A wafer transfer method between a transfer chamber and a reaction chamber

Abstract

A wafer transfer method between a transfer chamber and a reaction chamber, comprising: a heating plate ejector pin in the reaction chamber lifting the wafer from the heating plate; rotating the reaction chamber robot to a position for receiving the wafer, wherein a ejector pin assembly is arranged on the reaction chamber robot; the heating plate ejector pin descending so that the wafer falls onto the reaction chamber robot; the transfer chamber robot extending into the reaction chamber to the position for receiving the wafer; the transfer chamber robot lifting the wafer upward to separate the wafer from the reaction chamber robot in the height direction.

Description

Technical Field

[0001] The present invention relates to the field of semiconductor technology, and in particular to a chip transfer method between a transmission cavity and a reaction cavity. Background Art

[0002] The wafer transfer of multi-station semiconductor coating equipment is an important medium for transferring wafers in and out of the front opening device (Foup) and the reaction chamber. The stability and reliability of the wafer transfer will directly affect the stability and reliability of the equipment operation, thereby affecting the equipment's production capacity.

[0003] Traditional multi-station semiconductor coating equipment at least includes a transfer module (TM) and a reaction module (PM). The transfer module uses a lift pin as a transfer part to transfer the wafer to or from the reaction module (PM).

[0004] The traditional reaction chamber (PM) has a heating plate with ejector pins on it. The ejector pins on the heating plate lift the wafer by lifting and lowering, and then the transfer chamber (TM) robot grabs the wafer from the ejector pins on the heating plate of the reaction chamber. However, the reaction chamber robot does not have an ejector pin structure, so the wafer can only be transferred to the reaction chamber or transfer chamber robot through the ejector pins on the heating plate, thereby realizing the wafer transfer of the equipment.

[0005] This film transmission method has many defects. For example, the frequent lifting and lowering of the ejector pin of the heating plate will affect the production capacity on the one hand, and on the other hand, it will reduce the service life of the ejector pin of the heating plate. Summary of the invention

[0006] In order to overcome the above-mentioned defects, the present invention provides a method for transferring films between a transfer chamber and a reaction chamber, the method comprising at least the following steps:

[0007] A heating plate ejector pin located in the reaction chamber lifts the wafer from the heating plate;

[0008] Rotate the reaction chamber robot to a position to receive the wafer, wherein the reaction chamber robot is provided with an ejector pin assembly;

[0009] The ejector pin of the heating plate descends, so that the wafer falls onto the robot arm of the reaction chamber;

[0010] The transfer chamber robot reaches into the reaction chamber to receive the wafer;

[0011] The transfer chamber robot lifts the wafer upwards, so that the wafer is separated from the reaction chamber robot in the height direction.

[0012] In one embodiment, the step of extending the transfer chamber robot to the position in the reaction chamber to receive the wafer further includes: the transfer chamber robot extending into the gap between the reaction chamber robot and the wafer.

[0013] In one embodiment, the height of the gap is determined by the height of the thimble assembly on the transfer chamber robot arm.

[0014] In one embodiment, after the transfer chamber robot arm lifts the wafer upward, the following steps are further included: the transfer chamber robot arm holds the wafer and transports the wafer into the transfer chamber.

[0015] In one embodiment, before the transfer chamber robot arm extends into the reaction chamber to pick up the wafer, the following steps are further included: opening the valve between the transfer chamber and the reaction chamber.

[0016] In one embodiment, the transfer chamber robot arm directly hands over the wafer to the reaction chamber robot arm.

[0017] The present invention also provides a wafer transfer method between a transfer chamber and a reaction chamber, and the method at least includes the following steps:

[0018] The transfer chamber robot arm holds the wafer and transports the wafer from the transfer chamber into the reaction chamber;

[0019] The reaction chamber robot arm rotates to the position to pick up the wafer, wherein a thimble assembly is arranged on the reaction chamber robot arm;

[0020] The transfer chamber robot arm is withdrawn, so that the wafer falls onto the thimble assembly of the reaction chamber robot arm;

[0021] The heating plate thimble rises to pick up the wafer;

[0022] The reaction chamber robot arm is withdrawn, so that the wafer falls onto the heating plate thimble.

[0023] In one embodiment, the step that the reaction chamber robot arm rotates to the position to pick up the wafer further includes: the transfer chamber robot arm is located in the gap between the reaction chamber robot arm and the wafer.

[0024] In one embodiment, the height of the gap is determined by the height of the thimble assembly on the reaction chamber robot arm.

[0025] In one embodiment, after the transfer chamber robot arm is withdrawn, the following steps are further included: closing the valve between the transfer chamber and the reaction chamber.

[0026] In one embodiment, the transfer chamber robot arm directly hands over the wafer to the reaction chamber robot arm.

[0027] In one embodiment, the thimble assembly includes three thimbles, which are arranged at different positions on the reaction chamber robot arm.

[0028] The reaction chamber robot of the present invention is provided with a thimble assembly, enabling the wafer to be naturally separated from the reaction chamber robot. The separation space facilitates the transfer chamber robot to extend to the side of the reaction chamber for wafer exchange. The wafer transfer method of the present invention enables the transfer chamber robot to directly exchange wafers with the reaction chamber robot, greatly reducing the number of frequent lifting and lowering operations of the heating plate thimble, significantly increasing the lifting life of the heating plate thimble. At the same time, due to the reduction in the number of lifting and lowering operations of the heating plate thimble, the production capacity of the equipment is greatly improved. BRIEF DESCRIPTION OF THE DRAWINGS

[0029] The above-described invention content of the present invention and the following specific embodiments will be better understood when read in conjunction with the accompanying drawings. It should be noted that the drawings are only examples of the claimed invention. In the drawings, the same reference numerals represent the same or similar elements.

[0030] Figure 1 Showing a conventional multi-station semiconductor coating equipment;

[0031] Figure 2a Showing the wafer transfer method of a conventional multi-chamber equipment;

[0032] Figure 2b Showing a schematic diagram of a conventional reaction chamber robot;

[0033] Figure 3 Showing a schematic diagram of a reaction chamber robot with a thimble according to an embodiment of the present invention;

[0034] Figure 4 Showing a schematic diagram of Step 1 of the wafer transfer method according to an embodiment of the present invention;

[0035] Figure 5 Showing a schematic diagram of Step 2 of the wafer transfer method according to an embodiment of the present invention;

[0036] Figure 6 Showing a schematic diagram of Step 3 of the wafer transfer method according to an embodiment of the present invention;

[0037] Figure 7 Showing a schematic diagram of Step 4 of the wafer transfer method according to an embodiment of the present invention;

[0038] Figure 8 Showing a schematic diagram of Step 5 of the wafer transfer method according to an embodiment of the present invention;

[0039] Figure 9 Showing a schematic diagram of Step 6 of the wafer transfer method according to an embodiment of the present invention. DETAILED DESCRIPTION OF THE EMBODIMENTS

[0040] The detailed features and advantages of the present invention are described in detail in the following specific embodiments. The content is sufficient for any person skilled in the art to understand the technical content of the present invention and implement it accordingly. According to the specification, claims and drawings disclosed in this specification, those skilled in the art can easily understand the related purposes and advantages of the present invention. Although the description of the present invention will be introduced in conjunction with the preferred embodiments, this does not mean that the features of this invention are limited to this embodiment. On the contrary, the purpose of introducing the invention in conjunction with the embodiment is to cover other alternatives or modifications that may be extended based on the claims of the present invention. In order to provide a deep understanding of the present invention, many specific details will be included in the following description. The present invention can also be implemented without using these details. In addition, in order to avoid confusing or obscuring the key points of the present invention, some specific details will be omitted in the description.

[0041] In the description of the present invention, it should be noted that, unless otherwise clearly specified and defined, the terms "mounted", "connected" and "connected" should be understood in a broad sense. For example, it can be a fixed connection, a detachable connection, or an integral connection; it can be a mechanical connection or an electrical connection; it can be directly connected, or indirectly connected through an intermediate medium, and it can be the communication inside two elements. For those of ordinary skill in the art, the specific meanings of the above terms in the present invention can be understood according to specific situations.

[0042] In addition, the "upper", "lower", "left", "right", "top", "bottom", "horizontal" and "vertical" used in the following description should be understood as the orientations shown in this paragraph and the related drawings. This relative term is only for the convenience of description, and it does not mean that the device described needs to be manufactured or operated in a specific orientation, so it should not be understood as a limitation to the present invention.

[0043] It can be understood that although the terms "first", "second", "third", etc. can be used here to describe various components, channels, components, regions, layers and / or parts, these components, channels, components, regions, layers and / or parts should not be limited by these terms, and these terms are only used to distinguish different components, channels, components, regions, layers and / or parts. In addition, the terms "first", "second", "third" are only used for descriptive purposes and cannot be understood as indicating or implying relative importance.

[0044] As shown in this application and the claims, unless the context clearly indicates an exceptional situation, the words "a", "an", "one" and / or "the" etc. do not specifically refer to the singular, but may also include the plural. Generally speaking, the terms "comprising" and "including" only indicate the inclusion of the clearly identified steps and elements, and these steps and elements do not constitute an exclusive list. The method or device may also include other steps or elements.

[0045] In some embodiments, numbers are used to describe components and the quantity of attributes. It should be understood that such numbers used in the description of embodiments are, in some examples, modified by the modifiers "about", "approximate" or "substantially". Unless otherwise specified, "about", "approximate" or "substantially" indicate that the said numbers allow a variation of ±20%. Accordingly, in some embodiments, the numerical parameters used in the specification and claims are approximate values, and such approximate values may change according to the characteristics required by individual embodiments. In some embodiments, numerical parameters should consider the specified significant digits and adopt the method of retaining the general number of digits. Although the numerical ranges and parameters used in some embodiments of the present application to confirm the breadth of their scope are approximate values, in specific embodiments, such numerical settings are as precise as possible within the feasible range.

[0046] Meanwhile, the present application uses specific terms to describe the embodiments of the present application. Such as "one embodiment", "an embodiment", and / or "some embodiments" mean a certain feature, structure or characteristic related to at least one embodiment of the present application. Therefore, it should be emphasized and noted that the "one embodiment" or "an embodiment" or "an alternative embodiment" mentioned twice or more at different positions in this specification does not necessarily refer to the same embodiment. In addition, certain features, structures or characteristics in one or more embodiments of the present application can be appropriately combined.

[0047] Figure 1 A traditional multi-station semiconductor coating equipment is shown. The multi-station semiconductor coating equipment at least includes a transfer component (TM) 101 and a reaction component (PM) 102. The wafer transfer is realized by using a lift pin as a transfer part to transfer the wafer into or out of the reaction component (PM) 102.

[0048] Figure 2a A schematic diagram of the wafer transfer method of a traditional multi-chamber equipment is shown. A heating plate (not shown) is arranged in the reaction chamber (PM), and a heating plate lift pin 201 is arranged on the heating plate. The lift pin 201 lifts the wafer 203 through a lifting movement, and then the transfer chamber (TM) robot 202 grabs the wafer 203 from the lift pin 201 on the heating plate of the reaction chamber.

[0049] Figure 2b A schematic diagram of a traditional reaction chamber robot is shown. As shown in the figure, the reaction chamber robot does not have a lift pin structure, so the wafer can only be transferred to the reaction chamber or the transfer chamber robot through the lift pin of the heating plate, thereby realizing the wafer transfer of the equipment.

[0050] This kind of wafer transfer method has many defects. For example, the frequent lifting of the lift pin of the heating plate will affect the production capacity on the one hand and reduce the service life of the lift pin of the heating plate on the other hand.

[0051] To overcome the above-mentioned deficiencies, the present invention provides a wafer transfer method between a transfer chamber and a reaction chamber, and the method at least includes the following steps:

[0052] The heating plate ejector pin located in the reaction chamber lifts the wafer from the heating plate;

[0053] Rotate the reaction chamber manipulator to the position for receiving the wafer, wherein a top pin assembly is provided on the reaction chamber manipulator;

[0054] The heating plate ejector pin descends, so that the wafer falls onto the reaction chamber manipulator;

[0055] The transfer chamber manipulator extends into the reaction chamber to the position for receiving the wafer;

[0056] The transfer chamber manipulator lifts the wafer upward, so that the wafer is separated from the reaction chamber manipulator in the height direction.

[0057] In one embodiment, the step of the transfer chamber manipulator extending into the reaction chamber to the position for receiving the wafer further includes: the transfer chamber manipulator extends into the gap between the reaction chamber manipulator and the wafer.

[0058] In one embodiment, the height of the gap is determined by the height of the top pin assembly on the reaction chamber manipulator.

[0059] In one embodiment, after the transfer chamber manipulator lifts the wafer upward, the following steps are further included: the transfer chamber manipulator holds the wafer and transports the wafer into the transfer chamber.

[0060] In one embodiment, before the transfer chamber manipulator extends into the reaction chamber to the position for receiving the wafer, the following steps are further included: opening the valve between the transfer chamber and the reaction chamber.

[0061] In one embodiment, the transfer chamber manipulator directly exchanges the wafer with the reaction chamber manipulator.

[0062] The present invention also provides a wafer transfer method between a transfer chamber and a reaction chamber, and the method at least includes the following steps:

[0063] The transfer chamber manipulator holds the wafer and transports the wafer from the transfer chamber into the reaction chamber;

[0064] The reaction chamber manipulator rotates to the position for receiving the wafer, wherein a top pin assembly is provided on the reaction chamber manipulator;

[0065] Withdraw the transfer chamber manipulator, so that the wafer falls onto the top pin assembly of the reaction chamber manipulator;

[0066] The heating plate ejector pin rises for receiving the wafer;

[0067] Remove the reaction chamber robot arm so that the wafer falls onto the thimble of the heating plate.

[0068] In one embodiment, the step of the reaction chamber robot arm rotating to the position for picking up the wafer further includes: the transfer chamber robot arm is located in the gap between the reaction chamber robot arm and the wafer.

[0069] In one embodiment, the height of the gap is determined by the height of the thimble assembly on the reaction chamber robot arm.

[0070] In one embodiment, after removing the transfer chamber robot arm, the following steps are further included: closing the valve between the transfer chamber and the reaction chamber.

[0071] In one embodiment, the transfer chamber robot arm directly exchanges the wafer with the reaction chamber robot arm.

[0072] In one embodiment, the thimble assembly includes three thimbles, which are arranged at different positions on the reaction chamber robot arm.

[0073] Figure 3 Schematic diagram of a reaction chamber robot arm with a thimble assembly according to an embodiment of the present invention is shown. A thimble assembly 301 is provided on the reaction chamber robot arm 300. In this way, the wafer is naturally separated from the reaction chamber robot arm, and the separation space facilitates the transfer chamber robot arm to extend to the reaction chamber side for wafer transfer.

[0074] In one embodiment, the thimble assembly 301 includes three thimbles. The three thimbles are installed at three different positions on the reaction chamber robot arm.

[0075] In one embodiment, the height of the thimble needs to be ensured to be sufficient to enable the transfer chamber robot arm to smoothly insert into the gap between the reaction chamber robot arm and the wafer.

[0076] This structure of the reaction chamber robot arm with thimbles according to the present invention can reduce the number of frequent lifting and lowering of the thimbles of the heating plate, and can realize that the heating plate thimbles are lifted and lowered tightly only twice during the whole chamber wafer exchange. This greatly increases the lifting life of the heating plate thimbles. At the same time, due to the reduction of the lifting and lowering times of the heating plate thimbles, the production capacity of the equipment is greatly improved.

[0077] In one embodiment, the structure of the thimble assembly on the reaction chamber robot arm is not limited to Figure 3 as shown, and any structure that can perform the function of lifting the wafer is within the protection scope of the present invention. For example, the thimble structure can be a chuck structure.

[0078] Figure 4 Schematic diagram of a wafer transfer method for a multi-station vacuum coating equipment according to an embodiment of the present invention is shown. According to this wafer transfer method, the transfer chamber robot arm directly exchanges wafers with the reaction chamber robot arm (such as Figure 8as shown, rather than the transfer chamber robot grasping the wafer from the ejector pin on the heating plate of the reaction chamber.

[0079] The method includes, but is not limited to, the following steps:

[0080] Step 1: The ejector pin 200 on the heating plate raises the wafer 203 from the heating plate, as Figure 4 shown. At this time, the valve 402 is closed. In one embodiment, the valve 402 is a self-closing valve.

[0081] Step 2: The reaction chamber robot rotates to the position for picking up the wafer, as Figure 5 shown. Among them, an ejector pin assembly is provided on the reaction chamber robot.

[0082] Step 3: The ejector pin on the heating plate descends, so that the wafer falls onto the reaction chamber robot 300, as Figure 6 shown.

[0083] Step 4: Open the valve, and the transfer chamber robot 202 extends to the position for picking up the wafer in the reaction chamber, as Figure 7 shown, where the transfer chamber robot extends into the gap between the reaction chamber robot 300 and the wafer, and the height of this gap is determined by the height of the ejector pin on the reaction chamber robot 300.

[0084] Step 5: The transfer chamber robot 202 lifts the wafer upward, so that the wafer is separated from the reaction chamber robot 300 in the height direction, as Figure 8 shown.

[0085] Step 6: The transfer chamber robot holds the wafer and transports it into the transfer chamber 102, as Figure 9 shown.

[0086] Steps 1-6 of the present invention are the wafer transfer method for taking the wafer out of the reaction chamber to the transfer chamber. Taking a 6-station reaction chamber as an example, there are 6 such actions for taking out the wafer, or 3 groups of such actions. Of course, the rotation action of the reaction chamber robot in the reaction chamber is also interspersed in the middle.

[0087] Similarly, 6 such actions, or 3 groups of such actions, are also required for placing the wafer from the vacuum transfer chamber into the reaction chamber. Note that the action sequence is opposite and the rest is the same.

[0088] For example, the wafer transfer method for transferring the wafer from the transfer chamber into the reaction chamber includes but is not limited to the following steps.

[0089] Step 7: The transfer chamber robot holds the wafer and transports the wafer into the reaction chamber.

[0090] Step 8: The reaction chamber manipulator rotates to the position for picking up the wafer, and a thimble assembly is provided on the reaction chamber manipulator; the transfer chamber manipulator is located in the gap between the reaction chamber manipulator and the wafer, and the height of this gap is determined by the height of the thimble assembly on the reaction chamber manipulator.

[0091] Step 9: Remove the transfer chamber manipulator so that the wafer falls onto the thimble assembly of the reaction chamber manipulator.

[0092] Step 10: The thimble of the heating plate rises to pick up the wafer.

[0093] Step 11: Remove the reaction chamber manipulator so that the wafer falls onto the thimble of the heating plate.

[0094] Those skilled in the art will understand that the various illustrative components, modules, blocks, units, circuits, systems, and steps described in conjunction with the embodiments disclosed herein can be implemented by hardware, software (including firmware, resident software, microcode, etc.), or a combination of both. To clearly illustrate this interchangeability of hardware and software, the various illustrative components, modules, blocks, units, circuits, systems, and steps are generally described above in terms of their functionality. Whether such functionality is implemented as hardware or software depends on the specific application and the design constraints imposed on the overall system. Those skilled in the art can implement the described functionality in different ways for each specific application, but such implementation decisions should not be construed as causing a departure from the scope of the present invention.

[0095] This application describes the various steps in the wafer transfer method of a multi-station vacuum coating device. It should be understood that the previous or subsequent operations or steps do not necessarily have to be precisely executed in sequence. Instead, various operations or steps can be processed in reverse order or simultaneously. Also, one or more other operations or steps can be added to these processes, or one or more operations or steps can be removed from these processes.

[0096] Unless clearly stated in the claims, the order of the processing elements and sequences, the use of numerical letters, or the use of other names in this application is not used to limit the order of the processes and methods of this application.

[0097] In addition, aspects of this application may manifest as a computer product located in one or more computer-readable media, which includes computer-readable program code.

[0098] A computer-readable signal medium may include a propagated data signal embodying computer program code therein, for example, on a baseband or as part of a carrier wave. The propagated signal may take any of a variety of forms, including electromagnetic, optical, or the like, or any suitable combination thereof. The computer-readable signal medium may be any computer-readable medium other than a computer-readable storage medium that can communicate, propagate, or transport a program for use by or in connection with an instruction execution system, apparatus, or device. Program code located on a computer-readable signal medium may be propagated over any suitable medium, including radio, cable, fiber optic cable, RF, or the like, or any combination of the foregoing media.

[0099] The computer program code required for the operation of various parts of this application may be written in any one or more programming languages, including object-oriented programming languages such as Java, Scala, Smalltalk, Eiffel, JADE, Emerald, C++, C#, VB.NET, Python, etc., conventional procedural programming languages such as C, Visual Basic, Fortran 2003, Perl, COBOL 2002, PHP, ABAP, dynamic programming languages such as Python, Ruby, and Groovy, or other programming languages. The program code may run entirely on the user's computer, or as a stand-alone software package on the user's computer, or partially on the user's computer and partially on a remote computer, or entirely on a remote computer or server. In the latter case, the remote computer may be connected to the user's computer through any network form, such as a local area network (LAN) or a wide area network (WAN), or connected to an external computer (for example, through the Internet), or in a cloud computing environment, or used as a service such as software as a service (SaaS).

[0100] The steps of a method or algorithm described in connection with the embodiments disclosed herein may be embodied directly in hardware, in a software module executed by a processor, or in a combination of the two. The software module may reside in RAM memory, flash memory, ROM memory, EPROM memory, EEPROM memory, registers, a hard disk, a removable disk, a CD-ROM, or any other form of storage medium known in the art. The exemplary storage medium is coupled to the processor such that the processor can read from and write to the storage medium. In an alternative, the storage medium may be integrated into the processor. In an alternative, the processor and the storage medium may reside as discrete components in a user terminal.

[0101] In one or more exemplary embodiments, the described functionality may be implemented in hardware, software, firmware, or any combination thereof. If implemented in software as a computer program product, the functions may be stored on or transmitted via a computer-readable medium as one or more instructions or code. The computer-readable medium includes both computer storage media and communication media including any medium that facilitates transfer of a computer program from one place to another. The storage media may be any available media that can be accessed by a computer. By way of example and not limitation, such computer-readable media can include RAM, ROM, EEPROM, CD-ROM or other optical disk storage, magnetic disk storage or other magnetic storage devices, or any other medium that can be used to carry or store desired program code in the form of instructions or data structures and that can be accessed by a computer. Any connection is properly termed a computer-readable medium. For example, if the software is transmitted from a web site, server, or other remote source using a coaxial cable, fiber optic cable, twisted pair, DSL, or wireless technologies such as infrared, radio, and microwave, then the coaxial cable, fiber optic cable, twisted pair, DSL, or wireless technologies such as infrared, radio, and microwave are included in the definition of the medium. As used herein, the terms disk and disc include compact disc (CD), laser disc, optical disc, digital versatile disc (DVD), floppy disk, and Blu-ray disc, where disks typically reproduce data magnetically, while discs reproduce data optically with a laser. Combinations of the above should also be included within the scope of computer-readable media.

[0102] The terms and expressions employed above are used for description only and are not to be construed as limiting the invention. The use of these terms and expressions is not intended to exclude any equivalents of the features shown and described (or portions thereof), and it is to be recognized that various modifications are possible and are to be included within the scope of the claims. Other modifications, variations, and substitutions are also possible. Accordingly, the claims are to be regarded as covering all such equivalents.

[0103] Similarly, it should be noted that, for the sake of simplicity in the presentation of the disclosure of the present application and to assist in the understanding of one or more embodiments of the invention, in the foregoing description of the embodiments of the present application, various features are sometimes grouped together in one embodiment, figure, or description thereof. However, this method of disclosure does not imply that the features required by the subject matter of the present application are more than those recited in the claims.

[0104] Similarly, it should be noted that although the present invention has been described with reference to current specific embodiments, those of ordinary skill in the art should recognize that the above embodiments are only used to illustrate the present invention, and various equivalent changes or substitutions can be made without departing from the spirit of the present invention. Therefore, as long as the changes and modifications to the above embodiments are within the scope of the spirit of the present invention, they will fall within the scope of the claims of this application.

Claims

1. A wafer transfer method between a transfer chamber and a reaction chamber, characterized in that, The method includes: The heating plate ejector pin located in the reaction chamber lifts the wafer from the heating plate. Rotate the reaction chamber manipulator to the position for receiving the wafer, wherein an ejector pin assembly is provided on the reaction chamber manipulator. The heating plate ejector pin descends so that the wafer falls onto the reaction chamber manipulator. The transfer chamber manipulator extends into the reaction chamber to the position for receiving the wafer. The transfer chamber manipulator lifts the wafer upward to separate the wafer from the reaction chamber manipulator in the height direction. Wherein, the step that the transfer chamber manipulator extends into the reaction chamber to the position for receiving the wafer further includes: The transfer chamber manipulator extends into the gap between the reaction chamber manipulator and the wafer.

2. The wafer transfer method between the transfer chamber and the reaction chamber according to claim 1, characterized in that, The height of the gap is determined by the height of the ejector pin assembly on the reaction chamber manipulator.

3. The wafer transfer method between the transfer chamber and the reaction chamber according to claim 1, characterized in that, After the transfer chamber manipulator lifts the wafer upward, the following steps are further included: The transfer chamber manipulator holds the wafer and transports the wafer into the transfer chamber.

4. The wafer transfer method between the transfer chamber and the reaction chamber according to claim 1, characterized in that, The transfer chamber manipulator directly exchanges the wafer with the reaction chamber manipulator.

5. A wafer transfer method between a transfer chamber and a reaction chamber, characterized in that, The method includes: The transfer chamber manipulator holds the wafer and transports the wafer from the transfer chamber into the reaction chamber. Rotate the reaction chamber manipulator to the position for receiving the wafer, wherein an ejector pin assembly is provided on the reaction chamber manipulator. Withdraw the transfer chamber manipulator so that the wafer falls onto the ejector pin assembly of the reaction chamber manipulator. The heating plate ejector pin rises for receiving the wafer. Withdraw the reaction chamber manipulator so that the wafer falls onto the heating plate ejector pin. Wherein, the step that the reaction chamber manipulator rotates to the position for receiving the wafer further includes: The transfer chamber manipulator is located in the gap between the reaction chamber manipulator and the wafer.

6. The wafer transfer method between the transfer chamber and the reaction chamber according to claim 5, characterized in that The height of the gap is determined by the height of the ejector pin assembly on the reaction chamber manipulator.

7. The wafer transfer method between the transfer chamber and the reaction chamber according to claim 5, characterized in that The transfer chamber manipulator directly exchanges the wafer with the reaction chamber manipulator.

8. The wafer transfer method between the transfer chamber and the reaction chamber according to claim 5, wherein The ejector pin assembly includes three ejector pins, which are arranged at different positions on the reaction chamber manipulator.

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