A heat dissipation DC power supply based on the Internet of Things

Abstract

The present invention belongs to the technical field of power supply equipment, and specifically is a heat dissipation type DC power supply based on the Internet of Things. The abnormal area is identified by monitoring the internal temperature of the power supply with an infrared thermal sensor, and then the heat dissipation mode and the adapted heat dissipation terminal are determined based on the proportion of the abnormal area, thereby realizing targeted heat dissipation of the temperature inside the power supply. At the same time, when the abnormal area is identified, the adjacent area is delineated based on the abnormal area, and then the temperature of the adjacent area is obtained, and the required temperature reduction range is analyzed accordingly, which helps to protect electronic devices located in the abnormal area and the adjacent area from being damaged by the influence of temperature, and helps to better maintain the stability of the system. Finally, when the execution of the heat dissipation terminal affects the normal operation of the power supply, the power consumption distribution ratio of each operating item of the power supply is retrieved, thereby reducing and adjusting the operating items of the power supply, which can keep the power supply running in a stable working state and avoid unstable operation caused by overheating.

Description

Technical Field

[0001] The present invention belongs to the technical field of power supply equipment, and in particular is a heat dissipation type direct current power supply based on the Internet of Things. Background Art

[0002] Heat dissipation DC power supplies are a type of power supply device widely used in IoT applications. They are usually designed to provide stable DC power to various electronic devices and sensors, and can effectively dissipate heat to maintain good working condition when necessary.

[0003] In order to achieve efficient heat dissipation, heat dissipation type DC power supplies are now often designed with multiple heat dissipation terminals to effectively reduce the operating temperature of the power supply and improve the heat dissipation efficiency, thereby ensuring the stability and reliability of the power supply. However, the following defects exist when using multiple heat dissipation terminals for heat dissipation operations: 1. When the temperature inside the power supply is high and heat dissipation is required, most of the existing heat dissipation terminals are started for heat dissipation operations, which may cause excessive heat dissipation, making the internal temperature of the power supply too low, thereby reducing the working efficiency of the electronic components and even affecting the stability and performance of the power supply. In addition, starting all the heat dissipation terminals will consume more energy, which may lead to an increase in the overall energy consumption of the power supply, especially under long-term high-load conditions, which may increase the operating cost of the power supply.

[0004] 2. When the temperature inside the power supply is high, the existing startup heat dissipation terminal usually lowers the temperature to a uniform temperature range, ignoring the temperature of the adjacent area of ​​the abnormal area, which easily causes uneven heat dissipation between the abnormal area and the adjacent area, which may cause a large temperature difference between the two, thereby affecting the normal operation of electronic devices located in the abnormal area and the adjacent area.

[0005] 3. Generally speaking, when heat dissipation control is performed, it may have a certain impact on the operating power of the power supply. Usually, the higher the operating level of the heat dissipation terminal, the more additional power is consumed, resulting in a reduction in the actual output power of the power supply. However, this problem is ignored in the existing heat dissipation control. It is often the case that when the actual output power of the power supply is reduced, it still operates according to the original operating data of the power supply, making it impossible for the power supply to provide sufficient power to support the normal operation of the equipment, resulting in performance degradation or limited equipment functions, thereby reducing the power supply guarantee for the equipment. Summary of the invention

[0006] In view of this, the present invention aims to propose a heat dissipation type DC power supply based on the Internet of Things, which optimizes the heat dissipation control method and required heat dissipation temperature of the power supply, and adds operation adjustments after the heat dissipation affects the normal operation of the power supply, thereby effectively solving the problems raised in the above background technology.

[0007] The purpose of the present invention can be achieved through the following technical solutions: A heat dissipation type DC power supply based on the Internet of Things, comprising the following modules: a heat dissipation terminal layout module, used to layout the heat dissipation terminal in the DC power supply and extract the heat dissipation terminal layout state diagram.

[0008] The operating temperature monitoring module is used to use an infrared thermal sensor to monitor the temperature inside the power supply in real time during the power supply process to form a thermal map of the power supply.

[0009] The abnormal area identification module is used to identify the abnormal area based on the formed internal heat map of the power supply.

[0010] The adaptive heat dissipation terminal screening module is used to screen adaptive heat dissipation terminals based on abnormal areas.

[0011] The required cooling range analysis module is used to define adjacent areas based on abnormal areas, and then obtain the temperature of the adjacent areas, and analyze the required cooling range accordingly.

[0012] The required operating level determination module is used to determine the required operating level of the adaptive heat dissipation terminal according to the required cooling range.

[0013] The heat dissipation execution module is used to start the adapted heat dissipation terminal to perform heat dissipation operations according to the required operating level.

[0014] The operation-related impact evaluation module is used to analyze the heat dissipation power consumption of the heat dissipation terminal according to the required operation level of the heat dissipation terminal, and compare it with the power supply of the power supply to judge whether the heat dissipation affects the normal operation of the power supply.

[0015] The operation reduction adjustment module is used to retrieve the power consumption distribution ratio of each operation item of the power supply when it is determined that heat dissipation affects the normal operation of the power supply, thereby reducing and adjusting the operation items of the power supply.

[0016] Compared with the prior art, the beneficial effects of the present invention are as follows: 1. The present invention uses infrared thermal sensors to monitor the internal temperature of the power supply and identify abnormal areas, and then determines the heat dissipation mode and the adapted heat dissipation terminal based on the proportion of the abnormal area, thereby realizing targeted heat dissipation of the temperature inside the power supply. On the one hand, it avoids excessive heat dissipation, which is beneficial to ensure the working efficiency of electronic components. On the other hand, selecting some heat dissipation terminals for heat dissipation according to the abnormal area can reduce energy consumption while achieving the heat dissipation purpose, and at the same time improves the heat dissipation efficiency, which helps to improve equipment performance and reliability, reduce maintenance costs, and bring environmental benefits.

[0017] 2. When an abnormal area is identified, the present invention defines an adjacent area based on the abnormal area, and then obtains the temperature of the adjacent area, and analyzes the required cooling range accordingly. Compared with uniformly lowering the temperature to a temperature range, this operation takes into account the temperature difference between the abnormal area and the adjacent area, and can perform heat dissipation control based on the temperature difference between the two. It not only avoids excessive or insufficient heat dissipation and improves the accuracy of heat dissipation, but also can save energy more effectively. At the same time, it helps to protect electronic devices located in the abnormal area and the adjacent area from damage caused by temperature, and helps to better maintain the stability of the system.

[0018] 3. When the execution of the heat dissipation terminal affects the normal operation of the power supply, the present invention retrieves the power consumption distribution ratio of each operating item of the power supply, thereby reducing and adjusting the operating items of the power supply, which can keep the power supply running in a stable working state and avoid unstable operation caused by overheating or other factors. At the same time, it can reduce the electric and thermal pressure during equipment operation and reduce the risk of equipment damage, thereby improving the reliability and stability of the entire power supply system. BRIEF DESCRIPTION OF THE DRAWINGS

[0019] In order to more clearly illustrate the technical solutions of the embodiments of the present invention, the accompanying drawings required for describing the embodiments will be briefly introduced below. Obviously, the accompanying drawings described below are only some embodiments of the present invention. For ordinary technicians in this field, other accompanying drawings can be obtained based on these accompanying drawings without paying creative work.

[0020] Figure 1 It is a schematic diagram of the connection of each module of the system of the present invention. DETAILED DESCRIPTION

[0021] The following will be combined with the drawings in the embodiments of the present invention to clearly and completely describe the technical solutions in the embodiments of the present invention. Obviously, the described embodiments are only part of the embodiments of the present invention, not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the present invention.

[0022] See also Figure 1As shown, the present invention proposes a heat dissipation type DC power supply based on the Internet of Things, including a heat dissipation terminal layout module, an operating temperature monitoring module, an abnormal area identification module, an adaptive heat dissipation terminal screening module, a required cooling amplitude analysis module, a required operating gear determination module, a heat dissipation execution module, an operation-related impact evaluation module, and an operation reduction adjustment module, wherein the operating temperature monitoring module is connected to the abnormal area identification module, the abnormal area identification module and the heat dissipation terminal layout module are both connected to the adaptive heat dissipation terminal screening module, the abnormal area identification module is connected to the required cooling amplitude analysis module, the required cooling amplitude analysis module is connected to the required operating gear determination module, the required operating gear determination module and the adaptive heat dissipation terminal screening module are both connected to the heat dissipation execution module, the required operating gear determination module is connected to the operation-related impact evaluation module, and the operation-related impact evaluation module is connected to the operation reduction adjustment module.

[0023] The heat dissipation terminal arrangement module is used to arrange the heat dissipation terminal in the DC power supply and extract the heat dissipation terminal arrangement state diagram, wherein the heat dissipation terminal may be a heat dissipation fan.

[0024] The operating temperature monitoring module is used to monitor the temperature inside the power supply in real time using an infrared thermal sensor during the power supply process to form a thermal map inside the power supply.

[0025] The present invention uses an infrared thermal sensor to form a thermal map when collecting the operating temperature inside the power supply. On the one hand, this method can realize non-contact measurement of the internal temperature of the power supply without directly contacting the power supply or the internal components of the power supply, avoiding interference or damage that may be introduced by the contact sensor. On the other hand, by forming a thermal map, the temperature distribution of each area inside the power supply can be fully understood, which is helpful to comprehensively evaluate the working status and heat dissipation of the power supply. Moreover, compared with other sensors, the infrared thermal sensor has a smaller size and a convenient installation method, and is easy to deploy inside the power supply without affecting the layout and structure inside the power supply.

[0026] The abnormal area identification module is used to identify abnormal areas based on the formed internal heat map of the power supply. Specifically, the abnormal area identification process is as follows: temperature distribution features are extracted from the internal heat map of the power supply, specifically including the number of temperature distribution areas and the chromaticity values ​​corresponding to each temperature distribution area.

[0027] The chromaticity value corresponding to each temperature distribution area is compared with the temperature represented by each chromaticity in the heat map, and the temperature corresponding to each temperature distribution area is obtained.

[0028] The temperature corresponding to each temperature distribution area is compared with the limit temperature in the power supply, and the temperature distribution area with a temperature greater than the limit temperature is identified as an abnormal area.

[0029] In the example of the above scheme, generally speaking, the ambient temperature range of most power supplies is between 0°C and 40°C. Exceeding this range may cause power supply performance degradation or failure, so the limit temperature in the power supply may be 40°C.

[0030] The adapted heat dissipation terminal screening module is used to screen out adapted heat dissipation terminals based on abnormal areas. The specific screening process is as follows: the first step is to identify whether a heat dissipation terminal is deployed in the abnormal area based on the heat dissipation terminal deployment status diagram. If a heat dissipation terminal is deployed, the second step to the third step are executed, otherwise the fourth step to the sixth step are executed.

[0031] As a further innovation of the above scheme, before identifying whether to arrange the heat dissipation terminal in the abnormal area, it also includes counting the number of abnormal areas, and comparing it with the number of temperature distribution areas to obtain the abnormal proportion, and then comparing the abnormal proportion with the set high proportion. For example, the high proportion can be set to 0.8. If the abnormal proportion is greater than or equal to the high proportion, all the heat dissipation terminals arranged in the DC power supply are used as adapted heat dissipation terminals.

[0032] It is understandable that when the abnormal area accounts for a large proportion, the heat dissipation effect can be maximized by enabling all heat dissipation terminals to execute the overall heat dissipation mode. By utilizing all heat dissipation terminals, heat can be discharged from the abnormal area as quickly as possible, effectively reducing the temperature of the abnormal area and protecting the stable operation of electronic devices. When the abnormal area accounts for a small proportion, energy can be saved by enabling some heat dissipation terminals to execute the local heat dissipation mode. Since the abnormal area is small, only some heat dissipation terminals need to participate in the heat dissipation to meet the heat dissipation requirements, avoiding unnecessary energy consumption, and thus achieving energy savings. Therefore, according to the size and location of the abnormal area, the overall heat dissipation mode or the local heat dissipation mode can be flexibly selected, which can improve the efficiency of the system while ensuring the heat dissipation effect, so that the heat dissipation system can maintain the best performance under different workloads.

[0033] The high ratio mentioned above is the initial setting of the system, and its purpose is to assist in the selection of overall cooling mode and local cooling mode.

[0034] It should be noted that the placement position of the heat dissipation terminal can be obtained from the heat dissipation terminal placement state diagram, and thus whether the heat dissipation terminal is placed in the abnormal area can be identified according to the placement position of the heat dissipation terminal.

[0035] The second step is to count the number of heat dissipation terminals deployed in the abnormal area. If there is only one heat dissipation terminal deployed, the heat dissipation terminal is used as the adaptation heat dissipation terminal. If there is more than one heat dissipation terminal deployed, the third step is executed.

[0036] The third step is to mark the center point in the abnormal area and extract the layout positions of each heat dissipation terminal in the abnormal area from the heat dissipation terminal layout status diagram, thereby comparing the center point position of the abnormal area with the layout positions of each heat dissipation terminal to obtain the distance between the layout positions of each heat dissipation terminal and the center point of the abnormal area, and then take the heat dissipation terminal with the smallest distance as the adapted heat dissipation terminal.

[0037] It should be understood that by comparing the distance between the heat dissipation terminal and the center point of the abnormal area, the heat dissipation terminal corresponding to the minimum distance is selected as the adaptive heat dissipation terminal. This is because the heat dissipation terminal located near the center point of the abnormal area can make the heat dissipated more evenly in all directions, avoid local overheating or overcooling, improve the balance of the heat dissipation effect, and thus maximize the heat dissipation effect. At the same time, it can reduce the loss of energy during the transmission process, because only the nearest heat dissipation terminal needs to operate, while other heat dissipation terminals can remain closed or in low-power operation, thereby reducing the energy consumption of the heat dissipation system and achieving the goal of energy conservation and emission reduction.

[0038] The fourth step is to extract the boundary contour of the abnormal area from the internal heat map of the power supply, and then identify the heat dissipation terminals located around the abnormal area based on the heat dissipation terminal layout state diagram, and record them as candidate heat dissipation terminals.

[0039] The fifth step is to compare the layout position of the alternative heat dissipation terminal with the center point of the abnormal area to obtain the distance between the layout position of the alternative heat dissipation terminal and the center point of the abnormal area, and at the same time extract the layout direction of the alternative heat dissipation terminal from the heat dissipation terminal layout state diagram to obtain the heat dissipation coverage range of the alternative heat dissipation terminal, and then compare it with the boundary contour of the abnormal area to obtain the coverage overlap.

[0040] Preferably, the coverage overlap can be obtained by obtaining the size of the overlap region, such as the area or volume, and dividing it by the size of the heat dissipation coverage range of the candidate heat dissipation terminal to obtain the coverage overlap.

[0041] It needs to be explained that the heat dissipation terminal usually dissipates heat through heat conduction. The different orientations of the heat dissipation terminal will affect the heat conduction path, and then affect the direction and range of heat release, thereby determining the heat dissipation coverage of the heat dissipation terminal.

[0042] Step 6: Calculate the selection value of the alternative heat dissipation terminal by combining the distance between the layout position of the alternative heat dissipation terminal and the center point of the abnormal area with the coverage overlap. Specifically, the calculation expression of the selection value is: In the formula represents the selection value of the i-th candidate heat dissipation terminal, i represents the number of the candidate heat dissipation terminal, i=1,2,......,n,l irepresents the distance between the i-th candidate heat dissipation terminal layout location and the center point of the abnormal area, σ i It represents the coverage overlap corresponding to the i-th candidate heat dissipation terminal, and then extracts the candidate heat dissipation terminal corresponding to the maximum selection value as the adapted heat dissipation terminal.

[0043] It should be understood that when no heat dissipation terminal is deployed in the abnormal area, the heat dissipation effect of the abnormal area can be maximized by selecting an adaptive heat dissipation terminal from the heat dissipation terminals located around the abnormal area based on the distance between the heat dissipation terminal deployment position and the center point of the abnormal area and the overlap between the heat dissipation coverage range of the heat dissipation terminal and the abnormal area. Such a selection can ensure that the heat dissipation terminal covers most of the heat generation area in the abnormal area and effectively discharges the heat. In addition, while achieving effective heat dissipation, there is no need to introduce additional heat dissipation equipment, which is conducive to reducing energy waste.

[0044] The required cooling range analysis module is used to demarcate adjacent areas based on the abnormal area, and then obtain the temperature of the adjacent area, and analyze the required cooling range accordingly.

[0045] It should be noted that the adjacent region refers to a region that shares a boundary contour with the abnormal region.

[0046] In particular, delineating the adjacent region based on the abnormal region is implemented as follows: focusing the internal heat map of the power supply on the abnormal region, and extracting a region that shares a boundary contour with the abnormal region as the adjacent region.

[0047] The temperature of the adjacent area mentioned above can be obtained from the internal thermal map of the power supply.

[0048] Applied to the above embodiment, the process of analyzing the required temperature reduction range is as follows: counting the number of adjacent areas and extracting the size of the adjacent areas from the internal heat map of the power supply.

[0049] Compare the temperatures of adjacent areas, extract the highest and lowest temperatures, and import them into the expression The temperature approximation TD of the adjacent areas is calculated, where Tmax and Tmin represent the maximum temperature and the minimum temperature respectively, and e represents a natural constant. The smaller the difference between the maximum temperature and the minimum temperature, the greater the temperature approximation.

[0050] The temperature approach of the adjacent area is compared with the configured effective temperature approach. For example, the effective temperature approach can be configured to 0.9. If the temperature approach of the adjacent area is greater than or equal to the effective temperature approach, the temperature of each adjacent area is averaged to obtain the target temperature. Otherwise, the sizes of each adjacent area are compared, and the temperature of the largest adjacent area is extracted as the target temperature, where the target temperature is the cooling temperature to be achieved.

[0051] The temperature of the abnormal area is subtracted from the current temperature to obtain the required cooling range.

[0052] It should be noted that the adjacent area mentioned above is an area where the temperature is not higher than the limit temperature.

[0053] The effective temperature approach mentioned above is the initial configuration of the system, and its purpose is to assist in the analysis of cooling targets.

[0054] The present invention performs a temperature approximation analysis on the temperature of the adjacent area when performing the required cooling range analysis based on the temperature of the adjacent area corresponding to the abnormal area. According to the analysis results, when the temperatures of the adjacent areas are relatively close, the average temperature of the adjacent areas is used as the cooling temperature to be achieved. When the temperatures of the adjacent areas differ greatly, the temperature of the adjacent area corresponding to the maximum size is used as the cooling temperature to be achieved. This can avoid excessive or insufficient heat dissipation. When the temperatures of the adjacent areas are close, using the average value as the cooling target can effectively control the heat dissipation intensity and avoid energy waste; and when the temperatures of the adjacent areas differ greatly, using the temperature of the adjacent area corresponding to the maximum size as the cooling target can ensure that the cooling target of the abnormal area can cover the adjacent area over a large range, which can minimize the impact of the abnormal area cooling area on electronic devices caused by the large temperature difference of the adjacent area.

[0055] The required operating gear determination module is used to determine the required operating gear of the adaptive heat dissipation terminal according to the required cooling amplitude, which is specifically implemented as follows: the required cooling amplitude of the abnormal area is combined with the size of the abnormal area and the coverage overlap of the adaptive heat dissipation terminal to calculate the heat dissipation demand coefficient of the abnormal area. The specific calculation formula is: Where ΔT represents the required cooling range in the abnormal area, T 异常 represents the temperature of the abnormal area, S represents the size of the abnormal area, S0 represents the sum of the sizes of the temperature distribution areas in the internal heat map of the power supply, and λ represents the coverage overlap of the adaptive heat dissipation terminal. In particular, when the adaptive heat dissipation terminal is located in the abnormal area, its coverage overlap takes a value of 1.

[0056] The model specifications of the adaptive heat dissipation terminal are obtained, thereby obtaining the heat dissipation requirement coefficient range of the adaptive heat dissipation terminal at each operating level.

[0057] It is particularly important to note that the operating level of the heat dissipation terminal usually refers to the power level of the heat dissipation terminal, which is formed when the heat dissipation terminal is designed and produced. It can be specifically read from the instructions for use based on the model specifications of the heat dissipation terminal. For example, the operating level can be divided into: low-level, mid-level, and high-level. In the low-level mode, the heat dissipation terminal may operate at a lower power and the heat dissipation effect is weaker.

[0058] The mid-range mode is usually the standard working mode of the cooling terminal, with moderate power, which can balance the cooling effect and energy consumption. In most cases, the cooling terminal can meet the conventional cooling needs in the mid-range mode.

[0059] In high-end mode, the heat dissipation terminal will run at a higher power and have a stronger heat dissipation effect.

[0060] The heat dissipation demand coefficient of the abnormal area is matched with the heat dissipation demand coefficient range of the adapted heat dissipation terminal at each operating level, and then the successfully matched operating level is used as the required operating level.

[0061] The heat dissipation execution module is used to start the adaptive heat dissipation terminal to perform heat dissipation operations according to the required operation level.

[0062] The operation-related impact evaluation module is used to analyze the heat dissipation power consumption of the adaptive heat dissipation terminal according to the required operation gear of the adaptive heat dissipation terminal, and compare it with the power supply of the power supply to judge whether the heat dissipation affects the normal operation of the power supply.

[0063] It should be added that, since the operating gear of the heat dissipation terminal is associated with power, the correlation between the operating gear and power can be read from the instructions for use of the heat dissipation terminal, thereby obtaining the heat dissipation power consumption of the adapted heat dissipation terminal.

[0064] It should be noted that the power supply of a power supply refers to the maximum output power that the power supply can provide. The power supply of a power supply depends on its design and specifications, and different types of power supplies have different power supply powers.

[0065] In the optimization implementation of the above scheme, whether the heat dissipation affects the normal operation of the power supply is judged by referring to the following process: the heat dissipation power consumption of the heat dissipation terminal is compared with the power supply of the power supply, and the proportion of the heat dissipation power consumption is calculated, where

[0066] The heat dissipation power consumption ratio is compared with the preset associated impact ratio. For example, the associated impact ratio can be preset to 20%. If the heat dissipation power consumption ratio is greater than the associated impact ratio, it is judged whether the heat dissipation affects the normal operation of the power supply. Otherwise, it is judged that the heat dissipation does not affect the normal operation of the power supply.

[0067] The operation reduction adjustment module is used to retrieve the power consumption distribution ratio of each operation item of the power supply when it is determined that heat dissipation affects the normal operation of the power supply, thereby reducing and adjusting the operation items of the power supply.

[0068] Exemplarily, the operating items of the power supply include but are not limited to output voltage and current, voltage and current regulation, overvoltage protection and overcurrent protection, startup and shutdown control, remote control and monitoring, display and indication, etc. The operation of each operating item requires power consumption.

[0069] Preferably, the reduction and adjustment of the operating items of the power supply are specifically implemented as follows: each operating item of the power supply is matched with the basic operating items of the power supply to obtain the operating necessity corresponding to each operating item, wherein the basic operating items of the power supply include output voltage and current, startup and shutdown control, overvoltage protection and overcurrent protection, etc.

[0070] In the above description, when a certain operation item of the power supply is a basic operation item, the operation necessity degree corresponding to the operation item is 1, otherwise the operation necessity degree corresponding to the operation item is 0.

[0071] The historical operation records are retrieved and the frequency of occurrence of each operation item being in an abnormal state is summarized therefrom, wherein the historical operation records contain the record result of whether each operation item is in an abnormal state.

[0072] The necessary operation index corresponding to each operation item is combined with the frequency of occurrence in abnormal state to calculate the operation demand index corresponding to each operation item. The specific calculation expression is: Where OI represents the operation demand index corresponding to the operation item, χ represents the operation necessity corresponding to the operation item, k represents the frequency of abnormal state in the historical operation records corresponding to the operation item, and z represents the total number of historical operation records corresponding to the retrieved operation item.

[0073] When performing operation demand analysis on a power supply operation item, the present invention can improve the overall reliability of the analysis result by analyzing whether it is a basic operation item in combination with the abnormal occurrence rate of the operation item in the historical operation record.

[0074] Arrange each operating item in descending order according to the power consumption distribution ratio to obtain the power consumption arrangement result corresponding to each operating item, and arrange each operating item in descending order according to the operation demand index to obtain the operation demand arrangement result.

[0075] The reduction value coefficient corresponding to each operating item is evaluated according to the ranking of each operating item in the power consumption ranking results and the operating demand ranking results. The specific evaluation expression is: In the formula, d represents the ranking of the operating item in the power consumption ranking result, and f represents the ranking of the operating item in the operating demand ranking. Then, the operating items are arranged in descending order according to the reduction value coefficient to obtain the reduction value ranking result corresponding to each operating item.

[0076] It should be noted that the closer the ranking of the operating item in the above power consumption ranking result is to 1, the more it needs to be reduced; and the closer the ranking of the operating item in the operating demand ranking result is to 1, the more it needs to be reduced.

[0077] Select the target operating item to be reduced from the reduction value ranking results corresponding to each operating item.

[0078] In the example of the above scheme, the running item ranked first can be selected for reduction first to judge whether the released energy can meet the heat dissipation consumption of the adaptive heat dissipation terminal, and then the running item ranked later can be selected for reduction based on the judgment result, and the selection is stopped until the energy released by the selected running item after reduction can meet the heat dissipation consumption of the adaptive heat dissipation terminal.

[0079] The present invention adopts a method of reducing the operating items of the power supply to cope with the reduction in actual output power caused by heat dissipation control of the heat dissipation type DC power supply, thereby reducing the workload and energy consumption of the power supply itself. On the one hand, it can adapt to the heat dissipation consumption of the heat dissipation terminal, and on the other hand, it reduces the heat generated by the power supply, thereby reducing the heat dissipation demand, alleviating the burden on the heat dissipation system, and helping to maintain a stable operating temperature of the electronic equipment.

[0080] The above contents are merely examples and explanations of the concept of the present invention. Those skilled in the art may make various modifications or additions to the specific embodiments described or replace them in a similar manner. As long as they do not deviate from the concept of the invention or exceed the scope defined by the present invention, they shall all fall within the protection scope of the present invention.

Claims

1. A heat dissipation DC power supply based on the Internet of Things, characterized in that , including the following modules: A heat dissipation terminal layout module is used to layout the heat dissipation terminal in the DC power supply and extract a heat dissipation terminal layout state diagram; The operating temperature monitoring module is used to monitor the temperature inside the power supply in real time using an infrared thermal sensor during the power supply process to form a thermal map of the power supply; An abnormal region identification module, used for identifying abnormal regions based on a formed internal heat map of the power supply; An adaptive heat dissipation terminal screening module is used to screen adaptive heat dissipation terminals based on abnormal areas; The required cooling range analysis module is used to define adjacent areas based on abnormal areas, obtain the temperature of adjacent areas, and analyze the required cooling range based on the temperature; A module for determining the required operating level, used to determine the required operating level of the heat dissipation terminal according to the required cooling range; The heat dissipation execution module is used to start the adapted heat dissipation terminal to perform heat dissipation operations according to the required operation level; The operation-related impact evaluation module is used to analyze the heat dissipation power consumption of the heat dissipation terminal according to the required operation level of the heat dissipation terminal, and compare it with the power supply of the power supply to judge whether the heat dissipation affects the normal operation of the power supply; An operation reduction adjustment module is used to retrieve the power consumption distribution ratio of each operation item of the power supply when it is determined that heat dissipation affects the normal operation of the power supply, thereby reducing and adjusting the operation items of the power supply; The process of implementing the cooling range required by the analysis is as follows: Count the number of adjacent regions and extract the size of adjacent regions from the power internal heat map; Compare the temperatures of adjacent areas, extract the highest and lowest temperatures, and import them into the expression , calculate the temperature proximity of the adjacent areas , , Represent the highest temperature and the lowest temperature respectively. represents a natural constant; The temperature approximation of the adjacent areas is compared with the configured effective temperature approximation. If the temperature approximation of the adjacent areas is greater than or equal to the effective temperature approximation, the temperatures of the adjacent areas are averaged to obtain the target temperature. Otherwise, the sizes of the adjacent areas are compared to extract the temperature of the largest adjacent area as the target temperature. The temperature of the abnormal area is subtracted from the current temperature to obtain the required cooling range.

2. A heat dissipation type DC power supply based on the Internet of Things as claimed in claim 1, characterized in that: The identification process of the abnormal area is as follows: Extract temperature distribution features from the internal heat map of the power supply, including the number of temperature distribution areas and the chromaticity value corresponding to each temperature distribution area; Compare the chromaticity value corresponding to each temperature distribution area with the temperature represented by each chromaticity in the heat map, and obtain the temperature corresponding to each temperature distribution area; The temperature corresponding to each temperature distribution area is compared with the limit temperature in the power supply, and the temperature distribution area with a temperature greater than the limit temperature is identified as an abnormal area.

3. The heat dissipation type DC power supply based on the Internet of Things as claimed in claim 1, characterized in that: The process of selecting the suitable heat dissipation terminal based on the abnormal area is as follows: Step 1: Based on the heat dissipation terminal deployment state diagram, identify whether a heat dissipation terminal is deployed in the abnormal area. If a heat dissipation terminal is deployed, execute steps 2 to 3; otherwise, execute steps 4 to 6; Step 2: Count the number of heat dissipation terminals deployed in the abnormal area. If there is only one heat dissipation terminal deployed, use the heat dissipation terminal as the adapted heat dissipation terminal. If there is more than one heat dissipation terminal deployed, execute step 3. Step 3: Mark the center point in the abnormal area, and extract the layout position of each heat dissipation terminal in the abnormal area from the heat dissipation terminal layout state diagram, thereby comparing the center point position of the abnormal area with the layout position of each heat dissipation terminal, and obtaining the distance between the layout position of each heat dissipation terminal and the center point of the abnormal area, and then taking the heat dissipation terminal with the smallest distance as the adapted heat dissipation terminal; Step 4: extract the boundary contour of the abnormal area from the internal heat map of the power supply, and then identify the heat dissipation terminals located around the abnormal area based on the heat dissipation terminal layout state map, and record them as candidate heat dissipation terminals; Step 5: Compare the layout position of the candidate heat dissipation terminal with the center point of the abnormal area to obtain the distance between the layout position of the candidate heat dissipation terminal and the center point of the abnormal area, and extract the layout direction of the candidate heat dissipation terminal from the heat dissipation terminal layout state diagram to obtain the heat dissipation coverage of the candidate heat dissipation terminal, and then compare it with the boundary contour of the abnormal area to obtain the coverage overlap; Step 6: Calculate the selection value of the alternative heat dissipation terminal by combining the distance between the layout position of the alternative heat dissipation terminal and the center point of the abnormal area with the coverage overlap, and then extract the alternative heat dissipation terminal corresponding to the maximum selection value as the adapted heat dissipation terminal.

4. The heat dissipation type DC power supply based on the Internet of Things as claimed in claim 1, characterized in that: The method of screening out suitable heat dissipation terminals based on abnormal areas also includes counting the number of abnormal areas, and comparing it with the number of temperature distribution areas to obtain the abnormal proportion, and then comparing the abnormal proportion with the set high proportion. If the abnormal proportion is greater than or equal to the high proportion, all heat dissipation terminals arranged in the DC power supply are used as suitable heat dissipation terminals.

5. The heat dissipation type DC power supply based on the Internet of Things as claimed in claim 3, characterized in that: Delineating adjacent areas based on abnormal areas is implemented as follows: The internal heat map of the power supply is focused on the abnormal area, and the area sharing the boundary contour with the abnormal area is extracted as the adjacent area.

6. The heat dissipation type DC power supply based on the Internet of Things as claimed in claim 1, characterized in that: The required operating level of the adapted heat dissipation terminal is implemented as follows: The required cooling range of the abnormal area is combined with the size of the abnormal area and the coverage overlap of the adapted heat dissipation terminal to calculate the heat dissipation demand coefficient of the abnormal area. The specific calculation formula is: , where Indicates the demand cooling range in the abnormal area, Indicates the temperature of the abnormal area, represents the size of the abnormal area, It represents the sum of the sizes of the temperature distribution areas in the internal heat map of the power supply. Indicates the coverage overlap of the adapted heat dissipation terminal; Obtain the model specifications of the adaptive heat dissipation terminal, thereby obtaining the range of the heat dissipation requirement coefficient of the adaptive heat dissipation terminal at each operating level; The heat dissipation demand coefficient of the abnormal area is matched with the heat dissipation demand coefficient range of the adapted heat dissipation terminal at each operating level, and then the successfully matched operating level is used as the required operating level.

7. The heat dissipation type DC power supply based on the Internet of Things as claimed in claim 1, characterized in that: The process of judging whether heat dissipation affects the normal operation of the power supply is as follows: Compare the heat dissipation power consumption of the heat dissipation terminal with the power supplied by the power supply, and calculate the proportion of the heat dissipation power consumption; The heat dissipation power consumption ratio is compared with the preset associated impact ratio. If the heat dissipation power consumption ratio is greater than the associated impact ratio, it is judged whether the heat dissipation affects the normal operation of the power supply. Otherwise, it is judged that the heat dissipation does not affect the normal operation of the power supply.

8. The heat dissipation type DC power supply based on the Internet of Things as claimed in claim 1, characterized in that: The specific implementation of the reduction and adjustment of the power supply operation items is as follows: Match each power supply operation item with the basic power supply operation item to obtain the operation necessity degree corresponding to each operation item; Retrieve historical operation records and summarize the frequency of abnormal status of each operation item; The necessary operation index corresponding to each operation item is combined with the frequency of occurrence in abnormal state to calculate the operation demand index corresponding to each operation item; Arrange each operating item in descending order according to the power consumption distribution ratio to obtain the power consumption arrangement result corresponding to each operating item, and arrange each operating item in descending order according to the operation demand index to obtain the operation demand arrangement result; According to the ranking of each operating item in the power consumption ranking result and the operating demand ranking result, the reduction value coefficient corresponding to each operating item is evaluated, and then the operating items are arranged in descending order according to the reduction value coefficient to obtain the reduction value ranking result corresponding to each operating item; Select the target operating item to be reduced from the reduction value ranking results corresponding to each operating item.

9. A heat dissipation DC power supply based on the Internet of Things as claimed in claim 8, characterized in that: The evaluation expression of the reduction value coefficient is: , where Indicates the ranking of the running item in the power consumption ranking results. Indicates the rank of the operation item in the operation requirement arrangement.

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