Apparatus and method for nanometer scale imprinting of an entire wafer

Abstract

The application discloses a kind of whole wafer nanoimprint's device and method, including storage tank and the transmission platform being set to the top of storage tank one side, the inside of the storage tank is equipped with several support plates by transmission member in both sides, and the top surface between left and right two support plates is placed with wafer, the back of the transmission platform is fixed with first electric slide rail, and the top surface of first electric slide rail is slidably provided with first electric push rod, and the application relates to wafer production technical field.The whole wafer nanoimprint's device and method are set through the setting of adsorption material taking mechanism, can be automatically adsorbed from the inside of storage box Wafer is taken out and placed on the top surface of placing plate, and after completing nanoimprint, wafer can be transferred to the top surface of transmission platform, and through transmission platform, the wafer unloading transfer work is realized, realizes the automatic feeding and discharging of wafer, greatly reduces the work intensity, and wafer breakage caused by personnel error can also be avoided.

Description

TECHNICAL FIELD

[0001] The present application relates to the technical field of wafer production, in particular to a device and method for nano-imprinting of whole wafer. BACKGROUND

[0002] Wafer refers to a silicon wafer used for making silicon semiconductor circuits, and its raw material is silicon. High-purity polycrystalline silicon is dissolved and added to a silicon crystal seed, and then slowly pulled out to form a cylindrical single crystal silicon. After the silicon rod is ground, polished and sliced, a silicon wafer, i.e. a wafer, is formed. Domestic wafer production lines mainly use 8-inch and 12-inch wafers.

[0003] According to the patent with the patent application number CN202223332002.X, a micro-nano imprinting device based on a soft template includes, from top to bottom, an ultraviolet lamp, a support ring for carrying the soft template, and an imprinting stage for carrying the wafer. The imprinting stage is in transmission connection with a lifting driving device, and the lifting driving device is used to drive the imprinting stage to lift; a closed pressure adjusting cavity is provided between the support ring and the ultraviolet lamp, the pressure adjusting cavity is in communication with a pressure adjusting mechanism through a pipeline, and the pressure adjusting mechanism is used to adjust the pressure in the pressure adjusting cavity.

[0004] In the above-mentioned patent, the personnel place the wafer on the top surface of the pressure platform and take it after nano-imprinting, which is complicated and labor-intensive, and it is difficult to realize the automatic feeding and discharging work of the wafer. In addition, there is no limiting clamping structure on the periphery of the wafer, and the position of the wafer is easy to deviate during the imprinting process, thereby affecting the subsequent imprinting effect. Therefore, in view of the above-mentioned deficiencies, the present application makes the following improvements. SUMMARY

[0005] (I) Technical problems solved

[0006] In view of the deficiencies of the prior art, the present application provides a device and method for nano-imprinting of whole wafer, which solves the problems mentioned in the background art.

[0007] (II) Technical solutions

[0008] To achieve the above purpose, the present application is realized by the following technical solutions: a device for nano-imprinting of whole wafer, comprising a storage tank and a transmission table arranged on the top of one side of the storage tank, a plurality of support plates are arranged on both sides of the inside of the storage tank through transmission members, and a wafer is placed between the top surfaces of the left and right two support plates, a first electric sliding rail is fixedly arranged on the back surface of the transmission table, a first electric push rod is slidably arranged on the top surface of the first electric sliding rail, and a suction material taking mechanism is arranged on the extension end of the first electric push rod through a mounting plate;

[0009] The adsorption material taking mechanism comprises a threaded sleeve rotatably arranged in the mounting plate, a threaded rod threadedly connected to the inside of the threaded sleeve, a vertical pipe arranged in the inside of the threaded rod, and an adsorption pipe communicated with one end of the vertical pipe at the bottom surface of the threaded rod.

[0010] Preferably, the transmission member comprises first and second chain wheels rotatably arranged on the two sides of the storage box, and a chain transmissionally connected between the surfaces of the first and second chain wheels, one side of the support plate is fixedly arranged on the surface of the chain, the distance between the upper and lower support plates is equal, a groove is formed in the top surface of the support plate, and the inner wall of the groove is provided with an arc-shaped clamping plate through a buffer spring.

[0011] Preferably, a plurality of placing grooves are formed in the front surface of the storage box, and a push plate is arranged on the front surface of the arc-shaped clamping plate, one side of the push plate penetrates through the placing grooves and extends to the front surface of the placing grooves.

[0012] Preferably, a limiting and fixing mechanism is arranged on the top surface of the storage box, and the limiting and fixing mechanism comprises an annular box fixedly arranged on the top surface of the storage box, a rotating ring rotatably arranged on the top surface of the annular box through a support leg, a special-shaped ring fixedly arranged on the top surface of the rotating ring, a fixed ring arranged in the inside of the special-shaped ring, a slanted plate slidably arranged in the inside of the fixed ring, a third electric push rod fixedly arranged on one side of the slanted plate, and a placing plate fixedly arranged on the extending end of the third electric push rod, an L-shaped air suction pipe communicated with the bottom surface of the placing plate, the bottom end of the L-shaped air suction pipe is communicated with the inner wall of the annular box, and a driving portion is arranged on the top surface of the storage box for driving the rotating ring to rotate.

[0013] Preferably, a slanted groove matched with the slanted plate is formed in the inside of the special-shaped ring, one side of the slanted plate in the inside of the slanted groove is a slanted surface, an active groove matched with the slanted plate is formed in the inside of the fixed ring, limiting blocks are fixedly arranged on the two sides of the inner wall of the active groove, the limiting blocks are slidably arranged in the inside of the slanted plate, and clamping springs are arranged between the surfaces of the limiting blocks and the inside of the slanted plate.

[0014] Preferably, the driving portion comprises a control motor fixedly arranged on one side of the top of the storage box through a support column, a driving gear fixedly arranged on one end of the output shaft of the control motor through a shaft coupling, and a driven gear fixedly arranged on the surface of the rotating ring and engaged with the driving gear.

[0015] Preferably, the front surface of the storage box is fixedly provided with a second electric sliding rail, and the top surface of the second electric sliding rail is slidably provided with a hydraulic oil cylinder, and the extending end of the hydraulic oil cylinder is provided with a stamping die plate through a connecting rod, and the surface of the connecting rod is fixedly provided with a fixing cover, and the top surface of the inner wall of the fixing cover is fixedly provided with an ultraviolet lamp.

[0016] The application further discloses a method for whole wafer nano-imprinting, and the method is specifically improved as follows.

[0017] S1, the wafer is inserted into the left and right adjacent two supporting plates through the placing groove, and the wafer is limited by the arc-shaped clamping plate;

[0018] S2, the wafer in the storage box is adsorbed and moved to the top surface of the fixing ring by the adsorption material taking mechanism, the bottom surface of the wafer is adsorbed and fixed by the limiting and fixing mechanism, and then the adsorption material taking mechanism is controlled to move to the initial position;

[0019] S3, the imprinting glue is coated on the top surface of the wafer on the placing plate by a person, the imprinting die plate is controlled to move downwards to perform the imprinting work on the wafer, the ultraviolet lamp in the fixing cover is turned on, the imprinting glue is solidified on the top surface of the wafer by the ultraviolet light, and after solidification, the imprinting die plate is controlled to move upwards to perform demolding;

[0020] S4, the wafer after imprinting is transferred to the top surface of the conveying table by the adsorption material taking mechanism, and the finished product is transferred by the conveying table.

[0021] (Three) beneficial effects

[0022] The application provides a whole wafer nano-imprinting device and method.

[0023] (1) The whole wafer nano-imprinting device and method can automatically adsorb and take out the wafer from the inside of the storage box and place the wafer on the top surface of the placing plate through the setting of the adsorption material taking mechanism, can transfer the wafer to the top surface of the conveying table after completing nano-imprinting, and realizes the unloading and transferring work of the wafer through the conveying table, realizes the automatic unloading and loading of the wafer, greatly reduces the work intensity, and can also avoid the problem that the wafer is broken due to personnel errors.

[0024] (2) The whole wafer nano-imprinting device and method can realize the automatic loading of the wafer in the storage box after one-time replenishment, and through the setting of the buffer spring and the arc-shaped clamping plate, the centers of all wafers are on an axis, so that the subsequent adsorption and material taking are facilitated, and the problem that the subsequent material taking is difficult due to different wafer placement positions is avoided.

[0025] (3), the device and method of the whole wafer nanoimprint, through the setting of the limiting fixing mechanism, the bottom surface of the wafer can be stably adsorbed after loading, and the position can be kept fixed during subsequent imprinting, so that the problem of affecting the imprinting quality caused by position deviation is avoided. BRIEF DESCRIPTION OF DRAWINGS

[0026] Figure 1 It is a perspective view of the structure of the application;

[0027] Figure 2 It is a sectional view of the structure of the storage box of the application;

[0028] Figure 3 It is a top view of the internal structure of the special-shaped ring and the fixing ring of the application;

[0029] Figure 4 It is a sectional view of the structure of the fixing ring of the application;

[0030] Figure 5 It is a structural schematic view of the adsorption material taking mechanism of the application.

[0031] In the figure: 1, storage box; 2, transmission table; 3, support plate; 4, first electric sliding rail; 5, first electric push rod; 6, adsorption material taking mechanism; 61, threaded sleeve; 62, threaded rod; 63, vertical pipe; 64, adsorption pipe; 65, second electric push rod; 66, pulley; 67, first sprocket; 68, second sprocket; 69, chain; 610, buffer spring; 611, arc clamping plate; 7, placing groove; 8, limiting fixing mechanism; 81, ring box; 82, rotating ring; 83, special-shaped ring; 84, fixing ring; 85, inclined plate; 86, third electric push rod; 87, placing plate; 88, L-shaped air pipe; 89, inclined groove; 810, limiting block; 811, clamping spring; 812, control motor; 813, driving gear; 814, driven gear; 9, second electric sliding rail; 10, hydraulic oil cylinder; 11, fixing cover; 12, imprinting template; 13, first motor; 14, second motor; 15, first gear; 16, second gear. DETAILED DESCRIPTION

[0032] The technical solutions in the embodiments of the application will be clearly and completely described below with reference to the drawings in the embodiments of the application. Obviously, the described embodiments are only part of the embodiments of the application, rather than all the embodiments. Based on the embodiments in the application, all other embodiments obtained by those skilled in the art without creative labor fall within the scope of protection of the application. Embodiment one

[0033] Please refer to Figure 1 , Figure 2 and Figure 5As shown, the present application provides a technical solution, the specific improvements are as follows:

[0034] A kind of whole wafer nanoimprint device, including storage tank 1 and the transmission table 2 of being arranged in the top of storage tank 1 side, transmission table 2 is prior art, this application file is not described in detail, the inside of the storage tank 1 both sides are provided with several support plates 3 by transmission member, and the top surface between left and right two support plates 3 is placed with wafer, the transmission member includes first sprocket 67 and second sprocket 68 being rotationally arranged in the both sides of storage tank 1, and the surface between first sprocket 67 and second sprocket 68 is drivingly connected with chain 69, the bottom of both sides of storage tank 1 is fixedly provided with first motor 13, and the output shaft of first motor 13 is fixedly connected with the surface of first sprocket 67 by coupling, one side of the support plate 3 is fixedly provided on the surface of chain 69, and the distance between the upper and lower support plates 3 is equal, the front of the storage tank 1 is provided with several placing grooves 7, the front of the arc-shaped clamping plate 611 is provided with a push plate, and one side of the push plate penetrates the placing groove 7 and extends to the front of the placing groove 7, the push plate is slidingly arranged in the inside of the placing groove 7, the top surface of the support plate 3 is provided with a groove, and the inner wall of the groove is provided with an arc-shaped clamping plate 611 by a buffer spring 610, the back of the transmission table 2 is fixedly provided with a first electric sliding rail 4, and the top surface of the first electric sliding rail 4 is slidingly provided with a first electric push rod 5, the extending end of the first electric push rod 5 is provided with a suction material taking mechanism 6 by a mounting plate, the suction material taking mechanism 6 includes a threaded sleeve 61 rotationally arranged in the inside of the mounting plate, and a threaded rod 62 is threadedly connected in the inside of the threaded sleeve 61, the top surface of the mounting plate is provided with a second motor 14, and the output shaft of the second motor 14 is fixedly connected with a first gear 15 by a coupling, the surface of the threaded sleeve 61 located at the top of the mounting plate is fixedly provided with a second gear 16 engaged with the first gear 15, the inside of the threaded rod 62 is provided with a vertical pipe 63, and the one end of the vertical pipe 63 located at the bottom surface of the threaded rod 62 is communicated with a suction pipe 64, the top end of the vertical pipe 63 is connected with an external vacuum equipment, the both sides of the surface of the vertical pipe 63 are fixedly provided with a second electric push rod 65 by an L-shaped rod, and the extending end of the second electric push rod 65 is rotationally provided with a pulley 66 by a connecting block;

[0035] Personnel controls left and right two arc-shaped clamping plates 611 to move away from each other by two push plates, wafer is inserted into the inside of the storage tank 1 through the placing groove 7 in advance and is located between the top surfaces of left and right two support plates 3, two wafers can be placed between the top surfaces of left and right two support plates 3, which can increase the number of wafer placement, the push plate is loosened, the arc-shaped clamping plate 611 is clamped on the outside of wafer under the action of the buffer spring 610, so as to limit the placement position of wafer;

[0036] When the wafer needs to be nano-imprinted, the first electric push rod 5 is controlled to move right along the top surface of the first electric sliding rail 4, so that the center axis of the vertical pipe 63 is in a straight line with the midpoint of the wafer, the first electric push rod 5 is controlled to lower the mounting plate, and at the same time, the second motor 14 is started, the second motor 14 drives the threaded sleeve 61 to rotate through the first gear 15 and the second gear 16, and the threaded rod 62 inside the threaded sleeve 61 moves downward while rotating, at this time, the vertical pipe 63 moves downward synchronously, until the bottom surface of the suction pipe 64 contacts the top surface of the wafer, the second motor 14 is turned off, the external vacuum equipment is started, and the wafer in contact with the vertical pipe 63 and the suction pipe 64 can be adsorbed, at the same time, in the process of adsorption, the second electric push rod 65 is started, the second electric push rod 65 moves the pulley 66 through the connecting block, the two pulleys 66 move away from each other, so that the arc-shaped clamping plate 611 is moved out, the arc-shaped clamping plate 611 releases the clamping of the current wafer, after the wafer is adsorbed stably, the threaded rod 62 is controlled to rise, the vertical pipe 63 rises synchronously to drive the wafer to move upward to the top surface of the storage box 1, the automatic feeding of the wafer can be realized, which is convenient for subsequent nano-imprinting work, after the wafer is imprinted, the wafer can be adsorbed by the suction pipe 64, and the wafer after imprinting can be transferred to the top surface of the transmission table 2 through the first electric sliding rail 4, the second motor 14 and the first electric push rod 5, and the automatic unloading of the wafer is completed.

[0037] In the process of wafer feeding, the first motor 13 is started, the first motor 13 drives the chain 69 through the first sprocket 67 and the second sprocket 68, the chain 69 drives the support plate 3 to move synchronously, and the wafer below moves upward synchronously, so that the wafer is replenished, and the automatic feeding of the wafer is facilitated. Example two

[0038] Based on example one, please refer to Figure 1 , Figure 3 and Figure 4 , the specific improvements are as follows:

[0039] The top surface of the storage box 1 is provided with a limiting and fixing mechanism 8, and the limiting and fixing mechanism 8 comprises an annular box 81 fixedly arranged on the top surface of the storage box 1, the front surface of the annular box 81 is communicated with a conduit, the top surface of the annular box 81 is rotatably provided with a rotating ring 82 through a supporting leg, and the top surface of the rotating ring 82 is fixedly provided with a special-shaped ring 83, the inside of the special-shaped ring 83 is provided with a fixed ring 84, the inside of the fixed ring 84 is slidably provided with an inclined plate 85, the inside of the special-shaped ring 83 is provided with an inclined groove 89 matched with the inclined plate 85, one side of the inside of the inclined groove 89 is inclined, the inside of the fixed ring 84 is provided with a movable groove matched with the inclined plate 85, and the two sides of the inner wall of the movable groove are fixedly provided with limiting blocks 810, the limiting blocks 810 are slidably arranged in the inside of the inclined plate 85, the surface of the limiting block 810 and the inside of the inclined plate 85 are provided with clamping springs 811, one side of the inclined plate 85 is fixedly provided with a third electric push rod 86, and the protruding end of the third electric push rod 86 is fixedly provided with a placing plate 87, the bottom surface of the placing plate 87 is communicated with an L-shaped air suction pipe 88, the surface of the L-shaped air suction pipe 88 is provided with two telescopic sections, so that the L-shaped air suction pipe 88 can be stretched leftward and rightward and upward and downward, the bottom end of the L-shaped air suction pipe 88 is communicated with the inner wall of the annular box 81, and the top surface of the storage box 1 is provided with a driving part for driving the rotating ring 82 to rotate, the driving part comprises a control motor 812 fixedly arranged on one side of the top of the storage box 1 through a supporting column, one end of the output shaft of the control motor 812 is fixedly provided with a driving gear 813 through a shaft coupling, and the surface of the rotating ring 82 is fixedly provided with a driven gear 814 engaged with the driving gear 813.

[0040] When the wafer is moved to the top surface of the fixed ring 84 by the adsorption material taking mechanism 6, the control motor 812 is started, so that the control motor 812 drives the rotating ring 82 to rotate through the driving gear 813 and the driven gear 814, in the synchronous rotating process of the special-shaped ring 83, the setting of the inclined groove 89 can drive the inclined plate 85 to move to the inside of the fixed ring 84, in the moving process, the third electric push rod 86 and the placing plate 87 can be driven to move synchronously, at the same time, the third electric push rod 86 is started, so that the protruding end of the third electric push rod 86 drives the placing plate 87 to rise, so that the placing plate 87 is in contact with the wafer on the bottom surface of the adsorption pipe 64, the control motor 812 can be turned off, and the air in the inside of the annular box 81 is sucked through the conduit, so that a negative pressure is generated, the wafer can be adsorbed and fixed on the top surface between the four placing plates 87 through the L-shaped air suction pipe 88, after the wafer is stably adsorbed on the top surface of the placing plate 87, the adsorption material taking mechanism 6 can be controlled to stop adsorbing the top surface of the wafer, and to move leftward to the initial position, so as to facilitate the subsequent wafer embossing work.

[0041] Embodiment three

[0042] Based on Example 2, please refer to Figure 1 As shown, the specific improvements are as follows:

[0043] The front of the storage box 1 is fixedly provided with a second electric slide rail 9, and a hydraulic cylinder 10 is slidably provided on the top surface of the second electric slide rail 9. The extended end of the hydraulic cylinder 10 is provided with an impression template 12 through a connecting rod. A fixing cover 11 is fixedly provided on the surface of the connecting rod, and an ultraviolet lamp is fixedly provided on the top surface of the inner wall of the fixing cover 11.

[0044] Personnel apply imprinting adhesive to the top surface of the wafer on the placement plate 87. After application, the second electric slide rail 9 is activated, causing it to control the hydraulic cylinder 10 to move to the left until the imprinting template 12 is directly above the wafer. The hydraulic cylinder 10 is then activated, causing its extended end to move the imprinting template 12 downward, thus enabling the wafer to be imprinted. The ultraviolet lamp is then turned on, and the imprinting adhesive is cured onto the top surface of the wafer using ultraviolet light. After curing, the imprinting template 12 is moved upward to demold the wafer. This part is prior art and will not be described in detail in this application. Example 4

[0045] Based on Example 3, please refer to Figures 1 to 5 As shown, this invention also discloses a method for nanoimprinting of an entire wafer, specifically including the following steps:

[0046] S1. Insert the wafer through the placement slot 7 and place it on the two adjacent support plates 3 on the left and right sides. Use the arc-shaped clamping plate 611 to limit the wafer.

[0047] S2. The wafer inside the storage box 1 is adsorbed and moved to the top surface of the fixing ring 84 by the adsorption and picking mechanism 6, and the bottom surface of the wafer is adsorbed and fixed by the limiting and fixing mechanism 8, and then the adsorption and picking mechanism 6 is controlled to move to the initial position.

[0048] S3. The personnel apply the imprinting adhesive to the top surface of the wafer on the placement plate 87, control the imprinting template 12 to move downward to imprint the wafer, turn on the ultraviolet lamp in the fixing cover 11, and use ultraviolet light to cure the imprinting adhesive on the top surface of the wafer. After curing, control the imprinting template 12 to move upward to demold.

[0049] S4. The imprinted wafer is then transferred to the top surface of the transfer stage 2 using the adsorption and material handling mechanism 6, and the finished product is transferred through the transfer stage 2.

[0050] Furthermore, any content not described in detail in this specification is existing technology known to those skilled in the art.

[0051] While embodiments of the application have been shown and described, it is to be understood that the embodiments described are merely exemplary of the principles and application of the present application. Numerous modifications and adaptions can be effected without departing from the spirit and scope of the present application, which is not limited to the exact construction and arrangement described. It is intended, therefore, to cover all modifications and adaptions that fall within the scope of the claims and their equivalents.

Claims

1. An apparatus for nanoimprinting of an entire wafer, comprising a storage bin and a transfer stage disposed on the top side of the storage bin, characterized in that: The storage box has several support plates on both sides through transmission components, and a wafer is placed between the top surfaces of the left and right support plates. The back of the transfer table is fixedly equipped with a first electric slide rail, and a first electric push rod is slidably installed on the top surface of the first electric slide rail. The extended end of the first electric push rod is equipped with an adsorption and material picking mechanism through a mounting plate. The adsorption and material handling mechanism includes a threaded sleeve rotatably disposed inside the mounting plate, and a threaded rod is threadedly connected inside the threaded sleeve. A vertical tube is disposed inside the threaded rod, and an adsorption tube is connected to one end of the vertical tube located at the bottom surface of the threaded rod. A second electric push rod is fixedly disposed on both sides of the surface of the vertical tube by an L-shaped rod, and a pulley is rotatably disposed on the extended end of the second electric push rod through a connecting block. The top surface of the storage box is provided with a limiting and fixing mechanism, which includes an annular box fixedly installed on the top surface of the storage box. A rotating ring is rotatably installed on the top surface of the annular box via a support leg, and an irregular ring is fixedly installed on the top surface of the rotating ring. A fixed ring is installed inside the irregular ring, and an inclined plate is slidably installed inside the fixed ring. A third electric push rod is fixedly installed on one side of the inclined plate, and a placement plate is fixedly installed at the extended end of the third electric push rod. An L-shaped air extraction pipe is connected to the bottom surface of the placement plate, and the bottom end of the L-shaped air extraction pipe is connected to the inner wall of the annular box. The top surface of the storage box is provided with a driving part for driving the rotating ring to rotate. The irregular ring has an inclined groove inside that matches the inclined plate. The inclined plate is located on one side inside the inclined groove and is inclined. The fixed ring has a movable groove inside that matches the inclined plate. Limit blocks are fixedly installed on both sides of the inner wall of the movable groove. The limit blocks are slidably installed inside the inclined plate. A clamping spring is installed between the surface of the limit block and the inside of the inclined plate. The drive unit includes a control motor fixedly mounted on the top of one side of the storage box via a support column, and a drive gear is fixedly mounted on one end of the output shaft of the control motor via a coupling, and a driven gear meshing with the drive gear is fixedly mounted on the surface of the rotating ring. A second electric slide rail is fixedly installed on the front of the storage box, and a hydraulic cylinder is slidably installed on the top surface of the second electric slide rail. An imprint template is installed on the extended end of the hydraulic cylinder through a connecting rod. A fixing cover is fixedly installed on the surface of the connecting rod, and an ultraviolet lamp is fixedly installed on the top surface of the inner wall of the fixing cover.

2. The device for whole-wafer nanoimprinting according to claim 1, characterized in that: The transmission component includes a first sprocket and a second sprocket rotatably disposed on both sides of the storage box, and a chain is connected between the surfaces of the first sprocket and the second sprocket. One side of the support plate is fixedly disposed on the surface of the chain, and the distance between the upper and lower support plates is equal. A groove is provided on the top surface of the support plate, and an arc-shaped clamping plate is provided on the inner wall of the groove through a buffer spring.

3. The device for whole-wafer nanoimprinting according to claim 2, characterized in that: The front of the storage box has several placement slots, and the front of the arc-shaped clamping plate is equipped with a toggle plate, with one side of the toggle plate passing through the placement slot and extending to the front of the placement slot.

4. A method for nanoimprinting on an entire wafer, characterized in that: The apparatus for whole-wafer nanoimprinting as described in claim 3 specifically includes the following steps: S1. Insert the wafer into the two adjacent support plates through the placement slot, and use the arc-shaped clamping plate to limit the wafer's position. S2. The wafer inside the storage box is adsorbed and moved to the top surface of the fixing ring by the adsorption and picking mechanism, and the bottom surface of the wafer is adsorbed and fixed by the limiting and fixing mechanism, and then the adsorption and picking mechanism is controlled to move to the initial position. S3. The personnel apply the imprinting adhesive to the top surface of the wafer on the placement plate, control the imprinting template to move downward to imprint the wafer, turn on the ultraviolet lamp in the fixing cover, and use ultraviolet light to cure the imprinting adhesive on the top surface of the wafer. After curing, control the imprinting template to move upward to demold. S4. The imprinted wafer is then transferred to the top surface of the transfer stage using the adsorption and material handling mechanism, and the finished product is transferred through the transfer stage.

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