A build-up adhesive film for FC-BGA package carrier containing modified benzocyclobutene, and preparation method and application thereof

Abstract

The invention discloses a build-up adhesive film for an FC-BGA package carrier board containing modified benzocyclobutene, and a preparation method and application thereof. The build-up adhesive film comprises the following components in parts by weight: 45-100 parts of epoxy resin, 40-100 parts of inorganic filler, 25-45 parts of cyanate ester, 40-60 parts of modified benzocyclobutene, 5-10 parts of acrylic resin, 5-10 parts of phenoxy resin, 0.1-1 part of curing accelerator, and 200-300 parts of organic solvent; wherein the modified benzocyclobutene is one or both of phosphorus-containing benzocyclobutene and nitrogen-containing benzocyclobutene. The present invention adds modified benzocyclobutene to the components of epoxy resin, phenoxy resin, cyanate ester, curing accelerator, etc. to adjust the performance. By adding different types of modified benzocyclobutene and combining other raw material components, the build-up adhesive film has excellent dielectric properties, reduces dielectric loss, and has good flame retardant properties, and is better applied to FC-BGA packaging substrates, thereby meeting the needs of high-speed and high-integration development of electronic components.

Description

Technical Field

[0001] The invention relates to the technical field of resin composite materials, and in particular to a build-up adhesive film for an FC-BGA package carrier board containing modified benzocyclobutene, and a preparation method and application thereof. Background Art

[0002] Flip chip ball grid array (FC-BGA) substrate is a high-density packaging substrate that can achieve high-speed and multi-functional chips. With the increase in the wiring density of very large-scale integrated circuits, the resistance of metal interconnects in electronic components and the capacitance of interlayer dielectrics can easily form an RC (resistance-capacitance delay) delay effect, which in turn causes adverse effects such as signal transmission delay and power loss.

[0003] The build-up film is one of the key core materials of the semi-additive manufacturing process SAP of FC-BGA substrates. The insufficient dielectric properties of the build-up film material seriously affect its application in integrated circuits. In addition, the main component of the build-up film is polymer material, which is flammable and releases a large amount of smoke and toxic gases during the combustion process. How to improve the flame retardant properties of polymer materials has also become a key area that the build-up film needs to focus on.

[0004] Therefore, the prior art still needs to be improved and developed. Summary of the invention

[0005] In view of the above-mentioned deficiencies in the prior art, the present invention provides a build-up adhesive film for FC-BGA package carrier containing modified benzocyclobutene and a preparation method and application thereof, so as to solve the problem that the dielectric properties and flame retardant properties of the existing build-up adhesive film cannot meet the requirements.

[0006] The technical solution adopted by the present invention to solve the above technical problems is as follows:

[0007] In a first aspect of the present invention, there is provided a build-up adhesive film for a FC-BGA package carrier board containing modified benzocyclobutene, wherein the build-up adhesive film comprises the following components in parts by weight:

[0008] 45-100 parts of epoxy resin, 40-100 parts of inorganic filler, 25-45 parts of cyanate ester, 40-60 parts of modified benzocyclobutene, 5-10 parts of acrylic resin, 5-10 parts of phenoxy resin, 0.1-1 parts of curing accelerator, and 200-300 parts of organic solvent;

[0009] Wherein, the modified benzocyclobutene is one or both of phosphorus-containing benzocyclobutene and nitrogen-containing benzocyclobutene.

[0010] Preferably, the phosphorus-containing benzocyclobutene is selected from any one or a combination of at least two of phosphorus-containing benzocyclobutene I, phosphorus-containing benzocyclobutene II and phosphorus-containing benzocyclobutene III;

[0011] Wherein, the structural formula of the phosphorus-containing benzocyclobutene I is:

[0012]

[0013] The structural formula of the phosphorus-containing benzocyclobutene II is:

[0014]

[0015] The structural formula of the phosphorus-containing benzocyclobutene III is:

[0016]

[0017] Preferably, the nitrogen-containing benzocyclobutene is selected from any one or a combination of at least two of nitrogen-containing benzocyclobutene I, nitrogen-containing benzocyclobutene II and nitrogen-containing benzocyclobutene III;

[0018] Wherein, the structural formula of the nitrogen-containing benzocyclobutene I is:

[0019]

[0020] The structural formula of the nitrogen-containing benzocyclobutene II is:

[0021]

[0022] The structural formula of the nitrogen-containing benzocyclobutene III is:

[0023]

[0024] Preferably, the epoxy resin is selected from any one or a combination of at least two of bisphenol epoxy resin, biphenyl epoxy resin, naphthalene epoxy resin, naphthol epoxy resin, linear phenolic epoxy resin, dicyclopentadiene epoxy resin, aralkyl phenolic epoxy resin, aralkyl biphenyl phenolic epoxy resin, and naphthol phenolic epoxy resin.

[0025] Preferably, the inorganic filler is selected from any one of silica, alumina, glass, cordierite, barium sulfate, barium carbonate, talc, clay, mica powder, zinc oxide, hydrotalcite, boehmite, aluminum hydroxide, magnesium hydroxide, calcium carbonate, magnesium carbonate, magnesium oxide, boron nitride, aluminum nitride, manganese nitride, aluminum borate, strontium carbonate, strontium titanate, calcium titanate, magnesium titanate, bismuth titanate, titanium oxide, zirconium oxide, barium titanate, barium zirconate, calcium zirconate, and zirconium phosphate, or a combination of at least two thereof.

[0026] Preferably, the curing accelerator is selected from any one of 1-cyanoethyl-2-ethyl-4-methylimidazole, 2-phenyl-4,5-dihydroxymethylimidazole, 2-phenyl-4-methyl-5-hydroxymethylimidazole, 2-ethyl-4-methylimidazole, 4-dimethylaminopyridine, and 2-phenylimidazole, or a combination of at least two thereof.

[0027] Preferably, the organic solvent is selected from any one of toluene, xylene, butanone, methyl ethyl ketone, cyclohexanone, ethyl acetate, and N,N-dimethylformamide, or a combination of at least two thereof.

[0028] Preferably, the build-up adhesive film further comprises 3 to 9 parts by weight of other additives;

[0029] The other auxiliary agent is selected from any one or a combination of at least two of a thickener, a defoamer, a leveling agent, a leveling agent, an adhesion-imparting agent and a colorant.

[0030] The second aspect of the present invention provides a method for preparing the above-mentioned build-up adhesive film for FC-BGA package carrier containing modified benzocyclobutene, the preparation method comprising the following steps:

[0031] After mixing the components of the build-up adhesive film evenly, coating the mixture on a substrate, and drying the mixture to obtain the build-up adhesive film;

[0032] Wherein, the drying temperature is 80-130° C., and the drying time is 3-10 minutes.

[0033] The third aspect of the present invention provides the use of the above-mentioned build-up adhesive film for FC-BGA package carrier containing modified benzocyclobutene in FC-BGA package carrier.

[0034] Beneficial effects:

[0035] The invention discloses a build-up adhesive film for an FC-BGA package carrier board containing modified benzocyclobutene, and a preparation method and application thereof. The invention adds modified benzocyclobutene to control performance on the basis of components such as epoxy resin, phenoxy resin, cyanate ester, and curing accelerator. By adding different types of modified benzocyclobutene and combining other raw material components, the build-up adhesive film has excellent dielectric properties, reduces dielectric loss, and has good flame retardant properties, and is better applied to FC-BGA package carrier boards, thereby meeting the needs of high-speed and high-integration development of electronic components. DETAILED DESCRIPTION

[0036] The present invention provides a build-up adhesive film for FC-BGA package carrier containing modified benzocyclobutene and a preparation method and application thereof. In order to make the purpose, technical scheme and effect of the present invention clearer and more specific, the present invention is further described in detail below. It should be understood that the specific embodiments described herein are only used to explain the present invention and are not used to limit the present invention.

[0037] The embodiment of the present invention provides a build-up adhesive film for a FC-BGA package carrier board containing modified benzocyclobutene, wherein the build-up adhesive film comprises the following components in parts by weight:

[0038] 45-100 parts of epoxy resin, 40-100 parts of inorganic filler, 25-45 parts of cyanate ester, 40-60 parts of modified benzocyclobutene, 5-10 parts of acrylic resin, 5-10 parts of phenoxy resin, 0.1-1 parts of curing accelerator, and 200-300 parts of organic solvent;

[0039] Wherein, the modified benzocyclobutene is one or both of phosphorus-containing benzocyclobutene and nitrogen-containing benzocyclobutene.

[0040] The embodiments of the present invention achieve the improvement of dielectric properties by using modified benzocyclobutene. Specifically, phosphorus-containing benzocyclobutene will not release any small molecules during the ring opening process, and the intramolecular polarity is low, so that the resin after the phosphorus-containing benzocyclobutene is cured has low dielectric properties; the chemical bond polarization rate of functional groups such as benzene rings and heterocyclic rings of nitrogen-containing benzocyclobutene is low, and the large volume structure contained in the functional group can increase the free volume of the polymer. Through the use of nitrogen-containing benzocyclobutene, low-polarity large-volume rigid functional groups can be introduced into the build-up film, thereby reducing the dielectric constant and dielectric loss.

[0041] From another perspective, the embodiments of the present invention reduce the dielectric constant and dielectric loss tangent of the build-up film by jointly using modified benzocyclobutene (phosphorus-containing benzocyclobutene and nitrogen-containing benzocyclobutene). During the high-temperature curing process, the four-membered rings of phosphorus-containing benzocyclobutene and nitrogen-containing benzocyclobutene will produce a ring-opening cross-linking reaction, and by forming a cyclic compound, the two form a network interconnected structure, thereby reducing molecular polarization and improving dielectric properties; at the same time, during the high-temperature curing process, the four-membered rings of phosphorus-containing benzocyclobutene and nitrogen-containing benzocyclobutene will produce a ring-opening cross-linking reaction, and by forming a cyclic compound, the two form a network interconnected structure, thereby reducing molecular polarization and improving dielectric properties.

[0042] Moreover, during the high-temperature curing process, phosphorus-containing benzocyclobutene and nitrogen-containing benzocyclobutene form a phosphorus-nitrogen flame retardant system through a ring-opening cross-linking reaction. The phosphorus element can form a stable phosphorus-containing carbon layer in the condensed phase flame retardant, and the nitrogen element generates a non-toxic flame-retardant gas at high temperature, which can dilute the concentration of combustible gases. At the same time, the phosphorus and nitrogen elements synergistically form a foamed porous expanded carbon layer, which can prevent combustible gases from entering the gas phase to achieve the effect of heat insulation and oxygen isolation, thereby improving the flame retardant properties of the build-up film.

[0043] In some embodiments, the build-up adhesive film has a thickness of 10 to 100 μm.

[0044] In some embodiments, the weight percentage of the epoxy resin may be 45 parts, 50 parts, 55 parts, 60 parts, 65 parts, 70 parts, 75 parts, 80 parts, 85 parts, 90 parts, 95 parts, 100 parts;

[0045] The weight proportion of the inorganic filler can be 40 parts, 45 parts, 50 parts, 55 parts, 60 parts, 65 parts, 70 parts, 75 parts, 80 parts, 85 parts, 90 parts, 95 parts, 100 parts;

[0046] The weight proportions of the cyanate ester may be 25 parts, 30 parts, 35 parts, 40 parts, or 45 parts;

[0047] The weight proportions of the modified benzocyclobutene can be 40 parts, 45 parts, 50 parts, 55 parts, or 60 parts;

[0048] The weight proportion of the acrylic resin may be 5 parts, 6 parts, 7 parts, 8 parts, 9 parts, or 10 parts;

[0049] The weight proportions of the phenoxy resin can be 5 parts, 6 parts, 7 parts, 8 parts, 9 parts, or 10 parts;

[0050] The weight proportion of the curing accelerator can be 0.1 part, 0.2 part, 0.3 part, 0.4 part, 0.5 part, 0.6 part, 0.7 part, 0.8 part, 0.9 part, 1 part;

[0051] The weight proportions of the organic solvent may be 200 parts, 210 parts, 220 parts, 230 parts, 240 parts, 250 parts, 260 parts, 270 parts, 280 parts, 290 parts, or 300 parts.

[0052] In some embodiments, the phosphorus-containing benzocyclobutene is selected from any one or a combination of at least two of phosphorus-containing benzocyclobutene I, phosphorus-containing benzocyclobutene II and phosphorus-containing benzocyclobutene III;

[0053] Wherein, the structural formula of the phosphorus-containing benzocyclobutene I is:

[0054]

[0055] The structural formula of the phosphorus-containing benzocyclobutene II is:

[0056]

[0057] The structural formula of the phosphorus-containing benzocyclobutene III is:

[0058]

[0059] No small molecules will be released during the ring-opening process of phosphorus-containing benzocyclobutene, and the polarity within the molecule is low, so that the resin after the phosphorus-containing benzocyclobutene is cured has low dielectric properties.

[0060] In some embodiments, the nitrogen-containing benzocyclobutene is selected from any one or a combination of at least two of nitrogen-containing benzocyclobutene I, nitrogen-containing benzocyclobutene II and nitrogen-containing benzocyclobutene III;

[0061] Wherein, the structural formula of the nitrogen-containing benzocyclobutene I is:

[0062]

[0063] The structural formula of the nitrogen-containing benzocyclobutene II is:

[0064]

[0065] The structural formula of the nitrogen-containing benzocyclobutene III is:

[0066]

[0067] The chemical bond polarizability of the functional groups such as the benzene ring and heterocyclic ring of nitrogen-containing benzocyclobutene is low, and the bulky structure contained in the functional groups can increase the free volume of the polymer. Through the use of nitrogen-containing benzocyclobutene, low-polarity bulky rigid functional groups can be introduced into the build-up film, thereby reducing the dielectric constant and dielectric loss.

[0068] In some embodiments, the epoxy resin is selected from any one or a combination of at least two of bisphenol epoxy resin, biphenyl epoxy resin, naphthalene epoxy resin, naphthol epoxy resin, linear phenolic epoxy resin, dicyclopentadiene epoxy resin, aralkyl phenolic epoxy resin, aralkyl biphenyl phenolic epoxy resin, and naphthol phenolic epoxy resin.

[0069] In some embodiments, the inorganic filler is selected from any one of silica, alumina, glass, cordierite, barium sulfate, barium carbonate, talc, clay, mica powder, zinc oxide, hydrotalcite, boehmite, aluminum hydroxide, magnesium hydroxide, calcium carbonate, magnesium carbonate, magnesium oxide, boron nitride, aluminum nitride, manganese nitride, aluminum borate, strontium carbonate, strontium titanate, calcium titanate, magnesium titanate, bismuth titanate, titanium oxide, zirconium oxide, barium titanate, barium zirconate, calcium zirconate, and zirconium phosphate, or a combination of at least two thereof.

[0070] In some embodiments, the acrylic resin is selected from "XX-5598Z" of Sekisui Chemicals Co., Ltd.

[0071] In some embodiments, the phenoxy resin is selected from any one of FX280 (Nippon Steel Corporation, Japan), FX293 (Nippon Steel Corporation, Japan), YX8100 (Mitsubishi Chemical Corporation), YX7553BH30 (Mitsubishi Chemical Corporation), YX7200B35 (Mitsubishi Chemical Corporation), TER240C30 (Guangdong Tongyu), or a combination of at least two thereof.

[0072] In some embodiments, the curing accelerator is selected from any one of 1-cyanoethyl-2-ethyl-4-methylimidazole, 2-phenyl-4,5-dihydroxymethylimidazole, 2-phenyl-4-methyl-5-hydroxymethylimidazole, 2-ethyl-4-methylimidazole, 4-dimethylaminopyridine, and 2-phenylimidazole, or a combination of at least two thereof.

[0073] In some embodiments, the organic solvent is selected from any one of toluene, xylene, butanone, methyl ethyl ketone, cyclohexanone, ethyl acetate, and N,N-dimethylformamide, or a combination of at least two thereof.

[0074] In some embodiments, the build-up adhesive film further includes 3 to 9 parts by weight of other additives;

[0075] The other auxiliary agent is selected from any one or a combination of at least two of a thickener, a defoamer, a leveling agent, a leveling agent, an adhesion-imparting agent and a colorant.

[0076] In some embodiments, the present invention provides a method for preparing the above-mentioned build-up adhesive film for FC-BGA package carrier containing modified benzocyclobutene, the preparation method comprising the following steps:

[0077] After uniformly mixing the components of the build-up adhesive film, coating the mixture on a substrate, and drying the mixture to obtain the build-up adhesive film;

[0078] Wherein, the drying temperature is 80-130° C., and the drying time is 3-10 minutes.

[0079] In some embodiments, the thickness of the substrate is 10 to 150 μm. The thickness of the substrate may be 10 μm, 20 μm, 30 μm, 40 μm, 50 μm, 60 μm, 70 μm, 80 μm, 90 μm, 100 μm, 110 μm, 120 μm, 130 μm, 140 μm, or 150 μm.

[0080] It should be noted that the embodiments of the present invention do not specifically limit the selection of the substrate, and any substrate commonly used in the art can be used, including but not limited to: PET release film, polyethylene film, polypropylene film or polyvinyl chloride film. At the same time, in order to facilitate the subsequent removal of the substrate, the polyethylene film, polypropylene film or polyvinyl chloride film can be corona treated in advance before use.

[0081] In some embodiments, the drying temperature may be 80°C, 90°C, 100°C, 110°C, 120°C, 130°C;

[0082] The drying time can be 3 min, 4 min, 5 min, 6 min, 7 min, 8 min, 9 min, or 10 min.

[0083] In some embodiments, the drying step further includes a post-treatment step; the post-treatment method is to remove the substrate.

[0084] In some embodiments, the present invention provides the use of the above-mentioned build-up adhesive film for FC-BGA package carrier containing modified benzocyclobutene in FC-BGA package carrier.

[0085] The technical solutions in the embodiments of the present invention are described clearly and completely below. Obviously, the described embodiments are only part of the embodiments of the present invention, not all of the embodiments, and are only for illustrating the present invention but not limiting the present invention. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in the field without creative work are within the scope of protection of the present invention.

[0086] The sources of some components in the examples and comparative examples of the present invention are as follows:

[0087] Epoxy resin: biphenyl type epoxy resin ("NC-3000-L" manufactured by Nippon Kayaku Co., Ltd.), phenol type epoxy resin ("WHR-991S" manufactured by Nippon Kayaku Co., Ltd.), bisphenol A type epoxy resin ("jER828EL" manufactured by Mitsubishi Chemical Corporation), naphthalene type epoxy resin ("HP-6000" manufactured by DIC Corporation);

[0088] Inorganic filler: spherical silica (“SOC2” manufactured by Yaduma Corporation);

[0089] Cyanate ester: Cyanate ester ("BA230S75" manufactured by Lonza Japan Co., Ltd.);

[0090] Acrylic resin: acrylic resin (manufactured by Sekisui Chemicals Co., Ltd., “XX-5598Z”);

[0091] Phenoxy resin: Phenoxy resin ("YX7553BH30" manufactured by Mitsubishi Chemical Corporation).

[0092] Example 1

[0093] This embodiment provides a build-up adhesive film for FC-BGA package carrier containing modified benzocyclobutene. The raw materials of the build-up adhesive film include, by weight:

[0094] 30 parts of biphenyl epoxy resin (NC-3000-L), 5 parts of phenol epoxy resin (WHR-991S), 10 parts of bisphenol A liquid epoxy resin (jER828EL), 100 parts of spherical silica (SOC2), 45 parts of cyanate (BA230S), 60 parts of phosphorus-containing benzocyclobutene, 10 parts of acrylic resin (XX-5598Z), 5 parts of phenoxy resin (YX7553BH30), 0.1 parts of 4-dimethylaminopyridine (DMAP) and 300 parts of cyclohexanone.

[0095] The preparation method of the build-up adhesive film is as follows: after uniformly mixing the raw material components according to the above proportions, coating the mixture on a PET release film, drying at 80° C. for 10 min, removing the PET release film, and obtaining a build-up adhesive film with a thickness of 100 μm.

[0096] Example 2

[0097] This embodiment provides a build-up adhesive film for FC-BGA package carrier containing modified benzocyclobutene. The raw materials of the build-up adhesive film include, by weight:

[0098] 30 parts of biphenyl epoxy resin (NC-3000-L), 5 parts of phenol epoxy resin (WHR-991S), 10 parts of bisphenol A liquid epoxy resin (jER828EL), 100 parts of spherical silica (SOC2), 45 parts of cyanate (BA230S), 60 parts of nitrogen-containing benzocyclobutene, 10 parts of acrylic resin (XX-5598Z), 5 parts of phenoxy resin (YX7553BH30), 0.1 parts of 4-dimethylaminopyridine (DMAP) and 300 parts of cyclohexanone.

[0099] The preparation method of the build-up adhesive film is as follows: after uniformly mixing the raw material components according to the above proportions, coating the mixture on a PET release film, drying at 130° C. for 3 minutes, removing the PET release film, and obtaining a build-up adhesive film with a thickness of 10 μm.

[0100] Example 3

[0101] This embodiment provides a build-up adhesive film for FC-BGA package carrier containing modified benzocyclobutene. The raw materials of the build-up adhesive film include, by weight:

[0102] 30 parts of biphenyl epoxy resin (NC-3000-L), 5 parts of phenol epoxy resin (WHR-991S), 10 parts of bisphenol A liquid epoxy resin (jER828EL), 100 parts of spherical silica (SOC2), 25 parts of cyanate (BA230S75), 30 parts of phosphorus-containing benzocyclobutene, 30 parts of nitrogen-containing benzocyclobutene, 10 parts of acrylic resin (XX-5598Z), 5 parts of phenoxy resin (YX7553BH30), 0.1 parts of 4-dimethylaminopyridine (DMAP) and 300 parts of cyclohexanone.

[0103] The preparation method of the build-up adhesive film is as follows: after uniformly mixing the raw material components according to the above proportions, coating the mixture on a PET release film, drying at 110° C. for 5 minutes, removing the PET release film, and obtaining a build-up adhesive film with a thickness of 40 μm.

[0104] Example 4

[0105] This embodiment provides a build-up adhesive film for FC-BGA package carrier containing modified benzocyclobutene. The raw materials of the build-up adhesive film include, by weight:

[0106] 100 parts of naphthalene epoxy resin (HP-6000), 40 parts of spherical silica (SOC2), 45 parts of cyanate (BA230S75), 40 parts of phosphorus-containing benzocyclobutene, 5 parts of acrylic resin (XX-5598Z), 5 parts of phenoxy resin (YX7553BH30), 1 part of 2-ethyl-4-methylimidazole (2E4MI) and 200 parts of butanone.

[0107] The preparation method of the build-up adhesive film is as follows: after uniformly mixing the raw material components according to the above proportions, coating the mixture on a PET release film, drying at 80° C. for 10 min, removing the PET release film, and obtaining a build-up adhesive film with a thickness of 100 μm.

[0108] Example 5

[0109] This embodiment provides a build-up adhesive film for FC-BGA package carrier containing modified benzocyclobutene. The raw materials of the build-up adhesive film include, by weight:

[0110] 80 parts of naphthalene-type epoxy resin (HP-6000), 60 parts of spherical silica (SOC2), 30 parts of cyanate (BA230S75), 50 parts of nitrogen-containing benzocyclobutene, 5 parts of acrylic resin (XX-5598Z), 5 parts of phenoxy resin (YX7553BH30), 0.5 parts of 2-ethyl-4-methylimidazole (2E4MI) and 250 parts of butanone.

[0111] The preparation method of the build-up adhesive film is as follows: after uniformly mixing the raw material components according to the above proportions, coating the mixture on a PET release film, drying at 80° C. for 10 min, removing the PET release film, and obtaining a build-up adhesive film with a thickness of 100 μm.

[0112] Example 6

[0113] This embodiment provides a build-up adhesive film for FC-BGA package carrier containing modified benzocyclobutene. The raw materials of the build-up adhesive film include, by weight:

[0114] 100 parts of naphthalene-type epoxy resin (HP-6000), 40 parts of spherical silica (SOC2), 45 parts of cyanate (BA230S75), 25 parts of phosphorus-containing benzocyclobutene, 25 parts of nitrogen-containing benzocyclobutene, 5 parts of acrylic resin (XX-5598Z), 5 parts of phenoxy resin (YX7553BH30), 1 part of 2-ethyl-4-methylimidazole (2E4MI) and 200 parts of butanone.

[0115] The preparation method of the build-up adhesive film is as follows: after uniformly mixing the raw material components according to the above proportions, coating the mixture on a PET release film, drying at 80° C. for 10 min, removing the PET release film, and obtaining a build-up adhesive film with a thickness of 100 μm.

[0116] Comparative Example 1

[0117] This embodiment provides a build-up adhesive film, and the raw materials of the build-up adhesive film include, by weight:

[0118] 30 parts of biphenyl epoxy resin (NC-3000-L), 5 parts of phenol epoxy resin (WHR-991S), 10 parts of bisphenol A liquid epoxy resin (jER828EL), 100 parts of spherical silica (SOC2), 25 parts of cyanate ester (BA230S75), 10 parts of acrylic resin (XX-5598Z), 5 parts of phenoxy resin (YX7553BH30), 0.1 parts of 4-dimethylaminopyridine (DMAP) and 300 parts of cyclohexanone.

[0119] The preparation method of the build-up adhesive film is as follows: after uniformly mixing the raw material components according to the above proportions, coating the mixture on a PET release film, drying at 80° C. for 10 min, removing the PET release film, and obtaining a build-up adhesive film with a thickness of 100 μm.

[0120] The performance of the build-up adhesive films provided in the above embodiments and comparative examples was tested, and the testing method was as follows:

[0121] Dielectric constant and dielectric loss tangent: The build-up adhesive with PET release film provided in the above-mentioned embodiments and comparative examples is cured at 180°C for 30 minutes, and then the release film is peeled off to obtain a pre-cured build-up adhesive film; the pre-cured build-up adhesive film is cut into 2mm×80mm test pieces (3 pieces), and then the dielectric constant and dielectric loss tangent of each test piece are measured using the "HP8362B" of Agilent Technologies Inc. by using the cavity resonance perturbation method at a measurement frequency of 5.8GHz and a measurement temperature of 23°C, and the average values ​​of the dielectric constant and dielectric loss tangent of the three test pieces are calculated as the dielectric constant and dielectric loss tangent.

[0122] Flame retardancy: The build-up adhesive film with PET release film provided in the above embodiments and comparative examples was pressed with a substrate (MCL-E-705G of Hitachi Chemical, Japan) by a film laminating machine, and the build-up adhesive film (the side without PET release film) was pressed on both sides of the substrate to obtain a laminate; after the lamination was completed, the PET release film on the laminate was removed, and the build-up adhesive film was thermally cured (cured at 190°C for 90 minutes) to form a cured product on both sides of the substrate. The laminate (thickness of about 380μm) was cut into samples with a size of 12.7mm×127mm and an edge of 1.27mm, and tested according to the UL-94V standard, and the test results were recorded.

[0123] The performance test results of the build-up adhesive films provided in the examples and comparative examples are shown in Table 1:

[0124] Table 1

[0125]

[0126] It should be understood that the application of the present invention is not limited to the above examples. For ordinary technicians in this field, improvements or changes can be made based on the above description. All these improvements and changes should fall within the scope of protection of the claims attached to the present invention.

Claims

1. A build-up adhesive film for FC-BGA package carrier containing modified benzocyclobutene, characterized in that: The build-up adhesive film comprises the following components in parts by weight: 45-100 parts of epoxy resin, 40-100 parts of inorganic filler, 25-45 parts of cyanate ester, 40-60 parts of modified benzocyclobutene, 5-10 parts of acrylic resin, 5-10 parts of phenoxy resin, 0.1-1 parts of curing accelerator, and 200-300 parts of organic solvent; Wherein, the modified benzocyclobutene is phosphorus-containing benzocyclobutene and nitrogen-containing benzocyclobutene; The phosphorus-containing benzocyclobutene is selected from any one or a combination of at least two of phosphorus-containing benzocyclobutene I, phosphorus-containing benzocyclobutene II and phosphorus-containing benzocyclobutene III; Wherein, the structural formula of the phosphorus-containing benzocyclobutene I is: The structural formula of the phosphorus-containing benzocyclobutene II is: The structural formula of the phosphorus-containing benzocyclobutene III is: The nitrogen-containing benzocyclobutene is selected from any one or a combination of at least two of nitrogen-containing benzocyclobutene I, nitrogen-containing benzocyclobutene II and nitrogen-containing benzocyclobutene III; Wherein, the structural formula of the nitrogen-containing benzocyclobutene I is: The structural formula of the nitrogen-containing benzocyclobutene II is: The structural formula of the nitrogen-containing benzocyclobutene III is:

2. The build-up adhesive film for FC-BGA package carrier containing modified benzocyclobutene according to claim 1, characterized in that: The epoxy resin is selected from any one or a combination of at least two of bisphenol epoxy resin, biphenyl epoxy resin, naphthalene epoxy resin, naphthol epoxy resin, linear phenolic epoxy resin, dicyclopentadiene epoxy resin, aralkyl phenolic epoxy resin, aralkyl biphenyl phenolic epoxy resin and naphthol phenolic epoxy resin.

3. The build-up adhesive film for FC-BGA package carrier containing modified benzocyclobutene according to claim 1, characterized in that: The inorganic filler is selected from any one of silicon dioxide, aluminum oxide, glass, cordierite, barium sulfate, barium carbonate, talc, clay, mica powder, zinc oxide, hydrotalcite, boehmite, aluminum hydroxide, magnesium hydroxide, calcium carbonate, magnesium carbonate, magnesium oxide, boron nitride, aluminum nitride, manganese nitride, aluminum borate, strontium carbonate, strontium titanate, calcium titanate, magnesium titanate, bismuth titanate, titanium oxide, zirconium oxide, barium titanate, barium zirconate, calcium zirconate, and zirconium phosphate, or a combination of at least two thereof.

4. The build-up adhesive film for FC-BGA package carrier containing modified benzocyclobutene according to claim 1, characterized in that: The curing accelerator is selected from any one of 1-cyanoethyl-2-ethyl-4-methylimidazole, 2-phenyl-4,5-dihydroxymethylimidazole, 2-phenyl-4-methyl-5-hydroxymethylimidazole, 2-ethyl-4-methylimidazole, 4-dimethylaminopyridine, and 2-phenylimidazole, or a combination of at least two thereof.

5. The build-up adhesive film for FC-BGA package carrier containing modified benzocyclobutene according to claim 1, characterized in that: The organic solvent is selected from any one of toluene, xylene, butanone, methyl ethyl ketone, cyclohexanone, ethyl acetate, and N,N-dimethylformamide, or a combination of at least two thereof.

6. The build-up adhesive film for FC-BGA package carrier containing modified benzocyclobutene according to claim 1, characterized in that: The build-up film also includes 3 to 9 parts by weight of other additives; The other auxiliary agent is selected from any one or a combination of at least two of a thickener, a defoamer, a leveling agent, a leveling agent, an adhesion-imparting agent and a colorant.

7. A method for preparing a build-up adhesive film for FC-BGA package carrier containing modified benzocyclobutene according to any one of claims 1 to 6, characterized in that: The preparation method comprises the following steps: The components of the build-up adhesive film are mixed evenly, coated on a substrate, and dried to obtain the build-up adhesive film.

8. Use of the build-up adhesive film for FC-BGA package carrier containing modified benzocyclobutene as claimed in any one of claims 1 to 6 in FC-BGA package carrier.

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