Substrate processing device and substrate processing method

Abstract

The present invention relates to a substrate processing device and a substrate processing method. The present invention utilizes an upper holding device to hold the outer peripheral end portion of a substrate, and uses a lower surface brush to clean the lower surface central area of ​​the substrate. During the cleaning, an adsorption holding portion of a lower holding device located below the upper holding device rotates. The substrate held by the upper holding device is handed over to the adsorption holding portion of the lower holding device. The outer area of ​​the lower surface of the substrate held by the adsorption holding portion is cleaned. After the lower surface central area of ​​the substrate is cleaned, the rotation of the adsorption holding portion of the lower holding device is stopped until the substrate is handed over to the adsorption holding portion of the lower holding device. In addition, the adsorption holding portion is moved in the horizontal direction by a base device. The rotation stopping action of the adsorption holding portion and the horizontal movement action of the adsorption holding portion are performed in a manner that overlaps at least a portion of the action period.

Description

Technical Field

[0001] The present invention relates to a substrate processing device and a substrate processing method for cleaning a substrate. Background Art

[0002] Substrate processing equipment is used to perform various processes on various substrates, such as FPD (Flat Panel Display) substrates, semiconductor substrates, optical disk substrates, magnetic disk substrates, magneto-optical disk substrates, mask substrates, ceramic substrates, and solar cell substrates used in liquid crystal displays and organic EL (Electro Luminescence) displays. Substrate cleaning equipment is used to clean substrates.

[0003] For example, the substrate cleaning device described in Japanese Patent No. 5904169 includes two suction pads that hold the peripheral edge of the wafer's back surface; a rotary chuck that holds the center of the wafer's back surface; and a brush that cleans the wafer's back surface. The two suction pads hold the wafer while it moves laterally. In this state, the center of the wafer's back surface is cleaned by the brush. The rotary chuck then receives the wafer from the suction pads and rotates while holding the center of the wafer's back surface. In this state, the peripheral edge of the wafer's back surface is cleaned by the brush. Summary of the Invention

[0004] In the aforementioned substrate cleaning apparatus, multiple substrates are sequentially loaded and unloaded, each substrate being cleaned. Therefore, if the time required to process a single substrate can be shortened, the efficiency of processing multiple substrates can be significantly improved. Therefore, there is a demand for further increasing the substrate processing throughput in substrate cleaning apparatuses.

[0005] An object of the present invention is to provide a substrate processing apparatus and a substrate processing method capable of improving the processing throughput of substrate processing.

[0006] 1. The substrate processing apparatus of claim 1, wherein the first substrate holding portion holds the peripheral portion of the substrate; the second substrate holding portion is configured to hold the lower surface central area of ​​the substrate at a position lower than the first substrate holding portion; a rotation drive portion rotates the second substrate holding portion around an axis in the vertical direction; a brush cleaning portion is configured to clean the lower surface central area of ​​the substrate held by the first substrate holding portion by bringing the brush into contact with the lower surface central area of ​​the substrate held by the second substrate holding portion, and to clean the lower surface outer area of ​​the substrate held by the second substrate holding portion by bringing the brush into contact with the lower surface outer area surrounding the lower surface central area; a horizontal moving portion performs a horizontal moving action to change the relative positional relationship between the first substrate holding portion and the second substrate holding portion in a horizontal plane; and a control portion; and the control portion controls the first substrate holding portion, the second substrate holding portion, the rotation drive portion, the brush cleaning portion and the horizontal moving portion to rotate the second substrate holding portion while using the brush cleaning portion. The cleaning section cleans the central area of ​​the lower surface of the substrate held by the first substrate holding section. After cleaning the central area of ​​the lower surface of the substrate, the second substrate holding section stops rotating so as to transfer the substrate from the first substrate holding section to the second substrate holding section. After cleaning the central area of ​​the lower surface of the substrate, the horizontal moving section performs the horizontal moving action so as to transfer the substrate from the first substrate holding section to the second substrate holding section. After transferring the substrate from the first substrate holding section to the second substrate holding section, the brush cleaning section cleans the outer area of ​​the lower surface of the substrate held by the second substrate holding section while rotating the second substrate holding section. After cleaning the central area of ​​the lower surface of the substrate and until the substrate is transferred to the second substrate holding section, the rotation stopping action and the horizontal moving action of the second substrate holding section are performed in a manner such that at least a portion of the rotation stopping action period and the horizontal moving action period overlap.

[0007] Another aspect of the substrate processing device of the present invention comprises: a first substrate holding portion for holding the peripheral portion of the substrate; a second substrate holding portion configured to hold the central area of ​​the lower surface of the substrate at a position lower than the first substrate holding portion; a rotation drive portion for rotating the second substrate holding portion around an axis in the vertical direction; a brush cleaning portion configured to enable a brush to contact the central area of ​​the lower surface of the substrate held by the first substrate holding portion to clean the central area of ​​the lower surface, and to enable the brush to contact the substrate held by the second substrate holding portion to surround the lower surface central area. The brush cleaning unit is adapted to move the first substrate holding unit, the second substrate holding unit, the second substrate holding unit, and the substrate up and down, thereby changing the relative position of the first substrate holding unit and the substrate; and a control unit, wherein the control unit controls the first substrate holding unit, the second substrate holding unit, the rotation drive unit, the brush cleaning unit, and the up and down moving unit to clean the substrate. The second substrate holding part rotates while using the brush cleaning part to clean the lower surface center area of ​​the substrate held by the first substrate holding part. After the lower surface center area of ​​the substrate is cleaned, the second substrate holding part stops rotating so as to transfer the substrate from the first substrate holding part to the second substrate holding part. After the lower surface center area of ​​the substrate is cleaned, the up-down moving part performs the up-down moving action so as to transfer the substrate from the first substrate holding part to the second substrate holding part. After the substrate is handed over from the first substrate holding part to the second substrate holding part, the outer area of ​​the lower surface of the substrate held by the second substrate holding part is cleaned by the brush cleaning part while the second substrate holding part is rotated. After the central area of ​​the lower surface of the substrate is cleaned, the rotation stopping action and the up and down movement action of the second substrate holding part are performed in a manner that at least a part of the rotation stopping action period and the up and down movement action period overlap during the period from when the substrate is cleaned to when the substrate is handed over to the second substrate holding part.

[0008] 14. The substrate processing apparatus of claim 13, wherein the brush cleaning portion is configured to clean the substrate by bringing the brush into contact with the lower surface central area of ​​the substrate held by the first substrate holding portion, and to clean the lower surface central area by bringing the brush into contact with the lower surface outer area of ​​the substrate held by the second substrate holding portion, which surrounds the lower surface central area. The brush cleaning portion is configured to clean the lower surface outer area by bringing the brush into contact with the lower surface outer area of ​​the substrate held by the second substrate holding portion. The brush cleaning portion is configured to clean the substrate ... The brush cleaning part, the horizontal moving part and the up-down moving part are used to clean the central area of ​​the lower surface of the substrate held by the first substrate holding part by using the brush cleaning part. After the central area of ​​the lower surface of the substrate is cleaned, the horizontal moving part is caused to perform the horizontal moving action to transfer the substrate from the first substrate holding part to the second substrate holding part. After the central area of ​​the lower surface of the substrate is cleaned, the up-down moving part is caused to perform the up-down moving action to transfer the substrate from the first substrate holding part to the second substrate holding part. After the substrate is transferred from the first substrate holding part to the second substrate holding part, the outer area of ​​the lower surface of the substrate held by the second substrate holding part is cleaned by using the brush cleaning part. After the central area of ​​the lower surface of the substrate is cleaned, until the substrate is transferred to the second substrate holding part, the horizontal moving action and the up-down moving action are performed in a manner such that at least a part of the horizontal moving action period overlaps with the up-down moving action period.

[0009] 19. The method of claim 18, wherein the brush is adapted to move the brush away from the first substrate holder and away from the second substrate holder, thereby cleaning the substrate. After the central area of ​​the lower surface of the substrate is cleaned, the horizontal moving part is caused to perform the horizontal moving action so as to hand over the substrate from the first substrate holding part to the second substrate holding part; and after the substrate is handed over from the first substrate holding part to the second substrate holding part, the brush is caused to contact the lower surface outer area of ​​the substrate held by the second substrate holding part surrounding the central area of ​​the lower surface while rotating the second substrate holding part to clean the lower surface outer area of ​​the substrate; and after the central area of ​​the lower surface of the substrate is cleaned, until the substrate is handed over to the second substrate holding part, the step of stopping the rotation of the second substrate holding part and the step of causing the horizontal moving part to perform the horizontal moving action are started in a manner that the period of the rotation stopping action of the second substrate holding part overlaps with at least a part of the period of the horizontal moving action.

[0010] 19. The swiveling device of claim 18, wherein the brush is adapted to move the brush away from the first substrate holder and away from the second substrate holder so as to allow the brush to move relative to the first substrate holder. to the second substrate holding part; after the central area of ​​the lower surface of the substrate is cleaned, the up-and-down moving part is caused to perform the up-and-down moving action so as to hand over the substrate from the first substrate holding part to the second substrate holding part; and after the substrate is handed over from the first substrate holding part to the second substrate holding part, the second substrate holding part is rotated while the brush is brought into contact with the lower surface outer area surrounding the central area of ​​the lower surface of the substrate held by the second substrate holding part to clean the lower surface outer area of ​​the substrate; and after the central area of ​​the lower surface of the substrate is cleaned, until the substrate is handed over to the second substrate holding part, the step of stopping the rotation of the second substrate holding part and the step of causing the up-and-down moving part to perform the up-and-down moving action are started in a manner that the period of the rotation stopping action of the second substrate holding part overlaps with at least a part of the period of the up-and-down moving action.

[0011] 19. The method of claim 18, wherein the brush is adapted to move the brush over the substrate and to allow the brush to move relative to the substrate during operation. a horizontal movement action to transfer the substrate from the first substrate holding portion to the second substrate holding portion; after cleaning the lower surface central area of ​​the substrate, causing the up-down movement portion to perform the up-down movement action to transfer the substrate from the first substrate holding portion to the second substrate holding portion; and after transferring the substrate from the first substrate holding portion to the second substrate holding portion, causing the brush to contact the lower surface outer area surrounding the lower surface central area of ​​the substrate held by the second substrate holding portion to clean the lower surface outer area of ​​the substrate; and after cleaning the lower surface central area of ​​the substrate until the substrate is transferred to the second substrate holding portion, starting the steps of causing the horizontal movement portion to perform the horizontal movement action and causing the up-down movement portion to perform the up-down movement action in such a manner that at least a portion of the horizontal movement action period overlaps with the up-down movement action period.

[0012] According to the present invention, the throughput of substrate processing can be improved. BRIEF DESCRIPTION OF THE DRAWINGS

[0013] Figure 1 It is a schematic plan view of a substrate cleaning apparatus according to one embodiment of the present invention.

[0014] Figure 2 Yes Figure 1 A three-dimensional appearance diagram of the internal structure of the substrate cleaning device.

[0015] Figure 3 yes Figure 1 and Figure 2 A three-dimensional view of the lower chuck.

[0016] Figure 4 yes Figure 1 and Figure 2A three-dimensional view of the upper chuck.

[0017] Figure 5 Yes Figure 1 A block diagram of the structure of a control system of a substrate cleaning device.

[0018] Figure 6 Is used to illustrate Figure 1 A schematic diagram of an example of the operation of a substrate cleaning device.

[0019] Figure 7 Is used to illustrate Figure 1 A schematic diagram of an example of the operation of a substrate cleaning device.

[0020] Figure 8 Is used to illustrate Figure 1 A schematic diagram of an example of the operation of a substrate cleaning device.

[0021] Figure 9 Is used to illustrate Figure 1 A schematic diagram of an example of the operation of a substrate cleaning device.

[0022] Figure 10 Is used to illustrate Figure 1 A schematic diagram of an example of the operation of a substrate cleaning device.

[0023] Figure 11 Is used to illustrate Figure 1 A schematic diagram of an example of the operation of a substrate cleaning device.

[0024] Figure 12 Is used to illustrate Figure 1 A schematic diagram of an example of the operation of a substrate cleaning device.

[0025] Figure 13 Is used to illustrate Figure 1 A schematic diagram of an example of the operation of a substrate cleaning device.

[0026] Figure 14 Is used to illustrate Figure 1 A schematic diagram of an example of the operation of a substrate cleaning device.

[0027] Figure 15 Is used to illustrate Figure 1 A schematic diagram of an example of the operation of a substrate cleaning device.

[0028] Figure 16 Is used to illustrate Figure 1 A schematic diagram of an example of the operation of a substrate cleaning device.

[0029] Figure 17 Is used to illustrate Figure 1 A schematic diagram of an example of the operation of a substrate cleaning device.

[0030] Figure 18 Is used to illustrate Figure 1 A schematic diagram of an example of the operation of a substrate cleaning device.

[0031] Figure 19 Is used to illustrate Figure 1 A schematic diagram of an example of the operation of a substrate cleaning device.

[0032] Figure 20 It is a schematic top view of a substrate cleaning apparatus according to another embodiment.

[0033] Figure 21 Yes Figure 20 A block diagram of the structure of a control system of a substrate cleaning device. DETAILED DESCRIPTION

[0034] Hereinafter, a substrate processing device and a substrate processing method according to an embodiment of the present invention will be described using drawings. The substrate processing device and the substrate processing method according to the present embodiment are a substrate cleaning device and a substrate cleaning method. In the following description, the substrate refers to a semiconductor substrate (wafer), a liquid crystal display device or an organic EL (Electro Luminescence) display device, an FPD (Flat Panel Display) substrate, an optical disc substrate, a magnetic disk substrate, a magneto-optical disc substrate, a mask substrate, a ceramic substrate, or a solar cell substrate, etc. In addition, in the present embodiment, the upper surface of the substrate is the circuit forming surface (front surface), and the lower surface of the substrate is the surface on the opposite side of the circuit forming surface (back surface). Furthermore, the substrate used in the present embodiment has an outer peripheral portion that is at least partially circular. For example, the substrate used in the present embodiment has an outer peripheral end portion that is circular outside the notch.

[0035] 1. Structure of substrate cleaning device

[0036] Figure 1 It is a schematic plan view of a substrate cleaning apparatus according to one embodiment of the present invention. Figure 2 Yes Figure 1 The external perspective view of the internal structure of the substrate cleaning apparatus 1. In the substrate cleaning apparatus 1 of this embodiment, mutually orthogonal X direction, Y direction and Z direction are defined to clarify the positional relationship. Figure 1 and Figure 2 In the following predetermined figures, arrows are used to indicate the X, Y, and Z directions as appropriate. The X and Y directions are perpendicular to each other in the horizontal plane, and the Z direction corresponds to the vertical direction (up and down direction).

[0037] like Figure 1As shown, the substrate cleaning apparatus 1 includes upper holding devices 10A and 10B, a lower holding device 20, a base device 30, a transfer device 40, a lower surface cleaning device 50, a shield device 60, an upper surface cleaning device 70, an end cleaning device 80, and an opening and closing device 90. These components are arranged in a unit housing 2. Figure 2 In FIG, the unit housing 2 is shown by a dotted line.

[0038] The unit housing 2 has a rectangular bottom 2a and four side walls 2b, 2c, 2d, and 2e extending upward from the four sides of the bottom 2a. The side walls 2b and 2c face each other, and the side walls 2d and 2e face each other. A rectangular opening is formed in the center of the side wall 2b. This opening serves as a loading / unloading port 2x for substrates W and is used when loading substrates W into and out of the unit housing 2. Figure 2 In the figure, the loading / unloading port 2x is indicated by a thick dotted line. In the following description, the direction from the inside of the unit case 2 through the loading / unloading port 2x to the outside of the unit case 2 (the direction from the side wall portion 2c to the side wall portion 2b) in the Y direction is referred to as the front, and the opposite direction (the direction from the side wall portion 2b to the side wall portion 2c) is referred to as the rear.

[0039] An opening and closing device 90 is provided in the portion of the side wall 2b where the loading / unloading port 2x is formed and in the vicinity thereof. The opening and closing device 90 includes a shutter 91 that opens and closes the loading / unloading port 2x and a shutter driving unit 92 that drives the shutter 91. Figure 2 In the figure, the shutter 91 is indicated by a thick two-dot chain line. The shutter driver 92 drives the shutter 91 to open the loading / unloading port 2x when a substrate W is loaded into or unloaded from the substrate cleaning apparatus 1. As a result, the shutter 91 is in the open state. Furthermore, the shutter driver 92 drives the shutter 91 to close the loading / unloading port 2x when a substrate W is being cleaned in the substrate cleaning apparatus 1. As a result, the shutter 91 is in the closed state.

[0040] A base unit 30 is provided in the center of the bottom portion 2a. The base unit 30 includes a linear guide 31, a movable base 32, and a base drive unit 33. The linear guide 31 includes two rails and is arranged so as to extend in the Y direction from near the side wall 2b to near the side wall 2c in a plan view. The movable base 32 is arranged so as to be movable in the Y direction on the two rails of the linear guide 31. The base drive unit 33 includes, for example, a pulse motor, and moves the movable base 32 in the Y direction on the linear guide 31.

[0041] The lower holding device 20 and the lower surface cleaning device 50 are arranged on the movable base 32 in a manner aligned in the Y direction. The lower holding device 20 includes a suction holding unit 21 and a suction holding drive unit 22. The suction holding unit 21 is a so-called rotary chuck having a circular suction surface capable of suction-holding the lower surface of the substrate W. It is configured to rotate about an axis extending in the vertical direction (the Z-axis). In the following description, when the substrate W is suction-held by the suction holding unit 21, the area of ​​the lower surface of the substrate W that is to be suctioned by the suction holding unit 21 is referred to as the lower surface center area. On the other hand, the area of ​​the lower surface of the substrate W surrounding the lower surface center area is referred to as the lower surface outer area.

[0042] The suction and holding drive unit 22 includes a motor. The motor of the suction and holding drive unit 22 is mounted on the movable base 32 with its rotational axis protruding upward. The suction and holding unit 21 is attached to the upper end of the rotational axis of the suction and holding drive unit 22. Furthermore, the rotational axis of the suction and holding drive unit 22 forms a suction path for suctioning and holding the substrate W on the suction and holding unit 21. This suction path is connected to an air inlet device (not shown). The suction and holding drive unit 22 rotates the suction and holding unit 21 about the rotational axis.

[0043] On the movable base 32, a delivery device 40 is further provided near the lower holding device 20. The delivery device 40 includes a plurality of (3 in this example) support pins 41, a pin connecting component 42 and a pin lifting drive unit 43. The pin connecting component 42 is formed in a manner of surrounding the adsorption holding portion 21 when viewed from above, and connects a plurality of support pins 41. The plurality of support pins 41 extend upward from the pin connecting component 42 by a certain length in a state of being connected to each other by the pin connecting component 42. The pin lifting drive unit 43 causes the pin connecting component 42 to be raised and lowered on the movable base 32. Thus, the plurality of support pins 41 are raised and lowered relative to the adsorption holding portion 21.

[0044] The lower surface cleaning device 50 includes a lower surface brush 51, two substrate nozzles 52, two brush nozzles 52a, 52b, a gas ejection unit 53, a lifting support unit 54, a lower surface brush rotation drive unit 55a and a lower surface brush lifting drive unit 55b. Figure 2 As shown, the lift support portion 54 is provided on the movable base 32 in a liftable manner. The lift support portion 54 has an upper surface 54u that is inclined obliquely downward in a direction away from the adsorption holding portion 21 (rearward in this example).

[0045] like Figure 1As shown, the lower surface brush 51 has a circular shape when viewed from above and is relatively large in this embodiment. Specifically, the diameter of the lower surface brush 51 is larger than the diameter of the suction surface of the suction holding unit 21, for example, 1.3 times the diameter of the suction surface of the suction holding unit 21. Furthermore, the diameter of the lower surface brush 51 is larger than 1 / 3 of the diameter of the substrate W and smaller than 1 / 2 of the diameter of the substrate W. The diameter of the substrate W is, for example, 300 mm.

[0046] The lower surface brush 51 is a sponge brush, preferably made of a material with relatively low wettability, such as a fluorine-based resin. In this case, contaminants are less likely to adhere to the lower surface brush 51. As a result, the lower surface brush 51 is less susceptible to contamination. In this example, the lower surface brush 51 is made of PTFE (polytetrafluoroethylene), but the embodiment is not limited to this. The lower surface brush 51 can also be made of a relatively soft resin material, such as PVA (polyvinyl alcohol).

[0047] The lower surface brush 51 has a cleaning surface that can contact the lower surface of the substrate W. The lower surface brush 51 is mounted on the upper surface 54u of the lifting support portion 54 so that the cleaning surface faces upward and is rotatable about an axis that passes through the center of the cleaning surface and extends in the vertical direction.

[0048] The two substrate nozzles 52 are each mounted on the upper surface 54u of the lifting support 54 so as to be located near the lower surface brush 51 and to have the liquid discharge port directed upward. The substrate nozzles 52 are connected to the lower surface cleaning liquid supply unit 56 ( Figure 5 The lower surface cleaning liquid supply unit 56 supplies a cleaning liquid for cleaning the substrate to the substrate nozzle 52. When the substrate W is cleaned by the lower surface brush 51, the substrate nozzle 52 ejects the cleaning liquid supplied from the lower surface cleaning liquid supply unit 56 onto the lower surface of the substrate W. In this embodiment, pure water is used as the cleaning liquid supplied to the substrate nozzle 52.

[0049] The two brush nozzles 52a and 52b are used to clean the lower surface brush 51. The two brush nozzles 52a and 52b are installed on the upper surface 54u of the lifting support 54 in a manner such that they are located near the lower surface brush 51. The brush nozzles 52a and 52b are connected to the brush cleaning liquid supply unit 57 ( Figure 5 The brush cleaning liquid supply unit 57 supplies a cleaning liquid for brush cleaning to the brush nozzles 52a and 52b. As a result, the cleaning liquid supplied by the brush cleaning liquid supply unit 57 is ejected from the brush nozzles 52a and 52b toward the lower surface brush 51. The cleaning liquid supplied to the two substrate nozzles 52 is the same as the cleaning liquid supplied to the two brush nozzles 52a and 52b. Therefore, in this embodiment, pure water is used as the cleaning liquid supplied to the brush nozzles 52a and 52b.

[0050] One brush nozzle 52a is positioned to the side of the lower surface brush 51 so that its front end (liquid discharge port) faces a position above the lower surface brush 51. Therefore, the cleaning liquid ejected from the brush nozzle 52a is guided from the side of the lower surface brush 51 to the center of the cleaning surface of the lower surface brush 51 in a manner that describes a parabola. The other brush nozzle 52b is positioned to the side of the lower surface brush 51 so that its front end (liquid discharge port) faces a position to the side (outer peripheral end) of the lower surface brush 51. Therefore, the cleaning liquid ejected from the brush nozzle 52b is guided from the side of the lower surface brush 51 to the side (outer peripheral end) of the lower surface brush 51.

[0051] As described below, the lower surface brush 51 rotates substantially while the substrate cleaning apparatus 1 is powered on. Therefore, when cleaning liquid is sprayed from the brush nozzles 52a and 52b toward the lower surface brush 51, the entire lower surface brush 51 is smoothly rinsed with the cleaning liquid. Furthermore, the cleaning surface of the lower surface brush 51 is uniformly wetted. This prevents any localized hardening of the lower surface brush 51.

[0052] The gas ejection portion 53 is a slit-shaped gas ejection nozzle having a gas ejection port extending in one direction. The gas ejection portion 53 can be independently raised and lowered on the movable base 32 relative to the other components of the lower surface cleaning device 50. The description of the driving portion for causing the gas ejection portion 53 to perform the lifting action is omitted. The gas ejection port of the gas ejection portion 53 is located between the lower surface brush 51 and the adsorption holding portion 21 in a plan view and faces upward. The ejection gas supply portion 58 ( Figure 5 ).

[0053] The ejection gas supply unit 58 supplies gas to the gas ejection unit 53. In this embodiment, an inert gas such as nitrogen is used as the gas supplied to the gas ejection unit 53. The gas ejection unit 53 ejects the gas supplied by the ejection gas supply unit 58 onto the lower surface of the substrate W when the lower surface brush 51 is used to clean the substrate W, or when the lower surface of the substrate W is dried (described later). In this case, a belt-shaped air curtain extending in the X direction is formed between the lower surface brush 51 and the suction and holding unit 21.

[0054] Figure 1 The lower surface brush rotation drive unit 55a includes a motor and basically rotates the lower surface brush 51 while the substrate cleaning apparatus 1 is powered on. The lower surface brush lifting drive unit 55b includes a stepping motor or an air cylinder and lifts the lifting support unit 54 on the movable base 32.

[0055] A shield device 60 is further provided at the center of the bottom surface portion 2a. The shield device 60 includes a shield 61 and a shield driving unit 62. The shield 61 is provided so as to surround the lower holding device 20 and the base device 30 in a plan view and is movable upward and downward. Figure 2In the figure, the shield 61 is shown by a dotted line. The shield drive unit 62 moves the shield 61 between a lower shield position and an upper shield position depending on which part of the lower surface of the substrate W is being cleaned by the lower surface brush 51. The lower shield position is a position in which the upper end of the shield 61 is at a height lower than the substrate W adsorbed and held by the adsorption and holding unit 21. On the other hand, the upper shield position is a position in which the upper end of the shield 61 is at a height higher than the adsorption and holding unit 21. When the shield 61 is in the upper shield position, the shield 61 and the adsorption and holding unit 21 overlap each other when viewed from the side. Therefore, the upper shield position can be said to be a height position of the shield 61 corresponding to the height position of the substrate W adsorbed and held by the adsorption and holding unit 21.

[0056] A pair of upper holding devices 10A and 10B are provided at a height position above the shield 61, facing each other across the base device 30 when viewed from above. The upper holding device 10A includes a lower chuck 11A, an upper chuck 12A, a lower chuck drive 13A, and an upper chuck drive 14A. The upper holding device 10B includes a lower chuck 11B, an upper chuck 12B, a lower chuck drive 13B, and an upper chuck drive 14B.

[0057] Figure 3 yes Figure 1 and Figure 2 A three-dimensional view of the appearance of the lower chucks 11A and 11B. Figure 3 In FIG, the lower chucks 11A and 11B are shown by thick solid lines. In addition, the upper chucks 12A and 12B are shown by dotted lines. Figure 3 In order to easily understand the shape of the lower chuck 11A, 11b, relative to Figure 2 For the three-dimensional appearance diagram, the enlargement and reduction ratios of each part are changed.

[0058] like Figure 3 As shown, the lower chucks 11A and 11B are arranged symmetrically about a vertical plane extending in the Y direction (front-back direction) through the center of the suction holding portion 21 when viewed from above, and are configured to be movable in the X direction within a common horizontal plane. Each of the lower chucks 11A and 11B has two support pieces 200. Each support piece 200 is provided with an inclined support surface 201 and a movement restriction surface 202.

[0059] In the lower chuck 11A, the inclined support surface 201 of each support piece 200 is capable of supporting the outer peripheral edge of the substrate W from below and is formed to extend diagonally downward toward the lower chuck 11B. A movement restriction surface 202 extends upward a certain distance from the upper end of the inclined support surface 201, forming a step at the upper end of the lower chuck 11A. Meanwhile, in the lower chuck 11B, the inclined support surface 201 of each support piece 200 is capable of supporting the outer peripheral edge of the substrate W from below and is formed to extend diagonally downward toward the lower chuck 11A. The movement restriction surface 202 extends upward a certain distance from the upper end of the inclined support surface 201, forming a step at the upper end of the lower chuck 11B.

[0060] Figure 1 The lower chuck driving units 13A and 13B include cylinders or motors as actuators. The lower chuck driving units 13A and 13B move the lower chucks 11A and 11B so that they approach each other or move away from each other. If the target positions of the lower chucks 11A and 11B in the X direction are predetermined, the lower chuck driving units 13A and 13B can individually adjust the positions of the lower chucks 11A and 11B in the X direction based on the target position information. For example, the distance between the lower chucks 11A and 11B can be made smaller than the outer diameter of the substrate W. In this case, the substrate W can be placed on the multiple inclined support surfaces 201 of the lower chucks 11A and 11B.

[0061] Figure 4 yes Figure 1 and Figure 2 A three-dimensional view of the appearance of the upper clamps 12A and 12B. Figure 4 In FIG, the upper chucks 12A and 12B are shown by thick solid lines. In addition, the lower chucks 11A and 11B are shown by dotted lines. Figure 4 In order to easily understand the shape of the upper clamps 12A and 12B, relative to Figure 2 For the three-dimensional appearance diagram, the enlargement and reduction ratios of each part are changed.

[0062] like Figure 4 As shown, the upper chucks 12A and 12B, like the lower chucks 11A and 11B, are symmetrically arranged in a plan view about a vertical plane extending in the Y direction (front-back direction) through the center of the suction holding portion 21, and are arranged to be movable in the X direction within a common horizontal plane. Each of the upper chucks 12A and 12B has two holding pieces 300. Each holding piece 300 has an abutment surface 301 and a protrusion 302.

[0063] In the upper chuck 12A, the abutment surface 301 of each retaining piece 300 is formed at the lower front end of the retaining piece 300, facing the upper chuck 12B, and perpendicular to the X-direction. A protrusion 302 is formed so as to protrude a predetermined distance from the upper end of the abutment surface 301 toward the upper chuck 12B. On the other hand, in the upper chuck 12B, the abutment surface 301 of each retaining piece 300 is formed at the lower front end of the retaining piece 300, facing the upper chuck 12A, and perpendicular to the X-direction. The protrusion 302 is formed so as to protrude a predetermined distance from the upper end of the abutment surface 301 toward the upper chuck 12A.

[0064] Figure 1 The upper chuck driving units 14A and 14B include air cylinders or motors as actuators. The upper chuck driving units 14A and 14B move the upper chucks 12A and 12B toward each other or away from each other. If the target positions of the upper chucks 12A and 12B in the X direction are predetermined, the upper chuck driving units 14A and 14B can individually adjust the positions of the upper chucks 12A and 12B in the X direction based on the target position information.

[0065] In the upper holding devices 10A and 10B, for example, the upper chucks 12A and 12B move toward the outer peripheral end of the substrate W placed on the lower chucks 11A and 11B. The two abutting surfaces 301 of the upper chuck 12A and the two abutting surfaces 301 of the upper chuck 12B contact multiple portions of the outer peripheral end of the substrate W, thereby holding the outer peripheral end of the substrate W and firmly fixing the substrate W.

[0066] The upper holding devices 10A and 10B are switched between three states: a retracted state, a placement ready state, and a holding state by adjusting the distance between the lower chucks 11A and 11B and the distance between the upper chucks 12A and 12B in a preset combination.

[0067] The retracted state of the upper holding devices 10A and 10B is a state in which the distance between the lower chucks 11A and 11B is larger than the outer diameter of the substrate W, and the distance between the upper chucks 12A and 12B is larger than the outer diameter of the substrate W. In this state, the substrate W in a horizontal position can be moved in the vertical direction (Z direction) between the lower chucks 11A and 11B and between the upper chucks 12A and 12B.

[0068] The upper holding devices 10A and 10B are in a position where the distance between the lower chucks 11A and 11B is smaller than the outer diameter of the substrate W, and the distance between the upper chucks 12A and 12B is larger than the outer diameter of the substrate W. In this state, interference between the substrate W and the upper chucks 12A and 12B can be prevented, and the substrate W can be placed in a horizontal position on the multiple inclined support surfaces 201 of the lower chucks 11A and 11B. Furthermore, the substrate W placed on the lower chucks 11A and 11B can be lifted.

[0069] The holding state of the upper holding devices 10A and 10B can be switched only when the upper holding devices 10A and 10B are in a position ready for placement and a substrate W is placed on the lower chucks 11A and 11B. Specifically, the holding state of the upper holding devices 10A and 10B is such that the distance between the lower chucks 11A and 11B is smaller than the outer diameter of the substrate W, and the upper chucks 12A and 12B are in contact with the outer peripheral edge of the substrate W on the lower chucks 11A and 11B, thereby securing the substrate W.

[0070] Here, when the upper holding devices 10A and 10B switch from the placement state to the holding state, the upper chucks 12A and 12B move in the X direction to approach each other while sandwiching the substrate W. Specifically, the upper chucks 12A and 12B move as follows.

[0071] First, one upper chuck moves toward the other upper chuck and stops at a preset target position. Thereafter, the other upper chuck moves toward the one upper chuck and contacts a portion of the outer peripheral end portion of the substrate W. Furthermore, the other upper chuck moves toward the one upper chuck until the other portion of the outer peripheral end portion of the substrate W contacts the one upper chuck. In the case of switching from the loadable state to the holding state in this manner, the substrate W is positioned on the lower chucks 11A and 11B with reference to the target position. Therefore, when the size of the substrate W is known, by determining the target position based on the size, the center of the substrate W can be easily positioned at the plane reference position rp ( Figure 6 ).

[0072] When the upper holding devices 10A and 10B switch from the holding state to the placement state, the upper chucks 12A and 12B move in the X direction to move away from each other while sandwiching the substrate W. Specifically, the upper chucks 12A and 12B move as follows.

[0073] First, with one upper chuck at a predetermined target position, the other upper chuck is moved away from the one upper chuck. After the other upper chuck is spaced from the substrate W, the one upper chuck is moved away from the other upper chuck. In this manner, when the substrate W is switched from the holding state to the placement state, the substrate W is positioned on the lower chucks 11A and 11B with the target position as a reference. Therefore, if the size of the substrate W is known, by determining the target position based on the size, the center of the substrate W can be easily positioned at the plane reference position rp ( Figure 6 ).

[0074] like Figure 1 As shown, the two side walls 2c and 2b facing each other in the Y direction are provided with a light projecting portion 19a and a light receiving portion 19b respectively. The light projecting portion 19a includes a light projecting element. The light receiving portion 19b includes a light receiving element. The light projecting portion 19a and the light receiving portion 19b constitute a transmissive photoelectric sensor 19 ( Figure 5 ).

[0075] The light projecting section 19a and the light receiving section 19b are arranged so that the light projecting section 19a is located below the light receiving section 19b. Furthermore, the light projecting section 19a and the light receiving section 19b are arranged so that when a substrate W is held by the upper holding devices 10A and 10B, a straight line connecting the light projecting section 19a and the light receiving section 19b passes through the substrate W.

[0076] In the substrate cleaning apparatus 1, when a substrate W is placed on the upper holding devices 10A and 10B in a placement ready state, light is emitted from the light projecting portion 19a toward the light receiving portion 19b (see FIG. Figure 2 (See the dashed arrows in the dashed lines). When a substrate W is normally placed on the upper holding devices 10A and 10B, light emitted from the light projecting portion 19a is blocked by the substrate W. Therefore, the light receiving portion 19b does not receive the light emitted from the light projecting portion 19a. On the other hand, when a substrate W is not normally placed on the upper holding devices 10A and 10B, light emitted from the light projecting portion 19a is not blocked by the substrate W and enters the light receiving portion 19b. Therefore, it is possible to determine whether the substrate W is normally placed on the upper holding devices 10A and 10B based on the light reception signal output by the light receiving element of the light receiving portion 19b. In the following description, this determination is referred to as substrate placement state determination.

[0077] In the substrate cleaning apparatus 1, even when the upper holding devices 10A and 10B are switched from a position capable of placing a substrate W to a holding position, light is emitted from the light projecting portion 19a toward the light receiving portion 19b. Thus, for the same reasons as described above, it is possible to determine whether the substrate W is being properly held by the upper holding devices 10A and 10B based on the light reception signal outputted from the light receiving element of the light receiving portion 19b. In the following description, this determination is referred to as substrate holding state determination.

[0078] like Figure 1 As shown, an upper surface cleaning device 70 is provided on one side of the hood 61 so as to be located near the upper holding device 10B in a plan view. The upper surface cleaning device 70 includes a rotation support shaft 71, an arm 72, a spray nozzle 73, and an upper surface cleaning drive unit 74.

[0079] The rotation support shaft 71 is supported by the upper surface cleaning drive unit 74 in a manner extending in the vertical direction on the bottom surface 2a so as to be able to rise and fall and to rotate. Figure 2 As shown, the arm 72 is provided above the upper holding device 10B so as to extend horizontally from the upper end of the rotation support shaft 71. A spray nozzle 73 is attached to the front end of the arm 72.

[0080] The spray nozzle 73 is connected to the upper surface cleaning fluid supply unit 75 ( Figure 5 The upper surface cleaning fluid supply unit 75 supplies cleaning liquid and gas to the spray nozzle 73. In this embodiment, pure water is used as the cleaning liquid supplied to the spray nozzle 73, and an inert gas such as nitrogen is used as the gas supplied to the spray nozzle 73. When cleaning the upper surface of the substrate W, the spray nozzle 73 mixes the cleaning liquid supplied from the upper surface cleaning fluid supply unit 75 with the gas to generate a mixed fluid, and sprays the generated mixed fluid downward.

[0081] The upper surface cleaning drive unit 74 includes one or more pulse motors and air cylinders, and moves the rotary support shaft 71 upward and downward, and rotates the rotary support shaft 71. With this configuration, the entire upper surface of the substrate W can be cleaned by moving the spray nozzle 73 in an arc shape over the upper surface of the substrate W being held and rotated by the suction and holding unit 21.

[0082] like Figure 1 As shown, an end cleaning device 80 is provided on the other side of the shield 61 so as to be located near the upper holding device 10A in a plan view. The end cleaning device 80 includes a rotation support shaft 81, an arm 82, a bevel brush 83, and a bevel brush driving unit 84.

[0083] The rotation support shaft 81 is supported on the bottom surface 2a in a manner extending in the vertical direction and is supported by the bevel brush driving unit 84 so as to be able to rise and fall and to rotate. Figure 2 As shown, the arm 82 is provided above the upper holding device 10A so as to extend horizontally from the upper end of the rotation support shaft 81. A bevel brush 83 is provided at the front end of the arm 82 so as to protrude downward and be rotatable about a vertical axis.

[0084] The upper half of the bevel brush 83 has an inverted truncated cone shape and the lower half has a truncated cone shape. According to the bevel brush 83, the outer peripheral edge of the substrate W can be cleaned using the center portion of the outer peripheral surface in the vertical direction.

[0085] The bevel brush drive unit 84 includes one or more pulse motors and air cylinders, and moves the rotary support shaft 81 upward and downward, and rotates the rotary support shaft 81. With this configuration, the entire outer edge of the substrate W can be cleaned by bringing the center portion of the outer peripheral surface of the bevel brush 83 into contact with the outer peripheral edge of the substrate W being sucked and held by the suction and holding unit 21 and rotating.

[0086] Here, the bevel brush driving unit 84 also includes a motor built into the arm 82. This motor rotates a bevel brush 83 provided at the tip of the arm 82 about a vertical axis. Therefore, when cleaning the outer edge of the substrate W, the rotation of the bevel brush 83 enhances the cleaning force of the bevel brush 83 on the outer edge of the substrate W.

[0087] 2. Control system of substrate cleaning device 1

[0088] Figure 5 Yes Figure 1 This is a block diagram showing the structure of a control system for a substrate cleaning apparatus 1. The substrate cleaning apparatus 1 includes a control unit 170. The control unit 170 includes a CPU (central processing unit), RAM (random access memory), ROM (read-only memory), and a storage device. The RAM serves as a work area for the CPU. The ROM stores system programs. The storage device stores substrate cleaning programs.

[0089] like Figure 5 As shown, the control unit 170 includes a chuck control unit 9A, a suction control unit 9B, a susceptor control unit 9C, a transfer control unit 9D, a lower surface cleaning control unit 9E, a shield control unit 9F, an upper surface cleaning control unit 9G, a slope cleaning control unit 9H, and a loading and unloading control unit 9I, as functional units for controlling the operation of each of the plurality of substrate cleaning apparatuses 1. The functional units of the control unit 170 are implemented by the CPU executing a substrate cleaning program stored in a storage device on a RAM. Alternatively, some or all of the functional units of the control unit 170 may be implemented using hardware such as electronic circuits.

[0090] The chuck control unit 9A controls the lower chuck driving units 13A and 13B and the upper chuck driving units 14A and 14B to receive a substrate W loaded into the substrate cleaning apparatus 1 and hold it above the suction holding unit 21. Furthermore, the chuck control unit 9A controls the photosensor 19 to perform the aforementioned substrate placement and holding status determinations. The suction control unit 9B controls the suction holding driving unit 22 to suction-hold the substrate W using the suction holding unit 21 and to rotate the suction-held substrate W.

[0091] The susceptor control unit 9C controls the susceptor drive unit 33 to move the movable susceptor 32 relative to the substrate W held by the upper holding devices 10A and 10B. The transfer control unit 9D controls the pin lift drive unit 43 to move the substrate W between the height position of the substrate W held by the upper holding devices 10A and 10B and the height position of the substrate W held by the suction holding unit 21.

[0092] The lower surface cleaning control unit 9E controls the lower surface brush rotation drive unit 55a, the lower surface brush lifting drive unit 55b, the lower surface cleaning liquid supply unit 56, and the ejection gas supply unit 58 to clean the lower surface of the substrate W. Furthermore, the lower surface cleaning control unit 9E controls the brush cleaning liquid supply unit 57 to clean the lower surface brush 51. The shield control unit 9F controls the shield drive unit 62 so that when cleaning the substrate W held by the suction and holding unit 21, the shield 61 catches the cleaning liquid that scatters from the substrate W.

[0093] The upper surface cleaning control unit 9G controls the upper surface cleaning drive unit 74 and the upper surface cleaning fluid supply unit 75 to clean the upper surface of the substrate W held by the suction and holding unit 21. The bevel cleaning control unit 9H controls the bevel brush drive unit 84 to clean the outer peripheral edge of the substrate W held by the suction and holding unit 21. The loading and unloading control unit 9I controls the shutter drive unit 92 to open and close the loading and unloading port 2x of the unit housing 2 when loading and unloading substrates W into and out of the substrate cleaning apparatus 1.

[0094] 3. Operation of substrate cleaning device 1

[0095] Figures 6 to 19 Is used to illustrate Figure 1 A schematic diagram of an example of the operation of the substrate cleaning device 1. Figures 6 to 19 In each figure, the upper section shows a top view of the substrate cleaning device 1. In addition, the middle section shows a side view of the lower holding device 20 and its surroundings as viewed along the Y direction, and the lower section shows a side view of the lower holding device 20 and its surroundings as viewed along the X direction. The side view in the middle section corresponds to Figure 1 The AA line side view of the lower section corresponds to the side view of Figure 1 BB line side view. In order to facilitate understanding of the shape and operation state of each component of the substrate cleaning device 1, the top view of the upper section and the side views of the middle section and the lower section have different magnifications of some components. Figures 6 to 19 , the shield 61 is shown by a two-dot chain line, and the outer shape of the substrate W is shown by a thick one-dot chain line.

[0096] Furthermore, in Figures 6 to 19In the top view of the upper section, the state of the baffle 91 or its change in state is shown in a character row, and the state of the upper side holding device 10A, 10B or its change in state is shown in a character row. Figures 6 to 19 In the side view of the middle section, the state of the lower holding device 20 or the change of its state is shown in a character row. In addition, the so-called state of the lower holding device 20 is a state indicating whether the adsorption holding part 21 is rotated.

[0097] First, if Figure 6 As shown, the initial state (standby state) in which no substrate W exists within the unit housing 2 is assumed. In the initial state before a substrate W is loaded into the substrate cleaning apparatus 1, the shutter 91 of the opening and closing device 90 is closed. Therefore, the loading / unloading port 2x is sealed by the shutter 91. Furthermore, the upper holding devices 10A and 10B are in a retracted state. Therefore, the lower chucks 11A and 11B are maintained at a distance sufficiently greater than the diameter of the substrate W. Furthermore, the upper chucks 12A and 12B are also maintained at a distance sufficiently greater than the diameter of the substrate W. The lower holding device 20 is in a stopped state, with the suction holding portion 21 stopped.

[0098] In addition, in the initial state, the movable base 32 of the base device 30 is configured in such a manner that the center of the lower adsorption holding part 21 is located at the center of the protective cover 61 when viewed from above. At this time, the lower surface cleaning device 50 is located on the movable base 32 at a position separated from the adsorption holding part 21 in the Y direction by a certain distance. Furthermore, the cleaning surface (upper end) of the lower surface brush 51 of the lower surface cleaning device 50 is located below the adsorption holding part 21. The position of the lower surface brush 51 in the up and down direction (Z direction) in the initial state is referred to as the brush standby position. When the substrate W is held by the adsorption holding part 21, the brush standby position is located below the substrate W. In particular, in the present embodiment, the brush standby position corresponds to the lowest position in the up and down direction range in which the lower surface brush 51 can be raised and lowered by the lifting support part 54.

[0099] In the initial state, the transfer device 40 is in a state where the plurality of support pins 41 are positioned below the suction holding portion 21. Furthermore, the shield 61 of the shield device 60 is in the lower shield position. In the following description, the center position of the shield 61 when viewed from above is referred to as the plane reference position rp. Furthermore, the position of the movable base 32 on the bottom surface portion 2a when the center of the suction holding portion 21 is at the plane reference position rp when viewed from above is referred to as the reference horizontal position.

[0100] like Figure 7 As shown in FIG. 1 , when a substrate W is carried into the substrate cleaning apparatus 1, the shutter 91 is switched from the closed state to the open state just before the substrate W enters the unit housing 2. Figure 7As indicated by the thick solid arrow a1 , the upper holding devices 10A and 10B are switched from the retracted state to the placement state by moving the lower chucks 11A and 11B closer to each other.

[0101] As described above, the action of switching the shutter 91 from the closed state to the open state is called the shutter opening action. In addition, the action of switching the upper holding devices 10A, 10B from the retracted state to the loadable state is called the loading preparation action. In this case, Figure 5 The chuck control unit 9A and the loading and unloading control unit 9I start each operation so that the shutter opening operation period and the placement preparation operation period overlap at least a part.

[0102] Next, if Figure 8 As indicated by the thick solid arrow a2, the hand (substrate holding portion) Ma of the substrate transfer robot (not shown) enters the interior of the unit housing 2 through the carry-in / out port 2x and moves the substrate W to a position approximately in the center of the unit housing 2. At this time, the substrate W held by the hand Ma is positioned between the lower chuck 11A and the upper chuck 12A, and the lower chuck 11B and the upper chuck 12B.

[0103] Next, the hand Ma descends. At this point, the upper holding devices 10A and 10B are in a position where they can be loaded. Therefore, by moving the hand Ma below the upper holding devices 10A and 10B, the substrate W held by the hand Ma is loaded onto the pair of lower chucks 11A and 11B. As a result, multiple portions of the lower surface periphery of the substrate W are supported by the multiple support pieces 200 ( Figure 3 ) Support. After that, the empty hand Ma exits from the load-in / load-out port 2x.

[0104] Next, after the phone is exited, Figure 9 As shown, the baffle 91 switches from the open state to the closed state. In addition, the photoelectric sensor 19 ( Figure 5 ) performs substrate placement status determination. Specifically, light is emitted from the light projecting unit 19a toward the light receiving unit 19b, and based on the light reception signal from the light receiving unit 19b, it is determined whether the substrate W is properly placed on the upper holding devices 10A and 10B. If it is determined that the substrate W is not properly placed, processing of the substrate W is stopped.

[0105] In addition, after the mobile phone is exited, Figure 9As indicated by the thick solid arrow a3, the upper chucks 12A and 12B are brought closer together, causing the plurality of holding pieces 300 of the upper chucks 12A and 12B to contact the outer peripheral edge of the substrate W. This causes the upper holding devices 10A and 10B to switch from a position capable of placing the substrate W to a holding position, with the upper holding devices 10A and 10B holding the substrate W. During this switching, after one of the upper chucks 12A and 12B is moved to the target position as described above, the other upper chuck is moved toward the one upper chuck, thereby accurately positioning the substrate W in the X direction.

[0106] At this time, the photoelectric sensor 19 ( Figure 5 ) performs a substrate holding status determination. Specifically, light is emitted from the light projecting unit 19a toward the light receiving unit 19b, and based on the light reception signal from the light receiving unit 19b, it is determined whether the substrate W is properly held by the upper holding devices 10A and 10B. If it is determined that the substrate W is not properly held, processing of the substrate W is stopped.

[0107] In the substrate cleaning apparatus 1 of this embodiment, while the substrate W is held by the upper holding devices 10A and 10B, the center area of ​​the lower surface of the substrate W is cleaned by the lower surface brush 51. Therefore, after the hand Ma is withdrawn, in preparation for cleaning the center area of ​​the lower surface of the substrate W, the lower surface brush 51 moves to a position opposite a predetermined area (initial contact area) on the lower surface of the substrate W with which it is to initially contact the brush. In this example, the initial contact area is the center area of ​​the lower surface of the substrate W.

[0108] In this case, specifically, the movable base 32 moves in the Y direction so that the initial contact area of ​​the lower surface brush 51 and the substrate W overlap when viewed from above. In addition, the lifting support 54 rises so that the lower surface brush 51 approaches a height position close to the lower surface of the substrate W. More specifically, Figure 9 In the example of FIG, as shown by the thick solid arrow a4, the movable base 32 moves forward from the reference horizontal position until the center of the lower surface brush 51 overlaps with the plane reference position rp when viewed from above. Figure 9 As indicated by the thick solid arrow a5, the lifting support 54 rises so that the lower surface brush 51 moves from the brush standby position to a position near the substrate W (a position approximately 5 mm away from the substrate W). The lifting support 54 can also rise to a position where the lower surface brush 51 contacts the lower surface of the substrate W.

[0109] As described above, the action of switching the shutter 91 from the open state to the closed state is called the shutter closing action. In addition, the action of switching the upper holding devices 10A, 10B from the loadable state to the holding state is called the holding switching action. Furthermore, the action of moving the lower surface brush 51 so that it overlaps with the initial contact area of ​​the substrate W when viewed from above, and the action of moving the brush from the brush standby position toward the lower surface of the substrate W in the vertical direction are called the brush preparation action. In this case, Figure 5 The chuck control unit 9A, base control unit 9C, lower surface cleaning control unit 9E and loading and unloading control unit 9I start each operation in such a manner that at least a portion of the shutter closing operation period, the holding switching operation period and the brush preparation operation period overlap.

[0110] Here, after the mobile phone is exited, Figure 9 As indicated by the thick solid arrow a6, the suction holding unit 21 begins to rotate. That is, the lower holding device 20 switches from a stopped state to a rotating state. This switching of the lower holding device 20 occurs, for example, between the time the substrate W enters the unit housing 2 and the time the substrate W is held by the upper holding devices 10A and 10B.

[0111] Next, the lower surface brush 51 is pressed against the initial contact area (the lower surface center area in this example) of the substrate W. Figure 10 As indicated by the thick solid arrow a7 , the lower surface brush 51 rotates (spins) around its vertical axis. Thus, the lower surface brush 51 physically removes contaminants adhering to the central region of the lower surface of the substrate W.

[0112] exist Figure 10 In the lower portion of the figure, the bubble frame shows an enlarged side view of the portion where the lower surface brush 51 contacts the lower surface of the substrate W. As shown in the bubble frame, while the lower surface brush 51 is in contact with the substrate W, the substrate nozzle 52 and the gas ejection portion 53 are maintained in a position close to the lower surface of the substrate W. At this time, as indicated by the hollow arrow a51, the substrate nozzle 52 ejects cleaning liquid toward the lower surface of the substrate W from a position near the lower surface brush 51. As a result, the cleaning liquid supplied from the substrate nozzle 52 to the lower surface of the substrate W is guided to the contact portion between the lower surface brush 51 and the substrate W, thereby rinsing away contaminants removed from the back surface of the substrate W by the lower surface brush 51.

[0113] Here, the upper surface 54u of the lift support 54 is inclined obliquely downward in a direction away from the adsorption holding portion 21. In this case, when cleaning liquid containing contaminants drips from the lower surface of the substrate W onto the lift support 54, the cleaning liquid caught by the upper surface 54u is guided in a direction away from the adsorption holding portion 21.

[0114] In addition, when the lower surface of the substrate W is cleaned by the lower surface brush 51, Figure 10 As shown by the hollow arrow a52 in the bubble frame, the gas ejection section 53 ejects gas toward the lower surface of the substrate W at a position between the lower surface brush 51 and the adsorption holding section 21. In this embodiment, the gas ejection section 53 is mounted on the movable base 32 in such a manner that the gas ejection port extends in the X direction. In this case, when the gas is ejected from the gas ejection section 53 toward the lower surface of the substrate W, a belt-shaped air curtain extending in the X direction is formed between the lower surface brush 51 and the adsorption holding section 21. This prevents the cleaning liquid containing contaminants from scattering toward the adsorption holding section 21 when the lower surface of the substrate W is cleaned using the lower surface brush 51. Therefore, the cleaning liquid containing contaminants is prevented from adhering to the adsorption holding section 21 when the lower surface of the substrate W is cleaned using the lower surface brush 51, thereby keeping the adsorption surface of the adsorption holding section 21 clean.

[0115] In addition, Figure 10 In the example shown in FIG. 5 , as indicated by the hollow arrow a52, the gas ejection unit 53 ejects gas obliquely upward from the gas ejection unit 53 toward the lower surface brush 51. However, the present invention is not limited thereto. The gas ejection unit 53 may also eject gas along the Z direction from the gas ejection unit 53 toward the lower surface of the substrate W.

[0116] As described above, the lower holding device 20 continues to rotate while the central area of ​​the lower surface of the substrate W is being cleaned. Therefore, even if droplets of cleaning liquid used to clean the substrate W fall onto the suction holding unit 21, the droplets are shaken off the rotating suction holding unit 21. This prevents droplets of cleaning liquid from remaining on the suction holding unit 21.

[0117] Next, in Figure 10 After the cleaning of the central area of ​​the lower surface of the substrate W is completed, the lifting support 54 is lowered so that the cleaning surface of the lower surface brush 51 is spaced a predetermined distance from the substrate W. Furthermore, the spraying of the cleaning liquid from the substrate nozzle 52 toward the substrate W is stopped. Meanwhile, the spraying of gas toward the substrate W from the gas ejection unit 53 continues.

[0118] Afterwards, if Figure 11 As indicated by the thick solid arrow a8, the movable base 32 moves to a position offset a predetermined distance rearward from the reference horizontal position when viewed from above. At this point, the gas ejection portion 53 continues to eject gas toward the substrate W, and the central area of ​​the lower surface of the substrate W is sequentially dried by the gas curtain.

[0119] Next, if Figure 12As indicated by the thick solid arrow a9, the lifting support 54 is lowered so that the cleaning surface of the lower surface brush 51 is positioned below the suction surface (upper end) of the suction holding portion 21. This moves the lower surface brush 51 to the brush standby position. Alternatively, the lower surface brush 51 may be moved from its position in contact with the lower surface of the substrate W to the brush standby position after cleaning the central area of ​​the lower surface of the substrate W and before drying by the gas ejection portion 53.

[0120] In addition, if Figure 12 As indicated by the thick solid arrow a10, the upper chucks 12A and 12B are moved away from each other so that they are spaced from the outer edge of the substrate W. This switches the upper holding devices 10A and 10B from a holding position to a position where the substrate W can be lifted and supported on the lower chucks 11A and 11B. During this switching, as described above, with one of the upper chucks 12A and 12B in the target position, the other upper chuck is moved away from the other upper chuck. This accurately positions the substrate W on the lower chucks 11A and 11B in the X direction.

[0121] Afterwards, if Figure 13 As shown in the middle and lower sections of FIG, the lower holding device 20 switches from a rotating state to a stopped state. That is, the rotation of the adsorption holding portion 21 of the lower holding device 20 stops. This rotation stop takes, for example, about 2 seconds. In addition, as shown in FIG. Figure 13 As shown by the thick solid arrow a11, the movable base 32 moves forward toward the reference horizontal position. Figure 1 As shown by the thick solid arrow a12 in FIG3 , the pin coupling member 42 is raised so that the upper ends of the plurality of support pins 41 are located slightly above the lower chucks 11A and 11B.

[0122] Here, Figure 5 The handover control unit 9D moves from the upper end of the plurality of support pins 41 to the position below the adsorption holding unit 21 to the position below the plurality of support pieces 200 ( Figure 3 ). Meanwhile, the transfer control unit 9D causes the support pins 41 to rise at a high speed while the upper ends of the support pins 41 are moving from a height slightly below the support pieces 200 to a height slightly above the support pieces 200. This prevents damage to the substrate W when the support pins 41 come into contact with it and shortens the time it takes for the support pins 41 in their initial state to receive the substrate W.

[0123] As described above, the action of switching the lower holding device 20 from a rotating state to a stopped state is called a rotation stop action. In addition, the action of moving the movable base 32 in a horizontal direction (in this case, forward) toward a reference horizontal position is called a horizontal movement action. Furthermore, the action of raising the plurality of support pins 41 is called an up-and-down movement action. The horizontal movement action of the movable base 32 and the up-and-down movement action of the plurality of support pins 41 are actions performed to transfer the substrate W from the upper holding devices 10A and 10B to the lower holding device 20. In this case, Figure 5 The chuck control unit 9A, the base control unit 9C and the handover control unit 9D start each operation in such a manner that at least a portion of the rotation stop operation period, at least a portion of the horizontal movement operation period and at least a portion of the vertical movement operation period overlap with each other.

[0124] Next, if Figure 14 As indicated by the thick solid arrow a13, the lower chucks 11A and 11B move away from each other. This causes the upper holding devices 10A and 10B to switch from a position capable of placing a substrate W to a retracted position. At this point, the lower chucks 11A and 11B are positioned so as not to overlap the substrate W supported by the plurality of support pins 41 when viewed from above. This allows the substrate W, supported horizontally by the plurality of support pins 41, to be moved vertically (in the Z direction) between the upper holding devices 10A and 10B.

[0125] Next, if Figure 15 As shown by the thick solid arrow a14, the pin-connecting member 42 is lowered so that the upper ends of the plurality of support pins 41 are located below the adsorption holding member 21. As a result, the substrate W supported on the plurality of support pins 41 is received by the adsorption holding member 21. In this state, the adsorption holding member 21 adsorbs and holds the center area of ​​the lower surface of the substrate W. Simultaneously with the lowering of the pin-connecting member 42 or after the lowering of the pin-connecting member 42 is completed, as shown in FIG. Figure 15 As indicated by the thick solid arrow a15 , the shroud 61 rises from the lower shroud position to the upper shroud position.

[0126] also, Figure 5 The transfer control unit 9D lowers the support pins 41 at a high speed while the upper ends of the support pins 41 move from a position above the suction holding unit 21 to a height position slightly above the suction holding unit 21, ensuring that the substrate W does not float. On the other hand, the transfer control unit 9D lowers the support pins 41 at a low speed while the upper ends of the support pins 41 move from a height position slightly above the suction holding unit 21 to a height position slightly below the suction holding unit 21. This prevents damage to the substrate W when the suction holding unit 21 contacts the substrate W and shortens the time it takes to transfer the substrate W from the upper holding devices 10A and 10B to the lower holding device 20.

[0127] Next, if Figure 16 As indicated by the thick solid arrow a16, the suction holding unit 21 rotates around the vertical axis (the axis of rotation of the suction holding drive unit 22). As a result, the substrate W suction-held by the suction holding unit 21 rotates in a horizontal posture.

[0128] Next, the rotation support shaft 71 of the upper surface cleaning device 70 rotates and descends. Figure 16 As shown by the thick solid arrow a17, the spray nozzle 73 moves to a position above the substrate W. In addition, the spray nozzle 73 is lowered so that the distance between the spray nozzle 73 and the substrate W becomes a predetermined distance. In this state, the spray nozzle 73 sprays a mixed fluid of cleaning liquid and gas onto the upper surface of the substrate W. In addition, the rotary support shaft 71 rotates. As a result, Figure 16 As indicated by a thick solid arrow a18, the spray nozzle 73 moves to a position above the rotating substrate W. By spraying the mixed fluid onto the entire upper surface of the substrate W, the entire upper surface of the substrate W is cleaned.

[0129] When the upper surface of the substrate W is cleaned by the spray nozzle 73, the rotary support shaft 81 of the end cleaning device 80 also rotates and descends. Figure 16 As indicated by the thick solid arrow a19, the bevel brush 83 moves to a position above the outer edge of the substrate W. Furthermore, it descends so that the center portion of the outer peripheral surface of the bevel brush 83 contacts the outer edge of the substrate W. In this state, the bevel brush 83 rotates (spins) about its vertical axis. This physically removes contaminants adhering to the outer edge of the substrate W by the bevel brush 83. The contaminants removed from the outer edge of the substrate W are rinsed away by the cleaning fluid of the mixed fluid sprayed onto the substrate W from the spray nozzle 73.

[0130] When the upper surface of the substrate W is cleaned by the spray nozzle 73, the lifting support 54 is raised so that the cleaning surface of the lower surface brush 51 contacts the outer area of ​​the lower surface of the substrate W. Figure 16 As indicated by the thick solid arrow a20, the lower surface brush 51 rotates (spins) about its vertical axis. Furthermore, the substrate nozzle 52 sprays cleaning liquid toward the lower surface of the substrate W, and the gas ejector 53 sprays gas toward the lower surface of the substrate W. This allows the lower surface brush 51 to clean the entire outer area of ​​the lower surface of the substrate W, which is being held and rotated by the suction and holding unit 21. The rotation direction of the lower surface brush 51 can also be opposite to that of the suction and holding unit 21. In this case, the outer area of ​​the lower surface of the substrate W can be cleaned efficiently.

[0131] In addition, the lifting support portion 54 may also be configured to be movable relative to the lower holding device 20 along the Y direction on the movable base 32. In this case, Figure 16As indicated by the thick solid arrow a21, the lifting support portion 54 is moved in the Y direction on the movable base 32. This expands the range that can be cleaned by the lower surface brush 51 while the movable base 32 is fixed at a predetermined position.

[0132] After the cleaning of the upper surface, the outer peripheral end portion and the outer area of ​​the lower surface of the substrate W is completed, the spraying of the mixed fluid from the spray nozzle 73 to the substrate W is stopped. Figure 17 As shown by the thick solid arrow a22, the spray nozzle 73 moves to a position on one side of the shield 61 (the position of the initial state). Figure 17 As indicated by the thick solid arrow a23, the bevel brush 83 moves to a position on the other side of the shield 61 (the initial position). Furthermore, the lifting support 54 descends. As a result, the lower surface brush 51 moves from its position in contact with the lower surface of the substrate W to the brush standby position. Furthermore, the spraying of cleaning liquid from the substrate nozzle 52 onto the substrate W and the injection of gas from the gas ejection unit 53 onto the substrate W cease. In this state, the high-speed rotation of the suction and holding unit 21 shakes off the cleaning liquid adhering to the substrate W, drying the entire substrate W.

[0133] Next, if Figure 18 As indicated by the thick solid arrow a24, the shield 61 descends from the upper shield position to the lower shield position. Subsequently, the substrate W is unloaded from the unit housing 2 of the substrate cleaning apparatus 1. When the substrate W is unloaded from the unit housing 2, the shutter 91 switches from a closed state to an open state (shutter opening operation) just before the hand (substrate holder) Ma of the substrate transport robot (not shown) enters the unit housing 2.

[0134] Then, if Figure 19 As indicated by the thick solid arrow a25, the hand (substrate holder) Ma of the substrate transport robot enters the unit housing 2 through the loading / unloading port 2x. The hand Ma then receives the substrate W from the suction holder 21 and exits through the loading / unloading port 2x. After the hand Ma exits, the shutter 91 switches from an open state to a closed state (shutter closing operation).

[0135] In addition, after the substrate W is carried out, a new unprocessed substrate W may be carried into the unit housing 2 (substrate W is replaced). Figure 5 The chuck control unit 9A and the loading and unloading control unit 9I start each operation in such a manner that the shutter opening operation period for unloading the processed substrate W overlaps at least a portion of the placement preparation operation period for the upper holding devices 10A and 10B to receive the unprocessed substrate W.

[0136] As described above, the lower surface brush 51 rotates substantially continuously while the power of the substrate cleaning apparatus 1 is on. Figure 5The lower surface cleaning control unit 9E controls the brush cleaning liquid supply unit 57, and during the preset brush cleaning period, the brush cleaning liquid supply unit 57 supplies the brush cleaning liquid to the lower surface cleaning control unit 9E. Figure 1 In this case, the brush cleaning period may include a period when no substrate W exists in the unit housing 2. In addition, the brush cleaning period may include a period when the lower surface brush 51 is located at the brush standby position in the vertical direction.

[0137] 4. Effect

[0138] In the substrate cleaning device 1, the upper holding devices 10A and 10B are used to hold the substrate W, and the central area of ​​the lower surface of the substrate W is cleaned. In addition, the upper holding devices 10A and 10B are switched from the holding state to the loading state. After that, the rotation of the adsorption holding part 21 stops (rotation stop action), the movable base 32 moves in the horizontal direction (horizontal movement action), and the plurality of support pins 41 rise (up and down movement action). At this time, Figure 5 The chuck control unit 9A, the base control unit 9C and the handover control unit 9D start each operation in such a manner that at least a portion of the rotation stop operation period, at least a portion of the horizontal movement operation period and at least a portion of the vertical movement operation period overlap with each other.

[0139] In this case, compared to a case where the rotation stop, horizontal movement, and vertical movement periods do not overlap, the time required to process one substrate W is shortened by the overlap period. Consequently, the substrate processing throughput is increased. Furthermore, the rotation stop of the adsorption holding unit 21, the horizontal movement of the movable base 32, and the vertical movement of the plurality of support pins 41 are preferably initiated simultaneously. Alternatively, the rotation stop of the adsorption holding unit 21, the horizontal movement of the movable base 32, and the vertical movement of the plurality of support pins 41 are preferably initiated so that their end points coincide. In these cases, the overlap period can be further increased.

[0140] 5. Other Implementation Methods

[0141] (a) In the above embodiment, after the central area of ​​the lower surface of the substrate W is cleaned and the upper holding devices 10A and 10B are switched from the holding state to the placement state, the suction holding unit 21 is rotated and stopped, the movable base 32 is moved horizontally, and the plurality of support pins 41 are moved up and down. At least a portion of the rotation stop period, at least a portion of the horizontal movement period, and at least a portion of the vertical movement period overlap. However, the present invention is not limited to this embodiment.

[0142] If the rotation stop period overlaps at least partially with the horizontal movement period, the vertical movement period may not overlap with either the rotation stop period or the horizontal movement period. In this case, since the rotation stop period overlaps at least partially with the horizontal movement period, the time required to process one substrate W is shortened by the amount of this overlap. Consequently, the substrate processing throughput is increased. Furthermore, in this case, the rotation stop period and the horizontal movement period preferably start or end simultaneously.

[0143] Furthermore, if the rotation stop period overlaps at least partially with the vertical movement period, the horizontal movement period may not overlap with either the rotation stop period or the vertical movement period. In this case, since the rotation stop period overlaps at least partially with the vertical movement period, the time required to process one substrate W is shortened by the amount of this overlap. Consequently, the substrate processing throughput is increased. Furthermore, in this case, the rotation stop period and the vertical movement period preferably start or end simultaneously.

[0144] Furthermore, if the horizontal movement period overlaps at least partially with the vertical movement period, the rotation stop period may not overlap with either the horizontal movement period or the vertical movement period. In this case, since the horizontal movement period overlaps at least partially with the vertical movement period, the time required to process one substrate W is shortened by the amount of this overlap. Consequently, the substrate processing throughput is increased. Furthermore, in this case, the horizontal movement and vertical movement operations are preferably started or ended simultaneously.

[0145] (b) In the above embodiment, the predetermined area (initial contact area) that the lower surface brush 51 should first contact on the lower surface of the substrate W held by the upper holding devices 10A and 10B is set to the central area of ​​the lower surface of the substrate W, but the present invention is not limited to this. The initial contact area can also be set to a position offset from the central area of ​​the lower surface by a predetermined distance in the Y direction. In this case, when cleaning the central area of ​​the lower surface of the substrate W, after the lower surface brush 51 contacts the initial contact area, the movable base 32 moves on the lower surface so that the lower surface brush 51 moves from the initial contact area to the central area of ​​the lower surface.

[0146] (c) In the substrate cleaning apparatus 1 of the embodiment described above, the upper holding devices 10A and 10B are configured to hold the outer peripheral edge of the substrate W, but the present invention is not limited to this. For example, the upper holding devices 10A and 10B may each include a plurality of suction pads in place of the lower chucks 11A and 11B and the upper chucks 12A and 12B, and may be configured to suction-hold a portion of the lower surface of the substrate W. In this case, the upper holding devices 10A and 10B suction-hold the outer region of the lower surface of the substrate W, which represents the peripheral edge of the substrate W. This allows the central region of the lower surface of the substrate W to be cleaned while the substrate W is suction-held by the upper holding devices 10A and 10B.

[0147] (d) In the substrate cleaning apparatus 1 of the above embodiment, the transfer apparatus 40 moves the plurality of support pins 41 up and down to transfer the substrate W from the upper holding apparatus 10A, 10B to the lower holding apparatus 20, but the present invention is not limited thereto.

[0148] The substrate cleaning apparatus 1 may also be provided with a lifting drive unit that raises and lowers the lower holding apparatus 20 relative to the upper holding apparatuses 10A and 10B. Alternatively, a lifting drive unit may be provided that raises and lowers the upper holding apparatuses 10A and 10B relative to the lower holding apparatus 20. In these cases, by raising and lowering at least one of the lower holding apparatus 20 and the upper holding apparatuses 10A and 10B relative to the other, substrates W can be transferred between the two holding apparatuses without using multiple support pins 41. In this case, the transfer apparatus 40 is unnecessary.

[0149] (e) In the substrate cleaning apparatus 1 of the above embodiment, the movable base 32 is horizontally moved by the base apparatus 30 to transfer the substrate W from the upper holding apparatus 10A, 10B to the lower holding apparatus 20, but the present invention is not limited thereto.

[0150] The substrate cleaning apparatus 1 may also be provided with a movement drive unit that moves the upper holding devices 10A and 10B relative to the lower holding device 20 in the Y direction. In this case, by moving the upper holding devices 10A and 10B relative to the lower holding device 20 in the Y direction, substrates W can be transferred between the two holding devices without moving the lower holding device 20 in the horizontal direction.

[0151] (f) The substrate cleaning apparatus 1 of the above embodiment may include a backwash nozzle for supplying a rinse liquid to an area outside the lower surface of the substrate W held by suction by the lower holding apparatus 20. Furthermore, the substrate cleaning apparatus 1 may include a rinse nozzle for supplying a rinse liquid to an upper surface of the substrate W held by suction by the lower holding apparatus 20.

[0152] Figure 20It is a schematic plan view of a substrate cleaning apparatus 1 according to another embodiment. Figure 21 Yes Figure 20 A block diagram showing the structure of a control system of the substrate cleaning apparatus 1. Figure 20 The schematic top view corresponds to Figure 1 Schematic top view of . Figure 21 The block diagram corresponds to Figure 5 About Figure 20 The substrate cleaning apparatus 1 of the embodiment will be described with reference to the following aspects which are different from the substrate cleaning apparatus 1 of the embodiment.

[0153] like Figure 20 As shown, the substrate cleaning device 1 of this example is equipped with an upper surface cleaning device 210 in addition to the upper side holding device 10A, 10B, the lower side holding device 20, the base device 30, the transfer device 40, the lower surface cleaning device 50, the shield device 60, the upper surface cleaning device 70, the end cleaning device 80 and the opening and closing device 90.

[0154] The upper surface washing device 210 is provided adjacent to the end cleaning device 80 at a position lateral to the shield 61 in the X direction. The upper surface washing device 210 includes a rotation support shaft 211 , an arm 212 , a washing nozzle 213 , and a washing drive unit 214 .

[0155] The rotation support shaft 211 extends vertically on the bottom surface 2a and is supported by a flushing drive unit 214 so as to be able to be raised and lowered and rotatable. The arm 212 extends horizontally from the upper end of the rotation support shaft 211 and is located above the upper holding device 10A. A flushing nozzle 213 is attached to the front end of the arm 212.

[0156] The rinsing nozzle 213 is connected to the rinsing liquid supply unit 215 ( Figure 21 The rinse liquid supply unit 215 supplies rinse liquid to the rinse nozzle 213. In this example, pure water is used as the cleaning liquid supplied to the rinse nozzle 213. The rinse nozzle 213 sprays the cleaning liquid supplied from the rinse liquid supply unit 215 onto the upper surface of the substrate W during or after cleaning the upper surface of the substrate W by the spray nozzle 73 and before the substrate W is dried.

[0157] The flushing drive unit 214 includes one or more pulse motors and cylinders, etc., which can lift and lower the rotating support shaft 211 and rotate the rotating support shaft 211. Figure 20 As shown by the thick dashed arrow, the rinse liquid can be supplied to the entire upper surface of the substrate W by moving the rinse nozzle 213 in an arc shape on the upper surface of the substrate W that is sucked and held by the suction holding unit 21 and rotated.

[0158] In addition, as described above, when the substrate cleaning apparatus 1 further includes a backwash nozzle, the rinse liquid can be supplied to the lower surface of the substrate W which is being sucked and held by the suction holding portion 21 and rotated. Figure 20 The substrate cleaning apparatus 1 can perform a rinsing process on the upper and lower surfaces of a substrate W after or during cleaning.

[0159] like Figure 21 As shown, the control device 170 of this example includes, as a functional unit, Figure 5 In addition to the various control units described in

[15] , the rinse control unit 9J also includes a rinse control unit 9J. Similar to the other control units, the functions of the rinse control unit 9J are implemented by the CPU executing a substrate cleaning program stored in a storage device on RAM. Alternatively, part or all of the rinse control unit 9J may be implemented using hardware such as electronic circuits. The rinse control unit 9J controls the rinse drive unit 214 and the rinse liquid supply unit 215 to rinse the upper surface of the substrate W held by the suction and holding unit 21.

[0160] (g) As shown in the above embodiment, when the cleaning liquid for substrate cleaning and the cleaning liquid for brush cleaning are the same, it is not necessary to provide the two substrate nozzles 52. In this case, when cleaning the central area of ​​the lower surface of the substrate W and when cleaning the outer areas of the lower surface of the substrate W, the cleaning liquid ejected from the brush nozzles 52a and 52b to the lower surface brush 51 can be used as the substrate cleaning liquid.

[0161] (h) In the substrate cleaning apparatus 1 of the above embodiment, the cleaning liquid is supplied to the substrate W from the two substrate nozzles 52 while the lower surface brush 51 is cleaning the central area of ​​the lower surface of the substrate W. However, the present invention is not limited to this.

[0162] In the substrate cleaning apparatus 1, the lower surface brush 51 may be cleaned before cleaning the lower surface of the substrate W using the lower surface brush 51, so that the cleaning liquid is immersed in the lower surface brush 51. In this case, by bringing the lower surface brush 51 immersed in the cleaning liquid into contact with the lower surface of the substrate W, the lower surface of the substrate W can be cleaned while the lower surface brush 51 is in contact with the substrate W, without the need to supply new cleaning liquid.

[0163] 6. Correspondence between the components of the technical solution and the parts of the implementation method

[0164] Hereinafter, examples of correspondence between the components of the technical solution and the components of the embodiment will be described, but the present invention is not limited to the following examples. As the components of the technical solution, various other components having the structure or function described in the technical solution may also be used.

[0165] In the embodiment, the upper side holding devices 10A and 10B are examples of the first substrate holding part, the adsorption holding part 21 is an example of the second substrate holding part, the adsorption holding drive part 22 is an example of the rotation drive part, the lower surface cleaning device 50 is an example of the brush cleaning part, the base device 30 is an example of the horizontal moving part, and the transfer device 40 is an example of the up and down moving part.

[0166] 7. Summary of Implementation Methods

[0167] (Item 1) The substrate processing apparatus of Item 1 comprises:

[0168] a first substrate holding portion for holding a peripheral edge portion of the substrate;

[0169] a second substrate holding portion configured to hold a central area of ​​a lower surface of the substrate at a position lower than that of the first substrate holding portion;

[0170] a rotation drive unit for rotating the second substrate holding unit around an axis in the vertical direction;

[0171] a brush cleaning portion configured to clean the lower surface central region of the substrate held by the first substrate holding portion by bringing the brush into contact with the lower surface central region, and to clean the lower surface outer region of the substrate held by the second substrate holding portion by bringing the brush into contact with the lower surface outer region surrounding the lower surface central region;

[0172] a horizontal moving portion that performs a horizontal movement operation to change the relative positional relationship between the first substrate holding portion and the second substrate holding portion in a horizontal plane; and

[0173] control unit; and

[0174] The control unit

[0175] When the substrate is cleaned, the first substrate holding portion, the second substrate holding portion, the rotation drive portion, the brush cleaning portion, and the horizontal moving portion are controlled.

[0176] while rotating the second substrate holding portion, the brush cleaning portion cleans the lower surface center area of ​​the substrate held by the first substrate holding portion,

[0177] After the central area of ​​the lower surface of the substrate is cleaned, the second substrate holding portion is stopped from rotating so as to transfer the substrate from the first substrate holding portion to the second substrate holding portion.

[0178] After the central area of ​​the lower surface of the substrate is cleaned, the horizontal moving portion is caused to perform the horizontal moving action so as to transfer the substrate from the first substrate holding portion to the second substrate holding portion.

[0179] After the substrate is transferred from the first substrate holding portion to the second substrate holding portion, the brush cleaning portion is used to clean the outer area of ​​the lower surface of the substrate held by the second substrate holding portion while rotating the second substrate holding portion.

[0180] After the central area of ​​the lower surface of the substrate is cleaned, the rotation stopping action and the horizontal movement action of the second substrate holding part are performed in a manner that at least a portion of the rotation stopping action period overlaps with the horizontal movement action period until the substrate is handed over to the second substrate holding part.

[0181] In this substrate processing apparatus, for example, multiple substrates are sequentially cleaned. During substrate cleaning, the first substrate holder holds the substrate while the central area of ​​the substrate's lower surface is cleaned. During this cleaning process, the second substrate holder rotates. This prevents droplets of cleaning liquid from remaining on the second substrate holder, even if they drip onto the second substrate holder. After the central area of ​​the substrate's lower surface is cleaned, the second substrate holder stops rotating, and the horizontal movement of the horizontal movement unit transfers the substrate from the first substrate holder to the second substrate holder. Furthermore, the second substrate holder holds the substrate while the outer area of ​​the substrate's lower surface is cleaned.

[0182] According to the substrate processing apparatus, after the central area of ​​the lower surface of the substrate is cleaned, until the substrate is transferred to the second substrate holder, a period during which the second substrate holder is stopped for rotation overlaps at least partially with a period during which the horizontal moving portion is moved horizontally. These periods are referred to as an overlapping period.

[0183] Thus, compared to a case where the rotation stop operation and the horizontal movement operation of the second substrate holding portion are performed without overlap, the period required for cleaning the substrate is shortened by the overlap period, thereby improving the substrate processing throughput.

[0184] (Item 2) The substrate processing apparatus of Item 2 comprises:

[0185] a first substrate holding portion for holding a peripheral edge portion of the substrate;

[0186] a second substrate holding portion configured to hold a central area of ​​a lower surface of the substrate at a position lower than that of the first substrate holding portion;

[0187] a rotation drive unit for rotating the second substrate holding unit around an axis in the vertical direction;

[0188] a brush cleaning portion configured to clean the lower surface central region of the substrate held by the first substrate holding portion by bringing the brush into contact with the lower surface central region, and to clean the lower surface outer region of the substrate held by the second substrate holding portion by bringing the brush into contact with the lower surface outer region surrounding the lower surface central region;

[0189] a vertical moving portion that performs a vertical movement operation, that is, changes the relative positional relationship between the first substrate holding portion and the substrate by moving at least one of the first substrate holding portion, the second substrate holding portion, and the substrate in the vertical direction; and

[0190] control unit; and

[0191] The control unit

[0192] When the substrate is cleaned, the first substrate holding portion, the second substrate holding portion, the rotation drive portion, the brush cleaning portion, and the vertical moving portion are controlled.

[0193] while rotating the second substrate holding portion, the brush cleaning portion cleans the central area of ​​the lower surface of the substrate held by the first substrate holding portion.

[0194] After the central area of ​​the lower surface of the substrate is cleaned, the second substrate holding portion is stopped from rotating so as to transfer the substrate from the first substrate holding portion to the second substrate holding portion.

[0195] After the central area of ​​the lower surface of the substrate is cleaned, the vertical moving portion is caused to perform the vertical movement so as to transfer the substrate from the first substrate holding portion to the second substrate holding portion.

[0196] After the substrate is transferred from the first substrate holding portion to the second substrate holding portion, the brush cleaning portion is used to clean the outer area of ​​the lower surface of the substrate held by the second substrate holding portion while rotating the second substrate holding portion.

[0197] After the central area of ​​the lower surface of the substrate is cleaned, the rotation stopping action and the up and down movement action of the second substrate holding part are performed in a manner that at least a portion of the rotation stopping action period overlaps with the up and down movement action period until the substrate is handed over to the second substrate holding part.

[0198] In this substrate processing apparatus, for example, multiple substrates are sequentially cleaned. During substrate cleaning, the first substrate holder holds the substrate while the central area of ​​the substrate's lower surface is cleaned. During this cleaning process, the second substrate holder rotates. This prevents droplets of cleaning liquid from remaining on the second substrate holder, even if they drip onto the second substrate holder. After the central area of ​​the substrate's lower surface is cleaned, the second substrate holder stops rotating, and the vertical movement of the vertical movement unit transfers the substrate from the first substrate holder to the second substrate holder. Furthermore, the second substrate holder holds the substrate while the outer area of ​​the substrate's lower surface is cleaned.

[0199] According to the substrate processing apparatus, after the central area of ​​the lower surface of the substrate is cleaned, until the substrate is transferred to the second substrate holder, at least a portion of the second substrate holder's rotation stop period overlaps with the vertical movement period of the vertical movement portion. These periods are referred to as overlapping periods.

[0200] Thus, compared to a case where the rotation stop operation and the vertical movement operation of the second substrate holding portion are performed without overlap, the period required for cleaning the substrate is shortened by the overlap period, thereby improving the substrate processing throughput.

[0201] (Item 3) The substrate processing apparatus of Item 3 comprises:

[0202] a first substrate holding portion for holding a peripheral edge portion of the substrate;

[0203] a second substrate holding portion configured to hold a central area of ​​a lower surface of the substrate at a position lower than that of the first substrate holding portion;

[0204] a brush cleaning portion configured to clean the lower surface central region of the substrate held by the first substrate holding portion by bringing the brush into contact with the lower surface central region, and to clean the lower surface outer region of the substrate held by the second substrate holding portion by bringing the brush into contact with the lower surface outer region surrounding the lower surface central region;

[0205] a horizontal moving portion for performing a horizontal movement operation to change a relative positional relationship between the first substrate holding portion and the second substrate holding portion in a horizontal plane;

[0206] a vertical moving portion that performs a vertical movement operation, that is, changes the relative positional relationship between the first substrate holding portion and the substrate by moving at least one of the first substrate holding portion, the second substrate holding portion, and the substrate in the vertical direction; and

[0207] control unit; and

[0208] The control unit

[0209] When the substrate is cleaned, the first substrate holding portion, the second substrate holding portion, the brush cleaning portion, the horizontal moving portion, and the vertical moving portion are controlled.

[0210] cleaning the central area of ​​the lower surface of the substrate held by the first substrate holding portion using the brush cleaning portion,

[0211] After the central area of ​​the lower surface of the substrate is cleaned, the horizontal moving portion is caused to perform the horizontal moving action so as to transfer the substrate from the first substrate holding portion to the second substrate holding portion.

[0212] After the central area of ​​the lower surface of the substrate is cleaned, the vertical moving portion is caused to perform the vertical movement so as to transfer the substrate from the first substrate holding portion to the second substrate holding portion.

[0213] After the substrate is transferred from the first substrate holding portion to the second substrate holding portion, the brush cleaning portion cleans the outer region of the lower surface of the substrate held by the second substrate holding portion.

[0214] After the central area of ​​the lower surface of the substrate is cleaned, the horizontal movement and the up and down movement are performed in a period from when the substrate is handed over to the second substrate holding portion, with at least a portion of the horizontal movement period overlapping with the up and down movement period.

[0215] In this substrate processing apparatus, for example, multiple substrates are sequentially cleaned. During substrate cleaning, the first substrate holder holds the substrate, and the central area of ​​the substrate's lower surface is cleaned. After the central area of ​​the substrate's lower surface is cleaned, the horizontal movement of the horizontal moving portion and the vertical movement of the vertical moving portion transfer the substrate from the first substrate holder to the second substrate holder. Furthermore, the second substrate holder holds the substrate, and the outer area of ​​the substrate's lower surface is cleaned.

[0216] According to the substrate processing apparatus, after the central area of ​​the lower surface of the substrate is cleaned, until the substrate is transferred to the second substrate holding portion, at least a portion of the horizontal movement period of the horizontal moving portion overlaps with the vertical movement period of the vertical moving portion. These periods are referred to as overlapping periods.

[0217] As a result, compared to a case where the horizontal movement operation and the vertical movement operation are performed without overlap, the period required for cleaning the substrate is shortened by the overlap period, thereby improving the throughput of substrate processing.

[0218] (Item 4) In the substrate processing apparatus of Item 1, it may also be

[0219] The substrate processing device further includes a vertical moving portion.

[0220] The vertical moving portion changes the relative positional relationship between the first substrate holding portion and the substrate by moving at least one of the first substrate holding portion, the second substrate holding portion, and the substrate in the vertical direction.

[0221] The control unit

[0222] When the substrate is cleaned, the vertical moving portion is controlled in addition to the first substrate holding portion, the second substrate holding portion, the rotation driving portion, the brush cleaning portion, and the horizontal moving portion.

[0223] After the central area of ​​the lower surface of the substrate is cleaned, the vertical moving portion is further moved up and down to transfer the substrate from the first substrate holding portion to the second substrate holding portion.

[0224] After the central area of ​​the lower surface of the substrate is cleaned, the rotation stopping action, the horizontal movement action and the up and down movement action of the second substrate holding portion are performed in a manner that at least a part of the rotation stopping action period, at least a part of the horizontal movement action period and at least a part of the up and down movement action period overlap with each other during the period until the substrate is handed over to the second substrate holding portion.

[0225] According to the substrate processing apparatus, after the central area of ​​the lower surface of the substrate is cleaned and until the substrate is transferred to the second substrate holder, at least a portion of a period during which the second substrate holder stops rotating, a period during which the horizontal moving portion moves horizontally, and a period during which the vertical moving portion moves vertically overlap. These periods are referred to as overlapping periods.

[0226] As a result, compared to a case where the rotation stop operation, horizontal movement operation, and vertical movement operation of the second substrate holding portion are performed without overlap, the period required for cleaning the substrate is shortened by the overlap period, thereby improving the substrate processing throughput.

[0227] (Item 5) Substrate processing method of Item 5

[0228] Using a substrate processing device,

[0229] The substrate processing apparatus comprises:

[0230] a first substrate holding portion for holding a peripheral edge portion of the substrate;

[0231] a second substrate holding portion configured to rotatably hold a central region of a lower surface of the substrate at a position lower than that of the first substrate holding portion; and

[0232] a horizontal moving portion for performing a horizontal movement operation, that is, changing the relative positional relationship between the first substrate holding portion and the second substrate holding portion in a horizontal plane; and

[0233] The substrate processing method comprises the following steps:

[0234] while rotating the second substrate holding portion, bringing a brush into contact with the central area of ​​the lower surface of the substrate held by the first substrate holding portion to clean the central area of ​​the lower surface of the substrate;

[0235] After the central area of ​​the lower surface of the substrate is cleaned, the second substrate holding portion stops rotating to transfer the substrate from the first substrate holding portion to the second substrate holding portion;

[0236] After cleaning the central area of ​​the lower surface of the substrate, causing the horizontal moving portion to perform the horizontal moving action so as to transfer the substrate from the first substrate holding portion to the second substrate holding portion; and

[0237] After the substrate is transferred from the first substrate holding portion to the second substrate holding portion, the brush is brought into contact with an outer region of the lower surface of the substrate held by the second substrate holding portion, surrounding the central region of the lower surface, while the second substrate holding portion is rotated, thereby cleaning the outer region of the lower surface of the substrate; and

[0238] After the central area of ​​the lower surface of the substrate is cleaned, until the substrate is handed over to the second substrate holding part, the step of stopping the rotation of the second substrate holding part and the step of causing the horizontal moving part to perform the horizontal movement action are started in a manner that at least a part of the rotation stopping action period of the second substrate holding part overlaps with the horizontal movement action period.

[0239] In this substrate processing method, for example, multiple substrates are sequentially cleaned. During substrate cleaning, the first substrate holder holds the substrate while the central area of ​​the substrate's lower surface is cleaned. During this cleaning process, the second substrate holder rotates. This prevents droplets of cleaning solution from remaining on the second substrate holder, even if they drip onto the second substrate holder. After the central area of ​​the substrate's lower surface is cleaned, the second substrate holder stops rotating, and the horizontal movement of the horizontal movement unit transfers the substrate from the first substrate holder to the second substrate holder. Furthermore, the second substrate holder holds the substrate while the outer area of ​​the substrate's lower surface is cleaned.

[0240] According to the substrate processing method, after the central area of ​​the lower surface of the substrate is cleaned, until the substrate is transferred to the second substrate holder, at least a portion of the second substrate holder's rotational stop period overlaps with the horizontal movement period of the horizontal movement portion. These periods are referred to as overlapping periods.

[0241] Thus, compared to a case where the rotation stop operation and the horizontal movement operation of the second substrate holding portion are performed without overlap, the period required for cleaning the substrate is shortened by the overlap period, thereby improving the substrate processing throughput.

[0242] (Item 6) Substrate processing method of Item 6

[0243] Using a substrate processing device,

[0244] The substrate processing apparatus comprises:

[0245] a first substrate holding portion for holding a peripheral edge portion of the substrate;

[0246] a second substrate holding portion configured to rotatably hold a central region of a lower surface of the substrate at a position lower than that of the first substrate holding portion; and

[0247] a vertical moving portion that performs a vertical movement action, that is, changes the relative positional relationship between the first substrate holding portion and the substrate by moving at least one of the first substrate holding portion, the second substrate holding portion, and the substrate in the vertical direction; and

[0248] The substrate processing method comprises the following steps:

[0249] while rotating the second substrate holding portion, bringing a brush into contact with the central area of ​​the lower surface of the substrate held by the first substrate holding portion to clean the central area of ​​the lower surface of the substrate;

[0250] After the central area of ​​the lower surface of the substrate is cleaned, the second substrate holding portion stops rotating to transfer the substrate from the first substrate holding portion to the second substrate holding portion;

[0251] After cleaning the central area of ​​the lower surface of the substrate, causing the vertical movement portion to perform the vertical movement to transfer the substrate from the first substrate holding portion to the second substrate holding portion; and

[0252] After the substrate is transferred from the first substrate holding portion to the second substrate holding portion, the brush is brought into contact with an outer region of the lower surface of the substrate held by the second substrate holding portion, surrounding the central region of the lower surface, while the second substrate holding portion is rotated, thereby cleaning the outer region of the lower surface of the substrate; and

[0253] After the central area of ​​the lower surface of the substrate is cleaned, until the substrate is handed over to the second substrate holding part, the steps of stopping the rotation of the second substrate holding part and causing the up and down moving part to perform the up and down movement are started in a manner that at least a part of the rotation stopping action period of the second substrate holding part overlaps with the up and down movement action period.

[0254] In this substrate processing method, for example, multiple substrates are sequentially cleaned. During substrate cleaning, the first substrate holder holds the substrate while the central area of ​​the substrate's lower surface is cleaned. During this cleaning process, the second substrate holder rotates. This prevents droplets of cleaning solution from remaining on the second substrate holder, even if they drip onto the second substrate holder. After the central area of ​​the substrate's lower surface is cleaned, the second substrate holder stops rotating, and the vertical movement of the vertical movement unit transfers the substrate from the first substrate holder to the second substrate holder. Furthermore, the second substrate holder holds the substrate while the outer area of ​​the substrate's lower surface is cleaned.

[0255] According to the substrate processing method, after the central area of ​​the lower surface of the substrate is cleaned, until the substrate is handed over to the second substrate holder, the period during which the second substrate holder is stopped from rotating overlaps at least a portion of the period during which the vertical movement portion is moving upward and downward. These periods are referred to as overlapping periods.

[0256] Thus, compared to a case where the rotation stop operation and the vertical movement operation of the second substrate holding portion are performed without overlap, the period required for cleaning the substrate is shortened by the overlap period, thereby improving the substrate processing throughput.

[0257] (Item 7) Substrate processing method of Item 7

[0258] Using a substrate processing device,

[0259] The substrate processing apparatus comprises:

[0260] a first substrate holding portion for holding a peripheral edge portion of the substrate;

[0261] a second substrate holding portion configured to hold a central area of ​​a lower surface of the substrate at a position lower than that of the first substrate holding portion;

[0262] a horizontal moving portion that performs a horizontal movement operation to change the relative positional relationship between the first substrate holding portion and the second substrate holding portion in a horizontal plane; and

[0263] a vertical moving portion that performs a vertical movement action, that is, changes the relative positional relationship between the first substrate holding portion and the substrate by moving at least one of the first substrate holding portion, the second substrate holding portion, and the substrate in the vertical direction; and

[0264] The substrate processing method comprises the following steps:

[0265] bringing a brush into contact with the central area of ​​the lower surface of the substrate held by the first substrate holding portion to clean the central area of ​​the lower surface of the substrate;

[0266] After the central area of ​​the lower surface of the substrate is cleaned, the horizontal moving portion is caused to perform the horizontal moving action so as to transfer the substrate from the first substrate holding portion to the second substrate holding portion;

[0267] After cleaning the central area of ​​the lower surface of the substrate, causing the vertical movement portion to perform the vertical movement to transfer the substrate from the first substrate holding portion to the second substrate holding portion; and

[0268] After the substrate is transferred from the first substrate holding portion to the second substrate holding portion, the brush is brought into contact with the lower surface outer region surrounding the lower surface central region of the substrate held by the second substrate holding portion to clean the lower surface outer region of the substrate; and

[0269] After the central area of ​​the lower surface of the substrate is cleaned, until the substrate is handed over to the second substrate holding portion, the steps of causing the horizontal moving portion to perform the horizontal movement action and the steps of causing the vertical moving portion to perform the vertical movement action are started in a manner that at least a portion of the horizontal movement action period overlaps with the vertical movement action period.

[0270] In this substrate processing method, for example, multiple substrates are sequentially cleaned. During substrate cleaning, the substrate is first held by a first substrate holder, and the central area of ​​the substrate's lower surface is cleaned. After the central area of ​​the substrate's lower surface is cleaned, the substrate is transferred from the first substrate holder to the second substrate holder through horizontal movement of the horizontal moving portion and vertical movement of the vertical moving portion. Furthermore, the substrate is held by the second substrate holder, and the outer area of ​​the substrate's lower surface is cleaned.

[0271] According to the substrate processing method, after the central area of ​​the lower surface of the substrate is cleaned, until the substrate is transferred to the second substrate holding unit, at least a portion of the horizontal movement period of the horizontal moving unit overlaps with the vertical movement period of the vertical moving unit. These periods are referred to as overlapping periods.

[0272] As a result, compared to a case where the horizontal movement operation and the vertical movement operation are performed without overlap, the period required for cleaning the substrate is shortened by the overlap period, thereby improving the throughput of substrate processing.

[0273] (Item 8) In the substrate processing method of Item 5, it may also be

[0274] The substrate processing device further includes a vertical moving portion.

[0275] The vertical moving portion changes the relative positional relationship between the first substrate holding portion and the substrate by moving at least one of the first substrate holding portion, the second substrate holding portion, and the substrate in the vertical direction.

[0276] The substrate processing method further comprises the following steps:

[0277] After the central area of ​​the lower surface of the substrate is cleaned, the vertical moving portion is caused to perform the vertical movement so as to transfer the substrate from the first substrate holding portion to the second substrate holding portion, and

[0278] After the central area of ​​the lower surface of the substrate is cleaned, until the substrate is handed over to the second substrate holding part, the steps of stopping the rotation of the second substrate holding part, causing the horizontal moving part to perform the horizontal movement, and causing the vertical moving part to perform the vertical movement are started in a manner that at least a part of the rotation stopping action period of the second substrate holding part, at least a part of the horizontal movement action period, and at least a part of the vertical movement action period overlap with each other.

[0279] According to the substrate processing apparatus, after the central area of ​​the lower surface of the substrate is cleaned and until the substrate is transferred to the second substrate holder, at least a portion of a period during which the second substrate holder stops rotating, a period during which the horizontal moving portion moves horizontally, and a period during which the vertical moving portion moves vertically overlap. These periods are referred to as overlapping periods.

[0280] As a result, compared to a case where the rotation stop operation, horizontal movement operation, and vertical movement operation of the second substrate holding portion are performed without overlap, the period required for cleaning the substrate is shortened by the overlap period, thereby improving the substrate processing throughput.

[0281] In the above embodiment, the lower holding device 20 is described as being continuously rotated while the central area of ​​the lower surface of the substrate W is being cleaned. However, the present invention is not limited to the lower holding device 20 being continuously rotated during the cleaning of the central area of ​​the lower surface of the substrate W. Alternatively, the lower holding device 20 may be rotated only for a certain period immediately before the cleaning of the central area of ​​the lower surface of the substrate W is completed. In this case, droplets of cleaning liquid used for cleaning the substrate W that have fallen onto the suction holding portion 21 will also be shaken off the suction holding portion 21. This prevents droplets of cleaning liquid from remaining on the suction holding portion 21.

[0282] The substrate processing apparatus and substrate processing method of the embodiments described above increase substrate processing throughput and substrate processing efficiency, thereby achieving energy-saving substrate processing. Furthermore, when chemical liquids are used in substrate processing, the improved yield reduces the use of excess chemical liquids, thereby contributing to reducing global environmental pollution.

Claims

1. A substrate processing apparatus comprising: a first substrate holding portion for holding a peripheral edge portion of the substrate; a second substrate holding portion configured to hold a central area of ​​a lower surface of the substrate at a position lower than that of the first substrate holding portion; a rotation drive unit for rotating the second substrate holding unit around an axis in the vertical direction; a brush cleaning portion configured to clean the lower surface central region of the substrate held by the first substrate holding portion by bringing the brush into contact with the lower surface central region, and to clean the lower surface outer region of the substrate held by the second substrate holding portion by bringing the brush into contact with the lower surface outer region surrounding the lower surface central region; a horizontal moving portion for performing a horizontal movement operation to change a relative positional relationship between the first substrate holding portion and the second substrate holding portion in a horizontal plane; as well as control unit; and The control unit When the substrate is cleaned, the first substrate holding portion, the second substrate holding portion, the rotation drive portion, the brush cleaning portion, and the horizontal moving portion are controlled. while rotating the second substrate holding portion, the brush cleaning portion cleans the lower surface center area of ​​the substrate held by the first substrate holding portion, After the central area of ​​the lower surface of the substrate is cleaned, the second substrate holding portion is stopped from rotating so as to transfer the substrate from the first substrate holding portion to the second substrate holding portion. After the central area of ​​the lower surface of the substrate is cleaned, the horizontal moving portion is caused to perform the horizontal moving action so as to transfer the substrate from the first substrate holding portion to the second substrate holding portion. After the substrate is transferred from the first substrate holding portion to the second substrate holding portion, the brush cleaning portion is used to clean the outer area of ​​the lower surface of the substrate held by the second substrate holding portion while rotating the second substrate holding portion. During the period from the cleaning of the central area of ​​the lower surface of the substrate to the handing over of the substrate to the second substrate holding portion, the rotation stopping action and the horizontal movement action are performed in such a manner that the period of the rotation stopping action of the second substrate holding portion overlaps with at least a portion of the period of the horizontal movement action.

2. The substrate processing apparatus according to claim 1, further comprising: a vertical moving portion having a plurality of support pins for supporting a plurality of portions of the substrate from below and a pin lifting and lowering driving portion for moving the plurality of support pins in the vertical direction, wherein the plurality of support pins are moved in the vertical direction by the pin lifting and lowering driving portion in a state where the plurality of support pins support the substrate, thereby performing a vertical movement action for changing the relative positional relationship between the first substrate holding portion and the substrate; and The control unit When the substrate is cleaned, the vertical moving portion is controlled in addition to the first substrate holding portion, the second substrate holding portion, the rotation driving portion, the brush cleaning portion, and the horizontal moving portion. After the central area of ​​the lower surface of the substrate is cleaned, the vertical moving portion is further moved up and down to transfer the substrate from the first substrate holding portion to the second substrate holding portion. During the period from the central area of ​​the lower surface of the substrate being cleaned to the time when the substrate is handed over to the second substrate holding portion, the rotation stopping action, the horizontal moving action and the up and down moving action of the second substrate holding portion are performed in a manner such that at least a portion of the period of the rotation stopping action, at least a portion of the period of the horizontal moving action and at least a portion of the period of the up and down moving action overlap with each other.

3. The substrate processing apparatus according to claim 1, further comprising: a lifting drive portion for performing a vertical movement operation of moving the holding portion of at least one of the first substrate holding portion and the second substrate holding portion in a vertical direction relative to the holding portion of the other substrate holding portion, in a state where the substrate is supported by either the first substrate holding portion or the second substrate holding portion; and The control unit When the substrate is cleaned, the lifting drive unit is controlled in addition to the first substrate holding unit, the second substrate holding unit, the rotation drive unit, the brush cleaning unit, and the horizontal moving unit. After the central area of ​​the lower surface of the substrate is cleaned, the lifting drive unit is caused to perform the vertical movement to transfer the substrate from the first substrate holding unit to the second substrate holding unit. During the period from the central area of ​​the lower surface of the substrate being cleaned to the time when the substrate is handed over to the second substrate holding portion, the rotation stopping action, the horizontal moving action and the up and down moving action of the second substrate holding portion are performed in a manner such that at least a portion of the period of the rotation stopping action, at least a portion of the period of the horizontal moving action and at least a portion of the period of the up and down moving action overlap with each other.

4. A substrate processing apparatus comprising: a first substrate holding portion for holding a peripheral edge portion of the substrate; a second substrate holding portion configured to hold a central area of ​​a lower surface of the substrate at a position lower than that of the first substrate holding portion; a rotation drive unit for rotating the second substrate holding unit around an axis in the vertical direction; a brush cleaning portion configured to clean the lower surface central region of the substrate held by the first substrate holding portion by bringing the brush into contact with the lower surface central region, and to clean the lower surface outer region of the substrate held by the second substrate holding portion by bringing the brush into contact with the lower surface outer region surrounding the lower surface central region; a vertical movement portion having a plurality of support pins for supporting a plurality of portions of the substrate from below and a pin lift driving portion for moving the plurality of support pins in a vertical direction, wherein the plurality of support pins are moved in a vertical direction by the pin lift driving portion while the plurality of support pins are supporting the substrate, thereby performing a vertical movement operation for changing a relative positional relationship between the first substrate holding portion and the substrate; as well as control unit; and The control unit When the substrate is cleaned, the first substrate holding portion, the second substrate holding portion, the rotation drive portion, the brush cleaning portion, and the vertical moving portion are controlled. while rotating the second substrate holding portion, the brush cleaning portion cleans the lower surface center area of ​​the substrate held by the first substrate holding portion, After the central area of ​​the lower surface of the substrate is cleaned, the second substrate holding portion is stopped from rotating so as to transfer the substrate from the first substrate holding portion to the second substrate holding portion. After the central area of ​​the lower surface of the substrate is cleaned, the vertical moving portion is caused to perform the vertical movement so as to transfer the substrate from the first substrate holding portion to the second substrate holding portion. After the substrate is transferred from the first substrate holding portion to the second substrate holding portion, the brush cleaning portion is used to clean the outer area of ​​the lower surface of the substrate held by the second substrate holding portion while rotating the second substrate holding portion. During the period from the cleaning of the central area of ​​the lower surface of the substrate to the delivery of the substrate to the second substrate holding portion, the rotation stopping action and the up-and-down movement action are performed in such a manner that the period of the rotation stopping action of the second substrate holding portion overlaps with at least a portion of the period of the up-and-down movement action.

5. A substrate processing apparatus comprising: a first substrate holding portion for holding a peripheral edge portion of the substrate; a second substrate holding portion configured to hold a central area of ​​a lower surface of the substrate at a position lower than that of the first substrate holding portion; a rotation drive unit for rotating the second substrate holding unit around an axis in the vertical direction; a brush cleaning portion configured to clean the lower surface central region of the substrate held by the first substrate holding portion by bringing the brush into contact with the lower surface central region, and to clean the lower surface outer region of the substrate held by the second substrate holding portion by bringing the brush into contact with the lower surface outer region surrounding the lower surface central region; a lifting drive portion for performing a vertical movement operation of moving at least one of the first substrate holding portion and the second substrate holding portion in a vertical direction relative to the other substrate holding portion in a state where the substrate is supported by either the first substrate holding portion or the second substrate holding portion; and control unit; and The control unit When the substrate is cleaned, the first substrate holding portion, the second substrate holding portion, the rotation drive portion, the brush cleaning portion, and the lifting drive portion are controlled. while rotating the second substrate holding portion, the brush cleaning portion cleans the central area of ​​the lower surface of the substrate held by the first substrate holding portion. After the central area of ​​the lower surface of the substrate is cleaned, the second substrate holding portion is stopped from rotating so as to transfer the substrate from the first substrate holding portion to the second substrate holding portion. After the central area of ​​the lower surface of the substrate is cleaned, the lifting drive unit is caused to perform the vertical movement to transfer the substrate from the first substrate holding unit to the second substrate holding unit. After the substrate is transferred from the first substrate holding portion to the second substrate holding portion, the brush cleaning portion is used to clean the outer area of ​​the lower surface of the substrate held by the second substrate holding portion while rotating the second substrate holding portion. During the period from the cleaning of the central area of ​​the lower surface of the substrate to the delivery of the substrate to the second substrate holding portion, the rotation stopping action and the up-and-down movement action are performed in such a manner that the period of the rotation stopping action of the second substrate holding portion overlaps with at least a portion of the period of the up-and-down movement action.

6. A substrate processing method using a substrate processing device, The substrate processing apparatus comprises: a first substrate holding portion for holding a peripheral edge portion of the substrate; a second substrate holding portion configured to rotatably hold a central area of ​​a lower surface of the substrate at a position lower than that of the first substrate holding portion; as well as a horizontal moving portion for performing a horizontal movement operation to change the relative positional relationship between the first substrate holding portion and the second substrate holding portion in a horizontal plane; and The substrate processing method comprises the following steps: while rotating the second substrate holding portion, bringing a brush into contact with the central area of ​​the lower surface of the substrate held by the first substrate holding portion to clean the central area of ​​the lower surface of the substrate; After the central area of ​​the lower surface of the substrate is cleaned, the second substrate holding portion stops rotating to transfer the substrate from the first substrate holding portion to the second substrate holding portion; After the central area of ​​the lower surface of the substrate is cleaned, the horizontal moving portion is caused to perform the horizontal moving action so as to transfer the substrate from the first substrate holding portion to the second substrate holding portion; as well as After the substrate is transferred from the first substrate holding portion to the second substrate holding portion, the brush is brought into contact with an outer region of the lower surface of the substrate held by the second substrate holding portion, surrounding the central region of the lower surface, while the second substrate holding portion is rotated, thereby cleaning the outer region of the lower surface of the substrate; and During the period from the central area of ​​the lower surface of the substrate being cleaned to the time when the substrate is handed over to the second substrate holding portion, the step of stopping the rotation of the second substrate holding portion and the step of causing the horizontal moving portion to perform the horizontal moving action are started in such a manner that at least a portion of the period of the rotation stopping action of the second substrate holding portion overlaps with the period of the horizontal moving action.

7. The substrate processing method according to claim 6, wherein The substrate processing apparatus further comprises: a vertical moving portion having a plurality of support pins for supporting a plurality of portions of the substrate from below and a pin lifting and lowering driving portion for moving the plurality of support pins in the vertical direction, wherein the plurality of support pins are moved in the vertical direction by the pin lifting and lowering driving portion in a state where the plurality of support pins support the substrate, thereby performing a vertical movement action for changing the relative positional relationship between the first substrate holding portion and the substrate; and The substrate processing method further comprises the following steps: After the central area of ​​the lower surface of the substrate is cleaned, the vertical moving portion is caused to perform the vertical movement so as to transfer the substrate from the first substrate holding portion to the second substrate holding portion. During the period from after the central area of ​​the lower surface of the substrate is cleaned to when the substrate is handed over to the second substrate holding portion, the steps of stopping the rotation of the second substrate holding portion, causing the horizontal moving portion to perform the horizontal movement, and causing the vertical moving portion to perform the vertical movement are started in a manner that at least a portion of the period of the rotation stop action of the second substrate holding portion, at least a portion of the period of the horizontal movement action, and at least a portion of the period of the vertical movement action overlap with each other.

8. The substrate processing method according to claim 6, wherein The substrate processing apparatus further comprises: a lifting drive portion for performing a vertical movement operation of moving the holding portion of at least one of the first substrate holding portion and the second substrate holding portion in a vertical direction relative to the holding portion of the other substrate holding portion, in a state where the substrate is supported by either the first substrate holding portion or the second substrate holding portion; and The substrate processing method further comprises the following steps: After the central area of ​​the lower surface of the substrate is cleaned, the lifting drive unit is caused to perform the vertical movement to transfer the substrate from the first substrate holding unit to the second substrate holding unit. During the period from after the central area of ​​the lower surface of the substrate is cleaned to when the substrate is handed over to the second substrate holding portion, the steps of stopping the rotation of the second substrate holding portion, causing the horizontal moving portion to perform the horizontal movement, and causing the lifting drive portion to perform the up and down movement are started in a manner that at least a portion of the period of the rotation stop action of the second substrate holding portion, at least a portion of the period of the horizontal movement action, and at least a portion of the period of the up and down movement action overlap with each other.

9. A substrate processing method using a substrate processing device, The substrate processing apparatus comprises: a first substrate holding portion for holding a peripheral edge portion of the substrate; a second substrate holding portion configured to rotatably hold a central area of ​​a lower surface of the substrate at a position lower than that of the first substrate holding portion; as well as a vertical moving portion having a plurality of support pins for supporting a plurality of portions of the substrate from below and a pin lifting and lowering driving portion for moving the plurality of support pins in the vertical direction, wherein the plurality of support pins are moved in the vertical direction by the pin lifting and lowering driving portion in a state where the plurality of support pins support the substrate, thereby performing a vertical movement action for changing the relative positional relationship between the first substrate holding portion and the substrate; and The substrate processing method comprises the following steps: while rotating the second substrate holding portion, bringing a brush into contact with the central area of ​​the lower surface of the substrate held by the first substrate holding portion to clean the central area of ​​the lower surface of the substrate; After the central area of ​​the lower surface of the substrate is cleaned, the second substrate holding portion stops rotating to transfer the substrate from the first substrate holding portion to the second substrate holding portion; After the central area of ​​the lower surface of the substrate is cleaned, the vertical movement portion is caused to perform the vertical movement so as to transfer the substrate from the first substrate holding portion to the second substrate holding portion; as well as After the substrate is transferred from the first substrate holding portion to the second substrate holding portion, the brush is brought into contact with an outer region of the lower surface of the substrate held by the second substrate holding portion, surrounding the central region of the lower surface, while the second substrate holding portion is rotated, thereby cleaning the outer region of the lower surface of the substrate; and During the period from the central area of ​​the lower surface of the substrate being cleaned to the time when the substrate is handed over to the second substrate holding part, the step of stopping the rotation of the second substrate holding part and the step of causing the up-and-down moving part to perform the up-and-down moving action are started in such a way that the period of the rotation stopping action of the second substrate holding part overlaps with at least a part of the period of the up-and-down moving action.

10. A substrate processing method using a substrate processing apparatus, The substrate processing apparatus comprises: a first substrate holding portion for holding a peripheral edge portion of the substrate; a second substrate holding portion configured to rotatably hold a central area of ​​a lower surface of the substrate at a position lower than that of the first substrate holding portion; as well as a lifting drive portion for performing a vertical movement operation of moving the holding portion of at least one of the first substrate holding portion and the second substrate holding portion in a vertical direction relative to the holding portion of the other substrate holding portion, in a state where the substrate is supported by either the first substrate holding portion or the second substrate holding portion; and The substrate processing method comprises the following steps: while rotating the second substrate holding portion, bringing a brush into contact with the central area of ​​the lower surface of the substrate held by the first substrate holding portion to clean the central area of ​​the lower surface of the substrate; After the central area of ​​the lower surface of the substrate is cleaned, the second substrate holding portion stops rotating to transfer the substrate from the first substrate holding portion to the second substrate holding portion; After the central area of ​​the lower surface of the substrate is cleaned, the lifting drive unit is caused to perform the vertical movement to transfer the substrate from the first substrate holding unit to the second substrate holding unit; as well as After the substrate is transferred from the first substrate holding portion to the second substrate holding portion, the brush is brought into contact with an outer region of the lower surface of the substrate held by the second substrate holding portion, surrounding the central region of the lower surface, while the second substrate holding portion is rotated, thereby cleaning the outer region of the lower surface of the substrate; During the period from the central area of ​​the lower surface of the substrate being cleaned to the time when the substrate is handed over to the second substrate holding part, the step of stopping the rotation of the second substrate holding part and the step of causing the lifting drive part to perform the up and down movement are started in a manner that at least a part of the period of the rotation stopping action of the second substrate holding part overlaps with the period of the up and down movement action.

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