Electronic devices

Abstract

The present application provides an electronic device, which relates to the technical field of electronic products. The electronic device includes: a middle frame and a grounding structure. The middle frame includes a frame and a middle plate. The frame is arranged around the edge of the middle plate. The frame includes a first frame segment. The first frame segment is used to form an antenna radiator. The middle plate includes a body and an insulating part. The body is used as a reference ground for the electronic device. The body and the antenna radiator are connected through the insulating part. The grounding structure is fixed and electrically connected between the antenna radiator and the body, and is located on one side in the thickness direction of the middle plate. As a result, it is helpful to at least to a certain extent solve the problem that the temperature of a local area of ​​the frame rises sharply compared to the temperature of other areas of the frame, and it is helpful to at least to a certain extent improve the uniformity of the temperature of the frame and improve the user experience.

Description

Technical Field

[0001] The present application relates to the technical field of electronic products, and in particular to an electronic device. Background Art

[0002] In order to improve the reception and transmission capabilities of antenna signals in electronic devices, the frame of the electronic device is usually made of metal material, and a part of the frame is used as the antenna radiator of the antenna. Since metal has good thermal conductivity, the heat generated by the heat-generating components such as chips inside the electronic device is generally transferred to the frame through direct or indirect contact with the frame, and the heat is dissipated through the frame. Therefore, when the electronic device is used for a long time, the temperature of the frame will increase.

[0003] However, due to the structural layout of the electronic device, the temperature of a local area of ​​the frame rises sharply compared to the temperature of other areas of the frame, forming a local hot spot. The temperature of the frame is uneven, resulting in a poor user experience when the user holds the electronic device. Summary of the invention

[0004] The present application provides an electronic device that is conducive to at least to solving the problem of the temperature of a local area of ​​the frame rising sharply compared to the temperature of other areas of the frame to a certain extent, and is conducive to at least to improving the temperature uniformity of the frame to a certain extent, thereby improving the user experience.

[0005] In order to achieve the above objectives, this application adopts the following technical solutions:

[0006] The present application provides an electronic device, comprising: a middle frame and a grounding structure. The middle frame comprises a frame and a middle plate, the frame is arranged around the edge of the middle plate, the frame comprises a first frame segment, the first frame segment is used to form an antenna radiator, the middle plate comprises a body and an insulating portion, the body is used as a reference ground of the electronic device, and the body and the antenna radiator are connected through the insulating portion; the grounding structure is fixed and electrically connected between the antenna radiator and the body, and is located on one side of the middle plate in the thickness direction.

[0007] In the electronic device of the embodiment of the present application, the grounding structure is fixed and electrically connected between the antenna radiator and the body, and can provide a ground return path for the antenna, so as to realize the grounding of the antenna radiator. The grounding structure is located on one side of the middle plate in the thickness direction, and it can be known that the grounding structure is not embedded in the inside of the insulating part, that is, the grounding structure is not wrapped by the insulating part. In this way, on the one hand, the insulation effect of the grounding structure caused by the insulating part wrapping the grounding structure can be avoided, which is conducive to at least to a certain extent facilitating the grounding structure to dissipate heat to the surroundings, and then further achieve heat diffusion with the help of the structure or space around the grounding structure, so as to at least to a certain extent reduce the heat transferred from the grounding structure to the antenna radiator, and then to at least to a certain extent reduce the temperature of the position corresponding to the grounding structure on the antenna radiator and the area near the position, and then to at least to a certain extent improve the uniformity of the temperature of the frame.

[0008] In a possible implementation of the present application, the connection area between the ground structure and the body is less than or equal to 1 mm 2 This helps to increase the thermal resistance at the connection between the ground structure and the body, so as to reduce the heat conducted to the antenna radiator.

[0009] In a possible specific implementation of the present application, the connection area between the ground structure and the body is less than or equal to 0.5mm 2 This helps to increase the thermal resistance at the connection between the ground structure and the body, so as to reduce the heat conducted to the antenna radiator.

[0010] For example, the connection area between the ground structure and the body is 0.05 mm 2 , 0.1mm 2 , 0.15mm 2 , 0.2mm 2 , 0.25mm 2 , 0.3mm 2 , 0.35mm 2 , 0.4mm 2 or 0.45mm 2 .

[0011] In a possible implementation of the present application, the connection area between the ground structure and the antenna radiator is less than or equal to 1 mm 2 This helps to increase the thermal resistance of the connection between the ground structure and the antenna radiator, so as to reduce the heat conducted to the antenna radiator.

[0012] In a possible specific implementation of the present application, the connection area between the ground structure and the antenna radiator is less than or equal to 0.5 mm 2This helps to increase the thermal resistance of the connection between the ground structure and the antenna radiator, so as to reduce the heat conducted to the antenna radiator.

[0013] For example, the connection area between the ground structure and the antenna radiator is 0.05 mm 2 , 0.1mm 2 , 0.15mm 2 , 0.2mm 2 , 0.25mm 2 , 0.3mm 2 , 0.35mm 2 , 0.4mm 2 or 0.45mm 2 .

[0014] In a possible implementation of the present application, the grounding structure includes a grounding spring, the grounding spring includes a fixed section and a first elastic arm, the first elastic arm is connected to the fixed section, the fixed section is relatively fixed to the middle plate, and the first elastic arm abuts against the antenna radiator. In this way, by providing the grounding spring, the problem of a large cross-sectional area of ​​the grounding structure caused by being limited by the CNC process during the processing of the middle frame can be avoided, and the processing technology of the grounding spring is more diversified, which is conducive to processing the size of the grounding spring to be relatively small to a certain extent, so that when the first elastic arm is used to abut against the antenna radiator, it is conducive to reducing the connection area between the grounding structure and the antenna radiator (that is, the contact area between the first elastic arm and the antenna radiator) to a certain extent, and then it is conducive to increasing the thermal resistance of the grounding spring to a certain extent, reducing the transfer of heat from the body to the grounding spring, and also conducive to reducing the heat transferred from the grounding structure to the antenna radiator to a certain extent, and then it is conducive to reducing the temperature of the position corresponding to the grounding structure on the antenna radiator and the area near the position to a certain extent, and it is conducive to improving the uniformity of the temperature of the frame to a certain extent.

[0015] In a possible specific implementation of the present application, the electronic device further includes a carrier, the carrier is fixed to the middle plate, and the fixing section is fixed to the carrier. Thus, the arrangement of the carrier can facilitate fixing the grounding structure to the carrier, thereby facilitating the separation of the grounding structure from the insulating portion, so that the grounding structure can better dissipate heat.

[0016] In a possible specific implementation of the present application, the grounding spring also includes a second elastic arm, the second elastic arm is connected to the fixed section, and the second elastic arm abuts against the body. In this way, the grounding of the antenna radiator can be achieved by using the grounding spring, the structure is simple, and the processing technology of the grounding spring is more diversified, which is conducive to processing the size of the grounding spring to be relatively small to a certain extent, so that when the second elastic arm is used to abut against the body, it is conducive to reducing the connection area between the grounding structure and the body (that is, the contact area between the second elastic arm and the body) to a certain extent, and then it is conducive to increasing the thermal resistance of the grounding spring to a certain extent, reducing the transfer of heat from the body to the grounding spring, and also conducive to reducing the heat transferred from the grounding structure to the antenna radiator to a certain extent, and then it is conducive to reducing the temperature of the position corresponding to the grounding structure on the antenna radiator and the area near the position to a certain extent, and it is conducive to improving the uniformity of the temperature of the frame to a certain extent.

[0017] In a possible specific implementation of the present application, the first elastic arm, the second elastic arm and the fixed section are an integrally formed part, which is helpful to improve the structural strength of the grounding spring sheet, simplify the processing technology of the grounding spring sheet, and improve the processing efficiency.

[0018] In a possible specific implementation of the present application, the carrier is a circuit board, which is located on the inner peripheral side of the frame and is stacked and fixed to the middle plate. In this way, it is possible to avoid setting up a carrier inside the electronic device, which is conducive to improving the compactness of the electronic device, reducing the thickness of the electronic device, and reducing the cost of the carrier.

[0019] On this basis, the circuit board includes a first board segment and a second board segment, the first board segment and the second board segment are arranged and connected in a direction parallel to the circuit board, the thermal conductivity of the first board segment is smaller than the thermal conductivity of the second board segment, the fixed segment is fixed to the first board segment, and the electronic components on the circuit board are all arranged at the second board segment. As a result, on the one hand, the electronic components on the circuit board are all arranged at the second board segment, that is, no electronic components are arranged at the first board segment, so it can be avoided that the electronic components generate heat at the first board segment. On the other hand, the thermal conductivity of the first board segment is smaller than the thermal conductivity of the second board segment, which can reduce the heat transfer from the second board segment to the first board segment. Combining the above two aspects, when the fixed segment is fixed to the first board segment with a relatively low thermal conductivity, it is beneficial to reduce the transfer of heat to the fixed segment.

[0020] In a possible specific implementation of the present application, the first plate segment is an insulator. Therefore, no metal is provided in the first plate segment, which can not only avoid the short circuit problem caused by the contact between the grounding spring and the metal layer or electronic components at the second plate segment, but also reduce the thermal conductivity of the first plate segment, prevent the heat at the second plate segment from being transferred to the grounding spring through the first plate segment, which is beneficial to reduce the heat transferred from the grounding structure to the antenna radiator, and then help reduce the temperature of the position corresponding to the grounding structure on the antenna radiator and the area near the position, which is beneficial to improve the temperature uniformity of the frame.

[0021] In a possible specific implementation of the present application, the grounding structure also includes a transfer spring, the transfer spring includes a fixed portion and a third elastic arm, the third elastic arm is connected to the fixed portion, the fixed portion is fixed to the carrier, the third elastic arm abuts and is electrically connected to the body, and the fixed portion is electrically connected to the fixed section. In this way, by setting the grounding spring and the transfer spring, it is convenient to separate the grounding spring and the transfer spring, that is, the transfer spring and the grounding spring are not integrally formed, and the transfer spring and the grounding spring can be processed separately, thereby simplifying the processing technology of the grounding spring and the transfer spring, which is conducive to processing the size of the grounding spring and the transfer spring smaller to a certain extent, thereby reducing the heat transferred from the grounding structure to the antenna radiator, and then it is conducive to reducing the temperature of the position of the corresponding grounding structure on the antenna radiator and the area near the position to a certain extent, which is conducive to improving the uniformity of the temperature of the frame to a certain extent. In addition, the setting of the two springs of the grounding spring and the transfer spring is also conducive to reasonably optimizing the position relationship between the grounding spring and the transfer spring according to the structural layout of the electronic device, thereby improving the structural compactness of the electronic device.

[0022] In a possible specific implementation of the present application, the fixing portion and the fixing section are arranged on the carrier at intervals; the grounding structure further includes a conductive section, the conductive section is fixed to the carrier, and the conductive section is fixed and electrically connected between the fixing portion and the fixing section. This is conducive to reasonably optimizing the layout of the grounding structure according to actual design needs.

[0023] In a possible specific implementation of the present application, the carrier is a circuit board, the circuit board is located on the inner peripheral side of the frame, and is stacked and fixed on the middle plate, the circuit board includes a first plate segment and a second plate segment, the first plate segment and the second plate segment are arranged and connected in a direction parallel to the circuit board, the thermal conductivity of the first plate segment is less than the thermal conductivity of the second plate segment, the fixed segment and the fixed portion are both fixed to the first plate segment, and the electronic components on the circuit board are all arranged at the second plate segment. As a result, on the one hand, the electronic components on the circuit board are all arranged at the second plate segment, that is, no electronic components are arranged at the first plate segment, so that the electronic components can be prevented from generating heat at the first plate segment. On the other hand, the thermal conductivity of the first plate segment is less than the thermal conductivity of the second plate segment, which can reduce the heat transfer from the second plate segment to the first plate segment. Combining the above two aspects, when the fixed segment is fixed to the first plate segment with a relatively low thermal conductivity, it is beneficial to reduce the transfer of heat to the fixed segment.

[0024] In a possible specific implementation of the present application, the first plate segment is composed of an insulator and a conductive layer, the conductive layer is fixed to the insulator, and the conductive layer defines a conductive segment. In this way, the conductive layer of the first plate segment itself can be used to achieve electrical connection between the fixed portion and the fixed segment, so there is no need to set up a conductive segment separately, and the entire structure is simpler and more compact. At the same time, since only one conductive layer is set up, the thermal conductivity of the first plate segment is poor. Therefore, when the fixed segment and the fixed portion are fixed to the first plate segment, the heat at the second plate segment can be prevented from being transferred to the grounding structure, which is beneficial to reducing the heat transferred from the grounding structure to the antenna radiator, and then it is beneficial to reduce the temperature of the position corresponding to the grounding structure on the antenna radiator and the area near the position, which is beneficial to improve the temperature uniformity of the frame to a certain extent.

[0025] In a possible specific implementation of the present application, the second board segment includes multiple metal layers and multiple insulating dielectric layers, which are alternately arranged and stacked in the thickness direction of the circuit board, and the metal layers are insulated and separated from the conductive layers. In this way, on the one hand, the short circuit problem caused by the electrical connection between the grounding structure and the metal layer or electronic components at the second board segment can be avoided, and on the other hand, the heat at the second board segment can be further prevented from being transferred to the conductive layer, which is beneficial to avoid the transfer of heat at the first board segment to the grounding spring sheet, and is also beneficial to reduce the heat transferred from the grounding structure to the antenna radiator, which is beneficial to reduce the temperature of the position corresponding to the grounding structure on the antenna radiator and the area near the position, which is beneficial to improve the temperature uniformity of the frame to a certain extent.

[0026] Exemplarily, the second board segment includes multiple metal layers and multiple insulating dielectric layers, and the multiple metal layers and the multiple insulating dielectric layers are alternately arranged and stacked in the thickness direction of the circuit board. The multiple insulating dielectric layers are made of the same material as the insulator and are connected as a whole. Thus, the insulating dielectric layers and the insulator can be processed simultaneously, which is conducive to simplifying the processing technology.

[0027] Exemplarily, the material of the insulator includes but is not limited to plastic, such as epoxy resin, polyimide, etc.

[0028] In a possible specific implementation of the present application, the surface of the antenna radiator facing the inside of the electronic device has a protrusion extending in the direction of the inside of the electronic device, the surface of the middle plate facing the grounding structure is the first surface, and the first elastic arm abuts against the surface of the protrusion that is consistent with the first surface. In this way, the assembly of the grounding spring can be more convenient.

[0029] Exemplarily, the first elastic arm and the second elastic arm are symmetrically arranged relative to the fixed section, thereby facilitating the improvement of the symmetry of the force applied to the grounding spring piece and the improvement of the service life of the grounding spring piece.

[0030] In a possible implementation of the present application, the grounding structure includes a first connection section and a first welding point structure, a first gap is provided between the first connection section and the antenna radiator, the first welding point structure is located in the first gap, and connects the first connection section and the antenna radiator. By providing a first gap between the first connection section and the antenna radiator, and connecting the first connection section and the antenna radiator using the first welding point structure located in the first gap, on the one hand, the electrical connection between the antenna radiator and the grounding structure can be achieved, and on the other hand, the connection area between the first welding point structure and the first connection section and the connection area between the first welding point structure and the antenna radiator are both small, which is conducive to increasing the thermal resistance of the grounding structure at the position between the first connection section and the antenna radiator, and is conducive to reducing the heat transferred from the grounding structure to the antenna radiator to a certain extent, and then is conducive to at least reducing the temperature of the position corresponding to the grounding structure on the antenna radiator and the area near the position, and is conducive to improving the uniformity of the frame temperature to a certain extent.

[0031] In some examples, considering the connection reliability between the first connecting section and the antenna radiator, there may be a plurality of first welding point structures.

[0032] In order to take into account both the connection reliability between the first connection section and the antenna radiator and to increase the thermal resistance of the ground structure at a position between the first connection section and the antenna radiator, the number of the first solder joint structures may be 2 to 5.

[0033] In a possible specific implementation of the present application, the grounding structure includes a second connecting section and a second welding point structure, the second connecting section is connected to the first connecting section, a second gap is provided between the second connecting section and the body, the second welding point structure is located in the second gap, and connects the second connecting section and the antenna radiator. In this way, by providing a second gap between the second connecting section and the body, and connecting the second connecting section and the body by using the second welding point structure located in the second gap, on the one hand, the electrical connection between the body and the grounding structure can be achieved, and on the other hand, the connection area between the second welding point structure and the second connecting section and the connection area between the second welding point structure and the body are both small, which is conducive to increasing the thermal resistance of the grounding structure at the position between the second connecting section and the body, and is conducive to reducing the heat transferred from the grounding structure to the antenna radiator to a certain extent, and then is conducive to reducing the temperature of the position corresponding to the grounding structure on the antenna radiator and the area near the position to a certain extent, and is conducive to improving the uniformity of the temperature of the frame to a certain extent.

[0034] In some examples, considering the connection reliability between the second connecting segment and the body, the second welding point structure may be multiple.

[0035] In order to take into account both the connection reliability between the second connection section and the body and to increase the thermal resistance of the grounding structure at a position between the second connection section and the body, the number of the second solder joint structures may be 2 to 5.

[0036] In a possible specific implementation of the present application, the grounding structure further includes a third connecting segment, the third connecting member is connected between the first connecting segment and the second connecting segment, and the third connecting segment is fixed to the surface of the insulating portion. In this way, by providing the third connecting segment connected between the second connecting segment and the first connecting segment and fixing the third connecting segment to the insulating portion, the reliability of the connection between the grounding structure and the middle frame is improved.

[0037] In a possible specific implementation of the present application, the third connecting section is bonded to the surface of the insulating portion through an adhesive layer, thereby making the connection method simple and convenient for assembly.

[0038] In a possible specific implementation of the present application, the first connecting section, the second connecting section, and the third connecting section are an integrally formed part, which is beneficial to improving the structural strength of the grounding structure, simplifying the processing technology of the grounding structure, and improving the processing efficiency.

[0039] In a possible implementation of the present application, the electronic device includes a screen, a back cover and a circuit board. The screen is stacked with the middle plate, the back cover is stacked on the side of the middle plate away from the screen, the frame is arranged around the edge of the screen and the back cover, the circuit board is fixed to the side of the middle plate facing the back cover, and the grounding structure is located on the side of the middle plate close to the back cover. Since the circuit board is located on the side of the middle plate close to the back cover, by setting the grounding structure on the side of the middle plate close to the back cover, it is beneficial to optimize the structural layout of the electronic device and reduce the thickness of the electronic device.

[0040] In a possible specific implementation of the present application, a first step is formed at one end of the inner circumference of the frame and is recessed in a direction away from the central axis of the frame, and the front cover of the screen is supported on the first step. In this way, the screen can be positioned and installed using the first step, thereby improving the installation efficiency of the electronic device.

[0041] In a possible specific implementation of the present application, the vertical projection of the grounding structure on the middle plate overlaps with the insulating portion, which is helpful to shorten the size of the grounding structure in the arrangement direction of the body and the antenna radiation, thereby shortening the return path of the antenna radiator.

[0042] In a possible specific implementation of the present application, a second step is formed at the other end of the inner circumference of the frame, which is recessed in a direction away from the central axis of the frame, and the back cover is supported on the second step. In this way, the back cover can be positioned and installed by using the second step, thereby improving the installation efficiency of the electronic device. BRIEF DESCRIPTION OF THE DRAWINGS

[0043] Figure 1 A perspective view of an electronic device according to some embodiments provided by the present application;

[0044] Figure 2 Based on Figure 1 an exploded schematic diagram of the electronic device shown;

[0045] Figure 3 Based on Figure 1 A schematic diagram of the cross-sectional structure of the electronic device shown at line A1-A1;

[0046] Figure 4 Based on Figure 2 A schematic diagram of the middle frame shown;

[0047] Figure 5 Based on Figure 3 An enlarged view of the portion of the electronic device shown circled at B1;

[0048] Figure 6 Schematic diagram of electronic devices provided for other embodiments of the present application;

[0049] Figure 7 Based on Figure 6 A schematic diagram of the cross-sectional structure of the electronic device shown at line A2-A2;

[0050] Figure 8 Based on Figure 7 An enlarged view of the portion of the electronic device shown circled at B2;

[0051] Fig. 9 Based on Figure 6 The assembly diagram of the middle frame, circuit board and grounding structure shown;

[0052] Fig.10 Based on Figure 7 A schematic diagram of the circuit board shown;

[0053] Fig.11 Based on Figure 1-Figure 5 The simulation heat map of the middle frame in the related art shown in FIG. Figure 6-Figure 10 The simulated thermal map of the middle frame shown;

[0054] Fig.12 Based on Figure 6 A schematic diagram showing the connection between a portion of the middle frame, a circuit board and an antenna;

[0055] Fig.13 A schematic diagram of an electronic device provided for some further embodiments of the present application;

[0056] Fig.14 Based on Fig.13 A schematic diagram of the cross-sectional structure of the electronic device shown at line A3-A3;

[0057] Fig.15 Based on Fig.14 An enlarged view of the portion of the electronic device shown circled at B3;

[0058] Fig.16 Schematic diagram of electronic devices provided for some other embodiments of the present application;

[0059] Fig.17 Based on Fig.16 A schematic diagram of the cross-sectional structure of the electronic device shown at line A4-A4;

[0060] Fig.18 Based on Fig.17 An enlarged view of the portion of the electronic device shown circled at B4;

[0061] Fig.19 Based on Fig.16 Schematic diagram of the positional relationship between the middle frame, the transfer spring, the grounding spring and the circuit board in the electronic device shown in ;

[0062] Fig. 20 Based on Fig.19 A schematic diagram of the cross-sectional structure of the circuit board shown;

[0063] Fig.21 Schematic diagram of a middle frame and a grounding structure provided for some other embodiments of the present application;

[0064] Fig. 22 Based on Fig.21 The structure shown is a schematic diagram of the cross-section structure at line A5-A5;

[0065] Fig.23 Based on Fig. 22 The structure shown is an enlarged view of the circled portion at B5. DETAILED DESCRIPTION

[0066] In the embodiments of the present application, the terms "exemplarily" or "for example" are used to indicate examples, illustrations or descriptions. Any embodiment or design described as "exemplarily" or "for example" in the embodiments of the present application should not be interpreted as being more preferred or more advantageous than other embodiments or designs. Specifically, the use of words such as "exemplarily" or "for example" is intended to present related concepts in a specific way.

[0067] In the description of the embodiments of the present application, the term "and / or" refers to and covers any and all possible combinations of one or more of the associated listed items. The term "and / or" is a description of the association relationship of associated objects, indicating that three relationships may exist. For example, A and / or B can represent: A exists alone, A and B exist at the same time, and B exists alone. In addition, the character " / " in the present application generally indicates that the associated objects before and after are in an "or" relationship.

[0068] In the description of the embodiments of the present application, unless otherwise clearly specified and limited, the terms "installed", "connected" and "connected" should be understood in a broad sense. For example, "connection" can be a detachable connection or a non-detachable connection; it can be a direct connection or an indirect connection through an intermediate medium.

[0069] In the description of the embodiments of the present application, the terms "comprise", "include" or any other variants thereof are intended to cover non-exclusive inclusion, so that a process, method, article or device including a series of elements includes not only those elements, but also includes other elements not explicitly listed, or also includes elements inherent to such process, method, article or device. In the absence of further restrictions, an element defined by the statement "comprises a ..." does not exclude the presence of other identical elements in the process, method, article or device including the element. In the absence of further restrictions, an element defined by the statement "comprises a ..." does not exclude the presence of other identical elements in the process, method, article or device including the element.

[0070] As used herein, "parallel", "perpendicular", and "equal" include the situations described and situations similar to the situations described, and the range of the similar situations is within the acceptable deviation range, wherein the acceptable deviation range is determined by a person of ordinary skill in the art taking into account the measurement in question and the errors associated with the measurement of a particular quantity (i.e., the limitations of the measurement system). For example, "parallel" includes absolute parallelism and approximate parallelism, wherein the acceptable deviation range of approximate parallelism can be, for example, a deviation within ±10°; "perpendicular" includes absolute perpendicularity and approximate perpendicularity, wherein the acceptable deviation range of approximate perpendicularity can also be, for example, a deviation within ±10°. "Equal" includes absolute equality and approximate equality, wherein the acceptable deviation range of approximate equality can be, for example, the difference between the two equalities is less than or equal to 5% of either one.

[0071] The present application provides an electronic device, which is a type of electronic device that supports audio playback. Specifically, the electronic device can be a portable electronic device or other suitable electronic device. For example, the electronic device can be a mobile phone, a tablet personal computer, a laptop computer, a personal digital assistant (PDA), a camera, a personal computer, a notebook computer, a vehicle-mounted device, a wearable device (such as a watch or a bracelet), augmented reality (AR) glasses, an AR helmet, virtual reality (VR) glasses or a VR helmet, etc.

[0072] See also Figure 1 and Figure 2 ,in, Figure 1 is a perspective view of an electronic device 100 according to some embodiments provided by the present application; Figure 2 Based on Figure 1The exploded schematic diagram of the electronic device 100 is shown. In this embodiment, the electronic device 100 is a mobile phone. The electronic device 100 may include a screen 10, a middle frame 20, a back cover 30, a circuit board 40, a battery 50 and an antenna 80.

[0073] Understandably, Figure 1 and Figure 2 Only some components of the electronic device 100 are schematically shown, and the actual shapes, sizes, positions and structures of these components are not subject to the present invention. Figure 1 and Figure 2 In some other examples, the electronic device 100 may not include the screen 10.

[0074] The screen 10 is used to display image information, video information, etc. The screen 10 includes a front cover plate 11 and a display screen 12. The front cover plate 11 is in the shape of a flat plate. Specifically, the shape of the front cover plate 11 includes but is not limited to a rectangular flat plate, a square flat plate, an oblong flat plate, a circular flat plate and an elliptical flat plate. The material of the front cover plate 11 includes but is not limited to glass, plastic and ceramic. The front cover plate 11 and the display screen 12 are stacked and fixedly connected. The connection method between the front cover plate 11 and the display screen 12 includes but is not limited to gluing. The front cover plate 11 is mainly used to protect the display screen 12 and prevent dust.

[0075] The display screen 12 may be a flexible display screen or a rigid display screen. For example, the display screen 12 may be an organic light-emitting diode (OLED) display screen, a quantum dot light emitting diode (QLED) display screen, or a liquid crystal display (LCD) display screen, etc. The front cover plate 11 is light-transmissive, and the display surface of the display screen 12 faces the front cover plate 11, so that the image, video and other information displayed by the display screen 12 can be observed by the user through the front cover plate 11.

[0076] In order to facilitate the description of each embodiment below, an XYZ coordinate system is established for the electronic device 100. Specifically, the thickness direction of the electronic device 100 (that is, the stacking direction of the front cover plate 11 and the display screen 12) is defined as the Z-axis direction, and the directions perpendicular to the Z-axis direction are the X-axis direction and the Y-axis direction, and the X-axis direction is perpendicular to the Y-axis direction. Specifically, in this embodiment, the electronic device 100 is in the shape of a rectangular flat plate, wherein the length direction of the electronic device 100 is the Y-axis direction, and the width direction of the electronic device 100 is the X-axis direction. It can be understood that the coordinate system setting of the electronic device 100 can be flexibly set according to actual needs, and is not specifically limited here.

[0077] Please continue reading Figure 2 The middle frame 20 includes a middle plate 22 and a frame 21 .

[0078] The middle plate 22 is in the shape of a flat plate. The shape of the middle plate 22 is adapted to the shape of the front cover plate 11. The middle plate 22 is located on the side of the display screen 12 away from the front cover plate 11, and the middle plate 22 is stacked with the screen 10. The middle plate 22 is used as the structural "skeleton" of the electronic device 100, and the circuit board 40, the battery 50, etc. can be fixed on the middle plate 22.

[0079] The frame 21 is arranged around the edge of the middle plate 22 and the screen 10. Figure 2 , and combined with Figure 3 , Figure 3 Based on Figure 1 The schematic diagram of the cross-sectional structure of the electronic device 100 shown is at the A1-A1 line. Wherein, "A1-A1 line" refers to the plane where the A1-A1 line and the arrows at both ends of the A1-A1 line are located. The description of similar drawings in the following text should be understood in the same way and will not be repeated in the following text. A first step 213 that is recessed in a direction away from the central axis of the frame 21 is formed at one end of the inner circumference of the frame 21, and the front cover 11 is supported on the first step 213. In this way, the first step 213 can be used to position and install the screen 10, thereby improving the installation efficiency of the electronic device 100. Of course, it can be understood that in other examples, the first step 213 may not be provided on the frame 21.

[0080] The middle frame 20 may be an integrally formed structure, that is, the middle plate 22 and the frame 21 are an integral structure. This is conducive to improving the structural strength of the middle frame 20, and simplifying the processing technology of the middle frame 20, which can reduce the production cost of the middle frame 20. Of course, the present application is not limited to this. In other examples, the middle frame 20 may also be formed by assembling the frame 21 and the middle plate 22, and the connection method between the frame 21 and the middle plate 22 includes but is not limited to gluing, clamping, screw connection and welding, etc.

[0081] The back cover 30 is in the shape of a flat plate. The shape of the back cover 30 includes but is not limited to a rectangular flat plate, an oblong flat plate, a circular flat plate or an elliptical flat plate. Specifically, the shape of the back cover 30 is adapted to the shape of the front cover 11. The material of the back cover 30 includes but is not limited to glass, plastic, metal and ceramic.

[0082] Please continue reading Figure 2 and Figure 3, the back cover 30 is located on the side of the middle plate 22 away from the screen 10, and the back cover 30 is stacked and spaced with the middle plate 22. The frame 21 is arranged around the back cover 30 and is fixed to the back cover 30. Exemplarily, the frame 21 can be fixedly connected to the back cover 30 by gluing, welding or clamping. Specifically, the other end of the inner circumference of the frame 21 is formed with a second step 214 that is recessed in a direction away from the central axis of the frame 21, and the back cover 30 is supported on the second step 214. In this way, the second step 214 can be used to position and install the back cover 30, thereby improving the installation efficiency of the electronic device 100. Of course, it can be understood that in other examples, the second step 214 may not be provided on the frame 21.

[0083] It is worth noting that when the frame 21 and the middle plate 22 are not an integral structure, the frame 21 can be an integrally formed structure with the back cover 30, that is, the frame 21 and the back cover 30 are an integral structure.

[0084] Specifically, the circuit board 40 is laminated and fixed on the side surface of the middle plate 22 facing the back cover 30. For example, the circuit board 40 can be fixed on the surface of the middle plate 22 facing the back cover 30 by means of threaded connection, clamping, gluing or welding.

[0085] In some embodiments, there may be multiple circuit boards 40, and the multiple circuit boards 40 may be used to integrate different electronic components to implement different functions of the electronic device 100. Figure 2 and Figure 3 As shown, there are two circuit boards 40. The two circuit boards 40 are electrically connected through a connection structure 60 to achieve data and signal transmission between the two. Among them, the connection structure 60 can be a flexible printed circuit (FPC). In other embodiments, the connection structure 60 can also be a wire or an enameled wire.

[0086] Understandably, Figure 2 and Figure 3 The two circuit boards 40 shown are for illustration only, which cannot constitute a special limitation to the present application. In other examples, the number of the circuit boards 40 can also be one, three or four.

[0087] The battery 50 is located between the two circuit boards 40. The battery 50 is used to provide power for the circuit boards 40, the screen 10, etc.

[0088] In some embodiments, in order to facilitate the installation of the two circuit boards 40 and the battery 50, a first partition rib 223 and a second partition rib 224 are provided on the surface of the middle plate 22 facing the back cover 30. The first partition rib 223 and the second partition rib 224 protrude from the surface of the middle plate 22 facing the back cover 30. The length direction of the first partition rib 223 is the X-axis direction. The two ends of the first partition rib 223 in the X-axis direction are connected to the opposite inner side surfaces of the frame 21, and the length direction of the second partition rib 224 is the X-axis direction. The two ends of the second partition rib 224 in the X-axis direction are connected to the opposite inner side surfaces of the frame 21.

[0089] The first partition rib 223 and the second partition rib 224 are spaced apart in the Y-axis direction. In this way, the frame 21, the middle plate 22, the first partition rib 223 and the second partition rib 224 can enclose a mounting groove 22a for mounting the battery 50. The portion of the frame 21 located on the side of the first partition rib 223 away from the second partition rib 224, the middle plate 22 and the first partition rib 223 can enclose a first mounting space 22m for mounting one of the circuit boards 40. The portion of the frame 21 located on the side of the second partition rib 224 away from the first partition rib 223, the middle plate 22 and the second partition rib 224 can enclose a second mounting space 22n for mounting another circuit board 40.

[0090] In other embodiments, the first partition rib 223 and the second partition rib 224 may be formed on the surface of the back cover 30 facing the middle plate 22. Specifically, the first partition rib 223 and the second partition rib 224 on the back cover 30 may be an integrally formed part with the back cover 30, or may be assembled by gluing, welding or clamping. Alternatively, in other embodiments, the first partition rib 223 and the second partition rib 224 are not provided on the middle plate 22 and the back cover 30.

[0091] The antenna 80 is electrically connected to the RF chip on the circuit board 40 to transmit the RF signal from the RF chip in the form of electromagnetic waves through the antenna radiator of the antenna 80 to the outside space to achieve signal transmission; or the antenna 80 receives electromagnetic waves from the outside space through the antenna radiator of the antenna 80 itself, and converts the electromagnetic waves into RF signals and transmits them to the RF chip to achieve signal reception.

[0092] In some embodiments, the RF chip includes a transmitting path and a receiving path. The transmitting path includes devices such as a power amplifier and a filter, through which the signal is subjected to power amplification, filtering and other processing, and then transmitted to the antenna radiator and transmitted to the outside world through the antenna 80; the receiving path includes devices such as a low-noise amplifier and a filter, through which the external signal received by the antenna 80 is subjected to low-noise amplification, filtering and other processing, and then transmitted to the RF chip, thereby realizing the communication of one signal between the electronic device 100 and the outside world through the RF chip and the antenna 80.

[0093] The antenna 80 includes but is not limited to an omnidirectional antenna and a directional antenna. An omnidirectional antenna is an antenna 80 that radiates signals in all directions of the antenna 80 like a spherical transmitting source, that is, the signal radiation intensity in all directions of the antenna 80 is the same at 360° to achieve the best communication effect. A directional antenna 80 is an antenna 80 that radiates signals in a specific direction.

[0094] Exemplarily, the antenna 80 can be a Wi-Fi antenna, and the electronic device 100 can achieve short-range communication through the antenna 80 to achieve functions such as D2D (device-to-device communication), WiFi screen projection, and WiFi proximity discovery. Antenna 80 can operate in the 2.4G frequency band (frequency in the range of 2.4GHz to 2.5GHz) and / or the 5G frequency band (frequency in the range of 5GHz-6GHz) for WLAN communication. Understandably, both the 2.4G frequency band and the 5G frequency band are used for short-range wireless communication technology. The 2.4G frequency band has a narrow bandwidth, a low frequency, a strong ability to penetrate walls, and a large communication range; the 5G frequency band has a wide bandwidth, a high frequency, and a fast transmission speed. The antenna 80 can select a suitable frequency band according to the working environment to adapt to a variety of application environments and improve the communication performance of the electronic device 100.

[0095] Exemplarily, the number of antennas 80 may be one or more. When there are multiple antennas 80, the multiple antennas 80 may work independently of each other or in combination. Each antenna 80 in the electronic device 100 may be used to cover a single or multiple communication frequency bands. Different antennas 80 may also be reused to improve the utilization of the antennas 80.

[0096] The antenna 80 may include one antenna radiator. In other examples, the antenna 80 may also include multiple antenna radiators. This application does not specifically limit this.

[0097] In order to realize the function of transmitting and receiving signals of the antenna 80, the antenna radiator 81 is made of metal. For example, the antenna radiator is made of copper, iron, aluminum or other metal materials.

[0098] See also Figure 4 and Figure 5 , Figure 4 Based on Figure 2 A schematic diagram of the middle frame 20 is shown. Figure 5 Based on Figure 3 The electronic device 100 is shown in an enlarged view of the circled portion at B1. In order to improve the signal receiving and transmitting capability of the antenna radiator 81, the frame 21 includes a first frame segment 211. The first frame segment 211 is used to form the antenna radiator 81.

[0099] The first frame segment 211 can be used to form one antenna radiator 81, or can be used to form multiple antenna radiators 81. When the first frame segment 211 is used to form multiple antenna radiators 81, the multiple antenna radiators 81 are spaced apart along the extension track of the first frame segment 211 itself, and two adjacent antenna radiators 81 are spaced apart to form a gap Q (also called an antenna gap), and the gap Q can be filled with an insulating structure. As a result, the setting of the insulating structure can achieve a fixed connection between two adjacent antenna radiators 81 on the one hand, and can also clear the antenna radiators 81 on both sides of the gap Q on the other hand, so as to facilitate the antenna radiator 81 to receive and transmit signals.

[0100] In addition, it is understood that when the first frame segment 211 is used to form multiple antenna radiators 81, the multiple antenna radiators 81 can belong to the same antenna 80. Multiple antenna radiators 81 can also belong to different antennas 80. This application does not impose specific restrictions on this. It is sufficient to ensure that each antenna 80 has at least one antenna radiator 81. Exemplarily, the material of the insulating structure includes but is not limited to plastic or plastic.

[0101] On this basis, in order to achieve the clearance of the antenna 80, please continue to refer to Figure 4 The middle plate 22 includes a main body 221 and an insulating portion 222 .

[0102] The body 221 is used as a reference ground for the electronic device 100. Thus, each circuit element in the electronic device 100 can be grounded by being electrically connected to the reference ground, thereby avoiding problems such as leakage of circuit elements and damage caused by large current shocks.

[0103] In order to realize the function of the body 221 as a reference ground, the material of the body 221 includes but is not limited to metal. For example, the material of the body 221 is copper, iron or aluminum. In other examples, the material of the body 221 can also be other materials with conductive properties.

[0104] The material of the insulating portion 222 includes but is not limited to plastic or plastic. The body 221 and the antenna radiator 81 are connected through the insulating portion 222. In this way, the insulating portion 222 can be used to separate the antenna radiator 81 from the body 221 to meet the clearance requirement of the antenna radiator 81.

[0105] Exemplarily, the insulating portion 222 and the above-mentioned insulating structure may be connected as one body, thereby facilitating improving the structural strength of the middle frame 20 .

[0106] Please continue reading Figure 5 In addition to the antenna radiator 81, the antenna 80 also includes a grounding structure 82 to achieve grounding of the antenna 80. The grounding structure 82 is embedded in the insulating portion 222, and the grounding structure 82 is fixedly connected between the body 221 and the antenna radiator 81. In other words, the insulating portion 222 wraps the grounding structure 82, and one end of the grounding structure 82 is exposed from the insulating portion 222 and is fixedly connected to the antenna radiator 81 and electrically connected, and the other end of the grounding structure 82 is exposed from the insulating portion 222 and is fixedly connected to the body 221 and electrically connected.

[0107] Exemplarily, one antenna radiator 81 corresponds to one grounding structure 82. Another exemplary embodiment, one antenna radiator 81 corresponds to multiple grounding structures 82. The present application does not impose any specific limitation on this, as long as the grounding structure 82 is connected between the antenna radiator 81 and the body 221 to achieve ground return.

[0108] When the electronic device 100 is working, the electronic components on the circuit board 40 will generate heat. Since the circuit board 40 is stacked and fixed on the middle plate 22. Therefore, the heat generated by the electronic components on the circuit board 40 will diffuse to the middle plate 22. The main body 221 on the middle plate 22 is generally made of metal. Therefore, the main body 221 has good thermal conductivity. At the same time, the grounding structure 82 is generally also made of metal material, and the grounding structure 82 also has good thermal conductivity. The insulating part 222 is generally made of plastic or plastic material, and the thermal resistance is relatively large, and the thermal conductivity of the insulating part 222 is relatively poor. Therefore, the heat at the main body 221 will be transferred to the antenna radiator 81 through the grounding structure 82, and the temperature of the position corresponding to the grounding structure 82 on the antenna radiator 81 and the area near the position is relatively high compared to other areas. In addition, in the structural layout of the electronic device 100, the grounding structure 82 is wrapped by the insulating portion 222, which keeps the grounding structure 82 warm. This causes the heat conducted to the grounding structure 82 to be concentrated and diffused to the antenna radiator 81, thereby exacerbating the temperature increase at the position of the antenna radiator 81 corresponding to the grounding structure 82 and the surrounding area of ​​the position, resulting in the formation of a locally hotter area at the position of the antenna radiator 81 corresponding to the grounding structure 82 and the surrounding area of ​​the position, thereby reducing the user experience.

[0109] In addition, since the middle frame 20 is often processed by a computer numerical control machine tool (CNC) process to first process the metal part of the middle frame 20 (such as the antenna radiator 81, the body 221 and the grounding structure 82 mentioned above) to obtain a metal part in the actual processing process. Then the metal part is placed in the mold cavity, and the insulating part 222 and the insulating structure are integrally processed on the metal part by the in-mold injection molding process to obtain the middle frame 20. Limited by the CNC processing technology, the cross-sectional area of ​​the grounding structure 82 is relatively large, resulting in a relatively large contact area between the grounding structure 82 and the antenna radiator 81 and a relatively large contact area between the grounding structure 82 and the body 221, which undoubtedly increases the heat transfer capacity of the grounding structure 82. Therefore, without changing the CNC process of the middle frame 20, it is extremely difficult to reduce the cross-sectional area of ​​the grounding structure 82 embedded in the insulating part 222 to reduce the heat transfer capacity of the grounding structure 82, thereby solving the problem of local overheating of the antenna radiator 81.

[0110] Based on this, in order to solve the above technical problems, the present application changes the design idea and proposes an electronic device from the perspective of placing the grounding structure 82 outside the insulating part 222. Figure 6 , Figure 7 and Figure 8 , Figure 6Schematic diagram of an electronic device 100 provided in some other embodiments of the present application, Figure 7 Based on Figure 6 The cross-sectional structure diagram of the electronic device 100 is shown at line A2 - A2. Figure 8 Based on Figure 7 The electronic device 100 is shown in an enlarged view of the circled portion at B2. In this embodiment, the grounding structure 82 is no longer embedded in the insulating portion 222. Instead, the grounding structure 82 is disposed on one side of the middle plate 22 in the thickness direction (ie, the Z-axis direction).

[0111] It is understandable that the middle plate 22 has a first side close to the back cover 30 and a second side close to the screen 10. "The grounding structure 82 is arranged on one side of the middle plate 22 in the thickness direction (i.e., the Z-axis direction)" means that the grounding structure 82 can be located on the first side of the middle plate 22 or on the second side of the middle plate 22. Moreover, when the electronic device 100 includes multiple grounding structures 82, one or several of the grounding structures 82 can be located on the first side of the middle plate 22, and the remaining grounding structures 82 can be located on the second side of the middle plate. It is also necessary to understand that the multiple grounding structures 82 can belong to the same antenna 80 or to different antennas 80, and this application does not limit this.

[0112] Specifically, in order to optimize the structural layout of the electronic device 100, the grounding structure 82 in the electronic device 100 can be located on the first side of the middle plate 22, that is, the grounding structure 82 in the electronic device 100 can be located on the side of the middle plate 22 close to the back cover 30. Since the circuit board 40 and the battery 50 are all located on the side of the middle plate 22 close to the back cover 30, the grounding structure 82 is located on the side of the middle plate 22 close to the back cover 30, which is conducive to optimizing the structural layout of the electronic device 100 and reducing the thickness of the electronic device 100. In the following description, the grounding structure 82 is located on the first side of the middle plate 22 as an example for explanation.

[0113] In the electronic device 100 of the embodiment of the present application, the grounding structure 82 is fixed and electrically connected between the antenna radiator 81 and the body 221, and can provide a ground return path for the antenna 80, so as to realize the grounding of the antenna radiator 81. The grounding structure 82 is located on one side of the middle plate 22 in the thickness direction. It can be seen that the grounding structure 82 is not embedded in the insulating part 222, that is, the grounding structure 82 is not wrapped by the insulating part 222. In this way, on the one hand, the insulation effect of the grounding structure 82 caused by the insulating part 222 wrapping the grounding structure 82 can be avoided, which is conducive to at least to a certain extent facilitating the grounding structure 82 to dissipate heat to the surroundings, and then further achieve heat diffusion with the help of the structure or space around the grounding structure 82, so as to at least to a certain extent reduce the heat transferred from the grounding structure 82 to the antenna radiator 81, and then to at least to a certain extent reduce the temperature of the position corresponding to the grounding structure 82 on the antenna radiator 81 and the surrounding area of ​​the position, and then to at least to a certain extent improve the uniformity of the temperature of the frame 21.

[0114] Please continue reading Figure 8 , the vertical projection of the grounding structure 82 on the middle plate 22 overlaps with the insulating portion 222. This helps to shorten the size of the grounding structure 82 in the arrangement direction of the body 221 and the antenna radiator 81, thereby shortening the ground return path of the antenna radiator 81.

[0115] It is worth noting that "the vertical projection of the grounding structure 82 on the middle plate 22 overlaps with the insulating part 222" may include at least the following situations. Situation 1: The vertical projection of the grounding structure 82 on the middle plate 22 is completely located within the outer contour of the insulating part 222. Situation 2: The edge of one end of the vertical projection of the grounding structure 82 on the middle plate 22 adjacent to the antenna radiator 81 and / or the edge of one end of the vertical projection of the grounding structure 82 on the middle plate 22 adjacent to the main body 221 overlap with a part of the outer contour of the insulating part 222, and the vertical projection of the grounding structure 82 on the middle plate 22 is located within the outer contour of the insulating part 222 as a whole, except for the above-mentioned edge. Situation 3: A part of the vertical projection of the grounding structure 82 on the middle plate 22 is located within the outer contour of the insulating part 222, and the rest of the vertical projection of the grounding structure 82 on the middle plate 22 is located outside the outer contour of the insulating part 222.

[0116] Please continue reading Figure 8 and Fig. 9 , Fig. 9 Based on Figure 6The middle frame 20, the circuit board 40 and the grounding structure 82 are shown in the assembly diagram. In the figure, the local area of ​​the grounding spring 821 is drawn with a dotted line to indicate that the local area of ​​the grounding spring 821 is blocked by the circuit board 40. The grounding structure 82 includes the grounding spring 821. In this specific example, the grounding structure 82 is the grounding spring 821.

[0117] The grounding spring 821 includes a fixing section 8211 and a first elastic arm 8212 .

[0118] The fixing section 8211 may be in the form of a sheet, and the shape of the fixing section 8211 includes but is not limited to a rectangular, triangular, circular, elliptical, or irregular shape.

[0119] In order to facilitate the fixing of the grounding spring 821, the electronic device 100 further includes a carrier 90. The carrier 90 is fixed to the surface of the middle plate 22 facing the back cover 30. The fixing section 8211 is fixed to the carrier 90. In this way, the arrangement of the carrier 90 can facilitate the fixing of the grounding structure 82 to the carrier 90, so as to facilitate the separation of the grounding structure 82 from the insulating portion 222, so that the grounding structure 82 can better dissipate heat.

[0120] Exemplarily, the fixing section 8211 is fixed to the surface of the carrier 90 facing the middle plate 22. The connection between the fixing section 8211 and the carrier 90 includes, but is not limited to, welding, screw connection, riveting, gluing or clamping.

[0121] In some specific embodiments, the carrier 90 may be an existing structure inside the electronic device 100. Figure 8 and Fig. 9 As shown, the carrier 90 is a circuit board 40. In this way, it is possible to avoid setting the carrier 90 inside the electronic device 100, which is conducive to improving the compactness of the structure of the electronic device 100, reducing the thickness of the electronic device 100, and reducing the cost of the carrier 90. In other embodiments, the carrier 90 may also be a structure that is separately set inside the electronic device 100. Alternatively, in other examples, the electronic device 100 may not be provided with the carrier 90, but the fixing section 8211 is fixed to the middle plate 22, as long as the fixing section 8211 is relatively fixed to the middle plate 22.

[0122] The first elastic arm 8212 is connected to the fixed section 8211. The extension shape of the first elastic arm 8212 includes but is not limited to a broken line shape, a curved line shape, and a combination of the two. The first elastic arm 8212 abuts against the antenna radiator 81.

[0123] In this way, by setting the grounding spring clip 821, the problem of a large cross-sectional area of ​​the grounding structure 82 caused by being limited by the CNC process during the processing of the middle frame 20 can be avoided. The processing technology of the grounding spring clip 821 is more diversified, which is conducive to processing the size of the grounding spring clip 821 to be relatively small to a certain extent. Therefore, when the first elastic arm 8212 is used to abut the antenna radiator 81, it is conducive to reducing the connection area between the grounding structure 82 and the antenna radiator 81 to a certain extent (that is, the contact area between the first elastic arm 8212 and the antenna radiator 81), which is conducive to increasing the thermal resistance of the grounding spring clip 821 to a certain extent, reducing the transfer of heat from the main body 221 to the grounding spring clip 821, and also helping to reduce the heat transferred from the grounding structure 82 to the antenna radiator 81 to a certain extent, and then helping to reduce the temperature of the position corresponding to the grounding structure 82 on the antenna radiator 81 and the surrounding area of ​​the position to a certain extent, which is conducive to improving the temperature uniformity of the frame 21 to a certain extent.

[0124] On this basis, in order to further increase the thermal resistance of the connection between the ground structure 82 and the antenna radiator 81 to reduce the heat conducted to the antenna radiator 81, in some embodiments, the connection area between the ground structure 82 and the antenna radiator 81 is S1, that is, the contact area between the first elastic arm 8212 and the antenna radiator 81 is S1. S1 is less than or equal to 1mm 2 .

[0125] On this basis, in order to further increase the thermal resistance of the connection between the ground structure 82 and the antenna radiator 81 to reduce the heat conducted to the antenna radiator 81, in some specific embodiments, the connection area S1 between the ground structure 82 and the antenna radiator 81 is less than or equal to 0.5 mm 2 For example, the value of S1 is 0.05 mm. 2 , 0.1mm 2 , 0.15mm 2 , 0.2mm 2 , 0.25mm 2 , 0.3mm 2 , 0.35mm 2 , 0.4mm 2 or 0.45mm 2 .

[0126] Please continue reading Figure 8 and Fig. 9 The grounding spring piece 821 further includes a second elastic arm 8213. The second elastic arm 8213 is connected to the fixed section 8211. The extension shape of the second elastic arm 8213 includes but is not limited to a broken line shape, a curved line shape, and a combination of the two.

[0127] The second elastic arm 8213 is in contact with the body 221. Thus, the grounding of the antenna radiator 81 can be achieved by using the grounding spring sheet 821, the structure is simple, and the processing technology of the grounding spring sheet 821 is more diversified, which is conducive to processing the size of the grounding spring sheet 821 to be relatively small to a certain extent, so that when the second elastic arm 8213 is used to abut against the body 221, it is conducive to reducing the connection area between the grounding structure 82 and the body 221 (that is, the contact area between the second elastic arm 8213 and the body 221) to a certain extent, and then it is conducive to increasing the thermal resistance of the grounding spring sheet 821 to a certain extent, reducing the transfer of heat from the body 221 to the grounding spring sheet 821, and also conducive to reducing the heat transferred from the grounding structure 82 to the antenna radiator 81 to a certain extent, and then it is conducive to reducing the temperature of the position corresponding to the grounding structure 82 on the antenna radiator 81 and the area near the position to a certain extent, which is conducive to improving the temperature uniformity of the frame 21 to a certain extent.

[0128] On this basis, in some embodiments, the first elastic arm 8212, the second elastic arm 8213 and the fixed section 8211 are an integrally formed part. In this way, it is beneficial to improve the structural strength of the grounding spring 821, simplify the processing technology of the grounding spring 821, and improve the processing efficiency. In other embodiments, the first elastic arm 8212 and the fixed section 8211 can also be connected by welding, riveting, screw connection or gluing. The second elastic arm 8213 and the fixed section 8211 can also be connected by welding, riveting, screw connection or gluing.

[0129] On this basis, in order to further increase the thermal resistance of the connection between the ground structure 82 and the body 221 to reduce the heat conducted to the antenna radiator 81, in some embodiments, the connection area between the ground structure 82 and the body 221 is S2, that is, the contact area between the second elastic arm 8213 and the body 221 is S2. S2 is less than or equal to 1mm 2 .

[0130] For example, in order to further increase the thermal resistance of the connection between the ground structure 82 and the body 221 to reduce the heat conducted to the antenna radiator 81, in some specific embodiments, the connection area S2 between the ground structure 82 and the body 221 is less than or equal to 0.5 mm 2 For example, the value of S2 is 0.05 mm. 2 , 0.1mm 2 , 0.15mm 2 , 0.2mm 2 , 0.25mm 2 , 0.3mm 2 , 0.35mm 2 , 0.4mm2 or 0.45mm 2 .

[0131] Based on the embodiment in which the carrier 90 is a circuit board 40, considering that the circuit board 40 is integrated with electronic components. The circuit board 40 itself is a heat source. When the fixing section 8211 is fixed to the circuit board 40, in order to prevent a part of the heat on the circuit board 40 from being directly transferred to the fixing section 8211. Fig.10 , Fig.10 Based on Figure 7 FIG. 4 is a schematic diagram of a circuit board 40 . The circuit board 40 includes a first board section 411 and a second board section 412 .

[0132] The first plate segment 411 is plate-shaped. The shape of the first plate segment 411 includes but is not limited to a rectangle, a triangle, a circle, an ellipse or a special shape. The fixing segment 8211 is fixed to the first plate segment 411 .

[0133] The second plate segment 412 is plate-shaped. The second plate segment 412 and the first plate segment 411 are arranged and connected in a direction parallel to the circuit board 40 (ie, in the XY direction). The shape of the second plate segment 412 includes, but is not limited to, a rectangle, a triangle, a circle, a ring, an ellipse or a special shape.

[0134] Please continue reading Fig.10 The second board segment 412 includes a multi-layer metal layer 4121 and a multi-layer insulating medium layer 4122. The multi-layer metal layer 4121 and the multi-layer insulating medium layer 4122 are alternately and stacked in sequence along the thickness direction (i.e., the Z-axis direction) of the circuit board 40, so that the second board segment 412 forms a multi-layer wiring structure. In some embodiments, the circuit board 40 further includes a solder resist layer 4123 disposed on the surface of the multi-layer wiring structure.

[0135] Please continue reading Fig.10 , the electronic components on the circuit board 40 are all arranged at the second board section 412. That is, no electronic components are arranged at the first board section 411. Moreover, the thermal conductivity of the first board section 411 is smaller than the thermal conductivity of the second board section 412.

[0136] As a result, on the one hand, the electronic components on the circuit board 40 are all arranged at the second board section 412, that is, no electronic components are arranged at the first board section 411, so it is possible to avoid the electronic components from generating heat at the first board section 411. On the other hand, the thermal conductivity of the first board section 411 is smaller than that of the second board section 412, which can reduce the heat transfer from the second board section 412 to the first board section 411. Combining the above two aspects, when the fixed section 8211 is fixed to the first board section 411 with a relatively low thermal conductivity, it is helpful to reduce the heat transfer to the fixed section 8211.

[0137] In order to achieve the difference in thermal conductivity between the first plate segment 411 and the second plate segment 412, in some embodiments, the first plate segment 411 is an insulator. Therefore, no metal is provided in the first plate segment 411. In this way, not only can the short circuit problem caused by the contact between the grounding spring 821 and the metal layer 4121 or the electronic components at the second plate segment 412 be avoided, but also the thermal conductivity of the first plate segment 411 can be reduced, and the heat at the second plate segment 412 is prevented from being transferred to the grounding spring 821 through the first plate segment 411, which is beneficial to reduce the heat transferred from the grounding structure 82 to the antenna radiator 81, and then it is beneficial to reduce the temperature of the position corresponding to the grounding structure 82 on the antenna radiator 81 and the area near the position, which is beneficial to improve the uniformity of the temperature of the frame 21.

[0138] Exemplarily, the material of the insulator includes but is not limited to plastic, such as epoxy resin, polyimide, etc.

[0139] Exemplarily, the insulator is made of the same material as the multi-layer insulating medium layer 4122 and is connected as a whole, so that the insulating medium layer and the first plate segment can be processed simultaneously, which is conducive to simplifying the processing technology.

[0140] For example, in an actual processing process, an insulating dielectric layer blank may be provided first, and then a metal layer is provided in a part of the insulating dielectric layer blank, and the remaining area is left blank (that is, no metal layer is provided). Then, the insulating dielectric layer blank and the metal layer are alternately arranged and stacked to obtain a circuit board. In this way, the part of the insulating dielectric layer blank provided with the metal layer and the entire metal layer can form the second board segment, and the blank part of the insulating dielectric layer blank can form the first board segment.

[0141] See also Fig.11 , Fig.11 Based on Figure 1-Figure 5 The simulation thermal diagram of the middle frame 20 in the related art shown in FIG. Figure 6-Figure 10 The simulated thermal diagram of the middle frame 20 is shown in FIG. The temperature of the dark-colored area is higher than the temperature of the light-colored area. Fig.11 (a) in the figure shows a simulation thermal diagram of the middle frame 20 in the related art. Fig.11 (b) in FIG. 1 shows a simulated thermal diagram of the middle frame 20 in the present application. Fig.11 (a) and Fig.11 It can be found from (b) that in the present application, the temperature of the antenna radiator 81 on the middle frame 20 is significantly lower than the temperature of the antenna radiator 81 in the middle frame 20 in the related art, and the temperature of the frame 21 in the present application is relatively uniform.

[0142] In order to realize the signal transmission and reception function of antenna 80, please refer to Fig.12 , Fig.12 Based on Figure 6 A schematic diagram of the connection between a portion of the middle frame 20, the circuit board 40 and the antenna 80 is shown. The antenna 80 also includes a feeding structure 83. The feeding structure 83 is spaced apart from the above-mentioned grounding structure 82. One end of the feeding structure 83 is fixed to and electrically connected to the antenna radiator 81. The other end of the feeding structure 83 is electrically connected to the RF chip 44 on the second board segment 412. The RF chip 44 feeds RF signals to the antenna radiator 81 through the feeding structure 83 or receives external RF signals received by the antenna radiator 81.

[0143] The feeding structure 83 includes but is not limited to metal connecting strips, feeding springs, microstrip lines and coaxial lines. Fig.12 The feeding structure 83 is a feeding spring. One end of the feeding spring is fixed to the second board section 412 of the circuit board 40 and is electrically connected to the RF chip 44. The other end of the feeding spring is in contact with the antenna radiator 81.

[0144] See also Fig.13 , Fig.14 and Fig.15 , Fig.13 A schematic diagram of an electronic device 100 provided in some further embodiments of the present application, Fig.14 Based on Fig.13 The cross-sectional structure diagram of the electronic device 100 at the line A3-A3 is shown. Fig.15 Based on Fig.14 The electronic device 100 shown in FIG. 1 is an enlarged view of the circled portion at B3. Figure 6-Figure 12 The difference between the illustrated embodiments is that the surface of the antenna radiator 81 facing the inside of the electronic device 100 has a protrusion 811 extending toward the inside of the electronic device 100. The surface of the middle plate 22 facing the grounding structure 82 is the first surface. In this example, the surface of the middle plate 22 facing the back cover 30 is the first surface, and the first elastic arm 8212 abuts against the surface of the protrusion 811 that is consistent with the first surface. In other words, the first elastic arm 8212 abuts against the surface of the protrusion 811 facing the back cover 30. Since the grounding structure 82 is between the middle plate 22 and the back cover, it is easier to assemble the grounding spring 821.

[0145] Exemplarily, the first elastic arm 8212 and the second elastic arm 8213 are symmetrically arranged relative to the fixed section 8211. This helps to improve the symmetry of the force on the grounding spring piece 821 and increase the service life of the grounding spring piece 821.

[0146] See also Fig.16 , Fig.17 and Fig.18 , Fig.16 Schematic diagram of an electronic device 100 provided for some other embodiments of the present application. Fig.17Based on Fig.16 The cross-sectional structure diagram of the electronic device 100 is shown at line A4-A4. Fig.18 Based on Fig.17 The electronic device 100 shown is an enlarged view of the part circled at B4. Figure 6-Figure 15 The difference between the illustrated embodiment is that the grounding spring piece 821 no longer includes the second elastic arm 8213. Instead, a transfer spring piece 822 is additionally provided in the grounding structure 82. In other words, the grounding structure 82 also includes the transfer spring piece 822.

[0147] Please continue reading Fig.18 , and combined with Fig.19 , Fig.19 Based on Fig.16 Schematic diagram of the positional relationship between the middle frame 20, the adapter spring 822, the grounding spring 821 and the circuit board 40 in the electronic device 100 shown in FIG. In the figure, a local area of ​​the grounding spring 821 and the entire adapter spring 822 are drawn with dotted lines to indicate that a local area of ​​the grounding spring 821 and the entire adapter spring 822 are blocked by the circuit board 40. The adapter spring 822 includes a fixing portion 8221 and a third elastic arm 8222.

[0148] The fixing portion 8221 may be in the form of a sheet. The shape of the fixing portion 8221 includes but is not limited to a rectangular, triangular, circular, elliptical, or irregular shape.

[0149] The fixing portion 8221 is fixed to the above-mentioned carrier 90 and is electrically connected to the fixing section 8211. Exemplarily, the connection between the fixing portion 8221 and the carrier 90 includes but is not limited to gluing, welding, clamping or screw connection.

[0150] The third elastic arm 8222 is connected to the fixing portion 8221. The extension shape of the third elastic arm 8222 includes but is not limited to a folded line shape, a curved line shape, and a combination of the two. The third elastic arm 8222 abuts against and is electrically connected to the body 221.

[0151] In this way, by providing the grounding spring sheet 821 and the transfer spring sheet 822, the separate processing of the grounding spring sheet 821 and the transfer spring sheet 822 can be facilitated, that is, the transfer spring sheet 822 and the grounding spring sheet 821 are not integrally formed, and the transfer spring sheet 822 and the grounding spring sheet 821 can be processed separately, thereby simplifying the processing technology of the grounding spring sheet 821 and the transfer spring sheet 822, which is conducive to processing the size of the grounding spring sheet 821 and the transfer spring sheet 822 to be smaller to a certain extent, thereby reducing the heat transferred from the grounding structure 82 to the antenna radiator 81, and then it is conducive to reducing the temperature of the position corresponding to the grounding structure 82 on the antenna radiator 81 and the area near the position to a certain extent, which is conducive to improving the uniformity of the temperature of the frame 21 to a certain extent. In addition, the provision of the two spring sheets of the grounding spring sheet 821 and the transfer spring sheet 822 is also conducive to reasonably optimizing the position relationship between the grounding spring sheet 821 and the transfer spring sheet 822 according to the structural layout of the electronic device, thereby improving the structural compactness of the electronic device 100.

[0152] See also Fig. 20 , Fig. 20 Based on Fig.19 Schematic diagram of the cross-sectional structure of the circuit board 40 shown. In order to realize the electrical connection between the fixing portion 8221 and the fixing segment 8211, in some embodiments, the grounding structure 82 further includes a conductive segment 823. The conductive segment 823 is fixed on the carrier 90. The conductive segment 823 is fixedly electrically connected between the fixing portion 8221 and the fixing segment 8211. This is conducive to reasonably optimizing the layout of the grounding structure 82 according to actual design requirements.

[0153] For some specific examples, see Fig. 20 When the carrier 90 is a circuit board 40 , the fixing portion 8221 and the fixing section 8211 are both fixed to the first board section 411 .

[0154] In order to achieve electrical connection between the fixing portion 8221 and the fixing segment 8211, the first plate segment 411 is composed of an insulator 4111 and a conductive layer 4112. The conductive layer 4112 is fixed to the insulator 4111. The conductive layer 4112 defines a conductive segment 823. In this way, the conductive layer 4112 of the first plate segment 411 itself can be used to realize the electrical connection between the fixed part 8221 and the fixed segment 8211, so there is no need to set up a conductive segment 823 separately. The whole structure is simpler and more compact. At the same time, since only one conductive layer 4112 is set in the first plate segment 411, the thermal conductivity of the first plate segment 411 is relatively poor. Therefore, when the fixed segment 8211 and the fixed part 8221 are fixed to the first plate segment 411, the heat at the second plate segment 412 can be prevented from being transferred to the grounding structure 82, which is beneficial to reduce the heat transferred from the grounding structure 82 to the antenna radiator 81, and then it is beneficial to reduce the temperature of the position corresponding to the grounding structure 82 on the antenna radiator 81 and the surrounding area of ​​the position, which is beneficial to improve the temperature uniformity of the frame 21 to a certain extent.

[0155] Exemplarily, the connection method between the conductive layer 4112 and the fixing portion 8221 includes, but is not limited to, welding or gluing. The connection method between the conductive layer 4112 and the fixing section 8211 includes, but is not limited to, welding or gluing.

[0156] On this basis, in some embodiments, the metal layer 4121 in the second plate segment 412 is insulated and separated from the conductive layer 4112. In this way, on the one hand, the short circuit problem caused by the electrical connection between the grounding structure 82 and the metal layer 4121 or electronic components at the second plate segment 412 can be avoided, and on the other hand, the heat at the second plate segment 412 can be further prevented from being transferred to the conductive layer 4112, thereby facilitating the heat at the first plate segment 411 to be transferred to the grounding spring 821, and also facilitating the reduction of the heat transferred from the grounding structure 82 to the antenna radiator 81, and then facilitating the reduction of the temperature at the position corresponding to the grounding structure 82 on the antenna radiator 81 and the area near the position, and facilitating the improvement of the temperature uniformity of the frame 21 to a certain extent.

[0157] Specifically, the metal layer 4121 in the second board segment 412 is insulated and separated from the conductive layer 4112 in the first board segment 411 by the insulating material of the circuit board 40 itself (for example, the above-mentioned insulator and / or insulating medium layer 4122 ).

[0158] Specifically, the multi-layer insulating medium layer 4122 and the insulator 4111 are made of the same material and are connected as one body. Therefore, the insulating medium layer 4122 and the insulator 4111 can be processed at the same time, which is conducive to simplifying the processing technology.

[0159] Specifically, the conductive layer 4112 and one of the metal layers 4121 may be the same circuit layer of the circuit board 40. It is sufficient as long as the conductive layer 4112 and one of the metal layers 4121 are separated by an insulating medium.

[0160] See also Fig.21 , Fig.21 Schematic diagrams of the middle frame 20 and the grounding structure 82 provided in some other embodiments of the present application. In this example, the grounding structure 82 is welded to the antenna radiator 81 and the body 221.

[0161] Specifically, see Fig. 22 and Fig.23 , Fig. 22 Based on Fig.21 The structure shown is a schematic diagram of the cross-section structure at line A5-A5. Fig.23 Based on Fig. 22 The structure shown is an enlarged view of the circled portion at B5 . The grounding structure 82 includes a first connection segment 824 , a first solder joint structure 827 , a second connection segment 825 , a second solder joint structure 828 and a third connection segment 826 .

[0162] The first connecting section 824 is in the form of a sheet. The material of the first connecting section 824 includes but is not limited to metal, for example, the material of the first connecting section 824 is copper, stainless steel, aluminum or iron.

[0163] The first connection section 824 is stacked with the surface of the antenna radiator 81 facing the inside of the electronic device 100. A first gap H1 is defined between the first connection section 824 and the antenna radiator 81. The first solder joint structure 827 is located in the first gap H1 and connects the first connection section 824 and the antenna radiator 81.

[0164] In this way, by providing a first gap H1 between the first connecting section 824 and the antenna radiator 81, and utilizing the first welding point structure 827 located in the first gap H1 to connect the first connecting section 824 and the antenna radiator 81, on the one hand, an electrical connection between the antenna radiator 81 and the grounding structure 82 can be achieved, and on the other hand, the connection area between the first welding point structure 827 and the first connecting section 824 and the connection area between the first welding point structure 827 and the antenna radiator 81 are both small, which is beneficial to increase the thermal resistance of the grounding structure 82 at the position between the first connecting section 824 and the antenna radiator 81, which is beneficial to reduce the heat transferred from the grounding structure 82 to the antenna radiator 81 to a certain extent, and then it is beneficial to reduce the temperature of the position corresponding to the grounding structure 82 on the antenna radiator 81 and the surrounding area of ​​the position to a certain extent, which is beneficial to improve the temperature uniformity of the frame 21 to a certain extent.

[0165] Specifically, in the actual processing, spot welding may be performed between the first connecting section 824 and the antenna radiator 81 to form the above-mentioned first welding point structure 827 .

[0166] In some examples, considering the connection reliability between the first connection section 824 and the antenna radiator 81, in each ground structure 82, there may be a plurality of first solder joint structures 827. Here, "plurality" refers to two or more.

[0167] In order to take into account the connection reliability between the first connection section 824 and the antenna radiator 81 and to increase the thermal resistance of the ground structure 82 at the position between the first connection section 824 and the antenna radiator 81, the number of the first solder joint structures 827 can be 2 to 5. For example, the number of the first solder joint structures 827 can be 2, 3 or 4.

[0168] Of course, it is understandable that in some other examples, the number of the first solder joint structure 827 may also be one.

[0169] Please continue reading Fig.23 The second connecting section 825 is in sheet shape. The material of the second connecting section 825 includes but is not limited to metal, for example, the material of the second connecting section 825 is copper, stainless steel, aluminum or iron.

[0170] The second connecting section 825 is connected to the first connecting section 824 .

[0171] The second connection section 825 is stacked with the body 221. A second gap H2 is defined between the second connection section 825 and the body 221. The second solder joint structure 828 is located in the second gap H2, and the second solder joint structure 828 connects the second connection section 825 and the body 221.

[0172] In this way, by providing a second gap H2 between the second connecting section 825 and the main body 221, and utilizing the second welding point structure 828 located in the second gap H2 to connect the second connecting section 825 and the main body 221, on the one hand, an electrical connection between the main body 221 and the grounding structure 82 can be achieved, and on the other hand, the connection area between the second welding point structure 828 and the second connecting section 825 and the connection area between the second welding point structure 828 and the main body 221 are both small, which is beneficial to increase the thermal resistance of the grounding structure 82 at the position between the second connecting section 825 and the main body 221, which is beneficial to reduce the heat transferred from the grounding structure 82 to the antenna radiator 81 to a certain extent, and then it is beneficial to reduce the temperature of the position corresponding to the grounding structure 82 on the antenna radiator 81 and the surrounding area of ​​the position to a certain extent, which is beneficial to improve the temperature uniformity of the frame 21 to a certain extent.

[0173] Specifically, in the actual processing process, spot welding can be performed between the second connecting section 825 and the body 221 to form the above-mentioned second welding point structure 828.

[0174] In some examples, considering the connection reliability between the second connecting segment 825 and the body 221, there may be a plurality of second welding point structures 828. Here, "plurality" means two or more.

[0175] In order to take into account the connection reliability between the second connection section 825 and the body 221 and to increase the thermal resistance of the ground structure 82 at the position between the second connection section 825 and the body 221, the number of the second solder joint structures 828 can be 2 to 5. For example, the number of the second solder joint structures 828 can be 2, 3 or 4.

[0176] Of course, it is understandable that in some other examples, the number of the second solder joint structure 828 may also be one.

[0177] The third connecting section 826 is in the form of a sheet. The material of the third connecting section 826 includes but is not limited to metal, for example, the material of the third connecting section 826 is copper, stainless steel, aluminum or iron.

[0178] The third connection segment 826 is connected between the second connection segment 825 and the first connection segment 824. The third connection segment 826 is fixed to the surface of the insulating portion 222 facing the back cover 30. In this way, by providing the third connection segment 826 connected between the second connection segment 825 and the first connection segment 824, the third connection segment 826 is fixed to the insulating portion 222, thereby facilitating the reliability of the connection between the grounding structure 82 and the middle frame 20.

[0179] Exemplarily, the third connection segment 826 and the insulating portion 222 are bonded by an adhesive layer K. Thus, the connection method is simple and easy to assemble. Of course, the present application is not limited thereto. In other examples, the third connection segment 826 and the insulating portion 222 may also be connected by screws or rivets. Alternatively, in other examples, there may be no connection between the third connection segment 826 and the insulating portion 222.

[0180] In some embodiments, the first connecting segment 824, the second connecting segment 825 and the third connecting segment 826 are integrally formed. For example, the grounding structure is obtained by stamping a metal blank through a stamping process. This is conducive to improving the structural strength of the grounding structure 82, simplifying the processing technology of the grounding structure 82, and improving the processing efficiency.

[0181] In the description of this specification, specific features, structures, materials or characteristics may be combined in an appropriate manner in any one or more embodiments or examples.

[0182] Finally, it should be noted that the above embodiments are only used to illustrate the technical solutions of the present application, rather than to limit it. Although the present application has been described in detail with reference to the aforementioned embodiments, those skilled in the art should understand that they can still modify the technical solutions described in the aforementioned embodiments, or make equivalent replacements for some of the technical features therein. However, these modifications or replacements do not deviate the essence of the corresponding technical solutions from the spirit and scope of the technical solutions of the embodiments of the present application.

Claims

1. An electronic device, characterized in that: include: A middle frame, wherein the middle frame includes a frame and a middle plate, wherein the frame is arranged around an edge of the middle plate, wherein the frame includes a first frame segment, wherein the first frame segment is used to form an antenna radiator, and wherein the middle plate includes a body and an insulating portion, wherein the body is used as a reference ground for the electronic device, and wherein the body and the antenna radiator are connected via the insulating portion; A grounding structure, wherein the grounding structure is fixed and electrically connected between the antenna radiator and the main body, and is located on one side in the thickness direction of the middle plate; the grounding structure includes a grounding spring sheet, and the grounding spring sheet includes a fixed section and a first elastic arm, the first elastic arm is connected to the fixed section, the fixed section is relatively fixed to the middle plate, and the first elastic arm abuts against the antenna radiator.

2. The electronic device according to claim 1, characterized in that: The connection area between the ground structure and the body is less than or equal to 1 mm 2 .

3. The electronic device according to claim 2, characterized in that: The connection area between the ground structure and the body is less than or equal to 0.5 mm 2 .

4. The electronic device according to claim 2, characterized in that: The connection area between the ground structure and the antenna radiator is less than or equal to 1 mm 2 .

5. The electronic device according to claim 4, characterized in that: The connection area between the ground structure and the antenna radiator is less than or equal to 0.5 mm 2 .

6. The electronic device according to any one of claims 1 to 5, characterized in that: The electronic device further comprises a carrier, the carrier is fixed to the middle plate, and the fixing section is fixed to the carrier.

7. The electronic device according to claim 6, characterized in that: The grounding elastic sheet further includes a second elastic arm, the second elastic arm is connected to the fixing section, and the second elastic arm abuts against the body.

8. The electronic device according to claim 7, characterized in that: The first elastic arm, the second elastic arm and the fixing section are an integrally formed part.

9. The electronic device according to claim 8, characterized in that: The electronic device also includes a carrier, which is a circuit board. The circuit board is located on the inner peripheral side of the frame and is stacked and fixed on the middle plate. The circuit board includes a first board segment and a second board segment. The first board segment and the second board segment are arranged and connected in a direction parallel to the circuit board. The thermal conductivity of the first board segment is smaller than the thermal conductivity of the second board segment. The fixed segment is fixed to the first board segment, and the electronic components on the circuit board are all arranged at the second board segment.

10. The electronic device according to claim 9, characterized in that: The first plate segment is an insulator.

11. The electronic device according to claim 6, characterized in that: The grounding structure also includes a transfer spring sheet, which includes a fixed portion and a third elastic arm, the third elastic arm is connected to the fixed portion, the fixed portion is fixed to the carrier, the third elastic arm abuts and is electrically connected to the body, and the fixed portion is electrically connected to the fixed section.

12. The electronic device according to claim 11, characterized in that: The fixing portion and the fixing section are arranged on the bearing member at intervals; The grounding structure further includes a conductive segment, the conductive segment is fixed to the supporting component, and the conductive segment is fixed and electrically connected between the fixing portion and the fixing segment.

13. The electronic device according to claim 12, characterized in that: The carrier is a circuit board, which is located on the inner peripheral side of the frame and is stacked and fixed on the middle plate. The circuit board includes a first plate segment and a second plate segment, which are arranged and connected in a direction parallel to the circuit board. The thermal conductivity of the first plate segment is smaller than the thermal conductivity of the second plate segment. The fixed segment and the fixed portion are both fixed to the first plate segment, and the electronic components on the circuit board are all arranged at the second plate segment.

14. The electronic device according to claim 13, characterized in that: The first plate segment is composed of an insulator and a conductive layer, wherein the conductive layer is fixed to the insulator and defines the conductive segment.

15. The electronic device according to claim 14, characterized in that: The second board segment includes multiple metal layers and multiple insulating dielectric layers, which are alternately arranged and stacked in the thickness direction of the circuit board, and the metal layers are insulated and separated from the conductive layers.

16. The electronic device according to claim 15, characterized in that: The second board segment includes multiple metal layers and multiple insulating dielectric layers, which are alternately arranged and stacked in the thickness direction of the circuit board. The multiple insulating dielectric layers are made of the same material as the insulator and are connected as a whole.

17. The electronic device according to claim 16, characterized in that: The surface of the antenna radiator facing the interior of the electronic device has a protrusion extending toward the interior of the electronic device, the surface of the middle plate facing the grounding structure is the first surface, and the first elastic arm abuts against the surface of the protrusion that is consistent with the first surface.

18. The electronic device according to any one of claims 1 to 5, characterized in that: The grounding structure includes a first connecting section and a first welding point structure. A first gap is provided between the first connecting section and the antenna radiator. The first welding point structure is located in the first gap and connects the first connecting section and the antenna radiator.

19. The electronic device according to claim 18, characterized in that: The grounding structure includes a second connecting section and a second welding point structure, the second connecting section is connected to the first connecting section, a second gap is provided between the second connecting section and the main body, the second welding point structure is located in the second gap and connects the second connecting section and the antenna radiator.

20. The electronic device according to claim 19, characterized in that The grounding structure further includes a third connecting segment, wherein the third connecting segment is connected between the first connecting segment and the second connecting segment, and the third connecting segment is fixed to the surface of the insulating portion.

21. The electronic device according to claim 20, characterized in that: The third connecting section is bonded to the surface of the insulating part through an adhesive layer.

22. The electronic device according to claim 21, characterized in that: The first connecting section, the second connecting section, and the third connecting section are an integrally formed part.

23. The electronic device according to any one of claims 1 to 5, characterized in that: The grounding structure overlaps the insulating portion in a vertical projection of the middle plate.

24. The electronic device according to any one of claims 1 to 5, characterized in that: It includes a screen, a back cover and a circuit board, wherein the screen is stacked with the middle plate, the back cover is stacked on a side of the middle plate away from the screen, the frame is arranged around the edge of the screen and the back cover, the circuit board is fixed to a side of the middle plate facing the back cover, and the grounding structure is located on a side of the middle plate close to the back cover.

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