Silicon component processing jig

Abstract

The present invention relates to the field of jig technology, and specifically to a silicon component processing jig, comprising: an electromagnetic suction cup, which can generate magnetic attraction when powered; an adapter plate, which is used for wax to adhere to the silicon component and can be magnetically adsorbed by the electromagnetic suction cup; a first flow channel for a fluid refrigerant to pass through is provided in the adapter plate, and the first flow channel includes a first input port and a first output port; the docking head has a second flow channel, and the second flow channel includes a second output port for docking with the first input port and a second input port for the fluid refrigerant to pass through; the docking head can move between a first position and a second position, and when the electromagnetic suction cup is powered on, the magnetic attraction component drives the docking head to move to the first position under the action of the magnetic attraction force of the electromagnetic suction cup, and when the electromagnetic suction cup is powered off, the electromagnetic suction cup releases the magnetic attraction force on the magnetic attraction component, and the docking head resets to the second position; the present invention can cool the adapter plate and the wax to prevent the wax from melting and causing the connection between the adapter plate and the silicon product to loosen.

Description

Technical Field

[0001] The present invention relates to the technical field of jigs, and in particular to a silicon component processing jig. Background Art

[0002] Silicon material is an important raw material in the semiconductor industry, and its processing technology directly affects the performance and quality of semiconductor devices. During the processing of silicon materials, such as polishing and grinding of silicon components, it is usually necessary to fix the silicon material. However, silicon materials are different from traditional metal workpieces. If they are clamped and fixed with traditional mechanical fixtures, it is easy to damage the surface of the silicon components. Related technologies use wax fixtures to fix silicon components, such as:

[0003] A transfer plate and an electromagnetic suction cup capable of being magnetically adsorbed are provided. First, wax is applied between the transfer plate and the silicon component. The transfer plate and the silicon component are then placed on a heating platform and heated to melt the wax between the transfer plate and the silicon component. The transfer plate and the silicon component are then removed from the heating platform and cooled to solidify the wax, thereby allowing the silicon component to adhere to the transfer plate under the adhesion of the wax. The transfer plate is then placed on the electromagnetic suction cup and energized to allow the electromagnetic suction cup to magnetically adsorb the transfer plate, thereby achieving wax adhesion and fixation of the silicon component.

[0004] The existing wax-sticking fixing bracket still has defects in practical applications. Specifically, when processing the silicon component after it is fixed, taking the polishing of the silicon component as an example, the silicon component will generate a lot of heat during the polishing process due to the friction between the silicon component and the polishing head. This heat may melt the wax between the adapter plate and the silicon component, thereby loosening the bonding fixation between the adapter plate and the silicon component, which is not conducive to the processing stability of the silicon component. Therefore, it needs to be improved. Summary of the Invention

[0005] In order to solve at least one of the technical problems mentioned in the background technology, an object of the present invention is to provide a silicon component processing tool.

[0006] To achieve the above object, the present invention provides the following technical solutions:

[0007] A silicon component processing jig, comprising:

[0008] Electromagnetic chuck, which can generate magnetic attraction when powered;

[0009] The adapter plate is used for wax to adhere to the silicon component and can be magnetically attracted by the electromagnetic chuck; the adapter plate is provided with a first flow channel for the flow of fluid refrigerant, the first flow channel including a first input port and a first output port;

[0010] The docking module includes a docking head and a magnetic member capable of being magnetically attracted by the electromagnetic chuck; the docking head has a second flow channel, the second flow channel includes a second output port for docking with the first input port and a second input port for introducing a fluid refrigerant;

[0011] The docking joint can move between a first position and a second position. In the first position, the second output port and the first input port are connected to each other; in the second position, the docking joint is separated from the adapter plate; the magnetic attraction component is linked to the docking joint, and can move relative to the electromagnetic suction cup under the action of the magnetic attraction force of the electromagnetic suction cup to drive the docking joint to move between the first position and the second position. When the electromagnetic suction cup is powered on, the magnetic attraction component drives the docking joint to move to the first position under the action of the magnetic attraction force of the electromagnetic suction cup. When the electromagnetic suction cup is powered off, the electromagnetic suction cup releases the magnetic attraction force on the magnetic attraction component, and the docking joint resets to the second position.

[0012] As an optional embodiment of the present invention, the first input port is located on the top surface of the adapter plate, and the second output port is located at the bottom of the docking head. The docking head moves vertically to move between a first position and a second position. In the first position, the docking head vertically abuts against the top surface of the adapter plate to axially connect the first input port and the second output port.

[0013] As an optional embodiment of the present invention, the electromagnetic chuck is provided with a support member, the support member comprising a horizontally arranged support surface for supporting the adapter plate and vertically spaced from the top surface of the electromagnetic chuck;

[0014] The magnetic element and the docking joint are relatively fixed and can both move vertically relative to the electromagnetic chuck; wherein the magnetic element is at least partially located directly above the electromagnetic chuck for adsorption by the electromagnetic chuck.

[0015] As an optional embodiment of the present invention, a vertical gap is set between the magnetic member and the docking joint for insertion of the adapter plate, wherein, in the second position, the magnetic member is not higher than the support surface in the vertical direction, and the docking joint is higher than the top surface of the adapter plate.

[0016] As an optional embodiment of the present invention, the docking module also includes a slide rail and a slider that can slide vertically relative to each other, and the docking head and the magnetic suction part are both fixed on the slider; an elastic component is provided between the slide rail and the slider, and the elastic component is used to provide elastic force. When the electromagnetic suction cup is powered off, the elastic force drives the slider to move upward to allow the docking head to enter the second position.

[0017] As an optional embodiment of the present invention, the docking module further includes a sealing ring, which is fixed to the bottom of the docking head and surrounds the second output port, or the sealing ring is fixed to the top surface of the adapter plate and surrounds the first input port.

[0018] As an optional embodiment of the present invention, the first input port includes an upper hole and a lower hole arranged coaxially, the upper end of the upper hole passes through the top surface of the adapter plate, and the lower end is connected to the lower hole; the radius of the upper hole is smaller than the radius of the lower hole to form a step surface between the upper hole and the lower hole; a vertically movable baffle is provided in the lower hole; an elastic component is also provided in the lower hole, and the elastic component is used to provide elastic force to drive the movable baffle to abut against the step surface to form a closure for the lower end of the upper hole; wherein, the radius of the movable baffle is smaller than the radius of the lower hole to form a gap between the peripheral wall of the movable baffle and the peripheral wall of the lower hole for the fluid refrigerant to pass through.

[0019] As an optional embodiment of the present invention, a radially extending protrusion is provided on the peripheral side of the movable baffle, and a guide groove is provided on the peripheral wall of the lower hole corresponding to the position of the protrusion; the protrusion is at least partially inserted into the guide groove and can slide vertically in the guide groove.

[0020] As an optional embodiment of the present invention, a vertically arranged ejector pin is fixed in the second output port, and the lower end of the ejector pin extends out of the bottom wall of the docking head to push the movable baffle downward to open the lower end of the lower hole when the first input port and the second output port are docked.

[0021] As an optional embodiment of the present invention, a positioning component is provided on the circumference of the electromagnetic suction cup, and the positioning component is used to position the adapter plate. When the adapter plate is positioned by the positioning component, the first input port and the second output port are coaxial in the vertical direction.

[0022] Compared with the existing technology, the advantages of adopting this solution are:

[0023] When using this solution, the silicon component is first adhered to the adapter plate with wax, and then the adapter plate is placed on the electromagnetic chuck. The electromagnetic chuck is powered on so that the electromagnetic chuck adsorbs the adapter plate, completing the fixation of the silicon component. The processing of the silicon component can then begin.

[0024] Based on this solution, it has the following advantages:

[0025] First, since a first flow channel is provided in the adapter plate, when processing the silicon component (such as polishing, grinding, etc.), a fluid refrigerant (such as cold air or coolant) is passed into the first flow channel. In this way, the fluid refrigerant can cool the adapter plate, and then cool the adapter plate and the silicon component, as well as the wax between the adapter plate and the silicon component, so that the wax will not melt due to excessive temperature, causing the connection between the adapter plate and the silicon component to loosen.

[0026] Secondly, in this solution, the first flow channel on the adapter plate is not directly connected to the fluid refrigerant, but is connected through a docking module, that is, the first input port of the first flow channel and the second output port of the second flow channel of the docking block are docked. When in use, the fluid refrigerant pipeline can be directly connected and fixed with the second input port of the second flow channel, so that the refrigerant can be input into the first flow channel through the second flow channel; such a design can separate the adapter plate and the refrigerant pipeline. For example, when the adapter plate needs to be placed on the heating platform for heating, the adapter plate can be directly removed without the need for the accompanying refrigerant pipeline, which is more convenient to use.

[0027] Finally, it is worth mentioning that in this embodiment, the docking and fixation of the second output port on the docking joint and the first input port on the first flow channel is carried out by relying on the magnetic force of the electromagnetic suction cup. In this way, after the adapter plate is placed on the electromagnetic suction cup and powered on, the magnetic attraction force generated by the electromagnetic suction cup can, on the one hand, adsorb and fix the adapter plate, and on the other hand, adsorb the magnetic attraction part to move, thereby moving the docking joint to the first position, so that the first input port and the second output port are docked and connected, thereby realizing the connection between the first flow channel and the second flow channel.

[0028] It can be seen that the connection between the first flow channel and the second flow channel does not require excessive operation by the staff, nor does it require an additional power source to drive the connection between the two; the connection between the first flow channel and the second flow channel can be controlled by simply controlling whether the electromagnetic suction cup is energized.

[0029] Similarly, when you need to remove the adapter plate, you only need to control the electromagnetic suction cup to cut off the power. At this time, the docking head will automatically reset to the second external position to separate from the adapter plate. In addition, at this time, the electromagnetic suction cup will not generate magnetic attraction to adsorb the adapter plate, so you can directly remove the adapter plate. BRIEF DESCRIPTION OF THE DRAWINGS

[0030] Figure 1 A schematic diagram of the structure of the invention;

[0031] Figure 2 This is a schematic diagram of the structure of the present invention when the adapter plate is installed;

[0032] Figure 3 Schematic top view of the adapter plate of the present invention;

[0033] Figure 4 Schematic diagram of the front structure of the docking module;

[0034] Figure 5 Schematic diagram of the back side structure of the docking module;

[0035] Figure 6 Schematic diagram of the bottom structure of the docking block;

[0036] Figure 7It is a partial cross-sectional view of the present invention (the docking block is in the first position);

[0037] Figure 8 for Figure 7 Enlarged view of part A in the middle;

[0038] Figure 9 It is a partial cross-sectional view of the present invention (the docking block is in the second position);

[0039] Figure 10 for Figure 9 Enlarged view of middle part B;

[0040] Figure 11 This is an exploded view of the movable baffle and the first input port. DETAILED DESCRIPTION

[0041] The following is an explanation and description of the technical solutions of the embodiments of the present invention in conjunction with the drawings of the embodiments of the present invention. However, the following embodiments are only preferred embodiments of the present invention and are not exhaustive. Based on the embodiments in the implementation manner, other embodiments obtained by those skilled in the art without creative work are all within the scope of protection of the present invention.

[0042] In the following description, terms such as "inside", "outside", "up", "down", "left", "right", etc. that indicate directions or positional relationships are only used to facilitate the description of the embodiments and simplify the description, and do not indicate or imply that the device or element referred to must have a specific direction, be constructed and operate in a specific direction. Therefore, they should not be understood as limiting the present invention.

[0043] Example 1

[0044] See also Figure 1-11 As shown, this embodiment provides a silicon component processing jig, including an electromagnetic chuck 2, an adapter plate 3, a docking module, etc., which are described in detail below:

[0045] like Figure 1 As shown, the electromagnetic chuck 2 is horizontally fixed on the processing platform 1. The electromagnetic chuck 2 can generate magnetic attraction when powered on, and the magnetic attraction disappears when the power is off.

[0046] The adapter plate 3 is made of a material that can be magnetically attracted by the electromagnetic chuck 2, such as alloy steel, iron, etc. The adapter plate 3 is mainly used as a silicon component (such as Figure 2 The adhesive carrier (shown in the middle M part) makes the silicon component adhere to the adapter plate 3 through wax, for example:

[0047] Place the silicon component and the adapter plate 3 on a heating platform for heating, and apply wax on the surface of the silicon component and the adapter plate 3. Under the heating of the heating platform, the wax is melted, and then the silicon component and the wax-coated surface of the adapter plate 3 are fitted together. Remove the adapter plate 3 and let it cool. After the wax solidifies, the silicon component can be adhered to the adapter plate 3.

[0048] Of course, it is also possible to apply wax on the surface of the silicon component and the adapter plate 3 in advance, and then stack the two and place them together on a heating platform for heating. During the heating process, the wax melts between the two, and then the adapter plate 3 is taken out for cooling. After the wax solidifies, the silicon component can be adhered to the adapter plate 3.

[0049] After the silicon component and the adapter plate 3 are adhered by wax, the adapter plate 3 is transferred to the electromagnetic chuck 2, and the adapter plate 3 is adsorbed by the magnetic attraction force generated by the electromagnetic chuck 2 when it is powered on, so as to achieve the fixation of the adapter plate 3. Figure 2 Status shown.

[0050] like Figure 3 As shown, the adapter plate 3 is provided with a first flow channel 31 for the fluid refrigerant to pass through. The fluid refrigerant (hereinafter referred to as refrigerant) here refers to a fluid medium used as a cooling medium, for example, it can be cold air or cooling liquid.

[0051] When the refrigerant flows in the first flow channel 31, it can cool the adapter plate 3, and then cool the silicon component and the wax between the silicon component and the adapter plate 3, to avoid the problem of the wax between the two melting due to excessive temperature during processing, resulting in a loose connection between the adapter plate 3 and the silicon component.

[0052] In order to increase the flow path of the refrigerant in the first flow channel 31 to improve the cooling effect, in this embodiment, Figure 3 As shown, the first flow channel 31 is preferably designed to be continuously bent in the adapter plate 3 to form a serpentine flow channel structure. One end of the first flow channel 31 serves as a first input port 3a for the refrigerant to flow in, and the other end serves as a first output port 3b for the refrigerant to flow out. Figure 2 As shown, the first output port 3 b can be opened on the side surface or the top surface of the adapter plate 3 .

[0053] The docking module is mainly used to achieve connectivity between the refrigerant supply pipeline and the first flow channel 31 . Taking the cold air provided by the air cooler as the refrigerant as an example, the first flow channel 31 is connected to the air cooler outlet pipeline through the docking module, thereby introducing the cold air into the first flow channel 31 .

[0054] In this embodiment, the docking module and the adapter plate 3 are two independent parts. Figure 1 and Figure 2As shown, the docking module includes a docking head 41 and a magnetic member 42 that can be magnetically attracted by the electromagnetic chuck 2. The magnetic member 42 can be made of a material that can be attracted by magnetic force, such as iron.

[0055] like Figure 7-10 As shown, the docking joint 41 has a second flow channel 411, and the second flow channel 411 includes a second output port 402 for docking with the first input port 3a and a second input port 401 for introducing fluid refrigerant. The output end of the refrigerant supply pipeline is fixedly connected to the second input port 401, so that the refrigerant output from the refrigerant supply pipeline enters the second flow channel 411 from the second input port 401, and finally flows out from the second output port 402 into the first flow channel 31.

[0056] The docking joint 41 can move between a first position and a second position:

[0057] The butt joint 41 is in the first position, as shown in FIG. Figure 7 and Figure 8 As shown, the second output port 402 is connected to the first input port 3a;

[0058] The butt joint 41 is in the second position, as shown in FIG. Figure 9 and Figure 10 As shown, the docking joint 41 is separated from the adapter plate 3, that is, the docking joint 41 and the adapter plate 3 are separated from each other.

[0059] The magnetic member 42 and the docking head 41 are interconnected. Specifically, the magnetic member 42 can move relative to the electromagnetic chuck 2 under the magnetic attraction of the electromagnetic chuck 2 to drive the docking head 41 to move between the first position and the second position. Specifically, it is defined as:

[0060] like Figure 8 As shown, when the electromagnetic chuck 2 is energized, the electromagnetic chuck 2 generates a magnetic attraction force, and the magnetic attraction member 42 drives the docking head 41 to move to the first position under the action of the magnetic attraction force of the electromagnetic chuck 2, thereby achieving the connection between the first input port 3a and the second output port 402, that is, connecting the first flow channel 31 and the second flow channel 411.

[0061] like Figure 10 As shown, when the electromagnetic chuck 2 is powered off, the magnetic attraction of the electromagnetic chuck 2 disappears, and the electromagnetic chuck 2 releases the magnetic attraction to the magnetic element 42 , and then the docking head 41 is reset to the second position, so that the docking head 41 is separated from the adapter plate 3 .

[0062] It can be seen that in this embodiment, the refrigerant supply pipeline and the first flow channel 31 of the adapter plate 3 are indirectly connected through the docking module, and the refrigerant supply pipeline is not directly fixed to the adapter plate 3. In this way, when the adapter plate 3 needs to be removed for heating, the adapter plate 3 can be directly removed without the need for a refrigerant supply pipeline, which is more convenient to use.

[0063] Finally, it is worth mentioning that in this embodiment, the docking and fixation of the second output port 402 on the docking joint 41 and the first input port 3a on the first flow channel 31 is carried out by relying on the magnetic force of the electromagnetic suction cup 2. In this way, after the adapter plate 3 is placed on the electromagnetic suction cup 2 and energized, the magnetic attraction force generated by the electromagnetic suction cup 2 has two functions. First, it can adsorb and fix the adapter plate 3, and second, it can adsorb the magnetic attraction part 42 to move, thereby making the docking joint 41 move to the first position, so that the first input port 3a and the second output port 402 are docked and connected, thereby realizing the connection between the first flow channel 31 and the second flow channel 411.

[0064] It can be seen that the connection between the first flow channel 31 and the second flow channel 411 does not require excessive operation by the staff, nor does it require an additional power source to drive the connection between the two (the magnetic suction member 42 and the adapter plate 3 share the electromagnetic suction cup 2); the connection between the first flow channel 31 and the second flow channel 411 can be controlled by simply controlling whether the electromagnetic suction cup 2 is energized.

[0065] Similarly, when the adapter plate 3 needs to be removed, it is only necessary to control the electromagnetic suction cup 2 to cut off the power. At this time, the docking head 41 will automatically reset to the second external position to separate from the adapter plate 3. In addition, at this time, the electromagnetic suction cup 2 will not generate magnetic attraction to adsorb the adapter plate 3, so the adapter plate 3 can be directly removed.

[0066] In this embodiment, preferably, the docking head 41 moves between the first position and the second position by vertical movement. The vertical direction claimed in this embodiment can also be understood as the height direction of the electromagnetic chuck 2 (that is, the thickness direction of the electromagnetic chuck 2).

[0067] like Figure 2 As shown, the first input port 3a is located on the top surface of the adapter plate 3 and faces vertically upwards, as shown in FIG. Figure 6 As shown, the second outlet 402 is located at the bottom of the docking head 41 and faces vertically downward.

[0068] The butt joint 41 is in the first position, as shown in FIG. Figure 8 As shown, the docking joint 41 is vertically abutted against the top surface of the adapter plate 3 to connect the first input port 3a and the second output port 402 axially (also understood as vertically), and the first input port 3a and the second output port 402 are coaxially arranged.

[0069] In addition, in order to improve the sealing performance of the joint between the first input port 3a and the second output port 402, a sealing ring 40 is further provided in this embodiment. Figure 6 As shown, the sealing ring 40 is fixed on the bottom of the docking head 41 and surrounds the second output port 402 , or the sealing ring 40 is fixed on the top surface of the adapter plate 3 and surrounds the first input port 3 a .

[0070] In this way, when the docking joint 41 moves downward and abuts against the adapter plate 3, the sealing ring 40 is pressed between the docking joint 41 and the top surface of the adapter plate 3 to form a seal; it is worth noting that the vertical projection of the first input port 3a and the vertical projection of the second output port 402 are both located within the vertical projection range of the sealing ring 40, and the three are coaxially arranged.

[0071] In addition, in this embodiment, Figure 1 and Figure 2 As shown, the electromagnetic suction cup 2 is provided with a supporting member, and the supporting member includes a horizontally arranged supporting surface 211 for supporting the adapter plate 3 and vertically spaced from the top surface of the electromagnetic suction cup 2. For example, in this embodiment, the supporting member includes a plurality of supporting bars 21 fixed on the electromagnetic suction cup 2 and arranged parallel to each other, and adjacent support bars 21 are spaced apart, and the top surfaces of each support bar 21 are flush to form the supporting surface 211. When fixing the adapter plate 3, the adapter plate 3 is directly placed on the supporting surface 211 and supported by the support bars 21, and then the electromagnetic suction cup 2 is energized to adsorb the adapter plate 3.

[0072] The magnetic member 42 and the docking head 41 remain relatively fixed and can both move vertically relative to the electromagnetic chuck 2, that is, the magnetic member 42 and the docking head 41 move vertically synchronously. For example, in this embodiment:

[0073] like Figure 1 、 Figure 4 and Figure 5 As shown, the docking module also includes a slide rail 44 and a slider 43 that can slide vertically relative to each other. The slide rail 44 is vertically fixed on the processing platform 1 and is located on the front side of the electromagnetic suction cup 2. The specific structure of the slide rail 44 can be that a vertically extending slide groove 441 is provided on the slide rail 44, and the slider 43 is slidably set in the slide groove 441.

[0074] The docking joint 41 and the magnetic member 42 are both fixed on the slider 43 and are spaced apart in the vertical direction; thus, under the connection of the slider 43 , the magnetic member 42 and the docking joint 41 can remain relatively fixed.

[0075] In addition, if Figure 1 As shown, the magnetic component 42 is at least partially located directly above the electromagnetic suction cup 2 for adsorption by the electromagnetic suction cup 2, that is, the magnetic component 42 extends toward one side of the electromagnetic suction cup 2 to directly above the electromagnetic suction cup 2, serving as the part of the electromagnetic suction cup 2 that is magnetically attracted. In this way, after the electromagnetic suction cup 2 is energized to generate a magnetic force, the magnetic component 42 will be attracted to move downward under the action of the magnetic force, thereby driving the slider 43 and the docking joint 41 to move downward together, and finally the docking joint 41 will abut against the top surface of the adapter plate 3 and enter the first position, so that the first input port 3a and the second output port 402 are connected to each other, thereby realizing the connection between the first flow channel 31 and the second flow channel 411.

[0076] Combine Figure 5and Figure 7 As shown, the second flow channel 411 passes through the slider 43, and a connecting pipe 410 connected to the second flow channel 411 is fixed on the back side of the slider 43. The end side of the connecting pipe 410 serves as the second input port 401 of the second flow channel 411 to connect with the refrigerant supply pipeline.

[0077] Since the connecting pipe 410 needs to move up and down with the slider 43, in this embodiment, Figure 5 As shown, a through opening 443 extending vertically and communicating with the slide groove 441 is opened on the back side of the slide rail 44 , and the communicating pipe 410 passes through the through opening 443 to be connected to the refrigerant supply pipeline.

[0078] In addition, an elastic component is provided between the slide rail 44 and the slider 43, and the elastic component is used to provide elastic force. When the electromagnetic suction cup 2 is powered off, the elastic force drives the slider 43 to move upward so that the docking joint 41 enters the second position. In this way, when the adapter plate 3 needs to be removed, the electromagnetic suction cup 2 can be powered off to eliminate the magnetic attraction of the electromagnetic suction cup 2. Without the adsorption of the magnetic attraction, the elastic component will drive the slider 43 to move upward, and then drive the magnetic attraction part 42 and the docking joint 41 to move upward together until the docking joint 41 enters the second position, at which time the docking joint 41 is separated from the adapter plate 3.

[0079] The specific structure of the elastic component is as follows: Figure 4 As shown, the elastic assembly includes a guide rod 451, a top plate 453 fixed to the top of the guide rod 451, and a first spring 452 mounted on the guide rod 451. The guide rod 451 is vertically and movably mounted on the slide rail 44. Its lower end extends into the slide groove 441 and is fixedly connected to the slider 43, while its upper end extends upward from the upper part of the slide rail 44 and is fixed to the top plate 453. One end of the first spring 452 abuts against the bottom wall of the top plate 453, and the other end abuts against the upper wall of the slide rail 44. In this way, when the electromagnetic chuck 2 is powered off, the first spring 452 pushes the top plate 453 upward, thereby pulling the guide rod 451 and the slider 43 upward, ultimately causing the docking head 41 to enter the second position.

[0080] In order to keep the docking joint 41 in the second position when the electromagnetic chuck 2 is powered off, a limiter 442 for limiting the upper position of the slider 43 is provided between the slide rail 44 and the slider 43. Specifically, Figure 4 and Figure 9 As shown, the limit member 442 is fixed on the side wall of the slide groove 441 and is located above the slider 43. When the first spring 452 pulls the slider 43 to the position of the limit member 442 (that is, when the top wall of the slider 43 is against the bottom wall of the limit member 442), the docking head 41 is in the second position.

[0081] In addition, in order to ensure that the first input port 3a and the second output port 402 are aligned before docking, in this embodiment, a positioning component is provided on the periphery of the electromagnetic chuck, such as Figure 1 and Figure 2 As shown, the positioning assembly is used to position the adapter plate 3. When the adapter plate 3 is positioned by the positioning assembly, the first input port 3a and the second output port 402 are in a coaxial state;

[0082] The positioning assembly specifically includes side positioning blocks 51 located on the left and right sides of the electromagnetic chuck 2, and a front positioning block 52 located on the front side of the electromagnetic chuck 2. Both the side positioning blocks 51 and the front positioning blocks 52 are fixed to the processing platform 1. Thus, the adapter plate 3 is confined between the left and right side positioning blocks 51 in the left-right direction and positioned forward by the front positioning blocks 52. Thus, the front end of the adapter plate 3 is positioned by the front positioning blocks 52, and the sides are positioned by the side positioning blocks 51. This positions the first input port 3a directly below the second output port 402, facilitating subsequent docking.

[0083] It is worth noting that the side wall of the slide rail 44 close to the electromagnetic suction cup 2 is flush with the side wall of the front positioning block 52 close to the electromagnetic suction cup 2, or the side wall of the slide rail 44 close to the electromagnetic suction cup 2 is farther away from the electromagnetic suction cup 2 than the side wall of the front positioning block 52 close to the electromagnetic suction cup 2, so as to ensure that the existence of the slide rail 44 will not interfere with the positioning of the adapter plate 3 by the front positioning block 52.

[0084] In addition, a vertical gap is set between the magnetic component 42 and the docking joint 41 to allow the adapter plate 3 to be inserted horizontally. In this embodiment, when installing the adapter plate 3, the adapter plate 3 is slid from the rear side of the electromagnetic suction cup 2 (that is, the side opposite to the front positioning block 52) along the top surface of the support bar 21 to the side close to the front positioning block 52 and finally abuts against the front positioning block 52 for installation. At this time, the adapter plate 3 is located between the magnetic component 42 and the docking joint 41.

[0085] Among them, in the second position, such as Figure 9 The magnetic member 42 does not extend vertically above the support surface 211. This arrangement ensures that when the adapter plate 3 is placed on the support bar 21, the presence of the magnetic member 42 does not interfere with the horizontal forward insertion of the adapter plate 3. In other words, if the magnetic member 42 extends above the support surface 211, then when the adapter plate 3 slides against the top surface of the support bar 21, the protruding portion of the magnetic member 42 will block the sliding of the adapter plate 3.

[0086] Similarly, in the second position, if Figure 9 As shown, the bottom surface of the docking joint 41 is higher than the top surface of the adapter plate 3 to avoid interference of the docking joint 41 when the adapter plate 3 is inserted between the magnetic element 42 and the docking joint 41 .

[0087] Example 2

[0088] In Example 1, since the first input port 3a is provided on the top surface of the adapter plate 3, and the top surface of the adapter plate 3 needs to be coated with wax, the wax may flow into the first input port 3a during the wax coating process, and then block the first flow channel 31 after the wax solidifies. Therefore, this embodiment makes further improvements on the basis of Example 1:

[0089] like Figure 7-10 As shown, the first input port 3a includes an upper hole 311 and a lower hole 312 arranged coaxially. The upper end of the upper hole 311 passes through the top surface of the adapter plate 3, and the lower end is connected to the lower hole 312. The lower hole 312 is connected to the flow channel part of the first flow channel 31.

[0090] The radius of the upper hole 311 is smaller than that of the lower hole 312 to form a step surface between the upper hole 311 and the lower hole 312 ; a vertically movable baffle 32 is provided in the lower hole 312 , and the movable baffle 32 is mainly used to close the lower end of the upper hole 311 .

[0091] In order to guide the vertical movement of the movable baffle 32, in this embodiment, as shown in FIG. Figure 8 and Figure 11 As shown, a radially extending protrusion 321 is provided on the circumferential side of the movable baffle 32. For example, in this embodiment, two protrusions 321 are provided, which are located on opposite sides of the movable baffle 32. A vertically extending guide groove 322 is provided on the circumferential wall of the lower hole 312 at the position corresponding to the protrusion 321. The protrusion 321 is at least partially inserted into the guide groove 322 and can slide vertically in the guide groove 322. Under the cooperation of the protrusion 321 and the guide groove 322, the movable baffle 32 is limited to move only in the vertical direction.

[0092] The lower hole 312 is further provided with an elastic member, which is used to provide elastic force to drive the movable baffle 32 to abut against the step surface 310 to form a seal on the lower end of the upper hole 311 (such as Figure 10 The state shown), specifically, the elastic member includes a second spring 323, which is vertically arranged in the lower hole 312, one end of which is against or fixed to the bottom of the movable baffle 32, and the other end is against or fixed to the lower wall of the lower hole 312. Under the elastic force of the second spring 323, the movable baffle 32 blocks the lower end of the upper hole 311, thereby closing the upper hole 311, thereby effectively reducing the risk of wax flowing from the first input port 3a into the first flow channel 31 and blocking the first flow channel 31.

[0093] It is worth noting that the radius of the movable baffle 32 is smaller than the radius of the lower hole 312 so as to form a gap between the peripheral wall of the movable baffle 32 and the peripheral wall of the lower hole 312 for the fluid refrigerant to pass through.

[0094] When the refrigerant is introduced, after the refrigerant rushes out downward from the second output port 402, it will generate a downward impact on the movable 32, thereby pushing the movable baffle 32 to overcome the elastic force of the second spring 323 and move downward, so that the refrigerant will flow between the movable baffle 32 and the lower end of the upper hole 311, and then flow into the lower hole 312 from all sides of the movable baffle 32, and finally enter the first flow channel 31 for cooling.

[0095] After the refrigerant is stopped, the movable baffle 32 automatically returns to its original position and closes the upper hole 311 under the elastic force of the second spring 323. It can be seen that the opening and closing of the upper hole 311 do not require manual operation, and can be automatically performed according to whether the refrigerant is introduced.

[0096] Example 3

[0097] In Example 2, the vertical movement of the movable baffle 32 is mainly driven by the impact of the refrigerant to close or open the upper hole 311. This places high demands on the impact force of the refrigerant, that is, the refrigerant must have sufficient pressure. In this regard, this embodiment is further improved on the basis of Example 2:

[0098] like Figure 6 and Figure 10 As shown, a vertically arranged ejector pin 6 is fixed in the second output port 402, and the ejector pin 6 is inserted into the second input port 401, wherein the upper end of the ejector pin 6 is fixed on the docking head 41, and the lower end of the ejector pin 6 extends out of the bottom wall of the docking head 41 to push the movable baffle 32 downward to open the lower end of the lower hole 312 when the first input port 3a and the second output port 402 are docked.

[0099] In this way, when the docking head 41 moves downward for docking, the ejector pin 6 moves downward together. When the lower end of the ejector pin 6 contacts the movable baffle 32 and continues to move downward, the ejector pin 6 pushes the movable baffle 32 downward, so that the movable baffle 32 opens the lower end of the upper hole 311 (such as Figure 8 On the contrary, when the docking head 41 moves upward, the movable baffle 32 can automatically reset under the elastic force of the second spring 323 (as shown in FIG. Figure 10 As shown in the state), such a setting does not require too high a force for the refrigerant, and the movement of the movable baffle 32 is mainly driven by the ejector pin 6.

[0100] It will be apparent to those skilled in the art that the present invention is not limited to the details of the exemplary embodiments described above and that the invention can be embodied in other specific forms without departing from the spirit or essential characteristics of the invention. Therefore, the embodiments should be considered in all respects as illustrative and non-restrictive, and the scope of the invention is defined by the appended claims rather than the foregoing description, and it is intended that all variations that come within the meaning and range of equivalents of the claims be embraced therein.

Claims

1. A silicon component processing jig, characterized in that: include: Electromagnetic chuck, which can generate magnetic attraction when powered; The adapter plate is used for wax to adhere to the silicon component and can be magnetically attracted by the electromagnetic chuck; the adapter plate is provided with a first flow channel for the flow of fluid refrigerant, the first flow channel including a first input port and a first output port; The docking module includes a docking head and a magnetic member capable of being magnetically attracted by the electromagnetic chuck; the docking head has a second flow channel, the second flow channel includes a second output port for docking with the first input port and a second input port for introducing a fluid refrigerant; The docking head is movable between a first position and a second position. In the first position, the second output port and the first input port are connected and communicated with each other. In the second position, the docking head is detached from the adapter plate. The magnetic element is linked to the docking head and is movable relative to the electromagnetic chuck under the magnetic attraction of the electromagnetic chuck to drive the docking head to move between the first position and the second position. When the electromagnetic chuck is powered on, the magnetic element drives the docking head to move toward the first position under the magnetic attraction of the electromagnetic chuck. When the electromagnetic chuck is powered off, the electromagnetic chuck releases the magnetic attraction of the magnetic element, and the docking head returns to the second position. The first input port is located on the top surface of the adapter plate, and the second output port is located at the bottom of the docking head. The docking head is vertically movable between a first position and a second position. In the first position, the docking head vertically abuts against the top surface of the adapter plate to axially connect the first input port and the second output port. The electromagnetic chuck is provided with a support member, the support member comprising a horizontally arranged support surface for supporting the adapter plate and vertically spaced from the top surface of the electromagnetic chuck; The magnetic member and the docking head are relatively fixed and can both move vertically relative to the electromagnetic chuck; wherein the magnetic member is at least partially located directly above the electromagnetic chuck for adsorption by the electromagnetic chuck; The magnetic member and the docking joint are vertically spaced apart to allow the adapter plate to be inserted, wherein in the second position, the magnetic member is not vertically higher than the support surface, and the docking joint is higher than the top surface of the adapter plate; The docking module also includes a slide rail and a slider that can slide vertically relative to each other, and the docking head and the magnetic attraction part are both fixed on the slider; an elastic component is provided between the slide rail and the slider, and the elastic component is used to provide elastic force. When the electromagnetic suction cup is powered off, the elastic force drives the slider to move upward to allow the docking head to enter the second position.

2. A silicon component processing jig according to claim 1, characterized in that: The docking module further includes a sealing ring, which is fixed to the bottom of the docking head and surrounds the second output port, or the sealing ring is fixed to the top surface of the adapter plate and surrounds the first input port.

3. A silicon component processing jig according to claim 1, characterized in that: The first input port includes an upper hole and a lower hole arranged coaxially, the upper end of the upper hole passes through the top surface of the adapter plate, and the lower end is connected to the lower hole; the radius of the upper hole is smaller than the radius of the lower hole to form a step surface between the upper hole and the lower hole; a vertically movable baffle is provided in the lower hole; an elastic component is also provided in the lower hole, and the elastic component is used to provide elastic force to drive the movable baffle to abut against the step surface to form a closure for the lower end of the upper hole; wherein, the radius of the movable baffle is smaller than the radius of the lower hole to form a gap between the peripheral wall of the movable baffle and the peripheral wall of the lower hole for the fluid refrigerant to pass through.

4. A silicon component processing jig according to claim 3, characterized in that: A radially extending convex portion is provided on the peripheral side of the movable baffle, and a guide groove is provided on the peripheral wall of the lower hole at a position corresponding to the convex portion; the convex portion is at least partially inserted into the guide groove and can slide vertically in the guide groove.

5. The silicon component processing jig according to claim 3, characterized in that: A vertically arranged ejector pin is fixed in the second output port, and the lower end of the ejector pin extends out of the bottom wall of the docking head for pushing the movable blocking piece downward to open the lower end of the lower hole when the first input port and the second output port are docked.

6. The silicon component processing jig according to claim 1, characterized in that: A positioning assembly is provided on the peripheral side of the electromagnetic chuck, and the positioning assembly is used to position the adapter plate. When the adapter plate is positioned by the positioning assembly, the first input port and the second output port are in a coaxial state in the vertical direction.

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