LED lamp beads, preparation method and electronic equipment

Abstract

The present application provides an LED lamp bead, a preparation method and an electronic device, wherein the LED lamp bead comprises an insulating seat, a plurality of pins, a first light-emitting component, a second light-emitting component and a packaging glue. The pins are arranged on the insulating seat; the first light-emitting component comprises a first light-emitting chip group and a first driving chip, the first light-emitting chip group and the first driving chip are respectively arranged on the pins and electrically connected to the pins; the second light-emitting component comprises a second light-emitting chip group and a second driving chip, the second light-emitting chip group and the second driving chip are respectively arranged on the pins and electrically connected to the pins; the packaging glue is packaged on the outside of the first light-emitting component and the second light-emitting component, the packaging glue comprises a first light-emitting surface arranged relative to the first light-emitting component and a second light-emitting surface arranged relative to the second light-emitting component; the first driving chip is used to control the first light-emitting chip group to emit light through the first light-emitting surface, and the second driving chip is used to control the second light-emitting chip group to emit light through the first light-emitting surface. Flexible light emission on both sides of the LED lamp bead is realized.

Description

Technical Field

[0001] The present application relates to the field of LED technology, and in particular to an LED lamp bead, a preparation method and an electronic device. Background Art

[0002] LED lamp beads are widely used in the lighting and display industries because of their advantages such as energy saving, power saving, high efficiency, fast response time, long life cycle, mercury-free and environmental protection, and have become one of the most watched products in recent years.

[0003] However, when LED lamp beads are used in a relatively narrow area of ​​electronic products, such as a fan with a circular shell shape, existing LED lamp beads can only illuminate one side of the fan, limiting the function of the fan. At the same time, with the miniaturization design of existing LED lamp bead products, such as the development of ultra-thin screens such as grille screens, it is necessary to set LED lamp beads in pairs to achieve double-sided lighting of the product, resulting in the size of LED products being limited. Summary of the invention

[0004] The present application provides an LED lamp bead, a preparation method and an electronic device, aiming to solve the problem that the size of the LED product is limited by arranging LED lamp beads in pairs to realize double-sided light emission of the product. The provided LED lamp bead can be provided with a first light-emitting surface and a second light-emitting surface on both sides, respectively, to realize flexible double-sided light emission of the LED lamp bead, so that the electronic device designed based on the provided LED lamp bead can be miniaturized.

[0005] According to a first aspect of the present application, the present application provides a method for preparing an LED lamp bead, which is used to manufacture an LED lamp bead, wherein the LED lamp bead includes an insulating seat, a plurality of pins, a first light-emitting component, a second light-emitting component and a packaging glue, wherein the plurality of pins are arranged on the insulating seat; the first light-emitting component includes a first light-emitting chip group and a first driving chip, wherein the first light-emitting chip group and the first driving chip are respectively arranged on the pins and electrically connected to the pins, and the first driving chip is electrically connected to the first light-emitting chip group; the second light-emitting component includes a second light-emitting chip group and a second driving chip, wherein the second light-emitting chip group and the second driving chip are respectively arranged on the pins and electrically connected to the pins, and the second driving chip is electrically connected to the second light-emitting chip group; the packaging glue is used to encapsulate the outside of the first light-emitting component and the second light-emitting component, wherein the packaging glue includes a first light-emitting surface and a second light-emitting surface, wherein the first light-emitting surface is arranged relative to the first light-emitting component, and the second light-emitting surface is arranged relative to the second light-emitting component, and the packaging glue includes a light-transmitting glue layer and a light-impermeable glue layer; the preparation method includes:

[0006] By means of a first molding process, the light-transmitting adhesive layer is formed outside the first light-emitting component and the second light-emitting component;

[0007] According to the position of the first light-emitting surface required on the light-transmitting adhesive layer, determine the shape of the first adhesive layer corresponding to the first light-emitting component, wherein the first adhesive layer is a light-transmitting adhesive layer encapsulated in the first light-emitting component, and the shape of the first adhesive layer is the shape of the contact surface between the light-transmitting adhesive layer and the first light-emitting component;

[0008] Determine the shape of the second adhesive layer corresponding to the second light-emitting component according to the position of the second light-emitting surface required on the light-transmitting adhesive layer, wherein the second adhesive layer is a light-transmitting adhesive layer encapsulated in the second light-emitting component, and the shape of the second adhesive layer is the shape of the contact surface between the light-transmitting adhesive layer and the second light-emitting component;

[0009] The light-transmitting adhesive layer is cut according to the shapes of the first adhesive layer and the second adhesive layer to obtain the first adhesive layer, the second adhesive layer and the adhesive flow channel; the adhesive flow channel is located outside the first adhesive layer and the second adhesive layer except the first light-emitting surface and the second light-emitting surface;

[0010] A third glue layer is formed in the glue flow channel by a second molding process; wherein the third glue layer is the opaque glue layer.

[0011] In the preparation method of one embodiment of the present application, the first light-emitting surface is located on the top surface or side surface of the first adhesive layer; and / or the second light-emitting surface is located on the top surface or side surface of the second adhesive layer; the top surface corresponds to the insulating seat.

[0012] In the preparation method of one embodiment of the present application, the first light-emitting surface and the second light-emitting surface are rectangular in shape.

[0013] In the preparation method of one embodiment of the present application, the first light-emitting surface is located on the top surface of the first adhesive layer, and the contact surface shape between the first adhesive layer and the first light-emitting component is rectangular, or, the first light-emitting surface is located on the side surface of the first adhesive layer, and the contact surface shape between the first adhesive layer and the first light-emitting component is trapezoidal; the second light-emitting surface is located on the top surface of the second adhesive layer, and the contact surface shape between the second adhesive layer and the second light-emitting component is rectangular, or, the second light-emitting surface is located on the side surface of the second adhesive layer, and the contact surface shape between the second adhesive layer and the second light-emitting component is trapezoidal.

[0014] According to the second aspect of the present application, the present application provides an LED lamp bead, comprising:

[0015] Insulation seat;

[0016] A plurality of pins, wherein the plurality of pins are arranged on the insulating seat;

[0017] A first light-emitting component, the first light-emitting component comprises a first light-emitting chip group and a first driving chip, the first light-emitting chip group and the first driving chip are respectively arranged on the pins and electrically connected to the pins, and the first driving chip is electrically connected to the first light-emitting chip group;

[0018] a second light-emitting component, the second light-emitting component comprising a second light-emitting chip group and a second driving chip, the second light-emitting chip group and the second driving chip are respectively arranged on the pins and electrically connected to the pins, and the second driving chip is electrically connected to the second light-emitting chip group;

[0019] Packaging glue, the packaging glue is packaged outside the first light-emitting component and the second light-emitting component, the packaging glue includes at least one first light-emitting surface and at least one second light-emitting surface, the first light-emitting surface is arranged relative to the first light-emitting component, and the second light-emitting surface is arranged relative to the second light-emitting component;

[0020] The first driving chip is used to control the first light-emitting chip group to emit light through the first light-emitting surface, and the second driving chip is used to control the second light-emitting chip group to emit light through the first light-emitting surface.

[0021] In an LED lamp bead of one embodiment of the present application, the packaging glue includes: a first glue layer, the first glue layer is encapsulated on the outside of the first light-emitting component; the first glue layer includes the first light-emitting surface; a second glue layer, the second glue layer is encapsulated on the outside of the second light-emitting component; the second glue layer includes the second light-emitting surface; a third glue layer, the third glue layer is encapsulated on the outside of the first glue layer and the second glue layer except the first light-emitting surface and the second light-emitting surface; wherein, the first glue layer and the second glue layer are light-transmitting glue layers, and the third glue layer is an opaque glue layer.

[0022] In an LED lamp bead of one embodiment of the present application, the first light-emitting surface is located on the top surface or side surface of the first adhesive layer; and / or the second light-emitting surface is located on the top surface or side surface of the second adhesive layer; the top surface corresponds to the insulating seat.

[0023] In an LED lamp bead of one embodiment of the present application, the first light-emitting surface and the second light-emitting surface are rectangular in shape.

[0024] In an LED lamp bead of one embodiment of the present application, the first light-emitting surface is located on the top surface of the first adhesive layer, and the contact surface shape of the first adhesive layer and the first light-emitting component is rectangular, or, the first light-emitting surface is located on the side surface of the first adhesive layer, and the contact surface shape of the first adhesive layer and the first light-emitting component is trapezoidal; and / or, the second light-emitting surface is located on the top surface of the second adhesive layer, and the contact surface shape of the second adhesive layer and the second light-emitting component is rectangular, or, the second light-emitting surface is located on the side surface of the second adhesive layer, and the contact surface shape of the second adhesive layer and the second light-emitting component is trapezoidal.

[0025] In an LED lamp bead of one embodiment of the present application, a pin provided on the first driver chip is connected to a pin provided on the second driver chip.

[0026] In an LED lamp bead of one embodiment of the present application, the multiple pins include four groups of pin pairs, and the four groups of pin pairs are respectively a first pin pair, a second pin pair, a third pin pair and a fourth pin pair, and the pins in each group of the pin pairs are relatively distributed on the insulating seat; wherein, the first pin pair includes a first power pin and a first ground pin, the first light-emitting chip group and the first driver chip are electrically connected to the first power pin, and the first driver chip is electrically connected to the first ground pin; the second pin pair includes a first signal input pin and a first signal output pin, and the first driver chip is electrically connected to the first signal input pin and the first signal output pin; the third pin pair includes a second signal input pin and a second signal output pin, and the second driver chip is electrically connected to the second signal input pin and the second signal output pin; the fourth pin pair includes a second power pin and a second ground pin, the second light-emitting chip group and the second driver chip are electrically connected to the second power pin, and the second driver chip is electrically connected to the second ground pin.

[0027] In an LED lamp bead of one embodiment of the present application, the insulating seat includes a first end face, and the first ground pin, the first power pin, the first signal input pin, the first signal output pin, the second ground pin, the second power pin, the second signal input pin, and the second signal output pin have a solid crystal portion formed on the first end face and a welding portion formed on the other end faces of the insulating seat; the first light-emitting component is arranged on the solid crystal portion of any one of the first ground pin, the first power pin, the first signal input pin, and the first signal output pin; the second light-emitting component is arranged on the solid crystal portion of any one of the second ground pin, the second power pin, the second signal input pin, and the second signal output pin, and at least part of the structure of the welding portion is formed with a via structure.

[0028] In an LED lamp bead of one embodiment of the present application, the first light-emitting chip group and the second light-emitting chip group each include a plurality of light-emitting chips; wherein the light-emitting chips of the first light-emitting chip group and the light-emitting chips of the second light-emitting chip group are equidistantly spaced on the die-bonding portion.

[0029] In an LED lamp bead of one embodiment of the present application, the first driver chip and the first light-emitting chip group are respectively arranged on the die-bonding part of any one of the first ground pin, the first power pin, the first signal input pin, and the first signal output pin; and / or, the second driver chip and the second light-emitting chip group are respectively arranged on the die-bonding part of any one of the second ground pin, the second power pin, the second signal input pin, and the second signal output pin.

[0030] In an LED lamp bead of one embodiment of the present application, the crystal-fixing portion provided in the first light-emitting chip group includes a first extension portion and a second extension portion perpendicular to the first extension portion, the first extension portion extends toward the direction of another pin in the pin pair where the crystal-fixing portion provided in the first light-emitting chip group is located, and forms a third extension portion and a fourth extension portion which are spaced apart from the second extension portion; the crystal-fixing portion provided in the second light-emitting chip group includes a fifth extension portion and a sixth extension portion perpendicular to the fifth extension portion, the fifth extension portion extends toward the direction of another pin in the pin pair where the crystal-fixing portion provided in the second light-emitting chip group is located, and forms a seventh extension portion and an eighth extension portion which are spaced apart from the sixth extension portion; wherein, the first light-emitting chip group is provided in the second extension portion, and a plurality of light-emitting chips in the first light-emitting chip group are electrically connected to the second extension portion and the fourth extension portion, respectively; the second light-emitting chip group is provided in the seventh extension portion, and a plurality of light-emitting chips in the second light-emitting chip group are electrically connected to the sixth extension portion and the eighth extension portion, respectively.

[0031] In an LED lamp bead of one embodiment of the present application, the crystal-fixing portion provided in the first light-emitting chip group also includes a ninth extension portion provided relative to the second extension portion, and the first driving chip is electrically connected to the ninth extension portion; the crystal-fixing portion provided in the second light-emitting chip group also includes a tenth extension portion provided relative to the sixth extension portion, and the second driving chip is electrically connected to the tenth extension portion.

[0032] According to the third aspect of the present application, the present application provides an electronic device, including the LED lamp beads provided by any embodiment of the present application.

[0033] The technical solution provided by the embodiment of the present application may include the following beneficial effects: The present application designs an LED lamp bead, a preparation method and an electronic device, wherein the LED lamp bead includes an insulating seat, a plurality of pins, a first light-emitting component, a second light-emitting component and a packaging glue. The plurality of pins are arranged on the insulating seat; the first light-emitting component includes a first light-emitting chip group and a first driver chip, the first light-emitting chip group and the first driver chip are respectively arranged on the pins and electrically connected to the pins, and the first driver chip is electrically connected to the first light-emitting chip group; the second light-emitting component includes a second light-emitting chip group and a second driver chip, the second light-emitting chip group and the second driver chip are respectively arranged on the pins and electrically connected to the pins, and the second driver chip is electrically connected to the second light-emitting chip group; the packaging glue is packaged outside the first light-emitting component and the second light-emitting component, and the packaging glue includes at least one first light-emitting surface and at least one second light-emitting surface, the first light-emitting surface is arranged relative to the first light-emitting component, and the second light-emitting surface is arranged relative to the second light-emitting component; wherein the first driver chip is used to control the first light-emitting chip group to emit light through the first light-emitting surface, and the second driver chip is used to control the second light-emitting chip group to emit light through the first light-emitting surface.

[0034] The LED lamp bead provided in the present application forms corresponding first and second light-emitting surfaces through packaging glue in the first and second light-emitting components on both sides of the LED lamp bead, and can then respectively control the first and second light-emitting surfaces to emit light, thereby achieving flexible light emission on both sides of the LED lamp bead, so that electronic equipment designed based on the provided LED lamp bead can be miniaturized.

[0035] It should be understood that the foregoing general description and the following detailed description are exemplary and explanatory only and are not restrictive of the present application. BRIEF DESCRIPTION OF THE DRAWINGS

[0036] In order to more clearly illustrate the technical solutions of the embodiments of the present application, the drawings required for use in the description of the embodiments will be briefly introduced below. Obviously, the drawings described below are some embodiments of the present application. For ordinary technicians in this field, other drawings can be obtained based on these drawings without paying any creative work.

[0037] Figure 1 This is one of the structural schematic diagrams of an LED lamp bead provided in one embodiment of the present application;

[0038] Figure 2 This is the second structural schematic diagram of the LED lamp bead provided in one embodiment of the present application;

[0039] Figure 3 This is the third structural schematic diagram of the LED lamp bead provided in one embodiment of the present application;

[0040] Figure 4 This is an exploded schematic diagram of an LED lamp bead provided in one embodiment of the present application;

[0041] Figure 5 This is the fourth structural diagram of the LED lamp bead provided in one embodiment of the present application;

[0042] Figure 6 This is the fifth structural diagram of the LED lamp bead provided in one embodiment of the present application;

[0043] Figure 7 This is a schematic flow chart of the steps of a method for preparing an LED lamp bead provided in an embodiment of the present application;

[0044] Figure 8 It is a schematic diagram of the structure of an electronic device provided in one embodiment of the present application.

[0045] Description of reference numerals:

[0046] 100. Electronic equipment;

[0047] 10. LED lamp beads;

[0048] 11. Insulation seat;

[0049] 12, pin; 121, first power pin; 1211, die-bonding portion of the first power pin; 1212, soldering portion of the first power pin; 122, first ground pin; 1221, die-bonding portion of the first ground pin; 1222, soldering portion of the first ground pin; 123, first signal input pin; 1231, die-bonding portion of the first signal input pin; 1232, soldering portion of the first signal input pin; 124, first signal output pin; 1241, die-bonding portion of the first signal output pin; 1242, soldering portion of the first signal output pin 125, second power supply pin; 1251, second power supply pin's crystal bonding portion; 1252, second power supply pin's soldering portion; 126, second ground pin; 1261, second ground pin's crystal bonding portion; 1262, second ground pin's soldering portion; 127, second signal input pin; 1271, second signal input pin's crystal bonding portion; 1272, second signal input pin's soldering portion; 128, second signal output pin; 1281, second signal output pin's crystal bonding portion; 1282, second signal output pin's soldering portion;

[0050] 13. First light-emitting component; 131. First light-emitting chip group; 132. First driving chip;

[0051] 14. second light-emitting component; 141. second light-emitting chip group; 142. second driving chip;

[0052] 15. packaging glue; 151. first glue layer; 152. second glue layer; 153. third glue layer;

[0053] 16. Welding materials.

[0054] It should be understood that the foregoing general description and the following detailed description are exemplary and explanatory only and are not restrictive of the present application. DETAILED DESCRIPTION

[0055] The following will be combined with the drawings in the embodiments of the present application to clearly and completely describe the technical solutions in the embodiments of the present application. Obviously, the described embodiments are part of the embodiments of the present application, not all of the embodiments. Based on the embodiments in the present application, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of this application.

[0056] It should also be understood that the terms used in this specification of the present application are only for describing specific realities. In the description of the present application, it should be understood that the terms "center", "longitudinal", "lateral", "length", "width", "thickness", "up", "down", "front", "back", "left", "right", "vertical", "horizontal", "top", "bottom", "inside", "outside", "clockwise", "counterclockwise" and the like indicate the orientation or position relationship based on the orientation or position relationship shown in the drawings, which is only for the convenience of describing the present application and simplifying the description, rather than indicating or implying that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore cannot be understood as a limitation on the present application. In addition, the terms "first" and "second" are only used for descriptive purposes, and cannot be understood as indicating or implying relative importance or implicitly indicating the number of technical features indicated. Therefore, the features defined as "first" and "second" may explicitly or implicitly include one or more of the features. In the description of the present application, the meaning of "multiple" is two or more, unless otherwise clearly and specifically defined.

[0057] In conjunction with the accompanying drawings, some embodiments of the present application are described in detail below. In the absence of conflict, the following embodiments and features in the embodiments can be combined with each other.

[0058] LED lamp beads are widely used in the lighting and display industries because of their advantages such as energy saving, power saving, high efficiency, fast response time, long life cycle, mercury-free and environmental protection, and have become one of the most watched products in recent years.

[0059] However, when LED lamp beads are used in a relatively narrow area of ​​electronic products, such as a fan with a circular shell shape, existing LED lamp beads can only illuminate one side of the fan, limiting the function of the fan. At the same time, with the miniaturization design of existing LED lamp bead products, such as the development of ultra-thin screens such as grille screens, it is necessary to set LED lamp beads in pairs to achieve double-sided lighting of the product, resulting in the size of LED products being limited.

[0060] To solve the above problems, please refer to Figures 1 to 6 ,like Figures 1 to 6 As shown, the present application provides an LED lamp bead 10 , including an insulating seat 11 , a plurality of pins 12 , a first light-emitting component 13 , a second light-emitting component 14 and a packaging adhesive 15 . A plurality of pins 12 are arranged on the insulating seat 11; the first light-emitting component 13 includes a first light-emitting chip group 131 and a first driving chip 132, the first light-emitting chip group 131 and the first driving chip 132 are respectively arranged on the pins 12 and electrically connected to the pins 12, and the first driving chip 132 is electrically connected to the first light-emitting chip group 131; the second light-emitting component 14 includes a second light-emitting chip group 141 and a second driving chip 142, the second light-emitting chip group 141 and the second driving chip 142 are respectively arranged on the pins 12 and electrically connected to the pins 12, and the second driving chip 142 is electrically connected to the second light-emitting chip group 141; the packaging glue 15 is packaged on the outside of the first light-emitting component 13 and the second light-emitting component 14, and the packaging glue 15 includes at least one first light-emitting surface and at least one second light-emitting surface, the first light-emitting surface is arranged relative to the first light-emitting component 13, and the second light-emitting surface is arranged relative to the second light-emitting component 14; wherein the first driving chip 132 is used to control the first light-emitting chip group 131 to emit light through the first light-emitting surface, and the second driving chip 142 is used to control the second light-emitting chip group 141 to emit light through the first light-emitting surface.

[0061] Specifically, the LED lamp bead 10 provided in the present application forms corresponding first and second light-emitting surfaces through the first light-emitting component 13 and the second light-emitting component 14 on both sides of the LED lamp bead 10 through the packaging glue 15, and can then emit light through the first and second light-emitting surfaces respectively, thereby achieving flexible double-sided light emission of the LED lamp bead 10, so that the electronic device 100 designed based on the provided LED lamp bead 10 can be miniaturized.

[0062] In some embodiments, in combination Figure 1 and Figure 4 The encapsulation glue 15 includes: a first glue layer 151 and a second glue layer 152, the first glue layer 151 is encapsulated on the outside of the first light-emitting component 13; the first glue layer 151 includes a first light-emitting surface; the second glue layer 152 is encapsulated on the outside of the second light-emitting component 14; the second glue layer 152 includes a second light-emitting surface; a third glue layer 153, the third glue layer 153 is encapsulated on the outside of the first glue layer 151 and the second glue layer 152 except the first light-emitting surface and the second light-emitting surface; wherein the first glue layer 151 and the second glue layer 152 are light-transmitting glue layers or diffusion glue layers, and the third glue layer 153 is an opaque glue layer.

[0063] By using either a translucent adhesive layer or a diffusion adhesive layer for the first adhesive layer 151 and the second adhesive layer 152 and using an opaque adhesive layer for the third adhesive layer 153, the first adhesive layer 151 and the second adhesive layer 152 can expose the first light-emitting surface and the second light-emitting surface, thereby achieving control of the light-emitting surfaces on both sides of the LED lamp bead 10.

[0064] In some embodiments, the first light emitting surface is located on the top surface or the side surface of the first adhesive layer 151 , and the top surface corresponds to the insulating seat 11 .

[0065] In some embodiments, the second light emitting surface is located on the top surface or the side surface of the second adhesive layer 152 ; the top surface corresponds to the insulating seat 11 .

[0066] It should be noted that the specific positions of the first light-emitting surface and the second light-emitting surface are selected according to the positions where the actual product needs to emit light, and the embodiments of the present application do not limit the positions of the first light-emitting surface and the second light-emitting surface.

[0067] like Figure 5 As shown, the present application can set the positions of the first light-emitting surface and the second light-emitting surface on the top surface or the side surface respectively according to actual needs, thereby improving the flexibility of the LED lamp bead 10.

[0068] In some embodiments, the first light emitting surface and the second light emitting surface are rectangular in shape, so that the light energy of the first light emitting component 13 and the second light emitting component 14 can be emitted uniformly.

[0069] It should be noted that the shapes of the first light-emitting surface and the second light-emitting surface may also be any shapes such as square, circle, diamond, etc., and the embodiments of the present application do not limit the types of the first light-emitting surface and the second light-emitting surface.

[0070] In some embodiments, the first light-emitting surface is located on the top surface of the first adhesive layer 151, and the contact surface shape of the first adhesive layer 151 and the first light-emitting component 13 is rectangular, or, the first light-emitting surface is located on the side surface of the first adhesive layer 151, and the contact surface shape of the first adhesive layer 151 and the first light-emitting component 13 is trapezoidal; and / or, the second light-emitting surface is located on the top surface of the second adhesive layer 152, and the contact surface shape of the second adhesive layer 152 and the second light-emitting component 14 is rectangular, or, the second light-emitting surface is located on the side surface of the second adhesive layer 152, and the contact surface shape of the second adhesive layer 152 and the second light-emitting component 14 is trapezoidal.

[0071] When the first light-emitting surface or the second light-emitting surface is a trapezoid, such as Figure 5 The trapezoid has an inward and downward angle, so that the light of the first light-emitting component 13 and the second light-emitting component 14 can be better emitted through the corresponding light-emitting surfaces.

[0072] In some embodiments, Figure 6As shown, the pin 12 provided in the first driver chip 132 is connected to the pin 12 provided in the second driver chip 142. This makes it easier to wire the LED lamp bead 10 and prevents the problem of poor solder joints caused by unilateral solder leakage. At the same time, the embodiment of the present application does not limit the types of the pins 12 provided in the first driver chip 132 and the second driver chip 142, that is, the types of the pins 12 connected to each other are not limited.

[0073] In some embodiments, the plurality of pins 12 include four groups of pin pairs 12, the four groups of pin pairs 12 are respectively a first pin pair, a second pin pair, a third pin pair and a fourth pin pair, and the pins 12 in each group of pin pairs are relatively distributed on the insulating seat 11; wherein the first pin pair includes a first power pin 121 and a first ground pin 122, the first light-emitting chip group 131 and the first driver chip 132 are electrically connected to the first power pin 121, and the first driver chip 132 is electrically connected to the first ground pin 122; the second pin pair includes a first signal input pin 123 and a first signal output pin 124. The first driving chip 132 is electrically connected to the first signal input pin 123 and the first signal output pin 124; the third pin pair includes the second signal input pin 127 and the second signal output pin 128, the second driving chip 142 is electrically connected to the second signal input pin 127 and the second signal output pin 128; the fourth pin pair includes the second power pin 125 and the second ground pin 126, the second light-emitting chip group 141 and the second driving chip 142 are electrically connected to the second power pin 125, and the second driving chip 142 is electrically connected to the second ground pin 126. Thus, the layout of the LED lamp bead 10 can be standardized by setting a plurality of pin pairs.

[0074] In some embodiments, the insulating seat 11 includes a first end surface, and the first grounding pin 122, the first power pin 121, the first signal input pin 123, the first signal output pin 124, the second grounding pin 126, the second power pin 125, the second signal input pin 127, and the second signal output pin 128 have a solid crystal portion formed on the first end surface and a welding portion formed on the other end surfaces of the insulating seat 11; the first light-emitting component 13 is arranged on the solid crystal portion of any pin 12 among the first grounding pin 122, the first power pin 121, the first signal input pin 123, and the first signal output pin 124; the second light-emitting component 14 is arranged on the solid crystal portion of any pin 12 among the second grounding pin 126, the second power pin 125, the second signal input pin 127, and the second signal output pin 128, and at least part of the structure of the welding portion is formed with a via structure.

[0075] In some embodiments, the first light emitting chip group 131 and the second light emitting chip group 141 each include a plurality of light emitting chips; wherein the light emitting chips of the first light emitting chip group 131 and the light emitting chips of the second light emitting chip group 141 are equidistantly spaced on the die bonding portion.

[0076] In some embodiments, the first driving chip 132 and the first light emitting chip group 131 are respectively disposed on the die-bonding portion of any one of the first ground pin 122 , the first power pin 121 , the first signal input pin 123 , and the first signal output pin 124 .

[0077] In some embodiments, the second driving chip 142 and the second light emitting chip group 141 are respectively disposed on the die-bonding portion of any one of the second ground pin 126 , the second power pin 125 , the second signal input pin 127 , and the second signal output pin 128 .

[0078] In some embodiments, Figure 6 As shown, the crystal-fixing portion provided in the first light-emitting chip group 131 includes a first extension portion and a second extension portion perpendicular to the first extension portion, the first extension portion extends toward the direction of another pin 12 in the pin pair where the crystal-fixing portion provided in the first light-emitting chip group 131 is located, and forms a third extension portion and a fourth extension portion which are spaced apart from the second extension portion; the crystal-fixing portion provided in the second light-emitting chip group 141 includes a fifth extension portion and a sixth extension portion perpendicular to the fifth extension portion, the fifth extension portion extends toward the direction of another pin 12 in the pin pair where the crystal-fixing portion provided in the second light-emitting chip group 141 is located, and forms a seventh extension portion and an eighth extension portion which are spaced apart from the sixth extension portion; wherein, the first light-emitting chip group 131 is provided in the second extension portion, and a plurality of light-emitting chips in the first light-emitting chip group 131 are electrically connected to the second extension portion and the fourth extension portion, respectively; the second light-emitting chip group 141 is provided in the seventh extension portion, and a plurality of light-emitting chips in the second light-emitting chip group 141 are electrically connected to the sixth extension portion and the eighth extension portion, respectively.

[0079] In some embodiments, Figure 6 As shown, the crystal-fixing portion provided in the first light-emitting chip group 131 also includes a ninth extension portion provided relative to the second extension portion, and the first driving chip 132 is electrically connected to the ninth extension portion; the crystal-fixing portion provided in the second light-emitting chip group 141 also includes a tenth extension portion provided relative to the sixth extension portion, and the second driving chip 142 is electrically connected to the tenth extension portion.

[0080] In some embodiments, Figure 3 As shown, the back side of the provided LED lamp bead 10 is coated with welding material 16, such as green oil, on the outside of the pins to ensure that the pins can be connected smoothly.

[0081] Please refer to Figure 7 , Figure 7 The present invention provides a method for preparing an LED lamp bead, which is used to manufacture Figures 1 to 6 The LED lamp bead shown in the figure comprises an insulating seat, a plurality of pins, a first light-emitting component, a second light-emitting component and packaging glue, wherein the plurality of pins are arranged on the insulating seat; the first light-emitting component comprises a first light-emitting chip group and a first driving chip, wherein the first light-emitting chip group and the first driving chip are respectively arranged on the pins and electrically connected to the pins, and the first driving chip is electrically connected to the first light-emitting chip group; the second light-emitting component comprises a second light-emitting chip group and a second driving chip, wherein the second light-emitting chip group and the second driving chip are respectively arranged on the pins and electrically connected to the pins, and the second driving chip is electrically connected to the second light-emitting chip group; the packaging glue is used to encapsulate the outside of the first light-emitting component and the second light-emitting component, wherein the packaging glue comprises a first light-emitting surface and a second light-emitting surface, wherein the first light-emitting surface is arranged relative to the first light-emitting component, and the second light-emitting surface is arranged relative to the second light-emitting component, and the packaging glue comprises a light-transmitting glue layer and a light-opaque glue layer.

[0082] like Figure 7 As shown, the provided preparation method includes steps S201 to S207.

[0083] S201. Through the first molding, a light-transmitting adhesive layer is formed on the outside of the first light-emitting component and the second light-emitting component.

[0084] Through the first molding, the provided method can form a corresponding light-transmitting adhesive layer on the outside of the first light-emitting component and the second light-emitting component. Of course, according to actual needs, a diffusion adhesive layer can also be formed, so that the light of the first light-emitting component and the second light-emitting component can be emitted outward.

[0085] S202. Determine the shape of the first adhesive layer corresponding to the first light-emitting component according to the position of the first light-emitting surface in the light-transmitting adhesive layer, wherein the first adhesive layer is the light-transmitting adhesive layer encapsulated in the first light-emitting component, and the shape of the first adhesive layer is the shape of the contact surface between the light-transmitting adhesive layer and the first light-emitting component.

[0086] S203. Determine the shape of the second adhesive layer corresponding to the second light-emitting component according to the position of the second light-emitting surface in the light-transmitting adhesive layer, wherein the second adhesive layer is the light-transmitting adhesive layer encapsulated in the second light-emitting component, and the shape of the second adhesive layer is the shape of the contact surface between the light-transmitting adhesive layer and the second light-emitting component.

[0087] Since not every surface requires a corresponding light-emitting component to emit light, the present application determines the shapes of the first adhesive layer and the second adhesive layer through the corresponding positions of the first light-emitting surface and the second light-emitting surface, such as the top surface or the side surface, to ensure that the first adhesive layer and the second adhesive layer that meet the requirements can be formed after cutting, thereby improving the luminous effect of the LED lamp beads.

[0088] S204. Cut the light-transmitting adhesive layer according to the shapes of the first adhesive layer and the second adhesive layer to obtain the first adhesive layer, the second adhesive layer and the adhesive flow channel; the adhesive flow channel is located on the outer sides of the first adhesive layer and the second adhesive layer except the first light-emitting surface and the second light-emitting surface.

[0089] The first glue layer and the second glue layer are cut into corresponding shapes, and corresponding glue flow channels are reserved to reserve glue flow openings for the subsequent second molding.

[0090] S205. Using a second molding process, a third glue layer is formed in the glue flow channel; wherein the third glue layer is an opaque glue layer.

[0091] Through the second molding, an opaque third adhesive layer can be formed on the outside of the first adhesive layer and the second adhesive layer except for the corresponding first light-emitting surface and second light-emitting surface, so that the prepared LED lamp beads can smoothly emit light according to the preset surface, thereby improving the flexibility of the LED lamp beads.

[0092] In some embodiments, the first light emitting surface is located on the top surface or side surface of the first adhesive layer; and / or, the second light emitting surface is located on the top surface or side surface of the second adhesive layer; the top surface corresponds to the insulating seat.

[0093] Exemplarily, the first light emitting surface and the second light emitting surface are rectangular in shape.

[0094] Exemplarily, the first light-emitting surface is located on the top surface of the first adhesive layer, and the contact surface shape between the first adhesive layer and the first light-emitting component is rectangular, or, the first light-emitting surface is located on the side surface of the first adhesive layer, and the contact surface shape between the first adhesive layer and the first light-emitting component is trapezoidal; the second light-emitting surface is located on the top surface of the second adhesive layer, and the contact surface shape between the second adhesive layer and the second light-emitting component is rectangular, or, the second light-emitting surface is located on the side surface of the second adhesive layer, and the contact surface shape between the second adhesive layer and the second light-emitting component is trapezoidal.

[0095] Please refer to Figure 8 , Figure 8 is a schematic diagram of the structure of the electronic device 100 provided in the embodiment of the present application, such as Figure 8 As shown, the electronic device 100 includes the LED lamp bead 10 provided in any embodiment of the present application, thereby enabling the electronic device 100 to be miniaturized.

[0096] In some embodiments, the electronic device 100 is any device such as a fan, a screen, etc., and the embodiment of the present application does not limit the type of the electronic device 100.

[0097] In some embodiments, the electronic device 100 includes a plurality of LED lamp beads 10 , and the plurality of LED lamp beads can be connected in the electronic device 100 at intervals, or a corresponding connection method can be set according to requirements.

[0098] In the description of this application, it should be noted that, unless otherwise clearly specified and limited, the terms "installed", "connected", and "connected" should be understood in a broad sense. For example, it can be a fixed connection, a detachable connection, or an integral connection. It can be a mechanical connection or an electrical connection. It can be directly connected or indirectly connected through an intermediate medium. It can be the internal connection of two elements or the interaction relationship between two elements. For ordinary technicians in this field, the specific meanings of the above terms in this application can be understood according to the specific circumstances.

[0099] In the present application, unless otherwise clearly specified and limited, a first feature being "above" or "below" a second feature may include that the first and second features are in direct contact, or may include that the first and second features are not in direct contact but are in contact through another feature between them. Moreover, a first feature being "above", "above" and "above" a second feature includes that the first feature is directly above and obliquely above the second feature, or simply indicates that the first feature is higher in level than the second feature. A first feature being "below", "below" and "below" a second feature includes that the first feature is directly below and obliquely below the second feature, or simply indicates that the first feature is lower in level than the second feature.

[0100] The disclosure above provides many different embodiments or examples to realize the different structures of the present application. In order to simplify the disclosure of the present application, the parts and settings of specific examples are described above. Of course, they are only examples, and the purpose is not to limit the present application. In addition, the present application can repeat reference numbers and / or reference letters in different examples, and this repetition is for the purpose of simplification and clarity, which itself does not indicate the relationship between the various embodiments and / or settings discussed. In addition, the various specific processes and material examples provided by the present application, but those of ordinary skill in the art can be aware of the application of other processes and / or the use of other materials.

[0101] In the description of this specification, the description with reference to the terms "one embodiment", "some embodiments", "illustrative embodiments", "examples", "specific examples", or "some examples" means that the specific features, structures, materials, or characteristics described in conjunction with the embodiments or examples are included in at least one embodiment or example of the present application. In this specification, the schematic representation of the above terms does not necessarily refer to the same embodiment or example. Moreover, the specific features, structures, materials, or characteristics described may be combined in any one or more embodiments or examples in a suitable manner.

Claims

1. A method for preparing an LED lamp bead, characterized in that: Used to manufacture LED lamp beads, the LED lamp beads include an insulating seat, a plurality of pins, a first light-emitting component, a second light-emitting component and a packaging glue, and the plurality of pins are arranged on the insulating seat; the first light-emitting component includes a first light-emitting chip group and a first driving chip, the first light-emitting chip group and the first driving chip are respectively arranged on the pins and electrically connected to the pins, and the first driving chip is electrically connected to the first light-emitting chip group; the second light-emitting component includes a second light-emitting chip group and a second driving chip, the second light-emitting chip group and the second driving chip are respectively arranged on the pins and electrically connected to the pins, and the second driving chip is electrically connected to the second light-emitting chip group; the packaging glue is used to encapsulate the outside of the first light-emitting component and the second light-emitting component, the packaging glue includes a first light-emitting surface and a second light-emitting surface, the first light-emitting surface is arranged relative to the first light-emitting component, and the second light-emitting surface is arranged relative to the second light-emitting component, and the packaging glue includes a light-transmitting glue layer and a light-impermeable glue layer; the preparation method includes: By means of a first molding process, the light-transmitting adhesive layer is formed outside the first light-emitting component and the second light-emitting component; According to the position of the first light-emitting surface required on the light-transmitting adhesive layer, determine the shape of the first adhesive layer corresponding to the first light-emitting component, wherein the first adhesive layer is a light-transmitting adhesive layer encapsulated in the first light-emitting component, and the shape of the first adhesive layer is the shape of the contact surface between the light-transmitting adhesive layer and the first light-emitting component; Determine the shape of the second adhesive layer corresponding to the second light-emitting component according to the position of the second light-emitting surface required on the light-transmitting adhesive layer, wherein the second adhesive layer is a light-transmitting adhesive layer encapsulated in the second light-emitting component, and the shape of the second adhesive layer is the shape of the contact surface between the light-transmitting adhesive layer and the second light-emitting component; The light-transmitting adhesive layer is cut according to the shapes of the first adhesive layer and the second adhesive layer to obtain the first adhesive layer, the second adhesive layer and the adhesive flow channel; the adhesive flow channel is located outside the first adhesive layer and the second adhesive layer except the first light-emitting surface and the second light-emitting surface; By means of a second molding, a third glue layer is formed in the glue flow channel; wherein the third glue layer is the opaque glue layer; wherein the packaging glue includes a first glue layer, the first glue layer is encapsulated on the outside of the first light-emitting component; the first glue layer includes the first light-emitting surface; a second glue layer, the second glue layer is encapsulated on the outside of the second light-emitting component; the second glue layer includes the second light-emitting surface; a third glue layer, the third glue layer is encapsulated on the outside of the first glue layer and the second glue layer except the first light-emitting surface and the second light-emitting surface; wherein the first glue layer and the second glue layer are translucent glue layers, and the third glue layer is an opaque glue layer; the first light-emitting surface is located on the top surface or side surface of the first glue layer; and / or the second light-emitting surface is located on the top surface or side surface of the second glue layer; the top surface corresponds to the insulating seat.

2. The preparation method according to claim 1, characterized in that: The first light emitting surface and the second light emitting surface are rectangular in shape.

3. The preparation method according to claim 1, characterized in that: The first light-emitting surface is located on the top surface of the first adhesive layer, and the contact surface of the first adhesive layer and the first light-emitting component is in a rectangular shape; or, the first light-emitting surface is located on the side surface of the first adhesive layer, and the contact surface of the first adhesive layer and the first light-emitting component is in a trapezoidal shape; The second light-emitting surface is located on the top surface of the second adhesive layer, and the contact surface between the second adhesive layer and the second light-emitting component is rectangular, or the second light-emitting surface is located on the side surface of the second adhesive layer, and the contact surface between the second adhesive layer and the second light-emitting component is trapezoidal.

4. An LED lamp bead, characterized in that: include: Insulation seat; A plurality of pins, wherein the plurality of pins are arranged on the insulating seat; A first light-emitting component, the first light-emitting component comprises a first light-emitting chip group and a first driving chip, the first light-emitting chip group and the first driving chip are respectively arranged on the pins and electrically connected to the pins, and the first driving chip is electrically connected to the first light-emitting chip group; a second light-emitting component, the second light-emitting component comprising a second light-emitting chip group and a second driving chip, the second light-emitting chip group and the second driving chip are respectively arranged on the pins and electrically connected to the pins, and the second driving chip is electrically connected to the second light-emitting chip group; Packaging glue, the packaging glue is packaged on the outside of the first light-emitting component and the second light-emitting component, the packaging glue includes at least one first light-emitting surface and at least one second light-emitting surface, the first light-emitting surface is arranged relative to the first light-emitting component, and the second light-emitting surface is arranged relative to the second light-emitting component; the packaging glue includes a first glue layer, the first glue layer is packaged on the outside of the first light-emitting component; the first glue layer includes the first light-emitting surface; a second glue layer, the second glue layer is packaged on the outside of the second light-emitting component; the second glue layer includes the second light-emitting surface; a third glue layer, the third glue layer is packaged on the outside of the first glue layer and the second glue layer except the first light-emitting surface and the second light-emitting surface; wherein the first glue layer and the second glue layer are light-transmitting glue layers, and the third glue layer is an opaque glue layer; the first light-emitting surface is located on the top surface or side surface of the first glue layer; and / or the second light-emitting surface is located on the top surface or side surface of the second glue layer; the top surface corresponds to the insulating seat; The first driving chip is used to control the first light-emitting chip group to emit light through the first light-emitting surface, and the second driving chip is used to control the second light-emitting chip group to emit light through the first light-emitting surface.

5. The LED lamp bead according to claim 4, characterized in that: The first light emitting surface and the second light emitting surface are rectangular in shape.

6. The LED lamp bead according to claim 4, characterized in that: The first light-emitting surface is located on the top surface of the first adhesive layer, and the contact surface of the first adhesive layer and the first light-emitting component is rectangular, or the first light-emitting surface is located on the side surface of the first adhesive layer, and the contact surface of the first adhesive layer and the first light-emitting component is trapezoidal; and / or, The second light-emitting surface is located on the top surface of the second adhesive layer, and the contact surface between the second adhesive layer and the second light-emitting component is rectangular, or the second light-emitting surface is located on the side surface of the second adhesive layer, and the contact surface between the second adhesive layer and the second light-emitting component is trapezoidal.

7. The LED lamp bead according to claim 4, characterized in that: A pin provided on the first driving chip is connected to a pin provided on the second driving chip.

8. The LED lamp bead according to claim 4, characterized in that: The plurality of pins include four groups of pin pairs, the four groups of pin pairs are respectively a first pin pair, a second pin pair, a third pin pair and a fourth pin pair, and the pins in each group of the pin pairs are relatively distributed on the insulating seat; wherein, The first pin pair includes a first power pin and a first ground pin, the first light-emitting chip group and the first driving chip are electrically connected to the first power pin, and the first driving chip is electrically connected to the first ground pin; The second pin pair includes a first signal input pin and a first signal output pin, and the first driver chip is electrically connected to the first signal input pin and the first signal output pin; The third pin pair includes a second signal input pin and a second signal output pin, and the second driver chip is electrically connected to the second signal input pin and the second signal output pin; the fourth pin pair includes a second power pin and a second ground pin, the second light-emitting chip group and the second driver chip are electrically connected to the second power pin, and the second driver chip is electrically connected to the second ground pin.

9. The LED lamp bead according to claim 8, characterized in that: The insulating seat comprises a first end surface, and the first ground pin, the first power pin, the first signal input pin, the first signal output pin, the second ground pin, the second power pin, the second signal input pin, and the second signal output pin have a crystal bonding portion formed on the first end surface and a welding portion formed on other end surfaces of the insulating seat; The first light-emitting component is arranged on the die-bonding portion of any one of the first ground pin, the first power pin, the first signal input pin, and the first signal output pin; The second light-emitting component is arranged on the die-bonding portion of any one of the second ground pin, the second power pin, the second signal input pin, and the second signal output pin, and at least a part of the structure of the welding portion is formed with a via structure.

10. The LED lamp bead according to claim 9, characterized in that: The first light-emitting chip group and the second light-emitting chip group each include a plurality of light-emitting chips; The light-emitting chips of the first light-emitting chip group and the light-emitting chips of the second light-emitting chip group are arranged on the die-bonding portion at equal intervals.

11. The LED lamp bead according to claim 9, characterized in that: The first driving chip and the first light-emitting chip group are respectively arranged on the die-bonding portion of any one of the first ground pin, the first power pin, the first signal input pin, and the first signal output pin; And / or, the second driving chip and the second light-emitting chip group are respectively arranged on the die-bonding portion of any one of the second ground pin, the second power pin, the second signal input pin, and the second signal output pin.

12. The LED lamp bead according to claim 11, characterized in that: The crystal-bonding portion provided in the first light-emitting chip group includes a first extension portion and a second extension portion perpendicular to the first extension portion, the first extension portion extends toward the other pin in the pair of pins where the crystal-bonding portion provided in the first light-emitting chip group is located, and is provided with a third extension portion and a fourth extension portion spaced apart from the second extension portion; The crystal-bonding portion provided in the second light-emitting chip group includes a fifth extension portion and a sixth extension portion perpendicular to the fifth extension portion, the fifth extension portion extends toward the other pin in the pair of pins where the crystal-bonding portion provided in the second light-emitting chip group is located, and is formed with a seventh extension portion and an eighth extension portion spaced apart from the sixth extension portion; Wherein, the first light-emitting chip group is arranged in the second extension part, and a plurality of light-emitting chips in the first light-emitting chip group are electrically connected to the second extension part and the fourth extension part respectively; The second light emitting chip group is disposed in the seventh extending portion, and a plurality of light emitting chips in the second light emitting chip group are electrically connected to the sixth extending portion and the eighth extending portion, respectively.

13. The LED lamp bead according to claim 12, characterized in that: The crystal fixing portion provided in the first light-emitting chip group further includes a ninth extending portion provided opposite to the second extending portion, and the first driving chip is electrically connected to the ninth extending portion; The die-bonding portion provided for the second light-emitting chip group further includes a tenth extending portion provided opposite to the sixth extending portion, and the second driving chip is electrically connected to the tenth extending portion.

14. An electronic device, characterized in that: The invention comprises at least one LED lamp bead as claimed in any one of claims 4 to 13.

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