Integrated circuit chip packaging and processing equipment

Abstract

The present invention discloses an integrated circuit chip packaging and processing equipment, belonging to the field of chip packaging technology. The integrated circuit chip packaging and processing equipment comprises a base, a connecting column is fixedly connected to the outer wall of the base, and a replacement mold assembly is assembled on the outer wall of the connecting column; the mold frame installation comprises a mold frame body, the mold frame body is installed on the surface of the connecting column, an eccentric wheel is rotatably connected inside the mold frame body, and a fixed block is slidably connected to the outer wall of the eccentric wheel. The integrated circuit chip packaging and processing equipment can quickly replace the mold through the setting of the mold frame installation, the extrusion spring pushes the first card block and the second card block to reset, and clamps and positions the connecting block, so that the fixed block and the first card slot are kept at the same horizontal plane, and then the eccentric wheel is rotated to push the fixed block into the first card slot, so as to complete the rapid installation of the mold and improve the overall ease of use of the device.

Description

Technical Field

[0001] The present invention relates to the technical field related to chip packaging, and particularly to an integrated circuit chip packaging processing device. Background Art

[0002] The mold assembly for chip packaging processing is a tool used in the manufacturing process of integrated circuits (chips). It is designed to encapsulate bare semiconductor chips in a protective housing to protect the chips from environmental influences and facilitate their connection to external circuits. Encapsulation is the process of enclosing tiny semiconductor devices in a larger and more durable housing. Usually, the housing of the encapsulated chip is placed in a mold, and a pressing tool in the packaging equipment is used to encapsulate the chip in the housing.

[0003] Chinese Patent CN115401865A, authorized and announced on November 29, 2022, discloses a high - heat - dissipation semiconductor element packaging mold. By setting a condensing pipe, water - cooled heat dissipation of the material inside the mold cavity is realized, and heat - dissipation fins and a heat - dissipation fan are set to accelerate the air flow inside the through - groove, and then the heat on the surface of the heat - dissipation fins is discharged, realizing dual cooling of air - cooling and water - cooling to improve its heat - dissipation effect, facilitating the rapid cooling and molding of products, and improving its practicability. However, during the use of this semiconductor element packaging mold, it is rather inconvenient to replace the mold. The disassembly process is time - consuming and laborious, and it is difficult to achieve the effect of rapid replacement, thus reducing the reuse rate of the equipment and making it still rather inconvenient to use. Summary of the Invention

[0004] The present invention aims to solve the problem that in the prior art, it is rather inconvenient to replace the mold during use, the disassembly process is time - consuming and laborious, it is difficult to achieve the effect of rapid replacement, thus reducing the reuse rate of the equipment and making it still rather inconvenient to use. For this reason, the present invention provides an integrated circuit chip packaging processing device that can rapidly replace the mold.

[0005] To achieve the above object, the present invention provides the following technical solution: An integrated circuit chip packaging processing device includes a base. A connecting column is fixedly connected to the outer wall of the base, a top plate is fixedly connected to the outer wall of the top of the connecting column, a hydraulic cylinder is installed on the outer wall of the top plate, and a mold replacement assembly is assembled on the outer wall of the connecting column. The mold replacement assembly includes a mounting mold frame slidably connected to the connecting column, an upper mold set slidably connected to the inside of the mounting mold frame, and a lower mold set slidably connected to the inside of the mounting mold frame.

[0006] The described installation mold rack includes a mold rack body, the mold rack body is installed on the surface of the connecting column, a chute is provided on the outer wall of the mold rack body, a first clamping block is rotatably connected to the surface of the mold rack body, a second clamping block is rotatably connected to the surface of the mold rack body, an extrusion spring is fixedly connected to the surface of the mold rack body, and one end of the extrusion spring is fixedly connected to the second clamping block. An eccentric wheel is rotatably connected to the inside of the mold rack body, a fixed block is slidably connected to the outer wall of the eccentric wheel, and a handle is fixedly connected to the outer wall of the eccentric wheel.

[0007] Preferably, extrusion springs are provided on the surfaces of both the first clamping block and the second clamping block. After the first clamping block and the second clamping block clamp the connecting block, the thrust of the extrusion springs on the first clamping block and the second clamping block can be used to clamp and fix the connecting block.

[0008] Preferably, a card slot for engaging with the fixed block is provided on the outer wall of the eccentric wheel. The eccentric wheel is rotatably connected to the mold rack body through a damping rotating shaft. Through the engagement connection between the card slot on the surface of the eccentric wheel and the fixed block, the fixed block can be driven to make a reciprocating motion when the eccentric wheel is rotated.

[0009] Preferably, the upper mold set includes an upper mold plate. The upper mold plate is installed inside the installation mold rack. A connecting block is fixedly connected to the outer wall of the upper mold plate. A first card slot is provided on the outer wall of the upper mold plate. A push rod is slidably connected to the inner wall of the upper mold plate. A return spring is fixedly connected to the outer wall of the push rod, and one end of the return spring is fixedly connected to the inner and outer walls of the upper mold plate. An air chamber is provided on the inner wall of the upper mold plate, and the inner wall of the air chamber is slidably connected to one end of the outer wall of the push rod. An airbag is installed on the outer wall of the upper mold plate. A ball is rotatably connected to the outer wall of the upper mold plate. An upper mold body is installed on the outer wall of the upper mold plate.

[0010] Preferably, one end of the push rod is made of rubber material, and the outer diameter dimension of its outer wall is matched with the inner diameter dimension of the air chamber, so as to ensure its sealing performance when the push rod squeezes the air inside the air chamber.

[0011] Preferably, a through hole for air inlet and outlet is provided at the connection between the airbag and the air chamber, so that the air inside the air chamber can enter the airbag through the through hole and inflate the airbag.

[0012] Preferably, multiple groups of balls are provided on the outer wall of the upper mold plate and are symmetrically arranged with respect to the central axis of the upper mold plate. The balls can reduce the friction between the upper mold plate and the chute, reduce the wear during the installation of the upper mold plate, and extend the service life of the upper mold plate.

[0013] Preferably, the lower die set includes a lower die plate which is installed inside the installation die rack. A second card slot is formed on the outer wall of the lower die plate. A connecting plate is slidably connected to the inner wall of the lower die plate. A pressing block is fixedly connected to the outer wall of the connecting plate. A top spring is fixedly connected to the outer wall of the connecting plate, and one end of the top spring is fixedly connected to the inner wall of the lower die plate. A ejector rod is fixedly connected to the outer wall of the lower die plate. A lower die body is installed on the outer wall of the lower die plate, and the inner wall of the lower die body is slidably connected to the ejector rod.

[0014] Preferably, the ejector rod is slidably connected to the lower die body through the top spring. Multiple groups of the top springs are arranged on the surface of the connecting plate, so that when the connecting plate is not stressed, the top spring can push the connecting plate to reset.

[0015] The difference from the prior art lies in that the beneficial effects of this application are as follows:

[0016] (1) For this integrated circuit chip packaging and processing equipment, through the setting of the installation die rack, the die can be quickly replaced. The extrusion spring pushes the first card block and the second card block to reset, and clamps and positions the connecting block, so that the fixing block and the first card slot are on the same horizontal plane. Then, the eccentric wheel is rotated, so as to push the fixing block into the inside of the first card slot, completing the quick installation of the die and improving the overall usability of the device.

[0017] (2) For this integrated circuit chip packaging and processing equipment, through the setting of the upper die set, the connecting block can assist in positioning the first card slot. The ball can reduce the friction when the upper die plate is connected to the die rack body. The push rod pushes the airbag to expand, which can increase the friction after the upper die plate is connected to the die rack body, further improving the installation stability and the overall usability of the device.

[0018] (3) For this integrated circuit chip packaging and processing equipment, through the setting of the lower die set, after the injection molding and packaging are completed, the upper die plate moves upward and releases the pressing on the pressing block. The top spring pushes the connecting plate and the ejector rod to slide inside the lower die plate, so that the top of the ejector rod ejects the packaged chip out of the lower die body, improving the overall usability of the device. BRIEF DESCRIPTION OF THE DRAWINGS

[0019] Figure 1 It is a schematic diagram of the external structure of the present invention;

[0020] Figure 2 It is a schematic diagram of the mutually cooperating structure of the installation die rack and the upper die set of the present invention;

[0021] Figure 3 It is a schematic diagram of the mutually cooperating structure of the installation die rack and the lower die set of the present invention;

[0022] Figure 4 Schematic diagram of the cooperating structure between the mold rack main body and the chute of the present invention;

[0023] Figure 5 Schematic diagram of the cooperating structure between the second spring and the extrusion spring of the present invention;

[0024] Figure 6 Schematic diagram of the cooperating structure between the eccentric wheel and the fixed block of the present invention;

[0025] Figure 7 Schematic diagram of the cooperating structure between the push rod and the return spring of the present invention;

[0026] Figure 8 Schematic diagram of the sectional structure of the lower mold set of the present invention;

[0027] Figure 9 For the present invention Figure 7 Schematic diagram of the enlarged structure at A.

[0028] In the figure:

[0029] 1. Base; 2. Connecting column; 3. Top plate; 4. Hydraulic cylinder; 5. Mold replacement assembly; 51. Mounting mold rack; 511. Mold rack main body; 512. Chute; 513. First clamping block; 514. Second clamping block; 515. Extrusion spring; 516. Eccentric wheel; 517. Fixed block; 518. Handle; 52. Upper mold set; 521. Upper mold plate; 522. Connecting block; 523. First card slot; 524. Push rod; 525. Return spring; 526. Air chamber; 527. Air bag; 528. Ball; 529. Upper mold main body; 53. Lower mold set; 531. Lower mold plate; 532. Second card slot; 533. Connecting plate; 534. Pressing block; 535. Ejecting spring; 536. Ejecting rod; 537. Lower mold main body. Detailed implementation manners

[0030] Next, the technical solutions in the embodiments of the present invention will be clearly and completely described in conjunction with the accompanying drawings in the embodiments of the present invention. Obviously, the described embodiments are only a part of the embodiments of the present invention, rather than all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by those of ordinary skill in the art without creative efforts shall fall within the protection scope of the present invention.

[0031] It should be noted that the terms "first", "second", etc. in the description, claims and above-mentioned drawings of the present invention are used to distinguish similar objects, and do not necessarily describe a specific order or sequence. It should be understood that the data used in this way can be interchanged under appropriate circumstances, so as to describe the embodiments of the present invention here. In addition, the terms "comprising" and "having" and any variations thereof are intended to cover non-exclusive inclusion. For example, a process, method, system, product or device comprising a series of steps or units does not necessarily limit to those steps or units clearly listed, but may include other steps or units not clearly listed or inherent to these processes, methods, products or devices.

[0032] In the present invention, the orientation or positional relationship indicated by the terms "upper", "lower", "left", "right", "front", "rear", "top", "bottom", "inner", "outer", "middle", "vertical", "horizontal", "lateral", "longitudinal", etc. is based on the orientation or positional relationship shown in the drawings. These terms are mainly used to better describe the present invention and its embodiments, and are not used to limit that the indicated devices, elements or components must have a specific orientation, or be constructed and operated in a specific orientation.

[0033] Moreover, in addition to being able to represent the orientation or positional relationship, some of the above terms may also be used to represent other meanings. For example, the term "upper" may also be used to represent a certain attachment relationship or connection relationship in some cases. For those of ordinary skill in the art, the specific meanings of these terms in the present invention can be understood according to specific circumstances.

[0034] In addition, the terms "mounted", "arranged", "provided with", "connected", "coupled", "socketed" should be understood in a broad sense. For example, it can be a fixed connection, a detachable connection, or an integral structure; it can be a mechanical connection or an electrical connection; it can be directly connected, or indirectly connected through an intermediate medium, or there is an internal connection between two devices, elements or components. For those of ordinary skill in the art, the specific meanings of the above terms in the present invention can be understood according to specific circumstances.

[0035] It should be noted that, without conflict, the embodiments and features in the embodiments of the present invention can be combined with each other. The present invention will be described in detail below with reference to the drawings and in combination with the embodiments.

[0036] Embodiment 1

[0037] Please refer to Figure 1 - Figure 9, as shown in the figure, an integrated circuit chip packaging and processing device includes a base 1. A connecting column 2 is fixedly connected to the outer wall of the base 1. The top outer wall of the connecting column 2 is fixedly connected to a top plate 3. A hydraulic cylinder 4 is installed on the outer wall of the top plate 3. A replacement mold assembly 5 is assembled on the outer wall of the connecting column 2. The replacement mold assembly 5 includes a mounting mold frame 51 slidably connected to the connecting column 2. An upper mold group 52 is slidably connected to the inner side of the mounting mold frame 51. A lower mold group 53 is slidably connected to the inner side of the mounting mold frame 51;

[0038] The mounting mold frame 51 includes a mold frame main body 511. The mold frame main body 511 is installed on the surface of the connecting column 2. A chute 512 is opened on the outer wall of the mold frame main body 511. A first clamping block 513 is rotatably connected to the surface of the mold frame main body 511. A second clamping block 514 is rotatably connected to the surface of the mold frame main body 511. A compression spring 515 is fixedly connected to the surface of the mold frame main body 511, and one end of the compression spring 515 is fixedly connected to the second clamping block 514. An eccentric wheel 516 is rotatably connected to the inside of the mold frame main body 511. A fixed block 517 is slidably connected to the outer wall of the eccentric wheel 516. A handle 518 is fixedly connected to the outer wall of the eccentric wheel 516.

[0039] During use, when the mold needs to be replaced, first pull the handle 518 to drive the eccentric wheel 516 to rotate, so as to pull out the fixed block 517 from the inside of the first card slot 523. Then pull the upper mold plate 521 to separate the connecting block 522 from the first clamping block 513 and the second clamping block 514. Then pull out the upper mold plate 521 from the inside of the chute 512 to complete the disassembly of the mold. Then, after sliding the upper mold plate 521 to be replaced into the inside of the mold frame main body 511 through the chute 512, the connecting block 522 on the surface of the upper mold plate 521 will abut against the gap between the first clamping block 513 and the second clamping block 514. Then push the upper mold plate 521 forcefully to make the connecting block 522 squeeze the surfaces of the first clamping block 513 and the second clamping block 514. The first clamping block 513 and the second clamping block 514 rotate to both sides under the action of external force and squeeze the compression spring 515. When the connecting block 522 enters the inside of the first clamping block 513 and the second clamping block 514, the compression spring 515 pushes the first clamping block 513 and the second clamping block 514 to reset and clamp and fix the connecting block 522. At this time, the fixed block 517 and the first card slot 523 are on the same horizontal plane. Then pull the handle 518 to drive the eccentric wheel 516 to rotate, so as to push the fixed block 517 into the inside of the first card slot 523 to complete the installation of the upper mold group 52. The replacement principle of the lower mold group 53 is the same as above, improving the overall usability of the device.

[0040] See Figure 2 - Figure 9, as shown in the figure, on the basis of the first embodiment, the upper die set 52 includes an upper die plate 521, the upper die plate 521 is installed inside the installation die holder 51, a connecting block 522 is fixedly connected to the outer wall of the upper die plate 521, a first card slot 523 is opened on the outer wall of the upper die plate 521, a push rod 524 is slidably connected to the inner wall of the upper die plate 521, a return spring 525 is fixedly connected to the outer wall of the push rod 524, and one end of the return spring 525 is fixedly connected to the inner and outer walls of the upper die plate 521. An air chamber 526 is opened on the inner wall of the upper die plate 521, and the inner wall of the air chamber 526 is slidably connected to the outer wall of one end of the push rod 524. An airbag 527 is installed on the outer wall of the upper die plate 521, a ball 528 is rotatably connected to the outer wall of the upper die plate 521, and an upper die main body 529 is installed on the outer wall of the upper die plate 521.

[0041] During use, on the basis of the first embodiment, when installing the upper die set 52, the upper die plate 521 is slidably connected to the chute 512, and the friction between the upper die plate 521 and the chute 512 is reduced by the balls 528 on the surface of the upper die plate 521. After the upper die plate 521 slides into the inside of the chute 512, the die holder main body 511 is pushed forcefully to make the connecting block 522 be stuck between the first block 513 and the second block 514, so that the fixing block 517 and the first card slot 523 are kept at the same horizontal plane and the first card slot 523 is positioned. At the same time, one end of the push rod 524 will squeeze the surface of the die holder main body 511. The push rod 524 squeezes the return spring 525 under the action of an external force and slides inside the air chamber 526, so that the push rod 524 squeezes the air inside the air chamber 526. After the air inside the air chamber 526 is squeezed, it expands outward and enters the inside of the airbag 527, thereby increasing the friction between the upper die plate 521 and the chute 512, further improving the installation stability and the overall usability of the device.

[0042] See Figure 3 - Figure 8 , as shown in the figure, the lower die set 53 includes a lower die plate 531, the lower die plate 531 is installed inside the installation die holder 51, a second card slot 532 is opened on the outer wall of the lower die plate 531, a connecting plate 533 is slidably connected to the inner wall of the lower die plate 531, a pressing block 534 is fixedly connected to the outer wall of the connecting plate 533, a top spring 535 is fixedly connected to the outer wall of the connecting plate 533, and one end of the top spring 535 is fixedly connected to the inner wall of the lower die plate 531. A ejector rod 536 is fixedly connected to the outer wall of the lower die plate 531, and a lower die main body 537 is installed on the outer wall of the lower die plate 531, and the inner wall of the lower die main body 537 is slidably connected to the ejector rod 536.

[0043] During use, when the upper die set 52 presses down on the chip for encapsulation through the hydraulic cylinder 4, the die holder body 511 presses the pressing block 534, thereby pushing the connecting plate 533 to slide inside the lower die plate 531 and compressing the ejector spring 535. At this time, the top end of the ejector rod 536 is at the same horizontal plane as the bottom end of the surface groove of the lower die body 537. After the injection molding encapsulation is completed, the upper die plate 521 moves upward and releases the pressing on the pressing block 534. The ejector spring 535 pushes the connecting plate 533 and the ejector rod 536 to slide inside the lower die plate 531, so that the top end of the ejector rod 536 ejects the encapsulated chip out of the lower die body 537, improving the overall usability of the device.

[0044] The above is only a preferred specific embodiment of the present invention, but the protection scope of the present invention is not limited thereto. Any person skilled in the art within the technical scope disclosed by the present invention, according to the technical solution and inventive concept of the present invention, makes equivalent substitutions or changes, and should be covered by the protection scope of the present invention.

Claims

1. An integrated circuit chip packaging processing equipment, comprising a base, a connecting column is fixedly connected to the outer wall of the base, a top plate is fixedly connected to the outer wall of the top end of the connecting column, a hydraulic cylinder is installed on the outer wall of the top plate, a replacement mold assembly is assembled on the outer wall of the connecting column, the replacement mold assembly comprises a mounting mold frame slidably connected to the connecting column, an upper mold group is slidably connected to the inner side of the mounting mold frame, and a lower mold group is slidably connected to the inner side of the mounting mold frame; Features: The mold frame is installed to include a mold frame body, which is installed on the surface of the connecting column, a sliding groove is provided on the outer wall of the mold frame body, a first clamping block is rotatably connected to the surface of the mold frame body, a second clamping block is rotatably connected to the surface of the mold frame body, an extrusion spring is fixedly connected to the surface of the mold frame body, and one end of the extrusion spring is fixedly connected to the second clamping block, an eccentric wheel is rotatably connected inside the mold frame body, a fixed block is slidably connected to the outer wall of the eccentric wheel, and a handle is fixedly connected to the outer wall of the eccentric wheel; The upper mold group includes an upper mold plate, which is installed inside the mold mounting frame, a connecting block is fixedly connected to the outer wall of the upper mold plate, a first clamping groove is provided on the outer wall of the upper mold plate, a push rod is slidably connected to the inner wall of the upper mold plate, a return spring is fixedly connected to the outer wall of the push rod, and one end of the return spring is fixedly connected to the inner and outer walls of the upper mold plate, an air chamber is provided on the inner wall of the upper mold plate, and the inner wall of the air chamber is slidably connected to the outer wall of one end of the push rod, an air bag is installed on the outer wall of the upper mold plate, a ball is rotatably connected to the outer wall of the upper mold plate, and an upper mold body is installed on the outer wall of the upper mold plate; The lower mold group includes a lower mold plate, which is installed inside the mold mounting frame, a second slot is opened on the outer wall of the lower mold plate, a connecting plate is slidably connected to the inner wall of the lower mold plate, a pressing block is fixedly connected to the outer wall of the connecting plate, an ejection spring is fixedly connected to the outer wall of the connecting plate, and one end of the ejection spring is fixedly connected to the inner wall of the lower mold plate, a ejector rod is fixedly connected to the outer wall of the lower mold plate, a lower mold body is installed on the outer wall of the lower mold plate, and the inner wall of the lower mold body is slidably connected to the ejector rod.

2. An integrated circuit chip packaging and processing equipment according to claim 1, characterized in that: The surfaces of the first clamping block and the second clamping block are both provided with compression springs.

3. An integrated circuit chip packaging and processing equipment according to claim 1, characterized in that: A clamping groove for clamping with a fixed block is provided on the outer wall of the eccentric wheel, and the eccentric wheel is rotatably connected with the mold frame body through a damping rotating shaft.

4. An integrated circuit chip packaging and processing equipment according to claim 1, characterized in that: One end of the push rod is made of rubber material, and the outer wall diameter size of the push rod is consistent with the inner wall diameter size of the gas chamber.

5. An integrated circuit chip packaging and processing equipment according to claim 1, characterized in that: A through hole for air in and out is provided at the connection between the air bag and the air chamber.

6. An integrated circuit chip packaging and processing equipment according to claim 1, characterized in that: The balls are arranged in multiple groups on the outer wall of the upper mold plate and are symmetrically arranged about the central axis of the upper mold plate.

7. An integrated circuit chip packaging and processing equipment according to claim 1, characterized in that: The ejector rod is slidably connected with the lower mold body through an ejector spring, and multiple groups of ejector springs are arranged on the surface of the connecting plate.

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