An IGBT chip and its packaging structure

Abstract

This invention discloses an IGBT chip and its packaging structure, relating to the field of IGBT chip packaging technology. The IGBT chip packaging structure includes a chip body and bonding wires. Multiple sets of bonding wires are evenly distributed, and one end of each bonding wire is soldered to the top of the chip body. During the packaging process using the wire bonding structure, the supporting components, positioning components, and limiting components work together to push the pressing bevels on the limiting plate against one side of the chip body placed in the positioning groove, before it is firmly bonded. Through the pressing action of the pressing bevels on each set of limiting plates against the surrounding area of ​​the chip body, the placed chip body is centered and positioned. Furthermore, the pressing action of the pressing bevels further limits and compresses the positioned chip body, ensuring the accuracy of chip body placement and thus guaranteeing the packaging effect of the IGBT chip.

Description

Technical Field

[0001] The present invention relates to the technical field of IGBT chip packaging, in particular to an IGBT chip and a packaging structure thereof. Background Art

[0002] IGBT chips mainly have the following packaging structures:

[0003] 1. Direct wire bonding structure (DLB): This structure uses solder to directly connect the bonding wire to the chip surface, reducing parasitic inductance and improving interconnection reliability. Compared with traditional wire bonding modules, its internal inductance is reduced by 57% and the internal lead resistance is also reduced by half;

[0004] 2. SKiN structure: The SKiN module structure adopts a wire-free bonding method, using a double-layer flexible printed circuit board to connect MOSFET and as a current path, which helps to improve overall performance and reliability;

[0005] 3. 2.5D and 3D module packaging structures: These structures achieve interconnection between power chips or between power chips and driving circuits through multi-layer substrates, further reducing parasitic effects and improving performance1.

[0006] 4. Press-fit IGBT devices: including press-fit single-chip devices and press-fit multi-chip devices. The internal chip and external electrodes are electrically connected by applying pressure, which has the advantages of low thermal resistance, double-sided heat dissipation, and failure short circuit.

[0007] In the process of packaging IGBT chips using wire bonding structure, the connection between chip and substrate is one of the key steps, which directly affects the performance and reliability of the package. In the actual process of welding connection between chip and substrate, auxiliary positioning is required by means of positioning pins. This positioning method will still cause chip displacement due to the clearance fit between positioning holes and positioning pins, affecting the quality of packaging IGBT chips using wire bonding structure. To this end, we propose an IGBT chip and its packaging structure. Summary of the invention

[0008] The object of the present invention is to provide an IGBT chip and a packaging structure thereof to solve the problems raised in the above background technology.

[0009] To achieve the above object, the present invention provides the following technical solution: an IGBT chip packaging structure, the IGBT chip includes a chip body and bonding wires, the bonding wires are evenly distributed in multiple groups, and one end of the bonding wire is soldered on the top of the chip body by solder;

[0010] It also includes a substrate, two groups of lining plates are arranged above the substrate, a welding layer is arranged between the lining plate at the bottom and the substrate, a ceramic plate is fixed between the two groups of lining plates, a diode is welded on the upper end of the lining plate at the top, the diode and the chip body are connected by a bonding wire, a packaging seat for engaging with the substrate is arranged above the substrate, and a supporting component for placing and supporting the chip body and a heat dissipation component for dissipating heat from the chip body during the packaging process are arranged on the substrate;

[0011] The support assembly includes a support plate arranged above the base plate, an organ pipe is connected between the lower end of the support plate and the base plate, a first spring is sleeved on the outer side of the organ pipe, and two ends of the first spring are respectively arranged to abut against the support plate and the base plate.

[0012] Preferably, the heat dissipation components are provided in multiple groups, and the multiple groups of heat dissipation components are evenly distributed around the support plate. The heat dissipation components include multiple groups of mounting seats arranged and fixed on the upper end of the substrate, the interior of each group of the mounting seats is hollow and communicated with the bottom of the substrate, the interior of the support plate is provided with a mounting cavity, and multiple groups of flow tubes are installed around the support plate, and the two ends of the flow tubes are respectively communicated with the interior of the mounting cavity and the mounting seat, a positioning component for positioning the chip body after placement is provided on the mounting seat, and a limiting component for limiting the chip body after positioning is provided between two adjacent groups of the mounting seats.

[0013] Preferably, the positioning component includes a plurality of groups of positioning grooves opened on the upper end of the mounting seat, there is a height difference between adjacent positioning grooves and they are arranged in a stepped manner on the mounting seat, the limiting component is located between the two groups of positioning grooves at the same height on the mounting seat, the positioning grooves are coated with a colloid for promoting the adhesion and adsorption of the rear chip body, and a guide slope is provided between the two adjacent groups of positioning grooves to facilitate the insertion of the auxiliary chip body.

[0014] Preferably, the limiting assembly includes a mounting frame fixed between two groups of mounting seats, a limiting plate is arranged on the side of the mounting frame close to the support plate, a first connecting assembly for connecting the limiting plate is arranged on the mounting frame, an extrusion slope is opened on one side of the limiting plate for pressing against the corner of the chip body, and a pushing assembly for pushing the limiting plate is arranged on the mounting frame.

[0015] Preferably, the pushing assembly includes a first piston cylinder fixed on a mounting frame, a first piston rod is slidably connected to the first piston cylinder, one end of the first piston rod is fixed to a limit plate, and an inflation assembly for inflating the interior of the first piston cylinder is arranged between the mounting frame and the support plate.

[0016] Preferably, the inflation component includes a mounting tube installed on a mounting frame, one end of the mounting tube is communicated with the interior of the first piston cylinder, a fixing tube is fixed to the other end of the mounting tube, one end of the fixing tube is communicated with a second piston cylinder, a second piston rod is slidably connected to the second piston cylinder, one end of the second piston rod is fixed to the bottom of a support plate, and a control component for gas circulation control is provided on the mounting tube.

[0017] Preferably, the control component includes an installation frame installed on the installation pipe, and a blocking plate for sealing the installation pipe is slidably connected to the installation frame, the upper end of the blocking plate is higher than the height of the positioning groove, a through hole is formed on the blocking plate, and a second connecting component for connecting the blocking plate is provided on the installation frame.

[0018] Preferably, the second connecting assembly includes a strip plate fixed to the upper end of the blocking plate, fixed blocks are fixed on both sides of the mounting frame, a T-shaped rod is slidably connected to the fixed block, one end of the T-shaped rod is fixed to the strip plate, and a second spring is sleeved on the outer side of the T-shaped rod.

[0019] Preferably, the first connecting assembly includes two groups of sleeves fixed on one side of the limit plate, the two groups of sleeves are respectively located on both sides of the first piston cylinder, a sliding rod is slidably connected to the sleeve, one end of the sliding rod is fixed to the mounting frame, and a third spring is sleeved on the outer side of the sleeve.

[0020] Compared with the prior art, the present invention has the following beneficial effects:

[0021] During the packaging operation of the IGBT chip of the present invention using the wire bonding structure, the support component, the positioning component and the limit component cooperate with each other to push the extrusion slope on the limit plate against the side of the chip body that is placed on the positioning groove and not bonded. The placed chip body is centrally positioned through the extrusion slopes on each group of limit plates and the surrounding of the chip body. The chip body is extruded and limited after being positioned and placed through the push and pull of each group of extrusion slopes, thereby ensuring the accuracy of chip body placement and further ensuring the packaging effect of the IGBT chip. BRIEF DESCRIPTION OF THE DRAWINGS

[0022] Figure 1 It is a schematic diagram of the overall appearance structure of the present invention;

[0023] Figure 2 It is a schematic diagram of the chip structure of the present invention;

[0024] Figure 3 This is a schematic diagram of the chip of the present invention after being positioned and placed;

[0025] Figure 4 A schematic diagram of the positional relationship between the support plate and multiple groups of heat dissipation components of the present invention;

[0026] Figure 5 It is a schematic diagram of the support assembly structure of the present invention;

[0027] Figure 6 It is a schematic diagram of the structure of the heat dissipation assembly of the present invention;

[0028] Figure 7 It is a schematic diagram of the structure of the inflatable component of the present invention;

[0029] Figure 8 It is a schematic diagram of the structure of the positioning component of the present invention;

[0030] Fig. 9 It is a schematic diagram of the structure of the inflatable component of the present invention;

[0031] Fig.10 It is a schematic diagram of the structures of the limit assembly, the pushing assembly, the first connecting assembly, the control assembly and the second connecting assembly of the present invention.

[0032] In the figure: 101, chip body; 102, bonding wire; 201, substrate; 202, lining plate; 203, ceramic plate; 204, solder layer; 205, diode; 206, package seat; 301, support plate; 302, organ pipe; 303, first spring; 401, mounting seat; 402, flow pipe; 501, positioning groove; 502, guide slope; 601, mounting frame; 602, limit plate; 603, extrusion Pressure ramp; 701, sleeve; 702, slide rod; 703, third spring; 801, first piston cylinder; 802, first piston rod; 901, fixed tube; 902, mounting tube; 903, second piston cylinder; 904, second piston rod; 1001, mounting frame; 1002, blocking plate; 1003, through hole; 1101, strip plate; 1102, fixing block; 1103, T-bar; 1104, second spring. DETAILED DESCRIPTION

[0033] The following will be combined with the drawings in the embodiments of the present invention to clearly and completely describe the technical solutions in the embodiments of the present invention. Obviously, the described embodiments are only part of the embodiments of the present invention, not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the present invention.

[0034] Example 1

[0035] See also Figure 1-Figure 10 , an IGBT chip packaging structure shown in the figure, the IGBT chip includes a chip body 101 and bonding wires 102, the bonding wires 102 are evenly distributed in multiple groups, and one end of the bonding wire 102 is soldered to the top of the chip body 101 through solder;

[0036] It also includes a substrate 201, two groups of lining plates 202 are arranged above the substrate 201, a welding layer 204 is arranged between the lower lining plate 202 and the substrate 201, a ceramic plate 203 is fixed between the two groups of lining plates 202, a diode 205 is welded on the upper end of the upper lining plate 202, the diode 205 is connected to the chip body 101 through the bonding wire 102, a packaging seat 206 for engaging with the substrate 201 is arranged above the substrate 201, and a supporting component for placing and supporting the chip body 101 and a heat dissipation component for dissipating heat from the chip body 101 during the packaging process are arranged on the substrate 201;

[0037] The support assembly includes a support plate 301 disposed above the base plate 201, an organ pipe 302 is connected between the lower end of the support plate 301 and the base plate 201, a first spring 303 is sleeved on the outer side of the organ pipe 302, and two ends of the first spring 303 are respectively disposed against the support plate 301 and the base plate 201;

[0038] It should be noted here that: during the packaging operation of the IGBT chip using the wire bonding structure, the support component, the positioning component and the limit component cooperate with each other to push the extrusion slope 603 on the limit plate 602 to abut against one side of the chip body 101 that is placed on the positioning groove 501 and not bonded. Through the abutment and extrusion effect of the extrusion slopes 603 on each group of the limit plates 602 and the four sides of the chip body 101, the placed chip body 101 is centered, and through the abutment and push of each group of extrusion slopes 603, the chip body 101 that is positioned and placed is squeezed and limited, thereby ensuring the accuracy of the placement of the chip body 101 and further ensuring the packaging effect of the IGBT chip.

[0039] Preferably, multiple groups of heat dissipation components are provided, and the multiple groups of heat dissipation components are evenly distributed around the support plate 301. The heat dissipation components include multiple groups of mounting seats 401 arranged and fixed on the upper end of the substrate 201. The interior of each group of mounting seats 401 is hollow and communicated with the bottom of the substrate 201. The interior of the support plate 301 is provided with a mounting cavity. Multiple groups of flow tubes 402 are installed around the support plate 301. The two ends of the flow tubes 402 are respectively communicated with the interior of the mounting cavity and the mounting seat 401. A positioning component for positioning the chip body 101 after placement is provided on the mounting seat 401, and a limiting component for limiting the position of the chip body 101 after positioning is provided between two adjacent groups of mounting seats 401;

[0040] It should be noted that: since each group of mounting seats 401 is hollow inside and communicates with the bottom of the substrate 201, after the chip body 101 is packaged, the heat generated by the chip body 101 can be discharged to the outside through the mounting cavity, the flow tube 402 and the mounting seat 401, so as to dissipate the heat of the chip body 101 during operation;

[0041] It is worth noting here that: when the support plate 301 moves toward the substrate 201, the first spring 303 is deformed by force to generate elastic force. The elastic force of the first spring 303 ensures the offset effect between the support plate 301 and the chip body 101, further facilitating the subsequent heat dissipation component to assist in the heat dissipation operation of the chip body 101.

[0042] Preferably, the positioning assembly includes a plurality of groups of positioning grooves 501 provided on the upper end of the mounting seat 401, there are height differences between adjacent positioning grooves 501 and they are arranged in a stepped manner on the mounting seat 401, the limiting assembly is located between the positioning grooves 501 of the same height on the two groups of mounting seats 401, the positioning grooves 501 are coated with a colloid for promoting the adhesion and adsorption of the rear chip body 101, and a guiding inclined surface 502 is provided between the two adjacent groups of positioning grooves 501 to facilitate the placement of the auxiliary chip body 101;

[0043] It should be noted that: the chip body 101 is pushed toward the support plate 301 on the substrate 201 and abutted against each other, so that the chip body 101 and the support plate 301 move toward the substrate 201. During the movement, the chip body 101 abuts against the positioning grooves 501 at the same height of each group of positioning components, and the colloid on the positioning grooves 501 adsorbs and positions the placed chip body 101.

[0044] It should be noted here that: a plurality of groups of positioning grooves 501 are provided at the upper end of the mounting seat 401, there is a height difference between adjacent positioning grooves 501 and they are arranged in a stepped manner on the mounting seat 401, and the positioning grooves 501 with height differences facilitate positioning of chip bodies 101 of different specifications and sizes, and in the positioning process, the guiding slope 502 facilitates the chip body 101 to slide to a lower positioning groove 501.

[0045] Preferably, the limiting assembly includes a mounting frame 601 fixed between the two groups of mounting seats 401, a limiting plate 602 is arranged on the side of the mounting frame 601 close to the support plate 301, a first connecting assembly for connecting the limiting plate 602 is arranged on the mounting frame 601, an extrusion inclined surface 603 for abutting against and extruding the corner of the chip body 101 is opened on one side of the limiting plate 602, and a pushing assembly for pushing the limiting plate 602 is arranged on the mounting frame 601;

[0046] It should be noted here that: by pushing the component, the extrusion slope 603 on the limit plate 602 is pushed against the side of the chip body 101 that is placed on the positioning groove 501 and not glued, and the chip body 101 is centered through the extrusion slopes 603 on each group of limit plates 602 and the four sides of the chip body 101. The chip body 101 is pushed and limited after positioning and placement through the push and push of each group of extrusion slopes 603, thereby ensuring the accuracy of the placement of the chip body 101.

[0047] Preferably, the pushing assembly includes a first piston cylinder 801 fixed on the mounting frame 601, a first piston rod 802 is slidably connected to the first piston cylinder 801, one end of the first piston rod 802 is fixed to the limit plate 602, and an inflation assembly for inflating the interior of the first piston cylinder 801 is provided between the mounting frame 601 and the support plate 301;

[0048] It should be noted here that: the interior of the mounting tube 902 is inflated through the inflation assembly, and the pressure after the inflation inside the mounting tube 902 pushes the first piston rod 802 to move toward the outside of the first piston cylinder 801. During the movement, the extrusion slope 603 on the limit plate 602 is pushed to abut against the side of the chip body 101 that is placed on the positioning groove 501 but not glued.

[0049] Preferably, the inflatable assembly includes a mounting tube 902 mounted on the mounting frame 601, one end of the mounting tube 902 is communicated with the interior of the first piston cylinder 801, the other end of the mounting tube 902 is fixed with a fixing tube 901, one end of the fixing tube 901 is communicated with and connected to a second piston cylinder 903, a second piston rod 904 is slidably connected to the second piston cylinder 903, one end of the second piston rod 904 is fixed to the bottom of the support plate 301, and a control assembly for gas circulation control is provided on the mounting tube 902;

[0050] It should be noted here that: in the process of pushing the opposing support plate 301 to move toward the base plate 201, as the support plate 301 moves, each group of second piston rods 904 are pushed to slide toward the inside of the second piston cylinder 903 respectively. During the movement, the interior of the fixed tube 901 is inflated to make the interior of the fixed tube 901 in a high-pressure state. When the control component is connected to the mounting tube 902, part of the high-pressure gas inside the fixed tube 901 rushes into the interior of the mounting tube 902. Since the first piston cylinder 801 is connected to the interior of the mounting tube 902, the first piston rod 802 is pushed toward the outside of the first piston cylinder 801 by the pressure after the inflation inside the mounting tube 902.

[0051] Preferably, the control assembly includes an installation frame 1001 which is installed on the installation tube 902, a plugging plate 1002 for plugging the installation tube 902 is slidably connected to the installation frame 1001, the upper end of the plugging plate 1002 is higher than the height of the positioning groove 501, a through hole 1003 is opened on the plugging plate 1002, and a second connecting assembly for connecting the plugging plate 1002 is provided on the installation frame 1001;

[0052] It should be noted here that: when the chip body 101 is not in contact with the blocking plate 1002, the mounting tube 902 is blocked by the blocking plate 1002, and in the process of the support plate 301 and the chip body 101 moving toward the substrate 201, the chip body 101 and the upper end of the strip plate 1101 are in contact with each other, pushing the blocking plate 1002 to move toward the inside of the mounting frame 1001, and in the process of the movement of the blocking plate 1002, the through hole 1003 is communicated with the inside of the mounting tube 902, and at this time, the pipeline between the fixed tube 901 and the mounting tube 902 is connected.

[0053] Preferably, the second connecting assembly includes a strip plate 1101 fixed to the upper end of the blocking plate 1002, fixed blocks 1102 are fixed on both sides of the mounting frame 1001, a T-shaped rod 1103 is slidably connected to the fixed block 1102, one end of the T-shaped rod 1103 is fixed to the strip plate 1101, and a second spring 1104 is sleeved on the outer side of the T-shaped rod 1103;

[0054] It should be noted here that the movement of the strip plate 1101 and the blocking plate 1002 after being subjected to force is guided by the fixing block 1102 and the T-bar 1103 , and the blocking plate 1002 and the strip plate 1101 are easily reset after movement by the second spring 1104 .

[0055] Preferably, the first connecting assembly includes two sets of sleeves 701 fixed on one side of the limiting plate 602, the two sets of sleeves 701 are respectively located on both sides of the first piston cylinder 801, a sliding rod 702 is slidably connected to the sleeve 701, one end of the sliding rod 702 is fixed to the mounting frame 601, and a third spring 703 is sleeved on the outer side of the sleeve 701;

[0056] It should be noted here that: the movement of the limit plate 602 after being subjected to force is guided by the sleeve 701 and the slide rod 702, and the return movement of the limit plate 602 after movement is facilitated by the third spring 703.

[0057] In this solution: an IGBT chip and its packaging structure, including the following steps:

[0058] During the packaging operation of the IGBT chip using the wire bonding structure, the chip body 101 is pushed toward the support plate 301 on the substrate 201 and abutted against each other, so that the chip body 101 and the support plate 301 move toward the substrate 201. During the movement, the chip body 101 abuts against the positioning grooves 501 at the same height of each group of positioning components, and the placed chip body 101 is adsorbed by the colloid on the positioning grooves 501. After the chip body 101 is pushed for a period of time, the chip body 101 is adsorbed and mounted on the positioning grooves 501 of each group of mounting seats 401;

[0059] In the process of pushing the support plate 301 to move toward the substrate 201, as the support plate 301 moves, each group of second piston rods 904 are pushed to slide toward the inside of the second piston cylinder 903 respectively. During the movement, the interior of the fixed tube 901 is inflated to make the interior of the fixed tube 901 in a high-pressure state. In the process of the support plate 301 and the chip body 101 moving toward the substrate 201, the chip body 101 and the upper end of the strip plate 1101 are abutted, pushing the blocking plate 1002 to move toward the inside of the installation frame 1001. In the process of the movement of the blocking plate 1002, the through hole 1003 is communicated with the inside of the installation tube 902. At this time, the pipeline between the fixed tube 901 and the installation tube 902 is connected, so that part of the high-pressure gas inside the fixed tube 901 rushes in To the inside of the mounting tube 902, because the first piston cylinder 801 is connected to the inside of the mounting tube 902, the pressure after the inflation inside the mounting tube 902 pushes the first piston rod 802 to move toward the outside of the first piston cylinder 801. During the movement, the extrusion slope 603 on the limiting plate 602 is pushed to abut against one side of the chip body 101 that is placed and not fixed on the positioning groove 501. Through the abutment and extrusion effect of the extrusion slopes 603 on each group of limiting plates 602 and the surrounding of the chip body 101, the placed chip body 101 is centered, and through the abutment and pushing of each group of extrusion slopes 603, the chip body 101 that is positioned and placed is squeezed and limited, thereby ensuring the accuracy of the placement of the chip body 101 and further ensuring the effect of IGBT chip packaging;

[0060] After the chip body 101 is positioned, the chip body 101 and the diode 205 are welded by welding materials. After the welding is completed, the packaging seat 206 and the substrate 201 are buckled together, and the packaging seat 206 and the substrate 201 are injected with glue for packaging. During the process of injection packaging, the colloid is filled in the gap between the chip body 101 and the two adjacent groups of support plates 301, thereby improving the adhesion of the chip body 101 after injection, and further ensuring the quality of packaging.

[0061] It should be noted that, in this article, relational terms such as first and second, etc. are only used to distinguish one entity or operation from another entity or operation, and do not necessarily require or imply any such actual relationship or order between these entities or operations. Moreover, the terms "include", "comprise" or any other variants thereof are intended to cover non-exclusive inclusion, so that a process, method, article or device including a series of elements includes not only those elements, but also other elements not explicitly listed, or also includes elements inherent to such process, method, article or device.

[0062] Although embodiments of the present invention have been shown and described, it will be appreciated by those skilled in the art that various changes, modifications, substitutions and variations may be made to the embodiments without departing from the principles and spirit of the present invention, and that the scope of the present invention is defined by the appended claims and their equivalents.

Claims

1. An IGBT chip packaging structure, the IGBT chip comprising: A chip body (101) and bonding wires (102), wherein the bonding wires (102) are evenly distributed in a plurality of groups, and one end of the bonding wires (102) is welded to the top of the chip body (101) by solder; It is characterized by further comprising: A substrate (201), wherein two groups of lining plates (202) are arranged above the substrate (201), a welding layer (204) is arranged between the lining plate (202) at the bottom and the substrate (201), a ceramic plate (203) is fixed between the two groups of lining plates (202), a diode (205) is welded to the upper end of the lining plate (202) at the top, the diode (205) is connected to the chip body (101) via a bonding wire (102), a packaging seat (206) for engaging with the substrate (201) is arranged above the substrate (201), and a support component for supporting the placement of the chip body (101) and a heat dissipation component for dissipating heat from the chip body (101) during the packaging process are arranged on the substrate (201); The support assembly comprises a support plate (301) arranged above the base plate (201); an organ pipe (302) is connected between the lower end of the support plate (301) and the base plate (201); a first spring (303) is sleeved on the outer side of the organ pipe (302); and two ends of the first spring (303) are respectively arranged to abut against the support plate (301) and the base plate (201).

2. The IGBT chip packaging structure according to claim 1, characterized in that: The heat dissipation components are provided in multiple groups, and the multiple groups of heat dissipation components are evenly distributed around the support plate (301). The heat dissipation components include multiple groups of mounting seats (401) arranged and fixed on the upper end of the substrate (201), each group of the mounting seats (401) is hollow inside and is arranged in communication with the bottom of the substrate (201), the support plate (301) is provided with a mounting cavity inside, multiple groups of flow tubes (402) are installed around the support plate (301), the two ends of the flow tubes (402) are respectively in communication with the mounting cavity and the inside of the mounting seat (401), a positioning component for positioning the chip body (101) after placement is provided on the mounting seat (401), and a limiting component for limiting the position of the chip body (101) after positioning is provided between two adjacent groups of the mounting seats (401).

3. The IGBT chip packaging structure according to claim 2, characterized in that: The positioning assembly comprises a plurality of groups of positioning grooves (501) provided at the upper end of the mounting seat (401), there being a height difference between adjacent positioning grooves (501) and being arranged in a stepped manner on the mounting seat (401), the limiting assembly being located between two groups of positioning grooves (501) at the same height on the mounting seat (401), the positioning grooves (501) being coated with a colloid for promoting the adhesion and adsorption of the rear chip body (101), and a guiding inclined surface (502) for facilitating the insertion of the auxiliary chip body (101) being arranged between two adjacent groups of positioning grooves (501).

4. The IGBT chip packaging structure according to claim 3, characterized in that: The limiting component comprises a mounting frame (601) fixed between two groups of mounting seats (401); a limiting plate (602) is arranged on the side of the mounting frame (601) close to the support plate (301); a first connecting component for connecting the limiting plate (602) is arranged on the mounting frame (601); an extrusion inclined surface (603) for abutting against and extruding the corner of the chip body (101) is opened on one side of the limiting plate (602); and a pushing component for pushing the limiting plate (602) is arranged on the mounting frame (601).

5. The IGBT chip packaging structure according to claim 4, characterized in that: The pushing assembly comprises a first piston cylinder (801) fixed on a mounting frame (601), a first piston rod (802) being slidably connected to the first piston cylinder (801), one end of the first piston rod (802) being fixed to a limiting plate (602), and an inflation assembly for inflating the interior of the first piston cylinder (801) is arranged between the mounting frame (601) and the support plate (301).

6. The IGBT chip packaging structure according to claim 5, characterized in that: The inflation component includes a mounting tube (902) mounted on a mounting frame (601), one end of the mounting tube (902) being connected to the interior of a first piston cylinder (801), the other end of the mounting tube (902) being fixed with a fixing tube (901), one end of the fixing tube (901) being connected to a second piston cylinder (903), a second piston rod (904) being slidably connected to the second piston cylinder (903), one end of the second piston rod (904) being fixed to the bottom of a support plate (301), and a control component for controlling gas circulation being arranged on the mounting tube (902).

7. The IGBT chip packaging structure according to claim 6, characterized in that: The control component comprises an installation frame (1001) which is installed on the installation tube (902), and a blocking plate (1002) is slidably connected to the installation frame (1001) for sealing the installation tube (902). The upper end of the blocking plate (1002) is higher than the height of the positioning groove (501), and a through hole (1003) is provided on the blocking plate (1002). The installation frame (1001) is provided with a second connecting component for connecting the blocking plate (1002).

8. The IGBT chip packaging structure according to claim 7, characterized in that: The second connection assembly comprises a strip plate (1101) fixed to the upper end of the blocking plate (1002), fixed blocks (1102) are fixed on both sides of the installation frame (1001), a T-shaped rod (1103) is slidably connected to the fixed block (1102), one end of the T-shaped rod (1103) is fixed to the strip plate (1101), and a second spring (1104) is sleeved on the outer side of the T-shaped rod (1103).

9. The IGBT chip packaging structure according to claim 8, characterized in that: The first connecting component includes two groups of sleeves (701) fixed on one side of the limit plate (602), the two groups of sleeves (701) are respectively located on both sides of the first piston cylinder (801), a sliding rod (702) is slidably connected to the sleeve (701), one end of the sliding rod (702) is fixed to the mounting frame (601), and a third spring (703) is sleeved on the outer side of the sleeve (701).

Images