A new energy distribution cabinet capable of automatically cooling down

Abstract

The present invention relates to the technical field of power distribution cabinets, and in particular, provides a new energy power distribution cabinet that can automatically cool down, including a cabinet cavity, a hanging plate arranged on the top of the cabinet cavity, a semiconductor cooling plate installed on the hanging plate, a rotating plate arranged in the cabinet cavity, a fan installed on the rotating plate and located below the semiconductor cooling plate, and a terminal board arranged in the cabinet cavity and located below the rotating plate; at least a controller and a temperature sensor are installed on the terminal board, and the other end of the connecting rod structure is upward along the back of the terminal board and hinged on the rotating plate. In the present invention, the closer the electrical components on the terminal board are to the cold air, the greater the strength of the cold air blowing on the electrical components, and the higher the cooling efficiency of the terminal board and the electrical components on the terminal board.

Description

Technical Field

[0001] The present invention relates to the technical field of power distribution cabinets, and in particular to a new energy power distribution cabinet capable of automatically cooling down. Background Art

[0002] There is no big difference between the new energy distribution cabinet and the general distribution cabinet. The inside is nothing more than a terminal board installed, on which a large number of electrical components are installed. The back of the cabinet is nothing more than a cable entry hole, and the front of the cabinet is nothing more than a hinged cabinet door. When in use, the cabinet door is closed to protect the internal components and avoid electric shock. The electrical components installed in the cabinet, including radiators or cooling fans, will automatically turn on and dissipate heat when the temperature inside the cabinet is high.

[0003] The automatic heat dissipation method in the existing distribution cabinet is to fix the radiator or cooling fan in the cabinet, wherein the gas blown by the fan is in a single direction. For example, when the cooling fan is directly installed on the terminal board and blows air at the electrical components, the electrical components are scattered in position, and the blown gas is limited, and the dead corners cannot be blown, resulting in poor cooling efficiency. Summary of the invention

[0004] In order to improve the heat dissipation efficiency of the distribution cabinet, it is necessary to provide a new energy distribution cabinet that can automatically cool down.

[0005] A new energy power distribution cabinet capable of automatically cooling down comprises a cabinet cavity, a hanging plate arranged on the top of the cabinet cavity, a semiconductor cooling sheet installed on the hanging plate, a rotating plate arranged in the cabinet cavity, a fan installed on the rotating plate and located below the semiconductor cooling sheet, and a terminal board arranged in the cabinet cavity and located below the rotating plate; at least a controller and a temperature sensor are installed on the terminal board, a motor controlled by the controller is installed in the cabinet cavity, a connecting rod structure is connected to the output shaft of the motor through an eccentric rod, the other end of the connecting rod structure is upward along the back of the terminal board and is hinged on the rotating plate; the rotating plate, driven by the rod structure, can rotate in the direction of bringing the fan to approach the cabinet door and the semiconductor cooling sheet in turn, and when the rotating plate rotates until the fan slowly approaches the semiconductor cooling sheet , so that the cold air emitted by the semiconductor refrigeration plate is blown back to the inner surface of the cabinet door by the fan, and then blown back to the terminal board from the inner surface of the cabinet door; a hanging chain is connected between the back of the terminal board and the rotating plate, and the side of the terminal board slides up and down in the cabinet cavity through the slide rail; when the rotating plate rotates upward, the terminal board is carried upward by the hanging chain, so that the cold air blown back to the terminal board from the inner surface of the cabinet door is blown from the top to the bottom of the terminal board; a wire seat is installed in the middle of the cabinet cavity, and a wire groove is opened from the front to the back of the wire seat, and a wire inlet is opened at the top of the back of the cabinet cavity, the top of the wire seat reaches the hanging plate and is opened with a circular hole that coincides with the wire inlet front and back, the bottom of the wire seat reaches the bottom side of the terminal board, and the side of the wire seat is opened with a lead-in port that communicates with the inside and outside of the wire groove, and the temperature sensor is close to the lead-in port.

[0006] As a further preference, a heat sink is installed at the top of the hanging plate, the bottom of the heat sink is connected to the semiconductor refrigeration plate, a heat dissipation space is left between the heat sink and the top of the cabinet cavity, and a space is formed with the front end of the heat dissipation space when the cabinet door is closed, and the space is communicated with the front of the terminal board up and down.

[0007] As a further preference, a guide plate is provided on the inner wall surface of the cabinet cavity, the top end of the guide plate is close to the top end of the cabinet door, the bottom end of the guide plate is close to the middle of the cabinet door, and the inner surface of the guide plate is an inclined surface which gradually inclines from the bottom end upward toward the terminal board.

[0008] As a further preference, a discharge plate is connected between the two inner walls of the cabinet cavity, the discharge plate is located on the bottom side of the wire seat and the terminal board, a heat dissipation window is provided on the back of the cabinet cavity, the front end of the discharge plate is close to the cabinet door, and the rear end of the discharge plate is inclined toward the lower and rear direction and connected to the heat dissipation window.

[0009] As a further preference, when the cabinet door is closed, its inner surface overlaps with the front of the wire holder, and the wire groove is covered by the inner surface of the cabinet door, and a curvature portion is provided at the top of the wire holder, and the curvature portion forms a throttling portion protruding toward the cabinet door in the wire groove, and the throttling portion is close to the wire inlet and the circular hole, and the circular hole and the lead-in port are located on the upper and lower sides of the throttling portion.

[0010] As a further preference, the curvature portion forms a rotating space on the back side of the wire holder, the middle part of the rotating plate passes through the rotating space on the back side of the wire holder, and two fans are installed on the rotating plate, the two fans are symmetrical on both sides of the wire holder, there are two terminal boards, the two terminal boards are symmetrical on both sides of the wire holder, and two semiconductor cooling plates are installed on the hanging plate, the two semiconductor cooling plates are symmetrical on both sides of the wire holder, and the two semiconductor cooling plates are respectively located above the two fans.

[0011] As a further preference, a temperature sensor is installed on each of the two terminal boards. The two temperature sensors are connected in series and connected to the same controller, and are also connected to the same motor. A lead-in opening is opened on each side of the wire holder, and the two lead-in openings are respectively close to the temperature sensors on the same side. A lifting chain is connected to each of the two terminal boards, and the top ends of the two lifting chains are respectively connected to the same rotating plate. When the rotating plate is deflected, the two terminal boards are driven to rise and fall simultaneously through the two lifting chains.

[0012] As a further preference, the lead-in port and the line inlet are connected with rubber rings.

[0013] Compared with the prior art, the present invention has the following beneficial effects:

[0014] 1. The cooling method of the power distribution cabinet in the present invention is automated, and the refrigeration components are composed of semiconductor refrigeration sheets and fans. The refrigeration methods are diverse and the heat dissipation efficiency is improved. The fan is made into a rotary exhaust so that the gas blown by the fan is blown toward the semiconductor refrigeration sheet, and the cold air emitted by the semiconductor refrigeration sheet is blown toward the front of the terminal board in two blowing directions, so that the electrical components installed on the front of the terminal board are quickly cooled down, further improving the heat dissipation effect. Through the cooling method, it is ensured that the front of the terminal board faces forward, which is conducive to the installation and maintenance of the electrical components. The cabinet door is used as a structure for the cold air to blow back to the front of the terminal board, which not only automatically cools the electrical components on the front of the terminal board, but also cools the cabinet door, and the entire power distribution cabinet casing is cooled through the cabinet door. The cold air blown back to the front of the terminal board through the cabinet door will also act on the wire holder, so that the wire holder and the wires in the wire holder dissipate heat. The wire holder, as a component for leading out the external wire, can make the line layout regular and centralized, and facilitate centralized heat dissipation.

[0015] Two technical effects are produced when the rotating plate rotates. In addition to causing the fan to deflect upward to form convection with the cold air generated by the semiconductor refrigeration plate, when the fan deflects upward, the terminal board will be lifted by the hanging chain, and the terminal board will move up with various components. Under the deflection effect, the closer the blowing surface of the fan is to the semiconductor refrigeration plate, the greater the convection intensity of the blown gas will be after being blocked by the semiconductor refrigeration plate, and the intensity of the cold air brought out after backblowing through the semiconductor refrigeration plate will be greater, and thus the intensity of the cold air backblown to the inner surface of the cabinet door will also be greater. After the cold air is backblown through the inner surface of the cabinet door, the intensity of the cold air blowing onto the terminal board will be greater, and at this time the upward movement of the terminal board will be greater, that is, the electrical components on the terminal board will be closer to the cold air, the intensity of the cold air blowing onto the electrical components will be greater, and the cooling efficiency of the terminal board and the electrical components on the terminal board will be higher. BRIEF DESCRIPTION OF THE DRAWINGS

[0016] Figure 1 A schematic diagram of the internal structure of a new energy distribution cabinet capable of automatically cooling down when the cabinet door is opened provided in an embodiment of the present invention;

[0017] Figure 2 A schematic diagram of a cabinet door in a new energy distribution cabinet capable of automatically cooling down provided in an embodiment of the present invention;

[0018] Figure 3 A new energy distribution cabinet capable of automatically cooling down is provided in the embodiment of the present invention. Figure 1 The main view plane diagram is drawn;

[0019] Figure 4 A new energy distribution cabinet capable of automatically cooling down is provided in the embodiment of the present invention. Figure 3 Schematic diagram of the lead-out section A when cut open;

[0020] Figure 5A schematic diagram of a new energy distribution cabinet capable of automatically cooling down provided by an embodiment of the present invention with the cabinet door and back removed;

[0021] Figure 6 A new energy distribution cabinet capable of automatically cooling down is provided in the embodiment of the present invention. Figure 5 The schematic diagram from the back perspective is shown;

[0022] Figure 7 A schematic diagram of the three-dimensional structure of a new energy distribution cabinet capable of automatically cooling down when disconnected, provided in an embodiment of the present invention.

[0023] In the figure: 1. cabinet cavity; 101. guide plate; 102. discharge plate; 103. heat dissipation window; 104. inclined plane; 2. hanging plate; 201. heat sink; 202. heat dissipation space; 3. semiconductor refrigeration plate; 4. rotating plate; 5. fan; 6. terminal board; 7. hanging chain; 8. controller; 9. temperature sensor; 10. motor; 11. connecting rod structure; 12. wire holder; 121. curvature part; 122. throttling part; 123. rotating space; 13. lead-in port; 135. rubber ring; 14. wire trough; 15. wire inlet; 16. round hole. DETAILED DESCRIPTION

[0024] The above and other embodiments and advantages of the present invention are described clearly and completely below in conjunction with the accompanying drawings. Obviously, the described embodiments are only some embodiments of the present invention, not all embodiments.

[0025] In one embodiment, see Figures 1 to 7 , provides a new energy distribution cabinet capable of automatically cooling down, comprising a cabinet cavity 1, a hanging plate 2 arranged on the top of the cabinet cavity 1, a semiconductor cooling sheet 3 installed on the hanging plate 2, a rotating plate 4 arranged in the cabinet cavity 1, a fan 5 installed on the rotating plate 4 and located below the semiconductor cooling sheet 3, and a terminal board 6 arranged in the cabinet cavity 1 and located below the rotating plate 4;

[0026] like Figure 3 As shown, at least a controller 8 and a temperature sensor 9 are installed on the terminal board 6, a motor 10 controlled by the controller 8 is installed in the cabinet cavity 1, and a connecting rod structure 11 is connected to the output shaft of the motor 10 through an eccentric rod, and the other end of the connecting rod structure 11 is upward along the back of the terminal board 6 and is hinged on the rotating plate 4;

[0027] Driven by the rod structure 11, the rotating plate 4 can rotate with the fan 5 in the direction of approaching the cabinet door and the semiconductor cooling plate 3 in sequence. When the rotating plate 4 rotates to make the fan 5 slowly approach the semiconductor cooling plate 3, the cold air emitted by the semiconductor cooling plate 3 is blown back to the inner surface of the cabinet door by the fan 5, and then blown back to the terminal board 6 from the inner surface of the cabinet door;

[0028] like Figure 1 , Figure 6 As shown, a hanging chain 7 is connected between the back of the terminal board 6 and the rotating plate 4, and the side of the terminal board 6 slides up and down in the cabinet cavity 1 through the slide rail; when the rotating plate 4 rotates upward, the terminal board 6 is carried upward by the hanging chain 7, so that the cold air blown back from the inner surface of the cabinet door to the terminal board 6 is blown from the top end to the bottom end of the terminal board 6;

[0029] like Figures 1 to 7 As shown, a wire holder 12 is installed in the middle of the cabinet cavity 1, and a wire groove 14 is opened from the front to the back of the wire holder 12, and a wire inlet 15 is opened at the top of the back of the cabinet cavity 1. The top of the wire holder 12 reaches the hanging plate 2 and is opened with a circular hole 16 that coincides with the wire inlet 15 front and back. The bottom end of the wire holder 12 reaches the bottom side of the terminal board 6, and a lead-in opening 13 that communicates with the wire groove 14 inside and outside is opened on the side of the wire holder 12, and the temperature sensor 9 is close to the lead-in opening 13.

[0030] When in use, a large number of electrical components are installed on the terminal board 6, or the terminal seat is first installed on the terminal board 6, and then the electrical components are installed on the terminal seat. The external bus enters the wire groove 14 through the circular hole 16 from the wire inlet 15, enters the bottom section from the top section of the wire groove 14, and then reaches the terminal board 6 from the wire inlet 15, and is connected to various electrical component circuits on the terminal board 6, wherein at least one phase line is connected to the controller 8 and the temperature sensor 9 after being transformed by the transformer, and is also connected to the motor 10, and is also connected to the fan 5 and the semiconductor cooling sheet 3. The wires of the semiconductor cooling sheet 3 and the fan 5 are controlled by the controller 8. The cabinet door is closed to place these electrical components and the wire seat 12 in a relatively closed environment. Various electrical components will generate a large amount of heat during use, and the heat dissipation by the fan 5 alone is inefficient. When the heat temperature in the cabinet cavity 1 exceeds the sensing temperature of the temperature sensor 9, the temperature sensor 9 will send this temperature signal to the controller 8, and the module on the controller 8 will instruct the semiconductor refrigeration plate 3 to power on for cooling. At the same time, when the fan 5 is powered on, the gas blown out will mix with the semiconductor refrigeration plate 3 and act together on the cabinet cavity 1 to improve the heat dissipation efficiency. In addition, the module on the controller 8 will also instruct the motor 10 to power on and work, and the motor 10 drives the eccentric rod to deflect, and the eccentric rod drives the connecting rod structure 11 to move up and down repeatedly, and the top of the connecting rod structure 11 drives the rotating plate 4 to deflect repeatedly, and the rotating plate 4 drives the fan 5 to deflect up and down, so that the gas blown out by the fan 5 is blown from near to far, and then from far to near to the semiconductor refrigeration plate 3, so that part of the cold air emitted by the semiconductor refrigeration plate 3 is directly blown downward along the front of the terminal board 6, and the other part is blown back to the rotating plate 4, and then guided by the rotating plate 4 to the inner surface of the cabinet door, and then blown back from the inner surface of the cabinet door to the terminal board 6. Since most of the electrical components are installed on the front of the terminal board 6, and most of the heat in the cabinet cavity 1 comes from these electrical components, when these cold air are blown back and blown to these electrical components, these electrical components can quickly dissipate heat and cool down, and this cooling method is automated.

[0031] This cooling method not only realizes automation, but also has the following technical effects: first, the refrigeration component is composed of a semiconductor refrigeration sheet 3 and a fan 5, and the refrigeration method is diverse, which improves the heat dissipation efficiency; second, the fan 5 is made into a rotary exhaust, so that the gas blown by the fan 5 is blown to the semiconductor refrigeration sheet 3, and the cold air emitted by the semiconductor refrigeration sheet 3 is blown to the front of the terminal board 6 in two blowing directions, so that the electrical components installed on the front of the terminal board 6 are quickly cooled, and the heat dissipation effect is further improved; third, through the above-mentioned cooling method, it is ensured that the front of the terminal board 6 faces forward, which is conducive to the installation and maintenance of the electrical components; fourth, the cabinet door is used as a structure for blowing cold air in reverse to the front of the terminal board 6, which not only automatically cools the electrical components on the front of the terminal board 6, but also cools the cabinet door, and the entire distribution cabinet casing is cooled through the cabinet door; fifth, the cold air blown back to the front of the terminal board 6 through the cabinet door will also act on the wire seat 12, so that the wire seat 12 and the wires in the wire seat 12 dissipate heat; the wire seat 12 As a component for leading out external lines, it can make the line layout regular and centralized, and facilitate centralized heat dissipation; six is ​​that two technical effects are produced when the rotating plate 4 rotates. In addition to causing the fan 5 to deflect upward to form convection with the cold air generated by the semiconductor refrigeration plate 3, when the fan 5 deflects upward, the terminal board 6 will be lifted up by the hanging chain 7, and the terminal board 6 will move up with various components. Under the deflection effect, the closer the blowing surface of the fan 5 is to the semiconductor refrigeration plate 3, the greater the convection intensity of the blown gas after being blocked by the semiconductor refrigeration plate 3, and the greater the intensity of the cold air brought out after backblowing by the semiconductor refrigeration plate 3, so that the intensity of the cold air backblown to the inner surface of the cabinet door is also greater, and the intensity of the cold air backblown through the inner surface of the cabinet door is greater when it blows onto the terminal board 6, and at this time, the greater the upward movement of the terminal board 6, that is, the electrical components on the terminal board 6 will be closer to the cold air, the intensity of the cold air blowing onto the electrical components will be greater, and the cooling efficiency of the terminal board 6 and the electrical components on the terminal board 6 will be higher.

[0032] like Figure 1 As shown, a heat sink 201 is installed on the top of the hanging plate 2, and the bottom surface of the heat sink 201 is connected to the semiconductor refrigeration plate 3. A heat dissipation space 202 is left between the heat sink 201 and the top of the cabinet cavity 1. When the cabinet door is closed, a space is formed with the front end of the heat dissipation space 202, and the space is communicated with the front of the terminal board 6 from top to bottom.

[0033] The heat sink 201 dissipates the heat generated by the semiconductor cooling plate 3 when it is working, and the heat is discharged forward from the heat dissipation space 202. The cold air blown back to the upper inner surface of the cabinet door will enter the heat dissipation space 202 to cool down the heat. The arrangement of the heat sink 201 makes the structure of the semiconductor cooling plate 3 more reasonable.

[0034] like Figure 1 , Figure 2As shown, a guide plate 101 is provided on the inner wall surface of the cabinet cavity 1, the top end of the guide plate 101 is close to the top end of the cabinet door, the bottom end of the guide plate 101 is close to the middle of the cabinet door, and the inner surface of the guide plate 101 is a slope 104 which gradually inclines from the bottom end upward toward the terminal board 6.

[0035] When the fan 5 is deflected to face the bottom side of the semiconductor cooling plate 3, the blown gas blows toward the semiconductor cooling plate 3, mixed with the cold air and blows toward the inclined surface 104 of the cabinet door. After being guided in the inclined direction of the inclined surface 104, it blows back to the front of the terminal board 6, so that the electrical components on the front of the terminal board 6 are quickly cooled down.

[0036] like Figure 3 , Figure 4 As shown, a discharge plate 102 is connected between the two inner walls of the cabinet cavity 1, the discharge plate 102 is located on the bottom side of the wire holder 12 and the terminal board 6, a heat dissipation window 103 is provided on the back of the cabinet cavity 1, the front end of the discharge plate 102 is close to the cabinet door, and the rear end of the discharge plate 102 is inclined toward the rear and downward direction and connected to the heat dissipation window 103.

[0037] A portion of the cold air is blocked by the semiconductor refrigeration sheet 3 and blown back downward. This portion of the cold air will blow toward the bottom along the front top of the terminal board 6, which not only cools down the electrical components installed on the front of the terminal board 6, but also cleans the dust attached to the front of the terminal board 6 and between the electrical components. After the dust is cleaned, the cold air is used to quickly cool and reduce the temperature. The cleaned dust falls onto the discharge plate 102, then slides down the inclined end of the discharge plate 102, and is finally discharged to the outside of the cabinet through the heat dissipation window 103.

[0038] When the cabinet door is closed, its inner surface overlaps with the front of the wire holder 12, and the inner surface of the cabinet door is used to cover the wire groove 14. The top of the wire holder 12 is provided with a curvature portion 121, and the curvature portion 121 forms a throttling portion 122 protruding toward the cabinet door in the wire groove 14. The throttling portion 122 is close to the wire inlet 15 and the circular hole 16, and the circular hole 16 and the lead-in port 13 are located on the upper and lower sides of the throttling portion 122.

[0039] That is, when the distribution cabinet is in normal use, in addition to protecting the electrical components in the cabinet after the cabinet door is closed, the wire holder 12 will also be covered in the cabinet, and the wiring harness introduced by the wire holder 12 will be covered in the cabinet. When the wiring harness is routed, it will be bent along the shape of the wire trough 14, that is, the wire harness enters from the wire inlet 15 and continues to be routed downward along the back of the wire trough 14. When it reaches the top of the throttling section 122, it will be routed forward along the top surface of the throttling section 122. When it reaches the front of the throttling section 122, it will be routed along the front of the throttling section 122 and reach the bottom of the throttling section 122. After reaching the bottom surface of the throttling section 122, it will be routed backward and then continue to be routed downward along the back of the wire trough 14. It will then be introduced into the terminal board 6 through the lead-in opening 13 and connected to the electrical components. During the wiring process, the wiring harness forms an inflection point at the connection between the wire trough 14 and the throttling part 122. After the cold air is blown back through the cabinet door, it will not only blow to the electrical components to quickly cool them down, but also some of the cold air will pass through the lead-in port 13 and enter the wire trough 14 to cool the wiring harness. In addition, when the cold air enters the wire trough 14, the front side is relatively blocked by the cabinet door, and the top is relatively blocked by the throttling part 122, so that the cold air forms an eddy flow in the wire trough 14, prolonging the residence time of the cold air in the wire trough 14, and further improving the heat dissipation efficiency of the wiring harness.

[0040] like Figure 4 , Figure 7 As shown, the curvature portion 121 forms a rotating space 123 on the back side of the wire holder 12, the middle portion of the rotating plate 4 passes through the rotating space 123 on the back side of the wire holder 12 for its rotation, and two fans 5 are installed on the rotating plate 4, the two fans 5 are symmetrical on both sides of the wire holder 12, there are two terminal boards 6, the two terminal boards 6 are symmetrical on both sides of the wire holder 12, and two semiconductor cooling plates 3 are installed on the hanging plate 2, the two semiconductor cooling plates 3 are symmetrical on both sides of the wire holder 12, and the two semiconductor cooling plates 3 are respectively located above the two fans 5.

[0041] A temperature sensor 9 is installed on each of the two terminal boards 6. The two temperature sensors 9 are connected in series to the same controller 8 and are also connected to the same motor 10. A lead-in opening 13 is provided on each side of the wire holder 12. The two lead-in openings 13 are respectively close to the temperature sensor 9 on the same side. A hanging chain 7 is connected to each of the two terminal boards 6. The top ends of the two hanging chains 7 are respectively connected to the same rotating plate 4. When the rotating plate 4 is deflected, the two terminal boards 6 are driven to rise and fall simultaneously through the two hanging chains 7. No matter which side has high temperature, the high temperature signal will be transmitted to the temperature sensor 9, and the temperature sensor 9 can send the high temperature signal to the controller 8, and the semiconductor refrigeration plate 3 will be started for automatic cooling, and the motor 10 will be started to drive the rotating plate 4 to deflect up and down through the connecting rod structure. The rotating plate 4 drives the fan 5 to deflect up and down relative to the semiconductor refrigeration plate 3. The gas blown out by the two fans 5 and the cold air produced by the two semiconductor refrigeration plates 3 form convection cold air. One part of it is blown back to the two terminal boards 6 by blowing downward from the top, and the other part is blown back to the terminal boards 6 by blowing back from the inside of the cabinet door. In addition to a part of these cold air entering the wire groove 14 after being blown back through the cabinet door, the cold air will also be cut left and right by the wire seat 12 and blown to the front of the two terminal boards 6 at a higher flow rate, so that the heat dissipation efficiency of the electrical components distributed on the two terminal boards 6 is further improved.

[0042] like Figure 3 , Figure 4 As shown, a rubber ring 135 is connected to the lead-in port 13 and the line inlet 15 .

[0043] When the external bus is connected to the electrical components on the terminal board 6 through the line inlet 15, it passes through the rubber ring 135, which protects the turning point of the wire harness to prevent the wire harness from breaking and sparking.

[0044] The above orientation designations do not represent the specific orientations of the components in this implementation scheme. This implementation scheme is only for the convenience of describing the scheme, and the orientations are described relatively with reference to the figures. In essence, the specific orientations of the components are described according to their actual installation and actual use as well as the customary orientations of technicians in this field. This is hereby explained.

[0045] The specific implementation methods described above further describe the invention purpose, technical solutions, and beneficial effects of the present invention in detail. It should be understood that the above description is only a specific implementation method of the present invention and is not intended to limit the protection scope of the present invention. It is particularly pointed out that for those skilled in the art, any modifications, equivalent substitutions, improvements, etc. made within the spirit and principles of the present invention should be included in the protection scope of the present invention.

Claims

1. A new energy distribution cabinet capable of automatically cooling down, characterized in that: The cabinet comprises a cabinet cavity, a hanging plate arranged on the top of the cabinet cavity, a semiconductor cooling sheet installed on the hanging plate, a rotating plate arranged in the cabinet cavity, a fan installed on the rotating plate and located below the semiconductor cooling sheet, and a terminal board arranged in the cabinet cavity and located below the rotating plate; at least a controller and a temperature sensor are installed on the terminal board, a motor controlled by the controller is installed in the cabinet cavity, a connecting rod structure is connected to the output shaft of the motor through an eccentric rod, the other end of the connecting rod structure is upward along the back of the terminal board and is hinged on the rotating plate; driven by the rod structure, the rotating plate can bring the fan to approach the cabinet door and the semiconductor cooling sheet in turn The rotating plate rotates in the direction of rotation, and when the rotating plate rotates until the fan slowly approaches the semiconductor cooling chip, the cold air emitted by the semiconductor cooling chip is blown back by the fan to the inner surface of the cabinet door, and then blown back from the inner surface of the cabinet door to the terminal board; a hanging chain is connected between the back of the terminal board and the rotating plate, and the side of the terminal board slides up and down in the cabinet cavity through the slide rail; when the rotating plate rotates upward, the terminal board is carried upward by the hanging chain, so that the cold air blown back from the inner surface of the cabinet door to the terminal board is blown from the top end to the bottom end of the terminal board; a wire seat is installed in the middle of the cabinet cavity, and a wire groove is opened on the wire seat from the front to the back, and a wire inlet is opened on the top of the back of the cabinet cavity. The end reaches the hanging plate and is provided with a circular hole that coincides with the front and rear of the wire inlet. The bottom end of the wire seat reaches the bottom side of the terminal board. The side of the wire seat is provided with a lead-in port that communicates with the inside and outside of the wire slot. The temperature sensor is close to the lead-in port. A heat sink is installed on the top of the hanging plate. The bottom surface of the heat sink is connected to the semiconductor refrigeration plate. A heat dissipation space is left between the heat sink and the top of the cabinet cavity. When the cabinet door is closed, a space that communicates with the front of the terminal board from top to bottom is formed with the front end of the heat dissipation space. A guide plate is provided on the inner wall of the cabinet cavity. The top end of the guide plate is close to the top of the cabinet door, the bottom end of the guide plate is close to the middle of the cabinet door, and the inner surface of the guide plate is An inclined surface gradually tilts upward from the bottom toward the terminal board, a discharge plate is connected between the two inner walls of the cabinet cavity, the discharge plate is located on the bottom side of the wire holder and the terminal board, a heat dissipation window is provided on the back of the cabinet cavity, the front end of the discharge plate is close to the cabinet door, and the rear end of the discharge plate is tilted toward the lower rear direction and connected to the heat dissipation window; when the cabinet door is closed, its inner surface coincides with the front of the wire holder, and the wire groove is covered with the inner surface of the cabinet door, a curvature portion is provided at the top of the wire holder, and a throttling portion protruding toward the cabinet door is formed in the wire groove by the curvature portion, the throttling portion is close to the wire inlet and the circular hole, and the circular hole and the lead-in port are located on the upper and lower sides of the throttling portion.

2. The new energy distribution cabinet capable of automatically cooling down according to claim 1 is characterized in that: The curvature portion forms a rotating space on the back of the wire holder, the middle portion of the rotating plate passes through the rotating space on the back of the wire holder, and two fans are installed on the rotating plate, the two fans are symmetrical on both sides of the wire holder, there are two terminal boards, the two terminal boards are symmetrical on both sides of the wire holder, and two semiconductor cooling plates are installed on the hanging plate, the two semiconductor cooling plates are symmetrical on both sides of the wire holder, and the two semiconductor cooling plates are respectively located above the two fans.

3. The new energy distribution cabinet capable of automatically cooling down according to claim 2 is characterized in that: A temperature sensor is installed on each of the two terminal boards. The two temperature sensors are connected in series to the same controller and are also connected to the same motor. A lead-in port is opened on each side of the wire holder. The two lead-in ports are close to the temperature sensors on the same side. A lifting chain is connected to each of the two terminal boards. The top ends of the two lifting chains are respectively connected to the same rotating plate. When the rotating plate is deflected, the two terminal boards are driven to rise and fall simultaneously through the two lifting chains.

4. The new energy distribution cabinet capable of automatically cooling down according to claim 3 is characterized in that: The lead-in port and the line inlet are connected with rubber rings.

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