A high-efficiency adhesive spreading device for semiconductor wafer processing

Abstract

The present invention discloses a highly efficient glue spreading device for semiconductor wafer processing, including an operating table, a glue supply component, a rotary glue spreading mechanism, a glue spreading thickness control component and an edge glue control mechanism. An installation port is provided at the center of the operating table and a control console is provided on one side. A top plate is provided at the installation port. The glue supply component is installed on one side of the operating table and includes a glue storage container, a pump body, a glue delivery pipe, a rotating support arm and a nozzle. The glue storage container is installed on the side of the operating table and is connected to the pump body at the top. The discharge port of the pump body is connected to the nozzle through the glue delivery pipe. The nozzle is installed at the front end of the rotating support arm and is located directly above the installation port. The rotating support arm is installed on the operating table. The rotary glue spreading mechanism is installed at the installation port and includes an outer cover and a motor built in the outer cover. The semiconductor wafer glue spreading device designed by the present invention can realize automatic glue spreading, thickness control and edge trimming of semiconductor wafers, greatly improving the glue spreading effect on semiconductor wafers.

Description

Technical Field

[0001] The invention relates to the technical field of semiconductor wafer processing equipment, and in particular to a high-efficiency adhesive spreading device for semiconductor wafer processing. Background Art

[0002] Conductor wafer refers to the basic material used to manufacture semiconductor devices, usually a round silicon wafer (also called silicon wafer), which is one of the most important raw materials in the semiconductor industry. Semiconductor wafers are the basis for manufacturing various semiconductor devices, including integrated circuits, solar cells, LEDs, etc. They transform semiconductor materials into microelectronic devices with specific functions and performances through a series of processing steps, such as photolithography, deposition, etching, ion implantation, etc. The coating operation is one of the basic steps of the photolithography process, also known as spin coating or spinning. After the base film is processed, the silicon wafer should be immediately coated with liquid photoresist material by spin coating.

[0003] However, the existing glue spreading equipment for semiconductor wafers has the following problems during use: mainly, the semiconductor wafer is placed on a rotating platform and the colloid is spread from the center of the semiconductor wafer through the glue coating equipment, and the colloid is evenly coated on the surface of the wafer through the high-speed rotation of the semiconductor wafer. However, the thickness of the glue layer in this coating method cannot be accurately controlled, and there is a risk that the thickness of the glue layer is too thick or too thin, which may cause deformation of the photolithography pattern, reduced resolution or poor exposure. Secondly, during the glue coating process, there may be problems such as glue overflow or boundary effect. Glue overflow will cause contamination on the surface of the wafer, and the boundary effect refers to the phenomenon of uneven thickness of the glue layer near the edge of the wafer. For this reason, it is necessary to design corresponding technical solutions to solve the existing technical problems. Summary of the invention

[0004] The purpose of the present invention is to provide an efficient glue spreading device for semiconductor wafer processing, which solves the problem of placing the semiconductor wafer on a rotating platform and spreading the colloid from the center of the semiconductor wafer through a glue coating device, and uniformly coating the colloid on the surface of the wafer through the high-speed rotation of the semiconductor wafer. However, the thickness of the glue layer cannot be accurately controlled in this coating method, and there are problems such as the thickness of the glue layer being too thick or too thin, which may cause deformation of the photolithography pattern, reduced resolution or poor exposure. Secondly, during the glue coating process, glue overflow or boundary effect may occur. Glue overflow will cause contamination of the wafer surface, and the boundary effect refers to the phenomenon of uneven thickness of the glue layer near the edge of the wafer, which is a technical problem.

[0005] To achieve the above-mentioned purpose, the present invention provides the following technical solutions: an efficient glue spreading device for semiconductor wafer processing, comprising an operating table, a glue supply component, a rotary glue spreading mechanism, a glue spreading thickness control component and an edge glue control mechanism, an installation port is opened at the center of the operating table and a control console is provided on one side, a top plate is provided at the installation port, the glue supply component is installed on one side of the operating table and comprises a glue storage container, a pump body, a glue delivery pipe, a rotating support arm and a nozzle, the glue storage container is installed on the side of the operating table and is connected to the pump body at the top, the discharge port of the pump body is connected to the nozzle through the glue delivery pipe, and the nozzle is installed at the front end of the rotating support arm and is located at the installation port Directly above the top, the rotating support arm is installed on the operating table, the rotating glue spreading mechanism is installed at the installation port and includes an outer cover and a motor 1 built into the outer cover, a suction cup is installed at the power output end of the motor 1, and the suction cup is located directly below the nozzle, and a plurality of annular grooves are also provided on the surface of the top plate, the glue spreading thickness control component is arranged directly below the top plate, the glue spreading thickness control component is composed of a plurality of glue spreading controllers, the glue spreading controller includes two symmetrically arranged groups of floaters and a floating limit ring arranged above the two groups of floaters, the floating limit ring is movably inserted in the annular groove, and the edge glue control mechanism is installed on the floating limit ring.

[0006] As a preferred embodiment of the present invention, the rotating support arm includes a second motor and a vertical pole installed at the power output end of the second motor, a crossbeam is fixed in the middle of the vertical pole, and the nozzle is fixed on the crossbeam.

[0007] As a preferred embodiment of the present invention, several groups of the annular grooves are concentrically distributed, the diameter of the inner annular groove is smaller than the diameter of the outer annular groove, and several groups of the floating limit rings are evenly distributed in the annular grooves.

[0008] As a preferred embodiment of the present invention, the floater includes a motor and a rotating wheel installed at the power output end of the motor, a toggle block is fixed to the edge of the rotating wheel, one end of the toggle block is thicker than the other end and contacts the bottom of the floating limit ring.

[0009] As a preferred embodiment of the present invention, in two adjacent groups of floating limit rings, the diameter of the floating limit ring located on the inner side is smaller than the diameter of the floating limit ring located on the outer side, and the floating limit ring has a ring-shaped structure.

[0010] As a preferred embodiment of the present invention, the edge glue control mechanism includes a tractor, a sealing rubber ring, an air pipe and an air pump. The tractor is divided into two groups and is symmetrically installed on the top of the floating limit ring. The sealing rubber ring is movably arranged on the inner side of the floating limit ring and the upper end is connected to the tractor. One end of the air pipe is connected to the sealing rubber ring and the other end is connected to the air pump.

[0011] As a preferred embodiment of the present invention, the traction device includes an outer shell and a motor three built into the inner shell, the power output end of the motor three is connected to a winding roller, a live wire is wound around the winding roller, the lower end of the live wire is connected to a sealing rubber ring and one side is connected to a conductive rod, a plurality of groups of contact heads are evenly distributed on one side of the conductive rod, the plurality of groups of contact heads are evenly distributed from top to bottom and are connected in parallel with a power supply through the line.

[0012] As a preferred embodiment of the present invention, the sealing rubber ring is made of insulating material and comprises an air ring and an annular blade arranged below the air ring, and the air ring is connected to the air pipe.

[0013] Compared with the prior art, the present invention has the following beneficial effects:

[0014] 1. The present invention designs a device for efficiently applying glue to semiconductor wafers. The semiconductor wafer applying glue device includes an operating table, a glue supply component, a rotary glue spreading mechanism, a glue spreading thickness control component and an edge glue control mechanism. When the semiconductor wafer needs to be applied glue, the staff can place the semiconductor wafer on the rotary glue spreading mechanism and rotate it. At the same time, the glue supply component is used to introduce the colloid from the center of the semiconductor wafer, and the colloid is evenly distributed during the high-speed rotation of the semiconductor wafer. At the same time, the edge of the wafer is sealed by selecting an appropriate glue spreading thickness control component according to the specifications of the wafer, so that the colloid can be applied according to the set thickness, and the edge of the wafer is trimmed by the edge glue control mechanism.

[0015] 2. The semiconductor wafer coating equipment designed in the present invention can realize automatic coating, thickness control and edge trimming processing of semiconductor wafers, greatly improving the coating effect of semiconductor wafers. BRIEF DESCRIPTION OF THE DRAWINGS

[0016] Figure 1 It is the overall structure diagram of the present invention;

[0017] Figure 2 This is a top view of the structure of the outer cover of the present invention;

[0018] Figure 3 This is a structural diagram of the glue-splitting controller of the present invention;

[0019] Figure 4 It is a local A structural diagram of the present invention;

[0020] Figure 5 This is a structural diagram of the sealing rubber ring described in the present invention.

[0021] In the figure: 1. operating table; 2. installation port; 3. control console; 4. top plate; 5. glue storage container; 6. pump body; 7. glue delivery hose; 8. rotating support arm; 9. nozzle; 10. outer cover; 11. motor one; 12. suction cup; 13. annular groove; 14. floater; 15. floating limit ring; 16. motor two; 17. vertical pole; 18. horizontal beam; 19. motor; 20. rotating wheel; 21. toggle block; 22. tractor; 23. sealing rubber ring; 24. air delivery pipe; 25. air pump; 26. outer shell; 27. motor three; 28. winding roller; 29. ​​electric wire; 30. conductive rod; 31. contact head; 32. power supply; 33. air ring; 34. annular blade. DETAILED DESCRIPTION

[0022] The following will be combined with the drawings in the embodiments of the present invention to clearly and completely describe the technical solutions in the embodiments of the present invention. Obviously, the described embodiments are only part of the embodiments of the present invention, not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the present invention.

[0023] See also Figure 1-5 The present invention provides a technical solution: an efficient glue spreading device for semiconductor wafer processing, comprising an operating table 1, a glue supply component, a rotary glue spreading mechanism, a glue spreading thickness control component and an edge glue control mechanism, a mounting port 2 is provided at the center of the operating table 1 and a control console 3 is provided on one side, a top plate 4 is provided at the mounting port 2, a glue supply component is installed on one side of the operating table 1 and comprises a glue storage container 5, a pump body 6, a glue delivery pipe 7, a rotating support arm 8 and a nozzle 9, a glue storage container 5 is installed on the side of the operating table 1 and connected to the pump body 6 at the top, a material outlet of the pump body 6 is connected to the nozzle 9 through the glue delivery pipe 7, and the nozzle 9 is installed at the front end of the rotating support arm 8 and is located directly above the mounting port 2, The rotating support arm 8 is installed on the operating table 1, and the rotating glue spreading mechanism is installed at the installation port 2 and includes an outer cover 10 and a motor 11 built into the outer cover 10. A suction cup 12 is installed at the power output end of the motor 11, and the suction cup 12 is located directly below the nozzle 9. A plurality of annular grooves 13 are also provided on the surface of the top plate 4. The glue spreading thickness control component is arranged directly below the top plate 4. The glue spreading thickness control component is composed of a plurality of glue spreading controllers. The glue spreading controller includes two symmetrically arranged groups of floaters 14 and a floating limit ring 15 arranged above the two groups of floaters 14. The floating limit ring 15 is movably inserted in the annular groove 13, and the edge glue control mechanism is installed on the floating limit ring 15.

[0024] Further improvement, such as Figure 1 As shown: the rotating support arm 8 includes a second motor 16 and a vertical pole 17 installed at the power output end of the second motor 16, a crossbeam 18 is fixed in the middle of the vertical pole 17, and the nozzle 9 is fixed on the crossbeam 18.

[0025] Further improvement, such as Figure 2 As shown, several groups of annular grooves 13 are distributed concentrically, the diameter of the inner annular groove 13 is smaller than the diameter of the outer annular groove 13 , and several groups of floating limit rings 15 are evenly distributed in the annular groove 13 .

[0026] Further improvement, such as Figure 3 As shown: the floater 14 includes a motor 19 and a rotating wheel 20 installed on the power output end of the motor 19, a toggle block 21 is fixed to the edge of the rotating wheel 20, one end of the toggle block 21 is thicker than the other end and contacts the bottom of the floating limit ring 15, the rotating wheel 20 is driven to rotate by the motor 19, and the rotating wheel 20 adjusts the height of the floating limit ring 15 by toggle block 21 during the rotation process.

[0027] Further improvement, such as Figure 2 As shown: in two adjacent groups of floating limit rings 15, the diameter of the inner floating limit ring 15 is smaller than the diameter of the outer floating limit ring 15, and the floating limit ring 15 is annular in structure. The floating limit ring 15 of appropriate specifications can be selected according to the diameter of the wafer.

[0028] Further improvement, such as Figure 3 As shown: the edge glue control mechanism includes a tractor 22, a sealing rubber ring 23, an air pipe 24 and an air pump 25. The tractor 22 is divided into two groups and is symmetrically installed on the top of the floating limit ring 15. The sealing rubber ring 23 is movably arranged on the inner side of the floating limit ring 15 and the upper end is connected to the tractor 22. One end of the air pipe 24 is connected to the sealing rubber ring 23 and the other end is connected to the air pump 25.

[0029] Further improvement, such as Figure 4As shown: the tractor 22 includes a shell 26 and a motor 3 27 built into the shell 26, the power output end of the motor 3 27 is connected to a winding roller 28, a conducting wire 29 is wound around the winding roller 28, the lower end of the conducting wire 29 is connected to the sealing rubber ring 23 and one side is connected to a conductive rod 30, a plurality of groups of contact heads 31 are evenly distributed on one side of the conductive rod 30, the plurality of groups of contact heads 31 are evenly distributed from top to bottom and are connected in parallel with a power supply 32 through the line, when it is necessary to adjust the coating thickness of the wafer colloid, the staff can control the contact head 31 at the corresponding position to be in a powered state through the console 3, and the contact head 31 here is the sealing rubber ring 2 3 needs to be adjusted, and then the winding roller 28 is driven to rotate by the motor three 27. During the rotation, the electric wire 29 is retracted and adjusted, so as to pull the sealing rubber ring 23 to float up and down. During the floating process, the conductive rod 30 moves synchronously. When the conductive rod 30 moves to the position of the corresponding energized contact head 31, the current is transmitted to the control console 3, indicating that the sealing rubber ring 23 has reached the set height at this time, that is, the motor three 27 is turned off, so as to achieve the purpose of accurately adjusting the height of the sealing rubber ring 23. After the height adjustment is completed, the air pump 25 ventilates the air ring 33, and the expansion of the air ring 33 can achieve the purpose of limiting the height of the edge colloid during the colloid coating process.

[0030] Specifically, the sealing rubber ring 23 is made of insulating material and includes an air ring 33 and an annular blade 34 arranged below the air ring 33. The air ring 33 is connected to the air supply pipe 24. A sensor can be embedded in the bottom of the air ring to achieve the purpose of sensing when the colloid contacts. The thickness of the glue on the wafer surface can be controlled and limited by the up and down floating of the sealing rubber ring 23.

[0031] During use: When the semiconductor wafer needs to be processed with glue, the staff can place the wafer on the top of the suction cup 12, and then select an appropriate floating limit ring 15 according to the diameter of the wafer, and drive the rotating wheel 20 to rotate through the motor 19. During the rotation of the rotating wheel 20, the height of the floating limit ring 15 is adjusted by the toggle block 21, and the floating limit ring 15 is located at the periphery of the wafer to prevent the colloid from contaminating the edge of the wafer and being thrown out during the rotation of the wafer. At the same time, when the coating thickness of the wafer colloid needs to be adjusted, the staff can control the contact head 31 at the corresponding position to be in the power-on state through the control console 3. The contact head 31 here is the height that the sealing rubber ring 23 needs to adjust, and then the winding roller 28 is driven to rotate by the motor 3 27. During the rotation, the power line 29 is retracted and adjusted. Thereby, the sealing rubber ring 23 is pulled to float up and down, and the conductive rod 30 moves synchronously during the floating process. When the conductive rod 30 moves to the position of the corresponding energized contact head 31, the current is transmitted to the control console 3, indicating that the sealing rubber ring 23 has reached the set height at this time, that is, the motor three 27 is powered off, so as to achieve the purpose of accurately adjusting the height of the sealing rubber ring 23. After the height adjustment is completed, the air pump 25 ventilates the air ring 33, and the expansion of the air ring 33 can achieve the purpose of limiting the height of the edge colloid during the colloid coating process. After the adjustment is completed, the colloid is pumped out through the pump body 6 and placed at the center of the wafer through the nozzle 9. At this time, the motor 11 drives the wafer to rotate rapidly, and the adhesive is spread out and coated on the wafer surface under the action of centrifugal force. This continues until the thickness of the colloid can contact the lower edge of the air ring 33, so as to achieve the purpose of thickness control.

[0032] In the description of the present invention, it is necessary to understand that the terms "coaxial", "bottom", "one end", "top", "middle", "the other end", "upper", "one side", "top", "inside", "front", "center", "both ends" and the like indicate orientations or positional relationships based on the orientations or positional relationships shown in the accompanying drawings, and are only for the convenience of describing the present invention and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore should not be understood as a limitation on the present invention.

[0033] In addition, the terms "first", "second", "third" and "fourth" are used for descriptive purposes only and are not to be understood as indicating or implying relative importance or implicitly indicating the number of technical features indicated. Thus, the features defined as "first", "second", "third" and "fourth" may explicitly or implicitly include at least one of such features.

[0034] In the present invention, unless otherwise clearly stipulated and limited, the terms such as "installation", "setting", "connection", "fixation" and "screw-on" should be understood in a broad sense. For example, it can be a fixed connection, a detachable connection, or an integral one; it can be a mechanical connection or an electrical connection; it can be a direct connection or an indirect connection through an intermediate medium; it can be the internal connection of two elements or the interaction relationship between two elements. Unless otherwise clearly defined, ordinary technicians in this field can understand the specific meanings of the above terms in the present invention according to the specific circumstances.

[0035] Finally, it should be noted that the above description is only a preferred embodiment of the present invention and is not intended to limit the present invention. Although the present invention has been described in detail with reference to the aforementioned embodiments, those skilled in the art can still modify the technical solutions described in the aforementioned embodiments or replace some of the technical features therein by equivalents. Any modification, equivalent replacement, improvement, etc. made within the spirit and principle of the present invention shall be included in the protection scope of the present invention.

Claims

1. A highly efficient coating device for semiconductor wafer processing, characterized in that: The invention comprises an operating table (1), a glue supply component, a rotary glue spreading mechanism, a glue spreading thickness control component and an edge glue control mechanism. The operating table (1) is provided with an installation opening (2) at the center and a control console (3) is provided on one side. A top plate (4) is provided at the installation opening (2). The glue supply component is installed on one side of the operating table (1) and comprises a glue storage container (5), a pump body (6), a glue delivery pipe (7), a rotating support arm (8) and a nozzle (9). The glue storage container (5) is installed on the side of the operating table (1) and is connected to the pump body (6) at the top. The discharge port of the pump body (6) is connected to the nozzle (9) via the glue delivery pipe (7). The nozzle (9) is installed at the front end of the rotating support arm (8) and is located directly above the installation opening (2). The rotating support arm (8) is mounted on the operating table (1), the rotating glue spreading mechanism is mounted at the mounting opening (2) and comprises an outer cover (10) and a motor (11) built into the outer cover (10), a suction cup (12) is mounted on the power output end of the motor (11), the suction cup (12) is located directly below the nozzle (9), the surface of the top plate (4) is also provided with a plurality of annular grooves (13), the glue spreading thickness control component is arranged directly below the top plate (4), the glue spreading thickness control component is composed of a plurality of glue spreading controllers, the glue spreading controllers include two symmetrically arranged groups of floaters (14) and a floating limit ring (15) arranged above the two groups of floaters (14), the floating limit ring (15) ) is movably inserted into the annular groove (13), the edge glue control mechanism is installed on the floating limit ring (15), the rotating support arm (8) includes a motor (16) and a vertical rod (17) installed at the power output end of the motor (16), a crossbeam (18) is fixed in the middle of the vertical rod (17), the nozzle (9) is fixed on the crossbeam (18), a plurality of groups of the annular grooves (13) are distributed in a concentric shape, the diameter of the annular groove (13) located on the inner side is smaller than the diameter of the annular groove (13) located on the outer side, a plurality of groups of the floating limit rings (15) are evenly distributed in the annular groove (13), the floater (14) includes a motor (19) and a rotating wheel (20) installed at the power output end of the motor (19), the rotating wheel A toggle block (21) is fixed to the edge of the (20), one end of the toggle block (21) is thicker than the other end and contacts the bottom of the floating limit ring (15), in two adjacent groups of the floating limit rings (15), the diameter of the floating limit ring (15) located on the inner side is smaller than the diameter of the floating limit ring (15) on the outer side, the floating limit ring (15) is annular, the edge glue control mechanism includes a tractor (22), a sealing rubber ring (23), an air pipe (24) and an air pump (25), the tractor (22) is divided into two groups and symmetrically installed on the top of the floating limit ring (15), the sealing rubber ring (23) is movably arranged on the inner side of the floating limit ring (15) and the upper end is connected to the tractor (22),One end of the air delivery pipe (24) is connected to the sealing rubber ring (23) and the other end is connected to the air pump (25). The tractor (22) comprises a housing (26) and a motor three (27) built into the housing (26). The power output end of the motor three (27) is connected to a winding roller (28). A conducting wire (29) is wound around the winding roller (28). The lower end of the conducting wire (29) is connected to the sealing rubber ring (23) and one side is connected to a conductive rod (30). One side of the conductive rod (30) is evenly distributed with a plurality of groups of contact heads (31). The plurality of groups of contact heads (31) are evenly distributed from top to bottom and are connected in parallel with a power supply (32) through a line. The sealing rubber ring (23) is made of insulating material and comprises an air ring (33) and an annular blade (34) arranged below the air ring (33). The air ring (33) is connected to the air delivery pipe (24).

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