Wafer positioning and clamping device for thin film deposition

Abstract

The application relates to a wafer positioning and clamping device for thin film deposition, which comprises a base, a driving positioning block and a driven positioning block are slidably arranged on the base along a first direction, the two are arranged at intervals along the same path, a driving mechanism for driving the driving positioning block to reciprocate is arranged on the base, the space between the driving positioning block and the driven positioning block and the space between the driven positioning block and the side wall of the adjacent base constitute a positioning space for positioning and clamping a wafer, the height of the wafer clamping side wall of the base, the driven positioning block and the driving positioning block is not higher than the height of the upper surface of the wafer to be positioned, when the driving positioning block moves, the driven positioning block can be pushed by the wafer to move towards the side wall of the base to horizontally clamp and fix the wafer in each positioning space. The problems of excessive edge pressing of a conventional fixing part and obstruction of deposition caused by the excessive height of the fixing part are solved. The wafer surface is not shielded, the device can be applied to complex angle deposition, and the angle process window is large.

Description

TECHNICAL FIELD

[0001] The present application relates to the technical field of thin film deposition equipment, in particular to a wafer positioning and clamping device for thin film deposition. BACKGROUND

[0002] Currently, when depositing thin films on wafers of various sizes and shapes, common fixing methods such as using high-temperature adhesive tape or fixing the sample tray through metal pressing / pressing pins are used.

[0003] As disclosed in the Chinese invention patent document with application number CN116713837A, a wafer supporting table and a wafer thinning machine are adopted, which places the film rack (and wafer) on the wafer supporting table, and then switches the working position of the locking piece to take down the film rack from the wafer supporting table or place and lock the film rack to the wafer supporting table. The locking piece can press the pressing piece down through the second support, so that the pressing piece can press the film rack, thereby fixing the film rack.

[0004] This type of pressing piece form faces the problems of inconvenient sample fixing, large pressing piece height blocking deposition, and large fixed edge and pressing area when fixing wafers or irregular substrates. The pressing piece as a whole is high, affecting the angle process window during non-vertical deposition, which will affect subsequent process processing.

[0005] In addition, the pressing piece form for clamping often uses a circular positioning table on a conventional supporting table, which is pressed and fixed from the top and bottom of the wafer by several pressing pieces on the periphery. However, this method can only be used for single-piece positioning and clamping of standard wafers and wafers of uniform size. For non-standard wafers, special equipment is needed, and it cannot meet the synchronous positioning and clamping of multiple wafers, which lacks applicability and has high equipment cost. SUMMARY

[0006] The present application aims to provide a wafer positioning and clamping device for thin film deposition to solve the problems of complex operation, deposition blocking, lack of applicability for multiple wafers and non-standard wafers, etc. caused by the current wafer positioning and clamping method using the upper surface pressing piece form.

[0007] To solve the above problems, the wafer positioning and clamping device for thin film deposition adopts the following technical solution:

[0008] The wafer positioning and clamping device for thin film deposition comprises a base, a driving positioning block and a driven positioning block are slidably arranged on the base along a first direction, the two blocks are arranged at intervals along the same path, a driving mechanism is arranged on the base for driving the driving positioning block to reciprocate, the space between the driving positioning block and the driven positioning block and the space between the driven positioning block and the side wall of the base form a positioning space for positioning and clamping a wafer, the height of the side wall of the base, the driven positioning block and the driving positioning block for clamping the wafer is not higher than the height of the upper surface of the wafer to be positioned, when the driving positioning block moves, the driven positioning block can be pushed by the wafer to move towards the side wall of the base to horizontally clamp and fix the wafer in each positioning space.

[0009] Further, the driven positioning block is two or more, each driven positioning block is arranged at intervals along the first direction, and the driven positioning block and the driven positioning block form the positioning space.

[0010] Further, a guide groove extending along the first direction is arranged on the base, and the two side walls of the driving positioning block and the driven positioning block are slidably arranged in the guide groove.

[0011] Further, the driving mechanism comprises a screw rod rotatably arranged in the guide groove, a threaded hole penetrating through the driving positioning block along the first direction is arranged, and the screw rod is threadedly arranged in the threaded hole to drive the driving positioning block to reciprocate when the screw rod rotates.

[0012] Further, the driving mechanism further comprises an operating handle connected to the end of the screw rod.

[0013] Further, a through hole penetrating through the driven positioning block along the first direction is arranged, and the screw rod is arranged in the through hole and the threaded hole.

[0014] Further, a protective layer is arranged between the side of the driving positioning block away from the driven positioning block and the other side wall of the base.

[0015] Further, the driving positioning block is two or more, and is arranged at intervals along a second direction, and the second direction is perpendicular to the first direction.

[0016] Further, a horizontal step surface is arranged on the two side walls of the driving positioning block, the corresponding side wall of the driven positioning block and the side wall of the base, which form the two side walls of the positioning space, and the depth of the step surface is lower than the height of the wafer to be clamped, and the step surface is used for supporting the wafer.

[0017] Further, the two side walls of the positioning space, which are formed by the corresponding side wall of the driving positioning block, the corresponding side wall of the driven positioning block and the side wall of the base, are planes extending along a direction perpendicular to the first direction.

[0018] The beneficial effects of the present application are as follows: the wafer positioning and clamping device for thin film deposition adopts the relative arrangement of the driving positioning block and the driven positioning block, which is surrounded by the side wall of the base to form a plurality of positioning spaces arranged along the first direction, and the driving mechanism drives the driving positioning block to be precisely adjusted by manually sliding the driven positioning block, and the wafer is fixed by the two ends of the driving positioning block and the driven positioning block, and the synchronous positioning and clamping of the wafers in each positioning space between the driving positioning block and the driven positioning block, the driven positioning block and the side wall of the base can be realized by one driving mechanism, and the cooperation mode of the multiple positioning blocks can adapt to wafers of various size standards and non-standard sizes (the minimum processing size < 5mm*5mm), and the wafer edge is positioned and clamped by the peripheral extrusion, which solves the problems of excessive edge pressing of the conventional fixing part and high shielding deposition of the fixing part. The wafer surface is not shielded, which can be applied to complex angle deposition with a large angle process window. The angle window of non-vertical deposition is improved, which can be applied to various deposition angle processes, supports various size sample processing, and can be extended to etching and cleaning processes, and has a wide application prospect in multiple scenes; and the risk of wafer contamination caused by fixing and pressing is reduced, the critical condition of wafer edge drawing design is improved, the pollution of mechanical mechanism caused by multiple coating is eliminated, and the yield of chips can be further improved. BRIEF DESCRIPTION OF DRAWINGS

[0019] In order to more clearly illustrate the technical solutions of the embodiments of the present application, the drawings needed in the embodiments will be briefly introduced as follows:

[0020] Figure 1 The specific embodiment structure diagram of the wafer positioning and clamping device for thin film deposition of the present application is shown in the figure.

[0021] Figure 2 The top view of Figure 1 ;

[0022] Figure 3 The A-A sectional view in Figure 2 ;

[0023] Figure 4 The structure diagram of the device suitable for wafer is shown in the figure.

[0024] Explanation of reference signs: 1-base; 11-guide groove;

[0025] 2-driving positioning block; 21-threaded hole; 22-step surface;

[0026] 3-driven positioning block; 31-through hole;

[0027] 4-screw; 5-operation handle; 6-wafer; 7-positioning space; 8-protection layer. DETAILED DESCRIPTION

[0028] In order to make the technical purposes, technical solutions and beneficial effects of the present application more clear, the technical solutions of the present application are further described below in combination with the drawings and specific embodiments. It should be understood that the specific embodiments described herein are only used to explain the present application and are not used to limit the present application, that is, the described embodiments are only a part of the embodiments of the present application, but not all the embodiments. The components of the embodiments of the present application generally described and shown in the drawings herein can be arranged and designed in various different configurations.

[0029] The wafer positioning and clamping device for thin film deposition according to the present application includes a base 1, a driving positioning block 2, a driven positioning block 3 and a driving mechanism arranged on the base 1. The driving positioning block 2 and the driven positioning block 3 can slide along a first direction on the base 1, and the first direction is the left-right direction. In this embodiment, the driving mechanism is assembled on the base 1 and is in transmission connection with the driving positioning block 2. The driven positioning block 3 is arranged between the left side wall of the base 1 and the driving positioning block 2, and the movement path of the driving positioning block 2 is consistent with that of the driven positioning block 3. Specifically, the driven positioning block 3 is arranged in the space between the left side of the driving positioning block 2 and the right side of the left side wall of the base 1. The space between the driving positioning block 2 and the driven positioning block 3 and the space between the driven positioning block 3 and the adjacent side wall of the base 1 form a positioning space 7 for positioning and clamping a wafer. In the actual clamping process, the driving mechanism drives the driving positioning block 2 to move left, and when the driving positioning block 2 moves, it can push the driven positioning block 3 left through the wafer 6 to move towards the left side wall of the base 1 to horizontally clamp and fix the wafers 6 in each positioning space 7.

[0030] In the actual operation process, the left side wall of the driving positioning block 2 and the right side wall of the driven positioning block 3 form a positioning space 7, and the left side wall of the driven positioning block 3 and the left side wall of the base 1 form a positioning space 7. First, each wafer 6 is placed into each positioning space 7 arranged along the first direction, and then when the driving positioning block 2 moves left, it pushes the wafer 6 in the adjacent positioning space 7 to move left, at the same time, the wafer 6 pushes the driven positioning block 3 left, and the driven positioning block 3 further pushes the wafer 6 in another positioning space 7 to move left until it is attached to the left side wall of the base 1, thereby achieving the same clamping and fixing of the wafers 6 in each positioning space 7.

[0031] In order to avoid the obstruction of the upper surface of the wafer 6 and increase the process window, the height of the side wall of the base 1, the driven positioning block 3 and the driving positioning block 2 for clamping the wafer 6 is not higher than the height of the upper surface of the wafer 6 to be positioned. After the wafer 6 is positioned and clamped, the upper surface of the wafer 6 protrudes out of the positioning space 7, and the periphery is not obstructed, and only the horizontal clamping force can achieve the fixation of the wafer 6.

[0032] In order to realize the guiding sliding assembly of the driving positioning block 2 and the driven positioning block 3, the base 1 is provided with a guiding groove 11 extending in the first direction, and the two side walls of the driving positioning block 2 and the driven positioning block are guided and slidably assembled with the guiding groove 11. Specifically, as shown in Figure 1 The base 1 is a rectangular frame structure, and the guiding groove 11 extending in the left-right direction (i.e. the first direction) is arranged inside. The driving positioning block 2 and the driven positioning block 3 are inserted into the guiding groove 11 downward, and the front and rear side walls thereof are attached to the front and rear groove walls of the guiding groove 11, so as to realize the guiding sliding assembly.

[0033] In order to realize the driving of the driving positioning block 2, the driving mechanism includes a screw rod 4 rotatably assembled in the guiding groove 11. The driving positioning block 2 is provided with a threaded hole 21 arranged through in the left-right direction. The screw rod 4 is threadedly assembled with the threaded hole 21, so as to drive the driving positioning block 2 to reciprocate when the screw rod 4 rotates. The two ends of the screw rod 4 are rotatably assembled on the left and right side walls of the base 1. Meanwhile, the left end of the screw rod 4 protrudes out of the base 1 to the left, and a rotating handle is connected to the left end of the screw rod 4. In order to avoid the screw rod 4, the driven positioning block 3 is provided with a through hole 31 extending in the left-right direction. The screw rod 4 passes through the through hole 31 and is threadedly assembled with the threaded hole 21. In this way, during the rotation of the screw rod 4, the driving positioning block 2 can slide in the left-right direction, and the driven positioning block 3 can be pushed to the left by the driving positioning block 2 or the wafer 6.

[0034] The driving mode of the screw rod 4 is because the sample needs to be transferred in different cavities in high vacuum during preparation, and the process needs to accurately know the angle of the sample. The ordinary horizontal clamping driving mode may cause the sample to be loose and the angle to change, which may cause the sample preparation to fail. The manual driving form by the operating handle 5 can avoid the situation that the sample is clamped too tightly due to electric control or other control forms, and the sample with a thickness of about 0.5mm may be clamped and broken.

[0035] Of course, in other embodiments, an electric driving form can also be adopted, and a pressure sensor can be arranged on the corresponding clamping surface to realize the accurate control of the horizontal driving stroke and the clamping force by timely signal transmission. Other ways such as cam jacks and linkage mechanisms can also be used to drive the driving positioning block 2, which is not limited.

[0036] The space to the left of the active positioning block 2 in the base 1 is defined as the working space, and the space to the right of the active positioning block 2 is defined as the floating space. In order to prevent metal from growing onto the screw 4 and affecting its normal use as the number of film growth cycles increases, and to prevent impurities from entering the floating space and affecting the accurate and stable operation of the equipment, a protective layer 8 is provided between the right side wall of the active positioning block 2 and the right side wall of the base 1. The protective layer 8 can be a folding cover plate, or it can be a cover cloth, a flexible plastic plate, a rubber stretch cloth, etc.

[0037] To achieve precise clamping of the wafer while avoiding obstruction of the upper surface of the wafer 6, i.e., ensuring that the height of the sidewalls of the base 1, driven positioning block 3, and active positioning block 2 clamping the wafer 6 is not higher than the height of the upper surface of the wafer 6 to be positioned, in this embodiment, the upper surfaces of the base 1, driven positioning block 3, and active positioning block 2 are arranged at the same height. Simultaneously, horizontally extending stepped surfaces 22 are provided on the inner side of the left sidewall of the base 1, the two sidewalls of the driven positioning block 3, and the left sidewall of the active positioning block 2, forming the positioning space 7. The depth of the stepped surfaces 22 is lower than the height of the wafer 6 to be clamped. The stepped surfaces 22 are used to support the wafer 6. Specifically, the design of the stepped surfaces 22 facilitates the holding and clamping of the wafer. The height of the stepped surfaces 22 is 0.1-1mm, preferably 0.3-0.5mm, to accommodate the thickness requirements of most wafers 6.

[0038] To accommodate the size and specifications of the rectangular wafer 6, the positioning space 7 is constructed with planar structures extending in the front-rear direction on the inner side of the left side wall of the base 1, the two side walls of the driven positioning block 3, and the left side wall of the active positioning block 2. This ensures that the positioning space 7 is relatively fitted and fixed through planar contact during clamping.

[0039] In order to adapt to the size and specifications of the circular chip 6, such as Figure 4 As shown, the two side walls of the positioning space 7, which are formed on the inner side of the left side wall of the base 1, the two side walls of the driven positioning block 3, and the left side wall of the active positioning block 2, are arc-shaped surfaces that convex outward in opposite directions. The arc-shaped surfaces are crescent-shaped in general, which is adapted to the curvature design of the chip 6.

[0040] In order to adapt to the size and specifications of other types of circular wafers 6, the aforementioned two sidewalls can also be designed as structural forms that adapt to the periphery of the wafer, such as the flared surface of the polygonal wafer 6.

[0041] The positioning space 7 on the base 1 has two, in order to expand the number of positioning space 7, the synchronous positioning of the multi-chip 6, driven positioning block 3 more than two, each driven positioning block 3 is arranged along the left and right direction interval, driven positioning block 3 and driven positioning block 3 between the formation of positioning space 7. In order to achieve more chip 6 clamping, while ensuring the compactness of the base 1 structure design, the driven positioning block 2 has two or more, along the front and rear direction interval and parallel arrangement, corresponding guide slot 11, screw 4, operating handle 5 and so on are designed with two or more, with each driven positioning block 2 one-to-one correspondence.

[0042] Finally, it should be noted that: the above examples are for illustration only and not limit the technical solutions of the present application, any equivalent replacement and not departing from the spirit and scope of the present invention modification or partial replacement, which should be covered within the scope of the present application claim protection.

Claims

1. A wafer positioning and clamping device for thin film deposition, characterized by, The base is provided with a guide groove extending along the first direction, and two side walls of the active positioning block and the driven positioning block are slidably arranged in the guide groove.

2. The wafer positioning and chucking apparatus for thin film deposition according to claim 1, wherein The driven positioning block is provided with a through hole extending along the first direction, and the screw rod is arranged in the through hole and the threaded hole.

3. The wafer positioning and chucking apparatus for thin film deposition according to claim 2, wherein The active positioning block is provided with a through hole extending along the first direction, and the screw rod is arranged in the through hole and the threaded hole.

4. The wafer positioning and chucking apparatus for thin film deposition according to claim 3, wherein The active positioning block is provided with a through hole extending along the first direction, and the screw rod is arranged in the through hole and the threaded hole.

5. The wafer positioning and chucking apparatus for thin film deposition according to claim 4, wherein The active positioning block is provided with a through hole extending along the first direction, and the screw rod is arranged in the through hole and the threaded hole.

6. The wafer positioning and chucking apparatus for thin film deposition according to claim 4, wherein The active positioning block is provided with a through hole extending along the first direction, and the screw rod is arranged in the through hole and the threaded hole.

7. The wafer positioning and chucking apparatus for thin film deposition according to claim 4, wherein The active positioning block is provided with a through hole extending along the first direction, and the screw rod is arranged in the through hole and the threaded hole.

8. The wafer positioning and clamping device for thin film deposition according to any one of claims 1 to 7, wherein The active positioning block is provided with a through hole extending along the first direction, and the screw rod is arranged in the through hole and the threaded hole.

9. The wafer positioning and clamping device for thin film deposition according to any one of claims 1 to 7, wherein The active positioning block is provided with a through hole extending along the first direction, and the screw rod is arranged in the through hole and the threaded hole.

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