Cooling equipment for semiconductor processing

Abstract

The present invention discloses a semiconductor processing cooling device, wherein a semiconductor processing workbench is provided with a positioning workbench spliced ​​to each other on the left and right; a positioning device is respectively provided on the left positioning workbench or the right positioning workbench; the positioning device is driven to move by a driving device; the positioning device is composed of a plurality of semiconductor positioning components attached to each other; each semiconductor positioning component includes an electrostatic suction cup, and a heat dissipation base, a fixed chassis, an elastic positioning ring block pad, and an elastic positioning ring block arranged on the positioning workbench from bottom to top; a cooling device is provided on the heat dissipation base, the fixed chassis, the elastic positioning ring block pad, and the elastic positioning ring block. The semiconductor processing cooling device provided by the present invention has both good positioning and cooling functions for semiconductors, and realizes a good up-and-down convection cooling effect for multiple wafers during the processing process.

Description

Technical Field

[0001] The present invention relates to the technical field of semiconductor processing, and in particular to a cooling device for semiconductor processing. Background Art

[0002] Semiconductors refer to materials with electrical conductivity between conductors and insulators at room temperature. Semiconductors are used in integrated circuits, consumer electronics, communication systems, photovoltaic power generation, lighting, high-power power conversion and other fields. For example, diodes are devices made of semiconductors. Nowadays, most electronic products, such as computers, mobile phones or digital recorders, are closely related to semiconductors. Common semiconductor materials include silicon, germanium, gallium arsenide, etc. Silicon is the most influential one in various semiconductor material applications.

[0003] The production and processing of semiconductors is very complicated and requires crushing, melting, cooling, shaping, etc. After the semiconductor production is completed, the semiconductor heated at high temperature needs to be annealed and cooled, so a semiconductor processing cooling device is required.

[0004] Existing semiconductor processing cooling devices often use coolant to anneal and cool semiconductors that have been heated at high temperatures. During cooling, the semiconductor needs to be cooled from a high temperature state to a preset value before it can be moved, and the semiconductor to be cooled can perform other operations. Using coolant to cool silicon wafer semiconductor materials consumes a large amount of coolant on the one hand. The coolant, which serves as the temperature control medium of the cooler, will be normally consumed as the cooler is used. On the other hand, the cooled water flows away directly and cannot be reused, which easily causes a waste of water resources. However, natural cooling has the problems of long waiting time and low cooling efficiency, and cannot meet the requirements of production and processing speed. Summary of the invention

[0005] In view of this, the present invention provides a cooling device for semiconductor processing.

[0006] In order to achieve the above object, the present invention adopts the following technical solutions:

[0007] A semiconductor processing cooling device, wherein a semiconductor processing workbench is provided with a positioning workbench spliced ​​with each other on the left and right; a positioning device is respectively provided on the left positioning workbench or the right positioning workbench; the positioning device is driven to move by a driving device; the positioning device is composed of a plurality of semiconductor positioning components attached to each other; each of the semiconductor positioning components comprises an electrostatic chuck, and a heat dissipation base, a fixed chassis, an elastic positioning ring block pad, and an elastic positioning ring block which are sequentially arranged on the positioning workbench from bottom to top; a plurality of electrostatic chucks are arranged on the positioning workbench at a certain interval; a semiconductor positioning component is arranged on the outer side of each of the electrostatic chucks;

[0008] The heat dissipation base, fixed chassis, elastic positioning ring block pad, and elastic positioning ring block are all hollow structures; the outer side of the heat dissipation base has an annular upper base convex portion; the upper base convex portion is a hollow structure and communicates with the inside of the heat dissipation base; the top height of the upper base convex portion is higher than the top height of the wafer; the upper end surface of the upper base convex portion is evenly provided with four mounting grooves in the circumferential direction, and the inner bottom end height of the mounting groove is lower than the top height of the fixed chassis; the bottom of the upper base convex portion has four base grooves from the outer side to the inner side; the four base grooves are evenly arranged along the circumferential direction of the upper base convex portion;

[0009] Each adjacent heat dissipation base is connected to each other by providing a base connector in the adjacent connected base grooves; the base connector is a hollow structure, and the base connector and the heat dissipation base are connected to each other with heat dissipation holes; the inner circumferential side surface of the upper base protrusion is provided with a plurality of heat dissipation holes connected to the inside; the outer circumferential side surface of the upper base protrusion is connected with a cold air inlet pipe;

[0010] Each adjacent fixed chassis is connected to each other by arranging chassis connectors at adjacent connected installation grooves; the chassis connector is a hollow structure and interconnected heat dissipation holes are provided on the connecting end surfaces of the chassis connector and the fixed chassis; the adjacent parts of the fixed chassis and the elastic positioning ring block and the pad are connected by penetrating connectors at the installation groove; the fixed chassis, the elastic positioning ring block and the pad, and the elastic positioning ring block are all provided with several interconnected heat dissipation holes on their mutually contacting end surfaces; the top end surface of the elastic positioning ring block is also provided with several heat dissipation holes; and a cold air inlet pipe is connected on the outer circumferential side surface of the fixed chassis.

[0011] Furthermore, it also includes a rotation drive device and an air source supply device;

[0012] The rotary drive device comprises a cylinder, a cylinder protection box, a cylinder fixed vertical plate, a rotating disc and a third drive motor; a plurality of fixed chassis near the outer end of the drive device are connected to a connecting plate through a chassis connector; the connecting plate is connected to a connecting rod; the connecting rod is connected to the piston rod of the cylinder; the cylinder is arranged on the cylinder protection box; the cylinder protection box is arranged on the cylinder fixed vertical plate; the cylinder fixed vertical plate is connected to the drive device; a rotating disc is provided in the middle of the outer end surface of the cylinder protection box; the rotating disc is rotatably arranged in the cylinder fixed vertical plate; a third drive motor is fixedly provided on the outer end surface of the cylinder fixed vertical plate; the motor shaft of the third drive motor passes through the cylinder fixed vertical plate and is connected to the rotating disc;

[0013] The driving device is arranged on the driving workbench; a cold air source supply device is arranged on the driving workbench; the outlet of the cold air source supply device is connected with a cold air outlet pipe; a driving pump is arranged on the cold air outlet pipe; a hose is sleeved and connected between the cold air outlet pipe and the two cold air inlet pipes.

[0014] The lockhole that is formed on the upper end of the support frame is formed on the upper end of the support frame, and the support frame is connected with the upper end of the support frame to form a circle, and the upper end of the support frame is connected with the upper end of the support frame to form a circle.

[0015] Several wafers are placed on several electrostatic chucks respectively; four abutment blocks slide inwards respectively until they are tangentially in contact with the wafers; and the electrostatic chucks generate adsorption force on the wafers.

[0016] Furthermore, the inner ends and outer ends of the four abutting slide grooves are mutually connected with the outside; and the longitudinal section of the abutting slide groove is T-shaped.

[0017] Furthermore, an upper chassis groove is opened at the upper end of each fixed chassis; the elastic positioning ring block is matched and embedded in the upper chassis groove, and the top end of the elastic positioning ring block extends out of the upper chassis groove; the inner end of the heat dissipation base has an annular upper base groove; the lower annular protrusion is matched and embedded in the upper base groove of the heat dissipation base.

[0018] Furthermore, the height of the inner bottom wall of the limiting groove is higher than the height of the inner top wall of the abutting slide groove; the length of the sliding block is smaller than the length of the sliding groove; and the length of the positioning block is smaller than the length of the accommodating slide groove.

[0019] Further, the first adsorption plate is a first glass plate; the second adsorption plate is a second glass plate;

[0020] The adsorption member is a suction cup; the suction cup is composed of an elastic disc and a connecting rod arranged in the middle of the upper end of the elastic disc; a longitudinal central hole is opened in the middle of the connecting rod; a blocking rod is connected to the central hole by interference fit;

[0021] Elastic stoppers are fixedly provided at the upper ends of the limiting grooves on both sides respectively; the distance between the elastic stoppers on both sides is the width of the positioning block; and the suction cup is located in the space left between the limiting groove and the second adsorption plate.

[0022] Furthermore, the lower end of the elastic positioning ring block is located between the two adjacent abutting slide grooves and a second abutting slide groove is provided; the inner side end and the outer side end of the second abutting slide groove are mutually connected with the outside; a second abutting block is slidably provided in the second abutting slide groove; the upper end surface of the elastic positioning ring block is provided with a second sliding groove corresponding to the position of the second abutting slide groove; the second sliding groove and the second abutting groove corresponding to the position are connected to each other; the upper end surface of the elastic positioning ring block is located on both sides of the second sliding groove and a second limiting groove is respectively provided; the inner bottom wall surface height of the second limiting groove is higher than the second abutting slide The inner top wall height of the groove; the second sliding block and the second positioning block are fixedly provided in sequence on the upper end of the second abutment block; the second sliding block is slidably provided in the second sliding groove; the third glass plate is fixedly provided on the upper end of the second sliding block; the fourth glass plate is fixedly provided on the lower end of the limiting groove; the upper surface of the third glass plate is flush with the upper surface of the fourth glass plate; a suction cup is jointly adsorbed on the flush upper surfaces of the two adsorption plates; a second slide groove for accommodating the extension of the second positioning block for sliding is provided at the lower end of the fixed chassis; the length of the extension of the second positioning block is less than the length of the second slide groove.

[0023] Furthermore, a notch positioning groove is provided on the outer end face of the second abutment block; the middle groove portion of the notch positioning groove is connected to the outside, and the outer end faces of the groove portions on both sides are not connected to the outside; the middle portion of the notch positioning block is slidably arranged in the middle groove of the notch positioning groove, and the two side portions are respectively slidably arranged in the groove portions on both sides of the notch positioning groove.

[0024] Furthermore, the driving device is arranged on the driving workbench; the driving device comprises a front-to-back motion driving mechanism and a left-to-right motion driving mechanism;

[0025] The forward and backward motion driving mechanism comprises a first driving motor, a longitudinal screw, a longitudinal slideway and a convex-shaped sliding block; the first driving motor is arranged on a driving workbench; the motor shaft of the first driving motor is connected to the longitudinal screw; the motor shaft of the first driving motor passes through a motor shaft limiting plate, and the motor shaft limiting plate is fixedly arranged on the driving workbench; the driving workbench is provided with a longitudinal slideway; the longitudinal screw is externally threadedly connected with a convex-shaped sliding block; the convex-shaped sliding block is slidably arranged on the longitudinal slideway;

[0026] A cylinder fixed horizontal plate is provided at the upper end of the convex sliding block on the longitudinal screw rod; the cylinder fixed horizontal plate is connected to the cylinder fixed vertical plate;

[0027] The left-right motion driving mechanism comprises a second driving motor, a transverse screw, a transverse slideway and a convex-shaped sliding block; the second driving motor is arranged on the driving workbench; the motor shaft of the second driving motor is connected to the transverse screw; the motor shaft of the second driving motor passes through a motor shaft limit plate, and the motor shaft limit plate is fixed on the driving workbench; the transverse screw is externally threadedly connected with a convex-shaped sliding block; the convex-shaped sliding block is slidably arranged on the transverse slideway;

[0028] Furthermore, two limit slide bars are transversely arranged on the upper end surface of the driving workbench; two limit grooves are transversely arranged on the longitudinal slideway corresponding to the positions of the two limit slide bars; and the two limit slide bars are respectively matched and passed through the two limit grooves.

[0029] Compared with the prior art, the present invention has the following beneficial effects:

[0030] (1) After the rotation angle is completed, the left elastic positioning ring block is tilted from the lower outer position to the upper inner position, and the left elastic positioning ring block is tilted from the lower outer position to the upper inner position, so that the wafer being processed can be cooled and cooled in time to prevent overheating; thus, an up-and-down convection cooling effect is formed, and the upper and lower ends of the wafer are fully cooled and dissipated, the cooling effect is very good, and the layout and installation are also very simple and convenient;

[0031] (1) The semiconductor processing cooling device achieves that each wafer is fixed at the same position on the electrostatic chuck, and that the notch positions of each wafer fixed on the electrostatic chuck are located at the same position on the electrostatic chuck, thereby achieving dual precise positioning of position and angle;

[0032] (2) The cooling device for semiconductor processing realizes the precise positioning of multiple wafers. Driven by the front-to-back motion drive mechanism and the left-to-right motion drive mechanism, multiple wafers are moved at regular distances to the bottom of the processing table, and are processed sequentially, orderly, and precisely. There is no need to fine-tune the position of the electrostatic suction cup. The high positioning accuracy and high movement efficiency lead to improved subsequent processing efficiency and processing accuracy, which improves product quality. BRIEF DESCRIPTION OF THE DRAWINGS

[0033] Figure 1 It is a schematic diagram of the overall three-dimensional structure of the present invention;

[0034] Figure 2 It is a schematic diagram of the overall three-dimensional structure of the present invention;

[0035] Figure 3 It is a schematic diagram of the overall three-dimensional structure of the present invention;

[0036] Figure 4It is a schematic diagram of the overall three-dimensional structure of the present invention;

[0037] Figure 5 It is an overall top view of the present invention;

[0038] Figure 6 for Figure 3 AA section view in the figure;

[0039] Figure 7 for Figure 4 A magnified view of part A in FIG.

[0040] Figure 8 It is a schematic diagram of the exploded structure of the heat dissipation base, the fixed chassis, the elastic positioning ring block pad and the elastic positioning ring block of the present invention;

[0041] Fig. 9 It is a schematic diagram of the exploded structure of the heat dissipation base, the fixed chassis, the elastic positioning ring block pad and the elastic positioning ring block of the present invention;

[0042] Fig.10 It is a schematic diagram of a three-dimensional structure in which a plurality of elastic positioning ring blocks and cushion blocks and elastic positioning ring blocks are stacked in the present invention;

[0043] Fig.11 It is a top view of a plurality of elastic positioning ring blocks and a cushion block and an elastic positioning ring block of the present invention;

[0044] Fig.12 for Fig.11 AA section view in the figure;

[0045] Fig.13 It is a schematic diagram of the three-dimensional structure of the present invention in another working state;

[0046] Fig.14 It is a top view of the whole of the present invention in another working state;

[0047] Fig.15 It is a front view of another working state of the whole invention;

[0048] In the figure: 1, electrostatic suction cup; 2, fixed chassis; 3, elastic positioning ring block pad; 4, elastic positioning ring block; 5, positioning workbench; 6, driving workbench; 7, base connecting piece; 8, chassis connecting piece; 9, abutting slide groove; 10, sliding groove; 11, abutting block; 12, sliding block 13, second glass plate; 16, suction cup; 161, elastic disc; 162, blocking rod; 17, elastic stopper; 18, accommodating slide groove; 19, second abutting slide groove; 20, second abutting block; 21, second sliding groove; 23, second limiting groove; 24, second sliding block; 25, second positioning block; 26, notch positioning block; 27, heat dissipation base; 28. The first driving motor; 29. ​​The longitudinal screw; 30. The longitudinal slide; 31. The convex sliding block; 32. The cylinder fixedly connected to the horizontal plate; 33. The connecting rod; 34. The connecting plate; 35. The second driving motor; 36. The transverse screw; 37. The transverse slide; 38. The limiting slide; 39. The first glass plate; 40. The positioning block; 41. The wafer; 42. The limiting groove; 43. The upper base protrusion; 44. The mounting groove; 45. The base groove; 46. The cylinder protection box; 47. The cylinder; 48. The cylinder fixedly connected to the vertical plate; 49. The heat dissipation hole; 50. The third driving motor; 51. The cold air source supply device; 52. The cold air outlet pipe; 53. The cold air inlet pipe. DETAILED DESCRIPTION

[0049] The technical solutions in the embodiments of the present invention will be described clearly and completely below in conjunction with the drawings in the embodiments of the present invention. Obviously, the described embodiments are only part of the embodiments of the present invention, rather than all the embodiments.

[0050] In the description of the present invention, unless otherwise specified, "plurality" means two or more than two; the orientations or positional relationships indicated by the terms "upper", "lower", "left", "right", "inner", "outer", "front end", "rear end", "head", "tail", etc. are based on the orientations or positional relationships shown in the drawings, and are only for the convenience of describing the present invention and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, be constructed and operate in a specific orientation, and therefore cannot be understood as limiting the present invention. In addition, the terms "first", "second", "third", etc. are only used for descriptive purposes and cannot be understood as indicating or implying relative importance.

[0051] In the description of the present invention, it should be noted that, unless otherwise clearly specified and limited, the terms "connected" and "connection" should be understood in a broad sense, for example, it can be a fixed connection, a detachable connection, or an integral connection; it can be a mechanical connection or an electrical connection; it can be a direct connection or an indirect connection through an intermediate medium. For ordinary technicians in this field, the specific meanings of the above terms in the present invention can be understood according to specific circumstances.

[0052] Example:

[0053] like Figure 1-15 As shown, a semiconductor processing cooling device is provided, wherein a positioning workbench 5 which is spliced ​​to each other on the left and right is provided on the semiconductor processing workbench; a positioning device is provided on the left positioning workbench 5 or the right positioning workbench 5 respectively; the positioning device is driven to move by a driving device; the positioning device is composed of a plurality of semiconductor positioning components attached to each other; each semiconductor positioning component comprises an electrostatic chuck 1, and a heat dissipation base 27, a fixed chassis 2, an elastic positioning ring block pad 3, and an elastic positioning ring block 4 which are sequentially arranged on the positioning workbench 5 from bottom to top; a plurality of electrostatic chucks 1 are provided on the positioning workbench 5 at a certain interval; a semiconductor positioning component is provided on the outer side of each of the electrostatic chucks 1;

[0054] The heat dissipation base 27, the fixed chassis 2, the elastic positioning ring block pad 3, and the elastic positioning ring block 4 are all hollow structures; the outer side of the heat dissipation base 27 has an annular upper base protrusion 43; the upper base protrusion 43 is a hollow structure and communicates with the inside of the heat dissipation base 27; the top height of the upper base protrusion 43 is higher than the top height of the wafer 41; four mounting grooves 44 are evenly opened in the circumferential direction of the upper end surface of the upper base protrusion 43, and the inner bottom end height of the mounting groove 44 is lower than the top height of the fixed chassis 2; the bottom of the upper base protrusion 43 has four base grooves 45 from the outside to the inside; the four base grooves 45 are evenly arranged along the circumferential direction of the upper base protrusion 43;

[0055] Each adjacent heat dissipation base 27 is connected to each other by providing a base connector 7 in the adjacent connected base grooves 45; the base connector 7 is a hollow structure and the base connector 7 and the heat dissipation base 27 are provided with interconnected heat dissipation holes 49 on the connecting end surfaces; a plurality of heat dissipation holes 49 connected to the inside are provided on the inner circumferential side surface of the upper base protrusion 43; and a cold air inlet pipe 53 is provided on the outer circumferential side surface of the upper base protrusion 43;

[0056] Each adjacent fixed chassis 2 is connected to each other by arranging a chassis connector 8 at the adjacent connected installation grooves 44; the chassis connector 8 is a hollow structure and the chassis connector 8 and the fixed chassis 2 are provided with interconnected heat dissipation holes 49 on the connecting end surfaces; the adjacent parts of the fixed chassis 2 and the elastic positioning ring block and pad 3 are connected by penetrating a connector at the installation groove 44; the fixed chassis 2, the elastic positioning ring block and pad 3, and the elastic positioning ring block 4 are all provided with a plurality of interconnected heat dissipation holes 49 on the mutually contacting end surfaces; the top end surface of the elastic positioning ring block 4 is also provided with a plurality of heat dissipation holes 49; and a cold air inlet pipe 53 is connected to the outer circumferential side surface of the fixed chassis 2.

[0057] The rotary drive device includes a cylinder 47, a cylinder protection box 46, a cylinder fixed vertical plate 48, a rotating disc and a third drive motor 50; a plurality of fixed chassis 2 near the outer end of the drive device are connected to a connecting plate 34 through a chassis connector 8; the connecting plate 34 is connected to a connecting rod 33; the connecting rod 33 is connected to the piston rod of the cylinder 47; the cylinder 47 is arranged on the cylinder protection box 46; the cylinder protection box 46 is arranged on the cylinder fixed vertical plate 48; the cylinder fixed vertical plate 48 is connected to the cylinder fixed vertical plate 32; a rotating disc is arranged in the middle of the outer end surface of the cylinder protection box 46; the rotating disc is rotatably arranged in the cylinder fixed vertical plate 48; the outer end surface of the cylinder fixed vertical plate 48 is fixedly provided with a third drive motor 50; the motor shaft of the third drive motor 50 passes through the cylinder fixed vertical plate 48 and is connected to the rotating disc;

[0058] The driving device is arranged on the driving workbench 6; a cold air source supply device 51 is arranged on the driving workbench 6; the outlet of the cold air source supply device 51 is connected to a cold air outlet pipe 52; a driving pump is arranged on the cold air outlet pipe 52; a hose is sleeved and connected between the cold air outlet pipe 52 and the two cold air inlet pipes 53.

[0059] An upper chassis groove is provided at the upper end of each fixed chassis 2; an elastic positioning ring block 4 is matched and embedded in the upper chassis groove, and the top end of the elastic positioning ring block 4 extends out of the upper chassis groove; the inner end of the heat dissipation base 27 has an annular upper base groove; and the lower annular protrusion is matched and embedded in the upper base groove of the heat dissipation base.

[0060] A plurality of electrostatic chucks 1 are arranged at a certain interval on the positioning workbench 5 ; a fixed chassis 2 is arranged on the outer side of each electrostatic chuck 1 .

[0061] The lower end of the elastic block is evenly provided with four abutting grooves 9 in the circumferential direction; the inner and outer ends of the four abutting grooves 9 are mutually connected with the outside; the longitudinal section of the abutting groove 9 is T-shaped. Four abutting blocks 11 are slidably arranged in the four abutting grooves 9 respectively.

[0062] The upper end surface of the elastic positioning ring block 4 is provided with four sliding grooves 10 evenly arranged in the circumferential direction corresponding to the positions of the four abutting sliding grooves 9; the sliding grooves 10 and the abutting grooves corresponding to the positions are connected to each other. The upper end surface of the elastic positioning ring block 4 is provided with limiting grooves 42 on both sides of each sliding groove 10; the upper end of each abutting block 11 is fixed with a sliding block 12 and a positioning block 40 in sequence. The sliding block 12 is slidably arranged in the sliding groove 10.

[0063] A first adsorption plate is fixedly provided at the upper end of each sliding block 12; a second adsorption plate is embedded and fixedly provided at the lower end of the limiting grooves 42 on both sides; the upper surface of the first adsorption plate is flush with the upper surface of the second adsorption plate; an adsorption component is jointly adsorbed on the flush upper surfaces of the two adsorption plates.

[0064] The first adsorption plate is a first glass plate 39; the second adsorption plate is a second glass plate 13;

[0065] The adsorption member is a suction cup 16; the suction cup 16 is composed of an elastic disc 161 and a connecting rod 33 arranged in the middle of the upper end of the elastic disc 161; a central hole is longitudinally penetrated in the middle of the connecting rod 33; a blocking rod 162 is connected to the central hole by interference fit.

[0066] Elastic blocks 17 are fixedly provided at the upper ends of the limiting grooves 42 on both sides respectively; the distance between the elastic blocks 17 on both sides is the width of the positioning block 40; the suction cup 16 is located in the space between the limiting groove 42 and the second adsorption plate.

[0067] The top end of the positioning block 40 extends out of the upper end of the elastic positioning ring block 4 to form a protruding portion; the lower end of the fixed chassis 2 is provided with an accommodating slide groove 18 for the protruding portion to slide.

[0068] A plurality of wafers 41 are placed on a plurality of electrostatic chucks 1 ; the four abutment blocks 11 slide inwards to be tangentially in contact with the wafers 41 ; and the electrostatic chucks 1 generate an adsorption force on the wafers 41 .

[0069] The inner bottom wall height of the limiting groove 42 is higher than the inner top wall height of the abutting slide groove 9 ; the length of the sliding block 12 is smaller than the length of the sliding groove 10 ; the length of the positioning block 40 is smaller than the length of the accommodating slide groove 18 .

[0070] The lower end of the elastic positioning ring block 4 is located between two adjacent abutting grooves 9 and is further provided with a second abutting groove 19; the inner and outer ends of the second abutting groove 19 are mutually connected with the outside; a second abutting block 20 is slidably provided in the second abutting groove 19; a second sliding groove 21 is provided on the upper end surface of the elastic positioning ring block 4 corresponding to the position of the second abutting groove 19; the second sliding groove 21 and the second abutting groove corresponding to the position are mutually connected,

[0071] The upper end surface of the elastic positioning ring block 4 is located on both sides of the second sliding groove 21 and is respectively provided with second limiting grooves 23; the inner bottom wall height of the second limiting groove 23 is higher than the inner top wall height of the second abutting sliding groove 19; the upper end of the second abutting block 20 is fixed with a second sliding block 24 and a second positioning block 25 in sequence; the second sliding block 24 is slidably arranged in the second sliding groove 21,

[0072] A third glass plate 14 is fixedly provided at the upper end of the second sliding block 24; a fourth glass plate is fixedly provided at the lower end of the limiting groove 42; the upper surface of the third glass plate 14 is flush with the upper surface of the fourth glass plate; a suction cup 16 is jointly adsorbed on the flush upper surfaces of the two adsorption plates; a second accommodating groove for sliding the extended portion of the second positioning block 25 is provided at the lower end of the fixed chassis 2; the length of the extended portion of the second positioning block 25 is less than the length of the accommodating second groove.

[0073] A notch positioning groove is provided on the outer end face of the second abutment block 20; the middle groove portion of the notch positioning groove is connected to the outside, and the outer end faces of the groove portions on both sides are not connected to the outside; the middle portion of the notch positioning block 26 is slidably arranged in the middle groove of the notch positioning groove, and the two side portions are respectively slidably arranged in the groove portions on both sides of the notch positioning groove.

[0074] The driving device includes a front-to-back motion driving mechanism and a left-to-right motion driving mechanism;

[0075] The forward and backward movement driving mechanism includes a first driving motor 28, a longitudinal screw 29, a longitudinal slide 30 and a convex sliding block 31; the first driving motor 28 is arranged on the driving workbench 6; the motor shaft of the first driving motor 28 is connected to the longitudinal screw 29; the motor shaft of the first driving motor 28 passes through a motor shaft limit plate, and the motor shaft limit plate is fixed on the driving workbench 6; a longitudinal slide 30 is provided on the driving workbench 6; the longitudinal screw 29 is externally threadedly connected to a convex sliding block 31; the convex sliding block 31 is slidably arranged on the longitudinal slide 30.

[0076] A cylinder fixed horizontal plate 32 is provided at the upper end of the convex sliding block 31 on the longitudinal screw rod 29; a connecting rod 33 is provided at the upper end of the piston rod of the cylinder fixed horizontal plate 32; the connecting rod 33 is connected to a connecting plate 34; the connecting plate 34 is connected to a plurality of side connecting parts;

[0077] The left-right motion driving mechanism includes a second driving motor 35, a transverse screw 36, a transverse slide 37 and a convex sliding block 31; the second driving motor 35 is arranged on the driving workbench 6; the motor shaft of the second driving motor 35 is connected to the transverse screw 36; the motor shaft of the second driving motor 35 passes through a motor shaft limit plate, and the motor shaft limit plate is fixed on the driving workbench 6; the transverse screw 36 is externally threadedly connected with a convex sliding block 31; the convex sliding block 31 is slidably arranged on the transverse slide 37;

[0078] Two limit slide bars 38 are disposed transversely on the upper end surface of the driving workbench 6 ; two limit grooves 42 are disposed transversely on the longitudinal slideway 30 corresponding to the positions of the two limit slide bars 38 ; and the two limit slide bars 38 are matched and passed through the two limit grooves 42 .

[0079] The working principle of the present invention is:

[0080] like Figure 11-13As shown, first take out an assembly of a stacked elastic positioning ring block, a cushion block 3 and an elastic positioning ring block 4, and place it horizontally; then measure the diameter of the wafer 41, calculate the displacement that the abutment block 11 needs to draw, accurately move the four abutment blocks 11 to an equal and appropriate distance respectively, and then put the wafer 41 between the four abutment blocks 11 (a cushion block is placed under the wafer 41 to ensure the height match between the wafer 41 and the abutment blocks 11). At this time, it can be seen that the outer end faces of the four abutment blocks 11 are just in tangential contact with the four directions of the wafer 41, but are not pressed against each other;

[0081] Then, the second abutting block 20 is moved out until the second abutting block 20 is in tangential contact with the wafer 41; the moving distance of the second abutting block 20 is also confirmed;

[0082] Then, several assemblies of elastic positioning ring blocks 3 and elastic positioning ring blocks 4 are placed on the stacked elastic positioning ring blocks 3 and elastic positioning ring blocks 4; due to the positioning block 40 being positioned in the accommodating slide groove 18, all the elastic positioning ring blocks 3 and elastic positioning ring blocks 4 can be stacked to achieve complete matching and stacking; then, according to the displacement of the lowermost end, all the above abutment blocks 11 and the second abutment block 20 can be moved out of the corresponding distance, without positioning the wafer 41 one by one and then moving the abutment block 11 out of the corresponding distance;

[0083] After the abutment blocks 11 of all the assemblies of the elastic positioning ring blocks 3 and the elastic positioning ring blocks 4 are moved out of the corresponding appropriate distance, each assembly of the elastic positioning ring blocks 3 and the elastic positioning ring blocks 4 is quickly placed on each fixed chassis 2;

[0084] If there is a notch on the wafer 41, the notch positioning block 26 is moved a small distance at this time, so that each wafer 41 is rotated to a suitable angle and then placed in the area between the four abutment blocks 11, and the end face of the notch is in contact with the end face of the notch positioning block 26. Thus, the wafer 41 is placed in the area between the four abutment blocks 11 whose positions have been adjusted, so that each wafer 41 is fixed at the same position on the electrostatic chuck 16; the end face of the notch of the wafer 41 is in contact with the end face of the notch positioning block 26, so that the notch positions of each wafer 41 fixed on the electrostatic chuck 16 are located at the same position on the electrostatic chuck 16, and dual precise positioning of position and angle is achieved;

[0085] After the position of the wafer 41 is fixed, the cylinder fixed horizontal plate 32 drives all the elastic positioning ring blocks 4 pads and the elastic positioning ring block 4 assembly to move upward. Since there is no crimping relationship, the position of the wafer 41 will not be changed. After all the elastic positioning ring blocks 4 pads and the elastic positioning ring block 4 assembly leave the positioning workbench 5, the electrostatic chuck 1 is powered on to adsorb the wafer 41 on the electrostatic chuck 1, thereby realizing the precise positioning of multiple wafers 41;

[0086] Subsequently, driven by the front-to-back motion drive mechanism and the left-to-right motion drive mechanism, multiple wafers 41 are moved at regular distances to the bottom of the processing workbench, and are processed sequentially, orderly, and accurately, without the need to fine-tune the position of the electrostatic suction cup 16; the positioning accuracy is high and the movement efficiency is high, which in turn leads to improved subsequent processing efficiency and processing accuracy, thereby improving product quality.

[0087] During the processing of the wafer 41, heat is inevitably generated. At this time, the fixed chassis 2 drives the elastic positioning ring block pad 4 and the elastic positioning ring block 5 thereon to move upward; then the left and right movement drive mechanism drives the fixed chassis 3, the elastic positioning ring block pad 4 and the elastic positioning ring block assembly 5 on the left to move to the left, and at the same time, the piston rod of the cylinder 47 on the left drives the fixed chassis 3, the elastic positioning ring block pad 4 and the elastic positioning ring block assembly 5 on the left to move upward; finally, the third drive motor drives the rotating disc, the cylinder protection box 46, the cylinder 47, the connecting rod 33 through the motor shaft; the connecting plate 34 and the fixed chassis 3, the elastic positioning ring block pad 4 and the elastic positioning ring block assembly 5 on the left rotate to a certain angle;

[0088] At the same time, the left and right motion driving mechanism drives the fixed chassis 3, the elastic positioning ring block pad 4 and the elastic positioning ring block assembly 5 on the right to move rightward, and at the same time, the piston rod of the cylinder 47 on the right drives the fixed chassis 3, the elastic positioning ring block pad 4 and the elastic positioning ring block assembly 5 on the left to move upward, and finally, the third driving motor drives the rotating disc, the cylinder protection box 46, the cylinder 47, the connecting rod 33 through the motor shaft; the connecting plate 34 and the fixed chassis 3, the elastic positioning ring block pad 4 and the elastic positioning ring block assembly 5 on the left to rotate a certain angle;

[0089] After the rotation, the elastic positioning ring block 5 on the left is tilted from the outer lower position toward the inner upper position; the elastic positioning ring block 5 on the left is tilted from the outer lower position toward the inner upper position.

[0090] After the rotation angle is completed, the driving pump on the cold air outlet pipe starts to work, and the cold air from the cold air source supply device is transmitted to the fixed chassis 3 on the left. The cold air in the fixed chassis 3, the elastic positioning ring block pad 4, and the elastic positioning ring block assembly 5 is transmitted upward in turn, and discharged from the heat dissipation holes 49 on the elastic positioning ring block assembly 5, so as to timely cool and reduce the temperature of the wafers being processed to prevent overheating; the cold air from the cold air source supply device is simultaneously transmitted to the heat dissipation base 27, and the cold air is transmitted in all the heat dissipation bases 27 in turn, and discharged from the heat dissipation holes 49 on the inner side of the heat dissipation base 27, so as to timely cool and reduce the temperature of the wafers being processed to prevent overheating; thereby forming an upper and lower convection cooling effect, and fully cooling and dissipating the upper and lower ends of the wafers.

[0091] The above are only preferred specific implementation modes of the present invention, but the protection scope of the present invention is not limited thereto. Any technician familiar with the technical field can make equivalent replacements or changes according to the technical solutions and inventive concepts of the present invention within the technical scope disclosed by the present invention, which should be covered by the protection scope of the present invention.

Claims

1. A cooling device for semiconductor processing, wherein a semiconductor processing workbench is provided with a positioning workbench (5) spliced ​​to each other on the left and right; a positioning device is provided on the left positioning workbench (5) or the right positioning workbench (5); the positioning device is driven to move by a driving device; characterized in that: The positioning device is composed of a plurality of semiconductor positioning components attached to each other; each of the semiconductor positioning components comprises an electrostatic chuck (1), and a heat dissipation base (27), a fixed chassis (2), an elastic positioning ring block (3), and an elastic positioning ring block (4) which are arranged on the positioning workbench (5) in order from bottom to top; a plurality of electrostatic chucks (1) are arranged on the positioning workbench (5) at a certain interval; and a semiconductor positioning component is arranged on the outer side of each of the electrostatic chucks (1); The heat dissipation base (27), the fixed chassis (2), the elastic positioning ring block pad (3), and the elastic positioning ring block (4) are all hollow structures; the outer side of the heat dissipation base (27) has an annular upper base protrusion (43); the upper base protrusion (43) is a hollow structure and communicates with the inside of the heat dissipation base (27); the top height of the upper base protrusion (43) is higher than the top height of the wafer (41); the upper end surface of the upper base protrusion (43) is evenly provided with four mounting grooves (44) in the circumferential direction, and the inner bottom end height of the mounting groove (44) is lower than the top height of the fixed chassis (2); the bottom of the upper base protrusion (43) has four base grooves (45) from the outer side to the inner side; the four base grooves (45) are evenly arranged along the circumferential direction of the upper base protrusion (43); Each adjacent heat dissipation base (27) is connected to each other by providing a base connector (7) in an adjacent and connected base groove (45); the base connector (7) is a hollow structure, and the base connector (7) and the heat dissipation base (27) are provided with heat dissipation holes (49) that are connected to each other on the end surface where the base connector (7) and the heat dissipation base (27) are attached to each other; the inner circumferential side surface of the upper base protrusion (43) is provided with a plurality of heat dissipation holes (49) that are connected to the inside; and the outer circumferential side surface of the upper base protrusion (43) is provided with a cold air inlet pipe (53) in communication; A plurality of fixed chassis (2) are connected to each other by providing chassis connectors (8) at adjacent connected mounting grooves (44); the chassis connector (8) is a hollow structure and interconnected heat dissipation holes (49) are provided on the end surfaces where the chassis connector (8) and the fixed chassis (2) are connected; the adjacent parts of the fixed chassis (2) and the elastic positioning ring block and cushion block (3) are connected by penetrating connectors at the mounting groove (44); the mutually contacting end surfaces of the fixed chassis (2), the elastic positioning ring block and cushion block (3) and the elastic positioning ring block (4) are all provided with a plurality of interconnected heat dissipation holes (49); the top end surface of the elastic positioning ring block (4) is also provided with a plurality of heat dissipation holes (49); and a cold air inlet pipe (53) is provided on the outer circumferential side surface of the fixed chassis (2).

2. The semiconductor processing cooling device according to claim 1, characterized in that: It also includes a rotation drive device and an air source supply device; The rotary drive device comprises a cylinder (47), a cylinder protection box (46), a cylinder fixed vertical plate (48), a rotating disc and a third drive motor (50); a plurality of fixed chassis (2) near the outer side of the drive device are connected to a connecting plate (34) through a chassis connecting member (8); the connecting plate (34) is connected to a connecting rod (33); the connecting rod (33) is connected to a piston rod of the cylinder (47); the cylinder (47) is arranged on the cylinder protection box (46) ; The cylinder protection box (46) is arranged on the cylinder fixed vertical plate (48); The cylinder fixed vertical plate (48) is connected to the driving device; A rotating disk is arranged in the middle of the outer end surface of the cylinder protection box (46); The rotating disk is rotatably arranged in the cylinder fixed vertical plate (48); A third driving motor (50) is fixedly arranged on the outer end surface of the cylinder fixed vertical plate (48); The motor shaft of the third driving motor (50) passes through the cylinder fixed vertical plate (48) and is connected to the rotating disk; The driving device is arranged on a driving workbench (6); a cold air source supply device (51) is arranged on the driving workbench (6); an outlet of the cold air source supply device (51) is connected to a cold air outlet pipe (52); a driving pump is arranged on the cold air outlet pipe (52); a hose is sleeved and connected between the cold air outlet pipe (52) and two cold air inlet pipes (53).

3. The semiconductor processing cooling device according to claim 1, characterized in that: The lower end of the elastic positioning ring block (4) is provided with four abutting grooves (9) uniformly in the circumference; four abutting blocks (11) are slidably arranged in the four abutting grooves (9); the upper end surface of the elastic positioning ring block (4) is provided with four sliding grooves (10) uniformly in the circumference corresponding to the positions of the four abutting grooves (9); the sliding grooves (10) and the abutting grooves corresponding in position are connected to each other; the upper end surface of the elastic positioning ring block (4) is provided with limiting grooves (42) on both sides of each sliding groove (10); the upper end of each abutting block (11) is fixedly provided with a sliding block (11) in sequence; 2) Positioning block (40); the sliding block (12) is slidably arranged in the sliding groove (10); a first adsorption plate is fixedly arranged at the upper end of each sliding block (12); a second adsorption plate is embedded and fixedly arranged at the lower end of the limiting grooves (42) on both sides; the upper surface of the first adsorption plate and the upper surface of the second adsorption plate are flush with each other; an adsorption member is adsorbed on the flush upper surfaces of the two adsorption plates; the top end of the positioning block (40) extends out of the upper end of the elastic positioning ring block (4) to form an extension portion; the lower end of the fixed chassis (2) is provided with a receiving slide groove (18) for the extension portion to slide; A plurality of wafers (41) are respectively placed on a plurality of electrostatic suction cups (1); four abutment blocks (11) respectively slide inwards until they are in tangential contact with the wafers (41); and the electrostatic suction cups (1) generate an adsorption force on the wafers (41).

4. The semiconductor processing cooling device according to claim 1, characterized in that: The inner ends and outer ends of the four abutting slide grooves (9) are mutually connected with the outside; the longitudinal section of the abutting slide groove (9) is T-shaped.

5. The semiconductor processing cooling device according to claim 1, characterized in that: The upper and lower ends of each fixed chassis (2) are respectively provided with an upper chassis groove and a lower chassis protrusion in an annular direction; the elastic positioning ring block (4) is matched and embedded in the upper chassis groove, and the top end of the elastic positioning ring block (4) extends out of the upper chassis groove; the inner side end of the heat dissipation base (27) has an annular upper base groove; the lower annular protrusion is matched and embedded in the upper base groove of the heat dissipation base.

6. The semiconductor processing cooling device according to claim 3, characterized in that: The height of the inner bottom wall of the limiting groove (42) is higher than the height of the inner top wall of the abutting sliding groove (9); the length of the sliding block (12) is shorter than the length of the sliding groove (10); and the length of the positioning block (40) is shorter than the length of the accommodating sliding groove (18).

7. The semiconductor processing cooling device according to claim 3, characterized in that: The first adsorption plate is a first glass plate (39); the second adsorption plate is a second glass plate (13); The adsorption member is a suction cup (16); the suction cup (16) is composed of an elastic disc (161) and a connecting rod (33) arranged at the middle of the upper end of the elastic disc (161); a central hole is longitudinally penetrated in the middle of the connecting rod (33); a blocking rod (162) is connected to the central hole by interference fit; Elastic stoppers (17) are fixedly provided at the upper ends of the limiting grooves (42) on both sides; the distance between the elastic stoppers (17) on both sides is the width of the positioning block (40); and the suction cup (16) is located in the space between the limiting grooves (42) and the second suction plate.

8. The semiconductor processing cooling device according to any one of claims 1 to 6, characterized in that: The lower end of the elastic positioning ring block (4) is located between two adjacent abutting grooves (9) and is also provided with a second abutting groove (19); the inner and outer ends of the second abutting groove (19) are mutually connected with the outside; a second abutting block (20) is slidably provided in the second abutting groove (19); the upper end surface of the elastic positioning ring block (4) is provided with a second sliding groove (21) corresponding to the position of the second abutting groove (19); the second sliding grooves (21) and the second abutting grooves (20) at corresponding positions are mutually connected; the upper end surface of the elastic positioning ring block (4) is provided with second limiting grooves (23) on both sides of the second sliding groove (21); the inner bottom wall height of the second limiting groove (23) is higher than that of the second abutting groove (19); 9); the second sliding block (24) and the second positioning block (25) are fixedly provided at the upper end of the second abutting block (20) in sequence; the second sliding block (24) is slidably provided in the second sliding groove (21); the third glass plate (14) is fixedly provided at the upper end of the second sliding block (24); the fourth glass plate is fixedly provided at the lower end of the limiting groove (42); the upper surface of the third glass plate (14) and the upper surface of the fourth glass plate are flush with each other; a suction cup (16) is jointly adsorbed on the flush upper surfaces of the two adsorption plates; the lower end of the fixed chassis (2) is provided with a second accommodating groove for sliding the extended portion of the second positioning block (25); the length of the extended portion of the second positioning block (25) is less than the length of the accommodating second sliding groove.

9. The semiconductor processing cooling device according to claim 8, characterized in that: The outer end surface of the second abutment block (20) is provided with a notch positioning slot; the middle slot portion of the notch positioning slot is connected to the outside, while the outer end surfaces of the slot portions on both sides are not connected to the outside; the middle portion of the notch positioning block (26) is slidably arranged in the middle slot of the notch positioning slot, while the two side portions are slidably arranged in the two side slot portions of the notch positioning slot.

10. The semiconductor processing cooling device according to claim 1, characterized in that: The driving device is arranged on a driving workbench (6); the driving device comprises a front-rear movement driving mechanism and a left-right movement driving mechanism; The forward and backward motion driving mechanism comprises a first driving motor (28), a longitudinal screw (29), a longitudinal slideway (30) and a convex-shaped sliding block (31); the first driving motor (28) is arranged on the driving workbench (6); the motor shaft of the first driving motor (28) is connected to the longitudinal screw (29); the motor shaft of the first driving motor (28) passes through a motor shaft limit plate, and the motor shaft limit plate is fixedly arranged on the driving workbench (6); the driving workbench (6) is provided with a longitudinal slideway (30); the longitudinal screw (29) is externally threadedly connected to a convex-shaped sliding block (31); the convex-shaped sliding block (31) is slidably arranged on the longitudinal slideway (30); A cylinder fixed horizontal plate (32) is provided at the upper end of a convex sliding block (31) on the longitudinal screw rod (29); The left-right motion driving mechanism comprises a second driving motor (35), a transverse screw (36), a transverse slideway (37) and a convex-shaped sliding block (31); the second driving motor (35) is arranged on the driving workbench (6); the motor shaft of the second driving motor (35) is connected to the transverse screw (36); the motor shaft of the second driving motor (35) passes through a motor shaft limiting plate, and the motor shaft limiting plate is fixed on the driving workbench (6); the transverse screw (36) is externally threadedly connected to a convex-shaped sliding block (31); the convex-shaped sliding block (31) is slidably arranged on the transverse slideway (37); The upper end surface of the driving workbench (6) is laterally provided with two limit sliding strips (38); The longitudinal slideway (30) is provided with two limit grooves (42) in a transverse direction corresponding to the positions of the two limit slide bars (38); the two limit slide bars (38) are respectively matched and penetrate the two limit grooves (42).

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