Optical imaging device

Abstract

The embodiment of the invention provides an optical imaging device, which comprises a shell with an accommodating space, and the top wall of the shell is provided with a through hole; the lens is fixed on the top wall of the shell and covers the through hole; the image sensor assembly is arranged in the accommodating space, and the image sensor assembly comprises an image sensor chip and a bracket for bearing the image sensor chip; the elastic supporting piece is arranged in the accommodating space, and the elastic supporting piece is connected with the bottom wall and the bracket so as to suspend the image sensor assembly in the accommodating space; the driving assembly is arranged in the containing space, observed in the optical axis direction of the lens, the driving assembly and the image sensor chip are at least partially overlapped, the driving assembly comprises a magnetic circuit system and a driving coil arranged opposite to the magnetic circuit system, and one of the driving coil and the magnetic circuit system is fixed to the support; the other one of the driving coil and the magnetic circuit system is fixed on the bottom wall of the shell, and the driving coil and the magnetic circuit system are matched to drive the image sensor assembly to move in the direction perpendicular to the optical axis of the lens.

Description

Technical Field

[0001] The embodiments of the present disclosure belong to the technical field of photographing equipment, and specifically relate to an optical imaging device. Background Art

[0002] The cameras currently used on AR glasses are limited by size and weight, and are all fixed-focus and non-stabilization designs, so a small-size anti-shake design is very necessary.

[0003] In the anti-shake design, the conventional dynamic lens movement solution will cause the screen opening to become larger, affecting the screen-to-body ratio; in addition, the lens movement solution requires reserving moving space for the movement of the lens in the housing of the optical imaging device, which is not conducive to the miniaturization design of the equipment, and the lateral size of the device cannot be effectively controlled.

[0004] Therefore, how to solve the above technical problems has become a technical problem that needs to be solved urgently by those skilled in the art. Summary of the invention

[0005] The embodiments of the present disclosure aim to solve at least one of the technical problems existing in the prior art and provide an optical imaging device.

[0006] According to one aspect of an embodiment of the present disclosure, an optical imaging device is provided, comprising:

[0007] A shell having a receiving space, the shell comprising a top wall, a bottom wall arranged opposite to the top wall, and a side wall connecting the top wall and the bottom wall, the top wall being provided with a through hole connecting the receiving space with the outside;

[0008] A lens, fixed to the top wall of the housing and covering the through hole;

[0009] An image sensor assembly is arranged in the receiving space, and the image sensor assembly includes an image sensor chip and a bracket for carrying the image sensor chip;

[0010] an elastic support member, disposed in the receiving space, the elastic support member connecting the bottom wall and the bracket to suspend the image sensor assembly in the receiving space;

[0011] A driving component is arranged in the accommodating space. When observed along the optical axis direction of the lens, the driving component at least partially overlaps with the image sensor chip. The driving component includes a magnetic circuit system and a driving coil arranged opposite to the magnetic circuit system. One of the driving coil and the magnetic circuit system is fixed to the bracket, and the other of the driving coil and the magnetic circuit system is fixed to the bottom wall of the shell. The driving coil cooperates with the magnetic circuit system to drive the image sensor component to move in a direction perpendicular to the optical axis of the lens.

[0012] Optionally, the driving coil is electrically connected to the elastic support member.

[0013] Optionally, the magnetic circuit system includes a first magnetic circuit and a second magnetic circuit stacked along the optical axis direction of the lens, the first magnetic circuit is closer to the driving coil than the second magnetic circuit, the first magnetic circuit includes a first annular inner magnetic steel and a first annular outer magnetic steel spaced apart from the first annular inner magnetic steel, the second magnetic circuit is an integrally magnetized magnetic steel and includes a second annular inner magnetic steel, a second annular outer magnetic steel spaced apart from the second annular inner magnetic steel, and a non-magnetic portion disposed between the second annular inner magnetic steel and the second annular outer magnetic steel;

[0014] The first annular inner magnetic steel and the second annular inner magnetic steel are both magnetized along the optical axis direction and the magnetization directions of the two are the same, the first annular outer magnetic steel and the second annular outer magnetic steel are both magnetized along the optical axis direction and the magnetization directions of the two are the same, and the magnetization directions of the first annular inner magnetic steel and the first annular outer magnetic steel are opposite.

[0015] Optionally, the magnetic circuit system includes a first magnetic circuit and a second magnetic circuit stacked along the optical axis direction of the lens, the first magnetic circuit is closer to the driving coil than the second magnetic circuit, the first magnetic circuit includes a first annular inner magnetic steel and a first annular outer magnetic steel spaced apart from the first annular inner magnetic steel, and the second magnetic circuit includes a second annular inner magnetic steel and a second annular outer magnetic steel spliced ​​to each other;

[0016] The first annular inner magnetic steel and the second annular inner magnetic steel are both magnetized along the optical axis direction and the magnetization directions of the two are the same, the first annular outer magnetic steel and the second annular outer magnetic steel are both magnetized along the optical axis direction and the magnetization directions of the two are the same, and the magnetization directions of the first annular inner magnetic steel and the first annular outer magnetic steel are opposite.

[0017] Optionally, the magnetic circuit system is an integral magnetized magnetic steel and includes an annular inner magnetic steel, an annular outer magnetic steel spaced apart from the annular inner magnetic steel, and a non-magnetic portion disposed between the annular inner magnetic steel and the annular outer magnetic steel;

[0018] The annular inner magnetic steel and the annular outer magnetic steel are both magnetized along the optical axis direction and the magnetization directions of the two are opposite.

[0019] Optionally, the magnetic circuit system is an integrated magnetized magnetic steel and includes an annular inner magnetic steel, an annular outer magnetic steel, and an intermediate magnetic portion arranged between the annular inner magnetic steel and the annular outer magnetic steel;

[0020] The annular inner magnetic steel and the annular outer magnetic steel are both magnetized along the optical axis and their magnetization directions are opposite; the intermediate magnetic part is magnetized along a direction perpendicular to the optical axis, and the polarity of the surface of the intermediate magnetic part close to the annular outer magnetic steel is the same as the polarity of the surface of the annular outer magnetic steel facing the lens.

[0021] Optionally, the elastic support member includes a first connecting portion connected to the bottom wall of the shell, a second connecting portion connected to the image sensor assembly, and a third connecting portion connecting the first connecting portion and the second connecting portion, wherein the third connecting portion extends along the side wall of the shell; the first connecting portion is bent from the third connecting portion and extends along the bottom wall, and the second connecting portion is bent from the third connecting portion and extends along the surface of the image sensor assembly.

[0022] Optionally, the third connection portion is frame-shaped, the first connection portion is bent from the outer side of the third connection portion and extends horizontally toward the outside of the frame, and the second connection portion is bent from the inner side of the third connection portion and extends horizontally toward the inside of the frame.

[0023] Optionally, the third connection portion is frame-shaped, and the first connection portion and the second connection portion are both bent from the inner side of the third connection portion and extend horizontally toward the inside of the frame.

[0024] Furthermore, it also includes: a first reinforcing sheet, which is arranged at a bending position of the first connecting portion; and / or the first reinforcing sheet is arranged at a bending position of the second connecting portion.

[0025] Furthermore, the third connecting portion is in a rectangular frame shape; and the imaging device further comprises:

[0026] The second reinforcing sheet is arranged on the inner side of the bending portion of the rectangular third connecting portion and / or on the outer side of the bending portion.

[0027] Optionally, the bracket includes a frame connected to the elastic support member, and a circuit board disposed on the frame and electrically connected to the elastic support member; the image sensor chip is disposed on the circuit board and electrically connected thereto.

[0028] Optionally, the bracket includes a frame connected to the elastic support member, and a circuit board disposed on the frame and electrically connected to the elastic support member;

[0029] The side wall of the frame has a bending transition portion, the elastic support member is connected to the bending transition portion to suspend the frame in the receiving space, and the second connection portion is bent from the third connection portion at the bending transition portion and extends along the bending transition portion toward the frame.

[0030] Optionally, a mounting cavity for accommodating the drive coil or the magnetic circuit system is provided on the side of the frame facing the bottom wall, and a carrying platform for carrying the circuit board is provided on the side of the frame facing the top wall, the carrying platform is connected to the mounting cavity through an opening, the first connecting portion is provided in the opening, and the surface of the first connecting portion facing the circuit board is flush with the surface of the carrying platform.

[0031] Furthermore, the image sensor assembly also includes: a filter and a carrying frame for carrying the filter, the filter is arranged between the lens and the image sensor chip, and the carrying frame covers the image sensor chip and is installed on the circuit board.

[0032] Optionally, four drive coils are provided and are respectively arranged corresponding to the first magnetic circuit intervals, the four drive coils are arranged at circumferential intervals along the first magnetic circuit, and the winding hole of each drive coil corresponds to the interval area between the first annular inner magnetic steel and the first annular outer magnetic steel.

[0033] Optionally, four drive coils are provided and are respectively arranged corresponding to the magnetic circuit system at intervals, the four drive coils are arranged at circumferential intervals along the magnetic circuit system, and the winding hole of each drive coil corresponds to the non-magnetic part.

[0034] Optionally, four drive coils are provided and are respectively arranged corresponding to the magnetic circuit system at intervals, the four drive coils are arranged at circumferential intervals along the magnetic circuit system, and the winding hole of each drive coil corresponds to the intermediate magnetic part.

[0035] The beneficial effects of the embodiments of the present disclosure include:

[0036] In the present invention, in the fixed-focus anti-shake design, in the design scheme using a mobile image sensor assembly, there is no need to provide additional moving space for the lens assembly, and the image sensor assembly can be accurately moved in a smaller space, so there is no need to increase the screen opening size of the lens, effectively improving the screen-to-body ratio. In addition, compared with the existing lens movement scheme, the projection of the drive assembly in the optical axis direction of the present invention at least partially overlaps with the projection of the image sensor chip of the image sensor assembly, that is, the space between the image sensor chip and the drive assembly in the optical axis direction is fully utilized. The use of this design method can significantly reduce the lateral space size in the shell, which is conducive to the miniaturization of the device. Furthermore, since the image sensor assembly can be moved directly in a direction perpendicular to the optical axis, a larger optical axis adjustment range can be achieved, so that the field of view (FOV) can be made larger at the same screen opening size. BRIEF DESCRIPTION OF THE DRAWINGS

[0037] Figure 1is a schematic structural diagram of an optical imaging device according to an embodiment of the present invention;

[0038] Figure 2 for Figure 1 A cross-sectional view of the optical imaging device along the AA direction shown in FIG. 1 , wherein the positional relationship among the driving assembly, the image sensor assembly and the lens is schematically shown;

[0039] Figure 3 for Figure 2 An enlarged schematic diagram of a portion of the structure of the optical imaging device shown in ;

[0040] Figure 4 for Figure 1 A perspective exploded view of the optical imaging device shown in ;

[0041] Figure 5 It is a partial structural schematic diagram of an optical imaging device according to an embodiment of the present invention, wherein the positional relationship among the driving assembly, the elastic support member and the image sensor chip is schematically shown;

[0042] Figure 6 for Figure 5 The exploded perspective view shown in ;

[0043] Figure 7 This is a schematic diagram of the structure of a driving assembly according to an embodiment of the present invention;

[0044] Figure 8 It is a three-dimensional exploded view of a magnetic circuit system according to an embodiment of the present invention;

[0045] Fig. 9 1 is a cross-sectional view of a magnetic circuit system of an embodiment of the present invention; the figure shows a first magnetic circuit manufactured in a split manner and a second magnetic circuit manufactured in an integrated manner using a quadrupole magnetization process, and schematically illustrates the magnetization directions of the first annular inner magnetic steel, the first annular outer magnetic steel, the second annular inner magnetic steel, and the second annular outer magnetic steel, wherein the magnetization direction is the direction of the arrow, i.e., the direction from the S pole to the N pole;

[0046] Fig.10 1 is a cross-sectional view of a magnetic circuit system of an embodiment of the present invention; the figure shows a first magnetic circuit manufactured in a split manner and a second magnetic circuit manufactured in an integrated manner using a splicing process, and schematically illustrates the magnetization directions of the first annular inner magnetic steel, the first annular outer magnetic steel, the second annular inner magnetic steel, and the second annular outer magnetic steel, wherein the magnetization direction is the direction of the arrow, i.e., the direction from the S pole to the N pole;

[0047] Fig.111 is a cross-sectional view of a magnetic circuit system of an embodiment of the present invention; the figure shows a first magnetic circuit and a second magnetic circuit integrally manufactured by the Halbach process, and schematically illustrates a first annular inner magnetic steel, a first annular outer magnetic steel, a second annular inner magnetic steel, a second annular outer magnetic steel, and a magnetizing direction of an intermediate magnetic portion, wherein the magnetizing direction is the direction of the arrow, i.e., the direction from the S pole to the N pole;

[0048] Fig.12 2 is a cross-sectional view of a magnetic circuit system of an embodiment of the present invention; the figure shows a magnetic circuit system integrally manufactured by a quadrupole magnetization process, and schematically shows the magnetization direction of the annular inner magnetic steel and the annular outer magnetic steel, wherein the magnetization direction is the direction of the arrow, i.e., the direction from the S pole to the N pole;

[0049] Fig.13 2 is a cross-sectional view of a magnetic circuit system of an embodiment of the present invention; the figure shows a magnetic circuit system made in one piece by the Halbach process, and schematically shows the magnetization direction of the annular inner magnetic steel, the annular outer magnetic steel, and the middle magnetic part, wherein the magnetization direction is the direction of the arrow, that is, the direction from the S pole to the N pole;

[0050] Fig.14 This is a schematic diagram of the overall structure of an elastic support member according to an embodiment of the present invention;

[0051] Fig.15 It is a three-dimensional exploded view of a part of the structure of an optical imaging device according to an embodiment of the present invention; wherein the positional relationship between the image sensor chip, the frame and the circuit board is schematically shown;

[0052] Fig.16 A cross-sectional view of an optical imaging device along the AA direction according to another embodiment of the present invention, wherein the positional relationship among the driving assembly, the image sensor assembly and the lens is schematically shown;

[0053] Fig.17 for Fig.16 An enlarged schematic diagram of a portion of the structure of the optical imaging device shown in ;

[0054] Fig.18 for Fig.16 A perspective exploded view of the image sensor assembly, elastic support member and drive assembly shown in ;

[0055] Fig.19 It is a three-dimensional exploded view of a part of the structure of an optical imaging device according to another embodiment of the present invention; wherein the positional relationship among the image sensor chip, the frame and the circuit board is schematically shown;

[0056] Fig. 20 for Fig.19 An enlarged schematic diagram of a portion of the structure of the optical imaging device shown in ;

[0057] Fig.21 for Fig.16 A schematic diagram of the structure of the elastic support member and the driving assembly shown in ;

[0058] Fig. 22 for Fig.19 A perspective exploded view of the image sensor assembly, elastic support member and drive assembly shown in ;

[0059] Fig.23 for Fig.19 The structural schematic diagram of the magnetic circuit system shown in;

[0060] Fig.24 for Fig. 22 A perspective exploded view of the elastic support member shown in ;

[0061] Fig.25 for Figure 4 The structural schematic diagram of the load-bearing frame is shown in FIG.

[0062] In the figure, 100, optical imaging device; 10, housing; 20, lens; 30, image sensor assembly; 40, elastic support member; 50, drive assembly; 60, first reinforcing sheet;

[0063] 70, second reinforcing sheet; 11, receiving space; 12, top wall; 13, bottom wall; 14, side wall; 121, through hole; 21, optical axis; 31, image sensor chip; 32, bracket; 321, frame; 322, circuit board; 323, filter; 324, carrying frame; 3211, bending transition portion; 3212, installation cavity; 3213, carrying platform; 3214, opening; 32131, table; 3241, receiving cavity; 324 2. Bearing slot; 41. First connecting part; 42. Second connecting part; 43. Third connecting part; 51. Magnetic circuit system; 52. Driving coil; 511. First magnetic circuit; 512. Second magnetic circuit; 513. Spacer; 5111. First annular inner magnetic steel; 5112. First annular outer magnetic steel; 5121. Second annular inner magnetic steel; 5122. Second annular outer magnetic steel; 5123. Non-magnetic part; 5124. Splicing part; 514. Annular inner magnetic steel;

[0064] 515, annular outer magnetic steel; 516, middle magnetic part; 521, winding hole. DETAILED DESCRIPTION

[0065] In order to enable those skilled in the art to better understand the technical solution of the present disclosure, the present disclosure is further described in detail below in conjunction with the accompanying drawings and specific implementation methods.

[0066] The following is a further detailed description of the implementation methods of the present application in conjunction with the accompanying drawings and examples. The detailed descriptions and drawings of the following examples are used to illustrate the principles of the present application, but cannot be used to limit the scope of the present application, that is, the present application is not limited to the described embodiments. In the description of the present application, it should be noted that, unless otherwise specified, the meaning of "multiple" is more than two; the orientation or position relationship indicated by the terms "upper", "lower", "left", "right", "inside", "outside", etc. is only for the convenience of describing the present application and simplifying the description, rather than indicating or implying that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore cannot be understood as a limitation on the present application. In addition, the terms "first", "second", etc. are only used for descriptive purposes and cannot be understood as indicating or implying relative importance. "Vertical" is not vertical in the strict sense, but within the error tolerance range. "Parallel" is not parallel in the strict sense, but within the error tolerance range.

[0067] In the description of this application, it should also be noted that, unless otherwise clearly specified and limited, the terms "installed", "connected", and "connected" should be understood in a broad sense, for example, it can be a fixed connection, a detachable connection, or an integral connection; it can be directly connected or indirectly connected through an intermediate medium. For ordinary technicians in this field, the specific meanings of the above terms in this application can be understood according to the specific circumstances.

[0068] like Figure 1-4 As shown, an optical imaging device 100 , the driving device includes a housing 10 , a lens 20 , an image sensor assembly 30 , an elastic support member 40 and a driving assembly 50 .

[0069] The housing 10 has a receiving space 11, and includes a top wall 12, a bottom wall 13 disposed opposite to the top wall 12, and a side wall 14 connecting the top wall 12 and the bottom wall 13. The top wall 12 is provided with a through hole 121 for connecting the receiving space 11 with the outside. The lens 20 is fixed to the top wall 12 of the housing 10 and covers the through hole 121.

[0070] The image sensor assembly 30 is disposed in the receiving space 11 , and includes an image sensor chip 31 and a bracket 32 ​​for carrying the image sensor chip 31 .

[0071] The elastic support member 40 is disposed in the receiving space 11 , and the elastic support member 40 connects the bottom wall 13 and the bracket 32 ​​to suspend the image sensor assembly 30 in the receiving space 11 .

[0072] The driving component 50 is disposed in the accommodating space 11. When observed along the optical axis 21 of the lens 20, the driving component 50 at least partially overlaps with the image sensor chip 31. The driving component 50 includes a magnetic circuit system 51 and a driving coil 52 arranged opposite to the magnetic circuit system 51, and one of the driving coil 52 and the magnetic circuit system 51 is fixed to the bracket 32, and the other of the driving coil 52 and the magnetic circuit system 51 is fixed to the bottom wall 13 of the shell 10. The driving coil 52 cooperates with the magnetic circuit system 51 to drive the image sensor component 30 to move in a direction perpendicular to the optical axis 21 of the lens 20.

[0073] In the present invention, in the fixed-focus anti-shake design, in the design scheme using the mobile image sensor assembly 30, there is no need to provide additional moving space for the lens 20 assembly, and the image sensor assembly 30 can be accurately moved in a smaller space, so there is no need to increase the screen opening size of the lens 20, effectively improving the screen-to-body ratio. In addition, compared with the existing lens 20 moving scheme, the projection of the drive assembly 50 of the present invention in the direction of the optical axis 21 overlaps at least partially with the projection of the image sensor chip 31 of the image sensor assembly 30, that is, the space between the image sensor chip 31 and the drive assembly 50 in the direction of the optical axis 21 is fully utilized. The use of this design method can significantly reduce the lateral space size in the housing 10, which is conducive to the miniaturization of the device. Furthermore, since the image sensor assembly 30 can be directly moved in a direction perpendicular to the optical axis 21, a larger adjustment range of the optical axis 21 can be achieved, so that the field of view (FOV) can be made larger under the same screen opening size.

[0074] Specifically, the axis of the through hole 121 of the top wall 12 of the housing 10 coincides with the optical axis 21 of the lens 20. The image sensor assembly 30 is supported by the elastic support member 40 and arranged along the optical axis 21 of the lens 20, and corresponds to the position of the lens 20.

[0075] In some embodiments, the driving coil 52 is electrically connected to the elastic support member 40 , so that the circuit board 322 is electrically connected to the driving coil 52 through the elastic support member 40 .

[0076] In some embodiments, reference Figure 7-8 The magnetic circuit system 51 includes a first magnetic circuit 511 and a second magnetic circuit 512 stacked along the optical axis 21 of the lens 20. The first magnetic circuit 511 is closer to the driving coil 52 than the second magnetic circuit 512. The first magnetic circuit 511 includes a first annular inner magnetic steel 5111 and a first annular outer magnetic steel 5112 spaced apart from the first annular inner magnetic steel 5111. The second magnetic circuit 512 is an integrally magnetized magnetic steel and includes a second annular inner magnetic steel 5121, a second annular outer magnetic steel 5122 spaced apart from the second annular inner magnetic steel 5121, and a non-magnetic portion 5123 disposed between the second annular inner magnetic steel 5121 and the second annular outer magnetic steel 5122.

[0077] The first annular inner magnetic steel 5111 and the second annular inner magnetic steel 5121 are both magnetized along the optical axis 21 and have the same magnetization direction. The first annular outer magnetic steel 5112 and the second annular outer magnetic steel 5122 are both magnetized along the optical axis 21 and have the same magnetization direction. The magnetization directions of the first annular inner magnetic steel 5111 and the first annular outer magnetic steel 5112 are opposite.

[0078] refer to Figure 9-11 In one embodiment of the present invention, the first annular inner magnetic steel 5111 and the second annular inner magnetic steel 5121 are magnetized along the optical axis 21 and the magnetization directions of the two are the same and both point to the bottom wall 13, and the first annular outer magnetic steel 5112 and the second annular outer magnetic steel 5122 are magnetized along the optical axis 21 and the magnetization directions of the two are the same and point to the top wall 12. It can be understood that the first magnetic circuit 511 is closer to the driving coil 52 than the second magnetic circuit 512, which means that along the direction of the optical axis 21, the first magnetic circuit 511 is spaced close to the driving coil 52, and the second magnetic circuit 512 is away from the driving coil 52 and is arranged on the side of the first magnetic circuit 511 away from the driving coil 52.

[0079] Specifically, the axis of the first annular outer magnetic steel 5112 coincides with the axis of the first annular inner magnetic steel 5111 , so that the magnetic field distribution between the axis of the first annular outer magnetic steel 5112 and the first annular inner magnetic steel 5111 is more uniform.

[0080] Furthermore, the first annular inner magnetic steel 5111 and the first annular outer magnetic steel 5112 are both rectangular ring-shaped, the first annular outer magnetic steel 5112 has a rectangular inner ring space, and the first annular inner magnetic steel 5111 has a circular inner ring space, wherein the first annular inner magnetic steel 5111 is arranged in the rectangular inner ring space. The first annular inner magnetic steel 5111 and the first annular outer magnetic steel 5112 together form a rectangular ring-shaped spacing area 513, and the shape of the spacing area 513 corresponds to the position of the driving coil 52.

[0081] Specifically, the axis of the second annular inner magnetic steel 5121 coincides with the axis of the second annular outer magnetic steel 5122 , so that the magnetic field distribution between the second annular inner magnetic steel 5121 and the second annular outer magnetic steel 5122 is more uniform.

[0082] Furthermore, the second annular inner magnetic steel 5121 and the second annular outer magnetic steel 5122 are both rectangular ring-shaped, the second annular outer magnetic steel 5122 has a rectangular inner ring space, and the second annular inner magnetic steel 5121 has a circular inner ring space, wherein the second annular inner magnetic steel 5121 is arranged in the rectangular inner ring space.

[0083] refer to Figure 7, 10. In some other embodiments, the magnetic circuit system 51 includes a first magnetic circuit 511 and a second magnetic circuit 512 stacked along the optical axis 21 of the lens 20, the first magnetic circuit 511 is closer to the driving coil 52 than the second magnetic circuit 512, the first magnetic circuit 511 includes a first annular inner magnetic steel 5111 and a first annular outer magnetic steel 5112 spaced apart from the first annular inner magnetic steel 5111, and the second magnetic circuit 512 includes a second annular inner magnetic steel 5121 and a second annular outer magnetic steel 5122 spliced ​​to each other.

[0084] The first annular inner magnetic steel 5111 and the second annular inner magnetic steel 5121 are both magnetized along the optical axis 21 and have the same magnetization direction. The first annular outer magnetic steel 5121 and the second annular outer magnetic steel 5122 are both magnetized along the optical axis 21 and have the same magnetization direction. The magnetization directions of the first annular inner magnetic steel 5111 and the first annular outer magnetic steel 5121 are opposite.

[0085] Specifically, the second annular inner magnetic steel 5121 and the second annular outer magnetic steel 5122 are spliced ​​to each other via a splicing portion 5124 , and the splicing portion 5124 corresponds to the spacing area 513 between the first annular inner magnetic steel 5111 and the first annular outer magnetic steel 5112 .

[0086] The first annular inner magnetic steel 5111 and the second annular inner magnetic steel 5121 are both magnetized along the optical axis 21, and the magnetization directions of the two are the same and both point to the bottom wall 13. The first annular outer magnetic steel 5112 and the second annular outer magnetic steel 5122 are both magnetized along the optical axis 21, and the magnetization directions of the two are the same and both point to the top wall 12. It can be understood that the first magnetic circuit 511 is closer to the drive coil 52 than the second magnetic circuit 512, which means that along the direction of the optical axis 21, the first magnetic circuit 511 is spaced close to the drive coil 52, and the second magnetic circuit 512 is away from the drive coil 52 and is arranged on the side of the first magnetic circuit 511 away from the drive coil 52.

[0087] In some embodiments, the first annular inner magnetic steel 5111 and the first annular outer magnetic steel 5112 are integrally formed using a quadrupole magnetization process. Specifically, along the direction pointing to the optical axis 21, the end of the first annular inner magnetic steel 5111 facing the top wall 12 is magnetized as an S pole, and the end of the first annular inner magnetic steel 5111 away from the top wall 12 is magnetized as an N pole. The end of the first annular outer magnetic steel 5112 facing the top wall 12 is magnetized as an N pole, and the end of the first annular outer magnetic steel 5112 away from the top wall 12 is magnetized as an S pole, wherein a non-magnetic portion is filled between the first annular inner magnetic steel 5111 and the first annular outer magnetic steel 5112. It can be understood that quadrupole magnetization refers to magnetizing the magnetic steel into four alternating magnetic poles (NSNS) to form four magnetic pole regions. This setting method can ensure that the magnetic field is evenly distributed in multiple directions, reducing magnetic field distortion. In addition, the multi-pole magnetic field can better cooperate with the drive coil 52 to provide a more concentrated electromagnetic force, improve the driving efficiency and response speed, and more easily achieve fine magnetic field control, which helps to improve the accuracy and stability of the movement of the sensor assembly 20.

[0088] refer to Fig.11 In some embodiments, the first annular inner magnetic steel 5111 and the first annular outer magnetic steel 5112 are integrally formed by a Halbach process. Specifically, along the direction pointing to the optical axis 21, the end of the first annular inner magnetic steel 5111 facing the top wall 12 is magnetized as an S pole, and the end of the first annular inner magnetic steel 5111 away from the top wall 12 is magnetized as an N pole. The end of the first annular outer magnetic steel 5112 facing the top wall 12 is magnetized as an N pole, and the end of the first annular outer magnetic steel 5112 away from the top wall 12 is magnetized as an S pole, wherein an intermediate magnetic portion is filled between the first annular inner magnetic steel 5111 and the first annular outer magnetic steel 5112, and along the direction perpendicular to the optical axis 21, the end of the intermediate magnetic portion close to the first annular inner magnetic steel 5111 is magnetized as an S pole, and the end of the intermediate magnetic portion close to the first annular outer magnetic steel 5112 is magnetized as an N pole.

[0089] refer to Fig. 9 In some embodiments, the second annular inner magnetic steel 5121 and the second annular outer magnetic steel 5122 are integrally formed by a quadrupole magnetization process. Specifically, along the direction pointing to the optical axis 21, the end of the second annular inner magnetic steel 5121 facing the first magnetic circuit 511 is magnetized as an S pole, and the end of the second annular inner magnetic steel 5121 away from the first magnetic circuit 511 is magnetized as an N pole. The end of the second annular outer magnetic steel 5122 facing the first magnetic circuit 511 is magnetized as an N pole, and the end of the second annular outer magnetic steel 5122 away from the first magnetic circuit 511 is magnetized as an S pole, wherein the first annular inner magnetic steel 5111 and the first annular outer magnetic steel 5112 are filled with a non-magnetic portion 5123.

[0090] refer to Fig.11In some embodiments, the second annular inner magnetic steel 5121 and the second annular outer magnetic steel 5122 are integrally formed by a Halbach process. Specifically, along the direction pointing to the optical axis 21, the end of the second annular inner magnetic steel 5121 facing the first magnetic circuit 511 is magnetized as an S pole, and the end of the second annular inner magnetic steel 5121 away from the first magnetic circuit 511 is magnetized as an N pole. The end of the second annular outer magnetic steel 5122 facing the first magnetic circuit 511 is magnetized as an N pole, and the end of the second annular outer magnetic steel 5122 away from the first magnetic circuit 511 is magnetized as an S pole, wherein an intermediate magnetic portion is filled between the second annular inner magnetic steel 5121 and the second annular outer magnetic steel 5122, and along the direction perpendicular to the optical axis 21, the end of the intermediate magnetic portion close to the second annular inner magnetic steel 5121 is magnetized as an S pole, and the end of the intermediate magnetic portion close to the second annular outer magnetic steel 5122 is magnetized as an N pole.

[0091] refer to Fig.12 In some embodiments, the magnetic circuit system 51 is an integral magnetized magnetic steel and includes an annular inner magnetic steel 514, an annular outer magnetic steel 515 spaced apart from the annular inner magnetic steel 514, and a non-magnetic portion 5123 disposed between the annular inner magnetic steel 514 and the annular outer magnetic steel 515. The annular inner magnetic steel 514 and the annular outer magnetic steel 515 are both magnetized along the optical axis 21 and in opposite directions.

[0092] In one embodiment of the present invention, the annular inner magnetic steel 514 is magnetized along the optical axis 21 and its magnetization direction points to the top wall 12 , and the annular outer magnetic steel 515 is magnetized along the optical axis 21 and its magnetization direction points to the bottom wall 13 .

[0093] In some embodiments, the annular inner magnetic steel 514 and the annular outer magnetic steel 515 are integrally formed by a quadrupole magnetization process. Specifically, along the direction pointing to the optical axis 21, the end of the annular inner magnetic steel 514 facing the top wall 12 is magnetized to an N pole, and the end of the annular inner magnetic steel 514 away from the top wall 12 is magnetized to an S pole. The end of the annular outer magnetic steel 515 facing the top wall 12 is magnetized to an S pole, and the end of the annular outer magnetic steel 515 away from the top wall 12 is magnetized to an N pole, wherein the annular inner magnetic steel 514 and the annular outer magnetic steel 515 fill the non-magnetic portion 5123.

[0094] refer to Fig.13 , 23 In some embodiments, the magnetic circuit system 51 is an integral magnetized magnetic steel and includes an annular inner magnetic steel 514, an annular outer magnetic steel 515, and an intermediate magnetic portion 516 disposed between the annular inner magnetic steel 514 and the annular outer magnetic steel 515. The annular inner magnetic steel 514 and the annular outer magnetic steel 515 are magnetized along the optical axis 21 and in opposite directions, the intermediate magnetic portion 516 is magnetized in a direction perpendicular to the optical axis 21, and the polarity of the surface of the intermediate magnetic portion close to the annular outer magnetic steel 515 is the same as the polarity of the surface of the annular outer magnetic steel 515 facing the lens.

[0095] In one example of the present invention, the annular inner magnetic steel 514 is magnetized along the optical axis 21 and its magnetization direction points to the top wall 12, the annular outer magnetic steel 515 is magnetized along the optical axis 21 and its magnetization direction points to the bottom wall 13, the intermediate magnetic portion 516 is magnetized along a direction perpendicular to the optical axis 21, and the polarity of the surface of the intermediate magnetic portion 516 close to the annular outer magnetic steel 515 is the same as the polarity of the surface of the annular outer magnetic steel 515 facing the lens, wherein the magnetization direction of the intermediate magnetic portion 516 points from the annular outer magnetic steel 515 to the annular inner magnetic steel 514.

[0096] Specifically, the annular inner magnetic steel 514 and the annular outer magnetic steel 515 are integrally formed by the Halbach process. Specifically, along the direction pointing to the optical axis 21, the end of the annular inner magnetic steel 514 facing the top wall 12 is magnetized as an N pole, and the end of the annular inner magnetic steel 514 away from the top wall 12 is magnetized as an S pole. The end of the annular outer magnetic steel 515 facing the top wall 12 is magnetized as an S pole, and the end of the annular outer magnetic steel 515 away from the top wall 12 is magnetized as an N pole, wherein an intermediate magnetic portion 516 is filled between the annular inner magnetic steel 514 and the annular outer magnetic steel 515, and along the direction perpendicular to the optical axis 21, the end of the intermediate magnetic portion 516 close to the annular inner magnetic steel 514 is magnetized as an N pole, and the end of the intermediate magnetic portion 516 close to the annular outer magnetic steel 515 is magnetized as an S pole.

[0097] In some embodiments, the first annular inner magnetic steel 5111 and the first annular outer magnetic steel 5112 of the first magnetic circuit 511 are designed in a split type, and the second annular inner magnetic steel 5121 and the second annular outer magnetic steel 5122 of the second magnetic circuit 512 are designed in a split type. It can be understood that the first annular inner magnetic steel 5111 and the first annular outer magnetic steel 5112 are designed in a split type, that is, the first annular inner magnetic steel 5111 and the first annular outer magnetic steel 5112 are both manufactured separately and formed, and the first magnetic circuit 511 is formed by assembling. The second annular inner magnetic steel 5121 and the second annular outer magnetic steel 5122 of the second magnetic circuit 512 are designed in a split type, that is, the second annular inner magnetic steel 5121 and the second annular outer magnetic steel 5122 of the second magnetic circuit 512 are both manufactured separately and formed, and the second magnetic circuit 512 is formed by assembling.

[0098] In some embodiments, the first annular inner magnetic steel 5111 and the first annular outer magnetic steel 5112 of the first magnetic circuit 511 are designed in a split type, and the second annular inner magnetic steel 5121 and the second annular outer magnetic steel 5122 of the second magnetic circuit 512 are designed in an integrated type. It is understandable that the second magnetic circuit 512 is integrally formed by the four-pole magnetization process described in the above embodiment, or is integrally formed by the splicing process 5124.

[0099] In some embodiments, the first annular inner magnetic steel 5111 and the first annular outer magnetic steel 5112 of the first magnetic circuit 511 are designed as an integrated unit, and the second annular inner magnetic steel 5121 and the second annular outer magnetic steel 5122 of the second magnetic circuit 512 are designed as an integrated unit. That is, the first magnetic circuit 511 and the second magnetic circuit 512 are both integrally formed by the four-pole magnetization process described in the above embodiment, or are both integrally formed by the Halbach process.

[0100] refer to Fig.14 and 24 In some embodiments, the elastic support member 40 includes a first connection portion 41 connected to the bottom wall 13 of the shell 10, a second connection portion 42 connected to the image sensor assembly 30, and a third connection portion 43 connecting the first connection portion 41 and the second connection portion 42, the third connection portion 43 extends along the side wall 14 of the shell 10, the first connection portion 41 is bent from the third connection portion 43 and extends along the bottom wall 13, and the second connection portion 42 is bent from the third connection portion 43 and extends along the surface of the image sensor assembly 30.

[0101] Specifically, the first connection part 41 is bent from the lower edge of the third connection part 43 and extends along the upper surface of the bottom wall 13, the second connection part 42 is bent from the upper edge of the third connection part 43 and extends along the lower surface of the circuit board 322, and the third connection part 43 can be attached to the side wall 14 or extend along the optical axis 21 at a certain distance from the side wall.

[0102] Specific reference Fig.14 In some embodiments, the third connection portion 43 is frame-shaped, the first connection portion 41 is bent from the outer side of the third connection portion 43 and extends horizontally toward the outside of the frame, and the second connection portion 42 is bent from the inner side of the third connection portion 43 and extends horizontally toward the inside of the frame. It can be understood that the inner side of the third connection portion 43 is a side inside the frame, and the outer side of the third connection portion 43 is a side outside the frame.

[0103] An embodiment provided by the present invention includes: the third connection part 43 is in a rectangular frame shape, the first connection part 41 and the second connection part 42 are both in a sheet shape, the first connection part 41 is bent from the outer side of the third connection part 43 and extends horizontally toward the outside of the frame until it is connected to the bottom wall 13 of the shell 10, and the second connection part 42 is bent from the inner side of the third connection part 43 and extends horizontally toward the inside of the frame until it is connected to the lower surface of the circuit board 322.

[0104] Specific reference Fig.24 In some embodiments, the third connection portion 43 is frame-shaped, and the first connection portion 41 and the second connection portion 42 are both bent from the inner side of the third connection portion 43 and extend horizontally toward the inside of the frame.

[0105] An embodiment provided by the present invention includes: the third connection part 43 is in a rectangular frame shape, the first connection part 41 and the second connection part 42 are both in a sheet shape, the first connection part 41 is bent inward from the lower end edge of the third connection part 43 and extends horizontally toward the frame until it is connected to the bottom wall 13 of the shell 10, and the second connection part 42 is bent inward from the upper end edge of the third connection part 43 and extends horizontally toward the frame until it is connected to the lower surface of the circuit board 322.

[0106] refer to Fig. 22 and 24 In some embodiments, the optical imaging device 100 further includes a first reinforcing sheet 60, which is disposed at the bending portion of the first connecting portion 41, and / or the first reinforcing sheet 60 is disposed at the bending portion of the second connecting portion 42. The first reinforcing sheet 60 has a curvature that is suitable for the bending portions of the first connecting portion 41 and the second connecting portion 42.

[0107] An embodiment provided by the present invention includes: a first reinforcing sheet 60 is disposed at a bending portion of the first connecting portion 41 to enhance the structural strength of the bending portion of the first connecting portion 41 .

[0108] Another embodiment provided by the present invention includes: a first reinforcing sheet 60 is disposed at a bending portion of the second connecting portion 42 to enhance the structural strength of the bending portion of the second connecting portion 42 .

[0109] Another embodiment provided by the present invention includes: a first reinforcing sheet 60 is simultaneously provided at the bending parts of the first connecting part 41 and the second connecting part 42 to enhance the structural strength of the bending parts of the first connecting part 41 and the second connecting part 42 .

[0110] In some embodiments, the third connection portion 43 is in a rectangular frame shape, and the imaging device further includes a second reinforcing sheet 70, which is disposed inside the bending portion of the rectangular third connection portion 43 and / or outside the bending portion. It can be understood that the third connection portion 43 in a rectangular frame has four bending portions along the circumferential direction.

[0111] An embodiment provided by the present invention includes: a second reinforcing sheet 70 is correspondingly provided on the inner side of the bending portion of the third connecting portion 43 to enhance the structural strength of the bending portion of the third connecting portion 43 .

[0112] Another embodiment provided by the present invention includes: a second reinforcing sheet 70 is correspondingly provided on the outer side of the bending portion of the third connecting portion 43 to enhance the structural strength of the bending portion of the third connecting portion 43 .

[0113] Another embodiment provided by the present invention includes: the third connecting portion 43 is provided with a second reinforcing sheet 70 correspondingly on the outer side and the outer side of the bending portion, so as to enhance the structural strength of the bending portion of the third connecting portion 43 .

[0114] In some embodiments, the bracket 32 ​​includes a frame 321 connected to the elastic support member 40, and a circuit board 322 disposed on the frame 321 and electrically connected to the elastic support member 40, and the image sensor chip 31 is disposed on the circuit board 322 and electrically connected thereto.

[0115] It can be understood that in other embodiments, the circuit board 322 is only used as a bracket, one side of which is electrically connected to the elastic support member 40, and the other opposite side is used to support the image sensor chip 31, so as to electrically connect the image sensor chip 31 to the elastic support member 40 and suspend the image sensor chip 31 in the accommodation space.

[0116] refer to Figure 5 and 15 , 19 and 21, in one embodiment provided by the present invention, the bracket 32 ​​includes a frame 321 connected to the elastic support member 40, and a circuit board 322 arranged on the frame 321 and electrically connected to the elastic support member 40.

[0117] The side wall 14 of the frame 321 has a bending transition portion 3211, and the elastic support member 40 is connected to the bending transition portion 3211 to suspend the frame 321 in the receiving space 11. The second connection portion 42 is bent from the third connection portion 43 at the bending transition portion 3211 and extends toward the frame along the bending transition portion 3211. The bending curvature of the bending transition portion 3211 is compatible with the bending curvature of the bending portion of the second connection portion 42.

[0118] In some embodiments, a mounting cavity 3212 for accommodating a driving coil 52 or a magnetic circuit system 51 is provided on a side of the frame 321 facing the bottom wall 13, and a supporting platform 3213 for supporting a circuit board 322 is provided on a side of the frame 321 facing the top wall 12. The supporting platform 3213 is connected to the mounting cavity 3212 via an opening 3214, and the first connecting portion 41 is provided in the opening 3214, and the surface of the first connecting portion 41 facing the circuit board 322 is flush with the table surface 32131 of the supporting platform 3213.

[0119] refer to Figure 4 and 25 In some embodiments, the image sensor assembly 30 further includes a filter 323 and a supporting frame 324 for supporting the filter 323 , the filter 323 is disposed between the lens 20 and the image sensor chip 31 , and the supporting frame 324 covers the image sensor chip 31 and is mounted on the circuit board 322 .

[0120] Specifically, the carrying frame 324 has a receiving cavity 3241 for receiving the image sensor chip 31, and a bearing groove 3242 for bearing the optical filter 323. The receiving cavity 3241 is connected with the bearing groove 3242 through the cavity opening of the receiving cavity 3241, and the size of the bearing groove 3242 is adapted to the size of the optical filter 323. Along the optical axis 21, the projection of the carrying frame 324 completely covers the projection of the image sensor chip 31 and the projection of the optical filter 323.

[0121] In some embodiments, four drive coils 52 are provided and are respectively arranged at intervals corresponding to the first magnetic circuit 511 , the four drive coils 52 are arranged at circumferential intervals along the first magnetic circuit 511 , and the winding hole 521 of each drive coil 52 corresponds to the interval area 513 between the first annular inner magnetic steel 5111 and the first annular outer magnetic steel 5112 .

[0122] refer to Figure 5-7 14, an embodiment provided by the present invention includes: along the direction of the optical axis 21, the magnetic circuit system 51 and the drive coil 52 are arranged in the installation cavity 3212 of the frame 321 at intervals, wherein the upper surface of the second connection part 42 of the elastic support member 40 is electrically connected to the circuit board 322, and the lower surface of the second connection part 42 is electrically connected to the drive coil 52, and the magnetic circuit system 51 is arranged on the bottom wall 13. The drive assembly 50 includes four drive coils 52 and an annular magnetic circuit system 51, and the four drive coils 52 are arranged at intervals corresponding to the first magnetic circuit 511, and the four drive coils 52 are arranged along the circumferential spacing of the first magnetic circuit 511, and the winding hole 521 of each drive coil 52 corresponds to the interval area 513 between the first annular inner magnetic steel 5111 and the first annular outer magnetic steel 5112.

[0123] refer to Figure 16-18 , an embodiment provided by the present invention includes: along the direction of the optical axis 21, the magnetic circuit system 51 and the driving coil 52 are arranged in the installation cavity 3212 of the frame 321 at intervals, wherein the upper surface of the second connecting portion 42 of the elastic support member 40 is electrically connected to the circuit board 322, the magnetic circuit system 51 is arranged on the lower surface side of the second connecting portion 42, and the driving coil 52 is arranged on the upper surface of the first connecting portion 41 of the elastic support member 40 to be electrically connected to the circuit board 322 through the elastic support member 40. The driving component 50 includes four driving coils 52 and an annular magnetic circuit system 51, the four driving coils 50 are arranged at intervals corresponding to the first magnetic circuit 511, and the four driving coils 52 are arranged along the circumferential spacing of the first magnetic circuit 511, and the winding hole 521 of each driving coil 52 corresponds to the interval area 513 between the first annular inner magnetic steel 5111 and the first annular outer magnetic steel 5112.

[0124] Another embodiment provided by the present invention includes: along the direction of the optical axis 21, the magnetic circuit system 51 and the drive coil 52 are arranged in the installation cavity 3212 of the frame 321 at intervals, wherein the upper surface of the second connection part 42 of the elastic support member 40 is electrically connected to the circuit board 322, and the lower surface of the second connection part 42 is electrically connected to the drive coil 52, and the magnetic circuit system 51 is arranged on the bottom wall 13. The drive assembly 50 includes four drive coils 52 and an annular magnetic circuit system 51, and the four drive coils 50 are respectively arranged at intervals with the first magnetic circuit 511, and the four drive coils 52 are arranged along the circumferential spacing of the first magnetic circuit 511, and the winding hole 521 of each drive coil 52 is aligned with the interval area 513 between the first annular inner magnetic steel 5111 and the first annular outer magnetic steel 5112, and the splicing part 5124 between the second annular inner magnetic steel 5121 and the second annular outer magnetic steel 5122 (such as Fig.10 shown) corresponds.

[0125] Another embodiment provided by the present invention includes: along the direction of the optical axis 21, the magnetic circuit system 51 and the drive coil 52 are arranged in the installation cavity 3212 of the frame 321 at intervals, wherein the upper surface of the second connection part 42 of the elastic support member 40 is electrically connected to the circuit board 322, and the magnetic circuit system 51 is arranged on the lower surface side of the second connection part 42, and the drive coil 52 is arranged on the upper surface of the first connection part 41 of the elastic support member 40 to be electrically connected to the circuit board 322 through the elastic support member 40. The drive component 50 includes four drive coils 52 and an annular magnetic circuit system 51, and the four drive coils 50 are arranged in a corresponding manner with the first magnetic circuit 511, and the four drive coils 52 are arranged along the circumferential spacing of the first magnetic circuit 511, and the winding hole 521 of each drive coil 52 is aligned with the interval area 513 between the first annular inner magnetic steel 5111 and the first annular outer magnetic steel 5112, and the splicing part 5124 (such as the second annular inner magnetic steel 5121 and the second annular outer magnetic steel 5122) between. Fig.10 ) corresponding to.

[0126] In some embodiments, four drive coils 52 are provided and are respectively arranged at intervals corresponding to the magnetic circuit system 51 . The four drive coils 52 are arranged at circumferential intervals along the magnetic circuit system 51 , and the winding hole 521 of each drive coil 52 corresponds to the non-magnetic portion 5123 .

[0127] An embodiment provided by the present invention includes: along the direction of the optical axis 21, the magnetic circuit system 51 and the drive coil 52 are arranged in the installation cavity 3212 of the frame 321 at intervals, wherein the upper surface of the second connection part 42 of the elastic support member 40 is electrically connected to the circuit board 322, and the lower surface of the second connection part 42 is electrically connected to the drive coil 52, and the magnetic circuit system 51 is arranged on the bottom wall 13. The drive assembly 50 includes four drive coils 52 and an annular magnetic circuit system 51, and the four drive coils 50 are arranged at intervals corresponding to the magnetic circuit system 51, and the four drive coils 52 are arranged along the circumferential spacing of the magnetic circuit system 51, and the winding hole 521 of each drive coil 52 corresponds to the non-magnetic part 5123 between the annular inner magnetic steel 514 and the annular outer magnetic steel 515.

[0128] refer to Figure 20-22 Another embodiment provided by the present invention includes: along the direction of the optical axis 21, the magnetic circuit system 51 and the driving coil 52 are arranged in the installation cavity 3212 of the frame 321 at intervals, wherein the upper surface of the second connecting portion 42 of the elastic support member 40 is electrically connected to the circuit board 322, and the magnetic circuit system 51 is arranged on the lower surface side of the second connecting portion 42, and the driving coil 52 is arranged on the upper surface of the first connecting portion 41 of the elastic support member 40 to be electrically connected to the circuit board 322 through the elastic support member 40. The driving component 50 includes four driving coils 52 and an annular magnetic circuit system 51, and the four driving coils 50 are arranged at intervals corresponding to the magnetic circuit system 51, and the four driving coils 52 are arranged along the circumferential spacing of the magnetic circuit system 51, and the winding hole 521 of each driving coil 52 corresponds to the non-magnetic portion 5123 between the annular inner magnetic steel 514 and the annular outer magnetic steel 515.

[0129] In some embodiments, four drive coils 52 are provided and are spaced apart from each other corresponding to the magnetic circuit system 51 . The four drive coils 52 are arranged at circumferential intervals along the magnetic circuit system 51 , and the winding hole 521 of each drive coil 52 corresponds to the middle magnetic portion 516 .

[0130] An embodiment provided by the present invention includes: along the direction of the optical axis 21, the magnetic circuit system 51 and the driving coil 52 are arranged in the installation cavity 3212 of the frame 321 at intervals, wherein the upper surface of the second connecting portion 42 of the elastic support member 40 is electrically connected to the circuit board 322, and the lower surface of the second connecting portion 42 is electrically connected to the driving coil 52, and the magnetic circuit system 51 is arranged on the bottom wall 13. The driving component 50 includes four driving coils 52 and an annular magnetic circuit system 51, and the four driving coils 50 are arranged at intervals corresponding to the magnetic circuit system 51, and the four driving coils 52 are arranged along the circumferential spacing of the first magnetic circuit 511, and the winding hole 521 of each driving coil 52 corresponds to the intermediate magnetic portion 516 between the annular inner magnetic steel 514 and the annular outer magnetic steel 515.

[0131] Another embodiment provided by the present invention includes: along the direction of the optical axis 21, the magnetic circuit system 51 and the drive coil 52 are arranged in the installation cavity 3212 of the frame 321 at intervals, wherein the upper surface of the second connection part 42 of the elastic support member 40 is electrically connected to the circuit board 322, the magnetic circuit system 51 is arranged on the lower surface side of the second connection part 42, and the drive coil 52 is arranged on the upper surface of the first connection part 41 of the elastic support member 40 to be electrically connected to the circuit board 322 through the elastic support member 40. The drive assembly 50 includes four drive coils 52 and an annular magnetic circuit system 51, the four drive coils 50 are arranged at intervals corresponding to the magnetic circuit system 51, and the four drive coils 52 are arranged along the circumferential spacing of the magnetic circuit system 51, and the winding hole 521 of each drive coil 52 corresponds to the intermediate magnetic part 516 between the annular inner magnetic steel 514 and the annular outer magnetic steel 515.

[0132] A flexible circuit board is printed on the elastic support member 40 , so that the elastic support member 40 can conduct the current of the image sensor assembly 30 to the driving coil 52 .

[0133] According to a second aspect of an embodiment of the present invention, an AR glasses is provided, and the AR glasses include the above-mentioned optical imaging device 100.

[0134] It is to be understood that the above embodiments are merely exemplary embodiments used to illustrate the principles of the present disclosure, but the present disclosure is not limited thereto. For those of ordinary skill in the art, various modifications and improvements can be made without departing from the spirit and substance of the present disclosure, and these modifications and improvements are also considered to be within the scope of protection of the present disclosure.

Claims

1. An optical imaging device, characterized in that: include: A shell having a receiving space, the shell comprising a top wall, a bottom wall arranged opposite to the top wall, and a side wall connecting the top wall and the bottom wall, the top wall being provided with a through hole connecting the receiving space with the outside; A lens, fixed to the top wall of the housing and covering the through hole; An image sensor assembly is arranged in the receiving space, and the image sensor assembly includes an image sensor chip and a bracket for carrying the image sensor chip; an elastic support member, disposed in the receiving space, the elastic support member connecting the bottom wall and the bracket to suspend the image sensor assembly in the receiving space; A driving component is arranged in the accommodating space. When observed along the optical axis direction of the lens, the driving component at least partially overlaps with the image sensor chip. The driving component includes a magnetic circuit system and a driving coil arranged opposite to the magnetic circuit system. One of the driving coil and the magnetic circuit system is fixed to the bracket, and the other of the driving coil and the magnetic circuit system is fixed to the bottom wall of the shell. The driving coil cooperates with the magnetic circuit system to drive the image sensor component to move in a direction perpendicular to the optical axis of the lens.

2. An optical imaging device according to claim 1, characterized in that: The driving coil is electrically connected to the elastic supporting member.

3. An optical imaging device according to claim 1, characterized in that: The magnetic circuit system includes a first magnetic circuit and a second magnetic circuit stacked along the optical axis direction of the lens, the first magnetic circuit is closer to the driving coil than the second magnetic circuit, the first magnetic circuit includes a first annular inner magnetic steel and a first annular outer magnetic steel spaced apart from the first annular inner magnetic steel, the second magnetic circuit is an integrally magnetized magnetic steel and includes a second annular inner magnetic steel, a second annular outer magnetic steel spaced apart from the second annular inner magnetic steel, and a non-magnetic portion disposed between the second annular inner magnetic steel and the second annular outer magnetic steel; The first annular inner magnetic steel and the second annular inner magnetic steel are both magnetized along the optical axis direction and the magnetization directions of the two are the same, the first annular outer magnetic steel and the second annular outer magnetic steel are both magnetized along the optical axis direction and the magnetization directions of the two are the same, and the magnetization directions of the first annular inner magnetic steel and the first annular outer magnetic steel are opposite.

4. The optical imaging device according to claim 1, characterized in that: The magnetic circuit system comprises a first magnetic circuit and a second magnetic circuit stacked along the optical axis direction of the lens, the first magnetic circuit being closer to the driving coil than the second magnetic circuit, the first magnetic circuit comprising a first annular inner magnetic steel and a first annular outer magnetic steel spaced apart from the first annular inner magnetic steel, and the second magnetic circuit comprising a second annular inner magnetic steel and a second annular outer magnetic steel spliced ​​to each other; The first annular inner magnetic steel and the second annular inner magnetic steel are both magnetized along the optical axis direction and the magnetization directions of the two are the same, the first annular outer magnetic steel and the second annular outer magnetic steel are both magnetized along the optical axis direction and the magnetization directions of the two are the same, and the magnetization directions of the first annular inner magnetic steel and the first annular outer magnetic steel are opposite.

5. An optical imaging device according to claim 1 or 2, characterized in that: The magnetic circuit system is an integrated magnetized magnetic steel and includes an annular inner magnetic steel, an annular outer magnetic steel spaced apart from the annular inner magnetic steel, and a non-magnetic portion disposed between the annular inner magnetic steel and the annular outer magnetic steel; The annular inner magnetic steel and the annular outer magnetic steel are both magnetized along the optical axis direction and the magnetization directions of the two are opposite.

6. An optical imaging device according to claim 1 or 2, characterized in that: The magnetic circuit system is an integrated magnetized magnetic steel and includes an annular inner magnetic steel, an annular outer magnetic steel, and an intermediate magnetic portion arranged between the annular inner magnetic steel and the annular outer magnetic steel; The annular inner magnetic steel and the annular outer magnetic steel are both magnetized along the optical axis and their magnetization directions are opposite; the intermediate magnetic part is magnetized along a direction perpendicular to the optical axis, and the polarity of the surface of the intermediate magnetic part close to the annular outer magnetic steel is the same as the polarity of the surface of the annular outer magnetic steel facing the lens.

7. An optical imaging device according to claim 1 or 2, characterized in that: The elastic support member includes a first connecting portion connected to the bottom wall of the shell, a second connecting portion connected to the image sensor component, and a third connecting portion connecting the first connecting portion and the second connecting portion, wherein the third connecting portion extends along the side wall of the shell; the first connecting portion is bent from the third connecting portion and extends along the bottom wall, and the second connecting portion is bent from the third connecting portion and extends along the surface of the image sensor component.

8. An optical imaging device according to claim 7, characterized in that: The third connection portion is frame-shaped, the first connection portion is bent from the outer side of the third connection portion and horizontally extends toward the outside of the frame, and the second connection portion is bent from the inner side of the third connection portion and horizontally extends toward the inside of the frame.

9. An optical imaging device according to claim 7, characterized in that: The third connection portion is in a frame shape, and the first connection portion and the second connection portion are both bent from the inner side of the third connection portion and extend horizontally toward the inside of the frame.

10. An optical imaging device according to claim 7, characterized in that: Also includes: The first reinforcing sheet is arranged at the bending position of the first connecting portion; and / or the first reinforcing sheet is arranged at the bending position of the second connecting portion.

11. An optical imaging device according to claim 7, characterized in that: The third connecting portion is in a rectangular frame shape; the imaging device further comprises: The second reinforcing sheet is arranged on the inner side of the bending portion of the rectangular third connecting portion and / or on the outer side of the bending portion.

12. An optical imaging device according to claim 1, characterized in that: The bracket includes a frame connected to the elastic support member, and a circuit board arranged on the frame and electrically connected to the elastic support member; the image sensor chip is arranged on the circuit board and electrically connected to the circuit board.

13. An optical imaging device according to claim 7, characterized in that: The bracket includes a frame connected to the elastic support member, and a circuit board disposed on the frame and electrically connected to the elastic support member; The side wall of the frame has a bending transition portion, the elastic support member is connected to the bending transition portion to suspend the frame in the receiving space, and the second connection portion is bent from the third connection portion at the bending transition portion and extends along the bending transition portion toward the frame.

14. An optical imaging device according to claim 13, characterized in that: A mounting cavity for accommodating the drive coil or the magnetic circuit system is provided on a side of the frame facing the bottom wall, and a carrying platform for carrying the circuit board is provided on a side of the frame facing the top wall. The carrying platform is connected to the mounting cavity through an opening, the first connecting portion is provided in the opening, and the surface of the first connecting portion facing the circuit board is flush with the surface of the carrying platform.

15. An optical imaging device according to claim 12, characterized in that: The image sensor assembly further includes: a filter and a carrying frame for carrying the filter, wherein the filter is arranged between the lens and the image sensor chip, and the carrying frame covers the image sensor chip and is mounted on the circuit board.

16. An optical imaging device according to any one of claims 3 and 4, characterized in that: There are four drive coils and they are respectively arranged corresponding to the first magnetic circuit intervals. The four drive coils are arranged at circumferential intervals along the first magnetic circuit, and the winding hole of each drive coil corresponds to the interval area between the first annular inner magnetic steel and the first annular outer magnetic steel.

17. An optical imaging device according to claim 5, characterized in that: The four drive coils are provided and are respectively arranged at intervals corresponding to the magnetic circuit system. The four drive coils are arranged at circumferential intervals along the magnetic circuit system, and the winding hole of each drive coil corresponds to the non-magnetic part.

18. An optical imaging device according to claim 6, characterized in that: The four drive coils are provided and are respectively arranged at intervals corresponding to the magnetic circuit system. The four drive coils are arranged at circumferential intervals along the magnetic circuit system, and the winding hole of each drive coil corresponds to the middle magnetic part.

Images