IGBT chip testing device

Abstract

The present invention relates to the field of semiconductor device testing technology, and discloses an IGBT chip testing device, including a probe board, a probe and a signal probe. The probe board end surface is provided with a groove structure, and a plurality of probes are provided. The probes include two symmetrically arranged special-shaped probes, one end of the two special-shaped probes is embedded in the groove structure, and elastic components are provided on two opposite side walls of the groove structure, and the elastic components provide elastic force for the other ends of the two special-shaped probes to approach each other. The signal probe is provided between every two special-shaped probes, and one end of each signal probe is connected to the probe board. Each pin of the IGBT chip module extends between the two special-shaped probes of each probe and is movably abutted with the other end of the signal probe in a one-to-one correspondence. The IGBT chip testing device can realize high current conduction testing even in a narrow space by providing special-shaped probes with high voltage and high current resistance.

Description

Technical Field

[0001] The present invention relates to the technical field of semiconductor device testing, and in particular to an IGBT chip testing device. Background Art

[0002] The IGBT module is a composite fully controlled voltage-driven power semiconductor device composed of BJT and MOS, which has the advantages of both the high input impedance of MOSFET and the low on-state voltage drop of GTR. As a typical representative of the third-generation semiconductor, IGBT (Insulated Gate Bipolar Transistor) has a current of more than 1000A and a voltage of more than 3000V. For example, the current of Mitsubishi brand IGBT on the market is 1200A and the voltage is 3300V; the voltage of Infineon brand IGBT even reaches 6500V. Moreover, the pin spacing of IGBT chip modules is often only about 2mm-3mm. In such a small space, it is not easy to achieve the conduction capability of large current. Therefore, in order to adapt to such harsh test conditions, it is urgent to design an IGBT chip test device. Summary of the invention

[0003] The purpose of the present invention is to provide an IGBT chip testing device to solve the technical problem that the pin spacing of the IGBT chip is small and it is difficult to test the IGBT chip for conducting a large current in a narrow space.

[0004] To achieve this object, the present invention adopts the following technical solutions:

[0005] IGBT chip testing device, including:

[0006] A probe plate, the end surface of which is provided with a groove structure;

[0007] A plurality of probes are provided, wherein the plurality of probes are provided on the probe plate, wherein the probes include two symmetrically arranged special-shaped probes, wherein one end of the two special-shaped probes is embedded in the groove structure, and elastic abutting members are provided on two opposite side walls of the groove structure, wherein the elastic abutting members provide elastic force for the other ends of the two special-shaped probes to approach each other, and an elastic pressing member is provided in the groove structure, wherein the elastic pressing member provides elastic force for the special-shaped probes to press against the bottom wall of the groove structure; and

[0008] The signal probe is arranged between every two of the special-shaped probes. Each of the signal probes is connected to the probe board. Each pin of the IGBT chip module extends between the two special-shaped probes of each probe and movably abuts against the other end of the signal probe in a one-to-one correspondence.

[0009] As a preferred solution of the IGBT chip testing device, the probe board includes a first probe board and a second probe board, the end surface of the first probe board is provided with a first mounting groove, the bottom wall of the first mounting groove is provided with a plurality of first through holes, the second probe board is provided with a second mounting groove, the first probe board and the second probe board are stacked and fixed so that the first mounting groove and the second mounting groove are connected to form the groove structure;

[0010] The special-shaped probe includes a main body, a stop arm is extended from the side of the main body, one end of the main body is inserted into the first through hole and limited in the first installation groove, and the stop arm passes through the second installation groove and extends out of the second probe plate.

[0011] As a preferred solution of the IGBT chip testing device, the special-shaped probe also includes an arc-shaped contact portion, which is arranged at the end of the stop arm away from the main body, and the distance between two corresponding surfaces of the arc-shaped contact surfaces of the arc-shaped contact portions of the two special-shaped probes is smaller than the distance between the stop arms of the two special-shaped probes.

[0012] As a preferred solution of the IGBT chip testing device, the distance between the ends of the arc-shaped contact portions of the two special-shaped probes away from the main body is greater than the distance between two corresponding surfaces of the arc-shaped contact surfaces of the arc-shaped contact portions of the two special-shaped probes.

[0013] As a preferred solution of the IGBT chip testing device, the main body, the stop arm and the arc-shaped contact portion are integrally formed.

[0014] As a preferred solution of the IGBT chip testing device, the elastic pressure piece is filled in the first mounting groove, the elastic pressure piece is in contact with each of the main body and the second probe board, and provides an elastic force for the main body to press against the bottom wall of the first mounting groove, so that one end of the main body can be movably extended out of the first through hole to contact the PCB board.

[0015] As a preferred solution of the IGBT chip testing device, the elastic abutment member is arranged on the side wall of the second mounting groove and abuts against the stop arm.

[0016] As a preferred solution of the IGBT chip testing device, the bottom wall of the first mounting groove is provided with a plurality of first step holes, the end surface of the second probe plate is provided with a second step hole, the first step holes and the second step holes are arranged opposite to each other, one end of the signal probe is inserted into the first step hole, and the other end is inserted into the second step hole.

[0017] As a preferred solution of the IGBT chip testing device, the IGBT chip testing device further includes:

[0018] A guide member is connected to the probe plate, and the guide member is provided with a plurality of second through holes through which the pin structure can pass, and the plurality of second through holes are arranged in one-to-one correspondence with the signal probes.

[0019] As a preferred solution of the IGBT chip testing device, the guide member is provided with an embedding groove matching the IGBT chip, and the second through hole is provided on the bottom wall of the embedding groove.

[0020] Beneficial effects of the present invention:

[0021] The present invention provides an IGBT chip testing device. The probes are arranged as special-shaped probes and signal probes. The two special-shaped probes are symmetrically arranged. The ends of the special-shaped probes are connected to the probe board through a groove structure. The other ends of the special-shaped probes extend out of the probe board and are connected to the pins. Each pin extends into the gap between each two special-shaped probes. The special-shaped probes are stretched open by squeezing elastic abutments so that the pins can maintain contact with the two special-shaped probes. The special-shaped probes have high voltage resistance and current resistance, thereby realizing high current conduction testing in a narrow space. BRIEF DESCRIPTION OF THE DRAWINGS

[0022] Figure 1 is a partial cross-sectional view of an IGBT chip testing device provided by an embodiment of the present invention in an untested state;

[0023] Figure 2 It is a partial cross-sectional view of the IGBT chip testing device provided by an embodiment of the present invention in a testing state.

[0024] In the figure:

[0025] 11. a first probe card; 12. a second probe card;

[0026] 2. Groove structure; 21. First mounting groove; 211. First through hole; 212. First step hole; 213. Second step hole; 22. Second mounting groove;

[0027] 31. Special-shaped probe; 311. Main body; 312. Gear arm; 313. Arc-shaped contact part; 32. Signal probe;

[0028] 4. Elastic pressure piece;

[0029] 5. Elastic abutment. DETAILED DESCRIPTION

[0030] The present invention will be further described in detail below in conjunction with the accompanying drawings and embodiments. It is to be understood that the specific embodiments described herein are only used to explain the present invention, rather than to limit the present invention. It should also be noted that, for ease of description, only parts related to the present invention, rather than all structures, are shown in the accompanying drawings.

[0031] In the description of the present invention, unless otherwise clearly specified and limited, the terms "connected", "connected", and "fixed" should be understood in a broad sense, for example, it can be a fixed connection, a detachable connection, or an integral connection; it can be a mechanical connection or an electrical connection; it can be a direct connection or an indirect connection through an intermediate medium, it can be the internal connection of two elements or the interaction relationship between two elements. For ordinary technicians in this field, the specific meanings of the above terms in the present invention can be understood according to specific circumstances.

[0032] In the present invention, unless otherwise clearly specified and limited, a first feature being "above" or "below" a second feature may include that the first and second features are in direct contact, or may include that the first and second features are not in direct contact but are in contact through another feature between them. Moreover, a first feature being "above", "above" and "above" a second feature includes that the first feature is directly above and obliquely above the second feature, or simply indicates that the first feature is higher in level than the second feature. A first feature being "below", "below" and "below" a second feature includes that the first feature is directly below and obliquely below the second feature, or simply indicates that the first feature is lower in level than the second feature.

[0033] In the description of this embodiment, the terms "upper", "lower", "right", etc., directions or positional relationships are based on the directions or positional relationships shown in the drawings, and are only for the convenience of description and simplification of operation, rather than indicating or implying that the device or element referred to must have a specific direction, be constructed and operated in a specific direction, and therefore cannot be understood as limiting the present invention. In addition, the terms "first" and "second" are only used to distinguish in the description and have no special meaning.

[0034] Combination Figure 1-Figure 2 As shown, this embodiment provides an IGBT chip testing device, which includes a probe board, a probe and a signal probe 32. The end surface of the probe board is provided with a groove structure 2, and a plurality of probes are arranged on the probe board, that is, a plurality of probes are arranged in the groove structure 2 of the probe board.

[0035] Among them, the number of probes is consistent with the number of pins of the pin structure of the IGBT chip module. There are several probes, and the layout (spacing and number of rows and columns, etc.) and specific number of the probes can be set according to the corresponding model of the IGBT chip module, and this embodiment does not limit this.

[0036] Furthermore, if Figure 1 and Figure 2 As shown, the probe includes two symmetrically arranged special-shaped probes 31 and a signal probe 32 arranged between every two special-shaped probes 31, one end of the two special-shaped probes 31 is embedded in the groove structure 2, one end of each signal probe 32 is connected to the probe board, and elastic abutment members 5 are arranged on the two opposite inner side walls of the groove structure 2, and the elastic abutment members 5 provide elastic force for the other ends of the two special-shaped probes 31 to approach each other, and an elastic pressing member 4 is arranged in the groove structure 2, and the elastic pressing member 4 provides elastic force for the special-shaped probes 31 to press against the bottom wall 2 of the groove structure, and one end of the special-shaped probe 31 located in the groove structure 2 extends out of the probe board, and the extended end contacts the PCB board and squeezes the elastic pressing member 4 to contract, and each pin of the pin structure of the IGBT chip module extends between the two special-shaped probes 31 of each probe and movably abuts against the other end of the signal probe 32 in a one-to-one corresponding manner.

[0037] It can be understood that by setting the probes as special-shaped probes 31 and signal probes 32, the two special-shaped probes 31 are symmetrically arranged, the ends of the special-shaped probes 31 are connected to the probe board through the groove structure 2, and the other ends of the special-shaped probes 31 extend out of the probe board and connect with the pins. Each pin extends into the gap between each two special-shaped probes 31, and the special-shaped probes 31 are stretched open by squeezing the elastic abutment 5 so that the pins can maintain contact with the two special-shaped probes 31. The special-shaped probes 31 are maintained in contact with the PCB board by squeezing the elastic abutment 4. The special-shaped probes 31 have high voltage and current resistance capabilities, thereby achieving high current conduction testing in a narrow space.

[0038] In addition, this embodiment has two schemes for realizing Kelvin test. First, the special-shaped probe 31 and the signal probe 32 are combined. At this time, the signal probe 32 carries the electrical signal and the special-shaped probe 31 carries the large current. Second, one of the two special-shaped probes 31 carries the electrical signal and the other special-shaped probe 31 carries the large current.

[0039] Specifically, Figure 1As shown, the probe plate includes a first probe plate 11 and a second probe plate 12. A first mounting groove 21 is provided on the end surface of the first probe plate 11, and the first mounting groove 21 extends and is provided along the first direction. A plurality of first mounting grooves 21 are provided along the second direction at intervals, and the first direction and the second direction are perpendicular. A plurality of first through holes 211 are provided on the bottom wall of the first mounting groove 21, and the plurality of first through holes 211 are provided along the first direction at intervals; a second mounting groove 22 is provided on the end surface of the second probe plate 12, and a plurality of second mounting grooves 22 are provided and arranged in a rectangular array, and the layout and specific number of the plurality of second mounting grooves 22 match the pins of the IGBT chip module, and the first probe plate 11 and the second probe plate 12 are of the same size, and the two are fixedly connected by bolts after being stacked, so that the first mounting groove 21 and the second mounting groove 22 are connected and form the above-mentioned groove structure 2.

[0040] Preferably, if Figure 1 As shown, the special-shaped probe 31 of this embodiment includes a main body 311, a stop arm 312 and an arc-shaped contact portion 313. The main body 311 is arranged in a "T" shape, and the side of the main body 311 is connected to the side of the stop arm 312. One end of the main body 311 is inserted into the first through hole 211 and can be movably extended out of the first probe plate 11. The step surface of the main body 311 is movably placed on the bottom wall of the first mounting groove 21. The main body 311 is limited in the first mounting groove 21 by the second probe plate 12, and the stop arm 312 passes through the second mounting groove 22 and extends out of the second probe plate 12.

[0041] Among them, the inner diameter of the first through hole 211 is larger than the end diameter of the main body 311 inserted into the first through hole 211, so that a gap is left between the inner wall of the first through hole 211 and the main body 311, which can facilitate the end of the main body 311 to extend out of the first probe plate 11 or be retracted into the first through hole 211.

[0042] In addition, a gap is also left between the inner wall of the second mounting groove 22 and the retaining arm 312 to ensure that when the pin pushes the two special-shaped probes 31 apart, the distance between the two opposite inner walls of the second mounting groove 22 is sufficient to allow the retaining arm 312 to deform, thereby ensuring that the pin can smoothly enter between the two special-shaped probes 31.

[0043] Furthermore, if Figure 1 and Figure 2 As shown, the arc-shaped contact portion 313 is arranged at the end of the stop arm 312 away from the main body 311, and the distance between the two corresponding surfaces of the arc-shaped contact surfaces of the arc-shaped contact portions 313 of the two special-shaped probes 31 is smaller than the distance between the stop arms 312 of the two special-shaped probes 31, so that the pin and the arc-shaped contact portion 313 are elastically abutted, and the elastic component provides elastic force for the special-shaped probes 31, and the connection is more stable.

[0044] Furthermore, guide portions (not shown in the figure) are also provided at the ends of the arc-shaped contact portions 313 of the two special-shaped probes 31. The two guide portions are respectively inclined in a direction away from the other arc-shaped contact portion 313, so that the two guide portions are arranged in a "V" shape. When the pin is extended into the two special-shaped probes 31, the end edge of the pin first abuts against the inclined surface of the guide portion, so that the docking of the pin and the two special-shaped probes 31 is more guided, and the guide portion plays a role in positioning the chip pin.

[0045] The main body 311, the stop arm 312, the arc-shaped contact portion 313 and the guide portion of this embodiment are integrally formed by using sheet materials, and the structure is simple and easy to process. The specific forming method is bending forming, and other embodiments can also be formed by injection molding using a mold, which is not specifically limited in this embodiment. The integrally formed special-shaped probe 31 has a special probe structure that matches the pin structure of the IGBT chip, and its probe resistance is less than 10mΩ. The low resistance ensures the accuracy of the detection, and the special-shaped probe 31 has the ability to withstand 1500V voltage and 300A current, which can meet the requirements of a small space and realize the conduction of a large current.

[0046] Preferably, if Figure 1 and Figure 2 As shown, the elastic pressing member 4 is filled in the first installation groove 21, and provides the main body 311 with an elastic force pressing against the bottom wall of the first installation groove 21, so that one end of the main body 311 can be movably extended out of the first through hole 211 to contact the PCB board. Specifically, the elastic pressing member 4 of this embodiment is a rubber strip, the cross section of the rubber strip is circular, the length of the rubber strip matches the first installation groove 21, and the rubber strip is filled in the first installation groove 21 to press against all the main bodies 311 in the first installation groove 21, so that the integrity is better. Figure 1 As shown, when the rubber strip is in an unextruded state, the rubber strip fills the first mounting groove 21 and abuts against the end surface of the main body 311 and the end surface of the second probe card 12, and the end of the main body 311 extends from the first through hole 211; Figure 2 As shown, during detection, the end of the main body 311 elastically contacts the PCB board and pushes the main body 311 into the first through hole 211. The main body 311 squeezes the rubber strip to shrink. At the same time, the rubber strip provides elastic force for the contact between the main body 311 and the PCB board.

[0047] The elastic abutment member 5 is arranged on the side wall of the second installation slot 22 and abuts against the stop arm 312. Specifically, the elastic abutment member 5 of this embodiment is a spring. Spring slots (not shown in the figure) are arranged opposite to each other on the two opposite inner side walls of the first installation slot 21. The spring is correspondingly embedded in the spring slot. One end of the spring abuts against the side wall of the spring slot, and the other end of the spring abuts against the stop arm 312. The spring is easy to obtain and has low cost. Figure 1As shown, when the special-shaped probe 31 is in an uncompressed state, the spring is in a natural state; Figure 2 As shown, when the pin is inserted between the two special-shaped probes 31, it abuts against and stretches the arc-shaped contact portion 313, so that the stop arm 312 squeezes the spring for compression. At the same time, the spring provides elastic force for the contact between the arc-shaped contact portion 313 and the pin.

[0048] In summary, under the action of the rubber strip and the spring, the life of the special-shaped probe 31 can be greater than 1 million times, and the test is stable; the rubber strip and the spring can reset the special-shaped probe 31, which is convenient for re-testing and has high test efficiency.

[0049] In other embodiments, the elastic pressure member 4 and the elastic contact member 5 are not limited to springs and rubber strips, but can also be polymer materials such as silicone, fluororubber, nitrile rubber, etc., or metal materials such as springs. As long as it does not affect the test, any object that can provide elastic force to the special-shaped probe 31 can be used, and this embodiment does not make specific limitations on this.

[0050] Preferably, a plurality of first step holes 212 are provided on the bottom wall of the first mounting groove 21, one end of the signal probe 32 is inserted into the first step hole 212, and a second step hole 213 is provided on the end surface of the second probe plate 12. The first step hole 212 and the second step hole 213 are arranged opposite to each other, one end of the signal probe 32 is inserted into the first step hole, and the other end of the signal probe 32 is inserted into the second step hole 213. Such an arrangement facilitates the replacement and repair of the signal probe 32 after it is damaged.

[0051] Specifically, the signal probe 32 includes a needle head, a needle tube and a needle tail. One end of the needle tube is connected to the needle head, and the other end of the needle tube is connected to the needle tail. The needle tube is located in the first mounting groove 21 and the second mounting groove 22. The needle head passes through the first step hole 212 to contact the pin, one end of the needle tube movably abuts against the bottom wall of the first mounting groove 21, the needle tail passes through the second step hole 213 to contact the PCB board, and the other end of the needle tube movably abuts against the bottom wall of the second mounting groove 22.

[0052] The IGBT chip testing device of this embodiment also includes a guide member (not shown in the figure), which is connected to the probe plate by bolts. The guide member is provided with an embedding groove matching the IGBT chip, and the bottom wall of the embedding groove is provided with a plurality of second through holes for the pin structure to pass through. The plurality of second through holes are arranged in a one-to-one correspondence with each signal probe 32. By placing the IGBT chip to be tested in the embedding groove accordingly until it abuts against the bottom wall of the embedding groove, at this time, the pin structure on the IGBT chip passes through the second through hole and extends between the corresponding two special-shaped probes 31 and abuts against the signal probe 32, so that the docking step during the test is guided and easy to operate.

[0053] It should be noted that the elastic force applied by the spring to the special-shaped probe 31 is not sufficient to push the pin, ie, the IGBT chip, out of the embedding slot.

[0054] Obviously, the above embodiments of the present invention are merely examples for clearly illustrating the present invention, and are not intended to limit the embodiments of the present invention. For those skilled in the art, various obvious changes, readjustments and substitutions can be made without departing from the protection scope of the present invention. It is not necessary and impossible to list all the embodiments here. Any modifications, equivalent substitutions and improvements made within the spirit and principles of the present invention should be included in the protection scope of the claims of the present invention.

Claims

1. IGBT chip testing device, characterized in that: include: A probe plate, the end surface of which is provided with a groove structure (2); A plurality of probes are provided, wherein the plurality of probes are provided on the probe plate, wherein the probes include two symmetrically arranged special-shaped probes (31), one end of the two special-shaped probes (31) is embedded in the groove structure (2), elastic abutment members (5) are provided on two opposite side walls of the groove structure (2), and the elastic abutment members (5) provide elastic force for the other ends of the two special-shaped probes (31) to approach each other, and an elastic pressing member (4) is provided in the groove structure (2), and the elastic pressing member (4) provides elastic force for the special-shaped probes (31) to press against the bottom wall (2) of the groove structure; as well as A signal probe (32) is arranged between every two of the special-shaped probes (31), each of the signal probes (32) is connected to the probe board, each pin of the IGBT chip module extends between the two special-shaped probes (31) of each probe and is movably abutted against the other end of the signal probe (32) in a one-to-one correspondence; The probe board comprises a first probe board (11) and a second probe board (12); the end surface of the first probe board (11) is provided with a first mounting groove (21); the bottom wall of the first mounting groove (21) is provided with a plurality of first through holes (211); the second probe board (12) is provided with a second mounting groove (22); the first probe board (11) and the second probe board (12) are stacked and fixed so that the first mounting groove (21) and the second mounting groove (22) are connected to form the groove structure (2); The special-shaped probe (31) comprises a main body (311), a retaining arm (312) extending from a side of the main body (311), one end of the main body (311) being inserted into the first through hole (211) and confined in the first mounting groove (21), and the retaining arm (312) passing through the second mounting groove (22) and extending out of the second probe plate (12); The special-shaped probe (31) further comprises an arc-shaped contact portion (313), the arc-shaped contact portion (313) being arranged at an end of the stop arm (312) away from the main body (311), and the distance between two corresponding surfaces of the arc-shaped contact surfaces of the arc-shaped contact portions (313) of the two special-shaped probes (31) being smaller than the distance between the stop arms (312) of the two special-shaped probes (31).

2. The IGBT chip testing device according to claim 1, characterized in that: The distance between the ends of the arc-shaped contact portions (313) of the two special-shaped probes (31) away from the main body (311) is greater than the distance between two corresponding surfaces of the arc-shaped contact surfaces of the arc-shaped contact portions (313) of the two special-shaped probes (31).

3. The IGBT chip testing device according to claim 1, characterized in that: The main body (311), the stop arm (312) and the arc-shaped contact portion (313) are integrally formed.

4. The IGBT chip testing device according to claim 1, characterized in that: The elastic pressing member (4) is filled in the first mounting groove (21), the elastic pressing member (4) is in contact with each of the main body (311) and the second probe board (12), and provides the main body (311) with an elastic force to press against the bottom wall of the first mounting groove (21), so that one end of the main body (311) can be movably extended out of the first through hole (211) to contact the PCB board.

5. The IGBT chip testing device according to claim 4, characterized in that: The elastic abutment member (5) is arranged on a side wall of the second installation groove (22) and abuts against the stop arm (312).

6. The IGBT chip testing device according to claim 1, characterized in that: A first step hole (212) is formed on the bottom wall of the first mounting groove (21), and a second step hole (213) is formed on the end surface of the second probe plate (12). The first step hole (212) and the second step hole (213) are arranged opposite to each other, and one end of the signal probe (32) is plugged into the first step hole (212), and the other end is plugged into the second step hole (213).

7. The IGBT chip testing device according to any one of claims 1 to 6, characterized in that: The IGBT chip testing device further comprises: A guide member is connected to the probe plate, and the guide member is provided with a plurality of second through holes through which the pin structure can pass, and the plurality of second through holes are arranged in one-to-one correspondence with each of the signal probes (32).

8. The IGBT chip testing device according to claim 7, characterized in that: The guide member is provided with an embedding groove matching the IGBT chip, and the second through hole is provided on the bottom wall of the embedding groove.

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