A plating method, a plating shower head, and a plating apparatus

Abstract

The application discloses a plating method, a plating nozzle and a plating device, and relates to the technical field of silicon wafer plating. The plating liquid is limited to a plating area by an insulating liquid in a flowing state and is taken away after plating, so that the use amount of the insulating liquid is reduced, cost is saved, and the plated plating liquid is conveniently discharged. The plating method comprises the following steps: forming the insulating liquid in the flowing state on a plating area on the surface of a to-be-plated piece; spraying the plating liquid to the plating area; the plating liquid and the insulating liquid reach the plating area at the same time or the insulating liquid reaches the plating area earlier than the plating liquid; the insulating liquid and the plating liquid are immiscible or slightly soluble; the plating liquid is limited to the plating area by the insulating liquid in the flowing state, and the plating liquid is taken away after plating. The plating device comprises a plating nozzle, an insulating liquid supply mechanism and a plating liquid supply mechanism, or the plating device comprises an insulating liquid nozzle, a plating liquid nozzle, an insulating liquid supply mechanism and a plating liquid supply mechanism.

Description

Technical Field

[0001] This invention relates to the field of silicon wafer coating technology, and more particularly to a coating method, a coating nozzle, and a coating apparatus. Background Technology

[0002] When patterning solar cell grid lines, it is necessary to define the coating area and protect the film layer in other areas from corrosion by the coating solution.

[0003] In existing technologies, the silicon wafer to be plated is typically placed in a plating tank filled with insulating liquid. The wafer is immersed in the liquid, which remains stationary. A spray nozzle is then moved to spray the plating liquid onto the area to be plated. The insulating liquid confines the plating area, preventing it from spreading to unplated areas. However, this method requires the plating tank to be completely filled with insulating liquid, resulting in a large volume and increased costs. Furthermore, the mixture of plating liquid and insulating liquid produced after plating is difficult to drain, potentially affecting the plated area. Summary of the Invention

[0004] The purpose of this invention is to provide a plating method, a plating nozzle, and a plating apparatus, which use a flowing insulating liquid to confine the plating liquid to the area to be plating and remove the plating liquid after plating, thereby reducing the amount of insulating liquid used, saving costs, and facilitating the discharge of the plating liquid after plating.

[0005] To achieve the above objectives, in a first aspect, the present invention provides a plating method, comprising:

[0006] An insulating liquid in a flowing state is formed on the area to be plated on the surface of the part to be plated;

[0007] The plating solution is sprayed onto the area to be plated. The plating solution and the insulating solution arrive at the area to be plated simultaneously or the insulating solution arrives at the area to be plated earlier than the plating solution. The insulating solution and the plating solution are immiscible or only slightly soluble. The plating solution is confined to the area to be plated by the flowing insulating solution and carries away the plating solution after plating.

[0008] When using the above technical solution, a flowing insulating liquid can be formed only in and around the area to be plated on the surface of the workpiece. The plating solution and the insulating liquid arrive at the area to be plated simultaneously, or the insulating liquid arrives at the area to be plated earlier than the plating solution, avoiding plating solution diffusion. The flowing insulating liquid confines the plating solution to the area to be plated, preventing it from diffusing to non-plating areas. This ensures that the plating solution only contacts the area to be plated and achieves electrodeposition, preventing corrosion of non-plating areas by the plating solution. This achieves confined plating while protecting the surface of the workpiece. After the plating solution contacts the area to be plated, the plating ions in the plating solution cannot be completely plated onto the area, leaving some plating solution remaining. The flowing insulating liquid can carry away the plating solution after plating, thus discharging it. Since the insulating liquid and the plating solution are immiscible, they can separate into layers after plating, preventing the plating solution from contacting the workpiece. Furthermore, even if the insulating liquid and the plating solution are only slightly soluble, the flowing insulating liquid can dilute the plating solution, reducing its concentration. The diluted plating solution will not be deposited on the surface of the workpiece, and the plating solution will not damage the surface. Compared to existing technologies that require a plating tank filled with insulating liquid, the plating method provided in this application can form a flowing insulating liquid only in and around the plating area on the surface of the workpiece, eliminating the need for a large amount of insulating liquid, reducing costs. The flowing insulating liquid also accelerates the drainage of the plating solution after plating.

[0009] In one possible implementation, forming a flowing insulating liquid on the area to be plated on the surface of the workpiece includes: spraying the insulating liquid onto the surface of the workpiece in one or more directions to form a flowing insulating liquid on the area to be plated.

[0010] When using the above technical solution, insulating liquid can be sprayed onto the surface of the workpiece from one or more directions. The spraying direction of the insulating liquid is not limited and can be selected and set according to the actual situation.

[0011] In one possible implementation, the direction of the spraying of the insulating liquid is the same as the direction of the spraying of the plating liquid, the sprayed insulating liquid surrounds the outside of the sprayed plating liquid, and the boundary of the sprayed insulating liquid and the sprayed plating liquid are in contact.

[0012] When the above technical solution is adopted, during the spraying process of the insulating liquid and the plating liquid, the insulating liquid surrounds the plating liquid, so that when the plating liquid is sprayed to the area to be plated, the insulating liquid can better confine the plating liquid to the area to be plated, and avoid the plating liquid from spreading.

[0013] In one possible implementation, the injection pressure of the insulating liquid is greater than or equal to the injection pressure of the plating liquid.

[0014] When the above technical solution is adopted, the spraying pressure of the plating liquid is relatively small, which avoids the plating liquid from breaking through the surrounding of the insulating liquid and spreading and splashing to the non-plating area during the spraying process. At the same time, the spraying pressure of the insulating liquid is relatively large, which not only helps to increase the area of ​​the surface of the workpiece to be plated covered by the insulating liquid to prevent the plating liquid from contacting the non-plating area, but also makes it easier to remove the plating liquid after plating.

[0015] In one possible implementation, the direction of the insulating liquid spray is different from that of the plating liquid spray, and the sprayed insulating liquid and the sprayed plating liquid do not intersect. The sprayed shape of the insulating liquid is columnar or curtain-like.

[0016] When the above technical solution is adopted, the spraying direction and spraying method of insulating liquid and plating liquid are enriched, which makes it easier to select and set according to the actual situation.

[0017] In one possible implementation, the flow rate of the insulating liquid across the surface of the workpiece is greater than or equal to the flow rate of the plating liquid across the surface of the workpiece.

[0018] When the above technical solution is adopted, it is convenient for the insulating liquid to confine the plating liquid to the area to be plated, and at the same time, it is beneficial for the insulating liquid to carry away the plating liquid after plating.

[0019] In one possible implementation, when the density of the insulating liquid is greater than that of the plating liquid, spraying the plating liquid onto the area to be plated includes: spraying the plating liquid onto the area to be plated from above the surface of the part to be plated;

[0020] Spraying insulating liquid onto the surface of a workpiece in one or more directions includes: spraying the insulating liquid onto the surface of the workpiece from above.

[0021] When using the above technical solution, the insulating liquid and plating liquid are sprayed onto the surface of the workpiece from above. Due to the spray pressure, the insulating liquid, upon contact with the surface, flows and spreads over the plating area, creating a confined area for the plating liquid. Subsequently, because the insulating liquid and plating liquid are immiscible or only slightly soluble, and the density of the insulating liquid is greater than that of the plating liquid, after plating, as the insulating liquid carries away the plating liquid, the two liquids will separate into layers. The insulating liquid will be located below the plating liquid, and it will directly contact the surface of the workpiece, preventing the plating liquid from contacting and corroding the surface. Furthermore, this reduces the likelihood of the plating liquid damaging non-plating areas.

[0022] In one possible implementation, when the density of the insulating liquid is less than that of the plating liquid, spraying the plating liquid onto the area to be plated includes: spraying the plating liquid onto the area to be plated from below the surface of the part to be plated;

[0023] Spraying insulating liquid onto the surface of a workpiece in one or more directions includes: spraying the insulating liquid onto the surface of the workpiece from below.

[0024] When using the above technical solution, the insulating liquid and plating liquid are sprayed onto the surface of the workpiece from below. Due to the spray pressure, the insulating liquid, upon contact with the surface, flows and spreads over the plating area, creating a confined space for the plating liquid. Subsequently, because the insulating liquid and plating liquid are immiscible or only slightly soluble, and the density of the insulating liquid is lower than that of the plating liquid, after plating, as the insulating liquid carries away the plating liquid, the two liquids will separate into layers. The insulating liquid will be on top of the plating liquid, directly contacting the surface of the workpiece, thus preventing the plating liquid from contacting and corroding the surface. Furthermore, this reduces the likelihood of the plating liquid damaging non-plating areas.

[0025] In one possible implementation, the insulating liquid includes at least one of halogen atoms, ester groups, hydrocarbon groups, and hydroxyl groups.

[0026] When the above technical solutions are adopted, all of the above materials are immiscible or only slightly soluble with the plating solution, which enriches the types of insulating liquids and makes it easier to select according to actual conditions.

[0027] In one possible implementation, the wettability between the insulating liquid and the surface of the workpiece to be plated is greater than that between the plating liquid and the surface of the workpiece to be plated.

[0028] When the above technical solution is adopted, the insulating liquid phase is more likely to adhere to the surface of the part to be plated than the plating liquid, which is beneficial to confine the plating liquid to the area to be plated.

[0029] In one possible implementation, the plating method includes electroplating, photo-induced plating, or field-induced plating.

[0030] In one possible implementation, the process of confining the plating liquid to the area to be plated by the flowing insulating liquid and carrying away the plated plating liquid also includes: supplying an airflow to the plated plating liquid to guide it away from the area to be plated.

[0031] When the above technical solution is adopted, the airflow setting can not only accelerate the flow speed of the plating liquid after plating and cause the plating liquid to leave the area to be plating, but also control the flow direction of the plating liquid. On the one hand, it can prevent the plating liquid from flowing to the non-plating area, and on the other hand, it facilitates the collection of insulating liquid and plating liquid. Another function of the airflow is the rear end of the travel direction. Since the plating liquid will stick to the nozzle and cause a trailing phenomenon, resulting in inaccurate plating shape, the airflow can quickly cut off the plating liquid trailing.

[0032] Secondly, the present invention provides a plating nozzle for plating a workpiece using the plating method described in the first aspect or any possible implementation thereof. The plating nozzle has a plating liquid channel and an insulating liquid channel. The plating liquid channel is used to spray plating liquid into the area to be plating, and the insulating liquid channel is used to spray insulating liquid onto the surface of the workpiece. A positive electrode is disposed within the plating liquid channel.

[0033] When the above technical solution is adopted, the insulating liquid channel can receive the insulating liquid and spray it onto the surface of the part to be plated, so that the insulating liquid forms a flow state on the plated area of ​​the part surface, ensuring that the insulating liquid confines the plating liquid to the plated area and carries away the plating liquid after plating. The plating liquid channel can receive the plating liquid and spray it onto the plated area to achieve plating in the plated area.

[0034] In one possible implementation, the plating nozzle includes an inner cylinder and an outer cylinder. The inner cylinder has a plating liquid channel for receiving the plating liquid and spraying it onto the area to be plating. The outer cylinder is fitted outside the inner cylinder, and an insulating liquid channel is formed between the inner wall of the outer cylinder and the outer wall of the inner cylinder for receiving insulating liquid and spraying it onto the surface of the workpiece to be plating.

[0035] When the above technical solution is adopted, the spraying direction of the insulating liquid is the same as the spraying direction of the plating liquid, and the insulating liquid surrounds the plating liquid, so that when the plating liquid is sprayed to the area to be plated, the insulating liquid can better confine the plating liquid to the area to be plated, and avoid the plating liquid from spreading.

[0036] In one possible implementation, a notch is provided on the side wall of the outer cylinder near the part to be plated.

[0037] When the above technical solution is adopted, the plating nozzle can be moved in the opposite direction of the notch relative to the workpiece to be plated. This not only facilitates the insulation liquid to surround the plating liquid, but the notch also has a liquid guiding function, allowing the insulation liquid and plating liquid to have a certain space to drain out and not accumulate under the plating nozzle. At the same time, it controls the mixture of insulation liquid and plating liquid to drain out along the notch position and not spread arbitrarily.

[0038] In one possible implementation, the inner and outer cylinders are eccentrically positioned, with the axis of the inner cylinder located inside the outer cylinder on the side near the notch.

[0039] When the above technical solution is adopted, during the plating process, the flow rate of insulating liquid is greater on the side of the insulating liquid channel away from the notch, which not only makes it easier for the insulating liquid to surround the plating liquid and better confine the plating liquid in the plating area, but also makes it easier for the insulating liquid to carry away the plating liquid after plating.

[0040] In one possible implementation, multiple baffles are provided between the inner wall of the outer cylinder and the outer wall of the inner cylinder. The multiple baffles are arranged along the circumference of the inner cylinder to form multiple insulating liquid channels; and the baffles and notches are staggered.

[0041] When the above technical solution is adopted, multiple insulating liquid channels can spray insulating liquid from different directions, confining the plating liquid to the area to be plated from multiple angles, resulting in better encapsulation of the plating liquid.

[0042] In one possible implementation, the spray end face of the coating nozzle has an acute angle with the axis of the coating nozzle.

[0043] When the above technical solution is adopted, the spray end face of the plating nozzle is inclined, which allows the plating nozzle to move in the opposite direction of the inclined direction of the inclined surface relative to the workpiece to be plated. This facilitates the insulating liquid to surround the plating liquid and also helps the insulating liquid to carry away the plating liquid after plating.

[0044] Thirdly, the present invention also provides a plating apparatus, including a plating nozzle as described in the second aspect or any possible implementation thereof, and further including an insulating liquid supply mechanism and a plating liquid supply mechanism. The insulating liquid supply mechanism is connected to an insulating liquid channel and is used to supply insulating liquid to the plating nozzle. The plating liquid supply mechanism is connected to a plating liquid channel and is used to supply plating liquid to the plating nozzle.

[0045] When the above technical solution is adopted, the plating device has the same beneficial effects as the second aspect, which will not be repeated here.

[0046] In one possible implementation, the plating apparatus further includes an air blowing mechanism for delivering an airflow to the plating solution after plating, so as to drive the plating solution after plating away from the area to be plated.

[0047] When the above technical solution is adopted, the setting of the air blowing mechanism can not only accelerate the flow speed of the plating liquid after plating and cause the plating liquid to leave the area to be plated, but also control the flow direction of the plating liquid. On the one hand, it can prevent the plating liquid from flowing to the non-plating area, and on the other hand, it facilitates the collection of insulating liquid and plating liquid. In addition, another function of the airflow of the blowing mechanism is to quickly cut off the plating liquid tail at the rear end of the travel direction, since the plating liquid will stick to the plating nozzle and cause a trailing phenomenon, resulting in inaccurate plating shape.

[0048] Fourthly, the present invention provides a plating apparatus for plating a workpiece using the plating method described in the first aspect or any possible implementation thereof. The plating apparatus includes an insulating liquid nozzle, a plating liquid nozzle, an insulating liquid supply mechanism, and a plating liquid supply mechanism. The insulating liquid nozzle is used to spray insulating liquid onto the surface of the workpiece to be plated. The plating liquid nozzle and the insulating liquid nozzle are independent of each other, and the plating liquid nozzle is used to spray plating liquid onto the area to be plated. The insulating liquid supply mechanism is connected to the insulating liquid nozzle and is used to supply insulating liquid to the insulating liquid nozzle. The plating liquid supply mechanism is connected to the plating liquid nozzle and is used to supply plating liquid to the plating liquid nozzle.

[0049] When employing the above technical solution, the insulating liquid nozzle can receive the insulating liquid and spray it onto the surface of the workpiece to be plated. The insulating liquid supply mechanism ensures a continuous supply of insulating liquid, guaranteeing sufficient supply and allowing the insulating liquid to flow in the plating area on the workpiece surface. This ensures that the insulating liquid confines the plating liquid within the plating area and carries away the plating liquid after plating. The plating liquid nozzle can receive the plating liquid and spray it onto the plating area to achieve electrodeposition. Furthermore, the plating liquid nozzle and the insulating liquid nozzle are independent of each other. The spray direction of the insulating liquid can be the same as or different from that of the plating liquid. The insulating liquid can be sprayed onto the surface of the workpiece from one or more directions, and the spray direction of the insulating liquid is not limited, allowing for selection and setting according to actual conditions.

[0050] In one possible implementation, the plating apparatus further includes an air blowing mechanism for delivering an airflow to the plating solution after plating, so as to drive the plating solution after plating away from the area to be plated.

[0051] When adopting the above technical solution, the air blowing mechanism not only accelerates the flow rate of the plating solution after plating, causing it to leave the area to be plated, but also controls the flow direction of the plating solution. This prevents the plating solution from flowing into non-plating areas and facilitates the collection of insulating and plating liquids. Furthermore, another function of the airflow from the blowing mechanism is to quickly cut off the plating solution tail at the rear end of its travel direction, as the plating solution can adhere to the spray nozzle, causing a trailing phenomenon and resulting in inaccurate plating shape. Attached Figure Description

[0052] The accompanying drawings, which are included to provide a further understanding of the invention and form part of this invention, illustrate exemplary embodiments of the invention and are used to explain the invention, but do not constitute an undue limitation of the invention. In the drawings:

[0053] Figure 1 This is a step diagram of the plating method provided in an embodiment of the present invention;

[0054] Figure 2A schematic diagram of the plating method provided in an embodiment of the present invention;

[0055] Figure 3 A schematic diagram of the coating nozzle provided in an embodiment of the present invention. Figure 1 ;

[0056] Figure 4 A schematic diagram of the coating nozzle provided in an embodiment of the present invention. Figure 2 ;

[0057] Figure 5 A schematic diagram of the coating nozzle provided in an embodiment of the present invention. Figure 3 ;

[0058] Figure 6 A schematic diagram of the coating nozzle provided in an embodiment of the present invention. Figure 4 .

[0059] Figure label:

[0060] 1-Workpiece to be plated, 2-Plate spray nozzle, 3-Plate spray nozzle, 31-Inner cylinder, 32-Outer cylinder, 321-Notch, 33-Baffle. Detailed Implementation

[0061] To make the technical problems to be solved, the technical solutions, and the beneficial effects of the present invention clearer, the present invention will be further described in detail below with reference to the accompanying drawings and embodiments. It should be understood that the specific embodiments described herein are only used to explain the present invention and are not intended to limit the present invention.

[0062] It should be noted that when a component is referred to as being "fixed to" or "set on" another component, it can be directly on or indirectly on that other component. When a component is referred to as being "connected to" another component, it can be directly connected to or indirectly connected to that other component.

[0063] Furthermore, the terms "first" and "second" are used for descriptive purposes only and should not be construed as indicating or implying relative importance or implicitly specifying the number of indicated technical features. Thus, a feature defined as "first" or "second" may explicitly or implicitly include one or more of that feature. In the description of this invention, "a plurality of" means two or more, unless otherwise explicitly specified. "Several" means one or more, unless otherwise explicitly specified.

[0064] In the description of this invention, it should be understood that the terms "upper", "lower", "front", "rear", "left", "right", etc., indicate the orientation or positional relationship based on the orientation or positional relationship shown in the accompanying drawings. They are only for the convenience of describing this invention and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation. Therefore, they should not be construed as limitations on this invention.

[0065] In the description of this invention, it should be noted that, unless otherwise explicitly specified and limited, the terms "installation," "connection," and "linking" should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral connection; they can refer to a mechanical connection or an electrical connection; they can refer to a direct connection or an indirect connection through an intermediate medium; they can refer to the internal communication of two components or the interaction between two components. Those skilled in the art can understand the specific meaning of the above terms in this invention according to the specific circumstances.

[0066] See Figure 1 As shown, an embodiment of the present invention provides a plating method, including the following steps:

[0067] Step S1: An insulating liquid in a flowing state is formed on the area to be plated on the surface of the workpiece 1.

[0068] In practice, insulating liquid can be sprayed onto the surface of the workpiece 1 in one or more directions to form a flowing insulating liquid on the area to be plated. The spraying direction of the insulating liquid is not limited and can be selected and set according to the actual situation. One or more types of insulating liquid can be used, and one or more insulating liquids can reach the surface of the workpiece 1 simultaneously from different directions at a certain flow rate.

[0069] Step S2: The plating solution is sprayed onto the area to be plated. The plating solution and the insulating liquid arrive at the area to be plated simultaneously or the insulating liquid arrives at the area to be plated earlier than the plating solution. The insulating liquid and the plating solution are immiscible or slightly soluble. The plating solution is confined to the area to be plated by the flowing insulating liquid and the plating solution after plating is carried away.

[0070] In practice, the plating solution and the insulating liquid can arrive at the area to be plated simultaneously, so that the insulating liquid can confine the plating solution to the area to be plated. Of course, the insulating liquid can also arrive at the area to be plated earlier than the plating liquid, so that a flowing state of insulating liquid is formed on the surface of the part to be plated 1 beforehand. Then, when the plating liquid is sprayed onto the area to be plated, the flowing state of the insulating liquid can confine the plating liquid to the area to be plated.

[0071] In this way, a flowing insulating liquid can be formed only in and around the area to be plated on the surface of the workpiece. The flowing insulating liquid confines the plating solution to the area to be plated, preventing it from spreading to non-plating areas. This ensures that the plating solution only contacts the area to be plated and achieves electrodeposition, avoiding corrosion of non-plating areas by the plating solution. This confined plating process protects the surface of the workpiece 1. After the plating solution contacts the area to be plated, the plating ions in the plating solution cannot be completely plated onto the area, leaving some plating solution remaining. The flowing insulating liquid can carry away the remaining plating solution, thus draining it out. Since the insulating liquid and the plating solution are immiscible, they can separate after plating, preventing the plating solution from contacting the workpiece 1. Furthermore, even if the insulating liquid and the plating solution are slightly soluble, the flowing insulating liquid can dilute the plating solution, reducing its concentration. The diluted plating solution will not be plated onto the surface of the workpiece, and the plating solution will not damage the surface of the workpiece 1. Compared to the prior art which requires a plating tank filled with insulating liquid, the plating method provided in this application can form a flowing insulating liquid only in and around the plating area on the surface of the workpiece, without the need for a large amount of insulating liquid, thus reducing costs. Furthermore, the flowing insulating liquid can accelerate the discharge of the plating liquid after plating.

[0072] During plating, the workpiece 1 to be plated is connected to the cathode of the power supply. A plating solution nozzle 2 with a built-in anode can be installed near the surface of the workpiece 1. When the plating solution is sprayed onto the plating area on the surface of the workpiece 1, one or more insulating liquids that are immiscible or slightly soluble with the plating solution reach the plating area from different directions at a certain flow rate, confining the plating solution within the plating area. See [link to documentation]. Figure 2 As shown, the diffusion of the plating solution is restricted, so that the plating solution only contacts the surface of the workpiece 1 at the position through which the plating solution nozzle 2 passes and completes electrodeposition, thereby achieving localized plating.

[0073] The plating method in this application includes electroplating, photo-induced plating, or field-induced plating. As long as the plating of the gate electrode can be achieved, it can be applied to the plating method in this application.

[0074] In one possible implementation, the spraying direction of the insulating liquid is the same as that of the plating liquid. The sprayed insulating liquid surrounds the sprayed plating liquid, and the boundaries of the sprayed insulating liquid and the sprayed plating liquid are in contact. In this way, during the spraying process of the insulating liquid and the plating liquid, the insulating liquid surrounds the plating liquid, so that when the plating liquid is sprayed onto the area to be plated, the insulating liquid can better confine the plating liquid to the area to be plated, avoiding the diffusion of the plating liquid.

[0075] In one example, the spray pressure of the insulating liquid is greater than or equal to the spray pressure of the plating liquid. In this case, the spray pressure of the plating liquid is lower, which prevents the plating liquid from breaking through the enclosure of the insulating liquid and spreading and splashing into the non-plating area during the spraying process. At the same time, the spray pressure of the insulating liquid is higher, which not only helps to increase the area of ​​the surface of the workpiece 1 covered by the insulating liquid to prevent the plating liquid from contacting the non-plating area, but also facilitates the flow away of the plating liquid after plating.

[0076] In some embodiments, the spray direction of the insulating liquid is different from that of the plating liquid, and the sprayed insulating liquid and the sprayed plating liquid do not intersect. The spray shape of the insulating liquid is columnar or curtain-like. This enriches the spray direction and spray method of the insulating liquid and plating liquid, making it convenient to select and set according to actual conditions.

[0077] In one alternative, the flow rate of the insulating liquid on the surface of the workpiece 1 is greater than or equal to the flow rate of the plating liquid on the surface of the workpiece 1, so that the insulating liquid can surround and confine the plating liquid to the area to be plated, while also facilitating the insulating liquid to carry away the plating liquid after plating.

[0078] As an example, when the density of the insulating liquid is greater than that of the plating liquid, spraying the plating liquid onto the area to be plated includes: spraying the plating liquid onto the area to be plated from above the surface of the part to be plated 1. Spraying the insulating liquid onto the surface of the part to be plated 1 in one or more directions includes: spraying the insulating liquid onto the surface of the part to be plated 1 from above the surface of the part to be plated 1. In this way, when the insulating liquid and the plating liquid are sprayed onto the surface of the part to be plated 1 from above the surface of the part to be plated 1, due to the spray pressure, the insulating liquid, after contacting the surface of the part to be plated, flows and spreads over the area to be plated, forming a confinement effect on the plating liquid. Subsequently, since the insulating liquid and the plating liquid are immiscible or slightly soluble, and the density of the insulating liquid is greater than that of the plating liquid, after plating, as the flowing insulating liquid carries away the plating liquid, the insulating liquid and the plating liquid will separate into layers, with the insulating liquid located below the plating liquid. The insulating liquid is in direct contact with the surface of the part to be plated 1, avoiding contact between the plating liquid and the surface of the part to be plated 1, thus preventing corrosion of the surface of the part to be plated 1. Furthermore, it reduces the occurrence of plating solutions damaging non-plating areas.

[0079] As another example, when the density of the insulating liquid is less than that of the plating liquid, spraying the plating liquid onto the area to be plated includes: spraying the plating liquid onto the area to be plated from below the surface of the part to be plated 1. Spraying the insulating liquid onto the surface of the part to be plated 1 in one or more directions includes: spraying the insulating liquid onto the surface of the part to be plated 1 from below the surface of the part to be plated 1. In this way, when the insulating liquid and the plating liquid are sprayed onto the surface of the part to be plated 1 from below the surface of the part to be plated 1, due to the spray pressure, the insulating liquid, after contacting the surface of the part to be plated, flows and spreads over the area to be plated, forming a confinement effect on the plating liquid. Subsequently, since the insulating liquid and the plating liquid are immiscible or only slightly soluble, and the density of the insulating liquid is less than that of the plating liquid, after plating, as the insulating liquid carries away the plating liquid, the insulating liquid and the plating liquid will separate into layers, with the insulating liquid above the plating liquid. The insulating liquid is in direct contact with the surface of the part to be plated 1, avoiding contact between the plating liquid and the surface of the part to be plated 1, thus preventing corrosion of the surface of the part to be plated 1. Furthermore, it avoids the phenomenon of plating solution damaging non-plating areas.

[0080] Therefore, in practice, the relative positions of the surface of the workpiece to be plated and the nozzle can be set according to the density of the insulating liquid and the plating liquid, so that the insulating liquid and the plating liquid can be layered in different ways.

[0081] In one possible implementation, the insulating liquid includes at least one of halogen atoms, ester groups, hydrocarbon groups, and hydroxyl groups, all of which are immiscible or slightly soluble in the plating solution. This enriches the variety of insulating liquids, facilitating selection based on specific requirements. Specifically, the insulating liquid is immiscible or slightly soluble in the plating solution, does not react with additives in the plating solution, and should have good fluidity. For example, the insulating liquid can be a halogen-containing hydride, carbon tetrachloride, etc. Exemplarily, the insulating liquid can be chloroform, carbon tetrachloride, n-butanol, bromobenzene, or chlorobenzene. Of course, this is merely illustrative and not intended as a specific limitation.

[0082] In one possible implementation, the wettability between the insulating liquid and the surface of the workpiece 1 is greater than that between the plating liquid and the surface of the workpiece 1. In this case, the insulating liquid adheres more easily to the surface of the workpiece 1 than the plating liquid, which helps to confine the plating liquid within the plating area. Wettability is typically expressed by the contact angle, which generally refers to the smallest angle formed between the liquid surface and the object surface. Generally, a larger contact angle indicates better wettability. Further, the contact angle between the insulating liquid and the surface of the workpiece 1 is 0°-35°. For example, the contact angle between the insulating liquid and the surface of the workpiece 1 can be 0°, 5°, 8°, 10°, 15°, 18°, 20°, 25°, 30°, 32°, 35°, etc.

[0083] In one possible implementation, step S2, while confining the plating liquid to the area to be plated by the flowing insulating liquid and carrying away the plated liquid, also includes: supplying airflow to the plated liquid to guide it away from the area to be plated. Here, the airflow not only accelerates the flow rate of the plated liquid, causing it to leave the area to be plated, but also controls its flow direction. This prevents the liquid from flowing into non-plated areas and facilitates the collection of both the insulating liquid and the plating liquid. Furthermore, another function of the airflow is to quickly cut off the plating liquid tail at the rear end of its travel direction, as the plating liquid tends to adhere to the nozzle, causing a trailing effect and resulting in inaccurate plating shape.

[0084] In addition to the above, this embodiment of the invention also provides a plating nozzle 3, which is used to plating the workpiece 1 to be plated using the above-described plating method. In one example, the plating nozzle 3 provided in this embodiment of the invention has a plating liquid channel and an insulating liquid channel. The plating liquid channel is used to spray plating liquid onto the area to be plated, and the insulating liquid channel is used to spray insulating liquid onto the surface of the workpiece 1 to be plated. A positive electrode is provided in the plating liquid channel.

[0085] When using the above technical solution, the insulating liquid channel can receive the insulating liquid and spray it onto the surface of the workpiece 1 to be plated, so that the insulating liquid forms a flow state on the plated area of ​​the workpiece 1, ensuring that the insulating liquid confines the plating liquid to the plated area and carries away the plating liquid after plating. The plating liquid channel can receive the plating liquid and spray it onto the plated area to achieve plating in the plated area. In specific implementation, the flow rates of the plating liquid and the insulating liquid can be adjusted independently to facilitate setting according to actual conditions.

[0086] See Figure 3 As shown, the plating nozzle 3 includes an inner cylinder 31 and an outer cylinder 32. The inner cylinder 31 has a plating liquid channel for receiving the plating liquid and spraying it onto the area to be plated. The outer cylinder 32 is sleeved outside the inner cylinder 31, and an insulating liquid channel is formed between the inner wall of the outer cylinder 32 and the outer wall of the inner cylinder 31 for receiving insulating liquid and spraying it onto the surface of the workpiece 1 to be plated. Thus, the spray direction of the insulating liquid is the same as the spray direction of the plating liquid, and the insulating liquid surrounds the plating liquid. This ensures that when the plating liquid is sprayed onto the area to be plated, the insulating liquid effectively confines the plating liquid to the area to be plated, preventing the plating liquid from spreading.

[0087] See Figures 3 to 5As shown, a notch 321 can be formed on the side wall of the outer cylinder 32 near the part to be plated 1. In specific implementation, the plating nozzle 3 can be moved in the opposite direction of the notch 321 relative to the part to be plated. This not only facilitates the insulating liquid to surround the plating liquid, but also allows the insulating liquid to carry away the plating liquid after plating from the notch 321. The notch 321 has a liquid guiding function, allowing the insulating liquid and plating liquid to have some space to drain out, preventing accumulation below the plating nozzle 3, and controlling the mixture of insulating liquid and plating liquid to drain out along the notch 321, preventing arbitrary diffusion. Specifically, as shown... Figure 3 and Figure 4 As shown, a portion of the sidewall of the outer cylinder 32 of the coating nozzle 3 can be cut off from the end of the outer cylinder 32 closest to the workpiece 1 along the axis of the coating nozzle 3 to form a rectangular notch. Alternatively, a conical notch can also be formed; see [reference needed]. Figure 5 As shown.

[0088] Meanwhile, the inner cylinder 31 and the outer cylinder 32 are eccentrically arranged, with the axis of the inner cylinder 31 located on the side of the outer cylinder 32 closer to the notch 321. Thus, in actual situations, during the plating process when the plating nozzle 3 moves relative to the workpiece 1 in the opposite direction of the notch, the flow rate of the insulating liquid on the side of the insulating liquid channel away from the notch is greater. This not only facilitates the insulating liquid to surround the plating liquid and better confine the plating liquid in the plating area, but also helps the insulating liquid to carry away the plating liquid after plating.

[0089] See Figure 4 As shown, multiple baffles 33 are provided between the inner wall of the outer cylinder 32 and the outer wall of the inner cylinder 31. These baffles 33 are arranged circumferentially along the inner cylinder 31 to form multiple insulating liquid channels, and the baffles 33 are staggered with the notch 321. Multiple insulating liquid channels can spray insulating liquid from different directions, allowing for zoned control and different flow rates and pressures. This confines the plating liquid to the area to be plated from multiple directions. A higher pressure insulating liquid can be introduced into the insulating liquid channel opposite the notch, enabling the insulating liquid to push the waste liquid after plating out through the notch 321, resulting in better encapsulation of the plating liquid. It should be noted that the baffles 33 and the notch 321 are staggered, meaning they do not overlap, and the baffles 33 are positioned away from the notch 321. The number of baffles 33 can be two, three, or more; no specific limit is imposed here.

[0090] As an optional example, see Figure 6As shown, the spray end face of the plating nozzle 3 has an acute angle with its axis, making the spray end face of the plating nozzle 3 an inclined surface. In specific implementation, the plating nozzle 3 can be moved relative to the workpiece in the opposite direction of the inclined surface, which facilitates the insulating liquid to surround the plating liquid and also facilitates the insulating liquid to carry away the plating liquid after plating. In addition, in this embodiment, the inner cylinder 31 can be eccentrically arranged with the outer cylinder 32, and the axis of the inner cylinder 31 is located on one side of the inclined surface of the outer cylinder 32.

[0091] In actual plating, the distance between the plating nozzle 3 and the surface of the workpiece 1 to be plated can be 0.001mm-10mm. For example, the distance between the plating nozzle 3 and the surface of the workpiece 1 to be plated can be 0.001mm, 0.01mm, 0.05mm, 0.1mm, 0.6mm, 1mm, 2mm, 5mm, 8mm, 10mm, etc. The plating liquid and the insulating liquid can be sprayed simultaneously from the plating nozzle 3. The plating liquid contacts the surface of the workpiece 1 to be plated, while the insulating liquid on the outer layer of the plating liquid encapsulates the plating liquid. Under the constraint of the outer insulating liquid, only the plating liquid at the location of the plating nozzle 3 contacts the surface of the workpiece 1 to be plated, completing the confined plating. The axis of the plating nozzle 3 can form any angle with the surface of the workpiece 1 to be plated, and the plating nozzle 3 and the workpiece 1 to be plated can move relative to each other to complete the patterning. It should be noted that the workpiece 1 to be plated in this embodiment of the invention can be a silicon wafer.

[0092] Based on the plating nozzle 3 described in any of the above embodiments, this invention also provides a plating apparatus, including the plating nozzle 3 as described in any of the above embodiments. The plating apparatus further includes an insulating liquid supply mechanism and a plating liquid supply mechanism. The insulating liquid supply mechanism is connected to an insulating liquid channel and is used to supply insulating liquid to the plating nozzle 3. The plating liquid supply mechanism is connected to the plating liquid channel and is used to supply plating liquid to the plating nozzle 3. The insulating liquid supply mechanism can continuously supply insulating liquid, ensuring a sufficient supply of insulating liquid.

[0093] The coating device has the same beneficial effects as the coating nozzle 3, which will not be described in detail here.

[0094] In one possible implementation, the plating apparatus further includes an air-blowing mechanism for delivering airflow to the plating solution after plating, thereby propelling the plating solution away from the area to be plated. Thus, the air-blowing mechanism not only accelerates the flow rate of the plating solution after plating, causing it to leave the area to be plated, but also controls the flow direction of the plating solution. This prevents the plating solution from flowing into non-plating areas and facilitates the collection of insulating and plating liquids. The air-blowing mechanism can be located on the same side of the workpiece to be plated as the plating nozzle 3. The air-blowing mechanism can be an air gun, but it is not limited to this. The air gun blows air to propel the plating solution away from the area to be plated. Additionally, another function of the airflow from the air-blowing mechanism is to control the rear end of the travel direction. Since the plating solution adheres to the plating nozzle 3, causing a trailing phenomenon and resulting in inaccurate plating shape, the airflow can quickly cut off the plating solution trail.

[0095] In another example, the plating apparatus provided in this embodiment of the invention includes an insulating liquid nozzle, a plating liquid nozzle, an insulating liquid supply mechanism, and a plating liquid supply mechanism. The insulating liquid nozzle is used to spray insulating liquid onto the surface of the workpiece 1 to be plated. The plating liquid nozzle is independent of the insulating liquid nozzle and is used to spray plating liquid onto the area to be plated. The insulating liquid supply mechanism is connected to the insulating liquid nozzle and is used to supply insulating liquid to the insulating liquid nozzle. The plating liquid supply mechanism is also connected to the plating liquid nozzle and is used to supply plating liquid to the plating liquid nozzle.

[0096] When the above technical solution is adopted, the insulating liquid nozzle can receive the insulating liquid and spray it onto the surface of the workpiece 1 to be plated. The insulating liquid supply mechanism can continuously supply the insulating liquid, ensuring a sufficient supply and allowing the insulating liquid to flow in the area to be plated on the surface of the workpiece 1. This ensures that the insulating liquid confines the plating liquid to the area to be plated and carries away the plating liquid after plating. The plating liquid nozzle can receive the plating liquid and spray it onto the area to be plated to achieve electrodeposition in the area to be plated. Furthermore, the plating liquid nozzle and the insulating liquid nozzle are independent of each other. The spray direction of the insulating liquid can be the same as or different from the spray direction of the plating liquid. The insulating liquid can be sprayed onto the surface of the workpiece 1 from one or more directions. See [reference needed]. Figure 2 As shown, the direction of the insulating liquid spray is not limited, which makes it easy to select and set according to the actual situation.

[0097] In one possible implementation, the plating apparatus further includes an air-blowing mechanism for delivering airflow to the plating solution after plating, thereby propelling the plating solution away from the area to be plated. Thus, the air-blowing mechanism not only accelerates the flow rate of the plating solution after plating, causing it to leave the area to be plated, but also controls the flow direction of the plating solution. This prevents the plating solution from flowing into non-plating areas and facilitates the collection of insulating and plating liquids. The air-blowing mechanism can be located on the same side of the workpiece to be plated as the plating solution nozzle. The air-blowing mechanism can be an air gun, which blows air to propel the plating solution away from the area to be plated. Additionally, another function of the airflow from the air-blowing mechanism is to control the rear end of the travel direction. Since the plating solution can adhere to the plating solution nozzle, causing a trailing phenomenon and resulting in inaccurate plating shape, the airflow can quickly cut off the plating solution trail.

[0098] In the description of the above embodiments, specific features, structures, materials, or characteristics may be combined in any suitable manner in one or more embodiments or examples.

[0099] The above are merely specific embodiments of the present invention, but the scope of protection of the present invention is not limited thereto. Any variations or substitutions that can be easily conceived by those skilled in the art within the technical scope disclosed in the present invention should be included within the scope of protection of the present invention. Therefore, the scope of protection of the present invention should be determined by the scope of the claims.

Claims

1. A plating method characterized by, The method comprises: forming an insulating liquid in a flowing state on a plating area on a surface of a plating object; injecting a plating liquid to the plating area, the plating liquid and the insulating liquid reaching the plating area at the same time or the insulating liquid reaching the plating area earlier than the plating liquid, the insulating liquid and the plating liquid being immiscible or slightly miscible, the plating liquid being confined to the plating area by the insulating liquid in the flowing state and being carried away by the insulating liquid after plating; the forming of the insulating liquid in the flowing state on the plating area on the surface of the plating object comprises: injecting the insulating liquid to the surface of the plating object in one or more directions to form the insulating liquid in the flowing state on the plating area; wherein the injection direction of the insulating liquid is the same as the injection direction of the plating liquid, the insulating liquid in injection is outside the plating liquid in injection, and the boundary of the insulating liquid in injection and the plating liquid in injection is connected; or, the injection direction of the insulating liquid is different from the injection direction of the plating liquid, and the insulating liquid in injection and the plating liquid in injection do not intersect, the injection shape of the insulating liquid is columnar or curtain-shaped.

2. The plating method according to claim 1, characterized by, When the injection direction of the insulating liquid is the same as the injection direction of the plating liquid, the injection pressure of the insulating liquid is greater than or equal to the injection pressure of the plating liquid.

3. The plating method according to claim 1, characterized by, When the density of the insulating liquid is greater than the density of the plating liquid, the injecting of the plating liquid to the plating area comprises: injecting the plating liquid to the plating area from above the surface of the plating object; The injecting of the insulating liquid to the surface of the plating object in one or more directions comprises: injecting the insulating liquid to the surface of the plating object from above the surface of the plating object; When the density of the insulating liquid is less than the density of the plating liquid, the injecting of the plating liquid to the plating area comprises: injecting the plating liquid to the plating area from below the surface of the plating object; The injecting of the insulating liquid to the surface of the plating object in one or more directions comprises: injecting the insulating liquid to the surface of the plating object from below the surface of the plating object.

4. The plating method according to claim 1, characterized by, The insulating liquid comprises at least one of halogen atom, ester group, hydrocarbon group and hydroxyl group; and / or, the wettability between the insulating liquid and the surface of the plating object is greater than the wettability between the plating liquid and the surface of the plating object; and / or, the flow rate of the insulating liquid on the surface of the plating object is greater than or equal to the flow rate of the plating liquid on the surface of the plating object; and / or, the plating method comprises electroplating, photo-induced plating or field-induced plating.

5. The plating method according to claim 1, wherein The confining of the plating liquid to the plating area by the insulating liquid in the flowing state and the carrying away of the plating liquid after plating further comprises: delivering a gas flow to the plating liquid after plating, and guiding the plating liquid after plating to leave the plating area by the gas flow.

6. A plating showerhead characterized by, A plating object is plated by using the plating method according to any one of claims 1 to 5; the plating nozzle has a plating liquid channel and an insulating liquid channel, the plating liquid channel is used for injecting a plating liquid to the plating area, and the insulating liquid channel is used for injecting an insulating liquid to the surface of the plating object. The plating liquid channel is provided with a positive electrode.

7. The plating showerhead of claim 6, wherein, The plating nozzle comprises: An inner cylinder having the plating liquid channel for receiving the plating liquid and spraying the plating liquid to the plating area; An outer cylinder sleeved on the inner cylinder, an insulation liquid channel is formed between the inner wall of the outer cylinder and the outer wall of the inner cylinder for receiving the insulation liquid and spraying the insulation liquid to the surface of the plating piece.

8. The plating showerhead of claim 7, wherein, A notch is formed on the side wall of the end of the outer cylinder close to the plating piece.

9. The plating showerhead of claim 8, wherein, The inner cylinder and the outer cylinder are arranged eccentrically, and the axis of the inner cylinder is located on the side of the outer cylinder close to the notch.

10. The plating showerhead of claim 9, wherein, A plurality of partitions are arranged between the inner wall of the outer cylinder and the outer wall of the inner cylinder, the partitions are arranged along the circumference of the inner cylinder for forming a plurality of insulation liquid channels, and the partitions are arranged in a staggered manner with the notch.

11. The plating showerhead of claim 7, wherein, The spray end surface of the plating nozzle and the axis of the plating nozzle have an acute angle.

12. A plating apparatus characterized by comprising: The plating device comprises the plating nozzle as claimed in any one of claims 6-11, and further comprises: An insulation liquid supply mechanism in communication with the insulation liquid channel for providing the plating nozzle with the insulation liquid; A plating liquid supply mechanism in communication with the plating liquid channel for providing the plating nozzle with the plating liquid.

13. The plating apparatus according to claim 12, wherein The plating device further comprises a blowing mechanism for delivering a gas flow to the plating liquid after plating to push the plating liquid after plating to flow away from the plating area.

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