Wafer drying apparatus swing mechanism

Abstract

A swing mechanism of a wafer drying device, having a containing seat (36) for containing a wafer box (9), the containing seat (36) comprising a middle hollow base (360) connected with an arched sliding arm (32), side limiting blocks (361) for limiting two sides of the wafer box respectively installed on the base (360), a top block (363) and an inner positioning block (362) between the side limiting blocks (361). The inner positioning block (362) is used for positioning the distance of the two side limiting blocks (361), providing an installation position for the top block (363), and the inner positioning block (362) and the top block (363) are suspended above the middle hollow part of the containing seat (36). The hollow side limiting blocks (361), the inner positioning block (362) and the top block (363) form a complete set of installation structure, having the installation positioning function, being simple to install and having high structural strength, and meanwhile not hindering the flow of drying gas, improving the drying effect.

Description

Technical Field

[0001] This application belongs to the field of wafer cleaning technology, and in particular relates to a swing mechanism for wafer drying equipment. Background Technology

[0002] For semiconductor wafer cleaning, the wafers require processes such as alkaline cleaning solution cleaning, pure water cleaning, hydrofluoric acid cleaning, ozone water cleaning, and drying. Wafer drying is generally the final step in wafer cleaning, which can remove residual cleaning solution from the wafer surface, prevent wafer oxidation, and control surface moisture and surface cleanliness. Chinese patent document CN114496847A discloses a swing mechanism disposed inside a cleaning tank, which has two wafer cassette carrying areas for placing wafer cassettes.

[0003] The outer shell of the wafer cleaning tank is made of metal. The oscillating mechanism includes a drive motor, a sliding rail, a sliding block, a shaft-connected rail, and a swing arm. The sliding rail is arranged parallel to the shaft-connected rail and is located above the shaft-connected rail. The sliding block is slidably mounted on the sliding rail, and the drive motor is used to control the reciprocating motion of the sliding block on the sliding rail.

[0004] Then, the wafer cassette holder (wafer cassette bearing area) in the swing mechanism is not flexible enough and is inconvenient to install, especially the multiple crossbeams in the middle are difficult to align.

[0005] Technical issues

[0006] The technical problem to be solved by the present invention is to provide a oscillating mechanism for wafer drying equipment that is easy to install, in order to overcome the shortcomings of the prior art.

[0007] Technical solutions

[0008] The technical solution adopted by this invention to solve its technical problem is:

[0009] The wafer drying equipment swing mechanism of the present invention includes a top mounting plate having a horizontal slide rail, a driving member disposed on the top mounting plate, a sliding mounting block slidably disposed on the horizontal slide rail and capable of moving along the horizontal slide rail under the drive of the driving member, an arched sliding arm mounted on the sliding mounting block, and a receiving seat mounted on the arched sliding arm. When the driving member is working, it can drive the arched sliding arm together with the receiving seat to swing.

[0010] The receiving seat is used to receive a wafer cassette, including a hollow base connected to an arched sliding arm, side limiting blocks installed on the base for limiting the two sides of the wafer cassette respectively, and a top block located between the side limiting blocks. The side limiting blocks are hollow in the middle, and the inner walls of the hollow portions of the two side limiting blocks have protrusions arranged opposite to each other. The receiving seat also includes an inner positioning block.

[0011] The two ends of the inner positioning block are respectively connected to the protrusions of the side limiting block, and the connection points are distributed on both sides of the width direction of the inner positioning block. The top block is installed on both sides of the length direction of the inner positioning block.

[0012] Preferably, in the oscillating mechanism of the wafer drying equipment of the present invention, a width limiting block is further provided between the two side limiting blocks.

[0013] Preferably, in the oscillating mechanism of the wafer drying equipment of the present invention, the bottom of the side limiting block is tenoned with the base.

[0014] Preferably, in the oscillating mechanism of the wafer drying equipment of the present invention, the top surface of the side limiting block is an inclined surface.

[0015] Preferably, in the oscillating mechanism of the wafer drying equipment of the present invention, the top surface of the top block is an inclined surface.

[0016] Preferably, in the oscillating mechanism of the wafer drying equipment of the present invention, the top block is provided with an elongated hole along the height direction.

[0017] Preferably, in the wafer drying equipment oscillation mechanism of the present invention, the inner positioning block has a subtractive through hole in the middle, which serves to both reduce weight and allow gas to pass through.

[0018] Preferably, in the oscillating mechanism of the wafer drying equipment of the present invention, the arched sliding arm extends over the top of the tank and into the tank to form a first arm located outside the tank and a second arm located inside the tank, wherein the receiving seat is installed at the bottom of the second arm.

[0019] Preferably, in the oscillating mechanism of the wafer drying equipment of the present invention, the first arm is rotatably connected to the rotating mounting base, the first arm has a sliding groove in the middle, and the sliding mounting block is provided with a pulley located in the sliding groove.

[0020] Preferably, in the oscillating mechanism of the wafer drying equipment of the present invention, the sliding mounting block extends downward to form an extension portion, and the pulley is disposed on the extension portion.

[0021] Beneficial effects

[0022] The beneficial effects of this invention are:

[0023] The oscillation mechanism of the wafer drying equipment of the present invention uses an inner positioning block to position the distance between the two side limiting blocks and provide an installation position for the top block. The inner positioning block and the top block are suspended above the hollowed-out portion in the middle of the receiving seat. The hollow side limiting blocks, inner positioning blocks, and top blocks form a complete installation structure, which has the advantages of installation and positioning function, simple installation, and high structural strength. At the same time, it does not obstruct the flow of drying gas, thus improving the drying effect. In addition, by extending downward on the sliding mounting block to form an extension portion, and installing a pulley on the extension portion, the pulley can be moved as far away as possible from the center line of movement of the sliding mounting block (i.e., the center line of the slide rail), thereby making the entire mating point between the pulley and the sliding groove lower and increasing the oscillation amplitude. Attached Figure Description

[0024] The technical solution of this application will be further described below with reference to the accompanying drawings and embodiments.

[0025] Figure 1 This is a schematic diagram of the structure of the swing-type wafer drying equipment according to an embodiment of this application;

[0026] Figure 2 yes Figure 1 A schematic diagram of the structure of the swing-type wafer drying equipment after removing the cover;

[0027] Figure 3 This is a schematic diagram of the swing mechanism in Embodiment 1 of this application;

[0028] Figure 4 and Figure 5 These are schematic diagrams showing the two states of the swing mechanism's oscillation.

[0029] Figure 6 This is a schematic diagram of the structure of the receiving seat in Embodiment 1 of this application;

[0030] The attached figures are labeled as follows:

[0031] 1. Tank body;

[0032] 2. Cover;

[0033] 3. Swinging mechanism;

[0034] 9. Wafer box;

[0035] 21. Gas pipelines;

[0036] 31. Top mounting plate;

[0037] 32. Arched sliding arm;

[0038] 33. Driving components;

[0039] 34 Sliding mounting blocks;

[0040] 35 Rotary mounting base;

[0041] 36 seats;

[0042] 321 Sliding groove;

[0043] 341 Pulley;

[0044] 342 Extension;

[0045] 360 base;

[0046] 361 Side limiting block;

[0047] 362 inner positioning block;

[0048] 363 Top Block;

[0049] 364 Width Limiting Block.

[0050] The best embodiment of the present invention

[0051] It should be noted that, unless otherwise specified, the embodiments and features described in this application can be combined with each other.

[0052] In the description of this application, it should be understood that the terms "center," "longitudinal," "lateral," "upper," "lower," "front," "rear," "left," "right," "vertical," "horizontal," "top," "bottom," "inner," and "outer," etc., indicating orientation or positional relationships based on the orientation or positional relationships shown in the accompanying drawings, are only for the convenience of describing this application and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation, and therefore should not be construed as limiting the scope of protection of this application. Furthermore, the terms "first," "second," etc., are used for descriptive purposes only and should not be construed as indicating or implying relative importance or implicitly specifying the number of indicated technical features. Thus, features defined with "first," "second," etc., may explicitly or implicitly include one or more of that feature. In the description of this invention, unless otherwise stated, "a plurality of" means two or more.

[0053] In the description of this application, it should be noted that, unless otherwise expressly specified and limited, the terms "installation," "connection," and "linking" should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral connection; they can refer to a mechanical connection or an electrical connection; they can refer to a direct connection or an indirect connection through an intermediate medium; and they can refer to the internal connection between two components. Those skilled in the art will understand the specific meaning of the above terms in this application based on the specific circumstances.

[0054] The technical solution of this application will now be described in detail with reference to the accompanying drawings and embodiments.

[0055] Example

[0056] This embodiment provides a oscillating mechanism for a wafer drying equipment, such as... Figure 1 and Figure 2 and Figure 3 As shown,

[0057] A top mounting plate 31 with a horizontal slide rail, a drive member 33 set on the top mounting plate, a sliding mounting block 34 slidably set on the horizontal slide rail and capable of moving along the horizontal slide rail under the drive of the drive member 33, an arched sliding arm 32 mounted on the sliding mounting block 34, a receiving seat 36 mounted on the arched sliding arm 32, and the drive member 33 can drive the arched sliding arm 32 and the receiving seat 36 to swing when working.

[0058] The receiving seat 36 is used to receive the wafer cassette 9, including a base 360 ​​connected to an arched sliding arm 32, side limiting blocks 361 for limiting the two sides of the wafer cassette respectively, and a top block 363 located between the side limiting blocks 361, the side limiting blocks 361 are hollow in the middle, and the inner walls of the hollow portions of the two side limiting blocks 361 have protrusions arranged opposite to each other. The receiving seat 36 also includes an inner positioning block 362.

[0059] The inner positioning block 362 is connected to the protrusions of the side limiting block 361 at both ends, with the connection points distributed on both sides of the width direction of the inner positioning block 362. The top block 363 is installed on both sides of the length direction of the inner positioning block 362. After the wafer cassette 9 is placed into the receiving seat 36, the top block 363 can lift the wafer inside the wafer cassette 9 to a certain height (slightly lift) to improve the drying effect. The receiving seat 36 has a hollow center to allow for smoother airflow during drying.

[0060] In this embodiment, the oscillating mechanism of the wafer drying equipment uses an inner positioning block 362 to position the distance between the two side limiting blocks 361 and provide an installation position for the top block 363. The inner positioning block 362 and the top block 363 are suspended above the hollow part in the middle of the receiving seat 36. The hollow side limiting blocks, inner positioning block 362, and top block 363 form a complete installation structure, which has the advantages of installation positioning function, simple installation, and high structural strength. At the same time, it does not hinder the flow of drying gas and improves the drying effect.

[0061] like Figure 4 and 5 As shown, the driving component 33 drives the sliding mounting block 34 to move on the slide rail, which in turn acts on the sliding groove 321 through the pulley 341, thereby causing the receiving seat 36 to swing. Figure 4 Located in the exact center, wafer cassette 9 can now be loaded and unloaded. Figure 5 It is the maximum amplitude of the swing to the right.

[0062] Furthermore, a width limiting block 364 is provided between the two side limiting blocks 361, and the two ends of the width limiting block 364 abut against the side limiting blocks 361 to improve structural stability.

[0063] Furthermore, the bottom of the side limiting block 361 is tenoned with the base 360. That is, the side limiting block 361 is installed by sliding in from the side and then fastened with bolts, which improves the ease of installation.

[0064] The sliding mounting block extends downward to form an extension, on which a pulley is installed. This allows the pulley to be as far away as possible from the center line of movement of the sliding mounting block (i.e., the center line of the slide rail), thereby lowering the mating point between the pulley and the sliding groove and increasing the swing amplitude.

[0065] The top surfaces of both the side limiting block 361 and the top block 363 are sloped, meaning they have sharp tops. The slopes of the side limiting block 361 face each other, facilitating the sliding of the wafer cassette 9 into the wafer and providing positioning. The slope of the top surface of the top block 363 reduces the contact area with the wafer, improving the drying effect.

[0066] The top block 363 has an elongated hole along its height to facilitate adjustment of the installation height of the top block 363.

[0067] The inner positioning block 362 has a subtractive through hole in the middle. The subtractive through hole has two functions: first, to reduce weight, and second, to allow drying gas to pass through from the bottom. The closer the subtractive through hole is to the top surface, the larger the opening is.

[0068] The specific structure of the arched sliding arm 32 is designed to extend from the outside of the tank 1 to the inside of the tank 1, such as... Figure 6 As shown, the arched sliding arm 32 extends beyond the top of the groove 1 and into the groove 1 to form a first arm outside the groove 1 and a second arm inside the groove 1. The receiving seat 36 is installed at the bottom of the second arm. The first arm is rotatably connected to the rotating mounting seat 35. The first arm has a sliding groove 321 in the middle, and a pulley 341 located in the sliding groove 321 is provided on the sliding mounting block 34. The sliding mounting block 34 extends downward to form an extension 342, and the pulley 341 is provided on the extension 342. By extending downward on the sliding mounting block to form an extension and providing a pulley on the extension, the pulley can be moved as far away as possible from the center line of movement of the sliding mounting block (i.e., the center line of the slide rail), thereby making the mating point between the pulley and the sliding groove lower and increasing the swing amplitude.

[0069] Based on the above-described preferred embodiments according to this application, and through the foregoing description, those skilled in the art can make various changes and modifications without departing from the technical concept of this application. The technical scope of this application is not limited to the contents of the specification, but must be determined according to the scope of the claims.

Claims

1. A oscillating mechanism for a wafer drying equipment, characterized in that, include: A top mounting plate (31) with a horizontal slide rail, a drive member (33) set on the top mounting plate, a sliding mounting block (34) slidably set on the horizontal slide rail and capable of moving along the horizontal slide rail under the drive of the drive member (33), an arched sliding arm (32) mounted on the sliding mounting block (34), a receiving seat (36) mounted on the arched sliding arm (32), and the drive member (33) can drive the arched sliding arm (32) together with the receiving seat (36) to swing when it is working. There are two arched sliding arms (32) and two receiving seats (36). The receiving seat (36) is used to receive the wafer cassette (9), including a hollow base (360) connected to an arched sliding arm (32), side limiting blocks (361) installed on the base (360) for limiting the two sides of the wafer cassette respectively, and a top block (363) located between the side limiting blocks (361). The side limiting blocks (361) are hollow in the middle, and the inner walls of the hollow parts of the two side limiting blocks (361) have protrusions arranged opposite to each other. The receiving seat (36) also includes an inner positioning block (362). The two ends of the inner positioning block (362) are respectively connected to the protrusions of the side limiting block (361), and the connection points are distributed on both sides of the width direction of the inner positioning block (362). The top block (363) is installed on both sides of the length direction of the inner positioning block (362). The inner positioning block (362) has a subtractive through hole in the middle, which serves to reduce weight and allow gas to pass through. The inner positioning block (362) and the top block (363) are suspended above the hollowed-out part in the middle of the receiving seat (36); A width limiting block (364) is also provided between the two side limiting blocks (361), and the two ends of the width limiting block (364) abut against the side limiting blocks (361).

2. The oscillating mechanism of the wafer drying equipment according to claim 1, characterized in that, The bottom of the side limiting block (361) is tenoned with the base (360).

3. The oscillating mechanism of the wafer drying equipment according to claim 1, characterized in that, The top surface of the side limiting block (361) is an inclined surface.

4. The oscillating mechanism of the wafer drying equipment according to claim 1, characterized in that, The top surface of the top block (363) is an inclined surface.

5. The oscillating mechanism of the wafer drying equipment according to claim 1, characterized in that, The top block (363) has an elongated hole along its height direction.

6. The oscillating mechanism of the wafer drying equipment according to claim 1, characterized in that, An arched sliding arm (32) extends over the top of the trough (1) and into the trough (1) to form a first arm located outside the trough (1) and a second arm located inside the trough (1), with the receiving seat (36) mounted at the bottom of the second arm.

7. The oscillating mechanism of the wafer drying equipment according to claim 6, characterized in that, The first arm is rotatably connected to the rotating mounting base (35), and the first arm has a sliding groove (321) in the middle. The sliding mounting block (34) is provided with a pulley (341) located in the sliding groove (321).

8. The oscillating mechanism of the wafer drying equipment according to claim 7, characterized in that, The sliding mounting block (34) extends downward to form an extension (342), and the pulley (341) is disposed on the extension (342).

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