Wafer test system, probe card replacement method, and prober

Abstract

The present invention provides a wafer testing system, a probe card replacement method, and a prober that can minimize the increase in installation space and automate probe card replacement at low cost. The wafer testing system includes: a prober having a suction cup for holding a semiconductor wafer and a probe card having probes, and inspecting the semiconductor chips by bringing the probes into contact with a plurality of semiconductor chips formed on the semiconductor wafer; a ceiling-mounted automated guided vehicle that transports a cassette containing a plurality of semiconductor wafers before inspection into the prober and retrieves a cassette containing a plurality of semiconductor wafers after inspection from the prober; a transport control unit that controls the ceiling-mounted automated guided vehicle to transport the probe card between a probe card replacement position pre-set in the prober and a probe card storage location outside the prober; and a card transport mechanism that transports the probe card between a holding position and a replacement position within the prober.

Description

Technical Field

[0001] The present invention relates to a wafer testing system for inspecting semiconductor wafers using a prober, a probe card replacing method for replacing a probe card of the prober, and a prober used in the wafer testing system. Background Art

[0002] Multiple semiconductor chips with identical electrical circuits are formed on the surface of a semiconductor wafer. Before each semiconductor chip is cut into individual pieces by a dicing machine during the semiconductor manufacturing process, its electrical characteristics are inspected using a wafer testing system. This wafer testing system includes a prober and a tester (see Patent Document 1).

[0003] The prober holds the semiconductor wafer on a wafer chuck and moves a probe card with probes relative to the wafer chuck, bringing the probes into electrical contact with the electrode pads on the semiconductor chip. The tester supplies various test signals to the semiconductor chip via terminals connected to the probes and receives and analyzes the signals output from the semiconductor chip to test whether the semiconductor chip is operating normally.

[0004] In recent years, automation has been advancing in semiconductor manufacturing processes, and automation is also advancing in wafer testing systems. For example, in the wafer testing system described in Patent Document 1, an overhead hoist transport (OHT) is used to place a cassette containing multiple semiconductor wafers to be inspected onto a prober's loading device. Next, the wafer testing system places the semiconductor wafer on a wafer chuck, probes contact each semiconductor chip on the semiconductor wafer, and a tester tests each semiconductor chip. The OHT then retrieves the cassette containing the inspected semiconductor wafers from the prober. This allows for inspection of semiconductor wafers without the presence of an operator.

[0005] Prior art literature

[0006] Patent Literature

[0007] Patent Document 1: Japanese Patent Application Laid-Open No. 2007-329458 Summary of the Invention

[0008] Problems to be solved by the invention

[0009] In addition, there are various types of semiconductor chips formed on semiconductor wafers, and there are also various types of probe cards used in the inspection of semiconductor chips. Therefore, in a wafer testing system, there is a situation where the type of probe card provided in the probe must be replaced in accordance with the change in the type of semiconductor chip to be inspected. In the past, an operator was required to replace the probe card in the probe, and the replacement was performed manually or semi-automatically. Therefore, devices delivered to the United States and Europe need to meet prescribed safety standards (SEMI standard S2CE, etc.), for example, when opening and closing the door of the probe when replacing the probe card, it is necessary to turn off the power supply of the drive unit of the probe. In addition, the replacement of the probe card by the operator through manual work may cause the probe card to fall by mistake, so it is strongly desired to automate the replacement of the probe card in the probe in the semiconductor manufacturing process.

[0010] To automate the replacement of probe cards in a prober, it is necessary to automate the collection of previously replaced probe cards from the prober and the loading of new probe cards into the prober. However, installing new equipment for collecting and loading probe cards in the semiconductor manufacturing process poses challenges in terms of cost and space.

[0011] The present invention has been made in view of the above circumstances, and an object of the present invention is to provide a wafer test system, a probe card replacement method, and a prober that can suppress an increase in installation space and automate probe card replacement at low cost.

[0012] Solutions to Problems

[0013] The chip testing system for achieving the purpose of the present invention comprises: a probe having a suction cup for holding a semiconductor chip and a probe card having probes, and making the probes contact a plurality of semiconductor chips formed on the semiconductor chip to inspect the semiconductor chips; a ceiling-moving unmanned guided vehicle, which moves along a conveying track while holding a box containing a plurality of semiconductor chips, and moves the box containing a plurality of semiconductor chips before inspection into the probe and recovers the box containing a plurality of semiconductor chips after inspection from the probe; a conveying control unit, which controls the ceiling-moving unmanned guided vehicle, and conveys the probe card between a replacement position of the probe card pre-set in the probe and a storage place of the probe card located outside the probe; a card conveying mechanism, which is provided in the probe, and conveys the probe card between a holding position held in the probe and a replacement position; a separation control unit, which controls the card conveying mechanism, and performs a separation process of conveying the probe card before replacement from the holding position to the replacement position; and an assembly control unit, which controls the card conveying mechanism, and performs an assembly process of conveying a new probe card from the replacement position to the holding position.

[0014] According to this wafer test system, the probe card of the prober can be automatically replaced using a ceiling-traveling automated guided vehicle for cassette transport.

[0015] In another embodiment of the present invention, a wafer test system includes a prober comprising: a housing that accommodates a suction cup, a probe card, and a card transport mechanism; an opening formed in the housing that exposes a replacement position to the outside of the housing; a door that can be switched between an open state (opening the opening) and a closed state (covering the opening); a door opening and closing mechanism for switching the door between an open state and a closed state; and a door opening and closing control unit that drives the door opening and closing mechanism to switch the door from the closed state to the open state during a separation process, and drives the door opening and closing mechanism to switch the door from the open state to the closed state during a mounting process. Thus, the door opening and closing during the separation process and the mounting process can be automated.

[0016] In another embodiment of the present invention, a wafer testing system includes a human detection sensor that detects intrusion into a predefined protection zone based on the position of a door. Based on the detection result of the human detection sensor, a door opening and closing control unit stops the door opening and closing mechanism while a person is intruding into the protection zone. This prevents the door from striking a person or preventing hands or fingers from being pinched by the door.

[0017] In another embodiment of the wafer testing system of the present invention, when the door opening and closing mechanism is stopped midway, the door opening and closing control unit restarts the door opening and closing mechanism in response to the human detection sensor detecting a change from a human intrusion into the protected area to no human intrusion into the protected area. This reduces the operator's time and effort in restarting the operation.

[0018] In another embodiment of the present invention, a wafer test system includes a card holding unit that holds a probe card at a holding position so that it can be loaded and unloaded. A card transport mechanism includes a tray that can hold the probe card and transports the tray between the holding position and a replacement position. A separation control unit sequentially performs, as a separation process, a process of driving the card transport mechanism to transport the tray to the holding position, a process of releasing the probe card held by the card holding unit so that the tray holds the probe card, and a process of driving the card transport mechanism to transport the tray from the holding position to the replacement position. When a new probe card is held by the tray at the replacement position, an assembly control unit sequentially performs, as an assembly process, a process of driving the card transport mechanism to transport the tray from the replacement position to the holding position, and a process of holding the probe card by the card holding unit. Thus, the separation process and the assembly process can also be automated, so that the probe card of the prober can be replaced completely automatically.

[0019] In a wafer test system according to another aspect of the present invention, the prober includes a card holder that holds the probe card, and the card transport mechanism transports the probe card and the card holder integrally between the holding position and the replacement position.

[0020] In another embodiment of the present invention, a wafer testing system includes a card holder having a card holding hole for holding a probe card, and a ceiling-mounted automated guided vehicle (AGV) places the probe card in the card holding hole of the card holder at a replacement position. The wafer testing system includes a plurality of positioning portions provided at an edge of an opening of the card holder forming the card holding hole. The plurality of positioning portions include guide surfaces for guiding the probe card toward the card holding hole when the probe card is placed in the card holding hole by the ceiling-mounted automated guided vehicle. Thus, the probe card can be reliably guided toward the card holding hole.

[0021] In another embodiment of the wafer testing system of the present invention, a transport control unit controls a ceiling-mounted automated guided vehicle (AGV) to perform a retrieving process (transferring a probe card before probe replacement from a replacement location to a storage location) and a loading process (transferring a new probe card from the storage location to the replacement location). The wafer testing system includes a human detection sensor that detects intrusion into a protection zone pre-set with respect to the replacement location. Based on the detection results of the human detection sensor, the transport control unit stops the retrieving process while a person intrudes into the protection zone. Based on the detection results of the human detection sensor, the transport control unit stops the loading process while a person intrudes into the protection zone. This prevents the ceiling-mounted automated guided vehicle from colliding with a person.

[0022] In a chip testing system of another embodiment of the present invention, a transport control unit controls a ceiling-moving unmanned transport vehicle to perform a recovery process of transporting the probe card before replacement of the detector from the replacement position to a storage place and a carry-in process of transporting the new probe card from the storage place to the replacement position. The ceiling-moving unmanned transport vehicle has a lifting and holding part that can be raised and lowered freely and holds the box or probe card so that it can be loaded and unloaded. The transport control unit performs a process of moving the ceiling-moving unmanned transport vehicle to a position directly above the replacement position, a process of lowering the lifting and holding part to the replacement position, a process of holding the probe card at the replacement position by using the lifting and holding part, a process of raising the lifting and holding part, and a process of moving the ceiling-moving unmanned transport vehicle from a directly above position to a storage place as a recovery process. The transport control unit performs a process of making the lifting and holding part hold the probe card in the storage place, a process of moving the ceiling-moving unmanned transport vehicle from the storage place to a directly above position, a process of lowering the lifting and holding part, a process of releasing the hold of the probe card at the replacement position by using the lifting and holding part, and a process of raising the lifting and holding part as a carry-in process. Thus, the probe card of the prober can be automatically replaced using the ceiling-traveling automated guided vehicle for magazine transportation.

[0023] In another embodiment of the present invention, a wafer test system includes a card transport mechanism disposed on a prober and transporting a probe card between a holding position held in the prober and a replacement position. The card transport mechanism includes a tray capable of holding the probe card and transporting the tray between the holding position and the replacement position. The wafer test system includes a card sensor disposed on the tray and detecting the presence of the probe card on the tray. The transport control unit lowers the lift holding unit while the card sensor detects that the probe card is not on the tray. Furthermore, the lift holding unit releases the probe card and raises the lift holding unit in response to a change in the detection result of the card sensor from the absence of the probe card on the tray to the presence of the probe card on the tray. This allows for automated loading.

[0024] In another embodiment of the wafer testing system of the present invention, a transport track extends in the X direction of mutually orthogonal XYZ directions, a ceiling-mounted automated guided vehicle includes a lifting and holding portion that is freely elevating in the Z direction and positionally adjustable in the Y direction within a predetermined range of motion, and the lifting and holding portion can be used to hold a cassette or a probe card so that it can be loaded and unloaded, the probe includes a loading device that is located at a position different from the replacement position in the X direction and on which the ceiling-mounted automated guided vehicle loads the cassette, the lifting and holding portion can load the cassette onto the loading device within the movable range of the lifting and holding portion in the Y direction, and can load the probe card into the replacement position. Thus, the ceiling-mounted automated guided vehicle for cassette transport can be used to retrieve the probe card from the replacement position and to load the probe card into the replacement position.

[0025] The probe card replacement method for achieving the purpose of the present invention replaces a probe card of a detector having a suction cup for holding a semiconductor chip and a probe card having probes, and makes the probes contact a plurality of semiconductor chips formed on the semiconductor chip for inspection, wherein the probe card replacement method comprises: a separation step, in which the card transport mechanism of the detector performs a separation process of transporting the probe card before replacement from a holding position held in the detector to a replacement position of the probe card pre-set in the detector; a recovery step, in which a ceiling-traveling unmanned guided vehicle performs a recovery process of transporting the probe card before replacement transported to the replacement position from the replacement position to a storage place of the probe card located outside the detector, the ceiling-traveling unmanned guided vehicle moves along a transport track while holding a box box containing a plurality of semiconductor chips, and transports the box box containing a plurality of semiconductor chips before inspection into the detector and recovers the box box containing a plurality of semiconductor chips that have been inspected from the detector; a carry-in step, in which the ceiling-traveling unmanned guided vehicle performs a carry-in process of transporting a new probe card from the storage place to the replacement position; and an assembly step, in which the card transport mechanism performs an assembly process of transporting the new probe card from the replacement position to the holding position.

[0026] The probe for achieving the purpose of the present invention comprises a suction cup for holding a semiconductor wafer and a probe card having probes, and the probes are brought into contact with a plurality of semiconductor chips formed on the semiconductor wafer to inspect the semiconductor chips, wherein the probe comprises: a card transport mechanism that transports the probe card between a holding position in the probe and a replacement position for replacing the probe card; and a loading device that uses a ceiling-moving unmanned guided vehicle to load a box magazine for storing a plurality of semiconductor chips, the ceiling-moving unmanned guided vehicle being movable along a transport track extending in the X direction among mutually orthogonal XYZ directions, and having a lifting and holding portion that is movable in the Z direction and can be adjusted in position within a predetermined movable range in the Y direction, the lifting and holding portion can load the box magazine onto the loading device within the movable range of the lifting and holding portion in the Y direction, and can load the probe card onto the replacement position, the probe card having a held portion held by the lifting and holding portion, and the replacement position being a position where the probe card can be replaced by the ceiling-moving unmanned guided vehicle.

[0027] Effects of the Invention

[0028] The present invention can automate the replacement of probe cards at low cost while suppressing an increase in installation space. BRIEF DESCRIPTION OF THE DRAWINGS

[0029] Figure 1 This is a schematic diagram of a wafer test system.

[0030] Figure 2 This is a schematic diagram of a detector and a tester.

[0031] Figure 3 is a top view of the card holder.

[0032] Figure 4 This is an enlarged view of a plurality of positioning portions provided on the card holder.

[0033] Figure 5 This is a perspective view of a tray holding a probe card and a card holder.

[0034] Figure 6 This is a top view of the tray.

[0035] Figure 7 This is an explanatory diagram for explaining the separation process when replacing the probe card.

[0036] Figure 8 This is an explanatory diagram for explaining the separation process when replacing the probe card.

[0037] Figure 9 This is an explanatory diagram for explaining the assembly process when replacing the probe card.

[0038] Figure 10This is an explanatory diagram for explaining the assembly process when replacing the probe card.

[0039] Figure 11 It is a perspective view of the door of the housing switched to the open state.

[0040] Figure 12 It is a perspective view of the door of the housing switched to a closed state.

[0041] Figure 13 This is an illustration of a laser scanner.

[0042] Figure 14 This is a schematic diagram of the OHT, a wafer transport mechanism.

[0043] Figure 15 This is an explanatory diagram for explaining the conditions under which the recovery process and the loading process of the probe card by the wafer transport mechanism can be realized.

[0044] Figure 16 This is a functional block diagram of the detector control unit and the GEM host.

[0045] Figure 17 This is a flowchart showing the flow of a probe card replacement process of a prober performed by a wafer test system.

[0046] Figure 18 Is used to illustrate Figure 17 FIG. 1 is an explanatory diagram of the separation process (replacement instruction) in step S1.

[0047] Figure 19 Is used to illustrate Figure 17 FIG. 1 is an explanatory diagram of the separation process (pallet transport) in step S1.

[0048] Figure 20 Is used to illustrate Figure 17 1 is an explanatory diagram of the separation process (start of switching to the open state of the door) in step S1.

[0049] Figure 21 Is used to illustrate Figure 17 FIG. 1 is an explanatory diagram of the separation process (emergency stop of the door opening and closing mechanism) in step S1.

[0050] Figure 22 17. This is an explanatory diagram for explaining the separation process (restart of driving of the door opening and closing mechanism) in step S1 shown in FIG. 17.

[0051] Figure 23 Is used to illustrate Figure 17 FIG. 2 is an explanatory diagram of the separation process (notification of completion of replacement preparation) in step S1 shown in FIG.

[0052] Figure 24It is an explanatory diagram for explaining the recovery process (lowering of the lifting holding unit) in step S2 of FIG17 .

[0053] Figure 25 It is an explanatory diagram for explaining the recovery process (raising of the lifting holding unit) in step S2 of 17 .

[0054] Figure 26 17 is an explanatory diagram for explaining the carrying-in process (transportation of the probe card) in step S3 shown in FIG.

[0055] Figure 27 17 is an explanatory diagram for explaining the carrying-in process (lowering of the lifting holding unit) in step S3 shown in FIG.

[0056] Figure 28 17 is an explanatory diagram for explaining the carrying-in process (raising of the lifting holding unit) in step S3 shown in FIG.

[0057] Figure 29 17 is an explanatory diagram for explaining the assembly process (assembly instruction) in step S4.

[0058] Figure 30 17 is an explanatory diagram for explaining the assembly process (start of switching to the closed state of the door) in step S4 shown in FIG.

[0059] Figure 31 17 is an explanatory diagram for explaining the mounting process (reading information, authentication result) in step S4.

[0060] Figure 32 17 is an explanatory diagram for explaining the assembly process (assembly of the probe card) in step S4 shown in FIG.

[0061] Figure 33 17 is an explanatory diagram for explaining the mounting process (movement of the suction cup) in step S4 shown in FIG.

[0062] Figure 34 17 is an explanatory diagram for explaining the mounting process (replacement completion notification) in step S4. DETAILED DESCRIPTION

[0063] [Overall structure of the wafer test system]

[0064] Figure 1 FIG. 2 is a schematic diagram of the wafer test system 2. Figure 1 As shown, the wafer test system 2 automatically inspects the electrical characteristics of each semiconductor chip (not shown) on the semiconductor wafer W using a prober 10 described later. The wafer test system 2 also automatically replaces the probe card 30 of the prober 10 .

[0065] The wafer test system 2 generally includes a prober 10 and a tester 11 (see Figure 2 ), laser scanner 12, wafer transport mechanism 14 and GEM (Generic Model For Communications and Control Of Manufacturing Equipment) host 16. It should be noted that the wafer test system 2 is provided with a plurality of probes 10 (refer to Figure 14 ).

[0066] Each detector 10, wafer transport mechanism 14 and GEM host 16 are connected to each other via a well-known network 18. It should be noted that the network 18 connecting each detector 10 and GEM host 16 is actually different from the network 18 connecting the wafer transport mechanism 14 and GEM host 16 (see Figure 16 ). In addition, each detector 10 is connected to the wafer transport mechanism 14 (OHT54) via an I / O interface 19 (in accordance with SEMI-E48) (see Figure 16 ). In addition, the laser scanner 12 is connected to the detector 10 and is connected to the GEM host 16 via the detector 10 and the network 18.

[0067] [detector]

[0068] Figure 2 1 is a schematic diagram of the detector 10 and the tester 11. It should be noted that the XY direction in the mutually orthogonal XYZ directions in the figure is the horizontal direction, and the Z direction is the up-down direction. Figure 2 As shown, the probe 10 generally comprises a base 20, a load port 21 (see Figure 13 ), a suction cup 22, a suction cup moving mechanism 24, a card holding portion 26, a card holder 28, a probe card 30, a card transport mechanism 32, and a housing 34 for accommodating them. It should be noted that the detailed structure of the probe 10 is a well-known technology (for example, refer to Japanese Patent Application Laid-Open No. 2018-117096), so only a part of the structure of the probe 10 is described here.

[0069] The suction cup 22 is held on the base 20 so as to be movable in each of the X, Y, and Z directions and to be rotatable in the θ direction, which is an axis parallel to the Z direction. Furthermore, the card transport mechanism 32 is held on the base 20 so as to be movable in the Y direction.

[0070] In the loading device 21 (refer to Figure 13), the OHT 54 of the wafer transport mechanism 14 described later is used to load the cassette CS containing a plurality of semiconductor wafers W to be inspected. It should be noted that, although not shown, the probe 10 is provided with a transport mechanism for transporting the semiconductor wafers W between the loader 21 and the chuck 22.

[0071] The semiconductor wafer W is held on the upper surface of the chuck 22 by various holding methods such as vacuum suction. A temperature adjustment unit (not shown) for adjusting the temperature of the semiconductor wafer W is provided inside the chuck 22 .

[0072] In addition, a connecting portion 36 is provided on the suction cup 22 at a position opposite to the card transport mechanism 32 described later. The connecting portion 36 is used to connect the suction cup 22 and the card transport mechanism 32. The connecting portion 36 is housed inside the suction cup 22 except when the probe card 30 is replaced, which will be described later. When the probe card 30 is replaced, the connecting portion 36 protrudes from the side of the suction cup 22 in the Y direction and connects to the card transport mechanism 32. As a result, the suction cup 22 and the card transport mechanism 32 can move as a whole when the probe card 30 is replaced. It should be noted that the connecting portion 36 may not be provided, and the suction cup 22 and the card transport mechanism 32 may always move as a whole.

[0073] The chuck moving mechanism 24 is a well-known actuator composed of a motor or the like. This chuck moving mechanism 24 is capable of moving the chuck 22 in the X, Y, and Zθ directions. This enables relative movement of the semiconductor wafer W held by the chuck 22 and the probe 30a (described later) in the X, Y, and Zθ directions. Furthermore, the chuck moving mechanism 24 integrally moves the chuck 22 and the card transport mechanism 32 in the Y direction when the probe card 30 is replaced. It should be noted that a mechanism for moving the card transport mechanism 32 may also be provided in addition to the chuck moving mechanism 24.

[0074] The card holding portion 26 (also referred to as a head stage) is provided above the suction cup 22 in the Z direction and detachably holds the card holder 28. The card holder 28 holds the outer periphery of the probe card 30. Thus, the card holding portion 26 can detachably hold the probe card 30 via the card holder 28.

[0075] Figure 3 2 is a top view of the card holder 28 . Figure 4 It is an enlarged view of a plurality of positioning portions 40 provided on the card holder 28 .

[0076] like Figure 3 as well as Figure 4 As shown, the card holder 28 has a card holding hole 38 for holding the outer periphery of the probe card 30. The card holder 28 also includes a plurality of positioning portions 40 provided at intervals along the edge of the opening forming the card holding hole 38.

[0077] Each positioning portion 40 has a function of placing the probe card 30 on the card holding hole 38 by the OHT 54 described later (see FIG. Figure 27 ) The guide surface 40a guides the probe card 30 toward the card holding hole 38. The guide surface 40a is an inclined surface with its lower end in the Z direction located at the opening edge of the card holding hole 38 and is inclined so as to gradually move horizontally away from the card holding hole 38 as it moves upward in the Z direction. Thus, the probe card 30 can be guided toward the card holding hole 38 along the guide surfaces 40a of each positioning portion 40.

[0078] return Figure 2 The probe card 30 has probes 30a arranged in accordance with the arrangement of the electrode pads of a plurality of semiconductor chips (not shown) formed on the semiconductor wafer W. In addition, a lifting and holding portion 54a (see FIG. 1 ) of the OHT 54 constituting the wafer transport mechanism 14 described later is provided on the upper surface of the probe card 30. Figure 1 Furthermore, the probe card 30 is provided with connection terminals (not shown) electrically connected to the probes 30a, and the tester 11 is connected to the connection terminals.

[0079] The tester 11 supplies various test signals to the electrode pads of each semiconductor chip on the semiconductor wafer W via the connection terminals and probes 30a of the probe card 30, and receives and analyzes the signals output from the electrode pads to inspect (test) whether the semiconductor chips are operating normally. It should be noted that the structure and testing method of the tester 11 are well known in the art, and therefore a detailed description thereof is omitted.

[0080] The probe card 30 used for inspecting semiconductor chips is replaced, for example, depending on the type of semiconductor chip or after a predetermined number of inspections. In the wafer test system 2 of this embodiment, the probe card 30 is automatically replaced using the aforementioned chuck moving mechanism 24, the card transport mechanism 32, and the wafer transport mechanism 14. While "replacing the probe card 30" as used herein includes attaching a new probe card 30 to the prober 10 when the probe card 30 is not already attached, this embodiment uses the example of replacing a probe card 30 already held in the card holder 26 with a new probe card 30.

[0081] The card transport mechanism 32, together with the suction cup moving mechanism 24, performs a separation process of transporting the card holder 28 and the probe card 30 before replacement from the "holding position" to the "replacement position" as a whole, and an assembly process of transporting the card holder 28 and the new probe card 30 from the "replacement position" to the "holding position" as a whole when the probe card 30 is replaced. Here, the holding position is the position where the probe card 30 and the card holder 28 are held by the card holding portion 26. In addition, the replacement position is the position where the probe card 30 is replaced in the probe 10, more specifically, the position where the probe card 30 can be replaced by the OHT 54 described later (see Figure 1 ) to recover and carry in the probe card 30 (see Figure 8 ).

[0082] The card transport mechanism 32 is connected to the suction cup 22 via the connection portion 36 described above when the probe card 30 is replaced (see FIG. Figure 7 ), thereby transporting the card holder 28 and the probe card 30 integrally between the holding position and the replacement position.

[0083] The card transport mechanism 32 holds a substantially flat tray 42 capable of holding (supporting) the probe card 30 and the card holder 28 in a collapsed state parallel to the XZ plane (see FIG. Figure 2 ) and the upright state parallel to the XY plane (refer to Figure 7 ) can be displaced freely. In addition, the card transport mechanism 32 keeps the tray 42 in the upright state so that it can be lifted and lowered freely in the Z direction (see Figure 7 ).

[0084] Figure 5 It is a perspective view of a tray 42 that holds (supports) the probe card 30 and the card holder 28 . Figure 6 42 is a top view of the tray. Figure 5 as well as Figure 6 As shown, the tray 42 has a holder holding hole 44 for holding the outer periphery of the card holder 28, and holds the card holder 28 in the upright state described above by the holder holding hole 44. Thus, the tray 42 holds the probe card 30 and the card holder 28 integrally.

[0085] The tray 42 is provided with a plurality of retainer sensors 46 for detecting the presence of the card retainer 28 and a plurality of card sensors 48 for detecting the presence of the probe card 30. Each retainer sensor 46 is, for example, a press-type (or pressure-sensitive) sensor provided on the bottom surface of the retainer holding hole 44. When the card retainer 28 is held in the retainer holding hole 44, each retainer sensor 46 is pressed by the card retainer 28, causing the sensor output value to change. Thus, the presence of the card retainer 28 on the tray 42 can be detected based on the sensor output value of each retainer sensor 46.

[0086] Each card sensor 48 is, for example, a push-type sensor disposed inside the holder holding hole 44. When the card holder 28 is held in the holder holding hole 44, the sensor head of each card sensor 48 protrudes upward in the Z direction from the inside of the card holding hole 38. Therefore, when the probe card 30 is held in the card holding hole 38, the card holder 28 presses against each card sensor 48, causing the sensor output value to change. Thus, the presence or absence of the probe card 30 on the tray 42 can be detected based on the sensor output value of each card sensor 48.

[0087] Figure 7 as well as Figure 8 30 is an explanatory diagram for explaining the separation process when replacing the probe card 30. Figure 7 as well as Figure 8 (described later Figure 9 as well as Figure 10 ), in order to prevent the drawings from being complicated, the internal structure of the probe 10 and the probe card 30 are briefly recorded, and the size of the probe card 30 and the card holder 28 is emphasized compared to the tray 42 to make it clear that the probe card 30 and the card holder 28 are transported by the tray 42.

[0088] like Figure 7 As shown in FIG7A, before the separation process begins, the suction cup 22 is positioned at the inspection position Y1, vertically below the card holding portion 26. Furthermore, the card transport mechanism 32 is positioned at the replacement position. Furthermore, the tray 42 of the card transport mechanism 32 is switched to a fallen position.

[0089] like Figure 7 As shown in FIG7B , when the separation process begins, the suction cup moving mechanism 24 moves the suction cup 22 to the connection position Y3. The connection position Y3 is adjacent to the replacement position and is where the suction cup 22 can be connected to the card transport mechanism 32. Then, the connection portion 36 protrudes from the side of the suction cup 22 in the Y direction and connects to the card transport mechanism 32. This allows the suction cup 22 and the card transport mechanism 32 to move together in the Y direction.

[0090] like Figure 7 As shown in FIG7C , after the suction cup 22 and the card transport mechanism 32 are connected, the suction cup moving mechanism 24 moves the suction cup 22 to the tray switching position Y2 between the inspection position Y1 and the connection position Y3. After this movement is completed, the card transport mechanism 32 switches the tray 42 from the down position to the upright position.

[0091] like Figure 7As shown in FIG7D , after the tray 42 is switched to the upright state, the suction cup moving mechanism 24 moves the suction cup 22 to the separation / assembly position Y0. The separation / assembly position Y0 is a position where the tray 42 is adjusted to a position vertically below the card holding portion 26. More specifically, the holder holding hole 44 of the tray 42 is aligned with the card holder 28 held by the card holding portion 26. After this movement is completed, the card transport mechanism 32 raises the tray 42 and transports the tray 42 to a position where it contacts the card holder 28 held by the card holding portion 26. As a result, the card holder 28 is held in the holder holding hole 44 of the tray 42, and the probe card 30 is held by the card holder 28.

[0092] like Figure 8 As shown in FIG8A, when the probe card 30 and the card holder 28 are held by the tray 42 and the card holder 28 is released from the card holding portion 26, the sensor output values ​​of the holder sensors 46 and the output values ​​of the card sensors 48 change. As a result, the probe card 30 and the card holder 28 are held by the tray 42.

[0093] like Figure 8 As shown in FIG8B, when the card holder 28 is released from the card holding portion 26, the card transport mechanism 32 lowers the tray 42.

[0094] like Figure 8 As shown in the figure mark 8C, when the tray 42 is lowered, the suction cup moving mechanism 24 moves the suction cup 22 to the connection position Y3. As a result, the tray 42 of the card transport mechanism 32 is transported to the replacement position, and the probe card 30 and the card holder 28 are also transported to the replacement position. It should be noted that a door 35, which will be described in detail later, is provided in front of the replacement position. Therefore, when the suction cup moving mechanism 24 transports the tray 42 toward the replacement position, it temporarily stops the transportation of the tray 42 in front of the door 35, and resumes the transportation of the tray 42 after the door 35 is opened (refer to the later-described Figure 22 ). By transporting the tray 42 to the replacement position, the probe card 30 before replacement can be recovered from the tray 42 by the OHT 54 described later (see Figure 25 ) and the loading of the new probe card 30 into the tray 42 by the OHT 54 (see Figure 27 ).

[0095] Figure 9 as well as Figure 10 It is an explanatory diagram for explaining the assembly process when replacing the probe card 30 .

[0096] like Figure 9As shown in FIG. 9A, when the card holder 28 on the tray 42 provided at the replacement position holds a new probe card 30, as shown in FIG. Figure 9 As shown in FIG9B , the suction cup moving mechanism 24 moves the suction cup 22 to the separation / assembly position Y0. This positions the tray 42, the probe card 30, and the card holder 28 vertically below the card holder 26. The card transport mechanism 32 then raises the tray 42. This also raises the card holder 28 and the probe card 30 held on the tray 42.

[0097] like Figure 9 As shown in FIG9C , the card transport mechanism 32 continues to raise the tray 42 until the card holder 28 reaches the card holder 26 (holding position). Thus, the tray 42, probe card 30, and card holder 28 are transported from the replacement position to the holding position. When this transport is completed, the card holder 26 holds the card holder 28. As a result, a new probe card 30 is mounted on the card holder 26 via the card holder 28.

[0098] like Figure 10 As shown by the reference numeral XA, when the card holding portion 26 holds the card holder 28, the card transport mechanism 32 lowers the tray 42. Thus, the holding of the card holder 28 by the tray 42 is released.

[0099] like Figure 10 As shown in the figure mark XB, when the descent of the tray 42 is completed, the suction cup moving mechanism 24 moves the suction cup 22 to the tray switching position Y2. After the movement is completed, the card transport mechanism 32 switches the tray 42 from the upright state to the collapsed state.

[0100] like Figure 10 As shown by the reference numeral XC, after the tray 42 is switched to the inverted state, the suction cup moving mechanism 24 moves the suction cup 22 to the connection position Y3. The connection portion 36 then retracts into the suction cup 22, releasing the connection between the suction cup 22 and the card transport mechanism 32. As a result, the card transport mechanism 32 is positioned at the replacement position before the separation process begins.

[0101] like Figure 10 As shown by the reference numeral XD, when the connection between the suction cup 22 and the card transport mechanism 32 is released, the suction cup moving mechanism 24 moves the suction cup 22 to the inspection position Y1. Thus, the assembly process is completed.

[0102] Figure 11 It is a perspective view of the door 35 of the housing 34 switched to the open state. Figure 12 3 is a perspective view of the door 35 of the housing 34 switched to a closed state. Figure 11 as well as Figure 12As shown, the housing 34 has an opening 34a for exposing the replacement position, more specifically, the tray 42 moved to the replacement position, etc. to the outside. Note that, in this embodiment, a portion of the tray 42 moved to the replacement position protrudes from the opening 34a to the outside of the housing 34.

[0103] The housing 34 is provided with a rotatable opening portion 34a that can be switched to an open state (see Figure 11 ) and the closed state covering the opening 34a (refer to Figure 12 ) door 35. The door 35 is opened and closed by a door opening and closing mechanism 49 (see Figure 16 ) is executed. The door opening and closing mechanism 49 switches the door 35 to an open state before the tray 42 moves to the replacement position during the separation process. In addition, the door opening and closing mechanism 49 switches the door 35 to a closed state after the tray 42 is stored in the housing 34 during the assembly process.

[0104] [Laser Scanner]

[0105] Figure 13 1 is an explanatory diagram of the laser scanner 12. Figure 13 As well as the aforementioned Figure 1 As shown, the laser scanner 12 corresponds to the human detection sensor of the present invention and is positioned near the door 35 (opening 34a) of the detector 10. The laser scanner 12 emits and scans, for example, an infrared laser, and detects the infrared laser light reflected by and striking a human H, serving as a detection target, thereby detecting the distance to the human H. By adjusting the installation position of the laser scanner 12 and the scanning range of the infrared laser light, it is possible to detect the intrusion of a human H into the protection area PA and the warning area WA, which are pre-set based on the replacement position and the position of the door 35.

[0106] The protection area PA defines a range where a person H may collide with the opening and closing door 35 or have his hand caught in the door 35 , that is, a range where a person H may be intruded during the opening and closing operation of the door 35 .

[0107] The warning area WA is set outside the protection area PA and is an area for issuing a warning to the person H who may intrude into the protection area PA. Note that the setting of the warning area WA may be omitted.

[0108] The detection signal output from the laser scanner 12 is input to the probe 10 , and further input to a GEM host 16 described later via the probe 10 and the network 18 .

[0109] [Wafer transport mechanism]

[0110] Figure 14FIG. 1 is a schematic diagram of the OHT 54 of the wafer transport mechanism 14. Figure 14 As well as the aforementioned Figure 1 As shown in FIG. 1 , the wafer transport mechanism 14 is arranged between a plurality of probes 10 two-dimensionally arranged in the XY direction and a predetermined storage location 50 (see FIG. Figure 1 ) between the plurality of detectors 10. Specifically, the wafer transport mechanism 14 carries the cassette CS containing the plurality of semiconductor wafers W before inspection into the detector 10 and retrieves (also referred to as carries out) the cassette CS containing the plurality of semiconductor wafers W after inspection from the detector 10 for each of the plurality of detectors 10.

[0111] The wafer transport mechanism 14 includes multiple transport rails 52 and multiple ceiling-mounted automated guided vehicles (OHTs) 54. Each transport rail 52 extends in the X direction and is arranged in a plurality along the Y direction in the ceiling of a semiconductor manufacturing process (not shown). Specifically, a transport rail 52 is provided for each row of probes 10 arranged in the X direction. More specifically, the transport rail 52 is provided on the ceiling so as to intersect the loader 21 of each probe 10 within each row, when viewed from above in the Z direction.

[0112] One end of each transport rail 52 is connected to a storage location 50. This storage location 50 stores a plurality of cassettes CS containing a plurality of semiconductor wafers W before inspection, and also stores a plurality of probe cards 30 of various types corresponding to the types of semiconductor chips on the semiconductor wafers W. It should be noted that the storage location 50 storing the cassettes CS and the storage location 50 storing the probe cards 30 may be located in different locations.

[0113] An OHT 54 is provided for each transport rail 52 and travels along the transport rail 52. Therefore, each OHT 54 is movable in the X direction. Thus, the OHT 54 can be moved for each row of probes 10 to a position directly above (or substantially directly above) the loader 21 of each probe 10 within the row. Furthermore, each OHT 54 includes a lifting and holding portion 54a that is movable in the Z direction (vertical direction) and can be adjusted in the Y direction.

[0114] The lifting holding portion 54 a releasably holds the cassette CS storing the plurality of semiconductor wafers W when the cassette CS is placed on or retrieved from the loader 21 .

[0115] When placing the cassette CS on the loader 21, after the OHT 54 moves to the storage area 50, it lowers the lifting and holding unit 54a, allowing the lifting and holding unit 54a to hold the cassette CS. Next, the OHT 54 raises the lifting and holding unit 54a holding the cassette CS and moves it to a position directly above the loader 21 of the prober 10, designated by the GEM main unit 16 (described later). After lowering the lifting and holding unit 54a to place the cassette CS on the loader 21, the OHT 54 releases the lifting and holding unit 54a from holding the cassette CS. This allows the cassette CS, i.e., the plurality of semiconductor wafers W before inspection, to be transported from the storage area 50 to the loader 21.

[0116] When retrieving the cassette CS from the loader 21, the OHT 54 moves to a position directly above the loader 21 of the probe 10 to be retrieved. The OHT 54 then lowers the lifting and holding unit 54a, allowing the lifting and holding unit 54a to hold the cassette CS placed on the loader 21. The OHT 54 then raises the lifting and holding unit 54a holding the cassette CS and transports it to the storage location 50. After lowering the lifting and holding unit 54a to the storage location 50, the OHT 54 releases the lifting and holding unit 54a from holding the cassette CS. This allows the cassette CS, i.e., the plurality of inspected semiconductor wafers W, to be transported from the loader 21 to the storage location 50.

[0117] Such a wafer transport mechanism 14 is used not only for loading and retrieving the cassette CS but also for replacing the probe cards 30. Specifically, the wafer transport mechanism 14 performs a recovery process for each of the multiple probers 10, recovering the probe card 30 before replacement from the tray 42 that has been transported to the replacement position after separation and transporting it to the storage area 50, and a loading process for transferring a new probe card 30 from the storage area 50 to the tray 42 located at the replacement position before assembly. At this time, each prober 10 adjusts the center position of the loader 21 and the replacement position of the tray 42 to enable the recovery and loading of the probe card 30 by the wafer transport mechanism 14.

[0118] Figure 15 This is an explanatory diagram for explaining the conditions under which the recovery process and the loading process of the probe card 30 can be realized by the wafer transport mechanism 14. It should be noted that one prober 10 is used as an example for the explanation.

[0119] As mentioned above, the OHT 54 moves along the transport rail 52 and is therefore free to move in the X direction. On the other hand, the lifting and holding portion 54a of the OHT 54 can be adjusted in the Y direction, but its movable range ΔY is limited (for example, about ten or so mm). In addition, when each detector 10 is set in the semiconductor manufacturing process, there is a possibility of setting errors in the XY direction. Therefore, if Figure 15 As shown, in order to enable the recovery and loading processing of the probe card 30 by the chip transport mechanism 14, it is necessary to arrange the center position C1 of the loading device 21 of each probe 10 in the above-mentioned column and the center position C2 of the tray 42 (holder holding hole 44) set at the replacement position in a roughly straight line along the X direction.

[0120] Therefore, in this embodiment, the center position C1 and center position C2 of each probe 10 are adjusted, and the installation position of each probe 10 is adjusted, so that the center position C1 of each probe 10 is within the movable range ΔY in the Y direction of the cassette CS held by the lifting and holding portion 54a, and the center position C2 of each probe 10 is within the movable range ΔY in the Y direction of the probe card 30 held by the lifting and holding portion 54a. As a result, the lifting and holding portion 54a can place the cassette CS on the loader 21 and the probe card 30 at the replacement position within its movable range in the Y direction. It should be noted that the higher the installation position accuracy of each probe 10, that is, the higher the position accuracy of the center position C1, the larger the difference A between the center position C1 and the center position C2 can be. Conversely, the lower the position accuracy of the center position C1, the smaller the difference A needs to be.

[0121] In this way, for each row of probers 10, the center positions C1 and C2 of each probe 10 within the row are arranged on a substantially coherent line in the X direction. This allows the lifting and holding portion 54a of the OHT 54 to be adjusted to a position directly above the center position C2. Consequently, the lifting and holding portion 54a can be lowered to hold the held portion 30b of the probe card 30. This allows the OHT 54 to retrieve a previously replaced probe card 30 from the card holder 28 on the tray 42 or to place a new probe card 30 in the card holding hole 38 of the card holder 28 on the tray 42. Consequently, the wafer transport mechanism 14 can perform both the retrieval and loading of the probe card 30.

[0122] It should be noted that in this embodiment, in order to use the lifting and holding portion 54a of the OHT 54 for replacing (retrieving and placing) the cassette CS to hold the probe card 30, the held portion 30b of the probe card 30 is adjusted to a shape and configuration that can be held by the lifting and holding portion 54a. For example, the held portion 30b of the probe card 30 can also be shared with the held portion of the cassette CS (not shown).

[0123] [Detector control unit]

[0124] Figure 16 FIG is a functional block diagram of the detector control unit 58 and the GEM host 16 of the detector 10. Figure 16 As shown, the probe 10 is provided with a probe control unit 58 in addition to the above-mentioned components.

[0125] The detector control unit 58 comprehensively controls the operation of the detector 10 under the control of the GEM host 16 (described later). It includes a computing circuit composed of various processors and memories. These processors include CPUs (Central Processing Units), GPUs (Graphics Processing Units), ASICs (Application Specific Integrated Circuits), and programmable logic devices (such as SPLDs (Simple Programmable Logic Devices), CPLDs (Complex Programmable Logic Devices), and FPGAs (Field Programmable Gate Arrays). It should be noted that the various functions of the detector control unit 58 can be implemented by a single processor or by multiple processors of the same or different types.

[0126] The tester 11, the suction cup moving mechanism 24, the card transport mechanism 32, the holder sensor 46, the card sensor 48, and the door opening and closing mechanism 49 are connected to the probe control unit 58. Furthermore, the laser scanner 12 is connected via a connection interface (not shown). Furthermore, the probe control unit 58 is connected to the GEM host 16 via a communication interface (not shown) and the network 18.

[0127] The probe control unit 58 executes a control program read from a storage unit (not shown) to function as a transmission and reception control unit 60 , an inspection control unit 62 , a separation control unit 64 , a mounting control unit 66 , a scanner control unit 68 , and a door opening and closing control unit 70 .

[0128] When the probe card 30 is replaced, the transceiver control unit 60 exchanges various information with the GEM host 16 via the network 18. For example, before the start of the separation process, the transceiver control unit 60 receives a "replacement instruction" for the probe card 30 from the GEM host 16. Furthermore, after the separation process is completed, the transceiver control unit 60 sends a "replacement preparation completion notification" to the GEM host 16. Furthermore, after the OHT 54 completes the loading process, the transceiver control unit 60 receives an "assembly process start instruction" from the GEM host 16.

[0129] In addition, after the door 35 is switched to the closed state during the assembly process, the transmission and reception control unit 60 transmits the "read information" of the probe card 30 obtained by reading the information of the probe card 30 to the GEM host 16 (refer to Figure 31 ). In addition, the transceiver control unit 60 receives the "authentication result" of the probe card 30 sent from the GEM host 16 in response to the transmission of the "read information". Furthermore, the transceiver control unit 60 sends a "replacement completion notification" of the probe card 30 to the GEM host 16 after the assembly process is completed.

[0130] Furthermore, during the loading process of the probe card 30 (particularly during the raising and lowering of the raising and lowering holding portion 54a), the transmission and reception control unit 60 outputs the sensor output values ​​of both the holder sensor 46 and the card sensor 48 to the GEM host 16. It should be noted that the output of each sensor output value to the GEM host 16 may be performed at all times.

[0131] Furthermore, while the laser scanner 12 is operating, the transceiver control unit 60 transmits the detection signal output from the laser scanner 12 to the GEM host 16 via the network 18. It should be noted that the transceiver control unit 60 also exchanges various information (e.g., inspection instructions for semiconductor wafers W) with the GEM host 16 at times other than when the probe card 30 is replaced. However, this is a well-known technique, and therefore a detailed description thereof will be omitted here.

[0132] Under the control of the GEM host 16, the inspection control unit 62 controls the tester 11 and the suction cup moving mechanism 24 to perform the alignment of the semiconductor wafer W held on the suction cup 22 and the probe 30a, the contact of the probe 30a with the semiconductor chip of the semiconductor wafer W, and the test performed by the tester 11.

[0133] The separation control unit 64 controls the suction cup moving mechanism 24, the connecting unit 36, the card transport mechanism 32 and the card holding unit 26 under the control of the GEM host 16 to execute the above-mentioned Figure 7 as well as Figure 8 After the separation process is completed, the separation control unit 64 transmits a "Replacement Preparation Completion Notification" from the transmission and reception control unit 60 to the GEM host 16 via the network 18 .

[0134] The assembly control unit 66 controls the suction cup moving mechanism 24, the connecting unit 36, the card transport mechanism 32 and the card holding unit 26 under the control of the GEM host 16 to execute the above-mentioned Figure 9 as well as Figure 10 The assembly process shown in FIG. Furthermore, the assembly control unit 66 reads information from the probe card 30 using a known method during the assembly process and transmits the "read information" from the transceiver control unit 60 to the GEM host 16 via the network 18. Furthermore, after the assembly process is completed, the assembly control unit 66 transmits a "replacement completion notification" from the transceiver control unit 60 to the GEM host 16 via the network 18.

[0135] The scanner control unit 68 continuously detects the presence of a person H entering the protection area PA and the warning area WA using the laser scanner 12 from the time the door opening / closing mechanism 49 switches the door 35 to an open state during the separation process until the time the door opening / closing mechanism 49 switches the door 35 to a closed state during the assembly process. It should be noted that the laser scanner 12 may also be constantly performing detection.

[0136] The door opening and closing control unit 70 drives the door opening and closing mechanism 49 to switch the door 35 from a closed state to an open state when the tray 42 in the process of separation is conveyed to the front of the door 35. Furthermore, the door opening and closing control unit 70 drives the door opening and closing mechanism 49 to switch the door 35 from an open state to a closed state when the tray 42 in the process of assembly is stored in the housing 34.

[0137] While the door 35 is being opened and closed by the door opening and closing mechanism 49, the door opening and closing control unit 70 receives a detection signal from the laser scanner 12. Furthermore, based on the detection results of the laser scanner 12, the door opening and closing control unit 70 stops driving the door opening and closing mechanism 49 if a person H enters the protection area PA. This allows the door 35 to stop opening and closing before the door 35 strikes a person or pinches a hand (fingers).

[0138] Furthermore, the door opening and closing control unit 70 continues to stop driving the door opening and closing mechanism 49 while the person H intrudes into the protection area PA. Furthermore, based on the detection result of the laser scanner 12, the door opening and closing control unit 70 restarts driving the door opening and closing mechanism 49 in response to a switch from intrusion of the person H into the protection area PA to no intrusion of the person H into the protection area PA.

[0139] [GEM host]

[0140] The GEM host 16 comprehensively controls the operations of the multiple detectors 10 and the multiple OHTs 54 and includes a computing circuit composed of various processors, memories, and the like. It should be noted that the various functions of the GEM host 16 can be implemented by a single processor or by multiple processors of the same or different types. Furthermore, any control device other than the GEM host 16 can be used as long as it can comprehensively control the operations of the multiple detectors 10 and the multiple OHTs 54.

[0141] The GEM host 16 executes a control program read from a storage unit (not shown) to function as an inspection start control unit 80 , a separation process start control unit 82 , a collection control unit 84 , a loading control unit 86 , an assembly process start control unit 88 , and an authentication control unit 90 .

[0142] After the cassette CS is transported from the storage location 50 to the loader 21 of the prober 10 by the OHT 54, the inspection start control unit 80 outputs an inspection instruction for the semiconductor wafer W to the prober 10 via the network 18. This inspection instruction is input to the inspection control unit 62 via the transceiver control unit 60. The inspection control unit 62 then controls the tester 11 and the chuck moving mechanism 24 to perform a test on the semiconductor chips on the semiconductor wafer W.

[0143] At a predetermined replacement timing for the probe card 30, the separation process start control unit 82 outputs a probe card 30 replacement instruction to the transceiver control unit 60 of the prober 10 via the network 18. This replacement instruction is input to the separation control unit 64 and the door opening and closing control unit 70 via the transceiver control unit 60. Consequently, the separation control unit 64 controls the suction cup moving mechanism 24, the coupling unit 36, the card transport mechanism 32, and the card holding unit 26 to execute the separation process. Upon completion of the separation process, the transceiver control unit 60 transmits a "Replacement Preparation Completion Notification" to the GEM host 16. Furthermore, the door opening and closing control unit 70 drives the door opening and closing mechanism 49 during the separation process to open the door 35.

[0144] It should be noted that as examples of the timing for replacing the probe card 30, the timing for switching the type of semiconductor chip of the semiconductor wafer W to be inspected, the situation where the probe card 30 has been used more than a specified number of times, and the situation where the operator manually inputs a replacement instruction for the probe card 30 to the GEM host 16 are given.

[0145] The recovery control unit 84 and the carry-in control unit 86 constitute a transport control unit of the present invention, and control the OHT 54 of the wafer transport mechanism 14 to transport the probe card 30 between the replacement position and the storage location 50 .

[0146] When the "replacement preparation completion notification" is input from the transceiver control unit 60 via the network 18, the collection control unit 84 controls the OHT 54 to start the collection process. Specifically, the collection control unit 84 sequentially executes the following steps: moving the OHT 54 to a position directly above the replacement position; lowering the lift holder 54a to the replacement position; holding the probe card 30 by the lift holder 54a; raising the lift holder 54a; and transporting the probe card 30 to the storage location 50 by the OHT 54.

[0147] After the recovery process is completed, the carry-in control unit 86 controls the OHT 54 to start the carry-in process. Specifically, the carry-in control unit 86 first executes a process of transporting the probe card 30 corresponding to the semiconductor wafer W to be inspected from the storage location 50 to a position directly above the replacement position by the OHT 54.

[0148] Next, the carry-in control unit 86 lowers the lift and holder 54a to the replacement position (tray 42) and releases the probe card 30 from the lift and holder 54a based on the sensor output value of the card sensor 48 received from the transceiver control unit 60 via the network 18. In this case, the carry-in control unit 86 continues the lowering process until the sensor output value of the card sensor 48 changes, that is, until the card sensor 48 is pressed by the probe card 30, and then releases the hold in accordance with the change in the sensor output value. Next, the carry-in control unit 86 raises the lift and holder 54a.

[0149] It should be noted that the collection control unit 84 and the carry-in control unit 86, based on the detection signal of the laser scanner 12 input from the transmission and reception control unit 60 via the network 18, stop driving the OHT 54, particularly the raising and lowering of the lifting and holding unit 54a, when a person H intrudes into the protection area PA. Furthermore, the collection control unit 84 and the carry-in control unit 86 stop driving the OHT 54 while the person H intrudes into the protection area PA continues, and resume driving the OHT 54 when the state of the person H intruding into the protection area PA switches to a state of no person H intruding into the protection area PA.

[0150] After the loading process is completed, the assembly process start control unit 88 outputs a start instruction for the probe card 30 assembly process to the prober 10. This start instruction is input to the assembly control unit 66 and the door opening and closing control unit 70 via the transceiver control unit 60. The assembly control unit 66 then controls the suction cup moving mechanism 24, the coupling unit 36, the card transport mechanism 32, and the card holding unit 26 to execute the assembly process. Furthermore, the transceiver control unit 60 transmits a "read information" and a "replacement completion notification" to the GEM host 16. Furthermore, the door opening and closing control unit 70 drives the door opening and closing mechanism 49 during the assembly process to close the door 35.

[0151] When the "read information" of the probe card 30 is input from the transceiver control unit 60 via the network 18 during the assembly process, the authentication control unit 90 authenticates the probe card 30 using a known method and transmits the authentication result to the transceiver control unit 60 via the network 18. The authentication result is input to the assembly control unit 66 via the transceiver control unit 60. Thus, the assembly control unit 66 continues the assembly process if the authentication result is appropriate, and stops the assembly process if the authentication result is not appropriate.

[0152] [The role of the wafer test system]

[0153] Figure 17 1 is a flow chart showing the process of replacing the probe card 30 of the prober 10 by the wafer test system 2 having the above structure (equivalent to the probe card replacement method of the present invention). Figure 17 As shown, when the probe card 30 of the probe 10 is replaced, under the control of the GEM host 16, separation processing (step S1, equivalent to the separation step), recovery processing (step S2, equivalent to the recovery step), moving-in processing (step S3, equivalent to the moving-in step) and assembly processing (step S4, equivalent to the assembly step) are performed in sequence for each probe 10.

[0154] <Separation Processing>

[0155] Figures 18 to 23 Is used to illustrate Figure 17 FIG. 1 is an explanatory diagram of the separation process of step S1. Figure 18 As shown, the separation process start control unit 82 outputs a probe card 30 replacement instruction T1 to the prober 10 via the network 18 at a predetermined replacement timing of the probe card 30. The replacement instruction T1 is input to the separation control unit 64 and the door opening and closing control unit 70 via the transceiver control unit 60 of the prober 10.

[0156] like Figure 19As shown, the separation control unit 64 receives the replacement instruction T1 and controls the suction cup moving mechanism 24, the connecting unit 36, the card transport mechanism 32 and the card holding unit 26 to start the separation process. Figure 7 as well as Figure 8 As shown, after the probe card 30 and the card holder 28 located at the holding position are held by the tray 42 , the tray 42 is conveyed to the front of the door 35 by the suction cup moving mechanism 24 .

[0157] On the other hand, Figure 20 As shown, upon receiving the replacement instruction T1, the door opening / closing control unit 70 activates the door opening / closing mechanism 49 when the tray 42 is brought to the door 35 by the suction cup moving mechanism 24, thereby switching the door 35 from a closed state to an open state. Furthermore, in response to the start of this switching, the scanner control unit 68 begins detection by the laser scanner 12, specifically, detecting the presence of a person H entering the protected area PA. The detection results of the laser scanner 12 are continuously input to the door opening / closing control unit 70 and are also continuously input to the GEM host 16 via the transmission / reception control unit 60 and the network 18.

[0158] like Figure 21 As shown, the door opening and closing control unit 70 stops driving the door opening and closing mechanism 49 while the person H enters the protection area PA based on the detection result of the laser scanner 12. This prevents the door 35 from hitting the person H. Figure 22 As shown, the door opening and closing control unit 70, based on the detection results of the laser scanner 12, restarts the driving of the door opening and closing mechanism 49 when the intrusion of a person H into the protection area PA is switched to the intrusion of no person H into the protection area PA. This can reduce the operator's time and effort in the restart operation.

[0159] like Figure 23 As shown, when the door 35 is switched to the open state, the transport of the tray 42 by the suction cup moving mechanism 24 is started again, and the suction cup moving mechanism 24 transports the tray 42 to the replacement position. As a result, the probe card 30 held by the card holder 28 on the tray 42 is also transported to the replacement position. After the transport is completed, the separation control unit 64 sends a replacement preparation completion notification T2 from the transceiver control unit 60 to the GEM host 16 via the network 18. With the above content, the separation process of step S1 is completed. It should be noted that after the separation process is completed, the transceiver control unit 60 continuously outputs the sensor output values ​​of the card sensor 48 and the like to the GEM host 16 via the network 18.

[0160] <Recycling>

[0161] Figures 24 and 25 Is used to illustrate Figure 17 FIG. 1 is an explanatory diagram of the recycling process in step S2. Figure 24 As shown, when the replacement preparation completion notification T2 is input via the network 18, the recovery control unit 84 of the GEM host 16 controls the OHT 54 of the wafer transport mechanism 14 to sequentially execute the process of moving the OHT 54 to a position directly above the replacement position of the prober 10, lowering the lifting and holding unit 54a to the replacement position, and holding the held portion 30b of the probe card 30 by the lifting and holding unit 54a. Figure 25 As shown, the collection control unit 84 controls the OHT 54 to sequentially perform a process of raising the lifting and lowering holding unit 54 a holding the probe card 30 and a process of transporting the probe card 30 to the storage location 50 by the OHT 54 .

[0162] It should be noted that, based on the detection results of the laser scanner 12 input from the transceiver control unit 60 via the network 18 during the execution of the above-described processes, the recovery control unit 84 stops driving the OHT 54, particularly the lifting and lowering of the lifting and holding unit 54a, if a person H intrudes into the protected area PA. This prevents the lifting and holding unit 54a from colliding with the person H. Furthermore, based on the detection results of the laser scanner 12, the recovery control unit 84 resumes driving the OHT 54 if the situation switches from a person H intruding into the protected area PA to no person H intruding into the protected area PA. This reduces the operator's effort in resuming operations. With the above, the recovery process of step S2 is completed.

[0163] <Move-in Processing>

[0164] Figures 26 to 28 Is used to illustrate Figure 17 FIG. 1 is an explanatory diagram of the loading process of step S3 shown in FIG. Figure 26 As shown, when the recycling process is completed, the loading control unit 86 of the GEM host 16 controls OHT54 to move OHT54 to the storage place 50, and then after holding the new probe card 30 corresponding to the semiconductor chip W to be inspected by the lifting and holding part 54a, moves OHT54 to a position directly above the replacement position.

[0165] Next, if Figure 27 As shown, the loading control unit 86 lowers the lifting and holding unit 54a holding the probe card 30. At this time, the loading control unit 86 continues the lowering process of the lifting and holding unit 54a based on the sensor output value of each card sensor 48 input via the network 18 until the sensor output value changes, that is, each card sensor 48 is pressed by the probe card 30. As mentioned above, in the card holder 28 on the tray 42, a plurality of positioning parts 40 are provided around the card holding hole 38 (see Figure 3 as well as Figure 4Therefore, even if the XY position of the lifting and holding portion 54 a is offset (for example, ±2 mm), the probe card 30 is guided into the card holding hole 38 by the guide surfaces 40 a of the positioning portions 40 , and the probe card 30 is held by the card holder 28 .

[0166] When the probe card 30 is held by the card holder 28, as described above, the sensor output value of each card sensor 48 changes, so that the carry-in control unit 86 determines that the probe card 30 is switched from not being held on the card holder 28 (tray 42) to being held on the card holder 28 (tray 42). Then, the carry-in control unit 86 stops the lowering process of the lifting and holding unit 54a, and releases the holding of the probe card 30 (held portion 30b) by the lifting and holding unit 54a. Thus, the new probe card 30 is transported from the storage place 50 to the replacement position. Next, as Figure 28 As shown, the carrying-in control unit 86 raises the lifting and holding unit 54a.

[0167] It should be noted that, based on the detection results of the laser scanner 12 input from the transmission and reception control unit 60 via the network 18 during the carry-in process, the carry-in control unit 86 stops driving the OHT 54 while the person H enters the protection area PA, similar to the recovery process described above. It then resumes driving the OHT 54 as the person H exits the protection area PA. This prevents the lifting and holding unit 54a from colliding with the person H. With the above, the carry-in process of step S3 is completed.

[0168] <Assembly Processing>

[0169] Figures 29 to 34 Is used to illustrate Figure 17 FIG. 1 is an explanatory diagram of the assembly process of step S4 shown in FIG. Figure 29 As shown, when the loading process is completed, the mounting process start control unit 88 outputs a mounting instruction T3 of the probe card 30 to the prober 10 via the network 18. The mounting instruction T3 is input to the mounting control unit 66 and the door opening and closing control unit 70 via the transceiver control unit 60 of the prober 10.

[0170] Then, the assembly control unit 66 receives the assembly instruction T3 and controls the suction cup moving mechanism 24, the connecting unit 36, the card transport mechanism 32 and the card holding unit 26 to start the assembly process. Figure 9 As shown, the tray 42 is transported toward the holding position by the suction cup moving mechanism 24 and the card transport mechanism 32 .

[0171] On the other hand, Figure 30As shown, upon receiving the assembly instruction T3, the door opening and closing control unit 70 activates the door opening and closing mechanism 49 to switch the door 35 from an open state to a closed state when the tray 42, which has been transported toward the holding position, is stored within the housing 34. At this point, based on the detection results of the laser scanner 12, the door opening and closing control unit 70 stops driving the door opening and closing mechanism 49 while the person H is within the protected area PA. This prevents the door 35 from striking the person H or pinching their hands or fingers.

[0172] like Figure 31 As shown, after the door 35 is switched to the closed state (or before the switch), the assembly control unit 66 reads the information of the probe card 30 held by the card holder 28 on the tray 42, and transmits the read information T4 from the transceiver control unit 60 to the authentication control unit 90 of the GEM host 16 via the network 18. Then, the authentication control unit 90 authenticates the probe card 30 based on the read information T4 input via the network 18, and transmits the authentication result T5 to the assembly control unit 66 via the network 18 and the transceiver control unit 60. The assembly control unit 66, which receives the authentication result T5, continues the assembly process if the authentication result T5 is appropriate, and stops the assembly process if the authentication result T5 is not appropriate.

[0173] When the authentication of the probe card 30 is completed, the scanner control unit 68 ends the detection by the laser scanner 12 .

[0174] like Figure 32 As shown, when the assembly process continues, as described Figure 9 As shown, after the tray 42 is transported to the holding position by the chuck moving mechanism 24 and the card transport mechanism 32, the card holder 28 is held by the card holding portion 26. Thus, the transport of the probe card 30 to the holding position is completed, and a new probe card 30 is mounted on the card holding portion 26.

[0175] like Figure 33 As shown, when the new probe card 30 is assembled to the card holding portion 26, as described above, Figure 10 As shown, after the tray 42 is lowered by the card transporting mechanism 32, the suction cup 22 is moved by the suction cup moving mechanism 24, the card transporting mechanism 32 is switched to the inverted state of the tray 42, and the connection between the suction cup 22 and the card transporting mechanism 32 is released, the suction cup 22 is moved to the inspection position Y1 by the suction cup moving mechanism 24.

[0176] like Figure 34 As shown, when the movement of the suction pad 22 to the inspection position Y1 is completed, the assembly control unit 66 transmits a replacement completion notification from the transmission and reception control unit 60 to the GEM host 16 via the network 18. With the above, the assembly process of step S4 is completed.

[0177] As described above, in this embodiment, the OHT 54 of the wafer transport mechanism 14 that loads and retrieves the cassette CS (semiconductor wafer W) of the prober 10 is used in the semiconductor manufacturing process to carry in and retrieve the probe card 30 of the prober 10, thereby eliminating the need to install new equipment in the semiconductor manufacturing process for retrieving and carrying in the probe card 30. As a result, it is possible to reduce the increase in installation space within the semiconductor manufacturing process and automate the replacement of the probe card 30 at a low cost.

[0178] [other]

[0179] In the above embodiment, the case where the separation process is started in the state where the card holding portion 26 holds the card holder 28 and the probe card 30 is taken as an example for explanation, but there is also a case where the separation process is started in the state where the card holding portion 26 does not hold the card holder 28 and the probe card 30. In the separation process (step S1) in this case, Figure 7 The state shown by the reference numeral 7C is Figure 8 Then, the state shown by the reference numeral 8C is transferred. Then, the collection process (step S2) is omitted, and the carrying process (step S3) and the assembly process (step S4) are sequentially performed.

[0180] In the above embodiment, a plurality of probers 10 are provided in the wafer testing system 2 , but the number of probers 10 may be one.

[0181] In the above embodiment, when person H intrudes into the protection area PA, the opening and closing of the door 35 and the driving of the OHT54 are stopped, but for example, a warning (warning sound, warning display, etc.) can also be implemented to person H at the time when the intrusion of person H into the warning area WA occurs based on the detection result of the laser scanner 12.

[0182] In the above embodiment, the laser scanner 12 is used to detect the intrusion of a person H into the protection area PA and the warning area WA, but for example, the intrusion of a person H into the protection area PA, etc. can also be detected by image analysis of images captured by a surveillance camera, or various well-known human detection sensors can be used.

[0183] In the above embodiment, OHT54 is used as an example to illustrate the chip transport mechanism 14, but various well-known chip transport mechanisms such as an automated guided vehicle (AGV) that can transport a cassette CS (or only semiconductor chips W) and an over-head shuttle (OHS) can also be used.

[0184] In the above embodiment, the probe card 30 is transported between the storage location 50 and the replacement position using a chip transport mechanism 14 for loading and recovering the cassette CS (semiconductor chip W), but the probe card 30 can also be transported between the storage location 50 and the replacement position using a transport mechanism separately provided in addition to the chip transport mechanism 14.

[0185] Description of Reference Numerals

[0186] 2-wafer test system

[0187] 10 detectors

[0188] 11 Tester

[0189] 12 laser scanners

[0190] 14 Wafer transport mechanism

[0191] 16GEM host

[0192] 18 Network

[0193] 20 bases

[0194] 21 Loading equipment

[0195] 22 suction cups

[0196] 24 suction cup moving mechanism

[0197] 26 card holding part

[0198] 28 card holders

[0199] 30 probe cards

[0200] 30a probe

[0201] 30b held portion

[0202] 32 card transport mechanism

[0203] 34 shell

[0204] 34a opening

[0205] 35 doors

[0206] 36 connection part

[0207] 38 card holding holes

[0208] 40 positioning part

[0209] 40a guide surface

[0210] 42 pallets

[0211] 44 retaining hole

[0212] 46 holding parts sensor

[0213] 48 card sensor

[0214] 49 door opening and closing mechanism

[0215] 50 storage places

[0216] 52 transport track

[0217] 54a lifting and holding part

[0218] 58 detector control unit

[0219] 60 Transceiver Control Unit

[0220] 62 Inspection and Control Department

[0221] 64 Separation Control Unit

[0222] 66 Assembly Control Department

[0223] 68 Scanner Control Unit

[0224] 70 Door opening and closing control unit

[0225] 80 Check start control unit

[0226] 82 Separation process start control unit

[0227] 84 Recycling Control Department

[0228] 86 Move into the Control Department

[0229] 88 Assembly process start control unit

[0230] 90 Certification Control Department

[0231] A difference

[0232] C1 Central Location

[0233] C2 Central Location

[0234] CS Box

[0235] H people

[0236] PA protected area

[0237] T1 replacement indication

[0238] T2 Replacement preparation completion notification T3 Assembly instruction T4 Read information T5 Authentication result W Semiconductor wafer WA Warning area Y0 Assembly position Y1 Inspection position Y2 Tray switching position Y3 Connection position

[0239] △Y movable range.

Claims

1. A wafer testing system, wherein: The wafer testing system comprises: a prober including a chuck for holding a semiconductor wafer and a probe card having probes, and inspecting the semiconductor chips by bringing the probes into contact with a plurality of semiconductor chips formed on the semiconductor wafer; a ceiling-mounted automated guided vehicle that moves along a transport track while holding a cassette containing the plurality of semiconductor wafers before inspection, and carries the cassette containing the plurality of semiconductor wafers before inspection into the detector and retrieves the cassette containing the plurality of semiconductor wafers after inspection from the detector; a transport control unit that controls the ceiling-traveling automated guided vehicle to transport the probe card between a probe card replacement position preset in the probe and a probe card storage location located outside the probe; a card transport mechanism provided in the probe and configured to transport the probe card between a holding position where the probe card is held in the probe and the replacement position; a separation control unit that controls the card transport mechanism to perform a separation process of transporting the probe card before replacement from the holding position to the replacement position; as well as an assembly control unit that controls the card transport mechanism to perform an assembly process of transporting the new probe card from the replacement position to the holding position, The detector has: a housing for accommodating the suction cup, the probe card, and the card transport mechanism; an opening formed in the housing and exposing the replacement position to the outside of the housing; a door capable of switching between an open state in which the opening is opened and a closed state in which the opening is covered; a door opening and closing mechanism for switching the door between the open state and the closed state; and A door opening and closing control unit drives the door opening and closing mechanism to switch the door from the closed state to the open state in the separation process, and drives the door opening and closing mechanism to switch the door from the open state to the closed state in the assembly process.

2. The wafer testing system according to claim 1, wherein: The wafer testing system includes a human detection sensor for detecting whether a person has entered a protection area that is predetermined based on the position of the door. The door opening and closing control unit stops driving of the door opening and closing mechanism while a person has intruded into the protection area based on a detection result of the person detection sensor.

3. The wafer testing system according to claim 2, wherein: When the door opening and closing control unit stops driving the door opening and closing mechanism midway, the door opening and closing control unit restarts driving the door opening and closing mechanism in response to the detection result of the human detection sensor switching from a person intruding into the protection area to no person intruding into the protection area.

4. The wafer testing system according to any one of claims 1 to 3, wherein: The wafer test system includes a card holding portion for holding the probe card at the holding position in a detachable manner. The card transport mechanism includes a tray capable of holding the probe card and transports the tray between the holding position and the replacement position. The separation control unit sequentially performs, as the separation process, a process of driving the card transport mechanism to transport the tray to the holding position, a process of releasing the probe card held by the card holding unit to allow the tray to hold the probe card, and a process of driving the card transport mechanism to transport the tray from the holding position to the replacement position. When the tray at the replacement position holds the new probe card, the assembly control unit sequentially executes, as the assembly process, a process of driving the card transport mechanism to transport the tray from the replacement position to the holding position and a process of holding the probe card using the card holding unit.

5. The wafer testing system according to any one of claims 1 to 3, wherein: The prober includes a card holder for holding the probe card. The card transport mechanism transports the probe card and the card holder integrally between the holding position and the replacement position.

6. The wafer testing system according to claim 5, wherein: The card holder has a card holding hole for holding the probe card. The ceiling-traveling automated guided vehicle places the probe card on the card holding hole of the card holder located at the replacement position. The wafer testing system includes a plurality of positioning portions provided at an opening edge portion of the card holder forming the card holding hole. The plurality of positioning portions include guide surfaces for guiding the probe card toward the card holding hole when the probe card is mounted on the card holding hole by the ceiling-traveling automated guided vehicle.

7. The wafer testing system according to any one of claims 1 to 3, wherein: The transport control unit controls the ceiling-traveling unmanned guided vehicle to perform a recovery process of transporting the probe card before replacement of the probe from the replacement position to the storage location and a loading process of transporting the new probe card from the storage location to the replacement position. The wafer testing system includes a human detection sensor for detecting whether a person has entered a protection area that is preset based on the replacement position. The transport control unit stops the collection process based on the detection result of the human detection sensor while a human is intruding into the protection area. The transport control unit stops the carry-in process while a person is intruding into the protection area based on the detection result of the person detection sensor.

8. The wafer testing system according to any one of claims 1 to 3, wherein: The transport control unit controls the ceiling-traveling unmanned guided vehicle to perform a recovery process of transporting the probe card before replacement of the probe from the replacement position to the storage location and a loading process of transporting the new probe card from the storage location to the replacement position. The ceiling-traveling automated guided vehicle includes a lifting and holding portion that is capable of being raised and lowered and that holds the cassette or the probe card in a detachable manner. The transport control unit performs, as the recovery process, a process of moving the ceiling-traveling automated guided vehicle to a position directly above the replacement position, a process of lowering the lifting and holding unit to the replacement position, a process of holding the probe card located at the replacement position by the lifting and holding unit, a process of raising the lifting and holding unit, and a process of moving the ceiling-traveling automated guided vehicle from the position directly above the replacement position to the storage location. The transport control unit performs the following steps as the carrying-in process: causing the lifting and holding unit to hold the probe card in the storage place; moving the ceiling-traveling unmanned guided vehicle from the storage place to the position directly above; lowering the lifting and holding unit; releasing the probe card from the replacement position by using the lifting and holding unit; and raising the lifting and holding unit.

9. The wafer testing system according to claim 8, wherein: The wafer test system includes a card transport mechanism provided in the prober and configured to transport the probe card between the holding position and the replacement position held in the prober. The card transport mechanism includes a tray capable of holding the probe card and transports the tray between the holding position and the replacement position. The wafer testing system includes a card sensor provided on the tray and configured to detect whether the probe card is present on the tray. The transport control unit performs a process of lowering the lifting and holding unit while the card sensor detects that there is no probe card on the tray, and performs a process of releasing the probe card held by the lifting and holding unit and raising the lifting and holding unit in response to the detection result of the card sensor switching from the absence of the probe card on the tray to the presence of the probe card on the tray.

10. The wafer testing system according to any one of claims 1 to 3, wherein: The transport rail extends in the X direction among the mutually orthogonal XYZ directions. The ceiling-traveling automated guided vehicle includes a lifting and holding portion that is movable in the Z direction and can be adjusted in position within a predetermined movable range in the Y direction. The lifting and holding portion can be used to hold the cassette or the probe card so that it can be loaded and unloaded. The detector includes a loading device that is provided at a position different from the replacement position in the X direction and that uses the ceiling-traveling automated guided vehicle to load the box. The lifting and holding portion can place the magazine on the loader within the movable range of the lifting and holding portion in the Y direction, and can place the probe card at the replacement position.

11. A prober comprising a chuck for holding a semiconductor wafer and a probe card having probes, and inspecting a plurality of semiconductor chips formed on the semiconductor wafer by bringing the probes into contact with the semiconductor chips, wherein: The detector has: a card transport mechanism that transports the probe card between a holding position within the probe and a replacement position for replacing the probe card; A loading device that uses a ceiling-mounted automated guided vehicle to load a cassette containing the plurality of semiconductor wafers. The ceiling-mounted automated guided vehicle is movable along a transport track extending in the X direction of mutually orthogonal X, Y, and Z directions, and includes a lifting and holding portion that is movable in the Z direction and can be adjusted in position within a predetermined movable range in the Y direction. a housing for accommodating the suction cup, the probe card, and the card transport mechanism; an opening formed in the housing and exposing the replacement position to the outside of the housing; a door capable of switching between an open state in which the opening is opened and a closed state in which the opening is covered; a door opening and closing mechanism for switching the door between the open state and the closed state; and a door opening and closing control unit that drives the door opening and closing mechanism to switch the door from the closed state to the open state during a separation process in which the card transport mechanism transports the probe card before replacement from the holding position to the replacement position, and drives the door opening and closing mechanism to switch the door from the open state to the closed state during an assembly process in which the card transport mechanism transports the new probe card from the replacement position to the holding position, In the Y direction, within the movable range of the lifting and holding portion, the lifting and holding portion can be used to place the magazine on the loading device, and the lifting and holding portion can be used to place the probe card on the replacement position. The probe card has a held portion held by the lifting holding portion. The replacement position is a position where the probe card can be replaced by the ceiling-traveling automated guided vehicle.

Images