A single-chip microcomputer automatic welding device

Abstract

A single-chip microcomputer automatic welding device, comprising: a flat automatic soldering mechanism and a position adjustment mechanism; the position adjustment mechanism is clamped and installed with a PCB board and drives the PCB board to move; a single-chip microcomputer is placed on the PCB board; the flat automatic soldering mechanism is installed on one side of the position adjustment mechanism for welding the single-chip microcomputer; the present invention can automatically complete the welding process of the single-chip microcomputer, effectively improve the working efficiency of welding, and by adopting a flat contact method to weld the single-chip microcomputer, the soldering is more uniform.

Description

Technical Field

[0001] The present invention relates to the technical field of single-chip microcomputers, and in particular to an automatic soldering device for single-chip microcomputers. Background Art

[0002] A single-chip microcomputer is an integrated circuit chip. It is a small and complete microcomputer system formed by integrating a central processing unit CPU with data processing capabilities, a random access memory RAM, an interrupt system, a calculator, and other functions onto a silicon chip using ultra-large scale integrated circuit technology. Existing single-chip microcomputer chips are usually installed on a PCB board, and their pins need to be soldered. When soldering a single-chip microcomputer chip, the soldering quality has a great impact on the quality of the single-chip microcomputer. However, at present, most single-chip microcomputer chips are soldered manually. The chip is clamped by items such as clips, and then the chip is soldered onto the circuit board. However, during the soldering process, the circuit board is prone to moving, thus affecting the soldering quality, resulting in false soldering, bad soldering, and even burning the circuit board.

[0003] The invention disclosed in the publication (announcement) number CN212094751U discloses a new soldering device for single-chip microcomputer processing, including a heat-insulating handle and a power cord. The center position of the top end face of the heat-insulating handle is connected with a power cord. The right end face of the power cord is connected with a power plug. The left side of the power plug is connected with a cord reel at a position above the outer surface of the heat-insulating handle. The bottom end face of the heat-insulating handle is connected with a sleeve. The outer surface of the sleeve is connected with an adjusting bolt, and the telescopic property can be suitable for various limiting requirements, greatly increasing the overall practicability. The anti-magic tape and the positive magic tape are fixedly connected to effectively limit the position of the power cord and limit it at a specified position. The setting of the cord reel does not affect the normal function of the device and increases the overall practicability. The setting of the cord reel avoids the trouble problem that the power cord without a fixed structure for limiting will be more chaotic during the next use.

[0004] However, when soldering with this patent, the solder wire still melts in a point-to-point manner, that is, the end of the solder wire contacts and melts, which is likely to cause uneven soldering. Whether too much or too little solder melts will affect the soldering quality. The present invention is designed to address the above defects. The solder contact point of this device melts in a tiled manner, that is, a section of the solder wire is tiled at the lower end of the soldering iron, making the soldering more uniform. Summary of the Invention

[0005] In order to solve the problems in the background art, the present invention provides an automatic soldering device for single-chip microcomputers, and the specific technical solutions are as follows:

[0006] A single-chip microcomputer automatic soldering device, comprising: a flat automatic soldering mechanism, a position adjustment mechanism and a control device; the position adjustment mechanism is clamped and installed with a PCB board and drives the PCB board to move; a single-chip microcomputer is placed on the PCB board; the flat automatic soldering mechanism is installed on one side of the position adjustment mechanism for soldering the single-chip microcomputer; the control device is used to control the operation of the entire single-chip microcomputer automatic soldering device except itself.

[0007] Further, the flat automatic soldering mechanism comprises: a bracket; a horizontal carriage is horizontally slidably installed on the bracket and is driven by an electric lead screw device one fixedly installed on the bracket; a vertical carriage is vertically slidably installed on the horizontal carriage and is driven by an electric lead screw device two fixedly installed on the horizontal carriage; a solder wire wheel is installed on the bracket; a scanning and positioning camera is fixedly installed on the vertical carriage;

[0008] An upper slider is vertically slidably installed on the vertical carriage and is driven by a cylinder one rotatably installed on the vertical carriage; a driving assembly is installed on the upper slider; the driving assembly is used to drive the solder wire to move;

[0009] A lower slider is vertically slidably installed on the vertical carriage corresponding to the upper slider and is driven by a cylinder three rotatably installed on the vertical carriage; a bending rod is rotatably installed on the lower slider and is driven by a motor two fixedly installed on the lower slider;

[0010] A soldering iron is vertically slidably installed on the vertical carriage and is driven by a cylinder four rotatably installed on the vertical carriage; the bottom end face of the soldering iron is rectangular and corresponds to the bottom of the lower slider.

[0011] Further, a bending wheel two is rotatably installed on the bending rod; the bending wheel two is used to bend the solder wire.

[0012] Further, the driving assembly comprises: a driving wheel and a motor one; the two driving wheels are correspondingly rotatably installed on the upper slider and are synchronously driven by a motor one fixedly installed on the upper slider, and the motor one drives the two driving wheels to rotate to convey the solder wire.

[0013] Further, a bending wheel one is rotatably installed on the bracket corresponding to the driving assembly; limiting holes are provided on both the upper slider and the lower slider.

[0014] Further, a clamp is horizontally slidably installed on the upper slider and is driven by a cylinder two fixedly installed on the upper slider; the clamp is used to fix the solder wire.

[0015] Further, the position adjusting mechanism includes: a bottom plate; a flat plate is horizontally and slidably mounted on the bottom plate and driven by a motor three fixedly mounted on the bottom plate; a gear four is rotatably mounted on the flat plate and driven by a motor four fixedly mounted on the flat plate; a turntable bracket is fixedly mounted on the gear four; a central bracket is fixedly mounted on the turntable bracket; clamping plates are horizontally and slidably mounted on the central bracket symmetrically left and right and driven synchronously by a driving device mounted on the central bracket; the two clamping plates are used for clamping a PCB board.

[0016] Further, the driving device includes: a turntable and a buffer plate; the turntable is rotatably mounted on the central bracket and driven by a motor five fixedly mounted on the central bracket; connecting plates are rotatably mounted on both left and right ends of the turntable; the other ends of the two connecting plates are respectively rotatably connected to their corresponding clamping plates.

[0017] Further, buffer plates are horizontally and elastically slidably mounted on the sides of the clamping plates corresponding to the PCB board.

[0018] Compared with the prior art, the advantages of the present invention are as follows:

[0019] The present invention can automatically complete the welding process of the single-chip microcomputer, effectively improving the working efficiency of welding, and by adopting a tiled contact method for welding the single-chip microcomputer, the soldering is more uniform;

[0020] The present invention can bend the solder wire through the tiled automatic soldering mechanism, make the solder wire tiled under the soldering iron, and can supply the wire automatically, effectively improving the working efficiency;

[0021] The present invention can drive the single-chip microcomputer to move and rotate through the position adjusting mechanism, so as to cooperate with the tiled automatic soldering mechanism to complete the welding of all directions of the single-chip microcomputer. BRIEF DESCRIPTION OF THE DRAWINGS

[0022] Figure 1 is a schematic diagram of the overall assembly structure of the present invention;

[0023] Figures 2 - 3 is a schematic diagram of the assembly structure of the tiled automatic soldering mechanism of the present invention;

[0024] Figures 4 - 17 is a schematic diagram of the assembly structure of a part of the tiled automatic soldering mechanism of the present invention;

[0025] Figures 18 - 22 is a schematic diagram of the assembly structure of the position adjusting mechanism of the present invention.

[0026] In the figure: 1 - Flat automatic soldering mechanism [101 - Bracket, 102 - Electric screw device 1, 103 - Horizontal carriage, 104 - Electric screw device 2, 105 - Vertical carriage, 106 - Solder wire wheel, 107 - Upper slider, 108 - Cylinder 1, 109 - Turning wheel 1, 110 - Driving assembly (1101 - Motor 1, 1102 - Driving wheel, 1103 - Gear 1), 111 - Claw, 112 - Cylinder 2, 113 - Lower slider, 114 - Cylinder 3, 115 - Gear 2, 116 - Bending rod, 117 - Bending wheel 2, 118 - Motor 2, 119 - Scanning and positioning camera, 120 - Soldering iron, 121 - Cylinder 4]; 2 - Position adjusting mechanism (201 - Base plate, 202 - Rotating shaft, 203 - Motor 3, 204 - Belt, 205 - Flat plate, 206 - Gear 3, 207 - Motor 4, 208 - Gear 4, 209 - Turntable frame, 210 - Turntable, 211 - Motor 5, 212 - Central frame, 213 - Clamping plate, 214 - Connecting plate, 215 - Buffer plate, 216 - PCB board). Detailed implementation

[0027] In order to enable those skilled in the art to better understand the solution of the present invention, the technical solutions in the embodiments of the present invention will be clearly and completely described below. Obviously, the described embodiments are only a part of the embodiments of the present invention, rather than all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by those of ordinary skill in the art without making creative efforts shall fall within the protection scope of the present invention. Embodiment

[0028] A single-chip microcomputer automatic soldering device, as Figure 1 shown, includes: a flat automatic soldering mechanism 1, a position adjusting mechanism 2 and a control device; a PCB board 216 is clamped and installed on the position adjusting mechanism 2 and drives the PCB board 216 to move; a single-chip microcomputer is placed on the PCB board 216; the flat automatic soldering mechanism 1 is installed on one side of the position adjusting mechanism 2 for soldering the single-chip microcomputer; the control device is used to control the operation of the entire single-chip microcomputer automatic soldering device except itself.

[0029] Specifically, as Figures 2 - 17 shown, the flat automatic soldering mechanism 1 includes: a bracket 101; a horizontal carriage 103 is horizontally slidably installed on the bracket 101 and is driven by an electric screw device 102 fixedly installed on the bracket 101; a vertical carriage 105 is vertically slidably installed on the horizontal carriage 103 and is driven by an electric screw device 104 fixedly installed on the horizontal carriage 103; a solder wire wheel 106 is installed on the bracket 101;

[0030] A upper slider 107 is vertically slidably mounted on a vertical carriage 105 and is driven by a first cylinder 108 rotatably mounted on the vertical carriage 105; a driving assembly 110 is mounted on the upper slider 107; the driving assembly 110 is used to drive the solder wire to move;

[0031] As a specific implementation manner of this embodiment, as Figures 10 - 13 shown, the driving assembly 110 includes: a driving wheel 1102 and a first motor 1101; two driving wheels 1102 are correspondingly rotatably mounted on the upper slider 107; a first gear 1103 is fixedly mounted on one end of each driving wheel (1102), and the two first gears 1103 are meshed with each other; a first motor 1101 is fixedly mounted on the upper slider 107, and the output end of the first motor 1101 is fixedly connected to one of the driving wheels 1102, and the two driving wheels 1102 are driven by the first motor 1101 to rotate to convey the solder wire; the driving assembly 110 can supply the wire automatically, and there is no need for manual adjustment of the solder wire, improving work efficiency;

[0032] A lower slider 113 is vertically slidably mounted on the vertical carriage 105 corresponding to the upper slider 107 in the vertical direction and is driven by a third cylinder 114 rotatably mounted on the vertical carriage 105; a bending rod 116 is rotatably mounted on the lower slider 113; teeth are provided on the outer side of one end of the bending rod 116; a second motor 118 is fixedly mounted on the lower slider 113, a second gear 115 is fixedly connected to the output end of the second motor 118, and the second gear 115 is meshed with the teeth at one end of the bending rod 116, and the bending rod 116 is driven to rotate by the second motor 118; a second bending wheel 117 is rotatably mounted on the other end of the bending rod 116; the bending rod 116 drives the second bending wheel 117 to bend the solder wire;

[0033] At the same time, in order to accurately limit the solder wire, a first bending wheel 109 is rotatably mounted on the bracket 101 corresponding to the driving assembly 110; limiting holes are provided on both the upper slider 107 and the lower slider 113; grooves for placing the solder wire are provided at one ends of the upper slider 107 and the lower slider 113 corresponding to the solder wire;

[0034] As Figures 8 - 10 shown in FIGS. 16 and 17, a soldering iron 120 is vertically slidably mounted on the vertical carriage 105 and is driven by a fourth cylinder 121 rotatably mounted on the vertical carriage 105; the bottom end face of the soldering iron 120 is rectangular and corresponds to the bottom of the lower slider 113; the square end face of the soldering iron 120 contacts the solder wire, making the melting of the solder wire more uniform;

[0035] As a specific implementation manner of the present invention, as Figures 8 - 12As shown in the figure, a jaw 111 is horizontally and slidably mounted on the upper slider 107 and is driven by a second cylinder 112 fixedly mounted on the upper slider 107. When welding the single-chip microcomputer, the second cylinder 112 drives the jaw 111 to fix the solder wire, which can effectively prevent the solder wire from moving during the welding process to ensure the welding effect. At the same time, when completing the welding of a solder wire, the front-end solder wire needs to be straightened again so that the solder wire can be bent to the specified position next time. The solder wire is fixed by the jaw 111, and then the upper slider 107 drives the solder wire to move upward, and cooperates with the bending rod 116 to straighten the front end of the solder wire again. This process does not require manual adjustment of the solder wire, improving the working efficiency of the entire welding process.

[0036] A scanning and positioning camera 119 is fixedly mounted on the vertical sliding frame 105. The flat automatic soldering mechanism 1 is positioned at the chip pins that need to be soldered through the scanning and positioning camera 119.

[0037] Specifically, when using this device, the single-chip microcomputer is fixed by the position adjustment mechanism 2. One end of the solder wire on the solder wire wheel 106 is pulled, and the solder wire is wound around the first turning wheel 109, then passes through the limiting hole of the upper slider 107, and enters the driving component 110 on the upper slider 107. The driving component 110 drives the solder wire to move downward. One end of the solder wire passes through the limiting holes on the lower slider 113 and the bending rod 116 in sequence. The front end of the solder wire exceeds the lower end of the lower slider 113 by a certain distance. At this time, the preparation work is ready, and then soldering starts. The scanning and positioning camera 119 locates the chip pins that need to be soldered. The bending rod 116 rotates 90 degrees driven by the second motor 118, thereby driving the solder wire to rotate 90 degrees, so that the extended solder wire is bent to the lower end of the soldering iron 120, and this section of the solder wire is laid flat at the lower end of the soldering iron 120, and then the bending rod 116 resets. The second cylinder 112 drives the jaw 111 to fix the solder wire.

[0038] Next, the vertical sliding frame 105 moves downward driven by the second electric lead screw device 104, so that the soldering iron 120 and the solder wire approach the chip welding position. Then, the lower slider 113 moves upward a certain distance driven by the third cylinder 114, so that the lower end of the lower slider 113 is higher than the lower end of the soldering iron 120, which is convenient for welding without obstruction. Subsequently, the fourth cylinder 121 starts, driving the soldering iron 120 to move downward slightly, so that the soldering iron 120 contacts the laid flat solder wire and the pins of the chip, thereby melting the solder wire and attaching it to the pins. At the same time, the horizontal sliding frame 103 will perform a small-distance horizontal reciprocating movement driven by the first electric lead screw device 102, thereby driving the soldering iron 120 to reciprocate at the pins, making the solder attach to the pins more evenly.

[0039] During the previous soldering step, the flat solder wire was melted, so wire supply needs to continue. First, the air cylinder three 114 drives the lower slider 113 to reset, and the electric lead screw device two 104 drives the vertical carriage 105 to reset. Then, the air cylinder one 108 drives the upper slider 107 to slide upward, thereby driving the solder wire to move upward until one end of the solder wire is pulled to the position of the second bending wheel 117 on the bending rod 116. The purpose is to straighten the melted solder wire again. Then, the air cylinder one 108 drives the upper slider 107 to reset. The air cylinder two 112 drives the jaws 111 to release the solder wire. The drive assembly 110 drives the solder wire to move downward, so that the front end of the solder wire exceeds the lower end of the lower slider 113 by a certain distance. At this time, the solder wire returns to the state of being ready for the first time.

[0040] In the next step, continue to solder other pins. Adjust the position of the chip through the position adjustment mechanism 2 so that the soldering iron 120 corresponds to the position to be soldered, and repeat the steps of the first soldering above. In this way, each time the solder wire can be laid flat at the lower end of the soldering iron, making the soldering of the solder wire more uniform.

[0041] Specifically, as Figures 18 - 22 shown, the position adjustment mechanism 2 includes: a bottom plate 201; a bracket 101 is fixedly installed on the bottom plate 201; rotating shafts 202 are rotatably installed at both the left and right ends of the bottom plate 201; the two rotating shafts 202 are connected by two belts 204; a motor three 203 is fixedly installed on the bottom plate 201; the output end of the motor three 203 is fixedly connected to one end of the left rotating shaft 202, and the two belts 204 are driven to rotate synchronously by the motor three 203.

[0042] A flat plate 205 is horizontally slidably installed on the bottom plate 201 and is driven by the two belts 204; a third gear 206 and a fourth gear 208 are rotatably installed on the flat plate 205; a motor four 207 is fixedly installed on the flat plate 205, and the output end of the motor four 207 is fixedly connected to the third gear 206; the third gear 206 meshes with the fourth gear 208, and the fourth gear 208 is driven to rotate by the motor four 207.

[0043] A turntable frame 209 is fixedly installed on the fourth gear 208; a central frame 212 is fixedly installed on the turntable frame 209; clamping plates 213 are horizontally slidably installed on the central frame 212 symmetrically left and right and are synchronously driven by a drive device installed on the central frame 212; the two clamping plates 213 are used to clamp the PCB board 216; a single-chip microcomputer is placed on the PCB board 216.

[0044] As a specific implementation manner of this embodiment, the driving device includes: a turntable 210 and a buffer plate 215; the turntable 210 is rotatably mounted on a center frame 212 and is driven by a fifth motor 211 fixedly mounted on the center frame 212; connecting plates 214 are rotatably mounted on both the left and right ends of the turntable 210; the other ends of the two connecting plates 214 are respectively rotatably connected to their corresponding clamping plates 213; by driving the turntable 210 to rotate with the fifth motor 211, the two connecting plates 214 are driven to move, thereby driving the two clamping plates 213 to slide horizontally, so as to clamp and release the PCB board 216; meanwhile, in order to avoid damaging the PCB board 216, a buffer plate 215 is horizontally and elastically slidably mounted on one side of each clamping plate 213 corresponding to the PCB board 216.

[0045] When this device is in use, after threading the solder wire, the PCB board 216 installed with a single-chip microcomputer needs to be placed on the center frame 212; then the fifth motor drives the turntable 210 to rotate, thereby driving the buffer plate 215 to clamp the PCB board 216. A spring is provided between the buffer plate 215 and the clamping plate 213, which can prevent the PCB board 216 from being damaged due to excessive clamping force; subsequently, the third motor 203 drives the flat plate 205 to reciprocate horizontally left and right, thereby adjusting the position of the single-chip microcomputer, and cooperating with the first electric device 102 driving the horizontal slide 103 to slide horizontally back and forth, so that the soldering iron 120 corresponds to the chip to be soldered. After soldering is completed in one direction, the fourth gear 208 rotates 90 degrees driven by the fourth motor 207, so as to solder the single-chip microcomputer in another direction.

[0046] The first electric lead screw device 102, the second electric lead screw device 104, the first cylinder 108, the first motor 1101, the second cylinder 112, the third cylinder 114, the second motor 118, the scanning and positioning camera 119, the fourth cylinder 121, the third motor 203, the fourth motor 207 and the fifth motor 211 are all electrically connected to the control device.

[0047] The above is only a preferred specific implementation manner of this embodiment, but the protection scope of this embodiment is not limited thereto. Any person skilled in the art within the technical scope disclosed in this embodiment, according to the technical solution and inventive concept of this embodiment, makes equivalent replacements or changes, and should be covered by the protection scope of this embodiment.

Claims

1. A single-chip microcomputer automated welding device, characterized in that, Including: A flat automatic soldering mechanism (1), a position adjustment mechanism (2) and a control device; the PCB board (216) is clamped and installed on the position adjustment mechanism (2) and driven to move by the position adjustment mechanism (2); a single-chip microcomputer is placed on the PCB board (216); the flat automatic soldering mechanism (1) is installed on one side of the position adjustment mechanism (2) for soldering the single-chip microcomputer; the control device is used to control the operation of the entire single-chip microcomputer automatic soldering equipment except itself; The flat automatic soldering mechanism (1) includes: a bracket (101); a horizontal carriage (103) is horizontally slidably installed on the bracket (101) and driven by an electric lead screw device one (102) fixedly installed on the bracket (101); a vertical carriage (105) is vertically slidably installed on the horizontal carriage (103) and driven by an electric lead screw device two (104) fixedly installed on the horizontal carriage (103); a tin wire wheel (106) is installed on the bracket (101); a scanning and positioning camera (119) is fixedly installed on the vertical carriage (105); An upper slider (107) is vertically slidably installed on the vertical carriage (105) and driven by a cylinder one (108) rotatably installed on the vertical carriage (105); a driving component (110) is installed on the upper slider (107); the driving component (110) is used to drive the tin wire to move; A lower slider (113) is vertically slidably installed on the vertical carriage (105) corresponding to the upper slider (107) and driven by a cylinder three (114) rotatably installed on the vertical carriage (105); a bending rod (116) is rotatably installed on the lower slider (113) and driven by a motor two (118) fixedly installed on the lower slider (113); A soldering iron (120) is vertically slidably installed on the vertical carriage (105) and driven by a cylinder four (121) rotatably installed on the vertical carriage (105); the bottom end face of the soldering iron (120) is rectangular and corresponds to the bottom of the lower slider (113).

2. The automatic soldering device for a single-chip microcomputer according to claim 1, wherein: A bending wheel two (117) is rotatably installed on the bending rod (116); the bending wheel two (117) is used to bend the tin wire.

3. The single-chip microcomputer automatic welding equipment according to claim 1, characterized in that: The driving component (110) includes: a driving wheel (1102) and a motor one (1101); the two driving wheels (1102) are correspondingly rotatably installed on the upper slider (107) and synchronously driven by a motor one (1101) fixedly installed on the upper slider (107), and the motor one (1101) drives the two driving wheels (1102) to rotate to convey the tin wire.

4. An automatic single-chip microcomputer welding device according to claim 1, characterized in that: A bending wheel one (109) is rotatably installed on the bracket (101) corresponding to the driving component (110); limit holes are provided on both the upper slider (107) and the lower slider (113).

5. The automatic soldering device for single-chip microcomputer according to claim 1, characterized in that: A clamp (111) is horizontally slidably installed on the upper slider (107) and driven by a cylinder two (112) fixedly installed on the upper slider (107); the clamp (111) is used to fix the tin wire.

6. The automatic soldering device for single-chip microcomputer according to claim 1, wherein: The position adjustment mechanism (2) includes: a bottom plate (201); a flat plate (205) is horizontally slidably mounted on the bottom plate (201) and is driven by a third motor (203) fixedly mounted on the bottom plate (201); a fourth gear (208) is rotatably mounted on the flat plate (205) and is driven by a fourth motor (207) fixedly mounted on the flat plate (205); a turntable bracket (209) is fixedly mounted on the fourth gear (208); a center bracket (212) is fixedly mounted on the turntable bracket (209); clamping plates (213) are horizontally slidably mounted on the center bracket (212) in a left-right symmetric manner and are synchronously driven by a driving device mounted on the center bracket (212); the two clamping plates (213) are used for clamping a PCB board (216).

7. An automatic welding device for a single-chip microcomputer according to claim 6, characterized in that: The driving device includes: a turntable (210) and a buffer plate (215); the turntable (210) is rotatably mounted on the center bracket (212) and is driven by a fifth motor (211) fixedly mounted on the center bracket (212); connecting plates (214) are rotatably mounted on both the left and right ends of the turntable (210); the other ends of the two connecting plates (214) are respectively rotatably connected to their corresponding clamping plates (213).

8. The single-chip microcomputer automatic soldering equipment according to claim 6, characterized in that: Buffer plates (215) are horizontally elastically slidably mounted on one side of each clamping plate (213) corresponding to the PCB board (216).

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