A thermoelectric test auxiliary device based on integrated chip

Abstract

The present invention discloses a thermoelectric test auxiliary equipment based on an integrated chip, which relates to the field of thermoelectric performance detection technology, including a support structure, which includes a chip body, a detection mechanism is provided on the right side of the chip body, a dust removal mechanism is provided on the left side of the chip body, and a conveying mechanism is provided at the front end of the chip body. The detection mechanism includes an electrical detector for observing and recording multiple detection data, and the electrical detector is located on the front and back sides of the chip body. The detection mechanism is used to perform surface heating on the chip body and detect the thermoelectric performance. The device can detect the thermoelectric performance of the integrated chip, which is more helpful for the operator to understand the performance of the chip at high temperature, making the use process smoother, and can also timely discover potential problems, such as overheating failure. Discovery in a short time can greatly reduce the risk of product failure. The test results can provide engineers with important reference data to help optimize chip design and heat dissipation system.

Description

Technical Field

[0001] The present invention relates to the technical field of thermoelectric performance detection, and in particular to thermoelectric test auxiliary equipment based on an integrated chip. Background Art

[0002] Integrated chip thermoelectric testing refers to the process of testing the thermoelectric parameters of integrated circuit chips. Thermoelectric testing is a very important testing method used to evaluate the performance and stability of integrated circuit chips in high temperature environments and understand how the chips work in high temperature environments. Thermoelectric testing is an important method for evaluating the performance and stability of integrated circuit chips in high temperature environments, which can help engineers better design and manufacture integrated chip products.

[0003] However, the existing chip thermoelectric test auxiliary equipment still has the following defects:

[0004] First, when testing the thermoelectric properties of existing integrated chips, most still require manual connection and disconnection of the chip's electronic components. Manual connection and disconnection is a time-consuming process with low speed and efficiency, which prolongs the testing cycle and reduces overall production efficiency. Errors such as poor connections and misoperation may occur during manual operation, leading to inaccurate test results and even affecting the chip's functionality and performance. Furthermore, it is difficult to adapt to changes in production line speeds or meet different testing requirements.

[0005] Secondly, there are many integrated circuits that need to be tested, and they will be arranged in a long line for status testing. This process requires that the testing equipment maintain continuity at all times. If the spacing is too far or too close, improper chip spacing will cause safety problems during the operation of the testing equipment, such as damage caused by collision between equipment components or damage of chips during testing due to poor contact. If the spacing between chips is too far, the testing equipment will need to spend more time moving between chips, resulting in reduced testing efficiency. Conversely, if the chips are too close, they may be squeezed together for testing, which may lead to missed tests and make the product unqualified.

[0006] Finally, before testing the chip, if there is a lot of dust and impurities attached to the chip and they are not removed, the dust and impurities may affect the electrical performance of the chip, resulting in inaccurate test results, thereby affecting the judgment of chip performance. It may also block the chip's heat dissipation channel, affecting its heat dissipation efficiency, causing the chip to overheat, thereby affecting performance life and test results, and at the same time causing chip defects or short circuits, increasing the chip's failure rate. Summary of the Invention

[0007] (1) Technical problems solved

[0008] In view of the above-mentioned shortcomings of the prior art, the present invention provides a thermoelectric test auxiliary device based on an integrated chip, which can effectively solve the problem of teaching auxiliary marking in the prior art.

[0009] (2) Technical solution

[0010] To achieve the above objectives, the present invention is implemented through the following technical solutions:

[0011] The present invention discloses a thermoelectric test auxiliary device based on an integrated chip, comprising a support structure, wherein the support structure comprises a chip body, a detection mechanism is provided on the right side of the chip body, a dust removal mechanism is provided on the left side of the chip body, and a conveying mechanism is provided at the front end of the chip body;

[0012] The detection mechanism includes an electrical detector for observing and recording a plurality of detection data, the electrical detector is located on the front and rear sides of the chip body, and the detection mechanism is used to perform surface heating and thermoelectric performance detection operations on the chip body;

[0013] The transport mechanism includes a second swing rod that is pushed by the chip body to control the stop and passage of subsequent chips. The second swing rod is located on the right side of the chip body. The transport mechanism is used to remove dust and impurities on the surface of the chip body that may affect the thermoelectric performance test results.

[0014] The dust removal mechanism includes a brush head for wiping and removing dust from the chip after the cleaning substance has been sprayed. The brush head is located above the chip body. The dust removal mechanism is used to continuously transport the chip body that is about to undergo thermoelectric performance testing.

[0015] Furthermore, the front and rear ends of the chip body are fixedly connected with interfaces, the bottom end of the interface is fixedly connected with a square plate, the bottom end of the square plate is provided with a resistance rod, the right side of the square plate is fixedly connected with a resistance rod, the bottom end of the square plate is provided with a conveyor belt, the width of the conveyor belt is adapted to the resistance rod, and the bottom end of the conveyor belt is rotatably connected to a bracket.

[0016] Furthermore, the detection mechanism includes a heating furnace, which is located on the right side of the square plate. The front and back sides of the heating furnace are fixedly connected with spring 1, and the two springs are fixedly connected with cross bar 1 on the side facing the chip body, and the cross bar 1 is fixedly connected with cross bar 2 on the side facing the chip body.

[0017] Furthermore, a plug is fixedly connected to the side of the second crossbar facing the chip body, and the side of the plug away from the chip body passes through the second crossbar and is fixedly connected to the electrical tester, and the spacing of the plugs is adapted to the interface.

[0018] Furthermore, a concave plate is provided on the right side of the cross bar 1, and the concave plate and cross bar 1 and cross bar 2 are all in conflict with each other. The side of the concave plate away from the chip body is fixedly connected to spring 2, and the end of the spring 2 away from the chip body is fixedly connected to the heating furnace.

[0019] Furthermore, the conveying mechanism includes a partition plate located in front of the square plate, four round rods are fixedly connected to the surface of the partition plate, the round rods are distributed at right angles, the bottom end of the partition plate is rotatably connected to the central axis, and the bottom surface of the partition plate is fixedly connected to the chassis through the central axis.

[0020] Furthermore, four grooves are provided on the outer side of the chassis, a spring three is fixedly connected to the side of the central axis facing the chip body, a swing rod one is fixedly connected to the end of the spring three away from the central axis, and the end of the swing rod one facing the chip body is in conflict with the groove.

[0021] Furthermore, the first swing arm is fixedly connected to a long shaft, and one end of the long shaft away from the conveying mechanism is rotatably connected to the second swing arm.

[0022] Furthermore, the dust removal mechanism includes a shell, which is located in the middle of the chip body, and four cleaning agents are fixedly connected to the front and back sides of the inner surface of the shell, and the four top ends are fixedly connected to push buttons, and the push button is fixedly connected to the end facing the chip body with a push rod.

[0023] Furthermore, the push rod is located at the front and rear sides of the conveyor belt, the length of the push rod is adapted to the square plate, and the top end of the shell is rotatably connected to the brush head.

[0024] (3) Beneficial effects

[0025] Compared with the prior art, the technical solution provided by the present invention has the following beneficial effects:

[0026] 1. By providing a spring 1, a crossbar 1 and a concave plate, the movement of the resistance rod pushes the concave plate forward to release the positioning restriction on the crossbar 1. The crossbar 1 pops out toward the chip body under the action of the spring 1, the plug is inserted into the interface, and the data is read by the electrical tester. Finally, the resistance rod continues to move to push the concave plate until the concave plate leaves the resistance rod, the concave plate returns to its original position, and causes the crossbar 2 to move away from the chip body to restore the positioning restriction. The device can use a non-manual method for the detection of integrated chips, that is, automatic connection and automatic disconnection of electronic components, which can make the entire test process less time-consuming, effectively improve speed and efficiency, shorten the detection cycle, and better avoid errors, poor contact and other misoperations that may be caused by manual detection, so that the detection results are more accurate. In addition, the fully automatic method can also adapt to changes in production line speed and cope with various detection requirements.

[0027] 2. By providing a round rod, a swing rod 1 and a swing rod 2, the swing rod 2 swings after being pushed by the chip body that has been tested, and the swing rod 1 connected to the other side swings, and releases the positioning restriction on the chassis, so that it rotates under the push of the subsequent chip body, and the round rod also rotates to turn the originally blocked chip body into a pass. The device can automatically sort, block and pass multiple chips to be tested, effectively improving the speed and efficiency of chip testing, while avoiding the risks of chip falling and scratching caused by different manual technical levels. In addition, it can also prevent accidents such as burns and electric shocks, avoid erroneous operations caused by negligence, avoid affecting the test results and damaging the chip, and avoid the phenomenon of missed detection due to chips being too far or too close.

[0028] 3. By providing a press button, a push rod and a brush head, the resistance rod pushes the two push rods to both sides respectively through the arc-shaped rounded corners on both sides during the movement, and the push rod squeezes the fixed press button. Pressing the press button will spray the detergent in the press button through the nozzle above to the chip body, and the brush head is used for dust removal. The device can remove dust and impurities on the surface of the chip, avoid reducing the electrical performance of the chip, make the test results more accurate, prevent affecting the judgment of performance, and avoid clogging the heat dissipation device of the chip, effectively improve its efficiency, extend its life and make the test results more accurate, while preventing circuit defects or short circuits and reducing its failure rate. BRIEF DESCRIPTION OF THE DRAWINGS

[0029] To more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the following briefly introduces the drawings required for use in the embodiments or the description of the prior art. Obviously, the drawings described below are only some embodiments of the present invention. Those skilled in the art can also derive other drawings based on these drawings without inventive effort.

[0030] Figure 1 It is a front perspective structural diagram of the present invention;

[0031] Figure 2 It is a side perspective structural diagram of the present invention;

[0032] Figure 3 It is a top-down perspective structural diagram of the present invention;

[0033] Figure 4 It is a right-side perspective structural diagram of the present invention;

[0034] Figure 5 For the present invention Figure 1 A local enlarged structural diagram at point A in the middle;

[0035] Figure 6 For the present invention Figure 2 A local enlarged structural diagram at point B in the middle;

[0036] Figure 7 It is a top-view cross-sectional three-dimensional structural diagram of the present invention;

[0037] Figure 8 This is a three-dimensional structural diagram of the center plate and the interference rod in the present invention;

[0038] Figure 9 For the present invention Figure 8 A partial enlarged structural diagram at point C in the middle;

[0039] Figure 10 It is a three-dimensional structural diagram of the detection mechanism in the present invention;

[0040] Figure 11 This is a three-dimensional structural diagram of the detection mechanism of the present invention from another perspective;

[0041] Figure 12 This is an exploded view of the detection mechanism of the present invention;

[0042] Figure 13 It is a three-dimensional structural diagram of the conveying mechanism in the present invention.

[0043] The reference numerals in the figure represent, respectively, 100, support structure; 101, chip body; 102, interface; 103, square plate; 104, resistance rod; 105, conveyor belt; 106, bracket;

[0044] 200, testing mechanism; 201, heating furnace; 202, spring 1; 203, crossbar 1; 204, crossbar 2; 205, electrical tester; 206, plug; 207, concave plate; 208, spring 2;

[0045] 300, transport mechanism; 301, partition plate; 302, round rod; 303, central axis; 304, chassis; 305, groove; 306, spring three; 307, swing arm one; 308, long axis; 309, swing arm two;

[0046] 400, dust removal mechanism; 401, housing; 402, cleaning agent; 403, push button; 404, push rod; 405, brush head. DETAILED DESCRIPTION

[0047] To make the purpose, technical solutions, and advantages of the embodiments of the present invention more clear, the technical solutions in the embodiments of the present invention will be clearly and completely described below in conjunction with the accompanying drawings of the embodiments of the present invention. Obviously, the described embodiments are only part of the embodiments of the present invention, not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without making any creative efforts shall fall within the scope of protection of the present invention.

[0048] The present invention will be further described below with reference to the embodiments.

[0049] This embodiment is a thermoelectric test auxiliary device based on an integrated chip, such as Figures 1-13 As shown, it includes a support structure 100, which includes a chip body 101. A detection mechanism 200 is provided on the right side of the chip body 101, a dust removal mechanism 400 is provided on the left side of the chip body 101, and a conveying mechanism 300 is provided at the front end of the chip body 101;

[0050] The detection mechanism 200 includes an electrical detector 205 for observing and recording a plurality of detection data. The electrical detector 205 is located at the front and back sides of the chip body 101 . The detection mechanism 200 is used to perform surface heating and thermoelectric performance detection operations on the chip body 101 .

[0051] As a preferred implementation in this embodiment, Figures 1-13 As shown, the front and rear ends of the chip body 101 are fixedly connected with interfaces 102, the bottom end of the interface 102 is fixedly connected with a square plate 103, the bottom end of the square plate 103 is provided with a resistance rod 104, the right side of the square plate 103 is fixedly connected with a resistance rod 104, the bottom end of the square plate 103 is provided with a conveyor belt 105, the width of the conveyor belt 105 is adapted to the resistance rod 104, and the bottom end of the conveyor belt 105 is rotatably connected with a bracket 106.

[0052] As a preferred implementation in this embodiment, Figures 1-13 As shown, the detection mechanism 200 includes a heating furnace 201, which is located on the right side of the square plate 103. The front and back surfaces of the heating furnace 201 are fixedly connected with spring 1 202. The two springs 1 202 are fixedly connected with cross bar 1 203 on the side facing the chip body 101, and the cross bar 1 203 is fixedly connected with cross bar 2 204 on the side facing the chip body 101.

[0053] In this embodiment, Figures 1-13 As shown, a plug 206 is fixedly connected to the side of the second crossbar 204 facing the chip body 101 , and the side of the plug 206 away from the chip body 101 passes through the second crossbar 204 and is fixedly connected to the electrical tester 205 . The spacing of the plug 206 is adapted to the interface 102 .

[0054] In this embodiment, Figures 1-13 As shown, a concave plate 207 is provided on the right side of the cross bar 1 203, and the concave plate 207, the cross bar 1 203 and the cross bar 2 204 are all in conflict with each other. The side of the concave plate 207 away from the chip body 101 is fixedly connected to the spring 2 208, and the end of the spring 208 away from the chip body 101 is fixedly connected to the heating furnace 201.

[0055] Compared with existing technologies, this device can test the thermoelectric properties of integrated chips, which helps operators better understand the performance of the chip at high temperatures, making the use process smoother. It can also promptly discover some potential problems, such as overheating failure, etc. Discovery in a short period of time can greatly reduce the risk of product failure and make corresponding adjustments in a timely manner. The test results can provide engineers with important reference data to help optimize chip design and cooling systems.

[0056] In other aspects, this embodiment also provides a transmission device, such as Figures 1-13 As shown, the transport mechanism 300 includes a second rocker arm 309 that is pushed by the chip body 101 to control the stopping and passage of subsequent chips. The second rocker arm 309 is located on the right side of the chip body 101. The transport mechanism 300 is used to remove dust and impurities on the surface of the chip body 101 that may affect the thermoelectric performance test results.

[0057] As a preferred implementation in this embodiment, Figures 1-13 As shown, the conveying mechanism 300 includes a separating plate 301 located on the front side of the square plate 103, and four round rods 302 are fixedly connected to the surface of the separating plate 301. The round rods 302 are distributed at right angles. The bottom end of the separating plate 301 is rotatably connected to the central axis 303, and the bottom surface of the separating plate 301 is fixedly connected to the chassis 304 through the central axis 303.

[0058] In this embodiment, Figures 1-13 As shown, four grooves 305 are provided on the outer side of the chassis 304, and a spring three 306 is fixedly connected to the side of the central axis 303 facing the chip body 101, and a swing rod one 307 is fixedly connected to the end of the spring three 306 away from the central axis 303, and the end of the swing rod one 307 facing the chip body 101 is in conflict with the groove 305.

[0059] In this embodiment, Figures 1-13 As shown, the swing link 1 307 is fixedly connected to the long shaft 308 , and one end of the long shaft 308 away from the conveying mechanism 300 is rotatably connected to the swing link 2 309 .

[0060] Compared with the existing technology, this device can automatically sort, block and pass multiple chips to be tested, without the need for manual operation to transport the chips, thus preventing unnecessary energy and effectively improving the speed and efficiency of chip testing. At the same time, it avoids the risks of chips falling and scratching due to different manual technical levels. In addition, it can also prevent accidents such as burns and electric shocks, and there will be no negligence leading to erroneous operations, thus avoiding affecting the test results and damaging the chips.

[0061] In this embodiment, Figures 1-13As shown, a dust removal device is proposed. The dust removal mechanism 400 includes a brush head 405 for wiping and removing dust from the chip after it has been sprayed with a cleaning substance. The brush head 405 is located above the chip body 101. The dust removal mechanism 400 is used to continuously convey the chip body 101 that is about to undergo thermoelectric performance testing.

[0062] In this embodiment, Figures 1-13 As shown, the dust removal mechanism 400 includes a shell 401, which is located in the middle of the chip body 101. Four cleaning agents 402 are fixedly connected to the front and back sides of the inner surface of the shell 401, and the four top ends are fixedly connected to press buttons 403. The end of the press button 403 facing the chip body 101 is fixedly connected to a push rod 404.

[0063] In this embodiment, Figures 1-13 As shown, the push rod 404 is located at the front and rear sides of the conveyor belt 105 , the length of the push rod 404 is adapted to the square plate 103 , and the top of the housing 401 is rotatably connected to the brush head 405 .

[0064] Compared with the existing technology, this device can remove dust and impurities on the surface of the chip, avoid them from reducing the electrical performance of the chip, make the test results more accurate, prevent it from affecting the judgment of performance, and avoid clogging the chip's heat dissipation device, effectively improving its efficiency, extending its life and making the test results more accurate. At the same time, it prevents circuit defects or short circuits and reduces its failure rate.

[0065] The following is the specific working principle of the above embodiment:

[0066] Integrated chip thermoelectric testing refers to heating the chip to a certain temperature through a heating element or hot plate, and then measuring the chip's electrical characteristic parameters, such as current, voltage, power, etc., to understand the chip's working conditions in a high-temperature environment, as well as the chip's stability and reliability. It can also be used to evaluate the chip's heat dissipation performance.

[0067] Before testing, the surface of the chip body 101 must be cleaned, that is, the dust on the surface of the chip body 101 that may affect the thermal test must be removed. The chip body 101 is placed on a square plate 103, which is used to carry the chip body 101. The square plate 103 is then placed on a conveyor belt 105, and the conveyor belt 105 is then started to rotate. When the chip body 101 moves from left to right, it will first pass through the inside of the housing 401. There is a resistance rod 104 at the fixed point on the right side of the chip body 101. The resistance rod 104 is also set horizontally, but the resistance rod 104 is set horizontally. The length of the rod 104 is longer than the width of the chip body 101. The longer width can ensure that the interference rod 104 will produce interference with the objects on the front and rear sides of the conveyor belt 105 during movement. At the same time, the front and rear ends of the interference rod 104 are also rounded and have a certain curvature. After entering the shell 401, the chip body 101 and the interference rod 104 will first interfere with the push rod 404. The left and right sides of the push rod 404 are also rounded. When the interference rod 104 and the push rod 404 interfere with each other, the rounded arc at this point can make the interference rod 104 push the push rod 404 in the process of moving to the right. 404 is pushed to both sides, that is, the push rod 404 is moved in a direction away from the conveyor belt 105. During the translation process, the push rod 404 will squeeze the fixed push button 403, and the push button 403 is fixedly connected to the cleaning agent 402. When the push button 403 is squeezed, the cleaning agent 402 will trigger the spray switch, and the substance specially used for chip cleaning will be sprayed out from the top of the cleaning agent 402 to the surface of the chip body 101. When the cleaning substance reaches the top of the chip body 101, the chip body 101 is cleaned by the brush head 405 connected to the top of the housing 401. 01 is still moving to the right, and the conveyor belt 105 will rotate and brush to remove the dust on the chip body 101. During the whole process, as long as the resistance rod 104 always resists and pushes the two push rods 404, the push rod 404 will always keep squeezing the press button 403, that is, the cleaning agent 402 will always spray outward until the chip body 101 and the resistance rod 104 move to the right side of the shell 401. At this time, the resistance rod 104 is out of contact with the push rod 404, and the press button 403 and the push rod 404 will rebound to stop spraying the cleaning agent 402.

[0068] After completing this step, the thermoelectric performance of the chip body 101 is tested. Interfaces 102 are fixedly connected to the front and rear ends of the surface of the chip body 101. The function of the interface 102 is to insert the instrument for testing the thermoelectric performance into it for testing. The chip body 101 continues to move to the right and enters the heating furnace 201. The heating furnace 201 can heat the internal environment. The temperature can be manually determined by the operator. In order to test the thermoelectric performance of the chip body 101, multiple temperature groups can be set for control tests to better observe the performance. After the chip body 101 enters the heating furnace 201, the chip body 101 will be heated to a predetermined temperature, and the square plate 103 and the resistance rod 104 continue to move to the right until the square plate 103 The chip carrier body 101 moves to the multiple interfaces 102 and the plug 206 to be completely aligned. At this time, the necessary conditions for inserting the plug 206 into the interface 102 are met. At the same time, during this process, when the interface 102 and the plug 206 are about to be aligned, the resistance rod 104 will contact the concave plate 207 on one side. At the same time, the continued movement of the resistance rod 104 will continuously squeeze and resist the concave plate 207, which is consistent with the distance between the resistance rod 104 and the push rod 404 in the previous link. The two ends of the resistance rod 104 are set with rounded arcs, and the part where the concave plate 207 and the resistance rod 104 resist each other is also in a rounded arc state. In the process of the resistance rod 104 continuously pressing the concave plate 207, the concave plate 207 will also continuously move toward the direction of the second spring 208 and squeeze the second spring 208;

[0069] In the initial state, the concave plate 207 and the second spring 208 are located at the rightmost side of the entire detection mechanism 200. The concave plate 207 is in the shape of a "concave" character. One side of the concave plate 207 touches the heating furnace 201, and the other side touches the crossbar 1 203 and the second crossbar 204. The concave plate 207 acts as a limit device to limit the crossbar 1 203 and the second crossbar 204, so that the crossbar 1 203 and the second crossbar 204 overcome the elastic force of the spring 1 202, and the two maintain the existing compressed posture until the contact rod 104 pushes the concave plate 20 7 and make the concave plate 207 leave the crossbar 1 203 and the crossbar 2 204. After the concave plate 207 loses its locking effect, the crossbar 1 203 and the crossbar 2 204 are ejected outward by the elastic force of the spring 2 208, and drive the plug 206 to be ejected toward the chip body 101 and the interface 102. At this time, the plug 206 is inserted into the interface 102 under the action of the elastic force. After the connection is completed, the device enters the power-on state. At this time, the electrical tester 205 will display the thermoelectric performance data at that temperature.

[0070] After completing the thermoelectric performance test, the chip body 101 needs to continue to move forward. However, at this time, the interfaces 102 on both sides of the chip body 101 have been inserted into the plug 206, and the chip body 101 is restricted and cannot move. Therefore, the square plate 103 carrying the chip body 101 can be designed to be larger at the beginning. When the chip body 101 is loaded and moved to the detection mechanism 200, although the chip body 101 is limited and cannot move, the square plate 103 at the bottom is larger than the chip body 101, and the square plate 103 is not fixed and limited, so the square plate 103 can continue to move forward under the action of the conveyor belt 105, and the square plate 103 is connected to the resistance rod 104 to continue to push the concave plate 207, further allowing The concave plate 207 and the second spring 208 are compressed until the second spring 208 is subjected to greater pressure. At this time, the second spring 208 and the concave plate 207 can no longer be compressed. Under the action of the elastic force, the rounded arc part on the right side of the concave plate 207 breaks away from the push of the resistance rod 104 and pops out. After popping out, it will resist the right end of the cross bar 1 203. The concave plate 207 and the arc shape of the right end of the cross bar 1 203 conflict with each other. Under the elastic force of the second spring 208 to restore its original shape, the concave plate 207 will force the electrical tester 205 and the plug 206 to disengage from the interface 102, so that the chip body 101 loses its fixed limiting function. After that, the chip body 101 can continue to move to the next link for execution under the action of the conveyor belt 105.

[0071] After completing the thermoelectric performance test of the chip, the existing chip body 101 and the square plate 103 need to be removed from the detection mechanism 200 to enter the next step, and the subsequent chip body 101 and the square plate 103 need to be placed in the detection device. When the chip body 101 and the square plate 103 are removed from the detection mechanism 200, the square plate 103 will push the pendulum rod 2 309 under the driving action of the conveyor belt 105, causing the pendulum rod 2 309 to rotate at a certain angle. The pendulum rod 2 309 will rotate clockwise, and at the same time, it will pull the long axis 30 8 moves toward the right, that is, toward the detection mechanism 200, and the long axis 308 pulls the swing lever 1 307 on the left to rotate. In the initial state, the long axis 308 is locked with the groove 305 at the edge of the groove 305. When the swing lever 1 307 and the groove 305 are locked, the swing lever 1 307 keeps the chassis 304 fixed. When the swing lever 1 307 is separated from the chassis 304, the chassis 304 and the top separation plate 301 act as a whole, and the two rotate together under the push of the round rod 302 and the chip body 101. , the original round rod 302 can block and separate multiple chip bodies 101. Now the round rod 302 is pushed and rotated by the next chip body 101, and the swing rod 2 309 at the other end is also pushed and rotated by the chip body 101. When the chip body 101 on the right side that has completed the inspection completely leaves the swing rod 2 309, and the chip body 101 on the left side that is about to be inspected has also moved to the right side of the separation plate 301, the long axis 308 and the swing rod 1 307 are separated from the push of the chip body 101, and they will be pulled by the elastic action of the spring 306. When the spring 306 drives the swing rod 1 307 to snap with the chassis 304, the separator 301 and the round rod 302 will no longer move, blocking the subsequent chip bodies 101 until the chip body 101 is detected and moved out, and then the subsequent chip bodies 101 can pass through one after another.

[0072] After the above execution is completed, the integrated chip thermoelectric performance test is completed.

[0073] The above embodiments are only used to illustrate the technical solutions of the present invention, rather than to limit the same. Although the present invention has been described in detail with reference to the aforementioned embodiments, those skilled in the art should understand that they can still modify the technical solutions described in the aforementioned embodiments, or make equivalent replacements for some of the technical features therein. However, these modifications or replacements will not cause the essence of the corresponding technical solutions to deviate from the spirit and scope of the technical solutions of the various embodiments of the present invention.

Claims

1. A thermoelectric test auxiliary device based on an integrated chip, comprising a support structure (100), characterized in that: The support structure (100) comprises a chip body (101), a detection mechanism (200) is provided on the right side of the chip body (101), a dust removal mechanism (400) is provided on the left side of the chip body (101), and a conveying mechanism (300) is provided at the front end of the chip body (101); The detection mechanism (200) includes an electrical detector (205) for observing and recording a plurality of detection data, the electrical detector (205) being located on the front and rear sides of the chip body (101), and the detection mechanism (200) being used to perform surface heating and thermoelectric performance detection operations on the chip body (101); The transport mechanism (300) includes a second swing rod (309) that is pushed by the chip body (101) to control the stopping and passing of subsequent chips. The second swing rod (309) is located on the right side of the chip body (101). The transport mechanism (300) is used to continuously transport the chip body (101) that is about to undergo thermoelectric performance testing. The dust removal mechanism (400) comprises a brush head (405) for wiping and removing dust from the chip after the cleaning substance has been sprayed, the brush head (405) being located above the chip body (101), and the dust removal mechanism (400) is used to remove dust and impurities on the surface of the chip body (101) that may affect the thermoelectric performance test results; The front and rear ends of the chip body (101) are fixedly connected to interfaces (102), the bottom end of the interface (102) is fixedly connected to a square plate (103), the bottom end of the square plate (103) is provided with a resistance rod (104), the right side of the square plate (103) is fixedly connected to the resistance rod (104), the bottom end of the square plate (103) is provided with a conveyor belt (105), the width of the conveyor belt (105) is adapted to the resistance rod (104), and the bottom end of the conveyor belt (105) is rotatably connected to a bracket (106); The detection mechanism (200) includes a heating furnace (201), the heating furnace (201) is located on the right side of the square plate (103), the front and rear surfaces of the interior of the heating furnace (201) are fixedly connected to spring 1 (202), the side of the two springs 1 (202) facing the chip body (101) is fixedly connected to cross bar 1 (203), and the side of the cross bar 1 (203) facing the chip body (101) is fixedly connected to cross bar 2 (204); A plug (206) is fixedly connected to the side of the second crossbar (204) facing the chip body (101), and the side of the plug (206) away from the chip body (101) passes through the second crossbar (204) and is fixedly connected to the electrical detector (205), and the spacing of the plug (206) is adapted to the interface (102).

2. The integrated chip-based thermoelectric test auxiliary equipment according to claim 1, characterized in that: A concave plate (207) is provided on the right side of the cross bar 1 (203), and the concave plate (207) and the cross bar 1 (203) are in conflict with the cross bar 2 (204). The side of the concave plate (207) away from the chip body (101) is fixedly connected to the spring 2 (208), and the end of the spring 2 (208) away from the chip body (101) is fixedly connected to the heating furnace (201).

3. The thermoelectric test auxiliary equipment based on integrated chip according to claim 1, characterized in that: The transport mechanism (300) comprises a partition plate (301) located in front of the square plate (103); four round rods (302) are fixedly connected to the surface of the partition plate (301); the round rods (302) are distributed at right angles; the bottom end of the partition plate (301) is rotatably connected to a central axis (303); and the bottom surface of the partition plate (301) passes through the central axis (303) and is fixedly connected to a chassis (304).

4. The integrated chip-based thermoelectric test auxiliary equipment according to claim 3, characterized in that: Four grooves (305) are provided on the outer side of the chassis (304); a spring three (306) is fixedly connected to the side of the central axis (303) facing the chip body (101); an end of the spring three (306) away from the central axis (303) is fixedly connected to a swing rod one (307); an end of the swing rod one (307) facing the chip body (101) is in conflict with the groove (305).

5. The integrated chip-based thermoelectric test auxiliary equipment according to claim 4, characterized in that: The first swing rod (307) is fixedly connected to a long shaft (308), and one end of the long shaft (308) away from the conveying mechanism (300) is rotatably connected to the second swing rod (309).

6. The integrated chip-based thermoelectric test auxiliary equipment according to claim 1, characterized in that: The dust removal mechanism (400) includes a shell (401), the shell (401) is located in the middle of the chip body (101), four cleaning agents (402) are fixedly connected to the front and rear sides of the inner surface of the shell (401), and the four top ends are fixedly connected to push buttons (403), and the end of the push button (403) facing the chip body (101) is fixedly connected to a push rod (404).

7. The integrated chip-based thermoelectric test auxiliary equipment according to claim 6, characterized in that: The push rod (404) is located at the front and rear sides of the conveyor belt (105). The length of the push rod (404) is adapted to the square plate (103). The top end of the housing (401) is rotatably connected to the brush head (405).

Images