A carrier platform with positioning function

Abstract

The present invention discloses a carrier platform with a positioning function, which relates to the field of precision instrument technology. The carrier platform comprises a first base and a first track matched therewith. The carrier platform comprises a first carrier plate, and the first carrier plate is evenly provided with no less than three carrier holes. The carrier holes accommodate a support assembly. The support assembly comprises a support base, and the upper end of the support base is provided with a support blind hole. The support blind hole is provided with a first spring. The first spring is connected to a support rod matched with the support blind hole. The support rod is wrapped with a support platform. The purpose of the present invention is to provide a carrier platform with a positioning function, which can ensure the stability and parallelism of the carried items, prevent the carried items from tipping over, avoid bumps and wear, and thus enhance the protective effect.

Description

Technical Field

[0001] The present invention belongs to the technical field of precision instruments, and in particular relates to a carrier platform with a positioning function. Background Art

[0002] For sliced ​​flaky objects such as wafers and silicon wafers, most optical inspections are performed using automatic optical inspection equipment. For example, before optical testing of silicon wafers, the wafers need to be placed on a dedicated carrier for silicon wafers, which will then position and fix the wafers. The carrier requires precise positioning and will not damage the surface of the wafers. Therefore, the design requirements for the carrier are relatively high, and the carrier can only be used for carrying silicon wafers. In the process of realizing the present invention, the inventors found that the existing carriers for positioning and fixing silicon wafers have at least the following shortcomings: ordinary carriers only support the testing and measurement of silicon wafers, and the structure and shape of the designed carriers can only be used for silicon wafers that are roughly circular, with a single function. For the detection of flaky objects of other shapes, it is necessary to customize the carrier or even the equipment separately, which has high equipment costs and may also require additional site space.

[0003] Existing technologies include an invention patent titled "Carrying Platform and Processing Equipment," with the publication number of JP2024073260A. This invention relates to a holding platform capable of changing the height of a held workpiece at any position, and a processing device equipped with the holding platform. The solution comprises a holding platform for holding a plate-shaped workpiece, a porous plate for adsorbing and holding the workpiece on an adsorption surface, and a lower surface opposite to the adsorption surface of the porous plate, comprising a plurality of independent pressure chambers separated circumferentially and radially at predetermined positions corresponding to the suction surface of the porous plate. This invention can support a variety of objects, but it cannot support objects that are larger or heavier. Summary of the Invention

[0004] The purpose of the present invention is to provide a carrying platform with a positioning function, which can ensure the stability and parallelism of the carried items, prevent the carried items from tipping over, avoid bumps and wear, and thus enhance the protective effect.

[0005] The technical solutions adopted by the present invention to achieve the above-mentioned purpose are:

[0006] A supporting platform with a positioning function includes a first base and a first track cooperating therewith, the first base is provided with a loading platform, the loading platform includes a first loading plate, the first loading plate is evenly provided with no less than three loading holes, a support assembly is accommodated in the loading hole, the support assembly includes a supporting base, a supporting blind hole is provided at the upper end of the supporting base, a first spring is provided in the supporting blind hole, the first spring is connected to a support rod cooperating with the supporting blind hole, and the support rod is wrapped with a support platform.

[0007] By adopting the above technical solution, the first base and the first track are slidably matched, and the first base can drive the loading platform to move back and forth along the length of the first track, and can stay at any position of the first track as needed, so that the loading platform can be positioned and the fixed-point transfer of the loaded items can be achieved.

[0008] The upper surface of the first carrier plate can be used to place the carried items, such as wafers, etc. The wafer to be transferred is placed on the top of the first carrier plate using a robot. The setting of the carrier hole and the support assembly can achieve a buffering effect on the wafer, thereby avoiding or reducing the probability of the wafer colliding or rubbing with the carrier and other components during the transfer process, thereby reducing the wear of the wafer and strengthening the protection of the wafer surface.

[0009] The elastic deformation of the first spring prevents the wafer from falling too quickly, providing a buffer and preventing excessive impact when the wafer contacts the first loading platform. This also improves the stability of the wafer's fall. In particular, the first loading plate is equipped with no fewer than three loading holes, ensuring balanced force on the wafer during its fall and preventing it from tilting or tipping. This ensures parallelism during wafer transfer, further reducing the risk of wafer wear.

[0010] Furthermore, the support platform is made of a flexible material, such as rubber, silicone, etc. In this way, the support platform has a certain deformation space, which can further improve the buffering effect and reduce the wear on the wafer.

[0011] According to an embodiment of the present invention, a lifting motor is provided on the first base, and an output end of the lifting motor is cooperatively connected to the loading platform.

[0012] According to an embodiment of the present invention, a rotary motor is provided on the first base body, and an output end of the rotary motor is cooperatively connected to the loading platform.

[0013] According to an embodiment of the present invention, an external thread is provided on the side of the support base, and an internal thread is provided on the inner side of the loading hole, and the external thread and the internal thread are matched with each other.

[0014] In this way, the tightness of the fit between the support base and the loading hole can be improved, so that in the process of the support rod and the support platform being forced to move downward, the coaxiality of the support rod and the loading hole can be improved, thereby ensuring the stability of the force direction of the items transferred to the top of the first loading plate, such as wafers, and preventing the wafers from tilting and rubbing.

[0015] In addition, the support base is threadedly matched with the loading hole, so that the height of the support assembly can be adjusted in the vertical direction, that is, in the axial direction of the loading hole. In other words, the height of the support rod and the support platform can be adjusted according to the different items carried, thereby improving practicality.

[0016] According to an embodiment of the present invention, the loading hole is connected to a first gas path.

[0017] Furthermore, the first air path passes through the interior of the first carrier plate and is connected to an external pump body. Air can be supplied to the interior of the first air path through the external pump body, thereby achieving airflow blowing on the support base, support table, etc. In this way, the use of the first air path to blow inside the carrier hole can prevent dust or other impurities from adhering or accumulating, thereby ensuring the flexibility of the movable parts in the support assembly. In addition, in addition to this, the use of an external air pump to supply air to the interior of the first air path can form a stable air film in the gap between the support base and the inner wall of the carrier hole, thereby improving the cushioning effect of the support assembly. The use of the air film between the support base and the inner wall of the carrier hole can further improve the stability of the support table and the support rod during the falling process.

[0018] According to an embodiment of the present invention, a second carrier plate is spaced apart from each other on the lower side of the first carrier plate, and a support hole is provided on the second carrier plate, and the support hole is matched with the support base.

[0019] This creates a double-layered loading platform, with a space between the first and second loading plates. When no items are placed on the loading platform, the support assembly extends from the support hole of the second loading plate and passes through the loading hole of the first loading plate, remaining exposed on the upper surface of the first loading plate. The second loading plate, in conjunction with the first loading plate, increases the loading capacity of the loading platform, while the space between the first and second loading plates also enhances cushioning performance.

[0020] In addition, the support holes on the second loading plate are arranged in a one-to-one correspondence with the loading holes on the first loading plate, which can ensure the verticality of the support base, support rods and other components in the support assembly. That is, it can ensure that when the object falls until it abuts the upper surface of the first loading plate, the direction of the force exerted on it by each supporting assembly is consistent, thereby ensuring the stability and levelness of the object.

[0021] According to an embodiment of the present invention, the supporting hole is connected to a second air path.

[0022] The second air path passes through the interior of the second carrier plate and is connected to an external pump body, through which air can be supplied to the interior of the second air path. In this way, using the external pump body to supply air to the interior of the second air path not only prevents dust from adhering or accumulating inside the support holes, ensuring smooth operation of the support assembly, but also drives the flow of air within the space between the first carrier plate and the second carrier plate, thereby ensuring that the air pressure inside each support hole remains consistent, thereby ensuring the consistency of the air film stability within each support hole, and thus ensuring that the support platforms and support rods in the multiple support assemblies move synchronously, that is, maintaining the consistency of the height of each support component, and preventing the objects from tipping over or losing their center of gravity during movement. BRIEF DESCRIPTION OF THE DRAWINGS

[0023] Figure 1It is a schematic diagram of a carrier platform with positioning function;

[0024] Figure 2 Schematic diagram of the coordination between the first loading plate and the second loading plate;

[0025] Figure 3 Schematic diagram of the supporting component structure;

[0026] Figure 4 Schematic diagram of the adsorption component structure.

[0027] Figure numbers: first base 1, lifting motor 11, rotating motor 12, first track 2, loading platform 3, first loading plate 31, loading hole 32, internal thread 33, second loading plate 34, support hole 35, support assembly 4, support base 41, support blind hole 42, first spring 43, support rod 44, support platform 45, external thread 46, adsorption assembly 5, adsorption base 51, bellows 52, horn 53. DETAILED DESCRIPTION

[0028] The technical solution of the present invention is further described in detail below with reference to the specific embodiments and the accompanying drawings:

[0029] Example 1:

[0030] Figure 1-Figure 3 The schematic diagram shows a carrier platform with a positioning function according to one embodiment of the present invention, which can be cooperated with a robot arm to transfer items such as wafers. The carrier platform includes a first base 1 and a first track 2 that cooperates with the base 1. The first base 1 is provided with a carrier platform 3, and the carrier platform 3 includes a first carrier plate 31. For ease of use, the first carrier plate 31 can be set to a circular shape that is compatible with the wafer.

[0031] The first base 1 and the first track 2 are slidably engaged, driving the loading platform 3 in reverse motion along the length of the first track 2. The platform can be positioned at any desired location on the track 2, effectively positioning the loading platform and enabling the transfer of items. Furthermore, the first base 1 is provided with a lifting motor 11 and a rotating motor 12. The output ends of the lifting motor 11 and the rotating motor 12 are respectively connected to the loading platform 3. Thus, the lifting motor 11 can drive the loading platform 3 to move vertically above the first base 1; similarly, the rotating motor 12 can drive the loading platform 3 to rotate along its vertical axis above the first base 1. In this way, the coordination between the first base 1 and the first track 2 enables the loading platform 3 to move up and down, left and right, and rotate left and right within a defined three-dimensional space. In other words, the loading platform 3 can move the items it carries within a defined space, facilitating the transfer of items. Furthermore, the first base 1 is also coordinated with the output end of the servo motor, and the servo motor can drive the first base 1 to move back and forth along the first track 2; the servo motor, the lifting motor 11 and the rotating motor 12 are all coordinated with the single-chip microcomputer, so that the starting position and the end position of the loading platform 3 can be set as needed, thereby realizing the fixed-point transfer of the objects and the precise positioning of the loading platform 3.

[0032] The first carrier plate 31 is used to accommodate the wafer to be transferred. It is evenly distributed with no fewer than three carrier holes 32. The carrier holes 32 accommodate a support assembly 4, which includes a support base 41. The upper end of the support base 41 is provided with a support blind hole 42. A first spring 43 is disposed within the support blind hole 42. The first spring 43 is connected to a support rod 44 that is configured to cooperate with the support blind hole 42. The support rod 44 is wrapped around a support platform 45. The end of the support platform 45, away from the support base 41, can be configured as an expansion structure, and its end surface is configured as a flat structure to facilitate contact with the wafer.

[0033] The wafer to be transferred is placed on top of the first loading plate 31 using a robot. The setting of the loading hole 32 and the support assembly 4 can achieve a buffering effect on the wafer, thereby avoiding or reducing the probability of the wafer colliding or rubbing with components such as the loading table 3 during the transfer process, thereby reducing the wear of the wafer and strengthening the protection of the wafer surface.

[0034] Specifically, during the falling process, the wafer abuts against the end face of the support platform 45 mounted on the outside of the support rod 44. Then, under the action of the weight of the wafer, the support platform 45 and the support rod 44 move downward, and the first spring 43 is compressed until the surface of the wafer abuts against the upper surface of the first carrier plate 31. During this process, the elastic deformation of the first spring 43 can be used to prevent the wafer from falling too fast, achieve buffering, avoid excessive impact force when the wafer contacts the first carrier plate 3, and improve the stability of the wafer's fall. In particular, the first carrier plate 31 is provided with no less than three carrier holes 32, so as to ensure that the wafer is subjected to balanced force during the falling process, avoid tilting or tipping of the wafer during the falling process, that is, ensure the parallelism of the wafer during the transfer process, and further reduce the probability of wafer wear.

[0035] Furthermore, the support platform 45 is made of a flexible material, such as rubber, silicone, etc. In this way, the support platform 45 has a certain deformation space, which can further improve the buffering effect and reduce the wear on the wafer.

[0036] An external thread 46 is formed on the side of the support base 41 , and an internal thread 33 is formed inside the loading hole 32 . The external thread 46 and the internal thread 33 are matched with each other.

[0037] In this way, the tightness of the fit between the support base 41 and the loading hole 32 can be improved, so that in the process of the support rod 44 and the support platform 45 being forced to move downward, the coaxiality of the support rod 44 and the loading hole 32 can be improved, thereby ensuring the stability of the force direction of the objects transferred to the top of the first loading plate 31, such as wafers, and preventing the wafers from tilting and rubbing.

[0038] In addition, the support base 41 is threadedly engaged with the loading hole 32, so that the height of the support assembly 4 can be adjusted in the vertical direction, that is, in the axial direction of the loading hole 32, that is, the height of the support rod 44 and the support platform 45 can be adjusted according to the different items carried, thereby improving practicality.

[0039] Furthermore, the support base 41 is constructed in the shape of a bellows 52. This allows the support base 41 to have a large deformation space, ensuring smooth movement of the support rods 44 and support platform 45 while also enhancing the cushioning effect of the support assembly 4. Furthermore, during deformation, the support base 41 can drive the flow of surrounding air, preventing dust and other impurities from adhering to the loading hole 32 and promoting localized air disturbances, thereby stabilizing the deformation amplitude of the support base 41. This prevents the support base 41 from excessive, instantaneous deformation, and avoids large, instantaneous displacement of the support rods 44 and support platform 45, thereby improving the stability of falling objects.

[0040] The loading hole 32 is connected to a first air path. Furthermore, the first air path passes through the interior of the first loading plate 31 and is connected to an external pump body. Air can be supplied to the interior of the first air path through the external pump body, thereby achieving airflow blowing on the support base 41, the support platform 45, etc. In this way, the use of the first air path to blow inside the loading hole 32 can prevent dust or other impurities from adhering or accumulating, and can prevent dust and the like from entering the gap between the support base 41 and the inner wall of the loading hole 32 and causing blockage; thereby ensuring the flexibility of the movable parts in the support assembly 4. In addition, by using an external air pump to supply air to the interior of the first air path, a stable air film can be formed in the gap between the support base 41 and the inner wall of the loading hole 32, thereby improving the buffering effect of the support assembly 4. The air film between the support base 41 and the inner wall of the loading hole 32 further enhances the stability of the support platform 45 and support rod 44 during the descent process. This prevents the support platform 45 from excessive deformation or rapid downward movement due to sudden force applied to the support platform 45, particularly at the moment when the object contacts the support platform 45. Furthermore, airflow from the loading hole 32 to the surface of the first loading plate 31 creates a relatively balanced support force between the descending object and the first loading plate 31, helping to ensure a stable descent. Furthermore, the air film prevents the first spring 43 from excessive deformation during a short period of time, thereby extending its service life.

[0041] In addition, the first carrier plate 31 is also provided with an adsorption component 5, which is connected to the air path of an external air pump and is used to form a negative pressure above the first carrier plate 31, which helps to achieve the adsorption of the wafer and prevent the wafer from being dislocated, moving excessively and deflecting during the transfer process with the carrier 3, thereby preventing wear.

[0042] Specifically, a plurality of adsorption holes are evenly arranged on the upper surface of the first carrier plate 31, and the adsorption assembly 5 is arranged inside the adsorption hole body, including a trumpet-shaped or funnel-shaped adsorption sleeve. The adsorption sleeve is made of a flexible material, such as rubber, silicone, etc., and its open end with a larger diameter is exposed on the outer surface of the first carrier plate 31, which is used to abut against the surface of the wafer; the open end of the adsorption sleeve with a smaller diameter extends into the interior of the adsorption hole body and is connected to an air pipe, which passes through the adsorption hole body and is connected to an external air pump. The external pump body is used to suck gas through the air pipe to form a negative pressure near the adsorption sleeve, thereby achieving adsorption of the wafer; the external pump body is used to supply air to the inside of the air pipe, so that the air pressure around the adsorption sleeve increases, which helps to achieve the release of the wafer. In this way, the adsorption assembly 5 can avoid friction between the wafer and the carrier stage 3, ensure the stability of the wafer during the transfer process, and prevent wear.

[0043] Example 2:

[0044] like Figure 2 and Figure 4As shown, a carrier platform with a positioning function according to another embodiment of the present invention is different from Example 1 in that no less than three adsorption components 5 are provided on the first carrier plate 31, and the adsorption component 5 includes an adsorption base 51. The adsorption base 51 is provided with a bellows 52 on the side away from the first carrier plate 31, and a horn member 53 is provided at the end of the bellows 52.

[0045] A second carrier plate 34 is spaced apart at the lower side of the first carrier plate 31 . The second carrier plate 34 is provided with a support hole 35 . The support hole 35 is matched with the support base 41 .

[0046] As a result, the loading platform 3 forms a double-layer structure, with a space between the first loading plate 31 and the second loading plate 34. When no items are placed on the loading platform 3, the support assembly 4 extends from the support hole 35 of the second loading plate 34 and passes through the loading hole 32 of the first loading plate 31, leaving it exposed on the upper surface of the first loading plate 31. The second loading plate 34 cooperates with the first loading plate 31 to increase the load-bearing capacity of the loading platform 3, and the space between the first loading plate 31 and the second loading plate 34 also improves the cushioning performance.

[0047] In addition, the support holes 35 on the second loading plate 34 are arranged in a one-to-one correspondence with the loading holes 32 on the first loading plate 31, which can ensure the verticality of the support base 41, support rod 44 and other components in the support assembly 4. That is, it can ensure that when the object falls until it abuts the upper surface of the first loading plate 31, the direction of the force exerted on it by each support assembly 4 is consistent, thereby ensuring the stability and levelness of the object.

[0048] The support holes 35 are connected to a second air path. The second air path passes through the interior of the second carrier plate 34 and is connected to an external pump body, through which air can be supplied to the interior of the second air path. In this way, using the external pump body to supply air to the interior of the second air path not only prevents dust from adhering or accumulating inside the support holes 35, ensuring smooth operation of the support assembly 4, but also drives the flow of air within the space between the first carrier plate 31 and the second carrier plate 34, thereby ensuring that the air pressure inside each support hole 35 remains consistent, thereby ensuring the consistency of the stability of the air film within each support hole 35, and thus ensuring that the support platforms 45 and support rods 44 in the multiple support assemblies 4 move synchronously, that is, maintaining the consistency of the height of each support component, and preventing the objects from tipping over or losing their center of gravity during movement.

[0049] The embodiments described above provide a detailed description of the technical solutions of the present invention. It should be understood that the above are only specific embodiments of the present invention and are not intended to limit the present invention. Any modifications, supplements or similar substitutions made within the scope of the principles of the present invention should be included in the scope of protection of the present invention.

Claims

1. A carrier platform with a positioning function, comprising a first base (1) and a first track (2) matched therewith, wherein a loading platform (3) is provided on the first base (1), characterized in that: The loading platform (3) includes a first loading plate (31), the first loading plate (31) is evenly provided with no less than three loading holes (32), the loading holes (32) contain a support assembly (4), the support assembly (4) includes a support base (41), the upper end of the support base (41) is provided with a support blind hole (42), the support blind hole (42) is provided with a first spring (43), the first spring (43) is connected to a support rod (44) arranged in conjunction with the support blind hole (42), and the support rod (44) is wrapped with a support platform (45); A lifting motor (11) is provided on the first base (1); A second carrier plate (34) is provided at a distance below the first carrier plate (31), and a support hole (35) is provided on the second carrier plate (34), and the support hole (35) is arranged in cooperation with the support base (41); The first carrier plate (31) is provided with no less than three adsorption components (5), the adsorption components (5) including an adsorption matrix (51), a bellows (52) being provided on a side of the adsorption matrix (51) away from the first carrier plate (31), and a horn (53) being provided at an end of the bellows (52); The supporting base (41) is a bellows (52)-shaped structure; the supporting hole (35) is connected to a second air path; the second air path passes through the interior of the second carrier plate (34) and is connected to an external pump body, and air is supplied to the interior of the second air path through the external pump body.

2. A carrier platform with positioning function according to claim 1, characterized in that: A rotating motor (12) is provided on the first base (1).

3. The carrier platform with positioning function according to claim 1, characterized in that: An external thread (46) is provided on the side of the support base (41), an internal thread (33) is provided on the inner side of the object-carrying hole (32), and the external thread (46) and the internal thread (33) are arranged in coordination.

4. The carrier platform with positioning function according to claim 1, characterized in that: The loading hole (32) is connected to a first gas path.

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