Wafer handling equipment

Abstract

The present invention proposes a wafer clamping device for moving a wafer body, comprising: a mounting bracket, a gripping member, a first moving structure, a second moving structure and a third moving structure; wherein the gripping member is mounted on one end of the mounting bracket, and the gripping member is used to grip the wafer body; the first moving structure is mounted on the mounting bracket and is transmission-connected to the gripping member, and the first moving structure is used to drive the gripping member to have a movement direction along the circumferential plane extension direction of the mounting bracket; the second moving structure is mounted on the mounting bracket and is transmission-connected to the first moving structure, and the second moving structure has a movement direction along the circumferential rotation of the mounting bracket; the third moving structure is mounted on the mounting bracket and is transmission-connected to the second moving structure, and the third moving structure has a reciprocating motion trajectory along the axial direction of the mounting bracket. Through the synergistic effect of the three moving structures, the wafer body can be quickly and stably moved and positioned, thereby improving the working efficiency and performance of the wafer clamping device.

Description

Technical Field

[0001] The invention belongs to the technical field of semiconductor equipment, and in particular relates to a wafer clamping device. Background Art

[0002] In the manufacturing process of wafer materials, moving the wafer material is an important operation step, because slight changes or errors on the wafer may have a significant impact on the quality of the final product. Vibration needs to be minimized during the moving operation. Vibration can cause scratches or damage to the wafer surface, affecting the accuracy and quality of chip manufacturing.

[0003] Therefore, the moving operation needs to be equipped with a high-precision motion control system that can accurately control the position, speed and acceleration of the wafer to ensure accuracy and stability during the moving process. In the related art, multiple shifting mechanisms are usually used to realize the handling operation of wafer materials. Multiple shifting mechanisms are responsible for the movement of wafer materials in different directions in space. The internal structure of the shifting device composed of multiple shifting mechanisms is complex and poorly integrated. Synchronous and coordinated operations require signal connections or manual adjustments between multiple shifting mechanisms, which are prone to inaccurate shifting and cause errors. Summary of the invention

[0004] The technical purpose of the present invention is to provide a wafer clamping device, aiming to solve the problem of complex internal structure of the device and difficulty in coordination and error.

[0005] To solve the above technical problems, the present invention is implemented as follows: a wafer clamping device for moving a wafer body, comprising:

[0006] Mounting bracket;

[0007] A gripping member, mounted on one end of the mounting bracket, and used for gripping the wafer body;

[0008] A first moving structure, mounted on the mounting bracket and in transmission connection with the grabbing member, the first moving structure being used to drive the grabbing member to have a movement direction along the extending direction of the circumferential plane of the mounting bracket;

[0009] A second movable structure, mounted on the mounting bracket and in transmission connection with the first movable structure, the second movable structure having a movement direction of rotating along the circumferential direction of the mounting bracket;

[0010] The third movable structure is installed on the mounting bracket and is transmission-connected with the second movable structure. The third movable structure has a reciprocating motion track along the axial direction of the mounting bracket.

[0011] In some embodiments of the present invention, the first movable structure has a accommodating cavity with an opening on one side, the bottom of the accommodating cavity is parallel to the circumferential plane of the mounting bracket, the bottom of the accommodating cavity is provided with a first guide rail, the grabbing member is slidably assembled on the first guide rail and has a movement direction of extending or retracting the opening.

[0012] In some embodiments of the present invention, the grasping member includes a first clamping jaw and a second clamping jaw, the first guide rail includes a first sub-rail and a second sub-rail that are spaced apart and parallel to each other, the first clamping jaw is slidably assembled with the first sub-rail, the second clamping jaw is slidably assembled with the second sub-rail, the first clamping jaw is arranged on a side of the second clamping jaw away from the bottom of the accommodating cavity, and the first clamping jaw and the second clamping jaw are limited to form a clamping space.

[0013] In some embodiments of the present invention, the first moving structure also includes a first transmission component and a second transmission component; the first transmission component includes two first transmission wheels, the first transmission belt and a first power source, the first transmission wheel away from the opening is transmission-connected to the first power source, the first transmission belt is mounted on the two first transmission wheels, and the rotation direction of the first transmission belt remains parallel to the extension direction of the first sub-rail; the second transmission component includes two second transmission wheels, the second transmission belt and a second power source, the second transmission wheel away from the opening is transmission-connected to the second power source, the second transmission belt is mounted on the two second transmission wheels, and the rotation direction of the second transmission belt remains parallel to the extension direction of the second sub-rail; the first clamp is transmission-connected to the first transmission belt, and the second clamp is transmission-connected to the second transmission belt.

[0014] In some embodiments of the present invention, the first clamping jaw and the second clamping jaw are each provided with a plurality of clamping portions, and both ends of each of the clamping portions are chamfered.

[0015] In some embodiments of the present invention, a laser sensor is disposed at the bottom of the accommodating cavity, and a sensing surface of the laser sensor is disposed toward the grasping member.

[0016] In some embodiments of the present invention, the second movable structure includes a rotating motor that is transmission-connected to the first movable structure, the rotation direction of the rotating motor is along the circumference of the mounting bracket, the rotating motor is provided with a mounting surface connected to the first movable structure, the mounting surface is provided with a leveling mechanism, the leveling mechanism is provided with at least three adjustment holes corresponding to the first movable structure, and each of the adjustment holes is arranged around a ring shape.

[0017] In some embodiments of the present invention, a central control reducer connected to the first moving structure is also provided on the mounting surface.

[0018] In some embodiments of the present invention, the third movable structure includes a screw rod extending axially along the mounting bracket, and the second movable structure is slidably assembled on the screw rod.

[0019] In some embodiments of the present invention, the third movable structure also includes two sliding rails arranged on both sides of the screw rod, and the extension direction of the two sliding rails remains parallel to the screw rod. The second movable structure is provided with two sliding blocks slidably connected to the two sliding rails in a one-to-one correspondence.

[0020] Compared with the prior art, the wafer clamping device of the present invention has the following beneficial effects:

[0021] The mounting bracket of the wafer clamping device is installed on the ground, that is, the circumferential plane direction of the mounting bracket is parallel to the ground, and the axial direction of the mounting bracket is perpendicular to the ground. In the rectangular coordinate system, the first moving structure is used to drive the grasping member to move along the x-axis or y-axis, the second moving structure is used to drive the grasping member and the first moving structure to rotate along the xy-axis plane, and the third moving structure is used to drive the grasping member, the first moving structure and the second moving structure to move along the z-axis. With such an arrangement, the grasping member can be driven to move to any point in space through the mutual cooperation of multiple moving structures on the mounting bracket, thereby realizing the function of grasping the wafer body and moving it to a preset position. Through the synergistic effect of the three moving structures, the wafer body can be quickly and stably moved and positioned, thereby improving the working efficiency and performance of the wafer clamping device. BRIEF DESCRIPTION OF THE DRAWINGS

[0022] Figure 1 is a side view of a wafer clamping device according to an embodiment of the present invention;

[0023] Figure 2 yes Figure 1 A schematic diagram of the assembly structure of the first moving structure and the gripping member in the wafer clamping device;

[0024] Figure 3 yes Figure 1 A top view of a first moving structure in a wafer clamping device;

[0025] Figure 4 yes Figure 1 A schematic structural diagram of a second moving structure in a wafer clamping device;

[0026] Figure 5 yes Figure 1 A schematic diagram of the assembly structure of the second moving structure and the third moving structure in the wafer clamping device;

[0027] Figure 6 It is a flow chart of a control method of a wafer clamping device in one embodiment of the present invention.

[0028] In the accompanying drawings, each reference numeral represents:

[0029] 100. Wafer clamping device; 11. Mounting bracket; 12. Grabbing member; 121. First clamping jaw; 122. Second clamping jaw; 123. Clamping portion; 124. Scanning hole; 13. First moving structure; 131. First sub-track; 132. Second sub-track; 133. Accommodating chamber; 134. First transmission wheel; 135. First transmission belt; 136. First power source; 137. Second transmission wheel; 138. Second transmission belt; 139. Second power source; 14. Laser sensor; 15. Second moving structure; 151. Mounting surface; 152. Adjustment hole; 153. Rotating motor; 154. Central control reducer; 16. Third moving structure; 161. Third power source; 162. Screw; 163. Slide rail; 164. Slider; 200. Wafer body. DETAILED DESCRIPTION

[0030] The embodiments of the present invention are described in detail below, and examples of the embodiments are shown in the accompanying drawings, wherein the same or similar reference numerals throughout represent the same or similar elements or elements having the same or similar functions. The embodiments described below with reference to the accompanying drawings are exemplary and are intended to be used to explain the present invention, but are not to be construed as limiting the present invention. All other embodiments obtained by ordinary technicians in the field without creative work based on the embodiments of the present invention are within the scope of protection of the present invention.

[0031] In the description of the present invention, it is to be understood that the terms “center”, “longitudinal”, “lateral”, “length”, “width”, “thickness”, “up”, “down”, “front”, “back”, “left”, “right”, “vertical”, “horizontal”, “top”, “bottom”, “inside”, “outside”, “clockwise”, “counterclockwise”, “axial”, “circumferential”, “radial”, etc., indicating orientations or positional relationships based on the orientations or positional relationships shown in the accompanying drawings, are only for the convenience of describing the present invention and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore should not be understood as limiting the present invention.

[0032] In addition, the terms "first" and "second" are used for descriptive purposes only and should not be understood as indicating or implying relative importance or implicitly indicating the number of the indicated technical features. Therefore, the features defined as "first" and "second" may explicitly or implicitly include one or more of the features. In the description of the present invention, the meaning of "plurality" is two or more, unless otherwise clearly and specifically defined.

[0033] Please refer to Figures 1 to 5The present invention proposes a wafer clamping device 100 for moving a wafer body 200, comprising: a mounting bracket 11, a gripping member 12, a first moving structure 13, a second moving structure 15 and a third moving structure 16; wherein the gripping member 12 is mounted at one end of the mounting bracket 11, and the gripping member 12 is used to grip the wafer body 200; the first moving structure 13 is mounted on the mounting bracket 11 and is transmission-connected to the gripping member 12, and the first moving structure 13 is used to drive the gripping member 12 to have a movement direction along the circumferential plane extension direction of the mounting bracket 11; the second moving structure 15 is mounted on the mounting bracket 11 and is transmission-connected to the first moving structure 13, and the second moving structure 15 has a movement direction along the circumferential rotation of the mounting bracket 11; the third moving structure 16 is mounted on the mounting bracket 11 and is transmission-connected to the second moving structure 15, and the third moving structure 16 has a reciprocating motion trajectory along the axial direction of the mounting bracket 11.

[0034] The mounting bracket 11 is mounted on the ground, that is, the circumferential plane direction of the mounting bracket 11 is parallel to the ground, and the axial direction of the mounting bracket 11 is perpendicular to the ground. In the rectangular coordinate system, the first moving structure 13 is used to drive the grasping member 12 to move along the x-axis or y-axis, the second moving structure 15 is used to drive the grasping member 12 and the first moving structure 13 to rotate along the xy-axis plane, and the third moving structure 16 is used to drive the grasping member 12, the first moving structure 13 and the second moving structure 15 to move along the z-axis. With such a configuration, the grasping member 12 can be driven to move to any point in space through the mutual cooperation of multiple moving structures on the mounting bracket 11, thereby realizing the function of grasping the wafer body 200 and moving it to a preset position. Through the synergistic effect of the three moving structures, the wafer body 200 can be quickly and stably moved and positioned, thereby improving the working efficiency and performance of the wafer clamping device 100.

[0035] For details, please refer to Figure 1 and Figure 2 In this embodiment, the first movable structure 13 has a accommodating cavity 133 with an opening on one side, the bottom of the accommodating cavity 133 is parallel to the circumferential plane of the mounting bracket 11, and a first guide rail is provided at the bottom of the accommodating cavity 133. The grabbing member 12 is slidably assembled on the first guide rail and has a movement direction of extending or retracting the opening.

[0036] The first movable structure 13 may include an installation box, in which a receiving cavity 133 and an opening for avoiding the gripping member 12 are formed. The installation box integrates the first movable structure 13 and the gripping member 12 into an integral component, which is independently processed and assembled during the manufacturing process, and then installed on other components of the wafer clamping device 100, thereby improving the assembly effect. At the same time, the installation box isolates the external environment, provides additional structural support and protection, and helps prevent key components from being affected by the external environment, thereby improving the overall reliability and stability of the wafer clamping device 100.

[0037] The setting of the first guide rail provides stable guidance for the grasping member 12 during movement, and can ensure that the grasping member 12 accurately extends or retracts along a predetermined path, so that the grasping member 12 avoids movement deviations caused by posture changes during movement, thereby improving the movement accuracy and reliability of the wafer clamping device 100.

[0038] The gripper 12 is slidably mounted on the first guide rail, and this assembly method makes the gripper 12 move more smoothly and steadily, reduces friction and resistance during movement, and improves the operating efficiency of the wafer clamping device 100. The gripper 12 can accurately grasp and release the wafer body 200 according to actual needs, thereby improving the functional reliability and practicality of the wafer clamping device 100.

[0039] In this embodiment, the grasping member 12 includes a first clamping jaw 121 and a second clamping jaw 122, the first guide rail includes a first sub-rail 131 and a second sub-rail 132 which are arranged in parallel at intervals, the first clamping jaw 121 is slidably assembled with the first sub-rail 131, the second clamping jaw 122 is slidably assembled with the second sub-rail 132, the first clamping jaw 121 is arranged on the side of the second clamping jaw 122 away from the bottom of the accommodating cavity 133, and the first clamping jaw 121 and the second clamping jaw 122 are limited to form a clamping space.

[0040] The first clamping jaw 121 and the second clamping jaw 122 are spaced apart to limit and form a clamping space, ensuring that the clamping member has a stable clamping space during the clamping process, which can ensure that the clamping process of the wafer body 200 is stable and reliable, and improve the clamping capacity and working efficiency of the wafer clamping device 100.

[0041] The first sub-rail 131 and the second sub-rail 132 are separately arranged, and the first clamp 121 and the second clamp 122 are spaced apart. The two are staggered and moved and adjusted separately, so that the adjustable range of the clamping space becomes larger, and the specification range of the wafer body 200 that can be clamped by the first clamp 121 and the second clamp 122 can be larger, and the applicability of the wafer clamping device 100 is improved.

[0042] For details, please refer to Figure 3The first moving structure 13 also includes a first transmission component and a second transmission component; the first transmission component includes two first transmission wheels 134, a first transmission belt 135 and a first power source 136, the first transmission wheel 134 away from the opening is transmission-connected with the first power source 136, the first transmission belt 135 is mounted on the two first transmission wheels 134, and the rotation direction of the first transmission belt 135 is parallel to the extension direction of the first sub-rail 131; the second transmission component includes two second transmission wheels 137, a second transmission belt 138 and a second power source 139, the second transmission wheel 137 away from the opening is transmission-connected with the second power source 139, the second transmission belt 138 is mounted on the two second transmission wheels 137, and the rotation direction of the second transmission belt 138 is parallel to the extension direction of the second sub-rail 132; the first clamp 121 is transmission-connected to the first transmission belt 135, and the second clamp 122 is transmission-connected to the second transmission belt 138.

[0043] The above structure is set so that the first clamping jaw 121 and the second clamping jaw 122 are connected to their respective power sources through the first transmission belt 135 and the second transmission belt 138, respectively, and the rotation direction of the transmission belt is parallel to the extension direction of the guide rail. It can ensure that the clamping device maintains stable transmission during the movement process, and improve the movement accuracy and reliability of the clamping device. In this embodiment, the positioning accuracy of the first moving structure 13 is ±0.04.

[0044] The first clamp 121 and the second clamp 122 are clamped on the first transmission belt 135 and the second transmission belt 138 respectively, which enhances the supporting force during the movement and effectively reduces the friction and vibration, so that the first clamp 121 and the second clamp 122 move on the first sub-rail 131 and the second sub-rail 132 respectively, effectively reducing the interference and mutual influence between the power sources and improving the movement efficiency and reliability of the clamping device.

[0045] Among them, the first power source 136 and the second power source 139 drive the first transmission wheel 134 and the second transmission wheel 137 to rotate respectively. The rotation speeds of the first power source 136 and the second power source 139 can be the same. According to the actual grasping requirements, the movement speeds of the first clamp 121 and the second clamp 122 are kept the same to maintain the wafer body 200 clamped between the first clamp 121 and the second clamp 122 to maintain smooth movement, thereby improving the clamping stability and clamping effect of the wafer clamping device 100.

[0046] In this embodiment, the wafer body 200 is placed in the material box, and the first clamping jaw 121 and the second clamping jaw 122 are used to clamp the wafer body 200 in the material box and place it on the test table. After the test on the test table is completed, the first clamping jaw 121 and the second clamping jaw 122 place the wafer body 200 from the test table back into the material box. The first clamping jaw 121 and the second clamping jaw 122 are both provided with a plurality of clamping parts 123, and both ends of each clamping part 123 are chamfered, so that in the process of clamping the wafer body 200, the wafer body 200 is automatically centered, thereby improving the grasping accuracy of the grasping member 12 on the wafer body 200.

[0047] The first clamping jaw 121 and the second clamping jaw 122 can pick up and place the wafer body 200 separately through the multiple clamping parts 123. The clamping parts 123 of the first clamping jaw 121 and the second clamping jaw 122 can be moved by the built-in motor to adjust the relative distance between the multiple clamping parts 123 on the first clamping jaw 121 and the multiple clamping parts 123 on the second clamping jaw 122 to be suitable for wafer bodies 200 of different diameters, thereby improving the practicality and application range of the clamping device.

[0048] In addition, a scanning hole 124 can be opened on the first clamping jaw 121 and the second clamping jaw 122, and a material barcode can be set for each wafer body 200. A scanning device can be set on the inspection table. The scanning device is used to scan the material barcode through the scanning hole 124 to improve the accuracy of the wafer clamping device 100 in clamping the wafer body 200, and facilitate the judgment of the processing status of the wafer body 200, thereby avoiding the situation where the wafer body 200 is not detected or the wafer body 200 is detected multiple times.

[0049] In other embodiments, the clamping parts of the first clamp 121 and the second clamp 122 may include a negative pressure head. The negative pressure head is supported by a flexible material. When the negative pressure head contacts the wafer body 200, the air pump connected to the negative pressure head extracts the internal air, and a negative pressure is formed inside the negative pressure head, thereby tightly adsorbing the wafer body 200 on the corresponding clamp. When the air pump supplies air to the inside of the negative pressure head, the internal and external air pressure of the negative pressure head is balanced, thereby releasing the wafer body 200, thereby achieving adsorption and placement of the wafer body 200, and improving the operational flexibility and practicality of the wafer clamping device 100. The first clamp 121 and the second clamp 122 can absorb the same wafer body 200 at the same time, effectively enhancing the gripping force of the gripping member 12 on the wafer body 200. Alternatively, the first clamp 121 and the second clamp 122 may be provided with bonding surfaces for bonding the wafer body 200, or the first clamp 121 and the second clamp 122 may be provided with curved clamping columns for clamping the wafer body 200, or other settings for grasping and unloading are not limited here.

[0050] A laser sensor 14 is provided at the bottom of the accommodating cavity 133, and the sensing surface of the laser sensor 14 is arranged toward the gripping member 12. The laser sensor 14 is used to detect whether there are wafer bodies 200 on the material box or the detection table and the number of wafer bodies 200 before the upper clamping jaws and the lower clamping jaws perform corresponding point actions, which can reduce the dependence on operators and reduce manual intervention, thereby reducing labor costs and improving grasping accuracy.

[0051] In one embodiment, the clamping portion 123 of the second clamping jaw 122 may be provided with a rotary motor for controlling the clamping portion 123 of the second clamping jaw 122 to have a motion trajectory from a direction perpendicular to the placement plane to a direction parallel to the placement plane. For grasping a wafer body 200 with a relatively large thickness, when the clamping portion 123 of the second clamping jaw 122 is rotated to be parallel to the placement plane, the negative pressure head of the clamping portion 123 may be in close contact with the side circumference of the wafer body 200, and the negative pressure head of the clamping portion 123 of the first clamping jaw 121 is in close contact with the top surface of the wafer body 200, thereby achieving joint grasping of the wafer body 200, increasing the clamping space range of the wafer clamping device 100, and enhancing the fixing stability of the wafer clamping device 100 to the wafer body 200.

[0052] Please refer to Figure 4 In this embodiment, the second movable structure 15 includes a rotating motor 153 that is transmission-connected to the first movable structure 13. The rotation direction of the rotating motor 153 is along the circumferential direction of the mounting bracket 11. The rotating motor 153 is provided with a mounting surface 151 that is connected to the first movable structure 13. The mounting surface 151 is provided with a leveling mechanism. The leveling mechanism is provided with at least three adjustment holes 152 corresponding to the first movable structure 13, and each adjustment hole 152 is arranged around a ring shape.

[0053] The rotating motor 153 is used to drive the wafer body 200 on the grasping member 12 to rotate along a plane parallel to the placement plane, and the size of the rotation area is controlled by the first moving structure 13. The combination of the two can realize moving the wafer body 200 to any position on a plane parallel to the placement plane, thereby improving the shifting accuracy and applicability of the wafer clamping device 100.

[0054] The multiple adjustment holes 152 of the leveling mechanism are provided with multiple corresponding adjustment studs to form an adjustment plane. The relative distance and horizontal angle between the mounting surface 151 and the mounting box in the first movable structure 13 are adjusted by changing the installation heights of the multiple adjustment studs in the adjustment holes 152. Optimally, the bottom surface of the mounting box is kept parallel to the mounting surface 151, so that the rotating motor 153 can realize smooth rotation of the first movable structure 13, avoid deflection, reduce movement errors, and improve the movement accuracy of the wafer clamping device 100.

[0055] Among them, multiple adjustment holes 152 are arranged around an annular pattern, and the annular pattern can be in the shape of a triangle, square, polygon or circle, so that the distance between two adjacent adjustment holes 152 remains the same, providing stable support for the mounting surface 151.

[0056] Furthermore, a central control reducer 154 connected to the first moving structure 13 is also provided on the mounting surface 151. The central control reducer 154 can convert the high-speed rotation of the motor into a low-speed and high-torque output. For scenarios where the wafer body 200 needs to be precisely adjusted, the low-speed and high-torque rotation mode makes it more accurate to shift the wafer clamping device 100 to the preset position, avoiding positioning errors caused by inertia caused by excessive speed. The central control reducer 154 has high precision and large load-bearing capacity, and can achieve a multi-turn 360-degree accuracy of ±0.5 degrees. For scenarios where the user manually controls, the use of the central control reducer 154 requires lower user response, and the displacement can be adjusted through continuous observation, which has stronger operability and fault tolerance.

[0057] Please refer to Figure 5 In order to achieve the displacement of the wafer body 200 on the wafer clamping device 100 along the z-axis, the third moving structure 16 includes a screw rod 162 extending along the axial direction of the mounting bracket 11, and the second moving structure 15 is slidably assembled on the screw rod 162. The extension direction of the screw rod 162 is perpendicular to the ground on which it is placed. In order to reduce noise and friction during movement, the surface of the screw rod 162 can be specially processed, such as grinding, polishing or coating, to reduce friction and noise.

[0058] A corresponding nut is provided on the second movable structure 15 slidably assembled with the screw rod 162. The pitch and thread angle of the nut and the screw rod 162 are usually accurately calculated and optimized. Appropriate pitch and thread angle can make the movement of the thread pair smoother and reduce vibration and noise.

[0059] Specifically, the third moving structure 16 further includes two slide rails 163 disposed on both sides of the screw rod 162, the extension direction of the two slide rails 163 is parallel to the screw rod 162, and the second moving structure 15 is provided with two sliders 164 slidably connected to the two sliders in a one-to-one correspondence. The screw rod 162 and the two slide rails 163 are kept parallel to each other, and the displacement stability of the second moving structure 15 on the mounting bracket 11 is maintained to the greatest extent.

[0060] In this embodiment, the displacement accuracy of the third moving structure 16 is ±0.02, and the carrying capacity is 70-80KG. The third moving structure 16 is at the bottom of the wafer clamping device 100, so the higher carrying capacity can enhance the stability of the wafer clamping device 100 during movement. The third moving structure 16 includes a third power source 161 for controlling the rotation of the screw rod 162. The first power source 136, the second power source 139, the rotary motor 153 and the third power source 161 can all be multi-turn absolute encoder motors. The multi-turn absolute encoder motor has an absolute position feedback function, that is, the motor can accurately know its position without initialization, which means that even after power failure, the motor can maintain position information when it is powered on again, and there is no need to re-position or reset operations, thereby avoiding the risk of collision and injury when the wafer clamping device 100 is restarted, thereby improving the reliability and work efficiency of the wafer clamping device 100.

[0061] Multi-turn absolute encoder motors usually adopt a multi-turn design, that is, multiple poles or encoders are installed on the motor rotor, and each pole or encoder corresponds to a unique position value. This can improve the accuracy and reliability of position measurement and reduce position errors.

[0062] With absolute position feedback function and multi-turn design, they can accurately distinguish multiple positions of the same angle, provide richer and more detailed position representation, and have high precision and stability. They can monitor and feedback the precise position information of the motor in real time, so that the control system can control the movement of the motor more accurately and meet the needs of high-precision positioning and control.

[0063] Please refer to Figure 6 The present invention further proposes a control method for a wafer clamping device 100, which is used to control the clamping portion 123 to grasp the wafer body 200, wherein the negative pressure head of the first clamping jaw 121 is a first negative pressure head, and the negative pressure head of the second clamping jaw 122 is a second negative pressure head, and the steps are as follows:

[0064] Step 301 : obtaining the relative distance between the first negative pressure head and the top surface of the wafer body 200 .

[0065] The laser sensor 14 can also detect the relative distance between the first negative pressure head and the top surface of the wafer body 200, and transmit the data to the control main board of the wafer clamping device 100, and adjust the contact between the first negative pressure head and the top surface through the first power source 136, the second power source 139, the rotating motor 153 and the third power source 161.

[0066] Step 302 , controlling the first negative pressure head to move toward the top surface of the wafer body 200 until the internal and external pressure difference of the first negative pressure head is within a preset pressure difference range.

[0067] The air pump in the wafer clamping device 100 can be connected to an air pressure detector to detect the air pressure of the first negative pressure head and the second negative pressure head. When the first negative pressure head and the second negative pressure head come into contact with the wafer body 200, the air pressure will increase significantly, thereby judging that the wafer body 200 is in the clamping space.

[0068] Specifically, the material of the wafer body 200 has a maximum contact stress, and the user pre-enters the radius (r) of the wafer body 200, the thickness (t) of the wafer body 200, the maximum contact stress (σmax) of the material of the wafer body 200, the contact area (A) of the negative pressure head, the shape factor (S) and other parameters to calculate the maximum pressure difference between the negative pressure head and the wafer body 200. Among them, S is the influence factor of the shape of the contact area of ​​the negative pressure head on the pressure distribution, and if the shape of the contact area of ​​the negative pressure head is circular, S can be 1.

[0069] The calculation formula is as follows: ΔP = σmax (t 2 S) / (Ar 2 ), in the actual production process, the wafer body 200 material cannot exceed the safe contact stress (σsafe), σsafe=Xσmax, where X is a safety factor, and the range of X can be 0.8~0.9, such as 0.8, 0.85, 0.9, to leave a safety margin for the grasping of the wafer body 200. That is, the preset pressure difference range of the first negative pressure head and the second negative pressure head in contact with the wafer body 200 is 0.8ΔP~0.9ΔP.

[0070] By presetting the pressure difference range, it is determined whether the contact pressure of the first negative pressure head and the second negative pressure head on the wafer body 200 is too large or too small, so as to avoid damage to the wafer body 200 due to excessive pressure difference, thereby realizing the safety protection of the wafer body 200 by the wafer clamping device 100 and improving the yield rate of the wafer body 200. It is avoided that the first negative pressure head and the second negative pressure head cannot stably grasp the wafer body 200 due to too small pressure difference, thereby improving the fixing stability of the wafer body 200 by the wafer clamping device 100.

[0071] If the internal and external pressure difference of the first negative pressure head is less than 0.8ΔP, the first negative pressure head needs to be controlled to continue to approach the top surface of the wafer body 200 ; if the internal and external pressure difference of the second negative pressure head is greater than 0.9ΔP, the first negative pressure head needs to be controlled to stay away from the top surface of the wafer body 200 .

[0072] Step 303 , obtaining the relative distance and relative angle difference between the second negative pressure head and the side surface of the wafer body 200 .

[0073] The wafer clamping device 100 further includes a goniometer, which is used to detect the relative angle difference between the axis of the second negative pressure head and the side circumference of the wafer body 200 .

[0074] Step 304 , control the second negative pressure head to move toward the side surface of the wafer body 200 and rotate the second negative pressure head. The second negative pressure head can be controlled to move in a direction parallel to the placement plane by the first power source 136 so as to contact the side surface of the wafer body 200 .

[0075] Step 305 , determining whether the internal and external pressure difference of the second negative pressure head is within a preset pressure difference range; if so, executing step 306 , if not, executing step 303 .

[0076] The side surface of the wafer body 200 may be a curved surface. In order to eliminate the error of the relative angle difference detected by the goniometer, it is necessary to determine whether the internal and external air pressure difference of the second negative pressure head is within a preset pressure difference range to achieve the best contact effect.

[0077] Step 306: Control the grabbing member 12 to move to the target location. During the detection process, the target location is the coordinate of the detection platform, and during the collection process, the target location is the coordinate of the material box.

[0078] The above description is only a preferred embodiment of the present invention and is not intended to limit the present invention. Any modifications, equivalent substitutions and improvements made within the spirit and principles of the present invention should be included in the protection scope of the present invention.

Claims

1. A wafer gripping device for moving a wafer body, characterized in that: include: Mounting bracket; A gripper, mounted at one end of the mounting bracket, the gripper is used to grip the wafer body, the gripper comprises a first clamping jaw and a second clamping jaw, the first clamping jaw and the second clamping jaw are both provided with a plurality of clamping parts, the relative distance between the plurality of clamping parts of the first clamping jaw and the plurality of clamping parts of the second clamping jaw is adjustable, the clamping part of the first clamping jaw comprises a first negative pressure head, and the clamping part of the second clamping jaw comprises a second negative pressure head; A first moving structure, mounted on the mounting bracket and in transmission connection with the grabbing member, the first moving structure being used to drive the grabbing member to have a movement direction along the extending direction of the circumferential plane of the mounting bracket; A second movable structure, mounted on the mounting bracket and in transmission connection with the first movable structure, the second movable structure having a movement direction of rotating along the circumferential direction of the mounting bracket; A third movable structure, mounted on the mounting bracket and in transmission connection with the second movable structure, the third movable structure having a reciprocating motion track along the axial direction of the mounting bracket; The control steps of the grabbing member include: Step 301, obtaining the relative distance between the first negative pressure head and the top surface of the wafer; Step 302, controlling the first negative pressure head to move toward the top surface of the wafer body until the internal and external pressure difference of the first negative pressure head is within a preset pressure difference range; Step 303, obtaining the relative distance and relative angle difference between the second negative pressure head and the side surface of the wafer body; Step 304, controlling the second negative pressure head to move toward the side circumference of the wafer body and rotating the second negative pressure head; Step 305, determining whether the internal and external pressure difference of the second negative pressure head is within a preset pressure difference range; if so, executing step 306, if not, executing step 303; Step 306: Control the grabbing member to move to the target location.

2. The wafer gripping device according to claim 1, characterized in that: The first movable structure has a accommodating cavity with an opening on one side, the bottom of the accommodating cavity is parallel to the circumferential plane of the mounting bracket, and a first guide rail is provided at the bottom of the accommodating cavity. The grabbing member is slidably assembled on the first guide rail and has a movement direction of extending or retracting the opening.

3. The wafer gripping device according to claim 2, characterized in that: The first guide rail includes a first sub-rail and a second sub-rail which are arranged in parallel with each other. The first clamp is slidably assembled with the first sub-rail, and the second clamp is slidably assembled with the second sub-rail. The first clamp is arranged on a side of the second clamp away from the bottom of the accommodating cavity, and the first clamp and the second clamp are limited to form a clamping space.

4. The wafer gripping device according to claim 3, characterized in that: The first moving structure further includes a first transmission assembly and a second transmission assembly disposed in the accommodating cavity; The first transmission assembly includes two first transmission wheels, a first transmission belt and a first power source, the first transmission wheel away from the opening is in transmission connection with the first power source, the first transmission belt is mounted on the two first transmission wheels, and the rotation direction of the first transmission belt is parallel to the extension direction of the first sub-rail; The second transmission assembly includes two second transmission wheels, a second transmission belt and a second power source, the second transmission wheel away from the opening is in transmission connection with the second power source, the second transmission belt is mounted on the two second transmission wheels, and the rotation direction of the second transmission belt is parallel to the extension direction of the second sub-rail; The first clamping jaw is transmission-connected to the first transmission belt, and the second clamping jaw is transmission-connected to the second transmission belt.

5. The wafer clamping device according to claim 3 or 4, characterized in that: Both ends of each clamping portion are chamfered.

6. The wafer gripping device according to claim 2, characterized in that: A laser sensor is disposed at the bottom of the accommodating cavity, and a sensing surface of the laser sensor is disposed toward the grasping member.

7. The wafer gripping device according to claim 1, characterized in that: The second movable structure includes a rotating motor that is transmission-connected to the first movable structure, the rotating direction of the rotating motor is along the circumferential direction of the mounting bracket, the rotating motor is provided with a mounting surface that is connected to the first movable structure, the mounting surface is provided with a leveling mechanism, the leveling mechanism is provided with at least three adjustment holes corresponding to the first movable structure, and each of the adjustment holes is arranged around a ring shape.

8. The wafer gripping device according to claim 7, characterized in that: The mounting surface is also provided with a central control reducer connected to the first moving structure.

9. The wafer gripping device according to claim 1, characterized in that: The third movable structure comprises a screw rod extending axially along the mounting bracket, and the second movable structure is slidably assembled on the screw rod.

10. The wafer gripping device according to claim 9, characterized in that: The third movable structure also includes two slide rails arranged on both sides of the screw rod, and the extension direction of the two slide rails is parallel to the screw rod. The second movable structure is provided with two sliding blocks slidably connected to the two slide rails in a one-to-one correspondence.

11. The wafer gripping device according to claim 1, characterized in that: The maximum pressure difference ΔP between the first negative pressure head or the second negative pressure head and the wafer body is calculated as ΔP=σmax(t 2 S) / (Ar 2 ), where r is the radius of the wafer body, t is the thickness of the wafer body, σmax is the maximum contact stress of the wafer body, A is the contact area of ​​the first negative pressure head or the second negative pressure head, S is the influence factor of the shape of the contact area of ​​the first negative pressure head or the second negative pressure head on the pressure distribution, when the shape of the contact area of ​​the first negative pressure head or the second negative pressure head is circular, S is 1, and the preset pressure difference range of the first negative pressure head or the second negative pressure head in contact with the wafer body is 0.8ΔP~0.9ΔP.

Images