A thermal management monitoring and control system for an interface chip

Abstract

The present invention relates to the field of chip thermal management technology, and in particular to a thermal management monitoring and control system for an interface chip, comprising a thermal management platform, an information collection unit, a potential thermal impact unit, a thermal treatment evaluation unit, a status evaluation unit, a verification and analysis unit, and a management response unit; the present invention analyzes from the perspective of potential factors, which helps to provide a reasonable comparison curve for the subsequent thermal supervision analysis of the interface chip to improve the accuracy of the analysis result, and under the premise that the operating temperature of the interface chip is abnormal, analysis is performed from the two points of cooling and front-end energy transmission of the interface chip to determine whether the abnormal operating temperature of the interface chip is caused by the abnormal cooling and front-end energy transmission of the interface chip, so as to perform reasonable and targeted management of the cooling and front-end energy transmission of the interface chip according to the information feedback, so as to improve the operating safety and stability of the interface chip, and at the same time help to reasonably monitor and control the operating temperature of the interface chip.

Description

Technical Field

[0001] The present invention relates to the technical field of chip thermal management, and in particular to a thermal management monitoring and control system for an interface chip. Background Art

[0002] Chips are an important part of electronic products and are widely used in various fields, including computers, communications, consumer electronics, automotive electronics, etc. Different types of chips have different operating temperature requirements. The operating temperature of a chip refers to the maximum temperature range that the chip can withstand under normal operation and operation conditions. The operating temperature of a chip is determined by the characteristics of the internal materials of the chip and the conditions of the external environment. The internal materials of a chip are generally composed of semiconductor materials, such as silicon (Si) and gallium arsenide (GaAs).

[0003] However, in the prior art, the interface chip data thermal management monitoring and collection is single, resulting in large deviations in the analysis results, and thus the interface chip cannot be accurately monitored, resulting in reduced thermal management efficiency of the interface chip, and the inability to analyze abnormal operating temperature factors of the interface chip, which is not conducive to reasonable management and control of the interface chip, and reduces the operating safety and stability of the interface chip;

[0004] In view of the above technical defects, a solution is now proposed. Summary of the invention

[0005] The purpose of the present invention is to provide a thermal management monitoring and control system for an interface chip to solve the technical defects mentioned above. The present invention analyzes from the perspective of potential factors, which helps to provide a reasonable comparison curve for the subsequent thermal supervision analysis of the interface chip to improve the accuracy of the analysis results. Under the premise that the operating temperature of the interface chip is abnormal, analysis is performed from the two points of cooling and front-end energy transmission of the interface chip to determine whether the abnormal operating temperature of the interface chip is caused by the abnormal cooling and front-end energy transmission of the interface chip, so as to reasonably and targetedly manage the cooling and front-end energy transmission of the interface chip according to the information feedback, so as to improve the operating safety and stability of the interface chip, and at the same time help to reasonably monitor and control the operating temperature of the interface chip.

[0006] The object of the present invention can be achieved by the following technical solutions: A thermal management monitoring and control system for an interface chip, comprising a thermal management platform, an information acquisition unit, a potential thermal impact unit, a thermal treatment evaluation unit, a state evaluation unit, a verification and analysis unit, and a management response unit;

[0007] When the thermal management platform generates an operation management instruction, the operation management instruction is sent to the information collection unit. After receiving the operation management instruction, the information collection unit immediately collects the thermal interference data and cooling risk data of the interface chip. The thermal interference data includes the potential thermal interference value and the thermal barrier coefficient. The cooling risk data includes the cooling barrier value and the thermal flow interference value. The thermal interference data and the cooling risk data are sent to the potential thermal impact unit and the thermal treatment evaluation unit respectively. After receiving the thermal interference data, the potential thermal impact unit immediately performs thermal interference operation feedback evaluation analysis and in-depth information processing analysis on the thermal interference data, and sends the obtained thermal comparison value RD to the state evaluation unit;

[0008] The state evaluation unit receives the thermal comparison value RD and the operation state data, the operation state data represents the operation temperature characteristic curve, and performs operation thermal supervision evaluation and analysis on the operation state data, and sends the obtained management signal to the management response unit, the thermal treatment evaluation unit and the verification analysis unit;

[0009] After receiving the cooling risk data and the management signal, the heat treatment assessment unit performs a cooling treatment safety supervision analysis on the cooling risk data, sends the obtained normal signal to the verification and analysis unit, and sends the obtained optimization signal to the management response unit;

[0010] After receiving the management signal and the normal signal, the verification and analysis unit immediately collects the operating parameters of the interface chip, the operating parameters represent the input deviation values, and performs input operation interference risk analysis on the operating parameters, and sends the obtained input interference signal to the management response unit.

[0011] Preferably, the thermal interference operation feedback evaluation and analysis process of the potential thermal impact unit is as follows:

[0012] A monitoring cycle is set and set as a time threshold, and a potential thermal interference value of the interface chip within the time threshold is obtained. The potential thermal interference value represents the product of the portion of the operating temperature of the interface chip exceeding the preset operating temperature threshold during the historical operating time and the duration after data normalization, and the ratio obtained by the average of the interval durations between the times the operating temperature exceeds the preset operating temperature threshold after data normalization;

[0013] The thermal barrier coefficient of the interface chip within the time threshold is obtained. The thermal barrier coefficient indicates the product of the volume of dust particles on the surface of the interface chip that is greater than the surface area corresponding to the preset threshold and the oxidation area of ​​the interface chip's legs after data normalization. The potential thermal interference value and the thermal barrier coefficient are labeled QR and RZ, respectively.

[0014] Preferably, the in-depth information processing and analysis process of the potential heat impact unit is as follows:

[0015] According to the formula The thermal management influence coefficient is obtained, where a1 and a2 are preset proportional factor coefficients of the potential thermal interference value and the thermal barrier coefficient, respectively, and a1 and a2 are both greater than zero, a3 is the preset correction factor coefficient, and a3 is greater than zero. R is the thermal management influence coefficient. The thermal management influence coefficient R is compared and analyzed with the preset thermal management influence coefficient range stored in the internal data entry:

[0016] If the thermal management influence coefficient R is greater than the maximum value in the preset thermal management influence coefficient range, a third-level thermal signal is generated;

[0017] If the thermal management influence coefficient R belongs to the preset thermal management influence coefficient range, a secondary thermal signal is generated;

[0018] If the thermal management influence coefficient R is less than the minimum value in the preset thermal management influence coefficient range, a first-level thermal signal is generated, and the thermal comparison characteristic curves corresponding to the third-level thermal signal, the second-level thermal signal and the first-level thermal signal are obtained, and the thermal comparison characteristic curve is set to the thermal comparison value RD, and the thermal comparison value RD=1, 2, 3.

[0019] Preferably, the operation thermal supervision assessment and analysis process of the state assessment unit is as follows:

[0020] The operating temperature characteristic curve of the interface chip within the time threshold is obtained, and the thermal comparison value RD of the interface chip within the time threshold is obtained, and the thermal comparison characteristic curve corresponding to the thermal comparison value RD is set as the analysis curve, and the analysis curve is plotted in the coordinate system where the operating temperature characteristic curve is located, and then the area enclosed by the line segment corresponding to the operating temperature characteristic curve located above the analysis curve and the analysis curve is obtained, and the product value obtained after data normalization processing with the duration corresponding to the operating temperature characteristic curve located above the analysis curve is set as the thermal runaway risk coefficient, and at the same time, the product value obtained after data normalization processing of the acute angle degree and duration formed by the first intersection of the operating temperature characteristic curve and the analysis curve is obtained, and it is set as the abnormal performance value, and the product value obtained after data normalization processing of the thermal runaway risk coefficient and the abnormal performance value is set as the thermal management demand rate;

[0021] Compare and analyze the thermal management demand rate with the preset thermal management demand rate threshold value stored internally:

[0022] If the ratio between the thermal management demand rate and the preset thermal management demand rate threshold is less than 1, no signal is generated;

[0023] If the ratio between the thermal management demand rate and the preset thermal management demand rate threshold is greater than or equal to 1, a management signal is generated.

[0024] Preferably, the temperature reduction treatment safety supervision analysis process of the heat treatment evaluation unit is as follows:

[0025] S1: Divide the time threshold into i sub-time periods, where i is a natural number greater than zero, and obtain the operation evaluation value of the interface chip cooling component in each sub-time period, where the operation evaluation value represents the product of the portion where the actual cooling rate of the cooling component is lower than the preset cooling rate threshold and the portion where the maximum operating temperature of the cooling component exceeds the initial operating temperature after data normalization, construct a set A of operation evaluation values, obtain the mean of the set A, and set the mean of the set A as the cooling barrier value;

[0026] S2: Obtain the temperature rise interference value of the interface chip cooling component in each sub-time period, the temperature rise interference value represents the product of the part of the ambient temperature value of the interface chip exceeding the preset threshold and the part of the ambient gas flow rate below the preset threshold after data normalization processing, the number of sub-time periods corresponding to the temperature rise interference value greater than the preset temperature rise interference value threshold is set as the heat flow interference value, and the cooling obstacle value and the heat flow interference value are labeled LZ and RL respectively;

[0027] S3: The heat treatment risk coefficient J is obtained according to the formula, and the heat treatment risk coefficient J is compared and analyzed with the preset heat treatment risk coefficient threshold value recorded and stored internally:

[0028] If the ratio between the heat treatment risk factor J and the preset heat treatment risk factor threshold is less than 1, a normal signal is generated;

[0029] If the ratio between the heat treatment risk coefficient J and the preset heat treatment risk coefficient threshold is greater than or equal to 1, an optimization signal is generated.

[0030] Preferably, the input operation interference risk analysis process of the verification and analysis unit is as follows:

[0031] The corresponding time length of the line segment corresponding to the operating temperature characteristic curve above the analysis curve is obtained, and it is set as the operating analysis time length, the operating analysis time length is divided into g as sub-time nodes, g is a natural number greater than zero, and the parameter deviation value of the interface chip in each sub-time node is obtained. The parameter deviation value represents the sum of the actual operating voltage value and the actual energy consumption value of the interface chip that deviate from the preset actual operating voltage value threshold and the preset actual energy consumption value threshold after data normalization. A rectangular coordinate system is established with the number of sub-time nodes as the X-axis and the parameter deviation value as the Y-axis. The parameter deviation value curve is drawn by plotting points, and the area enclosed by the parameter deviation value curve and the X-axis is obtained, and it is set as the input deviation value;

[0032] Compare and analyze the input deviation value with the preset input deviation value threshold stored internally:

[0033] If the ratio between the input deviation value and the preset input deviation value threshold is less than 1, no signal is generated;

[0034] If the ratio between the input deviation value and the preset input deviation value threshold is greater than or equal to 1, an input interference signal is generated.

[0035] The beneficial effects of the present invention are as follows:

[0036] (1) The present invention analyzes from the perspective of potential factors, which helps to provide a reasonable comparison curve for the subsequent thermal supervision analysis of the interface chip to improve the accuracy of the analysis results, that is, to perform thermal interference operation feedback evaluation analysis on the thermal interference data, and to understand the potential damage situation, which helps to provide data support for subsequent analysis, and to perform operation thermal supervision evaluation analysis on the operation status data of the interface chip by means of information feedback to determine whether the risk of abnormal operation temperature of the interface chip is too high, so as to provide timely early warning feedback management, and to perform reasonable and targeted thermal management based on the feedback information to reduce the risk of abnormal operation temperature of the interface chip;

[0037] (2) Under the premise that the operating temperature of the interface chip is abnormal, the present invention analyzes the cooling and front-end energy transmission of the interface chip to determine whether the abnormal operating temperature of the interface chip is caused by the abnormal cooling and front-end energy transmission of the interface chip, so as to reasonably and specifically manage the cooling and front-end energy transmission of the interface chip according to the information feedback, so as to improve the operating safety and stability of the interface chip, and at the same time help to reasonably monitor and control the operating temperature of the interface chip. BRIEF DESCRIPTION OF THE DRAWINGS

[0038] The present invention will be further described below in conjunction with the accompanying drawings;

[0039] Figure 1 It is a flowchart of the system of the present invention;

[0040] Figure 2 It is a local analysis reference diagram of the first embodiment of the present invention. DETAILED DESCRIPTION

[0041] The following will be combined with the drawings in the embodiments of the present invention to clearly and completely describe the technical solutions in the embodiments of the present invention. Obviously, the described embodiments are only part of the embodiments of the present invention, not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the present invention.

[0042] Embodiment 1:

[0043] See also Figure 1 to Figure 2As shown, the present invention is a thermal management monitoring and control system of an interface chip, comprising a thermal management platform, an information collection unit, a potential thermal impact unit, a thermal treatment evaluation unit, a state evaluation unit, a verification and analysis unit, and a management response unit, wherein the thermal management platform is connected to the information collection unit in a one-way communication manner, the information collection unit is connected to the potential thermal impact unit and the thermal treatment evaluation unit in a one-way communication manner, the potential thermal impact unit is connected to the state evaluation unit in a one-way communication manner, the state evaluation unit is connected to the thermal treatment evaluation unit, the verification and analysis unit, and the management response unit in a one-way communication manner, the thermal treatment evaluation unit is connected to the verification and analysis unit and the management response unit in a one-way communication manner, and the verification and analysis unit is connected to the management response unit in a one-way communication manner;

[0044] When the thermal management platform generates an operation management instruction, the operation management instruction is sent to the information collection unit. After receiving the operation management instruction, the information collection unit immediately collects the thermal interference data and cooling risk data of the interface chip. The thermal interference data includes the potential thermal interference value and the thermal barrier coefficient. The cooling risk data includes the cooling barrier value and the thermal flow interference value. The thermal interference data and the cooling risk data are sent to the potential heat impact unit and the heat treatment evaluation unit respectively. After receiving the thermal interference data, the potential heat impact unit immediately performs thermal interference operation feedback evaluation and analysis on the thermal interference data to understand the potential damage, and then compares the interface chip with a reasonable matching curve, which helps to provide data support for subsequent analysis. The specific thermal interference operation feedback evaluation and analysis process is as follows:

[0045] A monitoring cycle is set and set as a time threshold to obtain a potential thermal interference value of the interface chip within the time threshold. The potential thermal interference value represents the product of the portion of the operating temperature of the interface chip exceeding the preset operating temperature threshold during the historical operating time and the duration after data normalization, and the ratio of the average of the interval durations between the times the operating temperature exceeds the preset operating temperature threshold after data normalization. It should be noted that the larger the value of the potential thermal interference value, the greater the risk of thermal runaway of the interface chip;

[0046] The thermal barrier coefficient of the interface chip within the time threshold is obtained. The thermal barrier coefficient represents the product of the dust particle volume on the interface chip surface that is greater than the surface area corresponding to the preset threshold and the oxidized area of ​​the interface chip foot after data normalization. It should be noted that the larger the value of the thermal barrier coefficient, the greater the risk of thermal runaway of the interface chip. The potential thermal interference value and the thermal barrier coefficient are labeled QR and RZ respectively.

[0047] According to the formula The thermal management influence coefficient is obtained, where a1 and a2 are the preset proportional factor coefficients of the potential thermal interference value and the thermal barrier coefficient respectively. The proportional factor coefficient is used to correct the deviation of various parameters in the formula calculation process, so as to make the calculation result more accurate. Both a1 and a2 are greater than zero, a3 is the preset correction factor coefficient, a3 is greater than zero, and R is the thermal management influence coefficient. The thermal management influence coefficient R is compared and analyzed with the preset thermal management influence coefficient range stored internally:

[0048] If the thermal management influence coefficient R is greater than the maximum value in the preset thermal management influence coefficient range, a third-level thermal signal is generated;

[0049] If the thermal management influence coefficient R belongs to the preset thermal management influence coefficient range, a secondary thermal signal is generated;

[0050] If the thermal management influence coefficient R is less than the minimum value in the preset thermal management influence coefficient interval, a first-level thermal signal is generated, wherein the thermal runaway risks corresponding to the third-level thermal signal, the second-level thermal signal and the first-level thermal signal are successively reduced, and the thermal comparison characteristic curves corresponding to the third-level thermal signal, the second-level thermal signal and the first-level thermal signal are obtained, and the thermal comparison characteristic curve is set to the thermal comparison value RD, the thermal comparison value RD=1, 2, 3, and when the thermal comparison value RD=1, it represents the thermal comparison characteristic curve corresponding to the first-level thermal signal, when the thermal comparison value RD=2, it represents the thermal comparison characteristic curve corresponding to the second-level thermal signal, when the thermal comparison value RD=3, it represents the thermal comparison characteristic curve corresponding to the third-level thermal signal, and the thermal comparison value RD is sent to the state evaluation unit;

[0051] The status evaluation unit receives the thermal comparison value RD and the operating status data, the operating status data represents the operating temperature characteristic curve, and performs an operating thermal supervision evaluation and analysis on the operating status data to determine whether the abnormal operating temperature risk of the interface chip is too high, so as to provide timely early warning feedback management, and perform thermal management reasonably and targetedly according to the feedback information. In order to make a more accurate comparison, the thermal comparison characteristic curve corresponding to the potential thermal interference information is analyzed, which helps to improve the accuracy of the analysis results. The specific operating thermal supervision evaluation and analysis process is as follows:

[0052] The operating temperature characteristic curve of the interface chip within the time threshold is obtained, and the thermal comparison value RD of the interface chip within the time threshold is obtained, and the thermal comparison characteristic curve corresponding to the thermal comparison value RD is set as the analysis curve, and the analysis curve is plotted in the coordinate system where the operating temperature characteristic curve is located, and then the area enclosed by the line segment corresponding to the operating temperature characteristic curve located above the analysis curve and the analysis curve is obtained, and the product value obtained after data normalization processing with the duration corresponding to the operating temperature characteristic curve located above the analysis curve is set as the thermal runaway risk coefficient, and at the same time, the product value of the acute angle formed by the first intersection of the operating temperature characteristic curve and the analysis curve and the duration is obtained after data normalization processing, and it is set as the abnormal performance value, and the product value obtained after data normalization processing of the thermal runaway risk coefficient and the abnormal performance value is set as the thermal management demand rate. It should be noted that the larger the value of the thermal management demand rate, the greater the thermal runaway risk of the interface chip and the greater the thermal impact risk;

[0053] Compare and analyze the thermal management demand rate with the preset thermal management demand rate threshold value stored internally:

[0054] If the ratio between the thermal management demand rate and the preset thermal management demand rate threshold is less than 1, no signal is generated;

[0055] If the ratio between the thermal management demand rate and the preset thermal management demand rate threshold is greater than or equal to 1, a management signal is generated and sent to the management response unit, the thermal treatment evaluation unit and the verification and analysis unit. After receiving the management signal, the management response unit immediately displays the preset warning text corresponding to the management signal, so as to timely perform reasonable and targeted thermal management of the interface chip to improve the operating safety of the interface chip.

[0056] Embodiment 2:

[0057] After receiving the cooling risk data and the management signal, the thermal treatment assessment unit performs a cooling treatment safety supervision analysis on the cooling risk data to determine whether the interface chip cooling components and the environment have an impact on the overheating of the interface chip, so as to perform timely processing according to the feedback information to reduce the risk of overheating of the interface chip. The specific cooling treatment safety supervision analysis process is as follows:

[0058] The time threshold is divided into i sub-time periods, where i is a natural number greater than zero, and the operation evaluation value of the interface chip cooling component in each sub-time period is obtained. The operation evaluation value represents the product of the portion where the actual cooling rate of the cooling component is lower than the preset cooling rate threshold and the portion where the maximum operating temperature of the cooling component exceeds the initial operating temperature after data normalization. A set A of operation evaluation values ​​is constructed, the mean of the set A is obtained, and the mean of the set A is set as the cooling barrier value. It should be noted that the larger the value of the cooling barrier value, the greater the risk of thermal runaway of the interface chip and the greater the risk of abnormal operation of the cooling component.

[0059] The temperature rise interference value of the interface chip cooling component in each sub-time period is obtained. The temperature rise interference value represents the product of the part of the ambient temperature value of the interface chip exceeding the preset threshold and the part of the ambient gas flow rate below the preset threshold after data normalization. The number of sub-time periods corresponding to the temperature rise interference value greater than the preset temperature rise interference value threshold is set as the heat flow interference value. It should be noted that the larger the value of the heat flow interference value, the greater the risk of thermal runaway of the interface chip and the greater the risk of cooling obstruction of the cooling component. The cooling obstruction value and the heat flow interference value are labeled LZ and RL respectively.

[0060] According to the formula The heat treatment risk coefficient is obtained, where f1 and f2 are respectively the preset weight factor coefficients of the cooling obstacle value and the heat flow interference value, f3 is the preset fault tolerance factor coefficient, f1, f2 and f3 are all greater than zero, and J is the heat treatment risk coefficient. The heat treatment risk coefficient J is compared and analyzed with the preset heat treatment risk coefficient threshold value stored in the internal input:

[0061] If the ratio between the heat treatment risk coefficient J and the preset heat treatment risk coefficient threshold is less than 1, a normal signal is generated and sent to the verification and analysis unit;

[0062] If the ratio between the heat treatment risk coefficient J and the preset heat treatment risk coefficient threshold is greater than or equal to 1, an optimization signal is generated and sent to the management response unit. After receiving the optimization signal, the management response unit immediately displays the preset warning text corresponding to the optimization signal, so as to timely and reasonably and targetedly manage the interface chip cooling component and the environment, so as to reduce the continuous heat impact on the interface chip and improve the operation safety of the interface chip;

[0063] After receiving the management signal and the normal signal, the verification and analysis unit immediately collects the operating parameters of the interface chip, which represent the input deviation value, and performs input operation interference risk analysis on the operating parameters to determine whether the high temperature of the interface chip is caused by abnormal transmission at the power supply end. The specific input operation interference risk analysis process is as follows:

[0064] The corresponding time length of the line segment corresponding to the operating temperature characteristic curve above the analysis curve is obtained, and it is set as the operating analysis time length, and the operating analysis time length is divided into g as sub-time nodes, where g is a natural number greater than zero, and the parameter deviation value of the interface chip in each sub-time node is obtained. The parameter deviation value represents the sum of the actual operating voltage value and the actual energy consumption value of the interface chip that deviate from the preset actual operating voltage value threshold and the preset actual energy consumption value threshold after data normalization. A rectangular coordinate system is established with the number of sub-time nodes as the X-axis and the parameter deviation value as the Y-axis. The parameter deviation value curve is drawn by plotting points, and the area enclosed by the parameter deviation value curve and the X-axis is obtained, and it is set as the input deviation value. It should be noted that the larger the value of the input deviation value, the greater the risk of transmission interference at the power supply end;

[0065] Compare and analyze the input deviation value with the preset input deviation value threshold stored internally:

[0066] If the ratio between the input deviation value and the preset input deviation value threshold is less than 1, no signal is generated;

[0067] If the ratio between the input deviation value and the preset input deviation value threshold is greater than or equal to 1, an input interference signal is generated and sent to the management response unit. After receiving the input interference signal, the management response unit immediately displays the preset warning text corresponding to the input interference signal, so as to timely and reasonably and targetedly manage the power supply end of the interface chip, so as to reduce the risk of overheating of the interface chip caused by abnormal power supply transmission and improve the operation safety of the interface chip;

[0068] In summary, the present invention analyzes from the perspective of potential factors, which is helpful to provide a reasonable comparison curve for the subsequent thermal supervision analysis of the interface chip to improve the accuracy of the analysis results, that is, to perform thermal interference operation feedback evaluation and analysis on the thermal interference data, and to understand the potential damage situation, which is helpful to provide data support for subsequent analysis, and to perform operation thermal supervision evaluation and analysis on the operation status data of the interface chip by means of information feedback to determine whether the risk of abnormal operation temperature of the interface chip is too high, so as to provide timely early warning feedback management, and to perform thermal management reasonably and targetedly according to the feedback information to reduce the risk of abnormal operation temperature of the interface chip, and under the premise of abnormal operation temperature of the interface chip, to analyze from the two points of cooling and front-end energy transmission of the interface chip to determine whether the abnormal operation temperature of the interface chip is caused by abnormal cooling and front-end energy transmission of the interface chip, so as to perform reasonable and targeted management of the cooling and front-end energy transmission of the interface chip according to the information feedback situation, so as to improve the operation safety and stability of the interface chip, and at the same time help to reasonably monitor and control the operation temperature of the interface chip.

[0069] The threshold is set to facilitate comparison. The size of the threshold depends on the amount of sample data and the number of bases set by technicians in this field for each group of sample data; as long as it does not affect the proportional relationship between the parameter and the quantized value.

[0070] The above formulas are obtained by collecting a large amount of data for software simulation and selecting a formula that is close to the actual value. The coefficients in the formula are set by technical personnel in this field according to actual conditions. The above is only a preferred specific implementation manner of the present invention, but the protection scope of the present invention is not limited to this. Any technical personnel familiar with the technical field within the technical scope disclosed by the present invention, according to the technical solution and the inventive concept of the present invention, make equivalent replacement or change, which should be covered within the protection scope of the present invention.

Claims

1. A thermal management monitoring and control system for an interface chip, characterized in that: It includes thermal management platform, information collection unit, potential thermal impact unit, thermal treatment assessment unit, status assessment unit, verification and analysis unit and management response unit; When the thermal management platform generates an operation management instruction, the operation management instruction is sent to the information collection unit. After receiving the operation management instruction, the information collection unit immediately collects the thermal interference data and cooling risk data of the interface chip. The thermal interference data includes the potential thermal interference value and the thermal barrier coefficient. The cooling risk data includes the cooling barrier value and the thermal flow interference value. The thermal interference data and the cooling risk data are sent to the potential thermal impact unit and the thermal treatment evaluation unit respectively. After receiving the thermal interference data, the potential thermal impact unit immediately performs thermal interference operation feedback evaluation analysis and in-depth information processing analysis on the thermal interference data, and sends the obtained thermal comparison value RD to the state evaluation unit; The state evaluation unit receives the thermal comparison value RD and the operation state data, the operation state data represents the operation temperature characteristic curve, and performs operation thermal supervision evaluation and analysis on the operation state data, and sends the obtained management signal to the management response unit, the thermal treatment evaluation unit and the verification analysis unit; After receiving the cooling risk data and the management signal, the heat treatment assessment unit performs a cooling treatment safety supervision analysis on the cooling risk data, sends the obtained normal signal to the verification and analysis unit, and sends the obtained optimization signal to the management response unit; After receiving the management signal and the normal signal, the verification and analysis unit immediately collects the operating parameters of the interface chip, the operating parameters representing the input deviation value, and performs input operation interference risk analysis on the operating parameters, and sends the obtained input interference signal to the management response unit; The thermal interference operation feedback evaluation and analysis process of the potential thermal impact unit is as follows: A monitoring cycle is set and set as a time threshold, and a potential thermal interference value of the interface chip within the time threshold is obtained. The potential thermal interference value represents the product of the portion of the operating temperature of the interface chip exceeding the preset operating temperature threshold during the historical operating time and the duration after data normalization, and the ratio obtained by the average of the interval durations between the times the operating temperature exceeds the preset operating temperature threshold after data normalization; The thermal barrier coefficient of the interface chip within the time threshold is obtained. The thermal barrier coefficient represents the product of the surface area occupied by dust particles on the interface chip that is larger than the preset threshold and the oxidized area of ​​the interface chip's legs after data normalization. The potential thermal interference value and the thermal barrier coefficient are labeled QR and RZ respectively. The in-depth information processing and analysis process of the potential heat impact unit is as follows: According to the formula The thermal management influence coefficient is obtained, where a1 and a2 are preset proportional factor coefficients of the potential thermal interference value and the thermal barrier coefficient, respectively, and a1 and a2 are both greater than zero, a3 is the preset correction factor coefficient, and a3 is greater than zero. R is the thermal management influence coefficient. The thermal management influence coefficient R is compared and analyzed with the preset thermal management influence coefficient range stored in the internal data entry: If the thermal management influence coefficient R is greater than the maximum value in the preset thermal management influence coefficient range, a third-level thermal signal is generated; If the thermal management influence coefficient R belongs to the preset thermal management influence coefficient range, a secondary thermal signal is generated; If the thermal management influence coefficient R is less than the minimum value in the preset thermal management influence coefficient range, a primary thermal signal is generated, and the thermal comparison characteristic curve corresponding to the third-level thermal signal, the second-level thermal signal and the first-level thermal signal is obtained, and the thermal comparison characteristic curve is set as the thermal comparison value RD, and the thermal comparison value RD=1, 2, 3; The operation thermal supervision assessment and analysis process of the state assessment unit is as follows: The operating temperature characteristic curve of the interface chip within the time threshold is obtained, and the thermal comparison value RD of the interface chip within the time threshold is obtained, and the thermal comparison characteristic curve corresponding to the thermal comparison value RD is set as the analysis curve, and the analysis curve is plotted in the coordinate system where the operating temperature characteristic curve is located, and then the area enclosed by the line segment corresponding to the operating temperature characteristic curve located above the analysis curve and the analysis curve is obtained, and the product value obtained after data normalization processing with the duration corresponding to the operating temperature characteristic curve located above the analysis curve is set as the thermal runaway risk coefficient, and at the same time, the product value obtained after data normalization processing of the acute angle degree and duration formed by the first intersection of the operating temperature characteristic curve and the analysis curve is obtained, and it is set as the abnormal performance value, and the product value obtained after data normalization processing of the thermal runaway risk coefficient and the abnormal performance value is set as the thermal management demand rate; Compare and analyze the thermal management demand rate with the preset thermal management demand rate threshold value stored internally: If the ratio between the thermal management demand rate and the preset thermal management demand rate threshold is less than 1, no signal is generated; If the ratio between the thermal management demand rate and the preset thermal management demand rate threshold is greater than or equal to 1, a management signal is generated; The cooling treatment safety supervision analysis process of the heat treatment evaluation unit is as follows: S1: Divide the time threshold into i sub-time periods, where i is a natural number greater than zero, and obtain the operation evaluation value of the interface chip cooling component in each sub-time period, where the operation evaluation value represents the product of the portion where the actual cooling rate of the cooling component is lower than the preset cooling rate threshold and the portion where the maximum operating temperature of the cooling component exceeds the initial operating temperature after data normalization, construct a set A of operation evaluation values, obtain the mean of the set A, and set the mean of the set A as the cooling barrier value; S2: Obtain the temperature rise interference value of the interface chip cooling component in each sub-time period, the temperature rise interference value represents the product of the part of the ambient temperature value of the interface chip exceeding the preset threshold and the part of the ambient gas flow rate below the preset threshold after data normalization processing, the number of sub-time periods corresponding to the temperature rise interference value greater than the preset temperature rise interference value threshold is set as the heat flow interference value, and the cooling obstacle value and the heat flow interference value are labeled LZ and RL respectively; S3: According to the formula The heat treatment risk coefficient J is obtained, where f1 and f2 are respectively the preset weight factor coefficients of the cooling obstacle value and the heat flow interference value, and f3 is the preset fault tolerance factor coefficient. f1, f2 and f3 are all greater than zero. The heat treatment risk coefficient J is compared and analyzed with the preset heat treatment risk coefficient threshold value stored in the internal input: If the ratio between the heat treatment risk factor J and the preset heat treatment risk factor threshold is less than 1, a normal signal is generated; If the ratio between the heat treatment risk factor J and the preset heat treatment risk factor threshold is greater than or equal to 1, an optimization signal is generated; The input operation interference risk analysis process of the verification analysis unit is as follows: The corresponding time length of the line segment corresponding to the operating temperature characteristic curve above the analysis curve is obtained, and it is set as the operating analysis time length, the operating analysis time length is divided into g as sub-time nodes, g is a natural number greater than zero, and the parameter deviation value of the interface chip in each sub-time node is obtained. The parameter deviation value represents the sum of the actual operating voltage value and the actual energy consumption value of the interface chip that deviate from the preset actual operating voltage value threshold and the preset actual energy consumption value threshold after data normalization. A rectangular coordinate system is established with the number of sub-time nodes as the X-axis and the parameter deviation value as the Y-axis. The parameter deviation value curve is drawn by plotting points, and the area enclosed by the parameter deviation value curve and the X-axis is obtained, and it is set as the input deviation value; Compare and analyze the input deviation value with the preset input deviation value threshold stored internally: If the ratio between the input deviation value and the preset input deviation value threshold is less than 1, no signal is generated; If the ratio between the input deviation value and the preset input deviation value threshold is greater than or equal to 1, an input interference signal is generated.

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