Semiconductor efficient manufacturing chip logistics and intelligent dispatching method and system

Abstract

The present invention provides a method and system for efficient semiconductor chip manufacturing logistics and intelligent dispatching, the method comprising: arranging electronic shelves at semiconductor process equipment according to environmental factors of the space where the semiconductor process equipment is located and working indicators of the semiconductor process equipment, the electronic shelves having shapes and specifications that are compatible with the environmental factors and working indicators; arranging multiple first tracks between multiple electronic shelves, so that each first track is connected to at least two electronic shelves, so as to establish multiple conveying paths between the multiple electronic shelves; selecting corresponding conveying paths according to process flow information reflecting the flow sequence of semiconductor products between multiple semiconductor process equipment, and conveying carriers from an electronic shelf at one semiconductor process equipment to an electronic shelf at another semiconductor process equipment through the conveying paths; wherein the electronic shelves and the first tracks are both configured to be removably re-arranged according to working indicators and / or process flow information.

Description

Technical Field

[0001] The present invention relates to the technical field of semiconductor manufacturing equipment, and in particular to a method and system for efficiently manufacturing semiconductor chips through logistics and intelligent dispatching. Background Art

[0002] After the process equipment of a semiconductor manufacturing plant is started, even if it is in standby mode, it will cost a lot of money. The standby process does not generate production capacity, which will directly lead to a large amount of cost consumption. Therefore, it is necessary to shorten the process time as much as possible and eliminate unnecessary waiting time to avoid cost waste.

[0003] Process time may involve vapor deposition, photolithography, etching, electroplating, ion implantation, annealing, cleaning, drying and other process times, which are strictly implemented according to the process flow (or process menu) of semiconductor products. The compression of process time is extremely challenging because it is related to many factors such as product performance requirements, material characteristics, and process equipment performance. Often, the adjustment of a process time requires the adjustment of many process parameters, so it is extremely difficult and has little room for adjustment. Even if a lot of effort is made, it can only save a few minutes or even seconds at most.

[0004] In comparison, it is easier to control the wafer transportation time in the semiconductor manufacturing plant. As mentioned above, the manufacturing of semiconductor products has a complex production process. For example, chip manufacturing requires repeated transportation back and forth between various process equipment, and transportation efficiency has become an important key factor in the large-scale mass production of semiconductor products. In order to solve the production and transportation problems of semiconductor products, the current solution is to use expensive overhead crane transportation systems (AMHS, OHT), which are arranged on the top of the semiconductor manufacturing plant, so they are called overhead cranes. However, although the overhead crane transportation system solves the transportation problem of semiconductor products, it can only transport semiconductor products to the storage space (Stocker) planned by the overhead crane transportation system, and cannot transport semiconductor products to a location close to the next process equipment. It still needs to be manually transported by a trolley for a distance, which costs extra manpower and time. At the same time, the track layout of the overhead crane transportation system is limited and fixed, and the dispatching system cannot ensure the adequacy and smoothness of the transportation path, which is easy to cause traffic jams and reduce transportation efficiency.

[0005] Since the track of the overhead crane transport system is generally supported by the clean room ceiling, if the clean room's ceiling height, load-bearing capacity, etc. are not coordinated with the overhead crane structure during the initial design and planning stage of the clean room, the subsequent overhead crane transport system cannot be implanted.

[0006] In addition, the installation plan of production equipment in semiconductor manufacturing plants is gradually increased in stages based on customer orders and production capacity requirements. The subsequent development of new products and replacement of equipment selection will affect the re-planning of the production layout in the clean room. The overhead crane transportation system cannot cope with the actual changes in the later stage for system expansion, re-layout of transportation routes and extension needs. It lacks flexibility and ductility, resulting in a gradual decrease in the utilization rate of the overhead crane transportation system, returning to the original state of using more carts for manual transportation. Summary of the invention

[0007] The purpose of the present invention is to provide a method and system for efficient semiconductor chip manufacturing logistics and intelligent dispatching, so as to solve the problem that the existing overhead crane handling system lacks flexibility and ductility in later applications.

[0008] In order to solve the above technical problems, the present invention provides a semiconductor efficient manufacturing chip logistics and intelligent dispatching method, which is applied to a semiconductor manufacturing plant, wherein a plurality of semiconductor process equipment separated from each other in space are arranged in the semiconductor manufacturing plant, and the semiconductor efficient manufacturing chip logistics and intelligent dispatching method comprises:

[0009] According to the environmental factors of the space where the semiconductor process equipment is located and the working indicators of the semiconductor process equipment, an electronic shelf is arranged at the semiconductor process equipment, and the electronic shelf has a shape and specification that is compatible with the environmental factors and the working indicators;

[0010] Arrange a plurality of first rails between the plurality of electronic shelves, so that each of the first rails connects at least two of the electronic shelves, so as to establish a plurality of conveying paths between the plurality of electronic shelves;

[0011] Selecting a corresponding conveying path according to process flow information reflecting the flow sequence of semiconductor products between the plurality of semiconductor process equipments, and conveying the carrier from an electronic shelf at one semiconductor process equipment to an electronic shelf at another semiconductor process equipment through the conveying path;

[0012] Wherein, the electronic shelf and the first track are both configured to be removably rearranged according to the work indicators and / or the process flow information.

[0013] Optionally, the semiconductor efficient manufacturing chip logistics and intelligent dispatching method further includes:

[0014] An in-and-out transport device is provided on the electronic shelf or at the end of the first track, so as to transport the carrier from the electronic shelf to the first track, or from the first track to the electronic shelf, through the in-and-out transport device.

[0015] Optionally, when the conveying path includes more than two first tracks, and the more than two first tracks are connected to the same electronic shelf, the semiconductor efficient manufacturing chip logistics and intelligent dispatching method further includes:

[0016] The carrier is transported by an in-and-out transport device and / or an internal transport device of the electronic shelf to connect different first tracks in the conveying path.

[0017] Optionally, the semiconductor efficient chip manufacturing logistics and intelligent dispatching method also includes: according to the work indicators and / or the process flow information, using the internal handling device of the electronic shelf to move the carrier to adjust the position of the carrier on the electronic shelf.

[0018] Optionally, the semiconductor efficient manufacturing chip logistics and intelligent dispatching method further includes:

[0019] Obtaining the loading ID information of the vehicle;

[0020] Acquire process flow information corresponding to the loading ID information, and obtain planned transport path information between corresponding semiconductor process equipment based on the process flow information;

[0021] The carrier is transported through the corresponding first track according to the loading ID information of the carrier and the planned transport path information; wherein at least two carriers with different types of loading ID information are configured to share the same first track.

[0022] Optionally, the semiconductor efficient manufacturing chip logistics and intelligent dispatching method further includes:

[0023] monitoring the patency rate and / or idle rate of the delivery path;

[0024] According to the monitoring results of the patency rate and / or idle rate, at least one of the first tracks is increased, decreased and / or replaced to optimize the corresponding conveying path.

[0025] Optionally, the first track includes a straight segment, an arc segment, a ring segment or an irregular segment, and the semiconductor efficient manufacturing chip logistics and intelligent dispatching method further includes:

[0026] According to environmental factors of the space through which the first track passes, a suitable shape of the first track is configured in combination with the work index and / or the process flow information.

[0027] Optionally, the semiconductor efficient manufacturing chip logistics and intelligent dispatching method further includes:

[0028] Get the location information of the operator's wristband;

[0029] Based on the selected conveying path and the location information of the operator's wristband, a work dispatch strategy is generated, and the handling task information is sent to the operator's wristband.

[0030] Optionally, the step of arranging electronic shelves at the semiconductor process equipment further includes:

[0031] Arrange a second track between the semiconductor process equipment and the electronic shelf, so that the second track connects the semiconductor process equipment and the electronic shelf;

[0032] Wherein, the second track is used to transport the carrier between the semiconductor process equipment and the electronic shelf.

[0033] In order to solve the above technical problems, the present invention also provides a semiconductor efficient manufacturing chip logistics and intelligent dispatching system, which is used to transport carriers according to the semiconductor efficient manufacturing chip logistics and intelligent dispatching method as described above; the semiconductor efficient manufacturing chip logistics and intelligent dispatching system includes: a plurality of electronic shelves and a plurality of first tracks;

[0034] The electronic shelf is arranged at the semiconductor process equipment and is used for storing and accessing the carrier;

[0035] The first track is configured to be detachably connected to the electronic shelf;

[0036] Wherein, the electronic shelf and the first track are both configured to be removably rearranged according to the work indicators and / or the process flow information.

[0037] Optionally, the semiconductor efficient manufacturing chip logistics and intelligent dispatching system further includes: an entry and exit handling device and / or an internal handling device;

[0038] The in-and-out transport device is disposed on the electronic shelf or at an end of the first track, and is used to transport the carrier from the electronic shelf to the first track, or from the first track to the electronic shelf;

[0039] The internal transport device is disposed on the electronic shelf, and is used to adjust the position of the carrier on the electronic shelf, or to transport the carrier from the electronic shelf to the first track, or from the first track to the electronic shelf.

[0040] Optionally, the semiconductor efficient chip manufacturing logistics and intelligent dispatching system also includes a second track arranged in a detachable manner between the semiconductor process equipment and the electronic shelf, the second track connecting the semiconductor process equipment and the electronic shelf, wherein the second track is used to transport carriers between the semiconductor process equipment and the electronic shelf.

[0041] In summary, in the semiconductor efficient manufacturing chip logistics and intelligent dispatching method and system provided by the present invention, the semiconductor efficient manufacturing chip logistics and intelligent dispatching method includes: according to the environmental factors of the space where the semiconductor process equipment is located and the working indicators of the semiconductor process equipment, electronic shelves are arranged at the semiconductor process equipment, and the electronic shelves have shapes and specifications that are compatible with the environmental factors and the working indicators; multiple first tracks are arranged between the multiple electronic shelves, so that each of the first tracks connects at least two of the electronic shelves to establish multiple conveying paths between the multiple electronic shelves; according to the process flow information reflecting the flow order of semiconductor products between the multiple semiconductor process equipment, the corresponding conveying path is selected, and the carrier is conveyed from the electronic shelf at one semiconductor process equipment to the electronic shelf at another semiconductor process equipment through the conveying path; wherein the electronic shelf and the first track are configured to be removably rearranged according to the working indicators and / or the process flow information.

[0042] With this configuration, electronic shelves are arranged at the semiconductor process equipment, so that the carrier can enter the electronic shelf nearby and enter the conveying path. Then, combined with the actual process flow information, the corresponding conveying path is selected, and the carrier can be transported to the electronic shelf at the next semiconductor process equipment through the first track between the electronic shelves, and enter the next semiconductor process equipment nearby, completing an efficient handling process.

[0043] Furthermore, since the electronic shelves and the first track are configured to be removably rearranged according to work indicators and / or process flow information, when the work indicators and / or process flow change, the layout of the electronic shelves and the first track can be adaptively adjusted, thereby coping with the expansion or change of the process layout caused by factors such as the initial, mid- and late stage capacity ramp-up of the semiconductor manufacturing plant, the gradual installation of equipment, and the development of new products.

[0044] The present invention breaks away from the current system thinking of using an overhead crane transport system to solve the limited system problems faced by logistics transport in semiconductor manufacturing, and provides a scalable system solution. BRIEF DESCRIPTION OF THE DRAWINGS

[0045] Those skilled in the art will appreciate that the accompanying drawings are provided for a better understanding of the present invention and do not constitute any limitation on the scope of the present invention.

[0046] Figure 1 It is a flow chart of a semiconductor efficient manufacturing chip logistics and intelligent dispatching method according to an embodiment of the present invention.

[0047] Figure 2 It is a schematic diagram of a semiconductor efficient manufacturing chip logistics and intelligent dispatching system according to an embodiment of the present invention.

[0048] Figure 3 Schematic diagram of an electronic shelf and a first circular track according to an embodiment of the present invention.

[0049] Figure 4 It is a schematic diagram of an electronic shelf, a first track and an in-and-out transport device according to an embodiment of the present invention.

[0050] Figure 5 It is a schematic diagram of an electronic shelf, a second track and semiconductor process equipment according to an embodiment of the present invention.

[0051] In the attached drawings: 10 - semiconductor process equipment; 20 - electronic shelf; 21 - internal transport device; 31 - first track; 32 - second track; 40 - entry and exit transport device; 41 - suspended transport robot; 42 - track pulley; 50 - carrier. DETAILED DESCRIPTION

[0052] In order to make the purpose, advantages and features of the present invention clearer, the present invention is further described in detail below in conjunction with the accompanying drawings and specific embodiments. It should be noted that the drawings are all in a very simplified form and are not drawn to scale, and are only used to conveniently and clearly assist in explaining the purpose of the embodiments of the present invention. In addition, the structure shown in the drawings is often a part of the actual structure. In particular, the emphasis of each drawing is different, and sometimes different scales are used.

[0053] As used in the present invention, the singular forms "a", "an", "one" and "the" include plural objects, the term "or" is usually used to include the meaning of "and / or", the term "several" is usually used to include the meaning of "at least one", and the term "at least two" is usually used to include the meaning of "two or more". In addition, the terms "first", "second" and "third" are used only for descriptive purposes and cannot be understood as indicating or implying relative importance or implicitly indicating the number of indicated technical features. Therefore, the features defined as "first", "second" and "third" may explicitly or implicitly include one or at least two of the features, "one end" and "the other end" as well as "proximal end" and "distal end" generally refer to two corresponding parts, which include not only endpoints. In addition, as used in the present invention, "installed", "connected", "connected", and one element "set" on another element should be understood in a broad sense, usually only indicating that there is a connection, coupling, cooperation or transmission relationship between the two elements, and the connection, coupling, cooperation or transmission between the two elements can be direct or indirect through an intermediate element, and cannot be understood as indicating or implying the spatial position relationship between the two elements, that is, one element can be in any orientation such as inside, outside, above, below or one side of another element, unless the content clearly indicates otherwise. For ordinary technicians in this field, the specific meanings of the above terms in the present invention can be understood according to specific circumstances. In addition, directional terms such as above, below, up, down, upward, downward, left, right, etc. are used relative to the exemplary embodiments as shown in the figures, with the upward or upper direction toward the top of the corresponding figure, and the downward or lower direction toward the bottom of the corresponding figure.

[0054] The purpose of the present invention is to provide a semiconductor chip efficient manufacturing logistics and intelligent dispatching method and system to solve the problem that the existing overhead crane handling system lacks elasticity and ductility in later applications. The following is a description with reference to the accompanying drawings.

[0055] To solve the problems existing in the prior art, please refer to Figure 1 The embodiment of the present invention provides a semiconductor efficient manufacturing chip logistics and intelligent dispatching method, which is applied to a semiconductor manufacturing plant, wherein a plurality of semiconductor process equipment separated from each other in space are arranged in the semiconductor manufacturing plant, and the semiconductor efficient manufacturing chip logistics and intelligent dispatching method comprises:

[0056] Step S1: according to the environmental factors of the space where the semiconductor process equipment 10 is located and the working indicators of the semiconductor process equipment, an electronic shelf 20 is arranged at the semiconductor process equipment 10, and the electronic shelf 20 has a shape and specification that is compatible with the environmental factors and the working indicators;

[0057] Step S2: Arranging a plurality of first rails 31 between the plurality of electronic shelves 20, so that each of the first rails 31 is connected to at least two of the electronic shelves 20, so as to establish a plurality of conveying paths between the plurality of electronic shelves 20;

[0058] Step S3: selecting a corresponding conveying path according to the process flow information reflecting the flow sequence of the semiconductor products between the plurality of semiconductor process equipments 10, and conveying the carrier from the electronic shelf 20 at one semiconductor process equipment 10 to the electronic shelf 20 at another semiconductor process equipment 10 through the conveying path;

[0059] The electronic shelf 20 and the first track 31 are both configured to be removably rearranged according to the work index and / or the process flow information.

[0060] Please refer to Figures 2 to 5 An embodiment of the present invention further provides a semiconductor efficient chip manufacturing logistics and intelligent dispatching system, which is used to transport carriers according to the semiconductor efficient chip manufacturing logistics and intelligent dispatching method as described above; the semiconductor efficient chip manufacturing logistics and intelligent dispatching system includes: a plurality of electronic shelves 20 and a plurality of first tracks 31; the electronic shelf 20 is arranged at the semiconductor process equipment 10 for storing and accessing the carrier 50; the first track 31 is configured to be detachably connected to the electronic shelf 20; wherein the electronic shelf 20 and the first track 31 are both configured to be detachably rearranged according to the work indicators and / or the process flow information.

[0061] In a semiconductor manufacturing plant, there are generally multiple semiconductor process equipment 10 separated from each other in space, which are used to process semiconductor products (including but not limited to wafers or chips, etc.) according to the process flow. After completing a process, the semiconductor product needs to be transferred to the next semiconductor process equipment 10. Semiconductor products are often placed in a carrier 50 (including but not limited to FOUP, FOSB, SMIF POD, Open Cassette, Reticle POD, etc.) and transported by the carrier 50. The carrier 50 is used to load semiconductor products. Of course, it is understandable that the carrier 50 can also be empty and transported.

[0062] The electronic shelf 20 is a special equipment in the field of material management, which includes a plurality of storage locations for storing materials. The electronic shelf 20 is preferably equipped with an RFID identification module to automatically read and record material information, realize real-time data management, and improve the efficiency and accuracy of material management. The storage space (Stocker) planned by the existing overhead crane handling system also belongs to a type of electronic shelf. In this embodiment, the electronic shelf 20 is used for access by the carrier 50 and to manage the carrier 50. Optionally, the electronic shelf 20 is arranged at the semiconductor process equipment 10, which may mean that the electronic shelf 20 is arranged at a position adjacent to the semiconductor process equipment 10, or it may mean that the electronic shelf 20 is connected to the semiconductor process equipment 10 through a second track 32 (see the following description for details). Figure 2 As shown in the example, the entire system includes 12 electronic shelves 20, which are labeled as shelves A to L for easy identification. Figure 2 Only the semiconductor process equipment 10 corresponding to shelf A, shelf B and shelf K are schematically shown, and the semiconductor process equipment 10 corresponding to the remaining shelves are not shown.

[0063] Furthermore, the carrier 50 has loading ID information, which includes, for example, ID information of semiconductor products loaded inside the carrier 50, or parameter information of the carrier 50 itself. Preferably, the loading ID information can be read by the RFID identification module of the electronic shelf 20, so that the electronic shelf 20 can identify each carrier 50, thereby providing a basis for the subsequent placement and management of the carrier 50.

[0064] The first rail 31 is connected between the electronic shelves 20 and can be used to transport the carrier 50. In one embodiment, a suspended transport robot 41 (see FIG. 4 ) can be provided on the first rail 31. Figure 2 and Figure 5 shown) or rail pulley 42 (see Figure 3 As shown in the figure, the suspended transport manipulator 41 or the rail trolley 42 can grab or support the carrier 50 and move along the first rail 31, thereby realizing the transmission of the carrier 50. Preferably, the first rail 31 is carried on the electronic shelf 20 or the ground, so that the first rail 31 does not need to be arranged on the ceiling of the clean room, which facilitates the flexible layout of the first rail 31.

[0065] For further information, please refer to Figure 3 and Figure 4The semiconductor efficient manufacturing chip logistics and intelligent dispatching system also includes an entry and exit handling device 40 and / or an internal handling device 21. The entry and exit handling device 40 is arranged on the electronic shelf 20 or at the end of the first track 31, and is used to transport the carrier 50 from the electronic shelf 20 to the first track 31 (further transported to the suspended handling manipulator 41 or the track pulley 42), or from the first track 31 to the electronic shelf 20; optionally, the internal handling device 21 is arranged on the electronic shelf 20, and is used to adjust the position of the carrier 50 on the electronic shelf 20, or to transport the carrier 50 from the electronic shelf 20 to the first track 31, or from the first track 31 to the electronic shelf 20.

[0066] In an alternative exemplary embodiment, the entry and exit transport device 40 includes, for example, a robotic arm or an XY-axis double-rod pushing device, and the internal transport device 21 includes, for example, an XY-axis double-rod pushing device or an elevator-type robotic arm, etc. The specific structures of the entry and exit transport device 40 and the internal transport device 21 can refer to the prior art and will not be elaborated in this embodiment.

[0067] The present invention has no limitation on the number and shape of the first rails 31 and the connection method between the first rails 31 and the electronic shelf 20. Optionally, the connection between the first rails 31 and the electronic shelf 20 may be that the end of the first rails 31 terminates at the electronic shelf 20. For example, in the simplest embodiment, Figure 4 As shown, a first track 31 is arranged between two electronic shelves 20, and both ends of the first track 31 terminate at the two electronic shelves 20 respectively. Optionally, the connection between the first track 31 and the electronic shelves 20 may also be that the middle section of the first track 31 passes through the electronic shelves 20. In one embodiment, both ends of a first track 31 terminate at two electronic shelves 20 respectively, and the middle section of the first track 31 is adjacent to and passes through the third electronic shelf 20. In practice, the carrier 50 transported by the first track 31 can enter and exit the third electronic shelf 20 under the transportation of equipment such as an entry and exit transport device, and it can be considered that the first track 31 and the third electronic shelf 20 are also connected. In other embodiments, such as Figure 3 As shown, the first track 31 can also be configured as a ring, that is, it has no end, and the connection between the first track 31 and the electronic shelf 20 is a path-type connection.

[0068] Optionally, the first track 31 may also have branches. For example, in one embodiment, the two ends of a first track 31 terminate at two electronic shelves 20 respectively, and the middle section of the first track 31 has a branch, so that the first track 31 is connected to another first track 31 or another electronic shelf 20 through the branch. It can be understood that the first track 31 is connected to multiple electronic shelves 20 at this time.

[0069] Preferably, the first track 31 is configured as a unidirectional first track, that is, each first track 31 has a fixed transmission direction and transmits in only one direction. Figure 2 In the illustrated embodiment, the arrows indicate the transmission direction of each first track 31. In some embodiments, in order to achieve bidirectional transmission between two electronic shelves 20, two first tracks may be arranged in parallel, or a circular first track may be arranged to achieve reciprocating transmission. The unidirectional first track is conducive to simplifying the transmission path and reducing crossing and blocking.

[0070] Preferably, the first track 31 includes a straight segment, an arc segment, a ring segment or an irregular segment. The semiconductor efficient manufacturing chip logistics and intelligent dispatching method further includes: configuring a suitable first track shape according to the environmental factors of the space through which the first track 31 passes, combined with the work index and / or the process flow information. It can be understood that the first track 31 can be flexibly laid out according to the actual required work index and / or process flow information to optimize the conveying path.

[0071] In step S1, the environmental factors of the space where the semiconductor process equipment 10 is located include, for example, objective physical conditions such as the space conditions near the semiconductor process equipment 10 and whether there are any obstructions (such as fire hydrants, sprinkler heads, etc.). The working indicators of the semiconductor process equipment 10 include the throughput and waiting time of the semiconductor process equipment 10. Arranging the electronic shelf 20 at the semiconductor process equipment 10 means arranging the electronic shelf 20 near the semiconductor process equipment 10. The specific arrangement position of the electronic shelf 20 and the distance from the semiconductor process equipment 10 can be obtained by comprehensive evaluation based on the environmental factors and working indicators of the space where the semiconductor process equipment 10 is located. For example, when there are no obstructions near the semiconductor process equipment 10, the electronic shelf 20 can be arranged as close to the semiconductor process equipment 10 as possible. For another example, when the throughput of the semiconductor process equipment 10 is small, the electronic shelf 20 can give priority to satisfying other conditions and be arranged appropriately away from the semiconductor process equipment 10.

[0072] The shape of the electronic shelf 20 refers to the plane layout form of the electronic shelf 20. A typical plane layout form of the electronic shelf 20 is, for example, a rectangle. When not restricted, the plane layout form of the electronic shelf 20 can be simply configured as a rectangle. When restricted by environmental factors and work indicators, the plane layout form of the electronic shelf 20 can be adaptively adjusted. For example, when the electronic shelf 20 is arranged in a corner or near a pillar in a clean room, the plane layout form of the electronic shelf 20 can be configured as an L shape. For another example, when the throughput of the semiconductor process equipment 10 corresponding to the electronic shelf 20 is large, the plane layout form of the electronic shelf 20 can be configured as a long strip to increase the length of the exchange surface. The specifications of the electronic shelf 20 refer to parameters such as the height, number of layers, storage positions, and load-bearing performance of the electronic shelf 20. It can be understood that these parameters can be set according to the environmental factors near the electronic shelf 20 and the corresponding work indicators of the semiconductor process equipment 10.

[0073] In step S2 , the layout of the first track 31 may be planned according to the process flow, and then a plurality of conveying paths may be established according to the layout of the first track 31 .

[0074] In step S3, the conveying path can be planned based on the process flow of the semiconductor product and the currently laid out first track 31. Optionally, the conveying path can include one or more first tracks 31. In one embodiment, the planning of the conveying path can be based on artificial intelligence and big data technology, taking into account the status of work-in-progress in different areas of the semiconductor manufacturing plant, the different Run cargo modes of each semiconductor process equipment 10, the different status of each semiconductor process equipment 10, the process switching situation, the product process Q Time control and other factors, so as to quickly calculate the optimal conveying path and each station on the conveying path (such as the electronic shelf 20 for transfer). Through the optimal conveying path and algorithm, the carrier 50 is intelligently scheduled and dispatched, the utilization rate of each semiconductor process equipment 10 is improved, the production cycle time is reduced, and the production efficiency is improved.

[0075] In some embodiments, there may be multiple transport paths from an electronic shelf 20 at a semiconductor process equipment 10 to an electronic shelf 20 at another semiconductor process equipment 10. A better transport path may be selected based on a comprehensive evaluation of the smoothness and / or idleness of each transport path, as well as the length of each transport path, the number of transfers required, etc. Figure 2 As shown in the figure, take the path from shelf A to shelf H as an example. Figure 2It can be seen that the goods can be directly transported from shelf A to shelf H through the first track 31 that is directly connected between the two, or they can be transported from shelf A to shelf H after being transferred from shelf E. The actual transportation path selected can be determined based on a comprehensive evaluation. For example, when the transportation volume of the first track 31 from shelf A to shelf F is high, resulting in the occupation of part of the first track 31 at the exit of shelf A, resulting in a low smoothness rate of the transportation path from shelf A to shelf H, and the transportation volume of the transportation path from shelf A to shelf H after being transferred from shelf E is not high, and its smoothness rate is high, the transportation path from shelf A to shelf H after being transferred from shelf E can be selected. Although it needs to be transferred once at shelf E, it may still be a better transportation path after comprehensive evaluation.

[0076] Furthermore, the semiconductor efficient manufacturing chip logistics and intelligent dispatching method also includes:

[0077] Step S41: monitoring the patency rate and / or idle rate of the transport path;

[0078] Step S42: according to the monitoring results of the patency rate and / or idle rate, at least one of the first tracks 31 is increased, decreased and / or replaced to optimize the corresponding conveying path.

[0079] The patency rate can be calculated based on the ratio of the current transport volume of a certain transport path to its maximum transport capacity, and the idle rate can be calculated based on the ratio of the transport time of a certain transport path to the idle time. The patency rate or idle rate can be used to evaluate whether the transport density of a certain transport path is reasonable. For example, when the idle rate is too high, it means that the utilization rate of the transport path is low, and at least one first track 31 contained therein can be reduced, or it can be abolished in whole or in part. For another example, when the patency rate is too low, it means that the transport path may be blocked, and at least one first track 31 can be added to improve the patency rate of the transport path.

[0080] Since the electronic shelf 20 and the first track 31 are configured to be removable and re-arranged according to work indicators and / or process flow information, when some transportation paths do not meet the requirements (such as the smooth rate and / or idle rate do not meet the requirements), the electronic shelf 20 and / or the first track 31 can be disassembled and re-arranged to eliminate the blockage or transportation bottleneck. Figure 2As shown in the figure, taking the transportation from shelf A to shelf H as an example, if the smoothness of the transportation path from shelf A to shelf F is low, and the smoothness of the transportation path from shelf A to shelf H after being transferred through shelf E is also low, it can be considered to add a first track 31 between shelf A and shelf H. In order to improve the transportation capacity between shelf A and shelf H, the smoothness of the transportation path is improved. Furthermore, after the process flow is adjusted or the work indicators are adjusted, such as the phased increase in production capacity demand, the subsequent new product development and replacement of equipment selection leading to process upgrades, etc., the electronic shelf 20 and the first track 31 can be rearranged, and the shape and specifications of the electronic shelf 20 can be further adjusted.

[0081] Optionally, the semiconductor efficient manufacturing chip logistics and intelligent dispatching method further includes: setting an entry and exit handling device 40 on the electronic shelf 20 or at the end of the first track 31, so as to transport the carrier 50 from the electronic shelf 20 to the first track 31, or from the first track 31 to the electronic shelf 20 through the entry and exit handling device 40. The entry and exit handling device 40 can be set on the electronic shelf 20 or on the first track 31, and this embodiment is not limited to this.

[0082] When the conveying path includes more than two first rails 31, and the two or more first rails 31 are connected to the same electronic shelf 20, the semiconductor efficient manufacturing chip logistics and intelligent dispatching method further includes: using the in-and-out handling device 40 and / or the internal handling device 21 of the electronic shelf 20 to carry the carrier 50 to connect different first rails 31 in the conveying path. Please continue to refer to Figure 2 Taking the conveying path of shelf A to shelf H after being transferred via shelf E as an example, the conveying path includes two first rails 31, and the two first rails 31 are connected to the same shelf E. In this case, shelf E is configured as a transfer station. After being conveyed from shelf A to shelf E, the carrier 50 can be conveyed to the first rail 31 between shelf E and shelf H through the in-and-out conveying device 40 and / or the internal conveying device 21 of shelf E, thereby running through the entire conveying path.

[0083] Optionally, the semiconductor efficient manufacturing chip logistics and intelligent dispatching method further includes: according to the work index and / or the process flow information, using the internal handling device 21 of the electronic shelf 20 to carry the carrier 50 to adjust the position of the carrier 50 on the electronic shelf 20. It is understandable that after being transported to a certain electronic shelf 20, the carrier 50 may need to be stored on the electronic shelf 20. At this time, the internal handling device 21 can be used to adjust and place the carrier 50 so that the carrier 50 is placed in a predetermined storage position.

[0084] Optionally, the semiconductor efficient manufacturing chip logistics and intelligent dispatching method further includes:

[0085] Step S51: Obtaining the loading ID information of the carrier 50;

[0086] Step S52: Acquire process flow information corresponding to the loading ID information, and obtain planned transport path information between corresponding semiconductor process equipment 10 based on the process flow information;

[0087] Step S53: transporting the carrier 50 through the corresponding first track according to the loading ID information of the carrier 50 and the planned transport path information; wherein at least two carriers 50 with different types of loading ID information are configured to share the same first track.

[0088] Steps S41 to S43 are a process of automatically planning a conveying path based on the existing electronic shelf 20 and the first track 31 and the loading ID information and process flow information. Step S41 can be implemented, for example, by an RFID identification module provided on the electronic shelf 20. Figure 2 Taking the system shown as an example, the electronic shelf 20 can obtain the type, quantity, specifications and other parameters of the semiconductor products specifically loaded in the carrier 50 stored in itself through its RFID identification module. In an exemplary embodiment, the carrier 50 stored on shelf A is loaded with semiconductor product a, and the carrier 50 stored on shelf D is loaded with semiconductor product d. According to the process flow, the semiconductor process equipment 10 corresponding to shelf G requires both semiconductor product a and semiconductor product d. At this time, two conveying paths can be planned, namely, from shelf A to shelf G and from shelf D to shelf G, that is, the planned conveying path information is obtained.

[0089] Then, according to the planned conveying path information, the corresponding carriers 50 loaded with semiconductor product a and the carriers 50 loaded with semiconductor product d on shelf A and shelf D are respectively transported to shelf G through the first track 31 based on the loading ID information, and then transported to the semiconductor process equipment 10 corresponding to shelf G. It can be understood that at this time, two carriers 50 with different types of loading ID information (i.e., the carriers 50 loaded with semiconductor product a and the carriers 50 loaded with semiconductor product d) share the same first track 31 and are transported to shelf G. By setting up a shared first track 31, the utilization rate of the first track 31 is effectively improved, and the connection between the first track 31 and the electronic shelf 20 and the setting of the carrier entrance and exit are simplified. Furthermore, based on the setting of the shared first track 31, each electronic shelf 20 can have only one carrier exit and one carrier entrance, which greatly simplifies the structure of the electronic shelf 20 and the difficulty of layout connection.

[0090] Optionally, the semiconductor efficient manufacturing chip logistics and intelligent dispatching method further includes:

[0091] Step S61: Obtaining the location information of the operator's wristband;

[0092] Step S62: Based on the selected conveying path and the location information of the operator's wristband, a work dispatch strategy is generated, and the handling task information is sent to the operator's wristband.

[0093] In some application scenarios, there may still be a certain distance between the semiconductor process equipment 10 and its corresponding electronic shelf 20, which requires manual transportation by an operator. In these application scenarios, an operator's wristband can be provided for the operator. The operator's wristband can be, for example, a wearable device, which is used on the one hand for system positioning so that the system knows the current operator's location distribution. After the system learns the location information of the operator's wristband, it can generate a dispatching strategy based on the selected conveying path. On the other hand, the operator's wristband is used to send handling task information to the operator to provide real-time task prompts and guidance, further improving work efficiency and quality. Furthermore, when the operator goes to the electronic shelf 20 for transportation, the operator's wristband can also interact with the electronic shelf 20 to help the operator find the correct storage location more quickly.

[0094] Please refer to Figure 5 Optionally, the step of arranging electronic shelves at the semiconductor process equipment includes:

[0095] A second track 32 is arranged between the semiconductor process equipment 10 and the electronic shelf 20, so that the second track 32 connects the semiconductor process equipment 10 and the electronic shelf 20;

[0096] The second track 32 is used to transport the carrier 50 between the semiconductor process equipment 10 and the electronic shelf 20 .

[0097] In some other application scenarios, there may be a certain distance between the semiconductor process equipment 10 and its corresponding electronic shelf 20. In order to further reduce the manual handling of operators, in these application scenarios, a second track 32 can be arranged between the semiconductor process equipment 10 and the corresponding electronic shelf 20, and then the second track 32 can be used to transport the carrier 50, thereby eliminating the manual handling between the semiconductor process equipment 10 and the corresponding electronic shelf 20.

[0098] The structure and arrangement of the second track 32 can refer to the first track 31, for example, it can be detachably connected and arranged between the semiconductor process equipment 10 and its corresponding electronic shelf 20. The carrier 50 can also be transported on the second track 32 by a suspended transport manipulator 41 or a track trolley 42. Furthermore, the semiconductor process equipment 10 or the end of the second track 32 can also be provided with an entry and exit transport device 40 to transport the carrier 50 from the semiconductor process equipment 10 to the second track 32, or from the second track 32 to the semiconductor process equipment 10.

[0099] In summary, in the semiconductor efficient manufacturing chip logistics and intelligent dispatching method and system provided by the present invention, the semiconductor efficient manufacturing chip logistics and intelligent dispatching method includes: according to the environmental factors of the space where the semiconductor process equipment is located and the working indicators of the semiconductor process equipment, an electronic shelf is arranged at the semiconductor process equipment, and the electronic shelf has a shape and specification that is compatible with the environmental factors and the working indicators; a plurality of first tracks are arranged between the plurality of electronic shelves, so that each of the first tracks is connected to at least two of the electronic shelves, so as to establish a plurality of conveying paths between the plurality of electronic shelves; according to the process flow information reflecting the flow sequence of semiconductor products between the plurality of semiconductor process equipment, a corresponding conveying path is selected, and the carrier is conveyed from the electronic shelf at one semiconductor process equipment to the electronic shelf at another semiconductor process equipment through the conveying path; wherein the electronic shelf and the first track are both configured to be removably re-arranged according to the working indicators and / or the process flow information. In this configuration, the electronic shelf is arranged at the semiconductor process equipment, so that the carrier can enter the electronic shelf nearby, thereby entering the conveying path. Then, in combination with the actual process flow information, the corresponding transportation path is selected, and the carrier can be transported to the electronic shelf at the next semiconductor process equipment through the first track between the electronic shelves, and enter the next semiconductor process equipment nearby. An efficient transportation process is completed. Furthermore, since the electronic shelves and the first track are configured to be removably rearranged according to work indicators and / or process flow information, when the work indicators and / or process flow change, the layout of the electronic shelves and the first track can be adaptively adjusted, thereby coping with the expansion or change of the process layout caused by factors such as the initial, mid- and late-stage capacity ramp-up of the semiconductor manufacturing plant, the gradual installation of equipment, and the development of new products. The present invention breaks away from the current system thinking of using an overhead crane transportation system to solve the limited system faced by logistics transportation in semiconductor manufacturing, and provides a solution for an expandable system.

[0100] It should be noted that the above embodiments can be combined with each other. The above description is only a description of the preferred embodiments of the present invention, and does not limit the scope of the present invention. Any changes and modifications made by ordinary technicians in the field of the present invention based on the above disclosure are within the protection scope of the present invention.

Claims

1. A semiconductor efficient manufacturing chip logistics and intelligent dispatching method, applied to a semiconductor manufacturing plant, wherein a plurality of semiconductor process equipment separated from each other in space are arranged in the semiconductor manufacturing plant, characterized in that: The semiconductor efficient manufacturing chip logistics and intelligent dispatching method comprises: According to the environmental factors of the space where the semiconductor process equipment is located and the working indicators of the semiconductor process equipment, an electronic shelf is arranged at the semiconductor process equipment, and the electronic shelf has a shape and specification that is compatible with the environmental factors and the working indicators; Arrange a plurality of first rails between the plurality of electronic shelves, so that each of the first rails connects at least two of the electronic shelves, so as to establish a plurality of conveying paths between the plurality of electronic shelves; A loading and unloading device is provided on the electronic shelf or at the end of the first track, so as to transfer the carrier from the electronic shelf to the first track or from the first track to the electronic shelf through the loading and unloading device; Selecting a corresponding conveying path according to process flow information reflecting the flow sequence of semiconductor products between the plurality of semiconductor process equipments, and conveying the carrier from an electronic shelf at one semiconductor process equipment to an electronic shelf at another semiconductor process equipment through the conveying path; Wherein, the electronic shelf and the first track are both configured to be removably rearranged according to the work indicators and / or the process flow information.

2. The semiconductor efficient manufacturing chip logistics and intelligent dispatching method according to claim 1 is characterized in that: When the conveying path includes more than two first tracks, and the more than two first tracks are connected to the same electronic shelf, the semiconductor efficient manufacturing chip logistics and intelligent dispatching method further includes: The carrier is transported by an in-and-out transport device and / or an internal transport device of the electronic shelf to connect different first tracks in the conveying path.

3. The semiconductor efficient manufacturing chip logistics and intelligent dispatching method according to claim 1 is characterized in that: The semiconductor efficient chip manufacturing logistics and intelligent dispatching method also includes: according to the work indicators and / or the process flow information, using the internal handling device of the electronic shelf to carry the carrier to adjust the position of the carrier on the electronic shelf.

4. The semiconductor efficient manufacturing chip logistics and intelligent dispatching method according to claim 1 is characterized in that: The semiconductor efficient manufacturing chip logistics and intelligent dispatching method also includes: Obtaining the loading ID information of the vehicle; Acquire process flow information corresponding to the loading ID information, and obtain planned transport path information between corresponding semiconductor process equipment based on the process flow information; The carrier is transported through the corresponding first track according to the loading ID information of the carrier and the planned transport path information; wherein at least two carriers with different types of loading ID information are configured to share the same first track.

5. The semiconductor efficient manufacturing chip logistics and intelligent dispatching method according to claim 1 is characterized in that: The semiconductor efficient manufacturing chip logistics and intelligent dispatching method also includes: monitoring the patency rate and / or idle rate of the delivery path; According to the monitoring results of the patency rate and / or idle rate, at least one of the first tracks is increased, decreased and / or replaced to optimize the corresponding conveying path.

6. The semiconductor efficient manufacturing chip logistics and intelligent dispatching method according to claim 1 is characterized in that: The first track includes a straight segment, an arc segment, a ring segment or an irregular segment, and the semiconductor efficient manufacturing chip logistics and intelligent dispatching method also includes: According to environmental factors of the space through which the first track passes, a suitable shape of the first track is configured in combination with the work index and / or the process flow information.

7. The semiconductor efficient manufacturing chip logistics and intelligent dispatching method according to claim 1 is characterized in that: The semiconductor efficient manufacturing chip logistics and intelligent dispatching method also includes: Get the location information of the operator's wristband; Based on the selected conveying path and the location information of the operator's wristband, a work dispatch strategy is generated, and the handling task information is sent to the operator's wristband.

8. The semiconductor efficient manufacturing chip logistics and intelligent dispatching method according to claim 1 is characterized in that: The step of arranging electronic shelves at the semiconductor process equipment also includes: Arrange a second track between the semiconductor process equipment and the electronic shelf, so that the second track connects the semiconductor process equipment and the electronic shelf; Wherein, the second track is used to transport the carrier between the semiconductor process equipment and the electronic shelf.

9. A semiconductor efficient manufacturing chip logistics and intelligent dispatching system, characterized in that: A carrier for efficiently manufacturing semiconductor chips in logistics and intelligent dispatching methods according to any one of claims 1 to 8; The semiconductor efficient manufacturing chip logistics and intelligent dispatching system comprises: a plurality of electronic shelves, a plurality of first tracks and an entry and exit handling device; The electronic shelf is arranged at the semiconductor process equipment and is used for storing and accessing the carrier; The first track is configured to be detachably connected to the electronic shelf; The in-and-out transport device is disposed on the electronic shelf or at an end of the first track, and is used to transport the carrier from the electronic shelf to the first track, or from the first track to the electronic shelf; Wherein, the electronic shelf and the first track are both configured to be removably rearranged according to the work indicators and / or the process flow information.

10. The semiconductor efficient manufacturing chip logistics and intelligent dispatching system according to claim 9, characterized in that: The semiconductor efficient manufacturing chip logistics and intelligent dispatching system also includes: an internal handling device; The internal transport device is disposed on the electronic shelf, and is used to adjust the position of the carrier on the electronic shelf, or to transport the carrier from the electronic shelf to the first track, or from the first track to the electronic shelf.

11. The semiconductor efficient manufacturing chip logistics and intelligent dispatching system according to claim 9, characterized in that: It also includes a second track that is detachably arranged between the semiconductor process equipment and the electronic shelf, wherein the second track connects the semiconductor process equipment and the electronic shelf, wherein the second track is used to transport the carrier between the semiconductor process equipment and the electronic shelf.

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