Semiconductor production slicing equipment

Abstract

The present invention discloses a slicing device for semiconductor production. The slicing machine is provided with a semiconductor fixing device, a slicing device and a positioning device. A slicing groove is provided at the lower end of the bottom plate of the slicing machine; a semiconductor fixing device is provided at the upper end of the bottom plate of the slicing machine; the semiconductor fixing device includes a plurality of groups of semiconductor accommodating blocks arranged in sequence from top to bottom, each group of semiconductor accommodating blocks is composed of a first semiconductor accommodating block fixedly arranged on one side of the slicing groove, and a second semiconductor accommodating block slidably arranged on the other side of the slicing groove; a group of semiconductor initial products is fastened in each group of semiconductor accommodating blocks; a lateral moving driving device fixed on the inner wall of one side of the slicing machine is provided on one side of the top of the slicing device; a positioning device is provided on the other side of the top of the slicing device. The slicing device for semiconductor production provided by the present invention realizes automatic, continuous and precise cutting of a plurality of semiconductor crystal rod products of different diameters and lengths, and has a good cutting effect.

Description

Technical Field

[0001] The present invention relates to the technical field of semiconductor processing, and in particular to a slicing device for semiconductor production. Background Art

[0002] Semiconductors refer to materials with electrical conductivity between conductors and insulators at room temperature. Semiconductors are used in integrated circuits, consumer electronics, communication systems, photovoltaic power generation, lighting, high-power power conversion and other fields. For example, diodes are devices made of semiconductors. Nowadays, most electronic products, such as computers, mobile phones or digital recorders, are closely related to semiconductors. Common semiconductor materials include silicon, germanium, gallium arsenide, etc. Silicon is the most influential one in various semiconductor material applications.

[0003] In the production and processing of semiconductors, slicing is often an essential step. Because common semiconductor materials are made of silicon, the production process is that silicon is first made into a crystal rod, and the crystal rod is cut into semiconductor slice products (usually sheet products) by a slicing device, and finally polished to form a wafer, forming the main body of the semiconductor material, which is used in various fields.

[0004] However, in the process of cutting the existing crystal rods into semiconductor slice products, there are the following areas for improvement: (1) The existing slicing device can often only synchronously cut multiple crystal rods of the same diameter and length. If it is necessary to synchronously cut multiple crystal rods of different diameters, multiple slicing devices with different crystal rod clamping mechanisms are required to cut them. If it is necessary to synchronously cut multiple crystal rods of different lengths, multiple slicing devices with different crystal rod clamping mechanisms are also required to cut them. After all the multiple crystal rods of different diameters and lengths are cut, the slicing efficiency is not high; (2) The existing slicing device uses manual movement or automatic drive devices to drive the crystal rod to move a certain distance, while the cutting blade position remains unchanged to achieve The thickness of the crystal rod cutting is currently controlled; however, the efficiency of manual movement is low, and the stroke of each movement and the thickness of the final semiconductor sliced ​​product cannot be accurately controlled. The efficiency of the automatic drive device is higher, but it is affected by the start and stop stages of the automatic drive device. The stroke of each automatic drive crystal rod movement and the thickness of the final semiconductor sliced ​​product cannot be accurately controlled. Ultimately, the manual or automatic drive movement range cannot be accurately controlled, resulting in uneven slicing of the final crystal rod and unsatisfactory cutting effect; (3) The existing cutting device will generate cutting debris during the slicing process of the crystal rod. If not handled in time, it may remain on the surface of the crystal rod, affecting the subsequent slicing effect. The generation of cutting debris also has a harmful effect on human health and the factory environment. Summary of the invention

[0005] In view of this, the present invention provides a slicing device for semiconductor production.

[0006] In order to achieve the above object, the present invention adopts the following technical solutions:

[0007] A slicing device for semiconductor production, comprising a slicing machine, wherein the slicing machine is provided with a semiconductor fixing device, a slicing device and a positioning device, wherein a slicing groove is provided at the lower end of the bottom plate of the slicing machine; a semiconductor fixing device is provided at the upper end of the bottom plate of the slicing machine; the semiconductor fixing device comprises a plurality of groups of semiconductor accommodating blocks arranged in sequence from top to bottom, wherein each group of semiconductor accommodating blocks is composed of a first semiconductor accommodating block fixedly arranged on one side of the slicing groove and a second semiconductor accommodating block slidably arranged on the other side of the slicing groove; a group of semiconductor initial products is fastened in each group of semiconductor accommodating blocks; the slicing device comprises a cutting blade arranged above the semiconductor initial product, a driving motor connected to the middle of the cutting blade, and a driving motor connected to the driving motor. A longitudinal moving drive device; a transverse moving drive device is provided on one side of the top end of the longitudinal moving drive device; the transverse moving drive device is fixedly arranged on one inner wall of the slicer; the positioning device comprises a positioning main board, and a plurality of positioning calibration plates evenly and detachably arranged on the lower end of the positioning main board, the positioning calibration plate at one end is attached to the other side of the top end of the longitudinal moving drive device, the lengths of the plurality of positioning calibration plates increase evenly from one side of the slicer toward the other side, and the distance between every two adjacent positioning calibration plates is the length of the semiconductor sliced ​​product; the lower end of the other side of the positioning device is connected to another longitudinal moving drive device, and the other longitudinal moving drive device is fixedly arranged on the inner wall of the other side of the slicer;

[0008] The first semiconductor accommodating block and the second semiconductor accommodating block in each group of semiconductor accommodating blocks are arranged side by side in the horizontal direction;

[0009] The first semiconductor accommodating block is composed of a first semiconductor upper accommodating block and a first semiconductor lower accommodating block stacked together; the second semiconductor accommodating block is composed of a second semiconductor upper accommodating block and a second semiconductor lower accommodating block stacked together; a plurality of upper semicircular receiving grooves are respectively provided on opposite side end surfaces of the first semiconductor upper accommodating block and the second semiconductor upper accommodating block, and a plurality of lower semicircular receiving grooves are respectively provided on opposite side end surfaces of the first semiconductor lower accommodating block and the second semiconductor lower accommodating block; the radius of each upper semicircular receiving groove and the lower semicircular receiving groove of the first semiconductor accommodating block or the second semiconductor accommodating block is the same, and the two grooves with the same radius are spliced ​​to form a circular receiving groove; the diameters of the plurality of circular receiving grooves of each group of semiconductor accommodating blocks are equal, and the diameters of the circular receiving grooves of the plurality of groups of semiconductor accommodating blocks are different, and a plurality of semiconductor initial products are respectively matched and fastened in the plurality of circular receiving grooves on both sides of each group of semiconductor accommodating blocks;

[0010] A first threaded hole is provided at the outer end of the first semiconductor upper accommodating block or the first semiconductor lower accommodating block of each first semiconductor accommodating block, the first threaded hole is communicated with the circular accommodating groove on the first semiconductor accommodating block, and the diameter of the first threaded hole is smaller than the radius of the circular accommodating groove; a first threaded hole is also provided at the outer end of the second semiconductor upper accommodating block or the second semiconductor lower accommodating block of each second semiconductor accommodating block, the first threaded hole is communicated with the circular accommodating groove on the second semiconductor accommodating block, and the diameter of the first threaded hole is smaller than the radius of the circular accommodating groove;

[0011] A sleeve fixing rod is provided at the outer end of each first semiconductor accommodating block, and the sleeve fixing rod on one side is fixedly arranged on the upper end of the slicer bottom plate; a sleeve fixing rod is provided at the outer end of each second semiconductor accommodating block, and the sleeve fixing rod on the other side is slidably arranged on the upper end of the slicer bottom plate.

[0012] Furthermore, an upper slide groove and a lower slide groove which are not connected to each other are provided on the inner side end surface of each of the sleeve fixing rods on one side, and a slide bar is provided on the outer side end of each of the first semiconductor upper accommodating blocks, and the slide bar is matched and slidably arranged in the upper slide groove; the rod height of the sleeve fixing rod of the lower first semiconductor accommodating block of every two upper and lower adjacent first semiconductor accommodating blocks is equal to the height of the lower slide groove of the sleeve fixing rod of the upper first semiconductor accommodating block, and the rod thickness of the sleeve fixing rod of the lower first semiconductor accommodating block of every two upper and lower adjacent first semiconductor accommodating blocks is equal to the depth of the lower slide groove of the sleeve fixing rod of the upper first semiconductor accommodating block; the sleeve fixing rod of the lower first semiconductor accommodating block of every two upper and lower adjacent first semiconductor accommodating blocks is matched and embedded in the lower slide groove of the sleeve fixing rod of the upper first semiconductor accommodating block;

[0013] An upper slide groove and a lower slide groove which are not connected to each other are provided on the inner end surface of each of the sleeve fixing rods on the other side, and a slide bar is provided on the outer end of each of the second semiconductor upper accommodating blocks, and the slide bar is matched and slidably arranged in the upper slide groove; the rod height of the sleeve fixing rod of the lower second semiconductor accommodating block of every two upper and lower adjacent second semiconductor accommodating blocks is equal to the height of the lower slide groove of the sleeve fixing rod of the upper second semiconductor accommodating block, and the rod thickness of the sleeve fixing rod of the lower second semiconductor accommodating block of every two upper and lower adjacent second semiconductor accommodating blocks is equal to the depth of the lower slide groove of the sleeve fixing rod of the upper second semiconductor accommodating block;

[0014] The other side of the bottom plate of the slicer is transversely provided with a middle groove and side grooves, the front end and the rear end of the middle groove are respectively provided with side grooves, and the middle groove and the front end and the rear end side grooves are separated by a partition bar; the lower end of each of the sleeve fixing rods on the other side is provided with a accommodating slider; each accommodating slider is provided with a second threaded hole, and a plurality of third threaded holes are evenly provided on the partition bar, and the diameter of the second threaded hole is the same as the diameter of the third threaded hole; the second threaded holes and the third threaded holes of the accommodating sliders aligned with each other are threadedly connected with bolts, and the bolts extend out of one end of the partition bar and are threadedly connected with a fastening nut.

[0015] Further, the lateral movement driving device is a first cylinder; the longitudinal movement driving device is a second cylinder; and another longitudinal movement driving device is a third cylinder;

[0016] The upper end cover of each of the first semiconductor upper accommodating blocks is provided with a pressure plate, and the upper end of each of the second semiconductor upper accommodating blocks is also covered with a pressure plate. The outer ends of the pressure plates on both sides are respectively provided with connecting rods, and the connecting rods on both sides are connected by bending rods; the top end of the connecting rod on the other side is connected to the piston rod of the fourth cylinder through a connecting shaft, and the fourth cylinder is fixed on the inner wall on the other side of the slicer.

[0017] Furthermore, a first cylinder guide plate is transversely arranged on the inner wall of the other side of the slicer; a certain distance is set between the first cylinder guide plate and the cutting blade; a strip slide groove is transversely arranged on the first cylinder guide plate, the width of the strip slide groove is equal to the outer diameter of the piston rod of the first cylinder, and the length of the strip slide groove is not less than the distance between the positioning and calibration plates at both ends; the piston rod of the first cylinder passes through the strip slide groove in a matching manner;

[0018] The diameter of the cutting blade is greater than the width of any group of semiconductor initial products; the radius of the cutting blade is less than the depth of the cutting groove;

[0019] A second cylinder guide plate is longitudinally arranged on the inner top wall of the slicer; a certain distance is between the second cylinder guide plate and the cutting blade; a second through hole is penetrated through the second cylinder guide plate, and the diameter of the second through hole is equal to the outer diameter of the piston rod of the second cylinder; the piston rod of the second cylinder is matched and penetrated through the second through hole;

[0020] A third cylinder guide plate is transversely arranged on the inner wall of the other side of the slicer; a certain distance is set between the third cylinder guide plate and the positioning calibration plate; a third through hole is formed through the third cylinder guide plate, and the diameter of the third through hole is equal to the outer diameter of the piston rod of the third cylinder; the piston rod of the third cylinder is matched and penetrated through the third through hole;

[0021] A fourth cylinder guide plate is horizontally arranged on the inner wall on the other side of the slicer; a certain distance is set between the fourth cylinder guide plate and the second semiconductor accommodating block; a fourth through hole is penetrated through the fourth cylinder guide plate, and the diameter of the fourth through hole is equal to the outer diameter of the piston rod of the fourth cylinder; the piston rod of the fourth cylinder is matched and passed through the fourth through hole.

[0022] Furthermore, a cylinder support is provided at the top of the first cylinder; the piston rod of the second cylinder is connected to the cylinder support through a connecting block; a first magnet block is embedded on the other side of the cylinder support; a second magnet block is embedded on the lower end of each positioning and calibration plate on the side end face opposite to the cylinder support; the first magnet block and the second magnet block are magnetically attracted to each other, and the first magnet block of the positioning and calibration plate at one end is magnetically attracted to the second magnet block of the cylinder support; the height difference between every two adjacent positioning and calibration plates is equal to the height of the part where the positioning and calibration plate at one end is in contact with the cylinder support.

[0023] Furthermore, a plurality of narrow positioning grooves are evenly formed on the positioning main board, and a positioning slider is provided on the other outer side end of the positioning main board;

[0024] A positioning groove is longitudinally provided on the inner wall on the other side of the slicer, and the positioning slider is matched and embedded in the positioning groove; a narrow plate is provided on the top of each positioning calibration plate, and each narrow plate is penetrated and extends out of a positioning narrow groove, and a connecting narrow groove is horizontally penetrated and provided at one end of each narrow plate extending out of the positioning narrow groove; a connecting narrow plate is commonly penetrated in the connecting narrow grooves of all the narrow plates; the two ends of the connecting narrow plates are threadedly connected to the positioning main board; the lower end of the other side of the positioning main board is connected to the piston rod of the third cylinder through a connecting block.

[0025] Furthermore, the cross section of the inner bottom wall of the slicing groove is an inverted V-shape; an inverted V-shaped elastic pad is attached to the inner bottom wall of the slicing groove.

[0026] Furthermore, a debris collection device is provided on the inner wall of one side of the slicer; the debris collection device includes a debris collection box, a collection pipe connected to the other side of the debris collection box, and an expanded collection cover connected to the collection pipe; a box door is pinned on the debris collection box; an air pump is provided on the collection pipe; and a certain distance is between the expanded collection cover and the first semiconductor accommodating block.

[0027] Further, a plurality of first semiconductor accommodating blocks are arranged side by side in the longitudinal direction from top to bottom; an ultrasonic distance measuring sensor assembly is arranged on the rear end face of each second semiconductor accommodating block; the ultrasonic distance measuring sensor assembly is composed of a mounting plate arranged on the rear end face of the second semiconductor accommodating block, and an ultrasonic distance measuring sensor arranged on the front end face of the mounting plate, and the ultrasonic distance measuring sensor corresponds to the position of the semiconductor initial product installed on its second semiconductor accommodating block; the distance between each ultrasonic distance measuring sensor and the inner end face of the second semiconductor accommodating block is equal to the length of the semiconductor slice product;

[0028] All ultrasonic distance measuring sensors are electrically connected to the controller; the controller is electrically connected to the air pump; the controller is electrically connected to the first cylinder, the second cylinder, the third cylinder and the fourth cylinder respectively; the controller is electrically connected to the drive motor.

[0029] Compared with the prior art, the present invention has the following beneficial effects:

[0030] (1) This semiconductor production slicing device can automatically and continuously cut multiple semiconductor crystal rod products of different diameters and lengths, with high cutting efficiency, uniform thickness, extremely high product thickness accuracy and good cutting effect;

[0031] (2) Due to the sophisticated setting of the positioning device, the semiconductor production slicing device can accurately control the semiconductor slices of different diameters and the same thickness. The cutting is automated and efficient. The final crystal rod slices are very uniform and the cutting effect is very ideal.

[0032] (3) During the cutting process, the cutting debris generated during the crystal rod slicing process will be sucked into the debris collection box in time to prevent the cutting debris from staying on the surface of the crystal rod and affecting the subsequent slicing effect. It also eliminates the harmful effects of the cutting debris on human health and the factory environment. BRIEF DESCRIPTION OF THE DRAWINGS

[0033] Figure 1 It is a schematic diagram of the overall three-dimensional structure of the present invention;

[0034] Figure 2 It is a schematic diagram of the overall three-dimensional structure of the present invention;

[0035] Figure 3 It is the overall front view of the present invention;

[0036] Figure 4 It is an overall top view of the present invention;

[0037] Figure 5 for Figure 4 AA section view in the figure;

[0038] Figure 6It is a schematic diagram of the three-dimensional structure of the positioning device of the present invention;

[0039] Figure 7 It is a schematic diagram of the three-dimensional structure of the positioning and marking plate and the connecting narrow plate of the present invention;

[0040] Figure 8 It is a schematic diagram of the three-dimensional structure of the slicing device and the second cylinder of the present invention;

[0041] Fig. 9 A top view of the slicing device and the second cylinder of the present invention;

[0042] Fig.10 It is a schematic diagram of the three-dimensional structure of the slicing device and the second cylinder of the present invention;

[0043] Fig.11 It is a schematic diagram of the three-dimensional structure of the slicer bottom plate and the semiconductor fixing device of the present invention;

[0044] Fig.12 for Fig.11 A magnified view of part A in FIG.

[0045] Fig.13 It is a schematic diagram of the three-dimensional structure of the slicer bottom plate and the semiconductor fixing device of the present invention;

[0046] Fig.14 A top view of a slicer bottom plate and a semiconductor fixing device of the present invention;

[0047] Fig.15 for Fig.14 BB section view in the figure;

[0048] Fig.16 for Fig.14 CC section view in the figure;

[0049] Fig.17 It is a schematic diagram of the three-dimensional structure of the slicer bottom plate of the present invention and the semiconductor fixing device on which the initial semiconductor product has been installed;

[0050] Fig.18 It is a schematic diagram of the three-dimensional structure of the slicer base plate of the present invention and the semiconductor fixing device on which the initial semiconductor product has been installed.

[0051] In the figure: 1, slicer; 2, first semiconductor accommodating block; 201, first semiconductor upper accommodating block; 202, first semiconductor lower accommodating block; 3, second semiconductor accommodating block; 301, second semiconductor upper accommodating block; 302, second semiconductor lower accommodating block; 4, circular accommodating groove; 5, first threaded hole; 6, sleeve fixing rod; 601, upper slide groove; 602, lower slide groove; 7, slide bar; 8, middle groove; 9, side groove; 10, spacer bar; 11, third threaded hole; 12, bolt; 13, fastening nut; 14, cutting blade; 15, driving motor; 16, first cylinder; 17, cylinder bracket; 18, second cylinder; 19, first cylinder guide plate; 20. Strip slide; 21. Second cylinder guide plate; 22. Positioning main board; 23. Positioning calibration plate; 24. Positioning narrow groove; 25. Narrow plate; 26. Positioning slider; 27. Positioning slide; 28. Connecting narrow plate; 29. ​​First magnet block; 30. Second magnet block; 31. Third cylinder; 32. Third cylinder guide plate; 33. Press plate; 34. Connecting rod; 35. Bending rod; 36. Connecting shaft; 37. Fourth cylinder; 38. Inverted V-shaped elastic pad; 39. Debris collection box; 40. Collection pipe; 41. Expanded collection cover; 42. Mounting plate; 43. Ultrasonic ranging sensor; 44. Slicing groove; 45. Accommodating slider; 46. Fourth cylinder guide plate. DETAILED DESCRIPTION

[0052] The technical solutions in the embodiments of the present invention will be described clearly and completely below in conjunction with the drawings in the embodiments of the present invention. Obviously, the described embodiments are only part of the embodiments of the present invention, rather than all the embodiments.

[0053] In the description of the present invention, unless otherwise specified, "plurality" means two or more than two; the orientations or positional relationships indicated by the terms "upper", "lower", "left", "right", "inner", "outer", "front end", "rear end", "head", "tail", etc. are based on the orientations or positional relationships shown in the drawings, and are only for the convenience of describing the present invention and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, be constructed and operate in a specific orientation, and therefore cannot be understood as limiting the present invention. In addition, the terms "first", "second", "third", etc. are only used for descriptive purposes and cannot be understood as indicating or implying relative importance.

[0054] In the description of the present invention, it should be noted that, unless otherwise clearly specified and limited, the terms "connected" and "connection" should be understood in a broad sense, for example, it can be a fixed connection, a detachable connection, or an integral connection; it can be a mechanical connection or an electrical connection; it can be a direct connection or an indirect connection through an intermediate medium. For ordinary technicians in this field, the specific meanings of the above terms in the present invention can be understood according to specific circumstances.

[0055] Example:

[0056] like Figure 1-18 As shown, a slicing device for semiconductor production includes a slicing machine 1, on which a semiconductor fixing device, a slicing device and a positioning device are provided. A slicing groove 44 is provided at the lower end of the bottom plate of the slicing machine 1; and a semiconductor fixing device is provided at the upper end of the bottom plate of the slicing machine 1. The semiconductor fixing device includes a plurality of groups of semiconductor accommodating blocks arranged in sequence from top to bottom, and each group of semiconductor accommodating blocks is composed of a first semiconductor accommodating block 2 fixedly arranged on one side of the slicing groove 44, and a second semiconductor accommodating block 3 slidably arranged on the other side of the slicing groove 44. The first semiconductor accommodating block 2 and the second semiconductor accommodating block 3 in each group of semiconductor accommodating blocks are arranged side by side in the horizontal direction.

[0057] The first semiconductor receiving block 2 is composed of a first semiconductor upper receiving block 201 and a first semiconductor lower receiving block 202 stacked together; the second semiconductor receiving block 3 is composed of a second semiconductor upper receiving block 301 and a second semiconductor lower receiving block 302 stacked together.

[0058] A plurality of upper semicircular receiving grooves 4 are respectively provided on the opposite side end faces of the first semiconductor upper receiving block 201 and the second semiconductor upper receiving block 301, and a plurality of lower semicircular receiving grooves 4 are respectively provided on the opposite side end faces of the first semiconductor lower receiving block 202 and the second semiconductor lower receiving block 302. The radius of each upper semicircular receiving groove 4 and the lower semicircular receiving groove 4 of the first semiconductor receiving block 2 or the second semiconductor receiving block 3 is the same, and the two grooves with the same radius are spliced ​​together to form a circular receiving groove 4. The diameters of the plurality of circular receiving grooves 4 of each group of semiconductor receiving blocks are equal, and the diameters of the circular receiving grooves 4 of the plurality of groups of semiconductor receiving blocks are different. In this embodiment, the diameters of the circular receiving grooves 4 of the plurality of groups of semiconductor receiving blocks are different. A plurality of semiconductor initial products (i.e., semiconductor crystal rod products) are respectively matched and fastened in the plurality of circular receiving grooves 4 on both sides of each group of semiconductor receiving blocks.

[0059] A first threaded hole 5 is provided at the outer end of the first semiconductor upper accommodating block 201 or the first semiconductor lower accommodating block 202 of each first semiconductor accommodating block 2, the first threaded hole 5 is communicated with the circular accommodating groove 4 on the first semiconductor accommodating block 2, and the diameter of the first threaded hole 5 is smaller than the radius of the circular accommodating groove 4. A first threaded hole 5 is also provided at the outer end of the second semiconductor upper accommodating block 301 or the second semiconductor lower accommodating block 302 of each second semiconductor accommodating block 3, the first threaded hole 5 is communicated with the circular accommodating groove 4 on the second semiconductor accommodating block 3, and the diameter of the first threaded hole 5 is smaller than the radius of the circular accommodating groove 4.

[0060] A sleeve fixing rod 6 is disposed at the outer end of each first semiconductor accommodating block 2 , and the sleeve fixing rod 6 on one side is fixedly disposed on the upper end of the bottom plate of the slicer 1 .

[0061] Specifically, an upper slide groove 601 and a lower slide groove 602 which are not connected to each other are provided on the inner side end surface of each sleeve fixing rod 6 on one side, and a slide bar 7 is provided on the outer side end of each first semiconductor upper accommodation block 201, and the slide bar 7 is matched and slidably arranged in the upper slide groove 601. The rod height of the sleeve fixing rod 6 of the lower first semiconductor accommodation block 2 of each two upper and lower adjacent first semiconductor accommodation blocks 2 is equal to the height of the lower slide groove 602 of the sleeve fixing rod 6 of the upper first semiconductor accommodation block 2, and the rod thickness of the sleeve fixing rod 6 of the lower first semiconductor accommodation block 2 of each two upper and lower adjacent first semiconductor accommodation blocks 2 is equal to the depth of the lower slide groove 602 of the sleeve fixing rod 6 of the upper first semiconductor accommodation block 2. The sleeve fixing rod 6 of the lower first semiconductor accommodation block 2 of each two upper and lower adjacent first semiconductor accommodation blocks 2 is matched and embedded in the lower slide groove 602 of the sleeve fixing rod 6 of the upper first semiconductor accommodation block 2.

[0062] A sleeve fixing rod 6 is disposed at the outer end of each second semiconductor accommodating block 3 , and the sleeve fixing rod 6 at the other side is slidably disposed on the upper end of the bottom plate of the slicer 1 .

[0063] Specifically, the inner end surface of each sleeve fixing rod 6 on the other side is provided with an upper slide groove 601 and a lower slide groove 602 which are not connected to each other, and the outer end of each second semiconductor upper accommodating block 301 is provided with a slide bar 7, which is matched and slidably arranged in the upper slide groove 601. The rod height of the sleeve fixing rod 6 of the lower second semiconductor accommodating block 3 of every two upper and lower adjacent second semiconductor accommodating blocks 3 is equal to the height of the lower slide groove 602 of the sleeve fixing rod 6 of the upper second semiconductor accommodating block 3, and the rod thickness of the sleeve fixing rod 6 of the lower second semiconductor accommodating block 3 of every two upper and lower adjacent second semiconductor accommodating blocks 3 is equal to the depth of the lower slide groove 602 of the sleeve fixing rod 6 of the upper second semiconductor accommodating block 3.

[0064] The other side of the bottom plate of the slicer 1 is provided with a middle groove 8 and a side groove 9 in a transverse direction. The front and rear ends of the middle groove 8 are provided with side grooves 9 respectively. A partition bar 10 is provided between the middle groove 8 and the front and rear side grooves 9. A receiving slider 45 is provided at the lower end of each sleeve fixing rod 6 on the other side; each receiving slider 45 is provided with a second threaded hole, and a plurality of third threaded holes 11 are evenly provided through the partition bar 10, and the diameter of the second threaded hole is the same as the diameter of the third threaded hole 11. Bolts 12 are threadedly connected to the second threaded holes and the third threaded holes 11 of the mutually aligned receiving sliders 45, and a fastening nut 13 is threadedly connected to one end of the bolt 12 extending out of the partition bar 10.

[0065] The slicing device includes a cutting blade 14 disposed above the semiconductor crystal rod product, a driving motor 15 connected to the middle of the cutting blade 14, and a first cylinder 16 connected to the driving motor 15. The piston rod of the first cylinder 16 is connected to the driving motor 15 through a connecting block.

[0066] The diameter of the cutting blade 14 is greater than the width of any group of semiconductor crystal rod products; the radius of the cutting blade 14 is less than the depth of the cutting groove.

[0067] The top of the first cylinder 16 is provided with a cylinder support 17. One side of the cylinder support 17 is connected to the piston rod of the second cylinder 18 through a connecting block. The second cylinder 18 is fixedly arranged on an inner wall of one side of the slicer 1.

[0068] A first cylinder guide plate 19 is transversely disposed on the inner wall of the other side of the slicer 1; a certain distance is between the first cylinder guide plate 19 and the cutting blade 14. A strip chute 20 is transversely provided on the first cylinder guide plate 19, the width of which is equal to the outer diameter of the piston rod of the first cylinder 16, and the length of which is not less than the distance between the positioning and calibration plates 23 at both ends; the piston rod of the first cylinder 16 passes through the strip chute 20 in a matching manner.

[0069] A second cylinder guide plate 21 is longitudinally provided on the inner top wall of the slicer 1; a certain distance is between the second cylinder guide plate 21 and the cutting blade 14. A second through hole is formed through the second cylinder guide plate 21, and the diameter of the second through hole is equal to the outer diameter of the piston rod of the second cylinder 18; the piston rod of the second cylinder 18 is matched and passed through the second through hole.

[0070] The positioning device includes a positioning main board 22, and a plurality of positioning marking plates 23 that are evenly and detachably arranged at the lower end of the positioning main board 22. Specifically: a plurality of positioning narrow grooves 24 are evenly and detachably arranged on the positioning main board 22, and a positioning slider 26 is arranged at the other outer end of the positioning main board 22. A positioning slide 27 is longitudinally arranged on the inner wall on the other side of the slicer 1, and the positioning slider 26 is matched and embedded in the positioning slide 27. A narrow plate 25 is arranged at the top of each positioning marking plate 23, and each narrow plate 25 is provided with a positioning narrow groove 24 extending therethrough, and a connecting narrow groove is arranged transversely through one end of each narrow plate 25 extending therethrough from the positioning narrow groove 24; a connecting narrow plate 28 is commonly arranged in the connecting narrow groove of the narrow plate 25. The two ends of the connecting narrow plate 28 are threadedly connected to the positioning main board 22 by screwing screws into the aligned threaded holes.

[0071] The positioning and calibration plate 23 at one end is attached to the other side of the top of the longitudinal moving drive device. The lengths of several positioning and calibration plates 23 increase uniformly from one side of the slicer 1 toward the other side. The distance between every two adjacent positioning and calibration plates 23 is the length of the semiconductor sliced ​​product.

[0072] A first magnet block 29 is embedded in the other side of the cylinder support 17; a second magnet block 30 is embedded in the lower end of each positioning and calibration plate 23 on the side opposite to the cylinder support 17. The first magnet block 29 and the second magnet block 30 are magnetically attracted to each other on the side opposite to the end, and the first magnet block 29 of the positioning and calibration plate 23 at one end is magnetically attracted to the second magnet block 30 of the cylinder support 17. The height difference between each two adjacent positioning and calibration plates 23 is equal to the height of the part where the positioning and calibration plate 23 at one end is in contact with the cylinder support 17.

[0073] The lower end of the other side of the positioning main board 22 is connected to the piston rod of the third cylinder 31 through a connecting block. The third cylinder 31 is fixedly arranged on the inner wall of the other side of the slicer 1.

[0074] A third cylinder guide plate 32 is transversely disposed on the inner wall of the other side of the slicer 1; a certain distance is between the third cylinder guide plate 32 and the positioning calibration plate 23. A third through hole is formed through the third cylinder guide plate 32, and the diameter of the third through hole is equal to the outer diameter of the piston rod of the third cylinder 31; the piston rod of the third cylinder 31 is matched and penetrated through the third through hole.

[0075] A fourth cylinder guide plate 46 is transversely disposed on the inner wall of the other side of the slicer 1; a certain distance is between the fourth cylinder guide plate 46 and the second semiconductor accommodation block 3. A fourth through hole is formed through the fourth cylinder guide plate 46, and the diameter of the fourth through hole is equal to the outer diameter of the piston rod of the fourth cylinder 37; the piston rod of the fourth cylinder 37 is matched and penetrated through the fourth through hole.

[0076] The upper end cover of each first semiconductor upper accommodating block 201 is provided with a pressure plate 33, and the upper end of each second semiconductor upper accommodating block 301 is also covered with a pressure plate 33, and the outer ends of the pressure plates 33 on both sides are respectively provided with connecting rods 34, and the connecting rods 34 on both sides are connected by bending rods 35. The top end of the connecting rod 34 on the other side is connected to the piston rod of the fourth cylinder 37 through a connecting shaft 36, and the fourth cylinder 37 is fixed on the inner wall of the other side of the slicer 1.

[0077] The cross section of the inner bottom wall of the slicing groove 44 is inverted V-shaped; an inverted V-shaped elastic pad 38 is attached to the inner bottom wall of the slicing groove 44 .

[0078] A debris collection device is provided on the inner wall of one side of the slicer 1. The debris collection device includes a debris collection box 39, a collection pipe 40 connected to the other side of the debris collection box 39, and a flared collection cover 41 connected to the collection pipe 40. A box door is pinned on the debris collection box 39. An air pump is provided on the collection pipe 40 (the air pump is not shown in the figure, and a conventional air pump structure and a conventional method of installing a conventional air pump on the pipe can be used); the flared collection cover 41 is separated from the first semiconductor accommodating block 2 by a certain distance.

[0079] Several first semiconductor accommodating blocks 2 are arranged side by side in the longitudinal direction from top to bottom. An ultrasonic distance sensor 43 assembly is provided on the rear end face of each second semiconductor accommodating block 3. The ultrasonic distance sensor 43 assembly is composed of a mounting plate 42 provided on the rear end face of the second semiconductor accommodating block 3, and an ultrasonic distance sensor 43 provided on the front end face of the mounting plate 42. The ultrasonic distance sensor 43 corresponds to the position of the semiconductor crystal rod product installed on its second semiconductor accommodating block 3. The distance between each ultrasonic distance sensor 43 and the inner end face of the second semiconductor accommodating block 3 is equal to the length of the semiconductor slice product.

[0080] The output ends of all ultrasonic distance measuring sensors 43 are electrically connected to the input end of the controller. The output end of the controller is electrically connected to the input end of the air pump. The output end of the controller is electrically connected to the input end of the first cylinder 16, the input end of the second cylinder 18, the input end of the third cylinder 31, and the input end of the fourth cylinder 37. The output end of the controller is electrically connected to the input end of the drive motor 15.

[0081] The beneficial effects of the present invention are:

[0082] First, the pressing plate 33 is not pressed onto the first semiconductor upper accommodating block 201 or the second semiconductor upper accommodating block 301; in the multiple groups of semiconductor accommodating blocks from top to bottom, a plurality of semiconductor crystal rod products are matched and penetrated in a plurality of circular accommodating grooves 4 on both sides, wherein a plurality of first semiconductor accommodating blocks 2 from top to bottom are arranged side by side in the longitudinal direction, and are fixed on the bottom plate of the slicer 1 by means of sleeve fixing rods 6, wherein a plurality of second semiconductor accommodating blocks 3 from top to bottom do not need to be arranged side by side in the longitudinal direction, and a plurality of second semiconductor accommodating blocks 3 are respectively slid in the middle groove by means of their sleeve fixing rods 6 to adapt to the length of the crystal rod itself, and when a plurality of second semiconductor accommodating blocks 3 slide to a suitable position, one, in the pair The second threaded hole and the third threaded hole 11 are connected with bolts 12 in threaded connection, and the bolts 12 extend out of the end of the spacer bar 10 to be fixed with the fastening nut 13, so as to realize the position fixation of several second semiconductor accommodating blocks 3. In addition, a screw is connected with a screw in the first threaded hole 5, and the screw extends out of one end of the first semiconductor accommodating block 2 or the second semiconductor accommodating block 3 to be fixed with the fastening thread; the controller controls the piston rod of the fourth cylinder 37 to move downward, and the piston rod drives the connecting shaft 36, the connecting rod 34, the pressing plate 33, and the bending rod 35 to move downward until the pressing plate 33 is pressed on the first semiconductor upper accommodating block 201 or the second semiconductor; thereby, a plurality of semiconductor crystal rod products with different diameters and lengths are fixed on the semiconductor fixing device;

[0083] like Figure 3As shown, in the initial position, the left end face of the cutting blade 14 is aligned with the right end faces of all the first semiconductor accommodating blocks 2, or a small gap is left between the left end face of the cutting blade 14 and the right end faces of all the first semiconductor accommodating blocks 2; in the initial position, the lengths of the multiple groups of semiconductor crystal rod products decrease successively from top to bottom.

[0084] According to the requirements, the thickness of the semiconductor sliced ​​product formed after the semiconductor crystal rod product is cut by the slicer 1 is set to L (L can be set according to the thickness), and the number of semiconductor sliced ​​products formed after the semiconductor crystal rod product is cut by the slicer 1 is set to N.

[0085] Several positioning calibration plates 23 are installed on the positioning main board 22, such as Figure 3 As shown, the leftmost positioning and calibration plate 23 is attached to the cylinder support seat 17, and then the narrow plates 25 of several positioning and calibration plates 23 are successively inserted through the positioning narrow grooves 24 at appropriate positions from left to right, so that the distance between the left end faces of each two adjacent positioning and calibration plates 23 is L, and then a connecting narrow plate 28 is inserted in the connecting narrow grooves of multiple narrow plates 25, and the two ends of the connecting narrow plate 28 are connected to the positioning main board 22, so that the connection of several installed positioning and calibration plates 23 on the positioning main board 22 is realized. The number of several installed positioning and calibration plates 23 is ≥N+1. The height of the part where the positioning and calibration plate 23 is attached to the cylinder support seat 17 is set to h.

[0086] Then, a mounting plate 42 is glued to the rear end face of each second semiconductor receiving block 3, and an ultrasonic distance sensor 43 is glued to the front end face of each mounting plate 42. The distance between each ultrasonic distance sensor 43 and the inner end face of the second semiconductor receiving block 3 is equal to the length L of the semiconductor slice product, and at this time, the initial distance between the ultrasonic distance sensor 43 and the semiconductor crystal rod product is D.

[0087] The entire slicer 1 is installed.

[0088] When the slicing work is started, the controller controls the drive motor 15 to start, and the motor shaft of the drive motor 15 controls the cutting blade 14 to rotate at a high speed. The controller controls the piston rod of the first cylinder 16 to move downward until the multiple groups of semiconductor crystal rod products are completely cut (the cutting blade 14 does not contact the bottom wall of the slicing groove 44 when the cutting is complete). After the complete cutting, the piston rod of the first cylinder 16 is controlled to move upward to the initial height position, and the first cylinder 16 stops working; then, the controller controls the piston rod of the third cylinder 31 to move upward to a height of h, and the third cylinder 31 stops working. The controller controls the piston rod of the second cylinder 18 to move rightward until the cylinder support 17 is aligned with the left cylinder 18. The second positioning calibration plate 23 is attached to the first end, the first magnet block 29 and the second magnet block 30 are magnetically attracted, and the second cylinder 18 stops working. At this time, the cutting device includes a cutting blade 14 that moves precisely to the right by a stroke L. The controller controls the piston rod of the first cylinder 16 to move downward until multiple groups of semiconductor crystal rod products are completely cut. After the complete cutting, the piston rod of the first cylinder 16 is controlled to move upward to the initial height position, and the first cylinder 16 stops working. Thus, the first batch of semiconductor slice products with the same thickness L are cut and manufactured. The cut semiconductor slice products fall into the slice groove 44 and slide from the inclined surface to the ends of the slice groove 44 on both sides.

[0089] The second batch, the third batch, and the nth batch of semiconductor slice products with the same thickness L are cut in sequence according to the above principle;

[0090] It is worth mentioning that when the distance between each ultrasonic distance sensor 43 and the semiconductor crystal ingot product detected by each ultrasonic distance sensor 43 is greater than the initially set distance D, that is, the remaining length of the semiconductor crystal ingot product of this layer is less than L, the ultrasonic distance sensor 43 transmits the information to the controller, and the controller controls the piston rod of the first cylinder 16 to descend to a height, and in the next cutting operation, the controller controls the piston rod of the first cylinder 16 to descend only to a position where a group of semiconductor crystal ingot products above it is completely cut;

[0091] Therefore, the slicing device for semiconductor production realizes automatic, continuous and precise cutting of multiple semiconductor crystal rod products of different diameters and lengths, with high cutting efficiency, uniform thickness, extremely high product thickness accuracy and good cutting effect.

[0092] During the cutting process, the controller controls the air pump to start working all the time, and the cutting debris generated during the crystal rod slicing process will be sucked into the expanded collection cover 41 in time and collected in the debris collection box 39. The debris collection box 39 has an openable pin-connected door and is a non-sealed box.

[0093] The above are only preferred specific implementation modes of the present invention, but the protection scope of the present invention is not limited thereto. Any technician familiar with the technical field can make equivalent replacements or changes according to the technical solutions and inventive concepts of the present invention within the technical scope disclosed by the present invention, which should be covered by the protection scope of the present invention.

Claims

1. A slicing device for semiconductor production, comprising a slicing machine (1), wherein the slicing machine (1) is provided with a semiconductor fixing device, a slicing device and a positioning device, characterized in that: The bottom end of the bottom plate of the slicer (1) is provided with a slice groove (44); the top end of the bottom plate of the slicer (1) is provided with a semiconductor fixing device; the semiconductor fixing device comprises a plurality of groups of semiconductor accommodating blocks arranged in sequence from top to bottom, each group of semiconductor accommodating blocks is composed of a first semiconductor accommodating block (2) fixedly arranged on one side of the slice groove (44), and a second semiconductor accommodating block (3) slidably arranged on the other side of the slice groove (44); a group of semiconductor initial products is fastened in each group of semiconductor accommodating blocks; the slicer comprises a cutting blade (14) arranged above the semiconductor initial product, a driving motor (15) connected to the middle of the cutting blade (14), and a longitudinal movement driving device connected to the driving motor (15); the longitudinal movement driving device A lateral moving drive device is provided on one side of the top of the device; the lateral moving drive device is fixedly arranged on one inner wall of the slicer (1); the positioning device comprises a positioning main board (22), and a plurality of positioning and marking plates (23) evenly and detachably arranged on the lower end of the positioning main board (22); the positioning and marking plates (23) at the end of one side are attached to the other side of the top of the longitudinal moving drive device; the lengths of the plurality of positioning and marking plates (23) increase evenly from one side of the slicer (1) toward the other side; the distance between every two adjacent positioning and marking plates (23) is the length of the semiconductor sliced ​​product; the lower end of the other side of the positioning device is connected to another longitudinal moving drive device, and the other longitudinal moving drive device is fixedly arranged on the inner wall of the other side of the slicer (1); The first semiconductor accommodating block (2) and the second semiconductor accommodating block (3) in each group of semiconductor accommodating blocks are arranged side by side in the horizontal direction; The first semiconductor accommodating block (2) is composed of a first semiconductor upper accommodating block (201) and a first semiconductor lower accommodating block (202) stacked together; the second semiconductor accommodating block (3) is composed of a second semiconductor upper accommodating block (301) and a second semiconductor lower accommodating block (302) stacked together; a plurality of upper semicircular accommodating grooves are respectively provided on opposite side end surfaces of the first semiconductor upper accommodating block (201) and the second semiconductor upper accommodating block (301); the first semiconductor lower accommodating block (202) and the second semiconductor lower accommodating block (302) are respectively provided with a plurality of upper semicircular accommodating grooves; A plurality of lower semicircular receiving grooves are respectively provided on the opposite side end surfaces; the radius of each upper semicircular receiving groove and the lower semicircular receiving groove of the first semiconductor receiving block (2) or the second semiconductor receiving block (3) is the same, and the two grooves with the same radius are spliced ​​together to form a circular receiving groove (4); the diameters of the plurality of circular receiving grooves (4) of each group of semiconductor receiving blocks are equal, and the diameters of the circular receiving grooves (4) of the plurality of groups of semiconductor receiving blocks are different; and a plurality of semiconductor initial products are respectively matched and fastened in the plurality of circular receiving grooves (4) on both sides of each group of semiconductor receiving blocks; A first threaded hole (5) is provided at the outer end of the first semiconductor upper accommodating block (201) or the first semiconductor lower accommodating block (202) of each first semiconductor accommodating block (2), the first threaded hole (5) is communicated with the circular accommodating groove (4) on the first semiconductor accommodating block (2), and the diameter of the first threaded hole (5) is smaller than the radius of the circular accommodating groove (4); a first threaded hole (5) is also provided at the outer end of the second semiconductor upper accommodating block (301) or the second semiconductor lower accommodating block (302) of each second semiconductor accommodating block (3), the first threaded hole (5) is communicated with the circular accommodating groove (4) on the second semiconductor accommodating block (3), and the diameter of the first threaded hole (5) is smaller than the radius of the circular accommodating groove (4); The outer end of each first semiconductor accommodating block (2) is provided with a sleeve fixing rod (6), and the sleeve fixing rod (6) on one side is fixedly arranged on the upper end of the bottom plate of the slicer (1); the outer end of each second semiconductor accommodating block (3) is provided with a sleeve fixing rod (6), and the sleeve fixing rod (6) on the other side is slidably arranged on the upper end of the bottom plate of the slicer (1).

2. The semiconductor production slicing device according to claim 1, characterized in that: An upper slide groove (601) and a lower slide groove (602) which are not connected to each other are provided on the inner side end surface of each of the sleeve fixing rods (6) on one side; a slide bar (7) is provided on the outer side end of each of the first semiconductor upper accommodating blocks (201); the slide bar (7) is matched and slidably arranged in the upper slide groove (601); the rod height of the sleeve fixing rod (6) of the lower first semiconductor accommodating block (2) of each two upper and lower adjacent first semiconductor accommodating blocks (2) is equal to the lower height of the sleeve fixing rod (6) of the upper first semiconductor accommodating block (2). The height of the groove (602) is such that the rod thickness of the sleeve fixing rod (6) of the lower first semiconductor accommodating block (2) of each two upper and lower adjacent first semiconductor accommodating blocks (2) is equal to the depth of the lower groove (602) of the sleeve fixing rod (6) of the upper first semiconductor accommodating block (2); the sleeve fixing rod (6) of the lower first semiconductor accommodating block (2) of each two upper and lower adjacent first semiconductor accommodating blocks (2) is matched and embedded in the lower groove (602) of the sleeve fixing rod (6) of the upper first semiconductor accommodating block (2); An upper slide groove (601) and a lower slide groove (602) which are not connected to each other are provided on the inner side end surface of each of the sleeve fixing rods (6) on the other side, and a slide bar (7) is provided on the outer side end of each of the second semiconductor upper accommodating blocks (301), and the slide bar (7) is matched and slidably arranged in the upper slide groove (601); the rod height of the sleeve fixing rod (6) of the lower second semiconductor accommodating block (3) of each two upper and lower adjacent second semiconductor accommodating blocks (3) is equal to the height of the lower slide groove (602) of the sleeve fixing rod (6) of the upper second semiconductor accommodating block (3), and the rod thickness of the sleeve fixing rod (6) of the lower second semiconductor accommodating block (3) of each two upper and lower adjacent second semiconductor accommodating blocks (3) is equal to the depth of the lower slide groove (602) of the sleeve fixing rod (6) of the upper second semiconductor accommodating block (3); The other side of the bottom plate of the slicer (1) is provided with a middle groove (8) and a side groove (9) in a transverse direction, the front end and the rear end of the middle groove (8) are provided with side grooves (9) respectively, and a spacer bar (10) is provided between the middle groove (8) and the front end and the rear end side grooves (9); the lower end of each sleeve fixing rod (6) on the other side is provided with a receiving slider (45); each receiving slider (45) is provided with a second threaded hole, and the spacer bar (10) is provided with a plurality of third threaded holes (11) uniformly extending therethrough, and the diameter of the second threaded hole is the same as the diameter of the third threaded hole (11); the second threaded hole and the third threaded hole (11) of the receiving slider (45) aligned with each other are threadedly connected with a bolt (12), and one end of the bolt (12) extending out of the spacer bar (10) is threadedly connected with a fastening nut (13).

3. The semiconductor production slicing device according to claim 2, characterized in that: The transverse movement driving device is a first cylinder (16); the longitudinal movement driving device is a second cylinder (18); and the other longitudinal movement driving device is a third cylinder (31); The upper end cover of each first semiconductor upper accommodating block (201) is provided with a pressure plate (33), and the upper end of each second semiconductor upper accommodating block (301) is also covered with a pressure plate (33). The outer ends of the pressure plates (33) on both sides are respectively provided with connecting rods (34), and the connecting rods (34) on both sides are connected by a bending rod (35); the top end of the connecting rod (34) on the other side is connected to the piston rod of the fourth cylinder (37) through a connecting shaft (36), and the fourth cylinder (37) is fixedly arranged on the inner wall of the other side of the slicer (1).

4. The semiconductor production slicing device according to claim 3, characterized in that: A first cylinder guide plate (19) is transversely disposed on the inner wall of the other side of the slicer (1); a certain distance is provided between the first cylinder guide plate (19) and the cutting blade (14); a strip-shaped slide groove (20) is transversely provided on the first cylinder guide plate (19); the width of the strip-shaped slide groove (20) is equal to the outer diameter of the piston rod of the first cylinder (16); the length of the strip-shaped slide groove (20) is not less than the distance between the positioning calibration plates (23) at both ends; the piston rod of the first cylinder (16) passes through the strip-shaped slide groove (20); The diameter of the cutting blade (14) is greater than the width of any group of semiconductor initial products; the radius of the cutting blade (14) is less than the depth of the cutting groove; A second cylinder guide plate (21) is longitudinally provided on the inner top wall of the slicer (1); a certain distance is provided between the second cylinder guide plate (21) and the cutting blade (14); a second through hole is provided through the second cylinder guide plate (21); the diameter of the second through hole is equal to the outer diameter of the piston rod of the second cylinder (18); the piston rod of the second cylinder (18) is matched and passes through the second through hole; A third cylinder guide plate (32) is transversely disposed on the inner wall of the other side of the slicer (1); a certain distance is provided between the third cylinder guide plate (32) and the positioning calibration plate (23); a third through hole is formed through the third cylinder guide plate (32); the diameter of the third through hole is equal to the outer diameter of the piston rod of the third cylinder (31); the piston rod of the third cylinder (31) is matched and penetrates through the third through hole; A fourth cylinder guide plate (46) is transversely arranged on the inner wall of the other side of the slicer (1); the fourth cylinder guide plate (46) is spaced a certain distance from the second semiconductor accommodating block (3); a fourth through hole is formed through the fourth cylinder guide plate (46); the diameter of the fourth through hole is equal to the outer diameter of the piston rod of the fourth cylinder (37); and the piston rod of the fourth cylinder (37) is matched and penetrates through the fourth through hole.

5. The semiconductor production slicing device according to claim 3, characterized in that: A cylinder support (17) is provided at the top end of the first cylinder (16); a piston rod of the second cylinder (18) is connected to the cylinder support (17) through a connecting block; a first magnet block (29) is embedded on the other side of the cylinder support (17); a second magnet block (30) is embedded at the lower end of the side end surface of each positioning and calibration plate (23) opposite to the cylinder support (17); the side end surfaces of the first magnet block (29) and the second magnet block (30) opposite to each other are magnetically attracted, and the first magnet block (29) of the positioning and calibration plate (23) at one end is magnetically attracted to the second magnet block (30) of the cylinder support (17); the height difference between each two adjacent positioning and calibration plates (23) is equal to the height of the part where the positioning and calibration plate (23) at one end and the cylinder support (17) are in contact.

6. The semiconductor production slicing device according to claim 5, characterized in that: The positioning main board (22) is evenly provided with a plurality of narrow positioning grooves (24), and the other outer end of the positioning main board (22) is provided with a positioning slider (26); A positioning groove (27) is longitudinally provided on the inner wall of the other side of the slicer (1), and the positioning slide block (26) is matched and embedded in the positioning groove (27); a narrow plate (25) is provided at the top of each positioning calibration plate (23), and each narrow plate (25) is penetrated by a positioning narrow groove (24) extending therethrough, and a connecting narrow groove is transversely penetrated at one end of each narrow plate (25) extending therethrough from the positioning narrow groove (24); a connecting narrow plate (28) is commonly penetrated in the connecting narrow grooves of all the narrow plates (25); both ends of the connecting narrow plate (28) are mutually threadedly connected to the positioning main plate (22); and the lower end of the other side of the positioning main plate (22) is connected to the piston rod of the third cylinder (31) through a connecting block.

7. The semiconductor production slicing device according to claim 1, characterized in that: The cross section of the inner bottom wall of the slicing groove (44) is in an inverted V shape; an inverted V-shaped elastic pad (38) is provided on the inner bottom wall of the slicing groove (44).

8. The semiconductor production slicing device according to any one of claims 1 to 7, characterized in that: A debris collection device is provided on an inner wall of one side of the slicer (1); the debris collection device comprises a debris collection box (39), a collection pipe (40) connected to the other side of the debris collection box (39), and an expanded collection cover (41) connected to the collection pipe (40); a box door is pinned to the debris collection box (39); an air pump is provided on the collection pipe (40); and a certain distance is between the expanded collection cover (41) and the first semiconductor accommodating block (2).

9. The semiconductor production slicing device according to claim 8, characterized in that: A plurality of first semiconductor accommodating blocks (2) are arranged side by side in a longitudinal direction from top to bottom; an ultrasonic distance sensor (43) assembly is provided on the rear end face of each second semiconductor accommodating block (3); the ultrasonic distance sensor (43) assembly is composed of a mounting plate (42) provided on the rear end face of the second semiconductor accommodating block (3), and an ultrasonic distance sensor (43) provided on the front end face of the mounting plate (42); the ultrasonic distance sensor (43) corresponds to the position of the semiconductor initial product installed on the second semiconductor accommodating block (3); the distance between each ultrasonic distance sensor (43) and the inner end face of the second semiconductor accommodating block (3) is equal to the length of the semiconductor slice product; All ultrasonic distance measuring sensors (43) are electrically connected to the controller; the controller is electrically connected to the air pump; the controller is electrically connected to the first cylinder (16), the second cylinder (18), the third cylinder (31), and the fourth cylinder (37), respectively; and the controller is electrically connected to the drive motor (15).

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