A detection system and detection method for micro-electromechanical vertical probe card

Abstract

The present invention relates to the field of micro-electromechanical system testing technology, and specifically to a detection system and detection method for a micro-electromechanical vertical probe card, including a probe card module, an electric variable measurement module, a magnetic variable measurement module, a high-frequency response module, a data processing module, and a control module; wherein the probe card module is configured with a plurality of groups of vertically arranged microprobes; the electric variable measurement module is used to measure and analyze the electric parameter change data transmitted from the probe card module; the magnetic variable measurement module is used to measure and adjust the response change of micro-electromechanical elements in a magnetic field; the high-frequency response module is used to capture the dynamic response under the excitation of a high-frequency electric signal; and the data processing module is used to extract the comprehensive performance index of the micro-electromechanical elements. The present invention realizes the comprehensive measurement and analysis of electric parameters, magnetic response, and high-frequency dynamic response, and ensures that the system operates in the best state through optimized control, thereby improving the accuracy, comprehensiveness, and efficiency of the test.

Description

Technical Field

[0001] The present invention relates to the technical field of micro-electromechanical system testing, and in particular to a detection system and a detection method for a micro-electromechanical system vertical probe card. Background Art

[0002] In modern micro-electromechanical systems (MEMS), probe cards are a key tool for testing the electrical properties of MEMS components. Traditional probe cards usually use a horizontally arranged probe structure, which may lead to poor contact or inaccurate test results in some cases. In addition, existing probe card detection systems are mostly limited to the measurement of electrical parameters and lack comprehensive testing capabilities for magnetic response and high-frequency dynamic response. With the development of MEMS technology, the complexity of MEMS components continues to increase, and the requirements for test equipment are also getting higher and higher. Single electrical parameter testing can no longer meet actual needs.

[0003] The main problems of the existing technology include: the unreasonable design of the probe card structure leads to poor contact; the lack of testing for magnetic response and high-frequency dynamic response affects the evaluation of the overall performance of MEMS components; and the insufficient parameter optimization during the test process cannot ensure that the system operates in the best state. Therefore, there is an urgent need for a probe card detection system that can arrange probes in the vertical direction and can simultaneously perform electrical parameter, magnetic response and high-frequency dynamic response tests, so as to improve the accuracy and comprehensiveness of the test and meet the increasingly complex MEMS test needs. Summary of the invention

[0004] Based on the above objectives, the present invention provides a detection system and a detection method for a micro-electromechanical vertical probe card.

[0005] A micro-electromechanical vertical probe card detection system includes a probe card module, an electrical variable measurement module, a magnetic variable measurement module, a high-frequency response module, a data processing module and a control module; wherein:

[0006] Probe card module: It is equipped with multiple groups of vertically arranged microprobes. Each group of microprobes is composed of multiple layers of conductive materials and insulating materials alternately to meet different voltage and current test requirements.

[0007] Electrical variable measurement module: connected to the probe card module, used to measure and analyze the electrical parameter change data transmitted from the probe card module, including resistance, capacitance, inductance and potential difference;

[0008] Magnetic variable measurement module: connected to the probe card module, used to measure and adjust the response changes of micro-electromechanical components in the magnetic field, including the adjustment function of the magnetic field strength;

[0009] High-frequency response module: electrically connected to the probe card module, receiving the magnetic field data adjusted from the magnetic variable measurement module, and used to capture and analyze the dynamic response of the micro-electromechanical components under the excitation of high-frequency electrical signals;

[0010] Data processing module: electrically connected to the electric variable measurement module, magnetic variable measurement module and high-frequency response module, comprehensively receives the data of each module, performs data fusion and analysis through a preset algorithm to extract the comprehensive performance indicators of the micro-electromechanical components, and optimizes the test parameters based on the data;

[0011] Control module: connected to the data processing module, automatically adjusts the operation of the probe card module and the settings of the electrical and magnetic variable measurement modules according to the optimized test parameters provided by the data processing module to ensure that the entire system operates in the best state.

[0012] Further, the probe card module includes a conductive layer unit, an insulating layer unit, a microprobe base unit and a connection terminal unit, wherein:

[0013] Conductive layer unit: made of highly conductive metal material, used to conduct test current and voltage;

[0014] Insulation layer unit: made of high-voltage insulating material, arranged alternately between conductive layers to isolate adjacent conductive layers and prevent electrical signal interference;

[0015] Microprobe base unit: used to support and fix the microprobe. The base material has high strength and heat resistance and can remain stable under high temperature and mechanical stress.

[0016] Connection terminal unit: located at both ends of the microprobe, matching the connection ports of the electrical variable measurement module and the magnetic variable measurement module to ensure efficient signal transmission and accurate measurement.

[0017] Furthermore, the electrical variable measurement module includes a resistance measurement unit, a capacitance measurement unit, an inductance measurement unit, a potential difference measurement unit, a data acquisition unit and a signal conditioning unit; wherein,

[0018] Resistance measuring unit: used to measure the resistance value of the micro-electromechanical element. The resistance measuring unit specifically includes a constant current source and a voltage measurement circuit. The resistance value is calculated by measuring the voltage drop generated when the current passes through the micro-probe.

[0019] Capacitance measurement unit: used to measure the capacitance value of the micro-electromechanical element. The capacitance measurement unit includes a high-frequency signal generator and a phase detection circuit. The capacitance value is calculated by applying a high-frequency signal to the micro-probe and measuring the phase difference.

[0020] Inductance measurement unit: used to measure the inductance value of the micro-electromechanical components. The inductance measurement unit specifically includes an AC signal generator and a voltage measurement circuit. The inductance value is calculated by measuring the phase difference between the AC voltage and the current.

[0021] Potential difference measuring unit: used to measure the potential difference between micro-electromechanical components. The potential difference measuring unit includes a high-precision voltmeter, which obtains potential difference data by directly measuring the voltage difference between probes.

[0022] Data acquisition unit: connected to each measuring unit, used to collect the measurement data of each unit and transmit the data to the data processing module;

[0023] Signal conditioning unit: used to filter and amplify the output signals of each measuring unit to ensure the accuracy and stability of the measured data.

[0024] Furthermore, the magnetic variable measurement module includes a magnetic field generating unit, a magnetic field measuring unit and a data acquisition unit; wherein:

[0025] Magnetic field generating unit: used to generate an adjustable magnetic field, the magnetic field generating unit specifically includes a variable current electromagnet, and the magnetic field strength is controlled by adjusting the current;

[0026] Magnetic field measurement unit: used to measure the response change of the micro-electromechanical element in the magnetic field. The magnetic field measurement unit specifically includes a Hall sensor and a fluxmeter. The magnetic response data is obtained by measuring the change of the magnetic flux around the micro-electromechanical element.

[0027] Data acquisition unit: used to collect the output data of the magnetic field measurement unit and transmit the data to the data processing module.

[0028] Furthermore, the high-frequency response module includes a high-frequency signal generating unit, a signal injection unit, a dynamic response detection unit, a spectrum analysis unit and a data transmission unit; wherein:

[0029] High-frequency signal generating unit: used to generate a high-frequency electrical signal, the high-frequency signal generating unit specifically includes a high-frequency signal generator with adjustable frequency, which excites the micro-electromechanical components by adjusting the signal frequency and amplitude;

[0030] A signal injection unit: connected to the high-frequency signal generation unit and the probe card module, and used to inject a high-frequency electrical signal into the microprobe of the probe card module to stimulate the micro-electromechanical element under test;

[0031] Dynamic response detection unit: used to capture the dynamic response of the micro-electromechanical components under the excitation of high-frequency electrical signals. The dynamic response detection unit specifically includes a high-speed sampling oscilloscope and a signal amplifier. The electrical response signal of the micro-electromechanical components is obtained through high-speed sampling, and the signal strength is enhanced through the amplifier.

[0032] Spectrum analysis unit: used to analyze the response signal captured by the dynamic response detection unit. The spectrum analysis unit includes a digital signal processor and a fast Fourier transform algorithm submodule. The digital signal processor is used to pre-process and analyze the sampled signal. The fast Fourier transform algorithm submodule is used to convert the time domain signal into a frequency domain signal. By performing spectrum analysis on the sampled signal, the characteristic parameters of the micro-electromechanical components under high-frequency excitation are extracted.

[0033] Data transmission unit: used to transmit the data processed by the spectrum analysis unit to the data processing module for fusion and analysis.

[0034] Furthermore, the spectrum analysis unit includes:

[0035] Signal acquisition and preprocessing: First, use a high-speed sampling oscilloscope to collect the response signal of the MEMS component after the high-frequency signal is injected to obtain the time domain sampling signal x(t), where t represents time; then denoise the sampling signal, specifically using an improved sliding average filter algorithm for denoising, the formula is:

[0036] Among them, x filtered (t) is the filtered signal, N is the sliding window size, and i is the number of time steps in the sliding window;

[0037] Fast Fourier transform: The filtered time domain signal x filtered (t) performs discrete Fourier transform, which is implemented using the fast Fourier transform algorithm to obtain the frequency domain signal X(f). The specific calculation formula is:

[0038] Where X(f) is the frequency domain signal, n is the number of sampling points, f is the frequency, j is the imaginary unit, and x filtered (n) is the filtered signal at discrete time point n;

[0039] Spectral feature extraction: Extract characteristic parameters from the frequency domain signal X(f), including harmonic components, harmonic amplitudes and phases:

[0040] Fundamental frequency amplitude A0: A0 = |X(f0)|, where f0 is the fundamental frequency and A0 is the amplitude of the fundamental frequency;

[0041] Harmonic amplitude A n : A n =|X(n·f0)|, where n is the harmonic number, A n is the amplitude of the nth-order harmonic;

[0042] Harmonic Phase θ n :θ n =arg(X(n·f0)), where θn is the phase angle of the nth harmonic, arg(X) is the phase function of the complex number X;

[0043] Feature parameter optimization and output: Normalize the extracted feature parameters to improve analysis accuracy and robustness: Among them, A n ′ is the normalized harmonic amplitude, max(A n ) is the maximum value among all harmonic amplitudes.

[0044] Furthermore, the data processing module includes a data receiving unit, a data fusion unit, a performance index extraction unit and an optimization unit; wherein:

[0045] Data receiving unit: used to receive the original measurement data from the electric variable measurement module, magnetic variable measurement module and high-frequency response module, including resistance, capacitance, inductance, potential difference, magnetic response data and high-frequency dynamic response data;

[0046] Data fusion unit: used to fuse the received raw measurement data. The data fusion unit includes a data fusion algorithm submodule. Specifically, the received data are normalized to ensure that the dimensions of different types of data are consistent. Then, the normalized data are fused through a weighted average algorithm: Among them, y is the fused data, w i is the weight factor, x i ′ is the normalized value of the i-th category data, and n is the number of data categories, including resistance, capacitance, inductance, potential difference, magnetic response, and high-frequency dynamic response data;

[0047] Performance index extraction unit: used to extract the comprehensive performance index of micro-electromechanical components from the fused data, specifically based on the statistical characteristics of the fused data, select characteristic parameters, including conductivity, magnetic response sensitivity, and high-frequency response characteristics; and calculate the comprehensive performance index of the selected characteristics, including response speed, sensitivity, and stability; the specific calculation formula of the comprehensive performance index is: Among them, S is the comprehensive performance index, f i is the value of the i-th characteristic parameter, and n is the total number of characteristic parameters;

[0048] Optimization unit: used to optimize test parameters according to the extracted comprehensive performance indicators.

[0049] Furthermore, the optimization unit includes an optimization algorithm submodule, and optimizes the test parameters through the following steps:

[0050] Objective function definition: Define the optimization objective function to improve test accuracy and efficiency. The specific formula is: Among them, J is the objective function, w iis the weight factor, e i is the error of the i-th performance indicator;

[0051] Parameter adjustment: The test parameters are adjusted based on the gradient descent algorithm of the objective function to minimize the objective function value. The adjustment formula is: Among them, θ new is the adjusted parameter value, θ old is the current parameter value, α is the learning rate, is the gradient of the objective function with respect to the parameters.

[0052] Furthermore, the control module includes a parameter receiving unit, a probe card control unit, an electrical variable measurement control unit, a magnetic variable measurement control unit and a system monitoring unit; wherein:

[0053] Parameter receiving unit: used to receive the optimized test parameters from the data processing module, including probe position parameters, electrical variable measurement parameters and magnetic variable measurement parameters calculated according to the comprehensive performance indicators;

[0054] Probe card control unit: used to automatically adjust the operation of the probe card module according to the optimized test parameters. The probe card control includes a position controller, which will adjust the position and contact pressure of the probe according to the received optimized probe position parameters. The specific formula is: P new =P current +ΔP, where P new is the probe position after adjustment, P current is the current probe position, ΔP is the adjustment amount;

[0055] Electric variable measurement control unit: used to adjust the settings of the electric variable measurement module according to the optimized test parameters, specifically including an electric parameter controller, used to set the resistance, capacitance, inductance and potential difference measurement range according to the received optimized electric variable parameters. The specific setting formula is: V new =V current +ΔV, where V new is the adjusted voltage range, V current is the current voltage range, ΔV is the adjustment amount;

[0056] Magnetic variable measurement control unit: used to adjust the settings of the magnetic variable measurement module according to the optimized test parameters, specifically including a magnetic field controller, used to adjust the current of the magnetic field generating unit and control the magnetic field strength according to the received optimized magnetic field strength parameters. The specific adjustment formula is:

[0057] I new =I current +K·(Φ target -Φ measured ), where I new is the adjusted current, Icurrent is the current, K is the adjustment gain, Φ target is the target magnetic flux, Φ measured is the measured magnetic flux;

[0058] System monitoring unit: used to monitor the operating status of the entire system. The system monitoring unit includes a status monitor, which collects and analyzes the operating data of each module in real time. It is used to determine whether the system has any faults based on the operating data of each module; and based on the diagnosis results, it provides corresponding maintenance suggestions and alarm information to ensure that the system continues to operate in the best condition.

[0059] A method for detecting a micro-electromechanical vertical probe card comprises the following steps:

[0060] S1: According to the received optimized probe position parameters, the probe position and contact pressure of the probe card module are adjusted using a precision position controller in the probe card control unit to ensure that the probe is in precise contact with the micro-electromechanical components;

[0061] S2: After the probe position is adjusted, the electrical variable measurement control unit is started, the measurement ranges of resistance, capacitance, inductance and potential difference are set according to the optimized electrical variable parameters, and the electrical parameter measurements are performed;

[0062] S3: After completing the electrical parameter measurement, start the magnetic variable measurement control unit, adjust the current of the magnetic field generating unit according to the optimized magnetic field strength parameter, and measure the response change of the micro-electromechanical element in the magnetic field;

[0063] S4: After completing the magnetic parameter measurement, start the high-frequency response module, generate a high-frequency electrical signal using the high-frequency signal generation unit, inject the high-frequency electrical signal into the probe card module through the signal injection unit, and capture and analyze the dynamic response of the micro-electromechanical component under the excitation of the high-frequency electrical signal;

[0064] S5: All measurement data are transmitted to the data processing module, and fused through the data fusion algorithm to extract the comprehensive performance indicators of the MEMS components;

[0065] S6: According to the extracted comprehensive performance indicators, the test parameters are adjusted through the optimization algorithm to optimize the probe position, the settings of the electrical variable and the magnetic variable measurement to ensure that the system operates in the best state.

[0066] Beneficial effects of the present invention:

[0067] The present invention significantly improves the contact quality between the probe and the micro-electromechanical system by adopting a vertically arranged microprobe structure. This structural design can effectively avoid the poor contact problem that may be caused by traditional horizontally arranged probes, ensure the contact stability and signal transmission reliability during the test, and thus improve the accuracy of the test.

[0068] The present invention realizes comprehensive measurement and analysis of the electrical parameters, magnetic response and high-frequency dynamic response of micro-electromechanical components through the combined application of the electrical variable measurement module, the magnetic variable measurement module and the high-frequency response module. By fusing and processing a variety of data through the advanced algorithm of the data processing module, more accurate and comprehensive performance analysis results can be provided. This comprehensive testing capability makes up for the shortcomings of the existing technology and can more comprehensively evaluate the performance of micro-electromechanical components.

[0069] The present invention can automatically adjust the operation of the probe card module and the settings of the electrical variable and magnetic variable measurement modules according to the optimized test parameters provided by the data processing module through the control module, thereby ensuring that the system operates in the best state, significantly improving the performance and efficiency of the MEMS test system, and meeting complex testing requirements. BRIEF DESCRIPTION OF THE DRAWINGS

[0070] In order to more clearly illustrate the technical solutions in the present invention or the prior art, the drawings required for use in the embodiments or the description of the prior art will be briefly introduced below. Obviously, the drawings in the following description are only for the present invention. For ordinary technicians in this field, other drawings can be obtained based on these drawings without paying creative work.

[0071] Figure 1 A schematic diagram of a detection system of a micro-electromechanical vertical probe card according to an embodiment of the present invention;

[0072] Figure 2 FIG. 4 is a schematic diagram of a detection method of a micro-electro-mechanical vertical probe card according to an embodiment of the present invention. DETAILED DESCRIPTION

[0073] In order to make the objectives, technical solutions and advantages of the present invention more clearly understood, the present invention is further described in detail below in conjunction with specific embodiments.

[0074] It should be noted that, unless otherwise defined, the technical terms or scientific terms used in the present invention should be understood by people with ordinary skills in the field to which the present invention belongs. The words "first", "second" and similar words used in the present invention do not indicate any order, quantity or importance, but are only used to distinguish different components. The words "include" or "comprise" and similar words mean that the elements or objects appearing before the word include the elements or objects listed after the word and their equivalents, without excluding other elements or objects.

[0075] like Figure 1 As shown, a micro-electromechanical vertical probe card detection system includes a probe card module, an electric variable measurement module, a magnetic variable measurement module, a high-frequency response module, a data processing module and a control module; wherein,

[0076] Probe card module: It is equipped with multiple groups of vertically arranged microprobes, each group of microprobes is composed of multiple layers of conductive materials and insulating materials alternating to meet different voltage and current test requirements; this module captures preliminary electrical parameters and magnetic response data from the MEMS components under test;

[0077] Electrical variable measurement module: connected to the probe card module, used to measure and analyze the electrical parameter change data transmitted from the probe card module, including resistance, capacitance, inductance and potential difference;

[0078] Magnetic variable measurement module: connected to the probe card module, used to measure and adjust the response changes of micro-electromechanical components in the magnetic field, including the adjustment function of the magnetic field intensity. This data is crucial for the signal processing of the high-frequency response module;

[0079] High-frequency response module: electrically connected to the probe card module, receiving the magnetic field data adjusted from the magnetic variable measurement module, used to capture and analyze the dynamic response of the micro-electromechanical components under the excitation of high-frequency electrical signals. This data will directly affect the analysis efficiency and accuracy of the data processing module;

[0080] Data processing module: electrically connected to the electric variable measurement module, magnetic variable measurement module and high-frequency response module, comprehensively receives the data of each module, performs data fusion and analysis through a preset algorithm to extract the comprehensive performance indicators of the micro-electromechanical components, and optimizes the test parameters based on the data;

[0081] Control module: connected to the data processing module, automatically adjusts the operation of the probe card module and the settings of the electrical and magnetic variable measurement modules according to the optimized test parameters provided by the data processing module to ensure that the entire system operates in the best state.

[0082] The probe card module includes a conductive layer unit, an insulating layer unit, a microprobe base unit and a connection terminal unit, wherein:

[0083] Conductive layer unit: Made of highly conductive metal material, used to conduct test current and voltage to ensure stable transmission of electrical signals;

[0084] Insulation layer unit: Made of high-voltage insulating material, it is alternately arranged between the conductive layers to isolate adjacent conductive layers, prevent electrical signal interference, and ensure the independence and safety of each layer of circuits;

[0085] Microprobe base unit: used to support and fix the microprobe. The base material has high strength and heat resistance and can remain stable under high temperature and mechanical stress.

[0086] Connection terminal unit: located at both ends of the microprobe, matching the connection ports of the electrical variable measurement module and the magnetic variable measurement module to ensure efficient transmission and accurate measurement of signals; through the alternating composition of the above-mentioned multiple layers of conductive materials and insulating materials, each group of microprobes can adjust the thickness and material type of its conductive layer and insulating layer according to different test requirements to adapt to different voltage and current test conditions. The specific configuration includes adjusting the material composition of the conductive layer to optimize the conductive performance, selecting the insulating layer material to improve the voltage resistance, and designing the geometric structure of the microprobe to achieve optimal electrical contact and mechanical stability.

[0087] The electrical variable measurement module includes a resistance measurement unit, a capacitance measurement unit, an inductance measurement unit, a potential difference measurement unit, a data acquisition unit and a signal conditioning unit; wherein,

[0088] Resistance measuring unit: used to measure the resistance value of the micro-electromechanical element. The resistance measuring unit specifically includes a constant current source and a voltage measurement circuit. The resistance value is calculated by measuring the voltage drop generated when the current passes through the micro-probe.

[0089] Capacitance measurement unit: used to measure the capacitance value of the micro-electromechanical element. The capacitance measurement unit includes a high-frequency signal generator and a phase detection circuit. The capacitance value is calculated by applying a high-frequency signal to the micro-probe and measuring the phase difference.

[0090] Inductance measurement unit: used to measure the inductance value of the micro-electromechanical components. The inductance measurement unit specifically includes an AC signal generator and a voltage measurement circuit. The inductance value is calculated by measuring the phase difference between the AC voltage and the current.

[0091] Potential difference measuring unit: used to measure the potential difference between micro-electromechanical components. The potential difference measuring unit includes a high-precision voltmeter, which obtains potential difference data by directly measuring the voltage difference between probes.

[0092] Data acquisition unit: connected to each measuring unit, used to collect the measurement data of each unit and transmit the data to the data processing module;

[0093] Signal conditioning unit: used to filter and amplify the output signals of each measuring unit to ensure the accuracy and stability of the measured data;

[0094] Through the combination and collaborative work of the above units, the electrical variable measurement module can accurately measure and analyze the electrical parameter change data transmitted from the probe card module, including resistance, capacitance, inductance and potential difference. The specific configuration and operation of each unit ensure the measurement accuracy and reliability of the system.

[0095] The magnetic variable measurement module includes a magnetic field generating unit, a magnetic field measuring unit and a data acquisition unit; wherein:

[0096] Magnetic field generating unit: used to generate an adjustable magnetic field, the magnetic field generating unit specifically includes a variable current electromagnet, and the magnetic field strength is controlled by adjusting the current;

[0097] Magnetic field measurement unit: used to measure the response change of the micro-electromechanical element in the magnetic field. The magnetic field measurement unit specifically includes a Hall sensor and a fluxmeter. The magnetic response data is obtained by measuring the change of the magnetic flux around the micro-electromechanical element.

[0098] Data acquisition unit: used to collect the output data of the magnetic field measurement unit and transmit the data to the data processing module; through the combination and coordinated work of the above units, the magnetic variable measurement module can effectively measure and adjust the response changes of micro-electromechanical components in the magnetic field, including precise control of the magnetic field intensity. The specific configuration and operation of each unit ensure the system's measurement accuracy and reliability of magnetic parameters.

[0099] The high-frequency response module includes a high-frequency signal generating unit, a signal injection unit, a dynamic response detection unit, a spectrum analysis unit and a data transmission unit; wherein:

[0100] High-frequency signal generating unit: used to generate a high-frequency electrical signal, the high-frequency signal generating unit specifically includes a high-frequency signal generator with adjustable frequency, which excites the micro-electromechanical components by adjusting the signal frequency and amplitude;

[0101] A signal injection unit: connected to the high-frequency signal generation unit and the probe card module, and used to inject a high-frequency electrical signal into the microprobe of the probe card module to stimulate the micro-electromechanical element under test;

[0102] Dynamic response detection unit: used to capture the dynamic response of the micro-electromechanical components under the excitation of high-frequency electrical signals. The dynamic response detection unit specifically includes a high-speed sampling oscilloscope and a signal amplifier. The electrical response signal of the micro-electromechanical components is obtained through high-speed sampling, and the signal strength is enhanced through the amplifier.

[0103] Spectrum analysis unit: used to analyze the response signal captured by the dynamic response detection unit. The spectrum analysis unit includes a digital signal processor (DSP) and a fast Fourier transform (FFT) algorithm submodule. The digital signal processor is used to pre-process and analyze the sampled signal; the fast Fourier transform algorithm submodule is used to convert the time domain signal into a frequency domain signal, and extract the characteristic parameters of the micro-electromechanical components under high-frequency excitation by performing spectrum analysis on the sampled signal.

[0104] Data transmission unit: used to transmit the data processed by the spectrum analysis unit to the data processing module for fusion and analysis; through the combination and coordinated work of the above units, the high-frequency response module can effectively capture and analyze the dynamic response of micro-electromechanical components under the excitation of high-frequency electrical signals. The specific configuration and operation of each unit ensure the measurement accuracy and analysis accuracy of the system for high-frequency response signals.

[0105] The spectrum analysis unit includes:

[0106] Signal acquisition and preprocessing: First, use a high-speed sampling oscilloscope to collect the response signal of the MEMS component after the high-frequency signal is injected to obtain the time domain sampling signal x(t), where t represents time; then denoise the sampling signal, specifically using an improved sliding average filter algorithm for denoising, the formula is:

[0107] Among them, x filtered (t) is the filtered signal, N is the sliding window size, which is optimally selected based on the actual noise level, and i is the number of time steps in the sliding window;

[0108] Fast Fourier transform: The filtered time domain signal x filtered (t) performs discrete Fourier transform, which is implemented using the fast Fourier transform algorithm to obtain the frequency domain signal X(f). The specific calculation formula is:

[0109] Where X(f) is the frequency domain signal, n is the number of sampling points, f is the frequency, j is the imaginary unit, and x filtered (n) is the filtered signal at discrete time point n;

[0110] Spectral feature extraction: Extract characteristic parameters from the frequency domain signal X(f), including harmonic components, harmonic amplitudes and phases:

[0111] Fundamental frequency amplitude A0: A0 = |X(f0)|, where f0 is the fundamental frequency and A0 is the amplitude of the fundamental frequency;

[0112] Harmonic amplitude A n : A n =|X(n·f0)|, where n is the harmonic number, A n is the amplitude of the nth-order harmonic;

[0113] Harmonic Phase θ n :θ n =arg(X(n·f0)), where θ n is the phase angle of the nth harmonic, arg(X) is the phase function of the complex number X;

[0114] Feature parameter optimization and output: Normalize the extracted feature parameters to improve analysis accuracy and robustness: Among them, A n ′ is the normalized harmonic amplitude, max(A n ) is the maximum value among all harmonic amplitudes; the optimized characteristic parameters are transmitted to the data processing module for further analysis and application.

[0115] The data processing module includes a data receiving unit, a data fusion unit, a performance index extraction unit and an optimization unit; wherein:

[0116] Data receiving unit: used to receive the original measurement data from the electric variable measurement module, magnetic variable measurement module and high-frequency response module, including resistance, capacitance, inductance, potential difference, magnetic response data and high-frequency dynamic response data;

[0117] Data fusion unit: used to fuse the received raw measurement data. The data fusion unit includes a data fusion algorithm submodule. Specifically, the received data are normalized to ensure that the dimensions of different types of data are consistent: Among them, x′ is the normalized data, x is the original data, min(x) and max(x) are the minimum and maximum values ​​of the data respectively; then the normalized data is fused by the weighted average algorithm: Among them, y is the fused data, w i is the weight factor, x i ′ is the normalized value of the i-th category data, and n is the number of data categories, including resistance, capacitance, inductance, potential difference, magnetic response, and high-frequency dynamic response data;

[0118] Performance index extraction unit: used to extract the comprehensive performance index of micro-electromechanical components from the fused data, specifically based on the statistical characteristics of the fused data, select characteristic parameters, including conductivity, magnetic response sensitivity, and high-frequency response characteristics; and calculate the comprehensive performance index of the selected characteristics, including response speed, sensitivity, and stability; the specific calculation formula of the comprehensive performance index is: Among them, S is the comprehensive performance index, f i is the value of the i-th characteristic parameter, and n is the total number of characteristic parameters;

[0119] Optimization unit: used to optimize test parameters according to the extracted comprehensive performance indicators; through the combination and collaborative work of the above units, the data processing module can comprehensively receive the data of each module, perform data fusion and analysis through preset algorithms, extract the comprehensive performance indicators of micro-electromechanical components, and optimize the test parameters based on these data to improve the test accuracy and efficiency of the system.

[0120] The optimization unit includes the optimization algorithm submodule and optimizes the test parameters through the following steps:

[0121] Objective function definition: Define the optimization objective function to improve test accuracy and efficiency. The specific formula is: Among them, J is the objective function, w i is the weight factor, e i is the error of the i-th performance indicator;

[0122] Parameter adjustment: The test parameters are adjusted based on the gradient descent algorithm of the objective function to minimize the objective function value. The adjustment formula is: Among them, θ new is the adjusted parameter value, θ old is the current parameter value, α is the learning rate, is the gradient of the objective function with respect to the parameters.

[0123] The control module includes a parameter receiving unit, a probe card control unit, an electric variable measurement control unit, a magnetic variable measurement control unit and a system monitoring unit; wherein:

[0124] Parameter receiving unit: used to receive the optimized test parameters from the data processing module, including probe position parameters, electrical variable measurement parameters and magnetic variable measurement parameters calculated according to the comprehensive performance indicators;

[0125] Probe card control unit: used to automatically adjust the operation of the probe card module according to the optimized test parameters. The probe card control includes a position controller, which will adjust the position and contact pressure of the probe according to the received optimized probe position parameters. The specific formula is: P new =P current +ΔP, where P new is the probe position after adjustment, P current is the current probe position, ΔP is the adjustment amount;

[0126] Electric variable measurement control unit: used to adjust the settings of the electric variable measurement module according to the optimized test parameters, specifically including an electric parameter controller, used to set the resistance, capacitance, inductance and potential difference measurement range according to the received optimized electric variable parameters. The specific setting formula is: V new =V current +ΔV, where V new is the adjusted voltage range, V current is the current voltage range, ΔV is the adjustment amount;

[0127] Magnetic variable measurement control unit: used to adjust the settings of the magnetic variable measurement module according to the optimized test parameters, specifically including a magnetic field controller, used to adjust the current of the magnetic field generating unit and control the magnetic field strength according to the received optimized magnetic field strength parameters. The specific adjustment formula is:

[0128] I new =I current +K·(Φ target -Φ measured ), where I new is the adjusted current, I current is the current, K is the adjustment gain, Φ target is the target magnetic flux, Φ measured is the measured magnetic flux;

[0129] System monitoring unit: used to monitor the operating status of the entire system. The system monitoring unit includes a status monitor, which collects and analyzes the operating data of each module in real time, and is used to determine whether the system has a fault based on the operating data of each module; and based on the diagnosis results, provides corresponding maintenance suggestions and alarm information to ensure that the system continues to operate in the best state; through the combination and collaborative work of the above units, the control module can automatically adjust the operation of the probe card module and the settings of the electrical variable and magnetic variable measurement modules according to the optimized test parameters provided by the data processing module to ensure that the entire system operates in the best state and improve the test accuracy and efficiency of the system. The optimized test parameters are the results of extraction and analysis based on comprehensive performance indicators, so they can accurately reflect the actual performance requirements of micro-electromechanical components and ensure that the system operates in the best state.

[0130] like Figure 2 As shown, a method for detecting a micro-electromechanical vertical probe card comprises the following steps:

[0131] S1: According to the received optimized probe position parameters, the probe position and contact pressure of the probe card module are adjusted using a precision position controller in the probe card control unit to ensure that the probe is in precise contact with the micro-electromechanical components;

[0132] S2: After the probe position is adjusted, the electrical variable measurement control unit is started, the measurement ranges of resistance, capacitance, inductance and potential difference are set according to the optimized electrical variable parameters, and the electrical parameter measurements are performed;

[0133] S3: After completing the electrical parameter measurement, start the magnetic variable measurement control unit, adjust the current of the magnetic field generating unit according to the optimized magnetic field strength parameter, and measure the response change of the micro-electromechanical element in the magnetic field;

[0134] S4: After completing the magnetic parameter measurement, start the high-frequency response module, generate a high-frequency electrical signal using the high-frequency signal generation unit, inject the high-frequency electrical signal into the probe card module through the signal injection unit, and capture and analyze the dynamic response of the micro-electromechanical component under the excitation of the high-frequency electrical signal;

[0135] S5: All measurement data are transmitted to the data processing module, and fused through the data fusion algorithm to extract the comprehensive performance indicators of the MEMS components;

[0136] S6: According to the extracted comprehensive performance indicators, the test parameters are adjusted through the optimization algorithm to optimize the probe position, the settings of the electrical variable and the magnetic variable measurement to ensure that the system operates in the best state.

[0137] The present invention is intended to cover all such substitutions, modifications and variations that fall within the broad scope of the appended claims. Therefore, any omissions, modifications, equivalent substitutions, improvements, etc. made within the spirit and principles of the present invention should be included in the scope of protection of the present invention.

Claims

1. A micro-electromechanical vertical probe card detection system, characterized in that: It includes a probe card module, an electric variable measurement module, a magnetic variable measurement module, a high frequency response module, a data processing module and a control module; wherein, Probe card module: It is equipped with multiple groups of vertically arranged microprobes. Each group of microprobes is composed of multiple layers of conductive materials and insulating materials alternately to meet different voltage and current test requirements. Electrical variable measurement module: connected to the probe card module, used to measure and analyze the electrical parameter change data transmitted from the probe card module, including resistance, capacitance, inductance and potential difference; Magnetic variable measurement module: connected to the probe card module, used to measure and adjust the response changes of micro-electromechanical components in the magnetic field, including the adjustment function of the magnetic field strength; High-frequency response module: electrically connected to the probe card module, receiving the magnetic field data adjusted from the magnetic variable measurement module, and used to capture and analyze the dynamic response of the micro-electromechanical components under the excitation of high-frequency electrical signals; Data processing module: electrically connected to the electric variable measurement module, magnetic variable measurement module and high-frequency response module, comprehensively receives data from each module, performs data fusion and analysis through a preset algorithm to extract the comprehensive performance index of the micro-electromechanical components, and optimizes the test parameters according to the comprehensive performance index; Control module: connected to the data processing module, automatically adjusts the operation of the probe card module and the settings of the electrical and magnetic variable measurement modules according to the optimized test parameters provided by the data processing module to ensure that the entire system operates in the best state.

2. A micro-electromechanical vertical probe card detection system according to claim 1, characterized in that: The probe card module comprises a conductive layer unit, an insulating layer unit, a microprobe base unit and a connection terminal unit, wherein: Conductive layer unit: made of highly conductive metal material, used to conduct test current and voltage; Insulation layer unit: made of high-voltage insulating material, arranged alternately between conductive layers to isolate adjacent conductive layers and prevent electrical signal interference; Microprobe base unit: used to support and fix the microprobe. The base material has high strength and heat resistance and can remain stable under high temperature and mechanical stress. Connection terminal unit: located at both ends of the microprobe, matching the connection ports of the electrical variable measurement module and the magnetic variable measurement module to ensure efficient signal transmission and accurate measurement.

3. A micro-electromechanical vertical probe card detection system according to claim 1, characterized in that: The electrical variable measurement module includes a resistance measurement unit, a capacitance measurement unit, an inductance measurement unit, a potential difference measurement unit, a data acquisition unit and a signal conditioning unit; wherein, Resistance measuring unit: used to measure the resistance value of the micro-electromechanical element. The resistance measuring unit specifically includes a constant current source and a voltage measuring circuit. The resistance value is calculated by measuring the voltage drop generated when the current passes through the micro-probe. Capacitance measurement unit: used to measure the capacitance value of the micro-electromechanical element. The capacitance measurement unit includes a high-frequency signal generator and a phase detection circuit. The capacitance value is calculated by applying a high-frequency signal to the micro-probe and measuring the phase difference. Inductance measurement unit: used to measure the inductance value of the micro-electromechanical components. The inductance measurement unit specifically includes an AC signal generator and a voltage measurement circuit. The inductance value is calculated by measuring the phase difference between the AC voltage and the current. Potential difference measuring unit: used to measure the potential difference between micro-electromechanical components. The potential difference measuring unit includes a high-precision voltmeter, which obtains potential difference data by directly measuring the voltage difference between probes. Data acquisition unit: connected to each measuring unit, used to collect the measurement data of each unit and transmit the data to the data processing module; Signal conditioning unit: used to filter and amplify the output signals of each measuring unit to ensure the accuracy and stability of the measured data.

4. A micro-electromechanical vertical probe card detection system according to claim 1, characterized in that: The magnetic variable measurement module includes a magnetic field generating unit, a magnetic field measuring unit and a data acquisition unit; wherein: Magnetic field generating unit: used to generate an adjustable magnetic field, the magnetic field generating unit specifically includes a variable current electromagnet, and the magnetic field strength is controlled by adjusting the current; Magnetic field measurement unit: used to measure the response change of the micro-electromechanical element in the magnetic field. The magnetic field measurement unit specifically includes a Hall sensor and a fluxmeter. The magnetic response data is obtained by measuring the change of the magnetic flux around the micro-electromechanical element. Data acquisition unit: used to collect the output data of the magnetic field measurement unit and transmit the data to the data processing module.

5. The micro-electromechanical vertical probe card detection system according to claim 1, characterized in that: The high-frequency response module includes a high-frequency signal generating unit, a signal injection unit, a dynamic response detection unit, a spectrum analysis unit and a data transmission unit; wherein: High-frequency signal generating unit: used to generate a high-frequency electrical signal, the high-frequency signal generating unit specifically includes a high-frequency signal generator with adjustable frequency, which excites the micro-electromechanical components by adjusting the signal frequency and amplitude; A signal injection unit: connected to the high-frequency signal generation unit and the probe card module, and used to inject a high-frequency electrical signal into the microprobe of the probe card module to stimulate the micro-electromechanical element under test; Dynamic response detection unit: used to capture the dynamic response of the micro-electromechanical components under the excitation of high-frequency electrical signals. The dynamic response detection unit specifically includes a high-speed sampling oscilloscope and a signal amplifier. The electrical response signal of the micro-electromechanical components is obtained through high-speed sampling, and the signal strength is enhanced through the amplifier. Spectrum analysis unit: used to analyze the response signal captured by the dynamic response detection unit. The spectrum analysis unit includes a digital signal processor and a fast Fourier transform algorithm submodule. The digital signal processor is used to pre-process and analyze the sampled signal. The fast Fourier transform algorithm submodule is used to convert the time domain signal into a frequency domain signal. By performing spectrum analysis on the sampled signal, the characteristic parameters of the micro-electromechanical components under high-frequency excitation are extracted. Data transmission unit: used to transmit the data processed by the spectrum analysis unit to the data processing module for fusion and analysis.

6. A micro-electromechanical vertical probe card detection system according to claim 5, characterized in that: The spectrum analysis unit comprises: Signal acquisition and preprocessing: First, use a high-speed sampling oscilloscope to collect the response signal of the MEMS component after the high-frequency signal is injected to obtain the time domain sampling signal x(t), where t represents time; then denoise the sampling signal, specifically using an improved sliding average filter algorithm for denoising, the formula is: Among them, x filtered (t) is the filtered signal, N is the sliding window size, and i is the number of time steps in the sliding window; Fast Fourier transform: The filtered time domain signal x filtered (t) performs discrete Fourier transform, which is implemented using the fast Fourier transform algorithm to obtain the frequency domain signal X(f). The specific calculation formula is: Where X(f) is the frequency domain signal, n is the number of sampling points, f is the frequency, j is the imaginary unit, and x filtered (n) is the filtered signal at discrete time point n; Spectral feature extraction: Extract characteristic parameters from the frequency domain signal X(f), including harmonic components, harmonic amplitudes and phases: Fundamental frequency amplitude A0: A0 = |X(f0)|, where f0 is the fundamental frequency and A0 is the amplitude of the fundamental frequency; Harmonic amplitude A n : A n =|X(n·f0)|, where n is the harmonic number, A n is the amplitude of the nth-order harmonic; Harmonic Phase θ n :θ n =argX(n·f0), where θ n is the phase angle of the nth harmonic, arg(X) is the phase function of the complex number X; Feature parameter optimization and output: Normalize the extracted feature parameters to improve analysis accuracy and robustness: Among them, A n ′ is the normalized harmonic amplitude, max(A n ) is the maximum value among all harmonic amplitudes.

7. A micro-electromechanical vertical probe card detection system according to claim 1, characterized in that: The data processing module includes a data receiving unit, a data fusion unit, a performance index extraction unit and an optimization unit; wherein: Data receiving unit: used to receive the original measurement data from the electric variable measurement module, magnetic variable measurement module and high-frequency response module, including resistance, capacitance, inductance, potential difference, magnetic response data and high-frequency dynamic response data; Data fusion unit: used to fuse the received raw measurement data. The data fusion unit includes a data fusion algorithm submodule. Specifically, the received data are normalized to ensure that the dimensions of different types of data are consistent. Then, the normalized data are fused through a weighted average algorithm: Among them, y is the fused data, w i is the weight factor, x i ′ is the normalized value of the i-th category data, and n is the number of data categories, including resistance, capacitance, inductance, potential difference, magnetic response, and high-frequency dynamic response data; Performance index extraction unit: used to extract the comprehensive performance index of micro-electromechanical components from the fused data, specifically based on the statistical characteristics of the fused data, select characteristic parameters, including conductivity, magnetic response sensitivity, and high-frequency response characteristics; and calculate the comprehensive performance index of the selected characteristics, including response speed, sensitivity, and stability; the specific calculation formula of the comprehensive performance index is: Among them, S is the comprehensive performance index, f i is the value of the i-th characteristic parameter, and n is the total number of characteristic parameters; Optimization unit: used to optimize test parameters according to the extracted comprehensive performance indicators.

8. A micro-electromechanical vertical probe card detection system according to claim 7, characterized in that: The optimization unit includes an optimization algorithm submodule and optimizes the test parameters through the following steps: Objective function definition: Define the optimization objective function to improve test accuracy and efficiency. The specific formula is: Among them, J is the objective function, w i is the weight factor, e i is the error of the i-th performance indicator; Parameter adjustment: The test parameters are adjusted based on the gradient descent algorithm of the objective function to minimize the objective function value. The adjustment formula is: Among them, θ new is the adjusted parameter value, θ old is the current parameter value, α is the learning rate, is the gradient of the objective function with respect to the parameters.

9. A micro-electromechanical vertical probe card detection system according to claim 1, characterized in that: The control module includes a parameter receiving unit, a probe card control unit, an electric variable measurement control unit, a magnetic variable measurement control unit and a system monitoring unit; wherein: Parameter receiving unit: used to receive the optimized test parameters from the data processing module, including probe position parameters, electrical variable measurement parameters and magnetic variable measurement parameters calculated according to the comprehensive performance indicators; Probe card control unit: used to automatically adjust the operation of the probe card module according to the optimized test parameters. The probe card control includes a position controller, which will adjust the position and contact pressure of the probe according to the received optimized probe position parameters. The specific formula is: P new =P current +ΔP, where P new is the probe position after adjustment, P current is the current probe position, ΔP is the adjustment amount; Electric variable measurement control unit: used to adjust the settings of the electric variable measurement module according to the optimized test parameters, specifically including an electric parameter controller, used to set the resistance, capacitance, inductance and potential difference measurement range according to the received optimized electric variable parameters. The specific setting formula is: V new =V current +ΔV, where V new is the adjusted voltage range, V current is the current voltage range, ΔV is the adjustment amount; Magnetic variable measurement control unit: used to adjust the settings of the magnetic variable measurement module according to the optimized test parameters, specifically including a magnetic field controller, used to adjust the current of the magnetic field generating unit and control the magnetic field strength according to the received optimized magnetic field strength parameters. The specific adjustment formula is: I new =I current +K·(Φ target -Φ measured ), where I new is the adjusted current, I current is the current, K is the adjustment gain, Φ target is the target magnetic flux, Φ measured is the measured magnetic flux; System monitoring unit: used to monitor the operating status of the entire system. The system monitoring unit includes a status monitor, which collects and analyzes the operating data of each module in real time. It is used to determine whether the system has any faults based on the operating data of each module; and based on the diagnosis results, it provides corresponding maintenance suggestions and alarm information to ensure that the system continues to operate in the best condition.

10. A method for detecting a micro-electromechanical vertical probe card according to any one of claims 1 to 9, characterized in that: The following steps are involved: S1: According to the received optimized probe position parameters, the probe position and contact pressure of the probe card module are adjusted using a precision position controller in the probe card control unit to ensure that the probe is in precise contact with the micro-electromechanical components; S2: After the probe position is adjusted, the electrical variable measurement control unit is started, the measurement ranges of resistance, capacitance, inductance and potential difference are set according to the optimized electrical variable parameters, and the electrical parameter measurements are performed; S3: After completing the electrical parameter measurement, start the magnetic variable measurement control unit, adjust the current of the magnetic field generating unit according to the optimized magnetic field strength parameter, and measure the response change of the micro-electromechanical element in the magnetic field; S4: After completing the magnetic parameter measurement, start the high-frequency response module, generate a high-frequency electrical signal using the high-frequency signal generation unit, inject the high-frequency electrical signal into the probe card module through the signal injection unit, and capture and analyze the dynamic response of the micro-electromechanical component under the excitation of the high-frequency electrical signal; S5: All measurement data are transmitted to the data processing module, and fused through the data fusion algorithm to extract the comprehensive performance indicators of the MEMS components; S6: According to the extracted comprehensive performance indicators, the test parameters are adjusted through the optimization algorithm to optimize the probe position, the settings of the electrical variable and the magnetic variable measurement to ensure that the system operates in the best state.

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