A semiconductor silicon wafer laser soft lettering method, device, medium and product

Abstract

Embodiments of the present application relate to the field of semiconductor processing, and disclose a semiconductor silicon wafer laser soft lettering method, equipment, medium and product. Three laser positioning points are obtained in a laser soft lettering target area, and depth values of a first positioning point, a second positioning point and a third positioning point are obtained. A center difference value is obtained according to the depth value of the second positioning point and a preset standard lettering depth value. An edge difference value is obtained according to the depth value of the first positioning point and the depth value of the third positioning point. A total difference value is obtained according to the depth value of the first positioning point, the depth value of the second positioning point, the depth value of the third positioning point and the standard lettering depth value. The operation parameters of a laser lettering machine and the placement position of a silicon wafer are adjusted according to the center difference value, the edge difference value and the total difference value. The technical problem of uneven left and right lettering depth of lettering code in the soft lettering process can be solved.

Description

Technical Field

[0001] This application relates to the field of semiconductor processing, and in particular to a method, equipment, medium and product for laser soft engraving on semiconductor silicon wafers. Background Technology

[0002] In the semiconductor manufacturing industry, the marking process on silicon wafers is crucial, and its final quality largely depends on the clarity of the markings. The silicon wafers undergo soft marking in the final stage of manufacturing; this process aims to create effective and rapid identification marks on the wafer. These markings not only track and record product information but also directly impact subsequent wafer processing, such as wafer dicing and polishing.

[0003] With technological advancements, modern semiconductor companies have widely adopted highly automated engraving equipment to meet the demands for high efficiency and precision in production. However, over extended periods of operation, the performance of these devices may degrade and wear down, affecting engraving quality. Traditional equipment and production process monitoring methods primarily focus on pre-production sample inspection, such as judging the engraving machine's operational status by sampling and reading the center point of barcode characters. However, this method has limitations, especially when the silicon wafer is not ideally positioned. For example, if the central suction cup is not level, it may lead to inconsistent engraving depth, thus affecting the overall quality of the finished silicon wafer. Summary of the Invention

[0004] One objective of this application is to provide a method, apparatus, medium, and product for laser soft engraving on semiconductor silicon wafers, at least to solve the problem of inconsistent engraving depth affecting the quality of silicon wafer output.

[0005] To achieve the above objectives, some embodiments of this application provide the following aspects:

[0006] In a first aspect, some embodiments of this application also provide a method for laser soft engraving on a semiconductor silicon wafer, comprising: acquiring three laser positioning points in the laser soft engraving target area to obtain depth values ​​of a first positioning point, a second positioning point, and a third positioning point; and obtaining a center difference value X based on the depth value X2 of the second positioning point and a preset standard engraving depth value T. m Based on the depth value X1 of the first positioning point and the depth value X2 of the third positioning point, the edge difference Y is obtained. m The total difference Z is obtained based on the depth values ​​X1, X2, and X3 of the first positioning point and the standard engraving depth value T. m According to the central difference X m Marginal difference Y m Sum of total differences Z mAdjust the operating parameters of the laser engraving machine and the placement of the silicon wafer.

[0007] Secondly, some embodiments of this application also provide an electronic device, the electronic device comprising: one or more processors; and a memory storing computer program instructions, which, when executed, cause the processor to perform the steps of the method described above.

[0008] Thirdly, some embodiments of this application also provide a computer-readable medium having computer program instructions stored thereon, which can be executed by a processor to implement the method described above.

[0009] Fourthly, some embodiments of this application also provide a computer program product, including a computer program / instructions that, when executed by a processor, implement the steps of the method described above.

[0010] Compared with related technologies, the solution provided in this application embodiment uses a semiconductor silicon wafer laser soft engraving method to strengthen daily monitoring by taking three-point tests on the sample wafer for engraving and judging whether the engraving machine is working properly by the difference of the three target values. It can also judge the level of the product's process capability by examining the silicon wafer or engraving sample for engraving. Attached Figure Description

[0011] One or more embodiments are illustrated by way of example with reference numerals in the accompanying drawings. These illustrations do not constitute a limitation on the embodiments. Elements with the same reference numerals in the drawings are denoted as similar elements. Unless otherwise stated, the figures in the drawings are not to be limited by scale.

[0012] Figure 1 This is a schematic flowchart of a method for laser soft engraving on a semiconductor silicon wafer according to an embodiment of this application;

[0013] Figure 2 This is a schematic diagram illustrating the effect of a laser soft engraving method for semiconductor silicon wafers according to an embodiment of this application;

[0014] Figure 3 This is a schematic diagram illustrating the effect of another laser soft engraving method for semiconductor silicon wafers provided in accordance with an embodiment of this application;

[0015] Figure 4 This is a schematic diagram of the structure of an electronic device according to an embodiment of this application. Detailed Implementation

[0016] To make the objectives, technical solutions, and advantages of the embodiments of this application clearer, the technical solutions of the embodiments of this application will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of this application, not all embodiments. Based on the embodiments of this application, all other embodiments obtained by those skilled in the art without creative effort are within the scope of protection of this application.

[0017] First Embodiment

[0018] The first embodiment of this application relates to a method for laser soft engraving on a semiconductor silicon wafer. For example... Figure 1 As shown, the method may include the following steps:

[0019] S101. Obtain three laser positioning points in the laser soft engraving target area to obtain the depth values ​​of the first, second, and third positioning points. Within the predetermined laser soft engraving target area on the silicon wafer, three key laser positioning points are clearly selected. These points are located on the left, center, and right sides of the engraving area, respectively, which helps to comprehensively assess the depth consistency and potential deviations within the engraving area. These three positioning points are precisely marked using the positioning device or strategy built into the laser engraving machine. This positioning device utilizes the principle of a laser measuring instrument, which can not only mark the position but also directly read the initial depth value of the silicon wafer at each positioning point. Depth measurement is performed at each positioning point to ensure accurate depth data is obtained. Subsequent calculations of the center difference, edge difference, and total difference directly depend on the accuracy of this depth data. By determining these three laser positioning points, the depth values ​​of these points will be used to calculate the difference from the preset standard engraving depth value, thereby assessing the accuracy of the engraving process and guiding the adjustment of the laser engraving machine operating parameters and the silicon wafer placement position.

[0020] S102. Based on the depth value X2 of the second positioning point and the preset standard engraving depth value T, obtain the center difference value X. m After obtaining the depth value X2 of the second positioning point (located at the center of the engraving area), this value is compared with the preset standard engraving depth value T. The center difference X... m The depth is obtained by subtracting the actual measured depth at the second positioning point from the standard engraving depth value T. This difference reflects the deviation between the actual engraving depth of the engraving machine in the center area and the preset target. By analyzing the magnitude of the center difference, the accuracy of the laser engraving machine in performing engraving tasks can be directly evaluated. If the center difference is within an acceptable range, it indicates that the performance of the engraving machine meets the requirements; otherwise, it may indicate that the performance of the engraving machine deviates from the preset value and further adjustments are needed.

[0021] S103. Based on the depth value X1 of the first positioning point and the depth value X2 of the third positioning point, obtain the edge difference Y. m The depth values ​​of the first positioning point on the left and the third positioning point on the right of the laser-engraved target area are measured. The difference between these two depth values ​​is then calculated to obtain the edge difference, which reflects the inconsistency in engraving depth across the silicon wafer. The magnitude of the edge difference directly reflects the horizontal state of the silicon wafer relative to the laser source during laser engraving. If the edge difference is close to zero or within an acceptable error range, it indicates that the silicon wafer maintains a good horizontal state during engraving, and the engraving machine is working normally. If the edge difference exceeds the normal range, it may indicate that the silicon wafer is tilted or the engraving machine is tilted, affecting the uniformity of the engraving depth. Analysis of the edge difference provides accurate data support for adjusting the silicon wafer placement or the engraving machine's state. Based on the specific edge difference, corresponding adjustments can be made, such as repositioning the silicon wafer, adjusting the horizontal state of the laser engraving machine, or modifying the laser engraving parameters, to ensure high quality and consistency in the engraving process.

[0022] S104. Based on the depth value X1 of the first positioning point, the depth value X2 of the second positioning point, and the depth value X3 of the third positioning point, and the standard engraving depth value T, the total difference Z is obtained. m The total difference reflects the overall deviation between the actual engraving depth and the preset depth of the laser soft engraving machine. This not only evaluates the overall performance of the engraving machine but also indicates whether adjustments to the engraving process are needed to ensure that all engraving depths meet the standard requirements. If the total difference exceeds the acceptable range, it indicates a systematic depth deviation in the laser soft engraving process. In this case, secondary corrections to the laser engraving machine are required, including but not limited to adjusting the laser power, changing the laser focus setting, and adjusting the silicon wafer placement, to reduce the total difference and restore the engraving depth to the preset standard. By accurately calculating and adjusting the total difference, high precision and high quality of the laser engraving process are ensured, improving the reliability of the engraving process. This method not only optimizes the quality of individual engravings but also helps maintain the long-term stability and accuracy of the engraving equipment, improving the efficiency of the overall production line and product quality.

[0023] S105, Based on the central difference X m Marginal difference Y m Sum of total differences Z m Adjust the operating parameters of the laser engraving machine and the placement of the silicon wafer.

[0024] It is easy to see that, compared with related technologies, the solution provided in this application embodiment can significantly improve the quality and consistency of laser engraving on silicon wafers, ensure that the engraving depth reaches the preset standard, and reduce engraving errors caused by improper silicon wafer position.

[0025] Second Embodiment

[0026] The second embodiment of this application relates to a laser soft engraving method for semiconductor silicon wafers. The second embodiment is an improvement upon the first embodiment, such as… Figure 2 and Figure 3 As shown, the specific improvements are as follows:

[0027] The central difference X m =T-X2; Based on the center difference, determine the center focus of the laser engraving machine. When the center difference angle exceeds the set standard center focus range, adjust the laser power and focus parameters of the laser engraving machine. X m The center difference is used to determine the difference between the preset value and the actual engraved depth of the laser engraving machine. If X m The value ≠ 0, meaning the relationship between the actual depth of the engraving machine and the set value is: actual value > set value + 0.5µm and actual value < set value - 0.5µm. It is necessary to confirm the operating current and voltage of the laser tube, as well as the lifespan of the laser tube, and other hardware conditions of the laser engraving machine. The above standard center focus range can be adjusted according to the actual situation and equipment parameters.

[0028] The edge difference Y m =X3-X2; The horizontal level of the silicon wafer placement is determined based on the edge difference. When the horizontal level exceeds the set standard horizontal level range, the placement of the silicon wafer is adjusted. Y m It serves as a criterion for judging whether the engraving by a laser engraving machine is tilted to the left or right, providing data reference for ensuring that the engraving meets the horizontal requirements. If Y m If the value is ≠0, it means that the engraved text is tilted, requiring calibration of the laser engraving machine's carrier or the silicon wafer's suction cup, as well as the overall level of the machine (a high-precision level instrument can be used for level calibration). The above standard level range can be adjusted according to the actual situation and equipment parameters.

[0029] The total difference Z m =T - (X1 + X2 + X3) / 3; based on the total difference Z m The accuracy of laser engraving on the silicon wafer is determined. When the accuracy exceeds the set standard engraving accuracy range, the operating parameters of the laser engraving machine and the placement of the silicon wafer are adjusted. mThis is the difference between the actual level of the laser engraving machine and the set value, used for secondary correction of the overall engraving level. If the overall difference (Z) is greater than 0.5µm, actual calibration of the overall engraving depth is required. This can be achieved by increasing or decreasing the actual power of the engraving machine to correct the deviation between the set and actual values. The above-mentioned standard engraving accuracy range can be adjusted according to the actual situation and equipment parameters.

[0030] The operating parameters of the laser engraving machine include laser power, focusing parameters, pulse frequency, and scanning speed; the laser engraving machine obtains the depth values ​​of the first positioning point, the second positioning point, and the third positioning point through a laser measuring instrument; and adjusts the operating parameters of the laser engraving machine based on the feedback results of at least one of the center difference, edge difference, and total difference. Laser power determines the energy of the laser beam when irradiating the silicon wafer. Increasing laser power can increase the depth of engraving, but excessive power may cause blurry engravings. The laser power should be adjusted appropriately based on feedback from the center difference and total difference. Focusing parameters determine the focal point of the laser beam, affecting the fineness of the engraving. Improper focusing may result in blurry or uneven engravings. Adjusting the focusing parameters ensures the laser beam is precisely focused on the silicon wafer surface. Adjusting based on edge difference feedback optimizes the uniformity of the engraving. Pulse frequency determines the laser emission interval, affecting the speed of the engraving process and the heat-affected zone. An appropriate pulse frequency can improve engraving efficiency while reducing thermal damage to the silicon wafer and maintaining engraving quality. Scanning speed is the speed at which the laser head moves, directly affecting the engraving time and depth. Fast scanning can improve production efficiency, but too fast scanning may result in unclear or insufficient engraving depth. Adjusting the scanning speed based on total difference feedback balances production efficiency and engraving quality.

[0031] By acquiring depth values ​​at the first, second, and third positioning points using a laser measuring instrument, the laser engraving machine can monitor depth deviations during the engraving process in real time. Based on feedback from at least one of the aforementioned center difference, edge difference, and total difference, the system automatically or manually adjusts the above operating parameters to ensure the engraving process is optimized. This dynamic adjustment mechanism based on real-time feedback not only improves engraving quality but also enhances the adaptability and flexibility of the laser engraving machine, providing an efficient and reliable engraving solution for the semiconductor manufacturing industry.

[0032] The silicon wafer is positioned so that it is relatively horizontal relative to the laser engraving machine by adjusting its placement using mechanical components. These mechanical components include suction cups, trays, or mechanical grippers for securing the silicon wafer. Ensuring the correct placement of the silicon wafer during laser soft engraving is crucial for achieving high-quality engraving results. Deviations in the wafer's position, especially non-horizontal placement, directly affect the consistency and accuracy of the engraving depth. The main function of the mechanical components is to adjust the wafer's placement, ensuring it remains horizontal during the laser soft engraving process. This adjustment is based on the edge difference calculated in the preceding steps and the overall depth consistency requirements of the silicon wafer during the engraving process.

[0033] Suction cups secure silicon wafers via vacuum adsorption, allowing for minute position adjustments, making them particularly suitable for finely adjusting wafer level. Their flexibility makes them ideal for wafer positioning. Trays can be equipped with fine-tuning mechanisms to adjust the wafer's level and position. Adjusting the tray mechanically or automatically enables precise wafer placement. Mechanical grippers precisely grasp and move the wafer to a designated location. Adjusting the angle and position of the grippers allows for wafer leveling and precise placement. Based on edge difference feedback, operators or automated control systems determine the wafer's level and, by activating one of the aforementioned mechanical components, fine-tune its position and angle to ensure optimal placement during the engraving process. This precise position adjustment significantly improves the consistency of engraving depth, reduces engraving errors caused by wafer positional deviations, and thus enhances the overall quality and efficiency of the engraving process. By introducing mechanical components such as suction cups, trays, or mechanical grippers for wafer position adjustment, the placement problem of silicon wafers during laser soft engraving is effectively solved, ensuring the correct position and level of the wafer and providing a reliable guarantee for high-quality laser engraving.

[0034] Third Embodiment

[0035] The third embodiment of this application relates to a method for laser soft engraving on a semiconductor silicon wafer. The third embodiment is an improvement upon the first embodiment, specifically in that:

[0036] Before performing batch laser soft engraving on semiconductor silicon wafers, sample silicon wafers are taken for inspection, based on the center difference value X. m Marginal difference Y m Sum of total differences Z m Adjust the operating parameters of the laser engraving machine and the placement of the silicon wafer; when the adjusted center difference X m Marginal difference Y m Sum of total differences Z m Once the engraving standards are met, the subsequent silicon wafers are engraved in batches according to the current operating parameters of the laser engraving machine and the placement of the silicon wafers.

[0037] In the initial stages of production, a small number of silicon wafers are selected as samples, and laser engraving machines are used to engrave characters on these samples. The purpose is to obtain initial engraving quality data to assess the current operating status of the laser engraving machine and ensure that it is calibrated to an ideal operating state before mass production begins, thus avoiding quality problems during batch production. The laser measuring instrument in the laser engraving machine is used to accurately measure the engraving depth on the samples, providing high-precision depth data and obtaining actual engraving depth data, providing a basis for subsequent quality control and machine adjustments. The depth data obtained from three positioning points are analyzed, and the center difference, edge difference, and total difference are calculated to assess the consistency and accuracy of the engraving depth. Through the analysis of these differences, it is possible to intuitively understand whether the engraving machine is working normally according to the predetermined parameters and whether further adjustments are needed. The analyzed data is visualized to generate specific graphs (such as depth distribution maps). These graphs are used to assess whether the engraving codes meet quality standards. Through graphical data representation, engraving quality can be judged more intuitively, facilitating the identification of any possible problem areas and quickly making a judgment on whether it is qualified or not. Once the engraving quality on the sample is confirmed to meet the predetermined quality standards, the mass production process of silicon wafers can begin, ensuring that each batch of silicon wafers achieves the same high standard of engraving quality, thereby maintaining the efficiency of the entire production line and the consistency of the products.

[0038] This laser soft engraving process for semiconductor silicon wafers can significantly improve the accuracy and consistency of engraving on silicon wafers, thereby ensuring high-quality standards for semiconductor products, reducing scrap rates, and increasing production efficiency.

[0039] The steps of the various methods described above are only for clarity. In practice, they can be combined into one step or some steps can be split into multiple steps. As long as they include the same logical relationship, they are all within the scope of protection of this patent. Adding insignificant modifications or introducing insignificant designs to the algorithm or process, but without changing the core design of the algorithm and process, are also within the scope of protection of this patent.

[0040] Furthermore, some embodiments of this application also provide an electronic device. The electronic device can be various forms of digital computer, such as laptop computers, desktop computers, workstations, personal digital assistants, servers, blade servers, mainframe computers, etc. The electronic device can also be various forms of mobile devices, such as personal digital processors, cellular phones, smartphones, wearable devices, and other similar computing devices.

[0041] The electronic device includes: one or more processors; and a memory storing computer program instructions that, when executed, cause the processor to perform the steps of the methods provided in any one or more of the above embodiments. Figure 4 An exemplary structural diagram of the electronic device is disclosed. For example... Figure 4 As shown, the electronic device includes one or more processors 1101, a memory 1102, and interfaces for connecting the components, including high-speed interfaces and low-speed interfaces. The components are interconnected via different buses and can be mounted on a common motherboard or otherwise as required. The processors can process instructions executed within the electronic device, including instructions stored in or on memory to display graphical information of the GUI on an external input / output device (such as a display device coupled to the interface). In some other embodiments, multiple processors and / or multiple buses can be used with multiple memories and multiple memory modules, if desired. Similarly, multiple electronic devices can be connected, each providing some of the necessary operations (e.g., as a server array, a group of blade servers, or a multiprocessor system). The components, their connections and relationships, and their functions shown herein are merely examples and are not intended to limit the implementation of the present application described and / or claimed herein.

[0042] The electronic device may further include an input device 1103 and an output device 1104. The processor 1101, memory 1102, input device 1103, and output device 1104 may be connected via a bus or other means. Figure 4 Taking the example of a connection between China and Israel via a bus.

[0043] Input device 1103 can receive input numerical or character information, and generate key signal inputs related to user settings and function control of the electronic device, such as a touch screen, keypad, mouse, trackpad, touchpad, joystick, one or more mouse buttons, trackball, joystick, etc. Output device 1104 may include a display device, auxiliary lighting device (e.g., LED), and haptic feedback device (e.g., vibration motor). The display device may include, but is not limited to, a liquid crystal display (LCD), a light-emitting diode (LED) display, and a plasma display. In some embodiments, the display device may be a touch screen.

[0044] To provide interaction with the user, the electronic device can be a computer. The computer has: a display device for displaying information to the user (e.g., a CRT (cathode ray tube) or LCD (liquid crystal display) monitor); and a keyboard and pointing device (e.g., a mouse or trackball) through which the user provides input to the computer. Other types of devices can also be used to provide interaction with the user; for example, the feedback provided to the user can be any form of sensory feedback (e.g., visual feedback, auditory feedback, or tactile feedback); and input from the user can be received in any form (including sound input, voice input, or tactile input).

[0045] In this embodiment, a computer-readable medium stores a computer program / instructions that, when executed by a processor, implement the steps of the methods provided in any one or more of the above embodiments. This computer-readable medium may be included in the electronic device described in the above embodiments; or it may exist independently and not assembled into that device. The aforementioned computer-readable medium carries one or more computer-readable instructions.

[0046] The memory 1102 can serve as a non-transitory computer-readable storage medium, used to store non-transitory software programs, non-transitory computer-executable programs, and modules. The processor 1101 executes various functional applications and data processing of the server by running the non-transitory software programs, instructions, and modules stored in the memory 1102, thereby implementing the program instructions / modules corresponding to the methods provided in any one or more of the embodiments described above in this application.

[0047] The memory 1102 may include a program storage area and a data storage area. The program storage area may store the operating system and applications required for at least one function; the data storage area may store data created based on the use of the electronic device. Furthermore, the memory 1102 may include high-speed random access memory and may also include non-transitory memory, such as at least one disk storage device, flash memory device, or other non-transitory solid-state storage device. In some embodiments, the memory 1102 may optionally include memory remotely located relative to the processor 1101, and these remote memories can be connected to the electronic device via a network. Examples of such networks include, but are not limited to, the Internet, intranets, local area networks, mobile communication networks, and combinations thereof.

[0048] It should be noted that the computer-readable medium described in this application can be a computer-readable signal medium or a computer-readable storage medium, or any combination thereof. A computer-readable medium can be, for example,—but not limited to—an electrical, magnetic, optical, electromagnetic, infrared, or semiconductor system, apparatus, or device, or any combination thereof. More specific examples of a computer-readable storage medium may include, but are not limited to: an electrical connection having one or more wires, a portable computer disk, a hard disk, random access memory (RAM), read-only memory (ROM), erasable programmable read-only memory (EPROM or flash memory), optical fiber, portable compact disk read-only memory (CD-ROM), optical storage device, magnetic storage device, or any suitable combination thereof. In this application, a computer-readable medium can be any tangible medium containing or storing a program that can be used by or in conjunction with an instruction execution system, apparatus, or device.

[0049] Computer-readable media include both permanent and non-permanent, removable and non-removable media, which can store information using any method or technology. Information can be computer-readable instructions, data structures, modules of programs, or other data. Examples of computer storage media include, but are not limited to, phase-change memory (PRAM), static random access memory (SRAM), dynamic random access memory (DRAM), other types of random access memory (RAM), read-only memory (ROM), electrically erasable programmable read-only memory (EEPROM), flash memory or other memory technologies, read-only optical disc (CD-ROM), digital versatile optical disc (DVD) or other optical storage, magnetic tape, magnetic disk storage or other magnetic storage devices, or any other non-transfer medium that can be used to store information accessible by a computing device.

[0050] Computer program code for performing the operations of this application can be written in one or more programming languages ​​or a combination thereof, including object-oriented programming languages ​​such as Java, Smalltank, and C++, and conventional procedural programming languages ​​such as the "C" language or similar programming languages. The program code can be executed entirely on the user's computer, partially on the user's computer, as a standalone software package, partially on the user's computer and partially on a remote computer, or entirely on a remote computer or server. In cases involving remote computers, the remote computer can be connected to the user's computer via any type of network—including a local area network (LAN) or a wide area network (WAN)—or can be connected to an external computer (e.g., via the Internet using an Internet service provider).

[0051] In the above embodiments, all or part of the implementation can be achieved through software, hardware, firmware, or any combination thereof. For example, it can be implemented using an application-specific integrated circuit (ASIC), a general-purpose computer, or any other similar hardware device. In some embodiments, the software program of this application can be executed by a processor to implement the above steps or functions. Similarly, the software program of this application (including related data structures) can be stored in a computer-readable recording medium, such as RAM memory, magnetic or optical drives, floppy disks, and similar devices. In addition, some steps or functions of this application can be implemented in hardware, for example, as circuitry that cooperates with a processor to perform the various steps or functions.

[0052] The computer program product provided in this application includes one or more computer programs / instructions. When executed by a processor, these computer programs / instructions generate, in whole or in part, the processes or functions described in this application. The computer may be a general-purpose computer, a special-purpose computer, a computer network, or other programmable device. The computer instructions may be stored in a computer-readable storage medium or transmitted from one computer-readable storage medium to another. For example, the computer instructions may be transmitted from one website, computer, server, or data center to another via wired (e.g., coaxial cable, fiber optic, digital subscriber line (DSL)) or wireless (e.g., infrared, wireless, microwave, etc.) means. The computer-readable storage medium may be any available medium accessible to a computer or a data storage device such as a server or data center that integrates one or more available media. The available medium may be a magnetic medium (e.g., floppy disk, hard disk, magnetic tape), an optical medium (e.g., DVD), or a semiconductor medium (e.g., solid-state drive (SSD)).

[0053] The flowcharts or block diagrams in the accompanying drawings illustrate the architecture, functionality, and operation of possible implementations of devices, methods, and computer program products according to various embodiments of this application. In this regard, each block in a flowchart or block diagram may represent a module, segment, or portion of code containing one or more executable instructions for implementing a specified logical function. It should also be noted that in some alternative implementations, the functions indicated in the blocks may occur in a different order than those indicated in the drawings. For example, two consecutively indicated blocks may actually be executed substantially in parallel, and they may sometimes be executed in reverse order, depending on the functions involved. It should also be noted that each block in the block diagrams and / or flowcharts, and combinations of blocks in the block diagrams and / or flowcharts, may be implemented using a dedicated hardware-specific system that performs the specified function or operation, or using a combination of dedicated hardware and computer instructions.

[0054] The scope of this application is defined by the appended claims rather than the foregoing description, and is therefore intended to encompass all variations falling within the meaning and scope of equivalents of the claims. No reference numerals in the claims should be construed as limiting the scope of the claims. Furthermore, it is clear that the word "comprising" does not exclude other units or steps, and the singular does not exclude the plural. Multiple units or devices recited in a device claim may also be implemented by a single unit or device in software or hardware. Terms such as "first," "second," etc., are used only for distinguishing descriptions and do not indicate any particular order, nor should they be construed as indicating or implying relative importance.

[0055] The above description is merely a specific embodiment of this application, but the scope of protection of this application is not limited thereto. Any variations or substitutions that can be easily made by those skilled in the art within the scope of the technology disclosed in this application should be included within the scope of protection of this application. Therefore, the scope of protection of this application should be determined by the scope of the claims, and the above embodiments should be regarded as exemplary and non-limiting.

Claims

1. A method for laser soft engraving on a semiconductor silicon wafer, characterized in that, The method includes: Three laser positioning points are acquired in the target area of ​​laser soft engraving to obtain the depth values ​​of the first, second, and third positioning points; based on the depth value X2 of the second positioning point and the preset standard engraving depth value T, the center difference X is obtained. m Based on the depth value X1 of the first positioning point and the depth value X2 of the third positioning point, the edge difference Y is obtained. m The total difference Z is obtained based on the depth values ​​X1, X2, and X3 of the first positioning point and the standard engraving depth value T. m According to the central difference X m Marginal difference Y m Sum of total differences Z m Adjust the operating parameters of the laser engraving machine and the placement of the silicon wafer.

2. The method according to claim 1, characterized in that, The central difference X m =T-X2; The center focus of the laser engraving machine is determined based on the center difference. When the center focus exceeds the set standard center focus range, the laser power and focus parameters of the laser engraving machine are adjusted.

3. The method according to claim 1, characterized in that, The edge difference Y m =X3-X2; Determine the horizontal level of the silicon wafer placement position based on the edge difference. When the horizontal level exceeds the set standard horizontal level range, adjust the placement position of the silicon wafer.

4. The method according to claim 1, characterized in that, The total difference Z m =T-(X1+X2+X3) / 3; The accuracy of laser engraving on the silicon wafer is determined based on the total difference. When the engraving accuracy exceeds the set standard engraving accuracy range, the operating parameters of the laser engraving machine and the placement of the silicon wafer are adjusted.

5. The method according to any one of claims 1 to 4, characterized in that, The operating parameters of the laser engraving machine include laser power, focusing parameters, pulse frequency, and scanning speed; the laser engraving machine obtains the depth values ​​of the first positioning point, the second positioning point, and the third positioning point through a laser measuring instrument; and adjusts the operating parameters of the laser engraving machine based on the feedback results of at least one of the center difference, edge difference, and total difference.

6. The method according to claim 5, characterized in that, The silicon wafer is positioned so that it is relatively horizontal to the laser engraving machine by means of a mechanical component; the mechanical component includes a suction cup, a tray or a mechanical gripper.

7. The method according to claim 6, characterized in that, The method further includes: before performing batch laser soft engraving on semiconductor silicon wafers, sampling and inspecting silicon wafer samples, based on the center difference X. m Marginal difference Y m Sum of total differences Z m Adjust the operating parameters of the laser engraving machine and the placement of the silicon wafer; when the adjusted center difference X m Marginal difference Y m Sum of total differences Z m Once the engraving standards are met, the subsequent silicon wafers are engraved in batches according to the current operating parameters of the laser engraving machine and the placement of the silicon wafers.

8. An electronic device, characterized in that, The electronic device includes: One or more processors; and A memory storing computer program instructions, which, when executed, cause the processor to perform the steps of the method as described in any one of claims 1 to 7.

9. A computer-readable medium having a computer program / instructions stored thereon, characterized in that, When the computer program / instructions are executed by the processor, they implement the steps of the method according to any one of claims 1 to 7.

10. A computer program product comprising a computer program / instructions, characterized in that, When the computer program / instructions are executed by the processor, they implement the steps of the method according to any one of claims 1 to 7.

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