An automatic loading and unloading device for aging board socket chips

Abstract

The present invention discloses an automatic loading and unloading device for aging board socket chips, which relates to the technical field of chip processing. Its specific structure includes: a frame; a support plate installed inside the frame; at least one storage device installed inside the frame for holding aging board materials; at least one handling device installed on the support plate, and the handling device is used for the aging board materials in the storage device; at least one pressing device installed on the support plate; at least one picking and placing device installed on the support plate, and the picking and placing end of the picking and placing device faces the pressing device. The present invention solves the technical problem of low efficiency of existing chip picking and placing.

Description

Technical Field

[0001] The present invention relates to the technical field of chip processing, and particularly to an automatic loading and unloading device for aging board socket chips. Background Art

[0002] At present, with the breakthrough progress of the chip performance itself, the market demand for quantity has been greatly increased; in the current chip test production process, a large number of aging boards and sockets are used as carriers for test production, thus bringing a large amount of chip loading and unloading work; currently, customers use the method of manually pressing the socket and manually picking and placing the chips, which has a large labor intensity and low production efficiency.

[0003] For the above reasons, by investing in an automatic loading and unloading device, the entire process of chip picking and placing can be automated, reducing labor costs and improving production efficiency. Summary of the Invention

[0004] The purpose of the present invention is to provide an automatic loading and unloading device for aging board socket chips, which solves the technical problem of low chip picking and placing efficiency in the prior art.

[0005] The embodiment of the present application discloses an automatic loading and unloading device for aging board socket chips, including:

[0006] A frame;

[0007] A support plate, installed inside the frame;

[0008] At least one storage device, installed inside the frame, for holding aging board materials;

[0009] At least one handling device, installed on the support plate, and the handling device is used for the aging board materials in the storage device;

[0010] At least one pulling and lifting device, installed on the support plate, the pulling and lifting device performs pulling and lifting movements on the aging board materials;

[0011] At least one pressing device, installed on the support plate;

[0012] At least one picking and placing device, installed on the support plate, and the picking and placing end of the picking and placing device faces the pressing device.

[0013] The present application is provided with corresponding multiple devices, which can achieve the stability of the chips.

[0014] On the basis of the above technical solutions, the embodiment of the present application can also be improved as follows:

[0015] Further, the storage device includes:

[0016] A storage bin, inside which there is a receiving cavity with openings at the front and back;

[0017] A plurality of support bars are respectively arranged on opposite sides inside the receiving cavity, and the support bars on the same side of the receiving cavity are arranged at intervals from top to bottom. The aging board materials are placed on the support bars.

[0018] Furthermore, the pulling and lifting device includes:

[0019] A lifting connecting plate, installed on the support plate;

[0020] A vertical track assembly, installed on one side of the lifting connecting plate;

[0021] A lifting bottom plate, installed on the slider of the vertical track assembly;

[0022] A pulling mechanism, installed on the lifting bottom plate, and the pulling mechanism extends towards the opening of the receiving cavity. The beneficial effect of this step is to pull the aging board assembly through the pulling mechanism, so as to facilitate the placement of the chips.

[0023] Furthermore, the pulling mechanism includes:

[0024] A pulling track assembly, installed on the lifting bottom plate, and the pulling track assembly extends towards the opening direction of the storage bin;

[0025] A pulling connecting plate, installed on the slider of the pulling track assembly, that is, moving closer to or away from the opening of the storage bin along the pulling track assembly;

[0026] A servo drive assembly, installed on the lifting bottom plate, and the moving end of the servo drive assembly is connected to the pulling connecting plate;

[0027] A pulling cylinder, installed on the pulling connecting plate, and the piston rod end of the pulling cylinder faces the storage bin;

[0028] A pulling auxiliary block, installed on the piston rod end of the pulling cylinder. The beneficial effect of this step is that the pulling mechanism can realize the stable movement of the aging board.

[0029] Furthermore, auxiliary baffles are installed at intervals on the lifting bottom plate, and a plurality of auxiliary rollers are arranged on the inner wall of the auxiliary baffles. The beneficial effect of this step is that the auxiliary rollers can drive the stability of the aging board assembly during movement.

[0030] Furthermore, the handling device includes:

[0031] A handling support base, installed on the support plate;

[0032] The handling and transverse movement module is installed on the handling support base;

[0033] At least two handling longitudinal movement modules are installed at intervals on the moving end of the handling and transverse movement module;

[0034] At least two handling rotation power components are respectively installed at the movable ends of the handling longitudinal movement modules;

[0035] At least two cylinder plates are respectively installed at the output ends of the handling rotation power components;

[0036] A plurality of clamping cylinders are installed at intervals around the cylinder plates;

[0037] A plurality of clamping blocks are respectively installed at the piston rod ends of the clamping cylinders. The beneficial effect of this step is that the clamping blocks can be driven by the clamping cylinders to move up and down, and the aging board assembly can be clamped to achieve stable transportation.

[0038] Furthermore, the pressing device includes:

[0039] The pressing track assembly is installed on the support plate;

[0040] The pressing connection block is slidably installed on the pressing track assembly;

[0041] The pressing displacement module is installed on the support plate;

[0042] The pressing lifting cylinder is installed on the side of the pressing connection block;

[0043] The pressing plate, the end of the pressing plate is connected to the piston rod end of the pressing lifting cylinder. The beneficial effect of this step is that the aging board assembly can be pressed by the pressing device, which is convenient for the subsequent placement of chips.

[0044] Furthermore, a plurality of through holes are spaced apart on the pressing plate. The beneficial effect of this step is that it is convenient to place chips through the through holes.

[0045] Furthermore, the pick-and-place device includes:

[0046] The pick-and-place base is installed on the support plate;

[0047] The pick-and-place longitudinal movement module is installed on the pick-and-place base;

[0048] The pick-and-place support plate is installed at the movable end of the pick-and-place longitudinal movement module;

[0049] The pick-and-place transverse movement module is installed on the pick-and-place support plate, and the pick-and-place transverse movement module is perpendicular to the pick-and-place longitudinal movement module;

[0050] The positioning mechanism is installed at the movable end of the pick-and-place crosswise moving module;

[0051] The nozzle mechanism is installed at the movable end of the pick-and-place crosswise moving module, and the nozzle mechanism is arranged at an interval from the positioning mechanism. The beneficial effect of this step is to complete the picking and placing of the chip during its back-and-forth movement through the pick-and-place device.

[0052] Furthermore, the positioning mechanism includes:

[0053] The positioning connecting plate is installed at the movable end of the pick-and-place crosswise moving module;

[0054] The positioning lifting cylinder is installed on the outer side of the positioning connecting plate;

[0055] The positioning connecting frame is installed at the piston rod end of the positioning lifting cylinder;

[0056] The positioning vision component is installed on the positioning connecting frame, and the shooting end of the positioning vision component faces the aging board component. The beneficial effect of this step is that visual positioning can be performed through the positioning mechanism, thereby improving the accuracy of positioning.

[0057] One or more technical solutions provided in the embodiments of the present application have at least the following technical effects or advantages:

[0058] 1. The present application is provided with a storage device for storing aging boards. Combined with the subsequent handling device, stable handling of the aging board components can be achieved, thereby improving the overall work efficiency.

[0059] 2. The present application is provided with a pull-out and lifting device, which can complete the extraction of the aging board components and subsequent handling, thereby realizing automation and improving work efficiency. BRIEF DESCRIPTION OF THE DRAWINGS

[0060] In order to more clearly illustrate the specific embodiments of the present invention or the technical solutions in the prior art, the following will briefly introduce the drawings required for use in the description of the specific embodiments or the prior art. Obviously, the following drawings are some embodiments of the present invention. For those of ordinary skill in the art, other drawings can be obtained based on these drawings without creative efforts.

[0061] Figure 1 It is a schematic structural diagram of an automatic loading and unloading device for aging board socket chips according to a specific embodiment of the present invention;

[0062] Figure 2 It is Figure 1 The structural schematic diagram after removing the frame in;

[0063] Figure 3 It isFigure 2 Schematic diagram of the structure of the middle storage bin part;

[0064] Figure 4 is Figure 2 Schematic diagram of the structure of the middle pull-up and down device;

[0065] Figure 5 is Figure 2 Schematic diagram of the structure of the middle pull-out mechanism;

[0066] Figure 6 is Figure 2 Schematic diagram of the structure of the middle handling device;

[0067] Figure 7 is Figure 6 Partial schematic diagram of the structure of the middle handling device;

[0068] Figure 8 is Figure 2 Schematic diagram of the structure of the middle pressing device;

[0069] Figure 9 is Figure 2 Schematic diagram of the structure of the middle picking and placing device;

[0070] Figure 10 is Figure 2 Schematic diagram of the structure of the middle suction nozzle mechanism;

[0071] Specific markings:

[0072] 1 - Frame; 2 - Support plate; 3 - Storage device; 4 - Handling device; 5 - Pressing device; 6 - Picking and placing device; 7 - Tray loading and unloading device;

[0073] 301 - Storage bin; 302 - Accommodation cavity; 303 - Support bar; 304 - Pull-up and down device; 305 - Auxiliary baffle; 306 - Auxiliary roller; 307 - Vertical groove; 308 - Roller;

[0074] 3041 - Lifting connection plate; 3042 - Vertical track assembly; 3043 - Lifting bottom plate; 3044 - Pull-out mechanism;

[0075] 3045 - Pull-out track assembly; 3046 - Pull-out connection plate; 3047 - Servo drive assembly; 3048 - Pull-out cylinder; 3049 - Pull-out auxiliary block;

[0076] 401 - Handling support base; 402 - Handling transverse movement module; 403 - Handling longitudinal movement module; 404 - Handling rotation power component; 405 - Cylinder plate; 406 - Clamping cylinder;

[0077] 501 - Compression track assembly; 502 - Compression connection block; 503 - Compression displacement module; 504 - Compression lifting cylinder; 505 - Compression plate; 506 - Through hole;

[0078] 601 - Pick - and - place base; 602 - Pick - and - place longitudinal displacement module; 603 - Pick - and - place support plate; 604 - Pick - and - place transverse displacement module; 605 - Positioning mechanism; 606 - Nozzle mechanism;

[0079] 6051 - Positioning connection plate; 6052 - Positioning lifting cylinder; 6053 - Positioning connection frame; 6054 - Positioning vision component. Detailed implementation mode

[0080] Hereinafter, embodiments of the technical solution of the present invention will be described in detail with reference to the accompanying drawings. The following embodiments are only used to more clearly illustrate the technical solution of the present invention, so they are only examples and cannot be used to limit the protection scope of the present invention.

[0081] It should be noted that unless otherwise specified, the technical terms or scientific terms used in this application should have the ordinary meaning understood by those skilled in the art to which the present invention belongs.

[0082] In this application, unless otherwise clearly defined and limited, terms such as "installation", "connection", "connection", "fixation" should be understood in a broad sense. For example, it can be a fixed connection, a detachable connection, or integrated; it can be a mechanical connection or an electrical connection; it can be directly connected or indirectly connected through an intermediate medium, and it can be the communication inside two components or the interaction relationship between two components. For those of ordinary skill in the art, the specific meanings of the above terms in the present invention can be understood according to specific circumstances.

[0083] To better understand the above - mentioned technical solution, the above - mentioned technical solution will be described in detail below in conjunction with the specification drawings and specific implementation modes.

[0084] Embodiment:

[0085] As Figures 1-10 shown, this application discloses an automatic loading and unloading device for aging board socket chips, which is used to complete the automatic loading and unloading operations of corresponding chips; at the same time, this application can be provided with two sets of handling mechanisms to improve work efficiency;

[0086] The specific structure of the automatic loading and unloading device in this application includes:

[0087] Frame 1, inside which there is a corresponding assembly space for installing corresponding devices. It can be composed of multiple support plates to form a square structure, and the assembly space is formed inside to avoid the influence of external dust on the handling of chips;

[0088] The support plate 2 is installed inside the frame 1. Some components can be installed on this support plate 2 to facilitate subsequent loading and unloading processes. Preferably, this support plate 2 is located in the middle. Since some of the subsequently installed devices have different heights, when grasping the corresponding devices, it is necessary to ensure that some devices are at the same height for easy grasping. Therefore, through the position of the support plate 2, it is convenient for the installation of other devices.

[0089] At least one storage device 3 is installed inside the frame 1 and is used to hold the aging board materials. The aging board materials are distributed in multiple layers in the storage device 3. Preferably, there are two storage devices 3 in this application. Figure 2 Viewed from the [description of the view], they are arranged at intervals on the left and right sides, which is conducive to improving the processing efficiency.

[0090] At least one handling device 4 is installed on the support plate 2, and the handling device 4 is used for the aging board materials in the storage device. The handling end of this handling device 4 corresponds to the number of storage devices 3, that is, the handling end of the handling device 4 transports and lifts the aging board materials. Preferably, there are two handling ends of this handling device. Figure 2 、 6 As shown in [figure number], they are divided into left and right ends and are used to clamp and transport the corresponding aging board to the middle of the handling device 4 for subsequent high-efficiency placement of chips.

[0091] At least one pressing device 5 is installed on the support plate 2. This pressing device 5 is used to clamp the corresponding aging board to facilitate subsequent chip placement operations, thereby improving work efficiency.

[0092] At least one pick-and-place device 6 is installed on the support plate 2, and the pick-and-place end of the pick-and-place device 6 faces the pressing device 5. The pick-and-place device 6 in this application is used to complete the picking operation and place the corresponding chips on the aging board. The opening method of the aging board socket can be a pressing type or a rotary type.

[0093] This application is also provided with a Tray loading and unloading device to meet continuous chip feeding or chip unloading operations. This structure is an existing device and will not be elaborated here.

[0094] The storage device 3 in this application is transported through the rollers at its bottom. In this way, after being filled, it can be transported out, and then replaced with a storage device 3 filled with empty aging boards. This storage device 3 is not connected to the support plate 2, so as to facilitate the replacement of the storage device.

[0095] In one embodiment, the storage device 3 includes:

[0096] Storage bin 301, an accommodating cavity 302 with openings at the front and back is formed inside the storage bin 301. The corresponding aging boards are placed inside the accommodating cavity 302, and the openings in the front-back direction are designed for inserting the aging boards, or the aging boards can enter the next process along the openings; the storage bin 301 can be made of metal material and is a square box;

[0097] A plurality of support bars 303 are respectively arranged on two opposite sides inside the accommodating cavity 302, and the support bars 303 on the same side of the accommodating cavity 302 are arranged at intervals from top to bottom. The aging board materials are placed on the support bars 303. The support bars 303 are used to support the aging boards, and their front and rear ends correspond to the openings, which is also convenient for taking out the aging boards for the next process later.

[0098] In another embodiment, the present application is further provided with a draw-lift device 304, which is installed on the support plate 2. The draw-lift device 304 performs draw and lift movements on the aging board materials; specifically, the stability of the draw-lift device 304 can be ensured by the provided support plate 2. At the same time, the lifting end of the draw-lift device 304 corresponds to the opening of the accommodating cavity 302, that is, the corresponding aging board can be driven to lift by the draw-lift device 304; the draw-lift device 304 in the present application has a push-pull function, that is, after the aging board is pulled out, it is convenient for subsequent handling. After the chips are installed, it can also be used to insert the aging board materials into the storage bin 301; when the position of the subsequent aging board is at a higher position, the draw-lift device 304 can be lifted to the corresponding position, and then the aging board is pulled out. Similarly, after the chips are installed, the aging board materials can also be inserted into the storage bin 301, that is, the transfer of the materials can be realized by the draw-lift device 304. Its specific structure is as Figure 4 、 5 shown.

[0099] Specifically, the draw-lift device 304 includes:

[0100] A lift connection plate 3041 is installed on the support plate 2. The lift connection plate 3041 is a vertical plate and is connected to the side surface of the support plate 2, specifically the inner side, that is, perpendicular to the support plate 2, to provide a trajectory for subsequent vertical movement. At the same time, in order to ensure the stability of the connection between the lift connection plate 3041 and the support plate 2, a reinforcement plate can be installed on the back of the lift connection plate 3041;

[0101] The vertical track assembly 3042 is installed on one side of the lifting connection plate 3041; specifically, it is located on the free side of the lifting connection plate 3041; further description is given to the vertical track assembly 3042, which includes a track and a slider, the track is vertically arranged, and a slider is movably installed on it, and a screw mechanism can be installed on the lifting connection plate, connected to the slider, and drives the slider to move up and down along the track; the vertical track assembly 3042 is mainly used to provide power and track for vertical movement, which is convenient for stacking materials inside the storage box;

[0102] The lifting bottom plate 3043 is installed on the slider of the vertical track assembly 3042. The lifting bottom plate 3043 is specifically perpendicular to the lifting connection plate 3041, that is, the lifting bottom plate 3043 always corresponds to the opening of the accommodating cavity 302 during the lifting process, and is subsequently coordinated with other components to pull the corresponding components of the aging board to complete material distribution, or push the aging board material pieces;

[0103] The pulling mechanism 3044 is installed on the lifting base plate 3043, and the pulling mechanism 3044 extends toward the opening of the accommodating cavity 302; specifically, when it is necessary to pull out the aging board assembly, the movable end of the pulling mechanism 3044 moves to the bottom of the aging board assembly (including the tray and the aging board, etc.), and then the pulling mechanism 3044 is driven to lift through the vertical rail assembly 3042, against the side wall of the aging board assembly, thereby pulling the aging board assembly out from the inside of the storage box 301; similarly, if it is necessary to push the aging board assembly into the inside of the storage box 301, proceed in the opposite manner.

[0104] In order to ensure that the aging board assembly can be stably pulled out, the present application further describes the structure of the pulling mechanism 3044, as follows:

[0105] The pulling mechanism 3044 includes:

[0106] A pull-out rail assembly 3045 is installed on the lifting bottom plate 3043, and the pull-out rail assembly 3045 extends toward the opening direction of the material storage box 301; the pull-out rail assembly 3045 includes components such as a rail and a slider, which are used to provide a track toward or away from the material storage box;

[0107] The pull-out connecting plate 3046 is mounted on the slider of the pull-out track assembly 3045, and the pull-out connecting plate 3046 is mounted on the slider of the track assembly 3045, that is, along the track assembly 3045 close to or away from the opening of the storage box 301;

[0108] The servo drive assembly 3047 is installed on the lifting bottom plate 3043, and the moving end of the servo drive assembly 3047 is connected to the draw connecting plate 3046 to drive the draw connecting plate 3046 to approach the opening of the storage bin 301. This servo drive assembly 3047 is an existing component, including components such as a servo motor and a conveyor belt, etc.;

[0109] The draw cylinder 3048 is installed on the draw connecting plate 3046, and the piston rod end of the draw cylinder 3048 faces the storage bin 301, so that the draw connecting plate 3046 can be pushed into the storage bin;

[0110] The draw auxiliary block 3049 is installed at the piston rod end of the draw cylinder 3048. The draw auxiliary block 3049 in this application is L-shaped. When the draw mechanism 3044 is required to push the aging plate assembly into the storage bin 301, the vertical section of the L-shaped draw auxiliary block 3049 is used to contact the side of the aging plate assembly, so as to push the aging plate assembly into the storage bin 301. When the draw mechanism 3044 is required to pull the aging plate assembly out of the storage bin 301, the servo drive assembly 3047 is used for pulling, so as to drive the aging plate assembly to leave the storage bin 201.

[0111] In order to ensure that the corresponding components can move stably when the aging plate assembly is drawn, auxiliary related components are installed on the lifting bottom plate, so that the aging plate assembly rolls stably.

[0112] Specifically, in this application, auxiliary baffles 305 are installed at intervals on the lifting bottom plate 3043. Preferably, there are two auxiliary baffles 305. The area between the auxiliary baffles 305 is for the subsequent stable movement of the aging plate assembly. At the same time, a plurality of auxiliary rollers 306 are arranged on the inner wall of the auxiliary baffle 305. When the aging plate assembly moves, it moves on the auxiliary rollers 306.

[0113] In order to further improve the stability of the movement of the aging plate assembly, vertical grooves 307 can be opened on the auxiliary baffle 305, and rollers 308 are installed inside the vertical grooves 307, so as to facilitate the stable movement of the aging plate assembly.

[0114] In order to ensure the stable movement of the aging plate assemblies at multiple stations, the handling device 4 is further designed so that it can achieve synchronous grasping and handling at multiple stations.

[0115] Specifically, the handling device 4 includes:

[0116] The handling support base 401 is installed on the support plate 2, and it extends from the station at the head end to the station at the tail end to provide the assembly of the subsequent handling transverse movement module 402;

[0117] The handling and transverse movement module 402 is installed on the handling support base 401. This handling and transverse movement module 402 is an existing motion module and will not be elaborated here to provide the power for the lateral movement of the components, that is, the power for the movement in the X-axis direction. Combining the foregoing content, it is used to drive the two groups of aging board components to move closer inward, thereby achieving high-efficiency assembly.

[0118] At least two handling longitudinal movement modules 403 are installed at intervals on the moving end of the handling and transverse movement module 402. This handling longitudinal movement module 403 is an existing component and will not be elaborated here to achieve the vertical movement, that is, the power for the movement in the Z-axis direction. Preferably, in this application, in order to realize the processing of the two groups of aging board components, two handling longitudinal movement modules 403 are required, so as to facilitate subsequent actions such as one-in and one-out, one-up and one-down, etc., thereby improving the processing efficiency.

[0119] At least two handling rotation power components 404 are installed on the movable ends of the handling longitudinal movement modules 403 one by one, that is, the handling rotation power components 404 can realize the rotation direction, which is convenient for cooperating with the foregoing components to transport the aging board components to the corresponding processing stations. Specifically, it can be components such as a rotation motor or a rotation cylinder, as long as the rotation function can be realized.

[0120] At least two cylinder plates 405 are installed on the output ends of the handling rotation power components 404 one by one. The cylinder plate 405 is a flat plate, so that the stability can be ensured when clamping the aging board components and there will be no collision.

[0121] A plurality of clamping cylinders 406 are installed at intervals around the cylinder plate 405. The preferred solution is to install them at the four corners of the cylinder plate 405 to facilitate subsequent stable clamping.

[0122] A plurality of clamping blocks 407 are installed on the piston rod ends of the clamping cylinders 406 one by one. Driven by the clamping cylinders 406, the adjacent clamping blocks 407 can move towards each other to control the distance and complete the clamping, thereby realizing the clamping of the aging board components.

[0123] In order to ensure the stability when clamping the aging board components, in this application, the inner wall of the clamping block 407 is designed as a groove that matches the corner ends of the aging board components to complete the clamping.

[0124] When the handling device 4 of this application is working, first, the corresponding aging board component is pulled to the corresponding position through the pulling mechanism 3044, and then the handling longitudinal movement module 403 drives components such as the handling rotation power component 404 to move down to complete the clamping of the aging board component, and then the handling and transverse movement module 402 drives the aging board component to move horizontally to the next processing area.

[0125] In order to ensure that the chip can be stably placed on the chip socket of the aging board assembly, the present application designs a pressing device as follows:

[0126] The pressing device 5 includes:

[0127] A pressing track assembly 501, which is installed on the support plate 2. The pressing track assembly 501 is an existing track assembly, including components such as a slide rail and a slider, and is used to provide the movement direction for subsequent components;

[0128] A pressing connection block 502, which is slidably installed on the pressing track assembly 501, that is, the pressing connection block 502 moves along the pressing track assembly 501; specifically, the two tracks in the pressing track assembly 501 are spaced apart, and the subsequent aging board assembly is placed between the two tracks. The pressing connection block 502 also has two pieces, which are connected to the two sliders of the pressing track assembly 501;

[0129] A pressing displacement module 503, which is installed on the support plate 2, specifically located between the two tracks of the pressing track assembly 501. At the same time, the pressing displacement module 503 is connected to the pressing connection block 502 to provide the power for the movement of the pressing connection block 502. The specific connection is that the movable end of the pressing displacement module 503 is connected to the bottom of the pressing connection block 502; the pressing displacement module 503 is also an existing linear module, which will not be elaborated here. At the same time, the pressing displacement module 503 is parallel to the pressing track assembly 501;

[0130] A pressing lifting cylinder 504, which is installed on the side of the pressing connection block 502, specifically on the side of the pressing connection block 502 facing the aging board assembly, so that the pressing lifting cylinder 504 and the pressing connection block 502 move synchronously; similarly, the number of the pressing lifting cylinders 504 is also two, and they have a one-to-one correspondence with the pressing connection block 502;

[0131] A pressing plate 505, the end of the pressing plate 505 is connected to the piston rod end of the pressing lifting cylinder 504. Specifically, the two ends of the pressing plate 505 are connected to the two pressing lifting cylinders 504 in a one-to-one correspondence. The pressing plate 505 is driven by the pressing lifting cylinder 504 to move up and down to complete the pressing of the two rows of sockets on the aging board assembly, facilitating the subsequent placement of the chip to improve stability.

[0132] Specifically, a plurality of through holes 506 are spaced apart on the pressing plate 505, corresponding to the sockets on the aging board assembly. The pressing plate 505 in the present application is for the subsequent clamping of the aging board assembly to ensure the stability when placing the chip.

[0133] In order to ensure the picking and placing of the chip, the present application designs a picking and placing device 6 as follows:

[0134] The pick-and-place device 6 includes:

[0135] A pick-and-place base 601, which is installed on the support plate 2, specifically located outside the pressing device 5 and inside the handling device 4;

[0136] A pick-and-place longitudinal movement module 602, which is installed on the pick-and-place base 601. This pick-and-place longitudinal movement module 602 is an existing module and will not be elaborated here; this pick-and-place longitudinal movement module 602 provides power;

[0137] A pick-and-place support plate 603, which is installed at the movable end of the pick-and-place longitudinal movement module 602, that is, the pick-and-place support plate 603 can move along the pick-and-place longitudinal movement module 602;

[0138] A pick-and-place transverse movement module 604, which is installed on the pick-and-place support plate 603, and the pick-and-place transverse movement module 604 is perpendicular to the pick-and-place longitudinal movement module 602. In this way, movements in the X-axis and Y-axis directions can be achieved, and the subsequent components can drive the chip for material placement;

[0139] A positioning mechanism 605, which is installed at the movable end of the pick-and-place transverse movement module 604;

[0140] A nozzle mechanism 606, which is installed at the movable end of the pick-and-place transverse movement module 604, and the nozzle mechanism 606 is spaced from the positioning mechanism 605. That is, positioning is performed through the positioning mechanism 605, and then the chip is picked up by the nozzle mechanism 606 and placed on the connection seat of the aging board assembly.

[0141] To ensure the stability of material picking and placement, positioning is performed through the positioning mechanism 605. This positioning mechanism 605 is a visual positioning component. Specifically, the positioning mechanism 605 includes:

[0142] A positioning connection plate 6051, which is installed at the movable end of the pick-and-place transverse movement module 604, that is, the positioning connection plate 6051 can move back and forth along the pick-and-place transverse movement module 604;

[0143] A positioning lifting cylinder 6052, which is installed outside the positioning connection plate 6051, and the piston rod of this positioning lifting cylinder 6052 moves vertically;

[0144] A positioning connection frame 6053, which is installed at the piston rod end of the positioning lifting cylinder 6052. That is, under the drive of the positioning lifting cylinder 6052, it makes a lifting movement;

[0145] The positioning vision component 6054 is installed on the positioning connection bracket 6053, and the shooting end of the positioning vision component 6054 faces the aging board component. The positioning vision component 6054 is an existing vision component, which will not be elaborated here.

[0146] In the description of the present invention, a large number of specific details are illustrated. However, it can be understood that the embodiments of the present invention can be practiced without these specific details. In some instances, well-known methods, structures, and technologies are not shown in detail so as not to obscure the understanding of this specification.

[0147] In the description of this specification, the descriptions referring to terms such as "one embodiment", "some embodiments", "example", "specific example", or "some examples", etc. mean that the specific features, structures, materials, or characteristics described in connection with the embodiment or example are included in at least one embodiment or example of the present invention. In this specification, the schematic representations of the above terms do not necessarily refer to the same embodiment or example. Moreover, the specific features, structures, materials, or characteristics described can be combined in a suitable manner in any one or more embodiments or examples. In addition, without contradiction, those skilled in the art can combine and combine the different embodiments or examples described in this specification and the features of different embodiments or examples.

[0148] Finally, it should be noted that: the above embodiments are only used to illustrate the technical solutions of the present invention, rather than to limit it; although the present invention has been described in detail with reference to the foregoing embodiments, those of ordinary skill in the art should understand that: they can still modify the technical solutions recorded in the foregoing embodiments, or perform equivalent replacements on some or all of the technical features; and these modifications or replacements do not make the essence of the corresponding technical solutions deviate from the scope of the technical solutions of the embodiments of the present invention, and they should all be covered by the scope of the claims and the specification of the present invention.

Claims

1. An automatic loading and unloading device for an aging board socket chip, characterized in that, Comprising: Frame; Support plate, installed inside the frame; At least one material storage device, installed inside the frame, for holding the aged board materials; At least one handling device, installed on the support plate, and the handling device is for the aged board materials in the material storage device; Pulling and lifting device, installed on the support plate, and the pulling and lifting device performs pulling and lifting movements on the aged board materials; At least one pressing device, installed on the support plate; At least one picking and placing device, installed on the support plate, and the picking and placing end of the picking and placing device faces the pressing device; The pulling and lifting device includes: Lifting connecting plate, installed on the support plate; Vertical track assembly, installed on one side of the lifting connecting plate; Lifting bottom plate, installed on the slider of the vertical track assembly; Pulling mechanism, installed on the lifting bottom plate; Auxiliary baffles are installed on the lifting bottom plate at intervals, and a plurality of auxiliary rollers are arranged on the inner wall of the auxiliary baffles; Vertical grooves are formed in the auxiliary baffles, and rollers are installed inside the vertical grooves to facilitate the stable movement of the aged board assembly; The handling device includes: Handling support base, installed on the support plate; Handling transverse movement module, installed on the handling support base; At least two handling longitudinal movement modules, installed at intervals on the moving end of the handling transverse movement module; At least two handling rotation power components, installed on the movable ends of the handling longitudinal movement modules one by one; At least two cylinder plates, installed on the output ends of the handling rotation power components one by one; A plurality of clamping cylinders, installed at intervals around the cylinder plates; A plurality of clamping blocks, installed on the piston rod ends of the clamping cylinders one by one.

2. The automatic loading and unloading device for the aging board socket chip according to claim 1, characterized in that, The material storage device includes: Material storage box, an accommodating cavity with front and rear openings is formed inside the material storage box; A plurality of support bars are respectively arranged on opposite sides inside the accommodating cavity, and the support bars on the same side of the accommodating cavity are arranged at intervals from top to bottom, and the support bars are for placing the aged board materials.

3. The aging board socket chip automatic loading and unloading device according to claim 2, characterized in that, The pulling mechanism includes: Pulling track assembly, installed on the lifting bottom plate, and the pulling track assembly extends towards the opening direction of the material storage box; Pulling connecting plate, installed on the slider of the pulling track assembly, that is, approaching or departing from the opening of the material storage box along the pulling track assembly; Servo drive assembly, installed on the lifting bottom plate, and the moving end of the servo drive assembly is connected to the pulling connecting plate; Pulling cylinder, installed on the pulling connecting plate, and the piston rod end of the pulling cylinder faces the material storage box; Pulling auxiliary block, installed on the piston rod end of the pulling cylinder.

4. The automatic loading and unloading device for the socket chip of the aging board according to claim 1, wherein, The pressing device includes: Pressing track assembly, installed on the support plate; Pressing connecting block, slidably installed on the pressing track assembly; Pressing displacement module, installed on the support plate; Pressing lifting cylinder, installed on the side of the pressing connecting block; Pressing plate, the end of the pressing plate is connected to the piston rod end of the pressing lifting cylinder.

5. The aging board socket chip automatic loading and unloading device according to claim 4, characterized in that, A plurality of through holes are formed in the pressing plate at intervals.

6. The aging board socket chip automatic loading and unloading device according to claim 1, characterized in that, The picking and placing device includes: Picking and placing base, installed on the support plate; The pick-and-place longitudinal translation module is installed on the pick-and-place base; The pick-and-place support plate is installed at the movable end of the pick-and-place longitudinal translation module; The pick-and-place transverse translation module is installed on the pick-and-place support plate, and the pick-and-place transverse translation module is perpendicular to the pick-and-place longitudinal translation module; The positioning mechanism is installed at the movable end of the pick-and-place transverse translation module; The nozzle mechanism is installed at the movable end of the pick-and-place transverse translation module, and the nozzle mechanism is arranged at an interval from the positioning mechanism.

7. The automatic loading and unloading equipment for the aging board socket chip according to claim 6, characterized in that The positioning mechanism includes: The positioning connection plate is installed at the movable end of the pick-and-place transverse translation module; The positioning lifting cylinder is installed on the outer side of the positioning connection plate; The positioning connection frame is installed at the piston rod end of the positioning lifting cylinder; The positioning vision component is installed on the positioning connection frame, and the shooting end of the positioning vision component faces the aging board component.

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