlet hole and a liquid outlet hole arranged at intervals; Step S4, inserting the multiple fins of the first substrate into the multiple sockets one by one, and connecting the second end of the side panel in the height direction to the second surface of the first substrate, welding the connection between the side panel and the first substrate, and the connection between the bottom plate and the fins, the side panel, the bottom plate and the first substrate can enclose a chamber for containing cooling liquid, the two ends of the fin in the length direction are at a predetermined distance from the inner wall of the chamber, and the height of the fin is greater than the height of the side panel.

2. The method for manufacturing a cold plate according to claim 1, characterized in that: The method for manufacturing the cold plate further comprises: Step S5, according to the heat dissipation requirements of the object to be cooled, the liquid inlet and the liquid outlet are processed in one of the following ways: 1) Obtain a first plug and a second plug, plug the liquid outlet through the first plug, inject a predetermined volume of coolant into the chamber through the liquid inlet, and plug the liquid inlet through the second plug; 2) Obtain a first joint and a second joint, connect the first joint to the liquid inlet hole, and connect the second joint to the liquid outlet hole. The first joint and the second joint are used to connect to a circulating cooling mechanism of an external coolant.

3. The method for manufacturing a cold plate according to claim 1, characterized in that: In the step S4, the connection between the side plate and the first base plate, and the connection between the bottom plate and the fins are both connected by brazing through a brazing plate.

4. The method for manufacturing a cold plate according to claim 1, characterized in that: Step S6 is also included between step S2 and step S3, and step S6 includes: Step S61, grooving the first surface of the first substrate to form a groove; Step S62, obtaining a heat pipe, wherein the size of the heat pipe is adapted to the groove; Step S63, burying the heat pipe in the groove.

5. The method for manufacturing a cold plate according to claim 4, characterized in that: The step S6 further comprises: Step S64, extruding the heat pipe so that the upper surface of the heat pipe is flush with the first surface of the first substrate; Step S65, obtaining thermally conductive resin, and filling the thermally conductive resin into the gap between the heat pipe and the groove.

6. A cooling system, characterized in that: The cooling system comprises: A cold plate, wherein the cold plate is manufactured by the cold plate manufacturing method according to any one of claims 1 to 5; A temperature sensor, wherein the temperature sensor is used to connect to the object to be cooled to detect the temperature of the object to be cooled; A fan faces the fins of the cold plate.

7. The cooling system according to claim 6, characterized in that: The cooling system further comprises: A water pump, wherein the liquid inlet end of the water pump is connected to the liquid outlet hole of the cold plate; A cooling device, wherein the liquid outlet of the cooling device is connected to the liquid outlet of the water pump to cool the coolant, and the liquid outlet of the cooling device is connected to the liquid inlet of the cold plate.

8. The cooling system according to claim 7, characterized in that: The cooling device comprises: A metal shell, wherein the metal shell can contain a coolant, and the cooling device is connected to the liquid outlet of the water pump and the liquid inlet of the cold plate through the metal shell; A semiconductor refrigerator is attached to the surface of the metal shell and can cool the metal shell.

9. The cooling system according to claim 8, characterized in that: The metal shell and the semiconductor refrigerator each include a plurality of metal shells, the metal shells correspond to the semiconductor refrigerators one by one, the metal shells are formed into a column, and two adjacent metal shells are threadedly connected. The cooling device also includes: A metal filter is arranged at the connection between two adjacent metal shells.

10. The cooling system according to claim 8, characterized in that The cooling device also includes: A controller is provided, wherein the controller is connected to the temperature sensor, the fan, the water pump and the semiconductor refrigerator, so as to start the fan according to the temperature of the coolant detected by the temperature sensor being higher than a first predetermined temperature, and to start the water pump and the semiconductor refrigerator according to the temperature of the coolant monitored by the temperature sensor being higher than a second predetermined temperature, wherein the first predetermined temperature is lower than the second predetermined temperature.

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