Composite heat dissipation structure of a pluggable optical module

By adopting a composite heat dissipation structure in the optical module and combining solid and liquid heat dissipation devices, the problem that traditional heat dissipation structures cannot quickly export heat is solved, and efficient heat dissipation and stable work of the optical module are achieved.

CN118311727BActive Publication Date: 2025-08-01WUHAN ESION OPTIC INC LTD
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Patent Information

Application Number
CN202410574547.6
Authority / Receiving Office
CN · China
Patent Type
Patents(China)
Current Assignee / Owner
Filing Date
2024-05-10
Publication Date
2025-08-01
Estimated Expiration
2044-05-10

AI Technical Summary

Technical Problem

The traditional heat dissipation structure is difficult to quickly and effectively export the heat inside the optical module, resulting in the inability to operate efficiently, affecting the conversion and processing of photoelectric signals.

Method used

The composite heat dissipation structure is adopted, including a first solid heat dissipation device installed inside the optical module and a second solid heat dissipation device on the surface of the housing. Combined with the liquid heat dissipation device, the composite heat dissipation is achieved by pressing the second heat dissipation base and bonding the first solid heat dissipation device, and the combination of the solid and liquid heat dissipation device is used to accelerate heat derivation.

Benefits of technology

It effectively avoids continuous temperature rise in the installation housing, ensures the normal operation and signal transmission of the optical module, improves the heat dissipation efficiency, and ensures that the optical module converts and transmits signals in an efficient state.

✦ Generated by Eureka AI based on patent content.

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Abstract

The present invention relates to a composite heat dissipation structure for a pluggable optical module, including an installation housing containing a plugging cavity. A heat dissipation device for cooling the optical module is arranged inside the installation housing. The heat dissipation device includes a first solid heat dissipation device installed inside the optical module and a second solid heat dissipation device arranged on the surface of the housing. The second solid heat dissipation device includes a heat dissipation cylinder, and a liquid heat dissipation device is installed on the surface of the heat dissipation cylinder. A second heat dissipation base adapted to the first solid heat dissipation device is fixed at the bottom of the heat dissipation cylinder. The invention improves the heat dissipation effect on the optical module through the composite heat dissipation structure and ensures the normal use of the optical module.
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Description

Technical Field

[0001] The present invention relates to the field of heat dissipation structures, and more particularly to a composite heat dissipation structure for a pluggable optical module. Background Art

[0002] An optical module is an electronic component that converts optical signals into electrical signals and is widely used in commercial communication devices.

[0003] The inside of the optical module includes components such as a laser converter and an electrical signal conversion board. During the overload operation of the optical module, heat is continuously generated inside it, and the heat accumulation causes the continuous temperature rise inside the installation housing, affecting the efficient operation of the optical module. The inability of the optical module to operate efficiently further exacerbates the temperature rise inside the installation housing, affecting the normal conversion and processing of optical and electrical signals by the optical module.

[0004] By installing a heat dissipation structure inside the optical module and the installation housing, heat can be dissipated. Most traditional heat dissipation structures are carried out separately through structures such as air cooling, water cooling, and heat dissipation silicone grease. As the processing efficiency of the optical module increases, its power consumption also increases, and the traditional heat dissipation structure is difficult to quickly cool the optical module inside the installation housing, affecting the normal use of the optical module. Summary of the Invention

[0005] In view of the technical problems existing in the prior art, the present invention provides a composite heat dissipation structure for a pluggable optical module. The invention improves the heat dissipation effect of the optical module through the composite heat dissipation structure and ensures the normal use of the optical module.

[0006] The technical solution for the present invention to solve the above technical problems is as follows:

[0007] A composite heat dissipation structure for a pluggable optical module includes an installation housing with a plugging cavity. A heat dissipation device for cooling the optical module is provided inside the installation housing. The heat dissipation device includes a first solid heat dissipation device installed inside the optical module and a second solid heat dissipation device provided on the surface of the housing. The second solid heat dissipation device includes a heat dissipation cylinder, and a liquid heat dissipation device is installed on the surface of the heat dissipation cylinder. A second heat dissipation base adapted to the first solid heat dissipation device is fixed at the bottom of the heat dissipation cylinder. Among them, after the optical module is inserted into the working position, the second heat dissipation base is pressed to fit with the surface of the first solid heat dissipation device to achieve composite heat dissipation.

[0008] Preferably, a U-shaped strip is fixed at the edge of the bottom surface of the second heat dissipation base, and heat dissipation holes for transporting heat dissipation grease are opened at the bottom of the second heat dissipation base, and the heat dissipation holes are arranged in the direction of the strip.

[0009] Preferably, an extrusion element for conveying heat dissipation grease is installed at the upper end of the heat dissipation column body. The extrusion element is communicated with the heat dissipation holes through a conveying pipeline. A pressing plate is fixedly connected to the telescopic end of the extrusion element. A guide rod is arranged between the pressing plate and the heat dissipation column body. A locking plate is fixed on the side wall of the heat dissipation column body, and a locking assembly is arranged between the locking plate and the installation shell.

[0010] Preferably, the bottom surface of the second heat dissipation base inclines towards the inner side of the installation shell, and the top surface of the first solid heat dissipation device inclines towards the outer side of the installation shell.

[0011] Preferably, the first solid heat dissipation device includes two first heat dissipation bases arranged at intervals. The heat dissipation column bodies are in two groups and are respectively opposite to the corresponding first heat dissipation bases. A first water cooling pipeline is installed on the surface of the first heat dissipation column body, and a second water cooling pipeline is installed on the surface of the second heat dissipation column body. The cooling liquid flows through the second water cooling pipeline and the first water cooling pipeline in sequence to complete liquid heat dissipation.

[0012] Preferably, a reversing device is installed between the first water cooling pipeline and the second water cooling pipeline to change the flow direction of the cooling liquid through the reversing device.

[0013] Preferably, the reversing device includes a reversing housing. The side wall of the reversing housing is communicated with a liquid inlet pipeline and a liquid outlet pipeline arranged oppositely. The side wall of the reversing housing is communicated with a first conveying joint and a second conveying joint arranged oppositely. A reversing valve core is hermetically and rotatably connected to the inner wall of the reversing housing. Two groups of bent reversing pipelines are arranged inside the reversing valve core. A control device for controlling the rotation of the reversing valve core is also included.

[0014] Preferably, the control device includes a control housing. A control rotating shaft is rotatably connected inside the control housing. The end of the control rotating shaft penetrates through the reversing housing and is fixedly connected to the reversing valve core. A driving element for driving the control rotating shaft to rotate is installed inside the control housing.

[0015] Preferably, a first control plate is fixed on the side wall of the control rotating shaft, and a second control plate is fixed on the inner wall of the control housing. The driving element is arranged between the first control plate and the second control plate.

[0016] Preferably, the driving element is an elastic control bladder filled with a low-boiling-point liquid. The low-boiling-point liquid is in thermal contact with the first water cooling pipeline. First limiting elements and second limiting elements for limiting the first control plate are arranged on the inner wall of the control housing.

[0017] The beneficial effects of the present invention are as follows: Compared with the traditional heat dissipation structure, by setting a composite heat dissipation structure, the present invention can efficiently export the heat at the optical module in the installation housing, avoid continuous temperature rise in the installation housing, and ensure the normal conversion and transmission of signals by the optical module; at the same time, by setting a composite heat dissipation structure, the heat in the second solid heat dissipation device and the first solid heat dissipation device can be quickly taken away by the liquid heat dissipation device, improving the heat conduction efficiency of the second solid heat dissipation device and the first solid heat dissipation device, further avoiding continuous temperature rise in the installation housing, and ensuring that the optical module can work normally. BRIEF DESCRIPTION OF THE DRAWINGS

[0018] Figure 1 is a schematic three-dimensional structure diagram of the present invention;

[0019] Figure 2 is a schematic internal structure diagram of the installation housing of the present invention;

[0020] Figure 3 is of the present invention Figure 2 front view structure diagram;

[0021] Figure 4 is of the present invention Figure 2 top view structure diagram;

[0022] Figure 5 is of the present invention Figure 2 left side view structure diagram;

[0023] Figure 6 is of the present invention Figure 3 magnified structure diagram at position A of the present invention;

[0024] Figure 7 is of the present invention Figure 3 magnified structure diagram at position B of the present invention;

[0025] Figure 8 is a schematic internal structure diagram of the commutation device of the present invention;

[0026] Figure 9 is a schematic internal structure diagram of the control device of the present invention;

[0027] Figure 10 is a schematic three-dimensional structure diagram of the second heat dissipation base of the present invention.

[0028] In the drawings, the list of components represented by each reference numeral is as follows:

[0029] 100. Optical module; 110. Laser converter; 120. Electrical signal conversion board; 200. Installation housing; 300. Second solid heat dissipation device; 310. Second heat dissipation base; 311. Stop bar; 312. Heat dissipation holes; 320. Heat dissipation column; 321. Locking plate; 330. Extrusion plate; 331. Guide rod; 340. Locking assembly; 400. Commutation device; 410. Commutation housing; 420. Commutation spool; 421. First commutation pipe; 422. Second commutation pipe; 500. Extrusion element; 510. Telescopic end; 600. Liquid heat dissipation device; 610. First water cooling pipe; 611. First delivery joint; 620. Second water cooling pipe; 621. Second delivery joint; 630. Liquid inlet pipe; 640. Liquid outlet pipe; 700. Control device; 710. Control housing; 711. First limiting element; 712. Second limiting element; 720. Control rotating shaft; 730. First control board; 740. Driving element; 741. Heat exchange pipe; 750. Second control board; 800. First solid heat dissipation device; 810. First heat dissipation base. Detailed implementation manners

[0030] Next, the technical solutions in the embodiments of the present application will be clearly and completely described in conjunction with the accompanying drawings in the embodiments of the present application. Obviously, the described embodiments are only a part of the embodiments of the present application, rather than all the embodiments. Based on the embodiments in the present application, all other embodiments obtained by those skilled in the art without creative efforts fall within the protection scope of the present application.

[0031] In the description of the present application, the terms "first" and "second" are only used for descriptive purposes and cannot be construed as indicating or implying relative importance or implicitly specifying the quantity of the indicated technical features. Thus, the features defined with "first" and "second" may explicitly or implicitly include one or more of the described features. In the description of the present application, "a plurality" means two or more, unless otherwise specifically defined.

[0032] In the description of the present application, the term "for example" is used to mean "serving as an example, illustration, or explanation". Any embodiment described as "for example" in the present application is not necessarily construed as being more preferred or having more advantages than other embodiments. In order to enable any person skilled in the art to implement and use the present invention, the following description is given. In the following description, details are set forth for the purpose of explanation. It should be understood that those skilled in the art can recognize that the present invention can be implemented without using these specific details. In other instances, well-known structures and processes are not elaborated in detail to avoid unnecessary details from obscuring the description of the present invention. Therefore, the present invention is not intended to be limited to the embodiments shown, but is consistent with the broadest scope that conforms to the principles and features disclosed in the present application.

[0033] Example 1

[0034] Refer to the attached Figure 1 - attached Figure 10 , a composite heat dissipation structure for a pluggable optical module, includes an installation housing 200 containing a plugging and unplugging chamber. The optical module 100 is pluggably installed in the plugging and unplugging chamber of the installation housing 200 to achieve the conversion of optical and electrical signals. Here, the optical module 100 includes a laser converter 110 and an electrical signal conversion board 120. One side of the laser converter 110 emits and receives optical signals and converts them into electrical signals. One side of the electrical signal conversion board 120 processes and transmits electrical signals to achieve the conversion and transmission of optical and electrical signals.

[0035] During the overload operation of the optical module 100, heat is continuously generated inside it, and the accumulation of heat causes the continuous temperature rise inside the installation housing 200, affecting the efficient operation of the optical module 100. The inability of the optical module 100 to operate efficiently further exacerbates the temperature rise inside the installation housing 200, affecting the normal conversion and processing of optical and electrical signals by the optical module 100. By installing a heat dissipation structure inside the optical module 100 and the installation housing 200, heat can be dissipated. Most traditional heat dissipation structures are carried out separately through structures such as air cooling, water cooling, and heat dissipation silicone grease. As the processing efficiency of the optical module 100 increases, its power consumption also increases. The traditional heat dissipation structure is difficult to quickly cool the optical module 100 inside the installation housing 200, affecting the normal use of the optical module 100.

[0036] To solve the above problems, a new heat dissipation device for cooling the optical module 100 is provided inside the installation housing 200; specifically: the heat dissipation device includes a first solid heat dissipation device 800 installed inside the optical module 100, and a second solid heat dissipation device 300 provided on the surface of the housing; the second solid heat dissipation device 300 includes a heat dissipation column 320, and a liquid heat dissipation device 600 is installed on the surface of the heat dissipation column 320. A second heat dissipation base 310 adapted to the first solid heat dissipation device 800 is fixed at the bottom of the heat dissipation column 320; among them, after the optical module 100 is inserted into the working position, the second heat dissipation base 310 is pressed to fit with the surface of the first solid heat dissipation device 800 to achieve composite heat dissipation.

[0037] When the optical module 100 is in the working state, the heat inside the optical module 100 can first be conducted through the first solid heat dissipation device 800. The first solid heat dissipation device 800 conducts the heat to the surface of the heat dissipation column 320 of the second solid heat dissipation device 300. The combination of the second solid heat dissipation device 300 and the first solid heat dissipation device 800 can dissipate the heat inside the optical module 100 to the outside of the installation housing 200, so as to quickly export the heat and avoid continuous temperature rise inside the installation housing 200. At the same time, by combining the solid heat dissipation device and the liquid heat dissipation device 600, the temperature of the solid heat dissipation device on the outside can be quickly reduced, the cooling of the solid heat dissipation device can be accelerated, and further the cooling of the optical module 100 inside the installation housing 200 can be accelerated, realizing high-speed cooling and ensuring that the optical module 100 can stably perform photoelectric conversion and normally and stably convert and transmit signals.

[0038] In summary, by setting the above structure, the heat at the optical module 100 inside the installation housing 200 can be efficiently exported, avoiding continuous temperature rise inside the installation housing 200, and ensuring that the optical module 100 can normally convert and transmit signals. At the same time, by setting a composite heat dissipation structure, the heat inside the second solid heat dissipation device 300 and the first solid heat dissipation device 800 can be quickly taken away by the liquid heat dissipation device 600, improving the heat conduction efficiency of the second solid heat dissipation device 300 and the first solid heat dissipation device 800, further avoiding continuous temperature rise inside the installation housing 200, and ensuring that the optical module 100 can work normally.

[0039] Embodiment 2

[0040] Specifically refer to the appendix Figure 6 、appendix Figure 7 、appendix Figure 10 Differing from Embodiment 1, a U-shaped retaining strip 311 is fixed at the edge of the bottom surface of the second heat dissipation base 310. A heat dissipation hole 312 for conveying heat dissipation grease is opened at the bottom of the second heat dissipation base 310, and the heat dissipation hole 312 is arranged in the direction of the retaining strip 311. Through the above structural design, the heat dissipation grease can be conveyed between the second heat dissipation base 310 and the first solid heat dissipation device 800. The heat dissipation grease can eliminate the air gap between the second heat dissipation base 310 and the first solid heat dissipation device 800 to improve the heat conduction between the second solid heat dissipation device 300 and the first solid heat dissipation device 800. At the same time, through the design of the inclined heat dissipation hole 312 and the U-shaped retaining strip 311, the heat dissipation grease can be fully filled between the second heat dissipation base 310 and the first solid heat dissipation device 800, improving the uniformity and area of the heat dissipation grease filling and enhancing the heat conduction effect.

[0041] An extrusion element 500 for transporting heat-conducting grease is installed at the upper end of the heat dissipation cylinder 320. The extrusion element 500 is elastic. The extrusion element 500 is communicated with the heat dissipation holes 312 through a conveying pipeline. A squeezing plate 330 is fixedly connected to the telescopic end 510 of the extrusion element 500. A guide rod 331 is arranged between the squeezing plate 330 and the heat dissipation cylinder 320. The squeezing plate 330 is slidably connected to the heat dissipation cylinder 320 through the guide rod 331. A locking plate 321 is fixed on the side wall of the heat dissipation cylinder 320. A locking assembly 340 is arranged between the locking plate 321 and the installation housing 200. Through the locking assembly 340, the locking plate 321 and the heat dissipation cylinder 320 can be locked and positioned, so that the heat dissipation cylinder 320 can descend to a predetermined position and then its position will no longer change. The predetermined position here is the position where the second heat dissipation base 310 is in contact with the surface of the first solid heat dissipation device 800.

[0042] During the operation, the staff squeezes the squeezing plate 330 from top to bottom. The extrusion element 500 is elastic and remains at a predetermined position without shrinking. At this time, the squeezing plate 330 drives the second heat dissipation base 310 at the bottom to move towards the first solid heat dissipation device 800. Finally, the second heat dissipation base 310 is in contact with the first solid heat dissipation device 800, and the locking assembly 340 is in a locked state to maintain the state where the second heat dissipation base 310 is in contact with the first solid heat dissipation device 800. The staff continues to squeeze the squeezing plate 330. At this time, the heat-conducting grease in the extrusion element 500 can be transported through the conveying pipeline to the heat dissipation holes 3l2 and flow out. After the second heat dissipation base 310 is in contact with the first solid heat dissipation device 800, the heat-conducting grease is automatically extruded, reducing the operation difficulty of the staff. At the same time, after the two are in contact, the heat-conducting grease is automatically extruded, which can make the heat-conducting grease more evenly distributed, reducing the consumption of the heat-conducting grease. The gap between the second heat dissipation base 310 and the first solid heat dissipation device 800 is completely eliminated, improving the heat conduction efficiency.

[0043] The locking assembly 340 here can be selected as an existing buckle structure. After the locking plate 321 descends to a predetermined position, the locking assembly 340 can lock and limit the locking plate 321, thereby ensuring that the heat dissipation cylinder 320 and the second heat dissipation base 310 are in a stable state at the predetermined position.

[0044] Furthermore, the bottom surface of the second heat dissipation base 310 here is inclined towards the inner side of the mounting housing 200, and the top surface of the first solid heat dissipation device 800 is inclined towards the outer side of the mounting housing 200. In the state where the second heat dissipation base 310 is locked, it can limit the first solid heat dissipation device 800 and the optical module 100 below, ensuring that the optical module 100 is in a stable position and preventing the optical module 100 from being pulled out under the action of external force. At the same time, through the above structural design, the heat conduction area between the second heat dissipation base 310 and the first solid heat dissipation device 800 can be increased to accelerate the conduction and dissipation of heat.

[0045] Embodiment 3

[0046] Specifically refer to the attached Figure 1 - attached Figure 4 、attached Figure 8 、attached Figure 9 ; Further, the first solid heat dissipation device 800 includes two first heat dissipation bases 810 arranged at intervals. The first first heat dissipation base 810 is opposite to the laser converter 110, and the second first heat dissipation base 810 is opposite to the electrical signal conversion board 120 to respectively achieve targeted cooling of the laser converter 110 and the electrical signal conversion board 120. Here, there are two groups of heat dissipation columns 320, which are respectively opposite to the corresponding first heat dissipation bases 810. The first water cooling pipe 610 is installed on the surface of the first heat dissipation column 320, and the second water cooling pipe 620 is installed on the surface of the second heat dissipation column 320. The cooling liquid flows through the second water cooling pipe 620 and the first water cooling pipe 610 in sequence to complete liquid heat dissipation. The cooling liquid can take away the heat on the surface of the heat dissipation columns 320 corresponding to the second water cooling pipe 620 and the first water cooling pipe 610 in sequence, realizing efficient temperature reduction. The photoelectric processing power at the laser converter 110 is large and the temperature there is higher. During the temperature reduction process, the cooling liquid first absorbs heat at the second water cooling pipe 620 and then absorbs the heat on the surface of the laser converter 110 at the first water cooling pipe 610, which can make the most of the cooling liquid and realize efficient heat dissipation.

[0047] It should be noted here that in order to further improve the heat dissipation effect of the first water cooling pipe 610 and the second water cooling pipe 620, the first water cooling pipe 610 and the second water cooling pipe 620 can both be selected as an embedded design, embedded in the two heat dissipation columns 320, and the cooling liquid can pass through the heat dissipation columns 320 to take away the heat, so as to further improve the efficiency of liquid cooling.

[0048] A reversing device 400 is installed between the first water-cooling pipe 610 and the second water-cooling pipe 620. By means of the reversing device 400, the flow direction of the cooling liquid is changed. At this time, the cooling liquid can first pass through the heat dissipation column 320 corresponding to one side of the laser converter 110, and then pass through the heat dissipation column 320 corresponding to one side of the electrical signal conversion board 120. At this time, efficient cooling of one side of the laser converter 110 can be achieved. After the temperature at the laser converter 110 exceeds the threshold, a reversing adjustment is carried out to ensure that the conversion and processing of the optical and electrical signals can be normally realized at the laser converter 110, ensuring the normal operation of the overall structure of the optical module 100.

[0049] For specific reference, see the appendix Figure 8 Specifically; the reversing device 400 here includes a reversing housing 410. The side wall of the reversing housing 410 is communicated with a relatively arranged liquid inlet pipe 630 and a liquid outlet pipe 640. The side wall of the reversing housing 410 is communicated with a relatively arranged first conveying joint 611 and a second conveying joint 621. The inner wall of the reversing housing 410 is hermetically and rotatably connected with a reversing valve core 420. Two groups of reversely bent reversing pipes are arranged inside the reversing valve core 420. It also includes a control device 700 for controlling the rotation of the reversing valve core 420.

[0050] The reversing pipes include a first reversing pipe 421 and a second reversing pipe 422. Both the first reversing pipe 421 and the second reversing pipe 422 are designed with a 90° bend, and the two are isolated from each other; in the normal state where the temperature at the laser converter 110 is lower than the threshold, the liquid inlet pipe 630 and the second conveying joint 621 are communicated through the first reversing pipe 421, and the first conveying joint 611 and the liquid outlet pipe 640 are communicated through the second reversing pipe 422. At this time, the cooling liquid flows through the second water-cooling pipe 620 and the first water-cooling pipe 610 through the liquid inlet pipe 630, and finally is discharged from the liquid outlet pipe 640.

[0051] In the abnormal state where the temperature at the laser converter 110 is higher than the threshold, the liquid inlet pipe 630 and the first conveying joint 611 are communicated through the first reversing pipe 421, and the second conveying joint 621 and the liquid outlet pipe 640 are communicated through the second reversing pipe 422. At this time, the cooling liquid flows through the first water-cooling pipe 610 and the second water-cooling pipe 620 through the liquid inlet pipe 630, and finally is discharged from the liquid outlet pipe 640. The cooling liquid first passes through the first water-cooling pipe 610 to achieve rapid and forced cooling of the laser converter 110, ensuring efficient heat dissipation of the laser converter 110 and the overall optical module 100, and ensuring that the optical module 100 can normally process optical and electrical signals.

[0052] Specifically, the control device 700 includes a control housing 710. A control rotating shaft 720 is rotatably connected inside the control housing 710. The end of the control rotating shaft 720 penetrates through the reversing housing 410 and is fixedly connected to the reversing valve core 420. A driving element 740 is installed inside the control housing 710 to drive the control rotating shaft 720 to rotate. Here, the reversing valve core 420 can be selected as an electric structure including a temperature sensor. After detecting that the temperature at the laser converter 110 exceeds the threshold, the reversing valve core 420 is controlled to rotate through the control rotating shaft 720, and the reversing valve core 420 is rotated by a predetermined angle to realize the switching of the conduction pipelines of the first reversing pipe 421 and the second reversing pipe 422, thereby realizing the conduction adjustment control.

[0053] A first control plate 730 is fixedly arranged on the side wall of the control rotating shaft 720, and a second control plate 750 is fixedly arranged on the inner wall of the control housing 710. The driving element 740 is arranged between the first control plate 730 and the second control plate 750. The position of the second control plate 750 is relatively fixed. During the expansion and contraction process of the driving element 740, it can push the first control plate 730 to deflect outward, thereby driving the control rotating shaft 720 to rotate and realizing stable rotation control.

[0054] As a preferred embodiment of the driving element, the driving element 740 here is a control bladder with elasticity. The control bladder is filled with a low-boiling-point liquid. The low-boiling-point liquid is in thermal contact with the first water-cooling pipeline 610, that is, the low-boiling-point liquid can absorb the heat at the first water-cooling pipeline 610 and expand. Specifically, the control bladder is communicated with a heat exchange pipeline 741, and the end of the heat exchange pipeline 741 is wound around the surface of the heat dissipation cylinder 320 corresponding to the laser converter 110; a first limiting element 711 and a second limiting element 712 for limiting the first control plate 730 are arranged on the inner wall of the control housing 710.

[0055] The initial position of the first control plate 730 can be limited by the first limiting element 711, and the position of the first control plate 730 after deflection can be limited by the second limiting element 712; through the above structural design, only when the surface temperature of the laser converter 110 continuously rises for a certain time, the low-boiling-point liquid inside the driving element 740 vaporizes and expands, breaks through the limitation of the first limiting element 711, and pushes the first control plate 730 to quickly rotate to the position of the second limiting element 712 to complete locking, avoiding the deflection control failure caused by overly sensitive temperature detection; at the same time, by setting the second limiting element 712, the position of the first control plate 730 after deflection can be locked, avoiding the position change of the control rotating shaft 720 and the reversing valve core 420, ensuring that the cooling liquid can flow stably and continuously after deflection, and ensuring the stability of liquid heat dissipation.

[0056] Through the above structural design, detection and drive control can be completed without installing too many detection components, which is suitable for long-term use. At the same time, after the control rotating shaft 720 rotates to a predetermined position, its position state deflects, and the staff can manually reset it. The staff can visually judge the abnormal temperature rise of the laser converter 110 structure according to the number of deflections per unit time, so as to timely repair and replace the abnormal laser converter 110. At the same time, the low-boiling-point liquid in the driving element 740 can independently serve as a liquid cooling system to absorb the heat at the corresponding heat dissipation cylinder 320 of the laser converter 110, further improving the heat dissipation efficiency of the optical module 100.

[0057] It should be noted that in the above embodiments, the descriptions of each embodiment have their own emphases. For the parts not detailedly described in a certain embodiment, reference can be made to the relevant descriptions of other embodiments.

[0058] Although the preferred embodiments of the present invention have been described, those skilled in the art can make additional changes and modifications to these embodiments once they know the basic creative concept. Therefore, the appended claims are intended to be construed as including the preferred embodiments and all changes and modifications falling within the scope of the present invention.

[0059] Obviously, those skilled in the art can make various changes and modifications to the present invention without departing from the spirit and scope of the present invention. Thus, if these modifications and variations of the present invention fall within the scope of the claims of the present invention and their equivalent technologies, the present invention also intends to include these changes and modifications.

Claims

1. Composite heat dissipation structure for a pluggable optical module, comprising a mounting housing (200) with a plugging chamber, wherein a heat dissipation device for cooling the optical module (100) is arranged inside the mounting housing (200), and it is characterized in that: The heat dissipation device includes a first solid heat dissipation device (800) installed inside the optical module (100), and a second solid heat dissipation device (300) arranged on the surface of the housing; the second solid heat dissipation device (300) includes a heat dissipation cylinder (320), and a liquid heat dissipation device (600) is installed on the surface of the heat dissipation cylinder (320), and a second heat dissipation base (310) adapted to the first solid heat dissipation device (800) is fixed at the bottom of the heat dissipation cylinder (320); Wherein, after the optical module (100) is inserted into the working position, the second heat dissipation base (310) is pressed to fit with the surface of the first solid heat dissipation device (800) to achieve composite heat dissipation; The first solid heat dissipation device (800) includes two first heat dissipation bases (810) arranged at intervals, the heat dissipation cylinders (320) are in two groups and are respectively opposite to the corresponding first heat dissipation bases (810), a first water cooling pipe (610) is installed on the surface of the first heat dissipation cylinder (320), a second water cooling pipe (620) is installed on the surface of the second heat dissipation cylinder (320), and the cooling liquid flows through the second water cooling pipe (620) and the first water cooling pipe (610) in sequence to complete liquid heat dissipation; A commutation device (400) is installed between the first water cooling pipe (610) and the second water cooling pipe (620) to change the flow direction of the cooling liquid through the commutation device (400); The commutation device (400) includes a commutation housing (410), the side wall of the commutation housing (410) is communicated with a relatively arranged liquid inlet pipe (630) and a liquid outlet pipe (640), the side wall of the commutation housing (410) is communicated with a relatively arranged first delivery joint (611) and a second delivery joint (621), a commutation valve core (420) is rotationally connected to the inner wall of the commutation housing (410) in a sealed manner, two groups of bent commutation pipes are arranged inside the commutation valve core (420), and a control device (700) for controlling the rotation of the commutation valve core (420) is also included; The control device (700) includes a control housing (710), a control rotating shaft (720) is rotationally connected to the inside of the control housing (710), the end of the control rotating shaft (720) penetrates through the commutation housing (410) and is fixedly connected to the commutation valve core (420), and a driving element (740) for driving the control rotating shaft (720) to rotate is installed inside the control housing (710); The driving element (740) is an elastic control bladder filled with a low-boiling-point liquid, the low-boiling-point liquid is in thermal contact with the first water cooling pipe (610), and a first limiting element (711) and a second limiting element (712) for limiting the first control plate (730) are arranged on the inner wall of the control housing (710).

2. The composite heat dissipation structure according to claim 1, wherein A U-shaped stop bar (311) is fixed at the edge of the bottom surface of the second heat dissipation base (310). Heat dissipation holes (312) for conveying heat dissipation grease are formed in the bottom of the second heat dissipation base (310), and the heat dissipation holes (312) are arranged in the direction of the stop bar (311).

3. The composite heat dissipation structure according to claim 2, wherein An extrusion element (500) for conveying heat dissipation grease is installed at the upper end of the heat dissipation column body (320). The extrusion element (500) is communicated with the heat dissipation holes (312) through a conveying pipeline. An extrusion plate (330) is fixedly connected to the telescopic end (510) of the extrusion element (500). A guide rod (331) is arranged between the extrusion plate (330) and the heat dissipation column body (320). A locking plate (321) is fixed on the side wall of the heat dissipation column body (320), and a locking assembly (340) is arranged between the locking plate (321) and the installation shell (200).

4. The composite heat dissipation structure according to claim 2, wherein, The bottom surface of the second heat dissipation base (310) is inclined towards the inner side of the installation shell (200), and the top surface of the first solid heat dissipation device (800) is inclined towards the outer side of the installation shell (200).

5. The composite heat dissipation structure according to claim 4, characterized in that, A first control board (730) is fixed on the side wall of the control rotating shaft (720), a second control board (750) is fixed on the inner wall of the control shell (710), and the driving element (740) is arranged between the first control board (730) and the second control board (750).

Citation Information

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