An integrated circuit chip testing system and tooling based on AI algorithm

Abstract

The present application provides an integrated circuit chip testing system and tooling based on an AI algorithm, including a computer, a machine, a chip, a voltage test, a unidirectional digital test, a bidirectional digital test, a simulation test, and a tested MCU chip. The computer performs a voltage test on the tested MCU chip and chip by starting a voltage test instrument, and the data is returned to the computer. The computer performs a unidirectional digital test on the tested MCU chip and chip through a unidirectional digital test instrument, and the data is returned to the computer. The computer performs a bidirectional digital test on the tested MCU chip and chip through a bidirectional digital instrument, and the data is returned to the computer. The simulation instrument performs a simulation test on the tested MCU chip and chip, and the simulation data is returned to the computer. The beneficial effects of the present application are that the chip is subjected to a unidirectional digital test, a voltage test, a bidirectional digital test, and a simulation test by a computer, so that more accurate data can be obtained, which is displayed on a computer for analysis by testers.

Description

Technical Field

[0001] The present invention relates to the field of AI chips, and in particular, to an integrated circuit chip testing system and tooling based on AI algorithms. Background Art

[0002] Existing integrated circuit chip testing tools for AI algorithms perform automated testing through the system during testing to reduce manpower and improve efficiency. However, most of them can only perform a single test and cannot meet the requirements of multi-function testing on one machine, resulting in a long testing time.

[0003] For example, the Chinese utility model patent (application number: CN202220299419.1) discloses a "chip test vibration control device", and its specification discloses: The utility model discloses a chip test vibration control device, including a vibration table, a rectangular block is slidably installed on the vibration table, a rack plate is fixedly connected to the rectangular block, two symmetrically arranged screw rods are rotatably installed on the vibration table, each of the screw rods is fixedly connected to a gear, and the gear and the rack plate are meshed and connected; each of the screw rods is threadedly connected to a sliding block, each of the sliding blocks is slidably connected to a mounting rod, a clamping block is fixedly connected to the mounting rod, a clamping plate is arranged on the clamping block, and the cross section of the clamping block is concave; two sliding assemblies are arranged on the vibration table, and each of the sliding assemblies includes a fixed block fixedly connected to the vibration table. The chip of the utility model will not shake during the vibration test, so that the test data is more accurate, which is conducive to the seismic detection of the chip.

[0004] Therefore, we made improvements to this and proposed an integrated circuit chip testing system and tooling based on AI algorithm. Summary of the invention

[0005] The purpose of the present invention is to address the existing ones, but most of them can only perform a single test and cannot meet the requirements of one machine with multiple functions, thus resulting in a long test time.

[0006] In order to achieve the above-mentioned purpose of the invention, the present invention provides the following integrated circuit chip testing system and tooling based on AI algorithm to improve the above-mentioned problems.

[0007] The specific application is as follows:

[0008] An integrated circuit chip testing system based on an AI algorithm, wherein the computer performs a voltage test on the MCU chip and chip under test by starting a voltage test instrument, and the data is returned to the computer; the computer performs a unidirectional digital test on the MCU chip and chip under test by a unidirectional digital test instrument, and the data is returned to the computer; the computer performs a bidirectional digital test on the MCU chip and chip under test by a bidirectional digital instrument, and the data is returned to the computer; the simulation instrument performs a simulation test on the MCU chip and chip under test, and the simulation data is returned to the computer.

[0009] As a preferred technical solution of the present application, an impact assembly is provided on the machine, and the impact assembly is used to test the strength of the chip. The impact assembly includes a plurality of airbags, each of which is located inside the machine, and the airbags opposite to each other up and down form a group. A plurality of straight slots are opened inside the machine, and the straight slots opposite to each other up and down form a group. A servo motor is slidably connected inside each group of straight slots, and a rotating rod is rotatably installed at one end of the servo motor, and the rotating rod passes through the airbag, and a plurality of limit blocks are equidistantly installed on both sides of the airbag, and a connecting block is fixedly installed on one side of each limit block, and a rotating shaft is placed at one end of the connecting block, and the connecting block is rotatably connected to the rotating shaft, and a first rectangular plate is rotatably installed on one side of two rotating shafts, and a plurality of first springs are equidistantly installed on the upper and lower opposite surfaces of the two first rectangular plates.

[0010] As a preferred technical solution of the present application, a leveling component is provided on the airbag, and the leveling component includes a plurality of leveling blocks, and the upper and lower opposite leveling blocks form a group, and the upper and lower ends of the airbag are equidistantly fixedly connected with the leveling blocks, and the interior of the airbag is equidistantly provided with a plurality of telescopic rods, and the upper and lower ends of each telescopic rod are fixedly connected to each group of leveling blocks.

[0011] As a preferred technical solution of the present application, a vibration component is arranged under the leveling component, and the vibration component is used for simulating experiments on chips encountering bumpy conditions. The vibration component includes a plurality of support plates, and the left and right opposing support plates form a group, and each group of support plates is fixedly connected with a U-shaped plate, and the upper and lower inner walls of each U-shaped plate are equidistantly fixed with a plurality of second springs, and a second rectangular plate is arranged in the middle of each U-shaped plate, and the upper and lower opposing surfaces of the second rectangular plate are fixedly connected with the second springs.

[0012] As a preferred technical solution of the present application, the second rectangular plates opposite to each other on the left and right sides form a group, and a plurality of clamps are fixedly connected to the opposite surfaces of each group of the second rectangular plates at equal distances.

[0013] As a preferred technical solution of the present application, a receiving component is provided on each of the airbags, and the receiving component is used to receive data from the leveling component and limit the airbag. The receiving component includes a plurality of U-shaped rods, and both ends of each of the U-shaped rods are connected to the rotating rod through a first ring. A plurality of indicator lights are fixedly connected at equal distances to the lower end of the U-shaped rod, and a memory flexible board is fixedly connected to the lower end of the indicator light.

[0014] As a preferred technical solution of the present application, a negative pressure component is provided on the machine, and the negative pressure component includes two negative pressure machines. A number of first circular through grooves are equidistantly opened inside the machine, and each of the first circular through grooves is communicated with the negative pressure machine. Each of the negative pressure machines is fixedly connected to both sides of the machine through a number of clips. A second circular through groove is opened at the upper end of the machine, and a U-shaped pipe is provided inside the second circular through groove. Both ends of the U-shaped pipe are fixedly connected to the negative pressure machine, and a number of boosting pipes are fixedly connected to one side of the U-shaped pipe at equal distances, and each of the boosting pipes is sleeved with a second circular ring, and a rectangular rod is fixedly connected to the second circular ring, and each of the rectangular rods is fixedly connected to the inner wall of the machine.

[0015] As a preferred technical solution of the present application, first rectangular grooves are opened on the left and right sides of the machine platform, a first bearing is installed at the lower end of each of the first rectangular grooves, and a folding rod is rotatably installed on the first bearing.

[0016] As a preferred technical solution of the present application, an observation window is rotatably mounted on the upper end of the machine platform, and second bearings are mounted on both ends of the observation window, and the second bearings are rotatably mounted on the upper end of the folding rod.

[0017] Compared with the prior art, the present invention has the following beneficial effects:

[0018] In the scheme of this application:

[0019] 1. In order to solve the problem of impact test in the prior art, the present application realizes that when the airbag is in a negative pressure environment formed by the negative pressure machine in the machine, the airbag is expanded, and then the airbag is limited by the rotating shaft. At the same time, the servo motor is driven to rotate so that the airbag becomes vertical. At the same time, the servo motor is slidably connected in the straight slot, so that it can move up and down in the straight slot, and then the first rectangular plate connected to the rotating shaft at both ends of the airbag is moved through the connecting block and the limiting block. By controlling the negative pressure machine to adjust the air pressure inside the machine, the expansion size of the airbag is adjusted, and the first rectangular plate can be squeezed by the airbag to form an obtuse angle and a right angle to impact the chip, so that different impact data can be obtained, and more detailed testing can be performed;

[0020] 2. In order to solve the problems of copper thickness and flatness of chips in the prior art, the present application sets an airbag, a flattening block, a telescopic rod, a servo motor, a rotating rod, a chip, a first rectangular plate, a first spring, a U-shaped plate, a negative pressure machine, a U-shaped rod, an indicator light, and a memory soft board, so that when the airbag is horizontal, the negative pressure machine adjusts the air pressure inside the machine, and then the airbag expands inside the negative pressure environment, and then the airbag is limited by the rotating rod. At the same time, the servo motor is slidably connected inside the straight slot, so that it can move up and down inside the straight slot, and then the flattening blocks at the upper and lower ends of the airbag move in two directions under the expansion of the airbag, and the lower end of the airbag The flattening block contacts the chip. When the copper thickness and flatness of the chip are abnormal, the telescopic rod is fixed in the middle of the flattening blocks at the upper and lower ends, which will cause the flattening block at the upper end to move. At the same time, when the airbag expands, the airbag will expand all around. The first rectangular plates on both sides of the airbag will contact the U-shaped plate, thereby forming a restriction, so that the airbag will only expand to the upper and lower ends. At the same time, after the experiment is completed, the first spring fixed between the two first rectangular plates can be used to reset the airbag. Then, after the flattening block at the upper end contacts the memory soft board, the indicator light fixed on the upper end of the memory soft board will light up in the case of an abnormality, thereby prompting the corresponding position;

[0021] 3. In order to solve the problem of chips in vibration experiments in the prior art, the present application realizes that the airbag is in the horizontal and vertical positions of the servo motor through the airbag, chip, support plate, U-shaped plate, second spring, second rectangular plate, airbag, first rectangular plate and first spring. When the airbag contacts the chip on the fixture, the second rectangular plate can play a buffering role through the second spring located inside the U-shaped plate to prevent the chip from vibrating during the impact and flattening test, resulting in inaccurate experimental data. At the same time, when the first rectangular plate and the airbag leave the chip, the squeezed second spring resets, so that they can bounce, so that the chip clamped in the middle vibrates up and down, thereby simulating a vibration environment;

[0022] 4. In order to solve the problems in the negative pressure environment in the prior art, the present application sets a negative pressure machine, a first circular through groove, a machine, a U-shaped pipe, a boost pipe, a second circular ring, and a rectangular rod, so that when the observation window on the machine is closed, the negative pressure machine is started to form a negative pressure environment inside the machine, thereby facilitating the testing of the chip in the negative pressure environment. At the same time, the U-shaped pipe fixed on the upper end of the negative pressure machine can discharge the washed air through the boost pipe, which can blow dust on the surface of the chip, thereby ensuring that the surface of the chip is clean when being tested. BRIEF DESCRIPTION OF THE DRAWINGS

[0023] Figure 1 A schematic diagram of an integrated circuit chip testing system based on an AI algorithm provided in this application;

[0024] Figure 2 A schematic diagram of the structure of the integrated circuit chip testing tooling based on the AI ​​algorithm provided in this application;

[0025] Figure 3 A schematic diagram of the top view structure of the integrated circuit chip testing tooling based on the AI ​​algorithm provided in this application;

[0026] Figure 4 A schematic diagram of the impact component structure of the integrated circuit chip testing tooling based on the AI ​​algorithm provided in this application;

[0027] Figure 5 A schematic diagram of the flattening component structure of the integrated circuit chip testing tooling based on the AI ​​algorithm provided in this application;

[0028] Figure 6 A schematic diagram of the structure of the negative pressure component of the integrated circuit chip testing tooling based on the AI ​​algorithm provided in this application;

[0029] Figure 7 A schematic diagram of the structure of the vibration component of the integrated circuit chip testing tooling based on the AI ​​algorithm provided in this application;

[0030] Figure 8 A schematic diagram of the receiving component structure of the integrated circuit chip testing tooling based on the AI ​​algorithm provided in this application;

[0031] Fig. 9 A schematic diagram of the receiving component structure of the integrated circuit chip testing tooling based on the AI ​​algorithm provided in this application.

[0032] Indicated in the figure:

[0033] 1. Machine platform; 101. Observation window; 102. Second bearing; 103. Folding rod; 104. First bearing; 105. First rectangular groove;

[0034] 2. Negative pressure assembly; 201. Negative pressure machine; 202. Buckle; 203. U-shaped pipe; 204. Rectangular rod; 205. Pressurized pipe; 206. Second circular ring; 207. First circular groove;

[0035] 3. Leveling assembly; 301. first rectangular plate; 302. first spring; 303. rotating shaft; 304. connecting block; 305. limiting block; 306. airbag; 307. leveling block; 308. telescopic rod;

[0036] 4. Vibration assembly; 401. Support plate; 402. U-shaped plate; 403. Second spring; 404. Clamp; 405. Second rectangular plate;

[0037] 5. Receiving assembly; 501. First ring; 502. Rotating rod; 503. Indicator light; 504. Servo motor; 505. U-shaped rod; 506. Memory soft board;

[0038] 6. Chip. DETAILED DESCRIPTION

[0039] In order to enable those skilled in the art to better understand the scheme of the present invention, the technical scheme in the embodiments of the present invention will be clearly and completely described below in conjunction with the drawings in the embodiments of the present invention. Obviously, the described embodiments are only part of the embodiments of the present invention, not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without creative work should fall within the scope of protection of the present invention.

[0040] As described in the background art, most of them can only perform a single test and cannot meet the requirements of one machine with multiple functions, thus resulting in a long test time.

[0041] In order to solve this technical problem, the present invention provides an integrated circuit chip testing system and tooling based on AI algorithm, which are applied to multifunctional testing.

[0042] Specifically, please refer to Figure 1 , the integrated circuit chip testing system based on AI algorithm specifically includes:

[0043] The computer performs voltage test on the MCU chip and chip 6 under test by starting the voltage test instrument, and the data is returned to the computer. The computer performs unidirectional digital test on the MCU chip and chip 6 under test by using the unidirectional digital test instrument, and the data is returned to the computer. The computer performs bidirectional digital test on the MCU chip and chip 6 under test by using the bidirectional digital instrument, and the data is returned to the computer. The analog instrument performs analog test on the MCU chip and chip 6 under test, and the analog data is returned to the computer.

[0044] The integrated circuit chip testing system based on AI algorithm provided by the present invention has the beneficial effect of performing unidirectional digital test and voltage test and bidirectional digital test and analog test on chip 6 through computer, so as to obtain more accurate data, which is displayed on the computer for analysis by test personnel.

[0045] In order to enable those skilled in the art to better understand the solutions of the present invention, the technical solutions in the embodiments of the present invention will be clearly and completely described below in conjunction with the accompanying drawings.

[0046] It should be noted that, in the absence of conflict, the embodiments of the present invention and the features and technical solutions in the embodiments may be combined with each other.

[0047] It should be noted that similar reference numerals and letters denote similar items in the following drawings, and therefore, once an item is defined in one drawing, further definition and explanation thereof is not required in subsequent drawings.

[0048] Example 1, please refer to Figure 1 An integrated circuit chip testing system based on AI algorithm has a physical test set under its computer, and the physical test is provided with a leveling component 3, an impact component, and a vibration component 4.

[0049] Beneficial effect: Physical testing is carried out under the control of a computer, and the chip 6 is tested for the flattening component 3, the impact component and the vibration component 4 respectively.

[0050] Please refer to Figure 1 , Figure 2 , Figure 3 , Figure 4 , an integrated circuit chip testing tool based on AI algorithm, wherein an impact assembly is arranged on a machine 1, and the impact assembly is used to test the strength of a chip 6, and the impact assembly comprises a plurality of airbags 306, each of which is located inside the machine 1, and the airbags 306 opposite to each other up and down form a group, and a plurality of straight slots are opened inside the machine 1, and the straight slots opposite to each other up and down form a group, and a servo motor 504 is slidably connected inside each group of straight slots, and a rotating rod 502 is rotatably installed at one end of the servo motor 504, and the rotating rod 502 passes through the airbag 306, and a plurality of limit blocks 305 are equidistantly installed on both sides of the airbag 306, and a connecting block 304 is fixedly installed on one side of each limit block 305, and a rotating shaft 303 is placed at one end of the connecting block 304, and the connecting block 304 is rotatably connected to the rotating shaft 303, and a first rectangular plate 301 is rotatably installed on one side of the two rotating shafts 303, and a plurality of first springs 302 are equidistantly installed on the upper and lower opposite surfaces of the two first rectangular plates 301.

[0051] Beneficial effect: The airbag 306 is then limited by the rotating shaft 303, and at the same time, the servo motor 504 is driven to rotate so that the airbag 306 becomes vertical. At the same time, the servo motor 504 is slidably connected inside the straight slot, so that it can move up and down inside the straight slot, and then the first rectangular plate 301 connected to the rotating shaft 303 at both ends of the airbag 306 through the connecting block 304 and the limiting block 305 is moved, and the expansion size of the airbag 306 is adjusted, so that the first rectangular plate 301 can form an obtuse angle and a right angle under the extrusion of the airbag 306 to impact the chip 6, so that different impact data can be obtained, and more detailed testing can be performed.

[0052] Embodiment 2 further optimizes the integrated circuit chip testing tooling based on the AI ​​algorithm provided in Embodiment 1. Specifically, Figure 5As shown, a leveling component 3 is provided on the airbag 306, and the leveling component 3 includes a plurality of leveling blocks 307, and the upper and lower opposite leveling blocks 307 form a group, and the upper and lower ends of the airbag 306 are equidistantly fixedly connected with the leveling blocks 307, and a plurality of telescopic rods 308 are equidistantly provided inside the airbag 306, and the upper and lower ends of each telescopic rod 308 are fixedly connected to each group of leveling blocks 307.

[0053] Beneficial effect: when the airbag 306 is horizontal, the airbag 306 expands inside the negative pressure environment, and then the airbag 306 is limited by the rotating rod 502. At the same time, the servo motor 504 is slidably connected inside the straight slot, so that it can move up and down inside the straight slot. Then the leveling blocks 307 at the upper and lower ends of the airbag 306 move in two directions under the expansion of the airbag 306. The leveling block 307 at the lower end of the airbag 306 contacts the chip 6. When the copper thickness and flatness of the chip 6 are abnormal, the telescopic rod 308 is fixed between the leveling blocks 307 at the upper and lower ends, which will cause the leveling block 307 at the upper end to be displaced, so that the abnormality of the corresponding position can be observed in time.

[0054] Further, such as Figure 7 As shown, a vibration component 4 is arranged under the leveling component 3, and the vibration component 4 is used for simulating experiments on the chip 6 when encountering bumps. The vibration component 4 includes a plurality of support plates 401, and the left and right opposing support plates 401 form a group, and each group of support plates 401 is fixedly connected with a U-shaped plate 402, and the upper and lower inner walls of each U-shaped plate 402 are equidistantly fixedly connected with a plurality of second springs 403, and a second rectangular plate 405 is arranged in the middle of each U-shaped plate 402, and the upper and lower opposing surfaces of the second rectangular plate 405 are fixedly connected with the second spring 403, and the left and right opposing second rectangular plates 405 form a group, and the opposing surfaces of each group of second rectangular plates 405 are equidistantly fixedly connected with a plurality of clamps 404.

[0055] Beneficial effect: the airbag 306 is in the horizontal and vertical positions of the servo motor 504. When it contacts the chip 6 on the fixture 404, the second rectangular plate 405 can play a buffering role through the second spring 403 located inside the U-shaped plate 402, preventing the chip 6 from vibrating during the impact and flattening test, which would cause inaccurate experimental data. At the same time, when the first rectangular plate 301 and the airbag 306 leave the chip 6, the squeezed second spring 403 is reset, so that it can bounce, so that the chip 6 clamped in the middle can vibrate up and down, thereby simulating a vibrating environment.

[0056] Embodiment 3 further optimizes the integrated circuit chip testing tooling based on the AI ​​algorithm provided in Embodiment 1 or 2. Specifically, Figure 2 , Figure 3 , Figure 8As shown, each airbag 306 is provided with a receiving component 5, which is used to receive data from the leveling component 3 and limit the airbag 306. The receiving component 5 includes a plurality of U-shaped rods 505, and both ends of each U-shaped rod 505 are connected to the rotating rod 502 through a first ring 501. A plurality of indicator lights 503 are equidistantly fixedly connected to the lower end of the U-shaped rod 505, and a memory soft board 506 is fixedly connected to the lower end of the indicator light 503.

[0057] Beneficial effect: After the upper flattening block 307 contacts the memory flexible board 506, the indicator light 503 fixed on the upper end of the memory flexible board 506 will light up in an abnormal situation, thereby providing a prompt at the corresponding position.

[0058] Further, such as Figure 6 As shown, a negative pressure component 2 is provided on the machine 1, and the negative pressure component 2 includes two negative pressure machines 201. A plurality of first circular through grooves 207 are equidistantly provided inside the machine 1, and each first circular through groove 207 is communicated with the negative pressure machine 201. Each negative pressure machine 201 is fixedly connected to both sides of the machine 1 through a plurality of buckles 202. A second circular through groove is provided at the upper end of the machine 1, and a U-shaped pipe 203 is provided inside the second circular through groove. Both ends of the U-shaped pipe 203 are fixedly connected to the negative pressure machine 201, and a plurality of boosting pipes 205 are fixedly connected to one side of the U-shaped pipe 203 at equal distances, and each boosting pipe 205 is sleeved with a second circular ring 206, and a rectangular rod 204 is fixedly connected to the second circular ring 206, and each rectangular rod 204 is fixedly connected to the inner wall of the machine 1.

[0059] Beneficial effect: When the observation window 101 on the machine 1 is closed, the negative pressure machine 201 is started, so that a negative pressure environment is formed inside the machine 1, so that the chip 6 can be tested in the negative pressure environment. At the same time, the U-shaped pipe 203 fixed on the upper end of the negative pressure machine 201 can discharge the washed air through the boost pipe 205, and can blow dust on the surface of the chip 6, thereby ensuring that the surface of the chip 6 is clean when testing.

[0060] Further, such as Figure 2 and Figure 3 As shown, first rectangular grooves 105 are opened on the left and right sides of the machine platform 1 , and a first bearing 104 is installed at the lower end of each first rectangular groove 105 , and a folding rod 103 is rotatably installed on the first bearing 104 .

[0061] Beneficial effect: the folding rod 103 can rotate under the action of the first bearing 104, so that when the observation window 101 is reset, it can enter the first rectangular groove 105, so that the machine 1 becomes more airtight.

[0062] Further, such as Figure 2 and Figure 3As shown, an observation window 101 is rotatably mounted on the upper end of the machine platform 1 , and second bearings 102 are mounted on both ends of the observation window 101 , and the second bearing 102 is rotatably mounted on the upper end of the folding rod 103 .

[0063] Beneficial effect: The second bearing 102 is convenient for resetting the folding rod 103 , and the folding rod 103 supports the observation window 101 when it is lifted.

[0064] The use process of an integrated circuit chip testing system and tooling based on an AI algorithm provided by the present invention is as follows:

[0065] Working principle: The chip 6 is subjected to unidirectional digital test, voltage test, bidirectional digital test and analog test by a computer, so as to obtain more accurate data, which is displayed on the computer for analysis by the test personnel. Physical test is carried out under the control of the computer, and the chip 6 is tested by the leveling component 3, the impact component and the vibration component 4 respectively. Then the airbag 306 is limited by the rotating shaft 303. At the same time, the servo motor 504 drives the airbag 306 to rotate vertically. At the same time, the servo motor 504 is slidably connected inside the straight slot, so that it can move up and down inside the straight slot. Then, the two ends of the airbag 306 are moved by the first rectangular plate 301 connected by the connecting block 304, the limiting block 305 and the rotating shaft 303. , the expansion size of the airbag 306 can be adjusted, so that the first rectangular plate 301 can form an obtuse angle and a right angle to impact the chip 6 under the extrusion of the airbag 306, so that the impact data at different times can be obtained, and the test can be carried out in more detail. When the airbag 306 is horizontal, the airbag 306 is expanded inside the negative pressure environment, and then the airbag 306 is limited by the rotating rod 502. At the same time, the servo motor 504 is slidably connected inside the straight slot, so that it can move up and down inside the straight slot. Then, the flattening blocks 307 at the upper and lower ends of the airbag 306 move in two directions under the expansion of the airbag 306. The flattening block 307 at the lower end of the airbag 306 contacts the chip 6. When the copper thickness and flatness of the chip 6 are abnormal, A telescopic rod 308 is fixed in the middle of the flattening block 307 at the upper and lower ends, which will cause the flattening block 307 at the upper end to be displaced, so as to timely observe the abnormality of the corresponding position, and realize the horizontal and vertical conditions of the airbag 306 at the servo motor 504. When it contacts the chip 6 on the fixture 404, the second rectangular plate 405 can play a buffering role through the second spring 403 located in the U-shaped plate 402 to prevent the chip 6 from vibrating during the impact and flattening test, resulting in inaccurate experimental data. At the same time, when the first rectangular plate 301 and the airbag 306 leave the chip 6, the squeezed second spring 403 is reset, so that it can bounce, so that the chip 6 clamped in the middle vibrates up and down, thereby simulating The vibrating environment is created, and then the flattening block 307 at the upper end contacts the memory flexible board 506. The indicator light 503 fixed at the upper end of the memory flexible board 506 will light up in an abnormal situation, thereby providing a prompt at the corresponding position. When the observation window 101 on the machine 1 is closed, the negative pressure machine 201 is started to form a negative pressure environment inside the machine 1, thereby facilitating the testing of the chip 6 in the negative pressure environment. At the same time, the U-shaped pipe 203 fixed at the upper end of the negative pressure machine 201 can discharge the washed air through the boost pipe 205, and can blow dust on the surface of the chip 6, thereby ensuring that the surface of the chip 6 is clean when being tested. The folding rod 103 can rotate under the action of the first bearing 104.Therefore, when the observation window 101 is reset, it can be placed in the first rectangular groove 105, so that the machine 1 becomes more airtight, and the second bearing 102 is convenient for resetting the folding rod 103, while the folding rod 103 supports the observation window 101 when it is lifted.

[0066] In the present invention, unless otherwise clearly specified and limited, the terms "installed", "connected", "connected", "fixed" and the like should be understood in a broad sense, for example, it can be a fixed connection, a detachable connection, or an integral one; it can be a mechanical connection, an electrical connection, or communication with each other; it can be a direct connection, or an indirect connection through an intermediate medium, it can be the internal connection of two elements or the interaction relationship between two elements, unless otherwise clearly defined. For ordinary technicians in this field, the specific meanings of the above terms in the present invention can be understood according to specific circumstances.

[0067] Obviously, the embodiments described above are only some embodiments of the present invention, rather than all embodiments. The preferred embodiments of the present invention are given in the accompanying drawings, but they do not limit the patent scope of the present invention. The present invention can be implemented in many different forms. On the contrary, the purpose of providing these embodiments is to make the understanding of the disclosure of the present invention more thorough and comprehensive. Although the present invention has been described in detail with reference to the aforementioned embodiments, for those skilled in the art, it is still possible to modify the technical solutions recorded in the aforementioned specific embodiments, or to perform equivalent replacements for some of the technical features therein. Any equivalent structure made using the contents of the specification and drawings of the present invention, directly or indirectly used in other related technical fields, is also within the scope of patent protection of the present invention.

Claims

1. An integrated circuit chip testing tool based on AI algorithm, characterized in that: The invention comprises a machine (1), a chip (6), a flattening component (3), and a vibration component (4), wherein an impact component is arranged on the machine (1), and the impact component is used to test the strength of the chip (6), and the impact component comprises a plurality of air bags (306), each of which is located inside the machine (1), and the air bags (306) that are opposite to each other up and down form a group, and the machine (1) is provided with a plurality of straight slots, and the straight slots that are opposite to each other up and down form a group, and a servo motor (504) is slidably connected inside each group of straight slots, and one end of the servo motor (504) is rotated. A rotating rod (502) is rotatably mounted, the rotating rod (502) passing through the airbag (306), a plurality of limit blocks (305) are equidistantly mounted on both sides of the airbag (306), a connecting block (304) is fixedly mounted on one side of each limit block (305), a rotating shaft (303) is placed at one end of the connecting block (304), the connecting block (304) is rotatably connected to the rotating shaft (303), a first rectangular plate (301) is rotatably mounted on one side of two rotating shafts (303), and a plurality of first springs (302) are equidistantly mounted on upper and lower opposite surfaces of the two first rectangular plates (301).

2. The integrated circuit chip testing tool based on AI algorithm according to claim 1, characterized in that: The airbag (306) is provided with a leveling component (3), the leveling component (3) comprising a plurality of leveling blocks (307), the leveling blocks (307) being arranged opposite to each other in a group, the upper and lower ends of the airbag (306) being equidistantly fixedly connected to the leveling blocks (307), the interior of the airbag (306) being equidistantly provided with a plurality of telescopic rods (308), the upper and lower ends of each telescopic rod (308) being fixedly connected to each group of the leveling blocks (307).

3. The integrated circuit chip testing tool based on AI algorithm according to claim 2, characterized in that: A vibration component (4) is arranged under the leveling component (3), and the vibration component (4) is used for simulating an experiment on a chip (6) encountering a bumpy situation. The vibration component (4) comprises a plurality of support plates (401), and the support plates (401) opposite to each other on the left and right form a group. A U-shaped plate (402) is fixedly connected to each group of support plates (401), and a plurality of second springs (403) are fixedly connected to the upper and lower inner walls of each U-shaped plate (402) at equal intervals. A second rectangular plate (405) is arranged in the middle of each U-shaped plate (402), and the upper and lower opposite surfaces of the second rectangular plate (405) are fixedly connected to the second spring (403).

4. The integrated circuit chip testing tool based on AI algorithm according to claim 3, characterized in that: The second rectangular plates (405) opposite to each other on the left and right form a group, and a plurality of clamps (404) are fixedly connected to the opposite surfaces of each group of the second rectangular plates (405) at equal distances.

5. The integrated circuit chip testing tool based on AI algorithm according to claim 4, characterized in that: A receiving assembly (5) is provided on each of the airbags (306), and the receiving assembly (5) is used to receive data from the leveling assembly (3) and to limit the position of the airbag (306). The receiving assembly (5) comprises a plurality of U-shaped rods (505), and both ends of each of the U-shaped rods (505) are sleeved with a rotating rod (502) via a first ring (501). A plurality of indicator lights (503) are fixedly connected at equal distances to the lower end of the U-shaped rod (505), and a memory soft board (506) is fixedly connected to the lower end of the indicator light (503).

6. The integrated circuit chip testing tool based on AI algorithm according to claim 5, characterized in that: The machine (1) is provided with a negative pressure assembly (2), the negative pressure assembly (2) comprising two negative pressure machines (201), a plurality of first circular through grooves (207) are equidistantly provided inside the machine (1), each of the first circular through grooves (207) is communicated with the negative pressure machine (201), each of the negative pressure machines (201) is fixedly connected to two sides of the machine (1) via a plurality of buckles (202), a second circular through groove is provided at the upper end of the machine (1), a U-shaped pipe (203) is provided inside the second circular through groove, both ends of the U-shaped pipe (203) are fixedly connected to the negative pressure machine (201), a plurality of boosting pipes (205) are equidistantly fixedly connected to one side of the U-shaped pipe (203), each of the boosting pipes (205) is sleeved with a second circular ring (206), a rectangular rod (204) is fixedly connected to the second circular ring (206), and each of the rectangular rods (204) is fixedly connected to the inner wall of the machine (1).

7. The integrated circuit chip testing tool based on AI algorithm according to claim 6, characterized in that: The left and right sides of the machine platform (1) are provided with first rectangular grooves (105), the lower end of each of the first rectangular grooves (105) is mounted with a first bearing (104), and a folding rod (103) is rotatably mounted on the first bearing (104).

8. The integrated circuit chip testing tool based on AI algorithm according to claim 7, characterized in that: An observation window (101) is rotatably mounted on the upper end of the machine platform (1), and second bearings (102) are mounted at both ends of the observation window (101). The second bearing (102) is rotatably mounted on the upper end of the folding rod (103).

9. An integrated circuit chip testing system based on AI algorithm, using the integrated circuit chip testing tool based on AI algorithm as claimed in claim 8, characterized in that: The computer performs a voltage test on the MCU chip and the chip (6) under test by starting the voltage test instrument, and the data is returned to the computer. The computer performs a unidirectional digital test on the MCU chip and the chip (6) under test by using the unidirectional digital test instrument, and the data is returned to the computer. The computer performs a bidirectional digital test on the MCU chip and the chip (6) under test by using the bidirectional digital instrument, and the data is returned to the computer. The analog instrument performs a simulation test on the MCU chip and the chip (6) under test, and the simulation data is returned to the computer.

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