A method, apparatus, and storage medium for identifying high-risk links in a PCB

Abstract

This invention discloses a method, apparatus, and storage medium for determining high-risk links in a PCB. The PCB includes multiple links, each link including at least one drill strip, and each drill strip including at least one via. The via penetrates at least one metal layer and at least one insulating layer. The method for determining high-risk links includes: acquiring the PCB design parameters; the design parameters including drill strip information and via location information; determining the initial value of each via based on the drill strip information; determining the correction value of each via based on the location information and the initial value of each via; determining the link value of each link based on the correction value of each via; and determining the high-risk links in the PCB based on the link values ​​of each link. This method solves the problems of low efficiency and low accuracy caused by manually checking the link structure layer by layer in existing methods. By utilizing relevant algorithm logic, the operation time for determining high-risk links is greatly shortened, improving both efficiency and accuracy.

Description

Technical Field

[0001] This invention relates to the technical field of PCBs, and more particularly to a method, apparatus, and storage medium for identifying high-risk links in PCBs. Background Technology

[0002] With increasing demand in the global consumer electronics market, electronic products are becoming increasingly complex, high-performing, and smaller in size, thus placing higher demands on PCB boards. This is particularly evident in the widespread application of HDI boards, which are playing a significant role in navigation, medical, transportation, telephony, and communication equipment. The demand for HDI boards is rising due to the widespread use of small-package portable electronic devices and high-density interconnects. Early processing focused on HDI boards below level 3 with coarse linewidths and spacing of 100µm / 100µm. However, with the evolving needs of product development, the laser via order has increased to 7-8, and the interconnect structure has become increasingly complex. Existing overlay diagrams no longer provide sufficient information for production.

[0003] Traditional analysis of the stack-up information of laser vias on HDI boards typically involves manually inspecting the overlap relationships of each laser via layer by layer, displaying partial overlap information. However, this manual inspection method is very inefficient. When the laser via stack-up order increases to 7-8, analyzing a single circuit board often takes 6 to 8 hours. Furthermore, when the laser stack-up order reaches 7-8, the via link structure often reaches 60 to 80 types. The link structure obtained through manual inspection is usually insufficient for comprehensive analysis, has low accuracy, and displays incomplete stack-up information, failing to reflect all the information required for production. Summary of the Invention

[0004] This invention provides a method, apparatus, and storage medium for determining high-risk links in a PCB, which addresses the shortcomings of existing technologies. By utilizing relevant algorithmic logic, the operation time for determining high-risk links is greatly shortened, thereby improving operational efficiency and accuracy.

[0005] In a first aspect, the present invention provides a method for determining high-risk links in a PCB, wherein the PCB includes at least one drill strip, the drill strip includes at least one via, the via penetrates at least one metal layer and at least one insulating layer, and each link includes at least one drill strip; the method for determining high-risk links includes:

[0006] Obtain the PCB design parameters; the design parameters include drill strip information and via location information;

[0007] Based on the borehole information, determine the initial values ​​for each through hole;

[0008] Based on the position information and initial value of each via, determine the correction value of each via;

[0009] Based on the correction values ​​of each via, determine the link value of each link;

[0010] Based on the link values ​​of each link, identify the high-risk links in the PCB.

[0011] Optionally, the borehole strip information includes the starting layer and the ending layer of the borehole strip;

[0012] Based on the borehole information, determine the initial values ​​for each through hole, including:

[0013] Based on the information of each borehole zone, the borehole zones are sorted according to their starting layer, and the borehole zones with the same starting layer are sorted according to their ending layer to determine the sequence number of each borehole zone.

[0014] Based on the sequence number of each borehole zone, a decimal value is assigned to each through hole in each borehole zone to determine the initial value of each through hole.

[0015] Optionally, based on the sequence number of each borehole zone, a decimal value is assigned to each through hole in each borehole zone, including:

[0016] Determine the exponent of the exponential function corresponding to each borehole zone based on the arrangement sequence number of each borehole zone;

[0017] Based on the exponent of the exponential function corresponding to each borehole zone, the decimal value of each through hole in each borehole zone is assigned to an exponential function with base 2.

[0018] Optionally, based on the position information and initial value of each via, a correction value for each via is determined, including:

[0019] Based on the position information of each through hole, each through hole with a vertical distance less than a preset distance is identified as a drilling zone group;

[0020] The sum of the initial values ​​of all vias within the same via group is determined as the correction value for each via in that via group.

[0021] Optionally, the correction value for the drilled area can be a decimal number;

[0022] Based on the correction values ​​for each via, determine the link values ​​for each link, including:

[0023] Based on the correction value of each via, the correction value of each via is converted into a binary correction value, and the binary correction value is determined as the link value of the link.

[0024] Optionally, based on the link values ​​of each link, high-risk links in the PCB can be identified, including:

[0025] Based on the link value of each link, the link containing the most boreholes is identified as the highest risk link; among them, the boreholes contained in the highest risk link are the first boreholes, and the boreholes not contained in the highest risk link are the second boreholes.

[0026] Links containing the second borehole zone were identified as the next highest risk links;

[0027] High-risk links include the highest-risk links and the second-highest-risk links.

[0028] Optionally, after identifying high-risk links in the PCB based on the link values ​​of each link, the process may also include:

[0029] Based on the link value of each high-risk link, determine the number of boreholes in each high-risk link;

[0030] The high-risk links are sorted according to the number of boreholes.

[0031] The high-risk links after being sorted are subjected to reliability testing according to the set rules.

[0032] Secondly, the present invention provides a high-risk link identification device for a PCB, wherein the PCB includes multiple links, each link includes at least one drill strip, the drill strip includes at least one via, the via penetrating at least one metal layer and at least one insulating layer, and the high-risk link identification device includes:

[0033] The information acquisition module is used to acquire the PCB design parameters, including drill strip information and via location information.

[0034] The initial value determination module is used to determine the initial value of each borehole zone based on the borehole zone information;

[0035] The correction value determination module is used to determine the correction value of each borehole zone based on the position information of each through hole and the initial value of each through hole;

[0036] The link value determination module is used to determine the link value of each link based on the correction value of each via.

[0037] The high-risk link identification module is used to identify high-risk links in the PCB based on the link values ​​of each link.

[0038] Thirdly, the present invention provides a computer-readable storage medium storing computer instructions that, when executed by a processor, implement the high-risk link determination method for a PCB according to any embodiment of the present invention.

[0039] The technical solution of this invention obtains PCB design parameters, including drill strip information and via location information; determines the initial value of each via based on the drill strip information; determines the correction value of each via based on the location information and the initial value of each via; determines the link value of each link based on the correction value of each via; and identifies high-risk links in the PCB based on the link values ​​of each link. This solves the problems of low efficiency and low accuracy caused by manually checking the link structure layer by layer in existing methods. By utilizing relevant algorithm logic, the operation time for identifying links and high-risk links is greatly shortened, improving operation efficiency and accuracy.

[0040] It should be understood that the description in this section is not intended to identify key or essential features of the embodiments of the present invention, nor is it intended to limit the scope of the invention. Other features of the invention will become readily apparent from the following description. Attached Figure Description

[0041] To more clearly illustrate the technical solutions in the embodiments of the present invention, the accompanying drawings used in the description of the embodiments will be briefly introduced below. Obviously, the accompanying drawings described below are only some embodiments of the present invention. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0042] Figure 1 This is a flowchart of a method for determining high-risk links in a PCB provided in Embodiment 1 of the present invention;

[0043] Figure 2 A flowchart of another method for determining high-risk links in a PCB provided in Embodiment 2 of the present invention;

[0044] Figure 3 A flowchart of another method for determining high-risk links in a PCB provided in Embodiment 3 of the present invention;

[0045] Figure 4 This is a schematic diagram of a high-risk link determination device for a PCB provided in Embodiment 4 of the present invention. Detailed Implementation

[0046] To enable those skilled in the art to better understand the present invention, the technical solutions of the present invention will be clearly and completely described below with reference to the accompanying drawings of the embodiments of the present invention. Obviously, the described embodiments are only some embodiments of the present invention, and not all embodiments. Based on the embodiments of the present invention, all other embodiments obtained by those skilled in the art without creative effort should fall within the scope of protection of the present invention.

[0047] It should be noted that the terms "first," "second," etc., in the specification, claims, and accompanying drawings of this invention are used to distinguish similar objects and are not necessarily used to describe a specific order or sequence. It should be understood that such data can be interchanged where appropriate so that the embodiments of the invention described herein can be implemented in orders other than those illustrated or described herein. Furthermore, the terms "comprising" and "having," and any variations thereof, are intended to cover a non-exclusive inclusion; for example, a process, method, system, product, or apparatus that comprises a series of steps or units is not necessarily limited to those steps or units explicitly listed, but may include other steps or units not explicitly listed or inherent to such processes, methods, products, or apparatus.

[0048] Example 1

[0049] Figure 1 This is a flowchart of a method for determining high-risk links in a PCB according to Embodiment 1 of the present invention. This embodiment is applicable to the identification of links and high-risk links in high-order PCB structures and the reliability testing of high-risk links. This method can be executed by a PCB high-risk link determination device, which can be implemented in hardware and / or software and can be configured in a storage medium. Figure 1 As shown, the PCB includes at least one drill strip, the drill strip includes at least one via, the via penetrates at least one metal layer and at least one insulating layer, each link includes at least one drill strip, the method includes:

[0050] S110, Obtain the PCB design parameters.

[0051] The design parameters include drill strip information and via location information. A drill strip is an area formed on a PCB by laser drilling or mechanical drilling, typically represented by the form dr mn, where m and n are the number of metal layers, m < n. For example, drill strip information dr1-2 represents holes penetrating the first and second metal layers, dr2-3 represents holes penetrating the second and third metal layers, and dr3-5 represents holes penetrating the third to fifth metal layers. The drill strip information includes all pre-designed drill strips on the PCB. Each drill strip includes multiple vias, which can include laser vias, blind vias, and buried vias. Each via penetrates at least one metal layer and at least one insulating layer. In this embodiment, if the distance between adjacent vias is less than or equal to 1 mil, the adjacent vias are merged into one via. The location information of the vias can include coordinate information and position point parameter information.

[0052] Specifically, after the design of each link on the PCB is completed, to ensure the PCB can be manufactured smoothly, it is necessary to confirm and conduct reliability tests on the high-risk links in the PCB. This process first requires obtaining the PCB's design parameters, namely, the drill bit information and via location information. The methods for obtaining design parameters may include, but are not limited to, importing design drawings or design parameter information, using software algorithms to obtain the required design parameters, and displaying the obtained drill bit information and via location information in the form of tables or databases for easy viewing by staff.

[0053] S120. Determine the initial value of each through hole based on the borehole information.

[0054] Specifically, after obtaining the borehole strip information, the obtained borehole strip information needs to be sorted in ascending order. The sorted borehole strip information can be arranged and displayed sequentially through tables or other means. The values ​​of each through hole contained in each arranged borehole strip are then assigned according to preset rules to determine the initial value of each through hole.

[0055] In one specific embodiment, the obtained drill strip information is sorted in the following order: dr1-2, dr2-3, dr3-5. Each through-hole in each sorted drill strip is assigned a value: the through-hole in drill strip dr1-2 is assigned a value of 1, meaning the initial value of each through-hole in drill strip dr1-2 is 1; similarly, the through-hole in drill strip dr2-3 is assigned a value of 2, meaning the initial value of each through-hole in drill strip dr2-3 is 2; and the through-hole in drill strip dr3-5 is assigned a value of 4, meaning the initial value of each through-hole in drill strip dr3-5 is 4.

[0056] S130. Based on the position information of each through hole and the initial value of each through hole, determine the correction value of each through hole.

[0057] This step can be further refined as follows: based on the position information of each through hole, each through hole whose vertical distance is less than a preset distance is identified as a through hole group; the sum of the initial values ​​of each through hole in the same through hole group is identified as the correction value of each through hole in the through hole group.

[0058] Specifically, after determining the location information and initial value of each through-hole, the positions of each through-hole within each borehole zone are sequentially confirmed based on the location information. If the vertical distance between two or more through-holes in the borehole zone is less than a preset distance (which can be 1 mil), it indicates that the through-holes belong to the same through-hole group. The initial values ​​of all through-holes in this group that meet the preset condition of vertical distance less than the preset distance are then corrected. The correction method involves adding the initial values ​​of all through-holes that meet the preset condition; the sum is the correction value for each through-hole. The initial values ​​of through-holes that do not meet the preset condition are not corrected and are retained.

[0059] In a specific embodiment, the initial value of each through hole in dr1-2 is 1, the initial value of each through hole in dr2-3 is 2, and the initial value of each through hole in dr3-5 is 4. If the borehole strip information dr1-2 and dr2-3 each include 10 through holes, and dr3-5 includes 4 through holes, the positions of each through hole in the three borehole strips are confirmed sequentially. It is found that the vertical distances between the first 5 through holes in dr1-2 and the first 5 through holes in dr2-3 are all less than the preset distance. Therefore, the initial values ​​of the first 5 through holes in dr1-2 and the first 5 through holes in dr2-3 need to be corrected. The sum of the initial values ​​of each through hole is the correction value, which is 3. At this point, the correction value for the first 5 through holes in the drilled strip dr1-2 is 3, while the value for the last 5 through holes remains the initial value of 1; similarly, the correction value for the first 5 through holes in dr2-3 is 3, while the value for the last 5 through holes remains the initial value of 2.

[0060] After confirming the positions of all through holes in the first two drilled sections, it is necessary to continue confirming the positions of all through holes in drilled section dr3-5. The final confirmation result is that the first three through holes in drilled section dr3-5 meet the preset conditions along with the third to fifth through holes in drilled sections dr1-2 and dr2-3, and the fourth through hole in drilled section dr3-5 meets the preset conditions along with the seventh through hole in drilled section dr1-2. Then, the correction value 3 of the third to fifth through holes in drilled sections dr1-2 and dr2-3 and the initial value 4 of the first three through holes in dr3-5 need to be added to obtain a correction value of 7; and the correction value 1 of the seventh through hole in drilled section dr1-2 and the initial value 4 of the fourth through hole in dr3-5 need to be added to obtain a correction value of 5. Thus, the correction value for the first two through holes in the drilled strips dr1-2 and dr2-3 is 3; the correction value for the third to fifth through holes in the drilled strips dr1-2 and dr2-3 and the first two through holes in dr3-5 is 7; the correction value for the seventh through hole in the drilled strip dr1-2 and the fourth through hole in dr3-5 is 5; the values ​​for the sixth, eighth to tenth through holes in the drilled strip dr1-2 remain at the initial value of 1; and the values ​​for the last five drilled strips in the drilled strip dr2-3 remain at the initial value of 2.

[0061] S140. Determine the link value of each link based on the correction value of each via.

[0062] This step can be further broken down as follows: Based on the correction value of each via, convert the correction value of each via into a binary correction value, and determine this binary correction value as the link value of the link. The correction value of the via is a decimal number, and the link value of each link can determine which drill strips are included in the link.

[0063] Specifically, after determining the correction value for each via, since the correction value for each via is a decimal number, it is necessary to convert the decimal correction value into a binary correction value. Based on the binary correction value, it is possible to determine how many links the PCB includes and the link value of each link.

[0064] In an optional embodiment, Table 1 is a schematic diagram of a method for representing the link values ​​of each link according to an embodiment of the present invention. Referring to Table 1, it can be seen that the final corrected values ​​are 1, 2, 3, 5 and 7, indicating that the PCB includes a total of 5 links. The decimal numbers 1, 2, 3, 5 and 7 are converted to binary as shown in the table below. It can be seen that the first link includes 3 drill strips and the link value is 111; the second link includes two drill strips, dr1-2 and dr3-5, and the link value is 101; the third link includes two drill strips, dr1-2 and dr2-3, and the link value is 011; the fourth link includes one drill strip, dr2-3, and the link value is 010; the fifth link includes one drill strip, dr1-2, and the link value is 001.

[0065]

[0066] S150. Based on the link values ​​of each link, identify the high-risk links in the PCB.

[0067] This step can be further broken down as follows: Based on the link value of each link, the link containing the most boreholes is identified as the highest-risk link; the boreholes contained in the highest-risk link are designated as the first boreholes, and the boreholes not contained in the highest-risk link are designated as the second boreholes; the links containing the second boreholes are identified as the second-highest-risk links; and the high-risk links include both the highest-risk link and the second-highest-risk link.

[0068] Specifically, after determining the link value of each link, the highest-risk and second-highest-risk links in the PCB can be identified based on these values. The more drill vias a link contains, the higher its risk; the link with the most drill vias is designated as the highest-risk link. The link with the most drill vias among those not included in the highest-risk link is designated as the second-highest-risk link. These highest-risk and second-highest-risk links are the ones that ultimately require reliability testing.

[0069] In another specific embodiment, there are a total of 10 drill strips in the PCB, and the link value of the first link in the PCB is finally determined to be 1110101101; the link value of the second link is 1011001011; the link value of the third link is 0100011011; the link value of the fourth link is 0010100101; and the link value of the fifth link is 0010000010. This indicates that the first link includes 7 drill strips, the second link includes 6 drill strips, the third link includes 5 drill strips, the fourth link includes 4 drill strips, and the fifth link includes 2 drill strips. The highest-risk link in this PCB is the first link. The drill bands included in the first link (i.e., drill bands 1-3, 5, 7, 8, and 10) constitute the first drill band. The drill bands not included in the first link (i.e., the fourth, sixth, and ninth drill bands) constitute the second drill band. Links containing the second drill band (excluding the highest-risk link) are the second, third, and fifth links. The link containing the most drill bands within the second drill band is the second link, therefore, the second link is the second highest-risk link. Thus, the highest-risk links in this PCB are identified as the first and second links.

[0070] The technical solution of this invention obtains PCB design parameters, including drill strip information and via location information. Based on the drill strip information, the initial value of each via is determined. Based on the location information and the initial value of each via, the correction value of each via is determined. Based on the correction value of each via, the link value of each link is determined. Based on the link value of each link, high-risk links in the PCB are identified. This method solves the problems of low efficiency and low accuracy caused by manually checking the link structure layer by layer. The relevant algorithm logic significantly shortens the operation time for identifying links and high-risk links, improving operation efficiency and accuracy.

[0071] Example 2

[0072] Figure 2 This is a flowchart of another method for determining high-risk links in a PCB provided in Embodiment 2 of the present invention. After determining the high-risk links in the PCB based on the link values ​​of each link, this embodiment adds the following steps, as described in the following example. Figure 2 As shown, the method includes:

[0073] S110, Obtain the PCB design parameters.

[0074] S120. Determine the initial value of each through hole based on the borehole information.

[0075] S130. Based on the position information of each through hole and the initial value of each through hole, determine the correction value of each through hole.

[0076] S140. Determine the link value of each link based on the correction value of each via.

[0077] S150. Based on the link values ​​of each link, identify the high-risk links in the PCB.

[0078] S160. Determine the number of boreholes in each high-risk link based on the link value of each high-risk link.

[0079] Specifically, after identifying each high-risk link, the number of boreholes included in each high-risk link is determined based on the link value of each high-risk link.

[0080] For example, if the link value of the second highest risk link is 11100, it indicates that the number of boreholes included in the second highest risk link is 3; if the link value of the highest risk link is 11011, it indicates that the number of boreholes included in the highest risk link is 4.

[0081] S170. Sort the high-risk links according to the number of boreholes.

[0082] Specifically, after determining the number of boreholes in each high-risk link, the high-risk links are sorted in order of the number of boreholes from high to low, or from low to high.

[0083] For example, if the second highest risk link includes 3 boreholes and the highest risk link includes 4 boreholes, then the result of sorting the high-risk links from highest to lowest according to the number of boreholes is: 11011, 11100.

[0084] S180. Perform reliability testing on the sorted high-risk links according to the set rules.

[0085] Specifically, after sorting the high-risk links, reliability testing needs to be performed on them. This can be done according to predefined rules. For example, links with unaffected drill holes can be placed on both sides of the same test board for reliability testing, while links with interfering drill holes can be placed on the same test board or in different groups on different test boards for reliability testing. The reliability testing may include, but is not limited to, via interconnect stress testing, current withstand testing, hot air testing, and ion contamination testing.

[0086] The technical solution of this invention, after identifying high-risk links, determines the number of drill bands in each high-risk link based on its link value; sorts the high-risk links according to the number of drill bands; and performs reliability testing on the sorted high-risk links according to set rules. This method achieves reliability testing of high-risk links without requiring reliability testing on all links on the PCB, significantly saving testing time and costs.

[0087] Example 3

[0088] Figure 3 This is a flowchart of another method for determining high-risk links in a PCB provided in Embodiment 3 of the present invention. This embodiment refines the specific implementation of determining the initial values ​​of each via based on the drill bit information, such as... Figure 3 As shown, the borehole zone information includes the starting layer and the ending layer of the borehole zone. The method includes:

[0089] S210, Obtain the PCB design parameters.

[0090] S220. Based on the information of each borehole zone, sort each borehole zone by its starting layer, and sort the borehole zones with the same starting layer by their ending layer to determine the sequence number of each borehole zone.

[0091] Specifically, after obtaining the drill strip information, since the PCB includes at least one drill strip, and the vias in the drill strip penetrate at least one metal layer and an insulating layer, and the drill strip information includes the start layer and the end layer of the drill strip, when the vias in the drill strip penetrate at least two metal layers and an insulating layer, there may be multiple drill strips where the start layer of one drill strip is the same as the end layer of another drill strip. Therefore, when sorting the drill strips, we can first start by sorting the drill strips in ascending or descending order of the start layer. If at least two drill strips have the same start layer but different end layers, it indicates that the vias in one of the two drill strips penetrate at least two metal layers and an insulating layer. After sorting the drill strips by start layer, we also need to sort these drill strips in ascending or descending order of their respective end layers. After sorting all the drill strips, we determine the sequence number of each drill strip.

[0092] For example, the borehole zone information is dr1-2, dr2-3, dr3-6, dr1-4, dr1-5, dr5-6, and dr6-7. Taking the dr1-2 borehole zone information as an example, 1 represents the starting layer of the borehole zone, and 2 represents the ending layer of the borehole zone. The result of sorting the borehole zones in ascending order of the starting layer can be dr1-2, dr1-5, dr1-4, dr2-3, dr3-6, dr5-6, and dr6-7. Then, the final sorting is confirmed in ascending order of the ending layer as dr1-2, dr1-4, dr1-5, dr2-3, dr3-6, dr5-6, and dr6-7. The seven determined borehole zones can be sorted by serial numbers 1 to 7 or by serial numbers 0 to 6. This embodiment of the invention does not impose any restrictions on this.

[0093] S230. Based on the arrangement sequence number of each borehole zone, assign a decimal value to each through hole in each borehole zone to determine the initial value of each through hole.

[0094] This step can be further broken down as follows: determine the exponent of the exponential function corresponding to each borehole zone according to the arrangement sequence number of each borehole zone; and assign the decimal value of each through hole in each borehole zone to an exponential function with base 2 according to the exponent of the exponential function corresponding to each borehole zone.

[0095] Specifically, after sorting the boreholes, each through hole in each borehole needs to be assigned a decimal value. When assigning the decimal value, the exponent of the base-2 exponential function corresponding to each borehole needs to be determined, and the exponents are incremented sequentially according to the order of the boreholes. The final assigned decimal value is the initial value of each through hole.

[0096] For example, the sorted drill strips are dr1-2, dr1-4, dr1-5, dr2-3, dr3-6, dr5-6, and dr6-7. Each through hole in each drill strip is assigned a decimal value. That is, the exponent of each through hole in drill strip dr1-2 is 0, therefore each through hole in drill strip dr1-2 is assigned a value of 2 to the power of 0, which is 1. The exponent of each through hole in drill strip dr1-4 is 1, therefore each through hole in drill strip dr1-4 is assigned a value of 2 to the power of 0, which is 1. The through holes are all assigned a value of 2 to the power of 1, which is 2. The exponent of each through hole in drill strip dr1-5 is 2, so each through hole in drill strip dr1-5 is assigned a value of 2 to the power of 2, which is 4. By analogy, we can know that each through hole in drill strip dr2-3 is assigned a value of 8, each through hole in drill strip dr3-6 is assigned a value of 16, each through hole in drill strip dr5-6 is assigned a value of 32, and each through hole in drill strip dr6-7 is assigned a value of 64.

[0097] S240. Based on the position information of each through hole and the initial value of each through hole, determine the correction value of each through hole.

[0098] S250. Determine the link value of each link based on the correction value of each via.

[0099] S260. Based on the link values ​​of each link, identify the high-risk links in the PCB.

[0100] The technical solution of this invention involves sorting the boreholes according to their starting layer based on the borehole information, and then sorting the boreholes with the same starting layer according to their ending layer to determine the sequence number of each borehole. Based on the sequence number of each borehole, a decimal value is assigned to each via in each borehole to determine its initial value. This method effectively sorts the boreholes with different penetration layers and assigns decimal values ​​to the vias in each sorted borehole, ensuring the effective assignment of values ​​to the vias in each borehole and preventing confusion when identifying high-risk links, thus guaranteeing the normal and stable operation of the system.

[0101] Example 4

[0102] Figure 4 This is a schematic diagram of a high-risk link determination device for a PCB provided in Embodiment 4 of the present invention. Figure 4 As shown, the PCB includes at least one drill strip, the drill strip includes at least one via, the via penetrates at least one metal layer and at least one insulating layer, each link includes at least one drill strip, and the device includes:

[0103] The information acquisition module 10 is used to acquire the design parameters of the PCB; the design parameters include drill strip information and the location information of vias;

[0104] The initial value determination module 20 is used to determine the initial value of each borehole zone based on the borehole zone information;

[0105] The correction value determination module 30 is used to determine the correction value of each borehole zone based on the position information of each through hole and the initial value of each through hole.

[0106] The link value determination module 40 is used to determine the link value of each link based on the correction value of each via.

[0107] The high-risk link identification module 50 is used to identify high-risk links in the PCB based on the link values ​​of each link.

[0108] The high-risk link determination device for PCBs provided in this embodiment of the invention can execute the high-risk link determination method for PCBs provided in any embodiment of the invention, and has the corresponding functional modules and beneficial effects of the method.

[0109] Optionally, the initial value determination module 20 can be configured to: sort each borehole zone according to the information of each borehole zone by the starting layer of each borehole zone, and sort the borehole zones with the same starting layer by the ending layer of the borehole zones to determine the arrangement number of each borehole zone; and assign a decimal value to each through hole in each borehole zone according to the arrangement number of each borehole zone to determine the initial value of each through hole.

[0110] Optionally, the initial value determination module 20 can also be configured to: determine the exponent of the exponential function corresponding to each borehole zone according to the arrangement sequence number of each borehole zone; and assign the decimal value of each through hole in each borehole zone to an exponential function with base 2 according to the exponent of the exponential function corresponding to each borehole zone.

[0111] Optionally, the correction value determination module 30 can be configured to: determine each through hole with a horizontal distance less than a preset distance as a drilling zone group based on the position information of the through holes; and determine the sum of the initial values ​​of each through hole in the same through hole group as the correction value of each through hole in the through hole group.

[0112] Optionally, the link value determination module 40 can be configured to: convert the correction value of each via into a binary correction value according to the correction value of each via, and determine the binary correction value as the link value of the link.

[0113] Optionally, the high-risk link determination module 50 can be configured to: determine the link with the most boreholes contained in each link as the highest-risk link based on the link value of each link; wherein, each borehole contained in the highest-risk link is a first borehole, and each borehole not contained in the highest-risk link is a second borehole; determine each link containing the second borehole as the second-highest-risk link; wherein, high-risk links include the highest-risk link and the second-highest-risk link.

[0114] Example 4

[0115] In the context of this invention, a computer-readable storage medium can be a tangible medium that may contain or store a computer program for use by or in conjunction with an instruction execution system, apparatus, or device. A computer-readable storage medium may include, but is not limited to, electronic, magnetic, optical, electromagnetic, infrared, or semiconductor systems, apparatus, or devices, or any suitable combination thereof. Alternatively, a computer-readable storage medium may be a machine-readable signal medium. More specific examples of machine-readable storage media include electrical connections based on one or more wires, portable computer disks, hard disks, random access memory (RAM), read-only memory (ROM), erasable programmable read-only memory (EPROM or flash memory), optical fibers, portable compact disk read-only memory (CD-ROM), optical storage devices, magnetic storage devices, or any suitable combination thereof.

[0116] To provide interaction with a user, the systems and techniques described herein can be implemented on an electronic device having: a display device (e.g., a CRT (cathode ray tube) or LCD (liquid crystal display) monitor) for displaying information to the user; and a keyboard and pointing device (e.g., a mouse or trackball) through which the user provides input to the electronic device. Other types of devices can also be used to provide interaction with the user; for example, feedback provided to the user can be any form of sensory feedback (e.g., visual feedback, auditory feedback, or tactile feedback); and input from the user can be received in any form (including sound input, voice input, or tactile input).

[0117] The systems and technologies described herein can be implemented in computing systems that include backend components (e.g., as data servers), or middleware components (e.g., application servers), or frontend components (e.g., user computers with graphical user interfaces or web browsers through which users can interact with implementations of the systems and technologies described herein), or any combination of such backend, middleware, or frontend components. The components of the system can be interconnected via digital data communication of any form or medium (e.g., communication networks). Examples of communication networks include local area networks (LANs), wide area networks (WANs), blockchain networks, and the Internet.

[0118] A computing system can include clients and servers. Clients and servers are generally located far apart and typically interact through communication networks. The client-server relationship is created by computer programs running on the respective computers and having a client-server relationship with each other. The server can be a cloud server, also known as a cloud computing server or cloud host, which is a hosting product within the cloud computing service system to address the shortcomings of traditional physical hosts and VPS services, such as high management difficulty and weak business scalability.

[0119] It should be understood that the various forms of processes shown above can be used, with steps reordered, added, or deleted. For example, the steps described in this invention can be executed in parallel, sequentially, or in different orders, as long as the desired result of the technical solution of this invention can be achieved, and this is not limited herein.

[0120] The specific embodiments described above do not constitute a limitation on the scope of protection of this invention. Those skilled in the art should understand that various modifications, combinations, sub-combinations, and substitutions can be made according to design requirements and other factors. Any modifications, equivalent substitutions, and improvements made within the spirit and principles of this invention should be included within the scope of protection of this invention.

Claims

1. A method for identifying high-risk links in a PCB, characterized in that, The PCB includes at least one drill strip, the drill strip includes at least one via, the via penetrates at least one metal layer and at least one insulating layer, each link includes at least one of the drill strips, and the method for determining the high-risk link includes: Obtain the design parameters of the PCB; the design parameters include drill strip information and the location information of the vias; Based on the borehole information, determine the initial value of each of the through holes; Based on the position information of each through hole and the initial value of each through hole, determine the correction value of each through hole; Based on the correction value of each of the aforementioned vias, the link value of each of the aforementioned links is determined; Based on the link value of each link, high-risk links in the PCB are identified; The borehole zone information includes the starting layer and the ending layer of the borehole zone; Based on the borehole information, the initial values ​​of each of the through holes are determined, including: Based on the information of each borehole zone, each borehole zone is sorted by its starting layer, and the portion of borehole zones with the same starting layer is sorted by its ending layer to determine the sequence number of each borehole zone. According to the arrangement sequence number of each drilled zone, each through hole in each drilled zone is assigned a decimal value to determine the initial value of each through hole. Based on the position information of each via and the initial value of each via, a correction value for each via is determined, including: Based on the position information of each of the through holes, each of the through holes whose vertical distance is less than a preset distance is determined as a group of through holes; The sum of the initial values ​​of each of the vias within the same via group is determined as the correction value of each of the vias in the via group. The correction value of each via is a decimal number; based on the correction value of each via, the link value of each link is determined, including: Based on the correction value of each via, the correction value of each via is converted into a binary correction value, and the binary correction value is determined as the link value of the link. Based on the link values ​​of each of the aforementioned links, high-risk links in the PCB are identified, including: Based on the link value of each link, the link containing the most boreholes is determined as the highest risk link. The link with the most boreholes among the links that contain boreholes not included in the highest-risk link is identified as the second-highest-risk link. The high-risk links include the highest-risk link and the second-highest-risk link.

2. The method for determining high-risk links according to claim 1, characterized in that, According to the arrangement sequence number of each drilled zone, each through hole in each drilled zone is assigned a decimal value, including: Based on the sequence number of each borehole zone, determine the exponent of the exponential function corresponding to each borehole zone; Based on the exponent of the exponential function corresponding to each of the drilled zones, the decimal value of each of the through holes in each of the drilled zones is determined as an exponential function with base 2.

3. The method for determining high-risk links according to claim 1, characterized in that, After determining the high-risk links in the PCB based on the link values ​​of each of the aforementioned links, the method further includes: Based on the link value of each high-risk link, determine the number of boreholes in each high-risk link; The high-risk links are sorted according to the number of boreholes. The high-risk links, after being sorted, are subjected to reliability testing according to the set rules.

4. A device for identifying high-risk links in a PCB, characterized in that, A method for determining high-risk links in a PCB according to any one of claims 1-3, wherein the PCB includes multiple links, each link includes at least one drill strip, the drill strip includes at least one via, the via penetrating at least one metal layer and at least one insulating layer, and the high-risk link determination device includes: The information acquisition module is used to acquire the design parameters of the PCB; the design parameters include drill strip information and the location information of the vias; An initial value determination module is used to determine the initial value of each of the through holes based on the borehole information; The correction value determination module is used to determine the correction value of each of the through holes based on the position information of each of the through holes and the initial value of each of the through holes; The link value determination module is used to determine the link value of each link based on the correction value of each of the vias; The high-risk link determination module is used to determine the high-risk links in the PCB based on the link values ​​of each link.

5. A computer-readable storage medium, characterized in that, The computer-readable storage medium stores computer instructions that, when executed by a processor, implement the method for determining high-risk links in a PCB as described in any one of claims 1-3.

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