Quantum chip cleaning method and cleaning container

Abstract

The present invention proposes a quantum chip cleaning method and cleaning container. The quantum chip cleaning method includes the following steps: obtaining a UV film and a wafer coated with protective glue; attaching the UV film to the side of the wafer not coated with protective glue, and cutting the wafer along a preset cutting path without scratching the UV film; cutting and grouping the multiple quantum chips obtained after cutting, and folding two adjacent quantum chips in half along the cutting path between them in the direction of the UV film; placing the two folded quantum chips in a cleaning container, and immersing the cleaning container in a degumming solution; after the UV film falls off, removing the detached UV film, and sequentially cleaning and drying the quantum chips. The quantum chip cleaning method of the present invention avoids excessive contact between tools and the chip during manual operation, effectively protecting the quantum chip.

Description

Technical Field

[0001] The present invention relates to the field of chip processing technology, and in particular to a quantum chip cleaning method and a cleaning container. Background Art

[0002] Quantum chips typically operate using analog circuits. As the number of qubits increases, the chip structure of quantum processors becomes increasingly complex, the size of quantum chips increases, and the manufacturing cost becomes increasingly expensive. When chip sizes reach tens of millimeters, not only does chip packaging become significantly difficult, but also separation and cleaning of quantum chips becomes extremely challenging. As chip size increases, the number of circuits on the chip also increases, spreading across the chip surface. During separation, cleaning, or packaging, scratches on the surface can easily occur, resulting in performance degradation.

[0003] On the other hand, existing chip cleaning methods almost all use automatic or semi-automatic equipment. However, in the field of quantum chip cleaning, these equipment are not suitable for chip cleaning. Therefore, quantum chips are mostly separated and cleaned manually. After the quantum chip is cut into core particles, there is no effective tool to clamp it. It is easy to fall during the rinsing and drying process, which causes damage to the quantum chip circuit, further leading to a decline in quantum chip performance, and even scrapping.

[0004] In addition, in the process of cutting the wafer into quantum chips, a layer of protective glue needs to be applied to the surface of the wafer to protect the surface of the quantum chip and prevent impurities such as dust and cooling water from adhering to the surface of the quantum chip during the cutting process. However, in the process of cleaning the entire quantum chip to remove the protective glue and UV film, the quantum chip is mostly picked up manually with tweezers for cleaning. In this process, due to excessive manual contact with the quantum chip, it is easy to cause the chip surface to be scratched, resulting in a decrease in the performance of the quantum chip and an increase in manufacturing costs. Summary of the Invention

[0005] In response to the problem in the prior art that chip cleaning easily causes scratches on the chip surface, the present invention provides a quantum chip cleaning method and a cleaning container.

[0006] In one aspect, the present invention provides a method for cleaning a quantum chip, comprising the following steps:

[0007] Obtain UV film and wafer coated with protective glue;

[0008] The UV film is attached to the side of the wafer not coated with the protective adhesive, and the wafer is cut along a preset cutting track without scratching the UV film;

[0009] Cutting the plurality of quantum chips obtained after cutting into groups, and folding two adjacent quantum chips along the cutting track between them in the direction of the UV film;

[0010] Place the two folded quantum chips into a cleaning container, and immerse the cleaning container in a degumming solution;

[0011] After the UV film falls off, the UV film is taken out and the quantum chip is cleaned and dried in sequence.

[0012] Optionally, the size of the cleaning container matches the length and width of the quantum chip, and the quantum chip is swingably arranged in the cleaning container along the plane where the quantum chip is located.

[0013] Optionally, before “cutting and grouping the plurality of quantum chips obtained after cutting”, the UV film of the wafer is irradiated for 10 min to 60 min.

[0014] Optionally, the process of “sticking the UV film to the side of the wafer not coated with the protective glue” further includes: placing the wafer in a fixing frame, and connecting the edge of the UV film to the fixing frame.

[0015] Optionally, in “cutting and grouping the plurality of quantum chips obtained after cutting”, if there are a plurality of independent quantum chips, the plurality of independent quantum chips are placed in the cleaning container in groups of two.

[0016] On the other hand, the present invention provides a quantum chip cleaning container, which is suitable for any of the quantum chip cleaning methods described above. The quantum chip cleaning container includes a box body, a cover body and at least one partition. An opening is provided at one end of the box body, and the cover body is provided at the opening. A cavity is formed between the cover body and the box body, and the cover body and / or the box body are provided with multiple through holes connecting the cavity with the outside; the partition body is provided in the cavity to divide the cavity into at least two accommodating cavities for accommodating chips, and the chip can be swingably provided in the accommodating cavity.

[0017] Optionally, an external thread is provided at the opening of the box body, an internal thread is provided on the cover body, and the box body is threadably connected to the cover body.

[0018] Optionally, a plurality of through holes are provided on the bottom of the box body, the side walls of the box body and / or the top of the cover body;

[0019] The through hole at the bottom of the box body is arranged opposite to the through hole at the top of the cover body.

[0020] Optionally, a plurality of through holes are formed on the partition, the through holes on the partition communicate with two adjacent accommodating cavities, and the through holes on the partition are arranged opposite to the through holes on the side wall of the box body and have the same size;

[0021] The through hole is a square hole and / or a circular hole.

[0022] Optionally, two first hand-held parts are provided on a side of the box body facing away from the cavity, and the two first hand-held parts are arranged on two sides of the box body opposite to each other and respectively located on two sides of the partition;

[0023] Two second hand-held parts are provided on one side of the cover body away from the cavity, and the two second hand-held parts are arranged on two sides of the cover body opposite to each other.

[0024] In the present invention, two adjacent quantum chips are folded in half along the cut path between them toward the UV film. The UV film is a flexible material that can be folded and stretched. The folded chips are then slid along a partition into a cleaning container. The UV film between the two quantum chips overlaps the partition, preventing the quantum chips from tipping over during the cleaning process. This prevents performance loss caused by contact between the quantum chip surfaces and the bottom of the cleaning tool or contact between the quantum chips. By removing the UV film in the cleaning container, not only is direct contact with the quantum chips reduced, minimizing damage to the quantum chips and further improving the yield of the quantum chips, but also by using a cleaning tool to process two quantum chips simultaneously, further improving the efficiency of quantum chip cleaning.

[0025] By providing partitions to divide the chamber into multiple cavities, the cleaning efficiency of the quantum chip is improved. The cleaned chips are also separated to prevent collision and friction between the chips during the cleaning process. The cover allows the chip to be placed in a slanting position within the cavity. This ensures that no matter how the box is shaken during cleaning, the side of the chip with the circuitry will never touch the inner wall of the box, preventing damage to the chip. BRIEF DESCRIPTION OF THE DRAWINGS

[0026] Figure 1 is a schematic diagram of a wafer after dicing provided by an embodiment of the present invention;

[0027] Figure 2 This is a schematic diagram of the structure of two folded quantum chips placed in a cleaning container according to an embodiment of the present invention;

[0028] Figure 3 This is a schematic structural diagram of a quantum chip cleaning container provided by one embodiment of the present invention;

[0029] Figure 4 This is a schematic structural diagram of a box body of a quantum chip cleaning container provided by one embodiment of the present invention;

[0030] Figure 5 The figure is a schematic structural diagram of a cover of a quantum chip cleaning container provided in one embodiment of the present invention.

[0031] The reference numerals in the drawings of the specification are as follows:

[0032] 1. Box body; 11. Through hole; 12. External thread; 13. First handle;

[0033] 2. Cover; 21. Internal thread; 22. Second hand-held portion;

[0034] 3. Partition; 4. Fixing frame; 5. UV film; 6. Wafer; 7. Cutting track. DETAILED DESCRIPTION

[0035] In order to make the purpose, technical solutions and advantages of the present invention more clearly understood, the present invention will be further described in detail below with reference to the accompanying drawings and embodiments. It should be understood that the specific embodiments described herein are only used to explain the present invention and are not intended to limit the present invention.

[0036] In order to illustrate the technical solution of the present invention, specific embodiments are provided below.

[0037] like Figure 1 and Figure 2 As shown, a quantum chip cleaning method according to an embodiment of the present invention includes the following steps:

[0038] Obtain a UV film 5 and a wafer 6 coated with a protective glue; specifically, the wafer 6 coated with the protective glue is dried and cured, and the circuit on the surface of the wafer 6 is protected by applying the protective glue to avoid damage to the circuit of the wafer 6 during the subsequent cutting process.

[0039] The UV film 5 is pasted on the side of the wafer 6 that is not coated with the protective glue, and the wafer 6 is cut along a preset cutting track without scratching the UV film 5 , and the wafer 6 is fixed by the UV film 5 .

[0040] The plurality of quantum chips obtained after cutting are cut into groups, and two adjacent quantum chips are folded in half along the cutting track 7 between them toward the direction of the UV film 5;

[0041] Place the two folded quantum chips into a cleaning container, and immerse the cleaning container in a degumming solution;

[0042] After the UV film 5 falls off, the UV film 5 is removed and the quantum chips are cleaned and dried in sequence. Specifically, an air gun or other drying tool is used to remove liquid and dry the two quantum chips through the through-holes of the cleaning container.

[0043] Specifically, the protective glue is preferably S18 series photoresist, and the coating thickness of the protective glue is between 1 μm and 2 μm.

[0044] In this embodiment, two adjacent quantum chips are folded in half along the cutting track 7 between them toward the UV film 5. The UV film 5 is a flexible material that can be folded and stretched. The folded chips are then slid along the partition into the cleaning container. The UV film 5 between the two quantum chips overlaps the partition, preventing the quantum chips from tipping over during the cleaning process. This prevents performance loss caused by the surface of the quantum chips contacting the bottom of the cleaning tool or contact between the quantum chips. By removing the UV film 5 in the cleaning container, not only is direct contact with the quantum chips reduced, reducing damage to the quantum chips, but also further improving the yield of the quantum chips. Moreover, by using a cleaning tool to process two quantum chips simultaneously, the efficiency of quantum chip cleaning is further improved.

[0045] In some embodiments of the present invention, the size of the cleaning container matches the length and width of the quantum chip, and the quantum chip is swingably disposed in the cleaning container.

[0046] In some embodiments of the present invention, prior to "cutting and grouping the plurality of quantum chips obtained after dicing," the UV film 5 of the wafer 6 is irradiated for a period of 10 to 60 minutes. Specifically, UV light or white light is used to reduce the viscosity of the UV film 5, thereby facilitating the removal of the quantum chips from the UV film 5.

[0047] In some embodiments of the present invention, “pasting the UV film 5 on the side of the wafer 6 not coated with protective glue” further includes: placing the wafer 6 in the fixing frame 4, and connecting the edge of the UV film 5 to the fixing frame 4. Specifically, the wafer 6 is placed in the middle of the dust-free cloth, and then the fixing frame 4 is placed flat on the dust-free cloth and aligned with the center of the wafer 6 as much as possible, and then a piece of UV film 5 with a length and width greater than the diameter of the fixing frame 4 is cut from the rolled UV film 5, and the transparent protective layer on the surface of the UV film 5 is torn off, and then one end of the UV film 5 is glued to one end of the fixing frame 4, and the other end of the UV film 5 is tightened and straightened and then covered on the other end of the fixing frame 4, and the part of the center of the UV film 5 where the wafer 6 is glued is gently pressed to remove air. At this time, the UV film 5 and the wafer 6 are glued to the fixing frame 4.

[0048] The fixing frame 4 is used for manual separation after the wafer 6 is cut and before the wafer 6 is cleaned. It is only necessary to manually tear off the UV film 5 along the inner diameter of the fixing frame 4.

[0049] In some embodiments of the present invention, in “cutting and grouping the plurality of quantum chips obtained after cutting”, if there are a plurality of independent quantum chips, the plurality of independent quantum chips are placed in the cleaning container in groups of two.

[0050] like Figure 2-Figure 5 As shown, a quantum chip cleaning container according to an embodiment of the present invention includes a box body 1, a cover body 2, and at least one partition 3. The box body 1 is provided with an opening at one end, and the cover body 2 is provided at the opening. A cavity is formed between the cover body 2 and the box body 1. The cover body 2 and / or the box body 1 are provided with a plurality of through holes 11 connecting the cavity with the outside. The partition 3 is provided in the cavity to separate the cavity into at least two accommodating cavities for accommodating chips, and the chips can be arranged in the accommodating cavities in a deflectable manner. Specifically, the partition 3 is welded to the box body 1.

[0051] In this embodiment of the present invention, the cavity is divided into multiple accommodating chambers by providing a partition 3, thereby improving the cleaning efficiency of the quantum chip. The cleaned chips are also separated to prevent collision and friction between the multiple chips during the cleaning process. The cover 2 allows the chip to be placed in a slanting position within the accommodating chamber. This ensures that no matter how the box body 1 is shaken during the cleaning process, the side of the chip with the circuitry will never touch the inner wall of the box body 1, thus preventing damage to the chip.

[0052] Specifically, the internal dimensions of the accommodating cavity match the length and width of the chip. The chip can be placed vertically in the accommodating cavity along the partition 3, but the chip cannot be parallel to the bottom of the accommodating cavity. This ensures that the chip can only swing and cannot tip over during the cleaning process, thereby avoiding performance loss due to the chip surface contacting the bottom of the box body 1.

[0053] The chip cleaning process is as follows: When the chip is cut and separated, the chip adheres to the UV film 5. After simple processing, the two chips are folded toward the side with the UV film 5. The two folded chips are inserted into the box body 1 along the internal partition 3. The partition 3 separates the two chips. At this time, the box body 1 is placed in Remover PG (debonding agent). After the chip falls off the UV film 5 and into the box body 1, it is sealed with the cover 2. When the box body 1 and the cover 2 are immersed in the liquid, the liquid can smoothly enter the accommodating cavity from the side wall and the top and contact the chip surface.

[0054] like Figure 4 and Figure 5 As shown, in some embodiments of the present invention, the opening of the box body 1 is provided with an external thread 13, and the cover body 2 is provided with an internal thread 21. The box body 1 and the cover body 2 are threadedly connected to each other so as to firmly fix the chip inside the box body 1.

[0055] like Figure 3-Figure 5 As shown, in some embodiments of the present invention, a plurality of through holes 11 are provided on the bottom of the box body 1 , the side walls of the box body 1 and / or the top of the cover body 2 .

[0056] The through hole 11 at the bottom of the box body 1 is arranged opposite to the through hole 11 at the top of the cover body 2 , which facilitates the liquid to flow from the top of the cover body 2 into the box body 1 and improves the fluidity of the liquid in the box body 1 .

[0057] In some embodiments of the present invention, the separator 3 is provided with a plurality of through holes 11. The through holes 11 on the separator 3 connect two adjacent accommodating chambers. The through holes 11 on the separator 3 are arranged opposite to the through holes 11 on the sidewall of the box body 1 and are of the same size. The through holes 11 provided on the separator 3 can improve the fluidity of the liquid within the box body, particularly the fluidity of the liquid on the back side of the quantum chip, thereby enhancing the cleaning effect on the back side of the quantum chip.

[0058] The through hole 11 is a square hole and / or a circular hole.

[0059] It should be noted that the through-holes are not limited to square or circular holes and can also be other regular or irregular shapes. The square or circular holes are provided here for ease of processing. Furthermore, the sizes of the square and circular holes can be different. In other words, the box body, lid, and partition can all have square or circular holes, or both.

[0060] like Figure 3 As shown, in some embodiments of the present invention, two first handles 13 are provided on the side of the box body 1 facing away from the cavity, and the two first handles 13 are arranged on opposite sides of the box body 1 to facilitate the transfer of the box body 1. Specifically, the first handles 13 are provided below the external thread 12.

[0061] like Figure 3 As shown, in some embodiments of the present invention, two second hand-held parts 22 are provided on the side of the cover body 2 facing away from the cavity, and the two second hand-held parts 22 are relatively arranged on both sides of the cover body 2 and are respectively located on both sides of the partition 3, so as to facilitate the cover body 2 to be covered on the box body 1.

[0062] In a specific embodiment, taking the separation of a 3-inch (76 mm) wafer 6 into two 50*25 mm quantum chips as an example, the cleaning container has a diameter of 61 mm, a height of 30 mm, and a wall thickness of 3 mm.

[0063] The cleaning container is 30 mm tall, and the distance between the two first handles 13 is 70 mm. The box body 1 has a diameter of 61 mm, an inner diameter of 55 mm, and a wall thickness of 3 mm. The partition 3 is 3 mm thick, and the opening is designed with a 5 mm high imperial thread. The partition 3 and the wall of the box body 1 are designed with three 10 x 10 mm square through-holes, each with a 5 x 10 mm rectangular through-hole on either side. These through-holes are 13 mm apart and arranged symmetrically along the axis of the box body 1. The bottom of the box body 1 is designed with 21 10 x 10 mm square through-holes, with a distance of 13 mm between them. The lid 2 has a diameter of 63 mm, an inner diameter of 59 mm, a maximum width of 70 mm, a height of 7 mm, a wall thickness of 3 mm, and a top thickness of 2 mm. The lid 2 is provided with a 5 mm high imperial thread. The lid 2 is provided with a second handle 22, 2 mm wide, on both sides. The specific separation and cleaning process is as follows: first, apply a layer of protective glue on the surface of the wafer 6. After drying and curing, use UV film 5 to fix the back of the wafer 6. Then use a cutting device to cut the wafer 6 into two 50*25 mm quantum chips. After separation, use ultraviolet light to irradiate the UV film for 10min-60min to reduce the viscosity of the UV film 5. The UV film 5 is simply cut, and the quantum chip is folded back to back. Then, it is inserted into the cleaning container along the partition 3. The cleaning container with the quantum chip is immersed in Remover PG. After the quantum chip falls off the UV film 5, use tweezers to remove the UV film 5 from the partition 3. At this time, the quantum chip is separated to both sides of the cleaning container and then sealed with the cover 2. At this time, due to the height limitation of the cleaning container, the quantum chip is fixed in the cleaning container. Then, the quantum chip is further cleaned to remove residual glue or other impurities on its surface. Finally, a nitrogen gun is used to blow dry the cleaning container. Since there are through holes on the cleaning container, the quantum chip will also be blown dry during the drying process of the cleaning container.

[0064] The above embodiments are intended only to illustrate the technical solutions of the present invention and are not intended to limit them. Although the present invention has been described in detail with reference to the aforementioned embodiments, those skilled in the art should understand that they may still modify the technical solutions described in the aforementioned embodiments or replace some of the technical features therein with equivalents. However, such modifications or replacements do not deviate from the spirit and scope of the technical solutions of the various embodiments of the present invention and are intended to be included within the scope of protection of the present invention.

Claims

1. A quantum chip cleaning method, characterized in that: The following steps are involved: Obtain UV film and wafer coated with protective glue; The UV film is attached to the side of the wafer not coated with the protective adhesive, and the wafer is cut along a preset cutting track without scratching the UV film; Cutting the plurality of quantum chips obtained after cutting into groups, and folding two adjacent quantum chips along the cutting track between them in the direction of the UV film; Insert the two folded quantum chips into the box body of the cleaning container along the partition of the cleaning container, and immerse the cleaning container in the degumming solution; After the UV film falls off, the UV film is taken out and the quantum chip is cleaned and dried in sequence.

2. The quantum chip cleaning method according to claim 1, characterized in that: The size of the cleaning container matches the length and width of the quantum chip, and the quantum chip is swingably arranged in the cleaning container.

3. The quantum chip cleaning method according to claim 1, characterized in that: Before "cutting and grouping the plurality of quantum chips obtained after cutting", the UV film of the wafer is irradiated for 10 min to 60 min.

4. The quantum chip cleaning method according to claim 1, characterized in that: The step of "sticking the UV film to the side of the wafer not coated with the protective adhesive" further includes: placing the wafer in a fixing frame, and connecting the edge of the UV film to the fixing frame.

5. The quantum chip cleaning method according to claim 1, characterized in that: In "cutting and grouping the plurality of quantum chips obtained after cutting", if there are a plurality of independent quantum chips, the plurality of independent quantum chips are placed in the cleaning container in groups of two.

6. The quantum chip cleaning method according to any one of claims 1 to 5, characterized in that: The quantum chip cleaning container includes a box body, a cover body and at least one partition. An opening is provided at one end of the box body, and the cover body is provided at the opening. A cavity is formed between the cover body and the box body. The cover body and / or the box body are provided with multiple through holes connecting the cavity with the outside; the partition body is provided in the cavity to divide the cavity into at least two accommodating cavities for accommodating chips, and the chip can be swingably provided in the accommodating cavity.

7. The quantum chip cleaning method according to claim 6, characterized in that: The opening of the box body is provided with an external thread, the cover body is provided with an internal thread, and the box body is threadedly connected to the cover body.

8. The quantum chip cleaning method according to claim 6, characterized in that: The bottom of the box body, the side walls of the box body and / or the top of the cover body are each provided with a plurality of through holes; The through hole at the bottom of the box body is arranged opposite to the through hole at the top of the cover body.

9. The quantum chip cleaning method according to claim 8, characterized in that: The partition plate is provided with a plurality of through holes, the through holes on the partition plate communicating with two adjacent accommodating cavities, and the through holes on the partition plate are arranged opposite to the through holes on the side wall of the box body and have the same size; The through hole is a square hole and / or a circular hole.

10. The quantum chip cleaning method according to claim 6, characterized in that: Two first hand-held parts are provided on one side of the box body away from the cavity, and the two first hand-held parts are arranged on two sides of the box body opposite to each other; Two second hand-held parts are provided on one side of the cover body away from the cavity, and the two second hand-held parts are arranged on two sides of the cover body opposite to each other.

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